DATA SH EET
Product specification
Supersedes data of 1996 Oct 01 2000 May 25
DISCRETE SEMICONDUCTORS
BAS86
Schottky barrier diode
lfpage
M3D121
2000 May 25 2
Philips Semiconductors Product specification
Schottky barrier diode BAS86
FEATURES
Low forward voltage
High breakdown voltage
Guard ring protected
Hermetically-sealed small SMD
package.
APPLICATIONS
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diodes.
DESCRIPTION
Planar Schottky barrier diode with an
integrated protection ring against
static discharges.
This surface mounted diode is
encapsulatedinahermeticallysealed
SOD80C glass SMD package with
tin-plated metal discs at each end. It
is suitable for “automatic placement”
and as such it can withstand
immersion soldering.
Fig.1 Simplified outline (SOD80C), pin configuration and symbol.
handbook, halfpage
MAM190
ka
Cathode indicated by a grey band.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRcontinuous reverse voltage 50 V
IFcontinuous forward current 200 mA
IF(AV) average forward current see Fig.2 200 mA
IFRM repetitive peak forward current tp1 sec.; δ≤0.5 500 mA
IFSM non-repetitive peak forward current tp=10ms 5A
T
stg storage temperature 65 +150 °C
Tjjunction temperature 125 °C
Tamb operating ambient temperature 65 +125 °C
2000 May 25 3
Philips Semiconductors Product specification
Schottky barrier diode BAS86
ELECTRICAL CHARACTERISTICS
Tamb =25°C; unless otherwise specified.
Note
1. Pulsed test: tp= 300 µs; δ= 0.02.
THERMAL CHARACTERISTICS
Note
1. Refer to SOD80 standard mounting conditions.
SYMBOL PARAMETER CONDITIONS MAX. UNIT
VFforward voltage see Fig.3
IF= 0.1 mA 300 mV
IF= 1 mA 380 mV
IF= 10 mA 450 mV
IF= 30 mA 600 mV
IF= 100 mA 900 mV
IRreverse current VR= 40 V; see Fig.4; note 1 5 µA
trr reverse recovery time when switched from IF= 10 mA to IR= 10 mA;
RL= 100 ; measured at IR= 1 mA; see Fig.6 4ns
C
ddiode capacitance f = 1 MHz; VR= 1 V; see Fig.5 8 pF
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth j-a thermal resistance from junction to ambient note 1 320 K/W
2000 May 25 4
Philips Semiconductors Product specification
Schottky barrier diode BAS86
GRAPHICAL DATA
Fig.2 Derating curve.
handbook, halfpage
0
50
100
150
200
250
0 50 100 150
IF(AV)
(mA)
T ( C)
amb o
MRA540
handbook, halfpage
1.20.80.40 VF (V)
IF
(mA)
103
102
10
1
101
MLD357
(1) (2) (3)
(1) (2) (3)
Fig.3 Forward current as a function of forward
voltage; typical values.
(1) Tamb = 125 °C.
(2) Tamb =85°C.
(3) Tamb =25°C.
(1) Tamb =85°C.
(2) Tamb =25°C.
(3) Tamb =40 °C.
handbook, halfpage
105
10
(nA)
IR
4
103
102
10
10
1
1500
MGC686
10 20 30 40VR (V)
(1)
(2)
(3)
Fig.4 Reverse current as a function of reverse
voltage; typical values.
f = 1 MHz.
Fig.5 Diode capacitance as a function of reverse
voltage; typical values.
handbook, halfpage
050
12
Cd
0
4
8
(pF)
MGC687
10 20 30 40 VR (V)
2000 May 25 5
Philips Semiconductors Product specification
Schottky barrier diode BAS86
Fig.6 Reverse recovery definitions.
h
andbook, halfpage
90%
10%
tf
Q
dI
dt
t
IF
IR
MRC129 - 1
F
r
2000 May 25 6
Philips Semiconductors Product specification
Schottky barrier diode BAS86
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
Note
1. The marking band indicates the cathode.
SOD80C 100H01 97-06-20
Hermetically sealed glass surface mounted package; 2 connectors SOD80C
UNIT D
mm 1.60
1.45 3.7
3.3 0.3
HL
DIMENSIONS (mm are the original dimensions)
H
D
LL
(1)
0 1 2 mm
scale
ka
2000 May 25 7
Philips Semiconductors Product specification
Schottky barrier diode BAS86
DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DATA SHEET STATUS PRODUCT
STATUS DEFINITIONS (1)
Objective specification Development This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification Production This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor atanyother conditionsabovethose givenin the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplicationswillbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyof theseproducts,conveysnolicence ortitle
under any patent, copyright, or mask work right to these
products,and makes norepresentations orwarranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2000 69
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Printed in The Netherlands 613514/03/pp8 Date of release: 2000 May 25 Document order number: 9397 750 07025