MRF24J40MB-I/RM - Microchip Technology

 2009 Microchip Technology Inc. Preliminary DS70599B

MRF24J40MB

Data Sheet

2.4 GHz IEEE Std. 802.15.4™

20 dBm RF Transceiver Module

DS70599B-page ii Preliminary  2009 Microchip Technology Inc.

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• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

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 2009 Microchip Technology Inc. Preliminary DS70599B-page 1

MRF24J40MB

Features:

• IEEE Std. 802.15.4™ Compliant RF Transceiver

• Supports ZigBee®, MiWi™, MiWi P2P and

Proprietary Wireless Networking Protocols

• Small Size: 0.9" x 1.3" (22.9 mm x 33.0 mm),

Surface Mo untable

• Integrated Crystal, Internal Voltage Regulator,

Matching Circuitry, Power Amplifier, Low Noise

Amplifie r and PCB Antenna

• Easy Integration into Final Product – Minimize

Product Development, Quicker Time to Market

• Radio Regulation Certified for United States

(FCC), Canada (IC) and Europe (ETSI)

• Compatible with Microchip Microcontroller

Families (PIC16F, PIC18F, PIC24F/H, dsPIC33

and PIC32)

• Up to 4000 ft. Range

Operational:

• Operating Voltage: 2.4-3.6V (3.3V typical)

• Temperature Range: -40C to +85C Industrial

• Simple, F our- Wire SPI Int erface

• Low-Current Consumption:

- RX mode: 25 mA (typical)

- TX mode: 130 mA (typical)

- Sleep: 5 A (typic al)

RF/Analog Features:

• ISM Band 2.405-2.475 GHz Operation

• Data Rate: 250 kbps

• -102 dBm Typical Sensitivity with -23 dBm

Maximum Input Level

• +20 dBm Typical Output Power with 56 dB TX

Power Control Range

• Integrated Low Phase Noise VCO, Frequency

Synthesizer and PLL Loop Filter

• Digital VCO and Filter Calibration

• Integrated RSSI ADC and I/Q DACs

• Integrated LDO

• High Receiver and RSSI D ynamic Range

MAC/Baseband Features:

• Hardware CSMA-CA M echanism, Automa tic ACK

Response and FCS Check

• Independent Beacon, Transmit and GTS FIFO

• Supports all CCA modes and RSS/LQI

• Autom ati c Packet Re tran sm it Cap able

• Hardware Security Engine (AES-128) with CTR,

CCM and CBC-MAC modes

• Supports Encryption and Decryption for MAC

Sublayer and Upper Layer

FIGURE 1: PIN DIAGRAM

VIN

GND

RESET

WAKE

SDO

SDI

SCK CS

GND

INT

11 GND

2.4 GHz IEEE Std. 802.15.4

™ 20 dBm

RF Transceiver Module

MRF24J40MB

DS70599B-page 2 Preliminary  2009 Mic rochip Tec hnology Inc.

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 3

2.0 Circuit Desc r i p tion ....................... ........... ................... ................... ................... .......... ................................................................... 9

3.0 Regulatory Approval.................................................. .... .... .... ......... .... .... .... ......... .... .... .. ... .......................................................... 19

4.0 Electrical Characteristics ........................................................................................................................................................... 23

Appendix A: Revision History............... ............................................ .................................................................................................... 25

Index ...................................................................................................................................... ...... ..... ...... ...... ..... ...... ...... ...... ..... ...... .... 27

The Micro chip Web Site.......... ........................... ........................... ............................ ........................................................................... 29

Customer Change Notification Service ............................................................ ................... ........ ......................................................... 29

Customer Support................................................................................................................................................................................ 29

Reader Response......................................................... . ...................................................................................................................... 30

Product Identification System............................................................................................................................................................... 31

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Customer No tific atio n Syst em

 2009 Microchip Technology Inc. Preliminary DS70599B-page 3

MRF24J40MB

1.0 DEVICE OVERVIEW

The MRF24J40MB is a 2.4 GHz IEEE Std. 802.15.4™

compliant, surface mount module with integrated

crystal, internal voltage regulator, matching circuitry,

Power Amplifier, Low Noise Amplifier and PCB

antenna. The MRF24J40MB module operates in the

non-licensed 2.4 GHz frequency band. The integrated

module design frees the integrator from extensive RF

and antenna design, and regulatory compliance

testing, allowing quicker time to market.

The MRF24J40MB module is compatible with

Microchip’s ZigBee®, MiWi™ and MiWi P2P software

stacks. Each software stack is available as a free

download, including source code, from the Microchip

web site: http://www.microchip.com/wireless.

The MRF24J40MB module has received regulatory

approvals for modular devices in the United States

(FCC), Canada (IC) and Europe (ETSI). Modular

approval removes the need for expensive RF and

antenna design, and allows the end user to place the

MRF24J40MB module inside a finished product and

not require regul atory testing for an inten tion al radia tor

(RF transmitte r).

1.1 Interface Description

Figure 1-1 shows a simplified block diagram of the

MRF24J40MB module. The module is based on the

Microchip Technology MRF24J40 IEEE 802.15.4™

2.4 GHz RF Transceiver IC. The module inte rfaces to

many popular Microchip PIC® microcontrollers via a

4-wire serial SPI interface, interrupt, wake, Reset,

power and groun d, as sh own in Fi gure 1-2. Table 1-1

provides the pin descriptions.

