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Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.09. 2008. Issue No: 1 Rev.1 www.everlightamericas.com
LAMP
EALP05RDFRGA2
Features
• Choice of various viewing angles
• Available on tape and reel.
• Reliable and robust
• The product itself will remain within RoHS compliant version.
• Compliance with EU REACH
• Compliance Halogen free. (Br <900 ppm, Cl<900 ppm, Br+Cl <1500 ppm).
Description
•The series is specially designed for applications requiring higher brightness
•The led lamps are available with different colors, intensities..
• TV set
• Monitor
• Telephone
• Computer
DATASHEET
LAMP
EALP05RDFRGA2
2
Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.09. 2008. Issue No: 1 Rev.1 www.everlightamericas.com
Device Selection Guide
Chip
Materials Emitted Color Resin Color
AlGaInP Deep-Red
White Diffused
AlGaInP Brilliant Yellow Green
Absolute Maximum Ratings (Ta=25
℃
℃℃
℃)
Parameter Symbol Rating Unit
Continuous Forward Current I
F
SUR/S530 25
mA
SYG/S530 25
Reverse Voltage V
R
5 V
Power Dissipation P
d
SUR/S530 60
mW
SYG/S530 60
Operating Temperature T
opr
-40 ~ +85
℃
Storage Temperature Tstg -40 ~ +100
℃
Soldering Temperature T
sol
260
℃
for 5 sec.
Electro
-Optical Characteristics (Ta=25℃
℃℃
℃)
Parameter Symbol Min. Typ. Max. Unit Conditio
n
Luminous Intensity Iv SUR/S530
25 50 ----- mcd I
F
=20mA
SYG/S530
16 32 -----
Viewing Angle 2θ
1/2
----- 70 ----- deg I
F
=20mA
Peak Wavelength λ
p
SUR/S530
----- 632 ----- nm I
F
=20mA
SYG/S530
----- 575 -----
Dominant Wavelength λ
d
SUR/S530
----- 624 ----- nm I
F
=20mA
SYG/S530
----- 573 -----
Spectrum Radiation Bandwidth ∆λ SUR/S530
----- 20 ----- nm I
F
=20mA
SYG/S530
----- 20 -----
Forward Voltage V
F
SUR/S530
----- 2.0 2.4 V I
F
=20mA
SYG/S530
----- 2.0 2.4
Reverse Current I
R
SUR/S530
----- ----- 10 µA V
R
=5V
SYG/S530
----- ----- 10
DATASHEET
LAMP
EALP05RDFRGA2
3
Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.09. 2008. Issue No: 1 Rev.1 www.everlightamericas.com
Typical E
lectro
-
Optical Characteristics Curves
SUR
Relative Intensity vs. Wavelength (Ta=25
℃
℃℃
℃
)
Directivity (Ta=25
℃
℃℃
℃
)
Relative Intensity (a.u.)
Radiation Angle
Wavelength (nm)
Relative Intensity (a.u.)
Forward Current vs. Forward Voltage (Ta=25
℃
℃℃
℃
) Relative Intensity vs. Forward Current (Ta=25
℃
℃℃
℃
)
Forward Current (mA)
Relative Intensity(a.u.)
0 5 10 15 20
25
0.0
0.5
1.0
1.5
Forward Voltage (V) Forward Current (mA)
Relative Intensity vs. Ambient Temp. Forward Current vs. Ambient Temp.
Relative Intensity(a.u.)
25 30 35 40 45 50 55 60 65 70
0.0
0.5
1.0
1.5
2.0
Forward Current (mA)
0 20 40 60 80 100
0
10
20
30
40
Ambient Temperature Ta
(℃)
Ambient Temperature Ta
(℃)
Typical Electro
-Optical Characteristics Curves
DATASHEET
LAMP
EALP05RDFRGA2
4
Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.09. 2008. Issue No: 1 Rev.1 www.everlightamericas.com
SYG
Relative Intensity vs. Wavelength (Ta=25
℃
℃℃
℃
)
Directivity (Ta=25
℃
℃℃
℃
)
Relative Intensity (a.u.)
