MC9S12ZVC-Family Reference Manual and Datasheet S12 MagniV Microcontrollers MC9S12ZVCRMV1 Rev. 1.9 29-January-2018 nxp.com The MC9S12ZVC family of microcontrollers is targeted at use in safety relevant systems and has been developed using an ISO26262 compliant development system under the NXP Safe Assure Program. For more details of the NXP Safe Assure program, refer to : NXP Safe Assure For more details of how to use the device in safety relevant systems refer to the MC9S12ZVC Safety Manual at nxp.com To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information available, refer to nxp.com/ A full list of family members and options is included in device overview section. The following revision history table summarizes changes contained in this document. This document contains information for all constituent modules, with the exception of the S12Z CPU. For S12ZCPU information please refer to the CPU S12Z Reference Manual. Revision History Date Revision Level Description 14-January-2016 Rev 1.4 PAD3 pin 16 in LQFP-48 and pin 20 in LQFP-64 renamed from VRH to VRH_0 Added Note on page 605 with reference to VRH and VRL connectivity Changed Temperature sensor slope and output voltage Table E-1 item 14 and 15 Added Stop IDD values for 85C and 105C to Table A14 Changed Item 7 RP_PASS in Table A-9 to 22ns 8-February-2016 Rev 1.5 Replaced Freescale logo with NXP logo 22-August-2016 Rev 1.6 Added item 18 and 19 Table E-1 Bandgap voltage and temperature dependency Changed item 5 Table H-2 ACMP input offset Added operating condition for C part to Table A-5 13-October-2016 Rev 1.7 Corrected Table 1-1 Two SCIs for 48pin packages. Corrected typo in table H-2 item 5 2-January-2018 Rev 1.8 Corrected Package Information for 64LQFP Exposed Pad 29-January-2018 Rev 1.9 Corrected Package Information for 64LQFP Exposed Pad NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the NXP product could create a situation where personal injury or death may occur. Should Buyer purchase or use NXP products for any such unintended or unauthorized application, Buyer shall indemnify and hold NXP and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that NXP was negligent regarding the design or manufacture of the part. Chapter 1 Device Overview MC9S12ZVC-Family . . . . . . . . . . . . . . . . . . . . . . . . 23 Chapter 2 Port Integration Module (S12ZVCPIMV1) . . . . . . . . . . . . . . . . . . . . 69 Chapter 3 Background Debug Controller (S12ZBDCV2) . . . . . . . . . . . . . . . . . 115 Chapter 4 Memory Mapping Control (S12ZMMCV1) . . . . . . . . . . . . . . . . . . . 153 Chapter 5 S12Z Interrupt (S12ZINTV0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module . . . . . . . . . . . . . . . . . . . . . . 179 Chapter 7 ECC Generation Module (SRAM_ECCV1) . . . . . . . . . . . . . . . . . . . 205 Chapter 8 217 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 283 Chapter 10 Supply Voltage Sensor - (BATSV3) . . . . . . . . . . . . . . . . . . . . . . . . . . 351 Chapter 11 Timer Module (TIM16B8CV3) Block Description . . . . . . . . . . . . . . 361 Chapter 12 Timer Module (TIM16B4CV3) Block Description . . . . . . . . . . . . . . 389 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) . . . . . . . . . . . . . . . . . . 407 Chapter 14 Serial Communication Interface (S12SCIV6). . . . . . . . . . . . . . . . . . 437 Chapter 15 Serial Peripheral Interface (S12SPIV5). . . . . . . . . . . . . . . . . . . . . . . 477 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description . . . . . . . . . . . . 503 Chapter 17 CAN Physical Layer (S12CANPHYV3) . . . . . . . . . . . . . . . . . . . . . . 531 Chapter 18 Scalable Controller Area Network (S12MSCANV3) . . . . . . . . . . . . 551 Chapter 19 Digital Analog Converter (DAC_8B5V_V2) . . . . . . . . . . . . . . . . . . . 605 Chapter 20 5V Analog Comparator (ACMPV2) . . . . . . . . . . . . . . . . . . . . . . . . . 617 Chapter 21 SENT Transmitter Module (SENTTXV1) . . . . . . . . . . . . . . . . . . . . 625 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) . . . . . . . . . . . . . . 643 Appendix A MCU Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 701 Appendix B ADC Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 717 Appendix C MSCAN Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 723 Appendix D SPI Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 725 Appendix E CPMU Electrical Specifications (VREG, OSC, IRC, PLL). . . . . . . 729 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 3 Appendix F BATS Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 733 Appendix G PIM Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 737 Appendix H ACMP Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 739 Appendix I S12CANPHY Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . 743 Appendix J DAC8B5V Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 749 Appendix K NVM Electrical Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 751 Appendix L Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755 Appendix M Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 760 Appendix N Detailed Register Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761 MC9S12ZVC Family Reference Manual , Rev. 1.9 4 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.1 1.2 1.3 1.4 1.5 1.6 1.7 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 1.2.1 MC9S12ZVC-Family Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Chip-Level Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Module Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 1.4.1 S12Z Central Processor Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 1.4.2 Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 1.4.3 Clocks, Reset and Power Management Unit (CPMU) . . . . . . . . . . . . . . . . . . . . . . . . . . 25 1.4.4 Main External Oscillator (XOSCLCP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 1.4.5 Timer (TIM0 and TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 1.4.6 Pulse Width Modulation Module (PWM0 and PWM1) . . . . . . . . . . . . . . . . . . . . . . . . . 27 1.4.7 Inter-IC Module (IIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 1.4.8 CAN Physical Layer (CANPHY) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 1.4.9 Multi-Scalable Controller Area Network (MSCAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 1.4.10 SENT Transmitter (SENT_TX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 1.4.11 Serial Communication Interface Module (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 1.4.12 Serial Peripheral Interface Module (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 1.4.13 Analog-to-Digital Converter Module (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 1.4.14 Digital-to-Analog Converter Module (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 1.4.15 Analog Comparator Module (ACMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 1.4.16 Supply Voltage Sensor (BATS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 1.4.17 On-Chip Voltage Regulator system (VREG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Family Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 1.6.1 Part ID Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Signal Description and Device Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 1.7.1 Pin Assignment Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 1.7.2 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 1.7.3 MODC -- Mode C signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 1.7.4 PAD[15:0] / KWAD[15:0] -- Port AD, input pins of ADC . . . . . . . . . . . . . . . . . . . . . . 36 1.7.5 PE[1:0] -- Port E I/O signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 1.7.6 PJ[1:0] -- Port J I/O signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 1.7.7 PL[1:0] / KWL[1:0] -- Port L input signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 1.7.8 PP[7:0] / KWP[7:0] -- Port P I/O signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 1.7.9 PS[7:0] / KWS[7:0] -- Port S I/O signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 1.7.10 PT[7:0] -- Port T I/O signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 1.7.11 AN[15:0] -- ADC input signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 1.7.12 ACMP Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 1.7.13 DAC Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 1.7.14 VRH_0, VRH_1, VRL_0, VRL_1 -- ADC reference signals . . . . . . . . . . . . . . . . . . . . 38 1.7.15 ETRIG0 -- External ADC trigger signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 1.7.16 SPI signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 1.7.17 SCI signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 5 1.8 1.9 1.10 1.11 1.12 1.13 1.14 1.7.18 Timer IOC[7:0] signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 1.7.19 PWM[7:0] signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 1.7.20 IIC signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 1.7.21 Interrupt signals -- IRQ and XIRQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 1.7.22 Oscillator and Clock Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 1.7.23 BDC and Debug Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 1.7.24 CAN0 Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 1.7.25 CAN Physical Layer Signals(CANPHY0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 1.7.26 BCTL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 1.7.27 BCTLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 1.7.28 VDDC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 1.7.29 High Current Output - EVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 1.7.30 Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Device Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Internal Signal Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 1.9.1 ACMP0 and ACMP1 Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 1.9.2 DAC Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 1.9.3 ADC Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 1.9.4 TIM0 and TIM1 Clock Source Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 1.9.5 TIM0 and TIM1 IOC Channel Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 1.9.6 PWM0 and PWM1 Clock Source Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 1.9.7 BDC Clock Source Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 1.9.8 FTMRZ Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 1.9.9 CPMU Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 1.10.1 Chip Configuration Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 1.10.2 Debugging Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 1.10.3 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 1.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 1.11.2 Securing the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 1.11.3 Operation of the Secured Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 1.11.4 Unsecuring the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 1.11.5 Reprogramming the Security Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 1.11.6 Complete Memory Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Resets and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 1.12.1 Interrupt Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 1.12.2 Effects of Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Module device level dependencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 1.13.1 API External Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 1.13.2 COP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 1.13.3 Flash IFR Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 1.14.1 ADC Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 1.14.2 Use Case Urea Concentration Level Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 MC9S12ZVC Family Reference Manual , Rev. 1.9 6 NXP Semiconductors 1.14.3 Voltage Domain Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.1 2.2 2.3 2.4 2.5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 2.1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 2.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 2.2.1 Internal Routing Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 2.3.1 Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 2.3.2 PIM Registers 0x0200-0x020F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 2.3.3 PIM Generic Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 2.3.4 PIM Generic Register Exceptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 2.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 2.4.2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 2.4.3 Pin I/O Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 2.4.4 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 2.4.5 High-Voltage Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Initialization and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 2.5.1 Port Data and Data Direction Register writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 2.5.2 SCI Baud Rate Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 2.5.3 Over-Current Protection on PP2 (EVDD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 2.5.4 Over-Current Protection on PP[6-4,0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 2.5.5 Open Input Detection on PL[1:0] (HVI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Chapter 3 Background Debug Controller (S12ZBDCV2) 3.1 3.2 3.3 3.4 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 3.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 3.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 3.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 3.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 3.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 3.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 3.4.1 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 3.4.2 Enabling BDC And Entering Active BDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 3.4.3 Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 3.4.4 BDC Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 3.4.5 BDC Access Of Internal Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 7 3.5 3.4.6 BDC Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 3.4.7 Serial Interface Hardware Handshake (ACK Pulse) Protocol . . . . . . . . . . . . . . . . . . . . 145 3.4.8 Hardware Handshake Abort Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 3.4.9 Hardware Handshake Disabled (ACK Pulse Disabled) . . . . . . . . . . . . . . . . . . . . . . . . . 148 3.4.10 Single Stepping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149 3.4.11 Serial Communication Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 3.5.1 Clock Frequency Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Chapter 4 Memory Mapping Control (S12ZMMCV1) 4.1 4.2 4.3 4.4 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 4.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 4.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 4.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 4.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 4.1.5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 4.3.1 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 4.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 4.4.1 Global Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 4.4.2 Illegal Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 4.4.3 Uncorrectable ECC Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 Chapter 5 S12Z Interrupt (S12ZINTV0) 5.1 5.2 5.3 5.4 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 5.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 5.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 5.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 5.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 5.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 5.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 5.4.1 S12Z Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 5.4.2 Interrupt Prioritization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 5.4.3 Priority Decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 5.4.4 Reset Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 5.4.5 Exception Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 5.4.6 Interrupt Vector Table Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 MC9S12ZVC Family Reference Manual , Rev. 1.9 8 NXP Semiconductors 5.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 5.5.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 5.5.2 Interrupt Nesting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 5.5.3 Wake Up from Stop or Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.1 6.2 6.3 6.4 6.5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 6.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 6.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 6.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 6.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 6.1.5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 6.2.1 External Event Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 6.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 6.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194 6.4.1 DBG Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194 6.4.2 Comparator Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 6.4.3 Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 6.4.4 State Sequence Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 6.4.5 Breakpoints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 6.5.1 Avoiding Unintended Breakpoint Re-triggering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 6.5.2 Breakpoints from other S12Z sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 Chapter 7 ECC Generation Module (SRAM_ECCV1) 7.1 7.2 7.3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 7.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 7.2.1 Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 7.2.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209 7.3.1 Aligned 2 and 4 Byte Memory Write Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210 7.3.2 Other Memory Write Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210 7.3.3 Memory Read Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211 7.3.4 Memory Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211 7.3.5 Interrupt Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211 7.3.6 ECC Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 7.3.7 ECC Debug Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 9 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.1 8.2 8.3 8.4 8.5 8.6 8.7 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 8.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216 8.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218 8.1.3 S12CPMU_UHV_V7 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 8.2.1 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 8.2.2 EXTAL and XTAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 8.2.3 VSUP -- Regulator Power Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 8.2.4 VDDA, VSSA -- Regulator Reference Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . 223 8.2.5 VDDX, VSSX -- Pad Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 8.2.6 VDDX has to be connected externally to VDDA.VDDC, VSSC -- CANPHY Supply Pin 224 8.2.7 BCTL -- Base Control Pin for external PNP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 8.2.8 BCTLC -- Base Control Pin for external PNP for VDDC . . . . . . . . . . . . . . . . . . . . . . 224 8.2.9 VSS -- Core Logic Ground Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 8.2.10 VDD -- Internal Regulator Output Supply (Core Logic) . . . . . . . . . . . . . . . . . . . . . . . . 224 8.2.11 VDDF -- Internal Regulator Output Supply (NVM Logic) . . . . . . . . . . . . . . . . . . . . . . 224 8.2.12 API_EXTCLK -- API external clock output pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 8.2.13 TEMPSENSE -- Internal Temperature Sensor Output Voltage . . . . . . . . . . . . . . . . . . 225 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226 8.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226 8.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266 8.4.1 Phase Locked Loop with Internal Filter (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266 8.4.2 Startup from Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268 8.4.3 Stop Mode using PLLCLK as source of the Bus Clock . . . . . . . . . . . . . . . . . . . . . . . . 268 8.4.4 Full Stop Mode using Oscillator Clock as source of the Bus Clock . . . . . . . . . . . . . . . 269 8.4.5 External Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270 8.4.6 System Clock Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272 8.5.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272 8.5.2 Description of Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 8.5.3 Oscillator Clock Monitor Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 8.5.4 PLL Clock Monitor Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 8.5.5 Computer Operating Properly Watchdog (COP) Reset . . . . . . . . . . . . . . . . . . . . . . . . . 274 8.5.6 Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 8.5.7 Low-Voltage Reset (LVR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 8.6.1 Description of Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 8.7.1 General Initialization Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 8.7.2 Application information for COP and API usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 8.7.3 Application Information for PLL and Oscillator Startup . . . . . . . . . . . . . . . . . . . . . . . . 278 MC9S12ZVC Family Reference Manual , Rev. 1.9 10 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281 Key Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283 9.2.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284 9.2.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 9.3.1 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 9.4.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 9.4.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 9.5.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 9.5.2 Analog Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 9.5.3 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338 9.7.1 ADC Conversion Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338 9.7.2 ADC Sequence Abort Done Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338 9.7.3 ADC Error and Conversion Flow Control Issue Interrupt . . . . . . . . . . . . . . . . . . . . . . . 339 Use Cases and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 340 9.8.1 List Usage -- CSL single buffer mode and RVL single buffer mode . . . . . . . . . . . . . . 340 9.8.2 List Usage -- CSL single buffer mode and RVL double buffer mode . . . . . . . . . . . . . 340 9.8.3 List Usage -- CSL double buffer mode and RVL double buffer mode . . . . . . . . . . . . . 341 9.8.4 List Usage -- CSL double buffer mode and RVL single buffer mode . . . . . . . . . . . . . 341 9.8.5 List Usage -- CSL double buffer mode and RVL double buffer mode . . . . . . . . . . . . . 342 9.8.6 RVL swapping in RVL double buffer mode and related registers ADCIMDRI and ADCEOLRI 342 9.8.7 Conversion flow control application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 344 9.8.8 Continuous Conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346 9.8.9 Triggered Conversion -- Single CSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347 9.8.10 Fully Timing Controlled Conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348 Chapter 10 Supply Voltage Sensor - (BATSV3) 10.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349 10.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349 10.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349 10.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350 10.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350 10.2.1 VSUP -- Voltage Supply Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350 10.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351 10.3.1 Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 11 10.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351 10.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355 10.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355 10.4.2 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355 Chapter 11 Timer Module (TIM16B8CV3) Block Description 11.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 359 11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 359 11.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 360 11.1.3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 360 11.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363 11.2.1 IOC7 -- Input Capture and Output Compare Channel 7 . . . . . . . . . . . . . . . . . . . . . . . . 363 11.2.2 IOC6 - IOC0 -- Input Capture and Output Compare Channel 6-0 . . . . . . . . . . . . . . . . 363 11.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363 11.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363 11.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 364 11.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 380 11.4.1 Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382 11.4.2 Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382 11.4.3 Output Compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382 11.4.4 Pulse Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383 11.4.5 Event Counter Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 384 11.4.6 Gated Time Accumulation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 384 11.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 384 11.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 384 11.6.1 Channel [7:0] Interrupt (C[7:0]F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385 11.6.2 Pulse Accumulator Input Interrupt (PAOVI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385 11.6.3 Pulse Accumulator Overflow Interrupt (PAOVF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385 11.6.4 Timer Overflow Interrupt (TOF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385 Chapter 12 Timer Module (TIM16B4CV3) Block Description 12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 387 12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 387 12.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 388 12.1.3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 388 12.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 389 12.2.1 IOC3 - IOC0 -- Input Capture and Output Compare Channel 3-0 . . . . . . . . . . . . . . . . 389 12.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 389 12.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 389 12.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 389 12.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 12.4.1 Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 402 MC9S12ZVC Family Reference Manual , Rev. 1.9 12 NXP Semiconductors 12.4.2 Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403 12.4.3 Output Compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403 12.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 404 12.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 404 12.6.1 Channel [3:0] Interrupt (C[3:0]F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 404 12.6.2 Timer Overflow Interrupt (TOF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 404 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) 13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 13.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 13.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 13.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406 13.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406 13.2.1 PWM7 - PWM0 -- PWM Channel 7 - 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 407 13.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 407 13.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 407 13.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 407 13.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422 13.4.1 PWM Clock Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422 13.4.2 PWM Channel Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 425 13.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 432 13.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 433 Chapter 14 Serial Communication Interface (S12SCIV6) 14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 435 14.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 435 14.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436 14.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436 14.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 437 14.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438 14.2.1 TXD -- Transmit Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438 14.2.2 RXD -- Receive Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438 14.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438 14.3.1 Module Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438 14.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 439 14.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 451 14.4.1 Infrared Interface Submodule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452 14.4.2 LIN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452 14.4.3 Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453 14.4.4 Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454 14.4.5 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 455 14.4.6 Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 13 14.4.7 Single-Wire Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 468 14.4.8 Loop Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 14.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 14.5.1 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 14.5.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 14.5.3 Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 14.5.4 Recovery from Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473 14.5.5 Recovery from Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473 Chapter 15 Serial Peripheral Interface (S12SPIV5) 15.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475 15.1.1 Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475 15.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475 15.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475 15.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 476 15.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 477 15.2.1 MOSI -- Master Out/Slave In Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 477 15.2.2 MISO -- Master In/Slave Out Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 477 15.2.3 SS -- Slave Select Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 478 15.2.4 SCK -- Serial Clock Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 478 15.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 478 15.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 478 15.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 479 15.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 487 15.4.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 488 15.4.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 489 15.4.3 Transmission Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 490 15.4.4 SPI Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 495 15.4.5 Special Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496 15.4.6 Error Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497 15.4.7 Low Power Mode Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description 16.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501 16.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501 16.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503 16.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503 16.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 16.2.1 IIC_SCL -- Serial Clock Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 16.2.2 IIC_SDA -- Serial Data Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 16.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 16.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 MC9S12ZVC Family Reference Manual , Rev. 1.9 14 NXP Semiconductors 16.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 516 16.4.1 I-Bus Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 516 16.4.2 Operation in Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521 16.4.3 Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521 16.4.4 Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521 16.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521 16.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521 16.7 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 522 16.7.1 IIC Programming Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 522 Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 529 17.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 529 17.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530 17.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530 17.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531 17.2.1 CANH -- CAN Bus High Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532 17.2.2 CANL -- CAN Bus Low Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532 17.2.3 SPLIT -- CAN Bus Termination Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532 17.2.4 VDDC -- Supply Pin for CAN Physical Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532 17.2.5 VSSC -- Ground Pin for CAN Physical Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532 17.3 Internal Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532 17.3.1 CPTXD -- TXD Input to CAN Physical Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532 17.3.2 CPRXD -- RXD Output of CAN Physical Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532 17.4 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533 17.4.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533 17.4.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 534 17.5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541 17.5.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541 17.5.2 Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541 17.5.3 Configurable Wake-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 543 17.5.4 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544 17.6 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 545 17.6.1 Initialization Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 545 17.6.2 Wake-up Mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 546 17.6.3 Bus Error Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 546 17.6.4 CPTXD-Dominant Timeout Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 547 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 549 18.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 550 18.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 550 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 15 18.2 18.3 18.4 18.5 18.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 551 18.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 551 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 552 18.2.1 RXCAN -- CAN Receiver Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 552 18.2.2 TXCAN -- CAN Transmitter Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 552 18.2.3 CAN System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 552 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 553 18.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 553 18.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 555 18.3.3 Programmer's Model of Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 574 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 585 18.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 585 18.4.2 Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 585 18.4.3 Identifier Acceptance Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 588 18.4.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594 18.4.5 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 18.4.6 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600 18.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 602 18.5.1 MSCAN initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 602 18.5.2 Bus-Off Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 602 Chapter 19 Digital Analog Converter (DAC_8B5V_V2) 19.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603 19.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603 19.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604 19.2.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604 19.2.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605 19.3 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605 19.3.1 DACU Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605 19.3.2 AMP Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605 19.3.3 AMPP Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605 19.3.4 AMPM Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 19.4 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 19.4.1 Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 19.4.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 19.5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609 19.5.1 Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609 19.5.2 Mode "Off" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 610 19.5.3 Mode "Operational Amplifier" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 610 19.5.4 Mode "Internal DAC only" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 610 19.5.5 Mode "Unbuffered DAC" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 610 19.5.6 Mode "Unbuffered DAC with Operational Amplifier" . . . . . . . . . . . . . . . . . . . . . . . . . 610 19.5.7 Mode "Buffered DAC" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611 MC9S12ZVC Family Reference Manual , Rev. 1.9 16 NXP Semiconductors 19.5.8 Analog output voltage calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611 Chapter 205V Analog Comparator (ACMPV2) 20.1 20.2 20.3 20.4 20.5 20.6 20.7 20.8 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614 External Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614 20.4.1 Internal Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615 20.6.1 Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615 20.6.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 616 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 618 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 619 Chapter 21 SENT Transmitter Module (SENTTXV1) 21.1 21.2 21.3 21.4 21.5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 621 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 621 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 622 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 622 External Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623 21.5.1 SENT_TX_OUT - SENT Transmitter Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623 21.5.2 SENT_IN - SENT Transmitter Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623 21.6 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623 21.7 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 624 21.7.1 Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 624 21.7.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625 21.8 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 631 21.8.1 Message Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 631 21.8.2 Transmitter States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 632 21.8.3 Tick Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 21.8.4 Transmission Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 21.9 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 636 21.10 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 637 21.10.1Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 637 21.10.2Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 637 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639 22.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 640 22.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 640 22.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 641 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 17 22.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 642 22.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 643 22.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 643 22.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 647 22.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 668 22.4.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 668 22.4.2 IFR Version ID Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 668 22.4.3 Flash Block Read Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 668 22.4.4 Internal NVM resource . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 669 22.4.5 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 670 22.4.6 Allowed Simultaneous P-Flash and EEPROM Operations . . . . . . . . . . . . . . . . . . . . . . 674 22.4.7 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675 22.4.8 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 22.4.9 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 692 22.4.10Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 692 22.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 692 22.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 693 22.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 694 22.5.3 .Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 694 22.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 694 Appendix A MCU Electrical Specifications A.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 697 A.1.1 Power Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 697 A.1.2 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 698 A.1.3 Current Injection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 699 A.1.4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 699 A.1.5 ESD Protection and Latch-up Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 700 A.1.6 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 701 A.1.7 Power Dissipation and Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 703 A.1.8 I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 706 A.1.9 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 709 A.1.10 ADC Calibration Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 712 Appendix B ADC Electrical Specifications B.1 ADC Operating Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713 B.1.1 Factors Influencing Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713 B.1.2 ADC Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 715 MC9S12ZVC Family Reference Manual , Rev. 1.9 18 NXP Semiconductors Appendix C MSCAN Electrical Specifications Appendix D SPI Electrical Specifications D.0.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 721 D.0.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 722 Appendix E CPMU Electrical Specifications (VREG, OSC, IRC, PLL) E.1 E.2 E.3 VREG Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 725 IRC and OSC Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 726 Phase Locked Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 727 E.3.1 Jitter Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 727 Appendix F BATS Electrical Specifications F.1 F.2 Static Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 729 Dynamic Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 731 Appendix GPIM Electrical Specifications G.1 High-Voltage Inputs (HVI) Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 733 Appendix HACMP Electrical Specifications H.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 735 H.2 Static Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 735 H.3 Dynamic Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 738 Appendix I S12CANPHY Electrical Specifications I.1 I.2 I.3 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 739 Static Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 739 Dynamic Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 742 Appendix J DAC8B5V Electrical Specifications Appendix K NVM Electrical Parameters K.1 NVM Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 747 K.2 NVM Reliability Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 747 K.3 NVM Factory Shipping Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 749 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 19 Appendix L Package Information Appendix M Ordering Information Appendix N Detailed Register Address Map N.1 N.2 N.3 N.4 N.5 N.6 N.7 N.8 N.9 N.10 N.11 N.12 N.13 N.14 N.15 N.16 N.17 N.18 N.19 N.20 N.21 N.22 N.23 N.24 N.25 0x0000-0x0003 Part ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 0x0010-0x001F S12ZINT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 0x0070-0x008F S12ZMMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761 0x0100-0x017F S12ZDBG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761 0x0200-0x037F S12ZVCPIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 764 0x0380-0x039F FTMRZ192K2K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 770 0x03C0-0x03CF SRAM_ECC_32D7P. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 771 0x0400-0x042F TIM1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 773 0x0480-0x04AF PWM0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 774 0x0500-0x052F PWM1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 776 0x05C0-0x05EF TIM0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 778 0x0600-0x063F ADC0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 780 0x0680-0x0687 DAC8B5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 782 0x0690-0x0697 ACMP0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 784 0x0698-0x069F ACMP1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 784 0x06C0-0x06DF CPMU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 785 0x06F0-0x06F7 BATS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 787 0x0700-0x0707 SCI0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 787 0x0710-0x0717 SCI1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 788 0x0780-0x0787 SPI0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 789 0x0790-0x0797 SPI1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 789 0x07C0-0x07C7 IIC0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 790 0x0800-0x083F CAN0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 791 0x0990-0x0997 CANPHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 793 0x09A0-0x09AF SENTTX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 793 MC9S12ZVC Family Reference Manual , Rev. 1.9 20 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family Revision History 1.1 Rev. No. (Item No.) Date (Submitted By) V0.01 9-April-2013 V0.02 22-August-2013 * Added Section 1.13.3 Flash IFR Mapping * Updated Section 1.14.1 ADC Calibration V0.03 10-September-2013 * Added Table 1-3 * Added S12ZVCA and S12ZVC Table 1-1 V0.04 7-February-2014 V0.05 6-March-2014 * Changed maskset N23N * Changed Package 48 LQFP without EP V0.06 28-April-2014 * Removed VRL functionality from PAD4 Substantial Change(s) * Initial Version * Added 12K RAM, new maskset and part ID, feedback from shared review Introduction The MC9S12ZVC-Family is a new member of the S12 MagniV product line integrating a battery level (12V) voltage regulator, supply voltage monitoring, high voltage inputs and a CAN physical interface. It's primarily targeting at CAN nodes like sensors, switch panels or small actuators. It offers various low-power modes and wakeup management to address state of the art power consumption requirements. Some members of the MC9S12ZVC-Family are also offered for high temperature applications requiring AEC-Q100 Grade 0 (-40C to +150C ambient operating temperature range). The MC9S12ZVC-Family is based on the enhanced performance, linear address space S12Z core and delivers an optimized solution with the integration of several key system components into a single device, optimizing system architecture and achieving significant space savings. 1.2 Features This section describes the key features of the MC9S12ZVC-Family. It documents the superset of features within the family. Section 1.2.1 MC9S12ZVC-Family Comparison provides information to help access the correct information for a particular part within the family. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 21 Chapter 1 Device Overview MC9S12ZVC-Family 1.2.1 MC9S12ZVC-Family Comparison Table 1-1 provides a summary of the MC9S12ZVC-Family. This information is intended to provide an understanding of the range of functionality offered by this microcontroller family. Table 1-1. MC9S12ZVC-Family devices S12ZVCA S12ZVCA S12ZVC S12ZVC Feature 192 Package option Temperature Option C ambient) 128 64 192 128 96 64 192 128 96 64 192 128 96 64 64-pin LQFP-EP 48-pin LQFP 64-pin LQFP-EP 48-pin LQFP -40 to 105/125/150 -40 to 85/105/125 -40 to 105/125/150 -40 to 85/105/125 S12Z S12Z S12Z S12Z Core Flash memory (ECC) [KByte] 96 192 128 96 64 192 128 96 64 192 128 96 64 192 128 96 64 EEPROM (ECC) [KByte] (4-byte erasable) 2 2 2 1 2 2 2 1 2 2 2 1 2 2 2 1 RAM (ECC) [KByte] 12 8 8 4 12 8 8 4 12 8 8 4 12 8 8 4 High Speed CAN Physical Layer 1 1 1 1 High Voltage Inputs 2 2 2 2 Vreg for CAN PHY with ext. ballast (BCTLC) yes yes yes yes VDDX/VSSX pins 2/2 2/2 2/2 2/2 msCAN 1 1 1 1 SCI 2 2 2 2 SPI 2 1 2 1 IIC 1 1 1 1 SENT (Transmitter) 1 1 1 1 16-bit Timer channels 8 4 8 4 1) 4 4 4 4 (1)) 16-bit PWM channels (20 ns resolution 4 3 4 3 16-bit PWM channels 4 4 4 4 12-bit ADC channels 16 10 - - 10-bit ADC channels - - 16 10 8-bit DAC 1 1 - - ACMP 5V (with rail-to-rail inputs) 2 2 - - EVDD (20 mA source) 1 1 1 1 Open Drain (5V GPIOs with disabled PMOS) 10 5 10 5 N-GPIO (25mA sink) 4 4 4 4 General purpose I/O 42 28 42 28 16-bit Timer channels (20 ns resolution 1 at 25 MHz bus frequency MC9S12ZVC Family Reference Manual , Rev. 1.9 22 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.3 Chip-Level Features On-chip modules available within the family include the following features: * S12Z CPU core * Up to 192 Kbyte on-chip flash with ECC * Up to 2 Kbyte EEPROM with ECC * Up to 12Kbyte on-chip SRAM with ECC * Phase locked loop (IPLL) frequency multiplier with internal filter * 1 MHz internal RC oscillator with +/-1.3% accuracy over rated temperature range * 4-20MHz amplitude controlled pierce oscillator * Internal COP (watchdog) module * Analog-to-digital converter (ADC) with 12-bit resolution and up to 16 channels available on external pins * Two analog comparators (ACMP) with rail-to-rail inputs * One 8-bit 5V digital-to-analog converter (DAC) * Up to two serial peripheral interface (SPI) modules * Up to two serial communication interface (SCI) modules * SENT Transmitter Interface * MSCAN (1 Mbit/s, CAN 2.0 A, B software compatible) module * One on-chip CAN physical layer module * 8-channel timer module (TIM0) with input capture/output compare * 4-channel timer module (TIM1) with input capture/output compare (fast max 64MHz) * Inter-IC (IIC) module * 4-channel 16-bit Pulse Width Modulation module (PWM0) * 4-channel 16-bit Pulse Width Modulation module (PWM1) (fast max 64MHz) * On-chip voltage regulator (VREG) for regulation of input supply and all internal voltages * Autonomous periodic interrupt (API), supports cyclic wakeup from Stop mode * Four pins to support 25 mA drive strength to VSSX * One pin to support 20 mA drive strength from VDDX (EVDD) * Two High Voltage Input (HVI) pins * Supply VSUP monitoring with warning * On-chip temperature sensor, temperature value can be measured with ADC or can generate a high temperature interrupt 1.4 Module Features The following sections provide more details of the integrated modules. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 23 Chapter 1 Device Overview MC9S12ZVC-Family 1.4.1 S12Z Central Processor Unit (CPU) The S12Z CPU is a revolutionary high-speed core, with code size and execution efficiencies over the S12X CPU. The S12Z CPU also provides a linear memory map eliminating the inconvenience and performance impact of page swapping. * Harvard Architecture - parallel data and code access * 3-stage pipeline * 32-bit wide instruction and databus * 32-bit ALU * 24-bit addressing (16 MB linear address space) * Instructions and Addressing modes optimized for C-Programming and Compiler -- MAC unit 32bit += 32bit*32bit -- Hardware divider -- Single cycle multi-bit shifts (Barrel shifter) -- Special instructions for fixed point math * Unimplemented opcode traps * Unprogrammed byte value (0xFF) defaults to SWI instruction 1.4.1.1 * * * * * * * * 1.4.1.2 Background Debug Controller (BDC) Single-wire communication with host development system SYNC command to determine communication rate Genuine non-intrusive handshake protocol Enhanced handshake protocol for error detection and stop mode recognition Active out of reset in special single chip mode Most commands not requiring active BDM, for minimal CPU intervention Full global memory map access without paging Simple flash mass erase capability Debugger (DBG) * Three comparators (A, B and D) -- Comparator A compare the full address bus and full 32-bit data bus -- Comparators B and D compare the full address bus onlyEach comparator can be configured to monitor PC addresses or addresses of data accesses -- Each comparator can select either read or write access cycles -- Comparator matches can force state sequencer state transitions * Three comparator modes -- Simple address/data comparator match mode -- Inside address range mode, Addmin Address Addmax -- Outside address range match mode, Address Addminor Address Addmax MC9S12ZVC Family Reference Manual , Rev. 1.9 24 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family * * 1.4.2 1.4.2.1 * * 1.4.2.2 State sequencer control -- State transitions forced by comparator matches -- State transitions forced by software write to TRIGState transitions forced by an external event The following types of breakpoints -- CPU breakpoint entering active BDM on breakpoint (BDM) -- CPU breakpoint executing SWI on breakpoint (SWI) Embedded Memory Memory Access Integrity Illegal address detection ECC support on embedded NVM and system RAM Flash On-chip flash memory on the MC9S12ZVC-Family on the features the following: * Up to 192Kbytes of program flash memory -- Automated program and erase algorithm -- Protection scheme to prevent accidental program or erase 1.4.2.3 * 1.4.2.4 * 1.4.3 * * * EEPROM 2 Kbytes EEPROM -- 16 data bits plus 6 syndrome ECC (error correction code) bits allow single bit error correction and double fault detection -- Erase sector size 4 bytes -- Automated program and erase algorithm -- User margin level setting for reads SRAM 12 Kbytes of general-purpose RAM with ECC -- Single bit error correction and double bit error detection code based on 16-bit data words Clocks, Reset and Power Management Unit (CPMU) Real time interrupt (RTI) Clock monitor, supervising the correct function of the oscillator (CM) Computer operating properly (COP) watchdog -- Configurable as window COP for enhanced failure detection -- Can be initialized out of reset using option bits located in flash memory MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 25 Chapter 1 Device Overview MC9S12ZVC-Family * * * 1.4.3.1 * 1.4.3.2 * 1.4.4 * System reset generation Autonomous periodic interrupt (API) (combination with cyclic, watchdog) Low Power Operation -- RUN mode is the main full performance operating mode with the entire device clocked. -- WAIT mode when the internal CPU clock is switched off, so the CPU does not execute instructions. -- Pseudo STOP - system clocks are stopped but the oscillator the RTI, the COP, and API modules can be enabled -- STOP - the oscillator is stopped in this mode, all clocks are switched off and all counters and dividers remain frozen, with the exception of the COP and API which can optionally run from ACLK. Internal Phase-Locked Loop (IPLL) Phase-locked-loop clock frequency multiplier -- No external components required -- Reference divider and multiplier allow large variety of clock rates -- Automatic bandwidth control mode for low-jitter operation -- Automatic frequency lock detector -- Configurable option to spread spectrum for reduced EMC radiation (frequency modulation) -- Reference clock sources: - Internal 1 MHz RC oscillator (IRC) - External 4-16MHz crystal oscillator/resonator Internal RC Oscillator (IRC) 1 MHz internal RC oscillator with +/-1.3% accuracy over rated temperature range Main External Oscillator (XOSCLCP) Amplitude controlled Pierce oscillator using 4 MHz to 20 MHz crystal -- Current gain control on amplitude output -- Signal with low harmonic distortion -- Low power -- Good noise immunity -- Eliminates need for external current limiting resistor -- Transconductance sized for optimum start-up margin for typical crystals -- Oscillator pins shared with GPIO functionality MC9S12ZVC Family Reference Manual , Rev. 1.9 26 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.4.5 * 1.4.6 * * 1.4.7 * * * * 1.4.8 * * * * * * * * 1.4.9 * * * Timer (TIM0 and TIM1) two independent timer modules with own 16-bit free-running counter and with 8-bit precision prescaler -- 8 x 16-bit channels Timer module (TIM0) for input capture or output compare, channel 7 supports pulse accumulator feature -- 4 x 16-bit channels fast Timer module (TIM1) for input capture or output compare Pulse Width Modulation Module (PWM0 and PWM1) Four channel x 16-bit pulse width modulator PWM0 Four channel x 16-bit pulse width modulator PWM1 fast max 64MHz -- Programmable period and duty cycle per channel -- Center-aligned or left-aligned outputs -- Programmable clock select logic with a wide range of frequencies Inter-IC Module (IIC) Multi-master operation Software programmable for one of 256 different serial clock frequencies Broadcast mode support 10-bit address support CAN Physical Layer (CANPHY) High speed CAN interface for baud rates of up to 1 Mbit/s ISO 11898-2 and ISO 11898-5 compliant for 12 V battery systems SPLIT pin driver for bus recessive level stabilization Low power mode with remote CAN wake-up handled by MSCAN module Over-current shutdown for CANH and CANL Voltage monitoring on CANH and CANL CPTXD-dominant timeout feature monitoring the CPTXD signal Fulfills the OEM "Hardware Requirements for (LIN,) CAN (and FlexRay) Interfaces in Automotive Applications" v1.3 Multi-Scalable Controller Area Network (MSCAN) Implementation of CAN protocol - Version 2.0A/B Five receive buffers with FIFO storage scheme Three transmit buffers with internal prioritization using "local priority" concept MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 27 Chapter 1 Device Overview MC9S12ZVC-Family * * 1.4.10 * * * * * * * 1.4.11 * * * * * * * * Flexible maskable identifier filter supports two full-size (32-bit) extended identifier filters, or four 16-bit filters, or eight 8-bit filters Programmable wake-up functionality with integrated low-pass filter SENT Transmitter (SENT_TX) Features a 13-bit prescaler to derive a SENT-protocol compatible time unit of 3 to 90 s from bus-clock. Programmable number of transmitted data-nibbles (1 to 6). Provides hardware to support SAE J2716-2010 (SENT) Fast Channel communication. CRC nibble generation: -- Supports SENT legacy method CRC generation in hardware. -- Supports SENT recommended method CRC generation in hardware. -- Optionally, the SENT configuration- and status-nibble can be included in the automatic calculation of the CRC nibble. -- Automatic CRC generation hardware can be bypassed to supply the CRC nibble directly from software Supports optional pause-pulse generation. The optional pause pulse can have a fixed length or its length can be automatically adapted to get a fixed overall message length. Supports both continuous and software-triggered transmission. Interrupt-driven operation with five flags: -- Transmit buffer empty -- Transmission complete -- Calibration start -- Transmitter underrun -- Pause-pulse Rising-Edge Serial Communication Interface Module (SCI) Full-duplex or single-wire operation Standard mark/space non-return-to-zero (NRZ) format Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths Baud rate generator by a 16-bit divider from the bus clock Programmable character length Programmable polarity for transmitter and receiver Active-edge receive wakeup Break detect and transmit collision detect supporting LIN MC9S12ZVC Family Reference Manual , Rev. 1.9 28 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.4.12 * * * * * * 1.4.13 * * * * * * * * * 1.4.14 * * * 1.4.15 * * * * * * * Serial Peripheral Interface Module (SPI) Configurable 8- or 16-bit data size Full-duplex or single-wire bidirectional Double-buffered transmit and receive Master or slave mode MSB-first or LSB-first shifting Serial clock phase and polarity options Analog-to-Digital Converter Module (ADC) 12-bit resolution Up to 16 external channels and 8 internal channels Left or right aligned result data Continuous conversion mode Programmers model with list based command and result storage architecture ADC directly writes results to RAM, preventing stall of further conversions Internal signals monitored with the ADC module -- VRH, VRL, (VRL+VRH)/2, VSUP monitor, VBG, Temperature Sensor, Port L HVI inputs External pins can also be used as digital I/O Up to 16 pins can be used as keyboard wake-up interrupt (KWU) Digital-to-Analog Converter Module (DAC) 8-bit resolution Buffered and unbuffered analog output voltage usable Operational amplifier stand alone usable Analog Comparator Module (ACMP) 0V to VDDA supply rail-to-rail inputs Low offset Up to 4 inputs selectable as inverting and non-inverting comparator inputs: -- 2 low-impedance inputs with selectable low pass filter for external pins -- 2 high-impedance inputs with fixed filter for SoC-internal signals Selectable hysteresis Selectable interrupt on rising edge, falling edge, or rising and falling edges of comparator output Option to output comparator signal on an external pin with selectable polarity Support for triggering timer input capture events MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 29 Chapter 1 Device Overview MC9S12ZVC-Family * 1.4.16 * * * 1.4.17 * * Operational over supply range from 3V-5% to 5V+10% Supply Voltage Sensor (BATS) Monitoring of supply (VSUP) voltage Internal ADC interface from an internal resistive divider Generation of low or high voltage interrupts On-Chip Voltage Regulator system (VREG) Voltage regulator -- Linear voltage regulator directly supplied by VSUP -- Low-voltage detect on VSUP -- Power-on reset (POR) -- Low-voltage reset (LVR) for VDDX domain -- External ballast device support to extend current capability and reduce internal power dissipation -- Capable of supplying both the MCU internally plus external components -- Over-temperature interrupt Internal voltage regulator -- Linear voltage regulator with bandgap reference -- Low-voltage detect on VDDA -- Power-on reset (POR) circuit -- Low-voltage reset for VDD, VDDF & VDDX domain MC9S12ZVC Family Reference Manual , Rev. 1.9 30 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.5 Block Diagram Figure 1 shows a high-level block diagram of the MC9S12ZVC-Family. ADC up to 192K bytes 12-bit Analog-Digital Converter up to 2K bytes ACMP0 RAM with ECC Analog Comparator up to 12K bytes ACMP1 Analog Comparator S12ZCPU DAC DBG Debug Module 8-bit Interrupt Module CPMU IRC XOSCLCP PTE LP Pierce Oscillator PE0 PE1 RESET TEST VSUP VSS VDDX[1:0] VSSX[1:0] BCTL VDDC BCTLC EXTAL XTAL PLL with Frequency Modulation option Clock Monitor PTL 16-bit 8 channel Timer Reset Generation and Test Entry IOC1[3..0] PWM0 PWM[7,5,3,1] 8-bit 8 channel Pulse Width Modulator Voltage Regulator (Nominal 12V) PWM1(fast) ext. ballast option PWM[7,5,3,1] 8-bit 8 channel Pulse Width Modulator CAN Vreg SCI0 with ext. ballast Asynchronous Serial IF SCI1 Asynchronous Serial IF Voltage Supply Monitor SPI0 Synchronous Serial IF HVI[1:0] SPI1 CANPHY CANH SPLIT CANL CANH SPLIT CANL VDDC VSSC VDDC VSSC Synchronous Serial IF CPRXD CPTXD PT[7:0] IOC0[7..4] Timer High Voltage Input KWL[1:0]/PL[1:0] TIM0 COP Watchdog Real Time Interrupt TIM1(fast) Auton. Periodic Int. 16-bit 4 channel BATS VSUP DACU AMPP AMPM AMP VDDA VSSA Clock Power Management Unit Internal RC Oscillator PAD[15:0]/KWAD[15:0] RXCAN0 TXCAN0 SENT PTP Background Debug Controller ACMPP ACMPM ACMPO PP[7:0]/KWP[7:0] PTS BDC ACMPP ACMPM ACMPO PS[7:0]/KWS[7:0] PTJ BKGD VRH VRL PTT EEPROM with ECC AN[15..0] PTAD Flash with ECC PJ[1:0] RXD0 TXD0 RXD1 TXD1 MISO0 MOSI0 SCK0 SS0 MISO0 MOSI0 SCK0 SS0 SENTTX SENT Transmitter IF SDA SCL IIC Inter IC IF CAN0 msCAN 2.0B RXCAN0 TXCAN0 Block Diagram shows the maximum configuration! Not all pins or all peripherals are available on all devices and packages. Rerouting options are not shown. Figure 1. MC9S12ZVC-Family Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 31 Chapter 1 Device Overview MC9S12ZVC-Family 1.6 Family Memory Map Table 1-2.shows the MC9S12ZVC-Family register memory map. Table 1-2. Device Register Memory Map Address Module Size (Bytes) 0x0000-0x0003 ID Register 4 0x0004-0x000F Reserved 12 0x0010-0x001F INT 16 0x0020-0x006F Reserved 80 0x0070-0x008F MMC 32 0x0090-0x00FF MMC Reserved 112 0x0100-0x017F DBG 128 0x0180-0x01FF Reserved 128 0x0200-0x037F PIM 380 0x0380-0x039F FTMRZ 32 0x03A0-0x03BF Reserved 32 0x03C0-0x03CF RAM ECC 16 0x03D0-0x03FF Reserved 48 0x0400-0x042F TIM1 48 0x0430-0x047F Reserved 48 0x0480-0x04AF PWM0 48 0x04B0-0x04FF Reserved 80 0x0500-0x052F PWM1 48 0x0530-0x05BF Reserved 144 0x05C0-0x05EF TIM0 48 0x05F0-0x05FF Reserved 16 0x0600-0x063F ADC0 64 0x0640-0x067F Reserved 64 0x0680-0x0687 DAC 8 0x0688-0x068F Reserved 128 0x0690-0x0697 ACMP0 8 0x0698-0x069F ACMP1 8 0x06A0-0x06BF Reserved 32 0x06C0-0x06DF CPMU 32 0x06E0-0x06EF Reserved 16 0x06F0-0x06F7 BATS 8 0x06F8-0x06FF Reserved 8 0x0700-0x0707 SCI0 8 0x0708-0x070F Reserved 8 0x0710-0x0717 SCI1 8 MC9S12ZVC Family Reference Manual , Rev. 1.9 32 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family Address Module Size (Bytes) 0x0718-0x077F Reserved 104 0x0780-0x0787 SPI0 8 0x0788-0x078F Reserved 8 0x0790-0x0797 SPI1 8 0x0798-0x07BF Reserved 32 0x07C0-0x07C7 IIC0 8 0x07C8-0x097F Reserved 56 0x0800-0x083F CAN0 64 0x0840-0x098F Reserved 336 0x0990-0x0997 CANPHY0 8 SENTTX 16 8 0x0998-0x099F 0x09A0-0x09AF 1616 0x09B0-0x0FFF NOTE Reserved register space shown in Table 1-2. is not allocated to any module. This register space is reserved for future use. Writing to these locations has no effect. Read access to these locations returns zero. Table 1-3. S12ZVC-Family Memory Address Ranges Device MC9S12ZVC64 & MC9S12ZVCA64 MC9S12ZVC96 & MC9S12ZVCA96 MC9S12ZVC128 & MC9S12ZVCA128 MC9S12ZVC192 & MC9S12ZVCA192 Address Memory Block Size (Bytes) 0x00_1000 - 0x00_1FFF SRAM 4K 0x10_0000 - 0x10_03FF EEPROM 1K 0xFF_0000 - 0xFF_FFFF Program Flash 64K 0x00_1000 - 0x00_2FFF SRAM 8K 0x10_0000 - 0x10_07FF EEPROM 2K 0xFE_8000 - 0xFF_FFFF Program Flash 96K 0x00_1000 - 0x00_2FFF SRAM 8K 0x10_0000 - 0x10_07FF EEPROM 2K 0xFE_0000 - 0xFF_FFFF Program Flash 128K 0x00_1000 - 0x00_3FFF SRAM 12K 0x10_0000 - 0x10_07FF EEPROM 2K 0xFD_0000 - 0xFF_FFFF Program Flash 192K MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 33 Chapter 1 Device Overview MC9S12ZVC-Family Figure 1-2. shows S12Z CPU global memory map as a graphical representation. Register Space 4 KByte RAM 0x00_0000 0x00_1000 max. 1 MByte - 4 KByte EEPROM 0x10_0000 max. 1 MByte - 48 KByte Reserved 0x1F_4000 Reserved (read only) 0x1F_8000 512 Byte 5 KByte NVM IFR 0x1F_C000 512 Byte 0x20_0000 Unimplemented 6 MByte 0x80_0000 Program NVM max. 8 MByte Unimplemented address range Low address aligned High address aligned 0xFF_FFFF MC9S12ZVC Family Reference Manual , Rev. 1.9 34 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family Figure 1-2. MC9S12ZVC-Family Global Memory Map 1.6.1 Part ID Assignments The ID is located in four 8-bit registers at addresses 0x0000 to 0x0003. The read-only value is a unique part ID for each revision of the chip. Table 1-4 shows the assigned Part ID register value. Table 1-4. Assigned ID Numbers 1.7 Device Mask Set Number Part ID MC9S12ZVCA64 N23N 05.1D.10.00 MC9S12ZVCA96 N23N 05.1D.10.00 MC9S12ZVCA128 N23N 05.1D.10.00 MC9S12ZVCA192 N23N 05.1D.10.00 MC9S12ZVC64 N23N 05.1D.10.00 MC9S12ZVC96 N23N 05.1D.10.00 MC9S12ZVC128 N23N 05.1D.10.00 MC9S12ZVC192 N23N 05.1D.10.00 Signal Description and Device Pinouts This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal properties, and detailed discussion of signals. It is built from the signal description sections of the individual IP blocks on the device. NOTE To avoid current drawn from floating inputs, all non-bonded pins should be configured as output or configured as input with a pull up or pull down device enabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 35 Chapter 1 Device Overview MC9S12ZVC-Family 1.7.1 Pin Assignment Overview Table 1-5. - Port Availability by package option 1.7.2 Port 64 LQFP-EP 48 LQFP Port AD PAD[15:0] PAD[9:0] Port E PE[1:0] PE[1:0] Port L (HVI) PL[1:0] PL[1:0] Port J PJ[1:0] -- Port P PP[7:0] PP[6:4,2, 0] Port S PS[7:0] PS[7,3:0] Port T PT[7:0] PT[7,4:0] sum of ports 46 30 Detailed Signal Descriptions This section describes the signal properties. 1.7.2.1 RESET -- External Reset signal The RESET signal is an active low bidirectional control signal. It acts as an input to initialize the MCU to a known start-up state, and an output when an internal MCU function causes a reset. The RESET pin has an internal pull-up device. 1.7.2.2 TEST -- Test pin This input only pin is reserved for factory test. This pin has an internal pull-down device. NOTE The TEST pin must be tied to ground in all applications. 1.7.3 MODC -- Mode C signal The MODC signal is used as a MCU operating mode select during reset. The state of this signal is latched to the MODC bit at the rising edge of RESET. The signal has an internal pull-up device. 1.7.4 PAD[15:0] / KWAD[15:0] -- Port AD, input pins of ADC PAD[15:0] are general-purpose input or output signals. The signals can be configured on per signal basis as interrupt inputs with wake-up capability (KWAD[15:0]). These signals can have a pull-up or pull-down device selected and enabled on per signal basis. Out of reset the pull devices are disabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 36 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.7.5 PE[1:0] -- Port E I/O signals PE[1:0] are general-purpose input or output signals. They can have a pull-up or pull-down device selected and enabled on per signal basis. Out of reset the pull down devices are enabled. 1.7.6 PJ[1:0] -- Port J I/O signals PJ[1:0] are general-purpose input or output signals. These signals can have a pull-up or pull-down device selected and enabled on per signal basis. Out of reset the pull-up devices are enabled. 1.7.7 PL[1:0] / KWL[1:0] -- Port L input signals PL[1:0] are the high voltage input signal. These signals can be configured on a per signal basis as interrupt inputs with wake-up capability (KWL[1:0]). These signals can alternatively be used as analog inputs measured by the ADC. 1.7.8 PP[7:0] / KWP[7:0] -- Port P I/O signals PP[7:0] are general-purpose input or output signals. The signals can be configured on per signal basis as interrupt inputs with wake-up capability (KWP[7:0]). They can have a pull-up or pull-down device selected and enabled on per signal basis. Out of reset the pull devices are disabled. 1.7.9 PS[7:0] / KWS[7:0] -- Port S I/O signals PS[7:0] are general-purpose input or output signals. The signals can be configured on per signal basis as interrupt inputs with wake-up capability (KWS[7:0]). They can have a pull-up or pull-down device selected and enabled on per signal basis. Out of reset the pull up devices are enabled. 1.7.10 PT[7:0] -- Port T I/O signals PT[7:0] are general-purpose input or output signals. These signals can have a pull-up or pull-down device selected and enabled on per signal basis. Out of reset the pull devices are disabled. 1.7.11 AN[15:0] -- ADC input signals AN[15:0] are the analog inputs of the Analog-to-Digital Converters. 1.7.12 1.7.12.1 ACMP Signals ACMP0_0 / ACMP0_1-- Analog Comparator 0 Inputs ACMP0_0 and ACMP0_1 are the inputs of the analog comparator 0 ACMP0. 1.7.12.2 ACMP1_0 / ACMP1_1 -- Analog Comparator 1 Inputs ACMP1_0 and ACMP1_1 are the inputs of the analog comparator 1 ACMP1. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 37 Chapter 1 Device Overview MC9S12ZVC-Family 1.7.12.3 ACMPO[1:0] -- Analog Comparator Output ACMPO[1:0] are the outputs of the analog comparators. 1.7.13 1.7.13.1 DAC Signals DACU Output Pin This analog pin is used for the unbuffered analog output voltage from the DAC resistor network output, when the according mode is selected in DACCTL register bits DACM[2:0]. 1.7.13.2 AMP Output Pin This analog pin is used for the buffered analog output voltage from the operational amplifier outputs, when the according mode is selected in DACCTL register bits DACM[2:0]. 1.7.13.3 AMPP Input Pin This analog input pin is used as input signal for the operational amplifier positive input pins when the according mode is selected in DACCTL register bits DACM[2:0]. 1.7.13.4 AMPM Input Pin This analog input pin is used as input signal for the operational amplifiers negative input pin when the according mode is selected in DACCTL register bits DACM[2:0]. 1.7.14 VRH_0, VRH_1, VRL_0, VRL_1 -- ADC reference signals VRH_0 , VRH_1, VRL_0 and VRL_1 are the reference voltage input pins for the analog-to-digital converter. 1.7.15 ETRIG0 -- External ADC trigger signal This signal inputs to the Analog-to-Digital Converter. Their purpose is to trigger ADC conversions (sequence of conversions). 1.7.16 1.7.16.1 SPI signals SS[1:0] signals This signal is associated with the slave select SS functionality of the serial peripheral interface SPI0 and SPI1. MC9S12ZVC Family Reference Manual , Rev. 1.9 38 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.7.16.2 SCK[1:0] signals This signal is associated with the serial clock SCK functionality of the serial peripheral interface SPI0 and SPI1. 1.7.16.3 MISO[1:0] signals This signal is associated with the MISO functionality of the serial peripheral interface SPI0 and SPI1. This signal acts as master input during master mode or as slave output during slave mode. 1.7.16.4 MOSI[1:0] signals This signal is associated with the MOSI functionality of the serial peripheral interface SPI0 and SPI1. This signal acts as master output during master mode or as slave input during slave mode 1.7.17 1.7.17.1 SCI signals RXD[1:0] signals These signals are associated with the receive functionality of the serial communication interfaces SCI[1:0]. 1.7.17.2 TXD[1:0] signals These signals are associated with the transmit functionality of the serial communication interfaces SCI[1:0]. 1.7.18 Timer IOC[7:0] signals The signals IOC0[7:0] and IOC1[3:0] are associated with the input capture or output compare functionality of the timer modules TIM0 and TIM1. 1.7.19 PWM[7:0] signals The signals PWM0[7:0] and PWM1[7:0] are associated with the outputs of the PWM0 and PWM1 modules. 1.7.20 1.7.20.1 IIC signals SDA signal This signal is associated with the serial data pin of IIC. 1.7.20.2 SCL signal This signal is associated with the serial clock pin of IIC. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 39 Chapter 1 Device Overview MC9S12ZVC-Family 1.7.21 Interrupt signals -- IRQ and XIRQ IRQ is a maskable level or falling edge sensitive input. XIRQ is a non-maskable level-sensitive interrupt. 1.7.22 1.7.22.1 Oscillator and Clock Signals 4-16MHZ Oscillator Signal -- EXTAL and XTAL EXTAL and XTAL are the crystal driver. On reset, the OSC is not enabled, all the device clocks are derived from the internal reference clock. EXTAL is the oscillator input. XTAL is the oscillator output. 1.7.22.2 ECLK This signal is associated with the output of the divided bus clock (ECLK). NOTE This feature is only intended for debug purposes at room temperature. It must not be used for clocking external devices in an application. 1.7.23 1.7.23.1 BDC and Debug Signals BKGD -- Background Debug Signal The BKGD signal is used as a pseudo-open-drain signal for the background debug communication. The BKGD signal has an internal pull-up device. 1.7.23.2 DBGEEV -- External Event Input This signal is the DBG external event input. It is input only. Within the DBG module, it allows an external event to force a state sequencer transition. A falling edge at the external event signal constitutes an event. Rising edges have no effect. The maximum frequency of events is half the internal core bus frequency. 1.7.24 1.7.24.1 CAN0 Signals RXCAN0 Signal This signal is associated with the receive functionality of the scalable controller area network controller (MSCAN0). 1.7.24.2 TXCAN0 Signal This signal is associated with the transmit functionality of the scalable controller area network controller (MSCAN0). MC9S12ZVC Family Reference Manual , Rev. 1.9 40 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.7.25 1.7.25.1 CAN Physical Layer Signals(CANPHY0) CANH0 -- CAN Bus High Pin0 The CANH0 signal either connects directly to CAN bus high line or through an optional external common mode choke. 1.7.25.2 CANL0 -- CAN Bus Low Pin0 The CANL0 signal either connects directly to CAN bus low line or through an optional external common mode choke. 1.7.25.3 SPLIT0 -- CAN Bus Termination Pin0 The SPLIT0 pin can drive a 2.5 V bias for bus termination purpose (CAN bus middle point). Usage of this pin is optional and depends on bus termination strategy for a given bus network. 1.7.25.4 CPTXD0 This is the CAN physical layer transmitter input signal. 1.7.25.5 CPRXD0 This is the CAN physical layer receiver output signal. 1.7.26 BCTL BCTL is the ballast connection for the on chip voltage regulator. It provides the base current of an external bipolar of the VDDX and VDDA supplies. 1.7.27 BCTLC BCTLC provides the base current of an external bipolar that supplies an external or internal CAN physical interface. 1.7.28 VDDC VDDC is the CANPHY supply. This is the output voltage of the external bipolar transistor, whose base current is supplied by BCTLC. It is fed back to the MCU for regulation. 1.7.29 High Current Output - EVDD This is a high current, low voltage drop output intended for supplying external devices in a range of up to 20mA. Configuring the pin direction as output automatically enables the high current capability. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 41 Chapter 1 Device Overview MC9S12ZVC-Family 1.7.30 Power Supply Pins The power and ground pins are described below. Because fast signal transitions place high, short-duration current demands on the power supply, use bypass capacitors with high-frequency characteristics and place them as close to the MCU as possible. NOTE All ground pins must be connected together in the application. 1.7.30.1 VDDX1, VDDX2, VSSX1, VSSX2 -- Digital I/O power and ground pins VDDX is the voltage regulator output for the digital I/O drivers. It supplies the VDDX domain pads. The VSSX1 and VSSX2 pin is the ground pin for the digital I/O drivers. Bypass capacitor requirements on VDDX/VSSX depend on how heavily the MCU pins are loaded. 1.7.30.2 VDDA, VSSA -- Power supply pins for ADC These are the power supply and ground pins for the analog-to-digital converter and the voltage regulator. These pins must be externally connected to the voltage regulator (VDDX, VSSX). A separate bypass capacitor for the ADC supply is recommended. 1.7.30.3 VSUP -- Voltage supply pin VSUP is the 12V supply voltage pin for the on chip voltage regulator. This is the voltage supply input from which the voltage regulator generates the on chip voltage supplies. It must be protected externally against a reverse battery connection. 1.8 Device Pinouts The MC9S12ZVC-Family will be offered in 48 pin LQFP and 64 pin LQFP-EP packages. The exposed pad on the package bottom of the LQFP-EP package must be connected to a ground pad on the PCB. MC9S12ZVC Family Reference Manual , Rev. 1.9 42 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family : 48 47 46 45 44 43 42 41 40 39 38 37 TEST BKGD PP6 / KWP6 / PWM1_5 VSSX2 PP5 / KWP5 / PWM1_3 PP2 / KWP2 / PWM0_5 VDDX2 VSS PT3 / IOC1_3 / (PWM0_7) PT2 / IOC1_2 / (PWM0_3) PT1 / IOC1_1 / (SCL0) / (TXD1) PT0 / IOC1_0 / (SDA0) / (RXD1) Figure 1-3. Pinout MC9S12ZVC-Family 48-pin LQFP 1 2 3 4 5 6 7 8 9 10 11 12 MC9S12ZVC-Family 48-pin LQFP 36 35 34 33 32 31 30 29 28 27 26 25 RESET PT7 / IOC0_7 / (SS0) / ECLK PT4 / IOC0_4 / (MISO0) / DBGEEV PS7 / KWS7 / SS1 / SENT_TX / IOC0_0 VDDX1 PP4 / KWP4 / PWM1_1 / (ETRIG0) VSSX1 PP0 / KWP0 / PWM0_1 PS3 / KWS3 / SS0 / (TXCAN0) / (CPDR1) / XIRQ PS2 / KWS2 / SCK0 / (RXCAN0) / IRQ PS1 / KWS1 / MOSI0 / (SCL0) / (TXD0) / (CPTXD0) PS0 / KWS0 / MISO0 / (SDA0) / (RXD0) / (CPRXD0) ACMP1_1 / AN4 / KWAD4 / PAD4 VSSA VDDA ACMP1_0 / VRH_0 / AN3 / KWAD3 / PAD3 ACMPO0 / AN2 / KWAD2 / PAD2 ACMP0_1 / (ETRIG0) / AN1 / KWAD1 / PAD1 ACMP0_0 / AN0 / KWAD0 / PAD0 SPLIT CANL VSSC CANH VDDC 13 14 15 16 17 18 19 20 21 22 23 24 VSUP KWL1 / PL1 KWL0 / PL0 BCTL BCTLC EXTAL / PE0 XTAL / PE1 AMP / AN9 / KWAD9 / PAD9 AMPM / AN8 / KWAD8 / PAD8 AMPP / AN7 / KWAD7 / PAD7 DACU / AN6 / KWAD6 / PAD6 ACMPO1 / AN5 / KWAD5 / PAD5 PP0, PP4, PP5 & PP6 supports 25 mA driver strength to VSSX PP2 supports 20 mA driver strength from VDDX (EVDD) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 43 Chapter 1 Device Overview MC9S12ZVC-Family 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 TEST BKGD PP6 / KWP6 / PWM1_5 VSSX2 PP5 / KWP5 / PWM1_3 PP2 / KWP2 / PWM0_5 VDDX2 VSS PP7 / KWP7 / PWM1_7 PP3 / KWP3 / PWM0_7 PP1 / KWP1 / PWM0_3 PS6 / KWS6 / SCK1 / (IOC0_1) PT3 / IOC1_3 / (PWM0_7) PT2 / IOC1_2 / (PWM0_3) PT1 / IOC1_1 / (SCL0) / (TXD1) PT0 / IOC1_0 / (SDA0) / (RXD1) Figure 1-4. Pinout MC9S12ZVC-Family 64-pin LQFP-EP1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 MC9S12ZVC-Family 64-pin LQFP-EP RESET PT7 / IOC0_7 / (SS0) / ECLK PT6 / IOC0_6 / (SCK0) PT5 / IOC0_5 / (MOSI0) PT4 / IOC0_4 / (MISO0) / DBGEEV PS7 / KWS7 / SS1 / SENT_TX / IOC0_0 VDDX1 PP4 / KWP4 / PWM1_1 / (ETRIG0) VSSX1 PP0 / KWP0 / PWM0_1 PS5 / KWS5 / MOSI1 / TXD1 / IOC0_2 PS4 / KWS4 / MISO1 / RXD1 / IOC0_3 PS3 / KWS3 / SS0 / (TXCAN0) / (CPDR1) / XIRQ PS2 / KWS2 / SCK0 / (RXCAN0) / IRQ PS1 / KWS1 / MOSI0 / (SCL0) / (TXD0) / (CPTXD0) PS0 / KWS0 / MISO0 / (SDA0) / (RXD0) / (CPRXD0) ACMP1_1 / AN4 / KWAD4 / PAD4 VSSA VDDA ACMP1_0 / VRH_0 / AN3 / KWAD3 / PAD3 ACMPO0 / AN2 / KWAD2 / PAD2 ACMP0_1 / (ETRIG0) / AN1 / KWAD1 / PAD1 ACMP0_0 / AN0 / KWAD0 / PAD0 AN15 / (ETRIG0) / KWAD15 / PAD15 AN14 / KWAD14 / PAD14 AN13 / KWAD13 / PAD13 AN12 / KWAD12/ PAD12 SPLIT CANL VSSC CANH VDDC 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 VSUP KWL1 / PL1 KWL0 / PL0 BCTL BCTLC EXTAL / PE0 XTAL / PE1 TXD0 / SCL0 / PJ1 RXD0 / SDA0 / PJ0 AN11 / KWAD11 / PAD11 AN10 / KWAD10 / PAD10 AMP / AN9 / KWAD9 / PAD9 AMPM / AN8 / KWAD8 / PAD8 AMPP / AN7 / KWAD7 / PAD7 DACU / AN6 / KWAD6 / PAD6 ACMPO1 / AN5 / KWAD5 / PAD5 PP0, PP4, PP5 & PP6 supports 25 mA driver strength to VSSX PP2 supports 20 mA driver strength from VDDX (EVDD) 1.The exposed pad on the package bottom must be connected to a ground pad on the PCB. MC9S12ZVC Family Reference Manual , Rev. 1.9 44 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family Table 1-6. MC9S12ZVC-Family Pin Summary LQFP Function Power Supply Internal Pull Resistor CTRL Reset State VSUP -- -- -- VDDX -- -- -- -- VDDX -- -- -- -- -- VDDX -- -- -- VDDX -- -- -- VDDX PERE/ PPSE Down -- -- -- -- VDDX PERE/ PPSE Down SCL0 TXD0 -- -- -- VDDX PERJ/ PPSJ Up PJ0 SDA0 RXD0 -- -- -- VDDX PERJ/ PPSJ Up 64 48 Pin 1st Func. 2nd Func. 3rd Func. 4th Func. 5th Func. 1 1 VSUP -- -- -- -- -- 2 2 PL1 HVI1 KWL1 -- -- 3 3 PL0 HVI0 KWL0 -- 4 4 BCTL 5 5 BCTLC 6 6 PE0 EXTAL 7 7 PE1 XTAL 8 PJ1 9 10 -- PAD11 KWAD11 AN11 -- -- -- VDDA PERADL/ PPSADL Off 11 -- PAD10 KWAD10 AN10 -- -- -- VDDA PERADL/ PPSADL Off 12 8 PAD9 KWAD9 AN9 AMP -- -- VDDA PERADL/ PPSADL Off 13 9 PAD8 KWAD8 AN8 AMPM -- -- VDDA PERADL/ PPSADL Off 14 10 PAD7 KWAD7 AN7 AMPP -- -- VDDA PERADH/ PPSADH Off 15 11 PAD6 KWAD6 AN6 DACU -- -- VDDA PERADH/ PPSADH Off 16 12 PAD5 KWAD5 AN5 ACMPO1 -- -- VDDA PERADL/ PPSADL Off 17 13 PAD4 KWAD4 AN4 ACMP1_1 -- -- VDDA PERADL/ PPSADL Off 18 14 VSSA -- VDDA 19 15 VDDA -- VDDA 20 16 PAD3 KWAD3 AN3 VRH_0 ACMP1_0 -- VDDA PERADL/ PPSADL Off 21 17 PAD2 KWAD2 AN2 ACMPO0 -- -- VDDA PERADL/ PPSADL Off MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 45 Chapter 1 Device Overview MC9S12ZVC-Family Table 1-6. MC9S12ZVC-Family Pin Summary LQFP Function 64 48 Pin 1st Func. 2nd Func. 3rd Func. 4th Func. 22 18 PAD1 KWAD1 AN1 (ERTIG0) ACMP0_1 23 19 PAD0 KWAD0 AN0 ACMP0_0 -- 24 PAD15 KWAD15 (ERTIG0) AN15 25 PAD14 KWAD14 26 PAD13 27 PAD12 5th Func. Power Supply Internal Pull Resistor CTRL Reset State VDDA PERADL/ PPSADL Off -- VDDA PERADL/ PPSADL Off -- -- VDDA PERADL/ PPSADL Off AN14 -- -- VDDA PERADL/ PPSADL Off KWAD13 AN13 -- -- VDDA PERADL/ PPSADL Off KWAD12 AN12 -- -- VDDA PERADL/ PPSADL Off 28 20 SPLIT -- -- -- -- VDDC 29 21 CANL -- -- -- -- VDDC 30 22 VSSC -- -- -- -- VDDC 31 23 CANH -- -- -- -- VDDC 32 24 VDDC -- -- -- -- VDDC 33 25 PS0 KWS0 MISO0 (SDA0) (RXD0) (CPRXD0 ) VDDX PERS/ PPSS Up 34 26 PS1 KWS1 MOSI0 (SCL0) (TXD0) (CPTXD0 ) VDDX PERS/ PPSS Up 35 27 PS2 KWS2 SCK0 (RXCAN0 ) IRQ VDDX PERS/ PPSS Up 36 28 PS3 KWS3 SS0 (TXCAN0 ) (CPDR1) VDDX PERS/ PPSS Up 37 PS4 KWS4 MISO1 RXD1 IOC0_31 VDDX PERS/ PPSS Up 38 PS5 KWS5 MOSI1 TXD1 IOC0_22 VDDX PERS/ PPSS Up KWP0 PWM0_1 PERP/ PPSP Off PERP/ PPSP Off PERS/ PPSS Up 39 29 PP0 40 30 VSSX1 41 31 PP4 42 32 VDDX1 43 33 PS7 KWP4 KWS7 XIRQ -- -- VDDX -- -- -- -- VDDX PWM1_1 (ETRIG0) -- -- VDDX -- -- -- VDDX SENT_TX IOC0_0 SS1 VDDX MC9S12ZVC Family Reference Manual , Rev. 1.9 46 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family Table 1-6. MC9S12ZVC-Family Pin Summary LQFP Function 64 48 Pin 1st Func. 2nd Func. 3rd Func. 44 34 PT4 IOC0_4 (MISO0) DBGEEV 45 -- PT5 IOC0_5 (MOSI0) 46 -- PT6 IOC0_6 (SCK0) 47 35 PT7 IOC0_7 48 36 RESET 49 37 50 4th Func. 5th Func. Power Supply Internal Pull Resistor CTRL Reset State -- VDDX PERT/ PPST Off -- -- VDDX PERT/ PPST Off -- -- -- VDDX PERT/ PPST Off (SS0) ECLK -- -- VDDX PERT/ PPST Off -- -- -- -- -- VDDX TEST pin Up PT0 IOC1_0 (SDA0) (RXD1) VDDX PERT/ PPST Off 38 PT1 IOC1_1 (SCL0) (TXD1) VDDX PERT/ PPST Off 51 39 PT2 IOC1_2 (PWM0_3 ) VDDX PERT/ PPST Off 52 40 PT3 IOC1_3 (PWM0_7 ) VDDX PERT/ PPST Off PS6 KWS6 SCK1 (IOC0_1) VDDX PERS/ PPSS Up 53 54 -- PP1 KWP1 PWM0_3 -- -- -- VDDX PERP/ PPSP Off 55 -- PP3 KWP3 PWM0_7 -- -- -- VDDX PERP/ PPSP Off 56 -- PP7 KWP7 PWM1_7 -- -- -- VDDX PERP/ PPSP Off 57 41 VSS -- -- -- -- -- 58 42 VDDX2 -- -- -- -- -- VDDX 59 43 PP2 KWP2 PWM0_5 -- -- -- VDDX PERP/ PPSP Off 60 44 PP5 KWP5 PWM1_3 -- -- -- VDDX PERP/ PPSP Off 61 45 VSSX2 -- -- -- -- -- VDDX 62 46 PP6 KWP6 PWM1_5 -- -- -- VDDX PERP/ PPSP Off 63 47 BKGD MODC -- -- -- -- VDDX 64 48 TEST -- -- -- -- -- -- 1Input 2Input Up RESET Down capture routed to PS7 by default. Output compare feature always on PS6. capture routed to PS7 by default. Output compare feature always on PS6 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 47 Chapter 1 Device Overview MC9S12ZVC-Family 1.9 Internal Signal Mapping This section specifies the mapping of inter-module signals at device level. 1.9.1 ACMP0 and ACMP1 Connectivity Table 1-7. shows the connectivity for the analog comparator modules ACMP0 and ACMP1. Table 1-7. ACMP0 and ACMP1 connectivity Analog Comparator Inputs ACMP1 acmpi_01 DACI (unbuffered DAC output) DACI (unbuffered DAC output) acmpi_12 AMP (buffered DAC output) AMP (buffered DAC output) ACMP_0 PAD0(AN0) PAD3(AN3) ACMP_1 PAD1(AN1) PAD4(AN4) 1Output 2Output 1.9.2 ACMP0 of DAC module DACI need to be enabled of the DAC module AMP need to be enabled DAC Connectivity DAC reference Voltage signal VRH is mapped to VDDA and VRL is mapped to VSSA. 1.9.3 1.9.3.1 ADC Connectivity ADC Reference Voltages ADC reference Voltage signal VRH_1 is mapped to VDDA and VRH_0 is mapped to PAD3. VRL_1 is mapped to VSSA and VRL_0 is mapped to VSSA. 1.9.3.2 ADC External Trigger Input The ADC module includes a trigger input to start a sequence of conversions. The trigger signal can be routed to 1 out of 4 sources: 1. internal to the TIM0 OC2 (trigger signal generated by TIM0) 2. external to the pin PAD15 (ETRIG0) 3. external to the pin PAD1 (ETRIG0) 4. external to the pin PP4 (ETRIG0) MC9S12ZVC Family Reference Manual , Rev. 1.9 48 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.9.3.3 ADC Internal Channels The ADC internal channel mapping is shown in Table 1-8. Table 1-8. ADC Channel Assignment ADCCMD_L[CH_SEL] 1.9.4 [5] [4] [3] [2] [1] [0] Analog Input Channel 0 0 0 0 0 0 VRL 0 0 0 0 0 1 VRH 0 0 0 0 1 0 (VRH-VRL)/2 0 0 0 0 1 1 Reserved 0 0 0 1 0 0 Reserved 0 0 0 1 0 1 Reserved 0 0 0 1 1 0 Reserved 0 0 0 1 1 1 Reserved 0 0 1 0 0 0 Internal_0 RESERVED 0 0 1 0 0 1 Internal_1 Bandgap Voltage VBG or Chip temperature sensor VHT see Section 8.3.2.14 High Temperature Control Register (CPMUHTCTL) 0 0 1 0 1 0 Internal_2 Flash Voltage VDDF 0 0 1 0 1 1 Internal_3 RESERVED 0 0 1 1 0 0 Internal_4 VSUP see Section 10.3.2.1 BATS Module Enable Register (BATE) 0 0 1 1 0 1 Internal_5 High voltage input port L0 see Section 2.3.4.10 Port L ADC Connection Enable Register (PTAENL) 0 0 1 1 1 0 Internal_6 High voltage input port L1 Section 2.3.4.10 Port L ADC Connection Enable Register (PTAENL) 0 0 1 1 1 1 Internal_7 RESERVED Usage TIM0 and TIM1 Clock Source Connectivity The clock for TIM1 is the device core clock generated in the CPMU module. (maximum core clock is 64MHz) The clock for TIM0 is the device bus clock generated in the CPMU module. (maximum bus clock 32MHz) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 49 Chapter 1 Device Overview MC9S12ZVC-Family 1.9.5 TIM0 and TIM1 IOC Channel Connectivity Table 1-9 shows a summary of TIM0 and TIM1channel connections. Table 1-9. TIM0 and TIM1 Connections 1.9.6 IOC Channel TIM0 TIM1 (fast) IOC0 SENTTX PT0 IOC1 SENTTX PT1 IOC2 ACLK / ADC Trigger PT2 / ACMP0 output IOC3 RXD0 / RXD1 PT3 / ACMP1 output IOC4 PT4 IOC5 PT5 IOC6 PT6 IOC7 PT7 PWM0 and PWM1 Clock Source Connectivity The clock for PWM1, PWM Clock , is mapped to device core clock, generated in the CPMU module. (maximum core clock is 64MHz) The clock for PWM0 , PWM Clock , is mapped to device bus clock, generated in the CPMU module. (maximum bus clock is 32MHz) 1.9.7 BDC Clock Source Connectivity The BDC clock, BDCCLK, is mapped to the IRCCLK generated in the CPMU module. The BDC clock, BDCFCLK is mapped to the device bus clock, generated in the CPMU module. 1.9.8 FTMRZ Connectivity The soc_erase_all_req input to the flash module is driven directly by a BDC erase flash request resulting from the BDC ERASE_FLASH command. 1.9.9 CPMU Connectivity The API clock generated in the CPMU is not mapped to a device pin in the MC9S12ZVC-Family. MC9S12ZVC Family Reference Manual , Rev. 1.9 50 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.10 Modes of Operation The MCU can operate in different modes. These are described in 1.10.1 Chip Configuration Modes. The MCU can operate in different power modes to facilitate power saving when full system performance is not required. These are described in 1.10.3 Low Power Modes. Some modules feature a software programmable option to freeze the module status whilst the background debug module is active to facilitate debugging. This is referred to as freeze mode at module level. 1.10.1 Chip Configuration Modes The different modes and the security state of the MCU affect the debug features (enabled or disabled). The operating mode out of reset is determined by the state of the MODC signal during reset (Table 1-10). The MODC bit in the MODE register shows the current operating mode and provides limited mode switching during operation. The state of the MODC signal is latched into this bit on the rising edge of RESET. Table 1-10. Chip Modes Chip Modes 1.10.1.1 MODC Normal single chip 1 Special single chip 0 Normal Single-Chip Mode This mode is intended for normal device operation. The opcode from the on-chip memory is executed after reset (requires the reset vector to be programmed correctly). The processor program is executed from internal memory. NOTE To avoid unpredictable behaviour do not start the device in Normal Single-Chip Mode while the flash is erased. 1.10.1.2 Special Single-Chip Mode This mode is used for debugging operation, boot-strapping, or security related operations. The background debug mode (BDM) is active on leaving reset in this mode. 1.10.2 Debugging Modes The background debug mode (BDM) can be activated by the BDC module or directly when resetting into Special Single-Chip mode. Detailed information can be found in the BDC module section. Writing to internal memory locations using the debugger, whilst code is running or at a breakpoint, can change the flow of application code. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 51 Chapter 1 Device Overview MC9S12ZVC-Family The MC9S12ZVC-Family supports BDC communication throughout the device Stop mode. During Stop mode, writes to control registers can alter the operation and lead to unexpected results. It is thus recommended not to reconfigure the peripherals during STOP using the debugger. 1.10.3 Low Power Modes The device has two dynamic-power modes (run and wait) and two static low-power modes (stop and pseudo stop). For a detailed description refer to the CPMU section. * Dynamic power mode: Run -- Run mode is the main full performance operating mode with the entire device clocked. The user can configure the device operating speed through selection of the clock source and the phase locked loop (PLL) frequency. To save power, unused peripherals must not be enabled. * Dynamic power mode: Wait -- This mode is entered when the CPU executes the WAI instruction. In this mode the CPU does not execute instructions. The internal CPU clock is switched off. All peripherals can be active in system wait mode. For further power consumption the peripherals can individually turn off their local clocks. Asserting RESET, XIRQ, IRQ, or any other interrupt that is not masked, either locally or globally by a CCR bit, ends system wait mode. * Static power modes: Static power (Stop) modes are entered following the CPU STOP instruction unless an NVM command is active. When no NVM commands are active, the Stop request is acknowledged and the device enters either Stop or Pseudo Stop mode. -- Pseudo-stop: In this mode the system clocks are stopped but the oscillator is still running and the real time interrupt (RTI), watchdog (COP) and Autonomous Periodic Interrupt (API) may be enabled. Other peripherals are turned off. This mode consumes more current than system STOP mode but, as the oscillator continues to run, the full speed wake up time from this mode is significantly shorter. -- Stop: In this mode the oscillator is stopped and clocks are switched off and the VREG enters reduced performance mode (RPM). The counters and dividers remain frozen. The autonomous periodic interrupt (API) may remain active but has a very low power consumption. The KWx pins and the SCI module can be configured to wake the device, whereby current consumption is negligible. If the BDC is enabled, in Stop mode, the VREG remains in full performance mode. With BDC enabled and BDCCIS bit set, then all clocks remain active during Stop mode to allow BDC access to internal peripherals. If the BDC is enabled and BDCCIS is clear, then the BDCSI clock remains active to allow BDC register access, but other clocks (with the exception of the API) are switched off. With the BDC enabled during Stop, the VREG full performance mode and clock activity lead to higher current consumption than with BDC disabled. If the BDC is enabled in Stop mode, then the voltage monitoring remains enabled. NOTE The U-bit should be cleared and the S-bit (stop enable) should be cleared in the CPU condition code register (CCR) to execute the STOP instruction.Otherwise the STOP instruction is considered as a NOP. MC9S12ZVC Family Reference Manual , Rev. 1.9 52 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.11 Security The MCU security mechanism prevents unauthorized access to the flash memory. It must be emphasized that part of the security must lie with the application code. An extreme example would be application code that dumps the contents of the internal memory. This would defeat the purpose of security. Also, if an application has the capability of downloading code through a serial port and then executing that code (e.g. an application containing bootloader code), then this capability could potentially be used to read the EEPROM and Flash memory contents even when the microcontroller is in the secure state. In this example, the security of the application could be enhanced by requiring a response authentication before any code can be downloaded. Device security details are also described in the flash block description. 1.11.1 Features The security features of the S12Z chip family are: * Prevent external access of the non-volatile memories (Flash, EEPROM) content * Restrict execution of NVM commands 1.11.2 Securing the Microcontroller The chip can be secured by programming the security bits located in the options/security byte in the Flash memory array. These non-volatile bits keep the device secured through reset and power-down. This byte can be erased and programmed like any other Flash location. Two bits of this byte are used for security (SEC[1:0]). The contents of this byte are copied into the Flash security register (FSEC) during a reset sequence. The meaning of the security bits SEC[1:0] is shown in Table 1-11. For security reasons, the state of device security is controlled by two bits. To put the device in unsecured mode, these bits must be programmed to SEC[1:0] = `10'. All other combinations put the device in a secured mode. The recommended value to put the device in secured state is the inverse of the unsecured state, i.e. SEC[1:0] = `01'. Table 1-11. Security Bits SEC[1:0] Security State 00 1 (secured) 01 1 (secured) 10 0 (unsecured) 11 1 (secured) NOTE Please refer to the Flash block description for more security byte details. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 53 Chapter 1 Device Overview MC9S12ZVC-Family 1.11.3 Operation of the Secured Microcontroller By securing the device, unauthorized access to the EEPROM and Flash memory contents is prevented. Secured operation has the following effects on the microcontroller: 1.11.3.1 * * Background debug controller (BDC) operation is completely disabled. Execution of Flash and EEPROM commands is restricted (described in flash block description). 1.11.3.2 * * Normal Single Chip Mode (NS) Special Single Chip Mode (SS) Background debug controller (BDC) commands are restricted Execution of Flash and EEPROM commands is restricted (described in flash block description). In special single chip mode the device is in active BDM after reset. In special single chip mode on a secure device, only the BDC mass erase and BDC control and status register commands are possible. BDC access to memory mapped resources is disabled. The BDC can only be used to erase the EEPROM and Flash memory without giving access to their contents. 1.11.4 Unsecuring the Microcontroller Unsecuring the microcontroller can be done using three different methods: 1. Backdoor key access 2. Reprogramming the security bits 3. Complete memory erase 1.11.4.1 Unsecuring the MCU Using the Backdoor Key Access In normal single chip mode, security can be temporarily disabled using the backdoor key access method. This method requires that: * The backdoor key has been programmed to a valid value * The KEYEN[1:0] bits within the Flash options/security byte select `enabled'. * The application program programmed into the microcontroller has the capability to write to the backdoor key locations The backdoor key values themselves would not normally be stored within the application data, which means the application program would have to be designed to receive the backdoor key values from an external source (e.g. through a serial port) The backdoor key access method allows debugging of a secured microcontroller without having to erase the Flash This is particularly useful for failure analysis. NOTE No backdoor key word is allowed to have the value 0x0000 or 0xFFFF. MC9S12ZVC Family Reference Manual , Rev. 1.9 54 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.11.5 Reprogramming the Security Bits Security can also be disabled by erasing and reprogramming the security bits within the flash options/security byte to the unsecured value. Since the erase operation will erase the entire sector (0x7F_FE00-0x7F_FFFF) the backdoor key and the interrupt vectors will also be erased; this method is not recommended for normal single chip mode. The application software can only erase and program the Flash options/security byte if the Flash sector containing the Flash options/security byte is not protected (see Flash protection). Thus Flash protection is a useful means of preventing this method. The microcontroller enters the unsecured state after the next reset following the programming of the security bits to the unsecured value. This method requires that: * The application software previously programmed into the microcontroller has been designed to have the capability to erase and program the Flash options/security byte. * The Flash sector containing the Flash options/security byte is not protected. 1.11.6 Complete Memory Erase The microcontroller can be unsecured by erasing the entire EEPROM and Flash memory contents. If ERASE_FLASH is successfully completed, then the Flash unsecures the device and programs the security byte automatically. 1.12 Resets and Interrupts Table 1-12. lists all Reset sources and the vector address. Resets are explained in detail in the Chapter 8, "S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7)"" Table 1-12. Reset Sources and Vector Locations 1.12.1 Vector Address Reset Source CCR Mask Local Enable 0xFF_FFFC Power-On Reset (POR) None None Low Voltage Reset (LVR) None None External pin RESET None None Clock monitor reset None OSCE Bit in CPMUOSC register & OMRE Bit in CPMUOSC2 register COP watchdog reset None CR[2:0] in CPMUCOP register Interrupt Vectors Table 1-13. lists all interrupt sources and vectors in the default order of priority. The interrupt module description provides an interrupt vector base register (IVBR) to relocate the vectors. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 55 Chapter 1 Device Overview MC9S12ZVC-Family Table 1-13. Interrupt Vector Locations CCR Mask Local Enable Wake up from STOP Wake up from WAIT Unimplemented page1 op-code trap (SPARE) None None - - Vector base + 0x1F4 Unimplemented page 2 op-code trap (TRAP) None None - - Vector base + 0x1F0 Software interrupt instruction (SWI) None None - - Vector base + 0x1EC System call interrupt instruction (SYS) None None - - Vector base + 0x1E8 Machine exception None None - - Vector Address Interrupt Source Vector base + 0x1F8 Vector base + 0x1E4 Reserved Vector base + 0x1E0 Reserved Vector base + 0x1DC Spurious interrupt - None - - Vector base + 0x1D8 XIRQ interrupt request X bit None Yes Yes Vector base + 0x1D4 IRQ interrupt request I bit IRQCR (IRQEN) Yes Yes Vector base + 0x1D0 RTI timeout interrupt I bit CPMUINT (RTIE) Yes Yes Vector base + 0x1CC TIM0 timer channel 0 I bit TIE (C0I) No Yes Vector base + 0x1C8 TIM0 timer channel 1 I bit TIM0TIE (C1I) No Yes Vector base + 0x1C4 TIM0 timer channel 2 I bit TIM0TIE (C2I) No Yes Vector base + 0x1C0 TIM0 timer channel 3 I bit TIM0TIE (C3I) No Yes Vector base + 0x1BC TIM0 timer channel 4 I bit TIM0TIE (C4I) No Yes Vector base + 0x1B8 TIM0 timer channel 5 I bit TIM0TIE (C5I) No Yes Vector base + 0x1B4 TIM0 timer channel 6 I bit TIM0TIE (C6I) No Yes Vector base + 0x1B0 TIM0 timer channel 7 I bit TIM0TIE (C7I) No Yes Vector base + 0x1AC TIM0 timer overflow I bit TIM0TSCR2 (TOF) No Yes Vector base + 0x1A8 TIM0 pulse accumulator A overflow I bit TIM0PACTL(PAOVI) No Yes Vector base + 0x1A4 TIM0 pulse accumulator input edge I bit TIM0PACTL (PAI) No Yes Vector base + 0x1A0 SPI0 I bit SPI0CR1 (SPIE, SPTIE) No Yes Vector base + 0x19C SCI0 I bit SCI0CR2 (TIE, TCIE, RIE, ILIE) Yes Yes Vector base + 0x198 SCI1 I bit SCI1CR2 (TIE, TCIE, RIE, ILIE) Yes Yes No Yes Vector base + 0x194 Reserved Vector base + 0x190 Reserved Vector base + 0x18C ADC0 error interrupt I bit ADC0EIE(IA_EIE, CMD_EIE, EOL_EIE, TRIG_EIE,RSTAR_EIE, LDOK_EIE) MC9S12ZVC Family Reference Manual , Rev. 1.9 56 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family Vector Address Interrupt Source CCR Mask Vector base + 0x188 ADC0 conversion sequence abort I bit Vector base + 0x184 ADC0 conversion complete interrupt Vector base + 0x180 Wake up from STOP Wake up from WAIT ADCIE(SEQAR_IE, CONIF_OIE) No Yes I bit ADCCONIE[9:0] No Yes Oscillator status interrupt I bit CPMUINT(OSCIE) No Yes Vector base + 0x17C PLL lock interrupt I bit CPMUINT(LOCKIE) No Yes Vector base + 0x178 ACMP0 I bit ACMP0C(ACIE) No Yes Vector base + 0x174 ACMP1 I bit ACMP1C(ACIE) No Yes Vector base + 0x170 RAM error I bit EECIE (SBEEIE) No Yes Vector base + 0x16C SPI1 I bit SPI1CR1(SPIE,SPTIE) No Yes Local Enable Reserved Vector base + 0x168 Vector base + 0x164 FLASH error I bit FERCNFG (SFDIE) No No Vector base + 0x160 FLASH command I bit FCNFG (CCIE) No Yes Vector base + 0x15C CAN wake-up I bit CANRIER (WUPIE) Yes Yes Vector base + 0x158 CAN error I bit CANRIER (CSCIE, OVRIE) No Yes Vector base + 0x154 CAN receive I bit CANRIER (RXFIE) No Yes Vector base + 0x150 CAN transmit I bit CANRIER (TXEIE[2:0]) No Yes No Yes Reserved Vector base + 0x14C to Vector base + 0x144 Vector base + 0x140 BATS supply voltage monitor interrupt Vector base + 0x13C to Vector base + 0x12C I bit BATIE(BVHIE, BVLIE) Reserved Vector base + 0x128 CAN Physical Layer I bit CPIE(CPVFIE, CPOCIE) No Yes Vector base + 0x124 Port S interrupt (Key Wakeup) I bit PIES(PIES[7..0]) Yes Yes Vector base + 0x120 to Vector base + 0x110 Reserved Vector base + 0x10C Port P interrupt I bit PIEP(PIEP[7..0]) Yes Yes Vector base + 0x108 EVDD and NGPIO over-current interrupt I bit OCPEP(OCPEP[6,4,2:0]) No Yes Vector base + 0x104 Low-voltage interrupt (LVI) I bit CPMUCTRL (LVIE) No Yes Vector base + 0x100 Autonomous periodical interrupt (API) I bit CPMUAPICTRL(APIE) Yes Yes Vector base + 0x0FC High temperature interrupt I bit CPMUHTCTL (HTIE) No Yes Yes Yes Vector base + 0x0F8 Vector base + 0x0F4 Reserved Port AD interrupt (Key Wakeup) I bit PIEADH(PIEADH[7..0]) PIEADL(PIEADL[7..0]) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 57 Chapter 1 Device Overview MC9S12ZVC-Family Vector Address Interrupt Source Vector base + 0x0F0 to Vector base + 0x0C4 Vector base + 0x0C0 CCR Mask Local Enable Wake up from STOP Wake up from WAIT PIEL(PIEL[1:0]) Yes Yes Reserved Port L interrupt (Key Wakeup) Vector base + 0x0BC to Vector base + 0x0B0 I bit Reserved Vector base + 0x0AC TIM1 timer channel 0 I bit TIM1TIE (C0I) No Yes Vector base + 0x0A8 TIM1 timer channel 1 I bit TIM1TIE (C1I) No Yes Vector base + 0x0A4 TIM1 timer channel 2 I bit TIM1TIE (C2I) No Yes Vector base + 0x0A0 TIM1 timer channel 3 I bit TIM1TIE (C3I) No Yes TIM1TSCR2 (TOF) No Yes Reserved Vector base + 0x09C to Vector base + 0x090 Vector base + 0x08C TIM1 timer overflow Vector base + 0x088 to Vector base + 0x064 I bit Reserved Vector base + 0x060 IIC0 I bit IBCR(IBIE) No Yes Vector base + 0x05C SENTTX I bit INTEN(xxIE) No Yes Reserved Vector base + 0x058 to Vector base + 0x000 1.12.2 Effects of Reset When a reset occurs, MCU registers and control bits are initialized. Refer to the respective block sections for register reset states. On each reset, the Flash module executes a reset sequence to load Flash configuration registers. 1.12.2.1 Flash Configuration Reset Sequence Phase On each reset, the Flash module will hold CPU activity while loading Flash module registers from the Flash memory. If double faults are detected in the reset phase, Flash module protection and security may be active on leaving reset. This is explained in more detail in the Flash module description. 1.12.2.2 Reset While Flash Command Active If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. MC9S12ZVC Family Reference Manual , Rev. 1.9 58 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.12.2.3 I/O Pins Refer to the PIM section for reset configurations of all peripheral module ports. 1.12.2.4 RAM The system RAM arrays, including their ECC syndromes, are initialized following a power on reset. All other RAM arrays are not initialized out of any type of reset. With the exception of a power-on-reset the RAM content is unaltered by a reset occurrence. 1.13 1.13.1 Module device level dependencies API External Clock Output API external clock output API_EXTCLK mentioned in 8.2.12 and 8.3.2.16 is not available on S12ZVCFamily. 1.13.2 COP Configuration The COP timeout rate bits CR[2:0] and the WCOP bit in the CPMUCOP register are loaded from the Flash configuration field byte at global address 0xFF_FE0E during the reset sequence. See Table 1-14 and Table 1-15 for coding. Table 1-14. Initial COP Rate Configuration NV[2:0] in FOPT Register CR[2:0] in COPCTL Register 000 111 001 110 010 101 011 100 100 011 101 010 110 001 111 000 Table 1-15. Initial WCOP Configuration NV[3] in FOPT Register WCOP in COPCTL Register 1 0 0 1 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 59 Chapter 1 Device Overview MC9S12ZVC-Family 1.13.3 Flash IFR Mapping Table 1-16. Flash IFR Mapping 15 14 13 12 11 10 9 7 6 5 4 3 2 1 0 IFR Byte Address ADC0 reference conversion using VDDA/VSSA 0x1F_C040 & 0x1F_C041 ADC0 reference conversion using PAD1/PAD0 0x1F_C042 & 0x1F_C043 ACLKTR[5:0]1 (CPMU) TCTRIM[4:0] (CPMU)3 1see 2see 3see 8 Reserved 0x1F_C050 & 0x1F_C051 Reserved 0x1F_C052 & 0x1F_C053 Reserved 0x1F_C054 & 0x1F_C055 Reserved 0x1F_C056 & 0x1F_C057 Reserved 0x1F_C058 & 0x1F_C059 Reserved 0x1F_C05A & 0x1F_C05B HTTR[3:0]2 (CPMU) IRCTRIM[9:0] (CPMU)3 0x1F_C0B8 & 0x1F_C0B9 0x1F_C0BA & 0x1F_C0BB Section 8.3.2.17 Autonomous Clock Trimming Register (CPMUACLKTR) Section 8.3.2.20 High Temperature Trimming Register (CPMUHTTR) Section 8.3.2.21 S12CPMU_UHV_V7 IRC1M Trim Registers (CPMUIRCTRIMH / CPMUIRCTRIML) MC9S12ZVC Family Reference Manual , Rev. 1.9 60 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family 1.14 1.14.1 Application Information ADC Calibration For applications that do not provide external ADC reference voltages, the VDDA/VSSA supplies can be used as sources for VRH/VRL respectively. Since the VDDA must be connected to VDDX at board level in the application, the accuracy of the VDDA reference is limited by the internal voltage regulator accuracy. In order to compensate for VDDA reference voltage variation in this case, the on chip bandgap reference voltage VBG is measured during production test. VBG has a narrow variation over temperature and external voltage supply. VBG is connected to an internal channel of the ADC module (see Table 1-8). The12-bit left justified ADC conversion result of VBG is stored in the flash IFR for reference, as listed in Table 1-16. By measuring the voltage VBG in the application environment and comparing the result to the reference value in the IFR, it is possible to determine the current ADC reference voltage VRH: StoredReference V RH = ------------------------------------------------------- 5V ConvertedReference The exact absolute value of an analog conversion can be determined as follows: StoredReference 5V Result = ConvertedADInput -----------------------------------------------------------------nConvertedReference 2 With: Converted AD Input: Converted Reference: Stored Reference: n: Result of the analog to digital conversion of the desired pin Result of internal channel conversion Value in IFR location ADC resolution (12 bit) NOTE The ADC reference voltage VRH must remain at a constant level throughout the conversion process. The reference voltage VBG is measured under the conditions shown in Table 1-17. The value stored in the IFR is the average of 8 consecutive conversions. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 61 Chapter 1 Device Overview MC9S12ZVC-Family Table 1-17. VBG Reference Conversion Measurement Conditions for 5V operation Description Symbol Value Unit I/O supply voltage VDDX 5 V Analog supply voltage VDDA 5 V ADC reference voltage VRH 5 V fADCCLK 2 MHz ADC sample time tSMP 4 ADC clock cycles Bus frequency fbus 25 MHz Ambient temperature TA 150 C ADC clock 1.14.2 Use Case Urea Concentration Level Sensor In this application the signal runtime of ultrasonic response is measured. Sensor output is connected to PAD1. This case uses the ACMP0 to compare the sensor output voltage with a reference voltage provided by the DAC module. The output of the ACMP0 module is connected to high resolution timer (TIM1) to measure the signal runtime. See Figure 1-5. 1. Setup ACMP0, DAC,and PIM: * Select PAD1/ACMP0_1 as positive input to ACMP0 -- Set ACMP0C1.[ACPSEL1:ACPSEL0]= 0x01 * Select Unbuffered DAC output DACU as negative input to ACMP0 -- Set ACMP0C1.[ACNSEL1:ACNSEL0]= 0x2 * Select required ACMP0 hysteresis VACMP_hys -- Set ACMP0C0.[ACHYS1:ACHYS0]= 11 (largest hysteresis) * Select required ACMP0 input filter characteristic -- Set ACMP0C0.[ACDLY]= 0x1 (high speed characteristic). * Select Full Voltage Range for DAC -- Set DACCTL[FVR]=0x1 * Select DAC output voltage Vout = DACVOL[7:0] x (VRH-VRL)/256 + VRL -- Set DACVOL=<required reference voltage> * Select DAC Mode unbuffered DAC and wait for DACU to settle Tsettle_DACU -- Set DACCTL[DACM2:DACM0]=100 MC9S12ZVC Family Reference Manual , Rev. 1.9 62 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family * * Route ACMP0 output to capture input of fast timer (TIM1). Timer resolution for core clock 64MHz about 16ns. -- Set MODRR1[T1IC2RR]=0x1. Enable ACMP0 and wait for the initialization delay of 127 bus clock cycles (for bus clock 32MHz about 4us) -- ACMP0C0[ACE]=0x1 2. Configure fast TIM1 input Capture channel IC2 to measure time between two input capture events Figure 1-5. DAC , ACMP and Pad Connectivity PAD7 AMPP AMPP DACU DACU PAD6 AMP PAD9 DAC PAD8 AMPM AMPM AMP DACI acmpi_0 acmpi_1 ACMP0 PAD0 ACMP0_0 ACMP_0 PAD1 ACMP0_1 ACMP_1 IC2 acmpi_0 IOC2 IC3 INT Fast TIM1 IOC3 acmpi_1 1.14.3 PAD3 ACMP1_0 PAD4 ACMP1_1 ACMP1 ACMP_0 ACMP_1 Voltage Domain Monitoring The BATS module monitors the voltage on the VSUP pin, providing status and flag bits, an interrupt and a connection to the ADC, for accurate measurement of the scaled VSUP level. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 63 Chapter 1 Device Overview MC9S12ZVC-Family The POR circuit monitors the VDD and VDDA domains, ensuring a reset assertion until an adequate voltage level is attained. The LVR circuit monitors the VDD, VDDF and VDDX domains, generating a reset when the voltage in any of these domains drops below the specified assert level. The VDDX LVR monitor is disabled when the VREG is in reduced power mode. A low voltage interrupt circuit monitors the VDDA domain. MC9S12ZVC Family Reference Manual , Rev. 1.9 64 NXP Semiconductors Chapter 1 Device Overview MC9S12ZVC-Family MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 65 Chapter 1 Device Overview MC9S12ZVC-Family MC9S12ZVC Family Reference Manual , Rev. 1.9 66 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) Table 2-1. Revision History Rev. No. (Item No.) Date (Submitted By) V01.00 14 May 2014 2.1 2.1.1 Sections Affected Substantial Change(s) * Initial version Introduction Overview The S12ZVC-family port integration module establishes the interface between the peripheral modules and the I/O pins for all ports. It controls the electrical pin properties as well as the signal prioritization and multiplexing on shared pins. This document covers: * 2-pin port E associated with the external oscillator * 16-pin port AD with pin interrupts and key-wakeup function; associated with 16 Analog-to-Digital Converter (ADC) channels, shared with 2 Analog Comparator (ACMP) and 1 Digital-to-Analog Converter (DAC) * 8-pin port T associated with 4 fast and 4 standard timer (TIM) channels, shared with ECLK, 1 routed SCI, 1 routed SPI, 1 routed IIC, 2 routed standard PWM channels * 8-pin port S with pin interrupts and key-wakeup function or IRQ, XIRQ interrupt inputs; associated with 2 SPI, shared with 1 SENT transmitter, 1 SCI, 4 routed standard TIM channels, 1 routed SCI and 1 routed IIC, 1 routed MSCAN and routed CPTXD and CPRXD interface of CANPHY (for test) * 8-pin port P with pin interrupts and key-wakeup function; associated with 4 fast and 4 standard PWM channels * 2-pin port J associated with 1 IIC shared with 1 SCI * 2-pin port L with pin interrupts and key-wakeup function; associated with 2 high voltage inputs (HVI) Most I/O pins can be configured by register bits to select data direction and to enable and select pullup or pulldown devices. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 67 Chapter 2 Port Integration Module (S12ZVCPIMV1) NOTE This document assumes the availability of all features offered in the largest package option. Refer to the package and pinout section in the device overview for functions not available in lower pin count packages. 2.1.2 Features The PIM includes these distinctive registers: * Data registers and data direction registers for ports E, AD, T, S, P and J when used as general-purpose I/O * Control registers to enable pull devices and select pullups/pulldowns on ports E, AD, T, S, P and J * Control register to enable open-drain (wired-or) mode on port S and J * Control register to enable digital input buffers on port AD and L * Interrupt flag register for pin interrupts and key-wakeup (KWU) on port AD, S, P and L * Control register to configure IRQ pin operation * Control register to enable ECLK output * Routing registers to support signal relocation on external pins and control internal routings: -- 2 PWM1 (fast) channels to alternative pins (1 option each) -- 4 TIM0 channels to pins (1 option each) -- IIC0 to alternative pins (2 options) -- SCI0 to alternative pins (1 option) -- SCI1 to alternative pins (1 option) -- SPI0 to alternative pins (1 option) -- ADC0 trigger input with edge select from internal TIM output compare channel link (OC0_2) or external pins (3 options) -- Various MSCAN0-CANPHY0 routing options for standalone use and conformance testing -- MSCAN0 to alternative pins (1 option) -- Internal RXD0 and RXD1 link to TIM input capture channel (IC0_3) for baud rate detection -- Internal ACLK link to TIM input capture channel (IC0_2) for calibration and clock monitoring purposes -- SENT_TX pin link to 2 TIM0 input capture channels (IC0_0 and IC0_1) -- Internal ACMP0 link to TIM1 (fast) input capture channel (IC1_2) -- Internal ACMP1 link to TIM1 (fast) input capture channel (IC1_3) A standard port pin has the following minimum features: * Input/output selection * 5V output drive * 5V digital and analog input * Input with selectable pullup or pulldown device MC9S12ZVC Family Reference Manual , Rev. 1.9 68 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) Optional features supported on dedicated pins: * Open drain for wired-or connections (ports S and J) * Interrupt input with glitch filtering * High current drive strength from VDDX with over-current protection * High current drive strength to VSSX * Selectable drive strength (port P) 2.2 External Signal Description This section lists and describes the signals that do connect off-chip. Table 2-2 shows all pins with the pins and functions that are controlled by the PIM. Routing options are denoted in parentheses. NOTE If there is more than one function associated with a pin, the output priority is indicated by the position in the table from top (highest priority) to bottom (lowest priority). Table 2-2. Pin Functions and Priorities Port Pin Pin Function & Priority -- BKGD MODC1 E PE1 PE0 AD PAD15 Func. after Reset -- BKGD -- XTAL -- -- PTE[1] I/O GPIO -- EXTAL -- -- PTE[0] I/O GPIO CPMU OSC signal CPMU OSC signal AN15 I ADC0 analog input (ETRIG0) I ADC0 external trigger AN14:AN10 I/O GPIO with pin-interrupt and key-wakeup I ADC0 analog input I/O GPIO with pin-interrupt and key-wakeup -- -- -- -- DAC buffered analog output -- AN9 I ADC0 analog input -- -- AMPM I DAC standalone OPAMP inverting input -- AN8 I ADC0 analog input -- PTADH[0]/ KWADH[0] I/O GPIO with pin-interrupt and key-wakeup GPIO TRIG0RR1-0 O I/O GPIO with pin-interrupt and key-wakeup GPIO -- AMP PTADH[1]/ KWADH[1] PAD8 MODC input during RESET Routing Register Bit I/O S12ZBDC communication PTADH[6:2]/ KWADH[6:2] PAD9 I Description BKGD PTADH[7]/ KWADH[7] PAD14-10 I/O -- MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 69 Chapter 2 Port Integration Module (S12ZVCPIMV1) Port Pin Pin Function & Priority I/O PAD7 AMPP I DAC standalone OPAMP non-inverting input -- AN7 I ADC0 analog input -- PTADL[7]/ KWADL[7] PAD6 DAC unbuffered analog output -- AN6 I ADC0 analog input -- O ACMP1 unsynchronized output -- AN5 I ADC0 analog input -- ACMP1 analog input 1 -- AN4 I ADC0 analog input -- I/O GPIO with pin-interrupt and key-wakeup -- ACMP1_0 I ACMP1 analog input 0 -- VRH I ADC0 voltage reference high -- I ADC0 analog input -- ACMPO0 AN2 PTADL[2]/ KWADL[2] I/O GPIO with pin-interrupt and key-wakeup -- O ACMP0 unsynchronized output -- I ADC0 analog input -- I/O GPIO with pin-interrupt and key-wakeup ACMP0_1 I ACMP0 analog input 1 AN1 I ADC0 analog input (ETRIG0) I ADC0 external trigger PTADL[1]/ KWADL[1] PAD0 -- I AN3 PAD1 I/O GPIO with pin-interrupt and key-wakeup ACMP1_1 PTADL[3]/ KWADL[3] PAD2 -- ACMPO1 PTADL[4]/ KWADL[4] PAD3 I/O GPIO with pin-interrupt and key-wakeup I/O GPIO with pin-interrupt and key-wakeup -- -- -- TRIG0RR1-0 -- ACMP0_0 I ACMP0 analog input 0 -- AN0 I ADC0 analog input -- PTADL[0]/ KWADL[0] I/O GPIO with pin-interrupt and key-wakeup Func. after Reset -- O PTADL[5]/ KWADL[5] PAD4 I/O GPIO with pin-interrupt and key-wakeup Routing Register Bit DACU PTADL[6]/ KWADL[6] PAD5 Description -- MC9S12ZVC Family Reference Manual , Rev. 1.9 70 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) Port Pin Pin Function & Priority I/O T PT7 ECLK O (SS0) PT6 PT4 PT3 PT2 PT1 PT0 Free-running clock I/O SPI0 slave select Routing Register Bit Func. after Reset -- GPIO SPI0RR IOC0_7 I/O TIM0 channel 7 -- PTT[7] I/O GPIO -- (SCK0) I/O SPI0 serial clock SPI0RR IOC0_6 I/O TIM0 channel 6 -- PTT[6] PT5 Description I/O GPIO -- (MOSI0) I/O SPI0 master out/slave in IOC0_5 I/O TIM0 channel 5 -- PTT[5] I/O GPIO -- DBGEEV DBG external event -- (MISO0) I/O SPI0 master in/slave out SPI0RR IOC0_4 I/O TIM0 channel 4 -- PTT[4] I/O GPIO -- (PWM0_7) I SPI0RR O PWM0 channel 7 IOC1_3 I/O TIM1 channel 3 PTT[3] I/O GPIO (PWM0_3) O PWM0 channel 3 P0C7RR T1IC3RR -- P0C3RR IOC1_2 I/O TIM1 channel 2 PTT[2] I/O GPIO T1IC2RR (TXD1) I/O SCI1 transmit SCI1RR (SCL0) I/O IIC0 serial clock IIC0RR -- IOC1_1 I/O TIM1 channel 1 -- PTT[1] I/O GPIO -- (RXD1) (SDA0) I SCI1 receive I/O IIC0 serial data SCI1RR IIC0RR IOC1_0 I/O TIM1 channel 0 -- PTT[0] I/O GPIO -- MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 71 Chapter 2 Port Integration Module (S12ZVCPIMV1) Port Pin Pin Function & Priority S PS7 IOC0_0 (IOC0_1) PS4 T0IC1RR PTS[7]/ KWS[7] I/O GPIO with pin-interrupt and key-wakeup -- IOC0_13 I/O TIM0 channel 1 T0IC1RR SCK1 I/O SPI1 serial clock -- PTS[6]/ KWS[6] I/O GPIO with pin-interrupt and key-wakeup -- IOC0_23 I/O TIM0 channel 2 T0IC2RR TXD1 I/O SCI1 transmit SCI1RR MOSI1 I/O SPI1 master out/slave in -- PTS[5]/ KWS[5] I/O GPIO with pin-interrupt and key-wakeup -- IOC0_33 I/O TIM0 channel 3 I SCI1 receive T0IC3RR1-0 SCI1RR MISO1 I/O SPI1 master in/slave out -- PTS[4]/ KWS[4] I/O GPIO with pin-interrupt and key-wakeup -- XIRQ4 I Non-maskable level-sensitive interrupt -- (TXCAN0)/ (CPDR1) O MSCAN0 transmit output/ Direct control output CP0DR[CPDR1] M0C0RR2-0 I/O SPI0 slave select I/O GPIO with pin-interrupt and key-wakeup IRQ I Maskable level- or falling edge-sensitive interrupt (RXCAN0) I MSCAN0 receive input SCK0 PTS[2]/ KWS[2] PS0 GPIO -- PTS[3]/ KWS[3] PS1 -- -- SS0 PS2 TIM0 channel 1 input capture Func. after Reset I/O SENT_TX_OUT output, SENT_TX_IN input RXD1 PS3 I Routing Register Bit I/O SPI1 slave select SS1 PS5 Description I/O TIM0 channel 0 2 SENT_TX PS6 I/O (CPTXD0) I/O SPI0 serial clock I/O GPIO with pin-interrupt and key-wakeup I CANPHY0 transmit input SPI0RR -- -- M0C0RR2-0 SPI0RR -- M0C0RR2-0 (TXD0) I/O SCI0 transmit (SCL0) I/O IIC0 serial clock IIC0RR MOSI0 I/O SPI0 master out/slave in SPI0RR PTS[1]/ KWS[1] I/O GPIO with pin-interrupt and key-wakeup (CPRXD0) O CANPHY0 receive output (RXD0) I SCI0 receive SCI0RR -- M0C0RR2-0 SCI0RR (SDA0) I/O IIC0 serial data IIC0RR MISO0 I/O SPI0 master in/slave out SPI0RR PTS[0]/ KWS[0] I/O GPIO with pin-interrupt and key-wakeup -- MC9S12ZVC Family Reference Manual , Rev. 1.9 72 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) Port Pin Pin Function & Priority I/O P PP7 PWM1_7 O PTP[7]/ KWP[7] PP66 PWM1_5 PTP[6]/ KWP[6] PP56 PWM1_3 PTP[5]/ KWP[5] PP46 PJ1 PJ0 L 1 2 3 4 5 6 PL1-0 -- PWM1 channel 5 (fast) with over-current interrupt -- I/O GPIO with pin-interrupt, key-wakeup and over-current interrupt -- O PWM1 channel 3 (fast) with over-current interrupt -- I/O GPIO with pin-interrupt, key-wakeup and over-current interrupt -- O PWM1 channel 1 (fast) with over-current interrupt -- I/O GPIO with pin-interrupt, key-wakeup and over-current interrupt -- PWM0_7 PWM0_5 PWM0_3 PWM0_1 PTP[0]/ KWP[0] J GPIO PWM1_1 PTP[1]/ KWP[1] PP06 O -- ADC0 external trigger PTP[2]/ KWP[2]/ EVDD1 PP1 I/O GPIO with pin-interrupt and key-wakeup Func. after Reset I PTP[3]/ KWP[3] PP25 PWM1 channel 7 (fast) Routing Register Bit (ETRIG0) PTP[4]/ KWP[4] PP3 Description O PWM0 channel 7 I/O GPIO with pin-interrupt and key-wakeup O PWM0 channel 5with over-current interrupt I/O GPIO with pin-interrupt, key-wakeup and over-current interrupt O PWM0 channel 3 I/O GPIO with pin-interrupt and key-wakeup O PWM0 channel 1 with over-current interrupt I/O GPIO with pin-interrupt, key-wakeup and over-current interrupt TRIG0RR1-0 P0C7RR -- -- -- P0C3RR -- -- -- TXD0 I/O SCI0 transmit SCI0RR SCL0 I/O IIC0 serial clock IIC0RR PTJ[1] I/O GPIO RXD0 I SCI0 receive SDA0 I/O IIC0 serial data PTJ[0] I/O GPIO PTIL[1:0]/ KWL[1:0] I High-voltage input (HVI) with pin-interrupt and key-wakeup; optional ADC link GPIO -- SCI0RR IIC0RR -- -- HVI Function active when RESET asserted Input Capture only. Output Compare on PS6. Input Capture routed to alternative signal out of reset (refer to Module Routing Register 3 (MODRR3)). Output Compare unaffected. The interrupt is enabled by clearing the X mask bit in the CPU CCR. The pin is forced to input upon first clearing of the X bit and is held in this state until reset. A stop or wait recovery using XIRQ with the X bit set is not available. High-current capable high-side output with over-current interrupt (EVDD1) High-current capable low-side output with over-current interrupt MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 73 Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.2.1 Internal Routing Options The following table summarizes the internal routing options. Table 2-3. Internal Routing Options Internal Signal Routing Bits ACMP0 out TIM1 IC2 T1IC2RR ACMP1 out TIM1 IC3 T1IC3RR ACLK TIM0 IC2 T0IC2RR RXD0, RXD1 TIM0 IC3 T0IC3RR1-0 ADC0 Trigger TRIG0RR1-0, TRIG0NEG TIM0 OC2 2.3 Connects to Memory Map and Register Definition This section provides a detailed description of all port integration module registers. MC9S12ZVC Family Reference Manual , Rev. 1.9 74 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.1 Global Address Register Map Register Name 0x0200 MODRR0 0x0201 MODRR1 0x0202 MODRR2 0x0203 MODRR3 0x0204- 0x0207 Reserved 0x0208 ECLKCTL 0x0209 IRQCR 0x020A- 0x020D Reserved 0x020E Reserved 0x020F Reserved 0x0210- 0x025F Reserved 0x0260 PTE 0x0261 Reserved 0x0262 PTIE 0x0263 Reserved Bit 7 5 4 3 SCI1RR SCI0RR SPI0RR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R IIC0RR1-0 W R W R W R 6 T1IC3RR P0C7RR T1IC2RR 1 Bit 0 M0C0RR2-0 TRIG0NEG TRIG0RR1-0 0 0 T0IC2RR T0IC1RR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R 2 P0C3RR T0IC3RR1 T0IC3RR0 0 0 W R W R W R NECLK IRQE IRQEN 0 0 0 0 0 0 0 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTE1 PTE0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTIE1 PTIE0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 75 Chapter 2 Port Integration Module (S12ZVCPIMV1) Global Address Register Name 0x0264 DDRE 0x0265 Reserved 0x0266 PERE 0x0267 Reserved 0x0268 PPSE 0x0269- 0x027F Reserved 0x0280 PTADH 0x0281 PTADL 0x0282 PTIADH 0x0283 PTIADL 0x0284 DDRADH 0x0285 DDRADL 0x0286 PERADH 0x0287 PERADL 0x0288 PPSADH 0x0289 PPSADL Bit 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTADH7 PTADH6 PTADH5 PTADH4 PTADL7 PTADL6 PTADL5 R PTIADH7 PTIADH6 PTIADL6 R 1 Bit 0 DDRE1 DDRE0 0 0 PERE1 PERE0 0 0 PPSE1 PPSE0 0 0 0 PTADH3 PTADH2 PTADH1 PTADH0 PTADL4 PTADL3 PTADL2 PTADL1 PTADL0 PTIADH5 PTIADH4 PTIADH3 PTIADH2 PTIADH1 PTIADH0 PTIADL5 PTIADL4 PTIADL3 PTIADL2 PTIADL1 PTIADL0 W R W R W R W R W R W R W R W W R PTIADL7 W R W R W R W R W R W R W DDRADH7 DDRADH6 DDRADH5 DDRADH4 DDRADH3 DDRADH2 DDRADH1 DDRADH0 DDRADL7 DDRADL6 DDRADL5 DDRADL4 DDRADL3 DDRADL2 DDRADL1 DDRADL0 PERADH7 PERADH6 PERADH5 PERADH4 PERADH3 PERADH2 PERADH1 PERADH0 PERADL7 PERADL6 PERADL5 PERADL4 PERADL3 PERADL2 PERADL1 PERADL0 PPSADH7 PPSADH6 PPSADH5 PPSADH4 PPSADH3 PPSADH2 PPSADH1 PPSADH0 PPSADL7 PPSADL6 PPSADL5 PPSADL4 PPSADL3 PPSADL2 PPSADL1 PPSADL0 MC9S12ZVC Family Reference Manual , Rev. 1.9 76 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) Global Address Register Name 0x028A- 0x028B Reserved 0x028C PIEADH 0x028D PIEADL 0x028E PIFADH 0x028F PIFADL 0x0290- 0x0297 Reserved 0x0298 DIENADH 0x0299 DIENADL 0x029A- 0x02BF Reserved 0x02C0 PTT 0x02C1 PTIT 0x02C2 DDRT 0x02C3 PERT 0x02C4 PPST 0x02C5- 0x02CE Reserved 0x02CF Reserved R Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 PIEADH7 PIEADH6 PIEADH5 PIEADH4 PIEADH3 PIEADH2 PIEADH1 PIEADH0 PIEADL7 PIEADL6 PIEADL5 PIEADL4 PIEADL3 PIEADL2 PIEADL1 PIEADL0 PIFADH7 PIFADH6 PIFADH5 PIFADH4 PIFADH3 PIFADH2 PIFADH1 PIFADH0 PIFADL7 PIFADL6 PIFADL5 PIFADL4 PIFADL3 PIFADL2 PIFADL1 PIFADL0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W R DIENADH7 DIENADH6 DIENADH5 DIENADH4 DIENADH3 DIENADH2 DIENADH1 DIENADH0 DIENADL7 DIENADL6 DIENADL5 DIENADL4 DIENADL3 DIENADL2 DIENADL1 DIENADL0 0 0 0 0 0 0 0 0 PTT7 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0 PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0 DDRT7 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0 PERT7 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0 PPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 77 Chapter 2 Port Integration Module (S12ZVCPIMV1) Global Address Register Name 0x02D0 PTS 0x02D1 PTIS 0x02D2 DDRS 0x02D3 PERS 0x02D4 PPSS 0x02D5 Reserved 0x02D6 PIES 0x02D7 PIFS 0x02D8- 0x02DE Reserved 0x02DF WOMS 0x02E0- 0x02EF Reserved 0x02F0 PTP 0x02F1 PTIP 0x02F2 DDRP 0x02F3 PERP 0x02F4 PPSP R W R Bit 7 6 5 4 3 2 1 Bit 0 PTS7 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0 PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0 DDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0 PERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0 PPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0 0 0 0 0 0 0 0 0 PIES7 PIES6 PIES5 PIES4 PIES3 PIES2 PIES1 PIES0 PIFS7 PIFS6 PIFS5 PIFS4 PIFS3 PIFS2 PIFS1 PIFS0 0 0 0 0 0 0 0 0 WOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0 0 0 0 0 0 0 0 0 PTP7 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0 PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0 DDRP7 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0 PERP7 PERP6 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0 PPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0 W R W R W R W R W R W R W R W R W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 78 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) Global Address Register Name 0x02F5 Reserved 0x02F6 PIEP 0x02F7 PIFP 0x02F8 Reserved 0x02F9 OCPEP 0x02FA OCIEP 0x02FB OCIFP 0x02FC Reserved 0x02FD RDRP 0x02FE- 0x02FF Reserved 0x0300- 0x030F Reserved 0x0310 PTJ 0x0311 PTIJ 0x0312 DDRJ 0x0313 PERJ 0x0314 PPSJ R Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 PIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0 PIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0 0 0 0 0 0 0 0 0 OCPEP6 OCPEP5 OCPEP4 OCIEP6 OCIEP5 OCIEP4 OCIFP6 OCIFP5 OCIFP4 0 0 0 RDRP6 RDRP5 RDRP4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTJ1 PTJ0 0 0 0 0 0 0 PTIJ1 PTIJ0 0 0 0 0 0 0 DDRJ1 DDRJ0 0 0 0 0 0 0 PERJ1 PERJ0 0 0 0 0 0 0 PPSJ1 PPSJ0 W R W R W R W R 0 W R 0 W R 0 W R 0 0 0 0 0 OCPEP2 OCIEP2 OCIFP2 0 0 0 0 0 OCPEP0 OCIEP0 OCIFP0 0 W R 0 W R 0 RDRP2 0 RDRP0 W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 79 Chapter 2 Port Integration Module (S12ZVCPIMV1) Global Address Register Name 0x0315- 0x031E Reserved 0x031F WOMJ 0x0320- 0x032F Reserved 0x0330 Reserved 0x0331 PTIL 0x0332 Reserved 0x0333 PTPSL 0x0334 PPSL 0x0335 Reserved 0x0336 PIEL 0x0337 PIFL 0x0338- 0x0339 Reserved 0x033A PTABYPL 0x033B PTADIRL 0x033C DIENL 0x033D PTAENL R Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 WOMJ1 WOMJ0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTIL1 PTIL0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTPSL1 PTPSL0 0 0 0 0 0 0 PPSL1 PPSL0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PIEL1 PIEL0 0 0 0 0 0 0 PIFL1 PIFL0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W PTABYPL1 PTABYPL0 PTADIRL1 PTADIRL0 DIENL1 DIENL0 PTAENL1 PTAENL0 MC9S12ZVC Family Reference Manual , Rev. 1.9 80 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) Global Address Register Name R Bit 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0x033E PIRL 0x033F PTTEL 0x0340- 0x037F Reserved 2.3.2 PIM Registers 0x0200-0x020F 1 Bit 0 PIRL1 PIRL0 PTTEL1 PTTEL0 0 0 W R W R W This section details the specific purposes of register implemented in address range 0x0200-0x020F. These registers serve for specific PIM related functions not part of the generic port registers. * If not stated differently, writing to reserved bits has no effect and read returns zero. * All register read accesses are synchronous to internal clocks. * Register bits can be written at any time if not stated differently. 2.3.2.1 Module Routing Register 0 (MODRR0) Access: User read1 Address 0x0200 7 R W 6 5 4 3 IIC0RR1-0 SCI1RR SCI0RR SPI0RR M0C0RR2-0 IIC0 SCI1 SCI0 SPI0 MSCAN0-CANPHY0 interface 0 0 0 Routing Option Reset 0 0 2 0 1 0 0 0 = Unimplemented or Reserved Figure 2-1. Module Routing Register 0 (MODRR0) 1 Read: Anytime Write: Once in normal, anytime in special mode MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 81 Chapter 2 Port Integration Module (S12ZVCPIMV1) Table 2-4. MODRR0 Routing Register Field Descriptions Field Description 7-6 IIC0RR1-0 Module Routing Register -- IIC0 routing 11 Reserved 10 SCL0 on PT1; SDA0 on PT0 01 SCL0 on PS1; SDA0 on PS0 00 SCL0 on PJ1; SDA0 on PJ0 5 SCI1RR Module Routing Register -- SCI1 routing 1 TXD1 on PT1; RXD1 on PT0 0 TXD1 on PS5; RXD1 on PS4 4 SCI0RR Module Routing Register -- SCI0 routing 1 TXD0 on PS1; RXD0 on PS0 0 TXD0 on PJ1; RXD0 on PJ0 3 SPI0RR Module Routing Register -- SPI0 routing 1 MISO0 on PT4; MOSI0 on PT5; SCK0 on PT6; SS0 on PT7 0 MISO0 on PS0; MOSI0 on PS1; SCK0 on PS2; SS0 on PS3 2-0 M0C0RR2-0 Module Routing Register -- MSCAN0-CANPHY0 routing Selection of MSCAN0-CANPHY0 interface routing options to support probing and conformance testing. Refer to Figure 2-2 for an illustration and Table 2-5 for preferred settings. MSCAN0 must be enabled for TXCAN0 routing to take effect on pin. CANPHY0 must be enabled for CPRXD0 and CP0DR[CPDR1] routings to take effect on pins. M0C0RR0 M0C0RR1 M0C0RR2 0 1 TXCAN0/CPDR1 CPTXD0 1 TXCAN 0 0 CPTXD 1 MSCAN0 CPDR1 CANH CANPHY0 SPLIT CANL RXCAN 0 CPRXD 1 0 1 CPRXD0 RXCAN0 Figure 2-2. CAN Routing Options Illustration MC9S12ZVC Family Reference Manual , Rev. 1.9 82 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) . Table 2-5. Preferred Interface Configurations M0C0RR[2:0] Description 000 Default setting: MSCAN connects to CANPHY, interface internal only 001 Direct control setting: CP0DR[CPDR1] connects to CPTXD, interface internal only 100 Probe setting: MSCAN connects to CANPHY, interface visible on 2 external pins 110 Conformance test setting: Interface opened and all 4 signals routed externally NOTE For standalone usage of MSCAN0 on external pins set M0C0RR[2:0]=0b110 and disable CANPHY0 (CPCR[CPE]=0). This releases the CANPHY0 associated pins to other shared functions. 