Data communications with the MRF24J40MB module

are documented in the “MRF24J40 IEEE 802.15.4™

2.4 GHz RF T ransceiver Data Sheet” (DS39776). Refer

to the MRF24J40 Data Sheet for specific serial

interface protocol and register definitions.

FIGURE 1-1: MRF24J40MB BLOCK DIAGRAM

Note: See Secti o n 3 . 0 “ Reg u l ato r y A p pr ov a l ”

for specifi c requirement s to be followed by

the integrator.

PCB

Antenna

Physical MAC

Interface

Power

Management

SPI

20 MHz

Crystal

Digital

I/O

Power

MRF24J40MB IEEE Std. 802.15.4™ Module

MRF24J40

LNA

MRF24J40MB

DS70599B-page 4 Preliminary  2009 Microchip Technology Inc.

FIGURE 1-2: MICROCONTROLLER TO MRF24J40MB INTERFACE

TABLE 1-1: PIN DESCRIPTION

Pin Symbol Type Description

1 GND Power Ground

2 RESET DI Global hardware Reset pin

3 WAKE DI Ex tern al wake -up trigger

4 INT DO Interrupt pin to microcontroller

5 SDI DI Serial interface data input

6 SCK DI Serial interface clock

7 SDO DO Serial interface data output from MRF24J40

8CS DI Serial interface enable

9 NC — No conne cti o n

10 VIN Power Power supply

11 GND Ground Ground

12 GND Ground Ground

Legend: Pin type abbreviation: D = Digital, I = Input, O = Output

SDO

I/O

SDI

SCK

INTx

MRF24J40MB

SDI

SDO

SCK

INT

I/O WAKE

VIN

GND

PIC® MCU

I/O RESET

 2009 Microchip Technology Inc. Preliminary DS70599B-page 5

MRF24J40MB

1.2 Mounting Details

The MRF24J40MB is a surface mountable module.

Module dimensions are shown in Figure 1-3. The

module Printed Circuit Board (PCB) is 0.032" thick with

castellated mounting points on the edge. Figure 1-4 is

a recommended host PCB footprint for the

MRF24J40MB.

The MRF24J40MB has an integrated PCB antenna.

For the best performance, follow the mounting details

shown in Figure 1-5. It is recommended that the

module be mounted on the edge of the host PCB, and

an area around the antenna, approximately 1.2", be

kept clear of metal objects. A host PCB ground plane

around the MRF24J40MB acts as a counterpoise to the

PCB antenn a. It is reco mmended to extend the ground

plane at least 0.4" around the module.

FIGURE 1-3: MODULE DETAILS

FIGURE 1-4: RECOMMENDED PCB

FOOTPRINT

MRF24J40MB

DS70599B-page 6 Preliminary  2009 Microchip Technology Inc.

FIGURE 1-5: MOUNTING DETAILS

0.315”

Edge of PCB

Keep area around antenna

(approximately 1.2 inches)

clear of metallic structures

for best performance

PCB Ground Plane (Counterpoise)

Underneath and extend as far as possible

to the sides and below the module

(at least 0.4 inches on each side)

for best performance

0.4”

0.4” 0.4”

1.2”

 2009 Microchip Technology Inc. Preliminary DS70599B-page 7

MRF24J40MB

1.3 Operation

1.3.1 PA/LNA CONTROL

Operation of the Power Amplifier (P A) IC3 and Low Noise

Amplifier (LNA) IC5 is controlled by the MRF24J40

intern al R F s t a te m ac h in e v ia RF s w itc h es , IC2 an d IC 4 ,

and the GPIO1 and GPIO2 pins on the MRF24J40.

Figure 1-6 shows the PA/LNA block diagram. Figure 2-1

is the schematic diagram for the module.

The internal RF state machine is configured for the PA/

LNA mode by setting TESTMODE (0x22F<2:0>) = 111.

Pins, GPIO1 and GPIO2, then control the RF switches,

PA and LNA automatically when the MRF24J40

receives and transmit s d at a.

FIGURE 1-6: PA/LNA BLOCK DIAGRAM

1.3.2 ENERGY DETECTION (ED)

Before performing an energy detection (see

Section 3.6.1 “RSSI Firmware Request (RSSI

Mode 1)” in the “MRF24J40 Data Sheet” (DS39776)),

perform the following steps :

1. Configure the internal RF state machine to normal

operation (TEST MOD E (0x 2 2F< 2:0>) = 000).

2. Configure GPIO2 and GPIO1 direction for the

outp ut (T RISGP 2 (0x3 4<2> ) = 1 and TRISGP1

(0x34<1>) = 1).

3. Set GPIO2 (0x33<2>) = 1 and GPIO1

(0x32<1>) = 0. This enables the LNA and

disa bl es the PA.

4. Perform the energy detect ion following the steps

in Section 3.6.1 “RSSI Firmware Request

(RSSI Mode 1)” in the “MRF24J40 Data Sheet”

(DS39776).