Radiation Angle
Wavelength (nm)
Relative Intensity (a.u.)
Forward Current vs. Forward Voltage (Ta=25
℃
℃℃
℃
) Relative Intensity vs. Forward Current (Ta=25
℃
℃℃
℃
)
Forward Current (mA)
Relative Intensity(a.u.)
0 5 10 15 20
25
0.0
0.5
1.0
1.5
Forward Voltage (V) Forward Current (mA)
Relative Intensity vs. Ambient Temp. Forward Current vs. Ambient Temp.
Relative Intensity(a.u.)
25 30 35 40 45 50 55 60 65 70
0.0
0.5
1.0
1.5
2.0
Forward Current (mA)
0 20 40 60 80 100
0
10
20
30
40
Ambient Temperature Ta
(℃)
Ambient Temperature Ta
(℃)
DATASHEET
LAMP
EALP05RDFRGA2
5
Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.09. 2008. Issue No: 1 Rev.1 www.everlightamericas.com
Package Dimension
Note: Note:
1. All dimensions are in millimeters
2. The height of flange must be less than 1.5mm(0.059").
3. Without special declared, the tolerance is ±0.25mm.
SYG
S
U
R
DATASHEET
LAMP
EALP05RDFRGA2
6
Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.09. 2008. Issue No: 1 Rev.1 www.everlightamericas.com
Pb
EL ECTROSTATIC ELECTRONAGNETIC
MAGNETIC OR RADIOACTIVE RELDS
anti-static for 750
Moisture Resistant Packing Materials
Label Explanation
‧
CPN: Customer’s Product Number
‧
P/N: Product Number
‧
QTY: Packing Quantity
‧
CAT: Ranks of Luminous Intensity
‧
HUE: Ranks of Dominant Wavelength
‧
REF: Ranks of Forward Voltage
‧
LOT No: Lot Number
Packing Specification
■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton
■ Packing Quantity
1. Min 200 To 500 PCS/1 Bag, 4 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
DATASHEET
LAMP
EALP05RDFRGA2
7
Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.09. 2008. Issue No: 1 Rev.1 www.everlightamericas.com
Prehead
laminar wave
Fluxing
Notes
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it
may break the LEDs.
Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs
are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight
Americas
and the
storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed
container with a nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can
occur.
3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,
and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
Hand Soldering DIP Soldering
Temp. at tip of iron 300
℃
Max. (30W Max.)
Preheat temp. 100
℃
Max. (60 sec Max.)
Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max
Distance 3mm Min.(From solder
joint to epoxy bulb)
Distance 3mm Min. (From solder
joint to epoxy bulb)
Recommended soldering profile
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to
room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
DATASHEET
LAMP
EALP05RDFRGA2
8
Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.09. 2008. Issue No: 1 Rev.1 www.everlightamericas.com
Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest
possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder
wave.
4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than
one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs
depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to
ensure this will not cause damage to the LED
5. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED application. The current
should be de-rated appropriately by referring to the de-rating curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating
curve.
6.
ESD (Electrostatic Discharge)
The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly
recommended:
Eliminating the charge
Grounded wrist strap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
Proper grounding is required for all devices, equipment, and machinery used in product assembly.
Surge protection should be considered when designing of commercial products.
If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
7. Directions for use
The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are
not subjected to forward or reverse voltage while it is off. If reverse voltage is continuously applied to the
LEDs, it may cause migration resulting in LED damage.
8. Other
Above specification may be changed without notice. Everlight Americas will reserve authority on material
change for above specification.
When using this product, please observe the absolute maximum ratings and the instructions for using outlined
in these specification sheets. Everlight Americas assumes no responsibility for any damage resulting from
use of the product which does not comply with the absolute maximum ratings and the instructions included in
DATASHEET
LAMP
EALP05RDFRGA2
9
Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.09. 2008. Issue No: 1 Rev.1 www.everlightamericas.com
these specification sheets.
These specification sheets include materials protected under copyright of Everlight Americas corporation.
Please don’t reproduce or cause anyone to reproduce them without Everlight Americas's consent.