2.3.2.2 Module Routing Register 1 (MODRR1) Access: User read/write1 Address 0x0201 R W 7 6 T1IC3RR T1IC2RR TIM1 IC3 0 Reset 5 4 3 0 0 0 TIM1 IC2 -- -- -- 0 0 0 0 2 1 TRIG0NEG 0 TRIG0RR1-0 ADC0 trigger 0 0 0 Figure 2-3. Module Routing Register 1 (MODRR1) 1 Read: Anytime Write: Anytime Table 2-6. MODRR1 Routing Register Field Descriptions Field Description 7 T1IC3RR Module Routing Register -- TIM1 IC3 routing 1 TIM1 input capture channel 3 is connected to internal ACMP1 out 0 TIM1 input capture channel 3 is connected to PT3 6 T1IC2RR Module Routing Register -- TIM1 IC2 routing 1 TIM1 input capture channel 2 is connected to internal ACMP0 out 0 TIM1 input capture channel 2 is connected to PT2 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 83 Chapter 2 Port Integration Module (S12ZVCPIMV1) Table 2-6. MODRR1 Routing Register Field Descriptions Field Description 2 Module Routing Register -- ADC0 trigger input inverted polarity TRIG0NEG 1 Falling edge active on ADC0 trigger input 0 Rising edge active on ADC0 trigger input 1-0 TRIG0RR 2.3.2.3 Module Routing Register -- ADC0 trigger input routing 11 PP4 (ETRIG0) to ADC0 trigger input 10 PAD1 (ETRIG0) to ADC0 trigger input 01 PAD15 (ETRIG0) to ADC0 trigger input 00 TIM0 output compare channel 2 to ADC0 trigger input (output compare function on pin remains active unless disabled in timer config register TIM0OCPD[OCPD2]=1) Module Routing Register 2 (MODRR2) Access: User read/write1 Address 0x0202 7 R W Reset 6 5 4 0 0 0 PWM0_7 -- -- -- 0 0 0 0 P0C7RR 3 2 1 0 0 0 0 PWM0_3 -- -- -- 0 0 0 0 P0C3RR Figure 2-4. Module Routing Register 2 (MODRR2) 1 Read: Anytime Write: Once in normal, anytime in special mode Table 2-7. MODRR2 Routing Register Field Descriptions Field Description 7 P0C7RR Module Routing Register -- PWM0_7 routing 1 PWM0_7 to PT3 0 PWM0_7 to PP3 3 P0C3RR Module Routing Register -- PWM0_3 routing 1 PWM0_3 to PT2 0 PWM0_3 to PP1 MC9S12ZVC Family Reference Manual , Rev. 1.9 84 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.2.4 Module Routing Register 3 (MODRR3) Access: User read/write1 Address 0x0203 7 6 5 0 0 0 -- -- -- 0 0 0 R W Reset 4 3 2 1 T0IC3RR1 T0IC3RR0 T0IC2RR T0IC1RR TIM0 IC2 TIM0 IC1 -- 0 0 0 TIM0 IC3 0 0 0 0 Figure 2-5. Module Routing Register 3 (MODRR3) 1 Read: Anytime Write: Anytime Table 2-8. MODRR3 Routing Register Field Descriptions Field Description 4 Module Routing Register -- TIM0 IC3 routing bit 1 T0IC3RR1 If timer channel is not used with a pin (T0IC3RR0=0) then one out of two internal sources can be selected as input. 1 TIM0 input capture channel 3 to RXD1 0 TIM0 input capture channel 3 to RXD0 3 Module Routing Register -- TIM0 IC3 routing bit 0 T0IC3RR0 1 TIM0 input capture channel 3 to PS4 0 TIM0 input capture channel 3 internally to RXD (see T0IC3RR1) 2 T0IC2RR Module Routing Register -- TIM0 IC2 routing 1 TIM0 input capture channel 2 to PS5 0 TIM0 input capture channel 2 internally to ACLK 1 T0IC1RR Module Routing Register -- TIM0 IC1 routing 1 TIM0 input capture channel 1 to PS6 0 TIM0 input capture channel 1 to PS7 (SENT_TX) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 85 Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.2.5 ECLK Control Register (ECLKCTL) Access: User read/write1 Address 0x0208 7 R W NECLK Reset: 1 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 2-6. ECLK Control Register (ECLKCTL) 1 Read: Anytime Write: Anytime Table 2-9. ECLKCTL Register Field Descriptions Field Description 7 NECLK No ECLK -- Disable ECLK output This bit controls the availability of a free-running clock on the ECLK pin. This clock has a fixed rate equivalent to the internal bus clock. 1 ECLK disabled 0 ECLK enabled 2.3.2.6 IRQ Control Register (IRQCR) Access: User read/write1 Address 0x0209 R W Reset 7 6 IRQE IRQEN 0 0 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 2-7. IRQ Control Register (IRQCR) 1 Read: Anytime Write: IRQE: Once in normal mode, anytime in special mode IRQEN: Anytime Table 2-10. IRQCR Register Field Descriptions Field 7 IRQE 6 IRQEN Description IRQ select edge sensitive only -- 1 IRQ pin configured to respond only to falling edges. Falling edges on the IRQ pin are detected anytime when IRQE=1 and will be cleared only upon a reset or the servicing of the IRQ interrupt. 0 IRQ configured for low level recognition IRQ enable -- 1 IRQ pin is connected to interrupt logic 0 IRQ pin is disconnected from interrupt logic MC9S12ZVC Family Reference Manual , Rev. 1.9 86 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.2.7 Reserved Register Access: User read/write1 Address 0x020E R W Reset 7 6 5 4 3 2 1 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved x x x x x x x x Figure 2-8. Reserved Register 1 Read: Anytime Write: Only in special mode This reserved register is designed for factory test purposes only and is not intended for general user access. Writing to this register when in special modes can alter the modules functionality. 2.3.2.8 Reserved Register Access: User read/write1 Address 0x020F R W Reset 7 6 5 4 3 2 1 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved x x x x x x x x Figure 2-9. Reserved Register 1 Read: Anytime Write: Only in special mode NOTE This reserved register is designed for factory test purposes only and is not intended for general user access. Writing to this register when in special modes can alter the modules functionality. 2.3.3 PIM Generic Registers This section describes the details of all configuration registers. * Writing to reserved bits has no effect and read returns zero. * All register read accesses are synchronous to internal clocks. * All registers can be written at any time, however a specific configuration might not become active. E.g. a pullup device does not become active while the port is used as a push-pull output. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 87 Chapter 2 Port Integration Module (S12ZVCPIMV1) * General-purpose data output availability depends on prioritization; input data registers always reflect the pin status independent of the use. Pull-device availability, pull-device polarity, wired-or mode, key-wake up functionality are independent of the prioritization unless noted differently. For availability of individual bits refer to Section 2.3.1, "Register Map" and Table 2-33. * * 2.3.3.1 Port Data Register Access: User read/write1 Address 0x0260 PTE 0x0280 PTADH 0x0281 PTADL 0x02C0 PTT 0x02D0 PTS 0x02F0 PTP 0x0310 PTJ R W Reset 7 6 5 4 3 2 1 0 PTx7 PTx6 PTx5 PTx4 PTx3 PTx2 PTx1 PTx0 0 0 0 0 0 0 0 0 Figure 2-10. Port Data Register 1 Read: Anytime. The data source is depending on the data direction value. Write: Anytime This is a generic description of the standard port data registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. Table 2-11. Port Data Register Field Descriptions Field Description 7-0 PTx7-0 Port Data -- General purpose input/output data This register holds the value driven out to the pin if the pin is used as a general purpose output. When not used with the alternative function (refer to Table 2-2), these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12ZVC Family Reference Manual , Rev. 1.9 88 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.3.2 Port Input Register Access: User read only1 Address 0x0262 PTIE 0x0282 PTIADH 0x0283 PTIADL 0x02C1 PTIT 0x02D1 PTIS 0x02F1 PTIP 0x0311 PTIJ 0x0331 PTIL R 7 6 5 4 3 2 1 0 PTIx7 PTIx6 PTIx5 PTIx4 PTIx3 PTIx2 PTIx1 PTIx0 0 0 0 0 0 0 0 0 W Reset Figure 2-11. Port Input Register 1 Read: Anytime Write:Never This is a generic description of the standard port input registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. Table 2-12. Port Input Register Field Descriptions Field Description 7-0 PTIx7-0 Port Input -- Data input A read always returns the buffered input state of the associated pin. It can be used to detect overload or short circuit conditions on output pins. 2.3.3.3 Data Direction Register Access: User read/write1 Address 0x0264 DDRE 0x0284 DDRADH 0x0285 DDRADL 0x02C2 DDRT 0x02D2 DDRS 0x02F2 DDRP 0x0312 DDRJ R W 7 6 5 4 3 2 1 0 DDRx7 DDRx6 DDRx5 DDRx4 DDRx3 DDRx2 DDRx1 DDRx0 0 0 0 0 0 0 0 0 Reset Figure 2-12. Data Direction Register 1 Read: Anytime Write: Anytime This is a generic description of the standard data direction registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 89 Chapter 2 Port Integration Module (S12ZVCPIMV1) Table 2-13. Data Direction Register Field Descriptions Field Description 7-0 DDRx7-0 Data Direction -- Select general-purpose data direction This bit determines whether the pin is a general-purpose input or output. If a peripheral module controls the pin the content of the data direction register is ignored. Independent of the pin usage with a peripheral module this register determines the source of data when reading the associated data register address. Note: Due to internal synchronization circuits, it can take up to two bus clock cycles until the correct value is read on port data and port input registers, when changing the data direction register. 1 Associated pin is configured as output 0 Associated pin is configured as input 2.3.3.4 Pull Device Enable Register Access: User read/write1 Address 0x0266 PERE 0x0286 PERADH 0x0287 PERADL 0x02C3 PERT 0x02D3 PERS 0x02F3 PERP 0x0313 PERJ 7 6 5 4 3 2 1 0 PERx7 PERx6 PERx5 PERx4 PERx3 PERx2 PERx1 PERx0 Ports E, J: 0 0 0 0 0 0 1 1 Ports S: 1 1 1 1 1 1 1 1 Others: 0 0 0 0 0 0 0 0 R W Reset Figure 2-13. Pull Device Enable Register 1 Read: Anytime Write: Anytime This is a generic description of the standard pull device enable registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. Table 2-14. Pull Device Enable Register Field Descriptions Field Description 7-0 PERx7-0 Pull Enable -- Activate pull device on input pin This bit controls whether a pull device on the associated port input or open-drain output pin is active. If a pin is used as push-pull output this bit has no effect. The polarity is selected by the related polarity select register bit. On open-drain output pins only a pullup device can be enabled. 1 Pull device enabled 0 Pull device disabled MC9S12ZVC Family Reference Manual , Rev. 1.9 90 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.3.5 Polarity Select Register Access: User read/write1 Address 0x0268 PPSE 0x0288 PPSADH 0x0289 PPSADL 0x02C4 PPST 0x02D4 PPSS 0x02F4 PPSP 0x0314 PPSJ 7 6 5 4 3 2 1 0 PPSx7 PPSx6 PPSx5 PPSx4 PPSx3 PPSx2 PPSx1 PPSx0 Ports E: 0 0 0 0 0 0 1 1 Others: 0 0 0 0 0 0 0 0 R W Reset Figure 2-14. Polarity Select Register 1 Read: Anytime Write: Anytime This is a generic description of the standard polarity select registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. Table 2-15. Polarity Select Register Field Descriptions Field Description 7-0 PPSx7-0 Pull Polarity Select -- Configure pull device and pin interrupt edge polarity on input pin This bit selects a pullup or a pulldown device if enabled on the associated port input pin. If a port has interrupt functionality this bit also selects the polarity of the active edge. Note: If MSCAN is active a pullup device can be activated on the RXCAN input; attempting to select a pulldown disables the pull-device. 1 Pulldown device selected; rising edge selected 0 Pullup device selected; falling edge selected 2.3.3.6 Port Interrupt Enable Register Access: User read/write1 Address 0x028C PIEADH 0x028D PIEADL 0x02D6 PIES 0x02F6 PIEP 0x0336 PIEL R W Reset 7 6 5 4 3 2 1 0 PIEx7 PIEx6 PIEx5 PIEx4 PIEx3 PIEx2 PIEx1 PIEx0 0 0 0 0 0 0 0 0 Figure 2-15. Port Interrupt Enable Register MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 91 Chapter 2 Port Integration Module (S12ZVCPIMV1) 1 Read: Anytime Write: Anytime This is a generic description of the standard port interrupt enable registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. Table 2-16. Port Interrupt Enable Register Field Descriptions Field 7-0 PIEx7-0 2.3.3.7 Description Port Interrupt Enable -- Activate pin interrupt (KWU) This bit enables or disables the edge sensitive pin interrupt on the associated pin. An interrupt can be generated if the pin is operating in input or output mode when in use with the general-purpose or related peripheral function. 1 Interrupt is enabled 0 Interrupt is disabled (interrupt flag masked) Port Interrupt Flag Register Access: User read/write1 Address 0x028E PIFADH 0x028F PIFADL 0x02D7 PIFS 0x02F7 PIFP 0x0337 PIFL R W Reset 7 6 5 4 3 2 1 0 PIFx7 PIFx6 PIFx5 PIFx4 PIFx3 PIFx2 PIFx1 PIFx0 0 0 0 0 0 0 0 0 Figure 2-16. Port Interrupt Flag Register 1 Read: Anytime Write: Anytime, write 1 to clear This is a generic description of the standard port interrupt flag registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. Table 2-17. Port Interrupt Flag Register Field Descriptions Field Description 7-0 PIFx7-0 Port Interrupt Flag -- Signal pin event (KWU) This flag asserts after a valid active edge was detected on the related pin (see Section 2.4.4.2, "Pin Interrupts and Key-Wakeup (KWU)"). This can be a rising or a falling edge based on the state of the polarity select register. An interrupt will occur if the associated interrupt enable bit is set. Writing a logic "1" to the corresponding bit field clears the flag. 1 Active edge on the associated bit has occurred 0 No active edge occurred MC9S12ZVC Family Reference Manual , Rev. 1.9 92 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.3.8 Digital Input Enable Register Access: User read/write1 Address 0x0298 DIENADH 0x0299 DIENADL R W 7 6 5 4 3 2 1 0 DIENx7 DIENx6 DIENx5 DIENx4 DIENx3 DIENx2 DIENx1 DIENx0 0 0 0 0 0 0 0 0 Reset Figure 2-17. Digital Input Enable Register 1 Read: Anytime Write: Anytime This is a generic description of the standard digital input enable registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. Table 2-18. Digital Input Enable Register Field Descriptions Field Description 7-0 DIENx7-0 Digital Input Enable -- Input buffer control This bit controls the digital input function. If set to 1 the input buffers are enabled and the pin can be used with the digital function. If a peripheral module is enabled which uses the pin with a digital function the input buffer is activated and the register bit is ignored. If the pin is used with an analog function this bit shall be cleared to avoid shoot-through current. 1 Associated pin is configured as digital input 0 Associated pin digital input is disabled 2.3.3.9 Reduced Drive Register Access: User read/write1 Address 0x02FD RDRP R W 7 6 5 4 3 2 1 0 RDRx7 RDRx6 RDRx5 RDRx4 RDRx3 RDRx2 RDRx1 RDRx0 0 0 0 0 0 0 0 0 Reset Figure 2-18. Reduced Drive Register 1 Read: Anytime Write: Anytime This is a generic description of the standard reduced drive registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 93 Chapter 2 Port Integration Module (S12ZVCPIMV1) Table 2-19. Reduced Drive Register Field Descriptions Field 7-0 RDRx7-0 Description Reduced Drive Register -- Select reduced drive for output pin This bit configures the drive strength of the associated output pin as either full or reduced. If a pin is used as input this bit has no effect. The reduced drive function is independent of which function is being used on a particular pin. 1 Reduced drive selected (approx. 1/10 of the full drive strength) 0 Full drive strength enabled 2.3.3.10 Wired-Or Mode Register Access: User read/write1 Address 0x02DF WOMS 0x031F WOMJ R W 7 6 5 4 3 2 1 0 WOMx7 WOMx6 WOMx5 WOMx4 WOMx3 WOMx2 WOMx1 WOMx0 0 0 0 0 0 0 0 0 Reset Figure 2-19. Wired-Or Mode Register 1 Read: Anytime Write: Anytime This is a generic description of the standard wired-or registers. Refer to Table 2-33 to determine the implemented bits in the respective register. Unimplemented bits read zero. Table 2-20. Wired-Or Mode Register Field Descriptions Field Description 7-0 Wired-Or Mode -- Enable open-drain output WOMx7-0 This bit configures the output buffer as wired-or. If enabled the output is driven active low only (open-drain) while the active high drive is turned off. This allows a multipoint connection of several serial modules. These bits have no influence on pins used as inputs. 1 Output buffers operate as open-drain outputs 0 Output buffers operate as push-pull outputs 2.3.3.11 PIM Reserved Register Access: User read1 Address (any reserved) R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset Figure 2-20. PIM Reserved Register 1 Read: Always reads 0x00 Write: Unimplemented MC9S12ZVC Family Reference Manual , Rev. 1.9 94 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.4 PIM Generic Register Exceptions This section lists registers with deviations from the generic description in one or more register bits. 2.3.4.1 Port P Over-Current Protection Enable Register (OCPEP) Access: User read/write1 Address 0x02F9 7 R 0 W Reset 0 6 5 4 3 OCPEP6 OCPEP5 OCPEP4 0 0 0 0 2 OCPEP2 0 0 1 0 0 0 OCPEP0 0 Figure 2-21. Over-Current Protection Enable Register (OCPEP) 1 Read: Anytime Write:Anytime Table 2-21. OCPEP Register Field Descriptions Field Description 6 OCPEP6 Over-Current Protection Enable -- Activate over-current detector on PP6 Refer to Section "2.5.4, "Over-Current Protection on PP[6-4,0]"" 1 PP6 over-current detector enabled 0 PP6 over-current detector disabled 5 OCPEP5 Over-Current Protection Enable -- Activate over-current detector on PP5 Refer to Section 2.5.4, "Over-Current Protection on PP[6-4,0]"" 1 PP5 over-current detector enabled 0 PP5 over-current detector disabled 4 OCPEP4 Over-Current Protection Enable -- Activate over-current detector on PP4 Refer to Section 2.5.4, "Over-Current Protection on PP[6-4,0]"" 1 PP4 over-current detector enabled 0 PP4 over-current detector disabled 2 OCPEP2 Over-Current Protection Enable -- Activate over-current detector on EVDD1 Refer to Section 2.5.3, "Over-Current Protection on PP2 (EVDD1)"" 1 EVDD1 over-current detector enabled 0 EVDD1 over-current detector disabled 0 OCPEP0 Over-Current Protection Enable -- Activate over-current detector on PP0 Refer to Section 2.5.4, "Over-Current Protection on PP[6-4,0]"" 1 PP0 over-current detector enabled 0 PP0 over-current detector disabled MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 95 Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.4.2 Port P Over-Current Interrupt Enable Register (OCIEP) Access: User read/write1 Address 0x02FA 7 R 0 W Reset 0 6 5 4 3 OCIEP6 OCIEP5 OCIEP4 0 0 0 0 2 OCIEP2 0 0 1 0 0 0 OCIEP0 0 Figure 2-22. Port P Over-Current Interrupt Enable Register 1 Read: Anytime Write: Anytime Table 2-22. Port P Over-Current Interrupt Enable Register Field Description 6 OCIEP6 Over-Current Interrupt Enable -- This bit enables or disables the over-current interrupt on PP6. 1 PP6 over-current interrupt enabled 0 PP6 over-current interrupt disabled (interrupt flag masked) 5 OCIEP5 Over-Current Interrupt Enable -- This bit enables or disables the over-current interrupt on PP5. 1 PP5 over-current interrupt enabled 0 PP5 over-current interrupt disabled (interrupt flag masked) 4 OCIEP4 Over-Current Interrupt Enable -- This bit enables or disables the over-current interrupt on PP4. 1 PP4 over-current interrupt enabled 0 PP4 over-current interrupt disabled (interrupt flag masked) 2 OCIEP2 Over-Current Interrupt Enable -- This bit enables or disables the over-current interrupt on EVDD1. 1 EVDD1 over-current interrupt enabled 0 EVDD1 over-current interrupt disabled (interrupt flag masked) 0 OCIEP0 Over-Current Interrupt Enable -- This bit enables or disables the over-current interrupt on PP0. 1 PP0 over-current interrupt enabled 0 PP0 over-current interrupt disabled (interrupt flag masked) 2.3.4.3 Port P Over-Current Interrupt Flag Register (OCIFP) Access: User read/write1 Address 0x02FB 7 R 0 W Reset 0 6 5 4 OCIFP6 OCIFP5 OCIFP4 0 0 0 3 0 2 OCIFP2 0 0 1 0 0 0 OCIFP0 0 Figure 2-23. Port P Over-Current Interrupt Flag Register MC9S12ZVC Family Reference Manual , Rev. 1.9 96 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 1 Read: Anytime Write: Anytime, write 1 to clear Table 2-23. Port P Over-Current Interrupt Flag Register Field Description 6 OCIFP6 Over-Current Interrupt Flag -- This flag asserts if an over-current condition is detected on PP6 (Section 2.4.4.3, "Over-Current Interrupt and Protection""). Writing a logic "1" to the corresponding bit field clears the flag. 1 PP6 over-current event occurred 0 No PP6 over-current event occurred 5 OCIFP5 Over-Current Interrupt Flag -- This flag asserts if an over-current condition is detected on PP5 (Section 2.4.4.3, "Over-Current Interrupt and Protection""). Writing a logic "1" to the corresponding bit field clears the flag. 1 PP5 over-current event occurred 0 No PP5 over-current event occurred 4 OCIFP4 Over-Current Interrupt Flag -- This flag asserts if an over-current condition is detected on PP4 (Section 2.4.4.3, "Over-Current Interrupt and Protection""). Writing a logic "1" to the corresponding bit field clears the flag. 1 PP4 over-current event occurred 0 No PP4 over-current event occurred 2 OCIFP2 Over-Current Interrupt Flag -- This flag asserts if an over-current condition is detected on EVDD1 (Section 2.4.4.3, "Over-Current Interrupt and Protection""). Writing a logic "1" to the corresponding bit field clears the flag. 1 EVDD1 over-current event occurred 0 No EVDD1 over-current event occurred 0 OCIFP0 Over-Current Interrupt Flag -- This flag asserts if an over-current condition is detected on PP0 (Section 2.4.4.3, "Over-Current Interrupt and Protection""). Writing a logic "1" to the corresponding bit field clears the flag. 1 PP0 over-current event occurred 0 No PP0 over-current event occurred MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 97 Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.4.4 Port L Input Register (PTIL) Access: User read only1 Address 0x0331 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 PTIL1 PTIL0 0 0 0 0 0 0 0 0 W Reset Figure 2-24. Port L Input Register (PTIL) 1 Read: Anytime Write: No Write Table 2-24. PTIL - Register Field Descriptions 1 Field Description 1-0 PTIL1-0 Port Input Data Register Port L -- A read returns the synchronized input state if the associated HVI pin is used in digital mode, that is the related DIENL bit is set to 1 and the pin is not used in analog mode (PTAENL=0). See Section 2.3.4.10, "Port L ADC Connection Enable Register (PTAENL)". A one is read in any other case1. Refer to PTTEL bit description in Section 2.3.4.12, "Port L Test Enable Register (PTTEL) for an override condition. 2.3.4.5 Port L Pull Select Register (PTPSL) Access: User read/write1 Address 0x0333 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 PTPSL1 PTPSL0 0 0 Figure 2-25. Port L Pull Select Register (PTPSL) 1 Read: Anytime Write: Anytime Table 2-25. PTPSL Register Field Descriptions Field Description 1-0 PTPSL1-0 Port L Pull Select -- This bit selects a pull device on the HVI pin in analog mode for open input detection. By default a pulldown device is active as part of the input voltage divider. If this bit set to 1 and PTTEL=1 and not in stop mode a pullup to a level close to VDDX takes effect and overrides the weak pulldown device. Refer to Section 2.5.5, "Open Input Detection on PL[1:0] (HVI)"). 1 Pullup enabled 0 Pulldown enabled MC9S12ZVC Family Reference Manual , Rev. 1.9 98 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.4.6 Port L Polarity Select Register (PPSL) Access: User read/write1 Address 0x0334 PPSL R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 PPSL1 PPSL0 0 0 Figure 2-26. Port L Polarity Select Register (PPSL) 1 Read: Anytime Write: Anytime Table 2-26. PPSL Register Field Descriptions Field 1-0 PPSL1-0 Description Polarity Select -- This bit selects the polarity of the active interrupt edge on the associated HVI pin. 1 Rising edge selected 0 Falling edge selected 2.3.4.7 Port L ADC Bypass Register (PTABYPL) Access: User read/write1 Address 0x033A R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 PTABYPL1 PTABYPL0 0 0 Figure 2-27. Port L ADC Bypass Register (PTABYPL) 1 Read: Anytime Write: Anytime Table 2-27. PTABYPL Register Field Descriptions Field 1-0 PTABYPL 1-0 Description Port L ADC Connection Bypass -- This bit bypasses and powers down the impedance converter stage in the signal path from the analog input pin to the ADC channel input. This bit takes effect only if using direct input connection to the ADC channel (PTADIRL=1). 1 Impedance converter bypassed 0 Impedance converter used MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 99 Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.4.8 Port L ADC Direct Register (PTADIRL) Access: User read/write1 Address 0x033B R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 PTADIRL1 PTADIRL0 0 0 Figure 2-28. Port L ADC Direct Register (PTADIRL) 1 Read: Anytime Write: Anytime Table 2-28. PTADIRL Register Field Descriptions Field Description 1-0 PTADIRL 1-0 Port L ADC Direct Connection -- This bit connects the analog input signal directly to the ADC channel bypassing the voltage divider. This bit takes effect only in analog mode (PTAENL=1). 1 Input pin directly connected to ADC channel 0 Input voltage divider active on analog input to ADC channel 2.3.4.9 Port L Digital Input Enable Register (DIENL) Access: User read/write1 Address 0x33C R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 DIENL1 DIENL0 0 0 Figure 2-29. Port L Digital Input Enable Register (DIENL) 1 Read: Anytime Write: Anytime Table 2-29. DIENL Register Field Descriptions Field Description 1-0 Digital Input Enable Port L -- Input buffer control DIENL1-0 This bit controls the HVI digital input function. If set to 1 the input buffer is enabled and the HVI pin can be used with the digital function. If the analog input function is enabled (PTAENL=1) the input buffer of the selected HVI pin is forced off1 in run mode and is released to be active in stop mode2 only if DIENL=1. 1 Associated pin digital input is enabled if not used as analog input in run mode1 0 Associated pin digital input is disabled1 1 2 Refer to PTTEL bit description in Section 2.3.4.10, "Port L ADC Connection Enable Register (PTAENL) for an override condition. "Stop mode" is limited to RPM; refer to Table 2-36. MC9S12ZVC Family Reference Manual , Rev. 1.9 100 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.4.10 Port L ADC Connection Enable Register (PTAENL) Access: User read/write1 Address 0x033D R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 PTAENL1 PTAENL0 0 0 Figure 2-30. Port L ADC Connection Enable Register (PTAENL) 1 Read: Anytime Write: Anytime Table 2-30. PTAENL Register Field Descriptions Field Description 1-0 PTAENL 1-0 Port L ADC Connection Enable -- This bit enables the analog signal link to an ADC channel. If set to 1 the analog input function takes precedence over the digital input in run mode by forcing off the input buffer if not overridden by PTTEL=1. Note: When enabling the resistor paths to ground by setting PTAENL=1, a delay of tUNC_HVI + two bus cycles must be accounted for. 1 ADC connection enabled 0 ADC connection disabled 2.3.4.11 Port L Input Divider Ratio Selection Register (PIRL) Access: User read/write1 Address 0x033E R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 PIRL1 PIRL0 0 0 Figure 2-31. Port L Input Divider Ratio Selection Register (PIRL) 1 Read: Anytime Write: Anytime Table 2-31. PIRL Register Field Descriptions Field 1-0 PIRL1-0 Description Port L Input Divider Ratio Select -- This bit selects one of two voltage divider ratios for the associated HVI pin in analog mode. 1 RatioL_HVI selected 0 RatioH_HVI selected MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 101 Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.3.4.12 Port L Test Enable Register (PTTEL) Access: User read/write1 Address 0x033F R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 PTTEL1 PTTEL0 0 0 Figure 2-32. Port L Test Enable Register (PTTEL) 1 Read: Anytime Write: Anytime Table 2-32. PTTEL Register Field Descriptions Field Description 1-0 PTTEL1-0 Port L Test Enable -- This bit forces the input buffer of the HVI pin active while using the analog function to support open input detection in run mode. Refer to Section 2.5.5, "Open Input Detection on PL[1:0] (HVI)"). In stop mode this bit has no effect. Note: In direct mode (PTADIRL=1) the digital input buffer is not enabled. 1 Input buffer enabled when used with analog function and not in direct mode (PTADIRL=0) 0 Input buffer disabled when used with analog function 2.4 2.4.1 Functional Description General Each pin except BKGD can act as general-purpose I/O. In addition each pin can act as an output or input of a peripheral module. 2.4.2 Registers Table 2-33 lists the implemented configuration bits which are available on each port. These registers except the pin input registers can be written at any time, however a specific configuration might not become active. For example a pullup device does not become active while the port is used as a push-pull output. Unimplemented bits read zero. MC9S12ZVC Family Reference Manual , Rev. 1.9 102 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) Table 2-33. Bit Indices of Implemented Register Bits per Port Port Data Register Port Input Register Data Direction Register Pull Device Enable Register Polarity Select Register Port Interrupt Enable Register Port Interrupt Flag Register Digital Input Enable Register Reduced Drive Register Wired-Or Mode Register Port PT PTI DDR PER PPS PIE PIF DIE RDR WOM E 1-0 1-0 1-0 1-0 1-0 - - - - - ADH 7-0 7-0 7-0 7-0 7-0 7-0 7-0 7-0 - - ADL 7-0 7-0 7-0 7-0 7-0 7-0 7-0 7-0 - - T 7-0 7-0 7-0 7-0 7-0 - - - - - S 7-0 7-0 7-0 7-0 7-0 7-0 7-0 - - 7-0 P 7-0 7-0 7-0 7-0 7-0 7-0 7-0 - 6-4,2,0 - J 1-0 1-0 1-0 1-0 1-0 - - - - 1-0 L - 1-0 - - 1-0 1-0 1-0 1-0 - - Table 2-34 shows the effect of enabled peripheral features on I/O state and enabled pull devices. Table 2-34. Effect of Enabled Features Enabled Feature1 Effect on I/O state Related Signal(s) Effect on enabled pull device CPMU OSC EXTAL, XTAL CPMU takes control Forced off TIMx output compare y IOCx_y Forced output Forced off, pulldown forced off if open-drain TIMx input capture y IOCx_y None2 None3 SPIx MISOx, MOSx, SCKx, SSx SPI takes control Forced off if output, pulldown forced off if open-drain SCIx transmitter TXDx Forced output Forced off, pulldown forced off if open-drain SCIx receiver RXDx Forced input None3 IICx SDAx, SCLx Forced open-drain Pulldown forced off S12ZDBG DBGEEV None2 None3 PWMx channel y PWMx_y Forced output Forced off ADCx ANy None2 4 None3 ACMPx_0, ACMPx_1 None2 4 None3 ACMPOx Forced output Forced off AMPPx, AMPMx None2 4 None3 DACUx, AMPx Digital output forced off Forced off VRH ACMPx DACx MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 103 Chapter 2 Port Integration Module (S12ZVCPIMV1) Table 2-34. Effect of Enabled Features Enabled Feature1 Related Signal(s) Effect on I/O state Effect on enabled pull device SENT SENT_TX Forced output Forced off if push-pull, pulldown forced off if open-drain IRQ IRQ Forced input None3 XIRQ XIRQ Forced input None3 MSCANx TXCANx Forced output Forced off RXCANx Forced input Pulldown forced off CPTXDx Forced input None3 CPRXDx Forced output Forced off, pulldown forced off if open-drain CANPHYx 1 If applicable the appropriate routing configuration must be set for the signals to take effect on the pins. DDR maintains control 3 PER/PPS maintain control 4 To use the digital input function the related bit in Digital Input Enable Register (DIENADH/L) must be set to logic level "1". 2 2.4.3 Pin I/O Control Figure 2-33 illustrates the data paths to and from an I/O pin. Input and output data can always be read via the input register (PTIx, Section 2.3.3.2, "Port Input Register") independent if the pin is used as general-purpose I/O or with a shared peripheral function. If the pin is configured as input (DDRx=0, Section 2.3.3.3, "Data Direction Register"), the pin state can also be read through the data register (PTx, Section 2.3.3.1, "Port Data Register"). The general-purpose data direction configuration can be overruled by an enabled peripheral function shared on the same pin (Table 2-34). If more than one peripheral function is available and enabled at the same time, the highest ranked module according the predefined priority scheme in Table 2-2 will take precedence on the pin. MC9S12ZVC Family Reference Manual , Rev. 1.9 104 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) PTIx synch. 0 1 PTx Pin 0 1 DDRx 0 1 data out Periph. Module output enable port enable data in Figure 2-33. Illustration of I/O pin functionality 2.4.4 Interrupts This section describes the interrupts generated by the PIM and their individual sources. Vector addresses and interrupt priorities are defined at MCU level. Table 2-35. PIM Interrupt Sources Module Interrupt Sources 2.4.4.1 Local Enable XIRQ None IRQ IRQCR[IRQEN] Port AD pin interrupt PIEADH[PIEADH] PIEADL[PIEADL] Port S pin interrupt PIES[PIES] Port P pin interrupt PIEP[PIEP] Port L pin interrupt PIEL[PIEL] Port P over-current interrupt OCIEP[OCIEP] XIRQ, IRQ Interrupts The XIRQ pin allows requesting non-maskable interrupts after reset initialization. During reset, the X bit in the condition code register is set and any interrupts are masked until software enables them. The IRQ pin allows requesting asynchronous interrupts. The interrupt input is disabled out of reset. To enable the interrupt the IRQCR[IRQEN] bit must be set and the I bit cleared in the condition code register. The interrupt can be configured for level-sensitive or falling-edge-sensitive triggering. If IRQCR[IRQEN] is cleared while an interrupt is pending, the request will deassert. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 105 Chapter 2 Port Integration Module (S12ZVCPIMV1) Both interrupts are capable to wake-up the device from stop mode. Means for glitch filtering are not provided on these pins. 2.4.4.2 Pin Interrupts and Key-Wakeup (KWU) Ports AD, S, P and L offer pin interrupt and key-wakeup capability. The related interrupt enable (PIE) as well as the sensitivity to rising or falling edges (PPS) can be individually configured on per-pin basis. All bits/pins in a port share the same interrupt vector. Interrupts can be used with the pins configured as inputs or outputs. An interrupt is generated when a bit in the port interrupt flag (PIF) and its corresponding port interrupt enable (PIE) are both set. The pin interrupt feature is also capable to wake up the CPU when it is in stop or wait mode (key-wakeup). A digital filter on each pin prevents short pulses from generating an interrupt. A valid edge on an input is detected if 4 consecutive samples of a passive level are followed by 4 consecutive samples of an active level. Else the sampling logic is restarted. In run and wait mode the filters are continuously clocked by the bus clock. Pulses with a duration of tPULSE < nP_MASK/fbus are assuredly filtered out while pulses with a duration of tPULSE > nP_PASS/fbus guarantee a pin interrupt. In stop mode the filter clock is generated by an RC-oscillator. The minimum pulse length varies over process conditions, temperature and voltage (Figure 2-34). Pulses with a duration of tPULSE < tP_MASK are assuredly filtered out while pulses with a duration of tPULSE > tP_PASS guarantee a wakeup event. Please refer to the appendix table "Pin Interrupt Characteristics" for pulse length limits. To maximize current saving the RC oscillator is active only if the following condition is true on any individual pin: Sample count <= 4 (at active or passive level) and interrupt enabled (PIE[x]=1) and interrupt flag not set (PIF[x]=0). Glitch, filtered out, no interrupt flag set Valid pulse, interrupt flag set uncertain tP_MASK tP_PASS Figure 2-34. Interrupt Glitch Filter (here: active low level selected) MC9S12ZVC Family Reference Manual , Rev. 1.9 106 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2.4.4.3 Over-Current Interrupt and Protection In case of an over-current condition on PP2 (EVDD1) or PP[6-4,0] (see Section 2.5.3, "Over-Current Protection on PP2 (EVDD1)"" and 2.5.4, "Over-Current Protection on PP[6-4,0]"") the related over-current interrupt flag OCIFP[OCIFP] asserts. This flag generates an interrupt if the enable bit OCIEP[OCIEP] is set. An asserted flag immediately forces the related output independent of its driving source (peripheral output or port register bit) to its disabled level to protect the device. The flag must be cleared to re-enable the driver. 2.4.5 High-Voltage Input A high-voltage input (HVI) on port L has the following features: * Input voltage proof up to VHVI * Digital input function with pin interrupt and wakeup from stop capability * Analog input function with selectable divider ratio routable to ADC channel. Optional direct input bypassing voltage divider and impedance converter. Capable to wakeup from stop (pin interrupts in run mode not available). Open input detection. Figure 2-35 shows a block diagram of the HVI. NOTE The term stop mode (STOP) is limited to voltage regulator operating in reduced performance mode (RPM). Refer to "Low Power Modes" section in device overview. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 107 Chapter 2 Port Integration Module (S12ZVCPIMV1) VHVI REXT_HVI 10K PL (HVI) 40K Input Buffer PTIL (DIENL & (PTAENL | STOP)) | (PTAENL & PTADIRL & PTTEL & STOP) 500K PTAENL & STOP & PTADIRL PTAENL & PTTEL & PTPSL & STOP VDDX PTAENL & STOP & PTADIRL Impedance Converter ADC PTAENL & STOP & PTADIRL 110K PIRL PTAENL & PTADIRL & PTABYPL 440K Figure 2-35. HVI Block Diagram Voltages up to VHVI can be applied to the HVI pin. Internal voltage dividers scale the input signals down to logic level. There are two modes, digital and analog, where these signals can be processed. 2.4.5.1 Digital Mode Operation In digital mode the input buffer is enabled (DIENL=1 & PTAENL=0). The synchronized pin input state determined at threshold level VTH_HVI can be read in register PTIL. An interrupt flag (PIFL) is set on input transitions of the configured edge polarity (PPSL). An interrupt (PIFL) is generated if enabled (PIEL=1) and the interrupt being set (PIFL=1). Wakeup from stop mode is supported. 2.4.5.2 Analog Mode Operation In analog mode (PTAENL=1) the input buffer is forced off and the voltage applied to a selectable HVI pin can be measured on its related internal ADC channel (refer to device overview section for channel assignment). One of two input divider ratios (RatioH_HVI, RatioL_HVI) can be chosen (PIRL) on the analog MC9S12ZVC Family Reference Manual , Rev. 1.9 108 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) input or the voltage divider can be bypassed (PTADIRL=1). Additionally in latter case the impedance converter in the ADC signal path can be used or bypassed in direct input mode (PTABYPL). Out of reset the digital input buffer of the selected pin is disabled to avoid shoot-through current. Thus pin interrupts can only be generated if DIENL=1. In stop mode (RPM) the digital input buffer is enabled only if DIENL=1 to support wakeup functionality. Table 2-36 shows the HVI input configuration depending on register bits and operation mode. Table 2-36. HVI Input Configurations Mode DIENL PTAENL Run 0 0 off off 0 1 off1 enabled 1 0 enabled off 1 1 off1 enabled 0 X off off Input disabled, wakeup from stop not supported 1 X enabled off Digital input, wakeup from stop supported Stop2 1 2 Digital Input Analog Input Resulting Function Input disabled (Reset) Analog input, interrupt not supported Digital input, interrupt supported Analog input, interrupt not supported Enabled if PTTEL=1 & PTADIRL=0) The term "stop mode" is limited to voltage regulator operating in reduced performance mode (RPM; refer to "Low Power Modes" section in device overview). In any other case the HVI input configuration defaults to "run mode". Therefore set PTAENL=0 before entering stop mode in order to generally support wakeup from stop. NOTE An external resistor REXT_HVI must always be connected to the high-voltage input to protect the device pins from fast transients and to achieve the specified pin input divider ratios when using the HVI in analog mode. 2.5 2.5.1 Initialization and Application Information Port Data and Data Direction Register writes It is not recommended to write PORTx/PTx and DDRx in a word access. When changing the register pins from inputs to outputs, the data may have extra transitions during the write access. Initialize the port data register before enabling the outputs. 2.5.2 SCI Baud Rate Detection The baud rate for SCI0 and SCI1 can be determined by using a timer channel to measure the data rate on the related RXD signal. 1. Establish the link: -- For SCI0: Set MODRR3[T0IC3RR1:T0IC3RR0]=2b00 to route TIM0 input capture channel 3 to internal RXD0 signal of SCI0. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 109 Chapter 2 Port Integration Module (S12ZVCPIMV1) -- For SCI1: Set MODRR3[T0IC3RR1:T0IC3RR0]=2b10 to route TIM0 input capture channel 3 to internal RXD1 signal of SCI1. 2. Determine pulse width of incoming data: Configure TIM0 input capture channel 3 to measure time between incoming signal edges. 2.5.3 Over-Current Protection on PP2 (EVDD1) Pin PP2 can be used as general-purpose I/O or due to its increased current capability in output mode as a switchable external power supply pin (EVDD1) for external devices like Hall sensors. EVDD1 connects the load to the digital supply VDDX. An over-current monitor is implemented to protect the controller from short circuits or excess currents on the output which can only arise if the pin is configured for full drive. Although the full drive current is available on the high and low side, the protection is only available on the high side when sourcing current from EVDD1 to VSSX. There is also no protection to voltages higher than VDDX. To power up the over-current monitor set the related OCPEx bit. In stop mode the over-current monitor is disabled for power saving. The increased current capability cannot be maintained to supply the external device. Therefore when using the pin as power supply the external load must be powered down prior to entering stop mode by driving the output low. An over-current condition is detected if the output current level exceeds the threshold IOCD in run mode. The output driver is immediately forced low and the over-current interrupt flag OCIFx asserts. Refer to Section 2.4.4.3, "Over-Current Interrupt and Protection"". 2.5.4 Over-Current Protection on PP[6-4,0] Pins PP[6-4,0] can be used as general-purpose I/O or due to their increased current capability in output mode as a switchable external power ground pin for external devices like LEDs supplied by VDDX. PP[6-4,0] connect the loads to the digital ground VSSX. Similar protection mechanisms as for EVDD1 apply for PP[6-4,0] accordingly in an inverse way. 2.5.5 Open Input Detection on PL[1:0] (HVI) The connection of an external pull device on a high-voltage input can be validated by using the built-in pull functionality of the HVI. Depending on the application type an external pulldown circuit can be detected with the internal pullup device whereas an external pullup circuit can be detected with the internal pulldown device which is part of the input voltage divider. Note that the following procedures make use of a function that overrides the automatic disable mechanism of the digital input buffer when using the HVI in analog mode. Make sure to switch off the override function when using the HVI in analog mode after the check has been completed. External pulldown device (Figure 2-36): 1. Enable analog function on HVI in non-direct mode (PTAENL=1, PTADIRL=0) MC9S12ZVC Family Reference Manual , Rev. 1.9 110 NXP Semiconductors Chapter 2 Port Integration Module (S12ZVCPIMV1) 2. Select internal pullup device on HVI (PTPSL=1) 3. Enable function to force input buffer active on HVI in analog mode (PTTEL=1) 4. Verify PTIL=0 for a connected external pulldown device; read PTIL=1 for an open input VDDX 500K min. 1/10 * VDDX 110K / 550K PIRL=0 / PIRL=1 Digital in 40K HVI 10K HV Supply Figure 2-36. Digital Input Read with Pullup Enabled External pullup device (Figure 2-37): 1. Enable analog function on HVI in non-direct mode (PTAENL=1, PTADIRL=0) 2. Select internal pulldown device on HVI (PTPSL=0) 3. Enable function to force input buffer active on HVI in analog mode (PTTEL=1) 4. Verify PTIL=1 for a connected external pullup device; read PTIL=0 for an open input MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 111 Chapter 2 Port Integration Module (S12ZVCPIMV1) HV Supply 10K HVI 40K max. 10/11 * VHVI (PIRL=0) max. 21/22 * VHVI (PIRL=1) Digital in 610K / 1050K PIRL=0 / PIRL=1 Figure 2-37. Digital Input Read with Pulldown Enabled MC9S12ZVC Family Reference Manual , Rev. 1.9 112 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) Table 3-1. Revision History Revision Number Revision Date V2.04 03.Dec.2012 Section 3.1.3.3, Included BACKGROUND/ Stop mode dependency "Low-Power Modes V2.05 22.Jan.2013 Section 3.3.2.2, Improved NORESP description and added STEP1/ Wait mode dependency "BDC Control Status Register Low (BDCCSRL) V2.06 22.Mar.2013 Section 3.3.2.2, Improved NORESP description of STEP1/ Wait mode dependency "BDC Control Status Register Low (BDCCSRL) V2.07 11.Apr.2013 V2.08 31.May.2013 V2.09 29.Aug.2013 Section 3.4.4.12, "READ_DBGTB Noted that READ_DBGTB is only available for devices featuring a trace buffer. V2.10 21.Oct.2013 Section 3.1.3.3.2, "Wait Mode Improved description of NORESP dependence on WAIT and BACKROUND 3.1 Sections Affected Section 3.1.3.3.1, "Stop Mode Description of Changes Improved STOP and BACKGROUND interdepency description Section 3.4.4.4, Removed misleading WAIT and BACKGROUND interdepency description "BACKGROUND Added subsection dedicated to Long-ACK Section 3.4.7.1, "Long-ACK Hardware Handshake Protocol Introduction The background debug controller (BDC) is a single-wire, background debug system implemented in on-chip hardware for minimal CPU intervention. The device BKGD pin interfaces directly to the BDC. The S12ZBDC maintains the standard S12 serial interface protocol but introduces an enhanced handshake protocol and enhanced BDC command set to support the linear instruction set family of S12Z devices and offer easier, more flexible internal resource access over the BDC serial interface. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 113 Chapter 3 Background Debug Controller (S12ZBDCV2) 3.1.1 Glossary Table 3-2. Glossary Of Terms Term Definition DBG On chip Debug Module BDM Active Background Debug Mode CPU S12Z CPU SSC Special Single Chip Mode (device operating mode NSC Normal Single Chip Mode (device operating mode) BDCSI Background Debug Controller Serial Interface. This refers to the single pin BKGD serial interface. EWAIT Optional S12 feature which allows external devices to delay external accesses until deassertion of EWAIT 3.1.2 Features The BDC includes these distinctive features: * Single-wire communication with host development system * SYNC command to determine communication rate * Genuine non-intrusive handshake protocol * Enhanced handshake protocol for error detection and stop mode recognition * Active out of reset in special single chip mode * Most commands not requiring active BDM, for minimal CPU intervention * Full global memory map access without paging * Simple flash mass erase capability 3.1.3 Modes of Operation S12 devices feature power modes (run, wait, and stop) and operating modes (normal single chip, special single chip). Furthermore, the operation of the BDC is dependent on the device security status. 3.1.3.1 BDC Modes The BDC features module specific modes, namely disabled, enabled and active. These modes are dependent on the device security and operating mode. In active BDM the CPU ceases execution, to allow BDC system access to all internal resources including CPU internal registers. 3.1.3.2 Security and Operating mode Dependency In device run mode the BDC dependency is as follows * Normal modes, unsecure device General BDC operation available. The BDC is disabled out of reset. MC9S12ZVC Family Reference Manual , Rev. 1.9 114 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) * Normal modes, secure device BDC disabled. No BDC access possible. Special single chip mode, unsecure BDM active out of reset. All BDC commands are available. Special single chip mode, secure BDM active out of reset. Restricted command set available. * * When operating in secure mode, BDC operation is restricted to allow checking and clearing security by mass erasing the on-chip flash memory. Secure operation prevents BDC access to on-chip memory other than mass erase. The BDC command set is restricted to those commands classified as Always-available. 3.1.3.3 Low-Power Modes 3.1.3.3.1 Stop Mode The execution of the CPU STOP instruction leads to stop mode only when all bus masters (CPU, or others, depending on the device) have finished processing. The operation during stop mode depends on the ENBDC and BDCCIS bit settings as summarized in Table 3-3 Table 3-3. BDC STOP Operation Dependencies ENBDC BDCCIS Description Of Operation 0 0 BDC has no effect on STOP mode. 0 1 BDC has no effect on STOP mode. 1 0 Only BDCSI clock continues 1 1 All clocks continue A disabled BDC has no influence on stop mode operation. In this case the BDCSI clock is disabled in stop mode thus it is not possible to enable the BDC from within stop mode. STOP Mode With BDC Enabled And BDCCIS Clear If the BDC is enabled and BDCCIS is clear, then the BDC prevents the BDCCLK clock (Figure 3-5) from being disabled in stop mode. This allows BDC communication to continue throughout stop mode in order to access the BDCCSR register. All other device level clock signals are disabled on entering stop mode. NOTE This is intended for application debugging, not for fast flash programming. Thus the CLKSW bit must be clear to map the BDCSI to BDCCLK. With the BDC enabled, an internal acknowledge delays stop mode entry and exit by 2 BDCSI clock + 2 bus clock cycles. If no other module delays stop mode entry and exit, then these additional clock cycles represent a difference between the debug and not debug cases. Furthermore if a BDC internal access is being executed when the device is entering stop mode, then the stop mode entry is delayed until the internal access is complete (typically for 1 bus clock cycle). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 115 Chapter 3 Background Debug Controller (S12ZBDCV2) Accesses to the internal memory map are not possible when the internal device clocks are disabled. Thus attempted accesses to memory mapped resources are suppressed and the NORESP flag is set. Resources can be accessed again by the next command received following exit from Stop mode. A BACKGROUND command issued whilst in stop mode remains pending internally until the device leaves stop mode. This means that subsequent active BDM commands, issued whilst BACKGROUND is pending, set the ILLCMD flag because the device is not yet in active BDM. If ACK handshaking is enabled, then the first ACK, following a stop mode entry is long to indicate a stop exception. The BDC indicates a stop mode occurrence by setting the BDCCSR bit STOP. If the host attempts further communication before the ACK pulse generation then the OVRUN bit is set. STOP Mode With BDC Enabled And BDCCIS Set If the BDC is enabled and BDCCIS is set, then the BDC prevents core clocks being disabled in stop mode. This allows BDC communication, for access of internal memory mapped resources, but not CPU registers, to continue throughout stop mode. A BACKGROUND command issued whilst in stop mode remains pending internally until the device leaves stop mode. This means that subsequent active BDM commands, issued whilst BACKGROUND is pending, set the ILLCMD flag because the device is not yet in active BDM. If ACK handshaking is enabled, then the first ACK, following a stop mode entry is long to indicate a stop exception. The BDC indicates a stop mode occurrence by setting the BDCCSR bit STOP. If the host attempts further communication before the ACK pulse generation then the OVRUN bit is set. 3.1.3.3.2 Wait Mode The device enters wait mode when the CPU starts to execute the WAI instruction. The second part of the WAI instruction (return from wait mode) can only be performed when an interrupt occurs. Thus on entering wait mode the CPU is in the middle of the WAI instruction and cannot permit access to CPU internal resources, nor allow entry to active BDM. Thus only commands classified as Non-Intrusive or Always-Available are possible in wait mode. On entering wait mode, the WAIT flag in BDCCSR is set. If the ACK handshake protocol is enabled then the first ACK generated after WAIT has been set is a long-ACK pulse. Thus the host can recognize a wait mode occurrence. The WAIT flag remains set and cannot be cleared whilst the device remains in wait mode. After the device leaves wait mode the WAIT flag can be cleared by writing a "1" to it. A BACKGROUND command issued whilst in wait mode sets the NORESP bit and the BDM active request remains pending internally until the CPU leaves wait mode due to an interrupt. The device then enters BDM with the PC pointing to the address of the first instruction of the ISR. With ACK disabled, further Non-Intrusive or Always-Available commands are possible, in this pending state, but attempted Active-Background commands set NORESP and ILLCMD because the BDC is not in active BDM state. With ACK enabled, if the host attempts further communication before the ACK pulse generation then the OVRUN bit is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 116 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) Similarly the STEP1 command issued from a WAI instruction cannot be completed by the CPU until the CPU leaves wait mode due to an interrupt. The first STEP1 into wait mode sets the BDCCSR WAIT bit. If the part is still in Wait mode and a further STEP1 is carried out then the NORESP and ILLCMD bits are set because the device is no longer in active BDM for the duration of WAI execution. 3.1.4 Block Diagram A block diagram of the BDC is shown in Figure 3-1. HOST SYSTEM BKGD SERIAL INTERFACE CONTROL AND SHIFT REGISTER CLOCK DOMAIN CONTROL INSTRUCTION DECODE AND FSM BDCSI CORE CLOCK ADDRESS BUS INTERFACE AND CONTROL LOGIC BDCCSR REGISTER AND DATAPATH CONTROL DATA BUS CONTROL CPU CONTROL ERASE FLASH FLASH ERASED FLASH SECURE Figure 3-1. BDC Block Diagram 3.2 External Signal Description A single-wire interface pin (BKGD) is used to communicate with the BDC system. During reset, this pin is a device mode select input. After reset, this pin becomes the dedicated serial interface pin for the BDC. BKGD is a pseudo-open-drain pin with an on-chip pull-up. Unlike typical open-drain pins, the external RC time constant on this pin due to external capacitance, plays almost no role in signal rise time. The custom protocol provides for brief, actively driven speed-up pulses to force rapid rise times on this pin without risking harmful drive level conflicts. Refer to Section 3.4.6, "BDC Serial Interface" for more details. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 117 Chapter 3 Background Debug Controller (S12ZBDCV2) 3.3 Memory Map and Register Definition 3.3.1 Module Memory Map Table 3-4 shows the BDC memory map. Table 3-4. BDC Memory Map 3.3.2 Global Address Module Size (Bytes) Not Applicable BDC registers 2 Register Descriptions The BDC registers are shown in Figure 3-2. Registers are accessed only by host-driven communications to the BDC hardware using READ_BDCCSR and WRITE_BDCCSR commands. They are not accessible in the device memory map. Global Address Register Name Not Applicable BDCCSRH Not Applicable BDCCSRL Bit 7 R W R W 6 ENBDC WAIT BDMACT STOP 5 4 0 BDCCIS RAMWF OVRUN 3 2 STEAL CLKSW NORESP RDINV = Unimplemented, Reserved 0 1 Bit 0 UNSEC ERASE ILLACC ILLCMD = Always read zero Figure 3-2. BDC Register Summary 3.3.2.1 BDC Control Status Register High (BDCCSRH) Register Address: This register is not in the device memory map. It is accessible using BDC inherent addressing commands 7 R W ENBDC 6 BDMACT 5 BDCCIS 4 0 3 2 STEAL CLKSW 1 0 UNSEC ERASE Reset Secure AND SSC-Mode 1 1 0 0 0 0 0 0 Unsecure AND SSC-Mode 1 1 0 0 0 0 1 0 Secure AND NSC-Mode 0 0 0 0 0 0 0 0 Unsecure AND NSC-Mode 0 0 0 0 0 0 1 0 = Unimplemented, Reserved 0 = Always read zero Figure 3-3. BDC Control Status Register High (BDCCSRH) MC9S12ZVC Family Reference Manual , Rev. 1.9 118 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) Read: All modes through BDC operation only. Write: All modes through BDC operation only, when not secured, but subject to the following: -- Bits 7,3 and 2 can only be written by WRITE_BDCCSR commands. -- Bit 5 can only be written by WRITE_BDCCSR commands when the device is not in stop mode. -- Bits 6, 1 and 0 cannot be written. They can only be updated by internal hardware. Table 3-5. BDCCSRH Field Descriptions Field Description 7 ENBDC Enable BDC -- This bit controls whether the BDC is enabled or disabled. When enabled, active BDM can be entered and non-intrusive commands can be carried out. When disabled, active BDM is not possible and the valid command set is restricted. Further information is provided in Table 3-7. 0 BDC disabled 1 BDC enabled Note: ENBDC is set out of reset in special single chip mode. 6 BDMACT BDM Active Status -- This bit becomes set upon entering active BDM. BDMACT is cleared as part of the active BDM exit sequence. 0 BDM not active 1 BDM active Note: BDMACT is set out of reset in special single chip mode. 5 BDCCIS BDC Continue In Stop -- If ENBDC is set then BDCCIS selects the type of BDC operation in stop mode (as shown in Table 3-3). If ENBDC is clear, then the BDC has no effect on stop mode and no BDC communication is possible.If ACK pulse handshaking is enabled, then the first ACK pulse following stop mode entry is a long ACK. This bit cannot be written when the device is in stop mode. 0 Only the BDCSI clock continues in stop mode 1 All clocks continue in stop mode 3 STEAL Steal enabled with ACK-- This bit forces immediate internal accesses with the ACK handshaking protocol enabled. If ACK handshaking is disabled then BDC accesses steal the next bus cycle. 0 If ACK is enabled then BDC accesses await a free cycle, with a timeout of 512 cycles 1 If ACK is enabled then BDC accesses are carried out in the next bus cycle 2 CLKSW Clock Switch -- The CLKSW bit controls the BDCSI clock source. This bit is initialized to "0" by each reset and can be written to "1". Once it has been set, it can only be cleared by a reset. When setting CLKSW a minimum delay of 150 cycles at the initial clock speed must elapse before the next command can be sent. This guarantees that the start of the next BDC command uses the new clock for timing subsequent BDC communications. 0 BDCCLK used as BDCSI clock source 1 Device fast clock used as BDCSI clock source Note: Refer to the device specification to determine which clock connects to the BDCCLK and fast clock inputs. 1 UNSEC Unsecure -- If the device is unsecure, the UNSEC bit is set automatically. 0 Device is secure. 1 Device is unsecure. Note: When UNSEC is set, the device is unsecure and the state of the secure bits in the on-chip Flash EEPROM can be changed. 0 ERASE Erase Flash -- This bit can only be set by the dedicated ERASE_FLASH command. ERASE is unaffected by write accesses to BDCCSR. ERASE is cleared either when the mass erase sequence is completed, independent of the actual status of the flash array or by a soft reset. Reading this bit indicates the status of the requested mass erase sequence. 0 No flash mass erase sequence pending completion 1 Flash mass erase sequence pending completion. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 119 Chapter 3 Background Debug Controller (S12ZBDCV2) 3.3.2.2 BDC Control Status Register Low (BDCCSRL) Register Address: This register is not in the device memory map. It is accessible using BDC inherent addressing commands R W Reset 7 6 5 4 3 2 1 0 WAIT STOP RAMWF OVRUN NORESP RDINV ILLACC ILLCMD 0 0 0 0 0 0 0 0 Figure 3-4. BDC Control Status Register Low (BDCCSRL) Read: BDC access only. Write: Bits [7:5], [3:0] BDC access only, restricted to flag clearing by writing a "1" to the bit position. Write: Bit 4 never. It can only be cleared by a SYNC pulse. If ACK handshaking is enabled then BDC commands with ACK causing a BDCCSRL[3:1] flag setting condition also generate a long ACK pulse. Subsequent commands that are executed correctly generate a normal ACK pulse. Subsequent commands that are not correctly executed generate a long ACK pulse. The first ACK pulse after WAIT or STOP have been set also generates a long ACK. Subsequent ACK pulses are normal, whilst STOP and WAIT remain set. Long ACK pulses are not immediately generated if an overrun condition is caused by the host driving the BKGD pin low whilst a target ACK is pending, because this would conflict with an attempted host transmission following the BKGD edge. When a whole byte has been received following the offending BKGD edge, the OVRUN bit is still set, forcing subsequent ACK pulses to be long. Unimplemented BDC opcodes causing the ILLCMD bit to be set do not generate a long ACK because this could conflict with further transmission from the host. If the ILLCMD is set for another reason, then a long ACK is generated for the current command if it is a BDC command with ACK. Table 3-6. BDCCSRL Field Descriptions Field Description 7 WAIT WAIT Indicator Flag -- Indicates that the device entered wait mode. Writing a "1" to this bit whilst in wait mode has no effect. Writing a "1" after exiting wait mode, clears the bit. 0 Device did not enter wait mode 1 Device entered wait mode. 6 STOP STOP Indicator Flag -- Indicates that the CPU requested stop mode following a STOP instruction. Writing a "1" to this bit whilst not in stop mode clears the bit. Writing a "1" to this bit whilst in stop mode has no effect. This bit can only be set when the BDC is enabled. 0 Device did not enter stop mode 1 Device entered stop mode. 5 RAMWF RAM Write Fault -- Indicates an ECC double fault during a BDC write access to RAM. Writing a "1" to this bit, clears the bit. 0 No RAM write double fault detected. 1 RAM write double fault detected. MC9S12ZVC Family Reference Manual , Rev. 1.9 120 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) Table 3-6. BDCCSRL Field Descriptions (continued) Field Description 4 OVRUN Overrun Flag -- Indicates unexpected host activity before command completion. This occurs if a new command is received before the current command completion. With ACK enabled this also occurs if the host drives the BKGD pin low whilst a target ACK pulse is pending To protect internal resources from misinterpreted BDC accesses following an overrun, internal accesses are suppressed until a SYNC clears this bit. A SYNC clears the bit. 0 No overrun detected. 1 Overrun detected when issuing a BDC command. 3 NORESP No Response Flag -- Indicates that the BDC internal action or data access did not complete. This occurs in the following scenarios: a) If no free cycle for an access is found within 512 core clock cycles. This could typically happen if a code loop without free cycles is executing with ACK enabled and STEAL clear. b) With ACK disabled or STEAL set, when an internal access is not complete before the host starts data/BDCCSRL retrieval or an internal write access is not complete before the host starts the next BDC command. c) Attempted internal memory or SYNC_PC accesses during STOP mode set NORESP if BDCCIS is clear. In the above cases, on setting NORESP, the BDC aborts the access if permitted. (For devices supporting EWAIT, BDC external accesses with EWAIT assertions, prevent a command from being aborted until EWAIT is deasserted). d) If a BACKGROUND command is issued whilst the device is in wait mode the NORESP bit is set but the command is not aborted. The active BDM request is completed when the device leaves wait mode. Furthermore subsequent CPU register access commands during wait mode set the NORESP bit, should it have been cleared. e) If a command is issued whilst awaiting return from Wait mode. This can happen when using STEP1 to step over a CPU WAI instruction, if the CPU has not returned from Wait mode before the next BDC command is received. f) If STEP1 is issued with the BDC enabled as the device enters Wait mode regardless of the BDMACT state. When NORESP is set a value of 0xEE is returned for each data byte associated with the current access. Writing a "1" to this bit, clears the bit. 0 Internal action or data access completed. 1 Internal action or data access did not complete. 2 RDINV Read Data Invalid Flag -- Indicates invalid read data due to an ECC error during a BDC initiated read access. The access returns the actual data read from the location. Writing a "1" to this bit, clears the bit. 0 No invalid read data detected. 1 Invalid data returned during a BDC read access. 1 ILLACC Illegal Access Flag -- Indicates an attempted illegal access. This is set in the following cases: When the attempted access addresses unimplemented memory When the access attempts to write to the flash array When a CPU register access is attempted with an invalid CRN (Section 3.4.5.1, "BDC Access Of CPU Registers). Illegal accesses return a value of 0xEE for each data byte Writing a "1" to this bit, clears the bit. 0 No illegal access detected. 1 Illegal BDC access detected. 0 ILLCMD Illegal Command Flag -- Indicates an illegal BDC command. This bit is set in the following cases: When an unimplemented BDC command opcode is received. When a DUMP_MEM{_WS}, FILL_MEM{_WS} or READ_SAME{_WS} is attempted in an illegal sequence. When an active BDM command is received whilst BDM is not active When a non Always-available command is received whilst the BDC is disabled or a flash mass erase is ongoing. When a non Always-available command is received whilst the device is secure Read commands return a value of 0xEE for each data byte Writing a "1" to this bit, clears the bit. 0 No illegal command detected. 1 Illegal BDC command detected. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 121 Chapter 3 Background Debug Controller (S12ZBDCV2) 3.4 3.4.1 Functional Description Security If the device resets with the system secured, the device clears the BDCCSR UNSEC bit. In the secure state BDC access is restricted to the BDCCSR register. A mass erase can be requested using the ERASE_FLASH command. If the mass erase is completed successfully, the device programs the security bits to the unsecure state and sets the BDC UNSEC bit. If the mass erase is unsuccessful, the device remains secure and the UNSEC bit is not set. For more information regarding security, please refer to device specific security information. 3.4.2 Enabling BDC And Entering Active BDM BDM can be activated only after being enabled. BDC is enabled by setting the ENBDC bit in the BDCCSR register, via the single-wire interface, using the command WRITE_BDCCSR. After being enabled, BDM is activated by one of the following1: * The BDC BACKGROUND command * A CPU BGND instruction * The DBG Breakpoint mechanism Alternatively BDM can be activated directly from reset when resetting into Special Single Chip Mode. The BDC is ready for receiving the first command 10 core clock cycles after the deassertion of the internal reset signal. This is delayed relative to the external pin reset as specified in the device reset documentation. On S12Z devices an NVM initialization phase follows reset. During this phase the BDC commands classified as always available are carried out immediately, whereas other BDC commands are subject to delayed response due to the NVM initialization phase. NOTE After resetting into SSC mode, the initial PC address must be supplied by the host using the WRITE_Rn command before issuing the GO command. When BDM is activated, the CPU finishes executing the current instruction. Thereafter only BDC commands can affect CPU register contents until the BDC GO command returns from active BDM to user code or a device reset occurs. When BDM is activated by a breakpoint, the type of breakpoint used determines if BDM becomes active before or after execution of the next instruction. NOTE Attempting to activate BDM using a BGND instruction whilst the BDC is disabled, the CPU requires clock cycles for the attempted BGND execution. However BACKGROUND commands issued whilst the BDC is disabled are ignored by the BDC and the CPU execution is not delayed. 1. BDM active immediately out of special single-chip reset. MC9S12ZVC Family Reference Manual , Rev. 1.9 122 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) 3.4.3 Clock Source The BDC clock source can be mapped to a constant frequency clock source or a PLL based fast clock. The clock source for the BDC is selected by the CLKSW bit as shown in Figure 3-5. The BDC internal clock is named BDCSI clock. If BDCSI clock is mapped to the BDCCLK by CLKSW then the serial interface communication is not affected by bus/core clock frequency changes. If the BDC is mapped to BDCFCLK then the clock is connected to a PLL derived source at device level (typically bus clock), thus can be subject to frequency changes in application. Debugging through frequency changes requires SYNC pulses to re-synchronize. The sources of BDCCLK and BDCFCLK are specified at device level. BDC accesses of internal device resources always use the device core clock. Thus if the ACK handshake protocol is not enabled, the clock frequency relationship must be taken into account by the host. When changing the clock source via the CLKSW bit a minimum delay of 150 cycles at the initial clock speed must elapse before a SYNC can be sent. This guarantees that the start of the next BDC command uses the new clock for timing subsequent BDC communications. BDCCLK BDCFCLK 0 BDC serial interface and FSM BDCSI Clock 1 CLKSW BDC device resource interface Core clock Figure 3-5. Clock Switch 3.4.4 BDC Commands BDC commands can be classified into three types as shown in Table 3-7. Table 3-7. BDC Command Types Command Type Secure Status BDC Status Always-available Secure or Unsecure Enabled or Disabled CPU Status -- Command Set * * * * Read/write access to BDCCSR Mass erase flash memory using ERASE_FLASH SYNC ACK enable/disable MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 123 Chapter 3 Background Debug Controller (S12ZBDCV2) Table 3-7. BDC Command Types (continued) Command Type Non-intrusive Active background Secure Status Unsecure Unsecure BDC Status Enabled Active CPU Status Command Set Code execution allowed * * * * * * * * Read/write access to BDCCSR Memory access Memory access with status Mass erase flash memory using ERASE_FLASH Debug register access BACKGROUND SYNC ACK enable/disable Code execution halted * * * * * * * * * * Read/write access to BDCCSR Memory access Memory access with status Mass erase flash memory using ERASE_FLASH Debug register access Read or write CPU registers Single-step the application Exit active BDM to return to the application program (GO) SYNC ACK enable/disable Non-intrusive commands are used to read and write target system memory locations and to enter active BDM. Target system memory includes all memory and registers within the global memory map, including external memory. Active background commands are used to read and write all memory locations and CPU resources. Furthermore they allow single stepping through application code and to exit from active BDM. Non-intrusive commands can only be executed when the BDC is enabled and the device unsecure. Active background commands can only be executed when the system is not secure and is in active BDM. Non-intrusive commands do not require the system to be in active BDM for execution, although, they can still be executed in this mode. When executing a non-intrusive command with the ACK pulse handshake protocol disabled, the BDC steals the next bus cycle for the access. If an operation requires multiple cycles, then multiple cycles can be stolen. Thus if stolen cycles are not free cycles, the application code execution is delayed. The delay is negligible because the BDC serial transfer rate dictates that such accesses occur infrequently. For data read commands, the external host must wait at least 16 BDCSI clock cycles after sending the address before attempting to obtain the read data. This is to be certain that valid data is available in the BDC shift register, ready to be shifted out. For write commands, the external host must wait 16 bdcsi cycles after sending the data to be written before attempting to send a new command. This is to avoid disturbing the BDC shift register before the write has been completed. The external host must wait at least for 16 bdcsi cycles after a control command before starting any new serial command. If the ACK pulse handshake protocol is enabled and STEAL is cleared, then the BDC waits for the first free bus cycle to make a non-intrusive access. If no free bus cycle occurs within 512 core clock cycles then the BDC aborts the access, sets the NORESP bit and uses a long ACK pulse to indicate an error condition to the host. MC9S12ZVC Family Reference Manual , Rev. 1.9 124 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) Table 3-8 summarizes the BDC command set. The subsequent sections describe each command in detail and illustrate the command structure in a series of packets, each consisting of eight bit times starting with a falling edge. The bar across the top of the blocks indicates that the BKGD line idles in the high state. The time for an 8-bit command is 8 16 target BDCSI clock cycles. The nomenclature below is used to describe the structure of the BDC commands. Commands begin with an 8-bit hexadecimal command code in the host-to-target direction (most significant bit first) / d dack ad24 rd8 rd16 rd24 rd32 rd64 rd.sz wd8 wd16 wd32 wd.sz ss sz = = = = = = = = = = = = = = = = crn WS = = separates parts of the command delay 16 target BDCSI clock cycles (DLY) delay (16 cycles) no ACK; or delay (=> 32 cycles) then ACK.(DACK) 24-bit memory address in the host-to-target direction 8 bits of read data in the target-to-host direction 16 bits of read data in the target-to-host direction 24 bits of read data in the target-to-host direction 32 bits of read data in the target-to-host direction 64 bits of read data in the target-to-host direction read data, size defined by sz, in the target-to-host direction 8 bits of write data in the host-to-target direction 16 bits of write data in the host-to-target direction 32 bits of write data in the host-to-target direction write data, size defined by sz, in the host-to-target direction the contents of BDCCSRL in the target-to-host direction memory operand size (00 = byte, 01 = word, 10 = long) (sz = 11 is reserved and currently defaults to long) core register number, 32-bit data width command suffix signaling the operation is with status Table 3-8. BDC Command Summary Command Mnemonic Command Classification ACK Command Structure Description SYNC Always Available N/A N/A1 Request a timed reference pulse to determine the target BDC communication speed ACK_DISABLE Always Available No 0x03/d Disable the communication handshake. This command does not issue an ACK pulse. ACK_ENABLE Always Available Yes 0x02/dack Enable the communication handshake. Issues an ACK pulse after the command is executed. BACKGROUND Non-Intrusive Yes 0x04/dack Halt the CPU if ENBDC is set. Otherwise, ignore as illegal command. DUMP_MEM.sz Non-Intrusive Yes (0x32+4 x sz)/dack/rd.sz Dump (read) memory based on operand size (sz). Used with READ_MEM to dump large blocks of memory. An initial READ_MEM is executed to set up the starting address of the block and to retrieve the first result. Subsequent DUMP_MEM commands retrieve sequential operands. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 125 Chapter 3 Background Debug Controller (S12ZBDCV2) Table 3-8. BDC Command Summary (continued) Command Mnemonic Command Classification ACK Command Structure DUMP_MEM.sz_WS Non-Intrusive No (0x33+4 x sz)/d/ss/rd.sz Dump (read) memory based on operand size (sz) and report status. Used with READ_MEM{_WS} to dump large blocks of memory. An initial READ_MEM{_WS} is executed to set up the starting address of the block and to retrieve the first result. Subsequent DUMP_MEM{_WS} commands retrieve sequential operands. FILL_MEM.sz Non-Intrusive Yes (0x12+4 x sz)/wd.sz/dack Fill (write) memory based on operand size (sz). Used with WRITE_MEM to fill large blocks of memory. An initial WRITE_MEM is executed to set up the starting address of the block and to write the first operand. Subsequent FILL_MEM commands write sequential operands. FILL_MEM.sz_WS Non-Intrusive No (0x13+4 x sz)/wd.sz/d/ss Fill (write) memory based on operand size (sz) and report status. Used with WRITE_MEM{_WS} to fill large blocks of memory. An initial WRITE_MEM{_WS} is executed to set up the starting address of the block and to write the first operand. Subsequent FILL_MEM{_WS} commands write sequential operands. GO Active Background Yes 0x08/dack Resume CPU user code execution GO_UNTIL2 Active Background Yes 0x0C/dack Go to user program. ACK is driven upon returning to active background mode. Non-Intrusive Yes 0x00/dack No operation Active Background Yes (0x60+CRN)/dack/rd32 READ_MEM.sz Non-Intrusive Yes (0x30+4 x sz)/ad24/dack/rd.sz Read the appropriately-sized (sz) memory value from the location specified by the 24-bit address READ_MEM.sz_WS Non-Intrusive No (0x31+4 x sz)/ad24/d/ss/rd.sz Read the appropriately-sized (sz) memory value from the location specified by the 24-bit address and report status READ_DBGTB Non-Intrusive Yes (0x07)/dack/rd32/dack/rd32 Read 64-bits of DBG trace buffer READ_SAME.sz Non-Intrusive Yes (0x50+4 x sz)/dack/rd.sz Read from location. An initial READ_MEM defines the address, subsequent READ_SAME reads return content of same address READ_SAME.sz_WS Non-Intrusive No (0x51+4 x sz)/d/ss/rd.sz Read from location. An initial READ_MEM defines the address, subsequent READ_SAME reads return content of same address Always Available No 0x2D/rd16 NOP READ_Rn READ_BDCCSR Description Read the requested CPU register Read the BDCCSR register MC9S12ZVC Family Reference Manual , Rev. 1.9 126 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) Table 3-8. BDC Command Summary (continued) Command Mnemonic Command Classification ACK Command Structure SYNC_PC Non-Intrusive Yes 0x01/dack/rd24 WRITE_MEM.sz Non-Intrusive Yes (0x10+4 x sz)/ad24/wd.sz/dack Write the appropriately-sized (sz) memory value to the location specified by the 24-bit address WRITE_MEM.sz_WS Non-Intrusive No (0x11+4 x sz)/ad24/wd.sz/d/ss Active Background Yes (0x40+CRN)/wd32/dack WRITE_BDCCSR Always Available No 0x0D/wd16 ERASE_FLASH Always Available No 0x95/d Active Background Yes 0x09/dack WRITE_Rn STEP1 (TRACE1) 1 2 Description Read current PC Write the appropriately-sized (sz) memory value to the location specified by the 24-bit address and report status Write the requested CPU register Write the BDCCSR register Mass erase internal flash Execute one CPU command. The SYNC command is a special operation which does not have a command code. The GO_UNTIL command is identical to the GO command if ACK is not enabled. 3.4.4.1 SYNC The SYNC command is unlike other BDC commands because the host does not necessarily know the correct speed to use for serial communications until after it has analyzed the response to the SYNC command. To issue a SYNC command, the host: 1. Ensures that the BKGD pin is high for at least 4 cycles of the slowest possible BDCSI clock without reset asserted. 2. Drives the BKGD pin low for at least 128 cycles of the slowest possible BDCSI clock. 3. Drives BKGD high for a brief speed-up pulse to get a fast rise time. (This speedup pulse is typically one cycle of the host clock which is as fast as the maximum target BDCSI clock). 4. Removes all drive to the BKGD pin so it reverts to high impedance. 5. Listens to the BKGD pin for the sync response pulse. Upon detecting the sync request from the host (which is a much longer low time than would ever occur during normal BDC communications), the target: 1. Discards any incomplete command 2. Waits for BKGD to return to a logic high. 3. Delays 16 cycles to allow the host to stop driving the high speed-up pulse. 4. Drives BKGD low for 128 BDCSI clock cycles. 5. Drives a 1-cycle high speed-up pulse to force a fast rise time on BKGD. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 127 Chapter 3 Background Debug Controller (S12ZBDCV2) 6. Removes all drive to the BKGD pin so it reverts to high impedance. 7. Clears the OVRRUN flag (if set). The host measures the low time of this 128-cycle SYNC response pulse and determines the correct speed for subsequent BDC communications. Typically, the host can determine the correct communication speed within a few percent of the actual target speed and the serial protocol can easily tolerate this speed error. If the SYNC request is detected by the target, any partially executed command is discarded. This is referred to as a soft-reset, equivalent to a timeout in the serial communication. After the SYNC response, the target interprets the next negative edge (issued by the host) as the start of a new BDC command or the start of new SYNC request. A SYNC command can also be used to abort a pending ACK pulse. This is explained in Section 3.4.8, "Hardware Handshake Abort Procedure. 3.4.4.2 ACK_DISABLE Disable host/target handshake protocol Always Available 0x03 host target D L Y Disables the serial communication handshake protocol. The subsequent commands, issued after the ACK_DISABLE command, do not execute the hardware handshake protocol. This command is not followed by an ACK pulse. 3.4.4.3 ACK_ENABLE Enable host/target handshake protocol Always Available 0x02 host target D A C K Enables the hardware handshake protocol in the serial communication. The hardware handshake is implemented by an acknowledge (ACK) pulse issued by the target MCU in response to a host command. The ACK_ENABLE command is interpreted and executed in the BDC logic without the need to interface with the CPU. An ACK pulse is issued by the target device after this command is executed. This command can be used by the host to evaluate if the target supports the hardware handshake protocol. If the target supports the hardware handshake protocol, subsequent commands are enabled to execute the hardware handshake protocol, otherwise this command is ignored by the target. Table 3-8 indicates which commands support the ACK hardware handshake protocol. MC9S12ZVC Family Reference Manual , Rev. 1.9 128 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) For additional information about the hardware handshake protocol, refer to Section 3.4.7, "Serial Interface Hardware Handshake (ACK Pulse) Protocol," and Section 3.4.8, "Hardware Handshake Abort Procedure." 3.4.4.4 BACKGROUND Enter active background mode (if enabled) Non-intrusive 0x04 host target D A C K Provided ENBDC is set, the BACKGROUND command causes the target MCU to enter active BDM as soon as the current CPU instruction finishes. If ENBDC is cleared, the BACKGROUND command is ignored. A delay of 16 BDCSI clock cycles is required after the BACKGROUND command to allow the target MCU to finish its current CPU instruction and enter active background mode before a new BDC command can be accepted. The host debugger must set ENBDC before attempting to send the BACKGROUND command the first time. Normally the host sets ENBDC once at the beginning of a debug session or after a target system reset. During debugging, the host uses GO commands to move from active BDM to application program execution and uses the BACKGROUND command or DBG breakpoints to return to active BDM. A BACKGROUND command issued during stop or wait modes cannot immediately force active BDM because the WAI instruction does not end until an interrupt occurs. For the detailed mode dependency description refer to Section 3.1.3.3, "Low-Power Modes. The host can recognize this pending BDM request condition because both NORESP and WAIT are set, but BDMACT is clear. Whilst in wait mode, with the pending BDM request, non-intrusive BDC commands are allowed. 3.4.4.5 DUMP_MEM.sz, DUMP_MEM.sz_WS DUMP_MEM.sz Read memory specified by debug address register, then increment address Data[7-0] 0x32 host target 0x36 Non-intrusive D A C K target host Data[15-8] Data[7-0] MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 129 Chapter 3 Background Debug Controller (S12ZBDCV2) DUMP_MEM.sz host target D A C K 0x3A host target target host target host Data[31-24] D A C K Data[23-16] Data[15-8] Data[7-0] target host target host target host target host DUMP_MEM.sz_WS Read memory specified by debug address register with status, then increment address BDCCSRL 0x33 host target D L Y BDCCSRL 0x37 host target D L Y D L Y Data[7-0] target host Data[15-8] target host target host BDCCSRL 0x3B host target target host Non-intrusive Data[31-24] Data[7-0] target host Data23-16] Data[15-8] target host target host target host target host Data[7-0] target host DUMP_MEM{_WS} is used with the READ_MEM{_WS} command to access large blocks of memory. An initial READ_MEM{_WS} is executed to set-up the starting address of the block and to retrieve the first result. The DUMP_MEM{_WS} command retrieves subsequent operands. The initial address is incremented by the operand size (1, 2, or 4) and saved in a temporary register. Subsequent DUMP_MEM{_WS} commands use this address, perform the memory read, increment it by the current operand size, and store the updated address in the temporary register. If the with-status option is specified, the BDCCSRL status byte is returned before the read data. This status byte reflects the state after the memory read was performed. If enabled, an ACK pulse is driven before the data bytes are transmitted. The effect of the access size and alignment on the next address to be accessed is explained in more detail in Section 3.4.5.2, "BDC Access Of Device Memory Mapped Resources". NOTE DUMP_MEM{_WS} is a valid command only when preceded by SYNC, NOP, READ_MEM{_WS}, or another DUMP_MEM{_WS} command. Otherwise, an illegal command response is returned, setting the ILLCMD bit. NOP can be used for inter-command padding without corrupting the address pointer. MC9S12ZVC Family Reference Manual , Rev. 1.9 130 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) The size field (sz) is examined each time a DUMP_MEM{_WS} command is processed, allowing the operand size to be dynamically altered. The examples show the DUMP_MEM.B{_WS}, DUMP_MEM.W{_WS} and DUMP_MEM.L{_WS} commands. 3.4.4.6 FILL_MEM.sz, FILL_MEM.sz_WS FILL_MEM.sz Write memory specified by debug address register, then increment address 0x12 Data[7-0] host target host target 0x16 D A C K Data[15-8] Data[7-0] host target host target host target 0x1A Non-intrusive Data[31-24] D A C K Data[23-16] Data[15-8] Data[7-0] host target host target host target host target host target D A C K FILL_MEM.sz_WS Write memory specified by debug address register with status, then increment address 0x13 0x17 BDCCSRL Data[7-0] host target host target Data[15-8] D L Y target host Data[7-0] host target host target host target 0x1B Data[31-24] Non-intrusive Data[23-16] BDCCSRL D L Y target host Data[15-8] Data[7-0] host target host target host target host target host target BDCCSRL D L Y target host FILL_MEM{_WS} is used with the WRITE_MEM{_WS} command to access large blocks of memory. An initial WRITE_MEM{_WS} is executed to set up the starting address of the block and write the first datum. If an initial WRITE_MEM{_WS} is not executed before the first FILL_MEM{_WS}, an illegal command response is returned. The FILL_MEM{_WS} command stores subsequent operands. The initial address is incremented by the operand size (1, 2, or 4) and saved in a temporary register. Subsequent FILL_MEM{_WS} commands use this address, perform the memory write, increment it by the current MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 131 Chapter 3 Background Debug Controller (S12ZBDCV2) operand size, and store the updated address in the temporary register. If the with-status option is specified, the BDCCSRL status byte is returned after the write data. This status byte reflects the state after the memory write was performed. If enabled an ACK pulse is generated after the internal write access has been completed or aborted. The effect of the access size and alignment on the next address to be accessed is explained in more detail in Section 3.4.5.2, "BDC Access Of Device Memory Mapped Resources" NOTE FILL_MEM{_WS} is a valid command only when preceded by SYNC, NOP, WRITE_MEM{_WS}, or another FILL_MEM{_WS} command. Otherwise, an illegal command response is returned, setting the ILLCMD bit. NOP can be used for inter command padding without corrupting the address pointer. The size field (sz) is examined each time a FILL_MEM{_WS} command is processed, allowing the operand size to be dynamically altered. The examples show the FILL_MEM.B{_WS}, FILL_MEM.W{_WS} and FILL_MEM.L{_WS} commands. 3.4.4.7 GO Go Non-intrusive 0x08 host target D A C K This command is used to exit active BDM and begin (or resume) execution of CPU application code. The CPU pipeline is flushed and refilled before normal instruction execution resumes. Prefetching begins at the current address in the PC. If any register (such as the PC) is altered by a BDC command whilst in BDM, the updated value is used when prefetching resumes. If enabled, an ACK is driven on exiting active BDM. If a GO command is issued whilst the BDM is inactive, an illegal command response is returned and the ILLCMD bit is set. 3.4.4.8 GO_UNTIL Go Until Active Background 0x0C host target D A C K This command is used to exit active BDM and begin (or resume) execution of application code. The CPU pipeline is flushed and refilled before normal instruction execution resumes. Prefetching begins at the current address in the PC. If any register (such as the PC) is altered by a BDC command whilst in BDM, the updated value is used when prefetching resumes. MC9S12ZVC Family Reference Manual , Rev. 1.9 132 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) After resuming application code execution, if ACK is enabled, the BDC awaits a return to active BDM before driving an ACK pulse. timeouts do not apply when awaiting a GO_UNTIL command ACK. If a GO_UNTIL is not acknowledged then a SYNC command must be issued to end the pending GO_UNTIL. If a GO_UNTIL command is issued whilst BDM is inactive, an illegal command response is returned and the ILLCMD bit is set. If ACK handshaking is disabled, the GO_UNTIL command is identical to the GO command. 3.4.4.9 NOP No operation Active Background 0x00 host target D A C K NOP performs no operation and may be used as a null command where required. 3.4.4.10 READ_Rn Read CPU register Active Background Data [31-24] 0x60+CRN host target D A C K Data [23-16] Data [15-8] Data [7-0] target host target host target host target host This command reads the selected CPU registers and returns the 32-bit result. Accesses to CPU registers are always 32-bits wide, regardless of implemented register width. Bytes that are not implemented return zero. The register is addressed through the CPU register number (CRN). See Section 3.4.5.1, "BDC Access Of CPU Registers for the CRN address decoding. If enabled, an ACK pulse is driven before the data bytes are transmitted. If the device is not in active BDM, this command is illegal, the ILLCMD bit is set and no access is performed. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 133 Chapter 3 Background Debug Controller (S12ZBDCV2) 3.4.4.11 READ_MEM.sz, READ_MEM.sz_WS READ_MEM.sz Read memory at the specified address 0x30 Address[23-0] host target host target 0x34 Address[23-0] host target host target 0x38 Address[23-0] host target host target Non-intrusive Data[7-0] D A C K target host Data[15-8] D A C K target host target host Data[31-24] D A C K Data[7-0] Data[23-16] Data[15-8] Data[7-0] target host target host target host target host READ_MEM.sz_WS Read memory at the specified address with status 0x31 Address[23-0] host target host target 0x35 Address[23-0] host target host target 0x39 Address[23-0] host target host target Non-intrusive BDCCSRL D L Y target host BDCCSRL D L Y target host Data [15-8] target host target host BDCCSRL D L Y Data[7-0] Data[31-24] Data [7-0] target host Data[23-16] Data [15-8] target host target host target host target host Data [7-0] target host Read data at the specified memory address. The address is transmitted as three 8-bit packets (msb to lsb) immediately after the command. The hardware forces low-order address bits to zero longword accesses to ensure these accesses are on 0-modulo-size alignments. Byte alignment details are described in Section 3.4.5.2, "BDC Access Of Device Memory Mapped Resources". If the with-status option is specified, the BDCCSR status byte is returned before the read data. This status byte reflects the state after the memory read was performed. If enabled, an ACK pulse is driven before the data bytes are transmitted. The examples show the READ_MEM.B{_WS}, READ_MEM.W{_WS} and READ_MEM.L{_WS} commands. MC9S12ZVC Family Reference Manual , Rev. 1.9 134 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) 3.4.4.12 READ_DBGTB Read DBG trace buffer TB Line [31-24] 0x07 host target Non-intrusive D A C K TB Line [23-16] TB Line [15-8] TB Line [7-0] TB Line [63-56] target host target host target host target host D A C K TB Line [55-48] TB Line [47-40] TB Line [39-32] target host target host target host target host This command is only available on devices, where the DBG module includes a trace buffer. Attempted use of this command on devices without a traace buffer return 0x00. Read 64 bits from the DBG trace buffer. Refer to the DBG module description for more detailed information. If enabled an ACK pulse is generated before each 32-bit longword is ready to be read by the host. After issuing the first ACK a timeout is still possible whilst accessing the second 32-bit longword, since this requires separate internal accesses. The first 32-bit longword corresponds to trace buffer line bits[31:0]; the second to trace buffer line bits[63:32]. If ACK handshaking is disabled, the host must wait 16 clock cycles (DLY) after completing the first 32-bit read before starting the second 32-bit read. 3.4.4.13 READ_SAME.sz, READ_SAME.sz_WS READ_SAME Read same location specified by previous READ_MEM{_WS} Data[15-8] 0x54 host target D A C K Non-intrusive Data[7-0] target host target host READ_SAME_WS Read same location specified by previous READ_MEM{_WS} BDCCSRL 0x55 host target D L Y Data [15-8] target host target host Non-intrusive Data [7-0] target host Read from location defined by the previous READ_MEM. The previous READ_MEM command defines the address, subsequent READ_SAME commands return contents of same address. The example shows the sequence for reading a 16-bit word size. Byte alignment details are described in Section 3.4.5.2, "BDC Access Of Device Memory Mapped Resources". If enabled, an ACK pulse is driven before the data bytes are transmitted. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 135 Chapter 3 Background Debug Controller (S12ZBDCV2) NOTE READ_SAME{_WS} is a valid command only when preceded by SYNC, NOP, READ_MEM{_WS}, or another READ_SAME{_WS} command. Otherwise, an illegal command response is returned, setting the ILLCMD bit. NOP can be used for inter-command padding without corrupting the address pointer. 3.4.4.14 READ_BDCCSR Read BDCCSR Status Register 0x2D D L Y host target Always Available BDCCSR [15:8] BDCCSR [7-0] target host target host Read the BDCCSR status register. This command can be executed in any mode. 3.4.4.15 SYNC_PC Sample current PC Non-intrusive 0x01 host target D A C K PC data[23-16] PC data[15-8] PC data[7-0] target host target host target host This command returns the 24-bit CPU PC value to the host. Unsuccessful SYNC_PC accesses return 0xEE for each byte. If enabled, an ACK pulse is driven before the data bytes are transmitted. The value of 0xEE is returned if a timeout occurs, whereby NORESP is set. This can occur if the CPU is executing the WAI instruction, or the STOP instruction with BDCCIS clear, or if a CPU access is delayed by EWAIT. If the CPU is executing the STOP instruction and BDCCIS is set, then SYNC_PC returns the PC address of the instruction following STOP in the code listing. This command can be used to dynamically access the PC for performance monitoring as the execution of this command is considerably less intrusive to the real-time operation of an application than a BACKGROUND/read-PC/GO command sequence. Whilst the BDC is not in active BDM, SYNC_PC returns the PC address of the instruction currently being executed by the CPU. In active BDM, SYNC_PC returns the address of the next instruction to be executed on returning from active BDM. Thus following a write to the PC in active BDM, a SYNC_PC returns that written value. MC9S12ZVC Family Reference Manual , Rev. 1.9 136 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) 3.4.4.16 WRITE_MEM.sz, WRITE_MEM.sz_WS WRITE_MEM.sz Write memory at the specified address Non-intrusive 0x10 Address[23-0] Data[7-0] host target host target host target 0x14 Address[23-0] Data[15-8] host target host target host target host target 0x18 Address[23-0] Data[31-24] host target host target host target host target host target host target D A C K Data[7-0] Data[23-16] D A C K Data[15-8] Data[7-0] D A C K WRITE_MEM.sz_WS Write memory at the specified address with status Non-intrusive 0x11 Address[23-0] Data[7-0] host target host target host target 0x15 Address[23-0] Data[15-8] host target host target 0x19 Address[23-0] host target host target BDCCSRL D L Y target host Data[7-0] host target host target Data[31-24] Data[23-16] BDCCSRL D L Y target host Data[15-8] Data[7-0] host target host target host target host target BDCCSRL D L Y target host Write data to the specified memory address. The address is transmitted as three 8-bit packets (msb to lsb) immediately after the command. If the with-status option is specified, the status byte contained in BDCCSRL is returned after the write data. This status byte reflects the state after the memory write was performed. The examples show the WRITE_MEM.B{_WS}, WRITE_MEM.W{_WS}, and WRITE_MEM.L{_WS} commands. If enabled an ACK pulse is generated after the internal write access has been completed or aborted. The hardware forces low-order address bits to zero longword accesses to ensure these accesses are on 0-modulo-size alignments. Byte alignment details are described in Section 3.4.5.2, "BDC Access Of Device Memory Mapped Resources". MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 137 Chapter 3 Background Debug Controller (S12ZBDCV2) 3.4.4.17 WRITE_Rn Write general-purpose CPU register 0x40+CRN Data [31-24] Data [23-16] Active Background Data [15-8] Data [7-0] host target host target host target host target host target D A C K If the device is in active BDM, this command writes the 32-bit operand to the selected CPU general-purpose register. See Section 3.4.5.1, "BDC Access Of CPU Registers for the CRN details. Accesses to CPU registers are always 32-bits wide, regardless of implemented register width. If enabled an ACK pulse is generated after the internal write access has been completed or aborted. If the device is not in active BDM, this command is rejected as an illegal operation, the ILLCMD bit is set and no operation is performed. 3.4.4.18 WRITE_BDCCSR Write BDCCSR Always Available BDCCSR Data [15-8] 0x0D host target D L Y BDCCSR Data [7-0] host target host target 16-bit write to the BDCCSR register. No ACK pulse is generated. Writing to this register can be used to configure control bits or clear flag bits. Refer to the register bit descriptions. 3.4.4.19 ERASE_FLASH Erase FLASH Always Available 0x95 host target D L Y Mass erase the internal flash. This command can always be issued. On receiving this command twice in succession, the BDC sets the ERASE bit in BDCCSR and requests a flash mass erase. Any other BDC command following a single ERASE_FLASH initializes the sequence, such that thereafter the ERASE_FLASH must be applied twice in succession to request a mass erase. If 512 BDCSI clock cycles elapse between the consecutive ERASE_FLASH commands then a timeout occurs, which forces a soft reset and initializes the sequence. The ERASE bit is cleared when the mass erase sequence has been completed. No ACK is driven. MC9S12ZVC Family Reference Manual , Rev. 1.9 138 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) During the mass erase operation, which takes many clock cycles, the command status is indicated by the ERASE bit in BDCCSR. Whilst a mass erase operation is ongoing, Always-available commands can be issued. This allows the status of the erase operation to be polled by reading BDCCSR to determine when the operation is finished. The status of the flash array can be verified by subsequently reading the flash error flags to determine if the erase completed successfully. ERASE_FLASH can be aborted by a SYNC pulse forcing a soft reset. NOTE: Device Bus Frequency Considerations The ERASE_FLASH command requires the default device bus clock frequency after reset. Thus the bus clock frequency must not be changed following reset before issuing an ERASE_FLASH command. 3.4.4.20 STEP1 Step1 Active Background 0x09 host target D A C K This command is used to step through application code. In active BDM this command executes the next CPU instruction in application code. If enabled an ACK is driven. If a STEP1 command is issued and the CPU is not halted, the command is ignored. Using STEP1 to step through a CPU WAI instruction is explained in Section 3.1.3.3.2, "Wait Mode. 3.4.5 BDC Access Of Internal Resources Unsuccessful read accesses of internal resources return a value of 0xEE for each data byte. This enables a debugger to recognize a potential error, even if neither the ACK handshaking protocol nor a status command is currently being executed. The value of 0xEE is returned in the following cases. * Illegal address access, whereby ILLACC is set * Invalid READ_SAME or DUMP_MEM sequence * Invalid READ_Rn command (BDM inactive or CRN incorrect) * Internal resource read with timeout, whereby NORESP is set 3.4.5.1 BDC Access Of CPU Registers The CRN field of the READ_Rn and WRITE_Rn commands contains a pointer to the CPU registers. The mapping of CRN to CPU registers is shown in Table 3-9. Accesses to CPU registers are always 32-bits wide, regardless of implemented register width. This means that the BDC data transmission for these MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 139 Chapter 3 Background Debug Controller (S12ZBDCV2) commands is 32-bits long. The valid bits of the transfer are listed in the Valid Data Bits column. The other bits of the transmission are redundant. Attempted accesses of CPU registers using a CRN of 0xD,0xE or 0xF is invalid, returning the value 0xEE for each byte and setting the ILLACC bit. Table 3-9. CPU Register Number (CRN) Mapping CPU Register Valid Data Bits Command Opcode Command Opcode D0 [7:0] WRITE_D0 0x40 READ_D0 0x60 D1 [7:0] WRITE_D1 0x41 READ_D1 0x61 D2 [15:0] WRITE_D2 0x42 READ_D2 0x62 D3 [15:0] WRITE_D3 0x43 READ_D3 0x63 D4 [15:0] WRITE_D4 0x44 READ_D4 0x64 D5 [15:0] WRITE_D5 0x45 READ_D5 0x65 D6 [31:0] WRITE_D6 0x46 READ_D6 0x66 D7 [31:0] WRITE_D7 0x47 READ_D7 0x67 X [23:0] WRITE_X 0x48 READ_X 0x68 3.4.5.2 Y [23:0] WRITE_Y 0x49 READ_Y 0x69 SP [23:0] WRITE_SP 0x4A READ_SP 0x6A PC [23:0] WRITE_PC 0x4B READ_PC 0x6B CCR [15:0] WRITE_CCR 0x4C READ_CCR 0x6C BDC Access Of Device Memory Mapped Resources The device memory map is accessed using READ_MEM, DUMP_MEM, WRITE_MEM, FILL_MEM and READ_SAME, which support different access sizes, as explained in the command descriptions. When an unimplemented command occurs during a DUMP_MEM, FILL_MEM or READ_SAME sequence, then that sequence is ended. Illegal read accesses return a value of 0xEE for each byte. After an illegal access FILL_MEM and READ_SAME commands are not valid, and it is necessary to restart the internal access sequence with READ_MEM or WRITE_MEM. An illegal access does not break a DUMP_MEM sequence. After read accesses that cause the RDINV bit to be set, DUMP_MEM and READ_SAME commands are valid, it is not necessary to restart the access sequence with a READ_MEM. The hardware forces low-order address bits to zero for longword accesses to ensure these accesses are realigned to 0-modulo-size alignments. Word accesses map to 2-bytes from within a 4-byte field as shown in Table 3-10. Thus if address bits [1:0] are both logic "1" the access is realigned so that it does not straddle the 4-byte boundary but accesses data from within the addressed 4-byte field. MC9S12ZVC Family Reference Manual , Rev. 1.9 140 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) Table 3-10. Field Location to Byte Access Mapping Address[1:0] Access Size 00 01 10 11 00 32-bit Data[31:24] Data[23:16] Data [15:8] Data [7:0] 01 32-bit Data[31:24] Data[23:16] Data [15:8] Data [7:0] Realigned 10 32-bit Data[31:24] Data[23:16] Data [15:8] Data [7:0] Realigned 11 32-bit Data[31:24] Data[23:16] Data [15:8] Data [7:0] Realigned 00 16-bit Data [15:8] Data [7:0] 01 16-bit 10 16-bit Data [15:8] Data [7:0] 11 16-bit Data [15:8] Data [7:0] 00 8-bit 01 8-bit 10 8-bit 11 8-bit Data [15:8] Note Data [7:0] Realigned Data [7:0] Data [7:0] Data [7:0] Data [7:0] Denotes byte that is not transmitted 3.4.5.2.1 FILL_MEM and DUMP_MEM Increments and Alignment FILL_MEM and DUMP_MEM increment the previously accessed address by the previous access size to calculate the address of the current access. On misaligned longword accesses, the address bits [1:0] are forced to zero, therefore the following FILL_MEM or DUMP_MEM increment to the first address in the next 4-byte field. This is shown in Table 3-11, the address of the first DUMP_MEM.32 following READ_MEM.32 being calculated from 0x004000+4. When misaligned word accesses are realigned, then the original address (not the realigned address) is incremented for the following FILL_MEM, DUMP_MEM command. Misaligned word accesses can cause the same locations to be read twice as shown in rows 6 and 7. The hardware ensures alignment at an attempted misaligned word access across a 4-byte boundary, as shown in row 7. The following word access in row 8 continues from the realigned address of row 7. d Table 3-11. Consecutive Accesses With Variable Size Row Command Address Address[1:0] 00 01 10 11 1 READ_MEM.32 0x004003 11 Accessed Accessed Accessed Accessed 2 DUMP_MEM.32 0x004004 00 Accessed Accessed Accessed Accessed 3 DUMP_MEM.16 0x004008 00 Accessed Accessed Accessed Accessed 4 DUMP_MEM.16 0x00400A 10 5 DUMP_MEM.08 0x00400C 00 6 DUMP_MEM.16 0x00400D 01 7 DUMP_MEM.16 0x00400E 10 8 DUMP_MEM.16 0x004010 01 Accessed Accessed Accessed Accessed Accessed Accessed Accessed MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 141 Chapter 3 Background Debug Controller (S12ZBDCV2) 3.4.5.2.2 READ_SAME Effects Of Variable Access Size READ_SAME uses the unadjusted address given in the previous READ_MEM command as a base address for subsequent READ_SAME commands. When the READ_MEM and READ_SAME size parameters differ then READ_SAME uses the original base address buts aligns 32-bit and 16-bit accesses, where those accesses would otherwise cross the aligned 4-byte boundary. Table 3-12 shows some examples of this. d Table 3-12. Consecutive READ_SAME Accesses With Variable Size Row 3.4.6 Command Base Address 00 01 10 11 1 READ_MEM.32 0x004003 Accessed Accessed Accessed Accessed 2 READ_SAME.32 -- Accessed Accessed Accessed Accessed 3 READ_SAME.16 -- Accessed Accessed 4 READ_SAME.08 -- 5 READ_MEM.08 0x004000 Accessed 6 READ_SAME.08 -- Accessed 7 READ_SAME.16 -- Accessed Accessed 8 READ_SAME.32 -- Accessed Accessed Accessed Accessed Accessed 9 READ_MEM.08 0x004002 Accessed 10 READ_SAME.08 -- Accessed 11 READ_SAME.16 -- Accessed Accessed 12 READ_SAME.32 -- Accessed Accessed 13 READ_MEM.08 0x004003 Accessed 14 READ_SAME.08 -- Accessed 15 READ_SAME.16 -- 16 READ_SAME.32 -- Accessed Accessed Accessed Accessed Accessed Accessed Accessed Accessed Accessed 17 READ_MEM.16 0x004001 Accessed 18 READ_SAME.08 -- Accessed 19 READ_SAME.16 -- Accessed Accessed 20 READ_SAME.32 -- Accessed Accessed 21 READ_MEM.16 0x004003 22 READ_SAME.08 -- 23 READ_SAME.16 -- 24 READ_SAME.32 -- Accessed Accessed Accessed Accessed Accessed Accessed Accessed Accessed Accessed Accessed Accessed BDC Serial Interface The BDC communicates with external devices serially via the BKGD pin. During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the BDC. The BDC serial interface uses an internal clock source, selected by the CLKSW bit in the BDCCSR register. This clock is referred to as the target clock in the following explanation. MC9S12ZVC Family Reference Manual , Rev. 1.9 142 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) The BDC serial interface uses a clocking scheme in which the external host generates a falling edge on the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is transmitted or received. Data is transferred most significant bit (MSB) first at 16 target clock cycles per bit. The interface times out if during a command 512 clock cycles occur between falling edges from the host. The timeout forces the current command to be discarded. The BKGD pin is a pseudo open-drain pin and has a weak on-chip active pull-up that is enabled at all times. It is assumed that there is an external pull-up and that drivers connected to BKGD do not typically drive the high level. Since R-C rise time could be unacceptably long, the target system and host provide brief drive-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host for transmit cases and the target for receive cases. The timing for host-to-target is shown in Figure 3-6 and that of target-to-host in Figure 3-7 and Figure 3-8. All cases begin when the host drives the BKGD pin low to generate a falling edge. Since the host and target operate from separate clocks, it can take the target up to one full clock cycle to recognize this edge; this synchronization uncertainty is illustrated in Figure 3-6. The target measures delays from this perceived start of the bit time while the host measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle earlier. Synchronization between the host and target is established in this manner at the start of every bit time. Figure 3-6 shows an external host transmitting a logic 1 and transmitting a logic 0 to the BKGD pin of a target system. The host is asynchronous to the target, so there is up to a one clock-cycle delay from the host-generated falling edge to where the target recognizes this edge as the beginning of the bit time. Ten target clock cycles later, the target senses the bit level on the BKGD pin. Internal glitch detect logic requires the pin be driven high no later than eight target clock cycles after the falling edge for a logic 1 transmission. Since the host drives the high speedup pulses in these two cases, the rising edges look like digitally driven signals. BDCSI clock (TARGET MCU) HOST TRANSMIT 1 HOST TRANSMIT 0 10 CYCLES SYNCHRONIZATION UNCERTAINTY EARLIEST START OF NEXT BIT TARGET SENSES BIT LEVEL PERCEIVED START OF BIT TIME Figure 3-6. BDC Host-to-Target Serial Bit Timing Figure 3-7 shows the host receiving a logic 1 from the target system. The host holds the BKGD pin low long enough for the target to recognize it (at least two target clock cycles). The host must release the low MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 143 Chapter 3 Background Debug Controller (S12ZBDCV2) drive at the latest after 6 clock cycles, before the target drives a brief high speedup pulse seven target clock cycles after the perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it started the bit time. BDCSI clock (TARGET MCU) HOST DRIVE TO BKGD PIN TARGET MCU SPEEDUP PULSE HIGH-IMPEDANCE HIGH-IMPEDANCE HIGH-IMPEDANCE PERCEIVED START OF BIT TIME R-C RISE BKGD PIN 10 CYCLES 10 CYCLES EARLIEST START OF NEXT BIT HOST SAMPLES BKGD PIN Figure 3-7. BDC Target-to-Host Serial Bit Timing (Logic 1) Figure 3-8 shows the host receiving a logic 0 from the target. The host initiates the bit time but the target finishes it. Since the target wants the host to receive a logic 0, it drives the BKGD pin low for 13 target clock cycles then briefly drives it high to speed up the rising edge. The host samples the bit level about 10 target clock cycles after starting the bit time. MC9S12ZVC Family Reference Manual , Rev. 1.9 144 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) BDCSI clock (TARGET MCU) HOST DRIVE TO BKGD PIN HIGH-IMPEDANCE SPEEDUP PULSE TARGET MCU DRIVE AND SPEED-UP PULSE PERCEIVED START OF BIT TIME BKGD PIN 10 CYCLES EARLIEST START OF NEXT BIT 10 CYCLES HOST SAMPLES BKGD PIN Figure 3-8. BDC Target-to-Host Serial Bit Timing (Logic 0) 3.4.7 Serial Interface Hardware Handshake (ACK Pulse) Protocol BDC commands are processed internally at the device core clock rate. Since the BDCSI clock can be asynchronous relative to the bus frequency, a handshake protocol is provided so the host can determine when an issued command has been executed. This section describes the hardware handshake protocol. The hardware handshake protocol signals to the host controller when a BDC command has been executed by the target. This protocol is implemented by a low pulse (16 BDCSI clock cycles) followed by a brief speedup pulse on the BKGD pin, generated by the target MCU when a command, issued by the host, has been successfully executed (see Figure 3-9). This pulse is referred to as the ACK pulse. After the ACK pulse has finished, the host can start the bit retrieval if the last issued command was a read command, or start a new command if the last command was a write command or a control command. BDCSI clock (TARGET MCU) TARGET TRANSMITS ACK PULSE HIGH-IMPEDANCE 16 CYCLES HIGH-IMPEDANCE 32 CYCLES SPEED UP PULSE MINIMUM DELAY FROM THE BDC COMMAND BKGD PIN EARLIEST START OF NEXT BIT 16th CYCLE OF THE LAST COMMAND BIT Figure 3-9. Target Acknowledge Pulse (ACK) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 145 Chapter 3 Background Debug Controller (S12ZBDCV2) The handshake protocol is enabled by the ACK_ENABLE command. The BDC sends an ACK pulse when the ACK_ENABLE command has been completed. This feature can be used by the host to evaluate if the target supports the hardware handshake protocol. If an ACK pulse is issued in response to this command, the host knows that the target supports the hardware handshake protocol. Unlike the normal bit transfer, where the host initiates the transmission by issuing a negative edge on the BKGD pin, the serial interface ACK handshake pulse is initiated by the target MCU by issuing a negative edge on the BKGD pin. Figure 3-9 specifies the timing when the BKGD pin is being driven. The host must follow this timing constraint in order to avoid the risk of an electrical conflict at the BKGD pin. When the handshake protocol is enabled, the STEAL bit in BDCCSR selects if bus cycle stealing is used to gain immediate access. If STEAL is cleared, the BDC is configured for low priority bus access using free cycles, without stealing cycles. This guarantees that BDC accesses remain truly non-intrusive to not affect the system timing during debugging. If STEAL is set, the BDC gains immediate access, if necessary stealing an internal bus cycle. NOTE If bus steals are disabled then a loop with no free cycles cannot allow access. In this case the host must recognize repeated NORESP messages and then issue a BACKGROUND command to stop the target and access the data. Figure 3-10 shows the ACK handshake protocol without steal in a command level timing diagram. The READ_MEM.B command is used as an example. First, the 8-bit command code is sent by the host, followed by the address of the memory location to be read. The target BDC decodes the command. Then an internal access is requested by the BDC. When a free bus cycle occurs the READ_MEM.B operation is carried out. If no free cycle occurs within 512 core clock cycles then the access is aborted, the NORESP flag is set and the target generates a Long-ACK pulse. Having retrieved the data, the BDC issues an ACK pulse to the host controller, indicating that the addressed byte is ready to be retrieved. After detecting the ACK pulse, the host initiates the data read part of the command. TARGET BKGD PIN READ_MEM.B HOST ADDRESS[23-0] HOST BYTE IS RETRIEVED TARGET NEW BDC COMMAND HOST TARGET BDC ISSUES THE ACK PULSE (NOT TO SCALE) BDC DECODES THE COMMAND MCU EXECUTES THE READ_MEM.B COMMAND Figure 3-10. Handshake Protocol at Command Level Alternatively, setting the STEAL bit configures the handshake protocol to make an immediate internal access, independent of free bus cycles. MC9S12ZVC Family Reference Manual , Rev. 1.9 146 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) The ACK handshake protocol does not support nested ACK pulses. If a BDC command is not acknowledged by an ACK pulse, the host needs to abort the pending command first in order to be able to issue a new BDC command. The host can decide to abort any possible pending ACK pulse in order to be sure a new command can be issued. Therefore, the protocol provides a mechanism in which a command, and its corresponding ACK, can be aborted. Commands With-Status do not generate an ACK, thus if ACK is enabled and a With-Status command is issued, the host must use the 512 cycle timeout to calculate when the data is ready for retrieval. 3.4.7.1 Long-ACK Hardware Handshake Protocol If a command results in an error condition, whereby a BDCCSRL flag is set, then the target generates a "Long-ACK" low pulse of 64 BDCSI clock cycles, followed by a brief speed pulse. This indicates to the host that an error has occurred. The host can subsequently read BDCCSR to determine the type of error. Whether normal ACK or Long-ACK, the ACK pulse is not issued earlier than 32 BDCSI clock cycles after the BDC command was issued. The end of the BDC command is assumed to be the 16th BDCSI clock cycle of the last bit. The 32 cycle minimum delay differs from the 16 cycle delay time with ACK disabled. If a BDC access request does not gain access within 512 core clock cycles, the request is aborted, the NORESP flag is set and a Long-ACK pulse is transmitted to indicate an error case. Following a STOP or WAI instruction, if the BDC is enabled, the first ACK, following stop or wait mode entry is a long ACK to indicate an exception. 3.4.8 Hardware Handshake Abort Procedure The abort procedure is based on the SYNC command. To abort a command that has not responded with an ACK pulse, the host controller generates a sync request (by driving BKGD low for at least 128 BDCSI clock cycles and then driving it high for one BDCSI clock cycle as a speedup pulse). By detecting this long low pulse in the BKGD pin, the target executes the SYNC protocol, see Section 3.4.4.1, "SYNC", and assumes that the pending command and therefore the related ACK pulse are being aborted. After the SYNC protocol has been completed the host is free to issue new BDC commands. The host can issue a SYNC close to the 128 clock cycles length, providing a small overhead on the pulse length to assure the sync pulse is not misinterpreted by the target. See Section 3.4.4.1, "SYNC". Figure 3-11 shows a SYNC command being issued after a READ_MEM, which aborts the READ_MEM command. Note that, after the command is aborted a new command is issued by the host. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 147 Chapter 3 Background Debug Controller (S12ZBDCV2) READ_MEM.B CMD IS ABORTED BY THE SYNC REQUEST (NOT TO SCALE) BKGD PIN READ_MEM.B HOST ADDRESS[23-0] SYNC RESPONSE FROM THE TARGET (NOT TO SCALE) READ_BDCCSR TARGET HOST TARGET NEW BDC COMMAND HOST TARGET NEW BDC COMMAND BDC DECODES AND TRYS TO EXECUTE Figure 3-11. ACK Abort Procedure at the Command Level (Not To Scale) Figure 3-12 shows a conflict between the ACK pulse and the SYNC request pulse. The target is executing a pending BDC command at the exact moment the host is being connected to the BKGD pin. In this case, an ACK pulse is issued simultaneously to the SYNC command. Thus there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. As this is not a probable situation, the protocol does not prevent this conflict from happening. AT LEAST 128 CYCLES BDCSI clock (TARGET MCU) TARGET MCU DRIVES TO BKGD PIN ACK PULSE HIGH-IMPEDANCE ELECTRICAL CONFLICT HOST DRIVES SYNC TO BKGD PIN HOST AND TARGET DRIVE TO BKGD PIN SPEEDUP PULSE HOST SYNC REQUEST PULSE BKGD PIN 16 CYCLES Figure 3-12. ACK Pulse and SYNC Request Conflict 3.4.9 Hardware Handshake Disabled (ACK Pulse Disabled) The default state of the BDC after reset is hardware handshake protocol disabled. It can also be disabled by the ACK_DISABLE BDC command. This provides backwards compatibility with the existing host devices which are not able to execute the hardware handshake protocol. For host devices that support the hardware handshake protocol, true non-intrusive debugging and error flagging is offered. If the ACK pulse protocol is disabled, the host needs to use the worst case delay time at the appropriate places in the protocol. MC9S12ZVC Family Reference Manual , Rev. 1.9 148 NXP Semiconductors Chapter 3 Background Debug Controller (S12ZBDCV2) If the handshake protocol is disabled, the access is always independent of free cycles, whereby BDC has higher priority than CPU. Since at least 2 bytes (command byte + data byte) are transferred over BKGD the maximum intrusiveness is only once every few hundred cycles. After decoding an internal access command, the BDC then awaits the next internal core clock cycle. The relationship between BDCSI clock and core clock must be considered. If the host retrieves the data immediately, then the BDCSI clock frequency must not be more than 4 times the core clock frequency, in order to guarantee that the BDC gains bus access within 16 the BDCSI cycle DLY period following an access command. If the BDCSI clock frequency is more than 4 times the core clock frequency, then the host must use a suitable delay time before retrieving data (see 3.5.1/3-150). Furthermore, for stretched read accesses to external resources via a device expanded bus (if implemented) the potential extra stretch cycles must be taken into consideration before attempting to obtain read data. If the access does not succeed before the host starts data retrieval then the NORESP flag is set but the access is not aborted. The NORESP state can be used by the host to recognize an unexpected access conflict due to stretched expanded bus accesses. Although the NORESP bit is set when an access does not succeed before the start of data retrieval, the access may succeed in following bus cycles if the internal access has already been initiated. 3.4.10 Single Stepping When a STEP1 command is issued to the BDC in active BDM, the CPU executes a single instruction in the user code and returns to active BDM. The STEP1 command can be issued repeatedly to step through the user code one instruction at a time. If an interrupt is pending when a STEP1 command is issued, the interrupt stacking operation occurs but no user instruction is executed. In this case the stacking counts as one instruction. The device re-enters active BDM with the program counter pointing to the first instruction in the interrupt service routine. When stepping through the user code, the execution of the user code is done step by step but peripherals are free running. Some peripheral modules include a freeze feature, whereby their clocks are halted when the device enters active BDM. Timer modules typically include the freeze feature. Serial interface modules typically do not include the freeze feature. Hence possible timing relations between CPU code execution and occurrence of events of peripherals no longer exist. If the handshake protocol is enabled and BDCCIS is set then stepping over the STOP instruction causes the Long-ACK pulse to be generated and the BDCCSR STOP flag to be set. When stop mode is exited due to an interrupt the device enters active BDM and the PC points to the start of the corresponding interrupt service routine. Stepping can be continued. Stepping over a WAI instruction, the STEP1 command cannot be finished because active BDM cannot be entered after CPU starts to execute the WAI instruction. Stepping over the WAI instruction causes the BDCCSR WAIT and NORESP flags to be set and, if the handshake protocol is enabled, then the Long-ACK pulse is generated. Then the device enters wait mode, clears the BDMACT bit and awaits an interrupt to leave wait mode. In this time non-intrusive BDC commands are possible, although the STEP1 has actually not finished. When an interrupt occurs the device leaves wait mode, enters active BDM and the PC points to the start of the corresponding interrupt service routine. A further ACK related to stepping over the WAI is not generated. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 149 Chapter 3 Background Debug Controller (S12ZBDCV2) 3.4.11 Serial Communication Timeout The host initiates a host-to-target serial transmission by generating a falling edge on the BKGD pin. If BKGD is kept low for more than 128 target clock cycles, the target understands that a SYNC command was issued. In this case, the target waits for a rising edge on BKGD in order to answer the SYNC request pulse. When the BDC detects the rising edge a soft reset is generated, whereby the current BDC command is discarded. If the rising edge is not detected, the target keeps waiting forever without any timeout limit. If a falling edge is not detected by the target within 512 clock cycles since the last falling edge, a timeout occurs and the current command is discarded without affecting memory or the operating mode of the MCU. This is referred to as a soft-reset. This timeout also applies if 512 cycles elapse between 2 consecutive ERASE_FLASH commands. The soft reset is disabled whilst the internal flash mass erase operation is pending completion. timeouts are also possible if a BDC command is partially issued, or data partially retrieved. Thus if a time greater than 512 BDCSI clock cycles is observed between two consecutive negative edges, a soft-reset occurs causing the partially received command or data retrieved to be discarded. The next negative edge at the BKGD pin, after a soft-reset has occurred, is considered by the target as the start of a new BDC command, or the start of a SYNC request pulse. 3.5 3.5.1 Application Information Clock Frequency Considerations Read commands without status and without ACK must consider the frequency relationship between BDCSI and the internal core clock. If the core clock is slow, then the internal access may not have been carried out within the standard 16 BDCSI cycle delay period (DLY). The host must then extend the DLY period or clock frequencies accordingly. Taking internal clock domain synchronizers into account, the minimum number of BDCSI periods required for the DLY is expressed by: #DLY > 3(f(BDCSI clock) / f(core clock)) + 4 and the minimum core clock frequency with respect to BDCSI clock frequency is expressed by Minimum f(core clock) = (3/(#DLY cycles -4))f(BDCSI clock) For the standard 16 period DLY this yields f(core clock)>= (1/4)f(BDCSI clock) MC9S12ZVC Family Reference Manual , Rev. 1.9 150 NXP Semiconductors Chapter 4 Memory Mapping Control (S12ZMMCV1) Table 4-1. Revision History Revision Number Revision Date V01.05 6 Aug 2012 V01.06 12 Feb 2013 V01.07 3 May 2013 4.1 Sections Affected Description of Changes Fixed wording Figure 4-8 4.3.2.2/4-156 * Changed "KByte:to "KB" * Corrected the description of the MMCECH/L register * * Fixed typos * Removed PTU references Introduction The S12ZMMC module controls the access to all internal memories and peripherals for the S12ZCPU, and the S12ZBDC module. It also provides dirct memory access for the ADC module. The S12ZMMC determines the address mapping of the on-chip resources, regulates access priorities and enforces memory protection. Figure 4-1 shows a block diagram of the S12ZMMC module. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 151 Chapter 4 Memory Mapping Control (S12ZMMCV1) 4.1.1 Glossary Table 4-2. Glossary Of Terms Term Definition MCU Microcontroller Unit CPU S12Z Central Processing Unit BDC S12Z Background Debug Controller ADC Analog-to-Digital Converter unmapped address range reserved address range illegal access Address space that is not assigned to a memory Address space that is reserved for future use cases Memory access, that is not supported or prohibited by the S12ZMMC, e.g. a data store to NVM access violation Either an illegal access or an uncorrectable ECC error byte 8-bit data word 16-bit data 4.1.2 Overview The S12ZMMC provides access to on-chip memories and peripherals for the S12ZCPU, the S12ZBDC, and the ADC. It arbitrates memory accesses and determines all of the MCU memory maps. Furthermore, the S12ZMMC is responsible for selecting the MCUs functional mode. 4.1.3 * * * 4.1.4 4.1.4.1 Features S12ZMMC mode operation control Memory mapping for S12ZCPU, S12ZBDC, and ADC -- Maps peripherals and memories into a 16 MByte address space for the S12ZCPU, the S12ZBDC, and the ADC -- Handles simultaneous accesses to different on-chip resources (NVM, RAM, and peripherals) Access violation detection and logging -- Triggers S12ZCPU machine exceptions upon detection of illegal memory accesses and uncorrectable ECC errors -- Logs the state of the S12ZCPU and the cause of the access error Modes of Operation Chip configuration modes The S12ZMMC determines the chip configuration mode of the device. It captures the state of the MODC pin at reset and provides the ability to switch from special-single chip mode to normal single chip-mode. MC9S12ZVC Family Reference Manual , Rev. 1.9 152 NXP Semiconductors Chapter 4 Memory Mapping Control (S12ZMMCV1) 4.1.4.2 Power modes The S12ZMMC module is only active in run and wait mode.There is no bus activity in stop mode. 4.1.5 Block Diagram e Run Mode Controller S12ZCPU S12ZBDC ADC Memory Protection Register Block Crossbar Switch Program Flash EEPROM RAM Peripherals Figure 4-1. S12ZMMC Block Diagram 4.2 External Signal Description The S12ZMMC uses two external pins to determine the devices operating mode: RESET and MODC (Table 4-3) See device overview for the mapping of these signals to device pins. Table 4-3. External System Pins Associated With S12ZMMC Pin Name 4.3 4.3.1 Description RESET External reset signal. The RESET signal is active low. MODC This input is captured in bit MODC of the MODE register when the external RESET pin deasserts. Memory Map and Register Definition Memory Map A summary of the registers associated with the MMC block is shown in Figure 4-2. Detailed descriptions of the registers and bits are given in the subsections that follow. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 153 Chapter 4 Memory Mapping Control (S12ZMMCV1) Address Name 0x0070 MODE Bit 7 R W 0x00710x007F Reserved 0x0080 MMCECH R MODC 0 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W 0x0081 MMCECL R W 0x0082 MMCCCRH R ITR[3:0] TGT[3:0] ACC[3:0] ERR[3:0] CPUU 0 0 0 0 0 0 0 0 CPUX 0 CPUI 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W 0x0083 MMCCCRL R W 0x0084 Reserved R W 0x0085 MMCPCH R CPUPC[23:16] W 0x0086 MMCPCM R CPUPC[15:8] W 0x0087 MMCPCL R CPUPC[7:0] W 0x00880x00FF Reserved R 0 0 0 0 W = Unimplemented or Reserved Figure 4-2. S12ZMMC Register Summary 4.3.2 Register Descriptions This section consists of the S12ZMMC control and status register descriptions in address order. MC9S12ZVC Family Reference Manual , Rev. 1.9 154 NXP Semiconductors Chapter 4 Memory Mapping Control (S12ZMMCV1) 4.3.2.1 Mode Register (MODE) Address: 0x0070 7 R W Reset MODC MODC1 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1. External signal (see Table 4-3). = Unimplemented or Reserved Figure 4-3. Mode Register (MODE) Read: Anytime. Write: Only if a transition is allowed (see Figure 4-4). The MODE register determines the operating mode of the MCU. CAUTION Table 4-4. MODE Field Descriptions Field Description 7 MODC Mode Select Bit -- This bit determines the current operating mode of the MCU. Its reset value is captured from the MODC pin at the rising edge of the RESET pin. Figure 4-4 illustrates the only valid mode transition from special single-chip mode to normal single chip mode. Reset with MODC pin = 1 Normal Single-Chip Mode (NS) Reset with MODC pin = 0 write access to MODE: 1 MODC bit Special Single-Chip Mode (SS) Figure 4-4. Mode Transition Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 155 Chapter 4 Memory Mapping Control (S12ZMMCV1) 4.3.2.2 Error Code Register (MMCECH, MMCECL) Address: 0x0080 (MMCECH) 7 6 R 4 3 2 ITR[3:0] W Reset 5 0 1 0 TGT[3:0] 0 0 0 0 0 0 0 6 5 4 3 2 1 0 0 0 Address: 0x0081 (MMCECL) 7 R ACC[3:0] W Reset 0 0 ERR[3:0] 0 0 0 0 Figure 4-5. Error Code Register (MMCEC) Read: Anytime Write: Write of 0xFFFF to MMCECH:MMCECL resets both registers to 0x0000 Table 4-5. MMCECH and MMCECL Field Descriptions Field Description 7-4 (MMCECH) ITR[3:0] Initiator Field -- The ITR[3:0] bits capture the initiator which caused the access violation. The initiator is captured in form of a 4 bit value which is assigned as follows: 0: none (no error condition detected) 1: S12ZCPU 2: reserved 3: ADC 4-15: reserved 3-0 (MMCECH) TGT[3:0] Target Field -- The TGT[3:0] bits capture the target of the faulty access. The target is captured in form of a 4 bit value which is assigned as follows: 0: none 1: register space 2: RAM 3: EEPROM 4: program flash 5: IFR 6-15: reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 156 NXP Semiconductors Chapter 4 Memory Mapping Control (S12ZMMCV1) Field Description 7-4 (MMCECL) ACC[3:0] Access Type Field -- The ACC[3:0] bits capture the type of memory access, which caused the access violation. The access type is captured in form of a 4 bit value which is assigned as follows: 0: none (no error condition detected) 1: opcode fetch 2: vector fetch 3: data load 4: data store 5-15: reserved 3-0 (MMCECL) ERR[3:0] Error Type Field -- The EC[3:0] bits capture the type of the access violation. The type is captured in form of a 4 bit value which is assigned as follows: 0: none (no error condition detected) 1: access to an illegal address 2: uncorrectable ECC error 3-15: reserved The MMCEC register captures debug information about access violations. It is set to a non-zero value if a S12ZCPU access violation or an uncorrectable ECC error has occurred. At the same time this register is set to a non-zero value, access information is captured in the MMCPCn and MMCCCRn registers. The MMCECn, the MMCPCn and the MMCCCRn registers are not updated if the MMCECn registers contain a non-zero value. The MMCECn registers are cleared by writing the value 0xFFFF. 4.3.2.3 Captured S12ZCPU Condition Code Register (MMCCCRH, MMCCCRL) Address: 0x0082 (MMCCCRH) R 7 6 5 4 3 2 1 0 CPUU 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset Address: 0x0083 (MMCCCRL) R 7 6 5 4 3 2 1 0 0 CPUX 0 CPUI 0 0 0 0 0 0 0 0 0 0 0 0 W Reset Figure 4-6. Captured S12ZCPU Condition Code Register (MMCCCRH, MMCCCRL) Read: Anytime Write: Never MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 157 Chapter 4 Memory Mapping Control (S12ZMMCV1) Table 4-6. MMCCCRH and MMCCCRL Field Descriptions Field Description 7 (MMCCCRH) CPUU S12ZCPU User State Flag -- This bit shows the state of the user/supervisor mode bit in the S12ZCPU's CCR at the time the access violation has occurred. The S12ZCPU user state flag is read-only; it will be automatically updated when the next error condition is flagged through the MMCEC register. This bit is undefined if the error code registers (MMCECn) are cleared. 6 (MMCCCRL) CPUX S12ZCPU X-Interrupt Mask-- This bit shows the state of the X-interrupt mask in the S12ZCPU's CCR at the time the access violation has occurred. The S12ZCPU X-interrupt mask is read-only; it will be automatically updated when the next error condition is flagged through the MMCEC register. This bit is undefined if the error code registers (MMCECn) are cleared. 4 (MMCCCRL) CPUI S12ZCPU I-Interrupt Mask-- This bit shows the state of the I-interrupt mask in the CPU's CCR at the time the access violation has occurred. The S12ZCPU I-interrupt mask is read-only; it will be automatically updated when the next error condition is flagged through the MMCEC register. This bit is undefined if the error code registers (MMCECn) are cleared. 4.3.2.4 Captured S12ZCPU Program Counter (MMCPCH, MMCPCM, MMCPCL) Address: 0x0085 (MMCPCH) 7 6 5 R 4 3 2 1 0 0 0 0 0 3 2 1 0 0 0 0 0 3 2 1 0 0 0 0 0 CPUPC[23:16] W Reset 0 0 0 0 6 5 4 Address: 0x0086 (MMCPCM) 7 R CPUPC[15:8] W Reset 0 0 0 0 6 5 4 Address: 0x0087 (MMCPCL) 7 R CPUPC[7:0] W Reset 0 0 0 0 Figure 4-7. Captured S12ZCPU Program Counter (MMCPCH, MMCPCM, MMCPCL) Read: Anytime Write: Never MC9S12ZVC Family Reference Manual , Rev. 1.9 158 NXP Semiconductors Chapter 4 Memory Mapping Control (S12ZMMCV1) Table 4-7. MMCPCH, MMCPCM, and MMCPCL Field Descriptions Field Description 7-0 (MMCPCH) S12ZCPU Program Counter Value-- The CPUPC[23:0] stores the CPU's program counter value at the time the access 7-0 (MMCPCM) violation occurred. CPUPC[23:0] always points to the instruction which triggered the violation. These bits are undefined 7-0 (MMCPCL) if the error code registers (MMCECn) are cleared. CPUPC[23:0] 4.4 Functional Description This section provides a complete functional description of the S12ZMMC module. 