1.3.3 SLEEP

To get the lowest power consumption from the

MRF24J 40MB module during Sleep, it is necessary to

disable both the PA and LNA. To do this, perform the

following steps:

1. Configure the internal RF state machine to normal

operation (TESTMODE (0x22F<2:0>) = 000).

2. Configure the GPIO2 and GPIO1 direction for

output (TRISGP2 (0x3 4<2>) = 1 and TRISGP1

(0x34<1>) = 1).

3. Set GPIO2 (0x33<2>) = 0 and GPIO1

(0x32<1>) = 0. This disables the LNA and the P A.

4. Put the MRF24J40 to Sleep following the steps

in the “MRF24J40 Data Sheet” (DS39776).

When waking the modul e, re-enable the PA/LNA mode.

Note: A complete ex planation of the operati on of

the PA/LNA control is documented in the

“MRF24J40 Data Sheet” (DS39776),

Section 4.2 “Ex t ernal PA/LNA C ontrol” .

MRF24J40

GPIO1

GPIO2

PCB

Antenna

Balun RFP

RFN

PA2423L

LNA

RF Switch

AS179-92 RF Switch

AS179-92

LNA

uPC8233TK

V1 V2 V1 V2

Note: The LNA will amplify the received signal.

The RSSI value will include the receive

signal streng th plus the LNA a mplifi catio n.

MRF24J40MB

DS70599B-page 8 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70599B-page 9

MRF24J40MB

2.0 CIRCUIT DESCRIPTION

The MRF24J40MB is a complete 2.4 GHz IEEE

Std. 802.15.4™ compliant surface mount module with

integrated crystal, internal voltage regulator, matching

circuitry, Power Amplifier, Low Noise Amplifier and PCB

antenna. The MRF24J40MB module interfaces to many

popular Microchip PIC microcontrollers via a 4-wire

serial SPI interface, interrupt, wake, Reset, power and

ground. Data communications with the MRF24J40MB

module are documented in the “MRF24J40 IEEE

802.15.4™ 2.4 GHz RF Transceiver Data Sheet”

(DS39776). Refer to the MRF24J40 Data Sheet for

specific serial interface protocol and regis te r definitions.

2.1 Schematic

A schematic diagram of the module is shown in

Figure 2-1 and the Bill of Materials (BOM) is shown in

Table 2-1.

The MRF24J40MB module is based on the Microchip

Technology MRF24J40 IEEE 802.15.4™ 2.4 GHz RF

Transceiver IC (U1). The serial I/O (SCK, SDI, SDO

and CS), RESET, WAKE and INT pins are brought out

to the modul e pin s. The SDO s ignal is tri-st ate buf fered

by IC7 to solve a silicon errata, where the SDO signal

does not release to a high-impedance state, after the

CS pin returns to its inactive state.

Crystal, X1, is a 20 MHz crystal with a frequency

tolerance of ±10 ppm @ 25°C to meet the IEEE Std.

802.15.4 symbol rate tolerance of ±40 ppm.

A balun is formed by components: L1, L2, L3, C2, C3

and C 4. L2 is al so a pu l l-u p f o r th e RF P an d RF N pi ns

on the MRF24J40. C4 also acts as a DC block

capacitor. RF switches, IC2 and IC4, switch between

the power amplifier, IC3, when transmitting and low

noise am plifier, IC5, when receiv ing. A low- pass fil ter is

formed by components: L10, L11, C31, C32 and C36.

The remaining passive components provide bias and

decoupling.

MRF24J40MB

DS70599B-page 10 Preliminary  2009 Mic rochip Tec hnology Inc.

