DISCRETE SEMICONDUCTORS DATA SHEET lfpage M3D121 BAS86 Schottky barrier diode Product specification Supersedes data of 1996 Oct 01 2000 May 25 Philips Semiconductors Product specification Schottky barrier diode BAS86 FEATURES DESCRIPTION * Low forward voltage Planar Schottky barrier diode with an integrated protection ring against static discharges. This surface mounted diode is encapsulated in a hermetically sealed * High breakdown voltage * Guard ring protected * Hermetically-sealed small SMD package. SOD80C glass SMD package with tin-plated metal discs at each end. It is suitable for "automatic placement" and as such it can withstand immersion soldering. APPLICATIONS k handbook, halfpage * Ultra high-speed switching a * Voltage clamping * Protection circuits MAM190 * Blocking diodes. Cathode indicated by a grey band. Fig.1 Simplified outline (SOD80C), pin configuration and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage - 50 V IF continuous forward current - 200 mA IF(AV) average forward current see Fig.2 - 200 mA IFRM repetitive peak forward current tp 1 sec.; 0.5 - 500 mA tp = 10 ms IFSM non-repetitive peak forward current - 5 A Tstg storage temperature -65 +150 C Tj junction temperature - 125 C Tamb operating ambient temperature -65 +125 C 2000 May 25 2 Philips Semiconductors Product specification Schottky barrier diode BAS86 ELECTRICAL CHARACTERISTICS Tamb = 25 C; unless otherwise specified. SYMBOL VF PARAMETER forward voltage CONDITIONS MAX. UNIT see Fig.3 IF = 0.1 mA 300 mV IF = 1 mA 380 mV IF = 10 mA 450 mV IF = 30 mA 600 mV IF = 100 mA 900 mV IR reverse current VR = 40 V; see Fig.4; note 1 5 A trr reverse recovery time when switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA; see Fig.6 4 ns Cd diode capacitance f = 1 MHz; VR = 1 V; see Fig.5 8 pF Note 1. Pulsed test: tp = 300 s; = 0.02. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 Note 1. Refer to SOD80 standard mounting conditions. 2000 May 25 3 VALUE UNIT 320 K/W Philips Semiconductors Product specification Schottky barrier diode BAS86 GRAPHICAL DATA MRA540 MLD357 103 handbook, halfpage 250 handbook, halfpage I F(AV) IF (mA) (mA) 200 (1) (2) (3) 102 150 10 100 (1) (2) (3) 1 50 0 0 50 100 10-1 150 0 0.4 0.8 o Tamb ( C) VF (V) 1.2 (1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. Fig.3 Forward current as a function of forward voltage; typical values. Fig.2 Derating curve. MGC686 5 10halfpage handbook, IR (nA) MGC687 12 handbook, halfpage (1) Cd (pF) 10 4 (2) 10 3 8 10 2 10 4 (3) 1 10 -1 0 0 10 20 30 40 50 0 10 V (V) R 20 30 40 50 VR (V) (1) Tamb = 85 C. (2) Tamb = 25 C. (3) Tamb = -40 C. f = 1 MHz. Fig.4 Fig.5 Reverse current as a function of reverse voltage; typical values. 2000 May 25 4 Diode capacitance as a function of reverse voltage; typical values. Philips Semiconductors Product specification Schottky barrier diode BAS86 handbook, halfpage I F dI F dt 10% t Qr 90% IR tf MRC129 - 1 Fig.6 Reverse recovery definitions. 2000 May 25 5 Philips Semiconductors Product specification Schottky barrier diode BAS86 PACKAGE OUTLINE Hermetically sealed glass surface mounted package; 2 connectors k SOD80C a (1) D L L H DIMENSIONS (mm are the original dimensions) 0 UNIT D H L mm 1.60 1.45 3.7 3.3 0.3 1 2 mm scale Note 1. The marking band indicates the cathode. REFERENCES OUTLINE VERSION IEC SOD80C 100H01 2000 May 25 JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-20 6 Philips Semiconductors Product specification Schottky barrier diode BAS86 DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. 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