4.4.1 Global Memory Map The S12ZMMC maps all on-chip resources into an 16MB address space, the global memory map. The exact resource mapping is shown in Figure 4-8. The global address space is used by the S12ZCPU, ADC, and the S12ZBDC module. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 159 Chapter 4 Memory Mapping Control (S12ZMMCV1) Register Space 4 KB 0x00_0000 0x00_1000 RAM max. 1 MByte - 4 KB 0x10_0000 EEPROM max. 1 MByte - 48 KB Reserved Reserved (read only) NVM IFR 512 Byte 6 KBKB 256 Byte 0x1F_4000 0x1F_8000 0x1F_C000 0x20_0000 Unmapped 6 MByte 0x80_0000 Program NVM max. 8 MByte Unmapped address range Low address aligned High address aligned 0xFF_FFFF Figure 4-8. Global Memory Map MC9S12ZVC Family Reference Manual , Rev. 1.9 160 NXP Semiconductors Chapter 4 Memory Mapping Control (S12ZMMCV1) 4.4.2 Illegal Accesses The S12ZMMC module monitors all memory traffic for illegal accesses. See Table 4-8 for a complete list of all illegal accesses. Table 4-8. Illegal memory accesses Register space RAM EEPROM Reserved Space Reserved Read-only Space NVM IFR Program NVM Unmapped Space 1 S12ZCPU S12ZBDC ADC Read access ok ok illegal access Write access ok ok illegal access Code execution illegal access Read access ok ok ok Write access ok ok ok Code execution ok Read access ok1 ok1 ok1 Write access illegal access illegal access illegal access Code execution ok1 Read access ok ok illegal access Write access only permitted in SS mode ok illegal access Code execution illegal access Read access ok ok illegal access Write access illegal access illegal access illegal access Code execution illegal access Read access ok1 ok1 illegal access Write access illegal access illegal access illegal access Code execution illegal access Read access ok1 ok1 ok1 Write access illegal access illegal access illegal access Code execution ok1 Read access illegal access illegal access illegal access Write access illegal access illegal access illegal access Code execution illegal access Unsupported NVM accesses during NVM command execution ("collisions"), are treated as illegal accesses. Illegal accesses are reported in several ways: * All illegal accesses performed by the S12ZCPU trigger machine exceptions. * All illegal accesses performed through the S12ZBDC interface, are captured in the ILLACC bit of the BDCCSRL register. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 161 Chapter 4 Memory Mapping Control (S12ZMMCV1) * All illegal accesses performed by the ADC module trigger error interrupts. See ADC section for details. NOTE Illegal accesses caused by S12ZCPU opcode prefetches will also trigger machine exceptions, even if those opcodes might not be executed in the program flow. To avoid these machine exceptions, S12ZCPU instructions must not be executed from the last (high addresses) 8 bytes of RAM, EEPROM, and Flash. 4.4.3 Uncorrectable ECC Faults RAM and flash use error correction codes (ECC) to detect and correct memory corruption. Each uncorrectable memory corruption, which is detected during a S12ZCPU or ADC access triggers a machine exception. Uncorrectable memory corruptions which are detected during a S12ZBDC access, are captured in the RAMWF or the RDINV bit of the BDCCSRL register. MC9S12ZVC Family Reference Manual , Rev. 1.9 162 NXP Semiconductors Chapter 5 S12Z Interrupt (S12ZINTV0) Table 5-1. Revision History Version Number Revision Date Effective Date V00.01 17 Apr 2009 all Initial version based on S12XINT V2.06 V00.02 14 Jul 2009 all Reduce RESET vectors from three to one. V00.03 05 Oct 2009 all Removed dedicated ECC machine exception vector and marked vector-table entry "reserved for future use". Added a second illegal op-code vector (to distinguish between SPARE and TRAP). V00.04 04 Jun 2010 all Fixed remaining descriptions of RESET vectors. Split non-maskable hardware interrupts into XGATE software error and machine exception requests. Replaced mentions of CCR (old name from S12X) with CCW (new name). V00.05 12 Jan 2011 all Corrected wrong IRQ vector address in some descriptions. V00.06 22 Mar 2011 all Added vectors for RAM ECC and NVM ECC machine exceptions. And moved position to 1E0..1E8. Moved XGATE error interrupt to vector 1DC. Remaining vectors accordingly. Removed illegal address reset as a potential reset source. V00.07 15 Apr 2011 all Removed illegal address reset as a potential reset source from Exception vector table as well. Added the other possible reset sources to the table. Changed register addresses according to S12Z platform definition. V00.08 02 May 2011 all Reduced machine exception vectors to one. Removed XGATE error interrupt. Moved Spurious interrupt vector to 1DC. Moved vector base address to 010 to make room for NVM non-volatile registers. V00.09 12 Aug 2011 all Added: Machine exceptions can cause wake-up from STOP or WAIT V00.10 21 Feb 2012 all Corrected reset value for INT_CFADDR register V00.11 02 Jul 2012 all Removed references and functions related to XGATE V00.12 22 May 2013 all added footnote about availability of "Wake-up from STOP or WAIT by XIRQ with X bit set" feature 5.1 Description of Changes Introduction The INT module decodes the priority of all system exception requests and provides the applicable vector for processing the exception to the CPU. The INT module supports: * * * * I-bit and X-bit maskable interrupt requests One non-maskable unimplemented page1 op-code trap One non-maskable unimplemented page2 op-code trap One non-maskable software interrupt (SWI) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 163 Chapter 5 S12Z Interrupt (S12ZINTV0) * * * * One non-maskable system call interrupt (SYS) One non-maskable machine exception vector request One spurious interrupt vector request One system reset vector request Each of the I-bit maskable interrupt requests can be assigned to one of seven priority levels supporting a flexible priority scheme. The priority scheme can be used to implement nested interrupt capability where interrupts from a lower level are automatically blocked if a higher level interrupt is being processed. 5.1.1 Glossary The following terms and abbreviations are used in the document. Table 5-2. Terminology Term CCW Condition Code Register (in the S12Z CPU) DMA Direct Memory Access INT Interrupt IPL Interrupt Processing Level ISR Interrupt Service Routine MCU IRQ XIRQ 5.1.2 * * * * * * * * * Meaning Micro-Controller Unit refers to the interrupt request associated with the IRQ pin refers to the interrupt request associated with the XIRQ pin Features Interrupt vector base register (IVBR) One system reset vector (at address 0xFFFFFC). One non-maskable unimplemented page1 op-code trap (SPARE) vector (at address vector base1 + 0x0001F8). One non-maskable unimplemented page2 op-code trap (TRAP) vector (at address vector base1 + 0x0001F4). One non-maskable software interrupt request (SWI) vector (at address vector base1 + 0x0001F0). One non-maskable system call interrupt request (SYS) vector (at address vector base1 + 0x00001EC). One non-maskable machine exception vector request (at address vector base1 + 0x0001E8. One spurious interrupt vector (at address vector base1 + 0x0001DC). One X-bit maskable interrupt vector request associated with XIRQ (at address vector base1 + 0x0001D8). 1. The vector base is a 24-bit address which is accumulated from the contents of the interrupt vector base register (IVBR, used as the upper 15 bits of the address) and 0x000 (used as the lower 9 bits of the address). MC9S12ZVC Family Reference Manual , Rev. 1.9 164 NXP Semiconductors Chapter 5 S12Z Interrupt (S12ZINTV0) * * * * * 5.1.3 * * * 5.1.4 One I-bit maskable interrupt vector request associated with IRQ (at address vector base1 + 0x0001D4). up to 113 additional I-bit maskable interrupt vector requests (at addresses vector base1 + 0x000010 .. vector base + 0x0001D0). Each I-bit maskable interrupt request has a configurable priority level. I-bit maskable interrupts can be nested, depending on their priority levels. Wakes up the system from stop or wait mode when an appropriate interrupt request occurs or whenever XIRQ is asserted, even if X interrupt is masked. Modes of Operation Run mode This is the basic mode of operation. Wait mode In wait mode, the INT module is capable of waking up the CPU if an eligible CPU exception occurs. Please refer to Section 5.5.3, "Wake Up from Stop or Wait Mode" for details. Stop Mode In stop mode, the INT module is capable of waking up the CPU if an eligible CPU exception occurs. Please refer to Section 5.5.3, "Wake Up from Stop or Wait Mode" for details. Block Diagram Figure 5-1 shows a block diagram of the INT module. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 165 Chapter 5 S12Z Interrupt (S12ZINTV0) Peripheral Interrupt Requests Wake Up CPU Interrupt Requests One Set Per Channel (Up to 117 Channels) Priority Level Filter PRIOLVL2 PRIOLVL1 PRIOLVL0 Highest Pending IPL PRIOLVLn Priority Level = configuration bits from the associated channel configuration register IVBR = Interrupt Vector Base IPL = Interrupt Processing Level IVBR New IPL To CPU Non I Bit Maskable Channels Priority Decoder Vector Address Current IPL Figure 5-1. INT Block Diagram 5.2 External Signal Description The INT module has no external signals. 5.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the INT module. 5.3.1 Module Memory Map Table 5-3 gives an overview over all INT module registers. Table 5-3. INT Memory Map Address Use Access 0x000010-0x000011 Interrupt Vector Base Register (IVBR) R/W 0x000012-0x000016 RESERVED -- 0x000017 Interrupt Request Configuration Address Register (INT_CFADDR) R/W 0x000018 Interrupt Request Configuration Data Register 0 (INT_CFDATA0) R/W MC9S12ZVC Family Reference Manual , Rev. 1.9 166 NXP Semiconductors Chapter 5 S12Z Interrupt (S12ZINTV0) Table 5-3. INT Memory Map 5.3.2 0x000019 Interrupt Request Configuration Data Register 1 (INT_CFDATA1) R/W 0x00001A Interrupt Request Configuration Data Register 2 (INT_CFDATA2 R/W 0x00001B Interrupt Request Configuration Data Register 3 (INT_CFDATA3) R/W 0x00001C Interrupt Request Configuration Data Register 4 (INT_CFDATA4) R/W 0x00001D Interrupt Request Configuration Data Register 5 (INT_CFDATA5) R/W 0x00001E Interrupt Request Configuration Data Register 6 (INT_CFDATA6) R/W 0x00001F Interrupt Request Configuration Data Register 7 (INT_CFDATA7) R/W Register Descriptions This section describes in address order all the INT module registers and their individual bits. Address Register Name 0x000010 IVBR Bit 7 6 5 R R INT_CFADDR R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W 0x000019 INT_CFDATA1 R W 0x00001A INT_CFDATA2 R W 0x00001B INT_CFDATA3 R W 0x00001C INT_CFDATA4 R 1 Bit 0 0 INT_CFADDR[6:3] W 0x000018 INT_CFDATA0 R 2 IVB_ADDR[7:1] W 0x000017 3 IVB_ADDR[15:8] W 0x000011 4 W 0 0 PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] = Unimplemented or Reserved Figure 5-2. INT Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 167 Chapter 5 S12Z Interrupt (S12ZINTV0) Register Name Address Bit 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0x00001D INT_CFDATA5 R 2 1 PRIOLVL[2:0] W 0x00001E INT_CFDATA6 R PRIOLVL[2:0] W 0x00001F INT_CFDATA7 R Bit 0 PRIOLVL[2:0] W = Unimplemented or Reserved Figure 5-2. INT Register Summary 5.3.2.1 Interrupt Vector Base Register (IVBR) Address: 0x000010 15 14 13 12 11 10 R 8 7 6 5 4 3 2 1 1 1 1 1 1 1 1 1 1 0 0 IVB_ADDR[15:1] W Reset 9 1 1 1 1 1 1 0 Figure 5-3. Interrupt Vector Base Register (IVBR) Read: Anytime Write: Anytime Table 5-4. IVBR Field Descriptions Field Description 15-1 IVB_ADDR [15:1] Interrupt Vector Base Address Bits -- These bits represent the upper 15 bits of all vector addresses. Out of reset these bits are set to 0xFFFE (i.e., vectors are located at 0xFFFE00-0xFFFFFF). Note: A system reset will initialize the interrupt vector base register with "0xFFFE" before it is used to determine the reset vector address. Therefore, changing the IVBR has no effect on the location of the reset vector (0xFFFFFC-0xFFFFFF). MC9S12ZVC Family Reference Manual , Rev. 1.9 168 NXP Semiconductors Chapter 5 S12Z Interrupt (S12ZINTV0) 5.3.2.2 Interrupt Request Configuration Address Register (INT_CFADDR) Address: 0x000017 7 R 6 0 0 4 3 INT_CFADDR[6:3] W Reset 5 0 0 0 1 2 1 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 5-4. Interrupt Configuration Address Register (INT_CFADDR) Read: Anytime Write: Anytime Table 5-5. INT_CFADDR Field Descriptions Field Description 6-3 Interrupt Request Configuration Data Register Select Bits -- These bits determine which of the 128 configuration INT_CFADDR[6:3] data registers are accessible in the 8 register window at INT_CFDATA0-7. The hexadecimal value written to this register corresponds to the upper 4 bits of the vector number (multiply with 4 to get the vector address offset). If, for example, the value 0x70 is written to this register, the configuration data register block for the 8 interrupt vector requests starting with vector at address (vector base + (0x70*4 = 0x0001C0)) is selected and can be accessed as INT_CFDATA0-7. 5.3.2.3 Interrupt Request Configuration Data Registers (INT_CFDATA0-7) The eight register window visible at addresses INT_CFDATA0-7 contains the configuration data for the block of eight interrupt requests (out of 128) selected by the interrupt configuration address register (INT_CFADDR) in ascending order. INT_CFDATA0 represents the interrupt configuration data register of the vector with the lowest address in this block, while INT_CFDATA7 represents the interrupt configuration data register of the vector with the highest address, respectively. Address: 0x000018 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 PRIOLVL[2:0] W Reset 1 0 0 11 = Unimplemented or Reserved Figure 5-5. Interrupt Request Configuration Data Register 0 (INT_CFDATA0) 1 Please refer to the notes following the PRIOLVL[2:0] description below. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 169 Chapter 5 S12Z Interrupt (S12ZINTV0) Address: 0x000019 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 PRIOLVL[2:0] W Reset 1 0 11 0 = Unimplemented or Reserved Figure 5-6. Interrupt Request Configuration Data Register 1 (INT_CFDATA1) 1 Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x00001A R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 PRIOLVL[2:0] W Reset 1 0 11 0 = Unimplemented or Reserved Figure 5-7. Interrupt Request Configuration Data Register 2 (INT_CFDATA2) 1 Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x00001B R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 PRIOLVL[2:0] W Reset 1 0 11 0 = Unimplemented or Reserved Figure 5-8. Interrupt Request Configuration Data Register 3 (INT_CFDATA3) 1 Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x00001C R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 PRIOLVL[2:0] W Reset 1 0 0 11 = Unimplemented or Reserved Figure 5-9. Interrupt Request Configuration Data Register 4 (INT_CFDATA4) 1 Please refer to the notes following the PRIOLVL[2:0] description below. MC9S12ZVC Family Reference Manual , Rev. 1.9 170 NXP Semiconductors Chapter 5 S12Z Interrupt (S12ZINTV0) Address: 0x00001D R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 PRIOLVL[2:0] W Reset 1 0 0 11 = Unimplemented or Reserved Figure 5-10. Interrupt Request Configuration Data Register 5 (INT_CFDATA5) 1 Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x00001E R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 PRIOLVL[2:0] W Reset 1 0 0 11 = Unimplemented or Reserved Figure 5-11. Interrupt Request Configuration Data Register 6 (INT_CFDATA6) 1 Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x00001F R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 PRIOLVL[2:0] W Reset 1 0 0 11 = Unimplemented or Reserved Figure 5-12. Interrupt Request Configuration Data Register 7 (INT_CFDATA7) 1 Please refer to the notes following the PRIOLVL[2:0] description below. Read: Anytime Write: Anytime MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 171 Chapter 5 S12Z Interrupt (S12ZINTV0) Table 5-6. INT_CFDATA0-7 Field Descriptions Field Description 2-0 Interrupt Request Priority Level Bits -- The PRIOLVL[2:0] bits configure the interrupt request priority level of the PRIOLVL[2:0] associated interrupt request. Out of reset all interrupt requests are enabled at the lowest active level ("1"). Please also refer to Table 5-7 for available interrupt request priority levels. Note: Write accesses to configuration data registers of unused interrupt channels are ignored and read accesses return all 0s. For information about what interrupt channels are used in a specific MCU, please refer to the Device Reference Manual for that MCU. Note: When non I-bit maskable request vectors are selected, writes to the corresponding INT_CFDATA registers are ignored and read accesses return all 0s. The corresponding vectors do not have configuration data registers associated with them. Note: Write accesses to the configuration register for the spurious interrupt vector request (vector base + 0x0001DC) are ignored and read accesses return 0x07 (request is handled by the CPU, PRIOLVL = 7). Table 5-7. Interrupt Priority Levels Priority low high 5.4 PRIOLVL2 PRIOLVL1 PRIOLVL0 Meaning 0 0 0 Interrupt request is disabled 0 0 1 Priority level 1 0 1 0 Priority level 2 0 1 1 Priority level 3 1 0 0 Priority level 4 1 0 1 Priority level 5 1 1 0 Priority level 6 1 1 1 Priority level 7 Functional Description The INT module processes all exception requests to be serviced by the CPU module. These exceptions include interrupt vector requests and reset vector requests. Each of these exception types and their overall priority level is discussed in the subsections below. 5.4.1 S12Z Exception Requests The CPU handles both reset requests and interrupt requests. The INT module contains registers to configure the priority level of each I-bit maskable interrupt request which can be used to implement an interrupt priority scheme. This also includes the possibility to nest interrupt requests. A priority decoder is used to evaluate the relative priority of pending interrupt requests. 5.4.2 Interrupt Prioritization After system reset all I-bit maskable interrupt requests are configured to be enabled, are set up to be handled by the CPU and have a pre-configured priority level of 1. Exceptions to this rule are the non-maskable interrupt requests and the spurious interrupt vector request at (vector base + 0x0001DC) MC9S12ZVC Family Reference Manual , Rev. 1.9 172 NXP Semiconductors Chapter 5 S12Z Interrupt (S12ZINTV0) which cannot be disabled, are always handled by the CPU and have a fixed priority levels. A priority level of 0 effectively disables the associated I-bit maskable interrupt request. If more than one interrupt request is configured to the same interrupt priority level the interrupt request with the higher vector address wins the prioritization. The following conditions must be met for an I-bit maskable interrupt request to be processed. 1. The local interrupt enabled bit in the peripheral module must be set. 2. The setup in the configuration register associated with the interrupt request channel must meet the following conditions: a) The priority level must be set to non zero. b) The priority level must be greater than the current interrupt processing level in the condition code register (CCW) of the CPU (PRIOLVL[2:0] > IPL[2:0]). 3. The I-bit in the condition code register (CCW) of the CPU must be cleared. 4. There is no access violation interrupt request pending. 5. There is no SYS, SWI, SPARE, TRAP, Machine Exception or XIRQ request pending. NOTE All non I-bit maskable interrupt requests always have higher priority than I-bit maskable interrupt requests. If an I-bit maskable interrupt request is interrupted by a non I-bit maskable interrupt request, the currently active interrupt processing level (IPL) remains unaffected. It is possible to nest non I-bit maskable interrupt requests, e.g., by nesting SWI, SYS or TRAP calls. 5.4.2.1 Interrupt Priority Stack The current interrupt processing level (IPL) is stored in the condition code register (CCW) of the CPU. This way the current IPL is automatically pushed to the stack by the standard interrupt stacking procedure. The new IPL is copied to the CCW from the priority level of the highest priority active interrupt request channel which is configured to be handled by the CPU. The copying takes place when the interrupt vector is fetched. The previous IPL is automatically restored from the stack by executing the RTI instruction. 5.4.3 Priority Decoder The INT module contains a priority decoder to determine the relative priority for all interrupt requests pending for the CPU. A CPU interrupt vector is not supplied until the CPU requests it. Therefore, it is possible that a higher priority interrupt request could override the original exception which caused the CPU to request the vector. In this case, the CPU will receive the highest priority vector and the system will process this exception first instead of the original request. If the interrupt source is unknown (for example, in the case where an interrupt request becomes inactive after the interrupt has been recognized, but prior to the vector request), the vector address supplied to the CPU defaults to that of the spurious interrupt vector. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 173 Chapter 5 S12Z Interrupt (S12ZINTV0) NOTE Care must be taken to ensure that all exception requests remain active until the system begins execution of the applicable service routine; otherwise, the exception request may not get processed at all or the result may be a spurious interrupt request (vector at address (vector base + 0x0001DC)). 5.4.4 Reset Exception Requests The INT module supports one system reset exception request. The different reset types are mapped to this vector (for details please refer to the Clock and Power Management Unit module (CPMU)): 1. Pin reset 2. Power-on reset 3. Low-voltage reset 4. Clock monitor reset request 5. COP watchdog reset request 5.4.5 Exception Priority The priority (from highest to lowest) and address of all exception vectors issued by the INT module upon request by the CPU are shown in Table 5-8. Generally, all non-maskable interrupts have higher priorities than maskable interrupts. Please note that between the four software interrupts (Unimplemented op-code trap page1/page2 requests, SWI request, SYS request) there is no real priority defined since they cannot occur simultaneously (the S12Z CPU executes one instruction at a time). Table 5-8. Exception Vector Map and Priority Vector Address1 0xFFFFFC 1 Source Pin reset, power-on reset, low-voltage reset, clock monitor reset, COP watchdog reset (Vector base + 0x0001F8) Unimplemented page1 op-code trap (SPARE) vector request (Vector base + 0x0001F4) Unimplemented page2 op-code trap (TRAP) vector request (Vector base + 0x0001F0) Software interrupt instruction (SWI) vector request (Vector base + 0x0001EC) System call interrupt instruction (SYS) vector request (Vector base + 0x0001E8) Machine exception vector request (Vector base + 0x0001E4) Reserved (Vector base + 0x0001E0) Reserved (Vector base + 0x0001DC) Spurious interrupt (Vector base + 0x0001D8) XIRQ interrupt request (Vector base + 0x0001D4) IRQ interrupt request (Vector base + 0x000010 .. Vector base + 0x0001D0) Device specific I-bit maskable interrupt sources (priority determined by the associated configuration registers, in descending order) 24 bits vector address based MC9S12ZVC Family Reference Manual , Rev. 1.9 174 NXP Semiconductors Chapter 5 S12Z Interrupt (S12ZINTV0) 5.4.6 Interrupt Vector Table Layout The interrupt vector table contains 128 entries, each 32 bits (4 bytes) wide. Each entry contains a 24-bit address (3 bytes) which is stored in the 3 low-significant bytes of the entry. The content of the most significant byte of a vector-table entry is ignored. Figure 5-13 illustrates the vector table entry format. Bits [31:24] [23:0] (unused) ISR Address Figure 5-13. Interrupt Vector Table Entry 5.5 5.5.1 Initialization/Application Information Initialization After system reset, software should: * Initialize the interrupt vector base register if the interrupt vector table is not located at the default location (0xFFFE00-0xFFFFFB). * Initialize the interrupt processing level configuration data registers (INT_CFADDR, INT_CFDATA0-7) for all interrupt vector requests with the desired priority levels. It might be a good idea to disable unused interrupt requests. * Enable I-bit maskable interrupts by clearing the I-bit in the CCW. * Enable the X-bit maskable interrupt by clearing the X-bit in the CCW (if required). 5.5.2 Interrupt Nesting The interrupt request priority level scheme makes it possible to implement priority based interrupt request nesting for the I-bit maskable interrupt requests. * I-bit maskable interrupt requests can be interrupted by an interrupt request with a higher priority, so that there can be up to seven nested I-bit maskable interrupt requests at a time (refer to Figure 5-14 for an example using up to three nested interrupt requests). I-bit maskable interrupt requests cannot be interrupted by other I-bit maskable interrupt requests per default. In order to make an interrupt service routine (ISR) interruptible, the ISR must explicitly clear the I-bit in the CCW (CLI). After clearing the I-bit, I-bit maskable interrupt requests with higher priority can interrupt the current ISR. An ISR of an interruptible I-bit maskable interrupt request could basically look like this: * Service interrupt, e.g., clear interrupt flags, copy data, etc. * Clear I-bit in the CCW by executing the CPU instruction CLI (thus allowing interrupt requests with higher priority) * Process data * Return from interrupt by executing the instruction RTI MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 175 Chapter 5 S12Z Interrupt (S12ZINTV0) 0 Stacked IPL IPL in CCW 0 0 4 0 0 0 4 7 4 3 1 0 7 6 Processing Levels RTI L7 5 4 RTI 3 2 L3 (Pending) L4 1 L1 (Pending) 0 RTI RTI Reset Figure 5-14. Interrupt Processing Example 5.5.3 5.5.3.1 Wake Up from Stop or Wait Mode CPU Wake Up from Stop or Wait Mode Every I-bit maskable interrupt request which is configured to be handled by the CPU is capable of waking the MCU from stop or wait mode. Additionally machine exceptions can wake-up the MCU from stop or wait mode. To determine whether an I-bit maskable interrupts is qualified to wake up the CPU or not, the same settings as in normal run mode are applied during stop or wait mode: * If the I-bit in the CCW is set, all I-bit maskable interrupts are masked from waking up the MCU. * An I-bit maskable interrupt is ignored if it is configured to a priority level below or equal to the current IPL in CCW. The X-bit maskable interrupt request can wake up the MCU from stop or wait mode at anytime, even if the X-bit in CCW is set1. If the X-bit maskable interrupt request is used to wake-up the MCU with the X-bit in the CCW set, the associated ISR is not called. The CPU then resumes program execution with the instruction following the WAI or STOP instruction. This feature works following the same rules like any interrupt request, i.e. care must be taken that the X-bit maskable interrupt request used for wake-up remains active at least until the system begins execution of the instruction following the WAI or STOP instruction; otherwise, wake-up may not occur. 1. The capability of the XIRQ pin to wake-up the MCU with the X bit set may not be available if, for example, the XIRQ pin is shared with other peripheral modules on the device. Please refer to the Port Integration Module (PIM) section of the MCU reference manual for details. MC9S12ZVC Family Reference Manual , Rev. 1.9 176 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Table 6-1. Revision History Table Revision Number Revision Date Sections Affected 3.00 23.MAY.2012 General Updated for DBGV3 using conditional text 3.01 27.JUN.2012 General Added Lite to module name. Corrected DBGEFR register format issue 3.02 05.JUL.2012 3.03 16.NOV.2012 Section 6.5.1, "Avoiding Unintended Breakpoint Re-triggering 3.04 19.DEC.2012 General Formatting corrections 3.05 19.APR.2013 General Specified DBGC1[0] reserved bit as read only 3.06 15.JUL.2013 Section 6.3.2, "Register Descriptions 6.1 Description Of Changes Section 6.3.2.6, Removed ME2 flag from DBGEFR "Debug Event Flag Register (DBGEFR) Modified step over breakpoint information Added explicit names to state control register bit fields Introduction The DBG module provides on-chip breakpoints with flexible triggering capability to allow non-intrusive debug of application software. The DBG module is optimized for the S12Z architecture and allows debugging of CPU module operations. Typically the DBG module is used in conjunction with the BDC module, whereby the user configures the DBG module for a debugging session over the BDC interface. Once configured the DBG module is armed and the device leaves active BDM returning control to the user program, which is then monitored by the DBG module. Alternatively the DBG module can be configured over a serial interface using SWI routines. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 177 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.1.1 Glossary Table 6-2. Glossary Of Terms Term Definition COF Change Of Flow. Change in the program flow due to a conditional branch, indexed jump or interrupt PC Program Counter BDM Background Debug Mode. In this mode CPU application code execution is halted. Execution of BDC "active BDM" commands is possible. BDC Background Debug Controller WORD 16-bit data entity CPU S12Z CPU module 6.1.2 Overview The comparators monitor the bus activity of the CPU. A single comparator match or a series of matches can generate breakpoints. A state sequencer determines if the correct series of matches occurs. Similarly an external event can generate breakpoints. 6.1.3 * * * * Features Three comparators (A, B, and D) -- Comparator A compares the full address bus and full 32-bit data bus -- Comparator A features a data bus mask register -- Comparators B and D compare the full address bus only -- Each comparator can be configured to monitor PC addresses or addresses of data accesses -- Each comparator can select either read or write access cycles -- Comparator matches can force state sequencer state transitions Three comparator modes -- Simple address/data comparator match mode -- Inside address range mode, Addmin Address Addmax -- Outside address range match mode, Address Addminor Address Addmax State sequencer control -- State transitions forced by comparator matches -- State transitions forced by software write to TRIG -- State transitions forced by an external event The following types of breakpoints -- CPU breakpoint entering active BDM on breakpoint (BDM) -- CPU breakpoint executing SWI on breakpoint (SWI) -- MC9S12ZVC Family Reference Manual , Rev. 1.9 178 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.1.4 Modes of Operation The DBG module can be used in all MCU functional modes. The DBG module can issue breakpoint requests to force the device to enter active BDM or an SWI ISR. The BDC BACKGROUND command is also handled by the DBG to force the device to enter active BDM. When the device enters active BDM through a BACKGROUND command with the DBG module armed, the DBG remains armed. 6.1.5 Block Diagram B EXTERNAL EVENT TRIG REGISTERS COMPARATOR A COMPARATOR B COMPARATOR D MATCH0 COMPARATOR MATCH CONTROL BUS INTERFACE CPU BUS MATCH1 STATE SEQUENCER AND EVENT CONTROL BREAKPOINT REQUESTS MATCH3 Figure 6-1. Debug Module Block Diagram 6.2 6.2.1 External Signal Description External Event Input The DBG module features an external event input signal, DBGEEV. The mapping of this signal to a device pin is specified in the device specific documentation. This function can be enabled and configured by the EEVE field in the DBGC1 control register. This signal is input only and allows an external event to force a state sequencer transition. With the external event function enabled, a falling edge at the external event pin constitutes an event. Rising edges have no effect. The maximum frequency of events is half the internal core bus frequency. The function is explained in the EEVE field description. NOTE Due to input pin synchronization circuitry, the DBG module sees external events 2 bus cycles after they occur at the pin. Thus an external event occurring less than 2 bus cycles before arming the DBG module is perceived to occur whilst the DBG is armed. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 179 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module When the device is in stop mode the synchronizer clocks are disabled and the external events are ignored. 6.3 6.3.1 Memory Map and Registers Module Memory Map A summary of the registers associated with the DBG module is shown in Figure 6-2. Detailed descriptions of the registers and bits are given in the subsections that follow. Address Name Bit 7 R 5 4 3 2 1 Bit 0 reserved BDMBP BRKCPU reserved EEVE1 0 0x0100 DBGC1 0x0101 DBGC2 R W 0 0 0 0 0 0 0x0102 Reserved R W 0 0 0 0 0 0 0 0 0x0103 Reserved R W 0 0 0 0 0 0 0 0 0x0104 Reserved R W 0 0 0 0 0 0 0 0 0x0105 Reserved R W 0 0 0 0 0 0 0 0 0x0106 Reserved R W 0 0 0 0 0 0 0 0 0x0107 DBGSCR1 R W C3SC1 C3SC0 0 0 C1SC1 C1SC0 C0SC1 C0SC0 0x0108 DBGSCR2 R W C3SC1 C3SC0 0 0 C1SC1 C1SC0 C0SC1 C0SC0 0x0109 DBGSCR3 R W C3SC1 C3SC0 0 0 C1SC1 C1SC0 C0SC1 C0SC0 0x010A DBGEFR R W 0 TRIGF 0 EEVF ME3 0 ME1 ME0 0x010B DBGSR R W 0 0 0 0 0 SSF2 SSF1 SSF0 0x010C0x010F Reserved R W 0 0 0 0 0 0 0 0 0x0110 DBGACTL R W 0 NDB INST RW RWE reserved COMPE W ARM 6 0 TRIG 0 ABCM Figure 6-2. Quick Reference to DBG Registers MC9S12ZVC Family Reference Manual , Rev. 1.9 180 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Address Name Bit 7 0 6 0 5 0 4 0 3 0 2 0 1 0 Bit 0 0 27 26 25 Bit 24 20 19 18 17 Bit 16 13 12 11 10 9 Bit 8 6 5 4 3 2 1 Bit 0 Bit 31 30 29 28 27 26 25 Bit 24 R W Bit 23 22 21 20 19 18 17 Bit 16 DBGADM2 R W Bit 15 14 13 12 11 10 9 Bit 8 0x011F DBGADM3 R W Bit 7 6 5 4 3 2 1 Bit 0 0x0120 DBGBCTL R W 0 0 RW RWE reserved COMPE 0x01210x0124 Reserved R W 0 0 0 0 0 0 0x0125 DBGBAH R W DBGBA[23:16] 0x0126 DBGBAM R W DBGBA[15:8] 0x0127 DBGBAL R W DBGBA[7:0] 0x01280x012F Reserved R W 0 0 0 0 0 0 0 0 0x01300x013F Reserved R W 0 0 0 0 0 0 0 0 0x01110x0114 Reserved R W 0x0115 DBGAAH R W DBGAA[23:16] 0x0116 DBGAAM R W DBGAA[15:8] 0x0117 DBGAAL R W DBGAA[7:0] 0x0118 DBGAD0 R W Bit 31 30 29 28 0x0119 DBGAD1 R W Bit 23 22 21 0x011A DBGAD2 R W Bit 15 14 0x011B DBGAD3 R W Bit 7 0x011C DBGADM0 R W 0x011D DBGADM1 0x011E INST 0 0 0 Figure 6-2. Quick Reference to DBG Registers MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 181 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Address 0x0140 Name R DBGDCTL W Bit 7 0 6 0 0 0 5 INST 2 1 Bit 0 RW RWE reserved COMPE 0 0 0 0 0 0 0 Reserved R W 0x0145 DBGDAH R W DBGDA[23:16] 0x0146 DBGDAM R W DBGDA[15:8] 0x0147 DBGDAL R W DBGDA[7:0] 0x01480x017F Reserved R W 0 0 3 0x01410x0144 0 0 4 0 0 0 0 Figure 6-2. Quick Reference to DBG Registers 6.3.2 Register Descriptions This section consists of the DBG register descriptions in address order. When ARM is set in DBGC1, the only bits in the DBG module registers that can be written are ARM, and TRIG 6.3.2.1 Debug Control Register 1 (DBGC1) Address: 0x0100 7 0x0100 Reset 6 ARM 0 0 TRIG 0 5 4 3 2 1 0 reserved BDMBP BRKCPU reserved EEVE1 0 0 0 0 0 0 0 Figure 6-3. Debug Control Register (DBGC1) Read: Anytime Write: Bit 7 Anytime . An ongoing profiling session must be finished before DBG can be armed again. Bit 6 can be written anytime but always reads back as 0. Bits 5:0 anytime DBG is not armed. NOTE On a write access to DBGC1 and simultaneous hardware disarm from an internal event, the hardware disarm has highest priority, clearing the ARM bit and generating a breakpoint, if enabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 182 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module NOTE When disarming the DBG by clearing ARM with software, the contents of bits[5:0] are not affected by the write, since up until the write operation, ARM = 1 preventing these bits from being written. These bits must be cleared using a second write if required. Table 6-3. DBGC1 Field Descriptions Field Description 7 ARM Arm Bit -- The ARM bit controls whether the DBG module is armed. This bit can be set and cleared by register writes and is automatically cleared when the state sequencer returns to State0 on completing a debugging session. On setting this bit the state sequencer enters State1. 0 Debugger disarmed. No breakpoint is generated when clearing this bit by software register writes. 1 Debugger armed 6 TRIG Immediate Trigger Request Bit -- This bit when written to 1 requests an immediate transition to final state independent of comparator status. This bit always reads back a 0. Writing a 0 to this bit has no effect. 0 No effect. 1 Force state sequencer immediately to final state. 4 BDMBP Background Debug Mode Enable -- This bit determines if a CPU breakpoint causes the system to enter Background Debug Mode (BDM) or initiate a Software Interrupt (SWI). If this bit is set but the BDC is not enabled, then no breakpoints are generated. 0 Breakpoint to Software Interrupt if BDM inactive. Otherwise no breakpoint. 1 Breakpoint to BDM, if BDC enabled. Otherwise no breakpoint. 3 BRKCPU CPU Breakpoint Enable -- The BRKCPU bit controls whether the debugger requests a breakpoint to CPU upon transitions to State0. Please refer to Section 6.4.5, "Breakpoints for further details. 0 Breakpoints disabled 1 Breakpoints enabled 1 EEVE1 External Event Enable -- The EEVE1 bit enables the external event function. 0 External event function disabled. 1 External event is mapped to the state sequencer, replacing comparator channel 3 6.3.2.2 Debug Control Register2 (DBGC2) Address: 0x0101 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 1 ABCM W Reset 0 0 0 = Unimplemented or Reserved Figure 6-4. Debug Control Register2 (DBGC2) Read: Anytime. Write: Anytime the module is disarmed. This register configures the comparators for range matching. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 183 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Table 6-4. DBGC2 Field Descriptions Field Description 1-0 ABCM[1:0] A and B Comparator Match Control -- These bits determine the A and B comparator match mapping as described in Table 6-5. Table 6-5. ABCM Encoding 1 ABCM Description 00 Match0 mapped to comparator A match....... Match1 mapped to comparator B match. 01 Match0 mapped to comparator A/B inside range....... Match1 disabled. 10 Match0 mapped to comparator A/B outside range....... Match1 disabled. 11 Reserved1 Currently defaults to Match0 mapped to inside range: Match1 disabled 6.3.2.3 Debug State Control Register 1 (DBGSCR1) Address: 0x0107 7 R W Reset 6 C3SC1 C3SC0 0 0 5 4 0 0 0 0 3 2 1 0 C1SC1 C1SC0 C0SC1 C0SC0 0 0 0 0 Figure 6-6. Debug State Control Register 1 (DBGSCR1) Read: Anytime. Write: If DBG is not armed. The state control register 1 selects the targeted next state whilst in State1. The matches refer to the outputs of the comparator match control logic as depicted in Figure 6-1 and described in Section 6.3.2.8, "Debug Comparator A Control Register (DBGACTL)". Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 6-7. DBGSCR1 Field Descriptions Field Description 1-0 C0SC[1:0] Channel 0 State Control. These bits select the targeted next state whilst in State1 following a match0. 3-2 C1SC[1:0] Channel 1 State Control. These bits select the targeted next state whilst in State1 following a match1. 7-6 C3SC[1:0] Channel 3 State Control. If EEVE !=10, these bits select the targeted next state whilst in State1 following a match3. If EEVE = 10, these bits select the targeted next state whilst in State1 following an external event. MC9S12ZVC Family Reference Manual , Rev. 1.9 184 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Table 6-8. State1 Match State Sequencer Transitions CxSC[1:0] Function 00 Match has no effect 01 Match forces sequencer to State2 10 Match forces sequencer to State3 11 Match forces sequencer to Final State In the case of simultaneous matches, the match on the higher channel number (3...0) has priority. 6.3.2.4 Debug State Control Register 2 (DBGSCR2) Address: 0x0108 7 R W Reset 6 C3SC1 C3SC0 0 0 5 4 0 0 0 0 3 2 1 0 C1SC1 C1SC0 C0SC1 C0SC0 0 0 0 0 Figure 6-7. Debug State Control Register 2 (DBGSCR2) Read: Anytime. Write: If DBG is not armed The state control register 2 selects the targeted next state whilst in State2. The matches refer to the outputs of the comparator match control logic as depicted in Figure 6-1 and described in Section 6.3.2.8, "Debug Comparator A Control Register (DBGACTL)". Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 6-9. DBGSCR2 Field Descriptions Field Description 1-0 C0SC[1:0] Channel 0 State Control. These bits select the targeted next state whilst in State2 following a match0. 3-2 C1SC[1:0] Channel 1 State Control. These bits select the targeted next state whilst in State2 following a match1. 7-6 C3SC[1:0] Channel 3 State Control. If EEVE !=10, these bits select the targeted next state whilst in State2 following a match3. If EEVE =10, these bits select the targeted next state whilst in State2 following an external event. Table 6-10. State2 Match State Sequencer Transitions CxSC[1:0] Function 00 Match has no effect 01 Match forces sequencer to State1 10 Match forces sequencer to State3 11 Match forces sequencer to Final State In the case of simultaneous matches, the match on the higher channel number (3...0) has priority. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 185 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.3.2.5 Debug State Control Register 3 (DBGSCR3) Address: 0x0109 R W 7 6 C3SC1 C3SC0 0 0 Reset 5 4 0 0 0 0 3 2 1 0 C1SC1 C1SC0 C0SC1 C0SC0 0 0 0 0 Figure 6-8. Debug State Control Register 3 (DBGSCR3) Read: Anytime. Write: If DBG is not armed. The state control register three selects the targeted next state whilst in State3. The matches refer to the outputs of the comparator match control logic as depicted in Figure 6-1 and described in Section 6.3.2.8, "Debug Comparator A Control Register (DBGACTL)". Comparators must be enabled by setting the comparator enable bit in the associated DBGxCTL control register. Table 6-11. DBGSCR3 Field Descriptions Field Description 1-0 C0SC[1:0] Channel 0 State Control. These bits select the targeted next state whilst in State3 following a match0. 3-2 C1SC[1:0] Channel 1 State Control. These bits select the targeted next state whilst in State3 following a match1. 7-6 C3SC[1:0] Channel 3 State Control. If EEVE !=10, these bits select the targeted next state whilst in State3 following a match3. If EEVE =10, these bits select the targeted next state whilst in State3 following an external event. Table 6-12. State3 Match State Sequencer Transitions CxSC[1:0] Function 00 Match has no effect 01 Match forces sequencer to State1 10 Match forces sequencer to State2 11 Match forces sequencer to Final State In the case of simultaneous matches, the match on the higher channel number (3....0) has priority. 6.3.2.6 Debug Event Flag Register (DBGEFR) Address: 0x010A R 7 6 5 4 3 2 1 0 0 TRIGF 0 EEVF ME3 0 ME1 ME0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 6-9. Debug Event Flag Register (DBGEFR) MC9S12ZVC Family Reference Manual , Rev. 1.9 186 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Read: Anytime. Write: Never DBGEFR contains flag bits each mapped to events whilst armed. Should an event occur, then the corresponding flag is set. With the exception of TRIGF, the bits can only be set when the ARM bit is set. The TRIGF bit is set if a TRIG event occurs when ARM is already set, or if the TRIG event occurs simultaneous to setting the ARM bit.All other flags can only be cleared by arming the DBG module. Thus the contents are retained after a debug session for evaluation purposes. A set flag does not inhibit the setting of other flags. Table 6-13. DBGEFR Field Descriptions Field Description 6 TRIGF TRIG Flag -- Indicates the occurrence of a TRIG event during the debug session. 0 No TRIG event 1 TRIG event 4 EEVF External Event Flag -- Indicates the occurrence of an external event during the debug session. 0 No external event 1 External event 3-0 ME[3:0] Match Event[3:0]-- Indicates a comparator match event on the corresponding comparator channel. 6.3.2.7 Debug Status Register (DBGSR) Address: 0x010B R 7 6 5 4 3 2 1 0 0 0 0 0 0 SSF2 SSF1 SSF0 -- 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset POR = Unimplemented or Reserved Figure 6-10. Debug Status Register (DBGSR) Read: Anytime. Write: Never. Table 6-14. DBGSR Field Descriptions Field Description 2-0 SSF[2:0] State Sequencer Flag Bits -- The SSF bits indicate the current State Sequencer state. During a debug session on each transition to a new state these bits are updated. If the debug session is ended by software clearing the ARM bit, then these bits retain their value to reflect the last state of the state sequencer before disarming. If a debug session is ended by an internal event, then the state sequencer returns to State0 and these bits are cleared to indicate that State0 was entered during the session. On arming the module the state sequencer enters State1 and these bits are forced to SSF[2:0] = 001. See Table 6-15. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 187 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Table 6-15. SSF[2:0] -- State Sequence Flag Bit Encoding 6.3.2.8 SSF[2:0] Current State 000 State0 (disarmed) 001 State1 010 State2 011 State3 100 Final State 101,110,111 Reserved Debug Comparator A Control Register (DBGACTL) Address: 0x0110 7 R 6 0 W Reset 5 NDB INST 0 0 0 4 0 0 3 2 1 0 RW RWE reserved COMPE 0 0 0 0 = Unimplemented or Reserved Figure 6-11. Debug Comparator A Control Register Read: Anytime. Write: If DBG not armed. Table 6-16. DBGACTL Field Descriptions Field Description 6 NDB Not Data Bus -- The NDB bit controls whether the match occurs when the data bus matches the comparator register value or when the data bus differs from the register value. This bit is ignored if the INST bit in the same register is set. 0 Match on data bus equivalence to comparator register contents 1 Match on data bus difference to comparator register contents 5 INST Instruction Select -- This bit configures the comparator to compare PC or data access addresses. 0 Comparator compares addresses of data accesses 1 Comparator compares PC address 3 RW 2 RWE 0 COMPE Read/Write Comparator Value Bit -- The RW bit controls whether read or write is used in compare for the associated comparator. The RW bit is ignored if RWE is clear or INST is set. 0 Write cycle is matched 1 Read cycle is matched Read/Write Enable Bit -- The RWE bit controls whether read or write comparison is enabled for the associated comparator. This bit is ignored when INST is set. 0 Read/Write is not used in comparison 1 Read/Write is used in comparison Enable Bit -- Determines if comparator is enabled 0 The comparator is not enabled 1 The comparator is enabled MC9S12ZVC Family Reference Manual , Rev. 1.9 188 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Table 6-17 shows the effect for RWE and RW on the comparison conditions. These bits are ignored if INST is set, because matches based on opcodes reaching the execution stage are data independent. Table 6-17. Read or Write Comparison Logic Table 6.3.2.9 RWE Bit RW Bit RW Signal Comment 0 x 0 RW not used in comparison 0 x 1 RW not used in comparison 1 0 0 Write match 1 0 1 No match 1 1 0 No match 1 1 1 Read match Debug Comparator A Address Register (DBGAAH, DBGAAM, DBGAAL) Address: 0x0115, DBGAAH 23 22 21 R 19 18 17 16 DBGAA[23:16] W Reset 20 0 0 0 0 0 0 0 0 14 13 12 11 10 9 8 Address: 0x0116, DBGAAM 15 R DBGAA[15:8] W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 0 0 0 0 0 Address: 0x0117, DBGAAL 7 R DBGAA[7:0] W Reset 0 0 0 0 Figure 6-12. Debug Comparator A Address Register Read: Anytime. Write: If DBG not armed. Table 6-18. DBGAAH, DBGAAM, DBGAAL Field Descriptions Field Description 23-16 DBGAA [23:16] Comparator Address Bits [23:16]-- These comparator address bits control whether the comparator compares the address bus bits [23:16] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one 15-0 DBGAA [15:0] Comparator Address Bits [15:0]-- These comparator address bits control whether the comparator compares the address bus bits [15:0] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 189 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.3.2.10 Address: Debug Comparator A Data Register (DBGAD) 0x0118, 0x0119, 0x011A, 0x011B 31 R W W 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Bit 31 Bit 30 Bit 29 Bit 28 Bit 27 Bit 26 Bit 25 Bit 24 Bit 23 Bit 22 Bit 21 Bit 20 Bit 19 Bit 18 Bit 17 Bit 16 Reset R 30 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 0 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Reset 0 0 0 0 0 0 Figure 6-13. Debug Comparator A Data Register (DBGAD) Read: Anytime. Write: If DBG not armed. This register can be accessed with a byte resolution, whereby DBGAD0, DBGAD1, DBGAD2, DBGAD3 map to DBGAD[31:0] respectively. Table 6-19. DBGAD Field Descriptions Field Description 31-16 Bits[31:16] (DBGAD0, DBGAD1) Comparator Data Bits -- These bits control whether the comparator compares the data bus bits to a logic one or logic zero. The comparator data bits are only used in comparison if the corresponding data mask bit is logic 1. 0 Compare corresponding data bit to a logic zero 1 Compare corresponding data bit to a logic one 15-0 Bits[15:0] (DBGAD2, DBGAD3) Comparator Data Bits -- These bits control whether the comparator compares the data bus bits to a logic one or logic zero. The comparator data bits are only used in comparison if the corresponding data mask bit is logic 1. 0 Compare corresponding data bit to a logic zero 1 Compare corresponding data bit to a logic one 6.3.2.11 Address: Debug Comparator A Data Mask Register (DBGADM) 0x011C, 0x011D, 0x011E, 0x011F 31 R W Reset R W Reset 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Bit 31 Bit 30 Bit 29 Bit 28 Bit 27 Bit 26 Bit 25 Bit 24 Bit 23 Bit 22 Bit 21 Bit 20 Bit 19 Bit 18 Bit 17 Bit 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 0 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 0 0 0 0 0 0 Figure 6-14. Debug Comparator A Data Mask Register (DBGADM) Read: Anytime. MC9S12ZVC Family Reference Manual , Rev. 1.9 190 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Write: If DBG not armed. This register can be accessed with a byte resolution, whereby DBGADM0, DBGADM1, DBGADM2, DBGADM3 map to DBGADM[31:0] respectively. Table 6-20. DBGADM Field Descriptions Field Description 31-16 Bits[31:16] (DBGADM0, DBGADM1) Comparator Data Mask Bits -- These bits control whether the comparator compares the data bus bits to the corresponding comparator data compare bits. 0 Do not compare corresponding data bit 1 Compare corresponding data bit 15-0 Bits[15:0] (DBGADM2, DBGADM3) Comparator Data Mask Bits -- These bits control whether the comparator compares the data bus bits to the corresponding comparator data compare bits. 0 Do not compare corresponding data bit 1 Compare corresponding data bit 6.3.2.12 Debug Comparator B Control Register (DBGBCTL) Address: 0x0120 R 7 6 0 0 0 0 W Reset 5 INST 0 4 0 0 3 2 1 0 RW RWE reserved COMPE 0 0 0 0 = Unimplemented or Reserved Figure 6-15. Debug Comparator B Control Register Read: Anytime. Write: If DBG not armed. Table 6-21. DBGBCTL Field Descriptions Field1 5 INST 3 RW 2 RWE 0 COMPE 1 Description Instruction Select -- This bit configures the comparator to compare PC or data access addresses. 0 Comparator compares addresses of data accesses 1 Comparator compares PC address Read/Write Comparator Value Bit -- The RW bit controls whether read or write is used in compare for the associated comparator. The RW bit is ignored if RWE is clear or INST is set. 0 Write cycle is matched 1 Read cycle is matched Read/Write Enable Bit -- The RWE bit controls whether read or write comparison is enabled for the associated comparator. This bit is ignored when INST is set. 0 Read/Write is not used in comparison 1 Read/Write is used in comparison Enable Bit -- Determines if comparator is enabled 0 The comparator is not enabled 1 The comparator is enabled If the ABCM field selects range mode comparisons, then DBGACTL bits configure the comparison, DBGBCTL is ignored. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 191 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Table 6-22 shows the effect for RWE and RW on the comparison conditions. These bits are ignored if INST is set, as matches based on instructions reaching the execution stage are data independent. Table 6-22. Read or Write Comparison Logic Table 6.3.2.13 RWE Bit RW Bit RW Signal Comment 0 x 0 RW not used in comparison 0 x 1 RW not used in comparison 1 0 0 Write match 1 0 1 No match 1 1 0 No match 1 1 1 Read match Debug Comparator B Address Register (DBGBAH, DBGBAM, DBGBAL) Address: 0x0125, DBGBAH 23 22 21 R 19 18 17 16 DBGBA[23:16] W Reset 20 0 0 0 0 0 0 0 0 14 13 12 11 10 9 8 Address: 0x0126, DBGBAM 15 R DBGBA[15:8] W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 0 0 0 0 0 Address: 0x0127, DBGBAL 7 R DBGBA[7:0] W Reset 0 0 0 0 Figure 6-16. Debug Comparator B Address Register Read: Anytime. Write: If DBG not armed. Table 6-23. DBGBAH, DBGBAM, DBGBAL Field Descriptions Field Description 23-16 DBGBA [23:16] Comparator Address Bits [23:16]-- These comparator address bits control whether the comparator compares the address bus bits [23:16] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one 15-0 DBGBA [15:0] Comparator Address Bits[15:0]-- These comparator address bits control whether the comparator compares the address bus bits [15:0] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one MC9S12ZVC Family Reference Manual , Rev. 1.9 192 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.3.2.14 Debug Comparator D Control Register (DBGDCTL) Address: 0x0140 R 7 6 0 0 5 0 0 INST W Reset 4 0 0 0 3 2 1 0 RW RWE reserved COMPE 0 0 0 0 = Unimplemented or Reserved Figure 6-17. Debug Comparator D Control Register Read: Anytime. Write: If DBG not armed. Table 6-24. DBGDCTL Field Descriptions Field1 5 INST 3 RW 2 RWE 0 COMPE 1 Description Instruction Select -- This bit configures the comparator to compare PC or data access addresses. 0 Comparator compares addresses of data accesses 1 Comparator compares PC address Read/Write Comparator Value Bit -- The RW bit controls whether read or write is used in compare for the associated comparator. The RW bit is ignored if RWE is clear or INST is set. 0 Write cycle is matched 1 Read cycle is matched Read/Write Enable Bit -- The RWE bit controls whether read or write comparison is enabled for the associated comparator. This bit is ignored if INST is set. 0 Read/Write is not used in comparison 1 Read/Write is used in comparison Enable Bit -- Determines if comparator is enabled 0 The comparator is not enabled 1 The comparator is enabled If the CDCM field selects range mode comparisons, then DBGCCTL bits configure the comparison, DBGDCTL is ignored. Table 6-25 shows the effect for RWE and RW on the comparison conditions. These bits are ignored if INST is set, because matches based on opcodes reaching the execution stage are data independent. Table 6-25. Read or Write Comparison Logic Table RWE Bit RW Bit RW Signal Comment 0 x 0 RW not used in comparison 0 x 1 RW not used in comparison 1 0 0 Write match 1 0 1 No match 1 1 0 No match 1 1 1 Read match MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 193 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.3.2.15 Debug Comparator D Address Register (DBGDAH, DBGDAM, DBGDAL) Address: 0x0145, DBGDAH 23 22 21 R 19 18 17 16 DBGDA[23:16] W Reset 20 0 0 0 0 0 0 0 0 14 13 12 11 10 9 8 Address: 0x0146, DBGDAM 15 R DBGDA[15:8] W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 0 0 0 0 0 Address: 0x0147, DBGDAL 7 R DBGDA[7:0] W Reset 0 0 0 0 Figure 6-18. Debug Comparator D Address Register Read: Anytime. Write: If DBG not armed. Table 6-26. DBGDAH, DBGDAM, DBGDAL Field Descriptions Field Description 23-16 DBGDA [23:16] Comparator Address Bits [23:16]-- These comparator address bits control whether the comparator compares the address bus bits [23:16] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one 15-0 DBGDA [15:0] Comparator Address Bits[15:0]-- These comparator address bits control whether the comparator compares the address bus bits [15:0] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one 6.4 Functional Description This section provides a complete functional description of the DBG module. 6.4.1 DBG Operation The DBG module operation is enabled by setting ARM in DBGC1. When armed it can be used to generate breakpoints to the CPU. The DBG module is made up of comparators, control logic, and the state sequencer, Figure 6-1. The comparators monitor the bus activity of the CPU. Comparators can be configured to monitor opcode addresses (effectively the PC address) or data accesses. Comparators can be configured during data MC9S12ZVC Family Reference Manual , Rev. 1.9 194 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module accesses to mask out individual data bus bits and to use R/W access qualification in the comparison. Comparators can be configured to monitor a range of addresses. When configured for data access comparisons, the match is generated if the address (and optionally data) of a data access matches the comparator value. Configured for monitoring opcode addresses, the match is generated when the associated opcode reaches the execution stage of the instruction queue, but before execution of that opcode. When a match with a comparator register value occurs, the associated control logic can force the state sequencer to another state (see Figure 6-19). The state sequencer can transition freely between the states 1, 2 and 3. On transition to Final State, a breakpoint can be generated and the state sequencer returns to state0, disarming the DBG. Independent of the comparators, state sequencer transitions can be forced by the external event input or by writing to the TRIG bit in the DBGC1 control register. 6.4.2 Comparator Modes The DBG contains three comparators, A, B, and D. Each comparator compares the address stored in DBGXAH, DBGXAM, and DBGXAL with the PC (opcode addresses) or selected address bus (data accesses). Furthermore, comparator A can compare the data buses to values stored in DBGXD3-0 and allow data bit masking. The comparators can monitor the buses for an exact address or an address range. The comparator configuration is controlled by the control register contents and the range control by the DBGC2 contents. The comparator control register also allows the type of data access to be included in the comparison through the use of the RWE and RW bits. The RWE bit controls whether the access type is compared for the associated comparator and the RW bit selects either a read or write access for a valid match. The INST bit in each comparator control register is used to determine the matching condition. By setting INST, the comparator matches opcode addresses, whereby the databus, data mask, RW and RWE bits are ignored. The comparator register must be loaded with the exact opcode address. The comparator can be configured to match memory access addresses by clearing the INST bit. Each comparator match can force a transition to another state sequencer state (see Section 6.4.3, "Events"). Once a successful comparator match has occurred, the condition that caused the original match is not verified again on subsequent matches. Thus if a particular data value is matched at a given address, this address may not contain that data value when a subsequent match occurs. Match[0, 1, 3] map directly to Comparators [A, B, D] respectively, except in range modes (see Section 6.3.2.2, "Debug Control Register2 (DBGC2)"). Comparator priority rules are described in the event priority section (Section 6.4.3.4, "Event Priorities"). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 195 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.4.2.1 Exact Address Comparator Match With range comparisons disabled, the match condition is an exact equivalence of address bus with the value stored in the comparator address registers. Qualification of the type of access (R/W) is also possible. Code may contain various access forms of the same address, for example a 16-bit access of ADDR[n] or byte access of ADDR[n+1] both access n+1. The comparators ensure that any access of the address defined by the comparator address register generates a match, as shown in the example of Table 6-27. Thus if the comparator address register contains ADDR[n+1] any access of ADDR[n+1] matches. This means that a 16-bit access of ADDR[n] or 32-bit access of ADDR[n-1] also match because they also access ADDR[n+1]. The right hand columns show the contents of DBGxA that would match for each access. Table 6-27. Comparator Address Bus Matches Access Address ADDR[n] ADDR[n+1] ADDR[n+2] ADDR[n+3] 32-bit ADDR[n] Match Match Match Match 16-bit ADDR[n] Match Match No Match No Match 16-bit ADDR[n+1] No Match Match Match No Match 8-bit ADDR[n] Match No Match No Match No Match If the comparator INST bit is set, the comparator address register contents are compared with the PC, the data register contents and access type bits are ignored. The comparator address register must be loaded with the address of the first opcode byte. 6.4.2.2 Address and Data Comparator Match Comparator A features data comparators, for data access comparisons. The comparators do not evaluate if accessed data is valid. Accesses across aligned 32-bit boundaries are split internally into consecutive accesses. The data comparator mapping to accessed addresses for the CPU is shown in Table 6-28, whereby the Address column refers to the lowest 2 bits of the lowest accessed address. This corresponds to the most significant data byte. Table 6-28. Comparator Data Byte Alignment Address[1:0] Data Comparator 00 DBGxD0 01 DBGxD1 10 DBGxD2 11 DBGxD3 The fixed mapping of data comparator bytes to addresses within a 32-bit data field ensures data matches independent of access size. To compare a single data byte within the 32-bit field, the other bytes within that field must be masked using the corresponding data mask registers. This ensures that any access of that byte (32-bit,16-bit or 8-bit) with matching data causes a match. If no bytes are masked then the data comparator always compares all 32-bits and can only generate a match on a 32-bit access with correct 32-bit data value. In this case, 8-bit or 16-bit accesses within the 32-bit field cannot generate a match even MC9S12ZVC Family Reference Manual , Rev. 1.9 196 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module if the contents of the addressed bytes match because all 32-bits must match. In Table 6-29 the Access Address column refers to the address bits[1:0] of the lowest accessed address (most significant data byte). Table 6-29. Data Register Use Dependency On CPU Access Type Memory Address[2:0] Case Access Address Access Size 000 001 010 011 1 00 32-bit DBGxD0 DBGxD1 DBGxD2 DBGxD3 2 01 32-bit DBGxD1 DBGxD2 DBGxD3 DBGxD0 3 10 32-bit DBGxD2 DBGxD3 DBGxD0 DBGxD1 4 11 32-bit DBGxD3 DBGxD0 DBGxD1 5 00 16-bit 6 01 16-bit 7 10 16-bit 8 11 16-bit 9 00 8-bit 10 01 8-bit 11 10 8-bit 12 11 8-bit 13 00 8-bit DBGxD0 100 101 110 DBGxD2 DBGxD1 DBGxD1 DBGxD2 DBGxD2 DBGxD3 DBGxD3 DBGxD0 DBGxD0 DBGxD1 DBGxD2 DBGxD3 DBGxD0 Denotes byte that is not accessed. For a match of a 32-bit access with data compare, the address comparator must be loaded with the address of the lowest accessed byte. For Case1 Table 6-29 this corresponds to 000, for Case2 it corresponds to 001. To compare all 32-bits, it is required that no bits are masked. 6.4.2.3 Data Bus Comparison NDB Dependency The NDB control bit allows data bus comparators to be configured to either match on equivalence or on difference. This allows monitoring of a difference in the contents of an address location from an expected value. When matching on an equivalence (NDB=0), each individual data bus bit position can be masked out by clearing the corresponding mask bit, so that it is ignored in the comparison. A match occurs when all data bus bits with corresponding mask bits set are equivalent. If all mask register bits are clear, then a match is based on the address bus only, the data bus is ignored. When matching on a difference, mask bits can be cleared to ignore bit positions. A match occurs when any data bus bit with corresponding mask bit set is different. Clearing all mask bits, causes all bits to be ignored and prevents a match because no difference can be detected. In this case address bus equivalence does not cause a match. Bytes that are not accessed are ignored. Thus when monitoring a multi byte field for a difference, partial accesses of the field only return a match if a difference is detected in the accessed bytes. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 197 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Table 6-30. NDB and MASK bit dependency 6.4.2.4 NDB DBGADM Comment 0 0 Do not compare data bus bit. 0 1 Compare data bus bit. Match on equivalence. 1 0 Do not compare data bus bit. 1 1 Compare data bus bit. Match on difference. Range Comparisons Range comparisons are accurate to byte boundaries. Thus for data access comparisons a match occurs if at least one byte of the access is in the range (inside range) or outside the range (outside range). For opcode comparisons only the address of the first opcode byte is compared with the range. When using the AB comparator pair for a range comparison, the data bus can be used for qualification by using the comparator A data and data mask registers. The DBGACTL RW and RWE bits can be used to qualify the range comparison on either a read or a write access. The corresponding DBGBCTL bits are ignored. The DBGACTL COMPE/INST bits are used for range comparisons. The DBGBCTL COMPE/INST bits are ignored in range modes. 6.4.2.4.1 Inside Range (CompA_Addr address CompB_Addr) In the Inside Range comparator mode, comparator pair A and B can be configured for range comparisons by the control register (DBGC2). The match condition requires a simultaneous valid match for both comparators. A match condition on only one comparator is not valid. 6.4.2.4.2 Outside Range (address < CompA_Addr or address > CompB_Addr) In the Outside Range comparator mode, comparator pair A and B can be configured for range comparisons. A single match condition on either of the comparators is recognized as valid. Outside range mode in combination with opcode address matches can be used to detect if opcodes are from an unexpected range. NOTE When configured for data access matches, an outside range match would typically occur at any interrupt vector fetch or register access. This can be avoided by setting the upper or lower range limit to $FFFFFF or $000000 respectively. Interrupt vector fetches do not cause opcode address matches. 6.4.3 Events Events are used as qualifiers for a state sequencer change of state. The state control register for the current state determines the next state for each event. An event can immediately initiate a transition to the next state sequencer state whereby the corresponding flag in DBGSR is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 198 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.4.3.1 6.4.3.1.1 Comparator Match Events Opcode Address Comparator Match The comparator is loaded with the address of the selected instruction and the comparator control register INST bit is set. When the opcode reaches the execution stage of the instruction queue a match occurs just before the instruction executes, allowing a breakpoint immediately before the instruction boundary. The comparator address register must contain the address of the first opcode byte for the match to occur. Opcode address matches are data independent thus the RWE and RW bits are ignored. CPU compares are disabled when BDM becomes active. 6.4.3.1.2 Data Access Comparator Match Data access matches are generated when an access occurs at the address contained in the comparator address register. The match can be qualified by the access data and by the access type (read/write). The breakpoint occurs a maximum of 2 instructions after the access in the CPU flow. Note, if a COF occurs between access and breakpoint, the opcode address of the breakpoint can be elsewhere in the memory map. Opcode fetches are not classed as data accesses. Thus data access matches are not possible on opcode fetches. 6.4.3.2 External Event The DBGEEV input signal can force a state sequencer transition, independent of internal comparator matches. The DBGEEV is an input signal mapped directly to a device pin and configured by the EEVE field in DBGC1. The external events can change the state sequencer state. If configured to change the state sequencer state, then the external match is mapped to DBGSCRx bits C3SC[1:0]. The DBGEFR bit EEVF is set when an external event occurs. 6.4.3.3 Setting The TRIG Bit Independent of comparator matches it is possible to initiate a breakpoint by writing the TRIG bit in DBGC1 to a logic "1". This forces the state sequencer into the Final State. the transition to Final State is followed immediately by a transition to State0. Breakpoints, if enabled, are issued on the transition to State0. 6.4.3.4 Event Priorities If simultaneous events occur, the priority is resolved according to Table 6-31. Lower priority events are suppressed. It is thus possible to miss a lower priority event if it occurs simultaneously with an event of a higher priority. The event priorities dictate that in the case of simultaneous matches, the match on the higher comparator channel number (3,1,0) has priority. If a write access to DBGC1 with the ARM bit position set occurs simultaneously to a hardware disarm from an internal event, then the ARM bit is cleared due to the hardware disarm. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 199 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module Table 6-31. Event Priorities Priority Source Action Highest TRIG Force immediately to final state DBGEEV Force to next state as defined by state control registers (EEVE=2'b10) Lowest 6.4.4 Match3 Force to next state as defined by state control registers Match1 Force to next state as defined by state control registers Match0 Force to next state as defined by state control registers State Sequence Control State 0 (Disarmed) ARM = 1 State1 Final State State2 State3 Figure 6-19. State Sequencer Diagram The state sequencer allows a defined sequence of events to provide a breakpoint. When the DBG module is armed by setting the ARM bit in the DBGC1 register, the state sequencer enters State1. Further transitions between the states are controlled by the state control registers and depend upon event occurrences (see Section 6.4.3, "Events). From Final State the only permitted transition is back to the disarmed State0. Transition between the states 1 to 3 is not restricted. Each transition updates the SSF[2:0] flags in DBGSR accordingly to indicate the current state. If breakpoints are enabled, then an event based transition to State0 generates the breakpoint request. A transition to State0 resulting from writing "0" to the ARM bit does not generate a breakpoint request. 6.4.4.1 Final State When the Final State is reached the state sequencer returns to State0 immediately and the debug module is disarmed.If breakpoints are enabled, a breakpoint request is generated on transitions to State0. 6.4.5 Breakpoints Breakpoints can be generated by state sequencer transitions to State0. Transitions to State0 are forced by the following events MC9S12ZVC Family Reference Manual , Rev. 1.9 200 NXP Semiconductors Chapter 6 S12Z DebugLite (S12ZDBGV3) Module * * * Through comparator matches via Final State. Through software writing to the TRIG bit in the DBGC1 register via Final State. Through the external event input (DBGEEV) via Final State. Breakpoints are not generated by software writes to DBGC1 that clear the ARM bit. 6.4.5.1 Breakpoints From Comparator Matches or External Events Breakpoints can be generated when the state sequencer transitions to State0 following a comparator match or an external event. 6.4.5.2 Breakpoints Generated Via The TRIG Bit When TRIG is written to "1", the Final State is entered. In the next cycle TRIG breakpoints are possible even if the DBG module is disarmed. 6.4.5.3 6.4.5.3.1 DBG Breakpoint Priorities DBG Breakpoint Priorities And BDC Interfacing Breakpoint operation is dependent on the state of the S12ZBDC module. BDM cannot be entered from a breakpoint unless the BDC is enabled (ENBDC bit is set in the BDC). If BDM is already active, breakpoints are disabled. In addition, while executing a BDC STEP1 command, breakpoints are disabled. When the DBG breakpoints are mapped to BDM (BDMBP set), then if a breakpoint request, either from a BDC BACKGROUND command or a DBG event, coincides with an SWI instruction in application code, (i.e. the DBG requests a breakpoint at the next instruction boundary and the next instruction is an SWI) then the CPU gives priority to the BDM request over the SWI request. On returning from BDM, the SWI from user code gets executed. Breakpoint generation control is summarized in Table 6-32. Table 6-32. Breakpoint Mapping Summary BRKCPU BDMBP Bit (DBGC1[4]) BDC Enabled BDM Active Breakpoint Mapping 0 X X X No Breakpoint 1 0 X 0 Breakpoint to SWI 1 0 1 1 No Breakpoint 1 1 0 X No Breakpoint 1 1 1 0 Breakpoint to BDM 1 1 1 1 No Breakpoint MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 201 Chapter 6 S12Z DebugLite (S12ZDBGV3) Module 6.5 6.5.1 Application Information Avoiding Unintended Breakpoint Re-triggering Returning from an instruction address breakpoint using an RTI or BDC GO command without PC modification, returns to the instruction that generated the breakpoint. If an active breakpoint or trigger still exists at that address, this can re-trigger, disarming the DBG. If configured for BDM breakpoints, the user must apply the BDC STEP1 command to increment the PC past the current instruction. If configured for SWI breakpoints, the DBG can be re configured in the SWI routine. If a comparator match occurs at an SWI vector address then a code SWI and DBG breakpoint SWI could occur simultaneously. In this case the SWI routine is executed twice before returning. 6.5.2 Breakpoints from other S12Z sources The DBG is neither affected by CPU BGND instructions, nor by BDC BACKGROUND commands. MC9S12ZVC Family Reference Manual , Rev. 1.9 202 NXP Semiconductors Chapter 7 ECC Generation Module (SRAM_ECCV1) 7.1 Introduction The purpose of ECC logic is to detect and correct as much as possible memory data bit errors. These soft errors, mainly generated by alpha radiation, can occur randomly during operation. "Soft error" means that only the information inside the memory cell is corrupt; the memory cell itself is not damaged. A write access with correct data solves the issue. If the ECC algorithm is able to correct the data, then the system can use this corrected data without any issues. If the ECC algorithm is able to detect, but not correct the error, then the system is able to ignore the memory read data to avoid system malfunction. The ECC value is calculated based on an aligned 2 byte memory data word. The ECC algorithm is able to detect and correct single bit ECC errors. Double bit ECC errors will be detected but the system is not able to correct these errors. This kind of ECC code is called SECDED code. This ECC code requires 6 additional parity bits for each 2 byte data word. 7.1.1 Features The SRAM_ECC module provides the ECC logic for the system memory based on a SECDED algorithm. The SRAM_ECC module includes the following features: * SECDED ECC code - Single bit error detection and correction per 2 byte data word - Double bit error detection per 2 byte data word * Memory initialization function * Byte wide system memory write access * Automatic single bit ECC error correction for read and write accesses * Debug logic to read and write raw use data and ECC values 7.2 Memory Map and Register Definition This section provides a detailed description of all memory and registers for the SRAM_ECC module. 7.2.1 Register Summary Figure 7-1 shows the summary of all implemented registers inside the SRAM_ECC module. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 203 Chapter 7 ECC Generation Module (SRAM_ECCV1) NOTE Register Address = Module Base Address + Address Offset, where the Module Base Address is defined at the MCU level and the Address Offset is defined at the module level. Address Offset Register Name 0x0000 ECCSTAT R 0x0001 ECCIE R 0x0002 ECCIF R 0x0003 - 0x0006 Reserved R 0x0007 ECCDPTRH R 0x0008 ECCDPTRM R 0x0009 ECCDPTRL R Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 RDY 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W W W SBEEIE SBEEIF 0 W DPTR[23:16] W DPTR[15:8] W W 0x000A - 0x000B Reserved R 0x000C ECCDDH R 0x000D ECCDDL R 0 DPTR[7:1] 0 0 0 0 0 0 0 0 ECCDW ECCDR W DDATA[15:8] W DDATA[7:0] W 0x000E ECCDE R 0x000F ECCDCMD R 0 0 DECC[5:0] W W ECCDRR 0 0 0 0 0 = Unimplemented, Reserved, Read as zero Figure 7-1. SRAM_ECC Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 204 NXP Semiconductors Chapter 7 ECC Generation Module (SRAM_ECCV1) 7.2.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field functions follow the register diagrams, in bit order. 7.2.2.1 ECC Status Register (ECCSTAT) Access: User read only1 Module Base + 0x00000 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 RDY 0 0 0 0 0 0 0 0 W Reset 1 Read: Anytime Write: Never Figure 7-2. ECC Status Register (ECCSTAT) Table 7-2. ECCSTAT Field Description Field Description 0 RDY ECC Ready-- Shows the status of the ECC module. 0 Internal SRAM initialization is ongoing, access to the SRAM is disabled 1 Internal SRAM initialization is done, access to the SRAM is enabled 7.2.2.2 ECC Interrupt Enable Register (ECCIE) Access: User read/write1 Module Base + 0x00001 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 SBEEIE 0 Read: Anytime Write: Anytime Figure 7-3. ECC Interrupt Enable Register (ECCIE) Table 7-3. ECCIE Field Description Field 0 SBEEIE Description Single bit ECC Error Interrupt Enable -- Enables Single ECC Error interrupt. 0 Interrupt request is disabled 1 Interrupt will be requested whenever SBEEIF is set MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 205 Chapter 7 ECC Generation Module (SRAM_ECCV1) 7.2.2.3 ECC Interrupt Flag Register (ECCIF) Access: User read/write1 Module Base + 0x0002 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 SBEEIF 0 Read: Anytime Write: Anytime, write 1 to clear Figure 7-4. ECC Interrupt Flag Register (ECCIF) Table 7-4. ECCIF Field Description Field 0 SBEEIF Description Single bit ECC Error Interrupt Flag -- The flag is set to 1 when a single bit ECC error occurs. 0 No occurrences of single bit ECC error since the last clearing of the flag 1 Single bit ECC error has occured since the last clearing of the flag MC9S12ZVC Family Reference Manual , Rev. 1.9 206 NXP Semiconductors Chapter 7 ECC Generation Module (SRAM_ECCV1) ECC Debug Pointer Register (ECCDPTRH, ECCDPTRM, ECCDPTRL) 7.2.2.4 Access: User read/write1 Module Base + 0x0007 7 6 5 4 R 3 2 1 0 0 0 0 0 DPTR[23:16] W Reset 0 0 0 0 Module Base + 0x0008 7 Access: User read/write 6 5 4 R 3 2 1 0 0 0 0 0 DPTR[15:8] W Reset 0 0 0 0 Module Base + 0x0009 7 Access: User read/write 6 5 R 3 2 1 0 0 0 0 0 0 DPTR[7:1] W Reset 4 0 0 0 0 = Unimplemented Figure 7-5. ECC Debug Pointer Register (ECCDPTRH, ECCDPTRM, ECCDPTRL) 1 Read: Anytime Write: Anytime Table 7-5. ECCDPTR Register Field Descriptions Field Description DPTR [23:0] ECC Debug Pointer -- This register contains the system memory address which will be used for a debug access. Address bits not relevant for SRAM address space are not writeable, so the software should read back the pointer value to make sure the register contains the intended memory address. It is possible to write an address value to this register which points outside the system memory. There is no additional monitoring of the register content; therefore, the software must make sure that the address value points to the system memory space. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 207 Chapter 7 ECC Generation Module (SRAM_ECCV1) ECC Debug Data (ECCDDH, ECCDDL) 7.2.2.5 Access: User read/write1 Module Base + 0x000C 7 6 5 4 R 3 2 1 0 0 0 0 0 DDATA[15:8] W Reset 0 0 0 0 Module Base + 0x000D 7 Access: User read/write 6 5 4 R 3 2 1 0 0 0 0 0 DDATA[7:0] W Reset 0 0 0 0 = Unimplemented Figure 7-6. ECC Debug Data (ECCDDH, ECCDDL) 1 Read: Anytime Write: Anytime Table 7-6. ECCDD Register Field Descriptions Field DDATA [23:0] 7.2.2.6 Description ECC Debug Raw Data -- This register contains the raw data which will be written into the system memory during a debug write command or the read data from the debug read command. ECC Debug ECC (ECCDE) Access: User read/write1 Module Base + 0x000E R 7 6 0 0 0 0 5 4 3 Reset 1 0 0 0 0 DECC[5:0] W 1 2 0 0 0 Read: Anytime Write: Anytime Figure 7-7. ECC Debug ECC (ECCDE) Table 7-7. ECCDE Field Description Field Description 5:0 ECC Debug ECC -- This register contains the raw ECC value which will be written into the system memory during a DECC[5:0] debug write command or the ECC read value from the debug read command. MC9S12ZVC Family Reference Manual , Rev. 1.9 208 NXP Semiconductors Chapter 7 ECC Generation Module (SRAM_ECCV1) 7.2.2.7 ECC Debug Command (ECCDCMD) Access: User read/write1 Module Base + 0x000F 7 R ECCDRR W Reset 1 0 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 1 0 ECCDW ECCDR 0 0 Read: Anytime Write: Anytime, in special mode only Figure 7-8. ECC Debug Command (ECCDCMD) Table 7-8. ECCDCMD Field Description Field Description 7 ECCDRR ECC Disable Read Repair Function-- Writing one to this register bit will disable the automatic single bit ECC error repair function during read access; see also chapter 7.3.7, "ECC Debug Behavior"". 0 Automatic single ECC error repair function is enabled 1 Automatic single ECC error repair function is disabled 1 ECCDW ECC Debug Write Command -- Writing one to this register bit will perform a debug write access, to the system memory. During this access the debug data word (DDATA) and the debug ECC value (DECC) will be written to the system memory address defined by DPTR. If the debug write access is done, this bit is cleared. Writing 0 has no effect. It is not possible to set this bit if the previous debug access is ongoing (ECCDW or ECCDR bit set). 0 ECCDR ECC Debug Read Command -- Writing one to this register bit will perform a debug read access from the system memory address defined by DPTR. If the debug read access is done, this bit is cleared and the raw memory read data are available in register DDATA and the raw ECC value is available in register DECC. Writing 0 has no effect. If the ECCDW and ECCDR bit are set at the same time, then only the ECCDW bit is set and the Debug Write Command is performed. It is not possible to set this bit if the previous debug access is ongoing (ECCDW or ECCDR bit set). 7.3 Functional Description The bus system allows 1, 2, 3 and 4 byte write access to a 4 byte aligned memory address, but the ECC value is generated based on an aligned 2 byte data word. Depending on the access type, the access is separated into different access cycles. Table 7-9 shows the different access types with the expected number of access cycles and the performed internal operations. Table 7-9. Memory access cycles Access type ECC error access cycle Internal operation Memory content Error indication 2 and 4 byte aligned write access -- 1 write to memory new data -- MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 209 Chapter 7 ECC Generation Module (SRAM_ECCV1) Table 7-9. Memory access cycles Access type 1 or 3 byte write, non-aligned 2 byte write read access 1 ECC error access cycle no 2 single bit 2 double bit 2 no 1 single bit 11 double bit 1 Internal operation Memory content Error indication read data from the memory old + new data -- corrected + new data SBEEIF unchanged initiator module is informed read from memory unchanged - read data from the memory write corrected data back to memory corrected data SBEEIF read from memory unchanged data mark as invalid write old + new data to the memory read data from the memory write corrected + new data to the memory read data from the memory ignore write data The next back to back read access to the memory will be delayed by one clock cycle The single bit ECC error generates an interrupt when enabled. The double bit ECC errors are reported by the SRAM_ECC module, but handled at MCU level. For more information, see the MMC description. 7.3.1 Aligned 2 and 4 Byte Memory Write Access During an aligned 2 or 4 byte memory write access, no ECC check is performed. The internal ECC logic generates the new ECC value based on the write data and writes the data words together with the generated ECC values into the memory. 7.3.2 Other Memory Write Access Other types of write accesses are separated into a read-modify-write operation. During the first cycle, the logic reads the data from the memory and performs an ECC check. If no ECC errors were detected then the logic generates the new ECC value based on the read and write data and writes the new data word together with the new ECC value into the memory. If required both 2 byte data words are updated. If the module detects a single bit ECC error during the read cycle, then the logic generates the new ECC value based on the corrected read and new write read. In the next cycle, the new data word and the new ECC value are written into the memory. If required both 2 byte data words are updated. The SBEEIF bit is set. Hence, the single bit ECC error was corrected by the write access. Figure 7-9 shows an example of a 2 byte non-aligned memory write access. If the module detects a double bit ECC error during the read cycle, then the write access to the memory is blocked and the initiator module is informed about the error. MC9S12ZVC Family Reference Manual , Rev. 1.9 210 NXP Semiconductors Chapter 7 ECC Generation Module (SRAM_ECCV1) . 2 byte use data ECC 2 byte use data read out data and correct if single bit ECC error was found correct read data 4 byte read data from system memory read out data and correct if single bit ECC error was found correct read data write data correct read data write data ECC write data ECC write data 2 byte write data correct read data ECC 4 byte write data to system memory Figure 7-9. 2 byte non-aligned write access 7.3.3 Memory Read Access During each memory read access an ECC check is performed. If the logic detects a single bit ECC error, then the module corrects the data, so that the access initiator module receives correct data. In parallel, the logic writes the corrected data back to the memory, so that this read access repairs the single bit ECC error. This automatic ECC read repair function is disabled by setting the ECCDRR bit. If a single bit ECC error was detected, then the SBEEIF flag is set. If the logic detects a double bit ECC error, then the data word is flagged as invalid, so that the access initiator module can ignore the data. 7.3.4 Memory Initialization To avoid spurious ECC error reporting, memory operations that allow a read before a first write (like the read-modify-write operation of the unaligned access) require that the memory contains valid ECC values before the first read-modify-write access is performed. The ECC module provides logic to initialize the complete memory content with zero during the power up phase. During the initialization process the access to the SRAM is disabled and the RDY status bit is cleared. If the initialization process is done, SRAM access is possible and the RDY status bit is set. 7.3.5 Interrupt Handling This section describes the interrupts generated by the SRAM_ECC module and their individual sources. Vector addresses and interrupt priority are defined at the MCU level. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 211 Chapter 7 ECC Generation Module (SRAM_ECCV1) Table 7-10. SRAM_ECC Interrupt Sources Module Interrupt Sources Single bit ECC error 7.3.6 Local Enable ECCIE[SBEEIE] ECC Algorithm The table below shows the equation for each ECC bit based on the 16 bit data word. Table 7-11. ECC Calculation ECC bit 7.3.7 Use data ECC[0] ~ ( ^ ( data[15:0] & 0x443F ) ) ECC[1] ~ ( ^ ( data[15:0] & 0x13C7 ) ) ECC[2] ~ ( ^ ( data[15:0] & 0xE1D1 ) ) ECC[3] ~ ( ^ ( data[15:0] & 0xEE60 ) ) ECC[4] ~ ( ^ ( data[15:0] & 0x3E8A ) ) ECC[5] ~ ( ^ ( data[15:0] & 0x993C ) ) ECC Debug Behavior For debug purposes, it is possible to read and write the uncorrected use data and the raw ECC value directly from the memory. For these debug accesses a register interface is available. The debug access is performed with the lowest priority; other memory accesses must be done before the debug access starts. If a debug access is requested during an ongoing memory initialization process, then the debug access is performed if the memory initialization process is done. If the ECCDRR bit is set, then the automatic single bit ECC error repair function for all read accesses is disabled. In this case a read access from a system memory location with single bit ECC error will produce correct data and the single bit ECC error is flagged by the SBEEIF, but the data inside the system memory are unchanged. By writing wrong ECC values into the system memory the debug access can be used to force single and double bit ECC errors to check the software error handling. It is not possible to set the ECCDW or ECCDR bit if the previous debug access is ongoing (ECCDW or ECCDR bit active). This ensures that the ECCDD and ECCDE registers contains consistent data. The software should read out the status of the ECCDW and ECCDR register bit before a new debug access is requested. 7.3.7.1 ECC Debug Memory Write Access Writing one to the ECCDW bit performs a debug write access to the memory address defined by register DPTR. During this access, the raw data DDATA and the ECC value DECC are written directly into the system memory. If the debug write access is done, the ECCDW register bit is cleared. The debug write MC9S12ZVC Family Reference Manual , Rev. 1.9 212 NXP Semiconductors Chapter 7 ECC Generation Module (SRAM_ECCV1) access is always a 2 byte aligned memory access, so that no ECC check is performed and no single or double bit ECC error indication is activated. 7.3.7.2 ECC Debug Memory Read Access Writing one to the ECCDR bit performs a debug read access from the memory address defined by register DPTR. If the ECCDR bit is cleared then the register DDATA contains the uncorrected read data from the memory. The register DECC contains the ECC value read from the memory. Independent of the ECCDRR register bit setting, the debug read access will not perform an automatic ECC repair during read access. During the debug read access no ECC check is performed, so that no single or double bit ECC error indication is activated. If the ECCDW and the ECCDR bits are set at the same time, then only the debug write access is performed. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 213 Chapter 7 ECC Generation Module (SRAM_ECCV1) MC9S12ZVC Family Reference Manual , Rev. 1.9 214 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Revision History Rev. No. (Item No) V07.00 V07.01 V07.02 8.1 Date (Submitted By) Sections Affected Substantial Change(s) 6 March 2013 * copied from V5 * adapted for Hearst: added VDDC, added EXTCON Bit 13 June 2013 * EXTCON register Bit: correct reset value to 1 * PMRF register Bit: corrected description 21 Aug. 2013 * * * correct bit numbering for CSAD Bit fPLLRST changed to fVCORST changed frequency upper limit of external Pierce Oscillator (XOSCLCP) from 16MHz to 20MHz * corrected typo in heading of CPMUOSC2 Field Description * Memory Map, CPMUAPIRH register: corrected address typo Introduction This specification describes the function of the Clock, Reset and Power Management Unit (S12CPMU_UHV_V7). * The Pierce oscillator (XOSCLCP) provides a robust, low-noise and low-power external clock source. It is designed for optimal start-up margin with typical crystal oscillators. * The Voltage regulator (VREGAUTO) operates from the range 6V to 18V. It provides all the required chip internal voltages and voltage monitors. * The Phase Locked Loop (PLL) provides a highly accurate frequency multiplier with internal filter. * The Internal Reference Clock (IRC1M) provides a 1MHz internal clock. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 215 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.1.1 Features The Pierce Oscillator (XOSCLCP) contains circuitry to dynamically control current gain in the output amplitude. This ensures a signal with low harmonic distortion, low power and good noise immunity. * Supports crystals or resonators from 4MHz to 20MHz. * High noise immunity due to input hysteresis and spike filtering. * Low RF emissions with peak-to-peak swing limited dynamically * Transconductance (gm) sized for optimum start-up margin for typical crystals * Dynamic gain control eliminates the need for external current limiting resistor * Integrated resistor eliminates the need for external bias resistor * Low power consumption: Operates from internal 1.8V (nominal) supply, Amplitude control limits power * Optional oscillator clock monitor reset * Optional full swing mode for higher immunity against noise injection on the cost of higher power consumption and increased emission The Voltage Regulator (VREGAUTO) has the following features: * Input voltage range from 6 to 18V (nominal operating range) * Low-voltage detect (LVD) with low-voltage interrupt (LVI) * Power-on reset (POR) * Low-voltage reset (LVR) * On Chip Temperature Sensor and Bandgap Voltage measurement via internal ADC channel. * Voltage Regulator providing Full Performance Mode (FPM) and Reduced Performance Mode (RPM) * External ballast device support to reduce internal power dissipation * Capable of supplying both the MCU internally plus external components * Over-temperature interrupt The Phase Locked Loop (PLL) has the following features: * Highly accurate and phase locked frequency multiplier * Configurable internal filter for best stability and lock time * Frequency modulation for defined jitter and reduced emission * Automatic frequency lock detector * Interrupt request on entry or exit from locked condition * PLL clock monitor reset * Reference clock either external (crystal) or internal square wave (1MHz IRC1M) based. * PLL stability is sufficient for LIN communication in slave mode, even if using IRC1M as reference clock The Internal Reference Clock (IRC1M) has the following features: MC9S12ZVC Family Reference Manual , Rev. 1.9 216 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) * * Frequency trimming (A factory trim value for 1MHz is loaded from Flash Memory into the IRCTRIM register after reset, which can be overwritten by application if required) Temperature Coefficient (TC) trimming. (A factory trim value is loaded from Flash Memory into the IRCTRIM register to turn off TC trimming after reset. Application can trim the TC if required by overwriting the IRCTRIM register). Other features of the S12CPMU_UHV_V7 include * Oscillator clock monitor to detect loss of crystal * Autonomous periodical interrupt (API) * Bus Clock Generator -- Clock switch to select either PLLCLK or external crystal/resonator as source of the Bus Clock -- PLLCLK divider to adjust system speed * System Reset generation from the following possible sources: -- Power-on reset (POR) -- Low-voltage reset (LVR) -- COP system watchdog, COP reset on time-out, windowed COP -- Loss of oscillation (Oscillator clock monitor fail) -- Loss of PLL clock (PLL clock monitor fail) -- External pin RESET MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 217 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.1.2 Modes of Operation This subsection lists and briefly describes all operating modes supported by the S12CPMU_UHV_V7. 8.1.2.1 Run Mode The voltage regulator is in Full Performance Mode (FPM). NOTE The voltage regulator is active, providing the nominal supply voltages with full current sourcing capability (see also Appendix for VREG electrical parameters). The features ACLK clock source, Low Voltage Interrupt (LVI), Low Voltage Reset (LVR) and Power-On Reset (POR) are available. The Phase Locked Loop (PLL) is on. The Internal Reference Clock (IRC1M) is on. The API is available. * * * PLL Engaged Internal (PEI) -- This is the default mode after System Reset and Power-On Reset. -- The Bus Clock is based on the PLLCLK. -- After reset the PLL is configured for 50MHz VCOCLK operation. Post divider is 0x03, so PLLCLK is VCOCLK divided by 4, that is 12.5MHz and Bus Clock is 6.25MHz. The PLL can be re-configured for other bus frequencies. -- The reference clock for the PLL (REFCLK) is based on internal reference clock IRC1M. PLL Engaged External (PEE) -- The Bus Clock is based on the PLLCLK. -- This mode can be entered from default mode PEI by performing the following steps: - Configure the PLL for desired bus frequency. - Program the reference divider (REFDIV[3:0] bits) to divide down oscillator frequency if necessary. - Enable the external oscillator (OSCE bit). - Wait for oscillator to start up (UPOSC=1) and PLL to lock (LOCK=1). PLL Bypassed External (PBE) -- The Bus Clock is based on the Oscillator Clock (OSCCLK). -- The PLLCLK is always on to qualify the external oscillator clock. Therefore it is necessary to make sure a valid PLL configuration is used for the selected oscillator frequency. -- This mode can be entered from default mode PEI by performing the following steps: - Make sure the PLL configuration is valid for the selected oscillator frequency. MC9S12ZVC Family Reference Manual , Rev. 1.9 218 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) - Enable the external oscillator (OSCE bit). - Wait for oscillator to start up (UPOSC=1). - Select the Oscillator Clock (OSCCLK) as source of the Bus Clock (PLLSEL=0). -- The PLLCLK is on and used to qualify the external oscillator clock. 8.1.2.2 Wait Mode For S12CPMU_UHV_V7 Wait Mode is the same as Run Mode. 8.1.2.3 Stop Mode This mode is entered by executing the CPU STOP instruction. The voltage regulator is in Reduced Performance Mode (RPM). NOTE The voltage regulator output voltage may degrade to a lower value than in Full Performance Mode (FPM), additionally the current sourcing capability is substantially reduced (see also Appendix for VREG electrical parameters). Only clock source ACLK is available and the Power On Reset (POR) circuitry is functional. The Low Voltage Interrupt (LVI) and Low Voltage Reset (LVR) are disabled. The API is available. The Phase Locked Loop (PLL) is off. The Internal Reference Clock (IRC1M) is off. Core Clock and Bus Clock are stopped. Depending on the setting of the PSTP and the OSCE bit, Stop Mode can be differentiated between Full Stop Mode (PSTP = 0 or OSCE=0) and Pseudo Stop Mode (PSTP = 1 and OSCE=1). In addition, the behavior of the COP in each mode will change based on the clocking method selected by COPOSCSEL[1:0]. * Full Stop Mode (PSTP = 0 or OSCE=0) External oscillator (XOSCLCP) is disabled. -- If COPOSCSEL1=0: The COP and RTI counters halt during Full Stop Mode. After wake-up from Full Stop Mode the Core Clock and Bus Clock are running on PLLCLK (PLLSEL=1). COP and RTI are running on IRCCLK (COPOSCSEL0=0, RTIOSCSEL=0). -- If COPOSCSEL1=1: The clock for the COP is derived from ACLK (trimmable internal RC-Oscillator clock). During Full Stop Mode the ACLK for the COP can be stopped (COP static) or running (COP active) depending on the setting of bit CSAD. When bit CSAD is set the ACLK clock source for the COP is stopped during Full Stop Mode and COP continues to operate after exit from Full Stop MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 219 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) * Mode. For this COP configuration (ACLK clock source, CSAD set) a latency time occurs when entering or exiting (Full, Pseudo) Stop Mode. When bit CSAD is clear the ACLK clock source is on for the COP during Full Stop Mode and COP is operating. During Full Stop Mode the RTI counter halts. After wake-up from Full Stop Mode the Core Clock and Bus Clock are running on PLLCLK (PLLSEL=1). The COP runs on ACLK and RTI is running on IRCCLK (COPOSCSEL0=0, RTIOSCSEL=0). Pseudo Stop Mode (PSTP = 1 and OSCE=1) External oscillator (XOSCLCP) continues to run. -- If COPOSCSEL1=0: If the respective enable bits are set (PCE=1 and PRE=1) the COP and RTI will continue to run with a clock derived from the oscillator clock. The clock configuration bits PLLSEL, COPOSCSEL0, RTIOSCSEL are unchanged. -- If COPOSCSEL1=1: If the respective enable bit for the RTI is set (PRE=1) the RTI will continue to run with a clock derived from the oscillator clock. The clock for the COP is derived from ACLK (trimmable internal RC-Oscillator clock). During Pseudo Stop Mode the ACLK for the COP can be stopped (COP static) or running (COP active) depending on the setting of bit CSAD. When bit CSAD is set the ACLK for the COP is stopped during Pseudo Stop Mode and COP continues to operate after exit from Pseudo Stop Mode. For this COP configuration (ACLK clock source, CSAD set) a latency time occurs when entering or exiting (Pseudo, Full) Stop Mode. When bit CSAD is clear the ACLK clock source is on for the COP during Pseudo Stop Mode and COP is operating. The clock configuration bits PLLSEL, COPOSCSEL0, RTIOSCSEL are unchanged. NOTE When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop Mode with OSCE bit already 1) the software must wait for a minimum time equivalent to the startup-time of the external oscillator tUPOSC before entering Pseudo Stop Mode. 8.1.2.4 Freeze Mode (BDM active) For S12CPMU_UHV_V7 Freeze Mode is the same as Run Mode except for RTI and COP which can be frozen in Active BDM Mode with the RSBCK bit in the CPMUCOP register. After exiting BDM Mode RTI and COP will resume its operations starting from this frozen status. Additionally the COP can be forced to the maximum time-out period in Active BDM Mode. For details please see also the RSBCK and CR[2:0] bit description field of Table 8-13 in Section 8.3.2.10, "S12CPMU_UHV_V7 COP Control Register (CPMUCOP) MC9S12ZVC Family Reference Manual , Rev. 1.9 220 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.1.3 S12CPMU_UHV_V7 Block Diagram VSUP vsup monitor ADC VDDA VSSA VDDX VSSX VSS VDDC Low Voltage Detect VDDA Low Voltage Detect Voltage VDDX, VDD, VDDF Regulator LVRF 6V to 18V Power-On Detect (VREGAUTO) PORF PMRF VSSC BCTL S12CPMU_UHV COP time-out COPRF OMRF Power-On Reset System Reset Reset Generator osc monitor fail BCTLC LVIE Low Voltage Interrupt LVDS PLL monitor fail RESET OSCCLK Monitor EXTAL Loop Controlled REFDIV[3:0] Pierce XTAL Oscillator (XOSCLCP) Reference 4MHz-20MHz Divider PSTP OSCCLK OSCCLK IRCTRIM[9:0] UPOSC Internal Reference Clock (IRC1M) IRCCLK OSCMOD REFCLK FBCLK Phase locked Loop with internal Filter (PLL) Post Divider 1,2,.32 divide by 4 HTDS Divide by 2*(SYNDIV+1) ACLK CSAD divide by 2 COPOSCSEL1 IRCCLK SYNDIV[5:0] Watchdog OSCCLK COPOSCSEL0 UPOSC=0 clears Bus Clock divide by 2 HT Interrupt APICLK APIE RTIE OSCCLK RTIOSCSEL PLL lock interrupt Autonomous API_EXTCLK Periodic Interrupt (API) ACLK COP time-out to Reset Generator IRCCLK CPMUCOP HTIE LOCKIE RTICLK PCE ECLK2X (Core Clock) High Temperature Sense RC Osc. COPCLK COP ECLK divide by 2 (Bus Clock) VCOCLK VCOFRQ[1:0] UPOSC PLLSEL PLLCLK REFFRQ[1:0] LOCK Oscillator status Interrupt OSCIE UPOSC=0 sets PLLSEL bit POSTDIV[4:0] OSCE Lock detect IRCCLK API Interrupt RTI Interrupt Real Time Interrupt (RTI) PRE CPMURTI Figure 8-1. Block diagram of S12CPMU_UHV_V7 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 221 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Figure 8-2 shows a block diagram of the XOSCLCP. OSCMOD Peak Detector Clock monitor fail Monitor + _ Gain Control OSCCLK VDD=1.8V VSS Rf Quartz Crystals EXTAL or Ceramic Resonators XTAL C1 C2 VSS VSS Figure 8-2. XOSCLCP Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 222 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.2 Signal Description This section lists and describes the signals that connect off chip as well as internal supply nodes and special signals. 8.2.1 RESET Pin RESET is an active-low bidirectional pin. As an input it initializes the MCU asynchronously to a known start-up state. As an open-drain output it indicates that an MCU-internal reset has been triggered. 8.2.2 EXTAL and XTAL These pins provide the interface for a crystal to control the internal clock generator circuitry. EXTAL is the input to the crystal oscillator amplifier. XTAL is the output of the crystal oscillator amplifier. If XOSCLCP is enabled, the MCU internal OSCCLK_LCP is derived from the EXTAL input frequency. If OSCE=0, the EXTAL pin is pulled down by an internal resistor of approximately 200 k and the XTAL pin is pulled down by an internal resistor of approximately 700 k. NOTE NXP recommends an evaluation of the application board and chosen resonator or crystal by the resonator or crystal supplier. The loop controlled circuit (XOSCLCP) is not suited for overtone resonators and crystals. 8.2.3 VSUP -- Regulator Power Input Pin Pin VSUP is the power input of VREGAUTO. All currents sourced into the regulator loads flow through this pin. A suitable reverse battery protection network can be used to connect VSUP to the car battery supply network. 8.2.4 VDDA, VSSA -- Regulator Reference Supply Pins Pins VDDA and VSSA,are used to supply the analog parts of the regulator. Internal precision reference circuits are supplied from these signals. An off-chip decoupling capacitor (220 nF(X7R ceramic)) between VDDA and VSSA is required and can improve the quality of this supply. VDDA has to be connected externally to VDDX. 8.2.5 VDDX, VSSX -- Pad Supply Pins VDDX is the supply domain for the digital Pads. VDDX has to be connected externally to VDDA. An off-chip decoupling capacitor (10F plus 220 nF(X7R ceramic)) between VDDX and VSSX is required. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 223 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) This supply domain is monitored by the Low Voltage Reset circuit. 8.2.6 .VDDC, VSSC -- CANPHY Supply Pin VDDC is the supply domain for the CANPHY. An off-chip decoupling capacitor (10F plus 220 nF(X7R ceramic)) between VDDC and VSSC is required. This supply domain is monitored by the Low Voltage Reset circuit. 8.2.7 BCTL -- Base Control Pin for external PNP BCTL is the ballast connection for the on chip voltage regulator. It provides the base current of an external BJT (PNP) of the VDDX and VDDA supplies. An additional 1K resistor between emitter and base of the BJT is required. 8.2.8 BCTLC -- Base Control Pin for external PNP for VDDC BCTLC is the ballast connection for the on chip voltage regulator. It provides the base current of an external BJT (PNP) of the VDDC supply. An additional 1K resistor between emitter and base of the BJT is required. 8.2.9 VSS -- Core Logic Ground Pin VSS is the core logic supply return pins. It must be grounded. 8.2.10 VDD -- Internal Regulator Output Supply (Core Logic) Node VDD is a device internal supply output of the voltage regulator that provides the power supply for the internal core logic. This supply domain is monitored by the Low Voltage Reset circuit and The Power On Reset circuit. 8.2.11 VDDF -- Internal Regulator Output Supply (NVM Logic) Node VDDF is a device internal supply output of the voltage regulator that provides the power supply for the NVM logic. This supply domain is monitored by the Low Voltage Reset circuit. 8.2.12 API_EXTCLK -- API external clock output pin This pin provides the signal selected via APIES and is enabled with APIEA bit. See the device specification if this clock output is available on this device and to which pin it might be connected. MC9S12ZVC Family Reference Manual , Rev. 1.9 224 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.2.13 TEMPSENSE -- Internal Temperature Sensor Output Voltage Depending on the VSEL setting either the voltage level generated by the temperature sensor or the VREG bandgap voltage is driven to a special channel input of the ADC Converter. See device level specification for connectivity of ADC special channels. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 225 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3 Memory Map and Registers This section provides a detailed description of all registers accessible in the S12CPMU_UHV_V7. 8.3.1 Module Memory Map The S12CPMU_UHV_V7 registers are shown in Figure 8-3. Address Offset Register Name 0x0000 CPMU RESERVED00 0x0001 CPMU RESERVED01 0x0002 CPMU RESERVED02 0x0003 CPMURFLG 0x0004 CPMU SYNR 0x0005 CPMU REFDIV 0x0006 CPMU POSTDIV 0x0007 CPMUIFLG 0x0008 CPMUINT 0x0009 CPMUCLKS 0x000A CPMUPLL 0x000B CPMURTI 0x000C CPMUCOP 0x000D RESERVED CPMUTEST0 0x000E RESERVED CPMUTEST1 R Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PORF LVRF OMRF PMRF W R W R W R 0 W R W R W R 0 COPRF VCOFRQ[1:0] REFFRQ[1:0] 0 SYNDIV[5:0] 0 0 0 0 0 0 0 0 PLLSEL PSTP CSAD COP OSCSEL1 0 0 FM1 FM0 RTDEC RTR6 RTR5 WCOP RSBCK 0 0 0 0 0 REFDIV[3:0] POSTDIV[4:0] W R W R W R W R RTIF RTIE W R W R W R 0 LOCK 0 0 0 PRE PCE RTI OSCSEL COP OSCSEL0 0 0 0 0 RTR4 RTR3 RTR2 RTR1 RTR0 0 0 CR2 CR1 CR0 0 0 0 0 0 0 0 0 0 0 0 0 LOCKIF LOCKIE WRTMASK OSCIF OSCIE UPOSC 0 W R W = Unimplemented or Reserved Figure 8-3. CPMU Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 226 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Address Offset Register Name 0x000F CPMU ARMCOP 0x0010 CPMU HTCTL 0x0011 CPMU LVCTL 0x0012 CPMU APICTL 0x0013 CPMUACLKTR 0x0014 CPMUAPIRH 0x0015 CPMUAPIRL 0x0016 RESERVED CPMUTEST3 0x0017 CPMUHTTR 0x0018 CPMU IRCTRIMH 0x0019 CPMU IRCTRIML 0x001A CPMUOSC 0x001B CPMUPROT 0x001C RESERVED CPMUTEST2 0x001D CPMU VREGCTL 0x001E CPMUOSC2 0x001F CPMU RESERVED1F Bit 7 6 5 4 3 2 1 Bit 0 R 0 0 0 0 0 0 0 0 W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 R 0 0 HTIE HTIF 0 0 0 LVIE LVIF 0 0 APIE APIF ACLKTR5 ACLKTR4 ACLKTR3 0 0 APIR15 APIR14 APIR13 APIR12 APIR11 APIR10 APIR9 APIR8 APIR7 APIR6 APIR5 APIR4 APIR3 APIR2 APIR1 APIR0 0 0 0 0 0 0 0 0 0 0 0 HTTR3 HTTR2 HTTR1 HTTR0 W R 0 VSEL HTE HTDS 0 0 LVDS APIES APIEA APIFE W R W R W R W R W R APICLK ACLKTR2 ACLKTR1 ACLKTR0 W R W HTOE R W R W R IRCTRIM[9:8] IRCTRIM[7:0] W R 0 TCTRIM[4:0] OSCE 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 EXTCON EXTXON INTXON OMRE OSCMOD 0 0 Reserved 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R 0 PROT 0 W = Unimplemented or Reserved Figure 8-3. CPMU Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 227 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2 Register Descriptions This section describes all the S12CPMU_UHV_V7 registers and their individual bits. Address order is as listed in Figure 8-3 8.3.2.1 S12CPMU_UHV_V7 Reset Flags Register (CPMURFLG) This register provides S12CPMU_UHV_V7 reset flags. Module Base + 0x0003 7 R 0 W Reset 0 6 5 PORF LVRF Note 1 Note 2 4 3 0 COPRF 0 Note 3 2 0 0 1 0 OMRF PMRF Note 4 Note 5 1. PORF is set to 1 when a power on reset occurs. Unaffected by System Reset. 2. LVRF is set to 1 when a low voltage reset occurs. Unaffected by System Reset. Set by power on reset. 3. COPRF is set to 1 when COP reset occurs. Unaffected by System Reset. Cleared by power on reset. 4. OMRF is set to 1 when an oscillator clock monitor reset occurs. Unaffected by System Reset. Cleared by power on reset. 5. PMRF is set to 1 when a PLL clock monitor reset occurs. Unaffected by System Reset. Cleared by power on reset. = Unimplemented or Reserved Figure 8-4. S12CPMU_UHV_V7 Flags Register (CPMURFLG) Read: Anytime Write: Refer to each bit for individual write conditions Table 8-1. CPMURFLG Field Descriptions Field Description 6 PORF Power on Reset Flag -- PORF is set to 1 when a power on reset occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Power on reset has not occurred. 1 Power on reset has occurred. 5 LVRF Low Voltage Reset Flag -- LVRF is set to 1 when a low voltage reset occurs on the VDD, VDDF or VDDX domain. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Low voltage reset has not occurred. 1 Low voltage reset has occurred. 3 COPRF COP Reset Flag -- COPRF is set to 1 when a COP (Computer Operating Properly) reset occurs. Refer to 8.5.5, "Computer Operating Properly Watchdog (COP) Reset" and 8.3.2.10, "S12CPMU_UHV_V7 COP Control Register (CPMUCOP)" for details.This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 COP reset has not occurred. 1 COP reset has occurred. MC9S12ZVC Family Reference Manual , Rev. 1.9 228 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-1. CPMURFLG Field Descriptions (continued) Field Description 1 OMRF Oscillator Clock Monitor Reset Flag -- OMRF is set to 1 when a loss of oscillator (crystal) clock occurs. Refer to8.5.3, "Oscillator Clock Monitor Reset" for details.This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Loss of oscillator clock reset has not occurred. 1 Loss of oscillator clock reset has occurred. 0 PMRF PLL Clock Monitor Reset Flag -- PMRF is set to 1 when a loss of PLL clock occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Loss of PLL clock reset has not occurred. 1 Loss of PLL clock reset has occurred. 8.3.2.2 S12CPMU_UHV_V7 Synthesizer Register (CPMUSYNR) The CPMUSYNR register controls the multiplication factor of the PLL and selects the VCO frequency range. Module Base + 0x0004 7 R W Reset 6 5 4 3 VCOFRQ[1:0] 0 2 1 0 0 0 0 SYNDIV[5:0] 1 0 1 1 Figure 8-5. S12CPMU_UHV_V7 Synthesizer Register (CPMUSYNR) Read: Anytime Write: If PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register), then write anytime. Else write has no effect. NOTE Writing to this register clears the LOCK and UPOSC status bits. If PLL has locked (LOCK=1) f VCO = 2 f REF SYNDIV + 1 NOTE fVCO must be within the specified VCO frequency lock range. Bus frequency fbus must not exceed the specified maximum. The VCOFRQ[1:0] bits are used to configure the VCO gain for optimal stability and lock time. For correct PLL operation the VCOFRQ[1:0] bits have to be selected according to the actual target VCOCLK MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 229 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) frequency as shown in Table 8-2. Setting the VCOFRQ[1:0] bits incorrectly can result in a non functional PLL (no locking and/or insufficient stability). Table 8-2. VCO Clock Frequency Selection 8.3.2.3 VCOCLK Frequency Ranges VCOFRQ[1:0] 32MHz <= fVCO <= 48MHz 00 48MHz < fVCO <= 64MHz 01 Reserved 10 Reserved 11 S12CPMU_UHV_V7 Reference Divider Register (CPMUREFDIV) The CPMUREFDIV register provides a finer granularity for the PLL multiplier steps when using the external oscillator as reference. Module Base + 0x0005 7 R REFFRQ[1:0] W Reset 6 0 0 5 4 0 0 0 0 3 2 1 0 1 1 REFDIV[3:0] 1 1 Figure 8-6. S12CPMU_UHV_V7 Reference Divider Register (CPMUREFDIV) Read: Anytime Write: If PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register), then write anytime. Else write has no effect. NOTE Write to this register clears the LOCK and UPOSC status bits. If XOSCLCP is enabled (OSCE=1) f OSC f REF = ------------------------------------ REFDIV + 1 If XOSCLCP is disabled (OSCE=0) f REF = f IRC1M The REFFRQ[1:0] bits are used to configure the internal PLL filter for optimal stability and lock time. For correct PLL operation the REFFRQ[1:0] bits have to be selected according to the actual REFCLK frequency as shown in Table 8-3. If IRC1M is selected as REFCLK (OSCE=0) the PLL filter is fixed configured for the 1MHz <= fREF <= 2MHz range. The bits can still be written but will have no effect on the PLL filter configuration. For OSCE=1, setting the REFFRQ[1:0] bits incorrectly can result in a non functional PLL (no locking and/or insufficient stability). MC9S12ZVC Family Reference Manual , Rev. 1.9 230 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-3. Reference Clock Frequency Selection if OSC_LCP is enabled REFCLK Frequency Ranges (OSCE=1) REFFRQ[1:0] 1MHz <= fREF <= 2MHz 00 2MHz < fREF <= 6MHz 01 6MHz < fREF <= 12MHz 10 fREF >12MHz 11 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 231 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.4 S12CPMU_UHV_V7 Post Divider Register (CPMUPOSTDIV) The POSTDIV register controls the frequency ratio between the VCOCLK and the PLLCLK. Module Base + 0x0006 R 7 6 5 0 0 0 0 0 0 4 3 1 0 1 1 POSTDIV[4:0] W Reset 2 0 0 0 = Unimplemented or Reserved Figure 8-7. S12CPMU_UHV_V7 Post Divider Register (CPMUPOSTDIV) Read: Anytime Write: If PLLSEL=1 write anytime, else write has no effect If PLL is locked (LOCK=1) f VCO f PLL = ---------------------------------------- POSTDIV + 1 If PLL is not locked (LOCK=0) f VCO f PLL = --------------4 If PLL is selected (PLLSEL=1) f PLL f bus = ------------2 When changing the POSTDIV[4:0] value or PLL transitions to locked stated (lock=1), it takes up to 32 Bus Clock cycles until fPLL is at the desired target frequency. This is because the post divider gradually changes (increases or decreases) fPLL in order to avoid sudden load changes for the on-chip voltage regulator. 8.3.2.5 S12CPMU_UHV_V7 Interrupt Flags Register (CPMUIFLG) This register provides S12CPMU_UHV_V7 status bits and interrupt flags. MC9S12ZVC Family Reference Manual , Rev. 1.9 232 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Module Base + 0x0007 7 R W Reset RTIF 0 6 5 0 0 0 0 4 LOCKIF 0 3 2 LOCK 0 0 0 1 OSCIF 0 0 UPOSC 0 = Unimplemented or Reserved Figure 8-8. S12CPMU_UHV_V7 Flags Register (CPMUIFLG) Read: Anytime Write: Refer to each bit for individual write conditions Table 8-4. CPMUIFLG Field Descriptions Field 7 RTIF Description Real Time Interrupt Flag -- RTIF is set to 1 at the end of the RTI period. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (RTIE=1), RTIF causes an interrupt request. 0 RTI time-out has not yet occurred. 1 RTI time-out has occurred. 4 LOCKIF PLL Lock Interrupt Flag -- LOCKIF is set to 1 when LOCK status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (LOCKIE=1), LOCKIF causes an interrupt request. 0 No change in LOCK bit. 1 LOCK bit has changed. 3 LOCK Lock Status Bit -- LOCK reflects the current state of PLL lock condition. Writes have no effect. While PLL is unlocked (LOCK=0) fPLL is fVCO / 4 to protect the system from high core clock frequencies during the PLL stabilization time tlock. 0 VCOCLK is not within the desired tolerance of the target frequency. fPLL = fVCO/4. 1 VCOCLK is within the desired tolerance of the target frequency. fPLL = fVCO/(POSTDIV+1). 1 OSCIF Oscillator Interrupt Flag -- OSCIF is set to 1 when UPOSC status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (OSCIE=1), OSCIF causes an interrupt request. 0 No change in UPOSC bit. 1 UPOSC bit has changed. 0 UPOSC Oscillator Status Bit -- UPOSC reflects the status of the oscillator. Writes have no effect. Entering Full Stop Mode UPOSC is cleared. 0 The oscillator is off or oscillation is not qualified by the PLL. 1 The oscillator is qualified by the PLL. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 233 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.6 S12CPMU_UHV_V7 Interrupt Enable Register (CPMUINT) This register enables S12CPMU_UHV_V7 interrupt requests. Module Base + 0x0008 7 R W Reset RTIE 0 6 5 0 0 0 0 4 LOCKIE 0 3 2 0 0 0 0 1 0 OSCIE 0 0 0 = Unimplemented or Reserved Figure 8-9. S12CPMU_UHV_V7 Interrupt Enable Register (CPMUINT) Read: Anytime Write: Anytime Table 8-5. CPMUINT Field Descriptions Field 7 RTIE 4 LOCKIE 1 OSCIE Description Real Time Interrupt Enable Bit 0 Interrupt requests from RTI are disabled. 1 Interrupt will be requested whenever RTIF is set. PLL Lock Interrupt Enable Bit 0 PLL LOCK interrupt requests are disabled. 1 Interrupt will be requested whenever LOCKIF is set. Oscillator Corrupt Interrupt Enable Bit 0 Oscillator Corrupt interrupt requests are disabled. 1 Interrupt will be requested whenever OSCIF is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 234 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.7 S12CPMU_UHV_V7 Clock Select Register (CPMUCLKS) This register controls S12CPMU_UHV_V7 clock selection. Module Base + 0x0009 R W Reset 7 6 5 4 3 2 1 0 PLLSEL PSTP CSAD COP OSCSEL1 PRE PCE RTI OSCSEL COP OSCSEL0 1 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 8-10. S12CPMU_UHV_V7 Clock Select Register (CPMUCLKS) Read: Anytime Write: * * * * * * Only possible if PROT=0 (CPMUPROT register) in all MCU Modes (Normal and Special Mode). All bits in Special Mode (if PROT=0). PLLSEL, PSTP, PRE, PCE, RTIOSCSEL: In Normal Mode (if PROT=0). CSAD: In Normal Mode (if PROT=0) until CPMUCOP write once has taken place. COPOSCSEL0: In Normal Mode (if PROT=0) until CPMUCOP write once has taken place. If COPOSCSEL0 was cleared by UPOSC=0 (entering Full Stop Mode with COPOSCSEL0=1 or insufficient OSCCLK quality), then COPOSCSEL0 can be set once again. COPOSCSEL1: In Normal Mode (if PROT=0) until CPMUCOP write once has taken place. COPOSCSEL1 will not be cleared by UPOSC=0 (entering Full Stop Mode with COPOSCSEL1=1 or insufficient OSCCLK quality if OSCCLK is used as clock source for other clock domains: for instance core clock etc.). NOTE After writing CPMUCLKS register, it is strongly recommended to read back CPMUCLKS register to make sure that write of PLLSEL, RTIOSCSEL and COPOSCSEL was successful. This is because under certain circumstances writes have no effect or bits are automatically changed (see CPMUCLKS register and bit descriptions). NOTE When using the oscillator clock as system clock (write PLLSEL = 0) it is highly recommended to enable the oscillator clock monitor reset feature (write OMRE = 1 in CPMUOSC2 register). If the oscillator monitor reset feature is disabled (OMRE = 0) and the oscillator clock is used as system clock, the system will stall in case of loss of oscillation. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 235 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-6. CPMUCLKS Descriptions Field 7 PLLSEL Description PLL Select Bit This bit selects the PLLCLK as source of the System Clocks (Core Clock and Bus Clock). PLLSEL can only be set to 0, if UPOSC=1. UPOSC= 0 sets the PLLSEL bit. Entering Full Stop Mode sets the PLLSEL bit. 0 System clocks are derived from OSCCLK if oscillator is up (UPOSC=1, fbus = fosc / 2). 1 System clocks are derived from PLLCLK, fbus = fPLL / 2. 6 PSTP Pseudo Stop Bit This bit controls the functionality of the oscillator during Stop Mode. 0 Oscillator is disabled in Stop Mode (Full Stop Mode). 1 Oscillator continues to run in Stop Mode (Pseudo Stop Mode), option to run RTI and COP. Note: Pseudo Stop Mode allows for faster STOP recovery and reduces the mechanical stress and aging of the resonator in case of frequent STOP conditions at the expense of a slightly increased power consumption. Note: When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop Mode with OSCE bit already 1) the software must wait for a minimum time equivalent to the startup-time of the external oscillator tUPOSC before entering Pseudo Stop Mode. 5 CSAD COP in Stop Mode ACLK Disable -- This bit disables the ACLK for the COP in Stop Mode. Hence the COP is static while in Stop Mode and continues to operate after exit from Stop Mode. Due to clock domain crossing synchronization there is a latency time to enter and exit Stop Mode if COP clock source is ACLK and this clock is stopped in Stop Mode. This maximum latency time is 4 ACLK cycles which must be added to the Stop Mode recovery time tSTP_REC from exit of current Stop Mode to entry of next Stop Mode. This latency time occurs no matter which Stop Mode (Full, Pseudo) is currently exited or entered next. After exit from Stop Mode (Pseudo, Full) for 2 ACLK cycles no Stop Mode request (STOP instruction) should be generated to make sure the COP counter increments at each Stop Mode exit. This bit does not influence the ACLK for the API. 0 COP running in Stop Mode (ACLK for COP enabled in Stop Mode). 1 COP stopped in Stop Mode (ACLK for COP disabled in Stop Mode) 4 COP OSCSEL1 COP Clock Select 1 -- COPOSCSEL0 and COPOSCSEL1 combined determine the clock source to the COP (see also Table 8-7). If COPOSCSEL1 = 1, COPOSCSEL0 has no effect regarding clock select and changing the COPOSCSEL0 bit does not re-start the COP time-out period. COPOSCSEL1 selects the clock source to the COP to be either ACLK (derived from trimmable internal RC-Oscillator) or clock selected via COPOSCSEL0 (IRCCLK or OSCCLK). Changing the COPOSCSEL1 bit re-starts the COP time-out period. COPOSCSEL1 can be set independent from value of UPOSC. UPOSC= 0 does not clear the COPOSCSEL1 bit. 0 COP clock source defined by COPOSCSEL0 1 COP clock source is ACLK derived from a trimmable internal RC-Oscillator 3 PRE RTI Enable During Pseudo Stop Bit -- PRE enables the RTI during Pseudo Stop Mode. 0 RTI stops running during Pseudo Stop Mode. 1 RTI continues running during Pseudo Stop Mode if RTIOSCSEL=1. Note: If PRE=0 or RTIOSCSEL=0 then the RTI will go static while Stop Mode is active. The RTI counter will not be reset. 2 PCE COP Enable During Pseudo Stop Bit -- PCE enables the COP during Pseudo Stop Mode. 0 COP stops running during Pseudo Stop Mode 1 COP continues running during Pseudo Stop Mode if COPOSCSEL=1 Note: If PCE=0 or COPOSCSEL=0 then the COP will go static while Stop Mode is active. The COP counter will not be reset. MC9S12ZVC Family Reference Manual , Rev. 1.9 236 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-6. CPMUCLKS Descriptions (continued) Field Description 1 RTI Clock Select-- RTIOSCSEL selects the clock source to the RTI. Either IRCCLK or OSCCLK. Changing the RTIOSCSEL RTIOSCSEL bit re-starts the RTI time-out period. RTIOSCSEL can only be set to 1, if UPOSC=1. UPOSC= 0 clears the RTIOSCSEL bit. 0 RTI clock source is IRCCLK. 1 RTI clock source is OSCCLK. 0 COP OSCSEL0 COP Clock Select 0 -- COPOSCSEL0 and COPOSCSEL1 combined determine the clock source to the COP (see also Table 8-7) If COPOSCSEL1 = 1, COPOSCSEL0 has no effect regarding clock select and changing the COPOSCSEL0 bit does not re-start the COP time-out period. When COPOSCSEL1=0,COPOSCSEL0 selects the clock source to the COP to be either IRCCLK or OSCCLK. Changing the COPOSCSEL0 bit re-starts the COP time-out period. COPOSCSEL0 can only be set to 1, if UPOSC=1. UPOSC= 0 clears the COPOSCSEL0 bit. 0 COP clock source is IRCCLK. 1 COP clock source is OSCCLK Table 8-7. COPOSCSEL1, COPOSCSEL0 clock source select description COPOSCSEL1 COPOSCSEL0 COP clock source 0 0 IRCCLK 0 1 OSCCLK 1 x ACLK MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 237 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.8 S12CPMU_UHV_V7 PLL Control Register (CPMUPLL) This register controls the PLL functionality. Module Base + 0x000A R 7 6 0 0 0 0 W Reset 5 4 FM1 FM0 0 0 3 2 1 0 0 0 0 0 0 0 0 0 Figure 8-11. S12CPMU_UHV_V7 PLL Control Register (CPMUPLL) Read: Anytime Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has no effect. NOTE Write to this register clears the LOCK and UPOSC status bits. NOTE Care should be taken to ensure that the bus frequency does not exceed the specified maximum when frequency modulation is enabled. Table 8-8. CPMUPLL Field Descriptions Field 5, 4 FM1, FM0 Description PLL Frequency Modulation Enable Bits -- FM1 and FM0 enable frequency modulation on the VCOCLK. This is to reduce noise emission. The modulation frequency is fref divided by 16. See Table 8-9 for coding. Table 8-9. FM Amplitude selection FM1 FM0 FM Amplitude / fVCO Variation 0 0 FM off 0 1 1% 1 0 2% 1 1 4% MC9S12ZVC Family Reference Manual , Rev. 1.9 238 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.9 S12CPMU_UHV_V7 RTI Control Register (CPMURTI) This register selects the time-out period for the Real Time Interrupt. The clock source for the RTI is either IRCCLK or OSCCLK depending on the setting of the RTIOSCSEL bit. In Stop Mode with PSTP=1 (Pseudo Stop Mode) and RTIOSCSEL=1 the RTI continues to run, else the RTI counter halts in Stop Mode. Module Base + 0x000B R W Reset 7 6 5 4 3 2 1 0 RTDEC RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0 0 0 0 0 0 0 0 0 Figure 8-12. S12CPMU_UHV_V7 RTI Control Register (CPMURTI) Read: Anytime Write: Anytime NOTE A write to this register starts the RTI time-out period. A change of the RTIOSCSEL bit (writing a different value or loosing UPOSC status) re-starts the RTI time-out period. Table 8-10. CPMURTI Field Descriptions Field 7 RTDEC Description Decimal or Binary Divider Select Bit -- RTDEC selects decimal or binary based prescaler values. 0 Binary based divider value. See Table 8-11 1 Decimal based divider value. See Table 8-12 6-4 RTR[6:4] Real Time Interrupt Prescale Rate Select Bits -- These bits select the prescale rate for the RTI.See Table 8-11 and Table 8-12. 3-0 RTR[3:0] Real Time Interrupt Modulus Counter Select Bits -- These bits select the modulus counter target value to provide additional granularity.Table 8-11 and Table 8-12 show all possible divide values selectable by the CPMURTI register. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 239 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-11. RTI Frequency Divide Rates for RTDEC = 0 RTR[6:4] = RTR[3:0] 1 000 (OFF) 001 (210) 010 (211) 011 (212) 100 (213) 101 (214) 110 (215) 111 (216) 0000 (1) OFF1 210 211 212 213 214 215 216 0001 (2) OFF 2x210 2x211 2x212 2x213 2x214 2x215 2x216 0010 (3) OFF 3x210 3x211 3x212 3x213 3x214 3x215 3x216 0011 (4) OFF 4x210 4x211 4x212 4x213 4x214 4x215 4x216 0100 (5) OFF 5x210 5x211 5x212 5x213 5x214 5x215 5x216 0101 (6) OFF 6x210 6x211 6x212 6x213 6x214 6x215 6x216 0110 (7) OFF 7x210 7x211 7x212 7x213 7x214 7x215 7x216 0111 (8) OFF 8x210 8x211 8x212 8x213 8x214 8x215 8x216 1000 (9) OFF 9x210 9x211 9x212 9x213 9x214 9x215 9x216 1001 (10) OFF 10x210 10x211 10x212 10x213 10x214 10x215 10x216 1010 (11) OFF 11x210 11x211 11x212 11x213 11x214 11x215 11x216 1011 (12) OFF 12x210 12x211 12x212 12x213 12x214 12x215 12x216 1100 (13) OFF 13x210 13x211 13x212 13x213 13x214 13x215 13x216 1101 (14) OFF 14x210 14x211 14x212 14x213 14x214 14x215 14x216 1110 (15) OFF 15x210 15x211 15x212 15x213 15x214 15x215 15x216 1111 (16) OFF 16x210 16x211 16x212 16x213 16x214 16x215 16x216 Denotes the default value out of reset.This value should be used to disable the RTI to ensure future backwards compatibility. MC9S12ZVC Family Reference Manual , Rev. 1.9 240 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-12. RTI Frequency Divide Rates for RTDEC=1 RTR[6:4] = RTR[3:0] 000 (1x103) 001 (2x103) 010 (5x103) 011 (10x103) 100 (20x103) 101 (50x103) 110 (100x103) 111 (200x103) 0000 (1) 1x103 2x103 5x103 10x103 20x103 50x103 100x103 200x103 0001 (2) 2x103 4x103 10x103 20x103 40x103 100x103 200x103 400x103 0010 (3) 3x103 6x103 15x103 30x103 60x103 150x103 300x103 600x103 0011 (4) 4x103 8x103 20x103 40x103 80x103 200x103 400x103 800x103 0100 (5) 5x103 10x103 25x103 50x103 100x103 250x103 500x103 1x106 0101 (6) 6x103 12x103 30x103 60x103 120x103 300x103 600x103 1.2x106 0110 (7) 7x103 14x103 35x103 70x103 140x103 350x103 700x103 1.4x106 0111 (8) 8x103 16x103 40x103 80x103 160x103 400x103 800x103 1.6x106 1000 (9) 9x103 18x103 45x103 90x103 180x103 450x103 900x103 1.8x106 1001 (10) 10 x103 20x103 50x103 100x103 200x103 500x103 1x106 2x106 1010 (11) 11 x103 22x103 55x103 110x103 220x103 550x103 1.1x106 2.2x106 1011 (12) 12x103 24x103 60x103 120x103 240x103 600x103 1.2x106 2.4x106 1100 (13) 13x103 26x103 65x103 130x103 260x103 650x103 1.3x106 2.6x106 1101 (14) 14x103 28x103 70x103 140x103 280x103 700x103 1.4x106 2.8x106 1110 (15) 15x103 30x103 75x103 150x103 300x103 750x103 1.5x106 3x106 1111 (16) 16x103 32x103 80x103 160x103 320x103 800x103 1.6x106 3.2x106 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 241 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.10 S12CPMU_UHV_V7 COP Control Register (CPMUCOP) This register controls the COP (Computer Operating Properly) watchdog. The clock source for the COP is either ACLK, IRCCLK or OSCCLK depending on the setting of the COPOSCSEL0 and COPOSCSEL1 bit (see also Table 8-7). In Stop Mode with PSTP=1 (Pseudo Stop Mode), COPOSCSEL0=1 and COPOSCEL1=0 and PCE=1 the COP continues to run, else the COP counter halts in Stop Mode with COPOSCSEL1 =0. In Full Stop Mode and Pseudo Stop Mode with COPOSCSEL1=1 the COP continues to run. Module Base + 0x000C R W Reset 7 6 WCOP RSBCK F 0 5 4 3 0 0 0 0 0 WRTMASK 0 2 1 0 CR2 CR1 CR0 F F F After de-assert of System Reset the values are automatically loaded from the Flash memory. See Device specification for details. = Unimplemented or Reserved Figure 8-13. S12CPMU_UHV_V7 COP Control Register (CPMUCOP) Read: Anytime Write: 1. RSBCK: Anytime in Special Mode; write to "1" but not to "0" in Normal Mode 2. WCOP, CR2, CR1, CR0: -- Anytime in Special Mode, when WRTMASK is 0, otherwise it has no effect -- Write once in Normal Mode, when WRTMASK is 0, otherwise it has no effect. - Writing CR[2:0] to "000" has no effect, but counts for the "write once" condition. - Writing WCOP to "0" has no effect, but counts for the "write once" condition. When a non-zero value is loaded from Flash to CR[2:0] the COP time-out period is started. A change of the COPOSCSEL0 or COPOSCSEL1 bit (writing a different value) or loosing UPOSC status while COPOSCSEL1 is clear and COPOSCSEL0 is set, re-starts the COP time-out period. In Normal Mode the COP time-out period is restarted if either of these conditions is true: 1. Writing a non-zero value to CR[2:0] (anytime in special mode, once in normal mode) with WRTMASK = 0. 2. Writing WCOP bit (anytime in Special Mode, once in Normal Mode) with WRTMASK = 0. 3. Changing RSBCK bit from "0" to "1". In Special Mode, any write access to CPMUCOP register restarts the COP time-out period. MC9S12ZVC Family Reference Manual , Rev. 1.9 242 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-13. CPMUCOP Field Descriptions Field Description 7 WCOP Window COP Mode Bit -- When set, a write to the CPMUARMCOP register must occur in the last 25% of the selected period. A write during the first 75% of the selected period generates a COP reset. As long as all writes occur during this window, $55 can be written as often as desired. Once $AA is written after the $55, the time-out logic restarts and the user must wait until the next window before writing to CPMUARMCOP. Table 8-14 shows the duration of this window for the seven available COP rates. 0 Normal COP operation 1 Window COP operation 6 RSBCK COP and RTI Stop in Active BDM Mode Bit 0 Allows the COP and RTI to keep running in Active BDM mode. 1 Stops the COP and RTI counters whenever the part is in Active BDM mode. 5 WRTMASK 2-0 CR[2:0] Write Mask for WCOP and CR[2:0] Bit -- This write-only bit serves as a mask for the WCOP and CR[2:0] bits while writing the CPMUCOP register. It is intended for BDM writing the RSBCK without changing the content of WCOP and CR[2:0]. 0 Write of WCOP and CR[2:0] has an effect with this write of CPMUCOP 1 Write of WCOP and CR[2:0] has no effect with this write of CPMUCOP. (Does not count for "write once".) COP Watchdog Timer Rate Select -- These bits select the COP time-out rate (see Table 8-14 and Table 8-15). Writing a nonzero value to CR[2:0] enables the COP counter and starts the time-out period. A COP counter time-out causes a System Reset. This can be avoided by periodically (before time-out) initializing the COP counter via the CPMUARMCOP register. While all of the following four conditions are true the CR[2:0], WCOP bits are ignored and the COP operates at highest time-out period (2 24 cycles) in normal COP mode (Window COP mode disabled): 1) COP is enabled (CR[2:0] is not 000) 2) BDM mode active 3) RSBCK = 0 4) Operation in Special Mode Table 8-14. COP Watchdog Rates if COPOSCSEL1=0. (default out of reset) CR2 CR1 CR0 COPCLK Cycles to time-out (COPCLK is either IRCCLK or OSCCLK depending on the COPOSCSEL0 bit) 0 0 0 COP disabled 0 0 1 2 14 0 1 0 2 16 0 1 1 2 18 1 0 0 2 20 1 0 1 2 22 1 1 0 2 23 1 1 1 2 24 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 243 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-15. COP Watchdog Rates if COPOSCSEL1=1. CR2 CR1 CR0 COPCLK Cycles to time-out (COPCLK is ACLK divided by 2) 0 0 0 COP disabled 0 0 1 27 0 1 0 29 0 1 1 2 11 1 0 0 2 13 1 0 1 2 15 1 1 0 2 16 1 1 1 2 17 MC9S12ZVC Family Reference Manual , Rev. 1.9 244 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.11 Reserved Register CPMUTEST0 NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in Special Mode can alter the S12CPMU_UHV_V7's functionality. Module Base + 0x000D R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 8-14. Reserved Register (CPMUTEST0) Read: Anytime Write: Only in Special Mode 8.3.2.12 Reserved Register CPMUTEST1 NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in Special Mode can alter the S12CPMU_UHV_V7's functionality. Module Base + 0x000E R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 8-15. Reserved Register (CPMUTEST1) Read: Anytime Write: Only in Special Mode MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 245 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.13 S12CPMU_UHV_V7 COP Timer Arm/Reset Register (CPMUARMCOP) This register is used to restart the COP time-out period. Module Base + 0x000F R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 W ARMCOP-Bit ARMCOP-Bit ARMCOP-Bit ARMCOP-Bit ARMCOP-Bit ARMCOP-Bit ARMCOP-Bit ARMCOP-Bit 7 6 5 4 3 2 1 0 Reset 0 0 0 0 0 0 0 0 Figure 8-16. S12CPMU_UHV_V7 CPMUARMCOP Register Read: Always reads $00 Write: Anytime When the COP is disabled (CR[2:0] = "000") writing to this register has no effect. When the COP is enabled by setting CR[2:0] nonzero, the following applies: Writing any value other than $55 or $AA causes a COP reset. To restart the COP time-out period write $55 followed by a write of $AA. These writes do not need to occur back-to-back, but the sequence ($55, $AA) must be completed prior to COP end of time-out period to avoid a COP reset. Sequences of $55 writes are allowed. When the WCOP bit is set, $55 and $AA writes must be done in the last 25% of the selected time-out period; writing any value in the first 75% of the selected period will cause a COP reset. 