FIGURE 2-1: MRF2 4J40 MB SCHE MATIC

10 MF

2.2 MF

1 MF

20 MHz

 2009 Microchip Technology Inc. Preliminary DS70599B-page 11

MRF24J40MB

TABLE 2-1: MRF24J40MB BILL OF MATERIALS

Designator Description Manufacturer Part Number

C2 Chip Capacitor 0402 CO G 0.5P Johanson Technology 500R07S0R5AV4T

C3 Chip Capacitor 0402 CO G 0.5P Johanson Technology 500R07S0R5AV4T

C4 Chip Capacitor 0402 CO G 1.0P Johanson Technology 500R07S1R0BV4T

C5 Chip Capacitor 0402 COG 1.5P Murata GRM1555C1H1R5CZ01D

C6 Not Used

C7 Chip Capacitor 0402 COG 4.7P Murata GRM1555C1H4R7CZ01D

C8 Chip Capacitor 0402 COG 4.7P Murata GRM1555C1H4R7CZ01D

C9 Chip Capacitor 0402 COG 10P Murata GRM1555C1H100JZ01D

C10 Chip Capacitor 0402 COG 10P Murata GRM1555C1H100JZ01D

C11 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D

C12 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D

C13 Chip Capacitor 0402 COG 15P Murata GRM1555C1H150JZ01D

C14 Chip Capacitor 0402 COG 15P Murata GRM1555C1H150JZ01D

C16 Chip Capacitor 0402 COG 22P Murata GRM1555C1H220JZ01D

C17 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D

C18 Chip Capacitor 0402 COG 5.6P Murata GRM1555C1H5R6CZ01D

C19 Chip Capacitor 0402 COG 1.8P Murata GRM1555C1H1R8CZ01D

C20 Chip Capacitor 0402 X7R 1N Murata GRM155R71H102KA01D

C21 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D

C22 Chip Capacitor 0402 X7R 1N Murata GRM155R71H102KA01D

C23 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D

C24 Not Used

C25 Chip Capacitor 0402 X7R 1N Murata GRM155R71H102KA01D

C26 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D

C27 Chip Capacitor 0402 COG 10P Murata GRM1555C1H100JZ01D

C28 Chip Capacitor 0402 COG 100P Murata GRM1555C1H101JZ01D

C29 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D

C30 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D

C31 Chip Capacitor 0402 COG 1.5P Johanson Technology 500R07S1R5BV4T

C32 Chip Capacitor 0402 COG 0.4P Johanson Technology 500R07S0R4AV4T

C33 Chip Capacitor 0402 COG 18P Murata GRM1555C1H180JZ01D

C34 Chip Capacitor 0402 COG 18P Murata GRM1555C1H180JZ01D

C35 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D

C36 Not Used

C37 Chip Capa citor 0805 X5R 10U Murata GRM21BR60J106ME19L

C38 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D

C39 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D

C40 Chip Capacitor 0402 X5R 1U Murata GRM155R60J105ME19D

C41 Chip Capacitor 0402 X7R 10N Murata GRM155R71E103KA01D

C42 Chip Capacitor 0402 X7R 10N Murata GRM155R71E103KA01D

C43 Chip Capacitor 0402 COG 100P Murata GRM1555C1H101JZ01D

C44 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D

C45 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D

Note: Capacitors and inductors cannot be substituted.

MRF24J40MB

DS70599B-page 12 Preliminary  2009 Mic rochip Tec hnology Inc.

C46 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D

C47 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D

C48 Chip Capacitor 0603 X5R 2.2U Murata GRM188R60J225ME01D

IC1 802.15. 4 Radi o Microchip MRF24J40 -I/M L

IC2 Switch SPDT Skyworks AS179-92

IC3 Power Amplifier SiGe PA2423L-R

IC4 Switch SPDT Skyworks AS179-92

IC5 Low Noise Amplifier NEC UPC8233TK-E2-A

IC6 Volt a ge Re gu lato r Microc hip MCP170 0T-3302E/TT

IC7 Buf fe r-SC70 Pac ka ge Fairchil d NC7SZ125 P5X

L1 Chip Inductor 0402 8.2N Panasonic ELJ-RF8N2JFB

L2 Chip Inductor 0402 2.7N Panasonic ELJ-RF2N7DFB

L3 Chip Inductor 0402 4.7N Panasonic ELJ-RF4N7DFB

L4 Chip Resistor 0402 0Ohms Dale CRCW04020000Z0ED

L5 Chip Inductor 0402 3.3N Panasonic ELJ-RF3N3DFB

L6 Chip Inductor 0402 3.9N Panasonic ELJ-RF3N9DFB

L7 Chip Inductor 0402 1.5N Panasonic ELJ-RF1N5DFB

L8 Chip Inductor 0402 18N Panasonic ELJ-RF18NJFB

L9 Chip Inductor 0402 1.5N Panasonic ELJ-RF1N5DFB

L10 Chip Inductor 0402 2.2N Panasonic ELJ-RF2N2DFB

L11 Chip Inductor 0402 2.7N Panasonic ELJ-RF2N7DFB

R1 Ch ip Resistor 0402 10Ohms 5% Dale CRCW040210R0JNED

R2 Not Used

R3 Ch ip Resistor 0402 2.2Ohms 5% Dale CRCW04022R20JNED

R4 Ch ip Resistor 0402 10K 5% Dale CRCW040210K0JNED

R7 Not Used

R8 Not Used

S Shield-Custom TBD

X1 20 MHz Crystal Abracon ABM8-156-20.0000MHZ-T

TABLE 2-1: MRF24J40MB BILL OF MATERIALS (CONTINUED)

Designator Description Manufacturer Part Number

Note: Capacitors and inductors cannot be substituted.

 2009 Microchip Technology Inc. Preliminary DS70599B-page 13

MRF24J40MB

2.2 Printed Circuit Board

The MR F24J4 0MB m odule printe d circuit bo ard is co n-

structed with FR4 material, four layers and

0.032 inches thick. The layers are shown in Figure 2-2

through Figure 2-6. The stack up of the PCB is shown

in Figure 2-7.

FIGURE 2-2: TOP SILK SCREEN

FIGURE 2-3: TOP COPPER FIGURE 2-4: LAYER 2 – GROUND

PLANE

Note: Top view positive Gerber.

MRF24J40MB

DS70599B-page 14 Preliminary  2009 Mic rochip Tec hnology Inc.

FIGURE 2-5: LAYER 3 – POWER

PLANE FIGURE 2-6: BOTTOM COPPER

FIGURE 2-7: PCB LAYER STACK UP

Note: Top view positive Gerber.

Note: Top view.

