LM137HVQML
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LM137HVQML 3-Terminal Adjustable Negative Regulators (High Voltage)
Check for Samples: LM137HVQML
1FEATURES DESCRIPTION
The LM137HV is an adjustable 3-terminal negative
2• Output Voltage Adjustable from −47V to −1.2V voltage regulator capable of supplying in excess of
• 1.5A Output Current Specified, −55°C ≤TJ≤−1.5A over an output voltage range of −47V to −1.2V.
+150°C This regulators is exceptionally easy to apply,
• Line Regulation Typically 0.01%/V requiring only 2 external resistors to set the output
voltage and 1 output capacitor for frequency
• Load Regulation Typically 0.3% compensation. The circuit design has been optimized
• Excellent Thermal Regulation, 0.002%/W for excellent regulation and low thermal transients.
• 77 dB Ripple Rejection Further, the LM137HV features internal current
limiting, thermal shutdown and safe-area
• Excellent Rejection of Thermal Transients compensation, making them virtually blowout-proof
• 50 ppm/°C Temperature Coefficient against overloads.
• Temperature-Independent Current Limit The LM137HV serves a wide variety of applications
• Internal Thermal Overload Protection including local on-card regulation, programmable-
• Standard 3-Lead Transistor Package output voltage regulation or precision current
regulation. The LM137HV is an ideal complement to
• Output Short Circuit Protected the LM117HV adjustable positive regulator.
Connection Diagrams
See Physical Dimensions section for further information
Figure 1. TO Package – Bottom View Figure 2. TO-3 Package (Bottom View)
See Package Number NDT0003A See Package Number K
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2010–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM137HVQML
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Typical Applications
†C1 = 1 μF solid tantalum or 10 μF aluminum electrolytic required for stability. Output capacitors in the range of 1 μF
to 1000 μF of aluminum or tantalum electrolytic are commonly used to provide improved output impedance and
rejection of transients.
*C2 = 1 μF solid tantalum is required only if regulator is more than 4″from power-supply filter capacitor.
Figure 3. Adjustable Negative Voltage Regulator
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
Power Dissipation(2) Internally limited
Input—Output Voltage Differential 50V
Operating Ambient Temperature Range −55°C ≤TA≤
+125°C
Maximum Junction Temperature Range +150°C
Storage Temperature −65°C ≤TA≤
+150°C
Lead Temperature (Soldering, 10 sec.) 300°C
Thermal Resistance θJA NDT0003A pkg. (Still Air @ 0.5W) 174°C/W
NDT0003A pkg. (500LF / Min Air Flow @ 0.5W) 64°C/W
K pkg. (Still Air @ 0.5W) 42°C/W
K pkg. (500LF / Min Air Flow @ 0.5W) 14°C/W
θJC NDT0003A pkg. (@ 1.0W) 15°C/W
K pkg. 4°C/W
Package Weight (Typical) NDT0003A pkg 955mg
K pkg 12,750mg
ESD Rating(3) 4000V
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance, and TA(ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax −TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
(3) Human body model, 100pF discharged through 1.5KΩ
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Table 1. Quality Conformance Inspection
Mil-Std-883, Method 5004 and Method 5005
Subgroup(1) Description Temp (°C)
1 Static tests at +25°C
2 Static tests at +125°C
3 Static tests at -55°C
4 Dynamic tests at +25°C
5 Dynamic tests at +125°C
6 Dynamic tests at -55°C
7 Functional tests at +25°C
8A Functional tests at +125°C
8B Functional tests at -55°C
9 Switching tests at +25°C
10 Switching tests at +125°C
11 Switching tests at -55°C
(1) Group “A” sample only, test at all temperature.
LM137HVH 883 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. VIN =−4.0V, IO= 0.53A, VO= VRef Sub-
Symbol Parameter Conditions Notes Min Max Unit groups
-1.272 -1.23 V 1
VIN = -4.25V, IO= 8 mA -1.28 -1.225 V 2, 3
VRef Reference Voltage -1.272 -1.23 V 1
VIN = -42V, IO= 8mA -1.28 -1.225 V 2, 3
VO= -1.7V, VIN = -4.25V 3.0 mA 1, 2, 3
IQMinimum Load Current VO= -1.7V, VIN = -11.75V 3.0 mA 1, 2, 3
VO= -1.7V, VIN = -42V 5.0 mA 1, 2, 3
RLine Line Regulation -42V ≤VIN ≤-4.25V, IO= 8mA 9.4 mV 1, 2, 3
VIN = -42V, IO= 8mA 100 µA 1, 2, 3
IAdj Adjustment Pin Current VIN = -4.25V, IO= 8mA 100 µA 1, 2, 3
VIN = -54V, IO= 8mA 100 µA 1
ΔIAdj Adjustment Pin Current Change -42V ≤VIN ≤-4.25V, IL= 8mA 6.0 µA 1, 2, 3
VIN = -6.25V, 8mA ≤IO≤0.53A 5.0 µA 1, 2, 3
-54V ≤VIN ≤-4.25V, IO= 8mA 6.0 µA 1
VIN = -54V, 10mA ≤IO≤60mA 25 mV 1
RLoad Load Regulation VIN = -6.25V, 8mA ≤IO≤0.53A 25 mV 1
VRth Thermal Regulation IO= 0.53A, VIN = -14.5V 5 mV 1
VIN ≤-14.25 See(1) 0.5 1.6 A 1
ICL Current Limit VIN = -51.25V See(1) 0.1 0.5 A 1
(1) Specified parameter not tested.