8.3.2.14 High Temperature Control Register (CPMUHTCTL) The CPMUHTCTL register configures the temperature sense features. Module Base + 0x0010 R 7 6 0 0 W Reset 0 0 5 VSEL 0 4 0 0 3 HTE 0 2 HTDS 0 1 0 HTIE HTIF 0 0 = Unimplemented or Reserved Figure 8-17. High Temperature Control Register (CPMUHTCTL) Read: Anytime Write: VSEL, HTE, HTIE and HTIF are write anytime, HTDS is read only MC9S12ZVC Family Reference Manual , Rev. 1.9 246 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-16. CPMUHTCTL Field Descriptions Field Description 5 VSEL Voltage Access Select Bit -- If set, the bandgap reference voltage VBG can be accessed internally (i.e. multiplexed to an internal Analog to Digital Converter channel). If not set, the die temperature proportional voltage VHT of the temperature sensor can be accessed internally. See device level specification for connectivity. For any of these access the HTE bit must be set. 0 An internal temperature proportional voltage VHT can be accessed internally. 1 Bandgap reference voltage VBG can be accessed internally. 3 HTE High Temperature Sensor/Bandgap Voltage Enable Bit -- This bit enables the high temperature sensor and bandgap voltage amplifier. 0 The temperature sensor and bandgap voltage amplifier is disabled. 1 The temperature sensor and bandgap voltage amplifier is enabled. 2 HTDS High Temperature Detect Status Bit -- This read-only status bit reflects the temperature status. Writes have no effect. 0 Junction Temperature is below level THTID or RPM. 1 Junction Temperature is above level THTIA and FPM. 1 HTIE High Temperature Interrupt Enable Bit 0 Interrupt request is disabled. 1 Interrupt will be requested whenever HTIF is set. 0 HTIF High Temperature Interrupt Flag -- HTIF is set to 1 when HTDS status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (HTIE=1), HTIF causes an interrupt request. 0 No change in HTDS bit. 1 HTDS bit has changed. Figure 8-18. Voltage Access Select VBG Ref VSEL TEMPSENSE ADC Channel C HTD MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 247 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.15 Low Voltage Control Register (CPMULVCTL) The CPMULVCTL register allows the configuration of the low-voltage detect features. Module Base + 0x0011 R 7 6 5 4 3 2 0 0 0 0 0 LVDS 0 0 0 0 0 U W Reset 1 0 LVIE LVIF 0 U The Reset state of LVDS and LVIF depends on the external supplied VDDA level = Unimplemented or Reserved Figure 8-19. Low Voltage Control Register (CPMULVCTL) Read: Anytime Write: LVIE and LVIF are write anytime, LVDS is read only Table 8-17. CPMULVCTL Field Descriptions Field Description 2 LVDS Low-Voltage Detect Status Bit -- This read-only status bit reflects the voltage level on VDDA. Writes have no effect. 0 Input voltage VDDA is above level VLVID or RPM. 1 Input voltage VDDA is below level VLVIA and FPM. 1 LVIE Low-Voltage Interrupt Enable Bit 0 Interrupt request is disabled. 1 Interrupt will be requested whenever LVIF is set. 0 LVIF Low-Voltage Interrupt Flag -- LVIF is set to 1 when LVDS status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (LVIE = 1), LVIF causes an interrupt request. 0 No change in LVDS bit. 1 LVDS bit has changed. MC9S12ZVC Family Reference Manual , Rev. 1.9 248 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.16 Autonomous Periodical Interrupt Control Register (CPMUAPICTL) The CPMUAPICTL register allows the configuration of the autonomous periodical interrupt features. Module Base + 0x0012 7 R W Reset APICLK 0 6 5 0 0 0 0 4 3 2 1 0 APIES APIEA APIFE APIE APIF 0 0 0 0 0 = Unimplemented or Reserved Figure 8-20. Autonomous Periodical Interrupt Control Register (CPMUAPICTL) Read: Anytime Write: Anytime Table 8-18. CPMUAPICTL Field Descriptions Field Description 7 APICLK Autonomous Periodical Interrupt Clock Select Bit -- Selects the clock source for the API. Writable only if APIFE = 0. APICLK cannot be changed if APIFE is set by the same write operation. 0 Autonomous Clock (ACLK) used as source. 1 Bus Clock used as source. 4 APIES Autonomous Periodical Interrupt External Select Bit -- Selects the waveform at the external pin API_EXTCLK as shown in Figure 8-21. See device level specification for connectivity of API_EXTCLK pin. 0 If APIEA and APIFE are set, at the external pin API_EXTCLK periodic high pulses are visible at the end of every selected period with the size of half of the minimum period (APIR=0x0000 in Table 8-22). 1 If APIEA and APIFE are set, at the external pin API_EXTCLK a clock is visible with 2 times the selected API Period. 3 APIEA Autonomous Periodical Interrupt External Access Enable Bit -- If set, the waveform selected by bit APIES can be accessed externally. See device level specification for connectivity. 0 Waveform selected by APIES can not be accessed externally. 1 Waveform selected by APIES can be accessed externally, if APIFE is set. 2 APIFE Autonomous Periodical Interrupt Feature Enable Bit -- Enables the API feature and starts the API timer when set. 0 Autonomous periodical interrupt is disabled. 1 Autonomous periodical interrupt is enabled and timer starts running. 1 APIE Autonomous Periodical Interrupt Enable Bit 0 API interrupt request is disabled. 1 API interrupt will be requested whenever APIF is set. 0 APIF Autonomous Periodical Interrupt Flag -- APIF is set to 1 when the in the API configured time has elapsed. This flag can only be cleared by writing a 1.Writing a 0 has no effect. If enabled (APIE = 1), APIF causes an interrupt request. 0 API time-out has not yet occurred. 1 API time-out has occurred. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 249 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Figure 8-21. Waveform selected on API_EXTCLK pin (APIEA=1, APIFE=1) API min. period / 2 APIES=0 API period APIES=1 MC9S12ZVC Family Reference Manual , Rev. 1.9 250 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.17 Autonomous Clock Trimming Register (CPMUACLKTR) The CPMUACLKTR register configures the trimming of the Autonomous Clock (ACLK - trimmable internal RC-Oscillator) which can be selected as clock source for some CPMU features. Module Base + 0x0013 7 R W Reset 6 5 4 3 2 ACLKTR5 ACLKTR4 ACLKTR3 ACLKTR2 ACLKTR1 ACLKTR0 F F F F F F 1 0 0 0 0 0 After de-assert of System Reset a value is automatically loaded from the Flash memory. Figure 8-22. Autonomous Clock Trimming Register (CPMUACLKTR) Read: Anytime Write: Anytime Table 8-19. CPMUACLKTR Field Descriptions Field Description 7-2 Autonomous Clock Period Trimming Bits -- See Table 8-20 for trimming effects. The ACLKTR[5:0] value represents ACLKTR[5:0] a signed number influencing the ACLK period time. Table 8-20. Trimming Effect of ACLKTR[5:0] Bit Trimming Effect ACLKTR[5] Increases period ACLKTR[4] Decreases period less than ACLKTR[5] increased it ACLKTR[3] Decreases period less than ACLKTR[4] ACLKTR[2] Decreases period less than ACLKTR[3] ACLKTR[1] Decreases period less than ACLKTR[2] ACLKTR[0] Decreases period less than ACLKTR[1] MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 251 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.18 Autonomous Periodical Interrupt Rate High and Low Register (CPMUAPIRH / CPMUAPIRL) The CPMUAPIRH and CPMUAPIRL registers allow the configuration of the autonomous periodical interrupt rate. Module Base + 0x0014 R W Reset 7 6 5 4 3 2 1 0 APIR15 APIR14 APIR13 APIR12 APIR11 APIR10 APIR9 APIR8 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 8-23. Autonomous Periodical Interrupt Rate High Register (CPMUAPIRH) Module Base + 0x0015 R W Reset 7 6 5 4 3 2 1 0 APIR7 APIR6 APIR5 APIR4 APIR3 APIR2 APIR1 APIR0 0 0 0 0 0 0 0 0 Figure 8-24. Autonomous Periodical Interrupt Rate Low Register (CPMUAPIRL) Read: Anytime Write: Anytime if APIFE=0, Else writes have no effect. Table 8-21. CPMUAPIRH / CPMUAPIRL Field Descriptions Field 15-0 APIR[15:0] Description Autonomous Periodical Interrupt Rate Bits -- These bits define the time-out period of the API. See Table 8-22 for details of the effect of the autonomous periodical interrupt rate bits. The period can be calculated as follows depending on logical value of the APICLK bit: APICLK=0: Period = 2*(APIR[15:0] + 1) * (ACLK Clock Period * 2) APICLK=1: Period = 2*(APIR[15:0] + 1) * Bus Clock Period NOTE For APICLK bit clear the first time-out period of the API will show a latency time between two to three fACLK cycles due to synchronous clock gate release when the API feature gets enabled (APIFE bit set). MC9S12ZVC Family Reference Manual , Rev. 1.9 252 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-22. Selectable Autonomous Periodical Interrupt Periods 1 APICLK APIR[15:0] Selected Period 0 0000 0.2 ms1 0 0001 0.4 ms1 0 0002 0.6 ms1 0 0003 0.8 ms1 0 0004 1.0 ms1 0 0005 1.2 ms1 0 ..... ..... 0 FFFD 13106.8 ms1 0 FFFE 13107.0 ms1 0 FFFF 13107.2 ms1 1 0000 2 * Bus Clock period 1 0001 4 * Bus Clock period 1 0002 6 * Bus Clock period 1 0003 8 * Bus Clock period 1 0004 10 * Bus Clock period 1 0005 12 * Bus Clock period 1 ..... ..... 1 FFFD 131068 * Bus Clock period 1 FFFE 131070 * Bus Clock period 1 FFFF 131072 * Bus Clock period When fACLK is trimmed to 20KHz. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 253 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.19 Reserved Register CPMUTEST3 NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in Special Mode can alter the S12CPMU_UHV_V7's functionality. Module Base + 0x0016 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 8-25. Reserved Register (CPMUTEST3) Read: Anytime Write: Only in Special Mode MC9S12ZVC Family Reference Manual , Rev. 1.9 254 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.20 High Temperature Trimming Register (CPMUHTTR) The CPMUHTTR register configures the trimming of the S12CPMU_UHV_V7 temperature sense. Module Base + 0x0017 7 R W Reset HTOE 0 6 5 4 0 0 0 0 0 0 3 2 1 0 HTTR3 HTTR2 HTTR1 HTTR0 F F F F After de-assert of System Reset a trim value is automatically loaded from the Flash memory. See Device specification for details. = Unimplemented or Reserved Figure 8-26. High Temperature Trimming Register (CPMUHTTR) Read: Anytime Write: Anytime Table 8-24. CPMUHTTR Field Descriptions Field 7 HTOE 3-0 HTTR[3:0] Description High Temperature Offset Enable Bit -- If set the temperature sense offset is enabled. 0 The temperature sense offset is disabled. HTTR[3:0] bits don't care. 1 The temperature sense offset is enabled. HTTR[3:0] select the temperature offset. High Temperature Trimming Bits -- See Table 8-25 for trimming effects. Table 8-25. Trimming Effect of HTTR Bit Trimming Effect HTTR[3] Increases VHT twice of HTTR[2] HTTR[2] Increases VHT twice of HTTR[1] HTTR[1] Increases VHT twice of HTTR[0] HTTR[0] Increases VHT (to compensate Temperature Offset) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 255 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.21 S12CPMU_UHV_V7 IRC1M Trim Registers (CPMUIRCTRIMH / CPMUIRCTRIML) Module Base + 0x0018 15 14 R 12 11 F F F 10 0 TCTRIM[4:0] W Reset 13 F F 0 9 8 IRCTRIM[9:8] F F After de-assert of System Reset a factory programmed trim value is automatically loaded from the Flash memory to provide trimmed Internal Reference Frequency fIRC1M_TRIM. Figure 8-27. S12CPMU_UHV_V7 IRC1M Trim High Register (CPMUIRCTRIMH) Module Base + 0x0019 7 6 5 R 3 2 1 0 F F F IRCTRIM[7:0] W Reset 4 F F F F F After de-assert of System Reset a factory programmed trim value is automatically loaded from the Flash memory to provide trimmed Internal Reference Frequency fIRC1M_TRIM. Figure 8-28. S12CPMU_UHV_V7 IRC1M Trim Low Register (CPMUIRCTRIML) Read: Anytime Write: Anytime if PROT=0 (CPMUPROT register). Else write has no effect NOTE Writes to these registers while PLLSEL=1 clears the LOCK and UPOSC status bits. Table 8-26. CPMUIRCTRIMH/L Field Descriptions Field Description 15-11 IRC1M temperature coefficient Trim Bits TCTRIM[4:0] Trim bits for the Temperature Coefficient (TC) of the IRC1M frequency. Table 8-27 shows the influence of the bits TCTRIM[4:0] on the relationship between frequency and temperature. Figure 8-30 shows an approximate TC variation, relative to the nominal TC of the IRC1M (i.e. for TCTRIM[4:0]=0x00000 or 0x10000). 9-0 IRC1M Frequency Trim Bits -- Trim bits for Internal Reference Clock IRCTRIM[9:0] After System Reset the factory programmed trim value is automatically loaded into these registers, resulting in a Internal Reference Frequency fIRC1M_TRIM.See device electrical characteristics for value of fIRC1M_TRIM. The frequency trimming consists of two different trimming methods: A rough trimming controlled by bits IRCTRIM[9:6] can be done with frequency leaps of about 6% in average. A fine trimming controlled by bits IRCTRIM[5:0] can be done with frequency leaps of about 0.3% (this trimming determines the precision of the frequency setting of 0.15%, i.e. 0.3% is the distance between two trimming values). Figure 8-29 shows the relationship between the trim bits and the resulting IRC1M frequency. MC9S12ZVC Family Reference Manual , Rev. 1.9 256 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) IRC1M frequency (IRCCLK) IRCTRIM[9:6] 1.5MHz IRCTRIM[5:0] ...... 1MHz 600KHz IRCTRIM[9:0] $000 $3FF Figure 8-29. IRC1M Frequency Trimming Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 257 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) frequency T ] [4:0 M RI CT 111 x11 0 = 0x11111 ... 0x10101 0x10100 0x10011 0x10010 0x10001 TC increases TCTRIM[4:0] = 0x10000 or 0x00000 (nominal TC) TCT R - 40C IM[ 4:0 ]=0 x01 111 0x00001 0x00010 0x00011 0x00100 0x00101 ... 0x01111 TC decreases 150C temperature Figure 8-30. Influence of TCTRIM[4:0] on the Temperature Coefficient NOTE The frequency is not necessarily linear with the temperature (in most cases it will not be). The above diagram is meant only to give the direction (positive or negative) of the variation of the TC, relative to the nominal TC. Setting TCTRIM[4:0] at 0x00000 or 0x10000 does not mean that the temperature coefficient will be zero. These two combinations basically switch off the TC compensation module, which results in the nominal TC of the IRC1M. MC9S12ZVC Family Reference Manual , Rev. 1.9 258 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-27. TC trimming of the frequency of the IRC1M at ambient temperature TCTRIM[4:0] IRC1M Indicative relative TC variation IRC1M indicative frequency drift for relative TC variation 00000 0 (nominal TC of the IRC) 0% 00001 -0.27% -0.5% 00010 -0.54% -0.9% 00011 -0.81% -1.3% 00100 -1.08% -1.7% 00101 -1.35% -2.0% 00110 -1.63% -2.2% 00111 -1.9% -2.5% 01000 -2.20% -3.0% 01001 -2.47% -3.4% 01010 -2.77% -3.9% 01011 -3.04 -4.3% 01100 -3.33% -4.7% 01101 -3.6% -5.1% 01110 -3.91% -5.6% 01111 -4.18% -5.9% 10000 0 (nominal TC of the IRC) 0% 10001 +0.27% +0.5% 10010 +0.54% +0.9% 10011 +0.81% +1.3% 10100 +1.07% +1.7% 10101 +1.34% +2.0% 10110 +1.59% +2.2% 10111 +1.86% +2.5% 11000 +2.11% +3.0% 11001 +2.38% +3.4% 11010 +2.62% +3.9% 11011 +2.89% +4.3% 11100 +3.12% +4.7% 11101 +3.39% +5.1% 11110 +3.62% +5.6% 11111 +3.89% +5.9% NOTE Since the IRC1M frequency is not a linear function of the temperature, but more like a parabola, the above relative variation is only an indication and should be considered with care. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 259 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Be aware that the output frequency varies with the TC trimming. A frequency trimming correction is therefore necessary. The values provided in Table 8-27 are typical values at ambient temperature which can vary from device to device. 8.3.2.22 S12CPMU_UHV_V7 Oscillator Register (CPMUOSC) This registers configures the external oscillator (XOSCLCP). Module Base + 0x001A 7 R W Reset 6 OSCE 0 0 0 5 Reserved 0 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 8-31. S12CPMU_UHV_V7 Oscillator Register (CPMUOSC) Read: Anytime Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has no effect. NOTE. Write to this register clears the LOCK and UPOSC status bits. MC9S12ZVC Family Reference Manual , Rev. 1.9 260 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Table 8-28. CPMUOSC Field Descriptions Field Description 7 OSCE Oscillator Enable Bit -- This bit enables the external oscillator (XOSCLCP). The UPOSC status bit in the CPMIUFLG register indicates when the oscillation is stable and when OSCCLK can be selected as source of the Bus Clock or source of the COP or RTI.If the oscillator clock monitor reset is enabled (OMRE = 1 in CPMUOSC2 register), then a loss of oscillation will lead to an oscillator clock monitor reset. 0 External oscillator is disabled. REFCLK for PLL is IRCCLK. 1 External oscillator is enabled. Oscillator clock monitor is enabled. External oscillator is qualified by PLLCLK. REFCLK for PLL is the external oscillator clock divided by REFDIV. If OSCE bit has been set (write "1") the EXTAL and XTAL pins are exclusively reserved for the oscillator and they can not be used anymore as general purpose I/O until the next system reset. Note: When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop Mode with OSCE bit already 1) the software must wait for a minimum time equivalent to the startup-time of the external oscillator tUPOSC before entering Pseudo Stop Mode. 5 Reserved Do not alter this bit from its reset value. It is for Manufacturer use only and can change the Oscillator behavior. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 261 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.23 S12CPMU_UHV_V7 Protection Register (CPMUPROT) This register protects the clock configuration registers from accidental overwrite: CPMUSYNR, CPMUREFDIV, CPMUCLKS, CPMUPLL, CPMUIRCTRIMH/L, CPMUOSC and CPMUOSC2 Module Base + 0x001B R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 0 PROT 0 Figure 8-32. S12CPMU_UHV_V7 Protection Register (CPMUPROT) Read: Anytime Write: Anytime Field Description PROT Clock Configuration Registers Protection Bit -- This bit protects the clock configuration registers from accidental overwrite (see list of protected registers above): Writing 0x26 to the CPMUPROT register clears the PROT bit, other write accesses set the PROT bit. 0 Protection of clock configuration registers is disabled. 1 Protection of clock configuration registers is enabled. (see list of protected registers above). MC9S12ZVC Family Reference Manual , Rev. 1.9 262 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.24 Reserved Register CPMUTEST2 NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in Special Mode can alter the S12CPMU_UHV_V7's functionality. Module Base + 0x001C 7 R W Reset 6 0 0 0 0 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 8-33. Reserved Register CPMUTEST2 Read: Anytime Write: Only in Special Mode MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 263 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.25 Voltage Regulator Control Register (CPMUVREGCTL) The CPMUVREGCTL allows to enable or disable certain parts of the voltage regulator.This register must be configured after system startup. Module Base + 0x001D R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 W Reset 2 1 0 EXTCON EXTXON INTXON 1 1 1 = Unimplemented or Reserved Figure 8-34. Voltage Regulator Control Register (CPMUVREGCTL) Read: Anytime Write: Once in normal modes, anytime in special modes Table 8-29. Effects of writing the EXTXON and INTXON bits value of EXTXON to be written value of INTXON to be written Write Access 0 0 blocked, no effect 0 1 legal access 1 0 legal access 1 1 blocked, no effect Table 8-30. CPMUVREGCTL Field Descriptions Field Description 2 EXTCON External voltage regulator Enable Bit for VDDC domain -- Should be disabled after system startup if VDDC domain is not used. 0 VDDC domain disabled 1 VDDC domain enabled 1 EXTXON External voltage regulator Enable Bit for VDDX domain -- Should be set to 1 if external BJT is present on the PCB, cleared otherwise. 0 VDDX control loop does not use external BJT 1 VDDX control loop uses external BJT 0 INTXON Internal voltage regulator Enable Bit for VDDX domain-- Should be set to 1 if no external BJT is present on the PCB, cleared otherwise. 0 VDDX control loop does not use internal power transistor 1 VDDX control loop uses internal power transistor MC9S12ZVC Family Reference Manual , Rev. 1.9 264 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.3.2.26 S12CPMU_UHV_V7 Oscillator Register 2 (CPMUOSC2) This registers configures the external oscillator (XOSCLCP). Module Base + 0x001E R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 OMRE OSCMOD 0 0 Figure 8-35. S12CPMU_UHV_V7 Oscillator Register 2 (CPMUOSC2) Read: Anytime Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has no effect. Table 8-31. CPMUOSC2 Field Descriptions Field 0 OSCMOD 1 OMRE Description This bit selects the mode of the external oscillator (XOSCLCP) If OSCE bit in CPMUOSC register is 1, then the OSCMOD bit can not be changed (writes will have no effect). 0 External oscillator configured for loop controlled mode (reduced amplitude on EXTAL and XTAL)) 1 External oscillator configured for full swing mode (full swing amplitude on EXTAL and XTAL) This bit enables the oscillator clock monitor reset. If OSCE bit in CPMUOSC register is 1, then the OMRE bit can not be changed (writes will have no effect). 0 Oscillator clock monitor reset is disabled 1 Oscillator clock monitor reset is enabled MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 265 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.4 8.4.1 Functional Description Phase Locked Loop with Internal Filter (PLL) The PLL is used to generate a high speed PLLCLK based on a low frequency REFCLK. The REFCLK is by default the IRCCLK which is trimmed to fIRC1M_TRIM=1MHz. If using the oscillator (OSCE=1) REFCLK will be based on OSCCLK. For increased flexibility, OSCCLK can be divided in a range of 1 to 16 to generate the reference frequency REFCLK using the REFDIV[3:0] bits. Based on the SYNDIV[5:0] bits the PLL generates the VCOCLK by multiplying the reference clock by a 2, 4, 6,... 126, 128. Based on the POSTDIV[4:0] bits the VCOCLK can be divided in a range of 1,2, 3, 4, 5, 6,... to 32 to generate the PLLCLK. If oscillator is enabled (OSCE=1) f OSC f REF = ------------------------------------ REFDIV + 1 If oscillator is disabled (OSCE=0) f REF = f IRC1M f VCO = 2 f REF SYNDIV + 1 If PLL is locked (LOCK=1) f VCO f PLL = ---------------------------------------- POSTDIV + 1 If PLL is not locked (LOCK=0) f VCO f PLL = --------------4 If PLL is selected (PLLSEL=1) f PLL f bus = ------------2 . NOTE Although it is possible to set the dividers to command a very high clock frequency, do not exceed the specified bus frequency limit for the MCU. MC9S12ZVC Family Reference Manual , Rev. 1.9 266 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Several examples of PLL divider settings are shown in Table 8-32. The following rules help to achieve optimum stability and shortest lock time: * Use lowest possible fVCO / fREF ratio (SYNDIV value). * Use highest possible REFCLK frequency fREF. Table 8-32. Examples of PLL Divider Settings fosc REFDIV[3:0] fREF REFFRQ[1:0] SYNDIV[5:0] fVCO VCOFRQ[1:0] POSTDIV[4:0] fPLL fbus off $00 1MHz 00 $18 50MHz 01 $03 12.5MHz 6.25MHz off $00 1MHz 00 $18 50MHz 01 $00 50MHz 25MHz 4MHz $00 4MHz 01 $05 48MHz 00 $00 48MHz 24MHz The phase detector inside the PLL compares the feedback clock (FBCLK = VCOCLK/(SYNDIV+1)) with the reference clock (REFCLK = (IRC1M or OSCCLK)/(REFDIV+1)). Correction pulses are generated based on the phase difference between the two signals. The loop filter alters the DC voltage on the internal filter capacitor, based on the width and direction of the correction pulse which leads to a higher or lower VCO frequency. The user must select the range of the REFCLK frequency (REFFRQ[1:0] bits) and the range of the VCOCLK frequency (VCOFRQ[1:0] bits) to ensure that the correct PLL loop bandwidth is set. The lock detector compares the frequencies of the FBCLK and the REFCLK. Therefore the speed of the lock detector is directly proportional to the reference clock frequency. The circuit determines the lock condition based on this comparison. So e.g. a failure in the reference clock will cause the PLL not to lock. If PLL LOCK interrupt requests are enabled, the software can wait for an interrupt request and for instance check the LOCK bit. If interrupt requests are disabled, software can poll the LOCK bit continuously (during PLL start-up) or at periodic intervals. In either case, only when the LOCK bit is set, the VCOCLK will have stabilized to the programmed frequency. * The LOCK bit is a read-only indicator of the locked state of the PLL. * The LOCK bit is set when the VCO frequency is within the tolerance, Lock, and is cleared when the VCO frequency is out of the tolerance, unl. * Interrupt requests can occur if enabled (LOCKIE = 1) when the lock condition changes, toggling the LOCK bit. In case of loss of reference clock (e.g. IRCCLK) the PLL will not lock or if already locked, then it will unlock. The frequency of the VCOCLK will be very low and will depend on the value of the VCOFRQ[1:0] bits. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 267 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.4.2 Startup from Reset An example for startup of the clock system from Reset is given in Figure 8-36. Figure 8-36. Startup of clock system after Reset System Reset 768 cycles PLLCLK fPLL increasing fVCORST fPLL=25 MHz fPLL=12.5MHz )( tlock LOCK SYNDIV $18 (default target fVCO=50MHz) POSTDIV $03 (default target fPLL=fVCO/4 = 12.5MHz) reset state CPU 8.4.3 $01 example change of POSTDIV vector fetch, program execution Stop Mode using PLLCLK as source of the Bus Clock An example of what happens going into Stop Mode and exiting Stop Mode after an interrupt is shown in Figure 8-37. Disable PLL Lock interrupt (LOCKIE=0) before going into Stop Mode. Figure 8-37. Stop Mode using PLLCLK as source of the Bus Clock wake up CPU execution interrupt STOP instruction continue execution tSTP_REC PLLCLK LOCK tlock Depending on the COP configuration there might be an additional significant latency time until COP is active again after exit from Stop Mode due to clock domain crossing synchronization. This latency time of 2 ACLK cycles occurs if COP clock source is ACLK and the CSAD bit is set and must be added to the device Stop Mode recovery time tSTP_REC. After exit from Stop Mode (Pseudo, Full) for this latency time MC9S12ZVC Family Reference Manual , Rev. 1.9 268 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) of 2 ACLK cycles no Stop Mode request (STOP instruction) should be generated to make sure the COP counter can increment at each Stop Mode exit. 8.4.4 Full Stop Mode using Oscillator Clock as source of the Bus Clock An example of what happens going into Full Stop Mode and exiting Full Stop Mode after an interrupt is shown in Figure 8-38. Disable PLL Lock interrupt (LOCKIE=0) and oscillator status change interrupt (OSCIE=0) before going into Full Stop Mode. Figure 8-38. Full Stop Mode using Oscillator Clock as source of the Bus Clock wake up CPU execution Core Clock PLLCLK interrupt STOP instruction continue execution tSTP_REC tlock OSCCLK UPOSC select OSCCLK as Core/Bus Clock by writing PLLSEL to "0" PLLSEL automatically set when going into Full Stop Mode Depending on the COP configuration there might be a significant latency time until COP is active again after exit from Stop Mode due to clock domain crossing synchronization. This latency time of 2 ACLK cycles occurs if COP clock source is ACLK and the CSAD bit is set and must be added to the device Stop Mode recovery time tSTP_REC. After exit from Stop Mode (Pseudo, Full) for this latency time of 2 ACLK cycles no Stop Mode request (STOP instruction) should be generated to make sure the COP counter can increment at each Stop Mode exit. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 269 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.4.5 8.4.5.1 External Oscillator Enabling the External Oscillator An example of how to use the oscillator as source of the Bus Clock is shown in Figure 8-39. Figure 8-39. Enabling the external oscillator enable external oscillator by writing OSCE bit to one. OSCE crystal/resonator starts oscillating EXTAL UPOSC flag is set upon successful start of oscillation UPOSC OSCCLK select OSCCLK as Core/Bus Clock by writing PLLSEL to zero PLLSEL Core Clock based on PLL Clock based on OSCCLK MC9S12ZVC Family Reference Manual , Rev. 1.9 270 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.4.6 8.4.6.1 System Clock Configurations PLL Engaged Internal Mode (PEI) This mode is the default mode after System Reset or Power-On Reset. The Bus Clock is based on the PLLCLK, the reference clock for the PLL is internally generated (IRC1M). The PLL is configured to 50 MHz VCOCLK with POSTDIV set to 0x03. If locked (LOCK=1) this results in a PLLCLK of 12.5 MHz and a Bus Clock of 6.25 MHz. The PLL can be re-configured to other bus frequencies. The clock sources for COP and RTI can be based on the internal reference clock generator (IRC1M) or the RC-Oscillator (ACLK). 8.4.6.2 PLL Engaged External Mode (PEE) In this mode, the Bus Clock is based on the PLLCLK as well (like PEI). The reference clock for the PLL is based on the external oscillator. The clock sources for COP and RTI can be based on the internal reference clock generator or on the external oscillator clock or the RC-Oscillator (ACLK). This mode can be entered from default mode PEI by performing the following steps: 1. Configure the PLL for desired bus frequency. 2. Enable the external Oscillator (OSCE bit). 3. Wait for oscillator to start-up and the PLL being locked (LOCK = 1) and (UPOSC =1). 4. Clear all flags in the CPMUIFLG register to be able to detect any future status bit change. 5. Optionally status interrupts can be enabled (CPMUINT register). Loosing PLL lock status (LOCK=0) means loosing the oscillator status information as well (UPOSC=0). The impact of loosing the oscillator status (UPOSC=0) in PEE mode is as follows: * The PLLCLK is derived from the VCO clock (with its actual frequency) divided by four until the PLL locks again. Application software needs to be prepared to deal with the impact of loosing the oscillator status at any time. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 271 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.4.6.3 PLL Bypassed External Mode (PBE) In this mode, the Bus Clock is based on the external oscillator clock. The reference clock for the PLL is based on the external oscillator. The clock sources for COP and RTI can be based on the internal reference clock generator or on the external oscillator clock or the RC-Oscillator (ACLK). This mode can be entered from default mode PEI by performing the following steps: 1. Make sure the PLL configuration is valid. 2. Enable the external Oscillator (OSCE bit) 3. Wait for the oscillator to start-up and the PLL being locked (LOCK = 1) and (UPOSC =1) 4. Clear all flags in the CPMUIFLG register to be able to detect any status bit change. 5. Optionally status interrupts can be enabled (CPMUINT register). 6. Select the Oscillator clock as source of the Bus clock (PLLSEL=0) Loosing PLL lock status (LOCK=0) means loosing the oscillator status information as well (UPOSC=0). The impact of loosing the oscillator status (UPOSC=0) in PBE mode is as follows: * PLLSEL is set automatically and the source of the Bus clock is switched back to the PLL clock. * The PLLCLK is derived from the VCO clock (with its actual frequency) divided by four until the PLL locks again. Application software needs to be prepared to deal with the impact of loosing the oscillator status at any time. 8.5 8.5.1 Resets General All reset sources are listed in Table 8-33. There is only one reset vector for all these reset sources. Refer to MCU specification for reset vector address. Table 8-33. Reset Summary Reset Source Local Enable Power-On Reset (POR) None Low Voltage Reset (LVR) None External pin RESET None PLL Clock Monitor Reset None Oscillator Clock Monitor Reset OSCE Bit in CPMUOSC register and OMRE Bit in CPMUOSC2 register COP Reset CR[2:0] in CPMUCOP register MC9S12ZVC Family Reference Manual , Rev. 1.9 272 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.5.2 Description of Reset Operation Upon detection of any reset of Table 8-33, an internal circuit drives the RESET pin low for 512 PLLCLK cycles. After 512 PLLCLK cycles the RESET pin is released. The internal reset of the MCU remains asserted while the reset generator completes the 768 PLLCLK cycles long reset sequence.In case the RESET pin is externally driven low for more than these 768 PLLCLK cycles (External Reset), the internal reset remains asserted longer. NOTE While System Reset is asserted the PLLCLK runs with the frequency fVCORST. Figure 8-40. RESET Timing RESET S12_CPMU drives RESET pin low fVCORST fVCORST ) ) PLLCLK S12_CPMU releases RESET pin ( ( 512 cycles ) ( 256 cycles possibly RESET driven low 8.5.3 Oscillator Clock Monitor Reset If the external oscillator is enabled (OSCE=1)and the oscillator clock monitor reset is enabled (OMRE=1), then in case of loss of oscillation or the oscillator frequency drops below the failure assert frequency fCMFA (see device electrical characteristics for values), the S12CPMU_UHV_V7 generates an Oscillator Clock Monitor Reset. In Full Stop Mode the external oscillator and the oscillator clock monitor are disabled. 8.5.4 PLL Clock Monitor Reset In case of loss of PLL clock oscillation or the PLL clock frequency is below the failure assert frequency fPMFA (see device electrical characteristics for values), the S12CPMU_UHV_V7 generates a PLL Clock Monitor Reset[. In Full Stop Mode the PLL and the PLL clock monitor are disabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 273 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.5.5 Computer Operating Properly Watchdog (COP) Reset The COP (free running watchdog timer) enables the user to check that a program is running and sequencing properly. When the COP is being used, software is responsible for keeping the COP from timing out. If the COP times out it is an indication that the software is no longer being executed in the intended sequence; thus COP reset is generated. The clock source for the COP is either ACLK, IRCCLK or OSCCLK depending on the setting of the COPOSCSEL0 and COPOSCSEL1 bit. Due to clock domain crossing synchronization there is a latency time to enter and exit Stop Mode if the COP clock source is ACLK and this clock is stopped in Stop Mode. This maximum total latency time is 4 ACLK cycles (2 ACLK cycles for Stop Mode entry and exit each) which must be added to the Stop Mode recovery time tSTP_REC from exit of current Stop Mode to entry of next Stop Mode. This latency time occurs no matter which Stop Mode (Full, Pseudo) is currently exited or entered next. After exit from Stop Mode (Pseudo, Full) for this latency time of 2 ACLK cycles no Stop Mode request (STOP instruction) should be generated to make sure the COP counter can increment at each Stop Mode exit. Table 8-34 gives an overview of the COP condition (run, static) in Stop Mode depending on legal configuration and status bit settings: Table 8-34. COP condition (run, static) in Stop Mode COPOSCSEL1 CSAD PSTP PCE COPOSCSEL0 OSCE COP counter behavior in Stop Mode (clock source) UPOSC 1 0 x x x x x Run (ACLK) 1 1 x x x x x Static (ACLK) 0 x 1 1 1 1 1 Run (OSCCLK) 0 x 1 1 0 0 x Static (IRCCLK) 0 x 1 1 0 1 x Static (IRCCLK) 0 x 1 0 0 x x Static (IRCCLK) 0 x 1 0 1 1 1 Static (OSCCLK) 0 x 0 1 1 1 1 Static (OSCCLK) 0 x 0 1 0 1 x Static (IRCCLK) 0 x 0 1 0 0 0 Static (IRCCLK) 0 x 0 0 1 1 1 Satic (OSCCLK) 0 x 0 0 0 1 1 Static (IRCCLK) 0 x 0 0 0 1 0 Static (IRCCLK) 0 x 0 0 0 0 0 Static (IRCCLK) Three control bits in the CPMUCOP register allow selection of seven COP time-out periods. MC9S12ZVC Family Reference Manual , Rev. 1.9 274 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) When COP is enabled, the program must write $55 and $AA (in this order) to the CPMUARMCOP register during the selected time-out period. Once this is done, the COP time-out period is restarted. If the program fails to do this and the COP times out, a COP reset is generated. Also, if any value other than $55 or $AA is written, a COP reset is generated. Windowed COP operation is enabled by setting WCOP in the CPMUCOP register. In this mode, writes to the CPMUARMCOP register to clear the COP timer must occur in the last 25% of the selected time-out period. A premature write will immediately reset the part. In MCU Normal Mode the COP time-out period (CR[2:0]) and COP window (WCOP) setting can be automatically pre-loaded at reset release from NVM memory (if values are defined in the NVM by the application). By default the COP is off and no window COP feature is enabled after reset release via NVM memory. The COP control register CPMUCOP can be written once in an application in MCU Normal Mode to update the COP time-out period (CR[2:0]) and COP window (WCOP) setting loaded from NVM memory at reset release. Any value for the new COP time-out period and COP window setting is allowed except COP off value if the COP was enabled during pre-load via NVM memory. The COP clock source select bits can not be pre-loaded via NVM memory at reset release. The IRC clock is the default COP clock source out of reset. The COP clock source select bits (COPOSCSEL0/1) and ACLK clock control bit in Stop Mode (CSAD) can be modified until the CPMUCOP register write once has taken place. Therefore these control bits should be modified before the final COP time-out period and window COP setting is written. The CPMUCOP register access to modify the COP time-out period and window COP setting in MCU Normal Mode after reset release must be done with the WRTMASK bit cleared otherwise the update is ignored and this access does not count as the write once. 8.5.6 Power-On Reset (POR) The on-chip POR circuitry detects when the internal supply VDD drops below an appropriate voltage level. The POR is deasserted, if the internal supply VDD exceeds an appropriate voltage level (voltage levels not specified, because the internal supply can not be monitored externally). The POR circuitry is always active. It acts as LVR in Stop Mode. 8.5.7 Low-Voltage Reset (LVR) The on-chip LVR circuitry detects when one of the supply voltages VDD, VDDX and VDDF drops below an appropriate voltage level. If LVR is deasserted the MCU is fully operational at the specified maximum speed. The LVR assert and deassert levels for the supply voltage VDDX are VLVRXA and VLVRXD and are specified in the device Reference Manual.The LVR circuitry is active in Run- and Wait Mode. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 275 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) 8.6 Interrupts The interrupt vectors requested by the S12CPMU_UHV_V7 are listed in Table 8-35. Refer to MCU specification for related vector addresses and priorities. Table 8-35. S12CPMU_UHV_V7 Interrupt Vectors 8.6.1 8.6.1.1 Interrupt Source CCR Mask Local Enable RTI time-out interrupt I bit CPMUINT (RTIE) PLL lock interrupt I bit CPMUINT (LOCKIE) Oscillator status interrupt I bit CPMUINT (OSCIE) Low voltage interrupt I bit CPMULVCTL (LVIE) High temperature interrupt I bit CPMUHTCTL (HTIE) Autonomous Periodical Interrupt I bit CPMUAPICTL (APIE) Description of Interrupt Operation Real Time Interrupt (RTI) The clock source for the RTI is either IRCCLK or OSCCLK depending on the setting of the RTIOSCSEL bit. In Stop Mode with PSTP=1 (Pseudo Stop Mode), RTIOSCSEL=1 and PRE=1 the RTI continues to run, else the RTI counter halts in Stop Mode. The RTI can be used to generate hardware interrupts at a fixed periodic rate. If enabled (by setting RTIE=1), this interrupt will occur at the rate selected by the CPMURTI register. At the end of the RTI time-out period the RTIF flag is set to one and a new RTI time-out period starts immediately. A write to the CPMURTI register restarts the RTI time-out period. 8.6.1.2 PLL Lock Interrupt The S12CPMU_UHV_V7 generates a PLL Lock interrupt when the lock condition (LOCK status bit) of the PLL changes, either from a locked state to an unlocked state or vice versa. Lock interrupts are locally disabled by setting the LOCKIE bit to zero. The PLL Lock interrupt flag (LOCKIF) is set to1 when the lock condition has changed, and is cleared to 0 by writing a 1 to the LOCKIF bit. 8.6.1.3 Oscillator Status Interrupt When the OSCE bit is 0, then UPOSC stays 0. When OSCE=1 the UPOSC bit is set after the LOCK bit is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 276 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) Upon detection of a status change (UPOSC) the OSCIF flag is set. Going into Full Stop Mode or disabling the oscillator can also cause a status change of UPOSC. Any change in PLL configuration or any other event which causes the PLL lock status to be cleared leads to a loss of the oscillator status information as well (UPOSC=0). Oscillator status change interrupts are locally enabled with the OSCIE bit. NOTE Loosing the oscillator status (UPOSC=0) affects the clock configuration of the system1. This needs to be dealt with in application software. 8.6.1.4 Low-Voltage Interrupt (LVI) In FPM the input voltage VDDA is monitored. Whenever VDDA drops below level VLVIA, the status bit LVDS is set to 1. When VDDA rises above level VLVID the status bit LVDS is cleared to 0. An interrupt, indicated by flag LVIF = 1, is triggered by any change of the status bit LVDS if interrupt enable bit LVIE = 1. 8.6.1.5 HTI - High Temperature Interrupt In FPM the junction temperature TJ is monitored. Whenever TJ exceeds level THTIA the status bit HTDS is set to 1. Vice versa, HTDS is reset to 0 when TJ get below level THTID. An interrupt, indicated by flag HTIF = 1, is triggered by any change of the status bit HTDS, if interrupt enable bit HTIE = 1. 8.6.1.6 Autonomous Periodical Interrupt (API) The API sub-block can generate periodical interrupts independent of the clock source of the MCU. To enable the timer, the bit APIFE needs to be set. The API timer is either clocked by the Autonomous Clock (ACLK - trimmable internal RC oscillator) or the Bus Clock. Timer operation will freeze when MCU clock source is selected and Bus Clock is turned off. The clock source can be selected with bit APICLK. APICLK can only be written when APIFE is not set. The APIR[15:0] bits determine the interrupt period. APIR[15:0] can only be written when APIFE is cleared. As soon as APIFE is set, the timer starts running for the period selected by APIR[15:0] bits. When the configured time has elapsed, the flag APIF is set. An interrupt, indicated by flag APIF = 1, is triggered if interrupt enable bit APIE = 1. The timer is re-started automatically again after it has set APIF. The procedure to change APICLK or APIR[15:0] is first to clear APIFE, then write to APICLK or APIR[15:0], and afterwards set APIFE. The API Trimming bits ACLKTR[5:0] must be set so the minimum period equals 0.2 ms if stable frequency is desired. See Table 8-20 for the trimming effect of ACLKTR[5:0]. 1. For details please refer to "8.4.6 System Clock Configurations" MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 277 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) NOTE The first period after enabling the counter by APIFE might be reduced by API start up delay tsdel. It is possible to generate with the API a waveform at the external pin API_EXTCLK by setting APIFE and enabling the external access with setting APIEA. 8.7 8.7.1 Initialization/Application Information General Initialization Information Usually applications run in MCU Normal Mode. It is recommended to write the CPMUCOP register in any case from the application program initialization routine after reset no matter if the COP is used in the application or not, even if a configuration is loaded via the flash memory after reset. By doing a "controlled" write access in MCU Normal Mode (with the right value for the application) the write once for the COP configuration bits (WCOP,CR[2:0]) takes place which protects these bits from further accidental change. In case of a program sequencing issue (code runaway) the COP configuration can not be accidentally modified anymore. 8.7.2 Application information for COP and API usage In many applications the COP is used to check that the program is running and sequencing properly. Often the COP is kept running during Stop Mode and periodic wake-up events are needed to service the COP on time and maybe to check the system status. For such an application it is recommended to use the ACLK as clock source for both COP and API. This guarantees lowest possible IDD current during Stop Mode. Additionally it eases software implementation using the same clock source for both, COP and API. The Interrupt Service Routine (ISR) of the Autonomous Periodic Interrupt API should contain the write instruction to the CPMUARMCOP register. The value (byte) written is derived from the "main routine" (alternating sequence of $55 and $AA) of the application software. Using this method, then in the case of a runtime or program sequencing issue the application "main routine" is not executed properly anymore and the alternating values are not provided properly. Hence the COP is written at the correct time (due to independent API interrupt request) but the wrong value is written (alternating sequence of $55 and $AA is no longer maintained) which causes a COP reset. If the COP is stopped during any Stop Mode it is recommended to service the COP shortly before Stop Mode is entered. 8.7.3 Application Information for PLL and Oscillator Startup The following C-code example shows a recommended way of setting up the system clock system using the PLL and Oscillator: MC9S12ZVC Family Reference Manual , Rev. 1.9 278 NXP Semiconductors Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) /* Procedure proposed by to setup PLL and Oscillator */ /* example for OSC = 4 MHz and Bus Clock = 25MHz, That is VCOCLK = 50MHz */ /* Initialize */ /* PLL Clock = 50 MHz, divide by one */ CPMUPOSTDIV = 0x00; /* Generally: Whenever changing PLL reference clock (REFCLK) frequency to a higher value */ /* it is recommended to write CPMUSYNR = 0x00 in order to stay within specified */ /* maximum frequency of the MCU */ CPMUSYNR = 0x00; /* configure PLL reference clock (REFCLK) for usage with Oscillator */ /* OSC=4MHz divide by 4 (3+1) = 1MHz, REFCLK range 1MHz to 2 MHz (REFFRQ[1:0] = 00) */ CPMUREFDV = 0x03; /* enable external Oscillator, switch PLL reference clock (REFCLK) to OSC */ CPMUOSC = 0x80; /* multiply REFCLK = 1MHz by 2*(24+1)*1MHz = 50MHz */ /* VCO range 48 to 80 MHz (VCOFRQ[1:0] = 01) */ CPMUSYNR = 0x58; /* clear all flags, especially LOCKIF and OSCIF */ CPMUIFLG = 0xFF; /* put your code to loop and wait for the LOCKIF and OSCIF or */ /* poll CPMUIFLG register until both UPOSC and LOCK status are "1" */ /* that is CPMIFLG == 0x1B */ /*...............continue to your main code execution here...............*/ /* in case later in your code you want to disable the Oscillator and use the */ /* 1MHz IRCCLK as PLL reference clock */ /* Generally: Whenever changing PLL reference clock (REFCLK) frequency to a higher value */ /* it is recommended to write CPMUSYNR = 0x00 in order to stay within specified */ /* maximum frequency of the MCU */ CPMUSYNR = 0x00; /* disable OSC and switch PLL reference clock to IRC */ CPMUOSC = 0x00; /* multiply REFCLK = 1MHz by 2*(24+1)*1MHz = 50MHz */ /* VCO range 48 to 80 MHz (VCOFRQ[1:0] = 01) */ CPMUSYNR = 0x58; /* clear all flags, especially LOCKIF and OSCIF */ CPMUIFLG = 0xFF; /* put your code to loop and wait for the LOCKIF or */ /* poll CPMUIFLG register until both LOCK status is "1" */ /* that is CPMIFLG == 0x18 */ /*...............continue to your main code execution here...............*/ MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 279 Chapter 8 S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V7) MC9S12ZVC Family Reference Manual , Rev. 1.9 280 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Table 9-1. Revision History Revision Number Revision Date Sections Affected Description of Changes V1.40 02. Oct 2013 entire document Updated formatting and wording correction for entire document (for technical publications). 9.1 Introduction The ADC12B_LBA is an n-channel multiplexed input successive approximation analog-to-digital converter. Refer to device electrical specifications for ADC parameters and accuracy. The List Based Architecture (LBA) provides flexible conversion sequence definition as well as flexible oversampling. The order of channels to be converted can be freely defined. Also, multiple instantiations of the module can be triggered simultaneously (matching sampling point across multiple module instantiations). There are four register bits which control the conversion flow (please refer to the description of register ADCFLWCTL). The four conversion flow control bits of register ADCFLWCTL can be modified in two different ways: * Via data bus accesses * Via internal interface Signals (Trigger, Restart, LoadOK, and Seq_Abort; see also Figure 9-2). Each Interface Signal is associated with one conversion flow control bit. For information regarding internal interface connectivity related to the conversion flow control please refer to the device overview of the reference manual. The ADCFLWCTL register can be controlled via internal interface only or via data bus only or by both depending on the register access configuration bits ACC_CFG[1:0]. The four bits of register ADCFLWCTL reflect the captured request and status of the four internal interface Signals (LoadOK, Trigger, Restart, and Seq_abort; see also Figure 9-2) if access configuration is set accordingly and indicate event progress (when an event is processed and when it is finished). Conversion flow error situations are captured by corresponding interrupt flags in the ADCEIF register. There are two conversion flow control modes (Restart Mode, Trigger Mode). Each mode causes a certain behavior of the conversion flow control bits which can be selected according to the application needs. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 281 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Please refer to Section 9.4.2.1, "ADC Control Register 0 (ADCCTL_0) and Section 9.5.3.2.4, "The two conversion flow control Mode Configurations for more information regarding conversion flow control. Because internal components of the ADC are turned on/off with bit ADC_EN, the ADC requires a recovery time period (tREC) after ADC is enabled until the first conversion can be launched via a trigger. When bit ADC_EN gets cleared (transition from 1'b1 to 1'b0) any ongoing conversion sequence will be aborted and pending results, or the result of current conversion, gets discarded (not stored). The ADC cannot be re-enabled before any pending action or action in process is finished respectively aborted, which could take up to a maximum latency time of tDISABLE (see device level specification for more details). MC9S12ZVC Family Reference Manual , Rev. 1.9 282 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.2 * * * * * * * * * * * * * * * * * * Key Features Programmer's Model with List Based Architecture for conversion command and result value organization Selectable resolution of 8-bit, 10-bit, or 12-bit Channel select control for n external analog input channels Provides up to eight device internal channels (please see the device reference manual for connectivity information and Figure 9-2) Programmable sample time A sample buffer amplifier for channel sampling (improved performance in view to influence of channel input path resistance versus conversion accuracy) Left/right justified result data Individual selectable VRH_0/1 and VRL_0/1 inputs on a conversion command basis (please see Figure 9-2) Special conversions for selected VRH_0/1, VRL_0/1, (VRL_0/1 + VRH_0/1) / 2 15 conversion interrupts with flexible interrupt organization per conversion result One dedicated interrupt for "End Of List" type commands Command Sequence List (CSL) with a maximum number of 64 command entries Provides conversion sequence abort Restart from top of active Command Sequence List (CSL) The Command Sequence List and Result Value List are implemented in double buffered manner (two lists in parallel for each function) Conversion Command (CSL) loading possible from System RAM or NVM Single conversion flow control register with software selectable access path Two conversion flow control modes optimized to different application use cases MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 283 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.2.1 Modes of Operation 9.2.1.1 Conversion Modes This architecture provides single, multiple, or continuous conversion on a single channel or on multiple channels based on the Command Sequence List. 9.2.1.2 * MCU Operating Modes MCU Stop Mode Before issuing an MCU Stop Mode request the ADC should be idle (no conversion or conversion sequence or Command Sequence List ongoing). If a conversion, conversion sequence, or CSL is in progress when an MCU Stop Mode request is issued, a Sequence Abort Event occurs automatically and any ongoing conversion finish. After the Sequence Abort Event finishes, if the STR_SEQA bit is set (STR_SEQA=1), then the conversion result is stored and the corresponding flags are set. If the STR_SEQA bit is cleared (STR_SEQA=0), then the conversion result is not stored and the corresponding flags are not set. The microcontroller then enters MCU Stop Mode without SEQAD_IF being set. Alternatively, the Sequence Abort Event can be issued by software before an MCU Stop Mode request. As soon as flag SEQAD_IF is set the MCU Stop Mode request can be is issued. With the occurrence of the MCU Stop Mode Request until exit from Stop Mode all flow control signals (RSTA, SEQA, LDOK, TRIG) are cleared. After exiting MCU Stop Mode, the following happens in the order given with expected event(s) depending on the conversion flow control mode: -- In ADC conversion flow control mode "Trigger Mode" a Restart Event is expected to simultaneously set bits TRIG and RSTA, causing the ADC to execute the Restart Event (CMD_IDX and RVL_IDX cleared) followed by the Trigger Event. The Restart Event can be generated automatically after exit from MCU Stop Mode if bit AUT_RSTA is set. -- In ADC conversion flow control mode "Restart Mode", a Restart Event is expected to set bit RSTA only (ADC already aborted at MCU Stop Mode entry hence bit SEQA must not be set simultaneously) causing the ADC to execute the Restart Event (CDM_IDX and RVL_IDX cleared). The Restart Event can be generated automatically after exit from MCU Stop Mode if bit AUT_RSTA is set. -- The RVL buffer select (RVL_SEL) is not changed if a CSL is in process at MCU Stop Mode request. Hence the same buffer will be used after exit from Stop Mode that was used when the Stop Mode request occurred. MC9S12ZVC Family Reference Manual , Rev. 1.9 284 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) * MCU Wait Mode Depending on the ADC Wait Mode configuration bit SWAI, the ADC either continues conversion in MCU Wait Mode or freezes conversion at the next conversion boundary before MCU Wait Mode is entered. ADC behavior for configuration SWAI =1'b0: The ADC continues conversion during Wait Mode according to the conversion flow control sequence. It is assumed that the conversion flow control sequence is continued (conversion flow control bits TRIG, RSTA, SEQA, and LDOK are serviced accordingly). ADC behavior for configuration SWAI = 1'b1: At MCU Wait Mode request the ADC should be idle (no conversion or conversion sequence or Command Sequence List ongoing). If a conversion, conversion sequence, or CSL is in progress when an MCU Wait Mode request is issued, a Sequence Abort Event occurs automatically and any ongoing conversion finish. After the Sequence Abort Event finishes, if the STR_SEQA bit is set (STR_SEQA=1), then the conversion result is stored and the corresponding flags are set. If the STR_SEQA bit is cleared (STR_SEQA=0), then the conversion result is not stored and the corresponding flags are not set. Alternatively the Sequence Abort Event can be issued by software before MCU Wait Mode request. As soon as flag SEQAD_IF is set, the MCU Wait Mode request can be issued. With the occurrence of the MCU Wait Mode request until exit from Wait Mode all flow control signals (RSTA, SEQA, LDOK, TRIG) are cleared. After exiting MCU Wait Mode, the following happens in the order given with expected event(s) depending on the conversion flow control mode: -- In ADC conversion flow control mode "Trigger Mode", a Restart Event is expected to occur. This simultaneously sets bit TRIG and RSTA causing the ADC to execute the Restart Event (CMD_IDX and RVL_IDX cleared) followed by the Trigger Event. The Restart Event can be generated automatically after exit from MCU Wait Mode if bit AUT_RSTA is set. -- In ADC conversion flow control mode "Restart Mode", a Restart Event is expected to set bit RSTA only (ADC already aborted at MCU Wait Mode entry hence bit SEQA must not be set simultaneously) causing the ADC to execute the Restart Event (CDM_IDX and RVL_IDX cleared). The Restart Event can be generated automatically after exit from MCU Wait Mode if bit AUT_RSTA is set. -- The RVL buffer select (RVL_SEL) is not changed if a CSL is in process at MCU Wait Mode request. Hence the same RVL buffer will be used after exit from Wait Mode that was used when Wait Mode request occurred. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 285 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) NOTE In principle, the MCU could stay in Wait Mode for a shorter period of time than the ADC needs to abort an ongoing conversion (range of s). Therefore in case a Sequence Abort Event is issued automatically due to MCU Wait Mode request a following Restart Event after exit from MCU Wait Mode can not be executed before ADC has finished this Sequence Abort Event. The Restart Event is detected but it is pending. This applies in case MCU Wait Mode is exited before ADC has finished the Sequence Abort Event and a Restart Event is issued immediately after exit from MCU Wait Mode. Bit READY can be used by software to detect when the Restart Event can be issued without latency time in processing the event (see also Figure 9-1). Wait Mode request (SWAI=1'b1), Automatic Sequence Abort Event Wake-up Event AN3 AN1 AN4 IN5 AN6 AN1 Begin from top of current CSL Restart Event AN3 AN1 AN4 AN5 AN2 AN0 Sequence_n Sequence_0 Wait Mode entry Abort CSL_0 Active Trigger Sequence_1 EOS READY=1'b1 Earliest point of time to issue Restart Event without latency Idle Active t Figure 9-1. Conversion Flow Control Diagram - Wait Mode (SWAI=1'b1, AUT_RSTA=1'b0) * MCU Freeze Mode Depending on the ADC Freeze Mode configuration bit FRZ_MOD, the ADC either continues conversion in Freeze Mode or freezes conversion at next conversion boundary before the MCU Freeze Mode is entered. After exit from MCU Freeze Mode with previously frozen conversion sequence the ADC continues the conversion with the next conversion command and all ADC interrupt flags are unchanged during MCU Freeze Mode. MC9S12ZVC Family Reference Manual , Rev. 1.9 286 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.2.2 Block Diagram System Clock Clock Prescaler ADC Clock Error/ FlowCtrl Issue Int. Error handler (EN) Data Bus LoadOK Sequence Abort Int. Trigger Control Unit Restart Conversion Int. (Conversion Flow, Timing, Interrupt) Seq_abort see reference manual for connectivity information regarding ADC internal interface Internal_7 Internal_6 Internal_5 Internal_4 Internal_3 Internal_2 DMA access ADC Temperature Sense Comm_0 Comm_1 .......... Idle/ .......... Active ........... Command .......... ........... Sequence AlternativeList ........... Command (RAM/ ........... Sequence NVM) ........... List ........... (RAM/ Comm 63 NVM) int. Channel MUX VREG_sense DMA access VRH_1 VRH_0 Result_0 Result_1 .......... active .......... Conversion ........... Result List .......... (RAM) ........... ........... ........... ........... ........... Result 63 Successive Approximation Register (SAR) and C-DAC VRL_1 VRL_0 VDDA VSSA ANx ..... AN2 AN1 ext. Channel MUX AN0 + - Final + Buffer - Buffer AMP Alternative Result List (RAM) Comparator Sample & Hold PIM ADC12B_LBA Figure 9-2. ADC12B_LBA Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 287 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.3 Signal Description This section lists all inputs to the ADC12B_LBA block. 9.3.1 9.3.1.1 Detailed Signal Descriptions ANx (x = n,..., 2, 1, 0) This pin serves as the analog input Channel x. The maximum input channel number is n. Please refer to the device reference manual for the maximum number of input channels. 9.3.1.2 VRH_0, VRH_1, VRL_0, VRL_1 VRH_0/1 are the high reference voltages, VRL0/1 are the low reference voltages for a ADC conversion selectable on a conversion command basis. Please refer to the device reference manual for availability and connectivity of these pins. 9.3.1.3 VDDA, VSSA These pins are the power supplies for the analog circuitry of the ADC12B_LBA block. MC9S12ZVC Family Reference Manual , Rev. 1.9 288 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the ADC12B_LBA. 9.4.1 Module Memory Map Figure 9-3 gives an overview of all ADC12B_LBA registers. NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level. Address Name 0x0000 ADCCTL_0 0x0001 ADCCTL_1 0x0002 ADCSTS 0x0003 ADCTIM 0x0004 ADCFMT 0x0005 ADCFLWCTL 0x0006 ADCEIE 0x0007 ADCIE 0x0008 ADCEiF 0x0009 ADCIF 0x000A ADCCONIE_0 0x000B ADCCONIE_1 0x000C ADCCONIF_0 0x000D ADCCONIF_1 0x000E ADCIMDRI_0 0x000F ADCIMDRI_1 Bit 7 R ADC_EN W R CSL_BMO D W R CSL_SEL W R 0 W R DJM W R SEQA W R IA_EIE W R SEQAD_IE W R IA_EIF W R SEQAD_IF W R W R W R W R W R CSL_IMD R W 0 6 5 4 ADC_SR FRZ_MOD SWAI RVL_BMO SMOD_AC AUT_RST D C A DBECC_ER Reserved R RVL_SEL 3 2 ACC_CFG[1:0] 1 Bit 0 STR_SEQA MOD_CFG 0 0 0 0 READY 0 0 0 PRS[6:0] 0 0 0 TRIG RSTA LDOK CMD_EIE EOL_EIE Reserved CONIF_OI E Reserved CMD_EIF EOL_EIF CONIF_OI F Reserved 0 Reserved 0 0 0 SRES[2:0] 0 0 TRIG_EIE RSTAR_EIE LDOK_EIE 0 0 0 TRIG_EIF RSTAR_EIF LDOK_EIF 0 0 0 0 0 0 0 0 CON_IE[15:8] CON_IE[7:1] EOL_IE CON_IF[15:8] CON_IF[7:1] RVL_IMD 0 0 0 EOL_IF 0 0 0 0 RIDX_IMD[5:0] = Unimplemented or Reserved Figure 9-3. ADC12B_LBA Register Summary (Sheet 1 of 3) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 289 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Address 0x0010 0x0011 0x0012 0x0013 0x0014 0x0015 0x0016 0x0017 0x0018 0x0019 0x001A 0x001B 0x001C 0x001D 0x001E 0x001F 0x0020 0x0021 0x0022 0x0023 0x0024 0x0025 0x0026 Name Bit 7 6 R CSL_EOL RVL_EOL ADCEOLRI W R 0 0 Reserved W R 0 0 Reserved W R Reserved Reserved W R ADCCMD_0 CMD_SEL W R ADCCMD_1 VRH_SEL VRL_SEL W R ADCCMD_2 W R ADCCMD_3 Reserved Reserved W R Reserved W R Reserved W R Reserved W R Reserved W R 0 0 ADCCIDX W R ADCCBP_0 W R ADCCBP_1 W R ADCCBP_2 W R 0 0 ADCRIDX W R 0 0 ADCRBP_0 W R ADCRBP_1 W R ADCRBP_2 W R 0 ADCCROFF0 W R 0 ADCCROFF1 W R 0 0 Reserved W 5 0 4 0 3 0 2 0 1 0 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Reserved 0 0 INTFLG_SEL[3:0] CH_SEL[5:0] 0 SMP[4:0] 0 Reserved Reserved Reserved Reserved Reserved Reserved CMD_IDX[5:0] CMD_PTR[23:16] CMD_PTR[15:8] 0 CMD_PTR[7:2] 0 RES_IDX[5:0] 0 0 RES_PTR[19:16] RES_PTR[15:8] 0 RES_PTR[7:2] 0 CMDRES_OFF0[6:0] CMDRES_OFF1[6:0] 0 0 Reserved = Unimplemented or Reserved Figure 9-3. ADC12B_LBA Register Summary (Sheet 2 of 3) MC9S12ZVC Family Reference Manual , Rev. 1.9 290 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Address Name 0x0027 Reserved 0x0028 Reserved 0x0029 Reserved 0x002A0x003F Reserved Bit 7 R W R W R W R W 6 5 4 3 2 1 Bit 0 0 0 0 0 Reserved Reserved Reserved 0 0 0 Reserved 0 0 0 0 = Unimplemented or Reserved Figure 9-3. ADC12B_LBA Register Summary (Sheet 3 of 3) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 291 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2 Register Descriptions This section describes in address order all the ADC12B_LBA registers and their individual bits. 9.4.2.1 ADC Control Register 0 (ADCCTL_0) Module Base + 0x0000 R W Reset 15 14 13 12 ADC_EN ADC_SR FRZ_MOD SWAI 0 0 0 0 11 10 ACC_CFG[1:0] 0 0 9 8 STR_SEQA MOD_CFG 0 0 = Unimplemented or Reserved Figure 9-4. ADC Control Register 0 (ADCCTL_0) Read: Anytime Write: * Bits ADC_EN, ADC_SR, FRZ_MOD and SWAI writable anytime * Bits MOD_CFG, STR_SEQA and ACC_CFG[1:0] writable if bit ADC_EN clear or bit SMOD_ACC set Table 9-2. ADCCTL_0 Field Descriptions Field Description 15 ADC_EN ADC Enable Bit -- This bit enables the ADC (e.g. sample buffer amplifier etc.) and controls accessibility of ADC register bits. When this bit gets cleared any ongoing conversion sequence will be aborted and pending results or the result of current conversion gets discarded (not stored). The ADC cannot be re-enabled before any pending action or action in process is finished or aborted, which could take up to a maximum latency time of tDISABLE (see device reference manual for more details). Because internal components of the ADC are turned on/off with this bit, the ADC requires a recovery time period (tREC) after ADC is enabled until the first conversion can be launched via a trigger. 0 ADC disabled. 1 ADC enabled. 14 ADC_SR ADC Soft-Reset -- This bit causes an ADC Soft-Reset if set after a severe error occurred (see list of severe errors in Section 9.4.2.9, "ADC Error Interrupt Flag Register (ADCEIF) that causes the ADC to cease operation). It clears all overrun flags and error flags and forces the ADC state machine to its idle state. It also clears the Command Index Register, the Result Index Register, and the CSL_SEL and RVL_SEL bits (to be ready for a new control sequence to load new command and start execution again from top of selected CSL). A severe error occurs if an error flag is set which cause the ADC to cease operation. In order to make the ADC operational again an ADC Soft-Reset must be issued. Once this bit is set it can not be cleared by writing any value. It is cleared only by ADC hardware after the Soft-Reset has been executed. 0 No ADC Soft-Reset issued. 1 Issue ADC Soft-Reset. 13 FRZ_MOD 12 SWAI Freeze Mode Configuration -- This bit influences conversion flow during Freeze Mode. 0 ADC continues conversion in Freeze Mode. 1 ADC freezes the conversion at next conversion boundary at Freeze Mode entry. Wait Mode Configuration -- This bit influences conversion flow during Wait Mode. 0 ADC continues conversion in Wait Mode. 1 ADC halts the conversion at next conversion boundary at Wait Mode entry. MC9S12ZVC Family Reference Manual , Rev. 1.9 292 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Table 9-2. ADCCTL_0 Field Descriptions (continued) Field Description 11-10 ADCFLWCTL Register Access Configuration -- These bits define if the register ADCFLWCTL is controlled via internal ACC_CFG[1: interface only or data bus only or both. See Table 9-3. for more details. 0] 9 STR_SEQA Control Of Conversion Result Storage and RSTAR_EIF flag setting at Sequence Abort or Restart Event -- This bit controls conversion result storage and RSTAR_EIF flag setting when a Sequence Abort Event or Restart Event occurs as follows: If STR_SEQA = 1'b0 and if a: * Sequence Abort Event or Restart Event is issued during a conversion the data of this conversion is not stored and the respective conversion complete flag is not set * Restart Event only is issued before the last conversion of a CSL is finished and no Sequence Abort Event is in process (SEQA clear) causes the RSTA_EIF error flag to be asserted and bit SEQA gets set by hardware If STR_SEQA = 1'b1 and if a: * Sequence Abort Event or Restart Event is issued during a conversion the data of this conversion is stored and the respective conversion complete flag is set and Intermediate Result Information Register is updated. * Restart Event only occurs during the last conversion of a CSL and no Sequence Abort Event is in process (SEQA clear) does not set the RSTA_EIF error flag * Restart Event only is issued before the CSL is finished and no Sequence Abort Event is in process (SEQA clear) causes the RSTA_EIF error flag to be asserted and bit SEQA gets set by hardware 8 MOD_CFG (Conversion Flow Control) Mode Configuration -- This bit defines the conversion flow control after a Restart Event and after execution of the "End Of List" command type: - Restart Mode - Trigger Mode (For more details please see also section Section 9.5.3.2, "Introduction of the Programmer's Model and following.) 0 "Restart Mode" selected. 1 "Trigger Mode" selected. Table 9-3. ADCFLWCTL Register Access Configurations ACC_CFG[1] ACC_CFG[0] 0 0 0 1 1 0 1 1 ADCFLWCTL Access Mode None of the access paths is enabled (default / reset configuration) Single Access Mode - Internal Interface (ADCFLWCTL access via internal interface only) Single Access Mode - Data Bus (ADCFLWCTL access via data bus only) Dual Access Mode (ADCFLWCTL register access via internal interface and data bus) NOTE Each conversion flow control bit (SEQA, RSTA, TRIG, LDOK) must be controlled by software or internal interface according to the requirements described in Section 9.5.3.2.4, "The two conversion flow control Mode Configurations and overview summary in Table 9-10. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 293 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.2 ADC Control Register 1 (ADCCTL_1) Module Base + 0x0001 7 R W 6 5 4 CSL_BMOD RVL_BMOD SMOD_ACC AUT_RSTA 0 0 0 0 Reset 3 2 1 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-5. ADC Control Register 1 (ADCCTL_1) Read: Anytime Write: * Bit CSL_BMOD and RVL_BMOD writable if bit ADC_EN clear or bit SMOD_ACC set * Bit SMOD_ACC only writable in MCU Special Mode * Bit AUT_RSTA writable anytime Table 9-4. ADCCTL_1 Field Descriptions Field Description 7 CSL Buffer Mode Select Bit -- This bit defines the CSL buffer mode. This bit is only writable if ADC_EN is clear. CSL_BMOD 0 CSL single buffer mode. 1 CSL double buffer mode. 6 RVL Buffer Mode Select Bit -- This bit defines the RVL buffer mode. RVL_BMOD 0 RVL single buffer mode 1 RVL double buffer mode 5 Special Mode Access Control Bit -- This bit controls register access rights in MCU Special Mode. This bit is automatically SMOD_ACC cleared when leaving MCU Special Mode. Note: When this bit is set also the ADCCMD register is writeable via the data bus to allow modification of the current command for debugging purpose. But this is only possible if the current command is not already processed (conversion not started). Please see access details given for each register. Care must be taken when modifying ADC registers while bit SMOD_ACC is set to not corrupt a possible ongoing conversion. 0 Normal user access - Register write restrictions exist as specified for each bit. 1 Special access - Register write restrictions are lifted. 4 AUT_RSTA Automatic Restart Event after exit from MCU Stop and Wait Mode (SWAI set) -- This bit controls if a Restart Event is automatically generated after exit from MCU Stop Mode or Wait Mode with bit SWAI set. It can be configured for ADC conversion flow control mode "Trigger Mode" and "Restart Mode" (anytime during application runtime). 0 No automatic Restart Event after exit from MCU Stop Mode. 1 Automatic Restart Event occurs after exit from MCU Stop Mode. MC9S12ZVC Family Reference Manual , Rev. 1.9 294 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.3 ADC Status Register (ADCSTS) It is important to note that if flag DBECC_ERR is set the ADC ceases operation. In order to make the ADC operational again an ADC Soft-Reset must be issued. An ADC Soft-Reset clears bits CSL_SEL and RVL_SEL. Module Base + 0x0002 R W Reset 7 6 CSL_SEL RVL_SEL 0 0 5 4 3 2 1 0 DBECC_ERR Reserved READY 0 0 0 0 0 1 0 0 0 = Unimplemented or Reserved Figure 9-6. ADC Status Register (ADCSTS) Read: Anytime Write: * Bits CSL_SEL and RVL_SEL anytime if bit ADC_EN is clear or bit SMOD_ACC is set * Bits DBECC_ERR and READY not writable Table 9-5. ADCSTS Field Descriptions Field Description 7 CSL_SEL Command Sequence List Select bit -- This bit controls and indicates which ADC Command List is active. This bit can only be written if ADC_EN bit is clear. This bit toggles in CSL double buffer mode when no conversion or conversion sequence is ongoing and bit LDOK is set and bit RSTA is set. In CSL single buffer mode this bit is forced to 1'b0 by bit CSL_BMOD. 0 ADC Command List 0 is active. 1 ADC Command List 1 is active. 6 RVL_SEL Result Value List Select Bit -- This bit controls and indicates which ADC Result List is active. This bit can only be written if bit ADC_EN is clear. After storage of the initial Result Value List this bit toggles in RVL double buffer mode whenever the conversion result of the first conversion of the current CSL is stored or a CSL got aborted. In RVL single buffer mode this bit is forced to 1'b0 by bit RVL_BMOD. Please see also Section 9.2.1.2, "MCU Operating Modes for information regarding Result List usage in case of Stop or Wait Mode. 0 ADC Result List 0 is active. 1 ADC Result List 1 is active. 5 Double Bit ECC Error Flag -- This flag indicates that a double bit ECC error occurred during conversion command load DBECC_ER or result storage and ADC ceases operation. R In order to make the ADC operational again an ADC Soft-Reset must be issued. This bit is cleared if bit ADC_EN is clear. 0 No double bit ECC error occurred. 1 A double bit ECC error occurred. 3 READY Ready For Restart Event Flag -- This flag indicates that ADC is in its idle state and ready for a Restart Event. It can be used to verify after exit from Wait Mode if a Restart Event can be issued and processed immediately without any latency time due to an ongoing Sequence Abort Event after exit from MCU Wait Mode (see also the Note in Section 9.2.1.2, "MCU Operating Modes). 0 ADC not in idle state. 1 ADC is in idle state. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 295 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.4 ADC Timing Register (ADCTIM) Module Base + 0x0003 7 R 6 5 4 0 0 2 1 0 1 0 1 PRS[6:0] W Reset 3 0 0 0 0 = Unimplemented or Reserved Figure 9-7. ADC Timing Register (ADCTIM)) Read: Anytime Write: These bits are writable if bit ADC_EN is clear or bit SMOD_ACC is set Table 9-6. ADCTIM Field Descriptions Field 6-0 PRS[6:0] Description ADC Clock Prescaler -- These 7bits are the binary prescaler value PRS. The ADC conversion clock frequency is calculated as follows: f BUS f A TD CLK = ---------------------------------2x PRS + 1 Refer to Device Specification for allowed frequency range of fATDCLK. MC9S12ZVC Family Reference Manual , Rev. 1.9 296 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.5 ADC Format Register (ADCFMT) Module Base + 0x0004 7 R W Reset DJM 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 SRES[2:0] 0 0 0 = Unimplemented or Reserved Figure 9-8. ADC Format Register (ADCFMT) Read: Anytime Write: Bits DJM and SRES[2:0] are writable if bit ADC_EN clear or bit SMOD_ACC set Table 9-7. ADCFMT Field Descriptions Field Description 7 DJM Result Register Data Justification -- Conversion result data format is always unsigned. This bit controls justification of conversion result data in the conversion result list. 0 Left justified data in the conversion result list. 1 Right justified data in the conversion result list. 2-0 SRES[2:0] ADC Resolution Select -- These bits select the resolution of conversion results. See Table 9-8 for coding. Table 9-8. Selectable Conversion Resolution 1 SRES[2] SRES[1] SRES[0] ADC Resolution 0 0 0 8-bit data 0 0 1 1 Reserved 0 1 0 10-bit data 0 1 1 1 Reserved 1 0 0 12-bit data 1 x x 1 Reserved Reserved settings cause a severe error at ADC conversion start whereby the CMD_EIF flag is set and ADC ceases operation MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 297 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.6 ADC Conversion Flow Control Register (ADCFLWCTL) Bit set and bit clear instructions should not be used to access this register. When the ADC is enabled the bits of ADCFLWCTL register can be modified after a latency time of three Bus Clock cycles. All bits are cleared if bit ADC_EN is clear or via ADC soft-reset. Module Base + 0x0005 7 R W Reset 6 5 4 SEQA TRIG RSTA LDOK 0 0 0 0 3 2 1 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-9. ADC Conversion Flow Control Register (ADCFLWCTL) Read: Anytime Write: * Bits SEQA, TRIG, RSTA, LDOK can only be set if bit ADC_EN is set. * Writing 1'b0 to any of these bits does not have an effect Timing considerations (Trigger Event - channel sample start) depending on ADC mode configuration: * Restart Mode When the Restart Event has been processed (initial command of current CSL is loaded) it takes two Bus Clock cycles plus two ADC conversion clock cycles (pump phase) from the Trigger Event (bit TRIG set) until the select channel starts to sample. During a conversion sequence (back to back conversions) it takes five Bus Clock cycles plus two ADC conversion clock cycles (pump phase) from current conversion period end until the newly selected channel is sampled in the following conversion period. * Trigger Mode When a Restart Event occurs a Trigger Event is issued simultaneously. The time required to process the Restart Event is mainly defined by the internal read data bus availability and therefore can vary. In this mode the Trigger Event is processed immediately after the Restart Event is finished and both conversion flow control bits are cleared simultaneously. From de-assert of bit TRIG until sampling begins five Bus Clock cycles are required. Hence from occurrence of a Restart Event until channel sampling it takes five Bus Clock cycles plus an uncertainty of a few Bus Clock cycles. For more details regarding the sample phase please refer to Section 9.5.2.2, "Sample and Hold Machine with Sample Buffer Amplifier. MC9S12ZVC Family Reference Manual , Rev. 1.9 298 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Table 9-9. ADCFLWCTL Field Descriptions Field Description 7 SEQA Conversion Sequence Abort Event -- This bit indicates that a conversion sequence abort event is in progress. When this bit is set the ongoing conversion sequence and current CSL will be aborted at the next conversion boundary. This bit gets cleared when the ongoing conversion sequence is aborted and ADC is idle. This bit can only be set if bit ADC_EN is set. This bit is cleared if bit ADC_EN is clear. Data Bus Control: This bit can be controlled via the data bus if access control is configured accordingly via ACC_CFG[1:0]. Writing a value of 1'b0 does not clear the flag. Writing a one to this bit does not clear it but causes an overrun if the bit has already been set. See Section 9.5.3.2.6, "Conversion flow control in case of conversion sequence control bit overrun scenarios for more details. Internal Interface Control: This bit can be controlled via the internal interface Signal "Seq_Abort" if access control is configured accordingly via ACC_CFG[1:0]. After being set an additional request via the internal interface Signal "Seq_Abort" causes an overrun. See also conversion flow control in case of overrun situations. General: In both conversion flow control modes (Restart Mode and Trigger Mode) when bit RSTA gets set automatically bit SEQA gets set when the ADC has not reached one of the following scenarios: - A Sequence Abort request is about to be executed or has been executed. - "End Of List" command type has been executed or is about to be executed In case bit SEQA is set automatically the Restart error flag RSTA_EIF is set to indicate an unexpected Restart Request. 0 No conversion sequence abort request. 1 Conversion sequence abort request. 6 TRIG Conversion Sequence Trigger Bit -- This bit starts a conversion sequence if set and no conversion or conversion sequence is ongoing. This bit is cleared when the first conversion of a sequence starts to sample. This bit can only be set if bit ADC_EN is set. This bit is cleared if bit ADC_EN is clear. Data Bus Control: This bit can be controlled via the data bus if access control is configured accordingly via ACC_CFG[1:0]. Writing a value of 1'b0 does not clear the flag. After being set this bit can not be cleared by writing a value of 1'b1 instead the error flag TRIG_EIF is set. See also Section 9.5.3.2.6, "Conversion flow control in case of conversion sequence control bit overrun scenarios for more details. Internal Interface Control: This bit can be controlled via the internal interface Signal "Trigger" if access control is configured accordingly via ACC_CFG[1:0]. After being set an additional request via internal interface Signal "Trigger" causes the flag TRIG_EIF to be set. 0 No conversion sequence trigger. 1 Trigger to start conversion sequence. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 299 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Table 9-9. ADCFLWCTL Field Descriptions (continued) Field Description 5 RSTA Restart Event (Restart from Top of Command Sequence List) -- This bit indicates that a Restart Event is executed. The ADC loads the conversion command from top of the active Sequence Command List when no conversion or conversion sequence is ongoing. This bit is cleared when the first conversion command of the sequence from top of active Sequence Command List has been loaded into the ADCCMD register. This bit can only be set if bit ADC_EN is set. This bit is cleared if bit ADC_EN is clear. Data Bus Control: This bit can be controlled via the data bus if access control is configured accordingly via ACC_CFG[1:0]. Writing a value of 1'b0 does not clear the flag. Writing a one to this bit does not clear it but causes an overrun if the bit has already been set. See also Section 9.5.3.2.6, "Conversion flow control in case of conversion sequence control bit overrun scenarios for more details. Internal Interface Control: This bit can be controlled via the internal interface Signal "Restart" if access control is configured accordingly via ACC_CFG[1:0]. After being set an additional request via internal interface Signal "Restart" causes an overrun. See conversion flow control in case of overrun situations for more details. General: In conversion flow control mode "Trigger Mode" when bit RSTA gets set bit TRIG is set simultaneously if one of the following has been executed: - "End Of List" command type has been executed or is about to be executed - Sequence Abort Event 0 Continue with commands from active Sequence Command List. 1 Restart from top of active Sequence Command List. 4 LDOK Load OK for alternative Command Sequence List -- This bit indicates if the preparation of the alternative Sequence Command List is done and Command Sequence List must be swapped with the Restart Event. This bit is cleared when bit RSTA is set (Restart Event executed) and the Command Sequence List got swapped. This bit can only be set if bit ADC_EN is set. This bit is cleared if bit ADC_EN is clear. This bit is forced to zero if bit CSL_BMOD is clear. Data Bus Control: This bit can be controlled via the data bus if access control is configured accordingly via ACC_CFG[1:0]. Writing a value of 1'b0 does not clear the flag. To set bit LDOK the bits LDOK and RSTA must be written simultaneously. After being set this bit can not be cleared by writing a value of 1'b1. See also Section 9.5.3.2.6, "Conversion flow control in case of conversion sequence control bit overrun scenarios for more details. Internal Interface Control: This bit can be controlled via the internal interface Signal "LoadOK" and "Restart" if access control is configured accordingly via ACC_CFG[1:0]. With the assertion of Interface Signal "Restart" the interface Signal "LoadOK" is evaluated and bit LDOK set accordingly (bit LDOK set if Interface Signal "LoadOK" asserted when Interface Signal "Restart" asserts). General: Only in "Restart Mode" if a Restart Event occurs without bit LDOK being set the error flag LDOK_EIF is set except when the respective Restart Request occurred after or simultaneously with a Sequence Abort Request. The LDOK_EIF error flag is also not set in "Restart Mode" if the first Restart Event occurs after: - ADC got enabled - Exit from Stop Mode - ADC Soft-Reset 0 Load of alternative list done. 1 Load alternative list. MC9S12ZVC Family Reference Manual , Rev. 1.9 300 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Table 9-10. Summary of Conversion Flow Control Bit Scenarios RSTA TRIG SEQA LDOK Conversion Flow Control Conversion Flow Control Mode Scenario 0 0 0 0 Both Modes Valid 0 0 0 1 Both Modes Can Not Occur 0 0 1 0 Both Modes 5 Valid 0 0 1 1 Both Modes Can Not Occur 0 1 0 0 Both Modes 2 Valid 0 1 0 1 Both Modes Can Not Occur 0 1 1 0 Both Modes Can Not Occur 0 1 1 1 Both Modes Can Not Occur 1 0 0 0 Both Modes 4 Valid 1 0 0 1 Both Modes 14 Valid 1 0 1 0 Both Modes 345 Valid 1 0 1 1 Both Modes 1345 Valid "Restart Mode" Error flag TRIG_EIF set 1 1 0 0 "Trigger Mode" 1 1 1 1 2 3 4 5 6 1 1 1 0 1 1 Valid 246 "Restart Mode" Error flag TRIG_EIF set "Trigger Mode" 1246 Valid "Restart Mode" Error flag TRIG_EIF set "Trigger Mode" 23456 Valid "Restart Mode" Error flag TRIG_EIF set "Trigger Mode" 123456 Valid 1 0 1 Swap CSL buffer Start conversion sequence Prevent RSTA_EIF and LDOK_EIF Load conversion command from top of CSL Abort any ongoing conversion, conversion sequence and CSL Bit TRIG set automatically in Trigger Mode For a detailed description of all conversion flow control bit scenarios please see also Section 9.5.3.2.4, "The two conversion flow control Mode Configurations, Section 9.5.3.2.5, "The four ADC conversion flow control bits and Section 9.5.3.2.6, "Conversion flow control in case of conversion sequence control bit overrun scenarios MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 301 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.7 ADC Error Interrupt Enable Register (ADCEIE) Module Base + 0x0006 7 R W Reset 6 5 4 3 2 1 0 IA_EIE CMD_EIE EOL_EIE Reserved TRIG_EIE RSTAR_EIE LDOK_EIE 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-10. ADC Error Interrupt Enable Register (ADCEIE) Read: Anytime Write: Anytime Table 9-11. ADCEIE Field Descriptions Field 7 IA_EIE Description Illegal Access Error Interrupt Enable Bit -- This bit enables the illegal access error interrupt. 0 Illegal access error interrupt disabled. 1 Illegal access error interrupt enabled. 6 CMD_EIE Command Value Error Interrupt Enable Bit -- This bit enables the command value error interrupt. 0 Command value interrupt disabled. 1 Command value interrupt enabled. 5 EOL_EIE "End Of List" Error Interrupt Enable Bit -- This bit enables the "End Of List" error interrupt. 0 "End Of List" error interrupt disabled. 1 "End Of List" error interrupt enabled. 3 TRIG_EIE Conversion Sequence Trigger Error Interrupt Enable Bit -- This bit enables the conversion sequence trigger error interrupt. 0 Conversion sequence trigger error interrupt disabled. 1 Conversion sequence trigger error interrupt enabled. 2 Restart Request Error Interrupt Enable Bit-- This bit enables the restart request error interrupt. RSTAR_EIE 0 Restart Request error interrupt disabled. 1 Restart Request error interrupt enabled. 1 LDOK_EIE Load OK Error Interrupt Enable Bit -- This bit enables the Load OK error interrupt. 0 Load OK error interrupt disabled. 1 Load OK error interrupt enabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 302 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.8 ADC Interrupt Enable Register (ADCIE) Module Base + 0x0007 7 R W 6 5 SEQAD_IE CONIF_OIE Reserved 0 0 0 Reset 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-11. ADC Interrupt Enable Register (ADCIE) Read: Anytime Write: Anytime Table 9-12. ADCIE Field Descriptions Field 7 SEQAD_IE Description Conversion Sequence Abort Done Interrupt Enable Bit -- This bit enables the conversion sequence abort event done interrupt. 0 Conversion sequence abort event done interrupt disabled. 1 Conversion sequence abort event done interrupt enabled. 6 ADCCONIF Register Flags Overrun Interrupt Enable -- This bit enables the flag which indicates if an overrun situation CONIF_OIE occurred for one of the CON_IF[15:1] flags or for the EOL_IF flag. 0 No ADCCONIF Register Flag overrun occurred. 1 ADCCONIF Register Flag overrun occurred. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 303 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.9 ADC Error Interrupt Flag Register (ADCEIF) If one of the following error flags is set the ADC ceases operation: * IA_EIF * CMD_EIF * EOL_EIF * TRIG_EIF In order to make the ADC operational again an ADC Soft-Reset must be issued which clears above listed error interrupt flags. The error interrupt flags RSTAR_EIF and LDOK_EIF do not cause the ADC to cease operation. If set the ADC continues operation. Each of the two bits can be cleared by writing a value of 1'b1. Both bits are also cleared if an ADC Soft-Reset is issued. All bits are cleared if bit ADC_EN is clear. Writing any flag with value 1'b0 does not clear a flag. Writing any flag with value 1'b1 does not set the flag. Module Base + 0x0008 R W Reset 7 6 5 4 3 2 1 0 IA_EIF CMD_EIF EOL_EIF Reserved TRIG_EIF RSTAR_EIF LDOK_EIF 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-12. ADC Error Interrupt Flag Register (ADCEIF) Read: Anytime Write: * Bits RSTAR_EIF and LDOK_EIF are writable anytime * Bits IA_EIF, CMD_EIF, EOL_EIF and TRIG_EIF are not writable Table 9-13. ADCEIF Field Descriptions Field Description 7 IA_EIF Illegal Access Error Interrupt Flag -- This flag indicates that storing the conversion result caused an illegal access error or conversion command loading from outside system RAM or NVM area occurred. The ADC ceases operation if this error flag is set (issue of type severe). 0 No illegal access error occurred. 1 An illegal access error occurred. 6 CMD_EIF Command Value Error Interrupt Flag -- This flag indicates that an invalid command is loaded (Any command that contains reserved bit settings) or illegal format setting selected (reserved SRES[2:0] bit settings). The ADC ceases operation if this error flag is set (issue of type severe). 0 Valid conversion command loaded. 1 Invalid conversion command loaded. 5 EOL_EIF "End Of List" Error Interrupt Flag -- This flag indicates a missing "End Of List" command type in current executed CSL. The ADC ceases operation if this error flag is set (issue of type severe). 0 No "End Of List" error. 1 "End Of List" command type missing in current executed CSL. MC9S12ZVC Family Reference Manual , Rev. 1.9 304 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Table 9-13. ADCEIF Field Descriptions (continued) Field Description 3 TRIG_EIF Trigger Error Interrupt Flag -- This flag indicates that a trigger error occurred. This flag is set in "Restart" Mode when a conversion sequence got aborted and no Restart Event occurred before the Trigger Event or if the Trigger Event occurred before the Restart Event was finished (conversion command has been loaded). This flag is set in "Trigger" Mode when a Trigger Event occurs before the Restart Event is issued to start conversion of the initial Command Sequence List. In "Trigger" Mode only a Restart Event is required to start conversion of the initial Command Sequence List. This flag is set when a Trigger Event occurs before a conversion sequence got finished. This flag is also set if a Trigger occurs while a Trigger Event is just processed - first conversion command of a sequence is beginning to sample (see also Section 9.5.3.2.6, "Conversion flow control in case of conversion sequence control bit overrun scenarios). This flag is also set if the Trigger Event occurs automatically generated by hardware in "Trigger Mode" due to a Restart Event and simultaneously a Trigger Event is generated via data bus or internal interface. The ADC ceases operation if this error flag is set (issue of type severe). 0 No trigger error occurred. 1 A trigger error occurred. 2 Restart Request Error Interrupt Flag -- This flag indicates a flow control issue. It is set when a Restart Request occurs RSTAR_EIF after a Trigger Event and before one of the following conditions was reached: - The "End Of List" command type has been executed - Depending on bit STR_SEQA if the "End Of List" command type is about to be executed - The current CSL has been aborted or is about to be aborted due to a Sequence Abort Request. The ADC continues operation if this error flag is set. This flag is not set for Restart Request overrun scenarios (see also Section 9.5.3.2.6, "Conversion flow control in case of conversion sequence control bit overrun scenarios). 0 No Restart request error situation occurred. 1 Restart request error situation occurred. 1 LDOK_EIF Load OK Error Interrupt Flag -- This flag can only be set in "Restart Mode". It indicates that a Restart Request occurred without LDOK. This flag is not set if a Sequence Abort Event is already in process (bit SEQA set) when the Restart Request occurs or a Sequence Abort Request occurs simultaneously with the Restart Request. The LDOK_EIF error flag is also not set in "Restart Mode" if the first Restart Event occurs after: - ADC got enabled - Exit from Stop Mode - ADC Soft-Reset - ADC used in CSL single buffer mode The ADC continues operation if this error flag is set. 0 No Load OK error situation occurred. 1 Load OK error situation occurred. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 305 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.10 ADC Interrupt Flag Register (ADCIF) After being set any of these bits can be cleared by writing a value of 1'b1 or via ADC soft-reset (bit ADC_SR). All bits are cleared if bit ADC_EN is clear. Writing any flag with value 1'b0 does not clear the flag. Writing any flag with value 1'b1 does not set the flag. Module Base + 0x0009 R W 7 6 5 SEQAD_IF CONIF_OIF Reserved 0 0 0 Reset 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-13. ADC Interrupt Flag Register (ADCIF) Read: Anytime Write: Anytime Table 9-14. ADCIF Field Descriptions Field Description 7 SEQAD_IF Conversion Sequence Abort Done Interrupt Flag -- This flag is set when the Sequence Abort Event has been executed except the Sequence Abort Event occurred by hardware in order to be able to enter MCU Stop Mode or Wait Mode with bit SWAI set.This flag is also not set if the Sequence Abort request occurs during execution of the last conversion command of a CSL and bit STR_SEQA being set. 0 No conversion sequence abort request occurred. 1 A conversion sequence abort request occurred. 6 ADCCONIF Register Flags Overrun Interrupt Flag -- This flag indicates if an overrun situation occurred for one of the CONIF_OIF CON_IF[15:1] flags or for the EOL_IF flag. In RVL single buffer mode (RVL_BMOD clear) an overrun of the EOL_IF flag is not indicated (For more information please see Note below). 0 No ADCCONIF Register Flag overrun occurred. 1 ADCCONIF Register Flag overrun occurred. NOTE In RVL double buffer mode a conversion interrupt flag (CON_IF[15:1]) or End Of List interrupt flag (EOL_IF) overrun is detected if one of these bits is set when it should be set again due to conversion command execution. In RVL single buffer mode a conversion interrupt flag (CON_IF[15:1]) overrun is detected only. The overrun is detected if any of the conversion interrupt flags (CON_IF[15:1]) is set while the first conversion result of a CSL is stored (result of first conversion from top of CSL is stored). MC9S12ZVC Family Reference Manual , Rev. 1.9 306 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.11 ADC Conversion Interrupt Enable Register (ADCCONIE) Module Base + 0x000A 15 14 13 12 11 10 9 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 EOL_I E CON_IE[15:1] W Reset 8 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-14. ADC Conversion Interrupt Enable Register (ADCCONIE) Read: Anytime Write: Anytime Table 9-15. ADCCONIE Field Descriptions Field Description 15-1 Conversion Interrupt Enable Bits -- These bits enable the individual interrupts which can be triggered via interrupt flags CON_IE[15:1] CON_IF[15:1]. 0 ADC conversion interrupt disabled. 1 ADC conversion interrupt enabled. 0 EOL_IE End Of List Interrupt Enable Bit -- This bit enables the end of conversion sequence list interrupt. 0 End of list interrupt disabled. 1 End of list interrupt enabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 307 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.12 ADC Conversion Interrupt Flag Register (ADCCONIF) After being set any of these bits can be cleared by writing a value of 1'b1. All bits are cleared if bit ADC_EN is clear or via ADC soft-reset (bit ADC_SR set). Writing any flag with value 1'b0 does not clear the flag. Writing any flag with value 1'b1 does not set the flag. Module Base + 0x000C 15 14 13 12 11 10 9 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 EOL_I F CON_IF[15:1] W Reset 8 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-15. ADC Conversion Interrupt Flag Register (ADCCONIF) Read: Anytime Write: Anytime Table 9-16. ADCCONIF Field Descriptions Field Description 15-1 Conversion Interrupt Flags -- These bits could be set by the binary coded interrupt select bits INTFLG_SEL[3:0] when CON_IF[15:1] the corresponding conversion command has been processed and related data has been stored to RAM. See also notes below. 0 EOL_IF End Of List Interrupt Flag -- This bit is set by the binary coded conversion command type select bits CMD_SEL[1:0] for "end of list" type of commands and after such a command has been processed and the related data has been stored RAM. See also second note below NOTE These bits can be used to indicate if a certain packet of conversion results is available. Clearing a flag indicates that conversion results have been retrieved by software and the flag can be used again (see also Section 9.8.6, "RVL swapping in RVL double buffer mode and related registers ADCIMDRI and ADCEOLRI. NOTE Overrun situation of a flag CON_IF[15:1] and EOL_IF are indicated by flag CONIF_OIF. MC9S12ZVC Family Reference Manual , Rev. 1.9 308 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.13 ADC Intermediate Result Information Register (ADCIMDRI) This register is cleared when bit ADC_SR is set or bit ADC_EN is clear. Module Base + 0x000E 15 14 R CSL_IM RVL_I D MD 13 12 11 10 9 8 7 6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 5 4 3 2 1 0 0 0 RIDX_IMD[5:0] W Reset 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-16. ADC Intermediate Result Information Register (ADCIMDRI) Read: Anytime Write: Never Table 9-17. ADCIMDRI Field Descriptions Field Description 15 CSL_IMD Active CSL At Intermediate Event -- This bit indicates the active (used) CSL at the occurrence of a conversion interrupt flag (CON_IF[15:1]) (occurrence of an intermediate result buffer fill event) or when a Sequence Abort Event gets executed. 0 CSL_0 active (used) when a conversion interrupt flag (CON_IF[15:1]) got set. 1 CSL_1 active (used) when a conversion interrupt flag (CON_IF[15:1]) got set. 14 RVL_IMD Active RVL At Intermediate Event -- This bit indicates the active (used) RVL buffer at the occurrence of a conversion interrupt flag (CON_IF[15:1]) (occurrence of an intermediate result buffer fill event) or when a Sequence Abort Event gets executed. 0 RVL_0 active (used) when a conversion interrupt flag (CON_IF[15:1]) got set. 1 RVL_1 active (used) when a conversion interrupt flag (CON_IF[15:1]) got set. 5-0 RES_IDX Value At Intermediate Event -- These bits indicate the result index (RES_IDX) value at the occurrence of a RIDX_IMD[5 conversion interrupt flag (CON_IF[15:1]) (occurrence of an intermediate result buffer fill event) or occurrence of EOL_IF :0] flag or when a Sequence Abort Event gets executed to abort an ongoing conversion (the result index RES_IDX is captured at the occurrence of a result data store). When a Sequence Abort Event has been processed flag SEQAD_IF is set and the RES_IDX value of the last stored result is provided. Hence in case an ongoing conversion is aborted the RES_IDX value captured in RIDX_IMD bits depends on bit STORE_SEQA: - STORE_SEQA =1: The result index of the aborted conversion is provided - STORE_SEQA =0: The result index of the last stored result at abort execution time is provided In case a CSL is aborted while no conversion is ongoing (ADC waiting for a Trigger Event) the last captured result index is provided. In case a Sequence Abort Event was initiated by hardware due to MCU entering Stop Mode or Wait Mode with bit SWAI set, the result index of the last stored result is captured by bits RIDX_IMD but flag SEQAD_IF is not set. NOTE The register ADCIMDRI is updated and simultaneously a conversion interrupt flag CON_IF[15:1] occurs when the corresponding conversion command (conversion command with INTFLG_SEL[3:0] set) has been processed and related data has been stored to RAM. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 309 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.14 ADC End Of List Result Information Register (ADCEOLRI) This register is cleared when bit ADC_SR is set or bit ADC_EN is clear. Module Base + 0x0010 R 7 6 5 4 3 2 1 0 CSL_EOL RVL_EOL 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 9-17. ADC End Of List Result Information Register (ADCEOLRI) Read: Anytime Write: Never Table 9-18. ADCEOLRI Field Descriptions Field Description 7 CSL_EOL Active CSL When "End Of List" Command Type Executed -- This bit indicates the active (used) CSL when a "End Of List" command type has been executed and related data has been stored to RAM. 0 CSL_0 active when "End Of List" command type executed. 1 CSL_1 active when "End Of List" command type executed. 6 RVL_EOL Active RVL When "End Of List" Command Type Executed -- This bit indicates the active (used) RVL when a "End Of List" command type has been executed and related data has been stored to RAM. 0 RVL_0 active when "End Of List" command type executed. 1 RVL_1 active when "End Of List" command type executed. NOTE The conversion interrupt EOL_IF occurs and simultaneously the register ADCEOLRI is updated when the "End Of List" conversion command type has been processed and related data has been stored to RAM. MC9S12ZVC Family Reference Manual , Rev. 1.9 310 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.15 ADC Command Register 0 (ADCCMD_0) Module Base + 0x0014 31 R CMD_SEL W Reset 30 0 0 29 28 0 0 0 0 27 26 25 24 INTFLG_SEL[3:0] 0 0 0 0 = Unimplemented or Reserved Figure 9-18. ADC Command Register 0 (ADCCMD_0) Read: Anytime Write: Only writable if bit SMOD_ACC is set (see also Section 9.4.2.2, "ADC Control Register 1 (ADCCTL_1) bit SMOD_ACC description for more details) Table 9-19. ADCCMD_0 Field Descriptions Field Description 31-30 Conversion Command Select Bits -- These bits define the type of current conversion described in Table 9-20. CMD_SEL[1:0] 27-24 Conversion Interrupt Flag Select Bits -- These bits define which interrupt flag is set in the ADCIFH/L register at the INTFLG_SEL[3 end of current conversion.The interrupt flags ADCIF[15:1] are selected via binary coded bits INTFLG_SEL[3:0]. See also :0] Table 9-21 NOTE If bit SMOD_ACC is set modifying this register must be done carefully only when no conversion and conversion sequence is ongoing. Table 9-20. Conversion Command Type Select CMD_SEL[1] CMD_SEL[0] Conversion Command Type Description 0 0 Normal Conversion 0 1 End Of Sequence (Wait for Trigger to execute next sequence or for a Restart) End Of List 1 0 (Automatic wrap to top of CSL and Continue Conversion) End Of List 1 1 (Wrap to top of CSL and: - In "Restart Mode" wait for Restart Event followed by a Trigger - In "Trigger Mode" wait for Trigger or Restart Event) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 311 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Table 9-21. Conversion Interrupt Flag Select CON_IF[15:1] INTFLG_SEL[3] INTFLG_SEL[2] INTFLG_SEL[1] INTFLG_SEL[0] Comment 0x0000 0 0 0 0 No flag set 0x0001 0 0 0 1 0x0002 0 0 1 0 0x0004 0 0 1 1 0x0008 0 1 0 0 0x0010 0 1 0 1 Only one flag can .... ... ... ... ... (one hot coding) 0x0800 1 1 0 0 0x1000 1 1 0 1 0x2000 1 1 1 0 0x4000 1 1 1 1 be set MC9S12ZVC Family Reference Manual , Rev. 1.9 312 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.16 ADC Command Register 1 (ADCCMD_1) A command which contains reserved bit settings causes the error flag CMD_EIF being set and ADC cease operation. Module Base + 0x0015 R W Reset 23 22 VRH_SEL VRL_SEL 0 21 20 19 18 17 16 0 0 0 CH_SEL[5:0] 0 0 0 0 = Unimplemented or Reserved Figure 9-19. ADC Command Register 1 (ADCCMD_1) Read: Anytime Write: Only writable if bit SMOD_ACC is set (see also Section 9.4.2.2, "ADC Control Register 1 (ADCCTL_1) bit SMOD_ACC description for more details) Table 9-22. ADCCMD_1 Field Descriptions Field Description 23 VRH_SEL Reference High Voltage Select Bit -- This bit selects the high voltage reference for current conversion. 0 VRH_0 input selected as high voltage reference. 1 VRH_1 input selected as high voltage reference. 22 VRL_SEL Reference Low Voltage Select Bit -- This bit selects the voltage reference for current conversion. 0 VRL_0 input selected as low voltage reference. 1 VRL_1 input selected as low voltage reference. 21-16 ADC Input Channel Select Bits -- These bits select the input channel for the current conversion. See Table 9-23 for CH_SEL[5:0] channel coding information. NOTE If bit SMOD_ACC is set modifying this register must be done carefully only when no conversion and conversion sequence is ongoing. Table 9-23. Analog Input Channel Select CH_SEL[5] CH_SEL[4] CH_SEL[3] CH_SEL[2] CH_SEL[1] CH_SEL[0] Analog Input Channel 0 0 0 0 0 0 VRL_0/1 0 0 0 0 0 1 VRH_0/1 0 0 0 0 1 0 (VRH_0/1 + VRL_0/1) / 2 0 0 0 0 1 1 Reserved 0 0 0 1 0 0 Reserved 0 0 0 1 0 1 Reserved 0 0 0 1 1 0 Reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 313 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Table 9-23. Analog Input Channel Select CH_SEL[5] CH_SEL[4] CH_SEL[3] CH_SEL[2] CH_SEL[1] CH_SEL[0] Analog Input Channel 0 0 0 1 1 1 Reserved 0 0 1 0 0 0 Reserved 0 0 1 0 0 1 Internal_1 (Vreg_3v3 sense) 0 0 1 0 1 0 Internal_2 0 0 1 0 1 1 Internal_3 0 0 1 1 0 0 Internal_4 0 0 1 1 0 1 Internal_5 0 0 1 1 1 0 Internal_6 0 0 1 1 1 1 Internal_7 0 1 0 0 0 0 AN0 0 1 0 0 0 1 AN1 0 1 0 0 1 0 AN2 0 1 0 0 1 1 AN3 0 1 0 1 0 0 AN4 0 1 x x x x ANx 1 x x x x x Reserved NOTE ANx in Table 9-23 is the maximum number of implemented analog input channels on the device. Please refer to the device overview of the reference manual for details regarding number of analog input channels. MC9S12ZVC Family Reference Manual , Rev. 1.9 314 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.17 ADC Command Register 2 (ADCCMD_2) A command which contains reserved bit settings causes the error flag CMD_EIF being set and ADC cease operation. Module Base + 0x0016 15 14 13 R 11 SMP[4:0] W Reset 12 0 0 0 0 0 10 9 0 0 0 0 8 Reserved 0 = Unimplemented or Reserved Figure 9-20. ADC Command Register 2 (ADCCMD_2) Read: Anytime Write: Only writable if bit SMOD_ACC is set (see also Section 9.4.2.2, "ADC Control Register 1 (ADCCTL_1) bit SMOD_ACC description for more details) Table 9-24. ADCCMD_2 Field Descriptions Field Description 15-11 SMP[4:0] Sample Time Select Bits -- These four bits select the length of the sample time in units of ADC conversion clock cycles. Note that the ADC conversion clock period is itself a function of the prescaler value (bits PRS[6:0]). Table 9-25 lists the available sample time lengths. NOTE If bit SMOD_ACC is set modifying this register must be done carefully only when no conversion and conversion sequence is ongoing. Table 9-25. Sample Time Select SMP[4] SMP[3] SMP[2] SMP[1] SMP[0] Sample Time in Number of ADC Clock Cycles 0 0 0 0 0 4 0 0 0 0 1 5 0 0 0 1 0 6 0 0 0 1 1 7 0 0 1 0 0 8 0 0 1 0 1 9 0 0 1 1 0 10 0 0 1 1 1 11 0 1 0 0 0 12 0 1 0 0 1 13 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 315 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Table 9-25. Sample Time Select SMP[4] SMP[3] SMP[2] SMP[1] SMP[0] Sample Time in Number of ADC Clock Cycles 0 1 0 1 0 14 0 1 0 1 1 15 0 1 1 0 0 16 0 1 1 0 1 17 0 1 1 1 0 18 0 1 1 1 1 19 1 0 0 0 0 20 1 0 0 0 1 21 1 0 0 1 0 22 1 0 0 1 1 23 1 0 1 0 0 24 1 0 1 0 1 Reserved 1 0 1 1 0 Reserved 1 0 1 1 1 Reserved 1 1 x x x Reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 316 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.18 ADC Command Register 3 (ADCCMD_3) Module Base + 0x0017 R W Reset 7 6 5 Reserved Reserved 0 0 4 3 2 1 0 0 0 0 Reserved 0 0 0 = Unimplemented or Reserved Figure 9-21. ADC Command Register 3 (ADCCMD_3) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 317 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.19 ADC Command Index Register (ADCCIDX) It is important to note that these bits do not represent absolute addresses instead it is a sample index (object size 32bit). Module Base + 0x001C R 7 6 0 0 5 4 3 2 1 0 0 0 CMD_IDX[5:0] W Reset 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-22. ADC Command Index Register (ADCCIDX) Read: Anytime Write: NA Table 9-26. ADCCIDX Field Descriptions Field Description 5-0 CMD_IDX [5:0] ADC Command Index Bits -- These bits represent the command index value for the conversion commands relative to the two CSL start addresses in the memory map. These bits do not represent absolute addresses instead it is a sample index (object size 32bit). See also Section 9.5.3.2.2, "Introduction of the two Command Sequence Lists (CSLs) for more details. MC9S12ZVC Family Reference Manual , Rev. 1.9 318 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.20 ADC Command Base Pointer Register (ADCCBP) Module Base + 0x001D 23 22 21 R 19 18 17 16 CMD_PTR[23:16] W Reset 20 0 0 0 0 0 0 0 0 14 13 12 11 10 9 8 0 0 Module Base + 0x001E 15 R CMD_PTR[15:8] W Reset 0 0 0 0 0 0 6 5 4 3 2 Module Base + 0x001F 7 R CMD_PTR[7:2] W Reset 0 0 0 0 0 0 1 0 0 0 0 0 = Unimplemented or Reserved Figure 9-23. ADC Command Base Pointer Registers (ADCCBP_0, ADCCBP_1, ADCCBP_2)) Read: Anytime Write: Bits CMD_PTR[23:2] writable if bit ADC_EN clear or bit SMOD_ACC set Table 9-27. ADCCBP Field Descriptions Field Description 23-2 CMD_PTR [23:2] ADC Command Base Pointer Address -- These bits define the base address of the two CSL areas inside the system RAM or NVM of the memory map. They are used to calculate the final address from which the conversion commands will be loaded depending on which list is active. For more details see Section 9.5.3.2.2, "Introduction of the two Command Sequence Lists (CSLs). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 319 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.21 ADC Result Index Register (ADCRIDX) It is important to note that these bits do not represent absolute addresses instead it is a sample index (object size 16bit). Module Base + 0x0020 R 7 6 0 0 5 4 3 2 1 0 0 0 RES_IDX[5:0] W Reset 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-24. ADC Result Index Register (ADCRIDX) Read: Anytime Write: NA Table 9-28. ADCRIDX Field Descriptions Field Description 5-0 ADC Result Index Bits -- These read only bits represent the index value for the conversion results relative to the two RVL RES_IDX[5:0] start addresses in the memory map. These bits do not represent absolute addresses instead it is a sample index (object size 16bit). See also Section 9.5.3.2.3, "Introduction of the two Result Value Lists (RVLs) for more details. MC9S12ZVC Family Reference Manual , Rev. 1.9 320 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.22 ADC Result Base Pointer Register (ADCRBP) Module Base + 0x0021 R 23 22 21 20 19 0 0 0 0 17 16 0 0 0 0 0 0 0 0 14 13 12 11 10 9 8 0 0 RES_PTR[19:16] W Reset 18 Module Base + 0x0022 15 R RES_PTR[15:8] W Reset 0 0 0 0 0 0 6 5 4 3 2 Module Base + 0x0023 7 R RES_PTR[7:2] W Reset 0 0 0 0 0 0 1 0 0 0 0 0 = Unimplemented or Reserved Figure 9-25. ADC Result Base Pointer Registers (ADCRBP_0, ADCRBP_1, ADCRBP_2)) Read: Anytime Write: Bits RES_PTR[19:2] writeable if bit ADC_EN clear or bit SMOD_ACC set Table 9-29. ADCRBP Field Descriptions Field Description 19-2 RES_PTR[19:2] ADC Result Base Pointer Address -- These bits define the base address of the list areas inside the system RAM of the memory map to which conversion results will be stored to at the end of a conversion. These bits can only be written if bit ADC_EN is clear. See also Section 9.5.3.2.3, "Introduction of the two Result Value Lists (RVLs). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 321 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.23 ADC Command and Result Offset Register 0 (ADCCROFF0) Module Base + 0x0024 7 R 6 5 4 0 3 2 1 0 0 0 0 CMDRES_OFF0[6:0] W Reset 0 0 0 0 0 = Unimplemented or Reserved Figure 9-26. ADC Command and Result Offset Register 0 (ADCCROFF0) Read: Anytime Write: NA Table 9-30. ADCCROFF0 Field Descriptions Field Description 6-0 CMDRES_OF F0 [6:0] ADC Command and Result Offset Value -- These read only bits represent the conversion command and result offset value relative to the conversion command base pointer address and result base pointer address in the memory map to refer to CSL_0 and RVL_0. It is used to calculate the address inside the system RAM to which the result at the end of the current conversion is stored to and the area (RAM or NVM) from which the conversion commands are loaded from. This is a zero offset (null offset) which can not be modified. These bits do not represent absolute addresses instead it is a sample offset (object size 16bit for RVL, object size 32bit for CSL). See also Section 9.5.3.2.2, "Introduction of the two Command Sequence Lists (CSLs) and Section 9.5.3.2.3, "Introduction of the two Result Value Lists (RVLs) for more details. MC9S12ZVC Family Reference Manual , Rev. 1.9 322 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.4.2.24 ADC Command and Result Offset Register 1 (ADCCROFF1) It is important to note that these bits do not represent absolute addresses instead it is an sample offset (object size 16bit for RVL, object size 32bit for CSL). Module Base + 0x0025 7 R 6 5 4 0 0 2 1 0 0 0 0 CMDRES_OFF1[6:0] W Reset 3 0 0 0 0 = Unimplemented or Reserved Figure 9-27. ADC Command and Result Offset Register 1 (ADCCROFF1) Read: Anytime Write: These bits are writable if bit ADC_EN clear or bit SMOD_ACC set Table 9-31. ADCCROFF1 Field Descriptions Field Description 6-0 CMDRES_OF F1 [6:0] ADC Result Address Offset Value -- These bits represent the conversion command and result offset value relative to the conversion command base pointer address and result base pointer address in the memory map to refer to CSL_1 and RVL_1. It is used to calculate the address inside the system RAM to which the result at the end of the current conversion is stored to and the area (RAM or NVM) from which the conversion commands are loaded from. These bits do not represent absolute addresses instead it is an sample offset (object size 16bit for RVL, object size 32bit for CSL).,These bits can only be modified if bit ADC_EN is clear. See also Section 9.5.3.2.2, "Introduction of the two Command Sequence Lists (CSLs) and Section 9.5.3.2.3, "Introduction of the two Result Value Lists (RVLs) for more details. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 323 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.5 Functional Description 9.5.1 Overview The ADC12B_LBA consists of an analog sub-block and a digital sub-block. It is a successive approximation analog-to-digital converter including a sample-and-hold mechanism and an internal charge scaled C-DAC (switched capacitor scaled digital-to-analog converter) with a comparator to realize the successive approximation algorithm. 9.5.2 Analog Sub-Block The analog sub-block contains all analog circuits (sample and hold, C-DAC, analog Comparator, and so on) required to perform a single conversion. Separate power supplies VDDA and VSSA allow noise from the MCU circuitry to be isolated from the analog sub-block for improved accuracy. 9.5.2.1 Analog Input Multiplexer The analog input multiplexers connect one of the external or internal analog input channels to the sample and hold storage node. 9.5.2.2 Sample and Hold Machine with Sample Buffer Amplifier The Sample and Hold Machine controls the storage and charge of the storage node (sample capacitor) to the voltage level of the analog signal at the selected ADC input channel. This architecture employs the advantage of reduced crosstalk between channels. The sample buffer amplifier is used to raise the effective input impedance of the A/D machine, so that external components (higher bandwidth or higher impedance connected as specified) are less significant to accuracy degradation. During the sample phase, the analog input connects first via a sample buffer amplifier with the storage node always for two ADC clock cycles ("Buffer" sample time). For the remaining sample time ("Final" sample time) the storage node is directly connected to the analog input source. Please see also Figure 9-28 for illustration and the Appendix of the device reference manual for more details. The input analog signals are unipolar and must be within the potential range of VSSA to VDDA. During the hold process, the analog input is disconnected from the storage node. 1 2 3 Total Sample Time (N = SMP[4:0]) "Buffer" Sample Time (2 cycles) 4 5 6 7 8 9 10 11 12 13 14 SAR Sequence (Resolution Dependent Length: SRES[2:0]) "Final" Sample Time (N - 2 cycles) Sample CAP hold phase ADC_CLK Figure 9-28. Sampling and Conversion Timing Example (8-bit Resolution, 4 Cycle Sampling) MC9S12ZVC Family Reference Manual , Rev. 1.9 324 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Please note that there is always a pump phase of two ADC_CLK cycles before the sample phase begins, hence glitches during the pump phase could impact the conversion accuracy for short sample times. 9.5.3 Digital Sub-Block The digital sub-block contains a list-based programmer's model and the control logic for the analog sub-block circuits. 9.5.3.1 Analog-to-Digital (A/D) Machine The A/D machine performs the analog-to-digital conversion. The resolution is program selectable to be either 8- or 10- or 12 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the sampled and stored analog voltage with a series of binary coded discrete voltages. By following a binary search algorithm, the A/D machine identifies the discrete voltage that is nearest to the sampled and stored voltage. Only analog input signals within the potential range of VRL_0/1 to VRH_0/1 (A/D reference potentials) will result in a non-railed digital output code. 9.5.3.2 Introduction of the Programmer's Model The ADC_LBA provides a programmer's model that uses a system memory list-based architecture for definition of the conversion command sequence and conversion result handling. The Command Sequence List (CSL) and Result Value List (RVL) are implemented in double buffered manner and the buffer mode is user selectable for each list (bits CSL_BMOD, RVL_BMOD). The 32-bit wide conversion command is double buffered and the currently active command is visible in the ADC register map at ADCCMD register space. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 325 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.5.3.2.1 Introduction of The Command Sequence List (CSL) Format A Command Sequence List (CSL) contains up to 64 conversion commands. A user selectable number of successive conversion commands in the CSL can be grouped as a command sequence. This sequence of conversion commands is successively executed by the ADC at the occurrence of a Trigger Event. The commands of a sequence are successively executed until an "End Of Sequence" or "End Of List" command type identifier in a command is detected (command type is coded via bits CMD_SEL[1:0]). The number of successive conversion commands that belong to a command sequence and the number of command sequences inside the CSL can be freely defined by the user and is limited by the 64 conversion commands a CSL can contain. A CSL must contain at least one conversion command and one "end of list" command type identifier. The minimum number of command sequences inside a CSL is zero and the maximum number of command sequences is 63. A command sequence is defined with bits CMD_SEL[1:0] in the register ADCCMD_M by defining the end of a conversion sequence. The Figure 9-29 and Figure 9-30 provides examples of a CSL. Waiting for trigger to proceed Waiting for trigger to proceed CSL_0/1 Command_1 normal conversion Command_2 normal conversion Command_3 normal conversion Command_4 normal conversion Command_5 normal conversion Command_6 normal conversion Command_7 End Of Sequence Command_8 normal conversion Command_9 Waiting for trigger to proceed Wait for RSTA or LDOK+RSTA } Command Coding Information normal conversion Command_10 End Of Sequence Command_11 normal conversion Command_12 normal conversion Command_13 End Of List } } done by bits CMD_SEL[1:0] Sequence_1 Sequence_2 Sequence_3 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 1 0 0 0 0 1 1 Figure 9-29. Example CSL with sequences and an "End Of List" command type identifier MC9S12ZVC Family Reference Manual , Rev. 1.9 326 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Initial trigger only CSL_0 Command coding information Command_1 normal conversion 0 0 Command_2 normal conversion 0 0 Command_3 normal conversion 0 0 Command_4 normal conversion 0 0 Command_5 normal conversion 0 0 Command_6 normal conversion 0 0 Command_7 normal conversion 0 0 Command_8 normal conversion 0 0 Command_9 normal conversion 0 0 Command_10 normal conversion 0 0 Command_11 normal conversion 0 0 Command_12 normal conversion 0 0 1 0 Command_13 done by bits End Of List, wrap to top, continue continuous conversion CMD_SEL[1:0] Figure 9-30. Example CSL for continues conversion MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 327 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.5.3.2.2 Introduction of the two Command Sequence Lists (CSLs) The two Command Sequence Lists (CSLs) can be referred to via the Command Base Pointer Register plus the Command and Result Offset Registers plus the Command Index Register (ADCCBP, ADCCROFF_0/1, ADCCIDX). The final address for conversion command loading is calculated by the sum of these registers (e.g.: ADCCBP+ADCCROFF_0+ADCCIDX or ADCCBP+ADCCROFF_1+ADCCIDX). Bit CSL_BMOD selects if the CSL is used in double buffer or single buffer mode. In double buffer mode, the CSL can be swapped by flow control bits LDOK and RSTA. For detailed information about when and how the CSL is swapped, please refer to Section 9.5.3.2.5, "The four ADC conversion flow control bits description of Restart Event + CSL Swap, Section 9.8.7.1, "Initial Start of a Command Sequence List and Section 9.8.7.3, "Restart CSL execution with new/other CSL (alternative CSL becomes active CSL) -- CSL swapping Which list is actively used for ADC command loading is indicated by bit CSL_SEL. The register to define the CSL start addresses (ADCCBP) can be set to any even location of the system RAM or NVM area. It is the user's responsibility to make sure that the different ADC lists do not overlap or exceed the system RAM or the NVM area, respectively. The error flag IA_EIF will be set for accesses to ranges outside system RAM area and cause an error interrupt if enabled. Scenario with: CSL_SEL = 1'b0 0x00_0000 RAM or NVM start address ADCCBP+(ADCCROFF_0) ADCCBP+(ADCCROFF_0+ ADCCIDX(max)) ADCCBP+(ADCCROFF_1) ADCCBP+(ADCCROFF_1+ ADCCIDX(max)) RAM or NVM end address Memory Map Register Space RAM or NVM Space CSL_0 (active) CSL_1 (alternative) Scenario with: CSL_SEL = 1'b1 Memory Map 0x00_0000 Register Space RAM / NVM start address RAM or NVM Space ADCCBP+(ADCCROFF_0) ADCCBP+(ADCCROFF_0+ ADCCIDX(max)) ADCCBP+(ADCCROFF_1) ADCCMDP+(ADCCROFF_1+ ADCCIDX(max)) CSL_0 (alternative) CSL_1 (active) RAM or NVM end address Note: Address register names in () are not absolute addresses instead they are a sample offset or sample index Figure 9-31. Command Sequence List Schema in Double Buffer Mode MC9S12ZVC Family Reference Manual , Rev. 1.9 328 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) CSL_SEL = 1'b0 (forced by CSL_BMOD) 0x00_0000 RAM or NVM start address ADCCBP+(ADCCROFF_0) ADCCBP+(ADCCROFF_0+ ADCCIDX(max)) Memory Map Register Space RAM or NVM Space CSL_0 (active) RAM or NVM end address Note: Address register names in () are not absolute addresses instead they are a sample offset or sample index Figure 9-32. Command Sequence List Schema in Single Buffer Mode While the ADC is enabled, one CSL is active (indicated by bit CSL_SEL) and the corresponding list should not be modified anymore. At the same time the alternative CSL can be modified to prepare the ADC for new conversion sequences in CSL double buffered mode. When the ADC is enabled, the command address registers (ADCCBP, ADCCROFF_0/2, ADCCIDX) are read only and register ADCCIDX is under control of the ADC. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 329 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.5.3.2.3 Introduction of the two Result Value Lists (RVLs) The same list-based architecture as described above for the CSL has been implemented for the Result Value List (RVL) with corresponding address registers (ADCRBP, ADCCROFF_0/1, ADCRIDX). The final address for conversion result storage is calculated by the sum of these registers (e.g.: ADCRBP+ADCCROFF_0+ADCRIDX or ADCRBP+ADCCROFF_1+ADCRIDX). The RVL_BMOD bit selects if the RVL is used in double buffer or single buffer mode. In double buffer mode the RVL is swapped: * Each time an "End Of List" command type got executed followed by the first conversion from top of the next CSL and related (first) result is about to be stored * A CSL got aborted (bit SEQA=1'b1) and ADC enters idle state (becomes ready for new flow control events) Using the RVL in double buffer mode the RVL is not swapped after exit from Stop Mode or Wait Mode with bit SWAI set. Hence the RVL used before entry of Stop or Wait Mode with bit SWAI set is overwritten after exit from the MCU Operating Mode (see also Section 9.2.1.2, "MCU Operating Modes). Which list is actively used for the ADC conversion result storage is indicated by bit RVL_SEL. The register to define the RVL start addresses (ADCRBP) can be set to any even location of the system RAM area. It is the user's responsibility to make sure that the different ADC lists do not overlap or exceed the system RAM area. The error flag IA_EIF will be set for accesses to ranges outside system RAM area and cause an error interrupt if enabled. Scenario with: RVL_SEL = 1'b0 0x00_0000 Memory Map Register Space RAM start address RAM Space ADCRBP+(ADCCROFF_0) ADCRBP+(ADCCROFF_0+ ADCRIDX(max)) ADCRBP+(ADCCROFF_1) ADCRBP+(ADCCROFF_1+ ADCRIDX(max)) RAM end address RVL_0 (active) RVL_1 (alternative) Scenario with: RVL_SEL = 1'b1 0x00_0000 Memory Map Register Space RAM start address RAM Space ADCRBP+(ADCCROFF_0) ADCRBP+(ADCCROFF_0+ ADCRIDX(max)) ADCRBP+(ADCCROFF_1) ADCRBP+(ADCCROFF_1+ ADCRIDX(max)) RVL_0 (alternative) RVL_1 (active) RAM end address Note: Address register names in () are not absolute addresses instead they are a sample offset or sample index Figure 9-33. Result Value List Schema in Double Buffer Mode MC9S12ZVC Family Reference Manual , Rev. 1.9 330 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) RVL_SEL = 1'b0 (forced by bit RVL_BMOD) 0x00_0000 Memory Map Register Space RAM start address RAM Space ADCRBP+(ADCCROFF_0) ADCRBP+(ADCCROFF_0+ ADCRIDX(max)) RVL_0 (active) RAM end address Note: Address register names in () are not absolute addresses instead they are a sample offset or sample index Figure 9-34. Result Value List Schema in Single Buffer Mode While ADC is enabled, one Result Value List is active (indicated by bit RVL_SEL). The conversion Result Value List can be read anytime. When the ADC is enabled the conversion result address registers (ADCRBP, ADCCROFF_0/1, ADCRIDX) are read only and register ADCRIDX is under control of the ADC. A conversion result is always stored as 16bit entity in unsigned data representation. Left and right justification inside the entity is selected via the DJM control bit. Unused bits inside an entity are stored zero. Table 9-32. Conversion Result Justification Overview Conversion Resolution Left Justified Result Right Justified Result (SRES[1:0]) (DJM = 1'b0) (DJM = 1'b1) 8 bit {Result[7:0],8'b00000000} {8'b00000000,Result[7:0]} 10 bit {Result[9:0],6'b000000} {6'b000000,Result[9:0]} 12 bit {Result[11:0],4'b0000} {4'b0000,Result[11:0]} MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 331 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.5.3.2.4 The two conversion flow control Mode Configurations The ADC provides two modes ("Trigger Mode" and "Restart Mode") which are different in the conversion control flow. The "Restart Mode" provides precise timing control about the sample start point but is more complex from the flow control perspective, while the "Trigger Mode" is more simple from flow control point of view but is less controllable regarding conversion sample start. Following are the key differences: In "Trigger Mode" configuration, when conversion flow control bit RSTA gets set the bit TRIG gets set automatically. Hence in "Trigger Mode" the applications should not set the bit TRIG and bit RSTA simultaneously (via data bus or internal interface), because it is a flow control failure and the ADC will cease operation. In "Trigger Mode" configuration, after the execution of the initial Restart Event the current CSL can be executed and controlled via Trigger Events only. Hence, if the "End Of List" command is reached a restart of conversion flow from top of current CSL does not require to set bit RSTA because returning to the top of current CSL is done automatically. Therefore the current CSL can be executed again after the "End Of List" command type is executed by a Trigger Event only. In "Restart Mode" configuration, the execution of a CSL is controlled via Trigger Events and Restart Events. After execution of the "End Of List" command the conversion flow must be continued by a Restart Event followed by a Trigger Event and the Trigger Event must not occur before the Restart Event has finished. For more details and examples regarding flow control and application use cases please see following section and Section 9.8.7, "Conversion flow control application information. 9.5.3.2.5 The four ADC conversion flow control bits There are four bits to control conversion flow (execution of a CSL and CSL exchange in double buffer mode). Each bit is controllable via the data bus and internal interface depending on the setting of ACC_CFG[1:0] bits (see also Figure 9-2). In the following the conversion control event to control the conversion flow is given with the related internal interface signal and corresponding register bit name together with information regarding: -- Function of the conversion control event -- How to request the event -- When is the event finished -- Mandatory requirements to executed the event A summary of all event combinations is provided by Table 9-10. * Trigger Event Internal Interface Signal: Trigger Corresponding Bit Name: TRIG MC9S12ZVC Family Reference Manual , Rev. 1.9 332 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) - Function: Start the first conversion of a conversion sequence which is defined in the active Command Sequence List - Requested by: - Positive edge of internal interface signal Trigger - Write Access via data bus to set control bit TRIG - When finished: This bit is cleared by the ADC when the first conversion of the sequence is beginning to sample - Mandatory Requirements: - In all ADC conversion flow control modes bit TRIG is only set (Trigger Event executed) if the Trigger Event occurs while no conversion or conversion sequence is ongoing (ADC idle) - In ADC conversion flow control mode "Restart Mode" with a Restart Event in progress it is not allowed that a Trigger Event occurs before the background command load phase has finished (Restart Event has been executed) else the error flag TRIG_EIF is set - In ADC conversion flow control mode "Trigger Mode" a Restart Event causes bit TRIG being set automatically. Bit TRIG is set when no conversion or conversion sequence is ongoing (ADC idle) and the RVL done condition is reached by one of the following: * A "End Of List" command type has been executed * A Sequence Abort Event is in progress or has been executed The ADC executes the Restart Event followed by the Trigger Event. - In ADC conversion flow control mode "Trigger Mode" a Restart Event and a simultaneous Trigger Event via internal interface or data bus causes the TRIG_EIF bit being set and ADC cease operation. * Restart Event (with current active CSL) Internal Interface Signal: Restart Corresponding Bit Name: RSTA - Function: - Go to top of active CSL (clear index register for CSL) - Load one background command register and wait for Trigger (CSL offset register is not switched independent of bit CSL_BMOD) - Set error flag RSTA_EIF when a Restart Request occurs before one of the following conditions was reached: * The "End Of List" command type has been executed * Depending on bit STR_SEQA if the "End Of List" command type is about to be executed * The current CSL has been aborted or is about to be aborted due to a Sequence Abort Request. - Requested by: - Positive edge of internal interface signal Restart - Write Access via data bus to set control bit RSTA MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 333 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) - When finished: This bit is cleared when the first conversion command of the sequence from top of active Sequence Command List is loaded - Mandatory Requirement: - In all ADC conversion flow control modes a Restart Event causes bit RSTA to be set. Bit SEQA is set simultaneously by ADC hardware if: * ADC not idle (a conversion or conversion sequence is ongoing and current CSL not finished) and no Sequence Abort Event in progress (bit SEQA not already set or set simultaneously via internal interface or data bus) * ADC idle but RVL done condition not reached The RVL done condition is reached by one of the following: * A "End Of List" command type has been executed * A Sequence Abort Event is in progress or has been executed (bit SEQA already set or set simultaneously via internal interface or data bus) The ADC executes the Sequence Abort Event followed by the Restart Event for the conditions described before or only a Restart Event. - In ADC conversion flow control mode "Trigger Mode" a Restart Event causes bit TRIG being set automatically. Bit TRIG is set when no conversion or conversion sequence is ongoing (ADC idle) and the RVL done condition is reached by one of the following: * A "End Of List" command type has been executed * A Sequence Abort Event is in progress or has been executed The ADC executes the Restart Event followed by the Trigger Event. - In ADC conversion flow control mode "Trigger Mode" a Restart Event and a simultaneous Trigger Event via internal interface or data bus causes the TRIG_EIF bit being set and ADC cease operation. * Restart Event + CSL Exchange (Swap) Internal Interface Signals: Restart + LoadOK Corresponding Bit Names: RSTA + LDOK - Function: Go to top of active CSL (clear index register for CSL) and switch to other offset register for address calculation if configured for double buffer mode (exchange the CSL list) Requested by: - Internal interface with the assertion of Interface Signal Restart the interface Signal LoadOK is evaluated and bit LDOK is set accordingly (bit LDOK set if Interface Signal LoadOK asserted when Interface Signal Restart asserts). - Write Access via data bus to set control bit RSTA simultaneously with bit LDOK. - When finished: Bit LDOK can only be cleared if it was set as described before and both bits (LDOK, RSTA) are cleared when the first conversion command from top of active Sequence Command List is loaded - Mandatory Requirement: No ongoing conversion or conversion sequence Details if using the internal interface: MC9S12ZVC Family Reference Manual , Rev. 1.9 334 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) If signal Restart is asserted before signal LoadOK is set the conversion starts from top of currently active CSL at the next Trigger Event (no exchange of CSL list). If signal Restart is asserted after or simultaneously with signal LoadOK the conversion starts from top of the other CSL at the next Trigger Event (CSL is switched) if CSL is configured for double buffer mode. * Sequence Abort Event Internal Interface Signal: Seq_Abort Corresponding Bit Name: SEQA - Function: Abort any possible ongoing conversion at next conversion boundary and abort current conversion sequence and active CSL - Requested by: - Positive edge of internal interface signal Seq_Abort - Write Access via data bus to set control bit SEQA - When finished: This bit gets cleared when an ongoing conversion is finished and the result is stored and/or an ongoing conversion sequence is aborted and current active CSL is aborted (ADC idle, RVL done) - Mandatory Requirement: - In all ADC conversion flow control modes bit SEQA can only be set if: * ADC not idle (a conversion or conversion sequence is ongoing) * ADC idle but RVL done condition not reached The RVL done condition is not reached if: * An "End Of List" command type has not been executed * A Sequence Abort Event has not been executed (bit SEQA not already set) - In all ADC conversion flow control modes a Sequence Abort Event can be issued at any time - In ADC conversion flow control mode "Restart Mode" after a conversion sequence abort request has been executed it is mandatory to set bit RSTA. If a Trigger Event occurs before a Restart Event is executed (bit RSTA set and cleared by hardware), bit TRIG is set, error flag TRIG_EIF is set, and the ADC can only be continued by a Soft-Reset. After the Restart Event the ADC accepts new Trigger Events (bit TRIG set) and begins conversion from top of the currently active CSL. - In ADC conversion flow control mode "Restart Mode" after a Sequence Abort Event has been executed, a Restart Event causes only the RSTA bit being set. The ADC executes a Restart Event only. - In both conversion flow control modes ("Restart Mode" and "Trigger Mode") when conversion flow control bit RSTA gets set automatically bit SEQA gets set when the ADC has not reached one of the following scenarios: * An "End Of List" command type has been executed or is about to be executed * A Sequence Abort request is about to be executed or has been executed. In case bit SEQA is set automatically the Restart error flag RSTA_EIF is set to indicate an unexpected Restart Request. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 335 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.5.3.2.6 Conversion flow control in case of conversion sequence control bit overrun scenarios Restart Request Overrun: If a legal Restart Request is detected and no Restart Event is in progress, the RSTA bit is set due to the request. The set RSTA bit indicates that a Restart Request was detected and the Restart Event is in process. In case further Restart Requests occur while the RSTA bit is set, this is defined a overrun situation. This scenario is likely to occur when bit STR_SEQA is set or when a Restart Event causes a Sequence Abort Event. The request overrun is captured in a background register that always stores the last detected overrun request. Hence if the overrun situation occurs more than once while a Restart Event is in progress, only the latest overrun request is pending. When the RSTA bit is cleared, the latest overrun request is processed and RSTA is set again one cycle later. LoadOK Overrun: Simultaneously at any Restart Request overrun situation the LoadOK input is evaluated and the status is captured in a background register which is alternated anytime a Restart Request Overrun occurs while Load OK Request is asserted. The Load OK background register is cleared as soon as the pending Restart Request gets processed. Trigger Overrun: If a Trigger occurs whilst bit TRIG is already set, this is defined as a Trigger overrun situation and causes the ADC to cease conversion at the next conversion boundary and to set bit TRIG_EIF. A overrun is also detected if the Trigger Event occurs automatically generated by hardware in "Trigger Mode" due to a Restart Event and simultaneously a Trigger Event is generated via data bus or internal interface. In this case the ADC ceases operation before conversion begins to sample. In "Trigger Mode" a Restart Request Overrun does not cause a Trigger Overrun (bit TRIG_EIF not set). Sequence Abort Request Overrun: If a Sequence Abort Request occurs whilst bit SEQA is already set, this is defined as a Sequence Abort Request Overrun situation and the overrun request is ignored. MC9S12ZVC Family Reference Manual , Rev. 1.9 336 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.5.3.3 ADC List Usage and Conversion/Conversion Sequence Flow Description It is the user's responsibility to make sure that the different lists do not overlap or exceed the system RAM area respectively the CSL does not exceed the NVM area if located in the NVM. The error flag IA_EIF will be set for accesses done outside the system RAM area and will cause an error interrupt if enabled for lists that are located in the system RAM. Generic flow for ADC register load at conversion sequence start/restart: * It is mandatory that the ADC is idle (no ongoing conversion or conversion sequence). * It is mandatory to have at least one CSL with valid entries. See also Section 9.8.7.2, "Restart CSL execution with currently active CSL or Section 9.8.7.3, "Restart CSL execution with new/other CSL (alternative CSL becomes active CSL) -- CSL swapping for more details on possible scenarios. * A Restart Event occurs, which causes the index registers to be cleared (register ADCCIDX and ADCRIDX are cleared) and to point to the top of the corresponding lists (top of active RVL and CSL). * Load conversion command to background conversion command register 1. * The control bit(s) RSTA (and LDOK if set) are cleared. * Wait for Trigger Event to start conversion. Generic flow for ADC register load during conversion: * The index registers ADCCIDX is incremented. * The inactive background command register is loaded with a new conversion command. Generic flow for ADC result storage at end of conversion: * Index register ADCRIDX is incremented and the conversion result is stored in system RAM. As soon as the result is successfully stored, any conversion interrupt flags are set accordingly. * At the conversion boundary the other background command register becomes active and visible in the ADC register map. * If the last executed conversion command was of type "End Of Sequence", the ADC waits for the Trigger Event. * If the last executed conversion command was of type "End Of List" and the ADC is configured in "Restart Mode", the ADC sets all related flags and stays idle awaiting a Restart Event to continue. * If the last executed conversion command was of type "End Of List" and the ADC is configured in "Trigger Mode", the ADC sets all related flags and automatically returns to top of current CSL and is awaiting a Trigger Event to continue. * If the last executed conversion command was of type "Normal Conversion" the ADC continues command execution in the order of the current CSL (continues conversion). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 337 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.6 Resets At reset the ADC12B_LBA is disabled and in a power down state. The reset state of each individual bit is listed within Section 9.4.2, "Register Descriptions" which details the registers and their bit-fields. 9.7 Interrupts The ADC supports three types of interrupts: * Conversion Interrupt * Sequence Abort Interrupt * Error and Conversion Flow Control Issue Interrupt Each of the interrupt types is associated with individual interrupt enable bits and interrupt flags. 9.7.1 ADC Conversion Interrupt The ADC provides one conversion interrupt associated to 16 interrupt enable bits with dedicated interrupt flags. The 16 interrupt flags consist of: * 15 conversion interrupt flags which can be associated to any conversion completion. * One additional interrupt flag which is fixed to the "End Of List" conversion command type within the active CSL. The association of the conversion number with the interrupt flag number is done in the conversion command. 9.7.2 ADC Sequence Abort Done Interrupt The ADC provides one sequence abort done interrupt associated with the sequence abort request for conversion flow control. Hence, there is only one dedicated interrupt flag and interrupt enable bit for conversion sequence abort and it occurs when the sequence abort is done. MC9S12ZVC Family Reference Manual , Rev. 1.9 338 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.7.3 ADC Error and Conversion Flow Control Issue Interrupt The ADC provides one error interrupt for four error classes related to conversion interrupt overflow, command validness, DMA access status and Conversion Flow Control issues, and CSL failure. The following error interrupt flags belong to the group of severe issues which cause an error interrupt if enabled and cease ADC operation: * * * * IA_EIF CMD_EIF EOL_EIF TRIG_EIF In order to make the ADC operational again, an ADC Soft-Reset must be issued which clears the above listed error interrupt flags. NOTE It is important to note that if flag DBECC_ERR is set, the ADC ceases operation as well, but does not cause an ADC error interrupt. Instead, a machine exception is issued. In order to make the ADC operational again an ADC Soft-Reset must be issued. Remaining error interrupt flags cause an error interrupt if enabled, but ADC continues operation. The related interrupt flags are: * RSTAR_EIF * LDOK_EIF * CONIF_OIF MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 339 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.8 9.8.1 Use Cases and Application Information List Usage -- CSL single buffer mode and RVL single buffer mode In this use case both list types are configured for single buffer mode (CSL_BMOD=1'b0 and RVL_BMOD=1'b0, CSL_SEL and RVL_SEL are forced to 1'b0). The index register for the CSL and RVL are cleared to start from the top of the list with next conversion command and result storage in the following cases: * The conversion flow reaches the command containing the "End-of-List" command type identifier * A Restart Request occurs at a sequence boundary * After an aborted conversion or conversion sequence CSL_0 RVL_0 CSL_1 (unused) RVL_1 (unused) Figure 9-35. CSL Single Buffer Mode -- RVL Single Buffer Mode Diagram 9.8.2 List Usage -- CSL single buffer mode and RVL double buffer mode In this use case the CSL is configured for single buffer mode (CSL_BMOD=1'b0) and the RVL is configured for double buffer mode (RVL_BMOD=1'b1). In this buffer configuration only the result list RVL is switched when the first conversion result of a CSL is stored after a CSL was successfully finished or a CSL got aborted. CSL_0 RVL_0 CSL_1 (unused) RVL_1 Figure 9-36. CSL Single Buffer Mode -- RVL Single Buffer Mode Diagram The last entirely filled RVL (an RVL where the corresponding CSL has been executed including the "End Of List " command type) is shown by register ADCEOLRI. The CSL is used in single buffer mode and bit CSL_SEL is forced to 1'b0. MC9S12ZVC Family Reference Manual , Rev. 1.9 340 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.8.3 List Usage -- CSL double buffer mode and RVL double buffer mode In this use case both list types are configured for double buffer mode (CSL_BMOD=1'b1 and RVL_BMOD=1'b1) and whenever a Command Sequence List (CSL) is finished or aborted the command Sequence List is swapped by the simultaneous assertion of bits LDOK and RSTA. CSL_0 RVL_0 CSL_1 RVL_1 Figure 9-37. CSL Double Buffer Mode -- RVL Double Buffer Mode Diagram This use case can be used if the channel order or CSL length varies very frequently in an application. 9.8.4 List Usage -- CSL double buffer mode and RVL single buffer mode In this use case the CSL is configured for double buffer mode (CSL_BMOD=1'b1) and the RVL is configured for single buffer mode (RVL_BMOD=1'b0). The two command lists can be different sizes and the allocated result list memory area in the RAM must be able to hold as many entries as the larger of the two command lists. Each time when the end of a Command Sequence List is reached, if bits LDOK and RSTA are set, the commands list is swapped. CSL_0 RVL_0 CSL_1 RVL_1 (unused) Figure 9-38. CSL Double Buffer Mode -- RVL Single Buffer Mode Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 341 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.8.5 List Usage -- CSL double buffer mode and RVL double buffer mode In this use case both list types are configured for double buffer mode (CSL_BMOD=1'b1) and RVL_BMOD=1'b1). This setup is the same as Section 9.8.3, "List Usage -- CSL double buffer mode and RVL double buffer mode but at the end of a CSL the CSL is not always swapped (bit LDOK not always set with bit RSTA). The Result Value List is swapped whenever a CSL is finished or a CSL got aborted. CSL_0 RVL_0 CSL_1 RVL_1 Figure 9-39. CSL Double Buffer Mode -- RVL Double Buffer Mode Diagram 9.8.6 RVL swapping in RVL double buffer mode and related registers ADCIMDRI and ADCEOLRI When using the RVL in double buffer mode, the registers ADCIMDRI and ADCEOLRI can be used by the application software to identify which RVL holds relevant and latest data and which CSL is related to this data. These registers are updated at the setting of one of the CON_IF[15:1] or the EOL_IF interrupt flags. As described in the register description Section 9.4.2.13, "ADC Intermediate Result Information Register (ADCIMDRI) and Section 9.4.2.14, "ADC End Of List Result Information Register (ADCEOLRI), the register ADCIMDRI, for instance, is always updated at the occurrence of a CON_IF[15:1] interrupt flag amongst other cases. Also each time the last conversion command of a CSL is finished and the corresponding result is stored, the related EOL_IF flag is set and register ADCEOLRI is updated. Hence application software can pick up conversion results, or groups of results, or an entire result list driven fully by interrupts. A use case example diagram is shown in Figure 9-40. MC9S12ZVC Family Reference Manual , Rev. 1.9 342 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Stop Mode request while conversion ongoing and before EOL Initial Restart Event CSL Buffer CSL_0 CSL_1 INT_1 EOL CSL_0 INT_2 EOL CSL_0 Stop Mode entry tdelay return to execute from top of CSL RVL swap due to EOL followed by first result of next CSL to store RVL_0 RVL Buffer Wake-up Event with AUT_RSTA= 1'b1 RVL values before Stop Mode entry are overwritten bits are valid RVL_EOL 1'b0 1'b1 CSL_EOL 1'b0 1'b1 EOL_IF 1'b1 set by hardware bits not valid until first INT no RVL swap RVL_0 RVL_1 bits not valid until first EOL INT_1 1'b1 cleared by software before next EOL should be cleared by software before Stop Mode entry bits are valid RVL_IMD 1'b0 1'b1 1'b0 CSL_IMD 1'b0 1'b1 1'b0 RIDX_IMD[5:0] CON_IF[15:1] 0x00 0x05 0x0000 0x0001 0x0A 0x0000 0x08 0x0B 0x0010 0x05 0x0001 Flag should be cleared by software before it is set again t Comments: EOL: INT_x: tdelay: "End Of List" command type processed One of the CON_IF interrupt flags occurs Delay can vary depending on the DMA performance, and ADC configuration (conversion flow using the Trigger to proceed through the CSL) Figure 9-40. RVL Swapping -- Use Case Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 343 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.8.7 Conversion flow control application information The ADC12B_LBA provides various conversion control scenarios to the user accomplished by the following features. The ADC conversion flow control can be realized via the data bus only, the internal interface only, or by both access methods. The method used is software configurable via bits ACC_CFG[1:0]. The conversion flow is controlled via the four conversion flow control bits: SEQA, TRIG, RSTA, and LDOK. Two different conversion flow control modes can be configured: Trigger Mode or Restart Mode Single or double buffer configuration of CSL and RVL. 9.8.7.1 Initial Start of a Command Sequence List At the initial start of a Command Sequence List after device reset all entries for at least one of the two CSL must have been completed and data must be valid. Depending on if the CSL_0 or the CSL_1 should be executed at the initial start of a Command Sequence List the following conversion control sequence must be applied: If CSL_0 should be executed at the initial conversion start after device reset: A Restart Event and a Trigger Event must occur (depending to the selected conversion flow control mode the events must occur one after the other or simultaneously) which causes the ADC to start conversion with commands loaded from CSL_0. If CSL_1 should be executed at the initial conversion start after device reset: Bit LDOK must be set simultaneously with the Restart Event followed by a Trigger Event (depending on the selected conversion flow control mode the Trigger events must occur simultaneously or after the Restart Event is finished). As soon as the Trigger Event gets executed the ADC starts conversion with commands loaded from CSL_1. As soon as a new valid Restart Event occurs the flow for ADC register load at conversion sequence start as described in Section 9.5.3.3, "ADC List Usage and Conversion/Conversion Sequence Flow Description applies. 9.8.7.2 Restart CSL execution with currently active CSL To restart a Command Sequence List execution it is mandatory that the ADC is idle (no conversion or conversion sequence is ongoing). If necessary, a possible ongoing conversion sequence can be aborted by the Sequence Abort Event (setting bit SEQA). As soon as bit SEQA is cleared by the ADC, the current conversion sequence has been aborted and the ADC is idle (no conversion sequence or conversion ongoing). After a conversion sequence abort is executed it is mandatory to request a Restart Event (bit RSTA set). After the Restart Event is finished (bit RSTA is cleared), the ADC accepts a new Trigger Event (bit TRIG can be set) and begins conversion from the top of the currently active CSL. In conversion flow control MC9S12ZVC Family Reference Manual , Rev. 1.9 344 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) mode "Trigger Mode" only a Restart Event is necessary if ADC is idle to restart Conversion Sequence List execution (the Trigger Event occurs automatically). It is possible to set bit RSTA and SEQA simultaneously, causing a Sequence Abort Event followed by a Restart Event. In this case the error flags behave differently depending on the selected conversion flow control mode: * Setting both flow control bits simultaneously in conversion flow control mode "Restart Mode" prevents the error flags RSTA_EIF and LDOK_EIF from occurring. * Setting both flow control bits simultaneously in conversion flow control mode "Trigger Mode" prevents the error flag RSTA_EIF from occurring. If only a Restart Event occurs while ADC is not idle and bit SEQA is not set already (Sequence Abort Event in progress) a Sequence Abort Event is issued automatically and bit RSTAR_EIF is set. Please see also the detailed conversion flow control bit mandatory requirements and execution information for bit RSTA and SEQA described in Section 9.5.3.2.5, "The four ADC conversion flow control bits. 9.8.7.3 Restart CSL execution with new/other CSL (alternative CSL becomes active CSL) -- CSL swapping After all alternative conversion command list entries are finished the bit LDOK can be set simultaneously with the next Restart Event to swap command buffers. To start conversion command list execution it is mandatory that the ADC is idle (no conversion or conversion sequence is ongoing). If necessary, a possible ongoing conversion sequence can be aborted by the Sequence Abort Event (setting bit SEQA). As soon as bit SEQA is cleared by the ADC, the current conversion sequence has been aborted and the ADC is idle (no conversion sequence or conversion ongoing). After a conversion sequence abort is executed it is mandatory to request a Restart Event (bit RSTA set) and simultaneously set bit LDOK to swap the CSL buffer. After the Restart Event is finished (bit RSTA and LDOK are cleared), the ADC accepts a new Trigger Event (bit TRIG can be set) and begins conversion from the top of the newly selected CSL buffer. In conversion flow control mode "Trigger Mode" only a Restart Event (simultaneously with bit LDOK being set) is necessary to restart conversion command list execution with the newly selected CSL buffer (the Trigger Event occurs automatically). It is possible to set bits RSTA, LDOK and SEQA simultaneously, causing a Sequence Abort Event followed by a Restart Event. In this case the error flags behave differently depending on the selected conversion flow control mode: * Setting these three flow control bits simultaneously in "Restart Mode" prevents the error flags RSTA_EIF and LDOK_EIF from occurring. * Setting these three flow control bits simultaneously in "Trigger Mode" prevents the error flag RSTA_EIF from occurring. If only a Restart Event occurs while ADC is not idle and bit SEQA is not set already (Sequence Abort Event in progress) a Sequence Abort Event is issued automatically and bit RSTAR_EIF is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 345 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) Please see also the detailed conversion flow control bit mandatory requirements and execution information for bit RSTA and SEQA described in Section 9.5.3.2.5, "The four ADC conversion flow control bits. 9.8.8 Continuous Conversion Applications that only need to continuously convert a list of channels, without the need for timing control or the ability to perform different sequences of conversions (grouped number of different channels to convert) can make use of the following simple setup: * "Trigger Mode" configuration * Single buffer CSL * Depending on data transfer rate either use single or double buffer RVL configuration * Define a list of conversion commands which only contains the "End Of List" command with automatic wrap to top of CSL After finishing the configuration and enabling the ADC an initial Restart Event is sufficient to launch the continuous conversion until next device reset or low power mode. In case a Low Power Mode is used: If bit AUT_RSTA is set before Low Power Mode is entered the conversion continues automatically as soon as a low power mode (Stop Mode or Wait Mode with bit SWAI set) is exited. Initial Restart Event Wake-up Stop Mode request, Automatic Sequence Abort Event with AUT_RSTA Event AN3 AN1 AN4 IN5 AN3 AN1 AN4 IN5 AN3 AN1 EOL EOL AN3 AN1 AN4 Stop Mode entry Abort CSL_0 Active Idle Idle Active t Figure 9-41. Conversion Flow Control Diagram -- Continuous Conversion (with Stop Mode) MC9S12ZVC Family Reference Manual , Rev. 1.9 346 NXP Semiconductors Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.8.9 Triggered Conversion -- Single CSL Applications that require the conversion of one or more groups of different channels in a periodic and timed manner can make use of a configuration in "Trigger Mode" with a single CSL containing a list of sequences. This means the CSL consists of several sequences each separated by an "End of Sequence" command. The last command of the CSL uses the "End Of List" command with wrap to top of CSL and waiting for a Trigger (CMD_SEL[1:0] =2'b11). Hence after the initial Restart Event each sequence can be launched via a Trigger Event and repetition of the CSL can be launched via a Trigger after execution of the "End Of List" command. Initial Restart Event Trigger AN3 AN1 AN4 IN5 Trigger AN2 AN0 AN4 IN3 AN6 AN1 IN1 Sequence_1 Sequence_2 Sequence_0 EOS Repetition of CSL_0 Trigger EOS AN3 AN1 AN4 Sequence_0 EOL Active CSL_0 t Figure 9-42. Conversion Flow Control Diagram -- Triggered Conversion (CSL Repetition) initial Restart Event Trigger Stop Mode request, Automatic Sequence Abort Event Trigger AN3 AN1 AN4 IN5 AN21AN0 AN4 IN3 Sequence_1 Sequence_0 EOS Wake-up Event with AUT_RSTA Trigger AN3 AN1 AN4 AN5 AN2 AN0 AN6 AN1 Sequence_2 EOS Begin from top of current CSL Sequence_1 Sequence_0 Stop Mode entry EOS Abort Active CSL_0 Idle Idle Active t Figure 9-43. Conversion Flow Control Diagram -- Triggered Conversion (with Stop Mode) In case a Low Power Mode is used: If bit AUT_RSTA is set before Low Power Mode is entered, the conversion continues automatically as soon as a low power mode (Stop Mode or Wait Mode with bit SWAI set) is exited. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 347 Chapter 9 Analog-to-Digital Converter (ADC12B_LBA_V1) 9.8.10 Fully Timing Controlled Conversion As described previously, in "Trigger Mode" a Restart Event automatically causes a trigger. To have full and precise timing control of the beginning of any conversion/sequence the "Restart Mode" is available. In "Restart Mode" a Restart Event does not cause a Trigger automatically; instead, the Trigger must be issued separately and with correct timing, which means the Trigger is not allowed before the Restart Event (conversion command loading) is finished (bit RSTA=1'b0 again). The time required from Trigger until sampling phase starts is given (refer to Section 9.4.2.6, "ADC Conversion Flow Control Register (ADCFLWCTL), Timing considerations) and hence timing is fully controllable by the application. Additionally, if a Trigger occurs before a Restart Event is finished, this causes the TRIG_EIF flag being set. This allows detection of false flow control sequences. any Restart Event Trigger Trigger Stop Mode request, Automatic Sequence Abort Event Trigger AN3 AN1 AN4 IN5 AN21AN0 AN4 IN3 Sequence_1 Sequence_0 conversion command load phase CSL_0 EOS Wake-up Event with AUT_RSTA AN6 AN1 Sequence_2 EOS Begin from top of current CSL Trigger AN3 AN1 AN4 AN5 AN2 AN0 Sequence_1 Sequence_0 Stop Mode entry EOS Abort Active Idle Idle Active t Figure 9-44. Conversion Flow Control Diagram -- Fully Timing Controlled Conversion (with Stop Mode) Unlike the Stop Mode entry shown in Figure 9-43 and Figure 9-44 it is recommended to issue the Stop Mode at sequence boundaries (when ADC is idle and no conversion/conversion sequence is ongoing). Any of the Conversion flow control application use cases described above (Continuous, Triggered, or Fully Timing Controlled Conversion) can be used with CSL single buffer mode or with CSL double buffer mode. If using CSL double buffer mode, CSL swapping is performed by issuing a Restart Event with bit LDOK set. MC9S12ZVC Family Reference Manual , Rev. 1.9 348 NXP Semiconductors Chapter 10 Supply Voltage Sensor - (BATSV3) Table 10-1. Revision History Table Rev. No. (Item No.) Data Sections Affected Substantial Change(s) V01.00 15 Dec 2010 all Initial Version V02.00 16 Mar 2011 10.3.2.1 10.4.2.1 - added BVLS[1] to support four voltage level - moved BVHS to register bit 6 V03.00 26 Apr 2011 all - removed Vsense V03.10 04 Oct 2011 10.4.2.1 and 10.4.2.2 - removed BSESE 10.1 Introduction The BATS module provides the functionality to measure the voltage of the chip supply pin VSUP. 10.1.1 Features The VSUP pin can be routed via an internal divider to the internal Analog to Digital Converter. Independent of the routing to the Analog to Digital Converter, it is possible to route this voltage to a comparator to generate a low or a high voltage interrupt to alert the MCU. 10.1.2 Modes of Operation The BATS module behaves as follows in the system power modes: 1. Run mode The activation of the VSUP Level Sense Enable (BSUSE=1) or ADC connection Enable (BSUAE=1) closes the path from VSUP pin through the resistor chain to ground and enables the associated features if selected. 2. Stop mode During stop mode operation the path from the VSUP pin through the resistor chain to ground is opened and the low and high voltage sense features are disabled. The content of the configuration register is unchanged. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 349 Chapter 10 Supply Voltage Sensor - (BATSV3) 10.1.3 Block Diagram Figure 10-1 shows a block diagram of the BATS module. See device guide for connectivity to ADC channel. Figure 10-1. BATS Block Diagram ... VSUP BVLC BVLS[1:0] BVHS BVHC Comparator BSUSE 1 to ADC BSUAE 1automatically closed if BSUSE and/or BSUAE is active, open during Stop mode 10.2 External Signal Description This section lists the name and description of all external ports. 10.2.1 VSUP -- Voltage Supply Pin This pin is the chip supply. It can be internally connected for voltage measurement. The voltage present at this input is scaled down by an internal voltage divider, and can be routed to the internal ADC or to a comparator. MC9S12ZVC Family Reference Manual , Rev. 1.9 350 NXP Semiconductors Chapter 10 Supply Voltage Sensor - (BATSV3) 10.3 Memory Map and Register Definition This section provides the detailed information of all registers for the BATS module. 10.3.1 Register Summary Figure 10-2 shows the summary of all implemented registers inside the BATS module. NOTE Register Address = Module Base Address + Address Offset, where the Module Base Address is defined at the MCU level and the Address Offset is defined at the module level. Address Offset Register Name 0x0000 BATE Bit 7 R 0 W 0x0001 BATSR R 6 5 BVHS 4 BVLS[1:0] 3 2 BSUAE BSUSE 1 Bit 0 0 0 BVHC BVLC BVHIE BVLIE BVHIF BVLIF 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved W 0x0002 BATIE R W 0x0003 BATIF R W 0x0004 - 0x0005 Reserved 0x0006 - 0x0007 Reserved R W R W = Unimplemented Figure 10-2. BATS Register Summary 10.3.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. Unused bits read back zero. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 351 Chapter 10 Supply Voltage Sensor - (BATSV3) 10.3.2.1 BATS Module Enable Register (BATE) Access: User read/write1 Module Base + 0x0000 7 R 0 W Reset 0 6 5 BVHS 4 BVLS[1:0] 0 0 0 3 2 BSUAE BSUSE 0 0 1 0 0 0 0 0 = Unimplemented Figure 10-3. BATS Module Enable Register (BATE) 1 Read: Anytime Write: Anytime Table 10-2. BATE Field Description Field 6 BVHS Description BATS Voltage High Select -- This bit selects the trigger level for the Voltage Level High Condition (BVHC). 0 Voltage level VHBI1 is selected 1 Voltage level VHBI2 is selected 5:4 BATS Voltage Low Select -- This bit selects the trigger level for the Voltage Level Low Condition (BVLC). BVLS[1:0] 00 Voltage level VLBI1 is selected 01 Voltage level VLBI2 is selected 10 Voltage level VLBI3 is selected 11 Voltage level VLBI4 is selected 3 BSUAE BATS VSUP ADC Connection Enable -- This bit connects the VSUP pin through the resistor chain to ground and connects the ADC channel to the divided down voltage. 0 ADC Channel is disconnected 1 ADC Channel is connected 2 BSUSE BATS VSUP Level Sense Enable -- This bit connects the VSUP pin through the resistor chain to ground and enables the Voltage Level Sense features measuring BVLC and BVHC. 0 Level Sense features disabled 1 Level Sense features enabled NOTE When opening the resistors path to ground by changing BSUSE or BSUAE then for a time TEN_UNC + two bus cycles the measured value is invalid. This is to let internal nodes be charged to correct value. BVHIE, BVLIE might be cleared for this time period to avoid false interrupts. MC9S12ZVC Family Reference Manual , Rev. 1.9 352 NXP Semiconductors Chapter 10 Supply Voltage Sensor - (BATSV3) 10.3.2.2 BATS Module Status Register (BATSR) Access: User read only1 Module Base + 0x0001 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 BVHC BVLC 0 0 0 0 0 0 0 0 W Reset = Unimplemented Figure 10-4. BATS Module Status Register (BATSR) 1 Read: Anytime Write: Never Table 10-3. BATSR - Register Field Descriptions Field Description 1 BVHC BATS Voltage Sense High Condition Bit -- This status bit indicates that a high voltage at VSUP, depending on selection, is present. 0 Vmeasured VHBI_A (rising edge) or Vmeasured VHBI_D (falling edge) 1 Vmeasured VHBI_A (rising edge) or Vmeasured VHBI_D (falling edge) 0 BVLC BATS Voltage Sense Low Condition Bit -- This status bit indicates that a low voltage at VSUP, depending on selection, is present. 0 Vmeasured VLBI_A (falling edge) or Vmeasured VLBI_D (rising edge) 1 Vmeasured VLBI_A (falling edge) or Vmeasured VLBI_D (rising edge) Figure 10-5. BATS Voltage Sensing V VHBI_A VHBI_D VLBI_D VLBI_A t MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 353 Chapter 10 Supply Voltage Sensor - (BATSV3) 10.3.2.3 BATS Interrupt Enable Register (BATIE) Access: User read/write1 Module Base + 0x0002 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 BVHIE BVLIE 0 0 = Unimplemented Figure 10-6. BATS Interrupt Enable Register (BATIE) 1 Read: Anytime Write: Anytime Table 10-4. BATIE Register Field Descriptions Field 1 BVHIE Description BATS Interrupt Enable High -- Enables High Voltage Interrupt . 0 No interrupt will be requested whenever BVHIF flag is set . 1 Interrupt will be requested whenever BVHIF flag is set 0 BVLIE BATS Interrupt Enable Low -- Enables Low Voltage Interrupt . 0 No interrupt will be requested whenever BVLIF flag is set . 1 Interrupt will be requested whenever BVLIF flag is set . 10.3.2.4 BATS Interrupt Flag Register (BATIF) Access: User read/write1 Module Base + 0x0003 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 BVHIF BVLIF 0 0 = Unimplemented Figure 10-7. BATS Interrupt Flag Register (BATIF) 1 Read: Anytime Write: Anytime, write 1 to clear MC9S12ZVC Family Reference Manual , Rev. 1.9 354 NXP Semiconductors Chapter 10 Supply Voltage Sensor - (BATSV3) Table 10-5. BATIF Register Field Descriptions Field 1 BVHIF Description BATS Interrupt Flag High Detect -- The flag is set to 1 when BVHC status bit changes. 0 No change of the BVHC status bit since the last clearing of the flag. 1 BVHC status bit has changed since the last clearing of the flag. 0 BVLIF BATS Interrupt Flag Low Detect -- The flag is set to 1 when BVLC status bit changes. 0 No change of the BVLC status bit since the last clearing of the flag. 1 BVLC status bit has changed since the last clearing of the flag. 10.3.2.5 Reserved Register Access: User read/write1 Module Base + 0x0006 Module Base + 0x0007 R W Reset 7 6 5 4 3 2 1 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved x x x x x x x x Figure 10-8. Reserved Register 1 Read: Anytime Write: Only in special mode NOTE These reserved registers are designed for factory test purposes only and are not intended for general user access. Writing to these registers when in special mode can alter the module's functionality. 10.4 10.4.1 Functional Description General The BATS module allows measuring the voltage on the VSUP pin. The voltage at the VSUP pin can be routed via an internal voltage divider to an internal Analog to Digital Converter Channel. Also the BATS module can be configured to generate a low and high voltage interrupt based on VSUP. The trigger level of the high and low interrupt are selectable. 10.4.2 Interrupts This section describes the interrupt generated by the BATS module. The interrupt is only available in CPU run mode. Entering and exiting CPU stop mode has no effect on the interrupt flags. To make sure the interrupt generation works properly the bus clock frequency must be higher than the Voltage Warning Low Pass Filter frequency (fVWLP_filter). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 355 Chapter 10 Supply Voltage Sensor - (BATSV3) The comparator outputs BVLC and BVHC are forced to zero if the comparator is disabled (configuration bit BSUSE is cleared). If the software disables the comparator during a high or low Voltage condition (BVHC or BVLC active), then an additional interrupt is generated. To avoid this behavior the software must disable the interrupt generation before disabling the comparator. The BATS interrupt vector is named in Table 10-6. Vector addresses and interrupt priorities are defined at MCU level. The module internal interrupt sources are combined into one module interrupt signal. Table 10-6. BATS Interrupt Sources Module Interrupt Source Module Internal Interrupt Source Local Enable BATS Interrupt (BATI) BATS Voltage Low Condition Interrupt (BVLI) BVLIE = 1 BATS Voltage High Condition Interrupt (BVHI) BVHIE = 1 10.4.2.1 BATS Voltage Low Condition Interrupt (BVLI) To use the Voltage Low Interrupt the Level Sensing must be enabled (BSUSE =1). If measured when a) VLBI1 selected with BVLS[1:0] = 0x0 Vmeasure VLBI1_A (falling edge) or Vmeasure VLBI1_D (rising edge) or when b) VLBI2 selected with BVLS[1:0] = 0x1 at pin VSUP Vmeasure VLBI2_A (falling edge) or Vmeasure VLBI2_D (rising edge) or when c) VLBI3 selected with BVLS[1:0] = 0x2 Vmeasure VLBI3_A (falling edge) or Vmeasure VLBI3_D (rising edge) or when d) VLBI4 selected with BVLS[1:0] = 0x3 Vmeasure VLBI4_A (falling edge) or Vmeasure VLBI4_D (rising edge) then BVLC is set. BVLC status bit indicates that a low voltage at pin VSUP is present. The Low Voltage Interrupt flag (BVLIF) is set to 1 when the Voltage Low Condition (BVLC) changes state . The Interrupt flag BVLIF can only be cleared by writing a 1. If the interrupt is enabled by bit BVLIE the module requests an interrupt to MCU (BATI). 10.4.2.2 BATS Voltage High Condition Interrupt (BVHI) To use the Voltage High Interrupt the Level Sensing must be enabled (BSUSE=1). MC9S12ZVC Family Reference Manual , Rev. 1.9 356 NXP Semiconductors Chapter 10 Supply Voltage Sensor - (BATSV3) If measured when a) VHBI1 selected with BVHS = 0 Vmeasure VHBI1_A (rising edge) or Vmeasure VHBI1_D (falling edge) or when a) VHBI2 selected with BVHS = 1 Vmeasure VHBI2_A (rising edge) or Vmeasure VHBI2_D (falling edge) then BVHC is set. BVHC status bit indicates that a high voltage at pin VSUP is present. The High Voltage Interrupt flag (BVHIF) is set to 1 when a Voltage High Condition (BVHC) changes state. The Interrupt flag BVHIF can only be cleared by writing a 1. If the interrupt is enabled by bit BVHIE the module requests an interrupt to MCU (BATI). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 357 Chapter 10 Supply Voltage Sensor - (BATSV3) MC9S12ZVC Family Reference Manual , Rev. 1.9 358 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Table 11-1. V03.00 Jan. 28, 2009 Initial version V03.01 Aug. 26, 2009 11.1.2/11-360 Figure 1-4./1-8 11.3.2.15/11-376 11.3.2.2/11-366, 11.3.2.3/11-366, 11.3.2.4/11-367, 11.4.3/11-382 V03.02 Apri,12,2010 11.3.2.8/11-370 -Add Table 11-10 11.3.2.11/11-373 -update TCRE bit description 11.4.3/11-382 -add Figure 11-31 V03.03 Jan,14,2013 - Correct typo: TSCR ->TSCR1; - Correct typo: ECTxxx->TIMxxx - Correct reference: Figure 11-25 -> Figure 11-30 - Add description, "a counter overflow when TTOV[7] is set", to be the condition of channel 7 override event. - Phrase the description of OC7M to make it more explicit -single source generate different channel guide 11.1 Introduction The basic scalable timer consists of a 16-bit, software-programmable counter driven by a flexible programmable prescaler. This timer can be used for many purposes, including input waveform measurements while simultaneously generating an output waveform. Pulse widths can vary from microseconds to many seconds. This timer could contain up to 8 input capture/output compare channels with one pulse accumulator available only on channel 7. The input capture function is used to detect a selected transition edge and record the time. The output compare function is used for generating output signals or for timer software delays. The 16-bit pulse accumulator is used to operate as a simple event counter or a gated time accumulator. The pulse accumulator shares timer channel 7 when the channel is available and when in event mode. A full access for the counter registers or the input capture/output compare registers should take place in one clock cycle. Accessing high byte and low byte separately for all of these registers may not yield the same result as accessing them in one word. 11.1.1 Features The TIM16B8CV3 includes these distinctive features: * Up to 8 channels available. (refer to device specification for exact number) * All channels have same input capture/output compare functionality. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 359 Chapter 11 Timer Module (TIM16B8CV3) Block Description * * * Clock prescaling. 16-bit counter. 16-bit pulse accumulator on channel 7 . 11.1.2 Modes of Operation Stop: Timer is off because clocks are stopped. Freeze: Timer counter keeps on running, unless TSFRZ in TSCR1 is set to 1. Wait: Counters keeps on running, unless TSWAI in TSCR1 is set to 1. Normal: Timer counter keep on running, unless TEN in TSCR1 is cleared to 0. 11.1.3 Block Diagrams MC9S12ZVC Family Reference Manual , Rev. 1.9 360 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Bus clock Prescaler 16-bit Counter Timer channel 0 interrupt Channel 3 Input capture Output compare Registers Channel 4 Input capture Output compare Channel 5 Input capture Output compare Timer channel 7 interrupt PA input interrupt Channel 1 Input capture Output compare Channel 2 Input capture Output compare Timer overflow interrupt PA overflow interrupt Channel 0 Input capture Output compare Channel 6 Input capture Output compare 16-bit Pulse accumulator Channel 7 Input capture Output compare IOC0 IOC1 IOC2 IOC3 IOC4 IOC5 IOC6 IOC7 Maximum possible channels, scalable from 0 to 7. Pulse Accumulator is available only if channel 7 exists. Figure 11-1. TIM16B8CV3 Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 361 Chapter 11 Timer Module (TIM16B8CV3) Block Description TIMCLK(Timer clock) CLK1 CLK0 Clock select (PAMOD) PACLK PACLK / 256 PACLK / 65536 Intermodule Bus Prescaled clock (PCLK) 4:1 MUX Edge detector IOC7 Interrupt PACNT MUX Divide by 64 M clock Figure 11-2. 16-Bit Pulse Accumulator Block Diagram 16-bit Main Timer IOCn Edge detector Set CnF Interrupt TCn Input Capture Reg. Figure 11-3. Interrupt Flag Setting MC9S12ZVC Family Reference Manual , Rev. 1.9 362 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description PULSE ACCUMULATOR PAD CHANNEL 7 OUTPUT COMPARE OCPD TEN TIOS7 Figure 11-4. Channel 7 Output Compare/Pulse Accumulator Logic 11.2 External Signal Description The TIM16B8CV3 module has a selected number of external pins. Refer to device specification for exact number. 11.2.1 IOC7 -- Input Capture and Output Compare Channel 7 This pin serves as input capture or output compare for channel 7 . This can also be configured as pulse accumulator input. 11.2.2 IOC6 - IOC0 -- Input Capture and Output Compare Channel 6-0 Those pins serve as input capture or output compare for TIM16B8CV3 channel . NOTE For the description of interrupts see Section 11.6, "Interrupts". 11.3 Memory Map and Register Definition This section provides a detailed description of all memory and registers. 11.3.1 Module Memory Map The memory map for the TIM16B8CV3 module is given below in Figure 11-5. The address listed for each register is the address offset. The total address for each register is the sum of the base address for the TIM16B8CV3 module and the address offset for each register. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 363 Chapter 11 Timer Module (TIM16B8CV3) Block Description 11.3.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. Only bits related to implemented channels are valid. Register Name 0x0000 TIOS 0x0001 CFORC 0x0002 OC7M 0x0003 OC7D 0x0004 TCNTH 0x0005 TCNTL 0x0006 TSCR1 0x0007 TTOV 0x0008 TCTL1 0x0009 TCTL2 0x000A TCTL3 0x000B TCTL4 0x000C TIE 0x000D TSCR2 0x000E TFLG1 0x000F TFLG2 0x0010-0x001F TCxH-TCxL1 0x0020 PACTL R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 6 5 4 3 2 1 Bit 0 IOS7 IOS6 IOS5 IOS4 IOS3 IOS2 IOS1 IOS0 0 FOC7 0 FOC6 0 FOC5 0 FOC4 0 FOC3 0 FOC2 0 FOC1 0 FOC0 OC7M7 OC7M6 OC7M5 OC7M4 OC7M3 OC7M2 OC7M1 OC7M0 OC7D7 OC7D6 OC7D5 OC7D4 OC7D3 OC7D2 OC7D1 OC7D0 TCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8 TCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0 TEN TSWAI TSFRZ TFFCA PRNT 0 0 0 TOV7 TOV6 TOV5 TOV4 TOV3 TOV2 TOV1 TOV0 OM7 OL7 OM6 OL6 OM5 OL5 OM4 OL4 OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A C7I C6I C5I C4I C3I C2I C1I C0I 0 0 0 TCRE PR2 PR1 PR0 C6F C5F C4F C3F C2F C1F C0F 0 0 0 0 0 0 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 PAEN PAMOD PEDGE CLK1 CLK0 PAOVI PAI TOI C7F TOF 0 Figure 11-5. TIM16B8CV3 Register Summary (Sheet 1 of 2) MC9S12ZVC Family Reference Manual , Rev. 1.9 364 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Register Name Bit 7 0x0021 PAFLG 0x0022 PACNTH 0x0023 PACNTL 0x0024-0x002B Reserved 0x002C OCPD 0x002D Reserved 0x002E PTPSR R 0 W R PACNT15 W R PACNT7 W R W R OCPD7 W R R W R W 0x002F Reserved PTPS7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 PAOVF PAIF PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0 OCPD6 OCPD5 OCPD4 OCPD3 OCPD2 OCPD1 OCPD0 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 Figure 11-5. TIM16B8CV3 Register Summary (Sheet 2 of 2) 1 The register is available only if corresponding channel exists. 11.3.2.1 Timer Input Capture/Output Compare Select (TIOS) Module Base + 0x0000 R W Reset 7 6 5 4 3 2 1 0 IOS7 IOS6 IOS5 IOS4 IOS3 IOS2 IOS1 IOS0 0 0 0 0 0 0 0 0 Figure 11-6. Timer Input Capture/Output Compare Select (TIOS) Read: Anytime Write: Anytime Table 11-2. TIOS Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field 7:0 IOS[7:0] Description Input Capture or Output Compare Channel Configuration 0 The corresponding implemented channel acts as an input capture. 1 The corresponding implemented channel acts as an output compare. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 365 Chapter 11 Timer Module (TIM16B8CV3) Block Description 11.3.2.2 Timer Compare Force Register (CFORC) Module Base + 0x0001 7 6 5 4 3 2 1 0 R 0 0 0 0 0 0 0 0 W FOC7 FOC6 FOC5 FOC4 FOC3 FOC2 FOC1 FOC0 0 0 0 0 0 0 0 0 Reset Figure 11-7. Timer Compare Force Register (CFORC) Read: Anytime but will always return 0x0000 (1 state is transient) Write: Anytime Table 11-3. CFORC Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field Description 7:0 FOC[7:0] Note: Force Output Compare Action for Channel 7:0 -- A write to this register with the corresponding data bit(s) set causes the action which is programmed for output compare "x" to occur immediately. The action taken is the same as if a successful comparison had just taken place with the TCx register except the interrupt flag does not get set. A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare on channel 7, overrides any channel 6:0 compares. If forced output compare on any channel occurs at the same time as the successful output compare then forced output compare action will take precedence and interrupt flag won't get set. 11.3.2.3 Output Compare 7 Mask Register (OC7M) Module Base + 0x0002 R W Reset 7 6 5 4 3 2 1 0 OC7M7 OC7M6 OC7M5 OC7M4 OC7M3 OC7M2 OC7M1 OC7M0 0 0 0 0 0 0 0 0 Figure 11-8. Output Compare 7 Mask Register (OC7M) Read: Anytime Write: Anytime MC9S12ZVC Family Reference Manual , Rev. 1.9 366 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Table 11-4. OC7M Field Descriptions Field Description 7:0 OC7M[7:0] Output Compare 7 Mask -- A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare on channel 7, overrides any channel 6:0 compares. For each OC7M bit that is set, the output compare action reflects the corresponding OC7D bit. 0 The corresponding OC7Dx bit in the output compare 7 data register will not be transferred to the timer port on a channel 7 event, even if the corresponding pin is setup for output compare. 1 The corresponding OC7Dx bit in the output compare 7 data register will be transferred to the timer port on a channel 7 event. Note: The corresponding channel must also be setup for output compare (IOSx = 1 and OCPDx = 0) for data to be transferred from the output compare 7 data register to the timer port. 11.3.2.4 1 Output Compare 7 Data Register (OC7D) . Module Base + 0x0003 R W Reset 7 6 5 4 3 2 1 0 OC7D7 OC7D6 OC7D5 OC7D4 OC7D3 OC7D2 OC7D1 OC7D0 0 0 0 0 0 0 0 0 Figure 11-9. Output Compare 7 Data Register (OC7D) Read: Anytime Write: Anytime Table 11-5. OC7D Field Descriptions Field Description 7:0 OC7D[7:0] Output Compare 7 Data -- A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare on channel 7, can cause bits in the output compare 7 data register to transfer to the timer port data register depending on the output compare 7 mask register. 11.3.2.5 Timer Count Register (TCNT) Module Base + 0x0004 R W Reset 15 14 13 12 11 10 9 9 TCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8 0 0 0 0 0 0 0 0 Figure 11-10. Timer Count Register High (TCNTH) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 367 Chapter 11 Timer Module (TIM16B8CV3) Block Description Module Base + 0x0005 R W Reset 7 6 5 4 3 2 1 0 TCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0 0 0 0 0 0 0 0 0 Figure 11-11. Timer Count Register Low (TCNTL) The 16-bit main timer is an up counter. A full access for the counter register should take place in one clock cycle. A separate read/write for high byte and low byte will give a different result than accessing them as a word. Read: Anytime Write: Has no meaning or effect in the normal mode; only writable in special modes . The period of the first count after a write to the TCNT registers may be a different size because the write is not synchronized with the prescaler clock. 11.3.2.6 Timer System Control Register 1 (TSCR1) Module Base + 0x0006 R W Reset 7 6 5 4 3 TEN TSWAI TSFRZ TFFCA PRNT 0 0 0 0 0 2 1 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 11-12. Timer System Control Register 1 (TSCR1) Read: Anytime Write: Anytime Table 11-6. TSCR1 Field Descriptions Field Description 7 TEN Timer Enable 0 Disables the main timer, including the counter. Can be used for reducing power consumption. 1 Allows the timer to function normally. If for any reason the timer is not active, there is no 64 clock for the pulse accumulator because the 64 is generated by the timer prescaler. 6 TSWAI Timer Module Stops While in Wait 0 Allows the timer module to continue running during wait. 1 Disables the timer module when the MCU is in the wait mode. Timer interrupts cannot be used to get the MCU out of wait. TSWAI also affects pulse accumulator. MC9S12ZVC Family Reference Manual , Rev. 1.9 368 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Table 11-6. TSCR1 Field Descriptions (continued) Field Description 5 TSFRZ Timer Stops While in Freeze Mode 0 Allows the timer counter to continue running while in freeze mode. 1 Disables the timer counter whenever the MCU is in freeze mode. This is useful for emulation. TSFRZ does not stop the pulse accumulator. 4 TFFCA Timer Fast Flag Clear All 0 Allows the timer flag clearing to function normally. 1 For TFLG1(0x000E), a read from an input capture or a write to the output compare channel (0x0010-0x001F) causes the corresponding channel flag, CnF, to be cleared. For TFLG2 (0x000F), any access to the TCNT register (0x0004, 0x0005) clears the TOF flag. Any access to the PACNT registers (0x0022, 0x0023) clears the PAOVF and PAIF flags in the PAFLG register (0x0021) if channel 7 exists. This has the advantage of eliminating software overhead in a separate clear sequence. Extra care is required to avoid accidental flag clearing due to unintended accesses. 3 PRNT Precision Timer 0 Enables legacy timer. PR0, PR1, and PR2 bits of the TSCR2 register are used for timer counter prescaler selection. 1 Enables precision timer. All bits of the PTPSR register are used for Precision Timer Prescaler Selection, and all bits. This bit is writable only once out of reset. 11.3.2.7 Timer Toggle On Overflow Register 1 (TTOV) Module Base + 0x0007 R W Reset 7 6 5 4 3 2 1 0 TOV7 TOV6 TOV5 TOV4 TOV3 TOV2 TOV1 TOV0 0 0 0 0 0 0 0 0 Figure 11-13. Timer Toggle On Overflow Register 1 (TTOV) Read: Anytime Write: Anytime Table 11-7. TTOV Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field Description 7:0 TOV[7:0] Toggle On Overflow Bits -- TOVx toggles output compare pin on overflow. This feature only takes effect when in output compare mode. When set, it takes precedence over forced output compare but not channel 7 override events. 0 Toggle output compare pin on overflow feature disabled. 1 Toggle output compare pin on overflow feature enabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 369 Chapter 11 Timer Module (TIM16B8CV3) Block Description 11.3.2.8 Timer Control Register 1/Timer Control Register 2 (TCTL1/TCTL2) Module Base + 0x0008 R W Reset 7 6 5 4 3 2 1 0 OM7 OL7 OM6 OL6 OM5 OL5 OM4 OL4 0 0 0 0 0 0 0 0 Figure 11-14. Timer Control Register 1 (TCTL1) Module Base + 0x0009 R W Reset 7 6 5 4 3 2 1 0 OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 0 0 0 0 0 0 0 0 Figure 11-15. Timer Control Register 2 (TCTL2) Read: Anytime Write: Anytime Table 11-8. TCTL1/TCTL2 Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero Field Description 7:0 OMx Output Mode -- These eight pairs of control bits are encoded to specify the output action to be taken as a result of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to OCx. Note: To enable output action by OMx bits on timer port, the corresponding bit in OC7M should be cleared. For an output line to be driven by an OCx the OCPDx must be cleared. 7:0 OLx Output Level -- These eightpairs of control bits are encoded to specify the output action to be taken as a result of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to OCx. Note: To enable output action by OLx bits on timer port, the corresponding bit in OC7M should be cleared. For an output line to be driven by an OCx the OCPDx must be cleared. Table 11-9. Compare Result Output Action OMx OLx Action 0 0 No output compare action on the timer output signal 0 1 Toggle OCx output line 1 0 Clear OCx output line to zero 1 1 Set OCx output line to one Note: To enable output action using the OM7 and OL7 bits on the timer port,the corresponding bit OC7M7 in the OC7M register must also be cleared. The settings for these bits can be seen inTable 11-10. MC9S12ZVC Family Reference Manual , Rev. 1.9 370 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Table 11-10. The OC7 and OCx event priority OC7M7=0 OC7M7=1 OC7Mx=1 OC7Mx=0 TC7=TCx TC7>TCx IOCx=OC7Dx IOC7=OM7/O L7 IOCx=OC7Dx +OMx/OLx IOC7=OM7/O L7 TC7=TCx OC7Mx=1 TC7>TCx IOCx=OMx/OLx IOC7=OM7/OL7 OC7Mx=0 TC7=TCx TC7>TCx IOCx=OC7Dx IOC7=OC7D7 IOCx=OC7Dx +OMx/OLx IOC7=OC7D7 TC7=TCx TC7>TCx IOCx=OMx/OLx IOC7=OC7D7 Note: in Table 11-10, the IOS7 and IOSx should be set to 1 IOSx is the register TIOS bit x, OC7Mx is the register OC7M bit x, TCx is timer Input Capture/Output Compare register, IOCx is channel x, OMx/OLx is the register TCTL1/TCTL2, OC7Dx is the register OC7D bit x. IOCx = OC7Dx+ OMx/OLx, means that both OC7 event and OCx event will change channel x value. 11.3.2.9 Timer Control Register 3/Timer Control Register 4 (TCTL3 and TCTL4) Module Base + 0x000A R W Reset 7 6 5 4 3 2 1 0 EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A 0 0 0 0 0 0 0 0 Figure 11-16. Timer Control Register 3 (TCTL3) Module Base + 0x000B R W Reset 7 6 5 4 3 2 1 0 EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A 0 0 0 0 0 0 0 0 Figure 11-17. Timer Control Register 4 (TCTL4) Read: Anytime Write: Anytime. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 371 Chapter 11 Timer Module (TIM16B8CV3) Block Description Table 11-11. TCTL3/TCTL4 Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field 7:0 EDGnB EDGnA Description Input Capture Edge Control -- These eight pairs of control bits configure the input capture edge detector circuits. Table 11-12. Edge Detector Circuit Configuration EDGnB 11.3.2.10 EDGnA Configuration 0 0 Capture disabled 0 1 Capture on rising edges only 1 0 Capture on falling edges only 1 1 Capture on any edge (rising or falling) Timer Interrupt Enable Register (TIE) Module Base + 0x000C R W Reset 7 6 5 4 3 2 1 0 C7I C6I C5I C4I C3I C2I C1I C0I 0 0 0 0 0 0 0 0 Figure 11-18. Timer Interrupt Enable Register (TIE) Read: Anytime Write: Anytime. Table 11-13. TIE Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero Field 7:0 C7I:C0I Description Input Capture/Output Compare "x" Interrupt Enable -- The bits in TIE correspond bit-for-bit with the bits in the TFLG1 status register. If cleared, the corresponding flag is disabled from causing a hardware interrupt. If set, the corresponding flag is enabled to cause a interrupt. MC9S12ZVC Family Reference Manual , Rev. 1.9 372 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description 11.3.2.11 Timer System Control Register 2 (TSCR2) Module Base + 0x000D 7 R W Reset TOI 0 6 5 4 0 0 0 0 0 0 3 2 1 0 TCRE PR2 PR1 PR0 0 0 0 0 = Unimplemented or Reserved Figure 11-19. Timer System Control Register 2 (TSCR2) Read: Anytime Write: Anytime. Table 11-14. TSCR2 Field Descriptions Field 7 TOI Description Timer Overflow Interrupt Enable 0 Interrupt inhibited. 1 Hardware interrupt requested when TOF flag set. 3 TCRE Timer Counter Reset Enable -- This bit allows the timer counter to be reset by a successful output compare 7 event. This mode of operation is similar to an up-counting modulus counter. 0 Counter reset inhibited and counter free runs. 1 Counter reset by a successful output compare 7. Note: If TC7 = 0x0000 and TCRE = 1, TCNT will stay at 0x0000 continuously. If TC7 = 0xFFFF and TCRE = 1, TOF will never be set when TCNT is reset from 0xFFFF to 0x0000. Note: TCRE=1 and TC7!=0, the TCNT cycle period will be TC7 x "prescaler counter width" + "1 Bus Clock", for a more detail explanation please refer to Section 11.4.3, "Output Compare Note: This bit and feature is available only when channel 7 exists. If channel 7 doesn't exist, this bit is reserved. Writing to reserved bit has no effect. Read from reserved bit return a zero. 2:0 PR[2:0] Timer Prescaler Select -- These three bits select the frequency of the timer prescaler clock derived from the Bus Clock as shown in Table 11-15. Table 11-15. Timer Clock Selection PR2 PR1 PR0 Timer Clock 0 0 0 Bus Clock / 1 0 0 1 Bus Clock / 2 0 1 0 Bus Clock / 4 0 1 1 Bus Clock / 8 1 0 0 Bus Clock / 16 1 0 1 Bus Clock / 32 1 1 0 Bus Clock / 64 1 1 1 Bus Clock / 128 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 373 Chapter 11 Timer Module (TIM16B8CV3) Block Description NOTE The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter stages equal zero. 11.3.2.12 Main Timer Interrupt Flag 1 (TFLG1) Module Base + 0x000E R W Reset 7 6 5 4 3 2 1 0 C7F C6F C5F C4F C3F C2F C1F C0F 0 0 0 0 0 0 0 0 Figure 11-20. Main Timer Interrupt Flag 1 (TFLG1) Read: Anytime Write: Used in the clearing mechanism (set bits cause corresponding bits to be cleared). Writing a zero will not affect current status of the bit. Table 11-16. TRLG1 Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field Description 7:0 C[7:0]F Input Capture/Output Compare Channel "x" Flag -- These flags are set when an input capture or output compare event occurs. Clearing requires writing a one to the corresponding flag bit while TEN or PAEN is set to one. Note: When TFFCA bit in TSCR register is set, a read from an input capture or a write into an output compare channel (0x0010-0x001F) will cause the corresponding channel flag CxF to be cleared. 11.3.2.13 Main Timer Interrupt Flag 2 (TFLG2) Module Base + 0x000F 7 R W Reset TOF 0 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Unimplemented or Reserved Figure 11-21. Main Timer Interrupt Flag 2 (TFLG2) TFLG2 indicates when interrupt conditions have occurred. To clear a bit in the flag register, write the bit to one while TEN bit of TSCR1 or PAEN bit of PACTL is set to one. Read: Anytime Write: Used in clearing mechanism (set bits cause corresponding bits to be cleared). Any access to TCNT will clear TFLG2 register if the TFFCA bit in TSCR register is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 374 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Table 11-17. TRLG2 Field Descriptions Field Description 7 TOF Timer Overflow Flag -- Set when 16-bit free-running timer overflows from 0xFFFF to 0x0000. Clearing this bit requires writing a one to bit 7 of TFLG2 register while the TEN bit of TSCR1 or PAEN bit of PACTL is set to one (See also TCRE control bit explanation) . 11.3.2.14 Timer Input Capture/Output Compare Registers High and Low 0- 7(TCxH and TCxL) Module Base + 0x0010 = TC0H 0x0012 = TC1H 0x0014=TC2H 0x0016=TC3H R W 0x0018=TC4H 0x001A=TC5H 0x001C=TC6H 0x001E=TC7H 15 14 13 12 11 10 9 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 0 0 0 0 0 0 0 Reset Figure 11-22. Timer Input Capture/Output Compare Register x High (TCxH) Module Base + 0x0011 = TC0L 0x0013 = TC1L 0x0015 =TC2L 0x0017=TC3L R W Reset 0x0019 =TC4L 0x001B=TC5L 0x001D=TC6L 0x001F=TC7L 7 6 5 4 3 2 1 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Figure 11-23. Timer Input Capture/Output Compare Register x Low (TCxL) 1 This register is available only when the corresponding channel exists and is reserved if that channel does not exist. Writes to a reserved register have no functional effect. Reads from a reserved register return zeroes. Depending on the TIOS bit for the corresponding channel, these registers are used to latch the value of the free-running counter when a defined transition is sensed by the corresponding input capture edge detector or to trigger an output action for output compare. Read: Anytime Write: Anytime for output compare function.Writes to these registers have no meaning or effect during input capture. All timer input capture/output compare registers are reset to 0x0000. NOTE Read/Write access in byte mode for high byte should take place before low byte otherwise it will give a different result. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 375 Chapter 11 Timer Module (TIM16B8CV3) Block Description 11.3.2.15 16-Bit Pulse Accumulator Control Register (PACTL) Module Base + 0x0020 7 R 0 W Reset 0 6 5 4 3 2 1 0 PAEN PAMOD PEDGE CLK1 CLK0 PAOVI PAI 0 0 0 0 0 0 0 Unimplemented or Reserved Figure 11-24. 16-Bit Pulse Accumulator Control Register (PACTL) Read: Any time Write: Any time When PAEN is set, the Pulse Accumulator counter is enabled. The Pulse Accumulator counter shares the input pin with IOC7. Table 11-18. PACTL Field Descriptions Field Description 6 PAEN Pulse Accumulator System Enable -- PAEN is independent from TEN. With timer disabled, the pulse accumulator can function unless pulse accumulator is disabled. 0 16-Bit Pulse Accumulator system disabled. 1 Pulse Accumulator system enabled. 5 PAMOD Pulse Accumulator Mode -- This bit is active only when the Pulse Accumulator is enabled (PAEN = 1). See Table 11-19. 0 Event counter mode. 1 Gated time accumulation mode. 4 PEDGE Pulse Accumulator Edge Control -- This bit is active only when the Pulse Accumulator is enabled (PAEN = 1). For PAMOD bit = 0 (event counter mode). See Table 11-19. 0 Falling edges on IOC7 pin cause the count to be increased. 1 Rising edges on IOC7 pin cause the count to be increased. For PAMOD bit = 1 (gated time accumulation mode). 0 IOC7 input pin high enables M (Bus clock) divided by 64 clock to Pulse Accumulator and the trailing falling edge on IOC7 sets the PAIF flag. 1 IOC7 input pin low enables M (Bus clock) divided by 64 clock to Pulse Accumulator and the trailing rising edge on IOC7 sets the PAIF flag. 3:2 CLK[1:0] 1 PAOVI 0 PAI Clock Select Bits -- Refer to Table 11-20. Pulse Accumulator Overflow Interrupt Enable 0 Interrupt inhibited. 1 Interrupt requested if PAOVF is set. Pulse Accumulator Input Interrupt Enable 0 Interrupt inhibited. 1 Interrupt requested if PAIF is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 376 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Table 11-19. Pin Action PAMOD PEDGE Pin Action 0 0 Falling edge 0 1 Rising edge 1 0 Div. by 64 clock enabled with pin high level 1 1 Div. by 64 clock enabled with pin low level NOTE If the timer is not active (TEN = 0 in TSCR), there is no divide-by-64 because the 64 clock is generated by the timer prescaler. Table 11-20. Timer Clock Selection CLK1 CLK0 Timer Clock 0 0 Use timer prescaler clock as timer counter clock 0 1 Use PACLK as input to timer counter clock 1 0 Use PACLK/256 as timer counter clock frequency 1 1 Use PACLK/65536 as timer counter clock frequency For the description of PACLK please refer Figure 11-30. If the pulse accumulator is disabled (PAEN = 0), the prescaler clock from the timer is always used as an input clock to the timer counter. The change from one selected clock to the other happens immediately after these bits are written. 11.3.2.16 1 Pulse Accumulator Flag Register (PAFLG) . Module Base + 0x0021 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 PAOVF PAIF 0 0 Unimplemented or Reserved Figure 11-25. Pulse Accumulator Flag Register (PAFLG) Read: Anytime Write: Anytime When the TFFCA bit in the TSCR register is set, any access to the PACNT register will clear all the flags in the PAFLG register. Timer module or Pulse Accumulator must stay enabled (TEN=1 or PAEN=1) while clearing these bits. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 377 Chapter 11 Timer Module (TIM16B8CV3) Block Description Table 11-21. PAFLG Field Descriptions Field Description 1 PAOVF Pulse Accumulator Overflow Flag -- Set when the 16-bit pulse accumulator overflows from 0xFFFF to 0x0000. Clearing this bit requires writing a one to this bit in the PAFLG register while TEN bit of TSCR1 or PAEN bit of PACTL register is set to one. 0 PAIF Pulse Accumulator Input edge Flag -- Set when the selected edge is detected at the IOC7 input pin.In event mode the event edge triggers PAIF and in gated time accumulation mode the trailing edge of the gate signal at the IOC7 input pin triggers PAIF. Clearing this bit requires writing a one to this bit in the PAFLG register while TEN bit of TSCR1 or PAEN bit of PACTL register is set to one. Any access to the PACNT register will clear all the flags in this register when TFFCA bit in register TSCR(0x0006) is set. 11.3.2.17 Pulse Accumulators Count Registers (PACNT) Module Base + 0x0022 R W Reset 15 14 13 12 11 10 9 0 PACNT15 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8 0 0 0 0 0 0 0 0 Figure 11-26. Pulse Accumulator Count Register High (PACNTH) 1 . Module Base + 0x0023 R W Reset 7 6 5 4 3 2 1 0 PACNT7 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0 0 0 0 0 0 0 0 0 Figure 11-27. Pulse Accumulator Count Register Low (PACNTL) Read: Anytime Write: Anytime These registers contain the number of active input edges on its input pin since the last reset. When PACNT overflows from 0xFFFF to 0x0000, the Interrupt flag PAOVF in PAFLG (0x0021) is set. Full count register access should take place in one clock cycle. A separate read/write for high byte and low byte will give a different result than accessing them as a word. NOTE Reading the pulse accumulator counter registers immediately after an active edge on the pulse accumulator input pin may miss the last count because the input has to be synchronized with the Bus clock first. MC9S12ZVC Family Reference Manual , Rev. 1.9 378 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description 11.3.2.18 Output Compare Pin Disconnect Register(OCPD) Module Base + 0x002C R W Reset 7 6 5 4 3 2 1 0 OCPD7 OCPD6 OCPD5 OCPD4 OCPD3 OCPD2 OCPD1 OCPD0 0 0 0 0 0 0 0 0 Figure 11-28. Output Compare Pin Disconnect Register (OCPD) Read: Anytime Write: Anytime All bits reset to zero. Table 11-22. OCPD Field Description Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field Description 7:0 OCPD[7:0] Output Compare Pin Disconnect Bits 0 Enables the timer channel port. Output Compare action will occur on the channel pin. These bits do not affect the input capture or pulse accumulator functions. 1 Disables the timer channel port. Output Compare action will not occur on the channel pin, but the output compare flag still become set. 11.3.2.19 Precision Timer Prescaler Select Register (PTPSR) Module Base + 0x002E R W Reset 7 6 5 4 3 2 1 0 PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 0 0 0 0 0 0 0 0 Figure 11-29. Precision Timer Prescaler Select Register (PTPSR) Read: Anytime Write: Anytime All bits reset to zero. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 379 Chapter 11 Timer Module (TIM16B8CV3) Block Description ... Table 11-23. PTPSR Field Descriptions Field Description 7:0 PTPS[7:0] Precision Timer Prescaler Select Bits -- These eight bits specify the division rate of the main Timer prescaler. These are effective only when the PRNT bit of TSCR1 is set to 1. Table 11-24 shows some selection examples in this case. The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter stages equal zero. The Prescaler can be calculated as follows depending on logical value of the PTPS[7:0] and PRNT bit: PRNT = 1 : Prescaler = PTPS[7:0] + 1 Table 11-24. Precision Timer Prescaler Selection Examples when PRNT = 1 PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 Prescale Factor 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 1 2 0 0 0 0 0 0 1 0 3 0 0 0 0 0 0 1 1 4 - - - - - - - - - - - - - - - - - - - - - - - - - - - 0 0 0 1 0 0 1 1 20 0 0 0 1 0 1 0 0 21 0 0 0 1 0 1 0 1 22 - - - - - - - - - - - - - - - - - - - - - - - - - - - 1 1 1 1 1 1 0 0 253 1 1 1 1 1 1 0 1 254 1 1 1 1 1 1 1 0 255 1 1 1 1 1 1 1 1 256 11.4 Functional Description This section provides a complete functional description of the timer TIM16B8CV3 block. Please refer to the detailed timer block diagram in Figure 11-30 as necessary. MC9S12ZVC Family Reference Manual , Rev. 1.9 380 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description PTPSR[7:0] PRE-PRESCALER MUX PRNT tim source Clock CLK[1:0] PACLK PACLK/256 PACLK/65536 PR[2:1:0] channel 7 output compare 1 MUX 0 PRESCALER TCRE CxI TCNT(hi):TCNT(lo) CxF CLEAR COUNTER 16-BIT COUNTER TOF INTERRUPT LOGIC TOI TE TOF CHANNEL 0 16-BIT COMPARATOR C0F C0F OM:OL0 TC0 EDG0A TOV0 EDGE DETECT EDG0B CH. 0 CAPTURE IOC0 PIN LOGIC CH. 0COMPARE IOC0 PIN IOC0 CHANNEL 1 16-BIT COMPARATOR C1F C1F OM:OL1 TC1 EDG1A EDGE DETECT EDG1B CH. 1 CAPTURE IOC1 PIN LOGIC CH. 1 COMPARE TOV1 IOC1 PIN IOC1 CHANNEL2 CHANNEL7 16-BIT COMPARATOR C7F C7F TC7 OM:OL7 EDG7A EDG7B PAOVF TOV7 EDGE DETECT PEDGE MUX 16-BIT COUNTER IOC7 PIN IOC7 PACNT(hi):PACNT(lo) PACLK/65536 CH.7 CAPTURE PA INPUT IOC7 PIN LOGIC CH. 7 COMPARE PAEN EDGE DETECT PACLK PACLK/256 INTERRUPT REQUEST PAMOD INTERRUPT LOGIC PEDGE PAOVI PAI PAOVF PAIF TEN PAIF DIVIDE-BY-64 tim source clock PAOVF PAOVI Maximum possible channels, scalable from 0 to 7. Pulse Accumulator is available only if channel 7 exists. Figure 11-30. Detailed Timer Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 381 Chapter 11 Timer Module (TIM16B8CV3) Block Description 11.4.1 Prescaler The prescaler divides the Bus clock by 1, 2, 4, 8, 16, 32, 64 or 128. The prescaler select bits, PR[2:0], select the prescaler divisor. PR[2:0] are in timer system control register 2 (TSCR2). The prescaler divides the Bus clock by a prescalar value. Prescaler select bits PR[2:0] of in timer system control register 2 (TSCR2) are set to define a prescalar value that generates a divide by 1, 2, 4, 8, 16, 32, 64 and 128 when the PRNT bit in TSCR1 is disabled. By enabling the PRNT bit of the TSCR1 register, the performance of the timer can be enhanced. In this case, it is possible to set additional prescaler settings for the main timer counter in the present timer by using PTPSR[7:0] bits of PTPSR register generating divide by 1, 2, 3, 4,....20, 21, 22, 23,......255, or 256. 11.4.2 Input Capture Clearing the I/O (input/output) select bit, IOSx, configures channel x as an input capture channel. The input capture function captures the time at which an external event occurs. When an active edge occurs on the pin of an input capture channel, the timer transfers the value in the timer counter into the timer channel registers, TCx. The minimum pulse width for the input capture input is greater than two Bus clocks. An input capture on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt requests. Timer module or Pulse Accumulator must stay enabled (TEN bit of TSCR1 or PAEN bit of PACTL register must be set to one) while clearing CxF (writing one to CxF). 11.4.3 Output Compare Setting the I/O select bit, IOSx, configures channel x when available as an output compare channel. The output compare function can generate a periodic pulse with a programmable polarity, duration, and frequency. When the timer counter reaches the value in the channel registers of an output compare channel, the timer can set, clear, or toggle the channel pin if the corresponding OCPDx bit is set to zero. An output compare on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt requests. Timer module or Pulse Accumulator must stay enabled (TEN bit of TSCR1 or PAEN bit of PACTL register must be set to one) while clearing CxF (writing one to CxF). The output mode and level bits, OMx and OLx, select set, clear, toggle on output compare. Clearing both OMx and OLx results in no output compare action on the output compare channel pin. Setting a force output compare bit, FOCx, causes an output compare on channel x. A forced output compare does not set the channel flag. A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare on channel 7, overrides output compares on all other output compare channels. The output compare 7 mask register masks the bits in the output compare 7 data register. The timer counter reset enable bit, TCRE, enables channel 7 output compares to reset the timer counter. A channel 7 output compare can reset the timer counter even if the IOC7 pin is being used as the pulse accumulator input. MC9S12ZVC Family Reference Manual , Rev. 1.9 382 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Writing to the timer port bit of an output compare pin does not affect the pin state. The value written is stored in an internal latch. When the pin becomes available for general-purpose output, the last value written to the bit appears at the pin. When TCRE is set and TC7 is not equal to 0, then TCNT will cycle from 0 to TC7. When TCNT reaches TC7 value, it will last only one Bus cycle then reset to 0. Note: in Figure 11-31,if PR[2:0] is equal to 0, one prescaler counter equal to one Bus clock Figure 11-31. The TCNT cycle diagram under TCRE=1 condition prescaler counter TC7 1 Bus clock 0 1 TC7-1 TC7 0 TC7 event TC7 event 11.4.3.1 ----- OC Channel Initialization The internal register whose output drives OCx can be programmed before the timer drives OCx. The desired state can be programmed to this internal register by writing a one to CFORCx bit with TIOSx, OCPDx and TEN bits set to one. Set OCx: Write a 1 to FOCx while TEN=1, IOSx=1, OMx=1, OLx=1 and OCPDx=1 Clear OCx: Write a 1 to FOCx while TEN=1, IOSx=1, OMx=1, OLx=0 and OCPDx=1 Setting OCPDx to zero allows the internal register to drive the programmed state to OCx. This allows a glitch free switch over of port from general purpose I/O to timer output once the OCPDx bit is set to zero. 11.4.4 Pulse Accumulator The pulse accumulator (PACNT) is a 16-bit counter that can operate in two modes: Event counter mode -- Counting edges of selected polarity on the pulse accumulator input pin, PAI. Gated time accumulation mode -- Counting pulses from a divide-by-64 clock. The PAMOD bit selects the mode of operation. The minimum pulse width for the PAI input is greater than two Bus clocks. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 383 Chapter 11 Timer Module (TIM16B8CV3) Block Description 11.4.5 Event Counter Mode Clearing the PAMOD bit configures the PACNT for event counter operation. An active edge on the IOC7 pin increments the pulse accumulator counter. The PEDGE bit selects falling edges or rising edges to increment the count. NOTE The PACNT input and timer channel 7 use the same pin IOC7. To use the IOC7, disconnect it from the output logic by clearing the channel 7 output mode and output level bits, OM7 and OL7. Also clear the channel 7 output compare 7 mask bit, OC7M7. The Pulse Accumulator counter register reflect the number of active input edges on the PACNT input pin since the last reset. The PAOVF bit is set when the accumulator rolls over from 0xFFFF to 0x0000. The pulse accumulator overflow interrupt enable bit, PAOVI, enables the PAOVF flag to generate interrupt requests. NOTE The pulse accumulator counter can operate in event counter mode even when the timer enable bit, TEN, is clear. 11.4.6 Gated Time Accumulation Mode Setting the PAMOD bit configures the pulse accumulator for gated time accumulation operation. An active level on the PACNT input pin enables a divided-by-64 clock to drive the pulse accumulator. The PEDGE bit selects low levels or high levels to enable the divided-by-64 clock. The trailing edge of the active level at the IOC7 pin sets the PAIF. The PAI bit enables the PAIF flag to generate interrupt requests. The pulse accumulator counter register reflect the number of pulses from the divided-by-64 clock since the last reset. NOTE The timer prescaler generates the divided-by-64 clock. If the timer is not active, there is no divided-by-64 clock. 11.5 Resets The reset state of each individual bit is listed within Section 11.3, "Memory Map and Register Definition" which details the registers and their bit fields 11.6 Interrupts This section describes interrupts originated by the TIM16B8CV3 block. Table 11-25 lists the interrupts generated by the TIM16B8CV3 to communicate with the MCU. MC9S12ZVC Family Reference Manual , Rev. 1.9 384 NXP Semiconductors Chapter 11 Timer Module (TIM16B8CV3) Block Description Table 11-25. TIM16B8CV3 Interrupts Interrupt Offset Vector Priority Source Description C[7:0]F -- -- -- Timer Channel 7-0 Active high timer channel interrupts 7-0 PAOVI -- -- -- Pulse Accumulator Input Active high pulse accumulator input interrupt PAOVF -- -- -- Pulse Accumulator Overflow Pulse accumulator overflow interrupt TOF -- -- -- Timer Overflow Timer Overflow interrupt The TIM16B8CV3 could use up to 11 interrupt vectors. The interrupt vector offsets and interrupt numbers are chip dependent. 11.6.1 Channel [7:0] Interrupt (C[7:0]F) This active high outputs will be asserted by the module to request a timer channel 7 - 0 interrupt. The TIM block only generates the interrupt and does not service it. Only bits related to implemented channels are valid. 11.6.2 Pulse Accumulator Input Interrupt (PAOVI) This active high output will be asserted by the module to request a timer pulse accumulator input interrupt. The TIM block only generates the interrupt and does not service it. 11.6.3 Pulse Accumulator Overflow Interrupt (PAOVF) This active high output will be asserted by the module to request a timer pulse accumulator overflow interrupt. The TIM block only generates the interrupt and does not service it. 11.6.4 Timer Overflow Interrupt (TOF) This active high output will be asserted by the module to request a timer overflow interrupt. The TIM block only generates the interrupt and does not service it. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 385 Chapter 11 Timer Module (TIM16B8CV3) Block Description MC9S12ZVC Family Reference Manual , Rev. 1.9 386 NXP Semiconductors Chapter 12 Timer Module (TIM16B4CV3) Block Description Table 12-1. V03.00 Jan. 28, 2009 Initial version V03.01 Aug. 26, 2009 12.1.2/12-388 Figure 1-4./1-8 1.3.2.15/1-18 12.3.2.2/12-391, 1.3.2.3/1-8, Chapter 12/12-38 7, 12.4.3/12-403 V03.02 Apri,12,2010 12.3.2.6/12-394 12.3.2.9/12-396 12.4.3/12-403 V03.03 Jan,14,2013 - Correct typo: TSCR ->TSCR1; - Correct typo: ECTxxx->TIMxxx - Correct reference: Figure 1-25 -> Figure 12-22 - Add description, "a counter overflow when TTOV[7] is set", to be the condition of channel 7 override event. - Phrase the description of OC7M to make it more explicit -Add Table 1-10 -update TCRE bit description -add Figure 1-31 -single source generate different channel guide 12.1 Introduction The basic scalable timer consists of a 16-bit, software-programmable counter driven by a flexible programmable prescaler. This timer can be used for many purposes, including input waveform measurements while simultaneously generating an output waveform. This timer could contain up to 4 input capture/output compare channels . The input capture function is used to detect a selected transition edge and record the time. The output compare function is used for generating output signals or for timer software delays. A full access for the counter registers or the input capture/output compare registers should take place in one clock cycle. Accessing high byte and low byte separately for all of these registers may not yield the same result as accessing them in one word. 12.1.1 Features The TIM16B4CV3 includes these distinctive features: * * * Up to 4 channels available. (refer to device specification for exact number) All channels have same input capture/output compare functionality. Clock prescaling. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 387 Chapter 12 Timer Module (TIM16B4CV3) Block Description * 16-bit counter. 12.1.2 Modes of Operation Stop: Timer is off because clocks are stopped. Freeze: Timer counter keeps on running, unless TSFRZ in TSCR1 is set to 1. Wait: Counters keeps on running, unless TSWAI in TSCR1 is set to 1. Normal: Timer counter keep on running, unless TEN in TSCR1 is cleared to 0. 12.1.3 Block Diagrams Core clock Timer overflow interrupt Prescaler 16-bit Counter Timer channel 0 interrupt Timer channel 1 interrupt Timer channel 2 interrupt Channel 0 Input capture Output compare Channel 1 Input capture Output compare Channel 2 Input capture Output compare Registers Channel 3 Input capture Output compare IOC0 IOC1 IOC2 IOC3 Timer channel 3 interrupt Figure 12-1. TIM16B4CV3 Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 388 NXP Semiconductors Chapter 12 Timer Module (TIM16B4CV3) Block Description 16-bit Main Timer IOCn Edge detector Set CnF Interrupt TCn Input Capture Reg. Figure 12-2. Interrupt Flag Setting 12.2 External Signal Description The TIM16B4CV3 module has a selected number of external pins. Refer to device specification for exact number. 12.2.1 IOC3 - IOC0 -- Input Capture and Output Compare Channel 3-0 Those pins serve as input capture or output compare for TIM16B4CV3 channel . NOTE For the description of interrupts see Section 12.6, "Interrupts". 12.3 Memory Map and Register Definition This section provides a detailed description of all memory and registers. 12.3.1 Module Memory Map The memory map for the TIM16B4CV3 module is given below in Figure 12-3. The address listed for each register is the address offset. The total address for each register is the sum of the base address for the TIM16B4CV3 module and the address offset for each register. 12.3.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 389 Chapter 12 Timer Module (TIM16B4CV3) Block Description Only bits related to implemented channels are valid. Register Name 0x0000 TIOS 0x0001 CFORC 0x0004 TCNTH 0x0005 TCNTL 0x0006 TSCR1 0x0007 TTOV 0x0008 TCTL1 0x0009 TCTL2 0x000A TCTL3 0x000B TCTL4 0x000C TIE 0x000D TSCR2 0x000E TFLG1 0x000F TFLG2 0x0010-0x001F TCxH-TCxL1 0x0024-0x002B Reserved 0x002C OCPD 0x002D Reserved 0x002E PTPSR 0x002F Reserved Bit 7 6 5 4 3 2 1 Bit 0 R RESERVE D W R 0 W RESERVE D R TCNT15 W R TCNT7 W R TEN W R RESERVE D W RESERVE D RESERVE D RESERVE D IOS3 IOS2 IOS1 IOS0 0 RESERVE D 0 RESERVE D 0 RESERVE D 0 0 0 0 FOC3 FOC2 FOC1 FOC0 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0 TSWAI TSFRZ TFFCA PRNT 0 0 0 RESERVE D RESERVE D RESERVE D TOV3 TOV2 TOV1 TOV0 R W R W R W R W R W R W R W R W R W RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A RESERVE D RESERVE D RESERVE D RESERVE D C3I C2I C1I C0I 0 0 0 RESERVE D PR2 PR1 PR0 RESERVE D RESERVE D RESERVE D C3F C2F C1F C0F 0 0 0 0 0 0 0 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 RESERVE D RESERVE D RESERVE D OCPD3 OCPD2 OCPD1 OCPD0 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 TOI RESERVE D TOF Bit 15 R Bit 7 W R W R RESERVE D W R R W R W PTPS7 Figure 12-3. TIM16B4CV3 Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 390 NXP Semiconductors Chapter 12 Timer Module (TIM16B4CV3) Block Description 1 The register is available only if corresponding channel exists. 12.3.2.1 Timer Input Capture/Output Compare Select (TIOS) Module Base + 0x0000 R W Reset 7 6 5 4 3 2 1 0 RESERVED RESERVED RESERVED RESERVED IOS3 IOS2 IOS1 IOS0 0 0 0 0 0 0 0 0 Figure 12-4. Timer Input Capture/Output Compare Select (TIOS) Read: Anytime Write: Anytime Table 12-2. TIOS Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field 3:0 IOS[3:0] 12.3.2.2 Description Input Capture or Output Compare Channel Configuration 0 The corresponding implemented channel acts as an input capture. 1 The corresponding implemented channel acts as an output compare. Timer Compare Force Register (CFORC) Module Base + 0x0001 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 RESERVED RESERVED RESERVED FOC3 FOC2 FOC1 FOC0 0 0 0 0 0 0 0 W RESERVED Reset 0 Figure 12-5. Timer Compare Force Register (CFORC) Read: Anytime but will always return 0x0000 (1 state is transient) Write: Anytime Table 12-3. CFORC Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field Description 3:0 FOC[3:0] Note: Force Output Compare Action for Channel 3:0 -- A write to this register with the corresponding data bit(s) set causes the action which is programmed for output compare "x" to occur immediately. The action taken is the same as if a successful comparison had just taken place with the TCx register except the interrupt flag does not get set. If forced output compare on any channel occurs at the same time as the successful output compare then forced output compare action will take precedence and interrupt flag won't get set. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 391 Chapter 12 Timer Module (TIM16B4CV3) Block Description 12.3.2.3 Timer Count Register (TCNT) Module Base + 0x0004 R W Reset 15 14 13 12 11 10 9 9 TCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8 0 0 0 0 0 0 0 0 Figure 12-6. Timer Count Register High (TCNTH) Module Base + 0x0005 R W Reset 7 6 5 4 3 2 1 0 TCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0 0 0 0 0 0 0 0 0 Figure 12-7. Timer Count Register Low (TCNTL) The 16-bit main timer is an up counter. A full access for the counter register should take place in one clock cycle. A separate read/write for high byte and low byte will give a different result than accessing them as a word. Read: Anytime Write: Has no meaning or effect in the normal mode; only writable in special modes . The period of the first count after a write to the TCNT registers may be a different size because the write is not synchronized with the prescaler clock. 12.3.2.4 Timer System Control Register 1 (TSCR1) Module Base + 0x0006 R W Reset 7 6 5 4 3 TEN TSWAI TSFRZ TFFCA PRNT 0 0 0 0 0 2 1 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 12-8. Timer System Control Register 1 (TSCR1) Read: Anytime Write: Anytime MC9S12ZVC Family Reference Manual , Rev. 1.9 392 NXP Semiconductors Chapter 12 Timer Module (TIM16B4CV3) Block Description Table 12-4. TSCR1 Field Descriptions Field Description 7 TEN Timer Enable 0 Disables the main timer, including the counter. Can be used for reducing power consumption. 1 Allows the timer to function normally. If for any reason the timer is not active, there is no 64 clock for the pulse accumulator because the 64 is generated by the timer prescaler. 6 TSWAI Timer Module Stops While in Wait 0 Allows the timer module to continue running during wait. 1 Disables the timer module when the MCU is in the wait mode. Timer interrupts cannot be used to get the MCU out of wait. TSWAI also affects pulse accumulator. 5 TSFRZ Timer Stops While in Freeze Mode 0 Allows the timer counter to continue running while in freeze mode. 1 Disables the timer counter whenever the MCU is in freeze mode. This is useful for emulation. TSFRZ does not stop the pulse accumulator. 4 TFFCA Timer Fast Flag Clear All 0 Allows the timer flag clearing to function normally. 1 For TFLG1(0x000E), a read from an input capture or a write to the output compare channel (0x0010-0x001F) causes the corresponding channel flag, CnF, to be cleared. For TFLG2 (0x000F), any access to the TCNT register (0x0004, 0x0005) clears the TOF flag. This has the advantage of eliminating software overhead in a separate clear sequence. Extra care is required to avoid accidental flag clearing due to unintended accesses. 3 PRNT Precision Timer 0 Enables legacy timer. PR0, PR1, and PR2 bits of the TSCR2 register are used for timer counter prescaler selection. 1 Enables precision timer. All bits of the PTPSR register are used for Precision Timer Prescaler Selection, and all bits. This bit is writable only once out of reset. 12.3.2.5 Timer Toggle On Overflow Register 1 (TTOV) Module Base + 0x0007 R W Reset 7 6 5 4 3 2 1 0 RESERVED RESERVED RESERVED RESERVED TOV3 TOV2 TOV1 TOV0 0 0 0 0 0 0 0 0 Figure 12-9. Timer Toggle On Overflow Register 1 (TTOV) Read: Anytime Write: Anytime MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 393 Chapter 12 Timer Module (TIM16B4CV3) Block Description Table 12-5. TTOV Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field Description 3:0 TOV[3:0] Toggle On Overflow Bits -- TOVx toggles output compare pin on overflow. This feature only takes effect when in output compare mode. When set, it takes precedence over forced output compare 0 Toggle output compare pin on overflow feature disabled. 1 Toggle output compare pin on overflow feature enabled. 12.3.2.6 Timer Control Register 1/Timer Control Register 2 (TCTL1/TCTL2) Module Base + 0x0008 R W Reset 7 6 5 4 3 2 1 0 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED 0 0 0 0 0 0 0 0 Figure 12-10. Timer Control Register 1 (TCTL1) Module Base + 0x0009 R W Reset 7 6 5 4 3 2 1 0 OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 0 0 0 0 0 0 0 0 Figure 12-11. Timer Control Register 2 (TCTL2) Read: Anytime Write: Anytime Table 12-6. TCTL1/TCTL2 Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero Field Description 3:0 OMx Output Mode -- These four pairs of control bits are encoded to specify the output action to be taken as a result of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to OCx. Note: For an output line to be driven by an OCx the OCPDx must be cleared. 3:0 OLx Output Level -- These fourpairs of control bits are encoded to specify the output action to be taken as a result of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to OCx. Note: For an output line to be driven by an OCx the OCPDx must be cleared. Table 12-7. Compare Result Output Action OMx OLx Action 0 0 No output compare action on the timer output signal MC9S12ZVC Family Reference Manual , Rev. 1.9 394 NXP Semiconductors Chapter 12 Timer Module (TIM16B4CV3) Block Description Table 12-7. Compare Result Output Action 12.3.2.7 OMx OLx Action 0 1 Toggle OCx output line 1 0 Clear OCx output line to zero 1 1 Set OCx output line to one Timer Control Register 3/Timer Control Register 4 (TCTL3 and TCTL4) Module Base + 0x000A R W Reset 7 6 5 4 3 2 1 0 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED 0 0 0 0 0 0 0 0 Figure 12-12. Timer Control Register 3 (TCTL3) Module Base + 0x000B R W Reset 7 6 5 4 3 2 1 0 EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A 0 0 0 0 0 0 0 0 Figure 12-13. Timer Control Register 4 (TCTL4) Read: Anytime Write: Anytime. Table 12-8. TCTL3/TCTL4 Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field 3:0 EDGnB EDGnA Description Input Capture Edge Control -- These four pairs of control bits configure the input capture edge detector circuits. Table 12-9. Edge Detector Circuit Configuration EDGnB EDGnA Configuration 0 0 Capture disabled 0 1 Capture on rising edges only 1 0 Capture on falling edges only 1 1 Capture on any edge (rising or falling) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 395 Chapter 12 Timer Module (TIM16B4CV3) Block Description 12.3.2.8 Timer Interrupt Enable Register (TIE) Module Base + 0x000C R W Reset 7 6 5 4 3 2 1 0 RESERVED RESERVED RESERVED RESERVED C3I C2I C1I C0I 0 0 0 0 0 0 0 0 Figure 12-14. Timer Interrupt Enable Register (TIE) Read: Anytime Write: Anytime. Table 12-10. TIE Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero Field 3:0 C3I:C0I 12.3.2.9 Description Input Capture/Output Compare "x" Interrupt Enable -- The bits in TIE correspond bit-for-bit with the bits in the TFLG1 status register. If cleared, the corresponding flag is disabled from causing a hardware interrupt. If set, the corresponding flag is enabled to cause a interrupt. Timer System Control Register 2 (TSCR2) Module Base + 0x000D 7 R W Reset TOI 0 6 5 4 0 0 0 0 0 0 3 2 1 0 RESERVED PR2 PR1 PR0 0 0 0 0 = Unimplemented or Reserved Figure 12-15. Timer System Control Register 2 (TSCR2)s12tim16b4c Read: Anytime Write: Anytime. Table 12-11. TSCR2 Field Descriptions Field 7 TOI 2:0 PR[2:0] Description Timer Overflow Interrupt Enable 0 Interrupt inhibited. 1 Hardware interrupt requested when TOF flag set. Timer Prescaler Select -- These three bits select the frequency of the timer prescaler clock derived from the Core Clock as shown in Table 12-12. MC9S12ZVC Family Reference Manual , Rev. 1.9 396 NXP Semiconductors Chapter 12 Timer Module (TIM16B4CV3) Block Description Table 12-12. Timer Clock Selection PR2 PR1 PR0 Timer Clock 0 0 0 Core Clock / 1 0 0 1 Core Clock / 2 0 1 0 Core Clock / 4 0 1 1 Core Clock / 8 1 0 0 Core Clock / 16 1 0 1 Core Clock / 32 1 1 0 Core Clock / 64 1 1 1 Core Clock / 128 NOTE The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter stages equal zero. 12.3.2.10 Main Timer Interrupt Flag 1 (TFLG1) Module Base + 0x000E R W Reset 7 6 5 4 3 2 1 0 RESERVED RESERVED RESERVED RESERVED C3F C2F C1F C0F 0 0 0 0 0 0 0 0 Figure 12-16. Main Timer Interrupt Flag 1 (TFLG1) Read: Anytime Write: Used in the clearing mechanism (set bits cause corresponding bits to be cleared). Writing a zero will not affect current status of the bit. Table 12-13. TRLG1 Field Descriptions Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field Description 3:0 C[3:0]F Input Capture/Output Compare Channel "x" Flag -- These flags are set when an input capture or output compare event occurs. Clearing requires writing a one to the corresponding flag bit while TEN is set to one. Note: When TFFCA bit in TSCR register is set, a read from an input capture or a write into an output compare channel (0x0010-0x001F) will cause the corresponding channel flag CxF to be cleared. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 397 Chapter 12 Timer Module (TIM16B4CV3) Block Description 12.3.2.11 Main Timer Interrupt Flag 2 (TFLG2) Module Base + 0x000F 7 R W Reset TOF 0 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Unimplemented or Reserved Figure 12-17. Main Timer Interrupt Flag 2 (TFLG2) TFLG2 indicates when interrupt conditions have occurred. To clear a bit in the flag register, write the bit to one while TEN bit of TSCR1 . Read: Anytime Write: Used in clearing mechanism (set bits cause corresponding bits to be cleared). Any access to TCNT will clear TFLG2 register if the TFFCA bit in TSCR register is set. Table 12-14. TRLG2 Field Descriptions Field Description 7 TOF Timer Overflow Flag -- Set when 16-bit free-running timer overflows from 0xFFFF to 0x0000. Clearing this bit requires writing a one to bit 7 of TFLG2 register while the TEN bit of TSCR1 is set to one . MC9S12ZVC Family Reference Manual , Rev. 1.9 398 NXP Semiconductors Chapter 12 Timer Module (TIM16B4CV3) Block Description 12.3.2.12 Timer Input Capture/Output Compare Registers High and Low 0- 3(TCxH and TCxL) Module Base + 0x0010 = TC0H 0x0012 = TC1H 0x0014=TC2H 0x0016=TC3H R W 0x0018=RESERVD 0x001A=RESERVD 0x001C=RESERVD 0x001E=RESERVD 15 14 13 12 11 10 9 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 0 0 0 0 0 0 0 Reset Figure 12-18. Timer Input Capture/Output Compare Register x High (TCxH) Module Base + 0x0011 = TC0L 0x0013 = TC1L 0x0015 =TC2L 0x0017=TC3L R W Reset 0x0019 =RESERVD 0x001B=RESERVD 0x001D=RESERVD 0x001F=RESERVD 7 6 5 4 3 2 1 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Figure 12-19. Timer Input Capture/Output Compare Register x Low (TCxL) 1 This register is available only when the corresponding channel exists and is reserved if that channel does not exist. Writes to a reserved register have no functional effect. Reads from a reserved register return zeroes. Depending on the TIOS bit for the corresponding channel, these registers are used to latch the value of the free-running counter when a defined transition is sensed by the corresponding input capture edge detector or to trigger an output action for output compare. Read: Anytime Write: Anytime for output compare function.Writes to these registers have no meaning or effect during input capture. All timer input capture/output compare registers are reset to 0x0000. NOTE Read/Write access in byte mode for high byte should take place before low byte otherwise it will give a different result. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 399 Chapter 12 Timer Module (TIM16B4CV3) Block Description 12.3.2.13 Output Compare Pin Disconnect Register(OCPD) Module Base + 0x002C R W 7 6 5 4 3 2 1 0 RESERVED RESERVED RESERVED RESERVED OCPD3 OCPD2 OCPD1 OCPD0 0 0 0 0 0 0 0 0 Reset Figure 12-20. Output Compare Pin Disconnect Register (OCPD) Read: Anytime Write: Anytime All bits reset to zero. Table 12-15. OCPD Field Description Note: Writing to unavailable bits has no effect. Reading from unavailable bits return a zero. Field Description 3:0 OCPD[3:0] Output Compare Pin Disconnect Bits 0 Enables the timer channel port. Output Compare action will occur on the channel pin. These bits do not affect the input capture . 1 Disables the timer channel port. Output Compare action will not occur on the channel pin, but the output compare flag still become set. 12.3.2.14 Precision Timer Prescaler Select Register (PTPSR) Module Base + 0x002E R W Reset 7 6 5 4 3 2 1 0 PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 0 0 0 0 0 0 0 0 Figure 12-21. Precision Timer Prescaler Select Register (PTPSR) Read: Anytime Write: Anytime All bits reset to zero. ... Table 12-16. PTPSR Field Descriptions Field Description 7:0 PTPS[7:0] Precision Timer Prescaler Select Bits -- These eight bits specify the division rate of the main Timer prescaler. These are effective only when the PRNT bit of TSCR1 is set to 1. Table 12-17 shows some selection examples in this case. The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter stages equal zero. MC9S12ZVC Family Reference Manual , Rev. 1.9 400 NXP Semiconductors Chapter 12 Timer Module (TIM16B4CV3) Block Description The Prescaler can be calculated as follows depending on logical value of the PTPS[7:0] and PRNT bit: PRNT = 1 : Prescaler = PTPS[7:0] + 1 Table 12-17. Precision Timer Prescaler Selection Examples when PRNT = 1 PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 Prescale Factor 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 1 2 0 0 0 0 0 0 1 0 3 0 0 0 0 0 0 1 1 4 - - - - - - - - - - - - - - - - - - - - - - - - - - - 0 0 0 1 0 0 1 1 20 0 0 0 1 0 1 0 0 21 0 0 0 1 0 1 0 1 22 - - - - - - - - - - - - - - - - - - - - - - - - - - - 1 1 1 1 1 1 0 0 253 1 1 1 1 1 1 0 1 254 1 1 1 1 1 1 1 0 255 1 1 1 1 1 1 1 1 256 12.4 Functional Description This section provides a complete functional description of the timer TIM16B4CV3 block. Please refer to the detailed timer block diagram in Figure 12-22 as necessary. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 401 Chapter 12 Timer Module (TIM16B4CV3) Block Description PRE-PRESCALER PRNT tim source Clock PTPSR[7:0] PR[2:1:0] 1 MUX 0 PRESCALER CxI TCNT(hi):TCNT(lo) CxF 16-BIT COUNTER TOF INTERRUPT LOGIC TOI TE TOF CHANNEL 0 16-BIT COMPARATOR C0F TC0 EDG0A EDGE DETECT EDG0B C0F OM:OL0 CH. 0 CAPTURE IOC0 PIN LOGIC CH. 0COMPARE TOV0 IOC0 PIN IOC0 CHANNEL 1 16-BIT COMPARATOR C1F TC1 EDG1A EDGE DETECT EDG1B C1F OM:OL1 CH. 1 CAPTURE IOC1 PIN LOGIC CH. 1 COMPARE TOV1 IOC1 PIN IOC1 CHANNEL2 CHANNELn-1 16-BIT COMPARATOR TCn-1 EDG(n-1)A EDG(n-1)B Cn-1F Cn-1F EDGE DETECT CH.n-1 CAPTURE IOCn-1 PIN LOGIC CH. n-1COMPARE IOCn-1 PIN OM:OLn-1 TOVn-1 IOCn-1 n is channels number. Figure 12-22. Detailed Timer Block Diagram 12.4.1 Prescaler The prescaler divides the Core clock by 1, 2, 4, 8, 16, 32, 64 or 128. The prescaler select bits, PR[2:0], select the prescaler divisor. PR[2:0] are in timer system control register 2 (TSCR2). The prescaler divides the Core clock by a prescalar value. Prescaler select bits PR[2:0] of in timer system control register 2 (TSCR2) are set to define a prescalar value that generates a divide by 1, 2, 4, 8, 16, 32, 64 and 128 when the PRNT bit in TSCR1 is disabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 402 NXP Semiconductors Chapter 12 Timer Module (TIM16B4CV3) Block Description By enabling the PRNT bit of the TSCR1 register, the performance of the timer can be enhanced. In this case, it is possible to set additional prescaler settings for the main timer counter in the present timer by using PTPSR[7:0] bits of PTPSR register generating divide by 1, 2, 3, 4,....20, 21, 22, 23,......255, or 256. 12.4.2 Input Capture Clearing the I/O (input/output) select bit, IOSx, configures channel x as an input capture channel. The input capture function captures the time at which an external event occurs. When an active edge occurs on the pin of an input capture channel, the timer transfers the value in the timer counter into the timer channel registers, TCx. The minimum pulse width for the input capture input is greater than two Core clocks. An input capture on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt requests. Timer module must stay enabled (TEN bit of TSCR1 register must be set to one) while clearing CxF (writing one to CxF). 12.4.3 Output Compare Setting the I/O select bit, IOSx, configures channel x when available as an output compare channel. The output compare function can generate a periodic pulse with a programmable polarity, duration, and frequency. When the timer counter reaches the value in the channel registers of an output compare channel, the timer can set, clear, or toggle the channel pin if the corresponding OCPDx bit is set to zero. An output compare on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt requests. Timer module must stay enabled (TEN bit of TSCR1 register must be set to one) while clearing CxF (writing one to CxF). The output mode and level bits, OMx and OLx, select set, clear, toggle on output compare. Clearing both OMx and OLx results in no output compare action on the output compare channel pin. Setting a force output compare bit, FOCx, causes an output compare on channel x. A forced output compare does not set the channel flag. Writing to the timer port bit of an output compare pin does not affect the pin state. The value written is stored in an internal latch. When the pin becomes available for general-purpose output, the last value written to the bit appears at the pin. 12.4.3.1 OC Channel Initialization The internal register whose output drives OCx can be programmed before the timer drives OCx. The desired state can be programmed to this internal register by writing a one to CFORCx bit with TIOSx, OCPDx and TEN bits set to one. Set OCx: Write a 1 to FOCx while TEN=1, IOSx=1, OMx=1, OLx=1 and OCPDx=1 Clear OCx: Write a 1 to FOCx while TEN=1, IOSx=1, OMx=1, OLx=0 and OCPDx=1 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 403 Chapter 12 Timer Module (TIM16B4CV3) Block Description Setting OCPDx to zero allows the internal register to drive the programmed state to OCx. This allows a glitch free switch over of port from general purpose I/O to timer output once the OCPDx bit is set to zero. 12.5 Resets The reset state of each individual bit is listed within Section 12.3, "Memory Map and Register Definition" which details the registers and their bit fields 12.6 Interrupts This section describes interrupts originated by the TIM16B4CV3 block. Table 12-18 lists the interrupts generated by the TIM16B4CV3 to communicate with the MCU. Table 12-18. TIM16B4CV3 Interrupts Interrupt Offset Vector Priority Source Description C[3:0]F -- -- -- Timer Channel 3-0 Active high timer channel interrupts 3-0 TOF -- -- -- Timer Overflow Timer Overflow interrupt The TIM16B4CV3 could use up to 5 interrupt vectors. The interrupt vector offsets and interrupt numbers are chip dependent. 12.6.1 Channel [3:0] Interrupt (C[3:0]F) This active high outputs will be asserted by the module to request a timer channel 7 - 0 interrupt. The TIM block only generates the interrupt and does not service it. Only bits related to implemented channels are valid. 12.6.2 Timer Overflow Interrupt (TOF) This active high output will be asserted by the module to request a timer overflow interrupt. The TIM block only generates the interrupt and does not service it. MC9S12ZVC Family Reference Manual , Rev. 1.9 404 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Table 13-1. Revision History Revision Number Revision Date Sections Affected v02.00 Feb. 20, 2009 All 13.1 Description of Changes Initial revision of scalable PWM. Started from pwm_8b8c (v01.08). Introduction The Version 2 of S12 PWM module is a channel scalable and optimized implementation of S12 PWM8B8C Version 1. The channel is scalable in pairs from PWM0 to PWM7 and the available channel number is 2, 4, 6 and 8. The shutdown feature has been removed and the flexibility to select one of four clock sources per channel has improved. If the corresponding channels exist and shutdown feature is not used, the Version 2 is fully software compatible to Version 1. 13.1.1 Features The scalable PWM block includes these distinctive features: * Up to eight independent PWM channels, scalable in pairs (PWM0 to PWM7) * Available channel number could be 2, 4, 6, 8 (refer to device specification for exact number) * Programmable period and duty cycle for each channel * Dedicated counter for each PWM channel * Programmable PWM enable/disable for each channel * Software selection of PWM duty pulse polarity for each channel * Period and duty cycle are double buffered. Change takes effect when the end of the effective period is reached (PWM counter reaches zero) or when the channel is disabled. * Programmable center or left aligned outputs on individual channels * Up to eight 8-bit channel or four 16-bit channel PWM resolution * Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies * Programmable clock select logic 13.1.2 Modes of Operation There is a software programmable option for low power consumption in wait mode that disables the input clock to the prescaler. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 405 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) In freeze mode there is a software programmable option to disable the input clock to the prescaler. This is useful for emulation. Wait: The prescaler keeps on running, unless PSWAI in PWMCTL is set to 1. Freeze: The prescaler keeps on running, unless PFRZ in PWMCTL is set to 1. 13.1.3 Block Diagram Figure 13-1 shows the block diagram for the 8-bit up to 8-channel scalable PWM block. PWM8B8C PWM Channels Channel 7 Period and Duty Counter Channel 6 Clock Clock Select Period and Duty PWM Clock Counter Channel 5 Period and Duty Counter PWM7 PWM6 PWM5 Control Channel 4 Period and Duty Counter Channel 3 Period and Duty Enable Counter Channel 2 Polarity Period and Duty Alignment Counter Channel 1 Period and Duty Counter PWM4 PWM3 PWM2 PWM1 Channel 0 Period and Duty Counter PWM0 Maximum possible channels, scalable in pairs from PWM0 to PWM7. Figure 13-1. Scalable PWM Block Diagram 13.2 External Signal Description The scalable PWM module has a selected number of external pins. Refer to device specification for exact number. MC9S12ZVC Family Reference Manual , Rev. 1.9 406 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) 13.2.1 PWM7 - PWM0 -- PWM Channel 7 - 0 Those pins serve as waveform output of PWM channel 7 - 0. 13.3 Memory Map and Register Definition 13.3.1 Module Memory Map This section describes the content of the registers in the scalable PWM module. The base address of the scalable PWM module is determined at the MCU level when the MCU is defined. The register decode map is fixed and begins at the first address of the module address offset. The figure below shows the registers associated with the scalable PWM and their relative offset from the base address. The register detail description follows the order they appear in the register map. Reserved bits within a register will always read as 0 and the write will be unimplemented. Unimplemented functions are indicated by shading the bit. NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level. 13.3.2 Register Descriptions This section describes in detail all the registers and register bits in the scalable PWM module. Register Name 0x0000 PWME1 0x0001 PWMPOL1 0x0002 PWMCLK1 R W R W R W 0x0003 R PWMPRCLK W 0x0004 PWMCAE1 R W 0x0005 PWMCTL1 W R Bit 7 6 5 4 3 2 1 Bit 0 PWME7 PWME6 PWME5 PWME4 PWME3 PWME2 PWME1 PWME0 PPOL7 PPOL6 PPOL5 PPOL4 PPOL3 PPOL2 PPOL1 PPOL0 PCLK7 PCLKL6 PCLK5 PCLK4 PCLK3 PCLK2 PCLK1 PCLK0 PCKB2 PCKB1 PCKB0 PCKA2 PCKA1 PCKA0 CAE7 CAE6 CAE5 CAE4 CAE3 CAE2 CAE1 CAE0 CON67 CON45 CON23 CON01 PSWAI PFRZ 0 0 0 0 = Unimplemented or Reserved Figure 13-2. The scalable PWM Register Summary (Sheet 1 of 4) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 407 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Register Name Bit 7 6 5 4 3 2 1 Bit 0 PCLKAB6 PCLKAB5 PCLKAB4 PCLKAB3 PCLKAB2 PCLKAB1 PCLKAB0 0 0 0 0 0 0 0 0 0x0008 R PWMSCLA W Bit 7 6 5 4 3 2 1 Bit 0 0x0009 PWMSCLB Bit 7 6 5 4 3 2 1 Bit 0 0x000A R RESERVED W 0 0 0 0 0 0 0 0 0x000B R RESERVED W 0 0 0 0 0 0 0 0 0x000C R PWMCNT02 W Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R 0x000D PWMCNT12 W Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R 0x000E PWMCNT22 W Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R 0x000F PWMCNT32 W Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R 0x0010 PWMCNT42 W Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R 0x0011 PWMCNT52 W Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R 0x0012 PWMCNT62 W Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R 0x0013 PWMCNT72 W Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 R 0x0006 PWMCLKAB W PCLKAB7 1 0x0007 R RESERVED W R W R 0x0014 PWMPER02 W = Unimplemented or Reserved Figure 13-2. The scalable PWM Register Summary (Sheet 2 of 4) MC9S12ZVC Family Reference Manual , Rev. 1.9 408 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Register Name Bit 7 6 5 4 3 2 1 Bit 0 R 0x0015 PWMPER12 W Bit 7 6 5 4 3 2 1 Bit 0 0x0016 R PWMPER22 W Bit 7 6 5 4 3 2 1 Bit 0 0x0017 R PWMPER32 W Bit 7 6 5 4 3 2 1 Bit 0 0x0018 R PWMPER42 W Bit 7 6 5 4 3 2 1 Bit 0 0x0019 R PWMPER52 W Bit 7 6 5 4 3 2 1 Bit 0 0x001A R PWMPER62 W Bit 7 6 5 4 3 2 1 Bit 0 0x001B R PWMPER72 W Bit 7 6 5 4 3 2 1 Bit 0 0x001C R PWMDTY02 W Bit 7 6 5 4 3 2 1 Bit 0 0x001D R PWMDTY12 W Bit 7 6 5 4 3 2 1 Bit 0 0x001E R PWMDTY22 W Bit 7 6 5 4 3 2 1 Bit 0 0x001F R PWMDTY32 W Bit 7 6 5 4 3 2 1 Bit 0 0x0010 R PWMDTY42 W Bit 7 6 5 4 3 2 1 Bit 0 0x0021 R PWMDTY52 W Bit 7 6 5 4 3 2 1 Bit 0 0x0022 R PWMDTY62 W Bit 7 6 5 4 3 2 1 Bit 0 0x0023 R PWMDTY72 W Bit 7 6 5 4 3 2 1 Bit 0 = Unimplemented or Reserved Figure 13-2. The scalable PWM Register Summary (Sheet 3 of 4) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 409 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Register Name Bit 7 6 5 4 3 2 1 Bit 0 0x0024 R RESERVED W 0 0 0 0 0 0 0 0 0x0025 R RESERVED W 0 0 0 0 0 0 0 0 0x0026 R RESERVED W 0 0 0 0 0 0 0 0 0x0027 R RESERVED W 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 13-2. The scalable PWM Register Summary (Sheet 4 of 4) 1 2 The related bit is available only if corresponding channel exists. The register is available only if corresponding channel exists. 13.3.2.1 PWM Enable Register (PWME) Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx bits are set (PWMEx = 1), the associated PWM output is enabled immediately. However, the actual PWM waveform is not available on the associated PWM output until its clock source begins its next cycle due to the synchronization of PWMEx and the clock source. NOTE The first PWM cycle after enabling the channel can be irregular. An exception to this is when channels are concatenated. Once concatenated mode is enabled (CONxx bits set in PWMCTL register), enabling/disabling the corresponding 16-bit PWM channel is controlled by the low order PWMEx bit. In this case, the high order bytes PWMEx bits have no effect and their corresponding PWM output lines are disabled. While in run mode, if all existing PWM channels are disabled (PWMEx-0 = 0), the prescaler counter shuts off for power savings. Module Base + 0x0000 R W Reset 7 6 5 4 3 2 1 0 PWME7 PWME6 PWME5 PWME4 PWME3 PWME2 PWME1 PWME0 0 0 0 0 0 0 0 0 Figure 13-3. PWM Enable Register (PWME) Read: Anytime Write: Anytime MC9S12ZVC Family Reference Manual , Rev. 1.9 410 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Table 13-2. PWME Field Descriptions Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from unavailable bits return a zero Field Description 7 PWME7 Pulse Width Channel 7 Enable 0 Pulse width channel 7 is disabled. 1 Pulse width channel 7 is enabled. The pulse modulated signal becomes available at PWM output bit 7 when its clock source begins its next cycle. 6 PWME6 Pulse Width Channel 6 Enable 0 Pulse width channel 6 is disabled. 1 Pulse width channel 6 is enabled. The pulse modulated signal becomes available at PWM output bit 6 when its clock source begins its next cycle. If CON67=1, then bit has no effect and PWM output line 6 is disabled. 5 PWME5 Pulse Width Channel 5 Enable 0 Pulse width channel 5 is disabled. 1 Pulse width channel 5 is enabled. The pulse modulated signal becomes available at PWM output bit 5 when its clock source begins its next cycle. 4 PWME4 Pulse Width Channel 4 Enable 0 Pulse width channel 4 is disabled. 1 Pulse width channel 4 is enabled. The pulse modulated signal becomes available at PWM, output bit 4 when its clock source begins its next cycle. If CON45 = 1, then bit has no effect and PWM output line 4 is disabled. 3 PWME3 Pulse Width Channel 3 Enable 0 Pulse width channel 3 is disabled. 1 Pulse width channel 3 is enabled. The pulse modulated signal becomes available at PWM, output bit 3 when its clock source begins its next cycle. 2 PWME2 Pulse Width Channel 2 Enable 0 Pulse width channel 2 is disabled. 1 Pulse width channel 2 is enabled. The pulse modulated signal becomes available at PWM, output bit 2 when its clock source begins its next cycle. If CON23 = 1, then bit has no effect and PWM output line 2 is disabled. 1 PWME1 Pulse Width Channel 1 Enable 0 Pulse width channel 1 is disabled. 1 Pulse width channel 1 is enabled. The pulse modulated signal becomes available at PWM, output bit 1 when its clock source begins its next cycle. 0 PWME0 Pulse Width Channel 0 Enable 0 Pulse width channel 0 is disabled. 1 Pulse width channel 0 is enabled. The pulse modulated signal becomes available at PWM, output bit 0 when its clock source begins its next cycle. If CON01 = 1, then bit has no effect and PWM output line 0 is disabled. 13.3.2.2 PWM Polarity Register (PWMPOL) The starting polarity of each PWM channel waveform is determined by the associated PPOLx bit in the PWMPOL register. If the polarity bit is one, the PWM channel output is high at the beginning of the cycle and then goes low when the duty count is reached. Conversely, if the polarity bit is zero, the output starts low and then goes high when the duty count is reached. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 411 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Module Base + 0x0001 R W Reset 7 6 5 4 3 2 1 0 PPOL7 PPOL6 PPOL5 PPOL4 PPOL3 PPOL2 PPOL1 PPOL0 0 0 0 0 0 0 0 0 Figure 13-4. PWM Polarity Register (PWMPOL) Read: Anytime Write: Anytime NOTE PPOLx register bits can be written anytime. If the polarity is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition Table 13-3. PWMPOL Field Descriptions Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from unavailable bits return a zero Field 7-0 PPOL[7:0] 13.3.2.3 Description Pulse Width Channel 7-0 Polarity Bits 0 PWM channel 7-0 outputs are low at the beginning of the period, then go high when the duty count is reached. 1 PWM channel 7-0 outputs are high at the beginning of the period, then go low when the duty count is reached. PWM Clock Select Register (PWMCLK) Each PWM channel has a choice of four clocks to use as the clock source for that channel as described below. Module Base + 0x0002 R W Reset 7 6 5 4 3 2 1 0 PCLK7 PCLKL6 PCLK5 PCLK4 PCLK3 PCLK2 PCLK1 PCLK0 0 0 0 0 0 0 0 0 Figure 13-5. PWM Clock Select Register (PWMCLK) Read: Anytime Write: Anytime NOTE Register bits PCLK0 to PCLK7 can be written anytime. If a clock select is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition. MC9S12ZVC Family Reference Manual , Rev. 1.9 412 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Table 13-4. PWMCLK Field Descriptions Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from unavailable bits return a zero Field 7-0 PCLK[7:0] Description Pulse Width Channel 7-0 Clock Select 0 Clock A or B is the clock source for PWM channel 7-0, as shown in Table 13-5 and Table 13-6. 1 Clock SA or SB is the clock source for PWM channel 7-0, as shown in Table 13-5 and Table 13-6. The clock source of each PWM channel is determined by PCLKx bits in PWMCLK and PCLKABx bits in PWMCLKAB (see Section 13.3.2.7, "PWM Clock A/B Select Register (PWMCLKAB)). For Channel 0, 1, 4, 5, the selection is shown in Table 13-5; For Channel 2, 3, 6, 7, the selection is shown in Table 13-6. Table 13-5. PWM Channel 0, 1, 4, 5 Clock Source Selection PCLKAB[0,1,4,5] PCLK[0,1,4,5] Clock Source Selection 0 0 1 1 0 1 0 1 Clock A Clock SA Clock B Clock SB Table 13-6. PWM Channel 2, 3, 6, 7 Clock Source Selection 13.3.2.4 PCLKAB[2,3,6,7] PCLK[2,3,6,7] Clock Source Selection 0 0 1 1 0 1 0 1 Clock B Clock SB Clock A Clock SA PWM Prescale Clock Select Register (PWMPRCLK) This register selects the prescale clock source for clocks A and B independently. Module Base + 0x0003 7 R 6 0 W Reset 0 5 4 PCKB2 PCKB1 PCKB0 0 0 0 3 0 2 1 0 PCKA2 PCKA1 PCKA0 0 0 0 0 = Unimplemented or Reserved Figure 13-6. PWM Prescale Clock Select Register (PWMPRCLK) Read: Anytime Write: Anytime NOTE PCKB2-0 and PCKA2-0 register bits can be written anytime. If the clock pre-scale is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 413 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Table 13-7. PWMPRCLK Field Descriptions Field Description 6-4 PCKB[2:0] Prescaler Select for Clock B -- Clock B is one of two clock sources which can be used for all channels. These three bits determine the rate of clock B, as shown in Table 13-8. 2-0 PCKA[2:0] Prescaler Select for Clock A -- Clock A is one of two clock sources which can be used for all channels. These three bits determine the rate of clock A, as shown in Table 13-8. s Table 13-8. Clock A or Clock B Prescaler Selects 13.3.2.5 PCKA/B2 PCKA/B1 PCKA/B0 Value of Clock A/B 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 PWM clock PWM clock / 2 PWM clock / 4 PWM clock / 8 PWM clock / 16 PWM clock / 32 PWM clock / 64 PWM clock / 128 PWM Center Align Enable Register (PWMCAE) The PWMCAE register contains eight control bits for the selection of center aligned outputs or left aligned outputs for each PWM channel. If the CAEx bit is set to a one, the corresponding PWM output will be center aligned. If the CAEx bit is cleared, the corresponding PWM output will be left aligned. See Section 13.4.2.5, "Left Aligned Outputs" and Section 13.4.2.6, "Center Aligned Outputs" for a more detailed description of the PWM output modes. Module Base + 0x0004 R W Reset 7 6 5 4 3 2 1 0 CAE7 CAE6 CAE5 CAE4 CAE3 CAE2 CAE1 CAE0 0 0 0 0 0 0 0 0 Figure 13-7. PWM Center Align Enable Register (PWMCAE) Read: Anytime Write: Anytime NOTE Write these bits only when the corresponding channel is disabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 414 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Table 13-9. PWMCAE Field Descriptions Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from unavailable bits return a zero Field 7-0 CAE[7:0] 13.3.2.6 Description Center Aligned Output Modes on Channels 7-0 0 Channels 7-0 operate in left aligned output mode. 1 Channels 7-0 operate in center aligned output mode. PWM Control Register (PWMCTL) The PWMCTL register provides for various control of the PWM module. Module Base + 0x0005 7 R W Reset 6 CON67 0 5 4 3 2 CON45 CON23 CON01 PSWAI PFRZ 0 0 0 0 0 1 0 0 0 0 0 = Unimplemented or Reserved Figure 13-8. PWM Control Register (PWMCTL) Read: Anytime Write: Anytime There are up to four control bits for concatenation, each of which is used to concatenate a pair of PWM channels into one 16-bit channel. If the corresponding channels do not exist on a particular derivative, then writes to these bits have no effect and reads will return zeroes. When channels 6 and 7are concatenated, channel 6 registers become the high order bytes of the double byte channel. When channels 4 and 5 are concatenated, channel 4 registers become the high order bytes of the double byte channel. When channels 2 and 3 are concatenated, channel 2 registers become the high order bytes of the double byte channel. When channels 0 and 1 are concatenated, channel 0 registers become the high order bytes of the double byte channel. See Section 13.4.2.7, "PWM 16-Bit Functions" for a more detailed description of the concatenation PWM Function. NOTE Change these bits only when both corresponding channels are disabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 415 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Table 13-10. PWMCTL Field Descriptions Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from unavailable bits return a zero Field Description 7 CON67 Concatenate Channels 6 and 7 0 Channels 6 and 7 are separate 8-bit PWMs. 1 Channels 6 and 7 are concatenated to create one 16-bit PWM channel. Channel 6 becomes the high order byte and channel 7 becomes the low order byte. Channel 7 output pin is used as the output for this 16-bit PWM (bit 7 of port PWMP). Channel 7 clock select control-bit determines the clock source, channel 7 polarity bit determines the polarity, channel 7 enable bit enables the output and channel 7 center aligned enable bit determines the output mode. 6 CON45 Concatenate Channels 4 and 5 0 Channels 4 and 5 are separate 8-bit PWMs. 1 Channels 4 and 5 are concatenated to create one 16-bit PWM channel. Channel 4 becomes the high order byte and channel 5 becomes the low order byte. Channel 5 output pin is used as the output for this 16-bit PWM (bit 5 of port PWMP). Channel 5 clock select control-bit determines the clock source, channel 5 polarity bit determines the polarity, channel 5 enable bit enables the output and channel 5 center aligned enable bit determines the output mode. 5 CON23 Concatenate Channels 2 and 3 0 Channels 2 and 3 are separate 8-bit PWMs. 1 Channels 2 and 3 are concatenated to create one 16-bit PWM channel. Channel 2 becomes the high order byte and channel 3 becomes the low order byte. Channel 3 output pin is used as the output for this 16-bit PWM (bit 3 of port PWMP). Channel 3 clock select control-bit determines the clock source, channel 3 polarity bit determines the polarity, channel 3 enable bit enables the output and channel 3 center aligned enable bit determines the output mode. 4 CON01 Concatenate Channels 0 and 1 0 Channels 0 and 1 are separate 8-bit PWMs. 1 Channels 0 and 1 are concatenated to create one 16-bit PWM channel. Channel 0 becomes the high order byte and channel 1 becomes the low order byte. Channel 1 output pin is used as the output for this 16-bit PWM (bit 1 of port PWMP). Channel 1 clock select control-bit determines the clock source, channel 1 polarity bit determines the polarity, channel 1 enable bit enables the output and channel 1 center aligned enable bit determines the output mode. 3 PSWAI PWM Stops in Wait Mode -- Enabling this bit allows for lower power consumption in wait mode by disabling the input clock to the prescaler. 0 Allow the clock to the prescaler to continue while in wait mode. 1 Stop the input clock to the prescaler whenever the MCU is in wait mode. 2 PFRZ PWM Counters Stop in Freeze Mode -- In freeze mode, there is an option to disable the input clock to the prescaler by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze mode, the input clock to the prescaler is disabled. This feature is useful during emulation as it allows the PWM function to be suspended. In this way, the counters of the PWM can be stopped while in freeze mode so that once normal program flow is continued, the counters are re-enabled to simulate real-time operations. Since the registers can still be accessed in this mode, to re-enable the prescaler clock, either disable the PFRZ bit or exit freeze mode. 0 Allow PWM to continue while in freeze mode. 1 Disable PWM input clock to the prescaler whenever the part is in freeze mode. This is useful for emulation. 13.3.2.7 PWM Clock A/B Select Register (PWMCLKAB) Each PWM channel has a choice of four clocks to use as the clock source for that channel as described below. MC9S12ZVC Family Reference Manual , Rev. 1.9 416 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Module Base + 0x00006 R W 7 6 5 4 3 2 1 0 PCLKAB7 PCLKAB6 PCLKAB5 PCLKAB4 PCLKAB3 PCLKAB2 PCLKAB1 PCLKAB0 0 0 0 0 0 0 0 0 Reset Figure 13-9. PWM Clock Select Register (PWMCLK) Read: Anytime Write: Anytime NOTE Register bits PCLKAB0 to PCLKAB7 can be written anytime. If a clock select is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition. Table 13-11. PWMCLK Field Descriptions Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from unavailable bits return a zero Field Description 7 PCLKAB7 Pulse Width Channel 7 Clock A/B Select 0 Clock B or SB is the clock source for PWM channel 7, as shown in Table 13-6. 1 Clock A or SA is the clock source for PWM channel 7, as shown in Table 13-6. 6 PCLKAB6 Pulse Width Channel 6 Clock A/B Select 0 Clock B or SB is the clock source for PWM channel 6, as shown in Table 13-6. 1 Clock A or SA is the clock source for PWM channel 6, as shown in Table 13-6. 5 PCLKAB5 Pulse Width Channel 5 Clock A/B Select 0 Clock A or SA is the clock source for PWM channel 5, as shown in Table 13-5. 1 Clock B or SB is the clock source for PWM channel 5, as shown in Table 13-5. 4 PCLKAB4 Pulse Width Channel 4 Clock A/B Select 0 Clock A or SA is the clock source for PWM channel 4, as shown in Table 13-5. 1 Clock B or SB is the clock source for PWM channel 4, as shown in Table 13-5. 3 PCLKAB3 Pulse Width Channel 3 Clock A/B Select 0 Clock B or SB is the clock source for PWM channel 3, as shown in Table 13-6. 1 Clock A or SA is the clock source for PWM channel 3, as shown in Table 13-6. 2 PCLKAB2 Pulse Width Channel 2 Clock A/B Select 0 Clock B or SB is the clock source for PWM channel 2, as shown in Table 13-6. 1 Clock A or SA is the clock source for PWM channel 2, as shown in Table 13-6. 1 PCLKAB1 Pulse Width Channel 1 Clock A/B Select 0 Clock A or SA is the clock source for PWM channel 1, as shown in Table 13-5. 1 Clock B or SB is the clock source for PWM channel 1, as shown in Table 13-5. 0 PCLKAB0 Pulse Width Channel 0 Clock A/B Select 0 Clock A or SA is the clock source for PWM channel 0, as shown in Table 13-5. 1 Clock B or SB is the clock source for PWM channel 0, as shown in Table 13-5. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 417 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) The clock source of each PWM channel is determined by PCLKx bits in PWMCLK (see Section 13.3.2.3, "PWM Clock Select Register (PWMCLK)) and PCLKABx bits in PWMCLKAB as shown in Table 13-5 and Table 13-6. 13.3.2.8 PWM Scale A Register (PWMSCLA) PWMSCLA is the programmable scale value used in scaling clock A to generate clock SA. Clock SA is generated by taking clock A, dividing it by the value in the PWMSCLA register and dividing that by two. Clock SA = Clock A / (2 * PWMSCLA) NOTE When PWMSCLA = $00, PWMSCLA value is considered a full scale value of 256. Clock A is thus divided by 512. Any value written to this register will cause the scale counter to load the new scale value (PWMSCLA). Module Base + 0x0008 R W Reset 7 6 5 4 3 2 1 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 Figure 13-10. PWM Scale A Register (PWMSCLA) Read: Anytime Write: Anytime (causes the scale counter to load the PWMSCLA value) 13.3.2.9 PWM Scale B Register (PWMSCLB) PWMSCLB is the programmable scale value used in scaling clock B to generate clock SB. Clock SB is generated by taking clock B, dividing it by the value in the PWMSCLB register and dividing that by two. Clock SB = Clock B / (2 * PWMSCLB) NOTE When PWMSCLB = $00, PWMSCLB value is considered a full scale value of 256. Clock B is thus divided by 512. Any value written to this register will cause the scale counter to load the new scale value (PWMSCLB). Module Base + 0x0009 R W Reset 7 6 5 4 3 2 1 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 Figure 13-11. PWM Scale B Register (PWMSCLB) Read: Anytime Write: Anytime (causes the scale counter to load the PWMSCLB value). MC9S12ZVC Family Reference Manual , Rev. 1.9 418 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) 13.3.2.10 PWM Channel Counter Registers (PWMCNTx) Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source. The counter can be read at any time without affecting the count or the operation of the PWM channel. In left aligned output mode, the counter counts from 0 to the value in the period register - 1. In center aligned output mode, the counter counts from 0 up to the value in the period register and then back down to 0. Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up, the immediate load of both duty and period registers with values from the buffers, and the output to change according to the polarity bit. The counter is also cleared at the end of the effective period (see Section 13.4.2.5, "Left Aligned Outputs" and Section 13.4.2.6, "Center Aligned Outputs" for more details). When the channel is disabled (PWMEx = 0), the PWMCNTx register does not count. When a channel becomes enabled (PWMEx = 1), the associated PWM counter starts at the count in the PWMCNTx register. For more detailed information on the operation of the counters, see Section 13.4.2.4, "PWM Timer Counters". In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or high order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by 16-bit access to maintain data coherency. NOTE Writing to the counter while the channel is enabled can cause an irregular PWM cycle to occur. Module Base + 0x000C = PWMCNT0, 0x000D = PWMCNT1, 0x000E = PWMCNT2, 0x000F = PWMCNT3 Module Base + 0x0010 = PWMCNT4, 0x0011 = PWMCNT5, 0x0012 = PWMCNT6, 0x0013 = PWMCNT7 7 6 5 4 3 2 1 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 Reset 0 0 0 0 0 0 0 0 Figure 13-12. PWM Channel Counter Registers (PWMCNTx) 1 This register is available only when the corresponding channel exists and is reserved if that channel does not exist. Writes to a reserved register have no functional effect. Reads from a reserved register return zeroes. Read: Anytime Write: Anytime (any value written causes PWM counter to be reset to $00). 13.3.2.11 PWM Channel Period Registers (PWMPERx) There is a dedicated period register for each channel. The value in this register determines the period of the associated PWM channel. The period registers for each channel are double buffered so that if they change while the channel is enabled, the change will NOT take effect until one of the following occurs: * The effective period ends MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 419 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) * * The counter is written (counter resets to $00) The channel is disabled In this way, the output of the PWM will always be either the old waveform or the new waveform, not some variation in between. If the channel is not enabled, then writes to the period register will go directly to the latches as well as the buffer. NOTE Reads of this register return the most recent value written. Reads do not necessarily return the value of the currently active period due to the double buffering scheme. See Section 13.4.2.3, "PWM Period and Duty" for more information. To calculate the output period, take the selected clock source period for the channel of interest (A, B, SA, or SB) and multiply it by the value in the period register for that channel: * * Left aligned output (CAEx = 0) PWMx Period = Channel Clock Period * PWMPERx Center Aligned Output (CAEx = 1) PWMx Period = Channel Clock Period * (2 * PWMPERx) For boundary case programming values, please refer to Section 13.4.2.8, "PWM Boundary Cases". Module Base + 0x0014 = PWMPER0, 0x0015 = PWMPER1, 0x0016 = PWMPER2, 0x0017 = PWMPER3 Module Base + 0x0018 = PWMPER4, 0x0019 = PWMPER5, 0x001A = PWMPER6, 0x001B = PWMPER7 R W Reset 7 6 5 4 3 2 1 0 Bit 7 6 5 4 3 2 1 Bit 0 1 1 1 1 1 1 1 1 Figure 13-13. PWM Channel Period Registers (PWMPERx) 1 This register is available only when the corresponding channel exists and is reserved if that channel does not exist. Writes to a reserved register have no functional effect. Reads from a reserved register return zeroes. Read: Anytime Write: Anytime 13.3.2.12 PWM Channel Duty Registers (PWMDTYx) There is a dedicated duty register for each channel. The value in this register determines the duty of the associated PWM channel. The duty value is compared to the counter and if it is equal to the counter value a match occurs and the output changes state. The duty registers for each channel are double buffered so that if they change while the channel is enabled, the change will NOT take effect until one of the following occurs: * The effective period ends * The counter is written (counter resets to $00) MC9S12ZVC Family Reference Manual , Rev. 1.9 420 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) * The channel is disabled In this way, the output of the PWM will always be either the old duty waveform or the new duty waveform, not some variation in between. If the channel is not enabled, then writes to the duty register will go directly to the latches as well as the buffer. NOTE Reads of this register return the most recent value written. Reads do not necessarily return the value of the currently active duty due to the double buffering scheme. See Section 13.4.2.3, "PWM Period and Duty" for more information. NOTE Depending on the polarity bit, the duty registers will contain the count of either the high time or the low time. If the polarity bit is one, the output starts high and then goes low when the duty count is reached, so the duty registers contain a count of the high time. If the polarity bit is zero, the output starts low and then goes high when the duty count is reached, so the duty registers contain a count of the low time. To calculate the output duty cycle (high time as a% of period) for a particular channel: * Polarity = 0 (PPOL x =0) Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100% * Polarity = 1 (PPOLx = 1) Duty Cycle = [PWMDTYx / PWMPERx] * 100% For boundary case programming values, please refer to Section 13.4.2.8, "PWM Boundary Cases". Module Base + 0x001C = PWMDTY0, 0x001D = PWMDTY1, 0x001E = PWMDTY2, 0x001F = PWMDTY3 Module Base + 0x0020 = PWMDTY4, 0x0021 = PWMDTY5, 0x0022 = PWMDTY6, 0x0023 = PWMDTY7 R W Reset 7 6 5 4 3 2 1 0 Bit 7 6 5 4 3 2 1 Bit 0 1 1 1 1 1 1 1 1 Figure 13-14. PWM Channel Duty Registers (PWMDTYx) 1 This register is available only when the corresponding channel exists and is reserved if that channel does not exist. Writes to a reserved register have no functional effect. Reads from a reserved register return zeroes. Read: Anytime Write: Anytime MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 421 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) 13.4 13.4.1 Functional Description PWM Clock Select There are four available clocks: clock A, clock B, clock SA (scaled A), and clock SB (scaled B). These four clocks are based on the PWM clock. Clock A and B can be software selected to be 1, 1/2, 1/4, 1/8,..., 1/64, 1/128 times the PWM clock. Clock SA uses clock A as an input and divides it further with a reloadable counter. Similarly, clock SB uses clock B as an input and divides it further with a reloadable counter. The rates available for clock SA are software selectable to be clock A divided by 2, 4, 6, 8,..., or 512 in increments of divide by 2. Similar rates are available for clock SB. Each PWM channel has the capability of selecting one of four clocks, clock A, Clock B, clock SA or clock SB. The block diagram in Figure 13-15 shows the four different clocks and how the scaled clocks are created. 