Top Copper

Ground Plane

Power Plane

Bottom Copper

1/2 oz. Copper

8 mil FR4

12 mil FR4

8 mil FR4

0.032‚

+/- 0.005‚

 2009 Microchip Technology Inc. Preliminary DS70599B-page 15

MRF24J40MB

2.3 PCB Antenna

The PCB antenna is fabricated on the top copper trace.

Figure 2-8 shows the trace dimensions. The layers

below the antenna have no cop per traces . The gr ound

and power planes under the components serve as a

counterpoise to the PCB antenna. Additional ground

plane on the host PCB will substantially enhance the

performance of the module. For best performance,

place the module on the host PCB following the

recommendations in Section 1.2 “ M ou n t i ng Detail s” .

The Printed Circuit Board (PCB) antenna was designed

and simulated using Ansoft Designer® and HFSS™ 3D

full-wave solver software by Ansoft Corporation

(www.ansoft.com) and tested in an anechoic room. The

design goal was to create a compact, low-cost antenna

with the best radiation pattern. Figure 2-9 shows the

simulation drawing and Figure 2-10 and Figure 2-11

show the 2D and 3D radiation patterns, respectively. As

shown by the radiation patterns, the performance of the

antenna is dependant upon the orientation of the

module. Figure 2-12 shows the impedance simulation

and Figure 2-13 shows the SWR simulation. The

discrete matching circuitry matches the impedance of

the antenna with the MRF24J40 transc eiver IC .

FIGURE 2-8: PCB ANTENNA DIMENSIONS

1.0

1.0 1.0 1.0

0.72

3.37

0.85 0.5

3.82

4.2

6.6

4.3

1.2

1.3

2.0

3.8

5.3

8.6

22.0

1.2

6.0

1.54

0.5

9.6

2.0 6.6

Note 1: Dimensions are in mm and tolerance is +/– 0.05 mm.

MRF24J40MB

DS70599B-page 16 Preliminary  2009 Mic rochip Tec hnology Inc.

FIGURE 2-9: PCB ANTENNA SIMULATION DRAWING

FIGURE 2-10: SIMULATED 2D RADIATION PATTERN

 2009 Microchip Technology Inc. Preliminary DS70599B-page 17

MRF24J40MB

FIGURE 2-11: SIMULATED 3D RADIATION PATTERN

FIGURE 2-12: SIMULATED PCB ANTENNA IMPEDANCE

MRF24J40MB

DS70599B-page 18 Preliminary  2009 Mic rochip Tec hnology Inc.

FIGURE 2-13: SIMULATED PCB ANTENNA SWR

 2009 Microchip Technology Inc. Preliminary DS70599B-page 19

MRF24J40MB

3.0 REGULATORY APPROVAL

The MRF24J40MB module has received regulatory

approvals for modular devices in the United States,

Canada and European countries. Modular approval

allow s the end user to pl ace the MRF 24J40MB mo dule

inside a finished product and not require regulatory

testing for an intentional radiator (RF transmitter), pro-

vided no changes or modifications are made to the

module circuitry. Changes or modifications could void

the user’s auth orit y to operate the equipm ent . The en d

user must comply with all of the instructions provided

by the Grantee, which indicate installation and/or

operating conditions necessary for compliance.

The integrator may still be responsible for testing the end

product for any additional compliance requirements

required with this module, installed (for example: digital

device emission, PC peripheral requirements, etc.) in

the specific country that the end device will be marketed.

Annex F of the IEEE S td. 802.15.4 document has a good

summary of regulatory requirements in various countries

concerning IEEE Std. 802.15.4 devices. The standard

can be dow nloaded from the IEEE S tandards w eb page:

http://standards.ieee.org/getieee802/802.15.html.

Refer to the specific country radio regulations for

details on regulatory compliance.

3.1 United States

The MRF24J40MB has received Federal

Communications Commission (FCC) CFR47

Telecommunications, Part 15 Subpart C “Intentional

Radiators” 15.247 and modular approval in accordance

with FCC Public Notice DA 00-1407 Released: June 26,

2000, Part 15 Unlicensed Modular Transmitter Approval.

The MRF24J40MB module can be integrated into a

finished product without obtaining subsequent and

separate FCC approv als.

The MRF24J40MB module has been labeled with its

own FCC ID number, and if the FCC ID is not visible

when the module is installed inside another device,

then the outside of the finished product into which the

module is instal led must als o display a label referr ing to

the enclosed module. This exterior label can use

wording such as the following:

The user’s manual should include the following

statement:

3.1.1 MRF24J40MB SETTINGS

To meet the FCC requirements, the following settings

must be observed by the integrator:

• The MRF24J40MB transmit power setting

(RFCON3 0x203) cannot exceed -1.9 dB.

• Only channels 11 through 25 may be selected

(RFCON0 0x200).

3.1.2 RF EXPOSURE

All trans mitte rs reg ulated by FCC m ust com ply wi th RF

exposure requirements. OET Bulletin 65 “Evaluating

Compliance with FCC Guidelines for Human Exposure

to Radio Frequency Electromagnetic Fields” provides

assistance in determining whether proposed or existing

transmitting facilities, operations or devices comply

with limits for human exposure to Radio Frequency

(RF) fields adopted by the Federal Communications

Commission (FCC). The bulletin offers guidelines and

suggestions for evaluating compliance.

