Microstrips .050" Contact Spacing MT
48
www.ittcannon.com
Dimensions shown in inch (mm)
Specifications and dimensions subject to change
The Cannon Microstrips provide an extremely
dense and reliable interconnection solution in
aminimum profile package, giving great appli-
cation flexibility. Available with latches or
guide pins, Microstrips are frequently found in
board-to-wire applications where high reliabili-
ty is a primary concern.
Three termination styles are available: solder
cup, pigtail, harness, or printed circuit leads.
The MicroPin Contact System assures maxi-
mum performance in a minimum package.
Product Features
• High Performance MicroPin Contact System
•High-density .050” contact spacing
• Pre-wired for ease of installation
• Fully potted wireterminations
•Guide pins for alignment and polarizing
•Quick-disconnect latches
•3Amp current rating
• Precision crimp terminations
• Solder cup, pigtail or printed circuit terminations
• Surface mount leads
Specifications
Current Rating 3Amps max
Dielectric Withstanding Voltage 900 VAC @ sea level; 300 VAC @ 70,000 feet altitude
Insulation Resistance 5000 megohms min.
Contact Resistance 8milliohms max.
Operating Temperature MTV polyester -56°C to +125°C; MTB diallyl phthalate -55°C to +150°C
Durability 500 cycles min.
Shock/Vibration 50 G’s/20 G’s
Connector Mating Force (8 oz.) x (# of contacts)
Latch Retention 5lbs. min.
Wire Size #26 AWG insulated wire, #25 AWG uninsulated solid wire. MT strips will also accommodate #24 AWG through #32 AWG.
For other wiring options contact the factory for ordering information.
General Performance requirements in accordance with MIL-DTL-83513
Materials and Finishes
Insulator MTV:Glass-filled polyester per MIL-M-24519; MTB: Glass-filled diallyl phthalate per MIL-M-14
Contact Copper Alloy per MIL-C-83513
Contact Finish 50 Microinches Min. Gold Plated per MIL-G-45204
Insulated Wire#26 AWG. 19/38 Stranded, silver-plated copper,TFE Teflon insulation per MIL-W-16878/4
Uninsulated Solid Wire#25 AWG gold-plated copper per QQ-W-343
Potting Material/Contact Encapsulant Epoxy
Latch 300 series stainless steel, passivated
MicroPin Contact System
The Cannon MicroPin Contact System offers
uncompromised performance in downsized
interconnects. The beryllium copper pin contact is
fully recessed in the insulator, assuring positive
contact alignment and robust performance. The
socket contact is precision machined from high
strength copper alloy and features a smooth lead-in
chamfer.
The MicroPin features seven points of electrical
contact. This contact system assures high normal
force, excellent wipe and superior shock and
vibration performance.