CM75MXA-24S
NX-Series CIB Module
(3Ø Converter + 3Ø Inverter + Brake)
75 Amperes/1200 Volts
4
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
02/14 Rev. 4
Electrical Characteristics, Tj = 25°C unless otherwise specied
Inverter Part IGBT/Diode
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Emitter Cutoff Current ICES VCE = VCES, VGE = 0V — — 1.0 mA
Gate-Emitter Leakage Current IGES VGE = VGES, VCE = 0V — — 0.5 µA
Gate-Emitter Threshold Voltage VGE(th) IC = 7.5mA, VCE = 10V 5.4 6.0 6.6 Volts
Collector-Emitter Saturation Voltage VCE(sat) IC = 75A, VGE = 15V, Tj = 25°C*6 — 1.80 2.25 Volts
(Terminal) IC = 75A, VGE = 15V, Tj = 125°C*6 — 2.00 — Volts
IC = 75A, VGE = 15V, Tj = 150°C*6 — 2.05 — Volts
Collector-Emitter Saturation Voltage VCE(sat) IC = 75A, VGE = 15V, Tj = 25°C*6 — 1.70 2.15 Volts
(Chip) IC = 75A, VGE = 15V, Tj = 125°C*6 — 1.90 — Volts
IC = 75A, VGE = 15V, Tj = 150°C*6 — 1.95 — Volts
Input Capacitance Cies — — 7.5 nF
Output Capacitance Coes VCE = 10V, VGE = 0V — — 1.5 nF
Reverse Transfer Capacitance Cres — — 0.13 nF
Gate Charge QG VCC = 600V, IC = 75A, VGE = 15V — 175 — nC
Turn-on Delay Time td(on) — — 300 ns
Rise Time tr VCC = 600V, IC = 75A, VGE = ±15V, — — 200 ns
Turn-off Delay Time td(off) RG = 8.2Ω, Inductive Load — — 600 ns
Fall Time tf — — 300 ns
Emitter-Collector Voltage VEC*1 IE = 75A, VGE = 0V, Tj = 25°C*6 — 1.80 2.25 Volts
(Terminal) IE = 75A, VGE = 0V, Tj = 125°C*6 — 1.80 — Volts
IE = 75A, VGE = 0V, Tj = 150°C*6 — 1.80 — Volts
Emitter-Collector Voltage VEC*1 IE = 75A, VGE = 0V, Tj = 25°C*6 — 1.70 2.15 Volts
(Chip) IE = 75A, VGE = 0V, Tj = 125°C*6 — 1.70 — Volts
IE = 75A, VGE = 0V, Tj = 150°C*6 — 1.70 — Volts
Reverse Recovery Time trr*1 VCC = 600V, IE = 75A, VGE = ±15V — — 300 ns
Reverse Recovery Charge Qrr*1 RG = 8.2Ω, Inductive Load — 4.0 — µC
Turn-on Switching Energy per Pulse Eon VCC = 600V, IC = IE = 75A, — 7.3 — mJ
Turn-off Switching Energy per Pulse Eoff VGE = ±15V, RG = 8.2Ω, — 8.0 — mJ
Reverse Recovery Energy per Pulse Err*1 Tj = 150°C, Inductive Load — 6.9 — mJ
Internal Lead Resistance RCC' + EE' Main Terminals-Chip, — — 4.0 mΩ
Per Switch,TC = 25°C*4
Internal Gate Resistance rg Per Switch — 0 — Ω
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*6 Pulse width and repetition rate should be such as to cause negligible temperature rise.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
53
54
55
56
57
58
59
60
61
30
29
28
27
26
25
24
23
52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
0 0
1 7. 2
19.4
18.1
31.2
32.6
47.0
48.0
15.2
LABEL SIDE
Each mark points to the center position of each chip.
Tr*P / Tr*N / TrBr (* = U/V/W): IGBT Di*P / Di*N (* = U/V/W): FWDi
DiBr: Clamp Di CR*P / CR*N (* = R/S/T): Conv Di
Th: NTC Thermistor
0
24.5
18.2
0
33.9
26.0
71.3
83.5
93.3
102.9
46.8
36.4
64.5
72.9
82.4
90.8
99.3
108.8
25.6
24.6
35.9
42.5
46.2
110.9
Tr
Br Di
Br
Di
UN Di
VN
Di
WN
Tr
UN Tr
VN
Tr
WN
Tr
WP
Th
CR
RN CR
SN CR
TN
CR
RP CR
SP CR
TP
Di
WP
Di
VP
Tr
VP
Di
UP
Tr
UP