If appr opriate , comp lianc e with ex posure guidel ines for

mobile and unlicensed devices can be accomplished

by the use of warning labels and by providing users

with information concerning minimum separation

distances from transmitting structures and proper

installation of antenna s.

Cont ai ns Transmitte r Modu le FC C ID:

OA3MRF24J40MB

-or-

Contains FCC ID: OA3MRF24J40MB

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:

(1) this device may not cause harmful interference,

and (2) this device must accept any interference

received, including interference that may cause

undesired operation.

This equipment has been tested and found to comply

with the limits for a Class B digital device, pursuant to

part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful

interference in a residential installation. This

equipment generates, uses and can radiate radio

frequency energy, and if not installed and used in

accordance with the instructions, may cause harmful

interference to radio communications. However, there

is no guarantee that interference will not occur in a

particular installation. If this equipment does cause

harmful interference to radio or television reception,

which can be determined by turning the equipment off

and on, the user is encouraged to try to correct the

interference by one or more of the following measu res:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment

and receiver.

• Connect the equipment into an outlet on a

circuit dif ferent f rom tha t to which t he rece iver i s

connected.

• Consult the dealer or an experienced radio/TV

technician for help.

MRF24J40MB

DS70599B-page 20 Preliminary  2009 Mic rochip Tec hnology Inc.

The following statement must be included as a

CAUTIO N statement in manuals and OEM products to

alert users of FCC RF exposure compliance:

If the MRF24J40MB module is used in a portable

application (antenna is less than 20 cm from persons

during operation), the integrator is responsible for

performing Specific Absorption Rate (SAR) testing in

acco rdan ce with FC C rules 2.1091.

3.1. 3 HELPFUL WEB SITES

Federal Communications Commission (FCC):

http://www.fcc.gov

3.2 Canada

The MRF24J40MB module has been certified for use in

Canada under Industry Canada (IC) Radio Standards

Specification (RSS) RSS-210 and RSS-Gen.

From Section 7.1.1, RSS-Gen, Issue 2, June 2007,

Modular Transmitter Approval:

Host devices which contain separately certified

modules do not need to be recertified, provided that

they meet the fol low i ng con dit ion s:

a) The host device, as a stand-alone unit

without any separately certified modules,

complies with all applicable Radio S tandards

Specifications.

b) The host device and all the separately

certifie d modules it c ontains j ointly meet th e

RF exposure compliance requirements of

RSS-102, if applicable.

c) The host device complies with the

certification labeling requiremen t s of each of

the modules it cont ains .

From Section 5.2, RSS-Gen, Issue 2, June 2007,

Equipment La bels:

All Category I radio equipment intended for use in

Canada shall permanently display on each transmitter,

receiver or inseparable combination thereof, the

applicant’s name (i.e., manufacturer’s name, trade

name or brand name), model number and certification

number. This information shall be affixed in such a

manner as to not be removable ex cept by destruc tion or

defacement. The size of the lettering shall be legible

without the aid of m agnification, but is not required to be

larger than an 8-point font size. If the device is too small

to meet this condition, the information can be inc luded in

the user manual upon agreement with Ind ustry Canada.

Label:

From Section 7.1.6, RSS-Gen, Issue 2, June 2007,

Digital Circuits:

If the device contains digital circuitry that is not directly

associated with the radio transmitter, the device shall

also have to comply with ICES-003, Class A or B as

appropriate, except for ICES-003 labeling

requirem ents. The tes t data obta ined (for the ICES-003

tests) shall be kept by the manufacturer or importer

whose name appears on the equipment label, and

made available to Industry Canada on request, for as

long as the model is being marketed in Canada.

3.2.1 MRF24J40MB SETTINGS

To meet Industry Canada (IC) requirements, the following

settin gs m u st be observed b y th e integrator:

• The MRF24J40MB transmit power setting

(RFCON3 0x203) cannot exceed -1.9 dB.

• Only channels 11 through 25 may be selected

(RFCON0 0x200).

3.2. 2 HELPF UL WEB SITES

Industry Canada: http://www.ic.gc.ca/

Note: Compliance of a module in its final

configuration is the responsibility of the

applicant. A host device will not be

considered certified if the instructions

regarding antenna configuration provided

in the original description, of one or more

separately certified modules it contains,

were not followed

To satisfy FCC RF ex pos ure requ irem en ts for mobile

and base station transmission devices, a separation

distance of 20 cm or more should be maintained

between the antenna of this device and persons

during op erat ion. To ensure co mplia nce, op eratio n at

closer than this distance is not recommended.

The antenna(s) used for this transmitter must not be

co-located or operating in conjunction with any other

antenna or transmitter.

Cont ai ns IC : 7693 A-24J 40 MB

 2009 Microchip Technology Inc. Preliminary DS70599B-page 21

MRF24J40MB

3.3 Europe

The MRF24J40MB module has been certified for use in

European countries. The following testing has been

completed:

Test standard ETSI EN 300 328 V1.7.1 (2006-10):

• Maximum Transmit Power

• Maximum EIRP Spectral Density

• Frequ enc y R ang e

• Radia ted Emi ss io ns

Test standards ETSI EN 301 489-1:2008 and ETSI

EN 301 489 -17: 200 8:

• Radia ted Emi ss io ns

• Electrostatic Discharge

• Radia ted RF Susce pti bil ity

A helpful document that can be used as a starting point

in underst anding the use of Short Range Devices (SR D)

in Europe is the European Radio Communications

Committee (ERC) Recommendation 70-03 E,

downloadable from the European Radio

Communications Office (ERO): http://www.ero.dk.