13.4.1.1 Prescale The input clock to the PWM prescaler is the PWM clock. It can be disabled whenever the part is in freeze mode by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze mode (freeze mode signal active) the input clock to the prescaler is disabled. This is useful for emulation in order to freeze the PWM. The input clock can also be disabled when all available PWM channels are disabled (PWMEx-0 = 0). This is useful for reducing power by disabling the prescale counter. Clock A and clock B are scaled values of the input clock. The value is software selectable for both clock A and clock B and has options of 1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64, or 1/128 times the PWM clock. The value selected for clock A is determined by the PCKA2, PCKA1, PCKA0 bits in the PWMPRCLK register. The value selected for clock B is determined by the PCKB2, PCKB1, PCKB0 bits also in the PWMPRCLK register. 13.4.1.2 Clock Scale The scaled A clock uses clock A as an input and divides it further with a user programmable value and then divides this by 2. The scaled B clock uses clock B as an input and divides it further with a user programmable value and then divides this by 2. The rates available for clock SA are software selectable to be clock A divided by 2, 4, 6, 8,..., or 512 in increments of divide by 2. Similar rates are available for clock SB. MC9S12ZVC Family Reference Manual , Rev. 1.9 422 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Clock A PCKA2 PCKA1 PCKA0 Clock A/2, A/4, A/6,....A/512 M U X Load PWMSCLA DIV 2 Clock SA U Clock to PWM Ch 1 PCLK1 PCLKAB1 M U X M Clock to PWM Ch 2 PCLK2 PCLKAB2 X 8 16 32 64 128 M U X Clock to PWM Ch 3 PCLK3 PCLKAB3 Clock B 4 Clock B/2, B/4, B/6,....B/512 M U X Clock to PWM Ch 4 2 Divide by Prescaler Taps: Clock to PWM Ch 0 PCLK0 PCLKAB0 Count = 1 8-Bit Down Counter M U X M 8-Bit Down Counter U X M U X Load PWMSCLB DIV 2 Clock SB PCKB2 PCKB1 PCKB0 Clock to PWM Ch 5 PCLK5 PCLKAB5 M U X Clock to PWM Ch 6 PCLK6 PCLKAB6 M U X PWME7-0 Clock PFRZ Freeze Mode Signal PCLK4 PCLKAB4 Count = 1 Clock to PWM Ch 7 PCLK7 PCLKAB7 Prescale Scale Clock Select Maximum possible channels, scalable in pairs from PWM0 to PWM7. Figure 13-15. PWM Clock Select Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 423 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Clock A is used as an input to an 8-bit down counter. This down counter loads a user programmable scale value from the scale register (PWMSCLA). When the down counter reaches one, a pulse is output and the 8-bit counter is re-loaded. The output signal from this circuit is further divided by two. This gives a greater range with only a slight reduction in granularity. Clock SA equals clock A divided by two times the value in the PWMSCLA register. NOTE Clock SA = Clock A / (2 * PWMSCLA) When PWMSCLA = $00, PWMSCLA value is considered a full scale value of 256. Clock A is thus divided by 512. Similarly, clock B is used as an input to an 8-bit down counter followed by a divide by two producing clock SB. Thus, clock SB equals clock B divided by two times the value in the PWMSCLB register. NOTE Clock SB = Clock B / (2 * PWMSCLB) When PWMSCLB = $00, PWMSCLB value is considered a full scale value of 256. Clock B is thus divided by 512. As an example, consider the case in which the user writes $FF into the PWMSCLA register. Clock A for this case will be PWM clock divided by 4. A pulse will occur at a rate of once every 255x4 PWM cycles. Passing this through the divide by two circuit produces a clock signal at an PWM clock divided by 2040 rate. Similarly, a value of $01 in the PWMSCLA register when clock A is PWM clock divided by 4 will produce a clock at an PWM clock divided by 8 rate. Writing to PWMSCLA or PWMSCLB causes the associated 8-bit down counter to be re-loaded. Otherwise, when changing rates the counter would have to count down to $01 before counting at the proper rate. Forcing the associated counter to re-load the scale register value every time PWMSCLA or PWMSCLB is written prevents this. NOTE Writing to the scale registers while channels are operating can cause irregularities in the PWM outputs. 13.4.1.3 Clock Select Each PWM channel has the capability of selecting one of four clocks, clock A, clock SA, clock B or clock SB. The clock selection is done with the PCLKx control bits in the PWMCLK register and PCLKABx control bits in PWMCLKAB register. For backward compatibility consideration, the reset value of PWMCLK and PWMCLKAB configures following default clock selection. For channels 0, 1, 4, and 5 the clock choices are clock A. For channels 2, 3, 6, and 7 the clock choices are clock B. NOTE Changing clock control bits while channels are operating can cause irregularities in the PWM outputs. MC9S12ZVC Family Reference Manual , Rev. 1.9 424 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) 13.4.2 PWM Channel Timers The main part of the PWM module are the actual timers. Each of the timer channels has a counter, a period register and a duty register (each are 8-bit). The waveform output period is controlled by a match between the period register and the value in the counter. The duty is controlled by a match between the duty register and the counter value and causes the state of the output to change during the period. The starting polarity of the output is also selectable on a per channel basis. Shown below in Figure 13-16 is the block diagram for the PWM timer. Clock Source From Port PWMP Data Register 8-Bit Counter Gate PWMCNTx (Clock Edge Sync) Up/Down Reset 8-bit Compare = PWMDTYx T M U X Q Q R M U X To Pin Driver 8-bit Compare = PWMPERx PPOLx Q Q T CAEx R PWMEx Figure 13-16. PWM Timer Channel Block Diagram 13.4.2.1 PWM Enable Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx bits are set (PWMEx = 1), the associated PWM output signal is enabled immediately. However, the actual PWM waveform is not available on the associated PWM output until its clock source begins its next cycle due to the synchronization of PWMEx and the clock source. An exception to this is when channels are concatenated. Refer to Section 13.4.2.7, "PWM 16-Bit Functions" for more detail. NOTE The first PWM cycle after enabling the channel can be irregular. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 425 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) On the front end of the PWM timer, the clock is enabled to the PWM circuit by the PWMEx bit being high. There is an edge-synchronizing circuit to guarantee that the clock will only be enabled or disabled at an edge. When the channel is disabled (PWMEx = 0), the counter for the channel does not count. 13.4.2.2 PWM Polarity Each channel has a polarity bit to allow starting a waveform cycle with a high or low signal. This is shown on the block diagram Figure 13-16 as a mux select of either the Q output or the Q output of the PWM output flip flop. When one of the bits in the PWMPOL register is set, the associated PWM channel output is high at the beginning of the waveform, then goes low when the duty count is reached. Conversely, if the polarity bit is zero, the output starts low and then goes high when the duty count is reached. 13.4.2.3 PWM Period and Duty Dedicated period and duty registers exist for each channel and are double buffered so that if they change while the channel is enabled, the change will NOT take effect until one of the following occurs: * The effective period ends * The counter is written (counter resets to $00) * The channel is disabled In this way, the output of the PWM will always be either the old waveform or the new waveform, not some variation in between. If the channel is not enabled, then writes to the period and duty registers will go directly to the latches as well as the buffer. A change in duty or period can be forced into effect "immediately" by writing the new value to the duty and/or period registers and then writing to the counter. This forces the counter to reset and the new duty and/or period values to be latched. In addition, since the counter is readable, it is possible to know where the count is with respect to the duty value and software can be used to make adjustments NOTE When forcing a new period or duty into effect immediately, an irregular PWM cycle can occur. Depending on the polarity bit, the duty registers will contain the count of either the high time or the low time. 13.4.2.4 PWM Timer Counters Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source (see Section 13.4.1, "PWM Clock Select" for the available clock sources and rates). The counter compares to two registers, a duty register and a period register as shown in Figure 13-16. When the PWM counter matches the duty register, the output flip-flop changes state, causing the PWM waveform to also change state. A match between the PWM counter and the period register behaves differently depending on what output mode is selected as shown in Figure 13-16 and described in Section 13.4.2.5, "Left Aligned Outputs" and Section 13.4.2.6, "Center Aligned Outputs". MC9S12ZVC Family Reference Manual , Rev. 1.9 426 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Each channel counter can be read at anytime without affecting the count or the operation of the PWM channel. Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up, the immediate load of both duty and period registers with values from the buffers, and the output to change according to the polarity bit. When the channel is disabled (PWMEx = 0), the counter stops. When a channel becomes enabled (PWMEx = 1), the associated PWM counter continues from the count in the PWMCNTx register. This allows the waveform to continue where it left off when the channel is re-enabled. When the channel is disabled, writing "0" to the period register will cause the counter to reset on the next selected clock. NOTE If the user wants to start a new "clean" PWM waveform without any "history" from the old waveform, the user must write to channel counter (PWMCNTx) prior to enabling the PWM channel (PWMEx = 1). Generally, writes to the counter are done prior to enabling a channel in order to start from a known state. However, writing a counter can also be done while the PWM channel is enabled (counting). The effect is similar to writing the counter when the channel is disabled, except that the new period is started immediately with the output set according to the polarity bit. NOTE Writing to the counter while the channel is enabled can cause an irregular PWM cycle to occur. The counter is cleared at the end of the effective period (see Section 13.4.2.5, "Left Aligned Outputs" and Section 13.4.2.6, "Center Aligned Outputs" for more details). Table 13-12. PWM Timer Counter Conditions Counter Clears ($00) Counter Counts Counter Stops When PWMCNTx register written to any value When PWM channel is enabled (PWMEx = 1). Counts from last value in PWMCNTx. When PWM channel is disabled (PWMEx = 0) Effective period ends 13.4.2.5 Left Aligned Outputs The PWM timer provides the choice of two types of outputs, left aligned or center aligned. They are selected with the CAEx bits in the PWMCAE register. If the CAEx bit is cleared (CAEx = 0), the corresponding PWM output will be left aligned. In left aligned output mode, the 8-bit counter is configured as an up counter only. It compares to two registers, a duty register and a period register as shown in the block diagram in Figure 13-16. When the PWM counter matches the duty register the output flip-flop changes state causing the PWM waveform to also change state. A match between the PWM counter and the period register resets the counter and the output flip-flop, as shown in Figure 13-16, as well as performing a load from the double buffer period and duty register to the associated registers, as described in Section 13.4.2.3, "PWM Period and Duty". The counter counts from 0 to the value in the period register - 1. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 427 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) NOTE Changing the PWM output mode from left aligned to center aligned output (or vice versa) while channels are operating can cause irregularities in the PWM output. It is recommended to program the output mode before enabling the PWM channel. PPOLx = 0 PPOLx = 1 PWMDTYx Period = PWMPERx Figure 13-17. PWM Left Aligned Output Waveform To calculate the output frequency in left aligned output mode for a particular channel, take the selected clock source frequency for the channel (A, B, SA, or SB) and divide it by the value in the period register for that channel. * PWMx Frequency = Clock (A, B, SA, or SB) / PWMPERx * PWMx Duty Cycle (high time as a% of period): -- Polarity = 0 (PPOLx = 0) Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100% -- Polarity = 1 (PPOLx = 1) Duty Cycle = [PWMDTYx / PWMPERx] * 100% As an example of a left aligned output, consider the following case: Clock Source = PWM clock, where PWM clock = 10 MHz (100 ns period) PPOLx = 0 PWMPERx = 4 PWMDTYx = 1 PWMx Frequency = 10 MHz/4 = 2.5 MHz PWMx Period = 400 ns PWMx Duty Cycle = 3/4 *100% = 75% The output waveform generated is shown in Figure 13-18. E = 100 ns Duty Cycle = 75% Period = 400 ns Figure 13-18. PWM Left Aligned Output Example Waveform MC9S12ZVC Family Reference Manual , Rev. 1.9 428 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) 13.4.2.6 Center Aligned Outputs For center aligned output mode selection, set the CAEx bit (CAEx = 1) in the PWMCAE register and the corresponding PWM output will be center aligned. The 8-bit counter operates as an up/down counter in this mode and is set to up whenever the counter is equal to $00. The counter compares to two registers, a duty register and a period register as shown in the block diagram in Figure 13-16. When the PWM counter matches the duty register, the output flip-flop changes state, causing the PWM waveform to also change state. A match between the PWM counter and the period register changes the counter direction from an up-count to a down-count. When the PWM counter decrements and matches the duty register again, the output flip-flop changes state causing the PWM output to also change state. When the PWM counter decrements and reaches zero, the counter direction changes from a down-count back to an up-count and a load from the double buffer period and duty registers to the associated registers is performed, as described in Section 13.4.2.3, "PWM Period and Duty". The counter counts from 0 up to the value in the period register and then back down to 0. Thus the effective period is PWMPERx*2. NOTE Changing the PWM output mode from left aligned to center aligned output (or vice versa) while channels are operating can cause irregularities in the PWM output. It is recommended to program the output mode before enabling the PWM channel. PPOLx = 0 PPOLx = 1 PWMDTYx PWMDTYx PWMPERx PWMPERx Period = PWMPERx*2 Figure 13-19. PWM Center Aligned Output Waveform To calculate the output frequency in center aligned output mode for a particular channel, take the selected clock source frequency for the channel (A, B, SA, or SB) and divide it by twice the value in the period register for that channel. * PWMx Frequency = Clock (A, B, SA, or SB) / (2*PWMPERx) * PWMx Duty Cycle (high time as a% of period): -- Polarity = 0 (PPOLx = 0) Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100% -- Polarity = 1 (PPOLx = 1) Duty Cycle = [PWMDTYx / PWMPERx] * 100% As an example of a center aligned output, consider the following case: MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 429 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Clock Source = PWM clock, where PWM clock= 10 MHz (100 ns period) PPOLx = 0 PWMPERx = 4 PWMDTYx = 1 PWMx Frequency = 10 MHz/8 = 1.25 MHz PWMx Period = 800 ns PWMx Duty Cycle = 3/4 *100% = 75% Shown in Figure 13-20 is the output waveform generated. E = 100 ns E = 100 ns DUTY CYCLE = 75% PERIOD = 800 ns Figure 13-20. PWM Center Aligned Output Example Waveform 13.4.2.7 PWM 16-Bit Functions The scalable PWM timer also has the option of generating up to 8-channels of 8-bits or 4-channels of 16-bits for greater PWM resolution. This 16-bit channel option is achieved through the concatenation of two 8-bit channels. The PWMCTL register contains four control bits, each of which is used to concatenate a pair of PWM channels into one 16-bit channel. Channels 6 and 7 are concatenated with the CON67 bit, channels 4 and 5 are concatenated with the CON45 bit, channels 2 and 3 are concatenated with the CON23 bit, and channels 0 and 1 are concatenated with the CON01 bit. NOTE Change these bits only when both corresponding channels are disabled. When channels 6 and 7 are concatenated, channel 6 registers become the high order bytes of the double byte channel, as shown in Figure 13-21. Similarly, when channels 4 and 5 are concatenated, channel 4 registers become the high order bytes of the double byte channel. When channels 2 and 3 are concatenated, channel 2 registers become the high order bytes of the double byte channel. When channels 0 and 1 are concatenated, channel 0 registers become the high order bytes of the double byte channel. When using the 16-bit concatenated mode, the clock source is determined by the low order 8-bit channel clock select control bits. That is channel 7 when channels 6 and 7 are concatenated, channel 5 when channels 4 and 5 are concatenated, channel 3 when channels 2 and 3 are concatenated, and channel 1 when channels 0 and 1 are concatenated. The resulting PWM is output to the pins of the corresponding low order 8-bit channel as also shown in Figure 13-21. The polarity of the resulting PWM output is controlled by the PPOLx bit of the corresponding low order 8-bit channel as well. MC9S12ZVC Family Reference Manual , Rev. 1.9 430 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) Clock Source 7 High Low PWMCNT6 PWMCNT7 PWM7 Period/Duty Compare Clock Source 5 High Low PWMCNT4 PWMCNT5 PWM5 Period/Duty Compare Clock Source 3 High Low PWMCNT2 PWMCNT3 PWM3 Period/Duty Compare Clock Source 1 High Low PWMCNT0 PWMCNT1 Period/Duty Compare PWM1 Maximum possible 16-bit channels Figure 13-21. PWM 16-Bit Mode Once concatenated mode is enabled (CONxx bits set in PWMCTL register), enabling/disabling the corresponding 16-bit PWM channel is controlled by the low order PWMEx bit. In this case, the high order bytes PWMEx bits have no effect and their corresponding PWM output is disabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 431 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or high order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by 16-bit access to maintain data coherency. Either left aligned or center aligned output mode can be used in concatenated mode and is controlled by the low order CAEx bit. The high order CAEx bit has no effect. Table 13-13 is used to summarize which channels are used to set the various control bits when in 16-bit mode. Table 13-13. 16-bit Concatenation Mode Summary Note: Bits related to available channels have functional significance. 13.4.2.8 CONxx PWMEx PPOLx PCLKx CAEx PWMx Output CON67 PWME7 PPOL7 PCLK7 CAE7 PWM7 CON45 PWME5 PPOL5 PCLK5 CAE5 PWM5 CON23 PWME3 PPOL3 PCLK3 CAE3 PWM3 CON01 PWME1 PPOL1 PCLK1 CAE1 PWM1 PWM Boundary Cases Table 13-14 summarizes the boundary conditions for the PWM regardless of the output mode (left aligned or center aligned) and 8-bit (normal) or 16-bit (concatenation). Table 13-14. PWM Boundary Cases 1 13.5 PWMDTYx PWMPERx PPOLx PWMx Output $00 (indicates no duty) >$00 1 Always low $00 (indicates no duty) >$00 0 Always high XX $001 (indicates no period) 1 Always high XX $001 (indicates no period) 0 Always low >= PWMPERx XX 1 Always high >= PWMPERx XX 0 Always low Counter = $00 and does not count. Resets The reset state of each individual bit is listed within the Section 13.3.2, "Register Descriptions" which details the registers and their bit-fields. All special functions or modes which are initialized during or just following reset are described within this section. * The 8-bit up/down counter is configured as an up counter out of reset. * All the channels are disabled and all the counters do not count. MC9S12ZVC Family Reference Manual , Rev. 1.9 432 NXP Semiconductors Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) * * 13.6 For channels 0, 1, 4, and 5 the clock choices are clock A. For channels 2, 3, 6, and 7 the clock choices are clock B. Interrupts The PWM module has no interrupt. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 433 Chapter 13 Pulse-Width Modulator (S12PWM8B8CV2) MC9S12ZVC Family Reference Manual , Rev. 1.9 434 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) Table 14-1. Revision History Version Number Revision Date 06.06 03/11/2013 fix typo of BDL reset value,Figure 14-4 fix typo of Table 14-2,Table 14-16,reword 14.4.4/14-454 06.07 09/03/2013 update Figure 14-14./14-451 Figure 14-16./14-455 Figure 14-20./14-460 update 14.4.4/14-454,more detail for two baud add note for Table 14-16./14-454 update Figure 14-2./14-439,Figure 14-12./14-450 06.08 10/14/2013 update Figure 14-4./14-440 14.3.2.9/14-450 14.1 Effective Date Author Description of Changes Introduction This block guide provides an overview of the serial communication interface (SCI) module. The SCI allows asynchronous serial communications with peripheral devices and other CPUs. 14.1.1 Glossary IR: InfraRed IrDA: Infrared Design Associate IRQ: Interrupt Request LIN: Local Interconnect Network LSB: Least Significant Bit MSB: Most Significant Bit NRZ: Non-Return-to-Zero RZI: Return-to-Zero-Inverted RXD: Receive Pin SCI : Serial Communication Interface TXD: Transmit Pin MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 435 Chapter 14 Serial Communication Interface (S12SCIV6) 14.1.2 Features The SCI includes these distinctive features: * Full-duplex or single-wire operation * Standard mark/space non-return-to-zero (NRZ) format * Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths * 16-bit baud rate selection * Programmable 8-bit or 9-bit data format * Separately enabled transmitter and receiver * Programmable polarity for transmitter and receiver * Programmable transmitter output parity * Two receiver wakeup methods: -- Idle line wakeup -- Address mark wakeup * Interrupt-driven operation with eight flags: -- Transmitter empty -- Transmission complete -- Receiver full -- Idle receiver input -- Receiver overrun -- Noise error -- Framing error -- Parity error -- Receive wakeup on active edge -- Transmit collision detect supporting LIN -- Break Detect supporting LIN * Receiver framing error detection * Hardware parity checking * 1/16 bit-time noise detection 14.1.3 Modes of Operation The SCI functions the same in normal, special, and emulation modes. It has two low power modes, wait and stop modes. * Run mode * Wait mode * Stop mode MC9S12ZVC Family Reference Manual , Rev. 1.9 436 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.1.4 Block Diagram Figure 14-1 is a high level block diagram of the SCI module, showing the interaction of various function blocks. SCI Data Register RXD Data In Bus Clock Infrared Decoder Receive Shift Register IDLE Receive & Wakeup Control Receive Baud Rate Receive Interrupt Generation Generator 1/16 Transmit Control Transmit Shift Register BRKD SCI Interrupt Request RXEDG BERR Data Format Control Transmit Baud Rate Generator RDRF/OR Transmit Interrupt Generation Infrared Encoder TDRE TC Data Out TXD SCI Data Register Figure 14-1. SCI Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 437 Chapter 14 Serial Communication Interface (S12SCIV6) 14.2 External Signal Description The SCI module has a total of two external pins. 14.2.1 TXD -- Transmit Pin The TXD pin transmits SCI (standard or infrared) data. It will idle high in either mode and is high impedance anytime the transmitter is disabled. 14.2.2 RXD -- Receive Pin The RXD pin receives SCI (standard or infrared) data. An idle line is detected as a line high. This input is ignored when the receiver is disabled and should be terminated to a known voltage. 14.3 Memory Map and Register Definition This section provides a detailed description of all the SCI registers. 14.3.1 Module Memory Map and Register Definition The memory map for the SCI module is given below in Figure 14-2. The address listed for each register is the address offset. The total address for each register is the sum of the base address for the SCI module and the address offset for each register. MC9S12ZVC Family Reference Manual , Rev. 1.9 438 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Writes to a reserved register locations do not have any effect and reads of these locations return a zero. Details of register bit and field function follow the register diagrams, in bit order. Register Name R 0x0000 SCIBDH1 W 0x0001 SCIBDL1 W 0x0002 SCICR11 R R W 0x0000 SCIASR12 W 0x0001 SCIACR12 W 0x0002 SCIACR22 0x0003 SCICR2 0x0004 SCISR1 0x0005 SCISR2 0x0007 SCIDRL R R R W R W R Bit 7 6 5 4 3 2 1 Bit 0 SBR15 SBR14 SBR13 SBR12 SBR11 SBR10 SBR9 SBR8 SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 LOOPS SCISWAI RSRC M WAKE ILT PE PT 0 0 0 0 BERRV BERRIF BKDIF 0 0 0 0 BERRIE BKDIE IREN TNP1 TNP0 0 0 BERRM1 BERRM0 BKDFE TIE TCIE RIE ILIE TE RE RWU SBK TDRE TC RDRF IDLE OR NF FE PF 0 0 TXPOL RXPOL BRK13 TXDIR RXEDGIF RXEDGIE 0 W R W AMAP RAF R R7 R6 R5 R4 R3 R2 R1 R0 W T7 T6 T5 T4 T3 T2 T1 T0 1.These registers are accessible if the AMAP bit in the SCISR2 register is set to zero. 2,These registers are accessible if the AMAP bit in the SCISR2 register is set to one. = Unimplemented or Reserved Figure 14-2. SCI Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 439 Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2.1 SCI Baud Rate Registers (SCIBDH, SCIBDL) Module Base + 0x0000 R W Reset 7 6 5 4 3 2 1 0 SBR15 SBR14 SBR13 SBR12 SBR11 SBR10 SBR9 SBR8 0 0 0 0 0 0 0 0 Figure 14-3. SCI Baud Rate Register (SCIBDH) Module Base + 0x0001 R W Reset 7 6 5 4 3 2 1 0 SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 0 1 0 0 0 0 0 0 Figure 14-4. SCI Baud Rate Register (SCIBDL) Read: Anytime, if AMAP = 0. Write: Anytime, if AMAP = 0. NOTE Those two registers are only visible in the memory map if AMAP = 0 (reset condition). The SCI baud rate register is used by to determine the baud rate of the SCI, and to control the infrared modulation/demodulation submodule. Table 14-2. SCIBDH and SCIBDL Field Descriptions Field Description SBR[15:0] SCI Baud Rate Bits -- The baud rate for the SCI is determined by the bits in this register. The baud rate is calculated two different ways depending on the state of the IREN bit. The formulas for calculating the baud rate are: When IREN = 0 then, SCI baud rate = SCI bus clock / (SBR[15:0]) When IREN = 1 then, SCI baud rate = SCI bus clock / (2 x SBR[15:1]) Note: The baud rate generator is disabled after reset and not started until the TE bit or the RE bit is set for the first time. The baud rate generator is disabled when (SBR[15:4] = 0 and IREN = 0) or (SBR[15:5] = 0 and IREN = 1). Note: . User should write SCIBD by word access. The updated SCIBD may take effect until next RT clock start, write SCIBDH or SCIBDL separately may cause baud generator load wrong data at that time,if second write later then RT clock. MC9S12ZVC Family Reference Manual , Rev. 1.9 440 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2.2 SCI Control Register 1 (SCICR1) Module Base + 0x0002 R W Reset 7 6 5 4 3 2 1 0 LOOPS SCISWAI RSRC M WAKE ILT PE PT 0 0 0 0 0 0 0 0 Figure 14-5. SCI Control Register 1 (SCICR1) Read: Anytime, if AMAP = 0. Write: Anytime, if AMAP = 0. NOTE This register is only visible in the memory map if AMAP = 0 (reset condition). Table 14-3. SCICR1 Field Descriptions Field Description 7 LOOPS Loop Select Bit -- LOOPS enables loop operation. In loop operation, the RXD pin is disconnected from the SCI and the transmitter output is internally connected to the receiver input. Both the transmitter and the receiver must be enabled to use the loop function. 0 Normal operation enabled 1 Loop operation enabled The receiver input is determined by the RSRC bit. 6 SCISWAI 5 RSRC 4 M 3 WAKE 2 ILT SCI Stop in Wait Mode Bit -- SCISWAI disables the SCI in wait mode. 0 SCI enabled in wait mode 1 SCI disabled in wait mode Receiver Source Bit -- When LOOPS = 1, the RSRC bit determines the source for the receiver shift register input. See Table 14-4. 0 Receiver input internally connected to transmitter output 1 Receiver input connected externally to transmitter Data Format Mode Bit -- MODE determines whether data characters are eight or nine bits long. 0 One start bit, eight data bits, one stop bit 1 One start bit, nine data bits, one stop bit Wakeup Condition Bit -- WAKE determines which condition wakes up the SCI: a logic 1 (address mark) in the most significant bit position of a received data character or an idle condition on the RXD pin. 0 Idle line wakeup 1 Address mark wakeup Idle Line Type Bit -- ILT determines when the receiver starts counting logic 1s as idle character bits. The counting begins either after the start bit or after the stop bit. If the count begins after the start bit, then a string of logic 1s preceding the stop bit may cause false recognition of an idle character. Beginning the count after the stop bit avoids false idle character recognition, but requires properly synchronized transmissions. 0 Idle character bit count begins after start bit 1 Idle character bit count begins after stop bit MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 441 Chapter 14 Serial Communication Interface (S12SCIV6) Table 14-3. SCICR1 Field Descriptions (continued) Field Description 1 PE Parity Enable Bit -- PE enables the parity function. When enabled, the parity function inserts a parity bit in the most significant bit position. 0 Parity function disabled 1 Parity function enabled 0 PT Parity Type Bit -- PT determines whether the SCI generates and checks for even parity or odd parity. With even parity, an even number of 1s clears the parity bit and an odd number of 1s sets the parity bit. With odd parity, an odd number of 1s clears the parity bit and an even number of 1s sets the parity bit. 0 Even parity 1 Odd parity Table 14-4. Loop Functions LOOPS RSRC Function 0 x Normal operation 1 0 Loop mode with transmitter output internally connected to receiver input 1 1 Single-wire mode with TXD pin connected to receiver input MC9S12ZVC Family Reference Manual , Rev. 1.9 442 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2.3 SCI Alternative Status Register 1 (SCIASR1) Module Base + 0x0000 7 R W Reset RXEDGIF 0 6 5 4 3 2 0 0 0 0 BERRV 0 0 0 0 0 1 0 BERRIF BKDIF 0 0 = Unimplemented or Reserved Figure 14-6. SCI Alternative Status Register 1 (SCIASR1) Read: Anytime, if AMAP = 1 Write: Anytime, if AMAP = 1 Table 14-5. SCIASR1 Field Descriptions Field 7 RXEDGIF Description Receive Input Active Edge Interrupt Flag -- RXEDGIF is asserted, if an active edge (falling if RXPOL = 0, rising if RXPOL = 1) on the RXD input occurs. RXEDGIF bit is cleared by writing a "1" to it. 0 No active receive on the receive input has occurred 1 An active edge on the receive input has occurred 2 BERRV Bit Error Value -- BERRV reflects the state of the RXD input when the bit error detect circuitry is enabled and a mismatch to the expected value happened. The value is only meaningful, if BERRIF = 1. 0 A low input was sampled, when a high was expected 1 A high input reassembled, when a low was expected 1 BERRIF Bit Error Interrupt Flag -- BERRIF is asserted, when the bit error detect circuitry is enabled and if the value sampled at the RXD input does not match the transmitted value. If the BERRIE interrupt enable bit is set an interrupt will be generated. The BERRIF bit is cleared by writing a "1" to it. 0 No mismatch detected 1 A mismatch has occurred 0 BKDIF Break Detect Interrupt Flag -- BKDIF is asserted, if the break detect circuitry is enabled and a break signal is received. If the BKDIE interrupt enable bit is set an interrupt will be generated. The BKDIF bit is cleared by writing a "1" to it. 0 No break signal was received 1 A break signal was received MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 443 Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2.4 SCI Alternative Control Register 1 (SCIACR1) Module Base + 0x0001 7 R W Reset RXEDGIE 0 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 1 0 BERRIE BKDIE 0 0 = Unimplemented or Reserved Figure 14-7. SCI Alternative Control Register 1 (SCIACR1) Read: Anytime, if AMAP = 1 Write: Anytime, if AMAP = 1 Table 14-6. SCIACR1 Field Descriptions Field 7 RXEDGIE Description Receive Input Active Edge Interrupt Enable -- RXEDGIE enables the receive input active edge interrupt flag, RXEDGIF, to generate interrupt requests. 0 RXEDGIF interrupt requests disabled 1 RXEDGIF interrupt requests enabled 1 BERRIE Bit Error Interrupt Enable -- BERRIE enables the bit error interrupt flag, BERRIF, to generate interrupt requests. 0 BERRIF interrupt requests disabled 1 BERRIF interrupt requests enabled 0 BKDIE Break Detect Interrupt Enable -- BKDIE enables the break detect interrupt flag, BKDIF, to generate interrupt requests. 0 BKDIF interrupt requests disabled 1 BKDIF interrupt requests enabled MC9S12ZVC Family Reference Manual , Rev. 1.9 444 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2.5 SCI Alternative Control Register 2 (SCIACR2) Module Base + 0x0002 R W Reset 7 6 5 IREN TNP1 TNP0 0 0 0 4 3 0 0 0 0 2 1 0 BERRM1 BERRM0 BKDFE 0 0 0 = Unimplemented or Reserved Figure 14-8. SCI Alternative Control Register 2 (SCIACR2) Read: Anytime, if AMAP = 1 Write: Anytime, if AMAP = 1 Table 14-7. SCIACR2 Field Descriptions Field 7 IREN 6:5 TNP[1:0] Description Infrared Enable Bit -- This bit enables/disables the infrared modulation/demodulation submodule. 0 IR disabled 1 IR enabled Transmitter Narrow Pulse Bits -- These bits enable whether the SCI transmits a 1/16, 3/16, 1/32 or 1/4 narrow pulse. See Table 14-8. 2:1 Bit Error Mode -- Those two bits determines the functionality of the bit error detect feature. See Table 14-9. BERRM[1:0] 0 BKDFE Break Detect Feature Enable -- BKDFE enables the break detect circuitry. 0 Break detect circuit disabled 1 Break detect circuit enabled Table 14-8. IRSCI Transmit Pulse Width TNP[1:0] Narrow Pulse Width 11 1/4 10 1/32 01 1/16 00 3/16 Table 14-9. Bit Error Mode Coding BERRM1 BERRM0 Function 0 0 Bit error detect circuit is disabled 0 1 Receive input sampling occurs during the 9th time tick of a transmitted bit (refer to Figure 14-19) 1 0 Receive input sampling occurs during the 13th time tick of a transmitted bit (refer to Figure 14-19) 1 1 Reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 445 Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2.6 SCI Control Register 2 (SCICR2) Module Base + 0x0003 R W Reset 7 6 5 4 3 2 1 0 TIE TCIE RIE ILIE TE RE RWU SBK 0 0 0 0 0 0 0 0 Figure 14-9. SCI Control Register 2 (SCICR2) Read: Anytime Write: Anytime Table 14-10. SCICR2 Field Descriptions Field 7 TIE Description Transmitter Interrupt Enable Bit -- TIE enables the transmit data register empty flag, TDRE, to generate interrupt requests. 0 TDRE interrupt requests disabled 1 TDRE interrupt requests enabled 6 TCIE Transmission Complete Interrupt Enable Bit -- TCIE enables the transmission complete flag, TC, to generate interrupt requests. 0 TC interrupt requests disabled 1 TC interrupt requests enabled 5 RIE Receiver Full Interrupt Enable Bit -- RIE enables the receive data register full flag, RDRF, or the overrun flag, OR, to generate interrupt requests. 0 RDRF and OR interrupt requests disabled 1 RDRF and OR interrupt requests enabled 4 ILIE Idle Line Interrupt Enable Bit -- ILIE enables the idle line flag, IDLE, to generate interrupt requests. 0 IDLE interrupt requests disabled 1 IDLE interrupt requests enabled 3 TE Transmitter Enable Bit -- TE enables the SCI transmitter and configures the TXD pin as being controlled by the SCI. The TE bit can be used to queue an idle preamble. 0 Transmitter disabled 1 Transmitter enabled 2 RE Receiver Enable Bit -- RE enables the SCI receiver. 0 Receiver disabled 1 Receiver enabled 1 RWU Receiver Wakeup Bit -- Standby state 0 Normal operation. 1 RWU enables the wakeup function and inhibits further receiver interrupt requests. Normally, hardware wakes the receiver by automatically clearing RWU. 0 SBK Send Break Bit -- Toggling SBK sends one break character (10 or 11 logic 0s, respectively 13 or 14 logics 0s if BRK13 is set). Toggling implies clearing the SBK bit before the break character has finished transmitting. As long as SBK is set, the transmitter continues to send complete break characters (10 or 11 bits, respectively 13 or 14 bits). 0 No break characters 1 Transmit break characters MC9S12ZVC Family Reference Manual , Rev. 1.9 446 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2.7 SCI Status Register 1 (SCISR1) The SCISR1 and SCISR2 registers provides inputs to the MCU for generation of SCI interrupts. Also, these registers can be polled by the MCU to check the status of these bits. The flag-clearing procedures require that the status register be read followed by a read or write to the SCI data register.It is permissible to execute other instructions between the two steps as long as it does not compromise the handling of I/O, but the order of operations is important for flag clearing. Module Base + 0x0004 R 7 6 5 4 3 2 1 0 TDRE TC RDRF IDLE OR NF FE PF 1 0 0 0 0 0 0 W Reset 1 = Unimplemented or Reserved Figure 14-10. SCI Status Register 1 (SCISR1) Read: Anytime Write: Has no meaning or effect Table 14-11. SCISR1 Field Descriptions Field Description 7 TDRE Transmit Data Register Empty Flag -- TDRE is set when the transmit shift register receives a byte from the SCI data register. When TDRE is 1, the transmit data register (SCIDRH/L) is empty and can receive a new value to transmit.Clear TDRE by reading SCI status register 1 (SCISR1), with TDRE set and then writing to SCI data register low (SCIDRL). 0 No byte transferred to transmit shift register 1 Byte transferred to transmit shift register; transmit data register empty 6 TC Transmit Complete Flag -- TC is set low when there is a transmission in progress or when a preamble or break character is loaded. TC is set high when the TDRE flag is set and no data, preamble, or break character is being transmitted.When TC is set, the TXD pin becomes idle (logic 1). Clear TC by reading SCI status register 1 (SCISR1) with TC set and then writing to SCI data register low (SCIDRL). TC is cleared automatically when data, preamble, or break is queued and ready to be sent. TC is cleared in the event of a simultaneous set and clear of the TC flag (transmission not complete). 0 Transmission in progress 1 No transmission in progress 5 RDRF Receive Data Register Full Flag -- RDRF is set when the data in the receive shift register transfers to the SCI data register. Clear RDRF by reading SCI status register 1 (SCISR1) with RDRF set and then reading SCI data register low (SCIDRL). 0 Data not available in SCI data register 1 Received data available in SCI data register 4 IDLE Idle Line Flag -- IDLE is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M =1) appear on the receiver input. Once the IDLE flag is cleared, a valid frame must again set the RDRF flag before an idle condition can set the IDLE flag.Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE set and then reading SCI data register low (SCIDRL). 0 Receiver input is either active now or has never become active since the IDLE flag was last cleared 1 Receiver input has become idle Note: When the receiver wakeup bit (RWU) is set, an idle line condition does not set the IDLE flag. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 447 Chapter 14 Serial Communication Interface (S12SCIV6) Table 14-11. SCISR1 Field Descriptions (continued) Field Description 3 OR Overrun Flag -- OR is set when software fails to read the SCI data register before the receive shift register receives the next frame. The OR bit is set immediately after the stop bit has been completely received for the second frame. The data in the shift register is lost, but the data already in the SCI data registers is not affected. Clear OR by reading SCI status register 1 (SCISR1) with OR set and then reading SCI data register low (SCIDRL). 0 No overrun 1 Overrun Note: OR flag may read back as set when RDRF flag is clear. This may happen if the following sequence of events occurs: 1. After the first frame is received, read status register SCISR1 (returns RDRF set and OR flag clear); 2. Receive second frame without reading the first frame in the data register (the second frame is not received and OR flag is set); 3. Read data register SCIDRL (returns first frame and clears RDRF flag in the status register); 4. Read status register SCISR1 (returns RDRF clear and OR set). Event 3 may be at exactly the same time as event 2 or any time after. When this happens, a dummy SCIDRL read following event 4 will be required to clear the OR flag if further frames are to be received. 2 NF Noise Flag -- NF is set when the SCI detects noise on the receiver input. NF bit is set during the same cycle as the RDRF flag but does not get set in the case of an overrun. Clear NF by reading SCI status register 1(SCISR1), and then reading SCI data register low (SCIDRL). 0 No noise 1 Noise 1 FE Framing Error Flag -- FE is set when a logic 0 is accepted as the stop bit. FE bit is set during the same cycle as the RDRF flag but does not get set in the case of an overrun. FE inhibits further data reception until it is cleared. Clear FE by reading SCI status register 1 (SCISR1) with FE set and then reading the SCI data register low (SCIDRL). 0 No framing error 1 Framing error 0 PF Parity Error Flag -- PF is set when the parity enable bit (PE) is set and the parity of the received data does not match the parity type bit (PT). PF bit is set during the same cycle as the RDRF flag but does not get set in the case of an overrun. Clear PF by reading SCI status register 1 (SCISR1), and then reading SCI data register low (SCIDRL). 0 No parity error 1 Parity error MC9S12ZVC Family Reference Manual , Rev. 1.9 448 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2.8 SCI Status Register 2 (SCISR2) Module Base + 0x0005 7 R W Reset AMAP 0 6 5 0 0 0 0 4 3 2 1 TXPOL RXPOL BRK13 TXDIR 0 0 0 0 0 RAF 0 = Unimplemented or Reserved Figure 14-11. SCI Status Register 2 (SCISR2) Read: Anytime Write: Anytime Table 14-12. SCISR2 Field Descriptions Field Description 7 AMAP Alternative Map -- This bit controls which registers sharing the same address space are accessible. In the reset condition the SCI behaves as previous versions. Setting AMAP=1 allows the access to another set of control and status registers and hides the baud rate and SCI control Register 1. 0 The registers labelled SCIBDH (0x0000),SCIBDL (0x0001), SCICR1 (0x0002) are accessible 1 The registers labelled SCIASR1 (0x0000),SCIACR1 (0x0001), SCIACR2 (0x00002) are accessible 4 TXPOL Transmit Polarity -- This bit control the polarity of the transmitted data. In NRZ format, a one is represented by a mark and a zero is represented by a space for normal polarity, and the opposite for inverted polarity. In IrDA format, a zero is represented by short high pulse in the middle of a bit time remaining idle low for a one for normal polarity, and a zero is represented by short low pulse in the middle of a bit time remaining idle high for a one for inverted polarity. 0 Normal polarity 1 Inverted polarity 3 RXPOL Receive Polarity -- This bit control the polarity of the received data. In NRZ format, a one is represented by a mark and a zero is represented by a space for normal polarity, and the opposite for inverted polarity. In IrDA format, a zero is represented by short high pulse in the middle of a bit time remaining idle low for a one for normal polarity, and a zero is represented by short low pulse in the middle of a bit time remaining idle high for a one for inverted polarity. 0 Normal polarity 1 Inverted polarity 2 BRK13 Break Transmit Character Length -- This bit determines whether the transmit break character is 10 or 11 bit respectively 13 or 14 bits long. The detection of a framing error is not affected by this bit. 0 Break character is 10 or 11 bit long 1 Break character is 13 or 14 bit long 1 TXDIR Transmitter Pin Data Direction in Single-Wire Mode -- This bit determines whether the TXD pin is going to be used as an input or output, in the single-wire mode of operation. This bit is only relevant in the single-wire mode of operation. 0 TXD pin to be used as an input in single-wire mode 1 TXD pin to be used as an output in single-wire mode 0 RAF Receiver Active Flag -- RAF is set when the receiver detects a logic 0 during the RT1 time period of the start bit search. RAF is cleared when the receiver detects an idle character. 0 No reception in progress 1 Reception in progress MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 449 Chapter 14 Serial Communication Interface (S12SCIV6) 14.3.2.9 SCI Data Registers (SCIDRH, SCIDRL) Module Base + 0x0006 7 Reset 0 6 5 4 3 2 1 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 14-12. SCI Data Registers (SCIDRH) Module Base + 0x0007 7 6 5 4 3 2 1 0 R R7 R6 R5 R4 R3 R2 R1 R0 W T7 T6 T5 T4 T3 T2 T1 T0 0 0 0 0 0 0 0 0 Reset Figure 14-13. SCI Data Registers (SCIDRL) Read: Anytime; reading accesses SCI receive data register Write: Anytime; writing accesses SCI transmit data register; writing to R8 has no effect NOTE The reserved bit SCIDRH[2:0] are designed for factory test purposes only, and are not intended for general user access. Writing to these bit is possible when in special mode and can alter the modules functionality. Table 14-13. SCIDRH and SCIDRL Field Descriptions Field Description SCIDRH 7 R8 Received Bit 8 -- R8 is the ninth data bit received when the SCI is configured for 9-bit data format (M = 1). SCIDRH 6 T8 Transmit Bit 8 -- T8 is the ninth data bit transmitted when the SCI is configured for 9-bit data format (M = 1). SCIDRL 7:0 R[7:0] T[7:0] R7:R0 -- Received bits seven through zero for 9-bit or 8-bit data formats T7:T0 -- Transmit bits seven through zero for 9-bit or 8-bit formats NOTE If the value of T8 is the same as in the previous transmission, T8 does not have to be rewritten.The same value is transmitted until T8 is rewritten In 8-bit data format, only SCI data register low (SCIDRL) needs to be accessed. When transmitting in 9-bit data format and using 8-bit write instructions, write first to SCI data register high (SCIDRH), then SCIDRL. MC9S12ZVC Family Reference Manual , Rev. 1.9 450 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.4 Functional Description This section provides a complete functional description of the SCI block, detailing the operation of the design from the end user perspective in a number of subsections. Figure 14-14 shows the structure of the SCI module. The SCI allows full duplex, asynchronous, serial communication between the CPU and remote devices, including other CPUs. The SCI transmitter and receiver operate independently, although they use the same baud rate generator. The CPU monitors the status of the SCI, writes the data to be transmitted, and processes received data. R8 IREN SCI Data Register FE Ir_RXD Bus Clock Receive Shift Register SCRXD Receive and Wakeup Control PF RAF RE IDLE RWU RDRF LOOPS OR RSRC M Receive Baud Rate Generator IDLE ILIE RDRF/OR Infrared Receive Decoder R16XCLK RXD NF RIE TIE WAKE Data Format Control ILT PE SBR15:SBR0 TDRE TDRE TC PT SCI Interrupt Request TC TCIE TE Transmit Baud Rate Generator 16 Transmit Control LOOPS SBK RSRC T8 Transmit Shift Register RXEDGIE Active Edge Detect RXEDGIF BKDIF RXD SCI Data Register Break Detect BKDFE SCTXD BKDIE LIN Transmit BERRIF Collision Detect BERRIE R16XCLK Infrared Transmit Encoder BERRM[1:0] Ir_TXD TXD R32XCLK TNP[1:0] IREN Figure 14-14. Detailed SCI Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 451 Chapter 14 Serial Communication Interface (S12SCIV6) 14.4.1 Infrared Interface Submodule This module provides the capability of transmitting narrow pulses to an IR LED and receiving narrow pulses and transforming them to serial bits, which are sent to the SCI. The IrDA physical layer specification defines a half-duplex infrared communication link for exchange data. The full standard includes data rates up to 16 Mbits/s. This design covers only data rates between 2.4 Kbits/s and 115.2 Kbits/s. The infrared submodule consists of two major blocks: the transmit encoder and the receive decoder. The SCI transmits serial bits of data which are encoded by the infrared submodule to transmit a narrow pulse for every zero bit. No pulse is transmitted for every one bit. When receiving data, the IR pulses should be detected using an IR photo diode and transformed to CMOS levels by the IR receive decoder (external from the MCU). The narrow pulses are then stretched by the infrared submodule to get back to a serial bit stream to be received by the SCI.The polarity of transmitted pulses and expected receive pulses can be inverted so that a direct connection can be made to external IrDA transceiver modules that use active low pulses. The infrared submodule receives its clock sources from the SCI. One of these two clocks are selected in the infrared submodule in order to generate either 3/16, 1/16, 1/32 or 1/4 narrow pulses during transmission. The infrared block receives two clock sources from the SCI, R16XCLK and R32XCLK, which are configured to generate the narrow pulse width during transmission. The R16XCLK and R32XCLK are internal clocks with frequencies 16 and 32 times the baud rate respectively. Both R16XCLK and R32XCLK clocks are used for transmitting data. The receive decoder uses only the R16XCLK clock. 14.4.1.1 Infrared Transmit Encoder The infrared transmit encoder converts serial bits of data from transmit shift register to the TXD pin. A narrow pulse is transmitted for a zero bit and no pulse for a one bit. The narrow pulse is sent in the middle of the bit with a duration of 1/32, 1/16, 3/16 or 1/4 of a bit time. A narrow high pulse is transmitted for a zero bit when TXPOL is cleared, while a narrow low pulse is transmitted for a zero bit when TXPOL is set. 14.4.1.2 Infrared Receive Decoder The infrared receive block converts data from the RXD pin to the receive shift register. A narrow pulse is expected for each zero received and no pulse is expected for each one received. A narrow high pulse is expected for a zero bit when RXPOL is cleared, while a narrow low pulse is expected for a zero bit when RXPOL is set. This receive decoder meets the edge jitter requirement as defined by the IrDA serial infrared physical layer specification. 14.4.2 LIN Support This module provides some basic support for the LIN protocol. At first this is a break detect circuitry making it easier for the LIN software to distinguish a break character from an incoming data stream. As a further addition is supports a collision detection at the bit level as well as cancelling pending transmissions. MC9S12ZVC Family Reference Manual , Rev. 1.9 452 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.4.3 Data Format The SCI uses the standard NRZ mark/space data format. When Infrared is enabled, the SCI uses RZI data format where zeroes are represented by light pulses and ones remain low. See Figure 14-15 below. 8-Bit Data Format (Bit M in SCICR1 Clear) Start Bit Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Possible Parity Bit Bit 6 STOP Bit Bit 7 Next Start Bit Standard SCI Data Infrared SCI Data 9-Bit Data Format (Bit M in SCICR1 Set) Start Bit Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 POSSIBLE PARITY Bit Bit 6 Bit 7 Bit 8 STOP Bit NEXT START Bit Standard SCI Data Infrared SCI Data Figure 14-15. SCI Data Formats Each data character is contained in a frame that includes a start bit, eight or nine data bits, and a stop bit. Clearing the M bit in SCI control register 1 configures the SCI for 8-bit data characters. A frame with eight data bits has a total of 10 bits. Setting the M bit configures the SCI for nine-bit data characters. A frame with nine data bits has a total of 11 bits. Table 14-14. Example of 8-Bit Data Formats Start Bit Data Bits Address Bits Parity Bits Stop Bit 1 8 0 0 1 1 7 0 1 1 7 1 0 1 1 1 1 The address bit identifies the frame as an address character. See Section 14.4.6.6, "Receiver Wakeup". When the SCI is configured for 9-bit data characters, the ninth data bit is the T8 bit in SCI data register high (SCIDRH). It remains unchanged after transmission and can be used repeatedly without rewriting it. A frame with nine data bits has a total of 11 bits. Table 14-15. Example of 9-Bit Data Formats Start Bit Data Bits Address Bits Parity Bits Stop Bit 1 9 0 0 1 1 8 0 1 1 8 1 0 1 1 1 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 453 Chapter 14 Serial Communication Interface (S12SCIV6) 1 14.4.4 The address bit identifies the frame as an address character. See Section 14.4.6.6, "Receiver Wakeup". Baud Rate Generation A 16-bit modulus counter in the two baud rate generator derives the baud rate for both the receiver and the transmitter. The value from 0 to 65535 written to the SBR15:SBR0 bits determines the baud rate. The value from 0 to 4095 written to the SBR15:SBR4 bits determines the baud rate clock with SBR3:SBR0 for fine adjust. The SBR bits are in the SCI baud rate registers (SCIBDH and SCIBDL) for both transmit and receive baud generator. The baud rate clock is synchronized with the bus clock and drives the receiver. The baud rate clock divided by 16 drives the transmitter. The receiver has an acquisition rate of 16 samples per bit time. Baud rate generation is subject to one source of error: * Integer division of the bus clock may not give the exact target frequency. Table 14-16 lists some examples of achieving target baud rates with a bus clock frequency of 25 MHz. When IREN = 0 then, SCI baud rate = SCI bus clock / (SCIBR[15:0]) Table 14-16. Baud Rates (Example: Bus Clock = 25 MHz) 1 2 Bits SBR[15:0] Receiver1 Clock (Hz) Transmitter2 Clock (Hz) Target Baud Rate Error (%) 109 3669724.8 229,357.8 230,400 .452 217 1843318.0 115,207.4 115,200 .006 651 614439.3 38,402.5 38,400 .006 1302 307219.7 19,201.2 19,200 .006 2604 153,609.8 9600.6 9,600 .006 5208 76,804.9 4800.3 4,800 .006 10417 38,398.8 2399.9 2,400 .003 20833 19,200.3 1200.02 1,200 .00 41667 9599.9 600.0 600 .00 65535 6103.6 381.5 16x faster then baud rate divide 1/16 form transmit baud generator MC9S12ZVC Family Reference Manual , Rev. 1.9 454 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.4.5 Transmitter Internal Bus Transmit baud generator SBR15:SBR4 16 SCI Data Registers Stop SBR3:SBR0 11-Bit Transmit Register H 8 7 6 5 4 3 2 1 0 TXPOL SCTXD L MSB M Start Bus Clock LOOP CONTROL TIE TDRE IRQ Break (All 0s) Parity Generation Preamble (All 1s) PT Shift Enable PE Load from SCIDR T8 To Receiver LOOPS RSRC TDRE TC TC IRQ Transmitter Control TCIE TE BERRIF BER IRQ TCIE SBK BERRM[1:0] Transmit Collision Detect SCTXD SCRXD (From Receiver) Figure 14-16. Transmitter Block Diagram 14.4.5.1 Transmitter Character Length The SCI transmitter can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI control register 1 (SCICR1) determines the length of data characters. When transmitting 9-bit data, bit T8 in SCI data register high (SCIDRH) is the ninth bit (bit 8). 14.4.5.2 Character Transmission To transmit data, the MCU writes the data bits to the SCI data registers (SCIDRH/SCIDRL), which in turn are transferred to the transmitter shift register. The transmit shift register then shifts a frame out through the TXD pin, after it has prefaced them with a start bit and appended them with a stop bit. The SCI data registers (SCIDRH and SCIDRL) are the write-only buffers between the internal data bus and the transmit shift register. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 455 Chapter 14 Serial Communication Interface (S12SCIV6) The SCI also sets a flag, the transmit data register empty flag (TDRE), every time it transfers data from the buffer (SCIDRH/L) to the transmitter shift register.The transmit driver routine may respond to this flag by writing another byte to the Transmitter buffer (SCIDRH/SCIDRL), while the shift register is still shifting out the first byte. To initiate an SCI transmission: 1. Configure the SCI: a) Select a baud rate. Write this value to the SCI baud registers (SCIBDH/L) to begin the baud rate generator. Remember that the baud rate generator is disabled when the baud rate is zero. Writing to the SCIBDH has no effect without also writing to SCIBDL. b) Write to SCICR1 to configure word length, parity, and other configuration bits (LOOPS,RSRC,M,WAKE,ILT,PE,PT). c) Enable the transmitter, interrupts, receive, and wake up as required, by writing to the SCICR2 register bits (TIE,TCIE,RIE,ILIE,TE,RE,RWU,SBK). A preamble or idle character will now be shifted out of the transmitter shift register. 2. Transmit Procedure for each byte: a) Poll the TDRE flag by reading the SCISR1 or responding to the TDRE interrupt. Keep in mind that the TDRE bit resets to one. b) If the TDRE flag is set, write the data to be transmitted to SCIDRH/L, where the ninth bit is written to the T8 bit in SCIDRH if the SCI is in 9-bit data format. A new transmission will not result until the TDRE flag has been cleared. 3. Repeat step 2 for each subsequent transmission. NOTE The TDRE flag is set when the shift register is loaded with the next data to be transmitted from SCIDRH/L, which happens, generally speaking, a little over half-way through the stop bit of the previous frame. Specifically, this transfer occurs 9/16ths of a bit time AFTER the start of the stop bit of the previous frame. Writing the TE bit from 0 to a 1 automatically loads the transmit shift register with a preamble of 10 logic 1s (if M = 0) or 11 logic 1s (if M = 1). After the preamble shifts out, control logic transfers the data from the SCI data register into the transmit shift register. A logic 0 start bit automatically goes into the least significant bit position of the transmit shift register. A logic 1 stop bit goes into the most significant bit position. Hardware supports odd or even parity. When parity is enabled, the most significant bit (MSB) of the data character is the parity bit. The transmit data register empty flag, TDRE, in SCI status register 1 (SCISR1) becomes set when the SCI data register transfers a byte to the transmit shift register. The TDRE flag indicates that the SCI data register can accept new data from the internal data bus. If the transmit interrupt enable bit, TIE, in SCI control register 2 (SCICR2) is also set, the TDRE flag generates a transmitter interrupt request. MC9S12ZVC Family Reference Manual , Rev. 1.9 456 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) When the transmit shift register is not transmitting a frame, the TXD pin goes to the idle condition, logic 1. If at any time software clears the TE bit in SCI control register 2 (SCICR2), the transmitter enable signal goes low and the transmit signal goes idle. If software clears TE while a transmission is in progress (TC = 0), the frame in the transmit shift register continues to shift out. To avoid accidentally cutting off the last frame in a message, always wait for TDRE to go high after the last frame before clearing TE. To separate messages with preambles with minimum idle line time, use this sequence between messages: 1. Write the last byte of the first message to SCIDRH/L. 2. Wait for the TDRE flag to go high, indicating the transfer of the last frame to the transmit shift register. 3. Queue a preamble by clearing and then setting the TE bit. 4. Write the first byte of the second message to SCIDRH/L. 14.4.5.3 Break Characters Writing a logic 1 to the send break bit, SBK, in SCI control register 2 (SCICR2) loads the transmit shift register with a break character. A break character contains all logic 0s and has no start, stop, or parity bit. Break character length depends on the M bit in SCI control register 1 (SCICR1). As long as SBK is at logic 1, transmitter logic continuously loads break characters into the transmit shift register. After software clears the SBK bit, the shift register finishes transmitting the last break character and then transmits at least one logic 1. The automatic logic 1 at the end of a break character guarantees the recognition of the start bit of the next frame. The SCI recognizes a break character when there are 10 or 11(M = 0 or M = 1) consecutive zero received. Depending if the break detect feature is enabled or not receiving a break character has these effects on SCI registers. If the break detect feature is disabled (BKDFE = 0): * Sets the framing error flag, FE * Sets the receive data register full flag, RDRF * Clears the SCI data registers (SCIDRH/L) * May set the overrun flag, OR, noise flag, NF, parity error flag, PE, or the receiver active flag, RAF (see 3.4.4 and 3.4.5 SCI Status Register 1 and 2) If the break detect feature is enabled (BKDFE = 1) there are two scenarios1 The break is detected right from a start bit or is detected during a byte reception. * Sets the break detect interrupt flag, BKDIF * Does not change the data register full flag, RDRF or overrun flag OR * Does not change the framing error flag FE, parity error flag PE. * Does not clear the SCI data registers (SCIDRH/L) * May set noise flag NF, or receiver active flag RAF. 1. A Break character in this context are either 10 or 11 consecutive zero received bits MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 457 Chapter 14 Serial Communication Interface (S12SCIV6) Figure 14-17 shows two cases of break detect. In trace RXD_1 the break symbol starts with the start bit, while in RXD_2 the break starts in the middle of a transmission. If BRKDFE = 1, in RXD_1 case there will be no byte transferred to the receive buffer and the RDRF flag will not be modified. Also no framing error or parity error will be flagged from this transfer. In RXD_2 case, however the break signal starts later during the transmission. At the expected stop bit position the byte received so far will be transferred to the receive buffer, the receive data register full flag will be set, a framing error and if enabled and appropriate a parity error will be set. Once the break is detected the BRKDIF flag will be set. Start Bit Position Stop Bit Position BRKDIF = 1 RXD_1 Zero Bit Counter 1 2 3 4 5 6 7 8 9 10 . . . BRKDIF = 1 FE = 1 RXD_2 Zero Bit Counter 1 2 3 4 5 6 7 8 9 ... 10 Figure 14-17. Break Detection if BRKDFE = 1 (M = 0) 14.4.5.4 Idle Characters An idle character (or preamble) contains all logic 1s and has no start, stop, or parity bit. Idle character length depends on the M bit in SCI control register 1 (SCICR1). The preamble is a synchronizing idle character that begins the first transmission initiated after writing the TE bit from 0 to 1. If the TE bit is cleared during a transmission, the TXD pin becomes idle after completion of the transmission in progress. Clearing and then setting the TE bit during a transmission queues an idle character to be sent after the frame currently being transmitted. NOTE When queueing an idle character, return the TE bit to logic 1 before the stop bit of the current frame shifts out through the TXD pin. Setting TE after the stop bit appears on TXD causes data previously written to the SCI data register to be lost. Toggle the TE bit for a queued idle character while the TDRE flag is set and immediately before writing the next byte to the SCI data register. If the TE bit is clear and the transmission is complete, the SCI is not the master of the TXD pin MC9S12ZVC Family Reference Manual , Rev. 1.9 458 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.4.5.5 LIN Transmit Collision Detection This module allows to check for collisions on the LIN bus. LIN Physical Interface Synchronizer Stage Receive Shift Register Compare Bit Error RXD Pin LIN Bus Bus Clock Sample Point Transmit Shift Register TXD Pin Figure 14-18. Collision Detect Principle 3 4 5 6 7 8 9 BERRM[1:0] = 0:1 10 11 12 13 14 15 0 Sampling End Input Receive Shift Register 2 Sampling Begin Output Transmit Shift Register 1 Sampling End 0 Sampling Begin If the bit error circuit is enabled (BERRM[1:0] = 0:1 or = 1:0]), the error detect circuit will compare the transmitted and the received data stream at a point in time and flag any mismatch. The timing checks run when transmitter is active (not idle). As soon as a mismatch between the transmitted data and the received data is detected the following happens: * The next bit transmitted will have a high level (TXPOL = 0) or low level (TXPOL = 1) * The transmission is aborted and the byte in transmit buffer is discarded. * the transmit data register empty and the transmission complete flag will be set * The bit error interrupt flag, BERRIF, will be set. * No further transmissions will take place until the BERRIF is cleared. BERRM[1:0] = 1:1 Compare Sample Points Figure 14-19. Timing Diagram Bit Error Detection If the bit error detect feature is disabled, the bit error interrupt flag is cleared. NOTE The RXPOL and TXPOL bit should be set the same when transmission collision detect feature is enabled, otherwise the bit error interrupt flag may be set incorrectly. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 459 Chapter 14 Serial Communication Interface (S12SCIV6) 14.4.6 Receiver Internal Bus RXPOL Data Recovery Loop Control H 11-Bit Receive Shift Register 8 7 6 5 4 3 2 1 0 L All 1s SCRXD From TXD Pin or Transmitter Stop Receive Baud Generator MSB Bus Clock SCI Data Register SBR3:SBR0 Start SBR15:SBR4 RE RAF LOOPS RSRC FE M RWU NF WAKE Wakeup Logic ILT PE PE R8 Parity Checking PT Idle IRQ IDLE ILIE BRKDFE OR Break Detect Logic Active Edge Detect Logic RDRF/OR IRQ RDRF BRKDIF BRKDIE RXEDGIF RXEDGIE RIE Break IRQ RX Active Edge IRQ Figure 14-20. SCI Receiver Block Diagram 14.4.6.1 Receiver Character Length The SCI receiver can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI control register 1 (SCICR1) determines the length of data characters. When receiving 9-bit data, bit R8 in SCI data register high (SCIDRH) is the ninth bit (bit 8). 14.4.6.2 Character Reception During an SCI reception, the receive shift register shifts a frame in from the RXD pin. The SCI data register is the read-only buffer between the internal data bus and the receive shift register. After a complete frame shifts into the receive shift register, the data portion of the frame transfers to the SCI data register. The receive data register full flag, RDRF, in SCI status register 1 (SCISR1) becomes set, MC9S12ZVC Family Reference Manual , Rev. 1.9 460 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) indicating that the received byte can be read. If the receive interrupt enable bit, RIE, in SCI control register 2 (SCICR2) is also set, the RDRF flag generates an RDRF interrupt request. 14.4.6.3 Data Sampling The RT clock rate. The RT clock is an internal signal with a frequency 16 times the baud rate. To adjust for baud rate mismatch, the RT clock (see Figure 14-21) is re-synchronized immediatelly at bus clock edge: * After every start bit * After the receiver detects a data bit change from logic 1 to logic 0 (after the majority of data bit samples at RT8, RT9, and RT10 returns a valid logic 1 and the majority of the next RT8, RT9, and RT10 samples returns a valid logic 0) To locate the start bit, data recovery logic does an asynchronous search for a logic 0 preceded by three logic 1s.When the falling edge of a possible start bit occurs, the RT clock begins to count to 16. Start Bit LSB RXD Samples 1 1 1 1 1 1 1 1 0 0 Start Bit Qualification 0 0 Start Bit Verification 0 0 0 Data Sampling RT4 RT3 RT2 RT1 RT16 RT15 RT14 RT13 RT12 RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 RT3 RT2 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT CLock Count RT1 RT Clock Reset RT Clock Figure 14-21. Receiver Data Sampling To verify the start bit and to detect noise, data recovery logic takes samples at RT3, RT5, and RT7. Figure 14-17 summarizes the results of the start bit verification samples. Table 14-17. Start Bit Verification RT3, RT5, and RT7 Samples Start Bit Verification Noise Flag 000 Yes 0 001 Yes 1 010 Yes 1 011 No 0 100 Yes 1 101 No 0 110 No 0 111 No 0 If start bit verification is not successful, the RT clock is reset and a new search for a start bit begins. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 461 Chapter 14 Serial Communication Interface (S12SCIV6) To determine the value of a data bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 14-18 summarizes the results of the data bit samples. Table 14-18. Data Bit Recovery RT8, RT9, and RT10 Samples Data Bit Determination Noise Flag 000 0 0 001 0 1 010 0 1 011 1 1 100 0 1 101 1 1 110 1 1 111 1 0 NOTE The RT8, RT9, and RT10 samples do not affect start bit verification. If any or all of the RT8, RT9, and RT10 start bit samples are logic 1s following a successful start bit verification, the noise flag (NF) is set and the receiver assumes that the bit is a start bit (logic 0). To verify a stop bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 14-19 summarizes the results of the stop bit samples. Table 14-19. Stop Bit Recovery RT8, RT9, and RT10 Samples Framing Error Flag Noise Flag 000 1 0 001 1 1 010 1 1 011 0 1 100 1 1 101 0 1 110 0 1 111 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 462 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) In Figure 14-22 the verification samples RT3 and RT5 determine that the first low detected was noise and not the beginning of a start bit. The RT clock is reset and the start bit search begins again. The noise flag is not set because the noise occurred before the start bit was found. Start Bit LSB 0 0 0 0 0 0 0 RT10 RT1 1 RT9 RT1 1 RT8 RT1 1 RT7 0 RT1 1 RT1 1 RT5 1 RT1 RXD Samples RT3 RT2 RT1 RT16 RT15 RT14 RT13 RT12 RT11 RT6 RT5 RT4 RT3 RT2 RT4 RT3 RT Clock Count RT2 RT Clock Reset RT Clock Figure 14-22. Start Bit Search Example 1 In Figure 14-23, verification sample at RT3 is high. The RT3 sample sets the noise flag. Although the perceived bit time is misaligned, the data samples RT8, RT9, and RT10 are within the bit time and data recovery is successful. Perceived Start Bit Actual Start Bit LSB 1 0 RT1 RT1 RT1 RT1 RT1 1 0 0 0 0 0 RT10 1 RT9 1 RT8 1 RT7 1 RT1 RXD Samples RT7 RT6 RT5 RT4 RT3 RT2 RT1 RT16 RT15 RT14 RT13 RT12 RT11 RT6 RT5 RT4 RT3 RT Clock Count RT2 RT Clock Reset RT Clock Figure 14-23. Start Bit Search Example 2 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 463 Chapter 14 Serial Communication Interface (S12SCIV6) In Figure 14-24, a large burst of noise is perceived as the beginning of a start bit, although the test sample at RT5 is high. The RT5 sample sets the noise flag. Although this is a worst-case misalignment of perceived bit time, the data samples RT8, RT9, and RT10 are within the bit time and data recovery is successful. Perceived Start Bit Actual Start Bit LSB RT1 RT1 0 1 0 0 0 0 RT10 0 RT9 1 RT8 1 RT7 1 RT1 Samples RT1 RXD RT9 RT8 RT7 RT6 RT5 RT4 RT3 RT2 RT1 RT16 RT15 RT14 RT13 RT12 RT11 RT6 RT5 RT4 RT3 RT Clock Count RT2 RT Clock Reset RT Clock Figure 14-24. Start Bit Search Example 3 Figure 14-25 shows the effect of noise early in the start bit time. Although this noise does not affect proper synchronization with the start bit time, it does set the noise flag. Perceived and Actual Start Bit LSB 1 1 RT1 RT1 RT1 RT1 1 1 1 0 RT1 1 RT1 1 RT1 1 RT1 1 RT1 Samples RT1 RXD 1 0 RT3 RT2 RT1 RT16 RT15 RT14 RT13 RT12 RT11 RT9 RT10 RT8 RT7 RT6 RT5 RT4 RT3 RT Clock Count RT2 RT Clock Reset RT Clock Figure 14-25. Start Bit Search Example 4 MC9S12ZVC Family Reference Manual , Rev. 1.9 464 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) Figure 14-26 shows a burst of noise near the beginning of the start bit that resets the RT clock. The sample after the reset is low but is not preceded by three high samples that would qualify as a falling edge. Depending on the timing of the start bit search and on the data, the frame may be missed entirely or it may set the framing error flag. Start Bit 1 0 0 0 0 0 0 0 0 RT1 RT1 1 RT1 RT1 0 RT1 RT1 0 RT1 RT1 1 RT1 RT1 1 RT1 RT1 1 RT1 1 RT7 1 RT1 1 RT1 1 RT1 1 RT1 1 RT1 Samples LSB No Start Bit Found RXD RT1 RT1 RT1 RT1 RT6 RT5 RT4 RT3 RT Clock Count RT2 RT Clock Reset RT Clock Figure 14-26. Start Bit Search Example 5 In Figure 14-27, a noise burst makes the majority of data samples RT8, RT9, and RT10 high. This sets the noise flag but does not reset the RT clock. In start bits only, the RT8, RT9, and RT10 data samples are ignored. Start Bit LSB RT1 RT1 1 0 0 0 0 1 0 1 RT10 RT1 1 RT9 RT1 1 RT8 1 RT7 1 RT1 1 RT1 1 RT1 1 RT1 1 RT1 Samples RT1 RXD RT3 RT2 RT1 RT16 RT15 RT14 RT13 RT12 RT11 RT6 RT5 RT4 RT3 RT Clock Count RT2 RT Clock Reset RT Clock Figure 14-27. Start Bit Search Example 6 14.4.6.4 Framing Errors If the data recovery logic does not detect a logic 1 where the stop bit should be in an incoming frame, it sets the framing error flag, FE, in SCI status register 1 (SCISR1). A break character also sets the FE flag because a break character has no stop bit. The FE flag is set at the same time that the RDRF flag is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 465 Chapter 14 Serial Communication Interface (S12SCIV6) 14.4.6.5 Baud Rate Tolerance A transmitting device may be operating at a baud rate below or above the receiver baud rate. Accumulated bit time misalignment can cause one of the three stop bit data samples (RT8, RT9, and RT10) to fall outside the actual stop bit. A noise error will occur if the RT8, RT9, and RT10 samples are not all the same logical values. A framing error will occur if the receiver clock is misaligned in such a way that the majority of the RT8, RT9, and RT10 stop bit samples are a logic zero. As the receiver samples an incoming frame, it re-synchronizes the RT clock on any valid falling edge within the frame. Re synchronization within frames will correct a misalignment between transmitter bit times and receiver bit times. 14.4.6.5.1 Slow Data Tolerance Figure 14-28 shows how much a slow received frame can be misaligned without causing a noise error or a framing error. The slow stop bit begins at RT8 instead of RT1 but arrives in time for the stop bit data samples at RT8, RT9, and RT10. MSB Stop RT16 RT15 RT14 RT13 RT12 RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 RT3 RT2 RT1 Receiver RT Clock Data Samples Figure 14-28. Slow Data Let's take RTr as receiver RT clock and RTt as transmitter RT clock. For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles +7 RTr cycles = 151 RTr cycles to start data sampling of the stop bit. With the misaligned character shown in Figure 14-28, the receiver counts 151 RTr cycles at the point when the count of the transmitting device is 9 bit times x 16 RTt cycles = 144 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a slow 8-bit data character with no errors is: ((151 - 144) / 151) x 100 = 4.63% For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 7 RTr cycles = 167 RTr cycles to start data sampling of the stop bit. With the misaligned character shown in Figure 14-28, the receiver counts 167 RTr cycles at the point when the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a slow 9-bit character with no errors is: ((167 - 160) / 167) X 100 = 4.19% MC9S12ZVC Family Reference Manual , Rev. 1.9 466 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.4.6.5.2 Fast Data Tolerance Figure 14-29 shows how much a fast received frame can be misaligned. The fast stop bit ends at RT10 instead of RT16 but is still sampled at RT8, RT9, and RT10. Stop Idle or Next Frame RT16 RT15 RT14 RT13 RT12 RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 RT3 RT2 RT1 Receiver RT Clock Data Samples Figure 14-29. Fast Data For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles + 9 RTr cycles = 153 RTr cycles to finish data sampling of the stop bit. With the misaligned character shown in Figure 14-29, the receiver counts 153 RTr cycles at the point when the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a fast 8-bit character with no errors is: ((160 - 153) / 160) x 100 = 4.375% For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 9 RTr cycles = 169 RTr cycles to finish data sampling of the stop bit. With the misaligned character shown in Figure 14-29, the receiver counts 169 RTr cycles at the point when the count of the transmitting device is 11 bit times x 16 RTt cycles = 176 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a fast 9-bit character with no errors is: ((176 - 169) /176) x 100 = 3.98% NOTE Due to asynchronous sample and internal logic, there is maximal 2 bus cycles between startbit edge and 1st RT clock, and cause to additional tolerance loss at worst case. The loss should be 2/SBR/10*100%, it is small.For example, for highspeed baud=230400 with 25MHz bus, SBR should be 109, and the tolerance loss is 2/109/10*100=0.18%, and fast data tolerance is 4.375%-0.18%=4.195%. 14.4.6.6 Receiver Wakeup To enable the SCI to ignore transmissions intended only for other receivers in multiple-receiver systems, the receiver can be put into a standby state. Setting the receiver wakeup bit, RWU, in SCI control register 2 (SCICR2) puts the receiver into standby state during which receiver interrupts are disabled.The SCI will still load the receive data into the SCIDRH/L registers, but it will not set the RDRF flag. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 467 Chapter 14 Serial Communication Interface (S12SCIV6) The transmitting device can address messages to selected receivers by including addressing information in the initial frame or frames of each message. The WAKE bit in SCI control register 1 (SCICR1) determines how the SCI is brought out of the standby state to process an incoming message. The WAKE bit enables either idle line wakeup or address mark wakeup. 14.4.6.6.1 Idle Input line Wakeup (WAKE = 0) In this wakeup method, an idle condition on the RXD pin clears the RWU bit and wakes up the SCI. The initial frame or frames of every message contain addressing information. All receivers evaluate the addressing information, and receivers for which the message is addressed process the frames that follow. Any receiver for which a message is not addressed can set its RWU bit and return to the standby state. The RWU bit remains set and the receiver remains on standby until another idle character appears on the RXD pin. Idle line wakeup requires that messages be separated by at least one idle character and that no message contains idle characters. The idle character that wakes a receiver does not set the receiver idle bit, IDLE, or the receive data register full flag, RDRF. The idle line type bit, ILT, determines whether the receiver begins counting logic 1s as idle character bits after the start bit or after the stop bit. ILT is in SCI control register 1 (SCICR1). 14.4.6.6.2 Address Mark Wakeup (WAKE = 1) In this wakeup method, a logic 1 in the most significant bit (MSB) position of a frame clears the RWU bit and wakes up the SCI. The logic 1 in the MSB position marks a frame as an address frame that contains addressing information. All receivers evaluate the addressing information, and the receivers for which the message is addressed process the frames that follow.Any receiver for which a message is not addressed can set its RWU bit and return to the standby state. The RWU bit remains set and the receiver remains on standby until another address frame appears on the RXD pin. The logic 1 MSB of an address frame clears the receiver's RWU bit before the stop bit is received and sets the RDRF flag. Address mark wakeup allows messages to contain idle characters but requires that the MSB be reserved for use in address frames. NOTE With the WAKE bit clear, setting the RWU bit after the RXD pin has been idle can cause the receiver to wake up immediately. 14.4.7 Single-Wire Operation Normally, the SCI uses two pins for transmitting and receiving. In single-wire operation, the RXD pin is disconnected from the SCI. The SCI uses the TXD pin for both receiving and transmitting. MC9S12ZVC Family Reference Manual , Rev. 1.9 468 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) Transmitter Receiver TXD RXD Figure 14-30. Single-Wire Operation (LOOPS = 1, RSRC = 1) Enable single-wire operation by setting the LOOPS bit and the receiver source bit, RSRC, in SCI control register 1 (SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Setting the RSRC bit connects the TXD pin to the receiver. Both the transmitter and receiver must be enabled (TE = 1 and RE = 1).The TXDIR bit (SCISR2[1]) determines whether the TXD pin is going to be used as an input (TXDIR = 0) or an output (TXDIR = 1) in this mode of operation. NOTE In single-wire operation data from the TXD pin is inverted if RXPOL is set. 14.4.8 Loop Operation In loop operation the transmitter output goes to the receiver input. The RXD pin is disconnected from the SCI. Transmitter TXD Receiver RXD Figure 14-31. Loop Operation (LOOPS = 1, RSRC = 0) Enable loop operation by setting the LOOPS bit and clearing the RSRC bit in SCI control register 1 (SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Clearing the RSRC bit connects the transmitter output to the receiver input. Both the transmitter and receiver must be enabled (TE = 1 and RE = 1). NOTE In loop operation data from the transmitter is not recognized by the receiver if RXPOL and TXPOL are not the same. 14.5 14.5.1 Initialization/Application Information Reset Initialization See Section 14.3.2, "Register Descriptions". MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 469 Chapter 14 Serial Communication Interface (S12SCIV6) 14.5.2 14.5.2.1 Modes of Operation Run Mode Normal mode of operation. To initialize a SCI transmission, see Section 14.4.5.2, "Character Transmission". 14.5.2.2 Wait Mode SCI operation in wait mode depends on the state of the SCISWAI bit in the SCI control register 1 (SCICR1). * If SCISWAI is clear, the SCI operates normally when the CPU is in wait mode. * If SCISWAI is set, SCI clock generation ceases and the SCI module enters a power-conservation state when the CPU is in wait mode. Setting SCISWAI does not affect the state of the receiver enable bit, RE, or the transmitter enable bit, TE. If SCISWAI is set, any transmission or reception in progress stops at wait mode entry. The transmission or reception resumes when either an internal or external interrupt brings the CPU out of wait mode. Exiting wait mode by reset aborts any transmission or reception in progress and resets the SCI. 14.5.2.3 Stop Mode The SCI is inactive during stop mode for reduced power consumption. The STOP instruction does not affect the SCI register states, but the SCI bus clock will be disabled. The SCI operation resumes from where it left off after an external interrupt brings the CPU out of stop mode. Exiting stop mode by reset aborts any transmission or reception in progress and resets the SCI. The receive input active edge detect circuit is still active in stop mode. An active edge on the receive input can be used to bring the CPU out of stop mode. 14.5.3 Interrupt Operation This section describes the interrupt originated by the SCI block.The MCU must service the interrupt requests. Table 14-20 lists the eight interrupt sources of the SCI. Table 14-20. SCI Interrupt Sources Interrupt Source Local Enable Description TDRE SCISR1[7] TIE Active high level. Indicates that a byte was transferred from SCIDRH/L to the transmit shift register. TC SCISR1[6] TCIE RDRF SCISR1[5] RIE OR SCISR1[3] IDLE SCISR1[4] Active high level. Indicates that a transmit is complete. Active high level. The RDRF interrupt indicates that received data is available in the SCI data register. Active high level. This interrupt indicates that an overrun condition has occurred. ILIE Active high level. Indicates that receiver input has become idle. MC9S12ZVC Family Reference Manual , Rev. 1.9 470 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) Table 14-20. SCI Interrupt Sources RXEDGIF SCIASR1[7] RXEDGIE Active high level. Indicates that an active edge (falling for RXPOL = 0, rising for RXPOL = 1) was detected. BERRIF SCIASR1[1] BERRIE Active high level. Indicates that a mismatch between transmitted and received data in a single wire application has happened. BKDIF SCIASR1[0] BRKDIE Active high level. Indicates that a break character has been received. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 471 Chapter 14 Serial Communication Interface (S12SCIV6) 14.5.3.1 Description of Interrupt Operation The SCI only originates interrupt requests. The following is a description of how the SCI makes a request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt number are chip dependent. The SCI only has a single interrupt line (SCI Interrupt Signal, active high operation) and all the following interrupts, when generated, are ORed together and issued through that port. 14.5.3.1.1 TDRE Description The TDRE interrupt is set high by the SCI when the transmit shift register receives a byte from the SCI data register. A TDRE interrupt indicates that the transmit data register (SCIDRH/L) is empty and that a new byte can be written to the SCIDRH/L for transmission.Clear TDRE by reading SCI status register 1 with TDRE set and then writing to SCI data register low (SCIDRL). 14.5.3.1.2 TC Description The TC interrupt is set by the SCI when a transmission has been completed. Transmission is completed when all bits including the stop bit (if transmitted) have been shifted out and no data is queued to be transmitted. No stop bit is transmitted when sending a break character and the TC flag is set (providing there is no more data queued for transmission) when the break character has been shifted out. A TC interrupt indicates that there is no transmission in progress. TC is set high when the TDRE flag is set and no data, preamble, or break character is being transmitted. When TC is set, the TXD pin becomes idle (logic 1). Clear TC by reading SCI status register 1 (SCISR1) with TC set and then writing to SCI data register low (SCIDRL).TC is cleared automatically when data, preamble, or break is queued and ready to be sent. 14.5.3.1.3 RDRF Description The RDRF interrupt is set when the data in the receive shift register transfers to the SCI data register. A RDRF interrupt indicates that the received data has been transferred to the SCI data register and that the byte can now be read by the MCU. The RDRF interrupt is cleared by reading the SCI status register one (SCISR1) and then reading SCI data register low (SCIDRL). 14.5.3.1.4 OR Description The OR interrupt is set when software fails to read the SCI data register before the receive shift register receives the next frame. The newly acquired data in the shift register will be lost in this case, but the data already in the SCI data registers is not affected. The OR interrupt is cleared by reading the SCI status register one (SCISR1) and then reading SCI data register low (SCIDRL). 14.5.3.1.5 IDLE Description The IDLE interrupt is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M = 1) appear on the receiver input. Once the IDLE is cleared, a valid frame must again set the RDRF flag before an idle condition can set the IDLE flag. Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE set and then reading SCI data register low (SCIDRL). MC9S12ZVC Family Reference Manual , Rev. 1.9 472 NXP Semiconductors Chapter 14 Serial Communication Interface (S12SCIV6) 14.5.3.1.6 RXEDGIF Description The RXEDGIF interrupt is set when an active edge (falling if RXPOL = 0, rising if RXPOL = 1) on the RXD pin is detected. Clear RXEDGIF by writing a "1" to the SCIASR1 SCI alternative status register 1. 14.5.3.1.7 BERRIF Description The BERRIF interrupt is set when a mismatch between the transmitted and the received data in a single wire application like LIN was detected. Clear BERRIF by writing a "1" to the SCIASR1 SCI alternative status register 1. This flag is also cleared if the bit error detect feature is disabled. 14.5.3.1.8 BKDIF Description The BKDIF interrupt is set when a break signal was received. Clear BKDIF by writing a "1" to the SCIASR1 SCI alternative status register 1. This flag is also cleared if break detect feature is disabled. 14.5.4 Recovery from Wait Mode The SCI interrupt request can be used to bring the CPU out of wait mode. 14.5.5 Recovery from Stop Mode An active edge on the receive input can be used to bring the CPU out of stop mode. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 473 Chapter 14 Serial Communication Interface (S12SCIV6) MC9S12ZVC Family Reference Manual , Rev. 1.9 474 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) 15.1 Introduction The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral devices. Software can poll the SPI status flags or the SPI operation can be interrupt driven. 15.1.1 Glossary of Terms SPI Serial Peripheral Interface SS Slave Select SCK Serial Clock MOSI Master Output, Slave Input MISO Master Input, Slave Output MOMI Master Output, Master Input SISO 15.1.2 Slave Input, Slave Output Features The SPI includes these distinctive features: * Master mode and slave mode * Selectable 8 or 16-bit transfer width * Bidirectional mode * Slave select output * Mode fault error flag with CPU interrupt capability * Double-buffered data register * Serial clock with programmable polarity and phase * Control of SPI operation during wait mode 15.1.3 Modes of Operation The SPI functions in three modes: run, wait, and stop. * Run mode This is the basic mode of operation. * Wait mode MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 475 Chapter 15 Serial Peripheral Interface (S12SPIV5) * SPI operation in wait mode is a configurable low power mode, controlled by the SPISWAI bit located in the SPICR2 register. In wait mode, if the SPISWAI bit is clear, the SPI operates like in run mode. If the SPISWAI bit is set, the SPI goes into a power conservative state, with the SPI clock generation turned off. If the SPI is configured as a master, any transmission in progress stops, but is resumed after CPU goes into run mode. If the SPI is configured as a slave, reception and transmission of data continues, so that the slave stays synchronized to the master. Stop mode The SPI is inactive in stop mode for reduced power consumption. If the SPI is configured as a master, any transmission in progress stops, but is resumed after CPU goes into run mode. If the SPI is configured as a slave, reception and transmission of data continues, so that the slave stays synchronized to the master. For a detailed description of operating modes, please refer to Section 15.4.7, "Low Power Mode Options". 15.1.4 Block Diagram Figure 15-1 gives an overview on the SPI architecture. The main parts of the SPI are status, control and data registers, shifter logic, baud rate generator, master/slave control logic, and port control logic. MC9S12ZVC Family Reference Manual , Rev. 1.9 476 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) SPI 2 SPI Control Register 1 BIDIROE 2 SPI Control Register 2 SPC0 SPI Status Register SPIF MODF SPTEF Slave Control Interrupt Control CPOL Slave Baud Rate SPI Interrupt Request Master Baud Rate Baud Rate Generator CPHA Phase + Polarity Control Phase + Polarity Control SCK In MISO SCK Out Port Control Logic Master Control Counter Bus Clock Prescaler SPPR 3 Clock Select SCK SS Baud Rate 3 SPR MOSI Shift Clock Sample Clock Shifter SPI Baud Rate Register Data In LSBFE=1 LSBFE=0 MSB SPI Data Register LSBFE=0 LSBFE=1 LSBFE=0 LSB LSBFE=1 Data Out Figure 15-1. SPI Block Diagram 15.2 External Signal Description This section lists the name and description of all ports including inputs and outputs that do, or may, connect off chip. The SPI module has a total of four external pins. 15.2.1 MOSI -- Master Out/Slave In Pin This pin is used to transmit data out of the SPI module when it is configured as a master and receive data when it is configured as slave. 15.2.2 MISO -- Master In/Slave Out Pin This pin is used to transmit data out of the SPI module when it is configured as a slave and receive data when it is configured as master. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 477 Chapter 15 Serial Peripheral Interface (S12SPIV5) 15.2.3 SS -- Slave Select Pin This pin is used to output the select signal from the SPI module to another peripheral with which a data transfer is to take place when it is configured as a master and it is used as an input to receive the slave select signal when the SPI is configured as slave. 15.2.4 SCK -- Serial Clock Pin In master mode, this is the synchronous output clock. In slave mode, this is the synchronous input clock. 15.3 Memory Map and Register Definition This section provides a detailed description of address space and registers used by the SPI. 15.3.1 Module Memory Map The memory map for the SPI is given in Figure 15-2. The address listed for each register is the sum of a base address and an address offset. The base address is defined at the SoC level and the address offset is defined at the module level. Reads from the reserved bits return zeros and writes to the reserved bits have no effect. Register Name Bit 7 6 5 4 3 2 1 Bit 0 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE MODFEN BIDIROE SPISWAI SPC0 SPR2 SPR1 SPR0 0x0000 SPICR1 R W 0x0001 SPICR2 R W 0 0x0002 SPIBR R W 0 0x0003 SPISR R W 0x0004 SPIDRH XFRW 0 0 0 SPPR2 SPPR1 SPPR0 SPIF 0 SPTEF MODF 0 0 0 0 R W R15 T15 R14 T14 R13 T13 R12 T12 R11 T11 R10 T10 R9 T9 R8 T8 0x0005 SPIDRL R W R7 T7 R6 T6 R5 T5 R4 T4 R3 T3 R2 T2 R1 T1 R0 T0 0x0006 Reserved R W 0x0007 Reserved R W = Unimplemented or Reserved Figure 15-2. SPI Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 478 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) 15.3.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. 15.3.2.1 SPI Control Register 1 (SPICR1) Module Base +0x0000 R W Reset 7 6 5 4 3 2 1 0 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE 0 0 0 0 0 1 0 0 Figure 15-3. SPI Control Register 1 (SPICR1) Read: Anytime Write: Anytime Table 15-1. SPICR1 Field Descriptions Field Description 7 SPIE SPI Interrupt Enable Bit -- This bit enables SPI interrupt requests, if SPIF or MODF status flag is set. 0 SPI interrupts disabled. 1 SPI interrupts enabled. 6 SPE SPI System Enable Bit -- This bit enables the SPI system and dedicates the SPI port pins to SPI system functions. If SPE is cleared, SPI is disabled and forced into idle state, status bits in SPISR register are reset. 0 SPI disabled (lower power consumption). 1 SPI enabled, port pins are dedicated to SPI functions. 5 SPTIE SPI Transmit Interrupt Enable -- This bit enables SPI interrupt requests, if SPTEF flag is set. 0 SPTEF interrupt disabled. 1 SPTEF interrupt enabled. 4 MSTR SPI Master/Slave Mode Select Bit -- This bit selects whether the SPI operates in master or slave mode. Switching the SPI from master to slave or vice versa forces the SPI system into idle state. 0 SPI is in slave mode. 1 SPI is in master mode. 3 CPOL SPI Clock Polarity Bit -- This bit selects an inverted or non-inverted SPI clock. To transmit data between SPI modules, the SPI modules must have identical CPOL values. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Active-high clocks selected. In idle state SCK is low. 1 Active-low clocks selected. In idle state SCK is high. 2 CPHA SPI Clock Phase Bit -- This bit is used to select the SPI clock format. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Sampling of data occurs at odd edges (1,3,5,...) of the SCK clock. 1 Sampling of data occurs at even edges (2,4,6,...) of the SCK clock. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 479 Chapter 15 Serial Peripheral Interface (S12SPIV5) Table 15-1. SPICR1 Field Descriptions (continued) Field Description 1 SSOE Slave Select Output Enable -- The SS output feature is enabled only in master mode, if MODFEN is set, by asserting the SSOE as shown in Table 15-2. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 LSBFE LSB-First Enable -- This bit does not affect the position of the MSB and LSB in the data register. Reads and writes of the data register always have the MSB in the highest bit position. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Data is transferred most significant bit first. 1 Data is transferred least significant bit first. Table 15-2. SS Input / Output Selection MODFEN 15.3.2.2 SSOE Master Mode Slave Mode 0 0 SS not used by SPI SS input 0 1 SS not used by SPI SS input 1 0 SS input with MODF feature SS input 1 1 SS is slave select output SS input SPI Control Register 2 (SPICR2) Module Base +0x0001 7 R 0 W Reset 0 6 XFRW 0 5 0 0 4 3 MODFEN BIDIROE 0 0 2 0 0 1 0 SPISWAI SPC0 0 0 = Unimplemented or Reserved Figure 15-4. SPI Control Register 2 (SPICR2) Read: Anytime Write: Anytime; writes to the reserved bits have no effect MC9S12ZVC Family Reference Manual , Rev. 1.9 480 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) Table 15-3. SPICR2 Field Descriptions Field Description 6 XFRW Transfer Width -- This bit is used for selecting the data transfer width. If 8-bit transfer width is selected, SPIDRL becomes the dedicated data register and SPIDRH is unused. If 16-bit transfer width is selected, SPIDRH and SPIDRL form a 16-bit data register. Please refer to Section 15.3.2.4, "SPI Status Register (SPISR) for information about transmit/receive data handling and the interrupt flag clearing mechanism. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 8-bit Transfer Width (n = 8)1 1 16-bit Transfer Width (n = 16)1 4 MODFEN Mode Fault Enable Bit -- This bit allows the MODF failure to be detected. If the SPI is in master mode and MODFEN is cleared, then the SS port pin is not used by the SPI. In slave mode, the SS is available only as an input regardless of the value of MODFEN. For an overview on the impact of the MODFEN bit on the SS port pin configuration, refer to Table 15-2. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 SS port pin is not used by the SPI. 1 SS port pin with MODF feature. 3 BIDIROE Output Enable in the Bidirectional Mode of Operation -- This bit controls the MOSI and MISO output buffer of the SPI, when in bidirectional mode of operation (SPC0 is set). In master mode, this bit controls the output buffer of the MOSI port, in slave mode it controls the output buffer of the MISO port. In master mode, with SPC0 set, a change of this bit will abort a transmission in progress and force the SPI into idle state. 0 Output buffer disabled. 1 Output buffer enabled. 1 SPISWAI SPI Stop in Wait Mode Bit -- This bit is used for power conservation while in wait mode. 0 SPI clock operates normally in wait mode. 1 Stop SPI clock generation when in wait mode. 0 SPC0 1 Serial Pin Control Bit 0 -- This bit enables bidirectional pin configurations as shown in Table 15-4. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. n is used later in this document as a placeholder for the selected transfer width. Table 15-4. Bidirectional Pin Configurations Pin Mode SPC0 BIDIROE MISO MOSI Master Mode of Operation Normal 0 Bidirectional 1 X Master In 0 MISO not used by SPI 1 Master Out Master In Master I/O Slave Mode of Operation Normal 0 Bidirectional 1 X Slave Out Slave In 0 Slave In MOSI not used by SPI 1 Slave I/O MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 481 Chapter 15 Serial Peripheral Interface (S12SPIV5) 15.3.2.3 SPI Baud Rate Register (SPIBR) Module Base +0x0002 7 R 0 W Reset 0 6 5 4 3 SPPR2 SPPR1 SPPR0 0 0 0 0 0 2 1 0 SPR2 SPR1 SPR0 0 0 0 = Unimplemented or Reserved Figure 15-5. SPI Baud Rate Register (SPIBR) Read: Anytime Write: Anytime; writes to the reserved bits have no effect Table 15-5. SPIBR Field Descriptions Field Description 6-4 SPPR[2:0] SPI Baud Rate Preselection Bits -- These bits specify the SPI baud rates as shown in Table 15-6. In master mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state. 2-0 SPR[2:0] SPI Baud Rate Selection Bits -- These bits specify the SPI baud rates as shown in Table 15-6. In master mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state. The baud rate divisor equation is as follows: BaudRateDivisor = (SPPR + 1) 2(SPR + 1) Eqn. 15-1 The baud rate can be calculated with the following equation: Baud Rate = BusClock / BaudRateDivisor Eqn. 15-2 NOTE For maximum allowed baud rates, please refer to the SPI Electrical Specification in the Electricals chapter of this data sheet. Table 15-6. Example SPI Baud Rate Selection (25 MHz Bus Clock) (Sheet 1 of 3) SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud Rate Divisor Baud Rate 0 0 0 0 0 0 2 12.5 Mbit/s 0 0 0 0 0 1 4 6.25 Mbit/s 0 0 0 0 1 0 8 3.125 Mbit/s 0 0 0 0 1 1 16 1.5625 Mbit/s 0 0 0 1 0 0 32 781.25 kbit/s 0 0 0 1 0 1 64 390.63 kbit/s 0 0 0 1 1 0 128 195.31 kbit/s 0 0 0 1 1 1 256 97.66 kbit/s 0 0 1 0 0 0 4 6.25 Mbit/s 0 0 1 0 0 1 8 3.125 Mbit/s MC9S12ZVC Family Reference Manual , Rev. 1.9 482 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) Table 15-6. Example SPI Baud Rate Selection (25 MHz Bus Clock) (Sheet 2 of 3) SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud Rate Divisor Baud Rate 0 0 1 0 1 0 16 1.5625 Mbit/s 0 0 1 0 1 1 32 781.25 kbit/s 0 0 1 1 0 0 64 390.63 kbit/s 0 0 1 1 0 1 128 195.31 kbit/s 0 0 1 1 1 0 256 97.66 kbit/s 0 0 1 1 1 1 512 48.83 kbit/s 0 1 0 0 0 0 6 4.16667 Mbit/s 0 1 0 0 0 1 12 2.08333 Mbit/s 0 1 0 0 1 0 24 1.04167 Mbit/s 0 1 0 0 1 1 48 520.83 kbit/s 0 1 0 1 0 0 96 260.42 kbit/s 0 1 0 1 0 1 192 130.21 kbit/s 0 1 0 1 1 0 384 65.10 kbit/s 0 1 0 1 1 1 768 32.55 kbit/s 0 1 1 0 0 0 8 3.125 Mbit/s 0 1 1 0 0 1 16 1.5625 Mbit/s 0 1 1 0 1 0 32 781.25 kbit/s 0 1 1 0 1 1 64 390.63 kbit/s 0 1 1 1 0 0 128 195.31 kbit/s 0 1 1 1 0 1 256 97.66 kbit/s 0 1 1 1 1 0 512 48.83 kbit/s 0 1 1 1 1 1 1024 24.41 kbit/s 1 0 0 0 0 0 10 2.5 Mbit/s 1 0 0 0 0 1 20 1.25 Mbit/s 1 0 0 0 1 0 40 625 kbit/s 1 0 0 0 1 1 80 312.5 kbit/s 1 0 0 1 0 0 160 156.25 kbit/s 1 0 0 1 0 1 320 78.13 kbit/s 1 0 0 1 1 0 640 39.06 kbit/s 1 0 0 1 1 1 1280 19.53 kbit/s 1 0 1 0 0 0 12 2.08333 Mbit/s 1 0 1 0 0 1 24 1.04167 Mbit/s 1 0 1 0 1 0 48 520.83 kbit/s 1 0 1 0 1 1 96 260.42 kbit/s 1 0 1 1 0 0 192 130.21 kbit/s 1 0 1 1 0 1 384 65.10 kbit/s 1 0 1 1 1 0 768 32.55 kbit/s 1 0 1 1 1 1 1536 16.28 kbit/s 1 1 0 0 0 0 14 1.78571 Mbit/s 1 1 0 0 0 1 28 892.86 kbit/s 1 1 0 0 1 0 56 446.43 kbit/s 1 1 0 0 1 1 112 223.21 kbit/s MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 483 Chapter 15 Serial Peripheral Interface (S12SPIV5) Table 15-6. Example SPI Baud Rate Selection (25 MHz Bus Clock) (Sheet 3 of 3) SPR2 SPR1 SPR0 Baud Rate Divisor Baud Rate 0 1 0 0 224 111.61 kbit/s 0 1 0 1 448 55.80 kbit/s 1 0 1 1 0 896 27.90 kbit/s 1 0 1 1 1 1792 13.95 kbit/s 1 0 0 0 16 1.5625 Mbit/s 1 0 0 1 32 781.25 kbit/s 1 0 1 0 64 390.63 kbit/s 1 0 1 1 128 195.31 kbit/s 1 1 1 0 0 256 97.66 kbit/s 1 1 1 0 1 512 48.83 kbit/s 1 1 1 1 1 0 1024 24.41 kbit/s 1 1 1 1 1 1 2048 12.21 kbit/s SPPR2 SPPR1 SPPR0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15.3.2.4 SPI Status Register (SPISR) Module Base +0x0003 R 7 6 5 4 3 2 1 0 SPIF 0 SPTEF MODF 0 0 0 0 0 0 1 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 15-6. SPI Status Register (SPISR) Read: Anytime Write: Has no effect Table 15-7. SPISR Field Descriptions Field Description 7 SPIF SPIF Interrupt Flag -- This bit is set after received data has been transferred into the SPI data register. For information about clearing SPIF Flag, please refer to Table 15-8. 0 Transfer not yet complete. 1 New data copied to SPIDR. MC9S12ZVC Family Reference Manual , Rev. 1.9 484 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) Table 15-7. SPISR Field Descriptions (continued) Field Description 5 SPTEF SPI Transmit Empty Interrupt Flag -- If set, this bit indicates that the transmit data register is empty. For information about clearing this bit and placing data into the transmit data register, please refer to Table 15-9. 0 SPI data register not empty. 1 SPI data register empty. 4 MODF Mode Fault Flag -- This bit is set if the SS input becomes low while the SPI is configured as a master and mode fault detection is enabled, MODFEN bit of SPICR2 register is set. Refer to MODFEN bit description in Section 15.3.2.2, "SPI Control Register 2 (SPICR2)". The flag is cleared automatically by a read of the SPI status register (with MODF set) followed by a write to the SPI control register 1. 0 Mode fault has not occurred. 1 Mode fault has occurred. Table 15-8. SPIF Interrupt Flag Clearing Sequence XFRW Bit SPIF Interrupt Flag Clearing Sequence 0 Read SPISR with SPIF == 1 1 Read SPISR with SPIF == 1 then Read SPIDRL Byte Read SPIDRL 1 or then Byte Read SPIDRH 2 Byte Read SPIDRL or Word Read (SPIDRH:SPIDRL) 1 2 Data in SPIDRH is lost in this case. SPIDRH can be read repeatedly without any effect on SPIF. SPIF Flag is cleared only by the read of SPIDRL after reading SPISR with SPIF == 1. Table 15-9. SPTEF Interrupt Flag Clearing Sequence XFRW Bit SPTEF Interrupt Flag Clearing Sequence 0 Read SPISR with SPTEF == 1 1 Read SPISR with SPTEF == 1 then Write to SPIDRL 1 Byte Write to SPIDRL 12 or then Byte Write to SPIDRH 13 Byte Write to SPIDRL 1 or Word Write to (SPIDRH:SPIDRL) 1 1 Any write to SPIDRH or SPIDRL with SPTEF == 0 is effectively ignored. Data in SPIDRH is undefined in this case. 3 SPIDRH can be written repeatedly without any effect on SPTEF. SPTEF Flag is cleared only by writing to SPIDRL after reading SPISR with SPTEF == 1. 2 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 485 Chapter 15 Serial Peripheral Interface (S12SPIV5) 15.3.2.5 SPI Data Register (SPIDR = SPIDRH:SPIDRL) Module Base +0x0004 7 6 5 4 3 2 1 0 R R15 R14 R13 R12 R11 R10 R9 R8 W T15 T14 T13 T12 T11 T10 T9 T8 0 0 0 0 0 0 0 0 Reset Figure 15-7. SPI Data Register High (SPIDRH) Module Base +0x0005 7 6 5 4 3 2 1 0 R R7 R6 R5 R4 R3 R2 R1 R0 W T7 T6 T5 T4 T3 T2 T1 T0 0 0 0 0 0 0 0 0 Reset Figure 15-8. SPI Data Register Low (SPIDRL) Read: Anytime; read data only valid when SPIF is set Write: Anytime The SPI data register is both the input and output register for SPI data. A write to this register allows data to be queued and transmitted. For an SPI configured as a master, queued data is transmitted immediately after the previous transmission has completed. The SPI transmitter empty flag SPTEF in the SPISR register indicates when the SPI data register is ready to accept new data. Received data in the SPIDR is valid when SPIF is set. If SPIF is cleared and data has been received, the received data is transferred from the receive shift register to the SPIDR and SPIF is set. If SPIF is set and not serviced, and a second data value has been received, the second received data is kept as valid data in the receive shift register until the start of another transmission. The data in the SPIDR does not change. If SPIF is set and valid data is in the receive shift register, and SPIF is serviced before the start of a third transmission, the data in the receive shift register is transferred into the SPIDR and SPIF remains set (see Figure 15-9). If SPIF is set and valid data is in the receive shift register, and SPIF is serviced after the start of a third transmission, the data in the receive shift register has become invalid and is not transferred into the SPIDR (see Figure 15-10). MC9S12ZVC Family Reference Manual , Rev. 1.9 486 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) Data A Received Data B Received Data C Received SPIF Serviced Receive Shift Register Data B Data A Data C SPIF SPI Data Register = Unspecified Data C Data B Data A = Reception in progress Figure 15-9. Reception with SPIF serviced in Time Data A Received Data B Received Data B Lost Data C Received SPIF Serviced Receive Shift Register Data B Data A Data C SPIF SPI Data Register Data A = Unspecified Data C = Reception in progress Figure 15-10. Reception with SPIF serviced too late 15.4 Functional Description The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral devices. Software can poll the SPI status flags or SPI operation can be interrupt driven. The SPI system is enabled by setting the SPI enable (SPE) bit in SPI control register 1. While SPE is set, the four associated SPI port pins are dedicated to the SPI function as: * Slave select (SS) * Serial clock (SCK) * Master out/slave in (MOSI) * Master in/slave out (MISO) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 487 Chapter 15 Serial Peripheral Interface (S12SPIV5) The main element of the SPI system is the SPI data register. The n-bit1 data register in the master and the n-bit1 data register in the slave are linked by the MOSI and MISO pins to form a distributed 2n-bit1 register. When a data transfer operation is performed, this 2n-bit1 register is serially shifted n1 bit positions by the S-clock from the master, so data is exchanged between the master and the slave. Data written to the master SPI data register becomes the output data for the slave, and data read from the master SPI data register after a transfer operation is the input data from the slave. A read of SPISR with SPTEF = 1 followed by a write to SPIDR puts data into the transmit data register. When a transfer is complete and SPIF is cleared, received data is moved into the receive data register. This data register acts as the SPI receive data register for reads and as the SPI transmit data register for writes. A common SPI data register address is shared for reading data from the read data buffer and for writing data to the transmit data register. The clock phase control bit (CPHA) and a clock polarity control bit (CPOL) in the SPI control register 1 (SPICR1) select one of four possible clock formats to be used by the SPI system. The CPOL bit simply selects a non-inverted or inverted clock. The CPHA bit is used to accommodate two fundamentally different protocols by sampling data on odd numbered SCK edges or on even numbered SCK edges (see Section 15.4.3, "Transmission Formats"). The SPI can be configured to operate as a master or as a slave. When the MSTR bit in SPI control register1 is set, master mode is selected, when the MSTR bit is clear, slave mode is selected. NOTE A change of CPOL or MSTR bit while there is a received byte pending in the receive shift register will destroy the received byte and must be avoided. 15.4.1 Master Mode The SPI operates in master mode when the MSTR bit is set. Only a master SPI module can initiate transmissions. A transmission begins by writing to the master SPI data register. If the shift register is empty, data immediately transfers to the shift register. Data begins shifting out on the MOSI pin under the control of the serial clock. * Serial clock The SPR2, SPR1, and SPR0 baud rate selection bits, in conjunction with the SPPR2, SPPR1, and SPPR0 baud rate preselection bits in the SPI baud rate register, control the baud rate generator and determine the speed of the transmission. The SCK pin is the SPI clock output. Through the SCK pin, the baud rate generator of the master controls the shift register of the slave peripheral. * MOSI, MISO pin In master mode, the function of the serial data output pin (MOSI) and the serial data input pin (MISO) is determined by the SPC0 and BIDIROE control bits. * SS pin If MODFEN and SSOE are set, the SS pin is configured as slave select output. The SS output becomes low during each transmission and is high when the SPI is in idle state. 1. n depends on the selected transfer width, please refer to Section 15.3.2.2, "SPI Control Register 2 (SPICR2) MC9S12ZVC Family Reference Manual , Rev. 1.9 488 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) If MODFEN is set and SSOE is cleared, the SS pin is configured as input for detecting mode fault error. If the SS input becomes low this indicates a mode fault error where another master tries to drive the MOSI and SCK lines. In this case, the SPI immediately switches to slave mode, by clearing the MSTR bit and also disables the slave output buffer MISO (or SISO in bidirectional mode). So the result is that all outputs are disabled and SCK, MOSI, and MISO are inputs. If a transmission is in progress when the mode fault occurs, the transmission is aborted and the SPI is forced into idle state. This mode fault error also sets the mode fault (MODF) flag in the SPI status register (SPISR). If the SPI interrupt enable bit (SPIE) is set when the MODF flag becomes set, then an SPI interrupt sequence is also requested. When a write to the SPI data register in the master occurs, there is a half SCK-cycle delay. After the delay, SCK is started within the master. The rest of the transfer operation differs slightly, depending on the clock format specified by the SPI clock phase bit, CPHA, in SPI control register 1 (see Section 15.4.3, "Transmission Formats"). NOTE A change of the bits CPOL, CPHA, SSOE, LSBFE, XFRW, MODFEN, SPC0, or BIDIROE with SPC0 set, SPPR2-SPPR0 and SPR2-SPR0 in master mode will abort a transmission in progress and force the SPI into idle state. The remote slave cannot detect this, therefore the master must ensure that the remote slave is returned to idle state. 15.4.2 Slave Mode The SPI operates in slave mode when the MSTR bit in SPI control register 1 is clear. * Serial clock In slave mode, SCK is the SPI clock input from the master. * MISO, MOSI pin In slave mode, the function of the serial data output pin (MISO) and serial data input pin (MOSI) is determined by the SPC0 bit and BIDIROE bit in SPI control register 2. * SS pin The SS pin is the slave select input. Before a data transmission occurs, the SS pin of the slave SPI must be low. SS must remain low until the transmission is complete. If SS goes high, the SPI is forced into idle state. The SS input also controls the serial data output pin, if SS is high (not selected), the serial data output pin is high impedance, and, if SS is low, the first bit in the SPI data register is driven out of the serial data output pin. Also, if the slave is not selected (SS is high), then the SCK input is ignored and no internal shifting of the SPI shift register occurs. Although the SPI is capable of duplex operation, some SPI peripherals are capable of only receiving SPI data in a slave mode. For these simpler devices, there is no serial data out pin. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 489 Chapter 15 Serial Peripheral Interface (S12SPIV5) NOTE When peripherals with duplex capability are used, take care not to simultaneously enable two receivers whose serial outputs drive the same system slave's serial data output line. As long as no more than one slave device drives the system slave's serial data output line, it is possible for several slaves to receive the same transmission from a master, although the master would not receive return information from all of the receiving slaves. If the CPHA bit in SPI control register 1 is clear, odd numbered edges on the SCK input cause the data at the serial data input pin to be latched. Even numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit. If the CPHA bit is set, even numbered edges on the SCK input cause the data at the serial data input pin to be latched. Odd numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit. When CPHA is set, the first edge is used to get the first data bit onto the serial data output pin. When CPHA is clear and the SS input is low (slave selected), the first bit of the SPI data is driven out of the serial data output pin. After the nth1 shift, the transfer is considered complete and the received data is transferred into the SPI data register. To indicate transfer is complete, the SPIF flag in the SPI status register is set. NOTE A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0, or BIDIROE with SPC0 set in slave mode will corrupt a transmission in progress and must be avoided. 15.4.3 Transmission Formats During an SPI transmission, data is transmitted (shifted out serially) and received (shifted in serially) simultaneously. The serial clock (SCK) synchronizes shifting and sampling of the information on the two serial data lines. A slave select line allows selection of an individual slave SPI device; slave devices that are not selected do not interfere with SPI bus activities. Optionally, on a master SPI device, the slave select line can be used to indicate multiple-master bus contention. MASTER SPI SHIFT REGISTER BAUD RATE GENERATOR SLAVE SPI MISO MISO MOSI MOSI SCK SCK SS VDD SHIFT REGISTER SS Figure 15-11. Master/Slave Transfer Block Diagram 1. n depends on the selected transfer width, please refer to Section 15.3.2.2, "SPI Control Register 2 (SPICR2) MC9S12ZVC Family Reference Manual , Rev. 1.9 490 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) 15.4.3.1 Clock Phase and Polarity Controls Using two bits in the SPI control register 1, software selects one of four combinations of serial clock phase and polarity. The CPOL clock polarity control bit specifies an active high or low clock and has no significant effect on the transmission format. The CPHA clock phase control bit selects one of two fundamentally different transmission formats. Clock phase and polarity should be identical for the master SPI device and the communicating slave device. In some cases, the phase and polarity are changed between transmissions to allow a master device to communicate with peripheral slaves having different requirements. 15.4.3.2 CPHA = 0 Transfer Format The first edge on the SCK line is used to clock the first data bit of the slave into the master and the first data bit of the master into the slave. In some peripherals, the first bit of the slave's data is available at the slave's data out pin as soon as the slave is selected. In this format, the first SCK edge is issued a half cycle after SS has become low. A half SCK cycle later, the second edge appears on the SCK line. When this second edge occurs, the value previously latched from the serial data input pin is shifted into the LSB or MSB of the shift register, depending on LSBFE bit. After this second edge, the next bit of the SPI master data is transmitted out of the serial data output pin of the master to the serial input pin on the slave. This process continues for a total of 16 edges on the SCK line, with data being latched on odd numbered edges and shifted on even numbered edges. Data reception is double buffered. Data is shifted serially into the SPI shift register during the transfer and is transferred to the parallel SPI data register after the last bit is shifted in. After 2n1 (last) SCK edges: * Data that was previously in the master SPI data register should now be in the slave data register and the data that was in the slave data register should be in the master. * The SPIF flag in the SPI status register is set, indicating that the transfer is complete. Figure 15-12 is a timing diagram of an SPI transfer where CPHA = 0. SCK waveforms are shown for CPOL = 0 and CPOL = 1. The diagram may be interpreted as a master or slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal is the output from the slave and the MOSI signal is the output from the master. The SS pin of the master must be either high or reconfigured as a general-purpose output not affecting the SPI. 1. n depends on the selected transfer width, please refer to Section 15.3.2.2, "SPI Control Register 2 (SPICR2) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 491 Chapter 15 Serial Peripheral Interface (S12SPIV5) End of Idle State Begin 1 SCK Edge Number 2 3 4 5 6 7 8 Begin of Idle State End Transfer 9 10 11 12 13 14 15 16 SCK (CPOL = 0) SCK (CPOL = 1) If next transfer begins here SAMPLE I MOSI/MISO CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tT tL MSB first (LSBFE = 0): MSB Bit 6 Bit 5 Bit 4 Bit 3 LSB first (LSBFE = 1): LSB Bit 1 Bit 2 Bit 3 Bit 4 tL = Minimum leading time before the first SCK edge tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time) tL, tT, and tI are guaranteed for the master mode and required for the slave mode. Bit 2 Bit 5 Bit 1 Bit 6 tI tL LSB Minimum 1/2 SCK for tT, tl, tL MSB Figure 15-12. SPI Clock Format 0 (CPHA = 0), with 8-bit Transfer Width selected (XFRW = 0) MC9S12ZVC Family Reference Manual , Rev. 1.9 492 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) End of Idle State SCK Edge Number Begin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Begin of Idle State End Transfer 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SCK (CPOL = 0) SCK (CPOL = 1) If next transfer begins here SAMPLE I MOSI/MISO CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) MSB first (LSBFE = 0) LSB first (LSBFE = 1) tL tT tI tL MSB Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB Minimum 1/2 SCK LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 8 Bit 9 Bit 10Bit 11 Bit 12Bit 13Bit 14 MSB for tT, tl, tL tL = Minimum leading time before the first SCK edge tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time) tL, tT, and tI are guaranteed for the master mode and required for the slave mode. Figure 15-13. SPI Clock Format 0 (CPHA = 0), with 16-Bit Transfer Width selected (XFRW = 1) In slave mode, if the SS line is not deasserted between the successive transmissions then the content of the SPI data register is not transmitted; instead the last received data is transmitted. If the SS line is deasserted for at least minimum idle time (half SCK cycle) between successive transmissions, then the content of the SPI data register is transmitted. In master mode, with slave select output enabled the SS line is always deasserted and reasserted between successive transfers for at least minimum idle time. 15.4.3.3 CPHA = 1 Transfer Format Some peripherals require the first SCK edge before the first data bit becomes available at the data out pin, the second edge clocks data into the system. In this format, the first SCK edge is issued by setting the CPHA bit at the beginning of the n1-cycle transfer operation. The first edge of SCK occurs immediately after the half SCK clock cycle synchronization delay. This first edge commands the slave to transfer its first data bit to the serial data input pin of the master. A half SCK cycle later, the second edge appears on the SCK pin. This is the latching edge for both the master and slave. 1. n depends on the selected transfer width, please refer to Section 15.3.2.2, "SPI Control Register 2 (SPICR2) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 493 Chapter 15 Serial Peripheral Interface (S12SPIV5) When the third edge occurs, the value previously latched from the serial data input pin is shifted into the LSB or MSB of the SPI shift register, depending on LSBFE bit. After this edge, the next bit of the master data is coupled out of the serial data output pin of the master to the serial input pin on the slave. This process continues for a total of n1 edges on the SCK line with data being latched on even numbered edges and shifting taking place on odd numbered edges. Data reception is double buffered, data is serially shifted into the SPI shift register during the transfer and is transferred to the parallel SPI data register after the last bit is shifted in. After 2n1 SCK edges: * Data that was previously in the SPI data register of the master is now in the data register of the slave, and data that was in the data register of the slave is in the master. * The SPIF flag bit in SPISR is set indicating that the transfer is complete. Figure 15-14 shows two clocking variations for CPHA = 1. The diagram may be interpreted as a master or slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal is the output from the slave, and the MOSI signal is the output from the master. The SS line is the slave select input to the slave. The SS pin of the master must be either high or reconfigured as a general-purpose output not affecting the SPI. End of Idle State Begin SCK Edge Number 1 2 3 4 End Transfer 5 6 7 8 9 10 11 12 13 14 Begin of Idle State 15 16 SCK (CPOL = 0) SCK (CPOL = 1) If next transfer begins here SAMPLE I MOSI/MISO CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tT tL MSB first (LSBFE = 0): LSB first (LSBFE = 1): MSB LSB Bit 6 Bit 1 Bit 5 Bit 2 Bit 4 Bit 3 Bit 3 Bit 4 Bit 2 Bit 5 Bit 1 Bit 6 tI tL LSB Minimum 1/2 SCK for tT, tl, tL MSB tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers Figure 15-14. SPI Clock Format 1 (CPHA = 1), with 8-Bit Transfer Width selected (XFRW = 0) MC9S12ZVC Family Reference Manual , Rev. 1.9 494 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) End of Idle State SCK Edge Number Begin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Begin of Idle State End Transfer 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SCK (CPOL = 0) SCK (CPOL = 1) If next transfer begins here SAMPLE I MOSI/MISO CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tT tI tL Minimum 1/2 SCK for tT, tl, tL tL MSB first (LSBFE = 0) LSB first (LSBFE = 1) MSB Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 8 Bit 9 Bit 10Bit 11 Bit 12Bit 13Bit 14 MSB tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers Figure 15-15. SPI Clock Format 1 (CPHA = 1), with 16-Bit Transfer Width selected (XFRW = 1) The SS line can remain active low between successive transfers (can be tied low at all times). This format is sometimes preferred in systems having a single fixed master and a single slave that drive the MISO data line. * Back-to-back transfers in master mode In master mode, if a transmission has completed and new data is available in the SPI data register, this data is sent out immediately without a trailing and minimum idle time. The SPI interrupt request flag (SPIF) is common to both the master and slave modes. SPIF gets set one half SCK cycle after the last SCK edge. 15.4.4 SPI Baud Rate Generation Baud rate generation consists of a series of divider stages. Six bits in the SPI baud rate register (SPPR2, SPPR1, SPPR0, SPR2, SPR1, and SPR0) determine the divisor to the SPI module clock which results in the SPI baud rate. The SPI clock rate is determined by the product of the value in the baud rate preselection bits (SPPR2-SPPR0) and the value in the baud rate selection bits (SPR2-SPR0). The module clock divisor equation is shown in Equation 15-3. BaudRateDivisor = (SPPR + 1) 2(SPR + 1) Eqn. 15-3 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 495 Chapter 15 Serial Peripheral Interface (S12SPIV5) When all bits are clear (the default condition), the SPI module clock is divided by 2. When the selection bits (SPR2-SPR0) are 001 and the preselection bits (SPPR2-SPPR0) are 000, the module clock divisor becomes 4. When the selection bits are 010, the module clock divisor becomes 8, etc. When the preselection bits are 001, the divisor determined by the selection bits is multiplied by 2. When the preselection bits are 010, the divisor is multiplied by 3, etc. See Table 15-6 for baud rate calculations for all bit conditions, based on a 25 MHz bus clock. The two sets of selects allows the clock to be divided by a non-power of two to achieve other baud rates such as divide by 6, divide by 10, etc. The baud rate generator is activated only when the SPI is in master mode and a serial transfer is taking place. In the other cases, the divider is disabled to decrease IDD current. NOTE For maximum allowed baud rates, please refer to the SPI Electrical Specification in the Electricals chapter of this data sheet. 15.4.5 15.4.5.1 Special Features SS Output The SS output feature automatically drives the SS pin low during transmission to select external devices and drives it high during idle to deselect external devices. When SS output is selected, the SS output pin is connected to the SS input pin of the external device. The SS output is available only in master mode during normal SPI operation by asserting SSOE and MODFEN bit as shown in Table 15-2. The mode fault feature is disabled while SS output is enabled. NOTE Care must be taken when using the SS output feature in a multimaster system because the mode fault feature is not available for detecting system errors between masters. 15.4.5.2 Bidirectional Mode (MOMI or SISO) The bidirectional mode is selected when the SPC0 bit is set in SPI control register 2 (see Table 15-10). In this mode, the SPI uses only one serial data pin for the interface with external device(s). The MSTR bit decides which pin to use. The MOSI pin becomes the serial data I/O (MOMI) pin for the master mode, and the MISO pin becomes serial data I/O (SISO) pin for the slave mode. The MISO pin in master mode and MOSI pin in slave mode are not used by the SPI. MC9S12ZVC Family Reference Manual , Rev. 1.9 496 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) Table 15-10. Normal Mode and Bidirectional Mode When SPE = 1 Master Mode MSTR = 1 Serial Out Normal Mode SPC0 = 0 MOSI MOSI Serial In SPI SPI Serial In Bidirectional Mode SPC0 = 1 Slave Mode MSTR = 0 MISO Serial Out MOMI SPI BIDIROE Serial In Serial Out MISO Serial In SPI BIDIROE Serial Out SISO The direction of each serial I/O pin depends on the BIDIROE bit. If the pin is configured as an output, serial data from the shift register is driven out on the pin. The same pin is also the serial input to the shift register. * The SCK is output for the master mode and input for the slave mode. * The SS is the input or output for the master mode, and it is always the input for the slave mode. * The bidirectional mode does not affect SCK and SS functions. NOTE In bidirectional master mode, with mode fault enabled, both data pins MISO and MOSI can be occupied by the SPI, though MOSI is normally used for transmissions in bidirectional mode and MISO is not used by the SPI. If a mode fault occurs, the SPI is automatically switched to slave mode. In this case MISO becomes occupied by the SPI and MOSI is not used. This must be considered, if the MISO pin is used for another purpose. 15.4.6 Error Conditions The SPI has one error condition: * Mode fault error 15.4.6.1 Mode Fault Error If the SS input becomes low while the SPI is configured as a master, it indicates a system error where more than one master may be trying to drive the MOSI and SCK lines simultaneously. This condition is not permitted in normal operation, the MODF bit in the SPI status register is set automatically, provided the MODFEN bit is set. In the special case where the SPI is in master mode and MODFEN bit is cleared, the SS pin is not used by the SPI. In this special case, the mode fault error function is inhibited and MODF remains cleared. In case MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 497 Chapter 15 Serial Peripheral Interface (S12SPIV5) the SPI system is configured as a slave, the SS pin is a dedicated input pin. Mode fault error doesn't occur in slave mode. If a mode fault error occurs, the SPI is switched to slave mode, with the exception that the slave output buffer is disabled. So SCK, MISO, and MOSI pins are forced to be high impedance inputs to avoid any possibility of conflict with another output driver. A transmission in progress is aborted and the SPI is forced into idle state. If the mode fault error occurs in the bidirectional mode for a SPI system configured in master mode, output enable of the MOMI (MOSI in bidirectional mode) is cleared if it was set. No mode fault error occurs in the bidirectional mode for SPI system configured in slave mode. The mode fault flag is cleared automatically by a read of the SPI status register (with MODF set) followed by a write to SPI control register 1. If the mode fault flag is cleared, the SPI becomes a normal master or slave again. NOTE If a mode fault error occurs and a received data byte is pending in the receive shift register, this data byte will be lost. 15.4.7 15.4.7.1 Low Power Mode Options SPI in Run Mode In run mode with the SPI system enable (SPE) bit in the SPI control register clear, the SPI system is in a low-power, disabled state. SPI registers remain accessible, but clocks to the core of this module are disabled. 15.4.7.2 SPI in Wait Mode SPI operation in wait mode depends upon the state of the SPISWAI bit in SPI control register 2. * If SPISWAI is clear, the SPI operates normally when the CPU is in wait mode * If SPISWAI is set, SPI clock generation ceases and the SPI module enters a power conservation state when the CPU is in wait mode. - If SPISWAI is set and the SPI is configured for master, any transmission and reception in progress stops at wait mode entry. The transmission and reception resumes when the SPI exits wait mode. - If SPISWAI is set and the SPI is configured as a slave, any transmission and reception in progress continues if the SCK continues to be driven from the master. This keeps the slave synchronized to the master and the SCK. If the master transmits several bytes while the slave is in wait mode, the slave will continue to send out bytes consistent with the operation mode at the start of wait mode (i.e., if the slave is currently sending its SPIDR to the master, it will continue to send the same byte. Else if the slave is currently sending the last received byte from the master, it will continue to send each previous master byte). MC9S12ZVC Family Reference Manual , Rev. 1.9 498 NXP Semiconductors Chapter 15 Serial Peripheral Interface (S12SPIV5) NOTE Care must be taken when expecting data from a master while the slave is in wait or stop mode. Even though the shift register will continue to operate, the rest of the SPI is shut down (i.e., a SPIF interrupt will not be generated until exiting stop or wait mode). Also, the byte from the shift register will not be copied into the SPIDR register until after the slave SPI has exited wait or stop mode. In slave mode, a received byte pending in the receive shift register will be lost when entering wait or stop mode. An SPIF flag and SPIDR copy is generated only if wait mode is entered or exited during a tranmission. If the slave enters wait mode in idle mode and exits wait mode in idle mode, neither a SPIF nor a SPIDR copy will occur. 15.4.7.3 SPI in Stop Mode Stop mode is dependent on the system. The SPI enters stop mode when the module clock is disabled (held high or low). If the SPI is in master mode and exchanging data when the CPU enters stop mode, the transmission is frozen until the CPU exits stop mode. After stop, data to and from the external SPI is exchanged correctly. In slave mode, the SPI will stay synchronized with the master. The stop mode is not dependent on the SPISWAI bit. 15.4.7.4 Reset The reset values of registers and signals are described in Section 15.3, "Memory Map and Register Definition", which details the registers and their bit fields. * If a data transmission occurs in slave mode after reset without a write to SPIDR, it will transmit garbage, or the data last received from the master before the reset. * Reading from the SPIDR after reset will always read zeros. 15.4.7.5 Interrupts The SPI only originates interrupt requests when SPI is enabled (SPE bit in SPICR1 set). The following is a description of how the SPI makes a request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt priority are chip dependent. The interrupt flags MODF, SPIF, and SPTEF are logically ORed to generate an interrupt request. 15.4.7.5.1 MODF MODF occurs when the master detects an error on the SS pin. The master SPI must be configured for the MODF feature (see Table 15-2). After MODF is set, the current transfer is aborted and the following bit is changed: * MSTR = 0, The master bit in SPICR1 resets. The MODF interrupt is reflected in the status register MODF flag. Clearing the flag will also clear the interrupt. This interrupt will stay active while the MODF flag is set. MODF has an automatic clearing process which is described in Section 15.3.2.4, "SPI Status Register (SPISR)". MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 499 Chapter 15 Serial Peripheral Interface (S12SPIV5) 15.4.7.5.2 SPIF SPIF occurs when new data has been received and copied to the SPI data register. After SPIF is set, it does not clear until it is serviced. SPIF has an automatic clearing process, which is described in Section 15.3.2.4, "SPI Status Register (SPISR)". 