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LM137HVH 883 Electrical Characteristics AC Parameters Sub-
Symbol Parameter Conditions Notes Min Max Unit groups
VIN = -6.25V, VO= VRef, f = 120Hz,
RRRipple Rejection See(1)(2) 66 dB 4, 5, 6
eI= 1VRMS, IL= 125mA
(1) Tested at +25°C, specified, but not tested at +125°C and −55°C
(2) Bench test per (SG)RPI-3–362 Use TDN 70256657 (NSSG)
LM137HVK 883 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. VIN =−40V, IL= 8.0mA, VO= VRef =−1.25V (nominal) Sub-
Symbol Parameter Conditions Notes Min Max Unit groups
1.272 -1.23 V 1
VIN = -4.25V -1.28 -1.225 V 2, 3
VRef Reference Voltage VIN = -42V -1.272 -1.23 V 1
VIN = -41.3V -1.28 -1.225 V 2, 3
-42V ≤VIN ≤-4.25V 9.4 mV 1
RLine Line Regulation -41.3V ≤VIN ≤-4.25V 9.4 mV 2, 3
VIN = -54V, 10mA ≤IO≤110mA -25 25 mV 1
RLoad Load Regulation VIN = -6.25V, 8mA ≤IO≤1.5A -25 25 mV 1, 2, 3
IO= 1.5A, VIN = -14.5V,
VRth Thermal Regulation -5.0 5.0 mV 1
t = 10mS
VIN = -42V 100 µA 1
VIN = -41.3V 100 µA 2, 3
IAdj Adjustment Pin Current VIN = -4.25V 100 µA 1, 2, 3
VIN = -54V 100 µA 1
-42V ≤VIN ≤-4.25V -5.0 5.0 µA 1
-41.3V ≤VIN ≤-4.25V -5.0 5.0 µA 2, 3
ΔIAdj Adjustment Pin Current Change -54V ≤VIN ≤-4.25V -6.0 6.0 µA 1
VIN = -6.25V, 8mA ≤IO≤1.5A -5.0 5.0 µA 1, 2, 3
VO= 1.7V, VIN = -4.25V 3.0 mA 1, 2, 3
VO= -1.7V, VIN = -11.75V 3.0 mA 1, 2, 3
IQMinimum Load Current VO= -1.7V, VIN = -42V 5.0 mA 1
VO= -1.7V, VIN = -41.3V 5.0 mA 2, 3
-2.85 -1.6 A 1
VIN = -5V
ISC Short Circuit -3.5 -1.6 A 2, 3
VIN = -51.25V See(1) -0.8 -0.2 A 1
(1) Specified parameter not tested.
LM137HVK 883 Electrical Characteristics AC Parameters:
The following conditions apply, unless otherwise specified. VIN =−40V, IL= 8.0mA, VO= VRef =−1.25V (nominal) Sub-
Symbol Parameter Conditions Notes Min Max Unit groups
VIN = -6.25V, VO= VRef,
RRRipple Rejection f = 120Hz, ein = 1V RMS, See(1)(2) 66 dB 4, 5, 6
IL= 0.5A
(1) Tested at +25°C, specified, but not tested at +125°C and −55°C
(2) Bench test per (SG)RPI-3–362 Use TDN 70256657 (NSSG)
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Schematic Diagram
Thermal Regulation
When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC circuit
components. With an IC regulator, this gradient can be especially severe since power dissipation is large. Thermal regulation
is the effect of these temperature gradients on output voltage (in percentage output change) per Watt of power change in a
specified time. Thermal regulation error is independent of electrical regulation or temperature coefficient, and occurs within 5
ms to 50 ms after a change in power dissipation. Thermal regulation depends on IC layout as well as electrical design. The
thermal regulation of a voltage regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a
step of power is applied. The LM137HV's specification is 0.02%/W, max.
In Figure 4, a typical LM137HV's output drifts only 3 mV (or 0.03% of VOUT =−10V) when a 10W pulse is applied for 10 ms.
This performance is thus well inside the specification limit of 0.02%/W x 10W = 0.2% max. When the 10W pulse is ended, the
thermal regulation again shows a 3 mV step as the LM137HV chip cools off. Note that the load regulation error of about 8 mV
(0.08%) is additional to the thermal regulation error. In Figure 5, when the 10W pulse is applied for 100 ms, the output drifts
only slightly beyond the drift in the first 10 ms, and the thermal error stays well within 0.1% (10 mV).
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When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC circuit
components. With an IC regulator, this gradient can be especially severe since power dissipation is large. Thermal regulation
is the effect of these temperature gradients on output voltage (in percentage output change) per Watt of power change in a
specified time. Thermal regulation error is independent of electrical regulation or temperature coefficient, and occurs within 5
ms to 50 ms after a change in power dissipation. Thermal regulation depends on IC layout as well as electrical design. The
thermal regulation of a voltage regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a
step of power is applied. The LM137HV's specification is 0.02%/W, max.