The end user is responsible for ensuring compliance

with harmonized frequencies and labeling

requirements for each country the end device is

marketed and sold .

3.3.1 MRF24J40MB SETTINGS

To meet ETSI requirements, the followi ng settings must

be observed by the integrator:

• The MRF24J40MB transmit power setting

(RFCON3 0 x203) can not exce ed -14.9 dB. T his is

to meet the requirements of ETSI EN 300 328

v1.7.1 (2006-05), Maximum e.i.r.p. spectral

density limit, Section 4.3.2.2, “For wideband

modulations other then FHSS (e.g., DSSS,

OFDM, etc.), the maximum e.i.r.p. spec tral

density is limited to 10 mW per MHz”. The output

power o f the MRF24J40 MB module, a t this sett ing

with the PA enabled, is 9 dBm.

• Only channels 11 through 25 may be selected

(RFCON0 0x200).

3.3. 2 HELPF UL WEB SITES:

Radio and Telecommunications Terminal Equipment

(R&TTE):

http://ec.europa.eu/enterprise/rtte/index_en.htm

European Conference of Postal and T elecommunications

Admi ni strations ( CEPT): http :/ /www.cept. o rg /

European Telecommunications Standards Institute

(ETSI): http://www.etsi.org/

European Radio Communications Office (ERO):

http://www.ero.dk/

MRF24J40MB

DS70599B-page 22 Preliminary  2009 Mic rochip Tec hnology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70599B-page 23

MRF24J40MB

4.0 ELECTRICAL CHARACTERISTICS

TABLE 4-1: RECOMMENDED OPERATING CONDITIONS

Parameters Min Typ Max Units

Ambient Op era ting Tempera ture -40 — +85 °C

Supply Voltage for RF, Analog and

Digital Circuits 2.4 — 3.6 V

Supply Voltage for Digital I/O 2.4 3 .3 3.6 V

Input High Voltage (VIH) 0.5 x VDD —VDD + 0.3 V

Input Low Voltage (VIL) -0.3 — 0.2 x VDD V

TABLE 4-2: CURRENT CONSUMPTION

(TA = 25°C, VDD = 3.3V)

Chip Mode Condition Min Typ Max Units

Sleep Sleep Clock Disabled — 5 A— A

TX At Maximum Output Power — 130 mA — mA

RX — 25 mA — mA

TABLE 4-3: RECEIVER AC CHARACTERISTICS

Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz

Parameters Condition Min Typ Max Units

RF Input Frequency Compatible to

IEEE Std. 802.15.4™, 2003 2.405 — 2.480 GHz

RF Sensitivi ty — -102 — dBm

Maximu m RF Input -23 — — dBm

LO Leakage Measured at Balun Matching

Network Inpu t at Frequency,

2.405-2.48 GHz

—-60—dBm

Input Return Loss -8 -12 — dB

Noise Figure

(including matching) —1.9—dB

Adjacent Channel

Rejection @ +/-5 MHz 30 — — dB

Alternate C han nel

Rejection @ +/-10 MHz 40 — — dB

RSSI Range — 50 — dB

RSSI Error -5 — 5 dB

MRF24J40MB

DS70599B-page 24 Preliminary  2009 Mic rochip Tec hnology Inc.

TABLE 4-4: TRANSMITTER AC CHARACTERISTICS

Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz

Parameters Condition Min Typ Max Units

RF Carrier Freque nc y 2.405 — 2.475 GHz

Maximu m RF Output

Power —20—dBm

RF Output Power

Control Range —56—dB

TX Gain Control

Resolution Programmed by Register — 1.25 — dB

Carrier Suppres sion — -30 — dBc

TX Spectrum Mask for

O-QPSK Signal Offset Frequency > 3.5 MHz,

at 0 dBm Output Power -33 — — dBm

TX EVM — 15 — %

 2009 Microchip Technology Inc. Preliminary DS70599B-page 25

MRF24J40MB

APPENDIX A: REVISION HISTORY

Revision A (June 2009)

Original release of this document.

Revision B (August 2009)

Added Sec tion 3.0 “Regulato r y Appro val ”.

MRF24J40MB

DS70599B-page 26 Preliminary  2009 Mic rochip Tec hnology Inc.

NOTES:

DS70599B-page 27 Preliminary  2009 Mic rochip Tec hnology Inc.