15.4.7.5.3 SPTEF SPTEF occurs when the SPI data register is ready to accept new data. After SPTEF is set, it does not clear until it is serviced. SPTEF has an automatic clearing process, which is described in Section 15.3.2.4, "SPI Status Register (SPISR)". MC9S12ZVC Family Reference Manual , Rev. 1.9 500 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Table 16-1. Revision History Revision Number Revision Date Sections Affected V01.03 28 Jul 2006 16.7.1.7/16-525 - Update flow-chart of interrupt routine for 10-bit address V01.04 17 Nov 2006 16.3.1.2/16-505 - Revise Table1-5 V01.05 14 Aug 2007 16.3.1.1/16-505 - Backward compatible for IBAD bit name 16.1 Description of Changes Introduction The inter-IC bus (IIC) is a two-wire, bidirectional serial bus that provides a simple, efficient method of data exchange between devices. Being a two-wire device, the IIC bus minimizes the need for large numbers of connections between devices, and eliminates the need for an address decoder. This bus is suitable for applications requiring occasional communications over a short distance between a number of devices. It also provides flexibility, allowing additional devices to be connected to the bus for further expansion and system development. The interface is designed to operate up to 100 kbps with maximum bus loading and timing. The device is capable of operating at higher baud rates, up to a maximum of clock/20, with reduced bus loading. The maximum communication length and the number of devices that can be connected are limited by a maximum bus capacitance of 400 pF. 16.1.1 Features The IIC module has the following key features: * Compatible with I2C bus standard * Multi-master operation * Software programmable for one of 256 different serial clock frequencies * Software selectable acknowledge bit * Interrupt driven byte-by-byte data transfer * Arbitration lost interrupt with automatic mode switching from master to slave * Calling address identification interrupt * Start and stop signal generation/detection * Repeated start signal generation MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 501 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description * * * * Acknowledge bit generation/detection Bus busy detection General Call Address detection Compliant to ten-bit address MC9S12ZVC Family Reference Manual , Rev. 1.9 502 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description 16.1.2 Modes of Operation The IIC functions the same in normal, special, and emulation modes. It has two low power modes: wait and stop modes. 16.1.3 Block Diagram The block diagram of the IIC module is shown in Figure 16-1. IIC Registers Start Stop Arbitration Control Clock Control In/Out Data Shift Register Interrupt bus_clock SCL SDA Address Compare Figure 16-1. IIC Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 503 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description 16.2 External Signal Description The IICV3 module has two external pins. 16.2.1 IIC_SCL -- Serial Clock Line Pin This is the bidirectional serial clock line (SCL) of the module, compatible to the IIC bus specification. 16.2.2 IIC_SDA -- Serial Data Line Pin This is the bidirectional serial data line (SDA) of the module, compatible to the IIC bus specification. 16.3 Memory Map and Register Definition This section provides a detailed description of all memory and registers for the IIC module. 16.3.1 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. Register Name 0x0000 IBAD R W 0x0001 IBFD W 0x0002 IBCR W 0x0003 IBSR R R R Bit 7 6 5 4 3 2 1 ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 IBC7 IBC6 IBC5 IBC4 IBC3 IBC2 IBC1 IBEN IBIE MS/SL Tx/Rx TXAK 0 0 TCF IAAS IBB D7 D6 D5 GCEN ADTYPE 0 W 0x0004 IBDR R W 0x0005 IBCR2 W R Bit 0 0 IBC0 IBSWAI RSTA 0 SRW D4 D3 D2 D1 D0 0 0 ADR10 ADR9 ADR8 IBAL IBIF RXAK = Unimplemented or Reserved Figure 16-2. IIC Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 504 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description 16.3.1.1 IIC Address Register (IBAD) Module Base +0x0000 R W Reset 7 6 5 4 3 2 1 ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 16-3. IIC Bus Address Register (IBAD) Read and write anytime This register contains the address the IIC bus will respond to when addressed as a slave; note that it is not the address sent on the bus during the address transfer. Table 16-2. IBAD Field Descriptions Field Description 7:1 ADR[7:1] Slave Address -- Bit 1 to bit 7 contain the specific slave address to be used by the IIC bus module.The default mode of IIC bus is slave mode for an address match on the bus. 0 Reserved Reserved -- Bit 0 of the IBAD is reserved for future compatibility. This bit will always read 0. 16.3.1.2 IIC Frequency Divider Register (IBFD) Module Base + 0x0001 R W Reset 7 6 5 4 3 2 1 0 IBC7 IBC6 IBC5 IBC4 IBC3 IBC2 IBC1 IBC0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 16-4. IIC Bus Frequency Divider Register (IBFD) Read and write anytime Table 16-3. IBFD Field Descriptions Field Description 7:0 IBC[7:0] I Bus Clock Rate 7:0 -- This field is used to prescale the clock for bit rate selection. The bit clock generator is implemented as a prescale divider -- IBC7:6, prescaled shift register -- IBC5:3 select the prescaler divider and IBC2-0 select the shift register tap point. The IBC bits are decoded to give the tap and prescale values as shown in Table 16-4. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 505 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Table 16-4. I-Bus Tap and Prescale Values IBC2-0 (bin) SCL Tap (clocks) SDA Tap (clocks) 000 5 1 001 6 1 010 7 2 011 8 2 100 9 3 101 10 3 110 12 4 111 15 4 Table 16-5. Prescale Divider Encoding IBC5-3 (bin) scl2start (clocks) scl2stop (clocks) scl2tap (clocks) tap2tap (clocks) 000 2 7 4 1 001 2 7 4 2 010 2 9 6 4 011 6 9 6 8 100 14 17 14 16 101 30 33 30 32 110 62 65 62 64 111 126 129 126 128 Table 16-6. Multiplier Factor IBC7-6 MUL 00 01 01 02 10 04 11 RESERVED The number of clocks from the falling edge of SCL to the first tap (Tap[1]) is defined by the values shown in the scl2tap column of Table 16-4, all subsequent tap points are separated by 2IBC5-3 as shown in the tap2tap column in Table 16-5. The SCL Tap is used to generated the SCL period and the SDA Tap is used to determine the delay from the falling edge of SCL to SDA changing, the SDA hold time. IBC7-6 defines the multiplier factor MUL. The values of MUL are shown in the Table 16-6. MC9S12ZVC Family Reference Manual , Rev. 1.9 506 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description SCL Divider SCL SDA Hold SDA SDA SCL Hold(stop) SCL Hold(start) SCL START condition STOP condition Figure 16-5. SCL Divider and SDA Hold The equation used to generate the divider values from the IBFD bits is: SCL Divider = MUL x {2 x (scl2tap + [(SCL_Tap -1) x tap2tap] + 2)} The SDA hold delay is equal to the CPU clock period multiplied by the SDA Hold value shown in Table 16-7. The equation used to generate the SDA Hold value from the IBFD bits is: SDA Hold = MUL x {scl2tap + [(SDA_Tap - 1) x tap2tap] + 3} The equation for SCL Hold values to generate the start and stop conditions from the IBFD bits is: SCL Hold(start) = MUL x [scl2start + (SCL_Tap - 1) x tap2tap] SCL Hold(stop) = MUL x [scl2stop + (SCL_Tap - 1) x tap2tap] Table 16-7. IIC Divider and Hold Values (Sheet 1 of 6) IBC[7:0] (hex) SCL Divider (clocks) SDA Hold (clocks) SCL Hold (start) SCL Hold (stop) MUL=1 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 507 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Table 16-7. IIC Divider and Hold Values (Sheet 2 of 6) IBC[7:0] (hex) SCL Divider (clocks) SDA Hold (clocks) SCL Hold (start) SCL Hold (stop) 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 20/22 22/24 24/26 26/28 28/30 30/32 34/36 40/42 28/32 32/36 36/40 40/44 44/48 48/52 56/60 68/72 48 56 64 72 80 88 104 128 80 96 112 128 144 160 192 240 160 192 224 256 288 320 384 480 320 384 448 512 576 7 7 8 8 9 9 10 10 7 7 9 9 11 11 13 13 9 9 13 13 17 17 21 21 9 9 17 17 25 25 33 33 17 17 33 33 49 49 65 65 33 33 65 65 97 6 7 8 9 10 11 13 16 10 12 14 16 18 20 24 30 18 22 26 30 34 38 46 58 38 46 54 62 70 78 94 118 78 94 110 126 142 158 190 238 158 190 222 254 286 11 12 13 14 15 16 18 21 15 17 19 21 23 25 29 35 25 29 33 37 41 45 53 65 41 49 57 65 73 81 97 121 81 97 113 129 145 161 193 241 161 193 225 257 289 MC9S12ZVC Family Reference Manual , Rev. 1.9 508 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Table 16-7. IIC Divider and Hold Values (Sheet 3 of 6) IBC[7:0] (hex) SCL Divider (clocks) SDA Hold (clocks) SCL Hold (start) SCL Hold (stop) 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 640 768 960 640 768 896 1024 1152 1280 1536 1920 1280 1536 1792 2048 2304 2560 3072 3840 97 129 129 65 65 129 129 193 193 257 257 129 129 257 257 385 385 513 513 318 382 478 318 382 446 510 574 638 766 958 638 766 894 1022 1150 1278 1534 1918 321 385 481 321 385 449 513 577 641 769 961 641 769 897 1025 1153 1281 1537 1921 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 40 44 48 52 56 60 68 80 56 64 72 80 88 96 112 136 96 112 128 144 160 176 208 256 160 14 14 16 16 18 18 20 20 14 14 18 18 22 22 26 26 18 18 26 26 34 34 42 42 18 12 14 16 18 20 22 26 32 20 24 28 32 36 40 48 60 36 44 52 60 68 76 92 116 76 22 24 26 28 30 32 36 42 30 34 38 42 46 50 58 70 50 58 66 74 82 90 106 130 82 MUL=2 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 509 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Table 16-7. IIC Divider and Hold Values (Sheet 4 of 6) IBC[7:0] (hex) SCL Divider (clocks) SDA Hold (clocks) SCL Hold (start) SCL Hold (stop) 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F 192 224 256 288 320 384 480 320 384 448 512 576 640 768 960 640 768 896 1024 1152 1280 1536 1920 1280 1536 1792 2048 2304 2560 3072 3840 2560 3072 3584 4096 4608 5120 6144 7680 18 34 34 50 50 66 66 34 34 66 66 98 98 130 130 66 66 130 130 194 194 258 258 130 130 258 258 386 386 514 514 258 258 514 514 770 770 1026 1026 92 108 124 140 156 188 236 156 188 220 252 284 316 380 476 316 380 444 508 572 636 764 956 636 764 892 1020 1148 1276 1532 1916 1276 1532 1788 2044 2300 2556 3068 3836 98 114 130 146 162 194 242 162 194 226 258 290 322 386 482 322 386 450 514 578 642 770 962 642 770 898 1026 1154 1282 1538 1922 1282 1538 1794 2050 2306 2562 3074 3842 80 81 82 83 84 72 80 88 96 104 28 28 32 32 36 24 28 32 36 40 44 48 52 56 60 MUL=4 MC9S12ZVC Family Reference Manual , Rev. 1.9 510 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Table 16-7. IIC Divider and Hold Values (Sheet 5 of 6) IBC[7:0] (hex) SCL Divider (clocks) SDA Hold (clocks) SCL Hold (start) SCL Hold (stop) 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 112 128 152 112 128 144 160 176 192 224 272 192 224 256 288 320 352 416 512 320 384 448 512 576 640 768 960 640 768 896 1024 1152 1280 1536 1920 1280 1536 1792 2048 2304 2560 3072 3840 2560 3072 36 40 40 28 28 36 36 44 44 52 52 36 36 52 52 68 68 84 84 36 36 68 68 100 100 132 132 68 68 132 132 196 196 260 260 132 132 260 260 388 388 516 516 260 260 44 52 64 40 48 56 64 72 80 96 120 72 88 104 120 136 152 184 232 152 184 216 248 280 312 376 472 312 376 440 504 568 632 760 952 632 760 888 1016 1144 1272 1528 1912 1272 1528 64 72 84 60 68 76 84 92 100 116 140 100 116 132 148 164 180 212 260 164 196 228 260 292 324 388 484 324 388 452 516 580 644 772 964 644 772 900 1028 1156 1284 1540 1924 1284 1540 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 511 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Table 16-7. IIC Divider and Hold Values (Sheet 6 of 6) IBC[7:0] (hex) SCL Divider (clocks) SDA Hold (clocks) SCL Hold (start) SCL Hold (stop) B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF 3584 4096 4608 5120 6144 7680 5120 6144 7168 8192 9216 10240 12288 15360 516 516 772 772 1028 1028 516 516 1028 1028 1540 1540 2052 2052 1784 2040 2296 2552 3064 3832 2552 3064 3576 4088 4600 5112 6136 7672 1796 2052 2308 2564 3076 3844 2564 3076 3588 4100 4612 5124 6148 7684 Note:Since the bus frequency is speeding up,the SCL Divider could be expanded by it.Therefore,in the table,when IBC[7:0] is from $00 to $0F,the SCL Divider is revised by the format value1/value2.Value1 is the divider under the low frequency.Value2 is the divider under the high frequency.How to select the divider depends on the bus frequency.When IBC[7:0] is from $10 to $BF,the divider is not changed. 16.3.1.3 IIC Control Register (IBCR) Module Base + 0x0002 R W Reset 7 6 5 4 3 IBEN IBIE MS/SL Tx/Rx TXAK 0 0 0 0 0 2 1 0 0 RSTA 0 0 0 IBSWAI 0 = Unimplemented or Reserved Figure 16-6. IIC Bus Control Register (IBCR) Read and write anytime MC9S12ZVC Family Reference Manual , Rev. 1.9 512 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Table 16-8. IBCR Field Descriptions Field Description 7 IBEN I-Bus Enable -- This bit controls the software reset of the entire IIC bus module. 0 The module is reset and disabled. This is the power-on reset situation. When low the interface is held in reset but registers can be accessed 1 The IIC bus module is enabled.This bit must be set before any other IBCR bits have any effect If the IIC bus module is enabled in the middle of a byte transfer the interface behaves as follows: slave mode ignores the current transfer on the bus and starts operating whenever a subsequent start condition is detected. Master mode will not be aware that the bus is busy, hence if a start cycle is initiated then the current bus cycle may become corrupt. This would ultimately result in either the current bus master or the IIC bus module losing arbitration, after which bus operation would return to normal. 6 IBIE I-Bus Interrupt Enable 0 Interrupts from the IIC bus module are disabled. Note that this does not clear any currently pending interrupt condition 1 Interrupts from the IIC bus module are enabled. An IIC bus interrupt occurs provided the IBIF bit in the status register is also set. 5 MS/SL Master/Slave Mode Select Bit -- Upon reset, this bit is cleared. When this bit is changed from 0 to 1, a START signal is generated on the bus, and the master mode is selected. When this bit is changed from 1 to 0, a STOP signal is generated and the operation mode changes from master to slave.A STOP signal should only be generated if the IBIF flag is set. MS/SL is cleared without generating a STOP signal when the master loses arbitration. 0 Slave Mode 1 Master Mode 4 Tx/Rx Transmit/Receive Mode Select Bit -- This bit selects the direction of master and slave transfers. When addressed as a slave this bit should be set by software according to the SRW bit in the status register. In master mode this bit should be set according to the type of transfer required. Therefore, for address cycles, this bit will always be high. 0 Receive 1 Transmit 3 TXAK Transmit Acknowledge Enable -- This bit specifies the value driven onto SDA during data acknowledge cycles for both master and slave receivers. The IIC module will always acknowledge address matches, provided it is enabled, regardless of the value of TXAK. Note that values written to this bit are only used when the IIC bus is a receiver, not a transmitter. 0 An acknowledge signal will be sent out to the bus at the 9th clock bit after receiving one byte data 1 No acknowledge signal response is sent (i.e., acknowledge bit = 1) 2 RSTA Repeat Start -- Writing a 1 to this bit will generate a repeated START condition on the bus, provided it is the current bus master. This bit will always be read as a low. Attempting a repeated start at the wrong time, if the bus is owned by another master, will result in loss of arbitration. 1 Generate repeat start cycle 1 Reserved -- Bit 1 of the IBCR is reserved for future compatibility. This bit will always read 0. RESERVED 0 IBSWAI I Bus Interface Stop in Wait Mode 0 IIC bus module clock operates normally 1 Halt IIC bus module clock generation in wait mode Wait mode is entered via execution of a CPU WAI instruction. In the event that the IBSWAI bit is set, all clocks internal to the IIC will be stopped and any transmission currently in progress will halt.If the CPU were woken up by a source other than the IIC module, then clocks would restart and the IIC would resume from where was during the previous transmission. It is not possible for the IIC to wake up the CPU when its internal clocks are stopped. If it were the case that the IBSWAI bit was cleared when the WAI instruction was executed, the IIC internal clocks and interface would remain alive, continuing the operation which was currently underway. It is also MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 513 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description possible to configure the IIC such that it will wake up the CPU via an interrupt at the conclusion of the current operation. See the discussion on the IBIF and IBIE bits in the IBSR and IBCR, respectively. 16.3.1.4 IIC Status Register (IBSR) Module Base + 0x0003 R 7 6 5 TCF IAAS IBB 1 0 0 W Reset 4 IBAL 0 3 2 0 SRW 0 0 1 IBIF 0 0 RXAK 0 = Unimplemented or Reserved Figure 16-7. IIC Bus Status Register (IBSR) This status register is read-only with exception of bit 1 (IBIF) and bit 4 (IBAL), which are software clearable. Table 16-9. IBSR Field Descriptions Field Description 7 TCF Data Transferring Bit -- While one byte of data is being transferred, this bit is cleared. It is set by the falling edge of the 9th clock of a byte transfer. Note that this bit is only valid during or immediately following a transfer to the IIC module or from the IIC module. 0 Transfer in progress 1 Transfer complete 6 IAAS Addressed as a Slave Bit -- When its own specific address (I-bus address register) is matched with the calling address or it receives the general call address with GCEN== 1,this bit is set.The CPU is interrupted provided the IBIE is set.Then the CPU needs to check the SRW bit and set its Tx/Rx mode accordingly.Writing to the I-bus control register clears this bit. 0 Not addressed 1 Addressed as a slave 5 IBB 4 IBAL Bus Busy Bit 0 This bit indicates the status of the bus. When a START signal is detected, the IBB is set. If a STOP signal is detected, IBB is cleared and the bus enters idle state. 1 Bus is busy Arbitration Lost -- The arbitration lost bit (IBAL) is set by hardware when the arbitration procedure is lost. Arbitration is lost in the following circumstances: 1. SDA sampled low when the master drives a high during an address or data transmit cycle. 2. SDA sampled low when the master drives a high during the acknowledge bit of a data receive cycle. 3. A start cycle is attempted when the bus is busy. 4. A repeated start cycle is requested in slave mode. 5. A stop condition is detected when the master did not request it. This bit must be cleared by software, by writing a one to it. A write of 0 has no effect on this bit. 3 Reserved -- Bit 3 of IBSR is reserved for future use. A read operation on this bit will return 0. RESERVED MC9S12ZVC Family Reference Manual , Rev. 1.9 514 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Table 16-9. IBSR Field Descriptions (continued) Field Description 2 SRW Slave Read/Write -- When IAAS is set this bit indicates the value of the R/W command bit of the calling address sent from the master This bit is only valid when the I-bus is in slave mode, a complete address transfer has occurred with an address match and no other transfers have been initiated. Checking this bit, the CPU can select slave transmit/receive mode according to the command of the master. 0 Slave receive, master writing to slave 1 Slave transmit, master reading from slave 1 IBIF I-Bus Interrupt -- The IBIF bit is set when one of the following conditions occurs: -- Arbitration lost (IBAL bit set) -- Data transfer complete (TCF bit set) -- Addressed as slave (IAAS bit set) It will cause a processor interrupt request if the IBIE bit is set. This bit must be cleared by software, writing a one to it. A write of 0 has no effect on this bit. 0 RXAK Received Acknowledge -- The value of SDA during the acknowledge bit of a bus cycle. If the received acknowledge bit (RXAK) is low, it indicates an acknowledge signal has been received after the completion of 8 bits data transmission on the bus. If RXAK is high, it means no acknowledge signal is detected at the 9th clock. 0 Acknowledge received 1 No acknowledge received 16.3.1.5 IIC Data I/O Register (IBDR) Module Base + 0x0004 R W Reset 7 6 5 4 3 2 1 0 D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 0 0 0 Figure 16-8. IIC Bus Data I/O Register (IBDR) In master transmit mode, when data is written to the IBDR a data transfer is initiated. The most significant bit is sent first. In master receive mode, reading this register initiates next byte data receiving. In slave mode, the same functions are available after an address match has occurred.Note that the Tx/Rx bit in the IBCR must correctly reflect the desired direction of transfer in master and slave modes for the transmission to begin. For instance, if the IIC is configured for master transmit but a master receive is desired, then reading the IBDR will not initiate the receive. Reading the IBDR will return the last byte received while the IIC is configured in either master receive or slave receive modes. The IBDR does not reflect every byte that is transmitted on the IIC bus, nor can software verify that a byte has been written to the IBDR correctly by reading it back. In master transmit mode, the first byte of data written to IBDR following assertion of MS/SL is used for the address transfer and should com.prise of the calling address (in position D7:D1) concatenated with the required R/W bit (in position D0). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 515 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description 16.3.1.6 IIC Control Register 2(IBCR2) Module Base + 0x0005 R W Reset 7 6 GCEN ADTYPE 0 0 5 4 3 0 0 0 0 0 0 2 1 0 ADR10 ADR9 ADR8 0 0 0 Figure 16-9. IIC Bus Control Register 2(IBCR2) This register contains the variables used in general call and in ten-bit address. Read and write anytime Table 16-10. IBCR2 Field Descriptions Field Description General Call Enable. 0 General call is disabled. The module dont receive any general call data and address. 1 enable general call. It indicates that the module can receive address and any data. 7 GCEN Address Type-- This bit selects the address length. The variable must be configured correctly before IIC enters slave mode. 0 7-bit address 1 10-bit address 6 ADTYPE 5,4,3 Reserved -- Bit 5,4 and 3 of the IBCR2 are reserved for future compatibility. These bits will always read 0. RESERVED 2:0 ADR[10:8] 16.4 Slave Address [10:8] --These 3 bits represent the MSB of the 10-bit address when address type is asserted (ADTYPE = 1). Functional Description This section provides a complete functional description of the IICV3. 16.4.1 I-Bus Protocol The IIC bus system uses a serial data line (SDA) and a serial clock line (SCL) for data transfer. All devices connected to it must have open drain or open collector outputs. Logic AND function is exercised on both lines with external pull-up resistors. The value of these resistors is system dependent. Normally, a standard communication is composed of four parts: START signal, slave address transmission, data transfer and STOP signal. They are described briefly in the following sections and illustrated in Figure 16-10. MC9S12ZVC Family Reference Manual , Rev. 1.9 516 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description MSB CL 1 DA LSB 2 3 4 5 6 7 8 MSB 9 ADR7ADR6ADR5ADR4ADR3ADR2ADR1 R/W Start Signal Calling Address Read/ Write MSB CL 1 XXX 3 4 5 6 7 8 Start Signal Calling Address Read/ Write 3 4 5 6 7 8 D7 D6 D5 D4 D3 D2 D1 D0 Data Byte 1 XX Ack Bit 9 No Ack Bit MSB 9 ADR7ADR6ADR5ADR4ADR3ADR2ADR1 R/W DA 2 Ack Bit LSB 2 LSB 1 LSB 3 2 4 5 6 7 8 9 ADR7ADR6ADR5ADR4ADR3ADR2ADR1R/W Repeated Start Signal New Calling Address Read/ Write No Ack Bit Figure 16-10. IIC-Bus Transmission Signals 16.4.1.1 START Signal When the bus is free, i.e. no master device is engaging the bus (both SCL and SDA lines are at logical high), a master may initiate communication by sending a START signal.As shown in Figure 16-10, a START signal is defined as a high-to-low transition of SDA while SCL is high. This signal denotes the beginning of a new data transfer (each data transfer may contain several bytes of data) and brings all slaves out of their idle states. SDA SCL START Condition STOP Condition Figure 16-11. Start and Stop Conditions MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 517 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description 16.4.1.2 Slave Address Transmission The first byte of data transfer immediately after the START signal is the slave address transmitted by the master. This is a seven-bit calling address followed by a R/W bit. The R/W bit tells the slave the desired direction of data transfer. 1 = Read transfer, the slave transmits data to the master. 0 = Write transfer, the master transmits data to the slave. If the calling address is 10-bit, another byte is followed by the first byte.Only the slave with a calling address that matches the one transmitted by the master will respond by sending back an acknowledge bit. This is done by pulling the SDA low at the 9th clock (see Figure 16-10). No two slaves in the system may have the same address. If the IIC bus is master, it must not transmit an address that is equal to its own slave address. The IIC bus cannot be master and slave at the same time.However, if arbitration is lost during an address cycle the IIC bus will revert to slave mode and operate correctly even if it is being addressed by another master. 16.4.1.3 Data Transfer As soon as successful slave addressing is achieved, the data transfer can proceed byte-by-byte in a direction specified by the R/W bit sent by the calling master All transfers that come after an address cycle are referred to as data transfers, even if they carry sub-address information for the slave device. Each data byte is 8 bits long. Data may be changed only while SCL is low and must be held stable while SCL is high as shown in Figure 16-10. There is one clock pulse on SCL for each data bit, the MSB being transferred first. Each data byte has to be followed by an acknowledge bit, which is signalled from the receiving device by pulling the SDA low at the ninth clock. So one complete data byte transfer needs nine clock pulses. If the slave receiver does not acknowledge the master, the SDA line must be left high by the slave. The master can then generate a stop signal to abort the data transfer or a start signal (repeated start) to commence a new calling. If the master receiver does not acknowledge the slave transmitter after a byte transmission, it means 'end of data' to the slave, so the slave releases the SDA line for the master to generate STOP or START signal.Note in order to release the bus correctly,after no-acknowledge to the master,the slave must be immediately switched to receiver and a following dummy reading of the IBDR is necessary. 16.4.1.4 STOP Signal The master can terminate the communication by generating a STOP signal to free the bus. However, the master may generate a START signal followed by a calling command without generating a STOP signal first. This is called repeated START. A STOP signal is defined as a low-to-high transition of SDA while SCL at logical 1 (see Figure 16-10). The master can generate a STOP even if the slave has generated an acknowledge at which point the slave must release the bus. MC9S12ZVC Family Reference Manual , Rev. 1.9 518 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description 16.4.1.5 Repeated START Signal As shown in Figure 16-10, a repeated START signal is a START signal generated without first generating a STOP signal to terminate the communication. This is used by the master to communicate with another slave or with the same slave in different mode (transmit/receive mode) without releasing the bus. 16.4.1.6 Arbitration Procedure The Inter-IC bus is a true multi-master bus that allows more than one master to be connected on it. If two or more masters try to control the bus at the same time, a clock synchronization procedure determines the bus clock, for which the low period is equal to the longest clock low period and the high is equal to the shortest one among the masters. The relative priority of the contending masters is determined by a data arbitration procedure, a bus master loses arbitration if it transmits logic 1 while another master transmits logic 0. The losing masters immediately switch over to slave receive mode and stop driving SDA output. In this case the transition from master to slave mode does not generate a STOP condition. Meanwhile, a status bit is set by hardware to indicate loss of arbitration. 16.4.1.7 Clock Synchronization Because wire-AND logic is performed on SCL line, a high-to-low transition on SCL line affects all the devices connected on the bus. The devices start counting their low period and as soon as a device's clock has gone low, it holds the SCL line low until the clock high state is reached.However, the change of low to high in this device clock may not change the state of the SCL line if another device clock is within its low period. Therefore, synchronized clock SCL is held low by the device with the longest low period. Devices with shorter low periods enter a high wait state during this time (see Figure 16-11). When all devices concerned have counted off their low period, the synchronized clock SCL line is released and pulled high. There is then no difference between the device clocks and the state of the SCL line and all the devices start counting their high periods.The first device to complete its high period pulls the SCL line low again. WAIT Start Counting High Period SCL1 SCL2 SCL Internal Counter Reset Figure 16-12. IIC-Bus Clock Synchronization MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 519 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description 16.4.1.8 Handshaking The clock synchronization mechanism can be used as a handshake in data transfer. Slave devices may hold the SCL low after completion of one byte transfer (9 bits). In such case, it halts the bus clock and forces the master clock into wait states until the slave releases the SCL line. 16.4.1.9 Clock Stretching The clock synchronization mechanism can be used by slaves to slow down the bit rate of a transfer. After the master has driven SCL low the slave can drive SCL low for the required period and then release it.If the slave SCL low period is greater than the master SCL low period then the resulting SCL bus signal low period is stretched. 16.4.1.10 Ten-bit Address A ten-bit address is indicated if the first 5 bits of the first address byte are 0x11110. The following rules apply to the first address byte. SLAVE ADDRESS R/W BIT DESCRIPTION 0000000 0 General call address 0000010 x Reserved for different bus format 0000011 x Reserved for future purposes 11111XX x Reserved for future purposes 11110XX x 10-bit slave addressing Figure 16-13. Definition of bits in the first byte. The address type is identified by ADTYPE. When ADTYPE is 0, 7-bit address is applied. Reversely, the address is 10-bit address.Generally, there are two cases of 10-bit address.See the Figure 16-14 and Figure 16-15. S Slave Add1st 7bits 11110+ADR10+ADR9 R/W 0 A1 Slave Add 2nd byte ADR[8:1] A2 Data A3 Figure 16-14. A master-transmitter addresses a slave-receiver with a 10-bit address S Slave Add1st 7bits 11110+ADR10+ADR9 R/W 0 A1 Slave Add 2nd byte ADR[8:1] A2 Sr Slave Add 1st 7bits 11110+ADR10+ADR9 R/W 1 A3 Data Figure 16-15. A master-receiver addresses a slave-transmitter with a 10-bit address. In the Figure 16-15, the first two bytes are the similar to Figure 16-14. After the repeated START(Sr),the first slave address is transmitted again, but the R/W is 1, meaning that the slave is acted as a transmitter. MC9S12ZVC Family Reference Manual , Rev. 1.9 520 NXP Semiconductors A4 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description 16.4.1.11 General Call Address To broadcast using a general call, a device must first generate the general call address($00), then after receiving acknowledge, it must transmit data. In communication, as a slave device, provided the GCEN is asserted, a device acknowledges the broadcast and receives data until the GCEN is disabled or the master device releases the bus or generates a new transfer. In the broadcast, slaves always act as receivers. In general call, IAAS is also used to indicate the address match. In order to distinguish whether the address match is the normal address match or the general call address match, IBDR should be read after the address byte has been received. If the data is $00, the match is general call address match. The meaning of the general call address is always specified in the first data byte and must be dealt with by S/W, the IIC hardware does not decode and process the first data byte. When one byte transfer is done, the received data can be read from IBDR. The user can control the procedure by enabling or disabling GCEN. 16.4.2 Operation in Run Mode This is the basic mode of operation. 16.4.3 Operation in Wait Mode IIC operation in wait mode can be configured. Depending on the state of internal bits, the IIC can operate normally when the CPU is in wait mode or the IIC clock generation can be turned off and the IIC module enters a power conservation state during wait mode. In the later case, any transmission or reception in progress stops at wait mode entry. 16.4.4 Operation in Stop Mode The IIC is inactive in stop mode for reduced power consumption. The STOP instruction does not affect IIC register states. 16.5 Resets The reset state of each individual bit is listed in Section 16.3, "Memory Map and Register Definition," which details the registers and their bit-fields. 16.6 Interrupts IICV3 uses only one interrupt vector. Table 16-11. Interrupt Summary Interrupt Offset Vector Priority IIC Interrupt -- -- -- Source Description IBAL, TCF, IAAS When either of IBAL, TCF or IAAS bits is set may bits in IBSR cause an interrupt based on arbitration lost, transfer register complete or address detect conditions MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 521 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Internally there are three types of interrupts in IIC. The interrupt service routine can determine the interrupt type by reading the status register. IIC Interrupt can be generated on 1. Arbitration lost condition (IBAL bit set) 2. Byte transfer condition (TCF bit set) 3. Address detect condition (IAAS bit set) The IIC interrupt is enabled by the IBIE bit in the IIC control register. It must be cleared by writing 0 to the IBF bit in the interrupt service routine. 16.7 16.7.1 16.7.1.1 Application Information IIC Programming Examples Initialization Sequence Reset will put the IIC bus control register to its default status. Before the interface can be used to transfer serial data, an initialization procedure must be carried out, as follows: 1. Update the frequency divider register (IBFD) and select the required division ratio to obtain SCL frequency from system clock. 2. Update the ADTYPE of IBCR2 to define the address length, 7 bits or 10 bits. 3. Update the IIC bus address register (IBAD) to define its slave address. If 10-bit address is applied IBCR2 should be updated to define the rest bits of address. 4. Set the IBEN bit of the IIC bus control register (IBCR) to enable the IIC interface system. 5. Modify the bits of the IIC bus control register (IBCR) to select master/slave mode, transmit/receive mode and interrupt enable or not. 6. If supported general call, the GCEN in IBCR2 should be asserted. 16.7.1.2 Generation of START After completion of the initialization procedure, serial data can be transmitted by selecting the 'master transmitter' mode. If the device is connected to a multi-master bus system, the state of the IIC bus busy bit (IBB) must be tested to check whether the serial bus is free. If the bus is free (IBB=0), the start condition and the first byte (the slave address) can be sent. The data written to the data register comprises the slave calling address and the LSB set to indicate the direction of transfer required from the slave. The bus free time (i.e., the time between a STOP condition and the following START condition) is built into the hardware that generates the START cycle. Depending on the relative frequencies of the system clock and the SCL period it may be necessary to wait until the IIC is busy after writing the calling address to the IBDR before proceeding with the following instructions. This is illustrated in the following example. MC9S12ZVC Family Reference Manual , Rev. 1.9 522 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description An example of a program which generates the START signal and transmits the first byte of data (slave address) is shown below: CHFLAG BRSET IBSR,#$20,* ;WAIT FOR IBB FLAG TO CLEAR TXSTART BSET IBCR,#$30 ;SET TRANSMIT AND MASTER MODE;i.e. GENERATE START CONDITION MOVB CALLING,IBDR ;TRANSMIT THE CALLING ADDRESS, D0=R/W IBFREE BRCLR IBSR,#$20,* ;WAIT FOR IBB FLAG TO SET 16.7.1.3 Post-Transfer Software Response Transmission or reception of a byte will set the data transferring bit (TCF) to 1, which indicates one byte communication is finished. The IIC bus interrupt bit (IBIF) is set also; an interrupt will be generated if the interrupt function is enabled during initialization by setting the IBIE bit. Software must clear the IBIF bit in the interrupt routine first. The TCF bit will be cleared by reading from the IIC bus data I/O register (IBDR) in receive mode or writing to IBDR in transmit mode. Software may service the IIC I/O in the main program by monitoring the IBIF bit if the interrupt function is disabled. Note that polling should monitor the IBIF bit rather than the TCF bit because their operation is different when arbitration is lost. Note that when an interrupt occurs at the end of the address cycle the master will always be in transmit mode, i.e. the address is transmitted. If master receive mode is required, indicated by R/W bit in IBDR, then the Tx/Rx bit should be toggled at this stage. During slave mode address cycles (IAAS=1), the SRW bit in the status register is read to determine the direction of the subsequent transfer and the Tx/Rx bit is programmed accordingly.For slave mode data cycles (IAAS=0) the SRW bit is not valid, the Tx/Rx bit in the control register should be read to determine the direction of the current transfer. The following is an example of a software response by a 'master transmitter' in the interrupt routine. ISR TRANSMIT BCLR BRCLR BRCLR BRSET MOVB IBSR,#$02 IBCR,#$20,SLAVE IBCR,#$10,RECEIVE IBSR,#$01,END DATABUF,IBDR 16.7.1.4 Generation of STOP ;CLEAR THE IBIF FLAG ;BRANCH IF IN SLAVE MODE ;BRANCH IF IN RECEIVE MODE ;IF NO ACK, END OF TRANSMISSION ;TRANSMIT NEXT BYTE OF DATA A data transfer ends with a STOP signal generated by the 'master' device. A master transmitter can simply generate a STOP signal after all the data has been transmitted. The following is an example showing how a stop condition is generated by a master transmitter. MASTX END EMASTX TST BEQ BRSET MOVB DEC BRA BCLR RTI TXCNT END IBSR,#$01,END DATABUF,IBDR TXCNT EMASTX IBCR,#$20 ;GET VALUE FROM THE TRANSMITING COUNTER ;END IF NO MORE DATA ;END IF NO ACK ;TRANSMIT NEXT BYTE OF DATA ;DECREASE THE TXCNT ;EXIT ;GENERATE A STOP CONDITION ;RETURN FROM INTERRUPT MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 523 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description If a master receiver wants to terminate a data transfer, it must inform the slave transmitter by not acknowledging the last byte of data which can be done by setting the transmit acknowledge bit (TXAK) before reading the 2nd last byte of data. Before reading the last byte of data, a STOP signal must be generated first. The following is an example showing how a STOP signal is generated by a master receiver. MASR DEC BEQ MOVB DEC BNE BSET RXCNT ENMASR RXCNT,D1 D1 NXMAR IBCR,#$08 ENMASR NXMAR BRA BCLR MOVB RTI NXMAR IBCR,#$20 IBDR,RXBUF 16.7.1.5 Generation of Repeated START LAMAR ;DECREASE THE RXCNT ;LAST BYTE TO BE READ ;CHECK SECOND LAST BYTE ;TO BE READ ;NOT LAST OR SECOND LAST ;SECOND LAST, DISABLE ACK ;TRANSMITTING ;LAST ONE, GENERATE `STOP' SIGNAL ;READ DATA AND STORE At the end of data transfer, if the master continues to want to communicate on the bus, it can generate another START signal followed by another slave address without first generating a STOP signal. A program example is as shown. RESTART BSET MOVB IBCR,#$04 CALLING,IBDR 16.7.1.6 Slave Mode ;ANOTHER START (RESTART) ;TRANSMIT THE CALLING ADDRESS;D0=R/W In the slave interrupt service routine, the module addressed as slave bit (IAAS) should be tested to check if a calling of its own address has just been received. If IAAS is set, software should set the transmit/receive mode select bit (Tx/Rx bit of IBCR) according to the R/W command bit (SRW). Writing to the IBCR clears the IAAS automatically. Note that the only time IAAS is read as set is from the interrupt at the end of the address cycle where an address match occurred, interrupts resulting from subsequent data transfers will have IAAS cleared. A data transfer may now be initiated by writing information to IBDR, for slave transmits, or dummy reading from IBDR, in slave receive mode. The slave will drive SCL low in-between byte transfers, SCL is released when the IBDR is accessed in the required mode. In slave transmitter routine, the received acknowledge bit (RXAK) must be tested before transmitting the next byte of data. Setting RXAK means an 'end of data' signal from the master receiver, after which it must be switched from transmitter mode to receiver mode by software. A dummy read then releases the SCL line so that the master can generate a STOP signal. 16.7.1.7 Arbitration Lost If several masters try to engage the bus simultaneously, only one master wins and the others lose arbitration. The devices which lost arbitration are immediately switched to slave receive mode by the hardware. Their data output to the SDA line is stopped, but SCL continues to be generated until the end of the byte during which arbitration was lost. An interrupt occurs at the falling edge of the ninth clock of this transfer with IBAL=1 and MS/SL=0. If one master attempts to start transmission while the bus is being engaged by another master, the hardware will inhibit the transmission; switch the MS/SL bit from 1 to 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 524 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description without generating STOP condition; generate an interrupt to CPU and set the IBAL to indicate that the attempt to engage the bus is failed. When considering these cases, the slave service routine should test the IBAL first and the software should clear the IBAL bit if it is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 525 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Clear IBIF Y TX Tx/Rx ? Master Mode ? N RX Arbitration Lost ? Y N Last Byte Transmitted ? N RXAK=0 ? Clear IBAL Y Last Byte To Be Read ? N End Of Addr Cycle (Master Rx) ? N Write Next Byte To IBDR Y Y (Read) N Y IAAS=1 ? N N 2nd Last Byte To Be Read ? Set TXAK =1 Y IAAS=1 ? N Y Y N Y 10-bit address? N ACK From Receiver ? N Set TX Mode Switch To Rx Mode 10-bit address transfer TX SRW=1 ? IBDR== 11110xx1? Y set RX Mode Read Data From IBDR And Store Tx Next Byte Write Data To IBDR RX TX/RX ? 7-bit address transfer N (Write) Y Generate Stop Signal Y Data Transfer set TX Mode Dummy Read From IBDR Switch To Rx Mode Set RX Mode Write Data To IBDR Dummy Read From IBDR Generate Stop Signal Read Data From IBDR And Store Dummy Read From IBDR Dummy Read From IBDR RTI Figure 16-16. Flow-Chart of Typical IIC Interrupt Routine MC9S12ZVC Family Reference Manual , Rev. 1.9 526 NXP Semiconductors Chapter 16 Inter-Integrated Circuit (IICV3) Block Description Caution:When IIC is configured as 10-bit address,the point of the data array in interrupt routine must be reset after it's addressed. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 527 Chapter 16 Inter-Integrated Circuit (IICV3) Block Description MC9S12ZVC Family Reference Manual , Rev. 1.9 528 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) Table 17-1. Revision History Table Revision Number Revision Date V02.00 05 Nov 2012 * Added CPTXD-dominant timeout feature 15 Apr 2013 * * * * V03.00 17.1 Sections Affected Description of Changes Made transmit driver (CANH & CANL) independent of CPCHVL condition Changed CPCLVL condition to disable CANL only Added mode to cover separation of CANH and CANL drivers Added configurable wake-up filter Introduction The CAN Physical Layer provides a physical layer for high speed CAN area network communication in automotive applications. It serves as an integrated interface to the CAN bus lines for the internally connected MSCAN controller through the pins CANH, CANL and SPLIT. The CAN Physical Layer is designed to meet the CAN Physical Layer ISO 11898-2 and ISO 11898-5 standards. 17.1.1 Features The CAN Physical Layer module includes these distinctive features: * High speed CAN interface for baud rates of up to 1 Mbit/s * ISO 11898-2 and ISO 11898-5 compliant for 12 V battery systems * SPLIT pin driver for bus recessive level stabilization * Low power mode with remote CAN wake-up handled by MSCAN module * Configurable wake-up pulse filtering * Over-current shutdown for CANH and CANL * Voltage monitoring on CANH and CANL * CPTXD-dominant timeout feature monitoring the CPTXD signal * Fulfills the OEM "Hardware Requirements for (LIN,) CAN (and FlexRay) Interfaces in Automotive Applications" v1.3 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 529 Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.1.2 Modes of Operation There are five modes the CAN Physical Layer can take (refer to 17.5.2 for details): 1. Shutdown mode In shutdown mode the CAN Physical Layer is fully de-biased including the wake-up receiver. 2. Normal mode In normal mode the transceiver is fully biased and functional. The SPLIT pin drives 2.5 V if enabled. 3. Pseudo-normal mode Same as normal mode with CANL driver disabled. 4. Listen-only mode Same as normal mode with transmitter de-biased. 5. Standby mode with configurable wake-up feature In standby mode the transceiver is fully de-biased. The wake-up receiver is enabled out of reset. * * * 17.1.3 CPU Run Mode The CAN Physical Layer is able to operate normally in modes 1 to 4. CPU Wait Mode The CAN Physical Layer operation is the same as in CPU run mode. CPU Stop Mode The CAN Physical Layer enters standby mode when the device voltage regulator switches to reduced performance mode ("RPM") after a CPU stop mode request. If enabled, the wake-up pulse filtering mechanism is activated immediately at CPU stop mode entry. Block Diagram Figure 17-1 shows a block diagram of the CAN Physical Layer. The module consists of a precision receiver, a low-power wake-up receiver, an output driver and diagnostics. MC9S12ZVC Family Reference Manual , Rev. 1.9 530 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) CPDTIF Interrupt Generation CPTXD VDDC CHOCIF Time out CHVHIF Status Change CHVH 5V CHVLIF CHVL 0V Status Change Precision Receiver CPRXD Standby Mode Wake-up Receiver Normal/Shutdown/ Standby mode intern. mid point 2.5V high-z 0V 1 SPE SPLIT CANL CAN BUS 0 Wake-up Filter CANH Standby Mode CLVLIF CLVHIF Status Change CLVL Status Change CLVH 0V 5V CLOCIF VSSC Figure 17-1. CAN Physical Layer Block Diagram 17.2 External Signal Description Table 17-2 shows the external pins associated with the CAN Physical Layer. Table 17-2. CAN Physical Layer Signal Properties Name Function CANH CAN Bus High Pin SPLIT 2.5 V Termination Pin CANL CAN Bus Low Pin VDDC Supply Pin for CAN Physical Layer VSSC Ground Pin for CAN Physical Layer MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 531 Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.2.1 CANH -- CAN Bus High Pin The CANH signal either connects directly to CAN bus high line or through an optional external common mode choke. 17.2.2 CANL -- CAN Bus Low Pin The CANL signal either connects directly to CAN bus low line or through an optional external common mode choke. 17.2.3 SPLIT -- CAN Bus Termination Pin The SPLIT pin can drive a 2.5 V bias for bus termination purpose (CAN bus middle point). Usage of this pin is optional and depends on bus termination strategy for a given bus network. 17.2.4 VDDC -- Supply Pin for CAN Physical Layer The VDDC pin is used to supply the CAN Physical Layer with 5 V from an external source. 17.2.5 VSSC -- Ground Pin for CAN Physical Layer The VSSC pin is the return path for the 5 V supply (VDDC). 17.3 17.3.1 Internal Signal Description CPTXD -- TXD Input to CAN Physical Layer CPTXD is the input signal to the CAN Physical Layer. A logic 1 on this input is considered CAN recessive and a logic 0 as dominant level. Per default, CPTXD is connected device-internally to the TXCAN transmitter output of the MSCAN module. For optional routing options consult the device level documentation. 17.3.2 CPRXD -- RXD Output of CAN Physical Layer CPRXD is the output signal of the CAN Physical Layer. A logic 1 on this output represents CAN recessive and a logic 0 a dominant level. In stand-by mode the wake-up receiver is routed to this output. A dominant pulse filter can optionally be enabled to increase robustness against false wake-up pulses. In any other mode this signal defaults to the precision receiver without a pulse filter. Per default, CPRXD is connected device-internally to the RXCAN receiver input of the MSCAN module. For optional routing options consult the device level documentation. MC9S12ZVC Family Reference Manual , Rev. 1.9 532 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.4 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the CAN Physical Layer. 17.4.1 Module Memory Map A summary of the registers associated with the CAN Physical Layer sub-block is shown in Table 17-3. Detailed descriptions of the registers and bits are given in the following sections. NOTE Register Address = Module Base Address + Address Offset, where the Module Base Address is defined at the MCU level and the Address Offset is defined at the module level. Address Offset Register Name 0x0000 CPDR R W 0x0001 CPCR 0x0002 Reserved 0x0003 CPSR 0x0004 Reserved R W 0x0005 Reserved R W 0x0006 CPIE R W 0x0007 CPIF R W Bit 7 6 5 4 3 2 CPDR7 0 0 0 0 0 R W CPE SPE R W Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved R CPCHVH W CPCHVL CPCLVH CPCLVL CPDT 0 0 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 0 0 0 CPVFIE CPDTIE 0 0 CHVHIF CHVLIF CLVHIF CLVLIF CPDTIF WUPE1-0 0 1 CPDR1 Bit 0 CPDR0 SLR2-0 0 CHOCIF CPOCIE CLOCIF = Unimplemented or Reserved Table 17-3. CAN Physical Layer Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 533 Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.4.2 Register Descriptions This section describes all CAN Physical Layer registers and their individual bits. 17.4.2.1 Port CP Data Register (CPDR) Access: User read/write1 Module Base + 0x0000 R 7 6 5 4 3 2 CPDR7 0 0 0 0 0 1 0 0 0 0 0 W Reset 1 0 CPDR1 1 CPDR0 1 Figure 17-2. Port CP Data Register (CPDR) 1 Read: Anytime Write: Anytime Table 17-4. CPDR Register Field Descriptions Field Description 7 CPDR7 Port CP Data Bit 7 Read-only bit. The synchronized CAN Physical Layer wake-up receiver output can be read at any time. 1 CPDR1 Port CP Data Bit 1 The CAN Physical Layer CPTXD input can be directly controlled through this register bit if routed here (see device-level specification). In this case the register bit value is driven to the pin. 0 CPTXD is driven low (dominant) 1 CPTXD is driven high (recessive) 0 CPDR0 Port CP Data Bit 0 Read-only bit. The synchronized CAN Physical Layer CPRXD output state can be read at any time. MC9S12ZVC Family Reference Manual , Rev. 1.9 534 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.4.2.2 CAN Physical Layer Control Register (CPCR) Access: User read/write1 Module Base + 0x0001 R W Reset 7 6 CPE SPE 0 0 5 4 2 0 WUPE1-0 1 3 0 0 1 0 SLR2-0 0 0 0 Figure 17-3. CAN Physical Layer Control Register (CPCR) 1 Read: Anytime Write: Anytime except CPE which is set once Table 17-5. CPCR Register Field Descriptions Field 7 CPE Description CAN Physical Layer Enable Set once. If set to 1, the CAN Physical Layer exits shutdown mode and enters normal mode. 0 CAN Physical Layer is disabled (shutdown mode) 1 CAN Physical Layer is enabled 6 SPE Split Enable If set to 1, the CAN Physical Layer SPLIT pin drives a 2.5 V bias in normal and listen-only mode. 0 SPLIT pin is high-impedance 1 SPLIT pin drives a 2.5 V bias 5-4 WUPE1-0 Wake-Up Receiver Enable and Filter Select If WUPE[1:0]0, the CAN Physical Layer wake-up receiver is enabled when not in shutdown mode. To save additional power, these bits should be set to 00, if the CAN bus is not used to wake up the device. For robustness against false wake-up an optional pulse filter can be enabled. 00 Wake-up receiver is disabled 10 Wake-up receiver is enabled, no filtering 01 Wake-up receiver is enabled, first wake-up event is masked 11 Wake-up receiver is enabled, first two wake-up events are masked 2-0 SLR2-0 Slew Rate The slew rate controls recessive to dominant and dominant to recessive transitions. This affects the delay time from CPTXD to the bus and from the bus to CPRXD. The loop time is thus affected by the slew rate selection. Six slew rates are available: 000 CAN Physical Layer slew rate 0 001 CAN Physical Layer slew rate 1 010 CAN Physical Layer slew rate 2 011 Reserved 100 CAN Physical Layer slew rate 4 101 CAN Physical Layer slew rate 5 110 CAN Physical Layer slew rate 6 111 Reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 535 Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.4.2.3 Reserved Register Access: User read/write1 Module Base + 0x0002 R W 7 6 5 4 3 2 1 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved x x x x x x x x Reset Figure 17-4. Reserved Register 1 Read: Anytime Write: Only in special mode NOTE This reserved register is designed for factory test purposes only and is not intended for general user access. Writing to this register when in special modes can alter the modules functionality. 17.4.2.4 CAN Physical Layer Status Register (CPSR) Access: User read/write1 Module Base + 0x0003 R 7 6 5 4 3 2 1 0 CPCHVH CPCHVL CPCLVH CPCLVL CPDT 0 0 0 0 0 0 0 0 0 0 0 W Reset Figure 17-5. CAN Physical Layer Status Register (CPSR) 1 Read: Anytime Write: Never Table 17-6. CPSR Register Field Descriptions Field 7 CPCHVH Description CANH Voltage Failure High Status Bit This bit reflects the CANH voltage failure high monitor status. 0 Condition VCANH VH5 1 Condition VCANH VH5 6 CPCHVL CANH Voltage Failure Low Status Bit This bit reflects the CANH voltage failure low monitor status. 0 Condition VCANH VH0 1 Condition VCANH VH0 5 CPCLVH CANL Voltage Failure High Status Bit This bit reflects the CANL voltage failure high monitor status. 0 Condition VCANL VL5 1 Condition VCANL VL5 MC9S12ZVC Family Reference Manual , Rev. 1.9 536 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) Table 17-6. CPSR Register Field Descriptions Field 4 CPCLVL Description CANL Voltage Failure Low Status Bit This bit reflects the CANL voltage failure low monitor status. 0 Condition VCANL VL0 1 Condition VCANL VL0 3 CPDT CPTXD-Dominant Timeout Status Bit This bit is set to 1, if CPTXD is dominant for longer than tCPTXDDT. It signals a timeout event and remains set until CPTXD returns to recessive level for longer than 1 s. 0 No CPTXD-timeout occurred or CPTXD has ceased to be dominant after timeout 1 CPTXD-dominant timeout occurred and CPTXD is still dominant MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 537 Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.4.2.5 Reserved Register Access: User read/write1 Module Base + 0x0004 R W Reset 7 6 5 4 3 2 1 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved x x x x x x x x Figure 17-6. Reserved Register 1 Read: Anytime Write: Only in special mode NOTE This reserved register is designed for factory test purposes only and is not intended for general user access. Writing to this register when in special modes can alter the modules functionality. 17.4.2.6 Reserved Register Access: User read/write1 Module Base + 0x0005 R W Reset 7 6 5 4 3 2 1 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved x x x x x x x x Figure 17-7. Reserved Register 1 Read: Anytime Write: Only in special mode NOTE This reserved register is designed for factory test purposes only and is not intended for general user access. Writing to this register when in special modes can alter the modules functionality. 17.4.2.7 CAN Physical Layer Interrupt Enable Register (CPIE) Access: User read/write1 Module Base + 0x0006 R 7 6 5 0 0 0 0 0 0 W Reset 4 3 CPVFIE CPDTIE 0 0 2 1 0 0 0 0 0 CPOCIE 0 Figure 17-8. CAN Physical Layer Interrupt Enable Register (CPIE) 1 Read: Anytime Write: Anytime MC9S12ZVC Family Reference Manual , Rev. 1.9 538 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) Table 17-7. CPIE Register Field Descriptions Field Description 4 CPVFIE CAN Physical Layer Voltage-Failure Interrupt Enable If enabled, the CAN Physical Layer generates an interrupt if any of the CAN Physical Layer voltage failure interrupt flags assert. 0 Voltage failure interrupt is disabled 1 Voltage failure interrupt is enabled 3 CPDTIE CPTXD-Dominant Timeout Interrupt Enable If enabled, the CAN Physical Layer generates an interrupt if the CPTXD-dominant timeout interrupt flag asserts. 0 CPTXD-dominant timeout interrupt is disabled 1 CPTXD-dominant timeout interrupt is enabled 0 CPOCIE CAN Physical Layer Over-current Interrupt Enable If enabled, the CAN Physical Layer generates an interrupt if any of the CAN Physical Layer over-current interrupt flags assert. 0 Over-current interrupt is disabled 1 Over-current interrupt is enabled 17.4.2.8 CAN Physical Layer Interrupt Flag Register (CPIF) Access: User read/write1 Module Base + 0x0007 R W Reset 7 6 5 4 3 CHVHIF CHVLIF CLVHIF CLVLIF CPDTIF 0 0 0 0 0 2 0 0 1 0 CHOCIF CLOCIF 0 0 Figure 17-9. CAN Physical Layer Interrupt Flag Register (CPIF) 1 Read: Anytime Write: Anytime, write 1 to clear If any of the flags is asserted an error interrupt is pending if enabled. A flag can be cleared by writing a logic level 1 to the corresponding bit location. Writing a 0 has no effect. Table 17-8. CPIF Register Field Descriptions Field 7 CHVHIF Description CANH Voltage Failure High Interrupt Flag This flag is set to 1 when the CPCHVH bit in the CAN Physical Layer Status Register (CPSR) changes. 0 No change in CPCHVH 1 CPCHVH has changed 6 CHVLIF CANH Voltage Failure Low Interrupt Flag This flag is set to 1 when the CPCHVL bit in the CAN Physical Layer Status Register (CPSR) changes. 0 No change in CPCHVL 1 CPCHVL has changed MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 539 Chapter 17 CAN Physical Layer (S12CANPHYV3) Table 17-8. CPIF Register Field Descriptions Field 5 CLVHIF Description CANL Voltage Failure High Interrupt Flag This flag is set to 1 when the CPCLVH bit in the CAN Physical Layer Status Register (CPSR) changes. 0 No change in CPCLVH 1 CPCLVH has changed 4 CLVLIF CANL Voltage Failure Low Interrupt Flag This flag is set to 1 when the CPCLVL bit in the CAN Physical Layer Status Register (CPSR) changes. 0 No change in CPCLVL 1 CPCLVL has changed 3 CPDTIF CAN CPTXD-Dominant Timeout Interrupt Flag This flag is set to 1 when CPTXD is dominant longer than tCPTXDDT. It signals a timeout event and entry of listen-only mode disabling the transmitter. Exit of listen-only mode which was entered at timeout is requested by clearing CPDTIF when CPDT is clear after setting CPTXD to recessive state. It takes 1 to 2 s to return to normal mode. If CPTXD is dominant or dominant timeout status is still active (CPDT=1) when clearing the flag, the CAN Physical Layer remains in listen-only mode and this flag is set again after a delay (see 17.5.4.2, "CPTXD-Dominant Timeout Interrupt""). 0 No CPTXD-dominant timeout has occurred 1 CPTXD-dominant timeout has occurred 1 CHOCIF CANH Over-Current Interrupt Flag This flag is set to 1 if an over current condition was detected on CANH when driving a dominant bit to the CAN bus. While this flag is asserted the CAN Physical Layer remains in listen-only mode. 0 Normal current level ICANH < ICANHOC 1 Error event ICANH ICANHOC occurred 0 CLOCIF CANL Over-Current Interrupt Flag This flag is set to 1 if an over current condition was detected on CANL when driving a dominant bit to the CAN bus. While this flag is asserted the CAN Physical Layer remains in listen-only mode. 0 Normal current level ICANL < ICANLOC 1 Error event ICANL ICANLOC occurred MC9S12ZVC Family Reference Manual , Rev. 1.9 540 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.5 Functional Description 17.5.1 General The CAN Physical Layer provides an interface for the SoC-integrated MSCAN controller. 17.5.2 Modes Figure 17-10 shows the possible mode transitions depending on control bit CPE, device reduced performance mode ("RPM"; refer to "Low Power Modes" section in device overview) and bus error conditions. Reset Shutdown TRM: Transmitter REC: Receiver WUP: Wake-up receiver RPM: Reduced performance mode TRM: Off, REC: Off, WUP: Off CANH,CANL: 30Kterm. to VSSC SPLIT: High-impedance A = (CPCHVH| CPCLVH| CHOCIF | CLOCIF| CPDTIF1) CPE = 1 A Normal Listen-only TRM: On, REC: On, WUP: WUPE TRM: Off, REC: On, WUP: WUPE A & CPCLVL & CPTXD=1 CANH, CANL: Driver on SPLIT: SPE CPCLVL A & CPCLVL & CPTXD=1 RPM CPCLVL CANH, CANL: Driver off SPLIT: SPE A RPM RPM & A RPM & A & CPCLVL Standby Pseudo-Normal TRM: On, REC: On, WUP: WUPE CANH: Driver on, CANL: Driver off SPLIT: SPE RPM TRM: Off, REC: Off, WUP: WUPE RPM & A & CPCLVL CANH,CANL: 30K term. to VSSC SPLIT: High-impedance 1: A delay after clearing CPDTIF must be accounted for (see description) Figure 17-10. CAN Physical Layer Mode Transitions 17.5.2.1 Shutdown Mode Shutdown mode is a low power mode and entered out of reset. The transceiver, wake-up, bus error diagnostic, dominant timeout and interrupt functionality are disabled. CANH and CANL lines are pulled MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 541 Chapter 17 CAN Physical Layer (S12CANPHYV3) to VSSC via high-ohmic input resistors of the receiver. The SPLIT pin as well as the internal mid-point reference are set to high-impedance. Shutdown mode cannot be re-entered until reset. 17.5.2.2 Normal Mode In normal mode the full transceiver functionality is available. In this mode, the CAN bus is controlled by the CPTXD input and the CAN bus state (recessive, dominant) is reported on the CPRXD output. The voltage failure, over-current and CPTXD-dominant timeout monitors are enabled. The SPLIT pin is driving a 2.5 V bias if enabled. The internal mid-point reference is set to 2.5 V. If CPTXD is high, the transmit driver is set into recessive state, and CANH and CANL lines are biased to the voltage set at VDDC divided by 2, approx. 2.5 V. If CPTXD is low, the transmit driver is set into dominant state, and CANH and CANL drivers are active. CANL is pulled low and CANH is pulled high. The receiver reports the bus state on CPRXD. If the differential voltage VCANH minus VCANL at CANH and CANL is below the internal threshold, the bus is recessive and CPRXD is set high, otherwise a dominant bus is detected and CPRXD is set low. When detecting a voltage high failure, over-current or CPTXD-dominant timeout event the CAN Physical Layer enters listen-only mode. A voltage low failure on CANL results in entering pseudo-normal mode. A voltage low failure on CANH maintains normal mode. NOTE After entering normal mode from shutdown or standby mode a settling time of tCP_set must have passed until flags can be considered as valid. 17.5.2.3 Pseudo-Normal Mode Pseudo-normal mode is identical to normal mode except for CANL driver being disabled as a result of a voltage low failure that has been detected on the CANL bus line (CPCLVL=1). CANH remains functional in this mode to allow transmission. Normal mode will automatically be re-entered after the error condition has ceased. 17.5.2.4 Listen-only Mode Listen-only mode is entered upon detecting a CAN bus error condition (except for CPCLVL=1) or CPTXD-dominant timeout event. The entire transmitter is forced off. All other functions of the normal mode are maintained. Application software action is required to re-enter normal mode by clearing the related flags if the bus error condition was caused by an over-current (refer to 17.6.3). In case of a voltage failure, normal mode will automatically be re-entered if the condition has passed. If the listen-only mode was caused by CPTXD-dominant timeout event, the related flag can only be cleared after the CPTXD has returned to recessive level. MC9S12ZVC Family Reference Manual , Rev. 1.9 542 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.5.2.5 Standby Mode Standby is a reduced current consumption mode and is entered during RPM following a stop mode request. The transceiver and bus error diagnostics are disabled. The CPTXD-dominant timeout counter is stopped. CANH and CANL lines are pulled to VSSC via high-ohmic input resistors of the receiver. The SPLIT pin is set to high-impedance. The internal mid-point reference is set to 0V. All voltage failure and over-current monitors are disabled. Standby is left as soon as the device returns from RPM. 17.5.3 Configurable Wake-Up If the wake-up function is enabled, the CAN Physical Layer provides an asynchronous path through CPRXD to the MSCAN to support wake-up from stop mode. The CPRXD signal is switched from precision receiver to the low-power wake-up receiver as long as the device resides in RPM. In order to avoid false wake-up after entering stop mode, a pulse filter can be enabled and configured to mask the first or first two wake-up events from the MSCAN input. The CPRXD output is held at recessive level until the selected number of wake-up events have been detected as shown in Figure 17-11. A valid wakeup-event is defined as a dominant level with a length of min. tCPWUP followed by a recessive level of length tCPWUP. The wake-up filter specification tWUP of the MSCAN applies to wake-up the MSCAN from sleep mode. Refer to MSCAN chapter.After wake-up the CAN Physical Layer automatically returns to the mode where stop mode was requested. Refer to 17.6.2, "Wake-up Mechanism"" for setup information. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 543 Chapter 17 CAN Physical Layer (S12CANPHYV3) Wake-up Receiver Output CANPHY wake-up pulse specification: DOMINANT RECESSIVE tCPWUP tCPWUP tCPWUP tCPWUP 1. CANPHY Wake-up Event (disables CPRXD mask) 2. Case A: CPRXD (CPCR[WUPE]=b00) Case B: CPRXD (CPCR[WUPE]=b10) Case C: CPRXD (CPCR [WUPE]=b01) Case D: CPRXD (CPCR [WUPE]=b11) MSCAN Wake-up (CANCTL0[WUPE]=1 & CANCTL1[WUPM]=1) MSCAN wake-up pulse specification: B tWUP C tWUP D tWUP Figure 17-11. Wake-up Event Filtering 17.5.4 Interrupts This section describes the interrupt generated by the CAN Physical Layer and its individual sources. Vector addresses and interrupt priorities are defined at MCU level. The module internal interrupt sources are combined (OR-ed) into one module interrupt output CPI with a single local enable bit each for voltage failure and over-current errors. Table 17-9. CAN Physical Layer Interrupt Sources Module Interrupt Source CAN Physical Layer Interrupt (CPI) Module Internal Interrupt Source CANH Voltage Failure High Interrupt (CHVHIF) Local Enable CPVFIE = 1 CANH Voltage Failure Low Interrupt (CHVLIF) CANL Voltage Failure High Interrupt (CLVHIF) CANL Voltage Failure Low Interrupt (CLVLIF) CPTXD-Dominant Timeout Interrupt (CPDTIF) CPDTIE = 1 CANH Over-Current Interrupt (CHOCIF) CPOCIE = 1 CANL Over-Current Interrupt (CLOCIF) MC9S12ZVC Family Reference Manual , Rev. 1.9 544 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) 17.5.4.1 Voltage Failure Interrupts A voltage failure error is detected if voltage levels on the CAN bus lines exceed the specified limits. The voltages on both lines CANH and CANL are monitored continuously for crossing the lower and higher thresholds, VH0, VH5 and VL0, VL5, respectively. A comparator output transition to error level results in setting the corresponding status bit in CAN Physical Layer Status Register (CPSR). A change of a status bit sets the related interrupt flag in CAN Physical Layer Interrupt Flag Register (CPIF). The flags are used as interrupt sources of which either of the four can generate a CPI interrupt if the common enable bit CPVFIE in CAN Physical Layer Interrupt Enable Register (CPIE) is set. 17.5.4.2 CPTXD-Dominant Timeout Interrupt For network lock-up protection of the CAN bus, the CAN physical layer features a permanent CPTXD-dominant timeout monitor. When the CPTXD signal has been dominant for more than tCPTXDDT the transmitter is disabled by entering listen-only mode and the bus is released to recessive state. The CPDT status and CPDTIF interrupt flags are both set. To re-enable the transmitter, the CPDTIF flag must be cleared. If the CPTXD input is dominant or dominant timeout status is still active (CPDT=1), the CAN Physical Layer stays in listen-only mode and CPDTIF is set again after some microseconds to indicate that the attempt has failed. If CPTXD is recessive and CPDT=0 it takes 1 to 2 s after clearing CPDTIF for returning to normal mode. The flag is used as an interrupt source to generate a CPI interrupt if the enable bit CPDTIE in CAN Physical Layer Interrupt Enable Register (CPIE) is set. 17.5.4.3 Over-Current Interrupt An over-current error is detected if current levels on the CAN bus lines exceed the specified limits while driving a dominant bit. The current levels on both lines CANH and CANL are monitored continuously for crossing the thresholds ICANHOC and ICANLOC, respectively. A comparator output transition to error level results in setting the corresponding interrupt flag in CAN Physical Layer Interrupt Flag Register (CPIF). The flags are the direct interrupt sources of which either of the two can generate a CPI interrupt if the common enable bit CPOCIE in CAN Physical Layer Interrupt Enable Register (CPIE) is set. 17.6 17.6.1 Initialization/Application Information Initialization Sequence Setup for immediate CAN communication: 1. Enable and configure MSCAN MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 545 Chapter 17 CAN Physical Layer (S12CANPHYV3) 2. 3. 4. 5. 6. 7. 17.6.2 Configure CAN Physical Layer slew rate Enable CAN Physical Layer interrupts Optionally enable SPLIT pin Configure wake-up filter or disable wake-up receiver in case of other wake-up sources Enable CAN Physical Layer to enter normal mode Start CAN communication Wake-up Mechanism In stop mode the CAN Physical Layer passes CAN bus states to CPRXD if the wake-up function is enabled (CPCR[WUPE1:WUPE0]0). In order to wake up the device from stop mode, the wake-up interrupt of the connected MSCAN module is used. If CPCR[WUPE1:WUPE0]=b10 the CAN Physical Layer is transparent in stop mode and the MSCAN can be used with or without its integrated low-pass filter for wake-up. Refer to the MSCAN chapter for details on configuring and enabling the wake-up function. For increased robustness against false wake-up, a CAN Physical Layer pulse filter can optionally be enabled to mask the first (CPCR[WUPE1:WUPE0]=b01) or first two (CPCR[WUPE1:WUPE0]=b11) wake-up events after entering stop mode. The appropriate number of masked pulses depends on the individual CAN bus network topology. Note that the MSCAN can generate a wake-up interrupt immediately after it acknowledges sleep mode (CANCTL1[SPLAK]=1) whereas the CAN Physical Layer pulse filter takes effect only after entering stop mode. To avoid a false wake-up in between these two events, the MSCAN low-pass filter should also be activated (CANCTL1[WUPM]=1). After sleep mode acknowledge the CPU STOP instruction should be executed before the expiration of tWUP(min) to enable the CAN Physical Layer pulse filter in time. 17.6.3 Bus Error Handling Upon CAN bus error voltage high failures and over-current events listen-only is entered immediately and the transmitter is turned off. This mode is maintained as long as voltage failure conditions persist or, in case of over-current events, application software re-enables the transmit driver by clearing the related flags. All high and low voltage levels for both CAN bus lines are continuously reflected in their related voltage failure status bits. A change in a status bit sets the corresponding flag and generates an interrupt if enabled. As long as any of the voltage failure high status bits is set, the transmit driver remains off. It will be turned on again automatically as soon as all voltage failure conditions have disappeared. In case of a voltage failure low condition on CANL only the CANL driver is disabled. A voltage failure low condition on CANH has no effect on the transmitter. Voltage failure errors have informational purpose. If the application detects frequent CAN protocol errors it is advisable to take the appropriate action. No software action is need to re-enable the transmit driver. An over-current event on either CAN bus line sets the related flag and turns off the transmit driver. This error can only be detected while driving the bus dominant. In contrast to the voltage failure the over-current MC9S12ZVC Family Reference Manual , Rev. 1.9 546 NXP Semiconductors Chapter 17 CAN Physical Layer (S12CANPHYV3) condition instantaneously disappears as soon as the transmit driver is automatically being turned off. This state is locked and the application software must account for re-enabling the driver. The recommended procedure to handle an over-current related bus error is: 1. On interrupt abort any scheduled transmissions 2. Read interrupt flag register to determine over-current source(s) 3. Clear related interrupt flag(s) 4. Retry CAN transmission 5. On interrupt abort any scheduled transmissions 6. Read interrupt flag register to determine over-current source(s) 7. If the same over-current error persists do not retry and run appropriate custom diagnostics 17.6.4 CPTXD-Dominant Timeout Recovery Recovery from a CPTXD-dominant timeout error is attempted with the following sequence: 1. On CPTXD-dominant timeout interrupt set CPTXD input to recessive state 2. Wait until CPDT clear; exit loop if waiting for longer than 3 s and report malfunction 3. Clear CPDTIF 4. Wait for min. 2 s before attempting new transmission MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 547 Chapter 17 CAN Physical Layer (S12CANPHYV3) MC9S12ZVC Family Reference Manual , Rev. 1.9 548 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Revision History Revision Number Revision Date Sections Affected V03.14 12 Nov 2012 Table 18-10 V03.15 12 Jan 2013 Table 18-2 Table 18-25 Figure 18-37 18.1/18-549 18.3.2.15/18-570 V03.16 08 Aug 2013 18.1 Description of Changes * Corrected RxWRN and TxWRN threshold values * * * * * Updated TIME bit description Added register names to buffer map Updated TSRH and TSRL read conditions Updated introduction Updated CANTXERR and CANRXERR register notes * Corrected typos Introduction NXP's scalable controller area network (S12MSCANV3) definition is based on the MSCAN12 definition, which is the specific implementation of the MSCAN concept targeted for the S12, S12X and S12Z microcontroller families. The module is a communication controller implementing the CAN 2.0A/B protocol as defined in the Bosch specification dated September 1991. For users to fully understand the MSCAN specification, it is recommended that the Bosch specification be read first to familiarize the reader with the terms and concepts contained within this document. Though not exclusively intended for automotive applications, CAN protocol is designed to meet the specific requirements of a vehicle serial data bus: real-time processing, reliable operation in the EMI environment of a vehicle, cost-effectiveness, and required bandwidth. MSCAN uses an advanced buffer arrangement resulting in predictable real-time behavior and simplified application software. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 549 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.1.1 Glossary Table 18-1. Terminology ACK Acknowledge of CAN message CAN Controller Area Network CRC Cyclic Redundancy Code EOF End of Frame FIFO First-In-First-Out Memory IFS Inter-Frame Sequence SOF Start of Frame CPU bus CPU related read/write data bus CAN bus CAN protocol related serial bus oscillator clock bus clock CPU bus related clock CAN clock 18.1.2 Direct clock from external oscillator CAN protocol related clock Block Diagram MSCAN Oscillator Clock Bus Clock MUX CANCLK Presc. Tq Clk Receive/ Transmit Engine Transmit Interrupt Req. Receive Interrupt Req. Errors Interrupt Req. TXCAN Message Filtering and Buffering Control and Status Wake-Up Interrupt Req. Configuration Registers RXCAN Wake-Up Low Pass Filter Figure 18-1. MSCAN Block Diagram MC9S12ZVC Family Reference Manual , Rev. 1.9 550 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.1.3 Features The basic features of the MSCAN are as follows: * Implementation of the CAN protocol -- Version 2.0A/B -- Standard and extended data frames -- Zero to eight bytes data length -- Programmable bit rate up to 1 Mbps1 -- Support for remote frames * Five receive buffers with FIFO storage scheme * Three transmit buffers with internal prioritization using a "local priority" concept * Flexible maskable identifier filter supports two full-size (32-bit) extended identifier filters, or four 16-bit filters, or eight 8-bit filters * Programmable wake-up functionality with integrated low-pass filter * Programmable loopback mode supports self-test operation * Programmable listen-only mode for monitoring of CAN bus * Programmable bus-off recovery functionality * Separate signalling and interrupt capabilities for all CAN receiver and transmitter error states (warning, error passive, bus-off) * Programmable MSCAN clock source either bus clock or oscillator clock * Internal timer for time-stamping of received and transmitted messages * Three low-power modes: sleep, power down, and MSCAN enable * Global initialization of configuration registers 18.1.4 Modes of Operation For a description of the specific MSCAN modes and the module operation related to the system operating modes refer to Section 18.4.4, "Modes of Operation". 1. Depending on the actual bit timing and the clock jitter of the PLL. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 551 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.2 External Signal Description The MSCAN uses two external pins. NOTE On MCUs with an integrated CAN physical interface (transceiver) the MSCAN interface is connected internally to the transceiver interface. In these cases the external availability of signals TXCAN and RXCAN is optional. 18.2.1 RXCAN -- CAN Receiver Input Pin RXCAN is the MSCAN receiver input pin. 18.2.2 TXCAN -- CAN Transmitter Output Pin TXCAN is the MSCAN transmitter output pin. The TXCAN output pin represents the logic level on the CAN bus: 0 = Dominant state 1 = Recessive state 18.2.3 CAN System A typical CAN system with MSCAN is shown in Figure 18-2. Each CAN station is connected physically to the CAN bus lines through a transceiver device. The transceiver is capable of driving the large current needed for the CAN bus and has current protection against defective CAN or defective stations. CAN node 2 CAN node 1 CAN node n MCU CAN Controller (MSCAN) TXCAN RXCAN Transceiver CANH CANL CAN Bus Figure 18-2. CAN System MC9S12ZVC Family Reference Manual , Rev. 1.9 552 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the MSCAN. 18.3.1 Module Memory Map Figure 18-3 gives an overview on all registers and their individual bits in the MSCAN memory map. The register address results from the addition of base address and address offset. The base address is determined at the MCU level and can be found in the MCU memory map description. The address offset is defined at the module level. The MSCAN occupies 64 bytes in the memory space. The base address of the MSCAN module is determined at the MCU level when the MCU is defined. The register decode map is fixed and begins at the first address of the module address offset. The detailed register descriptions follow in the order they appear in the register map. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 553 Chapter 18 Scalable Controller Area Network (S12MSCANV3) Register Name Bit 7 0x0000 CANCTL0 R 0x0001 CANCTL1 R 0x0002 CANBTR0 R 0x0003 CANBTR1 R 0x0004 CANRFLG R 0x0005 CANRIER R 0x0006 CANTFLG R W W W W W W RXFRM 6 RXACT 5 CSWAI 4 SYNCH 3 2 1 Bit 0 TIME WUPE SLPRQ INITRQ SLPAK INITAK CANE CLKSRC LOOPB LISTEN BORM WUPM SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0 SAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10 WUPIF CSCIF RSTAT1 RSTAT0 TSTAT1 TSTAT0 OVRIF RXF WUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE 0 0 0 0 0 TXE2 TXE1 TXE0 0 0 0 0 0 TXEIE2 TXEIE1 TXEIE0 0 0 0 0 0 ABTRQ2 ABTRQ1 ABTRQ0 0 0 0 0 0 ABTAK2 ABTAK1 ABTAK0 0 0 0 0 0 TX2 TX1 TX0 0 0 IDAM1 IDAM0 0 IDHIT2 IDHIT1 IDHIT0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 W 0x0007 CANTIER R 0x0008 CANTARQ R W W 0x0009 CANTAAK R W 0x000A CANTBSEL W R 0x000B CANIDAC R 0x000C Reserved R 0x000D CANMISC R 0x000E CANRXERR R W W W BOHOLD RXERR0 W = Unimplemented or Reserved Figure 18-3. MSCAN Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 554 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Register Name 0x000F CANTXERR R 0x0010-0x0013 CANIDAR0-3 R 0x0014-0x0017 CANIDMRx R 0x0018-0x001B CANIDAR4-7 R 0x001C-0x001F CANIDMR4-7 R Bit 7 6 5 4 3 2 1 Bit 0 TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0 AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0 AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0 AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0 AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0 W 0x0020-0x002F CANRXFG 0x0030-0x003F CANTXFG W W W W R See Section 18.3.3, "Programmer's Model of Message Storage" W R See Section 18.3.3, "Programmer's Model of Message Storage" W = Unimplemented or Reserved Figure 18-3. MSCAN Register Summary (continued) 18.3.2 Register Descriptions This section describes in detail all the registers and register bits in the MSCAN module. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. All bits of all registers in this module are completely synchronous to internal clocks during a register read. 18.3.2.1 MSCAN Control Register 0 (CANCTL0) The CANCTL0 register provides various control bits of the MSCAN module as described below. Access: User read/write1 Module Base + 0x0000 7 R W RXFRM Reset: 0 6 5 RXACT CSWAI 0 0 4 SYNCH 0 3 2 1 0 TIME WUPE SLPRQ INITRQ 0 0 0 1 = Unimplemented Figure 18-4. MSCAN Control Register 0 (CANCTL0) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 555 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 1 Read: Anytime Write: Anytime when out of initialization mode; exceptions are read-only RXACT and SYNCH, RXFRM (which is set by the module only), and INITRQ (which is also writable in initialization mode) NOTE The CANCTL0 register, except WUPE, INITRQ, and SLPRQ, is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable again as soon as the initialization mode is exited (INITRQ = 0 and INITAK = 0). Table 18-2. CANCTL0 Register Field Descriptions Field Description 7 RXFRM Received Frame Flag -- This bit is read and clear only. It is set when a receiver has received a valid message correctly, independently of the filter configuration. After it is set, it remains set until cleared by software or reset. Clearing is done by writing a 1. Writing a 0 is ignored. This bit is not valid in loopback mode. 0 No valid message was received since last clearing this flag 1 A valid message was received since last clearing of this flag 6 RXACT Receiver Active Status -- This read-only flag indicates the MSCAN is receiving a message1. The flag is controlled by the receiver front end. This bit is not valid in loopback mode. 0 MSCAN is transmitting or idle 1 MSCAN is receiving a message (including when arbitration is lost) 5 CSWAI2 CAN Stops in Wait Mode -- Enabling this bit allows for lower power consumption in wait mode by disabling all the clocks at the CPU bus interface to the MSCAN module. 0 The module is not affected during wait mode 1 The module ceases to be clocked during wait mode 4 SYNCH Synchronized Status -- This read-only flag indicates whether the MSCAN is synchronized to the CAN bus and able to participate in the communication process. It is set and cleared by the MSCAN. 0 MSCAN is not synchronized to the CAN bus 1 MSCAN is synchronized to the CAN bus 3 TIME 2 WUPE3 Timer Enable -- This bit activates an internal 16-bit wide free running timer which is clocked by the bit clock rate. If the timer is enabled, a 16-bit time stamp will be assigned to each transmitted/received message within the active TX/RX buffer. Right after the EOF of a valid message on the CAN bus, the time stamp is written to the highest bytes (0x000E, 0x000F) in the appropriate buffer (see Section 18.3.3, "Programmer's Model of Message Storage"). In loopback mode no receive timestamp is generated. The internal timer is reset (all bits set to 0) when disabled. This bit is held low in initialization mode. 0 Disable internal MSCAN timer 1 Enable internal MSCAN timer Wake-Up Enable -- This configuration bit allows the MSCAN to restart from sleep mode or from power down mode (entered from sleep) when traffic on CAN is detected (see Section 18.4.5.5, "MSCAN Sleep Mode"). This bit must be configured before sleep mode entry for the selected function to take effect. 0 Wake-up disabled -- The MSCAN ignores traffic on CAN 1 Wake-up enabled -- The MSCAN is able to restart MC9S12ZVC Family Reference Manual , Rev. 1.9 556 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-2. CANCTL0 Register Field Descriptions (continued) 1 2 3 4 5 6 7 8 9 Field Description 1 SLPRQ4 Sleep Mode Request -- This bit requests the MSCAN to enter sleep mode, which is an internal power saving mode (see Section 18.4.5.5, "MSCAN Sleep Mode"). The sleep mode request is serviced when the CAN bus is idle, i.e., the module is not receiving a message and all transmit buffers are empty. The module indicates entry to sleep mode by setting SLPAK = 1 (see Section 18.3.2.2, "MSCAN Control Register 1 (CANCTL1)"). SLPRQ cannot be set while the WUPIF flag is set (see Section 18.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)"). Sleep mode will be active until SLPRQ is cleared by the CPU or, depending on the setting of WUPE, the MSCAN detects activity on the CAN bus and clears SLPRQ itself. 0 Running -- The MSCAN functions normally 1 Sleep mode request -- The MSCAN enters sleep mode when CAN bus idle 0 INITRQ5,6 Initialization Mode Request -- When this bit is set by the CPU, the MSCAN skips to initialization mode (see Section 18.4.4.5, "MSCAN Initialization Mode"). Any ongoing transmission or reception is aborted and synchronization to the CAN bus is lost. The module indicates entry to initialization mode by setting INITAK = 1 (Section 18.3.2.2, "MSCAN Control Register 1 (CANCTL1)"). The following registers enter their hard reset state and restore their default values: CANCTL07, CANRFLG8, CANRIER9, CANTFLG, CANTIER, CANTARQ, CANTAAK, and CANTBSEL. The registers CANCTL1, CANBTR0, CANBTR1, CANIDAC, CANIDAR0-7, and CANIDMR0-7 can only be written by the CPU when the MSCAN is in initialization mode (INITRQ = 1 and INITAK = 1). The values of the error counters are not affected by initialization mode. When this bit is cleared by the CPU, the MSCAN restarts and then tries to synchronize to the CAN bus. If the MSCAN is not in bus-off state, it synchronizes after 11 consecutive recessive bits on the CAN bus; if the MSCAN is in bus-off state, it continues to wait for 128 occurrences of 11 consecutive recessive bits. Writing to other bits in CANCTL0, CANRFLG, CANRIER, CANTFLG, or CANTIER must be done only after initialization mode is exited, which is INITRQ = 0 and INITAK = 0. 0 Normal operation 1 MSCAN in initialization mode See the Bosch CAN 2.0A/B specification for a detailed definition of transmitter and receiver states. In order to protect from accidentally violating the CAN protocol, TXCAN is immediately forced to a recessive state when the CPU enters wait (CSWAI = 1) or stop mode (see Section 18.4.5.2, "Operation in Wait Mode" and Section 18.4.5.3, "Operation in Stop Mode"). The CPU has to make sure that the WUPE register and the WUPIE wake-up interrupt enable register (see Section 18.3.2.6, "MSCAN Receiver Interrupt Enable Register (CANRIER)) is enabled, if the recovery mechanism from stop or wait is required. The CPU cannot clear SLPRQ before the MSCAN has entered sleep mode (SLPRQ = 1 and SLPAK = 1). The CPU cannot clear INITRQ before the MSCAN has entered initialization mode (INITRQ = 1 and INITAK = 1). In order to protect from accidentally violating the CAN protocol, TXCAN is immediately forced to a recessive state when the initialization mode is requested by the CPU. Thus, the recommended procedure is to bring the MSCAN into sleep mode (SLPRQ = 1 and SLPAK = 1) before requesting initialization mode. Not including WUPE, INITRQ, and SLPRQ. TSTAT1 and TSTAT0 are not affected by initialization mode. RSTAT1 and RSTAT0 are not affected by initialization mode. 18.3.2.2 MSCAN Control Register 1 (CANCTL1) The CANCTL1 register provides various control bits and handshake status information of the MSCAN module as described below. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 557 Chapter 18 Scalable Controller Area Network (S12MSCANV3) Access: User read/write1 Module Base + 0x0001 R W Reset: 7 6 5 4 3 2 CANE CLKSRC LOOPB LISTEN BORM WUPM 0 0 0 1 0 0 1 0 SLPAK INITAK 0 1 = Unimplemented Figure 18-5. MSCAN Control Register 1 (CANCTL1) 1 Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1), except CANE which is write once in normal and anytime in special system operation modes when the MSCAN is in initialization mode (INITRQ = 1 and INITAK = 1) Table 18-3. CANCTL1 Register Field Descriptions Field 7 CANE 6 CLKSRC Description MSCAN Enable 0 MSCAN module is disabled 1 MSCAN module is enabled MSCAN Clock Source -- This bit defines the clock source for the MSCAN module (only for systems with a clock generation module; Section 18.4.3.2, "Clock System," and Section Figure 18-43., "MSCAN Clocking Scheme,"). 0 MSCAN clock source is the oscillator clock 1 MSCAN clock source is the bus clock 5 LOOPB Loopback Self Test Mode -- When this bit is set, the MSCAN performs an internal loopback which can be used for self test operation. The bit stream output of the transmitter is fed back to the receiver internally. The RXCAN input is ignored and the TXCAN output goes to the recessive state (logic 1). The MSCAN behaves as it does normally when transmitting and treats its own transmitted message as a message received from a remote node. In this state, the MSCAN ignores the bit sent during the ACK slot in the CAN frame acknowledge field to ensure proper reception of its own message. Both transmit and receive interrupts are generated. 0 Loopback self test disabled 1 Loopback self test enabled 4 LISTEN Listen Only Mode -- This bit configures the MSCAN as a CAN bus monitor. When LISTEN is set, all valid CAN messages with matching ID are received, but no acknowledgement or error frames are sent out (see Section 18.4.4.4, "Listen-Only Mode"). In addition, the error counters are frozen. Listen only mode supports applications which require "hot plugging" or throughput analysis. The MSCAN is unable to transmit any messages when listen only mode is active. 0 Normal operation 1 Listen only mode activated 3 BORM Bus-Off Recovery Mode -- This bit configures the bus-off state recovery mode of the MSCAN. Refer to Section 18.5.2, "Bus-Off Recovery," for details. 0 Automatic bus-off recovery (see Bosch CAN 2.0A/B protocol specification) 1 Bus-off recovery upon user request 2 WUPM Wake-Up Mode -- If WUPE in CANCTL0 is enabled, this bit defines whether the integrated low-pass filter is applied to protect the MSCAN from spurious wake-up (see Section 18.4.5.5, "MSCAN Sleep Mode"). 0 MSCAN wakes up on any dominant level on the CAN bus 1 MSCAN wakes up only in case of a dominant pulse on the CAN bus that has a length of Twup MC9S12ZVC Family Reference Manual , Rev. 1.9 558 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-3. CANCTL1 Register Field Descriptions (continued) Field Description 1 SLPAK Sleep Mode Acknowledge -- This flag indicates whether the MSCAN module has entered sleep mode (see Section 18.4.5.5, "MSCAN Sleep Mode"). It is used as a handshake flag for the SLPRQ sleep mode request. Sleep mode is active when SLPRQ = 1 and SLPAK = 1. Depending on the setting of WUPE, the MSCAN will clear the flag if it detects activity on the CAN bus while in sleep mode. 0 Running -- The MSCAN operates normally 1 Sleep mode active -- The MSCAN has entered sleep mode 0 INITAK Initialization Mode Acknowledge -- This flag indicates whether the MSCAN module is in initialization mode (see Section 18.4.4.5, "MSCAN Initialization Mode"). It is used as a handshake flag for the INITRQ initialization mode request. Initialization mode is active when INITRQ = 1 and INITAK = 1. The registers CANCTL1, CANBTR0, CANBTR1, CANIDAC, CANIDAR0-CANIDAR7, and CANIDMR0-CANIDMR7 can be written only by the CPU when the MSCAN is in initialization mode. 0 Running -- The MSCAN operates normally 1 Initialization mode active -- The MSCAN has entered initialization mode 18.3.2.3 MSCAN Bus Timing Register 0 (CANBTR0) The CANBTR0 register configures various CAN bus timing parameters of the MSCAN module. Access: User read/write1 Module Base + 0x0002 R W 7 6 5 4 3 2 1 0 SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0 0 0 0 0 0 0 0 0 Reset: Figure 18-6. MSCAN Bus Timing Register 0 (CANBTR0) 1 Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 18-4. CANBTR0 Register Field Descriptions Field Description 7-6 SJW[1:0] Synchronization Jump Width -- The synchronization jump width defines the maximum number of time quanta (Tq) clock cycles a bit can be shortened or lengthened to achieve resynchronization to data transitions on the CAN bus (see Table 18-5). 5-0 BRP[5:0] Baud Rate Prescaler -- These bits determine the time quanta (Tq) clock which is used to build up the bit timing (see Table 18-6). Table 18-5. Synchronization Jump Width SJW1 SJW0 Synchronization Jump Width 0 0 1 Tq clock cycle 0 1 2 Tq clock cycles 1 0 3 Tq clock cycles 1 1 4 Tq clock cycles MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 559 Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-6. Baud Rate Prescaler 18.3.2.4 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0 Prescaler value (P) 0 0 0 0 0 0 1 0 0 0 0 0 1 2 0 0 0 0 1 0 3 0 0 0 0 1 1 4 : : : : : : : 1 1 1 1 1 1 64 MSCAN Bus Timing Register 1 (CANBTR1) The CANBTR1 register configures various CAN bus timing parameters of the MSCAN module. Access: User read/write1 Module Base + 0x0003 R W Reset: 7 6 5 4 3 2 1 0 SAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10 0 0 0 0 0 0 0 0 Figure 18-7. MSCAN Bus Timing Register 1 (CANBTR1) 1 Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 18-7. CANBTR1 Register Field Descriptions 1 Field Description 7 SAMP Sampling -- This bit determines the number of CAN bus samples taken per bit time. 0 One sample per bit. 1 Three samples per bit1. If SAMP = 0, the resulting bit value is equal to the value of the single bit positioned at the sample point. If SAMP = 1, the resulting bit value is determined by using majority rule on the three total samples. For higher bit rates, it is recommended that only one sample is taken per bit time (SAMP = 0). 6-4 TSEG2[2:0] Time Segment 2 -- Time segments within the bit time fix the number of clock cycles per bit time and the location of the sample point (see Figure 18-44). Time segment 2 (TSEG2) values are programmable as shown in Table 18-8. 3-0 TSEG1[3:0] Time Segment 1 -- Time segments within the bit time fix the number of clock cycles per bit time and the location of the sample point (see Figure 18-44). Time segment 1 (TSEG1) values are programmable as shown in Table 18-9. In this case, PHASE_SEG1 must be at least 2 time quanta (Tq). MC9S12ZVC Family Reference Manual , Rev. 1.9 560 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-8. Time Segment 2 Values 1 TSEG22 TSEG21 TSEG20 Time Segment 2 0 0 0 1 Tq clock cycle1 0 0 1 2 Tq clock cycles : : : : 1 1 0 7 Tq clock cycles 1 1 1 8 Tq clock cycles This setting is not valid. Please refer to Table 18-36 for valid settings. Table 18-9. Time Segment 1 Values 1 TSEG13 TSEG12 TSEG11 TSEG10 Time segment 1 0 0 0 0 1 Tq clock cycle1 0 0 0 1 2 Tq clock cycles1 0 0 1 0 3 Tq clock cycles1 0 0 1 1 4 Tq clock cycles : : : : : 1 1 1 0 15 Tq clock cycles 1 1 1 1 16 Tq clock cycles This setting is not valid. Please refer to Table 18-36 for valid settings. The bit time is determined by the oscillator frequency, the baud rate prescaler, and the number of time quanta (Tq) clock cycles per bit (as shown in Table 18-8 and Table 18-9). Eqn. 18-1 Prescaler value Bit Time = ----------------------------------------------------- 1 + TimeSegment1 + TimeSegment2 f CANCLK 18.3.2.5 MSCAN Receiver Flag Register (CANRFLG) A flag can be cleared only by software (writing a 1 to the corresponding bit position) when the condition which caused the setting is no longer valid. Every flag has an associated interrupt enable bit in the CANRIER register. Access: User read/write1 Module Base + 0x0004 R W 7 6 WUPIF CSCIF 0 0 Reset: 5 4 3 2 RSTAT1 RSTAT0 TSTAT1 TSTAT0 0 0 0 0 1 0 OVRIF RXF 0 0 = Unimplemented Figure 18-8. MSCAN Receiver Flag Register (CANRFLG) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 561 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 1 Read: Anytime Write: Anytime when not in initialization mode, except RSTAT[1:0] and TSTAT[1:0] flags which are read-only; write of 1 clears flag; write of 0 is ignored NOTE The CANRFLG register is held in the reset state1 when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable again as soon as the initialization mode is exited (INITRQ = 0 and INITAK = 0). Table 18-10. CANRFLG Register Field Descriptions Field Description 7 WUPIF Wake-Up Interrupt Flag -- If the MSCAN detects CAN bus activity while in sleep mode (see Section 18.4.5.5, "MSCAN Sleep Mode,") and WUPE = 1 in CANTCTL0 (see Section 18.3.2.1, "MSCAN Control Register 0 (CANCTL0)"), the module will set WUPIF. If not masked, a wake-up interrupt is pending while this flag is set. 0 No wake-up activity observed while in sleep mode 1 MSCAN detected activity on the CAN bus and requested wake-up 6 CSCIF CAN Status Change Interrupt Flag -- This flag is set when the MSCAN changes its current CAN bus status due to the actual value of the transmit error counter (TEC) and the receive error counter (REC). An additional 4-bit (RSTAT[1:0], TSTAT[1:0]) status register, which is split into separate sections for TEC/REC, informs the system on the actual CAN bus status (see Section 18.3.2.6, "MSCAN Receiver Interrupt Enable Register (CANRIER)"). If not masked, an error interrupt is pending while this flag is set. CSCIF provides a blocking interrupt. That guarantees that the receiver/transmitter status bits (RSTAT/TSTAT) are only updated when no CAN status change interrupt is pending. If the TECs/RECs change their current value after the CSCIF is asserted, which would cause an additional state change in the RSTAT/TSTAT bits, these bits keep their status until the current CSCIF interrupt is cleared again. 0 No change in CAN bus status occurred since last interrupt 1 MSCAN changed current CAN bus status 5-4 RSTAT[1:0] Receiver Status Bits -- The values of the error counters control the actual CAN bus status of the MSCAN. As soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate receiver related CAN bus status of the MSCAN. The coding for the bits RSTAT1, RSTAT0 is: 00 RxOK: 0 receive error counter 96 01 RxWRN: 96 receive error counter 128 10 RxERR: 128 receive error counter 11 Bus-off1: 256transmit error counter 3-2 TSTAT[1:0] Transmitter Status Bits -- The values of the error counters control the actual CAN bus status of the MSCAN. As soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate transmitter related CAN bus status of the MSCAN. The coding for the bits TSTAT1, TSTAT0 is: 00 TxOK: 0 transmit error counter 96 01 TxWRN: 96 transmit error counter 128 10 TxERR: 128 transmit error counter 256 11 Bus-Off: 256 transmit error counter 1. The RSTAT[1:0], TSTAT[1:0] bits are not affected by initialization mode. MC9S12ZVC Family Reference Manual , Rev. 1.9 562 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-10. CANRFLG Register Field Descriptions (continued) Field Description 1 OVRIF Overrun Interrupt Flag -- This flag is set when a data overrun condition occurs. If not masked, an error interrupt is pending while this flag is set. 0 No data overrun condition 1 A data overrun detected Receive Buffer Full Flag -- RXF is set by the MSCAN when a new message is shifted in the receiver FIFO. This flag indicates whether the shifted buffer is loaded with a correctly received message (matching identifier, matching cyclic redundancy code (CRC) and no other errors detected). After the CPU has read that message from the RxFG buffer in the receiver FIFO, the RXF flag must be cleared to release the buffer. A set RXF flag prohibits the shifting of the next FIFO entry into the foreground buffer (RxFG). If not masked, a receive interrupt is pending while this flag is set. 0 No new message available within the RxFG 1 The receiver FIFO is not empty. A new message is available in the RxFG 0 RXF2 1 Redundant Information for the most critical CAN bus status which is "bus-off". This only occurs if the Tx error counter exceeds a number of 255 errors. Bus-off affects the receiver state. As soon as the transmitter leaves its bus-off state the receiver state skips to RxOK too. Refer also to TSTAT[1:0] coding in this register. 2 To ensure data integrity, do not read the receive buffer registers while the RXF flag is cleared. For MCUs with dual CPUs, reading the receive buffer registers while the RXF flag is cleared may result in a CPU fault condition. 18.3.2.6 MSCAN Receiver Interrupt Enable Register (CANRIER) This register contains the interrupt enable bits for the interrupt flags described in the CANRFLG register. Access: User read/write1 Module Base + 0x0005 R W 7 6 5 4 3 2 1 0 WUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE 0 0 0 0 0 0 0 0 Reset: Figure 18-9. MSCAN Receiver Interrupt Enable Register (CANRIER) 1 Read: Anytime Write: Anytime when not in initialization mode NOTE The CANRIER register is held in the reset state when the initialization mode is active (INITRQ=1 and INITAK=1). This register is writable when not in initialization mode (INITRQ=0 and INITAK=0). The RSTATE[1:0], TSTATE[1:0] bits are not affected by initialization mode. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 563 Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-11. CANRIER Register Field Descriptions Field 7 WUPIE1 6 CSCIE Description Wake-Up Interrupt Enable 0 No interrupt request is generated from this event. 1 A wake-up event causes a Wake-Up interrupt request. CAN Status Change Interrupt Enable 0 No interrupt request is generated from this event. 1 A CAN Status Change event causes an error interrupt request. 5-4 Receiver Status Change Enable -- These RSTAT enable bits control the sensitivity level in which receiver state changes RSTATE[1:0] are causing CSCIF interrupts. Independent of the chosen sensitivity level the RSTAT flags continue to indicate the actual receiver state and are only updated if no CSCIF interrupt is pending. 00 Do not generate any CSCIF interrupt caused by receiver state changes. 01 Generate CSCIF interrupt only if the receiver enters or leaves "bus-off" state. Discard other receiver state changes for generating CSCIF interrupt. 10 Generate CSCIF interrupt only if the receiver enters or leaves "RxErr" or "bus-off"2 state. Discard other receiver state changes for generating CSCIF interrupt. 11 Generate CSCIF interrupt on all state changes. 3-2 Transmitter Status Change Enable -- These TSTAT enable bits control the sensitivity level in which transmitter state TSTATE[1:0] changes are causing CSCIF interrupts. Independent of the chosen sensitivity level, the TSTAT flags continue to indicate the actual transmitter state and are only updated if no CSCIF interrupt is pending. 00 Do not generate any CSCIF interrupt caused by transmitter state changes. 01 Generate CSCIF interrupt only if the transmitter enters or leaves "bus-off" state. Discard other transmitter state changes for generating CSCIF interrupt. 10 Generate CSCIF interrupt only if the transmitter enters or leaves "TxErr" or "bus-off" state. Discard other transmitter state changes for generating CSCIF interrupt. 11 Generate CSCIF interrupt on all state changes. 1 OVRIE Overrun Interrupt Enable 0 No interrupt request is generated from this event. 1 An overrun event causes an error interrupt request. 0 RXFIE Receiver Full Interrupt Enable 0 No interrupt request is generated from this event. 1 A receive buffer full (successful message reception) event causes a receiver interrupt request. 1 WUPIE and WUPE (see Section 18.3.2.1, "MSCAN Control Register 0 (CANCTL0)") must both be enabled if the recovery mechanism from stop or wait is required. 2 Bus-off state is only defined for transmitters by the CAN standard (see Bosch CAN 2.0A/B protocol specification). Because the only possible state change for the transmitter from bus-off to TxOK also forces the receiver to skip its current state to RxOK, the coding of the RXSTAT[1:0] flags define an additional bus-off state for the receiver (see Section 18.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)"). 18.3.2.7 MSCAN Transmitter Flag Register (CANTFLG) The transmit buffer empty flags each have an associated interrupt enable bit in the CANTIER register. MC9S12ZVC Family Reference Manual , Rev. 1.9 564 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Access: User read/write1 Module Base + 0x0006 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 W Reset: 2 1 0 TXE2 TXE1 TXE0 1 1 1 = Unimplemented Figure 18-10. MSCAN Transmitter Flag Register (CANTFLG) 1 Read: Anytime Write: Anytime when not in initialization mode; write of 1 clears flag, write of 0 is ignored NOTE The CANTFLG register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable when not in initialization mode (INITRQ = 0 and INITAK = 0). Table 18-12. CANTFLG Register Field Descriptions Field Description 2-0 TXE[2:0] Transmitter Buffer Empty -- This flag indicates that the associated transmit message buffer is empty, and thus not scheduled for transmission. The CPU must clear the flag after a message is set up in the transmit buffer and is due for transmission. The MSCAN sets the flag after the message is sent successfully. The flag is also set by the MSCAN when the transmission request is successfully aborted due to a pending abort request (see Section 18.3.2.9, "MSCAN Transmitter Message Abort Request Register (CANTARQ)"). If not masked, a transmit interrupt is pending while this flag is set. Clearing a TXEx flag also clears the corresponding ABTAKx (see Section 18.3.2.10, "MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)"). When a TXEx flag is set, the corresponding ABTRQx bit is cleared (see Section 18.3.2.9, "MSCAN Transmitter Message Abort Request Register (CANTARQ)"). When listen-mode is active (see Section 18.3.2.2, "MSCAN Control Register 1 (CANCTL1)") the TXEx flags cannot be cleared and no transmission is started. Read and write accesses to the transmit buffer will be blocked, if the corresponding TXEx bit is cleared (TXEx = 0) and the buffer is scheduled for transmission. 0 The associated message buffer is full (loaded with a message due for transmission) 1 The associated message buffer is empty (not scheduled) 18.3.2.8 MSCAN Transmitter Interrupt Enable Register (CANTIER) This register contains the interrupt enable bits for the transmit buffer empty interrupt flags. Access: User read/write1 Module Base + 0x0007 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 W Reset: 2 1 0 TXEIE2 TXEIE1 TXEIE0 0 0 0 = Unimplemented Figure 18-11. MSCAN Transmitter Interrupt Enable Register (CANTIER) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 565 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 1 Read: Anytime Write: Anytime when not in initialization mode NOTE The CANTIER register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable when not in initialization mode (INITRQ = 0 and INITAK = 0). Table 18-13. CANTIER Register Field Descriptions Field Description 2-0 TXEIE[2:0] 18.3.2.9 Transmitter Empty Interrupt Enable 0 No interrupt request is generated from this event. 1 A transmitter empty (transmit buffer available for transmission) event causes a transmitter empty interrupt request. MSCAN Transmitter Message Abort Request Register (CANTARQ) The CANTARQ register allows abort request of queued messages as described below. Access: User read/write1 Module Base + 0x0008 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 W Reset: 2 1 0 ABTRQ2 ABTRQ1 ABTRQ0 0 0 0 = Unimplemented Figure 18-12. MSCAN Transmitter Message Abort Request Register (CANTARQ) 1 Read: Anytime Write: Anytime when not in initialization mode NOTE The CANTARQ register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable when not in initialization mode (INITRQ = 0 and INITAK = 0). Table 18-14. CANTARQ Register Field Descriptions Field Description 2-0 Abort Request -- The CPU sets the ABTRQx bit to request that a scheduled message buffer (TXEx = 0) be aborted. The ABTRQ[2:0] MSCAN grants the request if the message has not already started transmission, or if the transmission is not successful (lost arbitration or error). When a message is aborted, the associated TXE (see Section 18.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and abort acknowledge flags (ABTAK, see Section 18.3.2.10, "MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)") are set and a transmit interrupt occurs if enabled. The CPU cannot reset ABTRQx. ABTRQx is reset whenever the associated TXE flag is set. 0 No abort request 1 Abort request pending MC9S12ZVC Family Reference Manual , Rev. 1.9 566 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.3.2.10 MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK) The CANTAAK register indicates the successful abort of a queued message, if requested by the appropriate bits in the CANTARQ register. Access: User read/write1 Module Base + 0x0009 R 7 6 5 4 3 2 1 0 0 0 0 0 0 ABTAK2 ABTAK1 ABTAK0 0 0 0 0 0 0 0 0 W Reset: = Unimplemented Figure 18-13. MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK) 1 Read: Anytime Write: Unimplemented NOTE The CANTAAK register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). Table 18-15. CANTAAK Register Field Descriptions Field Description 2-0 Abort Acknowledge -- This flag acknowledges that a message was aborted due to a pending abort request from the CPU. ABTAK[2:0] After a particular message buffer is flagged empty, this flag can be used by the application software to identify whether the message was aborted successfully or was sent anyway. The ABTAKx flag is cleared whenever the corresponding TXE flag is cleared. 0 The message was not aborted. 1 The message was aborted. 18.3.2.11 MSCAN Transmit Buffer Selection Register (CANTBSEL) The CANTBSEL register allows the selection of the actual transmit message buffer, which then will be accessible in the CANTXFG register space. Access: User read/write1 Module Base + 0x000A R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 W Reset: 2 1 0 TX2 TX1 TX0 0 0 0 = Unimplemented Figure 18-14. MSCAN Transmit Buffer Selection Register (CANTBSEL) 1 Read: Find the lowest ordered bit set to 1, all other bits will be read as 0 Write: Anytime when not in initialization mode MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 567 Chapter 18 Scalable Controller Area Network (S12MSCANV3) NOTE The CANTBSEL register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK=1). This register is writable when not in initialization mode (INITRQ = 0 and INITAK = 0). Table 18-16. CANTBSEL Register Field Descriptions Field Description 2-0 TX[2:0] Transmit Buffer Select -- The lowest numbered bit places the respective transmit buffer in the CANTXFG register space (e.g., TX1 = 1 and TX0 = 1 selects transmit buffer TX0; TX1 = 1 and TX0 = 0 selects transmit buffer TX1). Read and write accesses to the selected transmit buffer will be blocked, if the corresponding TXEx bit is cleared and the buffer is scheduled for transmission (see Section 18.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)"). 0 The associated message buffer is deselected 1 The associated message buffer is selected, if lowest numbered bit The following gives a short programming example of the usage of the CANTBSEL register: To get the next available transmit buffer, application software must read the CANTFLG register and write this value back into the CANTBSEL register. In this example Tx buffers TX1 and TX2 are available. The value read from CANTFLG is therefore 0b0000_0110. When writing this value back to CANTBSEL, the Tx buffer TX1 is selected in the CANTXFG because the lowest numbered bit set to 1 is at bit position 1. Reading back this value out of CANTBSEL results in 0b0000_0010, because only the lowest numbered bit position set to 1 is presented. This mechanism eases the application software's selection of the next available Tx buffer. * LDAA CANTFLG; value read is 0b0000_0110 * STAA CANTBSEL; value written is 0b0000_0110 * LDAA CANTBSEL; value read is 0b0000_0010 If all transmit message buffers are deselected, no accesses are allowed to the CANTXFG registers. 18.3.2.12 MSCAN Identifier Acceptance Control Register (CANIDAC) The CANIDAC register is used for identifier acceptance control as described below. Access: User read/write1 Module Base + 0x000B R 7 6 0 0 0 0 W Reset: 5 4 IDAM1 IDAM0 0 0 3 2 1 0 0 IDHIT2 IDHIT1 IDHIT0 0 0 0 0 = Unimplemented Figure 18-15. MSCAN Identifier Acceptance Control Register (CANIDAC) 1 Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1), except bits IDHITx, which are read-only MC9S12ZVC Family Reference Manual , Rev. 1.9 568 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-17. CANIDAC Register Field Descriptions Field Description 5-4 IDAM[1:0] Identifier Acceptance Mode -- The CPU sets these flags to define the identifier acceptance filter organization (see Section 18.4.3, "Identifier Acceptance Filter"). Table 18-18 summarizes the different settings. In filter closed mode, no message is accepted such that the foreground buffer is never reloaded. 2-0 IDHIT[2:0] Identifier Acceptance Hit Indicator -- The MSCAN sets these flags to indicate an identifier acceptance hit (see Section 18.4.3, "Identifier Acceptance Filter"). Table 18-19 summarizes the different settings. Table 18-18. Identifier Acceptance Mode Settings IDAM1 IDAM0 Identifier Acceptance Mode 0 0 Two 32-bit acceptance filters 0 1 Four 16-bit acceptance filters 1 0 Eight 8-bit acceptance filters 1 1 Filter closed Table 18-19. Identifier Acceptance Hit Indication IDHIT2 IDHIT1 IDHIT0 Identifier Acceptance Hit 0 0 0 Filter 0 hit 0 0 1 Filter 1 hit 0 1 0 Filter 2 hit 0 1 1 Filter 3 hit 1 0 0 Filter 4 hit 1 0 1 Filter 5 hit 1 1 0 Filter 6 hit 1 1 1 Filter 7 hit The IDHITx indicators are always related to the message in the foreground buffer (RxFG). When a message gets shifted into the foreground buffer of the receiver FIFO the indicators are updated as well. 18.3.2.13 MSCAN Reserved Register This register is reserved for factory testing of the MSCAN module and is not available in normal system operating modes. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 569 Chapter 18 Scalable Controller Area Network (S12MSCANV3) Access: User read/write1 Module Base + 0x000C R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset: = Unimplemented Figure 18-16. MSCAN Reserved Register 1 Read: Always reads zero in normal system operation modes Write: Unimplemented in normal system operation modes NOTE Writing to this register when in special system operating modes can alter the MSCAN functionality. 18.3.2.14 MSCAN Miscellaneous Register (CANMISC) This register provides additional features. Access: User read/write1 Module Base + 0x000D R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset: 0 BOHOLD 0 = Unimplemented Figure 18-17. MSCAN Miscellaneous Register (CANMISC) 1 Read: Anytime Write: Anytime; write of `1' clears flag; write of `0' ignored Table 18-20. CANMISC Register Field Descriptions Field Description 0 BOHOLD Bus-off State Hold Until User Request -- If BORM is set in MSCAN Control Register 1 (CANCTL1), this bit indicates whether the module has entered the bus-off state. Clearing this bit requests the recovery from bus-off. Refer to Section 18.5.2, "Bus-Off Recovery," for details. 0 Module is not bus-off or recovery has been requested by user in bus-off state 1 Module is bus-off and holds this state until user request 18.3.2.15 MSCAN Receive Error Counter (CANRXERR) This register reflects the status of the MSCAN receive error counter. MC9S12ZVC Family Reference Manual , Rev. 1.9 570 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Access: User read/write1 Module Base + 0x000E R 7 6 5 4 3 2 1 0 RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0 0 0 0 0 0 0 0 0 W Reset: = Unimplemented Figure 18-18. MSCAN Receive Error Counter (CANRXERR) 1 Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and INITAK = 1) Write: Unimplemented NOTE Reading this register when in any other mode other than sleep or initialization mode may return an incorrect value. For MCUs with dual CPUs, this may result in a CPU fault condition. 18.3.2.16 MSCAN Transmit Error Counter (CANTXERR) This register reflects the status of the MSCAN transmit error counter. Access: User read/write1 Module Base + 0x000F R 7 6 5 4 3 2 1 0 TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0 0 0 0 0 0 0 0 0 W Reset: = Unimplemented Figure 18-19. MSCAN Transmit Error Counter (CANTXERR) 1 Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and INITAK = 1) Write: Unimplemented NOTE Reading this register when in any other mode other than sleep or initialization mode, may return an incorrect value. For MCUs with dual CPUs, this may result in a CPU fault condition. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 571 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.3.2.17 MSCAN Identifier Acceptance Registers (CANIDAR0-7) On reception, each message is written into the background receive buffer. The CPU is only signalled to read the message if it passes the criteria in the identifier acceptance and identifier mask registers (accepted); otherwise, the message is overwritten by the next message (dropped). The acceptance registers of the MSCAN are applied on the IDR0-IDR3 registers (see Section 18.3.3.1, "Identifier Registers (IDR0-IDR3)") of incoming messages in a bit by bit manner (see Section 18.4.3, "Identifier Acceptance Filter"). For extended identifiers, all four acceptance and mask registers are applied. For standard identifiers, only the first two (CANIDAR0/1, CANIDMR0/1) are applied. Access: User read/write1 Module Base + 0x0010 to Module Base + 0x0013 R W Reset 7 6 5 4 3 2 1 0 AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0 0 0 0 0 0 0 0 0 Figure 18-20. MSCAN Identifier Acceptance Registers (First Bank) -- CANIDAR0-CANIDAR3 1 Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 18-21. CANIDAR0-CANIDAR3 Register Field Descriptions Field Description 7-0 AC[7:0] Acceptance Code Bits -- AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison is then masked with the corresponding identifier mask register. Access: User read/write1 Module Base + 0x0018 to Module Base + 0x001B R W Reset 7 6 5 4 3 2 1 0 AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0 0 0 0 0 0 0 0 0 Figure 18-21. MSCAN Identifier Acceptance Registers (Second Bank) -- CANIDAR4-CANIDAR7 1 Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) MC9S12ZVC Family Reference Manual , Rev. 1.9 572 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-22. CANIDAR4-CANIDAR7 Register Field Descriptions Field Description 7-0 AC[7:0] Acceptance Code Bits -- AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison is then masked with the corresponding identifier mask register. 18.3.2.18 MSCAN Identifier Mask Registers (CANIDMR0-CANIDMR7) The identifier mask register specifies which of the corresponding bits in the identifier acceptance register are relevant for acceptance filtering. To receive standard identifiers in 32 bit filter mode, it is required to program the last three bits (AM[2:0]) in the mask registers CANIDMR1 and CANIDMR5 to "don't care." To receive standard identifiers in 16 bit filter mode, it is required to program the last three bits (AM[2:0]) in the mask registers CANIDMR1, CANIDMR3, CANIDMR5, and CANIDMR7 to "don't care." Access: User read/write1 Module Base + 0x0014 to Module Base + 0x0017 R W Reset 7 6 5 4 3 2 1 0 AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0 0 0 0 0 0 0 0 0 Figure 18-22. MSCAN Identifier Mask Registers (First Bank) -- CANIDMR0-CANIDMR3 1 Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 18-23. CANIDMR0-CANIDMR3 Register Field Descriptions Field Description 7-0 AM[7:0] Acceptance Mask Bits -- If a particular bit in this register is cleared, this indicates that the corresponding bit in the identifier acceptance register must be the same as its identifier bit before a match is detected. The message is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier acceptance register does not affect whether or not the message is accepted. 0 Match corresponding acceptance code register and identifier bits 1 Ignore corresponding acceptance code register bit Access: User read/write1 Module Base + 0x001C to Module Base + 0x001F R W Reset 7 6 5 4 3 2 1 0 AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0 0 0 0 0 0 0 0 0 Figure 18-23. MSCAN Identifier Mask Registers (Second Bank) -- CANIDMR4-CANIDMR7 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 573 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 1 Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 18-24. CANIDMR4-CANIDMR7 Register Field Descriptions Field Description 7-0 AM[7:0] Acceptance Mask Bits -- If a particular bit in this register is cleared, this indicates that the corresponding bit in the identifier acceptance register must be the same as its identifier bit before a match is detected. The message is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier acceptance register does not affect whether or not the message is accepted. 0 Match corresponding acceptance code register and identifier bits 1 Ignore corresponding acceptance code register bit 18.3.3 Programmer's Model of Message Storage The following section details the organization of the receive and transmit message buffers and the associated control registers. To simplify the programmer interface, the receive and transmit message buffers have the same outline. Each message buffer allocates 16 bytes in the memory map containing a 13 byte data structure. An additional transmit buffer priority register (TBPR) is defined for the transmit buffers. Within the last two bytes of this memory map, the MSCAN stores a special 16-bit time stamp, which is sampled from an internal timer after successful transmission or reception of a message. This feature is only available for transmit and receiver buffers, if the TIME bit is set (see Section 18.3.2.1, "MSCAN Control Register 0 (CANCTL0)"). The time stamp register is written by the MSCAN. The CPU can only read these registers. MC9S12ZVC Family Reference Manual , Rev. 1.9 574 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-25. Message Buffer Organization Offset Address 1 Register Access 0x00X0 IDR0 -- Identifier Register 0 R/W 0x00X1 IDR1 -- Identifier Register 1 R/W 0x00X2 IDR2 -- Identifier Register 2 R/W 0x00X3 IDR3 -- Identifier Register 3 R/W 0x00X4 DSR0 -- Data Segment Register 0 R/W 0x00X5 DSR1 -- Data Segment Register 1 R/W 0x00X6 DSR2 -- Data Segment Register 2 R/W 0x00X7 DSR3 -- Data Segment Register 3 R/W 0x00X8 DSR4 -- Data Segment Register 4 R/W 0x00X9 DSR5 -- Data Segment Register 5 R/W 0x00XA DSR6 -- Data Segment Register 6 R/W 0x00XB DSR7 -- Data Segment Register 7 R/W 0x00XC DLR -- Data Length Register R/W Register1 0x00XD TBPR -- Transmit Buffer Priority 0x00XE TSRH -- Time Stamp Register (High Byte) R 0x00XF TSRL -- Time Stamp Register (Low Byte) R R/W Not applicable for receive buffers Figure 18-24 shows the common 13-byte data structure of receive and transmit buffers for extended identifiers. The mapping of standard identifiers into the IDR registers is shown in Figure 18-25. All bits of the receive and transmit buffers are `x' out of reset because of RAM-based implementation1. All reserved or unused bits of the receive and transmit buffers always read `x'. 1. Exception: The transmit buffer priority registers are 0 out of reset. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 575 Chapter 18 Scalable Controller Area Network (S12MSCANV3) Figure 18-24. Receive/Transmit Message Buffer -- Extended Identifier Mapping Register Name 0x00X0 IDR0 0x00X1 IDR1 0x00X2 IDR2 0x00X3 IDR3 0x00X4 DSR0 0x00X5 DSR1 0x00X6 DSR2 0x00X7 DSR3 0x00X8 DSR4 0x00X9 DSR5 0x00XA DSR6 0x00XB DSR7 0x00XC DLR R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 6 5 4 3 2 1 Bit0 ID28 ID27 ID26 ID25 ID24 ID23 ID22 ID21 ID20 ID19 ID18 SRR (=1) IDE (=1) ID17 ID16 ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DLC3 DLC2 DLC1 DLC0 MC9S12ZVC Family Reference Manual , Rev. 1.9 576 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Figure 18-24. Receive/Transmit Message Buffer -- Extended Identifier Mapping (continued) Register Name Bit 7 6 5 4 3 2 1 Bit0 = Unused, always read `x' Read: * For transmit buffers, anytime when TXEx flag is set (see Section 18.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 18.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)"). * For receive buffers, only when RXF flag is set (see Section 18.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)"). Write: * For transmit buffers, anytime when TXEx flag is set (see Section 18.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 18.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)"). * Unimplemented for receive buffers. Reset: Undefined because of RAM-based implementation Figure 18-25. Receive/Transmit Message Buffer -- Standard Identifier Mapping Register Name IDR0 0x00X0 IDR1 0x00X1 IDR2 0x00X2 IDR3 0x00X3 R W R W Bit 7 6 5 4 3 2 1 Bit 0 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR IDE (=0) R W R W = Unused, always read `x' 18.3.3.1 Identifier Registers (IDR0-IDR3) The identifier registers for an extended format identifier consist of a total of 32 bits: ID[28:0], SRR, IDE, and RTR. The identifier registers for a standard format identifier consist of a total of 13 bits: ID[10:0], RTR, and IDE. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 577 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.3.3.1.1 IDR0-IDR3 for Extended Identifier Mapping Module Base + 0x00X0 R W Reset: 7 6 5 4 3 2 1 0 ID28 ID27 ID26 ID25 ID24 ID23 ID22 ID21 x x x x x x x x Figure 18-26. Identifier Register 0 (IDR0) -- Extended Identifier Mapping Table 18-26. IDR0 Register Field Descriptions -- Extended Field Description 7-0 ID[28:21] Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. Module Base + 0x00X1 R W Reset: 7 6 5 4 3 2 1 0 ID20 ID19 ID18 SRR (=1) IDE (=1) ID17 ID16 ID15 x x x x x x x x Figure 18-27. Identifier Register 1 (IDR1) -- Extended Identifier Mapping Table 18-27. IDR1 Register Field Descriptions -- Extended Field Description 7-5 ID[20:18] Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. 4 SRR Substitute Remote Request -- This fixed recessive bit is used only in extended format. It must be set to 1 by the user for transmission buffers and is stored as received on the CAN bus for receive buffers. 3 IDE ID Extended -- This flag indicates whether the extended or standard identifier format is applied in this buffer. In the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send. 0 Standard format (11 bit) 1 Extended format (29 bit) 2-0 ID[17:15] Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. MC9S12ZVC Family Reference Manual , Rev. 1.9 578 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Module Base + 0x00X2 R W 7 6 5 4 3 2 1 0 ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7 x x x x x x x x Reset: Figure 18-28. Identifier Register 2 (IDR2) -- Extended Identifier Mapping Table 18-28. IDR2 Register Field Descriptions -- Extended Field Description 7-0 ID[14:7] Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. Module Base + 0x00X3 R W 7 6 5 4 3 2 1 0 ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR x x x x x x x x Reset: Figure 18-29. Identifier Register 3 (IDR3) -- Extended Identifier Mapping Table 18-29. IDR3 Register Field Descriptions -- Extended Field Description 7-1 ID[6:0] Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. 0 RTR Remote Transmission Request -- This flag reflects the status of the remote transmission request bit in the CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of the RTR bit to be sent. 0 Data frame 1 Remote frame MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 579 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.3.3.1.2 IDR0-IDR3 for Standard Identifier Mapping Module Base + 0x00X0 R W Reset: 7 6 5 4 3 2 1 0 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 x x x x x x x x Figure 18-30. Identifier Register 0 -- Standard Mapping Table 18-30. IDR0 Register Field Descriptions -- Standard Field Description 7-0 ID[10:3] Standard Format Identifier -- The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. See also ID bits in Table 18-31. Module Base + 0x00X1 R W Reset: 7 6 5 4 3 ID2 ID1 ID0 RTR IDE (=0) x x x x x 2 1 0 x x x = Unused; always read `x' Figure 18-31. Identifier Register 1 -- Standard Mapping Table 18-31. IDR1 Register Field Descriptions Field Description 7-5 ID[2:0] Standard Format Identifier -- The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. See also ID bits in Table 18-30. 4 RTR Remote Transmission Request -- This flag reflects the status of the Remote Transmission Request bit in the CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of the RTR bit to be sent. 0 Data frame 1 Remote frame 3 IDE ID Extended -- This flag indicates whether the extended or standard identifier format is applied in this buffer. In the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send. 0 Standard format (11 bit) 1 Extended format (29 bit) MC9S12ZVC Family Reference Manual , Rev. 1.9 580 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Module Base + 0x00X2 7 6 5 4 3 2 1 0 x x x x x x x x R W Reset: = Unused; always read `x' Figure 18-32. Identifier Register 2 -- Standard Mapping Module Base + 0x00X3 7 6 5 4 3 2 1 0 x x x x x x x x R W Reset: = Unused; always read `x' Figure 18-33. Identifier Register 3 -- Standard Mapping 18.3.3.2 Data Segment Registers (DSR0-7) The eight data segment registers, each with bits DB[7:0], contain the data to be transmitted or received. The number of bytes to be transmitted or received is determined by the data length code in the corresponding DLR register. Module Base + 0x00X4 to Module Base + 0x00XB R W Reset: 7 6 5 4 3 2 1 0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 x x x x x x x x Figure 18-34. Data Segment Registers (DSR0-DSR7) -- Extended Identifier Mapping Table 18-32. DSR0-DSR7 Register Field Descriptions Field 7-0 DB[7:0] Description Data bits 7-0 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 581 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.3.3.3 Data Length Register (DLR) This register keeps the data length field of the CAN frame. Module Base + 0x00XC 7 6 5 4 R W Reset: x x x 3 2 1 0 DLC3 DLC2 DLC1 DLC0 x x x x x = Unused; always read "x" Figure 18-35. Data Length Register (DLR) -- Extended Identifier Mapping Table 18-33. DLR Register Field Descriptions Field Description 3-0 DLC[3:0] Data Length Code Bits -- The data length code contains the number of bytes (data byte count) of the respective message. During the transmission of a remote frame, the data length code is transmitted as programmed while the number of transmitted data bytes is always 0. The data byte count ranges from 0 to 8 for a data frame. Table 18-34 shows the effect of setting the DLC bits. Table 18-34. Data Length Codes Data Length Code 18.3.3.4 DLC3 DLC2 DLC1 DLC0 Data Byte Count 0 0 0 0 0 0 0 0 1 1 0 0 1 0 2 0 0 1 1 3 0 1 0 0 4 0 1 0 1 5 0 1 1 0 6 0 1 1 1 7 1 0 0 0 8 Transmit Buffer Priority Register (TBPR) This register defines the local priority of the associated message buffer. The local priority is used for the internal prioritization process of the MSCAN and is defined to be highest for the smallest binary number. The MSCAN implements the following internal prioritization mechanisms: * * All transmission buffers with a cleared TXEx flag participate in the prioritization immediately before the SOF (start of frame) is sent. The transmission buffer with the lowest local priority field wins the prioritization. MC9S12ZVC Family Reference Manual , Rev. 1.9 582 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) In cases of more than one buffer having the same lowest priority, the message buffer with the lower index number wins. Access: User read/write1 Module Base + 0x00XD R W 7 6 5 4 3 2 1 0 PRIO7 PRIO6 PRIO5 PRIO4 PRIO3 PRIO2 PRIO1 PRIO0 0 0 0 0 0 0 0 0 Reset: Figure 18-36. Transmit Buffer Priority Register (TBPR) 1 Read: Anytime when TXEx flag is set (see Section 18.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 18.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)") Write: Anytime when TXEx flag is set (see Section 18.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 18.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)") 18.3.3.5 Time Stamp Register (TSRH-TSRL) If the TIME bit is enabled, the MSCAN will write a time stamp to the respective registers in the active transmit or receive buffer right after the EOF of a valid message on the CAN bus (see Section 18.3.2.1, "MSCAN Control Register 0 (CANCTL0)"). In case of a transmission, the CPU can only read the time stamp after the respective transmit buffer has been flagged empty. The timer value, which is used for stamping, is taken from a free running internal CAN bit clock. A timer overrun is not indicated by the MSCAN. The timer is reset (all bits set to 0) during initialization mode. The CPU can only read the time stamp registers. Access: User read/write1 Module Base + 0x00XE R 7 6 5 4 3 2 1 0 TSR15 TSR14 TSR13 TSR12 TSR11 TSR10 TSR9 TSR8 x x x x x x x x W Reset: Figure 18-37. Time Stamp Register -- High Byte (TSRH) 1 Read: For transmit buffers: Anytime when TXEx flag is set (see Section 18.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 18.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)"). For receive buffers: Anytime when RXF is set. Write: Unimplemented Access: User read/write1 Module Base + 0x00XF R 7 6 5 4 3 2 1 0 TSR7 TSR6 TSR5 TSR4 TSR3 TSR2 TSR1 TSR0 x x x x x x x x W Reset: Figure 18-38. Time Stamp Register -- Low Byte (TSRL) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 583 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 1 Read: or transmit buffers: Anytime when TXEx flag is set (see Section 18.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 18.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)"). For receive buffers: Anytime when RXF is set. Write: Unimplemented MC9S12ZVC Family Reference Manual , Rev. 1.9 584 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.4 18.4.1 Functional Description General This section provides a complete functional description of the MSCAN. 18.4.2 Message Storage CAN Receive / Transmit Engine Rx0 Rx1 Rx2 Rx3 Rx4 RxBG RXF CPU bus RxFG MSCAN Memory Mapped I/O Receiver TxBG Tx0 MSCAN TxFG Tx1 Transmitter TxBG Tx2 TXE0 PRIO TXE1 CPU bus PRIO TXE2 PRIO Figure 18-39. User Model for Message Buffer Organization MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 585 Chapter 18 Scalable Controller Area Network (S12MSCANV3) The MSCAN facilitates a sophisticated message storage system which addresses the requirements of a broad range of network applications. 18.4.2.1 Message Transmit Background Modern application layer software is built upon two fundamental assumptions: * Any CAN node is able to send out a stream of scheduled messages without releasing the CAN bus between the two messages. Such nodes arbitrate for the CAN bus immediately after sending the previous message and only release the CAN bus in case of lost arbitration. * The internal message queue within any CAN node is organized such that the highest priority message is sent out first, if more than one message is ready to be sent. The behavior described in the bullets above cannot be achieved with a single transmit buffer. That buffer must be reloaded immediately after the previous message is sent. This loading process lasts a finite amount of time and must be completed within the inter-frame sequence (IFS) to be able to send an uninterrupted stream of messages. Even if this is feasible for limited CAN bus speeds, it requires that the CPU reacts with short latencies to the transmit interrupt. A double buffer scheme de-couples the reloading of the transmit buffer from the actual message sending and, therefore, reduces the reactiveness requirements of the CPU. Problems can arise if the sending of a message is finished while the CPU re-loads the second buffer. No buffer would then be ready for transmission, and the CAN bus would be released. At least three transmit buffers are required to meet the first of the above requirements under all circumstances. The MSCAN has three transmit buffers. The second requirement calls for some sort of internal prioritization which the MSCAN implements with the "local priority" concept described in Section 18.4.2.2, "Transmit Structures." 