In Figure 4, a typical LM137HV's output drifts only 3 mV (or 0.03% of VOUT =−10V) when a 10W pulse is applied for 10 ms.
This performance is thus well inside the specification limit of 0.02%/W x 10W = 0.2% max. When the 10W pulse is ended, the
thermal regulation again shows a 3 mV step as the LM137HV chip cools off. Note that the load regulation error of about 8 mV
(0.08%) is additional to the thermal regulation error. In Figure 5, when the 10W pulse is applied for 100 ms, the output drifts
only slightly beyond the drift in the first 10 ms, and the thermal error stays well within 0.1% (10 mV).
LM137HV, VOUT =−10V
VIN−VOUT =−40V
IL= 0A→0.25A→0A
Vertical sensitivity, 5 mV/div
Figure 4.
LM137HV, VOUT =−10V
VIN−VOUT =−40V
IL= 0A→0.25A→0A
Horizontal sensitivity, 20 ms/div
Figure 5.
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When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC circuit
components. With an IC regulator, this gradient can be especially severe since power dissipation is large. Thermal regulation
is the effect of these temperature gradients on output voltage (in percentage output change) per Watt of power change in a
specified time. Thermal regulation error is independent of electrical regulation or temperature coefficient, and occurs within 5
ms to 50 ms after a change in power dissipation. Thermal regulation depends on IC layout as well as electrical design. The
thermal regulation of a voltage regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a
step of power is applied. The LM137HV's specification is 0.02%/W, max.
In Figure 4, a typical LM137HV's output drifts only 3 mV (or 0.03% of VOUT =−10V) when a 10W pulse is applied for 10 ms.
This performance is thus well inside the specification limit of 0.02%/W x 10W = 0.2% max. When the 10W pulse is ended, the
thermal regulation again shows a 3 mV step as the LM137HV chip cools off. Note that the load regulation error of about 8 mV
(0.08%) is additional to the thermal regulation error. In Figure 5, when the 10W pulse is applied for 100 ms, the output drifts
only slightly beyond the drift in the first 10 ms, and the thermal error stays well within 0.1% (10 mV).
Typical Applications
Full output current not available at high input-output voltages
*The 10 μF capacitors are optional to improve ripple rejection
Figure 6. Adjustable High Voltage Regulator
Figure 7. Current Regulator
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When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC circuit
components. With an IC regulator, this gradient can be especially severe since power dissipation is large. Thermal regulation
is the effect of these temperature gradients on output voltage (in percentage output change) per Watt of power change in a
specified time. Thermal regulation error is independent of electrical regulation or temperature coefficient, and occurs within 5
ms to 50 ms after a change in power dissipation. Thermal regulation depends on IC layout as well as electrical design. The
thermal regulation of a voltage regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a
step of power is applied. The LM137HV's specification is 0.02%/W, max.
In Figure 4, a typical LM137HV's output drifts only 3 mV (or 0.03% of VOUT =−10V) when a 10W pulse is applied for 10 ms.
This performance is thus well inside the specification limit of 0.02%/W x 10W = 0.2% max. When the 10W pulse is ended, the
thermal regulation again shows a 3 mV step as the LM137HV chip cools off. Note that the load regulation error of about 8 mV
(0.08%) is additional to the thermal regulation error. In Figure 5, when the 10W pulse is applied for 100 ms, the output drifts
only slightly beyond the drift in the first 10 ms, and the thermal error stays well within 0.1% (10 mV).
Figure 8. Adjustable Current Regulator
*When CLis larger than 20 μF, D1 protects the LM137HV in case the input supply is shorted
**When C2 is larger than 10 μF and −VOUT is larger than −25V, D2 protects the LM137HV is case the output is
shorted
Figure 9. Negative Regulator with Protection Diodes
*Use resistors with good tracking TC < 25 ppm/°C
Figure 10. High Stability −40V Regulator
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Typical Performance Characteristics
(H and K-STEEL Package)
Load Regulation Current Limit
Figure 11. Figure 12.
Adjustment Current Dropout Voltage
Figure 13. Figure 14.
Temperature Stability Minimum Operating Current
Figure 15. Figure 16.
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Typical Performance Characteristics (continued)
(H and K-STEEL Package)
Ripple Rejection Ripple Rejection
Figure 17. Figure 18.
Ripple Rejection Output Impedance
Figure 19. Figure 20.
Line Transient Response Load Transient Response
Figure 21. Figure 22.
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REVISION HISTORY
Date Released Revision Section Changes
12/16/2010 A New Release, Corporate format 2 MDS data sheets converted into one Corp. Data
sheet format. MNLM137HV-K rev 0A0, MNLM137HV-
H rev 2A0 MDS datasheets will be archived.
04/17/2013 A Changed layout of National Data Sheet to TI format.
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PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM137HVH/883 ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 150 LM137HVH/883 Q ACO
LM137HVH/883 Q >T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
NDT0003A
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H03A (Rev D)
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