MRF24J40MB

INDEX

AC Characteristics

Receiver......................................................................23

Transmitter..................................................................24

Antenna Impedance

Simula te d PCB.......................... ................... ...............17

Bill of Materials (BOM) ........................................................11

Block Diagrams

Micr o co n troller to MRF2 4J4 0 MB Interface....... .............4

MRF24J40MB ...............................................................3

PA/LNA .........................................................................7

Circuit Description.................................................................9

Customer Change Notification Service ...............................28

Customer Notification Service.............................................28

Customer Support...............................................................28

Details

Module ..........................................................................5

Mounting .......................................................................6

Recommended PCB Footprint . .....................................5

Electrical Character i stics.... ................... ............................ ..23

Curren t Co nsu m p tio n..................................... .............23

Recommended Operating Conditions.........................23

Errata.....................................................................................2

European Radio Communications (ERC)............................21

FCC ID Number..................... .................. ................... .........19

FCC RF Exposure Compliance......... ........................... .......20

Helpful We b Si te s............. ...................................... .......20, 21

Inter face Description............... ................... .................. .........3

Inter net Address.................................. ............................ ....28

MAC/Baseband Features......................................................1

Micr o chi p Internet Web Site...... ................................... .......28

MiWi P2P. .................................... ........................... ...............3

MiWi Protocol..... ........................... ........................... .............3

More Information...................................................................2

Customer Notification System.......................................2

Errata ............................................................................2

Mounting Details............................ .... .. .. .. ....... .... .. .. .. .... ....... ..5

MRF24J40 Data Sheet................... ...................................3, 9

Operation

Energ y Dete ction (ED) ................ ........... ................... ....7

PA/LNA Con trol................. ................... ................... ......7

Sleep.............................................................................7

Overview ...............................................................................3

PCB Antenna...................... ................................................15

Dimensions................................................................. 15

Simul atio n Drawin g......................................... .......... ..16

SWR ...........................................................................18

PCB Layers

Bottom Copper......................................... .. ....... .... .. ....14

Layer 2 – Ground Plane..............................................13

Layer 3 – Power Plane ............................................... 14

Stack Up .....................................................................14

Top Copper.................................. .... .. .. .. .. .. ....... .. .. .... ..13

Top Silk Screen ...... ........................... ................... ......13

Pin Description......................................................................4

Pin Diagram..........................................................................1

Print e d Cir cuit Bo a r d ( PCB). .. ...... ..... ...... .. ...... .. ..... ...... ...... . 13

Radiation Pattern

2D............................................................................... 16

3D............................................................................... 17

Reader Response...................... .........................................29

Regulatory Approval .............................. .... .... .... .. ......... .... ..19

Canada....................................................................... 20

Settings............................................................... 20

Europe ........................................................................ 21

Settings............................................................... 21

United States .............................................................. 19

Settings............................................................... 19

Revi si o n H i s tory.. .. ...... ..... ...... ...... ..... ...... ...... ...... ..... ...... ..... 25

RF Exposure....................... ........................... ..................... 19

RF/Analog Features..............................................................1

Schematic

MRF24J40MB.............................................................10

Serial I/O

SCK, SDI , SDO , CS......................................................9

Short Range Devices (SRD)...............................................21

Specif ic Absorption Rate (SAR).......................................... 20

SPI........................................................................................9

WWW Addr ess....................................................................28

WWW, On-Line Support .......................................................2

ZigBee Protocol ... ........................... ...................................... 3

MRF24J40MB

DS70599B-page 28 Preliminary  2009 Mic rochip Tec hnology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70599B-page 29

MRF24J40MB

THE MICROCHIP WEB SITE

Microc hip pro vides onl ine s upport v ia our W WW site at

www.microchip.com . Thi s w eb si te i s us ed as a m ean s

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

•Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

•General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online dis cu ss io n gr oups, Microchip con sul tant

program member listing

•Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specif ied produ ct family or develo pment tool of interes t.

To register, access the Microchip web site at

www.microchip.com, click on Customer Change

Notification and follow the registration instructions.

CUSTOMER SUPP ORT

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line

Customers should contact their distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

Technical suppo rt is avail able throug h the web si te

at: http://support.microchip.com

MRF24J40MB

DS70599B-page 30 Preliminary  2009 Mic rochip Tec hnology Inc.

READER RESP ONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our

documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-

4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To: Technical Publications Manager

RE: Reader Response Total Pages Sent ________

From: Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device: Literature Number:

Questions:

FAX: (______) _________ - _________

DS70599BMRF24J40MB

1. What are the best features of this document ?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

 2009 Microchip Technology Inc. Preliminary DS70599B-page 31

MRF24J40MB

PRODUCT IDENTIFICATION SYSTEM

To order or ob tain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. -XX T

Tape andModule Temperature

Range

Device

Device MRF24J40MB;

VDD range 2.4V to 3.6V

Temperatu re Range I = -40C to +85C (Industrial)

Examples:

a) MRF24J40MB-I = Industrial temp. tray

b) MRF24J40MBT-I = Industrial temp., tape and

reel.

Module Type Reel

DS70599B-page 32 Preliminary  2009 Mic rochip Tec hnology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Te chn ica l Support:

http://support.microchip.com

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasc a , IL

Tel: 630-285-0071

Fax: 630-285-0075

Cleveland

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Los A n ge les

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4080

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-6578-300

Fax: 886-3-6578-370

Tai wa n - Ka ohs iung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Cop e nha gen

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-14 4-44

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Spain - Ma drid

Tel: 34-91-708-08-90

Fax: 34-91-708-08 -91

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

WORLDWIDE SALES AND SERVICE

03/26/09