18.4.2.2 Transmit Structures The MSCAN triple transmit buffer scheme optimizes real-time performance by allowing multiple messages to be set up in advance. The three buffers are arranged as shown in Figure 18-39. All three buffers have a 13-byte data structure similar to the outline of the receive buffers (see Section 18.3.3, "Programmer's Model of Message Storage"). An additional Transmit Buffer Priority Register (TBPR) contains an 8-bit local priority field (PRIO) (see Section 18.3.3.4, "Transmit Buffer Priority Register (TBPR)"). The remaining two bytes are used for time stamping of a message, if required (see Section 18.3.3.5, "Time Stamp Register (TSRH-TSRL)"). To transmit a message, the CPU must identify an available transmit buffer, which is indicated by a set transmitter buffer empty (TXEx) flag (see Section 18.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)"). If a transmit buffer is available, the CPU must set a pointer to this buffer by writing to the CANTBSEL register (see Section 18.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)"). This makes the respective buffer accessible within the CANTXFG address space (see Section 18.3.3, "Programmer's Model of Message Storage"). The algorithmic feature associated with the CANTBSEL register simplifies the transmit buffer selection. In addition, this scheme makes the handler MC9S12ZVC Family Reference Manual , Rev. 1.9 586 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) software simpler because only one address area is applicable for the transmit process, and the required address space is minimized. The CPU then stores the identifier, the control bits, and the data content into one of the transmit buffers. Finally, the buffer is flagged as ready for transmission by clearing the associated TXE flag. The MSCAN then schedules the message for transmission and signals the successful transmission of the buffer by setting the associated TXE flag. A transmit interrupt (see Section 18.4.7.2, "Transmit Interrupt") is generated1 when TXEx is set and can be used to drive the application software to re-load the buffer. If more than one buffer is scheduled for transmission when the CAN bus becomes available for arbitration, the MSCAN uses the local priority setting of the three buffers to determine the prioritization. For this purpose, every transmit buffer has an 8-bit local priority field (PRIO). The application software programs this field when the message is set up. The local priority reflects the priority of this particular message relative to the set of messages being transmitted from this node. The lowest binary value of the PRIO field is defined to be the highest priority. The internal scheduling process takes place whenever the MSCAN arbitrates for the CAN bus. This is also the case after the occurrence of a transmission error. When a high priority message is scheduled by the application software, it may become necessary to abort a lower priority message in one of the three transmit buffers. Because messages that are already in transmission cannot be aborted, the user must request the abort by setting the corresponding abort request bit (ABTRQ) (see Section 18.3.2.9, "MSCAN Transmitter Message Abort Request Register (CANTARQ)".) The MSCAN then grants the request, if possible, by: 1. Setting the corresponding abort acknowledge flag (ABTAK) in the CANTAAK register. 2. Setting the associated TXE flag to release the buffer. 3. Generating a transmit interrupt. The transmit interrupt handler software can determine from the setting of the ABTAK flag whether the message was aborted (ABTAK = 1) or sent (ABTAK = 0). 18.4.2.3 Receive Structures The received messages are stored in a five stage input FIFO. The five message buffers are alternately mapped into a single memory area (see Figure 18-39). The background receive buffer (RxBG) is exclusively associated with the MSCAN, but the foreground receive buffer (RxFG) is addressable by the CPU (see Figure 18-39). This scheme simplifies the handler software because only one address area is applicable for the receive process. All receive buffers have a size of 15 bytes to store the CAN control bits, the identifier (standard or extended), the data contents, and a time stamp, if enabled (see Section 18.3.3, "Programmer's Model of Message Storage"). The receiver full flag (RXF) (see Section 18.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)") signals the status of the foreground receive buffer. When the buffer contains a correctly received message with a matching identifier, this flag is set. On reception, each message is checked to see whether it passes the filter (see Section 18.4.3, "Identifier Acceptance Filter") and simultaneously is written into the active RxBG. After successful reception of a valid message, the MSCAN shifts the content of RxBG into the receiver FIFO, sets the RXF flag, and 1. The transmit interrupt occurs only if not masked. A polling scheme can be applied on TXEx also. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 587 Chapter 18 Scalable Controller Area Network (S12MSCANV3) generates a receive interrupt1 (see Section 18.4.7.3, "Receive Interrupt") to the CPU. The user's receive handler must read the received message from the RxFG and then reset the RXF flag to acknowledge the interrupt and to release the foreground buffer. A new message, which can follow immediately after the IFS field of the CAN frame, is received into the next available RxBG. If the MSCAN receives an invalid message in its RxBG (wrong identifier, transmission errors, etc.) the actual contents of the buffer will be over-written by the next message. The buffer will then not be shifted into the FIFO. When the MSCAN module is transmitting, the MSCAN receives its own transmitted messages into the background receive buffer, RxBG, but does not shift it into the receiver FIFO, generate a receive interrupt, or acknowledge its own messages on the CAN bus. The exception to this rule is in loopback mode (see Section 18.3.2.2, "MSCAN Control Register 1 (CANCTL1)") where the MSCAN treats its own messages exactly like all other incoming messages. The MSCAN receives its own transmitted messages in the event that it loses arbitration. If arbitration is lost, the MSCAN must be prepared to become a receiver. An overrun condition occurs when all receive message buffers in the FIFO are filled with correctly received messages with accepted identifiers and another message is correctly received from the CAN bus with an accepted identifier. The latter message is discarded and an error interrupt with overrun indication is generated if enabled (see Section 18.4.7.5, "Error Interrupt"). The MSCAN remains able to transmit messages while the receiver FIFO is being filled, but all incoming messages are discarded. As soon as a receive buffer in the FIFO is available again, new valid messages will be accepted. 18.4.3 Identifier Acceptance Filter The MSCAN identifier acceptance registers (see Section 18.3.2.12, "MSCAN Identifier Acceptance Control Register (CANIDAC)") define the acceptable patterns of the standard or extended identifier (ID[10:0] or ID[28:0]). Any of these bits can be marked `don't care' in the MSCAN identifier mask registers (see Section 18.3.2.18, "MSCAN Identifier Mask Registers (CANIDMR0-CANIDMR7)"). A filter hit is indicated to the application software by a set receive buffer full flag (RXF = 1) and three bits in the CANIDAC register (see Section 18.3.2.12, "MSCAN Identifier Acceptance Control Register (CANIDAC)"). These identifier hit flags (IDHIT[2:0]) clearly identify the filter section that caused the acceptance. They simplify the application software's task to identify the cause of the receiver interrupt. If more than one hit occurs (two or more filters match), the lower hit has priority. A very flexible programmable generic identifier acceptance filter has been introduced to reduce the CPU interrupt loading. The filter is programmable to operate in four different modes: * Two identifier acceptance filters, each to be applied to: -- The full 29 bits of the extended identifier and to the following bits of the CAN 2.0B frame: - Remote transmission request (RTR) - Identifier extension (IDE) - Substitute remote request (SRR) -- The 11 bits of the standard identifier plus the RTR and IDE bits of the CAN 2.0A/B messages. This mode implements two filters for a full length CAN 2.0B compliant extended identifier. Although this mode can be used for standard identifiers, it is recommended to use the four or 1. The receive interrupt occurs only if not masked. A polling scheme can be applied on RXF also. MC9S12ZVC Family Reference Manual , Rev. 1.9 588 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) * * * eight identifier acceptance filters. Figure 18-40 shows how the first 32-bit filter bank (CANIDAR0-CANIDAR3, CANIDMR0-CANIDMR3) produces a filter 0 hit. Similarly, the second filter bank (CANIDAR4-CANIDAR7, CANIDMR4-CANIDMR7) produces a filter 1 hit. Four identifier acceptance filters, each to be applied to: -- The 14 most significant bits of the extended identifier plus the SRR and IDE bits of CAN 2.0B messages. -- The 11 bits of the standard identifier, the RTR and IDE bits of CAN 2.0A/B messages. Figure 18-41 shows how the first 32-bit filter bank (CANIDAR0-CANIDAR3, CANIDMR0-CANIDMR3) produces filter 0 and 1 hits. Similarly, the second filter bank (CANIDAR4-CANIDAR7, CANIDMR4-CANIDMR7) produces filter 2 and 3 hits. Eight identifier acceptance filters, each to be applied to the first 8 bits of the identifier. This mode implements eight independent filters for the first 8 bits of a CAN 2.0A/B compliant standard identifier or a CAN 2.0B compliant extended identifier. Figure 18-42 shows how the first 32-bit filter bank (CANIDAR0-CANIDAR3, CANIDMR0-CANIDMR3) produces filter 0 to 3 hits. Similarly, the second filter bank (CANIDAR4-CANIDAR7, CANIDMR4-CANIDMR7) produces filter 4 to 7 hits. Closed filter. No CAN message is copied into the foreground buffer RxFG, and the RXF flag is never set. CAN 2.0B Extended IdentifierID28 IDR0 ID21 ID20 IDR1 CAN 2.0A/B Standard IdentifierID10 IDR0 ID3 ID2 IDR1 AM7 CANIDMR0 AM0 AM7 CANIDMR1 AC7 CANIDAR0 AC0 AC7 CANIDAR1 ID15 ID14 IDR2 ID7 ID6 IDR3 RTR IDR2 ID3 ID10 IDR3 ID3 AM0 AM7 CANIDMR2 AM0 AM7 CANIDMR3 AM0 AC0 AC7 CANIDAR2 AC0 AC7 CANIDAR3 AC0 IDE ID10 ID Accepted (Filter 0 Hit) Figure 18-40. 32-bit Maskable Identifier Acceptance Filter MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 589 Chapter 18 Scalable Controller Area Network (S12MSCANV3) CAN 2.0B Extended Identifier ID28 IDR0 ID21 ID20 IDR1 CAN 2.0A/B ID10 Standard Identifier IDR0 ID3 ID2 IDR1 AM7 CANIDMR0 AM0 AM7 CANIDMR1 AM0 AC7 CANIDAR0 AC0 AC7 CANIDAR1 AC0 ID15 ID14 IDE ID10 IDR2 ID7 ID6 IDR3 RTR IDR2 ID3 ID10 IDR3 ID3 ID Accepted (Filter 0 Hit) AM7 CANIDMR2 AM0 AM7 CANIDMR3 AM0 AC7 CANIDAR2 AC0 AC7 CANIDAR3 AC0 ID Accepted (Filter 1 Hit) Figure 18-41. 16-bit Maskable Identifier Acceptance Filters MC9S12ZVC Family Reference Manual , Rev. 1.9 590 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) CAN 2.0B Extended IdentifierID28 IDR0 ID21 ID20 IDR1 CAN 2.0A/B Standard IdentifierID10 IDR0 ID3 ID2 IDR1 AM7 CIDMR0 AM0 AC7 CIDAR0 AC0 ID15 ID14 IDE ID10 IDR2 ID7 ID6 IDR3 RTR IDR2 ID3 ID10 IDR3 ID3 ID Accepted (Filter 0 Hit) AM7 CIDMR1 AM0 AC7 CIDAR1 AC0 ID Accepted (Filter 1 Hit) AM7 CIDMR2 AM0 AC7 CIDAR2 AC0 ID Accepted (Filter 2 Hit) AM7 CIDMR3 AM0 AC7 CIDAR3 AC0 ID Accepted (Filter 3 Hit) Figure 18-42. 8-bit Maskable Identifier Acceptance Filters MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 591 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.4.3.1 Protocol Violation Protection The MSCAN protects the user from accidentally violating the CAN protocol through programming errors. The protection logic implements the following features: * The receive and transmit error counters cannot be written or otherwise manipulated. * All registers which control the configuration of the MSCAN cannot be modified while the MSCAN is on-line. The MSCAN has to be in Initialization Mode. The corresponding INITRQ/INITAK handshake bits in the CANCTL0/CANCTL1 registers (see Section 18.3.2.1, "MSCAN Control Register 0 (CANCTL0)") serve as a lock to protect the following registers: -- MSCAN control 1 register (CANCTL1) -- MSCAN bus timing registers 0 and 1 (CANBTR0, CANBTR1) -- MSCAN identifier acceptance control register (CANIDAC) -- MSCAN identifier acceptance registers (CANIDAR0-CANIDAR7) -- MSCAN identifier mask registers (CANIDMR0-CANIDMR7) * The TXCAN is immediately forced to a recessive state when the MSCAN goes into the power down mode or initialization mode (see Section 18.4.5.6, "MSCAN Power Down Mode," and Section 18.4.4.5, "MSCAN Initialization Mode"). * The MSCAN enable bit (CANE) is writable only once in normal system operation modes, which provides further protection against inadvertently disabling the MSCAN. 18.4.3.2 Clock System Figure 18-43 shows the structure of the MSCAN clock generation circuitry. MSCAN Bus Clock CANCLK CLKSRC Prescaler (1 .. 64) Time quanta clock (Tq) CLKSRC Oscillator Clock Figure 18-43. MSCAN Clocking Scheme The clock source bit (CLKSRC) in the CANCTL1 register (18.3.2.2/18-557) defines whether the internal CANCLK is connected to the output of a crystal oscillator (oscillator clock) or to the bus clock. The clock source has to be chosen such that the tight oscillator tolerance requirements (up to 0.4%) of the CAN protocol are met. Additionally, for high CAN bus rates (1 Mbps), a 45% to 55% duty cycle of the clock is required. If the bus clock is generated from a PLL, it is recommended to select the oscillator clock rather than the bus clock due to jitter considerations, especially at the faster CAN bus rates. MC9S12ZVC Family Reference Manual , Rev. 1.9 592 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) For microcontrollers without a clock and reset generator (CRG), CANCLK is driven from the crystal oscillator (oscillator clock). A programmable prescaler generates the time quanta (Tq) clock from CANCLK. A time quantum is the atomic unit of time handled by the MSCAN. Eqn. 18-2 f CANCLK f Tq = ---------------------------------------------------- Prescaler value A bit time is subdivided into three segments as described in the Bosch CAN 2.0A/B specification. (see Figure 18-44): * SYNC_SEG: This segment has a fixed length of one time quantum. Signal edges are expected to happen within this section. * Time Segment 1: This segment includes the PROP_SEG and the PHASE_SEG1 of the CAN standard. It can be programmed by setting the parameter TSEG1 to consist of 4 to 16 time quanta. * Time Segment 2: This segment represents the PHASE_SEG2 of the CAN standard. It can be programmed by setting the TSEG2 parameter to be 2 to 8 time quanta long. Eqn. 18-3 f Tq Bit Rate = -------------------------------------------------------------------------------------- number of Time Quanta NRZ Signal SYNC_SEG 1 Time Segment 1 (PROP_SEG + PHASE_SEG1) Time Segment 2 (PHASE_SEG2) 4 ... 16 2 ... 8 8 ... 25 Time Quanta = 1 Bit Time Transmit Point Sample Point (single or triple sampling) Figure 18-44. Segments within the Bit Time MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 593 Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-35. Time Segment Syntax Syntax Description SYNC_SEG System expects transitions to occur on the CAN bus during this period. Transmit Point A node in transmit mode transfers a new value to the CAN bus at this point. Sample Point A node in receive mode samples the CAN bus at this point. If the three samples per bit option is selected, then this point marks the position of the third sample. The synchronization jump width (see the Bosch CAN 2.0A/B specification for details) can be programmed in a range of 1 to 4 time quanta by setting the SJW parameter. The SYNC_SEG, TSEG1, TSEG2, and SJW parameters are set by programming the MSCAN bus timing registers (CANBTR0, CANBTR1) (see Section 18.3.2.3, "MSCAN Bus Timing Register 0 (CANBTR0)" and Section 18.3.2.4, "MSCAN Bus Timing Register 1 (CANBTR1)"). Table 18-36 gives an overview of the Bosch CAN 2.0A/B specification compliant segment settings and the related parameter values. NOTE It is the user's responsibility to ensure the bit time settings are in compliance with the CAN standard. Table 18-36. Bosch CAN 2.0A/B Compliant Bit Time Segment Settings 18.4.4 18.4.4.1 Synchronization Jump Width Time Segment 1 TSEG1 Time Segment 2 TSEG2 SJW 5 .. 10 4 .. 9 2 1 1 .. 2 0 .. 1 4 .. 11 3 .. 10 3 2 1 .. 3 0 .. 2 5 .. 12 4 .. 11 4 3 1 .. 4 0 .. 3 6 .. 13 5 .. 12 5 4 1 .. 4 0 .. 3 7 .. 14 6 .. 13 6 5 1 .. 4 0 .. 3 8 .. 15 7 .. 14 7 6 1 .. 4 0 .. 3 9 .. 16 8 .. 15 8 7 1 .. 4 0 .. 3 Modes of Operation Normal System Operating Modes The MSCAN module behaves as described within this specification in all normal system operating modes. Write restrictions exist for some registers. MC9S12ZVC Family Reference Manual , Rev. 1.9 594 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.4.4.2 Special System Operating Modes The MSCAN module behaves as described within this specification in all special system operating modes. Write restrictions which exist on specific registers in normal modes are lifted for test purposes in special modes. 18.4.4.3 Emulation Modes In all emulation modes, the MSCAN module behaves just like in normal system operating modes as described within this specification. 18.4.4.4 Listen-Only Mode In an optional CAN bus monitoring mode (listen-only), the CAN node is able to receive valid data frames and valid remote frames, but it sends only "recessive" bits on the CAN bus. In addition, it cannot start a transmission. If the MAC sub-layer is required to send a "dominant" bit (ACK bit, overload flag, or active error flag), the bit is rerouted internally so that the MAC sub-layer monitors this "dominant" bit, although the CAN bus may remain in recessive state externally. 18.4.4.5 MSCAN Initialization Mode The MSCAN enters initialization mode when it is enabled (CANE=1). When entering initialization mode during operation, any on-going transmission or reception is immediately aborted and synchronization to the CAN bus is lost, potentially causing CAN protocol violations. To protect the CAN bus system from fatal consequences of violations, the MSCAN immediately drives TXCAN into a recessive state. NOTE The user is responsible for ensuring that the MSCAN is not active when initialization mode is entered. The recommended procedure is to bring the MSCAN into sleep mode (SLPRQ = 1 and SLPAK = 1) before setting the INITRQ bit in the CANCTL0 register. Otherwise, the abort of an on-going message can cause an error condition and can impact other CAN bus devices. In initialization mode, the MSCAN is stopped. However, interface registers remain accessible. This mode is used to reset the CANCTL0, CANRFLG, CANRIER, CANTFLG, CANTIER, CANTARQ, CANTAAK, and CANTBSEL registers to their default values. In addition, the MSCAN enables the configuration of the CANBTR0, CANBTR1 bit timing registers; CANIDAC; and the CANIDAR, CANIDMR message filters. See Section 18.3.2.1, "MSCAN Control Register 0 (CANCTL0)," for a detailed description of the initialization mode. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 595 Chapter 18 Scalable Controller Area Network (S12MSCANV3) Bus Clock Domain CAN Clock Domain INITRQ SYNC sync. INITRQ sync. SYNC INITAK CPU Init Request INITAK Flag INITAK INIT Flag Figure 18-45. Initialization Request/Acknowledge Cycle Due to independent clock domains within the MSCAN, INITRQ must be synchronized to all domains by using a special handshake mechanism. This handshake causes additional synchronization delay (see Figure 18-45). If there is no message transfer ongoing on the CAN bus, the minimum delay will be two additional bus clocks and three additional CAN clocks. When all parts of the MSCAN are in initialization mode, the INITAK flag is set. The application software must use INITAK as a handshake indication for the request (INITRQ) to go into initialization mode. NOTE The CPU cannot clear INITRQ before initialization mode (INITRQ = 1 and INITAK = 1) is active. 18.4.5 Low-Power Options If the MSCAN is disabled (CANE = 0), the MSCAN clocks are stopped for power saving. If the MSCAN is enabled (CANE = 1), the MSCAN has two additional modes with reduced power consumption, compared to normal mode: sleep and power down mode. In sleep mode, power consumption is reduced by stopping all clocks except those to access the registers from the CPU side. In power down mode, all clocks are stopped and no power is consumed. Table 18-37 summarizes the combinations of MSCAN and CPU modes. A particular combination of modes is entered by the given settings on the CSWAI and SLPRQ/SLPAK bits. MC9S12ZVC Family Reference Manual , Rev. 1.9 596 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) Table 18-37. CPU vs. MSCAN Operating Modes MSCAN Mode Reduced Power Consumption CPU Mode Normal RUN CSWAI = X1 SLPRQ = 0 SLPAK = 0 CSWAI = X SLPRQ = 1 SLPAK = 1 WAIT CSWAI = 0 SLPRQ = 0 SLPAK = 0 CSWAI = 0 SLPRQ = 1 SLPAK = 1 STOP 1 Sleep Power Down Disabled (CANE=0) CSWAI = X SLPRQ = X SLPAK = X CSWAI = 1 SLPRQ = X SLPAK = X CSWAI = X SLPRQ = X SLPAK = X CSWAI = X SLPRQ = X SLPAK = X CSWAI = X SLPRQ = X SLPAK = X `X' means don't care. 18.4.5.1 Operation in Run Mode As shown in Table 18-37, only MSCAN sleep mode is available as low power option when the CPU is in run mode. 18.4.5.2 Operation in Wait Mode The WAI instruction puts the MCU in a low power consumption stand-by mode. If the CSWAI bit is set, additional power can be saved in power down mode because the CPU clocks are stopped. After leaving this power down mode, the MSCAN restarts and enters normal mode again. While the CPU is in wait mode, the MSCAN can be operated in normal mode and generate interrupts (registers can be accessed via background debug mode). 18.4.5.3 Operation in Stop Mode The STOP instruction puts the MCU in a low power consumption stand-by mode. In stop mode, the MSCAN is set in power down mode regardless of the value of the SLPRQ/SLPAK and CSWAI bits (Table 18-37). 18.4.5.4 MSCAN Normal Mode This is a non-power-saving mode. Enabling the MSCAN puts the module from disabled mode into normal mode. In this mode the module can either be in initialization mode or out of initialization mode. See Section 18.4.4.5, "MSCAN Initialization Mode". MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 597 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.4.5.5 MSCAN Sleep Mode The CPU can request the MSCAN to enter this low power mode by asserting the SLPRQ bit in the CANCTL0 register. The time when the MSCAN enters sleep mode depends on a fixed synchronization delay and its current activity: * If there are one or more message buffers scheduled for transmission (TXEx = 0), the MSCAN will continue to transmit until all transmit message buffers are empty (TXEx = 1, transmitted successfully or aborted) and then goes into sleep mode. * If the MSCAN is receiving, it continues to receive and goes into sleep mode as soon as the CAN bus next becomes idle. * If the MSCAN is neither transmitting nor receiving, it immediately goes into sleep mode. Bus Clock Domain CAN Clock Domain SLPRQ SYNC sync. SLPRQ sync. SYNC SLPAK CPU Sleep Request SLPAK Flag SLPAK SLPRQ Flag MSCAN in Sleep Mode Figure 18-46. Sleep Request / Acknowledge Cycle NOTE The application software must avoid setting up a transmission (by clearing one or more TXEx flag(s)) and immediately request sleep mode (by setting SLPRQ). Whether the MSCAN starts transmitting or goes into sleep mode directly depends on the exact sequence of operations. If sleep mode is active, the SLPRQ and SLPAK bits are set (Figure 18-46). The application software must use SLPAK as a handshake indication for the request (SLPRQ) to go into sleep mode. When in sleep mode (SLPRQ = 1 and SLPAK = 1), the MSCAN stops its internal clocks. However, clocks that allow register accesses from the CPU side continue to run. If the MSCAN is in bus-off state, it stops counting the 128 occurrences of 11 consecutive recessive bits due to the stopped clocks. TXCAN remains in a recessive state. If RXF = 1, the message can be read and RXF can be cleared. Shifting a new message into the foreground buffer of the receiver FIFO (RxFG) does not take place while in sleep mode. It is possible to access the transmit buffers and to clear the associated TXE flags. No message abort takes place while in sleep mode. MC9S12ZVC Family Reference Manual , Rev. 1.9 598 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) If the WUPE bit in CANCTL0 is not asserted, the MSCAN will mask any activity it detects on CAN. RXCAN is therefore held internally in a recessive state. This locks the MSCAN in sleep mode. WUPE must be set before entering sleep mode to take effect. The MSCAN is able to leave sleep mode (wake up) only when: * CAN bus activity occurs and WUPE = 1 or * the CPU clears the SLPRQ bit NOTE The CPU cannot clear the SLPRQ bit before sleep mode (SLPRQ = 1 and SLPAK = 1) is active. After wake-up, the MSCAN waits for 11 consecutive recessive bits to synchronize to the CAN bus. As a consequence, if the MSCAN is woken-up by a CAN frame, this frame is not received. The receive message buffers (RxFG and RxBG) contain messages if they were received before sleep mode was entered. All pending actions will be executed upon wake-up; copying of RxBG into RxFG, message aborts and message transmissions. If the MSCAN remains in bus-off state after sleep mode was exited, it continues counting the 128 occurrences of 11 consecutive recessive bits. 18.4.5.6 MSCAN Power Down Mode The MSCAN is in power down mode (Table 18-37) when * CPU is in stop mode or * CPU is in wait mode and the CSWAI bit is set When entering the power down mode, the MSCAN immediately stops all ongoing transmissions and receptions, potentially causing CAN protocol violations. To protect the CAN bus system from fatal consequences of violations to the above rule, the MSCAN immediately drives TXCAN into a recessive state. NOTE The user is responsible for ensuring that the MSCAN is not active when power down mode is entered. The recommended procedure is to bring the MSCAN into Sleep mode before the STOP or WAI instruction (if CSWAI is set) is executed. Otherwise, the abort of an ongoing message can cause an error condition and impact other CAN bus devices. In power down mode, all clocks are stopped and no registers can be accessed. If the MSCAN was not in sleep mode before power down mode became active, the module performs an internal recovery cycle after powering up. This causes some fixed delay before the module enters normal mode again. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 599 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.4.5.7 Disabled Mode The MSCAN is in disabled mode out of reset (CANE=0). All module clocks are stopped for power saving, however the register map can still be accessed as specified. 18.4.5.8 Programmable Wake-Up Function The MSCAN can be programmed to wake up from sleep or power down mode as soon as CAN bus activity is detected (see control bit WUPE in MSCAN Control Register 0 (CANCTL0). The sensitivity to existing CAN bus action can be modified by applying a low-pass filter function to the RXCAN input line (see control bit WUPM in Section 18.3.2.2, "MSCAN Control Register 1 (CANCTL1)"). This feature can be used to protect the MSCAN from wake-up due to short glitches on the CAN bus lines. Such glitches can result from--for example--electromagnetic interference within noisy environments. 18.4.6 Reset Initialization The reset state of each individual bit is listed in Section 18.3.2, "Register Descriptions," which details all the registers and their bit-fields. 18.4.7 Interrupts This section describes all interrupts originated by the MSCAN. It documents the enable bits and generated flags. Each interrupt is listed and described separately. 18.4.7.1 Description of Interrupt Operation The MSCAN supports four interrupt vectors (see Table 18-38), any of which can be individually masked (for details see Section 18.3.2.6, "MSCAN Receiver Interrupt Enable Register (CANRIER)" to Section 18.3.2.8, "MSCAN Transmitter Interrupt Enable Register (CANTIER)"). Refer to the device overview section to determine the dedicated interrupt vector addresses. Table 18-38. Interrupt Vectors Interrupt Source Wake-Up Interrupt (WUPIF) 18.4.7.2 CCR Mask Local Enable I bit CANRIER (WUPIE) Error Interrupts Interrupt (CSCIF, OVRIF) I bit CANRIER (CSCIE, OVRIE) Receive Interrupt (RXF) I bit CANRIER (RXFIE) Transmit Interrupts (TXE[2:0]) I bit CANTIER (TXEIE[2:0]) Transmit Interrupt At least one of the three transmit buffers is empty (not scheduled) and can be loaded to schedule a message for transmission. The TXEx flag of the empty message buffer is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 600 NXP Semiconductors Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.4.7.3 Receive Interrupt A message is successfully received and shifted into the foreground buffer (RxFG) of the receiver FIFO. This interrupt is generated immediately after receiving the EOF symbol. The RXF flag is set. If there are multiple messages in the receiver FIFO, the RXF flag is set as soon as the next message is shifted to the foreground buffer. 18.4.7.4 Wake-Up Interrupt A wake-up interrupt is generated if activity on the CAN bus occurs during MSCAN sleep or power-down mode. NOTE This interrupt can only occur if the MSCAN was in sleep mode (SLPRQ = 1 and SLPAK = 1) before entering power down mode, the wake-up option is enabled (WUPE = 1), and the wake-up interrupt is enabled (WUPIE = 1). 18.4.7.5 Error Interrupt An error interrupt is generated if an overrun of the receiver FIFO, error, warning, or bus-off condition occurs. MSCAN Receiver Flag Register (CANRFLG) indicates one of the following conditions: * Overrun -- An overrun condition of the receiver FIFO as described in Section 18.4.2.3, "Receive Structures," occurred. * CAN Status Change -- The actual value of the transmit and receive error counters control the CAN bus state of the MSCAN. As soon as the error counters skip into a critical range (Tx/Rx-warning, Tx/Rx-error, bus-off) the MSCAN flags an error condition. The status change, which caused the error condition, is indicated by the TSTAT and RSTAT flags (see Section 18.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)" and Section 18.3.2.6, "MSCAN Receiver Interrupt Enable Register (CANRIER)"). 18.4.7.6 Interrupt Acknowledge Interrupts are directly associated with one or more status flags in either the MSCAN Receiver Flag Register (CANRFLG) or the MSCAN Transmitter Flag Register (CANTFLG). Interrupts are pending as long as one of the corresponding flags is set. The flags in CANRFLG and CANTFLG must be reset within the interrupt handler to handshake the interrupt. The flags are reset by writing a 1 to the corresponding bit position. A flag cannot be cleared if the respective condition prevails. NOTE It must be guaranteed that the CPU clears only the bit causing the current interrupt. For this reason, bit manipulation instructions (BSET) must not be used to clear interrupt flags. These instructions may cause accidental clearing of interrupt flags which are set after entering the current interrupt service routine. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 601 Chapter 18 Scalable Controller Area Network (S12MSCANV3) 18.5 18.5.1 Initialization/Application Information MSCAN initialization The procedure to initially start up the MSCAN module out of reset is as follows: 1. Assert CANE 2. Write to the configuration registers in initialization mode 3. Clear INITRQ to leave initialization mode If the configuration of registers which are only writable in initialization mode shall be changed: 1. Bring the module into sleep mode by setting SLPRQ and awaiting SLPAK to assert after the CAN bus becomes idle. 2. Enter initialization mode: assert INITRQ and await INITAK 3. Write to the configuration registers in initialization mode 4. Clear INITRQ to leave initialization mode and continue 18.5.2 Bus-Off Recovery The bus-off recovery is user configurable. The bus-off state can either be left automatically or on user request. For reasons of backwards compatibility, the MSCAN defaults to automatic recovery after reset. In this case, the MSCAN will become error active again after counting 128 occurrences of 11 consecutive recessive bits on the CAN bus (see the Bosch CAN 2.0 A/B specification for details). If the MSCAN is configured for user request (BORM set in MSCAN Control Register 1 (CANCTL1)), the recovery from bus-off starts after both independent events have become true: * 128 occurrences of 11 consecutive recessive bits on the CAN bus have been monitored * BOHOLD in MSCAN Miscellaneous Register (CANMISC) has been cleared by the user These two events may occur in any order. MC9S12ZVC Family Reference Manual , Rev. 1.9 602 NXP Semiconductors Chapter 19 Digital Analog Converter (DAC_8B5V_V2) 19.1 Revision History Table 19-1. Revision History Table Rev. No. (Item No.) Data Sections Affected Substantial Change(s) 1.4 17-Nov.-10 19.2.2 Update the behavior of the DACU pin during stop mode 1.5 29-Aug.-13 19.2.2, 19.3 added note about settling time added link to DACM register inside section 19.3 2.0 30-Jan.-14 19.2.3, 19.4.2.1, 19.5.4 added mode "Internal DAC only" 2.1 13-May.-15 Figure 19-5 correct read value of reserved register, Figure 19-5 Glossary Table 19-2. Terminology Term 19.2 Meaning DAC Digital to Analog Converter VRL Low Reference Voltage VRH High Reference Voltage FVR Full Voltage Range SSC Special Single Chip Introduction The DAC_8B5V module is a digital to analog converter. The converter works with a resolution of 8 bit and generates an output voltage between VRL and VRH. The module consists of configuration registers and two analog functional units, a DAC resistor network and an operational amplifier. The configuration registers provide all required control bits for the DAC resistor network and for the operational amplifier. The DAC resistor network generates the desired analog output voltage. The unbuffered voltage from the DAC resistor network output can be routed to the external DACU pin. When enabled, the buffered voltage from the operational amplifier output is available on the external AMP pin. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 603 Chapter 19 Digital Analog Converter (DAC_8B5V_V2) The operational amplifier is also stand alone usable. Figure 19-1 shows the block diagram of the DAC_8B5V module. 19.2.1 Features The DAC_8B5V module includes these distinctive features: * 1 digital-analog converter channel with: -- 8 bit resolution -- full and reduced output voltage range -- buffered or unbuffered analog output voltage usable * operational amplifier stand alone usable 19.2.2 Modes of Operation The DAC_8B5V module behaves as follows in the system power modes: 1. CPU run mode The functionality of the DAC_8B5V module is available. 2. CPU stop mode Independent from the mode settings, the operational amplifier is disabled, switch S1 and S2 are open. If the "Unbuffered DAC" mode was used before entering stop mode, then the DACU pin will reach VRH voltage level during stop mode. The content of the configuration registers is unchanged. NOTE After enabling and after return from CPU stop mode, the DAC_8B5V module needs a settling time to get fully operational, see Settling time specification of dac_8b5V_analog_ll18. MC9S12ZVC Family Reference Manual , Rev. 1.9 604 NXP Semiconductors Chapter 19 Digital Analog Converter (DAC_8B5V_V2) 19.2.3 Block Diagram S3 VRH DACU S1 S2 - + DAC Resistor Network AMPM S2 AMP S1 AMPP Operational Amplifier DACI Internal DAC connection, for more details see Device Overview section VRL Internal Bus Configuration Registers Figure 19-1. DAC_8B5V Block Diagram 19.3 External Signal Description This section lists the name and description of all external ports. 19.3.1 DACU Output Pin This analog pin drives the unbuffered analog output voltage from the DAC resistor network output, if the according mode is selected, see register bit DACM[2:0]. 19.3.2 AMP Output Pin This analog pin is used for the buffered analog output voltage from the operational amplifier output, if the according mode is selected, see register bit DACM[2:0]. 19.3.3 AMPP Input Pin This analog input pin is used as input signal for the operational amplifier positive input pin, if the according mode is selected, see register bit DACM[2:0]. NOTE For connectivity of VRH and VRL please refer to Section 1.9.2, "DAC Connectivity MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 605 Chapter 19 Digital Analog Converter (DAC_8B5V_V2) 19.3.4 AMPM Input Pin This analog pin is used as input for the operational amplifier negative input pin, if the according mode is selected, see register bit DACM[2:0]. 19.4 Memory Map and Register Definition This sections provides the detailed information of all registers for the DAC_8B5V module. 19.4.1 Register Summary Figure 19-2 shows the summary of all implemented registers inside the DAC_8B5V module. NOTE Register Address = Module Base Address + Address Offset, where the Module Base Address is defined at the MCU level and the Address Offset is defined at the module level. Address Offset Register Name 0x0000 DACCTL R 0x0001 Reserved R 0x0002 DACVOL R 0x0003 - 0x0006 Reserved R 0x0007 Reserved R W Bit 7 6 FVR DRIVE 0 0 5 4 3 0 0 0 0 0 0 2 1 Bit 0 DACM[2:0] 0 0 0 W VOLTAGE[7:0] W 0 0 0 0 0 0 0 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved W W 0 = Unimplemented Figure 19-2. DAC_8B5V Register Summary 19.4.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. MC9S12ZVC Family Reference Manual , Rev. 1.9 606 NXP Semiconductors Chapter 19 Digital Analog Converter (DAC_8B5V_V2) 19.4.2.1 Control Register (DACCTL) ) Access: User read/write1 Module Base + 0x0000 R W 7 6 FVR DRIVE 1 0 Reset 5 4 3 0 0 0 0 0 0 2 1 0 DACM[2:0] 0 0 0 = Unimplemented Figure 19-3. Control Register (DACCTL) 1 Read: Anytime Write: Anytime Table 19-3. DACCTL Field Description Field 7 FVR 6 DRIVE Description Full Voltage Range -- This bit defines the voltage range of the DAC. 0 DAC resistor network operates with the reduced voltage range 1 DAC resistor network operates with the full voltage range Note: For more details see Section 19.5.8, "Analog output voltage calculation". Drive Select -- This bit selects the output drive capability of the operational amplifier, see electrical Spec. for more details. 0 Low output drive for high resistive loads 1 High output drive for low resistive loads 2:0 Mode Select -- These bits define the mode of the DAC. A write access with an unsupported mode will be ignored. DACM[2:0] 000 Off 001 Operational Amplifier 010 Internal DAC only 100 Unbuffered DAC 101 Unbuffered DAC with Operational Amplifier 111 Buffered DAC other Reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 607 Chapter 19 Digital Analog Converter (DAC_8B5V_V2) 19.4.2.2 Analog Output Voltage Level Register (DACVOL) Access: User read/write1 Module Base + 0x0002 7 6 5 R 4 3 2 1 0 0 0 0 VOLTAGE[7:0] W Reset 0 0 0 0 0 Figure 19-4. Analog Output Voltage Level Register (DACVOL) 1 Read: Anytime Write: Anytime Table 19-4. DACVOL Field Description Field Description 7:0 VOLTAGE -- This register defines (together with the FVR bit) the analog output voltage. For more detail see VOLTAGE[7:0] Equation 19-1 and Equation 19-2. 19.4.2.3 Reserved Register Access: User read/write1 Module Base + 0x0007 7 R 0 W Reset 0 6 5 4 3 2 1 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved 0 0 0 0 0 0 0 Figure 19-5. Reserved Registerfv_dac_8b5v_RESERVED 1 Read: Anytime Write: Only in special mode NOTE This reserved register bits are designed for factory test purposes only and are not intended for general user access. Writing to this register when in special modes can alter the modules functionality. MC9S12ZVC Family Reference Manual , Rev. 1.9 608 NXP Semiconductors Chapter 19 Digital Analog Converter (DAC_8B5V_V2) 19.5 Functional Description 19.5.1 Functional Overview The DAC resistor network and the operational amplifier can be used together or stand alone. Following modes are supported: Table 19-5. DAC Modes of Operation Description Submodules DACM[2:0] Output DAC resistor network Operational Amplifier DACU AMP Off 000 disabled disabled disconnected disconnected Operational amplifier 001 disabled enabled disabled depend on AMPP and AMPM input Internal DAC only 010 enabled disabled disconnected disconnected Unbuffered DAC 100 enabled disabled unbuffered resistor output voltage disconnected Unbuffered DAC with Operational amplifier 101 enabled enabled unbuffered resistor output voltage depend on AMPP and AMPM input Buffered DAC 111 enabled enabled disconnected buffered resistor output voltage The DAC resistor network itself can work on two different voltage ranges: Table 19-6. DAC Resistor Network Voltage ranges DAC Mode Description Full Voltage Range (FVR) DAC resistor network provides a output voltage over the complete input voltage range, default after reset Reduced Voltage Range DAC resistor network provides a output voltage over a reduced input voltage range Table 19-7 shows the control signal decoding for each mode. For more detailed mode description see the sections below. Table 19-7. DAC Control Signals DACM DAC resistor network Operational Amplifier Switch S1 Switch S2 Switch S3 Off 000 disabled disabled open open open Operational amplifier 001 disabled enabled closed open open Internal DAC only 010 enabled disabled open open open Unbuffered DAC 100 enabled disabled open open closed MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 609 Chapter 19 Digital Analog Converter (DAC_8B5V_V2) Table 19-7. DAC Control Signals DACM DAC resistor network Operational Amplifier Switch S1 Switch S2 Switch S3 Unbuffered DAC with Operational amplifier 101 enabled enabled closed open closed Buffered DAC 111 enabled enabled open closed open 19.5.2 Mode "Off" The "Off" mode is the default mode after reset and is selected by DACCTL.DACM[2:0] = 0x0. During this mode the DAC resistor network and the operational amplifier are disabled and all switches are open. This mode provides the lowest power consumption. For decoding of the control signals see Table 19-7. 19.5.3 Mode "Operational Amplifier" The "Operational Amplifier" mode is selected by DACCTL.DACM[2:0] = 0x1. During this mode the operational amplifier can be used independent from the DAC resister network. All required amplifier signals, AMP, AMPP and AMPM are available on the pins. The DAC resistor network output is disconnected from the DACU pin. The connection between the amplifier output and the negative amplifier input is open. For decoding of the control signals see Table 19-7. 19.5.4 Mode "Internal DAC only" The "Internal DAC only" mode is selected by DACCNTL.DACM[2:0] = 0x2. During this mode the unbuffered analog voltage from the DAC resistor network is available on the internal connection DACI. The DACU output pin is disconnected. The operational amplifier is disabled and the operational amplifier signals are disconnected from the AMP pins. For decoding of the control signals see Table 19-7. 19.5.5 Mode "Unbuffered DAC" The "Unbuffered DAC" mode is selected by DACCNTL.DACM[2:0] = 0x4. During this mode the unbuffered analog voltage from the DAC resistor network output is available on the DACU output pin. The operational amplifier is disabled and the operational amplifier signals are disconnected from the AMP pins. The unbuffered analog voltage from the DAC resistor network is available on the internal connection DACI. For decoding of the control signals see Table 19-7. 19.5.6 Mode "Unbuffered DAC with Operational Amplifier" The "Unbuffered DAC with Operational Amplifier" mode is selected by DACCTL.DACM[2:0] = 0x5. During this mode the DAC resistor network and the operational amplifier are enabled and usable independent from each other. The unbuffered analog voltage from the DAC resistor network output is available on the DACU output pin. The operational amplifier is disconnected from the DAC resistor network. All required amplifier signals, AMP, AMPP and AMPM are available on the pins. The connection between the amplifier output and the MC9S12ZVC Family Reference Manual , Rev. 1.9 610 NXP Semiconductors Chapter 19 Digital Analog Converter (DAC_8B5V_V2) negative amplifier input is open. The unbuffered analog voltage from the DAC resistor network is available on the internal connection DACI. For decoding of the control signals see Table 19-7. 19.5.7 Mode "Buffered DAC" The "Buffered DAC" mode is selected by DACCTL.DACM[2:0] = 0x7. During this is mode the DAC resistor network and the operational amplifier are enabled. The analog output voltage from the DAC resistor network output is buffered by the operational amplifier and is available on the AMP output pin. The DAC resistor network output is disconnected from the DACU pin. The unbuffered analog voltage from the DAC resistor network is available on the internal connection DACI. For the decoding of the control signals see Table 19-7. 19.5.8 Analog output voltage calculation The DAC can provide an analog output voltage in two different voltage ranges: * FVR = 0, reduced voltage range The DAC generates an analog output voltage inside the range from 0.1 x (VRH - VRL) + VRL to 0.9 x (VRH-VRL) + VRL with a resolution ((VRH-VRL) x 0.8) / 256, see equation below: analog output voltage = VOLATGE[7:0] x ((VRH-VRL) x 0.8) / 256) + 0.1 x (VRH-VRL) + VRL * Eqn. 19-1 FVR = 1, full voltage range The DAC generates an analog output voltage inside the range from VRL to VRH with a resolution (VRH-VRL) / 256, see equation below: analog output voltage = VOLTAGE[7:0] x (VRH-VRL) / 256 +VRL Eqn. 19-2 See Table 19-8 for an example for VRL = 0.0 V and VRH = 5.0 V. Table 19-8. Analog output voltage calculation FVR min. voltage max. voltage Resolution Equation 0 0.5V 4.484V 15.625mV VOLTAGE[7:0] x (4.0V) / 256) + 0.5V 1 0.0V 4.980V 19.531mV VOLTAGE[7:0] x (5.0V) / 256 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 611 Chapter 19 Digital Analog Converter (DAC_8B5V_V2) MC9S12ZVC Family Reference Manual , Rev. 1.9 612 NXP Semiconductors Chapter 20 5V Analog Comparator (ACMPV2) Table 20-1. Revision History Rev. No. (Item No.) Date (Submitted By) V02.01 22 Mar 2013 * * * * * V02.02 29 Feb 2013 * Minor corrections based on feedback from shared review V02.03 25 Jun 2013 * Corrected ACMPO behavior in shutdown mode * Corrected ACMPC1 write restriction * Made input change during initialization delay description non-ambiguous 20.1 Sections Affected Substantial Change(s) Various changes based on shared review feedback Separated ACIE and ACIF in two registers Made ACPSEL and ACNSEL write only while module disabled Changed initialization delay to 127 bus clock cycles Introduction The analog comparator (ACMP) provides a circuit for comparing two analog voltages. The comparator circuit is designed to operate across the full range between 0V and VDDA supply voltage (rail-to-rail operation). 20.2 Features The ACMP has the following features: * 0V to VDDA supply rail-to-rail inputs * Low offset * Up to 4 inputs selectable as inverting and non-inverting comparator inputs: -- 2 low-impedance inputs with selectable low pass filter for external pins -- 2 high-impedance inputs with fixed filter for SoC-internal signals * Selectable hysteresis * Selectable interrupt on rising edge, falling edge, or rising and falling edges of comparator output * Option to output comparator signal on an external pin with selectable polarity * Support for triggering timer input capture events * Operational over supply range from 3V-5% to 5V+10% * Temperature range (TJ): -40C to 175C MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 613 Chapter 20 5V Analog Comparator (ACMPV2) 20.3 Block Diagram The block diagram of the ACMP is shown in Figure 20-1. ACPSEL1-0 ACE ACOPS ACOPE ACMPO MUX ACMPP + _ MUX acmpi_1 acmpi_0 ACMP_1 ACMP_0 ACDLY to timer input capture Hold Sync ACNSEL1-0 ACMP interrupt Edge Detect Logic ACMPN ACHYS1-0 ACO ACMOD1-0 ACIF ACIE Note: For connectivity of internal signals acmpi_0, acmpi_1 and timer input capture refer to device overview section Figure 20-1. ACMP Block Diagram 20.4 External Signals The ACMP has two external analog input signals, ACMP_0 and ACMP_1 which can be configured to be used with the inverting and non-inverting input, and one digital output, ACMPO. The inputs can accept a voltage that varies across the full 0V to VDDA voltage range. The ACMP monitors these inputs independent of any other functions which may be shared on these pins (GPIO, ADC). The ACMP output signal can optionally be driven out on the external pin ACMPO. 20.4.1 Internal Signals In addition to the external inputs there are two internal inputs acmpi_0 and acmpi_1 available for use with predefined SoC-internal analog signals. Refer to device-level section for connectivity. 20.5 Modes of Operation 1. Normal Mode The ACMP is operational when enabled (ACE=1) and not in STOP mode. It maintains operation throughout WAIT mode. An initialization delay of 127 bus clock cycles must be accounted for MC9S12ZVC Family Reference Manual , Rev. 1.9 614 NXP Semiconductors Chapter 20 5V Analog Comparator (ACMPV2) when entering normal mode after leaving shutdown mode. During this time the comparator output path to all subsequent logic (ACO, ACIF, timer link) is held in its current state. Refer to IACMP_run for current consumption of ACMP during operation. 2. Shutdown Mode The ACMP is held in shutdown mode either when disabled (ACE=0) or during STOP mode. When leaving normal mode the current state of the comparator will be maintained. ACMPO drives zero in shutdown mode if not inverted (ACOPS=0). In this mode the current consumption is reduced to IACMP_off. 20.6 20.6.1 Memory Map and Register Definition Register Map Table 20-2 shows the ACMP register map. NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level. Table 20-2. ACMP Register Map Address Offset Register Name 0x0000 ACMPC0 0x0001 ACMPC1 0x0002 ACMPC2 0x0003 ACMPS 0x0004- 0x0007 Reserved R W R Bit 7 6 5 4 ACE ACOPE ACOPS ACDLY 0 0 0 0 0 ACO 0 0 0 W R 3 2 ACHYS1-0 1 ACMOD1-0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ACPSEL1-0 ACNSEL1-0 W R W R Bit 0 ACIE ACIF 0 W MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 615 Chapter 20 5V Analog Comparator (ACMPV2) 20.6.2 Register Descriptions 20.6.2.1 ACMP Control Register 0 (ACMPC0) Access: User read/write1 Module Base + 0x0000 R W 7 6 5 4 ACE ACOPE ACOPS ACDLY 0 0 0 0 Reset 3 2 1 ACHYS1-0 0 0 ACMOD1-0 0 0 0 Figure 20-2. ACMP Control Register (ACMPC0) 1 Read: Anytime Write: Anytime Table 20-3. ACMPC0 Register Field Descriptions Field Description 7 ACE ACMP Enable -- This bit enables the ACMP module. When set the related input pins are connected with the low pass input filters. Note: After setting ACE to 1 an initialization delay of 127 bus clock cycles must be accounted for. During this time the comparator output path to all subsequent logic (ACO, ACIF, timer link) is held at its current state. When setting ACE to 0 the current state of the comparator will be maintained.For ACMPO a delay of tACMP_delay_en must be accounted for. 0 ACMP disabled 1 ACMP enabled 6 ACOPE ACMP Output Pin Enable -- This bit enables the ACMP output on external ACMPO pin. 0 ACMP output pin disabled 1 ACMP output is driven out to ACMPO 5 ACOPS ACMP Output Polarity Select -- This bit selects the output polarity on ACMPO. 0 ACMPO is ACMP output 1 ACMPO is ACMP output inverted 4 ACDLY ACMP Input Filter Select for Inputs ACMP_0 and ACMP_1 -- This bit selects the analog input filter characteristics resulting in a signal propagation delay of tACMP_delay. 0 Select input filter with low speed characteristics 1 Select input filter with high speed characteristics 3-2 ACMP Hysteresis -- ACHYS1-0 These bits select the ACMP hysteresis VACMP_hyst. 00 Select smallest hysteresis 01 Select small hysteresis 10 Select large hysteresis 11 Select largest hysteresis 1-0 ACMOD 1-0 ACMP Mode -- These bits select the type of compare event to set ACIF. 00 Flag setting disabled 01 Flag setting on output rising edge 10 Flag setting on output falling edge 11 Flag setting on output rising or falling edge MC9S12ZVC Family Reference Manual , Rev. 1.9 616 NXP Semiconductors Chapter 20 5V Analog Comparator (ACMPV2) 20.6.2.2 ACMP Control Register 1 (ACMPC1) Access: User read/write1 Module Base + 0x0001 R 7 6 0 0 0 0 5 ACPSEL1-0 W Reset 4 0 0 3 2 0 0 0 0 1 0 ACNSEL1-0 0 0 Figure 20-3. ACMP Control Register (ACMPC1) 1 Read: Anytime Write: Only if ACE=0 Table 20-4. ACMPC1 Routing Register Field Descriptions Field Description 5-4 ACMP Positive Input Select -- ACPSEL1-0 These bits select the ACMP non-inverting input connected to ACMPP. 11 acmpi_1 10 acmpi_0 01 ACMP_1 00 ACMP_0 1-0 ACMP Negative Input Select -- ACNSEL1-0 These bits select the ACMP inverting input connected to ACMPN. 11 acmpi_1 10 acmpi_0 01 ACMP_1 00 ACMP_0 20.6.2.3 ACMP Control Register 2 (ACMPC2) Access: User read/write1 Module Base + 0x0002 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 0 ACIE 0 Figure 20-4. ACMP Control Register (ACMPC2) 1 Read: Anytime Write: Anytime MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 617 Chapter 20 5V Analog Comparator (ACMPV2) Table 20-5. ACMPC2 Register Field Descriptions Field 0 ACIE 20.6.2.4 Description ACMP Interrupt Enable -- This bit enables the ACMP interrupt. 0 Interrupt disabled 1 Interrupt enabled ACMP Status Register (ACMPS) Access: User read/write1 Module Base + 0x0003 R 7 6 5 4 3 2 1 ACO 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 0 ACIF 0 Figure 20-5. ACMP Status Register (ACMPS) 1 Read: Anytime Write: ACIF: Anytime, write 1 to clear ACO: Never Table 20-6. ACMPS Register Field Descriptions Field Description 7 ACO ACMP Output -- Reading ACO returns the current value of the synchronized ACMP output. Refer to ACE description to account for initialization delay. 0 ACIF ACMP Interrupt Flag -- ACIF is set when a ACMP output has a valid edge defined by ACMPC0[ACMOD]. The setting of this flag lags the ACMPO output by two bus clocks. Writing 1 clears the flag. 0 Compare event has not occurred 1 Compare event has occurred 20.7 Functional Description The ACMP compares the analog voltage between inverting and non-inverting inputs. It generates a digital output signal and a related interrupt if enabled. The comparator output is high when the voltage at the non-inverting input is greater than the voltage at the inverting input, and is low when the non-inverting input voltage is lower than the inverting input voltage. The size of the ACMP hysteresis can be adapted to the specific application to prevent unintended rapid switching. Both the non-inverting and inverting input of the ACMP can be selected from four inputs: Two inputs from external signals ACMP_0 and ACMP_1 and two internal inputs acmpi_0 and acmpi_1. Refer to device-level section for connectivity. The positive input is selected by ACMPC1[ACPSEL] and the negative input is selected by ACMPC1[ACNSEL]. These bits can only be changed while the ACMP is disabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 618 NXP Semiconductors Chapter 20 5V Analog Comparator (ACMPV2) The ACMP is enabled with ACMPC0[ACE]. When this bit is set, the inputs are connected to low-pass filters while the comparator output is disconnected from the subsequent logic for 127 bus clock cycles. During this time the output state is preserved to mask potential glitches. This initialization delay must be accounted for before the first comparison result can be expected. The same delay must be accounted for after returning from STOP mode. The initial hold state after reset is logic level 0. If input voltages are set to result in logic level 1 (VACMPP > VACMPM) before the initialization delay has passed, a flag will be set immediately after the delay if rising edge is selected as flag setting event. Similarly the ACMPS[ACIF] flag will also be set when disabling the ACMP, then re-enabling it with the inputs changing to produce an opposite result to the hold state before the end of the initialization delay. The unsynchronized comparator output can be connected to the synchronized timer input capture channel defined at SoC-level (see Figure 20-1). This feature can be used to generate time stamps and timer interrupts on ACMP events. The comparator output signal can be read at register bit location ACMPS[ACO]. The condition causing the interrupt flag to assert is selected with ACMPC0[ACMOD]. This includes any edge configuration, that is rising, or falling, or rising and falling edges of the comparator output. Also flag setting can be disabled. An interrupt will be generated if the interrupt enable bit (ACMPC2[ACIE]) and the interrupt flag (ACMPS[ACIF]) are both set. ACMPS[ACIF] is cleared by writing a 1. The comparator output signal ACMPO can be driven out on an external pin by setting ACMPC0[ACOPE] and optionally inverted by setting ACMPC0[ACOPS]. One out of four hysteresis levels can be selected by setting ACMPC0[ACHYS]. The input delay of the ACMP_0 and ACMP_1 input depends on the selected filter characteristic by ACMPC0[ACDLY]. 20.8 Interrupts Table 20-7 shows the interrupt generated by the ACMP. Table 20-7. ACMP Interrupt Sources Module Interrupt Sources ACMP interrupt Local Enable ACMPC2[ACIE] MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 619 Chapter 20 5V Analog Comparator (ACMPV2) MC9S12ZVC Family Reference Manual , Rev. 1.9 620 NXP Semiconductors Chapter 21 SENT Transmitter Module (SENTTXV1) Table 21-1. Revision History Table Rev. No. (Item No.) Date (Submitted Sections Affected By) Substantial Change(s) 01.03 24-Jun-2013 All Fixed typos in application section. 01.04 15-Oct-2013 All Revision History table is now visible. 01.05 22-JAN-2014 All Clarified module behavior in Stop mode. 21.1 Introduction The Single Edge Nibble Transmission (SENT) module (SENTTX) is a transmitter for serial data frames which are implemented using the SENT encoding scheme. This module is based on the SAE J2716 information report titled "SENT - Single Edge Nibble Transmission for Automotive Applications" and released on January 27, 2010 (http://www.sae.org), Apr2007 and Feb2008. As per this standard, the SENT protocol is intended for use in applications where high resolution sensor data needs to be communicated from a sensor to an Engine Control Unit (ECU). It is intended as a replacement for the lower resolution methods of 10-bit A/Ds and PWM and as a simpler low-cost alternative to CAN or LIN. The SENT encoding scheme is a unidirectional communications scheme from the sensor/transmitting device to the controller/receiving device which does not include a coordination signal from the controller/receiving device. The sensor signal is transmitted as a series of pulses with data encoded as falling to falling edge periods. 21.2 Glossary The following terms and abbreviations are used in the document. Table 21-2. Terminology Term CRC idle level ISR Meaning Cyclic Redundancy Check, an algorithm used to perform data integrity checks Denotes the level of the SENT transmitter output signal (SENT_TX_OUT) when transmission is disabled. This is a logical one. Interrupt Service Routine MCU Micro-Controller Unit SENT Single Edge Nibble Transfer MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 621 Chapter 21 SENT Transmitter Module (SENTTXV1) 21.3 * * * * * * * 21.4 Features Features a 14 bit pre-scaler to derive a SENT-protocol compatible time unit of 3 to 90 s from bus clock. Programmable number of transmitted data-nibbles (1 to 6). Provides hardware to support SAE J2716 2010 (SENT) Fast Channel communication1. CRC nibble generation: -- Supports SENT legacy method CRC generation in hardware. -- Supports SENT recommended method CRC generation in hardware. -- Optionally, the SENT status and communication nibble can be included in the automatic calculation of the CRC nibble. -- Automatic CRC generation hardware can be bypassed to supply the CRC nibble directly from software. Supports optional pause-pulse generation. The optional pause pulse can have a fixed length or its length can be automatically adapted to get a fixed overall message period. Supports both continuous and software-triggered transmission. Interrupt-driven operation with five flags: -- Transmit buffer empty -- Transmission complete -- Calibration pulse start -- Transmitter under-run -- Pause pulse rising-edge Block Diagram Figure 21-1 shows a block-diagram of the SENTTX module. 1. Slow Channel communication can be implemented in software. MC9S12ZVC Family Reference Manual , Rev. 1.9 622 NXP Semiconductors Chapter 21 SENT Transmitter Module (SENTTXV1) TICKRATE[PRE] SENTTX interrupt Tick Rate Generator Transmit Buffer Transmit Register Transmit Control CRCLEG CRCSCNIB CRCBYP TBE TC CS TU PPRE Edge Detector CRC SENT Encoder SENT_IN SENT_TX_OUT Figure 21-1. SENTTX Block Diagram 21.5 External Signals The SENTTX module has two external signals. 21.5.1 SENT_TX_OUT - SENT Transmitter Output The SENT_TX_OUT signal is the transmitter output signal. 21.5.2 SENT_IN - SENT Transmitter Input The SENT_IN signal is used as a feedback input to compensate for the output delay on the transmitter output. This signal is used to detect when the Pause pulse rising-edge appears on the external pin. 21.6 * * * Modes of Operation Run mode This is the basic mode of operation. Wait mode Wait mode does not affect the function of the SENTTX module. Operation is the same as in Run mode. Stop mode MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 623 Chapter 21 SENT Transmitter Module (SENTTXV1) In stop mode the SENTTX module aborts any transmission and resets interrupt flags INTFLG[PPRE,CS,TC,TBE]1. This is not synchronized to an ongoing transmission sequence and can lead to the generation of an unexpected rising edge on the SENTTX module output and to the generation of unexpected interrupts (due to the reset of interrupt flags). To avoid this, software must take care to wait for message completion, disable transmission, and disable interrupt generation before Stop mode can be entered. 21.7 21.7.1 Memory Map and Register Definition Register Map Table 21-3 shows the SENTTX register map. NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level. Table 21-3. SENTTX Register Map Address Offset Register Name R 0x0000 TICKRATE Bit 7 6 0 0 5 4 R R PPULSE W PPEN PPFIXED 0 0 R 0x0004 CONFIG W R INTEN 0x0007 INTFLG R 0 TXINIT TXEN 0 0 0 0 0 0 0 0 0 W R W Bit 0 0 PPCOUNT[10:8] PPCOUNT[7:0] W 0x0006 1 PRE[7:0] W R 2 PRE[13:8] W W 0x0002 3 0 0 OPTEDGE SINGLE CRCSCN CRCLEG CRCBYP PPREIE TUIE CSIE TCIE TBEIE PPRE TU CS TC TBE DNIBBLECOUNT[2:0] = Unimplemented or Reserved 1. Please refer to Section 21.7.2.5, "SENT Transmitter Interrupt Flag Register (INTFLG) for details. MC9S12ZVC Family Reference Manual , Rev. 1.9 624 NXP Semiconductors Chapter 21 SENT Transmitter Module (SENTTXV1) Address Offset Register Name Bit 7 6 R W 0x0008 R TXBUF W R W 0x000A R W 0x000C 0x000F Reserved R 0 5 4 3 2 1 STATCONF[3:0] CRC[3:0] DATA0[3:0] DATA1[3:0] DATA2[3:0] DATA3[3:0] DATA4[3:0] DATA5[3:0] 0 0 0 0 0 Bit 0 0 0 W = Unimplemented or Reserved 21.7.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Writes to a reserved register location do not have any effect and reads of these locations return a zero.Details of register bit and field function follow the register diagrams, in bit order. 21.7.2.1 SENT Transmitter Tick Rate Register (TICKRATE) Access: User read/write1 Module Base + 0x0000 R 15 14 0 0 0 0 13 12 11 10 9 8 Reset 6 5 4 3 2 1 0 0 0 0 0 0 0 PRE[13:0] W 1 7 0 0 0 0 0 0 0 0 Read: Anytime. Write: Anytime, if CONFIG[TXINIT] is one. Table 21-4. SENT Transmitter Tick Rate Register (TICKRATE) Field Descriptions Field Description 13-0 PRE[13:0] SENTTX Tick Rate Bits -- The tick rate for the SENTTX module is determined by these 14 bits. The SENT transmitter Tick Rate Register can contain a value from 0 to 16383. It is used to derive the SENT unit-time (UT) from the SENTTX bus clock. The SENT unit-time has an allowable range of 3 to 90 s. The formula for calculating the tick rate is: SENTTX tick rate = SENTTX bus clock rate / (PRE+1) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 625 Chapter 21 SENT Transmitter Module (SENTTXV1) 21.7.2.2 SENT Transmitter Pause-Pulse Register (PPULSE) Access: User read/write1 Module Base + 0x0002 R W Reset 15 14 13 12 11 PPEN PPFIXED 0 7 0 0 0 0 0 0 0 0 0 0 6 5 4 3 2 1 0 0 0 0 R 1 9 8 PPCOUNT[10:8] PPCOUNT[7:0] W Reset 10 0 0 0 0 0 Read: Anytime. Write: Anytime, if CONFIG[TXINIT] is one. Table 21-5. SENT Transmitter Pause-Pulse Register (PPULSE) Field Descriptions Field Description 15 PPEN SENTTX Pause Pulse Enable -- If this bit is set, a pause pulse is inserted between the CRC nibble of the current SENT message and the start of the next SENT message. 1 - Pause pulse generation is enabled 0 - Pause pulse generation is disabled 14 PPFIXED SENTTX Fixed Length Pause Pulse -- If this bit is set, the optional pause pulse has a fixed length, as defined by the PPULSE[PPCOUNT] bits. If the value in PPULSE[PPCOUNT] is smaller than 12 (meaning smaller than a minimum pause pulse), a 12 tick pause pulse is used. Otherwise, if this bit is cleared, the PPULSE[PPCOUNT] bits define the overall message period. In this case the actual length of the pause pulse is adapted to the length of the remaining SENT message. Counting starts with the falling edge of the calibration pulse period at the start of the message. If the remaining message period after the falling edge of the CRC nibble is already lower than 12 ticks then a minimum pause-pulse of 12 ticks is appended. Note: For SENT a fixed or adapted pause pulse must not be longer than 768 ticks. 1 - Pause pulse length is fixed 0 - Pause pulse length is adapted to yield a fixed message period 10-0 PPCOUNT [10:0] SENTTX Pause Pulse Count Ticks -- If PPFIXED is one, these bits determine the length of the optional pause pulse inserted at the end of a SENT message. If PPFIXED is zero, these bits define the overall message period. The value in these bits is given in SENT ticks (UT). MC9S12ZVC Family Reference Manual , Rev. 1.9 626 NXP Semiconductors Chapter 21 SENT Transmitter Module (SENTTXV1) 21.7.2.3 SENT Transmitter Configuration Register (CONFIG) Access: User read/write1 Module Base + 0x0004 R W Reset R 15 14 13 12 11 TXINIT TXEN 1 0 0 0 0 0 0 0 0 0 1 7 6 5 4 3 2 1 0 0 0 0 OPTEDGE SINGLE CRCSCN CRCLEG CRCBYP 0 0 0 0 0 0 0 0 W Reset 1 10 9 8 DNIBBLECOUNT[2:0] Read: Anytime. Write: TXINIT bit: Anytime. All other bits: Anytime, if TXINIT is one. Table 21-6. SENT Transmitter Configuration Register (CONFIG) Field Descriptions Field Description 15 TXINIT SENTTX Initialization Enable -- If this bit is set, sending SENT messages is aborted and other configuration bits can be written. Setting this bit immediately aborts any ongoing transmission, resets interrupt flags INTFLG[PPRE,CS,TC,TBE] to their respective reset state and the SENTTX pin returns to idle level. Interrupt flags can only be cleared, if this bit is zero and CONFIG[TXEN] is one. 1 - Writing configuration bits is enabled. Data transmission is disabled. 0 - Writing configuration bits is disabled. Data transmission is enabled. 14 TXEN SENTTX Pin Enable -- This bit enables the SENTTX module function on the SENTTX output pin. This bit can only be changed if the CONFIG[TXINIT] bit is one. 1 - Output pin is controlled by the SENTTX module 0 - Output pin is not controlled by the SENTTX module 10-8 DNIBBLECOUNT[2:0] SENTTX Data Nibble Count -- These bits represent the number of data nibbles to be transmitted. These bits can only be changed if the CONFIG[TXINIT] bit is one. Available range for the number of data nibbles in a SENT message is 1 to 6, encoded in the CONFIG[DNIBBLECOUNT] bits as follows: 000 - Reserved 001 - One data nibble is transmitted 010 - Two data nibbles are transmitted 011 - Three data nibbles are transmitted 100 - Four data nibbles are transmitted 101 - Five data nibbles are transmitted 110 - Six data nibbles are transmitted 111 - Reserved 4 OPTEDGE SENTTX Optimized Rising Edge Position -- If set, this bit causes the SENTTX module to place the rising edge at half the number of the pulse period ticks after the falling edge to yield a duty cycle of about 50%. If the pulse period is an odd number of ticks, the number of ticks for the low pulse is rounded down (meaning the low pulse is one tick shorter than the high pulse). Otherwise, if this bit is cleared, a rising edge is positioned 5 ticks (UT) after a falling edge. This bit can only be changed if the CONFIG[TXINIT] bit is one. 1 - Optimized positioning of rising edges enabled 0 - Rising edges are generated 5 UT ticks after falling-edges MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 627 Chapter 21 SENT Transmitter Module (SENTTXV1) Field Description 3 SINGLE SENTTX Single Shot Operation -- If set, this bit causes the SENTTX module to stop after the current transmission is complete and wait for the Transmit-Buffer Empty bit to be cleared, before a new transmission is started. Transmitter Under-run is not flagged in this case. Otherwise, if this bit is cleared, messages are sent continuously back-to-back. This bit can only be changed if the CONFIG[TXINIT] bit is one. 1 - Single shot operation is enabled 0 - Single shot operation is disabled Note: Meaningful single shot operation requires pause pulse generation to be enabled (PPULSE[PPEN]=1). Otherwise the last nibble to be sent as part of the message (CRC) will have the terminating falling edge missing (rendering the whole transmission incomplete). 2 CRCSCN SENTTX CRC includes Status- and Communication Nibble -- If set, this bit causes the SENTTX module to include the status and communication nibble in the automatic generation of the CRC nibble. Otherwise, if this bit is cleared, the status and communication nibble is not included in the automatic CRC generation. This bit can only be changed if the CONFIG[TXINIT] bit is one. 1 - CRC generation includes Status- and Communication Nibble 0 - CRC generation excludes Status- and Communication Nibble 1 CRCLEG SENTTX CRC Legacy Algorithm Enable -- If set, this bit causes the SENTTX module to generate the automatic CRC nibble using the legacy CRC algorithm. Otherwise, if this bit is cleared, the CRC nibble is calculated using the recommended CRC algorithm. This bit can only be changed if the CONFIG[TXINIT] bit is one. 1 - CRC generation uses the legacy algorithm 0 - CRC generation uses the recommended algorithm 0 CRCBYP SENTTX Automatic CRC generation bypass -- If set, this bit causes the SENTTX module to bypass the automatic generation of the CRC nibble. The CRC information is taken from the Transmit Buffer (TXBUF[CRC]). This bit can only be changed if the CONFIG[TXINIT] bit is one. 1 - CRC generation bypass is enabled 0 - CRC generation bypass is disabled. Data in TXBUF[CRC] is ignored. 21.7.2.4 SENT Transmitter Interrupt Enable Register (INTEN) Access: User read/write1 Module Base + 0x0006 R 7 6 5 0 0 0 0 0 0 W Reset 1 4 3 2 1 0 PPREIE TUIE CSIE TCIE TBEIE 0 0 0 0 0 Read: Anytime. Write: Anytime. Table 21-7. SENT Transmitter Interrupt Enable Register (INTEN) Field Descriptions Field 4 PPREIE 3 TUIE Description SENTTX Pause Pulse Rising-Edge Interrupt Enable -- This bit enables the generation of a Pause Pulse Rising-Edge interrupt whenever the Pause Pulse Rising-Edge Flag is set in the SENTTX Interrupt Flag Register (INTFLG[PPRE]). 1 - Pause Pulse Rising-Edge interrupt is enabled 0 - Pause Pulse Rising-Edge interrupt is disabled SENTTX Transmitter Under-run Interrupt Enable -- This bit enables the generation of a Transmitter Under-run Interrupt whenever the Transmitter Under-run Flag is set in the SENTTX Interrupt Flag Register (INTFLG[TU]). 1 - Transmitter Under-run Interrupt is enabled 0 - Transmitter Under-run Interrupt is disabled MC9S12ZVC Family Reference Manual , Rev. 1.9 628 NXP Semiconductors Chapter 21 SENT Transmitter Module (SENTTXV1) Field Description 2 CSIE SENTTX Calibration Pulse Start Interrupt Enable -- This bit enables the generation of a Calibration Pulse Start Interrupt whenever the Calibration Pulse Start Flag is set in the SENTTX Interrupt Flag Register (INTFLG[CS]). 1 - Calibration Pulse Start Interrupt is enabled 0 - Calibration Pulse Start Interrupt is disabled 1 TCIE SENTTX Transmission Complete Interrupt Enable -- This bit enables the generation of a Transmission Complete Interrupt whenever the Transmission Complete Flag is set in the SENTTX Interrupt Flag Register (INTFLG[TC]). 1 - Transmission Complete Interrupt is enabled 0 - Transmission Complete Interrupt is disabled 0 TBEIE SENTTX Transmit-Buffer Empty Interrupt Enable -- This bit enables the generation of a Transmit-Buffer Empty Interrupt whenever the Transmit-Buffer Empty Flag is set in the SENTTX Interrupt Flag Register (INTFLG[TBE]). 1 - Transmit-Buffer Empty Interrupt is enabled 0 - Transmit-Buffer Empty Interrupt is disabled 21.7.2.5 SENT Transmitter Interrupt Flag Register (INTFLG) Access: User read/write1 Module Base + 0x0007 R 7 6 5 0 0 0 0 0 0 W Reset 1 4 3 2 1 0 PPRE TU CS TC TBE 0 0 0 1 1 Read: Anytime. Write: Anytime, if CONFIG[TXINIT] is zero and CONFIG[TXEN] is one. Write one to clear. Table 21-8. SENT Transmitter Interrupt Flag Register (INTFLG) Field Descriptions Field 4 PPRE Description SENTTX Pause Pulse Rising-Edge Flag -- If set, this bit indicates the rising-edge of a pause pulse has occurred (with sampling done using the bus clock). Write a one to this bit to clear. 1 - Pause Pulse Rising-edge detected 0 - Pause Pulse Rising-edge not detected 3 TU SENTTX Transmitter Under-run Flag -- If set, this bit indicates a Transmitter Under-run condition has occurred. A Transmitter Under-run condition means the transmit buffer was empty (INTFLG[TBE]=1) when the data from the transmit buffer is supposed to be copied to the transmit register. This copy is taken one bus-cycle before the ending falling edge of the calibration pulse is to occur, but only if the transmit buffer is marked as not empty (INTFLG[TBE]=0). Otherwise the falling edge at the end of the calibration pulse is suppressed, the transmission is aborted and an under-run condition is flagged. As long as this bit is set, the transmitter remains disabled and the SENT_TX_OUT signal remains at idle level. Write a one to this bit to clear. Clearing this bit resets INTFLG[PPRE,CS,TC,TBE] flags to their respective reset state. 1 - Transmitter Under-run condition has occurred 0 - Transmitter Under-run condition has not occurred 2 CS SENTTX Calibration Pulse Start Flag -- If set, this bit indicates a transmission has just started with the first falling edge of the calibration pulse. Write a one to this bit to clear. 1 - Calibration pulse has started 0 - Calibration pulse has not started MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 629 Chapter 21 SENT Transmitter Module (SENTTXV1) Field Description 1 TC SENTTX Transmission Complete Flag -- If set, this bit indicates the current transmission has completed. It is set after the CRC nibble has been sent. Write a one to this bit to clear. 1 - Transmission has completed 0 - Transmission has not completed 0 TBE SENTTX Transmit-Buffer Empty Flag -- If set, this bit indicates the transmit-buffer is empty and can be written to. It is set by transferring the data from the transmit buffer to the transmit register. Write a one to this bit to clear. Clearing this bit declares the transmit buffer as full. 1 - Transmit-Buffer is empty 0 - Transmit-Buffer is full 21.7.2.6 SENT Transmit Buffer (TXBUF) Access: User read/write1 Module Base + 0x0008 31 R 29 28 27 STATCONF[3:0] W Reset 30 0 0 26 25 24 23 CRC[3:0] 22 21 20 19 DATA0[3:0] 18 17 16 DATA1[3:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Module Base + 0x000A 15 R DATA2[3:0] W Reset 1 14 0 0 0 DATA3[3:0] 0 0 0 0 DATA4[3:0] 0 0 0 0 DATA5[3:0] 0 0 0 0 0 Read: Anytime. Write: Anytime. While the Transmit-Buffer Empty bit in the INTFLG register is zero (INTFLG[TBE]=0) the data in the transmit buffer (TXBUF) should not be changed to avoid transmission of inconsistent data. Table 21-9. SENT Transmit Buffer (TXBUF) Field Descriptions Field Description 31-28 STATCONF [3:0] SENTTX Status and Configuration Nibble -- These bits represent data which is sent as the SENT protocol status- and configuration-nibble. 27-24 CRC[3:0] SENTTX CRC Nibble -- These bits represent data which is sent as the SENT protocol CRC nibble, if the CRC bypass option bit in the SENTTX CONFIG register (CONFIG[CRCBYP]) is set. Otherwise these bits are ignored. 23-20 DATA0[3:0] SENTTX Data Nibble 0 -- These bits represent data which is sent as the first SENT protocol data nibble. 19-16 DATA1[3:0] SENTTX Data Nibble 1 -- These bits represent data which is sent as the second SENT protocol data nibble, if enabled by the data nibble count bits in the SENTTX CONFIG register (CONFIG[DNIBBLECOUNT]>=2). 15-12 DATA2[3:0] SENTTX Data Nibble 2 -- These bits represent data which is sent as the third SENT protocol data nibble, if enabled by the data nibble count bits in the SENTTX CONFIG register (CONFIG[DNIBBLECOUNT]>=3). 11-8 DATA3[3:0] SENTTX Data Nibble 3 -- These bits represent data which is sent as the fourth SENT protocol data nibble, if enabled by the data nibble count bits in the SENTTX CONFIG register (CONFIG[DNIBBLECOUNT]>=4). MC9S12ZVC Family Reference Manual , Rev. 1.9 630 NXP Semiconductors Chapter 21 SENT Transmitter Module (SENTTXV1) Field Description 7-4 DATA4[3:0] SENTTX Data Nibble 4 -- These bits represent data which is sent as the fifth SENT protocol data nibble, if enabled by the data nibble count bits in the SENTTX CONFIG register (CONFIG[DNIBBLECOUNT]>=5). 3-0 DATA5[3:0] SENTTX Data Nibble 5 -- These bits represent data which is sent as the sixth SENT protocol data nibble, if enabled by the data nibble count bits in the SENTTX CONFIG register (CONFIG[DNIBBLECOUNT]=6). 21.8 Functional Description This section provides a complete functional description of the SENTTX module, describing the operation of the design in a number of subsections. 21.8.1 Message Format The SENTTX module uses the standard SENT message format. The transmitted information is encoded into the distance between two consecutive falling edges. A message consists of: 1. One calibration/synchronization pulse period with a length of 56 unit-time (UT) ticks. 2. One status and serial communication nibble pulse period with a length of 12 to 27 UT ticks. 3. One to six data nibble pulse periods with a length of 12 to 27 UT ticks each. 4. One CRC nibble pulse period with a length of 12 to 27 UT ticks. 5. An optional pause pulse. Figure 21-2 below shows an example of a SENT message (not drawn to scale). 56 ticks 12..27 ticks 12..27 ticks 12..27 ticks 12..27 ticks 12..27 ticks Calibration Pulse Status and Serial Communication Nibble Pulse 1st Data Nibble Pulse 2nd Data Nibble Pulse 3rd Data Nibble Pulse CRC Nibble Pulse Pause Pulse Figure 21-2. SENT Message Format The number of transmitted data nibbles (1 to 6) is controlled by the data nibble count bits in the Configuration Register (CONFIG[DNIBBLECOUNT]). The CRC nibble can be supplied using one of the following three methods: 1. Hardware calculates the CRC nibble from the transmitted data nibbles using the SENT recommended method (CONFIG[CRCLEG]=0, CONFIG[CRCBYP]=0). 2. Hardware calculates the CRC nibble from the transmitted data nibbles using the SENT legacy method (CONFIG[CRCLEG]=1, CONFIG[CRCBYP]=0). 3. The CRC nibble can be supplied by software, together with the status and serial communication nibble and the data nibbles in the Transmit Buffer (CONFIG[CRCBYP]=1). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 631 Chapter 21 SENT Transmitter Module (SENTTXV1) An option exists to also include the status and serial communication nibble into the automatic CRC calculation (CONFIG[CRCSCN]=1). 21.8.2 * * * * Transmitter States Init State After system reset the SENTTX module starts up in Init State, which means the transmitter is initially disabled with all configuration registers (e.g. TICKRATE, PPULSE, CONFIG) writeable. Additionally, all interrupt flags are held in their respective reset states. The Init State can be left by clearing the CONFIG[TXINIT] bit with CONFIG[TXEN] being set (clearing CONFIG[TXINIT] and setting CONFIG[TXEN] to leave Init State can be done in the same write access). Idle State After leaving Init State, the SENTTX module enters Idle State. In this state, the registers TICKRATE, PPULSE and CONFIG (except CONFIG[TXINIT]) are read-only. The module waits for software to clear INTFLG[TBE] which announces valid data in the transmit buffer (TXBUF). Clearing INTFLG[TBE] causes the module to enter Transmit State. Transmit State In Transmit State the SENTTX module transmits the data written by software into the TXBUF register. As long as there is data available in TXBUF the SENTTX module remains in Transmit State. If single-shot mode is active (CONFIG[SINGLE]=1) the module enters Idle State after transmission completes and no new data is available in TXBUF. Otherwise, when not in single-shot mode and no new data is available at the end of the calibration pulse period of a new message, the SENTTX module aborts the transmission, sets the Transmitter Under-run flag bit and enters Error State. The SENT_TX_OUT signal remains at idle level in case of a Transmitter Under-run condition. If the system enters Stop mode while the SENTTX module is in Transmit State, the module aborts the current transmission, resets interrupt flags INTFLG[PPRE,CS,TC,TBE] and enters Idle State. The SENT_TX_OUT signal switches to idle level in this case. Error State In this state transmission of messages is disabled. The module waits for the Transmitter Under-run flag bit to be cleared. When software clears the Transmitter Under-run error flag bit, the module resets interrupt flags INTFLG[PPRE,CS,TC,TBE] and enters Idle State again. Whenever software sets the CONFIG[TXINIT] bit, the SENTTX aborts any ongoing transmission, and resets interrupt flags INTFLG[PPRE,CS,TC,TBE]. The SENT_TX_OUT signal switches to idle level in this case. If the transmitter under-run error flag is set (INTFLG[TU]=1) when software sets the CONFIG[TXINIT] bit, the transmitter remains in Error State; else transmitter enters Init State. MC9S12ZVC Family Reference Manual , Rev. 1.9 632 NXP Semiconductors Chapter 21 SENT Transmitter Module (SENTTXV1) 21.8.3 Tick Rate Generation A 14-bit modulus counter in the tick rate generator is used to derive a SENT-compliant tick period (3 to 90 s) from the supplied bus clock. The value from 0 to 16383 written to the TICKRATE[PRE] bits determines the bus clock divisor. SENTTX tick rate = SENTTX bus clock / (TICKRATE[PRE] + 1) 21.8.4 Transmission Modes To transmit data, the MCU writes the data bits to the transmit buffer (TXBUF), which in turn are transferred to the transmit register. The transmit register then shifts out a message nibble-by-nibble to the SENT encoder. The SENT encoder controls the data passing through the SENT_TX_OUT signal. The transmit buffer (TXBUF) acts as a buffer between the MCU's internal data bus and the transmit register. The SENTTX module also sets a flag, the transmit buffer empty flag (INTFLG[TBE]), every time it transfers data from the transmit buffer (TXBUF) to the transmit register. This flag also acts as a transmit buffer state indicator. That means by clearing this flag software declares the content of the transmit buffer as valid to the hardware. At the end of the data-dependent part of each message (that means at the end of the transmission of the CRC nibble) the SENTTX module sets the Transmission Complete flag (INTFLG[TC]). At the start of the calibration pulse of each message the SENTTX module sets the Calibration-Pulse Start flag (INTFLG[CS]). Each of these three flags can be used by software to drive the transfer of SENT messages by the SENTTX module. The following section provides an overview of available usage models. 21.8.4.1 Double-buffered Transmission without Pause Pulse This option offers the time of an entire message for the software to prepare the data (typically about 200 unit-time ticks, depending on message length). The down-side is that the data is relatively old when it gets transmitted since it was prepared while the previous message was sent. To use the double-buffered transmission option software uses the Transmit-Buffer Empty flag (TBE) to prepare new data for the next transmission. An example for this case is provided in Figure 21-3 below. TBE set TBE set Calibration CRC Data is copied to transmitter register Calibration Data is transmitted Software writes new data to transmit buffer and clears TBE Figure 21-3. Transmit-Buffer Empty driven SENT transfer without Pause Pulse MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 633 Chapter 21 SENT Transmitter Module (SENTTXV1) 21.8.4.2 Single-buffered Transmission without Pause Pulse This option offers the most up-to-date transmit data. The disadvantage for software is that the preparation of the transmit data has to occur in much less time (less than the length of the calibration pulse, meaning less than 56 unit-time ticks) compared to the double-buffered transmission option. The software uses the Transmission Complete interrupt (TC) to prepare new data for the next transmission. An example for this case is provided in Figure 21-4 below. TBE set TC set Calibration CRC Data is copied to transmitter register TBE set TC set Calibration Data is transmitted Software writes new data to transmit buffer and clears TBE Software writes new data to transmit buffer and clears TBE Figure 21-4. Transmission Complete driven SENT transfer without Pause Pulse 21.8.4.3 Double-buffered Transmission with Pause Pulse This option is similar to the double-buffered transmission without pause-pulse (for details please refer to Section 21.8.4.1, "Double-buffered Transmission without Pause Pulse). The only difference is that due to the pause pulse the message periods become longer offering even more time for the software to prepare new data. The software uses the Transmit Buffer Empty interrupt (TBE) to prepare new data for the next transmission. An example for this case is provided in Figure 21-5 below. TBE set TBE set Calibration CRC Data is copied to transmitter register Calibration Pause Data is transmitted Software writes new data to transmit buffer and clears TBE Figure 21-5. Transmit-Buffer Empty driven SENT transfer with Pause Pulse MC9S12ZVC Family Reference Manual , Rev. 1.9 634 NXP Semiconductors Chapter 21 SENT Transmitter Module (SENTTXV1) 21.8.4.4 Single-buffered Transmission with Pause Pulse This option offers the most up-to-date transmit data. The disadvantage for software is that the preparation of the transmit data has to occur in much less time (less than the length of the calibration pulse, meaning less than 56 unit-time ticks) compared to the double-buffered transmission option. This is similar to the single-buffered transmission without pause pulse case (please refer to Section 21.8.4.2, "Single-buffered Transmission without Pause Pulse for comparison). The software uses the Calibration Pulse Start interrupt (CS) to prepare new data for the next transmission. An example for this case is provided in Figure 21-6 below. TC set Pause TBE set CS set TC set Calibration CRC Data is copied to transmitter register Pause Data is transmitted Software writes new data to transmit buffer and clears TBE Figure 21-6. Calibration Pulse Start driven SENT transfer with Pause Pulse 21.8.4.5 Early Single-buffered Transmission with Pause Pulse This option is similar to the single-buffered transmission case, but offers additional time for the software to prepare new data by adding the duration of the pause pulse to the calibration pulse of the next message. Transmitted data is slightly older than with the single-buffered transmission with pause pulse case (please refer to Section 21.8.4.4, "Single-buffered Transmission with Pause Pulse for comparison). The software uses the Transmission Complete interrupt (TC) to prepare new data for the next transmission. An example for this case is provided in Figure 21-7 below. TBE set TC set Pause TC set Calibration Data is copied to transmitter register Software writes new data to transmit buffer and clears TBE CRC Pause Data is transmitted Software writes new data to transmit buffer and clears TBE Figure 21-7. Transmission Complete driven SENT transfer with Pause Pulse MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 635 Chapter 21 SENT Transmitter Module (SENTTXV1) 21.8.4.6 Software Triggered Transmission In addition to the automatic triggering of message transmission, the SENTTX module also features a software controlled way of triggering a transmission of a message (CONFIG[SINGLE]=1). This enables the possibility to synchronize message transmission to external events (like, for example, a periodic timer interrupt, or an external trigger pulse from a pin). Also, this transmission mode eliminates the possible occurrence of a transmitter underflow condition because the actual transmission does not start before software declares the data in the transmit buffer as valid by clearing the transmit-buffer empty flag (INTFLG[TBE]=0). Since the start of transmission is controlled by software, this feature requires the optional pause pulse to be enabled: without pause pulse the terminating edge of a message is the start of the next calibration pulse which in this case is software controlled and potentially appears much later leading to an incomplete CRC nibble of the current message. 21.9 Interrupts Table 21-10 shows the interrupts generated by the SENTTX module. Table 21-10. SENTTX Interrupt Sources Module Interrupt Source SENTTX interrupt Local Enable INTEN[PPREIE] INTEN[TUIE] INTEN[CSIE] INTEN[TCIE] INTEN[TBEIE] 21.10 Application Information This section provides basic information useful for implementing software for the SENTTX module. 21.10.1 Initialization All configuration options need to be defined before enabling the transmitter. This is the recommended initialization sequence: 1. Configure the SENT tick rate in the TICKRATE register. 2. Set required Pause-Pulse options in the PPULSE register. 3. Define all protocol related configuration options in the CONFIG register (such as number of data nibbles, CRC method to be used, etc.). Enable the transmitter and lock all static configuration bits in the TICKRATE, PPULSE and CONFIG registers by clearing the CONFIG[TXINIT] bit. Writing configuration bits in CONFIG and clearing CONFIG[TXINIT] can be done in a single write access to the CONFIG register. 4. Set interrupt enable bits in the interrupt enable register (INTEN) as required by the chosen transfer mode (see Section 21.8.4, "Transmission Modes for details). 5. Write data to the transmit buffer register (TXBUF) and clear the transmit buffer empty bit (INTFLG[TBE]) to start the transmission. MC9S12ZVC Family Reference Manual , Rev. 1.9 636 NXP Semiconductors Chapter 21 SENT Transmitter Module (SENTTXV1) 21.10.2 Stop Mode Since the SENTTX module needs the bus-clock to be running for transmission, Stop mode causes any ongoing transmission to be aborted. Interrupt flags INTFLG[PPRE,CS,TC,TBE] are reset. The SENT_TX_OUT pin returns to idle level. For a SENT receiver this looks like a transmitter reset. After wake-up the transmitter waits for new data to be provided before transmission is started again. If Stop mode is really required, the following options exist to synchronize Stop mode entry to the transmission sequence: * Software Triggered Transmission (please refer to Section 21.8.4, "Transmission Modes for details) In this mode software is responsible for triggering the transmission of each individual message. Simply wait for message completion, for example by waiting for the Pause-Pulse Rising-Edge flag to be set (INTFLG[PPRE]=1), before entering Stop mode to avoid the generation of incomplete messages. * Single- and Double-Buffered Transmission with optional Pause-Pulse (please refer to Section 21.8.4, "Transmission Modes for details) In this mode, the optional Pause-Pulse can be used as an indicator for an inter-message gap to enter Stop mode to avoid incomplete messages. In this mode the Pause-Pulse Rising-Edge flag (INTFLG[PPRE]) can be used as a message completion indicator before the transmitter can be disabled to cleanly enter Stop mode. * Single- and Double-Buffered Transmission without optional Pause-Pulse (please refer to Section 21.8.4, "Transmission Modes for details) Due to the structure of the SENT protocol in this mode, no real inter-message gap exists to avoid incomplete messages when entering Stop mode. However, it is (for example) possible to let the transmitter run into a transmitter under-run error condition by not providing new data. This stops the transmission at a defined state (at the expected end of the calibration pulse of a new message). Software must take care of the transmitter under-run condition before transmission can be started again after wake-up. While the SENTTX module is not capable of generating new interrupts if the bus-clock is not running, entering Stop mode causes interrupt flags INTFLG[PPRE,CS,TC,TBE] to enter their respective reset states before the bus-clock is shut down. This means the SENTTX module interrupt asserts if interrupt enables for interrupt flags getting set by Stop mode entry (INTFLG[TC,TBE]) are left in active state before entering Stop mode. Wake-up from Stop mode must be done by means outside of the SENTTX module (please refer to the Device Overview chapter in the Device Reference Manual for more details). MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 637 Chapter 21 SENT Transmitter Module (SENTTXV1) MC9S12ZVC Family Reference Manual , Rev. 1.9 638 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.1 Introduction The FTMRZ192K2K module implements the following: * 192 KB of P-Flash (Program Flash) memory * 2 KB of EEPROM memory The Flash memory is ideal for single-supply applications allowing for field reprogramming without requiring external high voltage sources for program or erase operations. The Flash module includes a memory controller that executes commands to modify Flash memory contents. The user interface to the memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is written to with the command, global address, data, and any required command parameters. The memory controller must complete the execution of a command before the FCCOB register can be written to with a new command. CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. The Flash memory may be read as bytes and aligned words. Read access time is one bus cycle for bytes and aligned words. For misaligned words access, the CPU has to perform twice the byte read access command. For Flash memory, an erased bit reads 1 and a programmed bit reads 0. It is possible to read from P-Flash memory while some commands are executing on EEPROM memory. It is not possible to read from EEPROM memory while a command is executing on P-Flash memory. Simultaneous P-Flash and EEPROM operations are discussed in <st-blue>Section 22.4.6 Allowed Simultaneous P-Flash and EEPROM Operations. Both P-Flash and EEPROM memories are implemented with Error Correction Codes (ECC) that can resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is always read by half-phrase, only one single bit fault in an aligned 4 byte half-phrase containing the byte or word accessed will be corrected. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 639 22.1.1 Glossary Command Write Sequence -- An MCU instruction sequence to execute built-in algorithms (including program and erase) on the Flash memory. EEPROM Memory -- The EEPROM memory constitutes the nonvolatile memory store for data. EEPROM Sector -- The EEPROM sector is the smallest portion of the EEPROM memory that can be erased. The EEPROM sector consists of 4 bytes. NVM Command Mode -- An NVM mode using the CPU to setup the FCCOB register to pass parameters required for Flash command execution. Phrase -- An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two sets of aligned double words with each set including 7 ECC bits for single bit fault correction and double bit fault detection within each double word. P-Flash Memory -- The P-Flash memory constitutes the main nonvolatile memory store for applications. P-Flash Sector -- The P-Flash sector is the smallest portion of the P-Flash memory that can be erased. Each P-Flash sector contains 512 bytes. Program IFR -- Nonvolatile information register located in the P-Flash block that contains the Version ID, and the Program Once field. 22.1.2 Features 22.1.2.1 * * * * * * 192 KB of P-Flash divided into 384 sectors of 512 bytes Single bit fault correction and double bit fault detection within a 32-bit double word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and phrase program operation Ability to read the P-Flash memory while programming a word in the EEPROM memory Flexible protection scheme to prevent accidental program or erase of P-Flash memory 22.1.2.2 * * * * P-Flash Features EEPROM Features 2 KB of EEPROM memory composed of one 2 KB Flash block divided into 512 sectors of 4 bytes Single bit fault correction and double bit fault detection within a word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and word program operation MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 640 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) * * Protection scheme to prevent accidental program or erase of EEPROM memory Ability to program up to four words in a burst sequence 22.1.2.3 * * * 22.1.3 Other Flash Module Features No external high-voltage power supply required for Flash memory program and erase operations Interrupt generation on Flash command completion and Flash error detection Security mechanism to prevent unauthorized access to the Flash memory Block Diagram The block diagram of the Flash module is shown in Figure 22-1. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 641 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Flash Interface Command Interrupt Request Error Interrupt Request 16bit internal bus Registers P-Flash 32Kx39 sector 0 sector 1 Protection sector 255 Security HardBlock-0S Bus Clock CPU Clock Divider FCLK Memory Controller EEPROM 1Kx22 sector 0 sector 1 P-Flash 16Kx39 sector 0 sector 1 sector 127 sector 511 HardBlock-0N (64 KB P-Flash + 2 KB D-Flash) Figure 22-1. FTMRZ192K2K Block Diagram 22.2 External Signal Description The Flash module contains no signals that connect off-chip. MC9S12ZVC Family Reference Manual , Rev. 1.9 642 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.3 Memory Map and Registers This section describes the memory map and registers for the Flash module. Read data from unimplemented memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space in the Flash module will be ignored by the Flash module. CAUTION Writing to the Flash registers while a Flash command is executing (that is indicated when the value of flag CCIF reads as '0') is not allowed. If such action is attempted, the result of the write operation will be unpredictable. Writing to the Flash registers is allowed when the Flash is not busy executing commands (CCIF = 1) and during initialization right after reset, despite the value of flag CCIF in that case (refer to <st-blue>Section 22.6 Initialization for a complete description of the reset sequence). . Table 22-1. FTMRZ Memory Map Global Address (in Bytes) 0x0_0000 - 0x0_0FFF 1 Size (Bytes) 4,096 Description Register Space 0x10_0000 - 0x10_07FF 2,048 EEPROM memory 0x1F_4000 - 0x1F_FFFF 49,152 NVM Resource Area1 (see <f-helvetica><st-bold>Figure 22-3.) 0xFD_0000 - 0xFF_FFFF 196,608 P-Flash Memory See NVM Resource area description in <st-blue>Section 22.4.4 Internal NVM resource 22.3.1 Module Memory Map The S12Z architecture places the P-Flash memory between global addresses 0xFD_0000 and 0xFF_FFFF as shown in Table 22-2. The P-Flash memory map is shown in <f-helvetica><st-bold>Figure 22-2.. Table 22-2. P-Flash Memory Addressing Global Address Size (Bytes) 0xFD_0000 - 0xFF_FFFF 192 K Description P-Flash Block Contains Flash Configuration Field (see Table 22-3) The FPROT register, described in <st-blue>Section 22.3.2.9 P-Flash Protection Register (FPROT), can be set to protect regions in the Flash memory from accidental program or erase. Three separate memory regions, one growing upward from global address 0xFF_8000 in the Flash memory (called the lower region), one growing downward from global address 0xFF_FFFF in the Flash memory (called the higher MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 643 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) region), and the remaining addresses in the Flash memory, can be activated for protection. The Flash memory addresses covered by these protectable regions are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code since it covers the vector space. Default protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in Table 22-3. Table 22-3. Flash Configuration Field 1 Global Address Size (Bytes) 0xFF_FE00-0xFF_FE07 8 Backdoor Comparison Key Refer to Section 22.4.7.11, "Verify Backdoor Access Key Command," and Section 22.5.1, "Unsecuring the MCU using Backdoor Key Access" 0xFF_FE08-0xFF_FE091 2 Protection Override Comparison Key. Refer to Section 22.4.7.17, "Protection Override Command" 0xFF_FE0A-0xFF_FE0B1 2 Reserved 0xFF_FE0C1 1 P-Flash Protection byte. Refer to Section 22.3.2.9, "P-Flash Protection Register (FPROT)" 0xFF_FE0D1 1 EEPROM Protection byte. Refer to Section 22.3.2.10, "EEPROM Protection Register (DFPROT)" 0xFF_FE0E1 1 Flash Nonvolatile byte Refer to Section 22.3.2.11, "Flash Option Register (FOPT)" 0xFF_FE0F1 1 Flash Security byte Refer to Section 22.3.2.2, "Flash Security Register (FSEC)" Description 0xFF_FE08-0xFF_FE0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in the 0xFF_FE0A - 0xFF_FE0B reserved field should be programmed to 0xFF. MC9S12ZVC Family Reference Manual , Rev. 1.9 644 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) P-Flash START = 0xFD_0000 Flash Protected/Unprotected Region 160 KB 0xFF_8000 0xFF_8400 0xFF_8800 0xFF_9000 Protection Fixed End Flash Protected/Unprotected Lower Region 1, 2, 4, 8 KB 0xFF_A000 Flash Protected/Unprotected Region 8 KB (up to 29 KB) Protection Movable End 0xFF_C000 Protection Fixed End 0xFF_E000 Flash Protected/Unprotected Higher Region 2, 4, 8, 16 KB 0xFF_F000 0xFF_F800 P-Flash END = 0xFF_FFFF Flash Configuration Field 16 bytes (0xFF_FE00 - 0xFF_FE0F) Figure 22-2. P-Flash Memory Map MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 645 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-4. Program IFR Fields 1 Global Address Size (Bytes) 0x1F_C000 - 0x1F_C007 8 Reserved 0x1F_C008 - 0x1F_C0B5 174 Reserved 0x1F_C0B6 - 0x1F_C0B7 2 Version ID1 0x1F_C0B8 - 0x1F_C0BF 8 Reserved 0x1F_C0C0 - 0x1F_C0FF 64 Program Once Field Refer to Section 22.4.7.6, "Program Once Command" Field Description Used to track firmware patch versions, see <st-blue>Section 22.4.2 IFR Version ID Word Table 22-5. Memory Controller Resource Fields (NVM Resource Area1) 1 Global Address Size (Bytes) 0x1F_4000 - 0x1F_41FF 512 Reserved 0x1F_4200 - 0x1F_7FFF 15,872 Reserved 0x1F_8000 - 0x1F_97FF 6,144 Reserved 0x1F_9800 - 0x1F_BFFF 10,240 Reserved 0x1F_C000 - 0x1F_C0FF 256 P-Flash IFR (see Table 22-4) 0x1F_C100 - 0x1F_C1FF 256 Reserved. 0x1F_C200 - 0x1F_FFFF 15,872 Reserved. Description See <st-blue>Section 22.4.4 Internal NVM resource for NVM Resources Area description. MC9S12ZVC Family Reference Manual , Rev. 1.9 646 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 0x1F_4000 Reserved 512 bytes 0x1F_41FF Reserved 15872 bytes 0x1F_8000 Reserved 6 KB 0x1F_97FF Reserved 10 KB 0x1F_C000 P-Flash IFR 256 bytes 0x1F_C100 Reserved 256 bytes 0x1F_C200 Reserved 15,872 bytes Figure 22-3. Memory Controller Resource Memory Map (NVM Resources Area) 22.3.2 Register Descriptions The Flash module contains a set of 24 control and status registers located between Flash module base + 0x0000 and 0x0017. In the case of the writable registers, the write accesses are forbidden during Flash command execution (for more detail, see Caution note in <st-blue>Section 22.3 Memory Map and Registers). A summary of the Flash module registers is given in Figure 22-4 with detailed descriptions in the following subsections. Address & Name 0x0000 FCLKDIV 0x0001 FSEC 7 R FDIVLD W R KEYEN1 6 5 4 3 2 1 0 FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0 W Figure 22-4. FTMRZ192K2K Register Summary MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 647 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Address & Name 0x0002 FCCOBIX 0x0003 FPSTAT 0x0004 FCNFG 0x0005 FERCNFG 0x0006 FSTAT 0x0007 FERSTAT 0x0008 FPROT 0x0009 DFPROT 0x000A FOPT 0x000B FRSV1 0x000C FCCOB0HI 0x000D FCCOB0LO 0x000E FCCOB1HI 0x000F FCCOB1LO R 7 6 5 4 3 0 0 0 0 0 FPOVRD 0 0 0 0 0 ERSAREQ 0 0 0 ACCERR FPVIOL 0 W R 2 1 0 CCOBIX2 CCOBIX1 CCOBIX0 0 0 WSTATACK FDFD FSFD W R W R CCIE 0 IGNSF WSTAT[1:0] 0 0 0 MGBUSY RSVD MGSTAT1 MGSTAT0 0 0 0 DFDF SFDIF FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0 DPS5 DPS4 DPS3 DPS2 DPS1 DPS0 SFDIE W R W R 0 CCIF 0 0 W R W R W R FPOPEN DPOPEN RNV6 0 NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0 0 0 0 0 0 0 0 0 CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 W R W R W R W R W R W Figure 22-4. FTMRZ192K2K Register Summary (continued) MC9S12ZVC Family Reference Manual , Rev. 1.9 648 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Address & Name 0x0010 FCCOB2HI 0x0011 FCCOB2LO 0x0012 FCCOB3HI 0x0013 FCCOB3LO 0x0014 FCCOB4HI 0x0015 FCCOB4LO 0x0016 FCCOB5HI 0x0017 FCCOB5LO R W R W R W R W R W R W R W R W 7 6 5 4 3 2 1 0 CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 = Unimplemented or Reserved Figure 22-4. FTMRZ192K2K Register Summary (continued) 22.3.2.1 Flash Clock Divider Register (FCLKDIV) The FCLKDIV register is used to control timed events in program and erase algorithms. Offset Module Base + 0x0000 7 R FDIVLD W Reset 0 6 5 4 3 FDIVLCK 0 2 1 0 0 0 0 FDIV[5:0] 0 0 0 = Unimplemented or Reserved Figure 22-5. Flash Clock Divider Register (FCLKDIV) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 649 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the writability of the FDIV field in normal mode. In special mode, bits 6-0 are writable any number of times but bit 7 remains unwritable. CAUTION The FCLKDIV register should never be written while a Flash command is executing (CCIF=0). Table 22-6. FCLKDIV Field Descriptions Field 7 FDIVLD Description Clock Divider Loaded 0 FCLKDIV register has not been written since the last reset 1 FCLKDIV register has been written since the last reset 6 FDIVLCK Clock Divider Locked 0 FDIV field is open for writing 1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and restore writability to the FDIV field in normal mode. 5-0 FDIV[5:0] Clock Divider Bits -- FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events during Flash program and erase algorithms. Table 22-7 shows recommended values for FDIV[5:0] based on the BUSCLK frequency. Please refer to Section 22.4.5, "Flash Command Operations," for more information. Table 22-7. FDIV values for various BUSCLK Frequencies BUSCLK Frequency (MHz) MIN1 MAX2 1.0 1.6 1.6 BUSCLK Frequency (MHz) FDIV[5:0] FDIV[5:0] MIN1 MAX2 0x00 26.6 27.6 0x1A 2.6 0x01 27.6 28.6 0x1B 2.6 3.6 0x02 28.6 29.6 0x1C 3.6 4.6 0x03 29.6 30.6 0x1D 4.6 5.6 0x04 30.6 31.6 0x1E 5.6 6.6 0x05 31.6 32.6 0x1F 6.6 7.6 0x06 32.6 33.6 0x20 7.6 8.6 0x07 33.6 34.6 0x21 8.6 9.6 0x08 34.6 35.6 0x22 9.6 10.6 0x09 35.6 36.6 0x23 10.6 11.6 0x0A 36.6 37.6 0x24 11.6 12.6 0x0B 37.6 38.6 0x25 12.6 13.6 0x0C 38.6 39.6 0x26 13.6 14.6 0x0D 39.6 40.6 0x27 14.6 15.6 0x0E 40.6 41.6 0x28 15.6 16.6 0x0F 41.6 42.6 0x29 MC9S12ZVC Family Reference Manual , Rev. 1.9 650 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-7. FDIV values for various BUSCLK Frequencies BUSCLK Frequency (MHz) 1 2 22.3.2.2 MIN1 MAX2 16.6 17.6 17.6 BUSCLK Frequency (MHz) FDIV[5:0] FDIV[5:0] MIN1 MAX2 0x10 42.6 43.6 0x2A 18.6 0x11 43.6 44.6 0x2B 18.6 19.6 0x12 44.6 45.6 0x2C 19.6 20.6 0x13 45.6 46.6 0x2D 20.6 21.6 0x14 46.6 47.6 0x2E 21.6 22.6 0x15 47.6 48.6 0x2F 22.6 23.6 0x16 48.6 49.6 0x30 23.6 24.6 0x17 49.6 50.6 0x31 24.6 25.6 0x18 25.6 26.6 0x19 BUSCLK is Greater Than this value. BUSCLK is Less Than or Equal to this value. Flash Security Register (FSEC) The FSEC register holds all bits associated with the security of the MCU and Flash module. Offset Module Base + 0x0001 7 R 6 5 4 KEYEN[1:0] 3 2 1 RNV[5:2] 0 SEC[1:0] W Reset F1 F1 F1 F1 F1 F1 F1 F1 = Unimplemented or Reserved Figure 22-6. Flash Security Register (FSEC) 1 Loaded from Flash configuration field, during reset sequence. All bits in the FSEC register are readable but not writable. During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the Flash configuration field at global address 0xFF_FE0F located in P-Flash memory (see Table 22-3) as indicated by reset condition F in Figure 22-6. If a double bit fault is detected while reading the P-Flash phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set to leave the Flash module in a secured state with backdoor key access disabled. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 651 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-8. FSEC Field Descriptions Field Description 7-6 Backdoor Key Security Enable Bits -- The KEYEN[1:0] bits define the enabling of backdoor key access to the Flash KEYEN[1:0] module as shown in Table 22-9. 5-2 RNV[5:2] Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements. 1-0 SEC[1:0] Flash Security Bits -- The SEC[1:0] bits define the security state of the MCU as shown in Table 22-10. If the Flash module is unsecured using backdoor key access, the SEC bits are forced to 10. Table 22-9. Flash KEYEN States KEYEN[1:0] 1 Status of Backdoor Key Access 00 DISABLED 01 DISABLED1 10 ENABLED 11 DISABLED Preferred KEYEN state to disable backdoor key access. Table 22-10. Flash Security States 1 SEC[1:0] Status of Security 00 SECURED 01 SECURED1 10 UNSECURED 11 SECURED Preferred SEC state to set MCU to secured state. The security function in the Flash module is described in <st-blue>Section 22.5 Security. 22.3.2.3 Flash CCOB Index Register (FCCOBIX) The FCCOBIX register is used to indicate the amount of parameters loaded into the FCCOB registers for Flash memory operations. Offset Module Base + 0x0002 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 2 0 CCOBIX[2:0] W Reset 1 0 0 0 = Unimplemented or Reserved Figure 22-7. FCCOB Index Register (FCCOBIX) CCOBIX bits are readable and writable while remaining bits read 0 and are not writable. MC9S12ZVC Family Reference Manual , Rev. 1.9 652 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-11. FCCOBIX Field Descriptions Field Description 2-0 CCOBIX[1:0] Common Command Register Index-- The CCOBIX bits are used to indicate how many words of the FCCOB register array are being read or written to. See 22.3.2.13 Flash Common Command Object Registers (FCCOB)," for more details. 22.3.2.4 Flash Protection Status Register (FPSTAT) This Flash register holds the status of the Protection Override feature. Offset Module Base + 0x0003 R 7 6 5 4 3 2 1 0 FPOVRD 0 0 0 0 0 0 WSTATACK 0 0 0 0 0 0 0 1 W Reset = Unimplemented or Reserved Figure 22-8. Flash Protection Status Register (FPSTAT) All bits in the FPSTAT register are readable but are not writable. Table 22-12. FPSTAT Field Descriptions Field Description 7 FPOVRD Flash Protection Override Status -- The FPOVRD bit indicates if the Protection Override feature is currently enabled. See Section 22.4.7.17, "Protection Override Command" for more details. 0 Protection is not overridden 1 Protection is overridden, contents of registers FPROT and/or DFPROT (and effective protection limits determined by their current contents) were determined during execution of command Protection Override 0 WSTATACK Wait-State Switch Acknowledge -- The WSTATACK bit indicates that the wait-state configuration is effectively set according to the value configured on bits FCNFG[WSTAT] (see Section 22.3.2.5, "Flash Configuration Register (FCNFG)"). WSTATACK bit is cleared when a change in FCNFG[WSTAT] is requested by writing to those bits, and is set when the Flash has effectively switched to the new wait-state configuration. The application must check the status of WSTATACK bit to make sure it reads as 1 before changing the frequency setup (see Section 22.4.3, "Flash Block Read Access"). 0 Wait-State switch is pending, Flash reads are still happening according to the previous value of FCNFG[WSTAT] 1 Wait-State switch is complete, Flash reads are already working according to the value set on FCNFG[WSTAT] 22.3.2.5 Flash Configuration Register (FCNFG) The FCNFG register enables the Flash command complete interrupt, control generation of wait-states and forces ECC faults on Flash array read access from the CPU. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 653 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Offset Module Base + 0x0004 7 R W Reset CCIE 0 6 5 0 ERSAREQ 0 0 4 3 IGNSF 0 2 WSTAT[1:0] 0 0 1 0 FDFD FSFD 0 0 = Unimplemented or Reserved Figure 22-9. Flash Configuration Register (FCNFG) CCIE, IGNSF, WSTAT, FDFD, and FSFD bits are readable and writable, ERSAREQ bit is read only, and remaining bits read 0 and are not writable. Table 22-13. FCNFG Field Descriptions Field Description 7 CCIE Command Complete Interrupt Enable -- The CCIE bit controls interrupt generation when a Flash command has completed. 0 Command complete interrupt disabled 1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see <st-blue>Section 22.3.2.7 Flash Status Register (FSTAT)) 5 ERSAREQ Erase All Request -- Requests the Memory Controller to execute the Erase All Blocks command and release security. ERSAREQ is not directly writable but is under indirect user control. Refer to the Reference Manual for assertion of the soc_erase_all_req input to the FTMRZ module. 0 No request or request complete 1 Request to: a) run the Erase All Blocks command b) verify the erased state c) program the security byte in the Flash Configuration Field to the unsecure state d) release MCU security by setting the SEC field of the FSEC register to the unsecure state as defined in Table 22-8. of <st-blue>Section 22.3.2.2 Flash Security Register (FSEC). The ERSAREQ bit sets to 1 when soc_erase_all_req is asserted, CCIF=1 and the Memory Controller starts executing the sequence. ERSAREQ will be reset to 0 by the Memory Controller when the operation is completed (see <st-blue>Section 22.4.7.7.1 Erase All Pin). 4 IGNSF Ignore Single Bit Fault -- The IGNSF controls single bit fault reporting in the FERSTAT register (see <st-blue>Section 22.3.2.8 Flash Error Status Register (FERSTAT)). 0 All single bit faults detected during array reads are reported 1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be generated 3-2 Wait State control bits -- The WSTAT[1:0] bits define how many wait-states are inserted on each read access to the Flash WSTAT[1:0] as shown on Table 22-14..Right after reset the maximum amount of wait-states is set, to be later re-configured by the application if needed. Depending on the system operating frequency being used the number of wait-states can be reduced or disabled, please refer to the Data Sheet for details. For additional information regarding the procedure to change this configuration please see <st-blue>Section 22.4.3 Flash Block Read Access. The WSTAT[1:0] bits should not be updated while the Flash is executing a command (CCIF=0); if that happens the value of this field will not change and no action will take place. MC9S12ZVC Family Reference Manual , Rev. 1.9 654 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-13. FCNFG Field Descriptions (continued) Field Description 1 FDFD Force Double Bit Fault Detect -- The FDFD bit allows the user to simulate a double bit fault during Flash array read operations. The FDFD bit is cleared by writing a 0 to FDFD. 0 Flash array read operations will set the DFDF flag in the FERSTAT register only if a double bit fault is detected 1 Any Flash array read operation will force the DFDF flag in the FERSTAT register to be set (see <st-blue>Section 22.3.2.7 Flash Status Register (FSTAT)) 0 FSFD Force Single Bit Fault Detect -- The FSFD bit allows the user to simulate a single bit fault during Flash array read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD. 0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected 1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see <st-blue>Section 22.3.2.7 Flash Status Register (FSTAT)) and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see <st-blue>Section 22.3.2.6 Flash Error Configuration Register (FERCNFG)) Table 22-14. Flash Wait-States control WSTAT[1:0] Wait-State configuration 00 ENABLED, maximum number of cycles1 01 reserved2 10 reserved2 11 DISABLED 1 Reset condition. For a target of 100MHz core frequency / 50MHz bus frequency the maximum number required is 1 cycle. 2 Value will read as 01 or 10, as written. In the current implementation the Flash will behave the same as 00 (wait-states enabled, maximum number of cycles). 22.3.2.6 Flash Error Configuration Register (FERCNFG) The FERCNFG register enables the Flash error interrupts for the FERSTAT flags. Offset Module Base + 0x0005 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 0 SFDIE 0 = Unimplemented or Reserved Figure 22-10. Flash Error Configuration Register (FERCNFG) All assigned bits in the FERCNFG register are readable and writable. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 655 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-15. FERCNFG Field Descriptions Field Description 0 SFDIE Single Bit Fault Detect Interrupt Enable -- The SFDIE bit controls interrupt generation when a single bit fault is detected during a Flash block read operation. 0 SFDIF interrupt disabled whenever the SFDIF flag is set (see <st-blue>Section 22.3.2.8 Flash Error Status Register (FERSTAT)) 1 An interrupt will be requested whenever the SFDIF flag is set (see <st-blue>Section 22.3.2.8 Flash Error Status Register (FERSTAT)) 22.3.2.7 Flash Status Register (FSTAT) The FSTAT register reports the operational status of the Flash module. Offset Module Base + 0x0006 7 R W Reset CCIF 1 6 0 0 5 4 ACCERR FPVIOL 0 0 3 2 MGBUSY RSVD 0 0 1 0 MGSTAT[1:0] 01 01 = Unimplemented or Reserved Figure 22-11. Flash Status Register (FSTAT) 1 Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see <st-blue>Section 22.6 Initialization). CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable but not writable, while remaining bits read 0 and are not writable. Table 22-16. FSTAT Field Descriptions Field Description 7 CCIF Command Complete Interrupt Flag -- The CCIF flag indicates that a Flash command has completed. The CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command completion or command violation. 0 Flash command in progress 1 Flash command has completed 5 ACCERR Flash Access Error Flag -- The ACCERR bit indicates an illegal access has occurred to the Flash memory caused by either a violation of the command write sequence (see <st-blue>Section 22.4.5.2 Command Write Sequence) or issuing an illegal Flash command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR. 0 No access error detected 1 Access error detected 4 FPVIOL Flash Protection Violation Flag --The FPVIOL bit indicates an attempt was made to program or erase an address in a protected area of P-Flash or EEPROM memory during a command write sequence. The FPVIOL bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL is set, it is not possible to launch a command or start a command write sequence. 0 No protection violation detected 1 Protection violation detected MC9S12ZVC Family Reference Manual , Rev. 1.9 656 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-16. FSTAT Field Descriptions (continued) Field 3 MGBUSY 2 RSVD 1-0 MGSTAT[1:0] 22.3.2.8 Description Memory Controller Busy Flag -- The MGBUSY flag reflects the active state of the Memory Controller. 0 Memory Controller is idle 1 Memory Controller is busy executing a Flash command (CCIF = 0) Reserved Bit -- This bit is reserved and always reads 0. Memory Controller Command Completion Status Flag -- One or more MGSTAT flag bits are set if an error is detected during execution of a Flash command or during the Flash reset sequence. The MGSTAT bits are cleared automatically at the start of the execution of a Flash command. See Section 22.4.7, "Flash Command Description," and Section 22.6, "Initialization" for details. Flash Error Status Register (FERSTAT) The FERSTAT register reflects the error status of internal Flash operations. Offset Module Base + 0x0007 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 W Reset 1 0 DFDF SFDIF 0 0 = Unimplemented or Reserved Figure 22-12. Flash Error Status Register (FERSTAT) All flags in the FERSTAT register are readable and only writable to clear the flag. Table 22-17. FERSTAT Field Descriptions Field Description 1 DFDF Double Bit Fault Detect Flag -- The setting of the DFDF flag indicates that a double bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash command operation.1 The DFDF flag is cleared by writing a 1 to DFDF. Writing a 0 to DFDF has no effect on DFDF.2 0 No double bit fault detected 1 Double bit fault detected or a Flash array read operation returning invalid data was attempted while command running. See Section 22.4.3, "Flash Block Read Access" for details 0 SFDIF Single Bit Fault Detect Interrupt Flag -- With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash command operation. The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on SFDIF. 0 No single bit fault detected 1 Single bit fault detected and corrected or a Flash array read operation returning invalid data was attempted while command running 1 In case of ECC errors the corresponding flag must be cleared for the proper setting of any further error, i.e. any new error will only be indicated properly when DFDF and/or SFDIF are clear at the time the error condition is detected. 2 There is a one cycle delay in storing the ECC DFDF and SFDIF fault flags in this register. At least one NOP is required after a flash memory read before checking FERSTAT for the occurrence of ECC errors. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 657 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.3.2.9 P-Flash Protection Register (FPROT) The FPROT register defines which P-Flash sectors are protected against program and erase operations. Offset Module Base + 0x0008 7 R W Reset FPOPEN F1 6 RNV6 F1 5 4 FPHDIS F1 3 FPHS[1:0] F1 2 1 FPLDIS F1 F1 0 FPLS[1:0] F1 F1 = Unimplemented or Reserved Figure 22-13. Flash Protection Register (FPROT) 1 Loaded from Flash configuration field, during reset sequence. The (unreserved) bits of the FPROT register are writable in Normal Single Chip Mode with the restriction that the size of the protected region can only be increased(see Section 22.3.2.9.1, "P-Flash Protection Restrictions," and Table 22-22.). All (unreserved) bits of the FPROT register are writable without restriction in Special Single Chip Mode. During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte in the Flash configuration field at global address 0xFF_FE0C located in P-Flash memory (see Table 22-3) as indicated by reset condition `F' in Figure 22-13. To change the P-Flash protection that will be loaded during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected. Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if any of the P-Flash sectors contained in the same P-Flash block are protected. Table 22-18. FPROT Field Descriptions Field Description 7 FPOPEN Flash Protection Operation Enable -- The FPOPEN bit determines the protection function for program or erase operations as shown in Table 22-19 for the P-Flash block. 0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the corresponding FPHS and FPLS bits 1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the corresponding FPHS and FPLS bits 6 RNV[6] Reserved Nonvolatile Bit -- The RNV bit should remain in the erased state for future enhancements. 5 FPHDIS Flash Protection Higher Address Range Disable -- The FPHDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory ending with global address 0xFF_FFFF. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled 4-3 FPHS[1:0] Flash Protection Higher Address Size -- The FPHS bits determine the size of the protected/unprotected area in P-Flash memory as shown inTable 22-20. The FPHS bits can only be written to while the FPHDIS bit is set. MC9S12ZVC Family Reference Manual , Rev. 1.9 658 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-18. FPROT Field Descriptions (continued) Field Description 2 FPLDIS Flash Protection Lower Address Range Disable -- The FPLDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0xFF_8000. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled 1-0 FPLS[1:0] Flash Protection Lower Address Size -- The FPLS bits determine the size of the protected/unprotected area in P-Flash memory as shown in Table 22-21. The FPLS bits can only be written to while the FPLDIS bit is set. Table 22-19. P-Flash Protection Function 1 Function1 FPOPEN FPHDIS FPLDIS 1 1 1 No P-Flash Protection 1 1 0 Protected Low Range 1 0 1 Protected High Range 1 0 0 Protected High and Low Ranges 0 1 1 Full P-Flash Memory Protected 0 1 0 Unprotected Low Range 0 0 1 Unprotected High Range 0 0 0 Unprotected High and Low Ranges For range sizes, refer to Table 22-20 and Table 22-21. Table 22-20. P-Flash Protection Higher Address Range FPHS[1:0] Global Address Range Protected Size 00 0xFF_F800-0xFF_FFFF 2 KB 01 0xFF_F000-0xFF_FFFF 4 KB 10 0xFF_E000-0xFF_FFFF 8 KB 11 0xFF_C000-0xFF_FFFF 16 KB Table 22-21. P-Flash Protection Lower Address Range FPLS[1:0] Global Address Range Protected Size 00 0xFF_8000-0xFF_83FF 1 KB 01 0xFF_8000-0xFF_87FF 2 KB 10 0xFF_8000-0xFF_8FFF 4 KB 11 0xFF_8000-0xFF_9FFF 8 KB All possible P-Flash protection scenarios are shown in Figure 22-14 . Although the protection scheme is loaded from the Flash memory at global address 0xFF_FE0C during the reset sequence, it can be changed by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in Normal Single Chip Mode while providing as much protection as possible if reprogramming is not required. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 659 FPHDIS = 0 FPLDIS = 0 7 6 5 4 3 2 1 0 0xFF_8000 Scenario FLASH START FPLS[1:0] 0xFF_FFFF FPHS[1:0] 0xFF_8000 FPOPEN = 0 FPHDIS = 0 FPLDIS = 1 FPLS[1:0] FPHDIS = 1 FPLDIS = 0 FPHS[1:0] Scenario FLASH START FPHDIS = 1 FPLDIS = 1 FPOPEN = 1 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 0xFF_FFFF Unprotected region Protected region with size defined by FPLS Protected region not defined by FPLS, FPHS Protected region with size defined by FPHS Figure 22-14. P-Flash Protection Scenarios MC9S12ZVC Family Reference Manual , Rev. 1.9 660 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.3.2.9.1 P-Flash Protection Restrictions In Normal Single Chip Mode the general guideline is that P-Flash protection can only be added and not removed. Table 22-22 specifies all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario. See the FPHS and FPLS bit descriptions for additional restrictions. Table 22-22. P-Flash Protection Scenario Transitions To Protection Scenario1 From Protection Scenario 0 1 2 3 0 X X X X X 1 X 4 X X X X X X X X X X 6 X 7 1 22.3.2.10 X 6 7 X 3 5 5 X X 2 4 X X X X X X Allowed transitions marked with X, see Figure 22-14 for a definition of the scenarios. EEPROM Protection Register (DFPROT) The DFPROT register defines which EEPROM sectors are protected against program and erase operations. Offset Module Base + 0x0009 7 R W Reset DPOPEN F1 6 5 4 3 0 F1 2 1 0 F1 F1 F1 DPS[5:0] F1 F1 F1 Figure 22-15. EEPROM Protection Register (DFPROT) 1 Loaded from Flash configuration field, during reset sequence. The (unreserved) bits of the DFPROT register are writable in Normal Single Chip Mode with the restriction that protection can be added but not removed. Writes in Normal Single Chip Mode must increase the DPS value and the DPOPEN bit can only be written from 1 (protection disabled) to 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is irrelevant.All DPOPEN/DPS bit registers are writable without restriction in Special Single Chip Mode. During the reset sequence, fields DPOPEN and DPS of the DFPROT register are loaded with the contents of the EEPROM protection byte in the Flash configuration field at global address 0xFF_FE0D located in MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 661 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) P-Flash memory (see Table 22-3) as indicated by reset condition F in Table 22-24.. To change the EEPROM protection that will be loaded during the reset sequence, the P-Flash sector containing the EEPROM protection byte must be unprotected, then the EEPROM protection byte must be programmed. If a double bit fault is detected while reading the P-Flash phrase containing the EEPROM protection byte during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the EEPROM memory fully protected. Trying to alter data in any protected area in the EEPROM memory will result in a protection violation error and the FPVIOL bit will be set in the FSTAT register. Block erase of the EEPROM memory is not possible if any of the EEPROM sectors are protected. Table 22-23. DFPROT Field Descriptions Field Description 7 DPOPEN EEPROM Protection Control 0 Enables EEPROM memory protection from program and erase with protected address range defined by DPS bits 1 Disables EEPROM memory protection from program and erase 5-0 DPS[5:0] EEPROM Protection Size -- The DPS[5:0] bits determine the size of the protected area in the EEPROM memory, this size increase in step of 32 bytes, as shown in Table 22-24. . Table 22-24. EEPROM Protection Address Range DPS[5:0] Global Address Range Protected Size 000000 0x10_0000 - 0x10_001F 32 bytes 000001 0x10_0000 - 0x10_003F 64 bytes 000010 0x10_0000 - 0x10_005F 96 bytes 000011 0x10_0000 - 0x10_007F 128 bytes 000100 0x10_0000 - 0x10_009F 160 bytes 000101 0x10_0000 - 0x10_00BF 192 bytes The Protection Size goes on enlarging in step of 32 bytes, for each DPS value increasing of one. . . . 111111 22.3.2.11 0x10_0000 - 0x10_07FF 2,048 bytes Flash Option Register (FOPT) The FOPT register is the Flash option register. MC9S12ZVC Family Reference Manual , Rev. 1.9 662 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Offset Module Base + 0x000A 7 6 5 4 R 3 2 1 0 F1 F1 F1 F1 NV[7:0] W Reset F1 F1 F1 F1 = Unimplemented or Reserved Figure 22-16. Flash Option Register (FOPT) 1 Loaded from Flash configuration field, during reset sequence. All bits in the FOPT register are readable but are not writable. During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash configuration field at global address 0xFF_FE0E located in P-Flash memory (see Table 22-3) as indicated by reset condition F in Figure 22-16. If a double bit fault is detected while reading the P-Flash phrase containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set. Table 22-25. FOPT Field Descriptions Field Description 7-0 NV[7:0] Nonvolatile Bits -- The NV[7:0] bits are available as nonvolatile bits. Refer to the Device Overview for proper use of the NV bits. 22.3.2.12 Flash Reserved1 Register (FRSV1) This Flash register is reserved for factory testing. Offset Module Base + 0x000B R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 22-17. Flash Reserved1 Register (FRSV1) All bits in the FRSV1 register read 0 and are not writable. 22.3.2.13 Flash Common Command Object Registers (FCCOB) The FCCOB is an array of six words. Byte wide reads and writes are allowed to the FCCOB registers. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 663 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Offset Module Base + 0x000C 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[15:8] W Reset 3 0 0 0 0 Figure 22-18. Flash Common Command Object 0 High Register (FCCOB0HI) Offset Module Base + 0x000D 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[7:0] W Reset 3 0 0 0 0 Figure 22-19. Flash Common Command Object 0 Low Register (FCCOB0LO) Offset Module Base + 0x000E 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[15:8] W Reset 3 0 0 0 0 Figure 22-20. Flash Common Command Object 1 High Register (FCCOB1HI) Offset Module Base + 0x000F 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[7:0] W Reset 3 0 0 0 0 Figure 22-21. Flash Common Command Object 1 Low Register (FCCOB1LO) Offset Module Base + 0x0010 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[15:8] W Reset 3 0 0 0 0 Figure 22-22. Flash Common Command Object 2 High Register (FCCOB2HI) MC9S12ZVC Family Reference Manual , Rev. 1.9 664 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Offset Module Base + 0x0011 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[7:0] W Reset 3 0 0 0 0 Figure 22-23. Flash Common Command Object 2 Low Register (FCCOB2LO) Offset Module Base + 0x0012 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[15:8] W Reset 3 0 0 0 0 Figure 22-24. Flash Common Command Object 3 High Register (FCCOB3HI) Offset Module Base + 0x0013 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[7:0] W Reset 3 0 0 0 0 Figure 22-25. Flash Common Command Object 3 Low Register (FCCOB3LO) Offset Module Base + 0x0014 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[15:8] W Reset 3 0 0 0 0 Figure 22-26. Flash Common Command Object 4 High Register (FCCOB4HI) Offset Module Base + 0x0015 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[7:0] W Reset 3 0 0 0 0 Figure 22-27. Flash Common Command Object 4 Low Register (FCCOB4LO) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 665 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Offset Module Base + 0x0016 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[15:8] W Reset 3 0 0 0 0 Figure 22-28. Flash Common Command Object 5 High Register (FCCOB5HI) Offset Module Base + 0x0017 7 6 5 4 R 2 1 0 0 0 0 0 CCOB[7:0] W Reset 3 0 0 0 0 Figure 22-29. Flash Common Command Object 5 Low Register (FCCOB5LO) 22.3.2.13.1 FCCOB - NVM Command Mode NVM command mode uses the FCCOB registers to provide a command code and its relevant parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates the command's execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the FCCOB register array. The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 22-26. The return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by the Memory Controller. The value written to the FCCOBIX field must reflect the amount of CCOB words loaded for command execution. Table 22-26 shows the generic Flash command format. The high byte of the first word in the CCOB array contains the command code, followed by the parameters for this specific Flash command. For details on the FCCOB settings required by each command, see the Flash command descriptions in <st-blue>Section 22.4.7 Flash Command Description. Table 22-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] Register 000 FCCOB0 001 FCCOB1 Byte FCCOB Parameter Fields (NVM Command Mode) HI FCMD[7:0] defining Flash command LO Global address [23:16] HI Global address [15:8] LO Global address [7:0] MC9S12ZVC Family Reference Manual , Rev. 1.9 666 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-26. FCCOB - NVM Command Mode (Typical Usage) 22.4 22.4.1 CCOBIX[2:0] Register 010 FCCOB2 011 FCCOB3 100 FCCOB4 101 FCCOB5 Byte FCCOB Parameter Fields (NVM Command Mode) HI Data 0 [15:8] LO Data 0 [7:0] HI Data 1 [15:8] LO Data 1 [7:0] HI Data 2 [15:8] LO Data 2 [7:0] HI Data 3 [15:8] LO Data 3 [7:0] Functional Description Modes of Operation The FTMRZ192K2K module provides the modes of operation normal and special . The operating mode is determined by module-level inputs and affects the FCLKDIV, FCNFG, and DFPROT registers (see Table 22-28.). 22.4.2 IFR Version ID Word The version ID word is stored in the IFR at address 0x1F_C0B6. The contents of the word are defined in Table 22-27. Table 22-27. IFR Version ID Fields * 22.4.3 [15:4] [3:0] Reserved VERNUM VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111 meaning `none'. Flash Block Read Access If data read from the Flash block results in a double-bit fault ECC error (meaning that data is detected to be in error and cannot be corrected), the read data will be tagged as invalid during that access (please look into the Reference Manual for details). Forcing the DFDF status bit by setting FDFD (see <st-blue>Section MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 667 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.3.2.5 Flash Configuration Register (FCNFG)) has effect only on the DFDF status bit value and does not result in an invalid access. To guarantee the proper read timing from the Flash array, the FTMRZ192K2K FMU will control (i.e. pause) the S12Z core accesses, considering that the MCU can be configured to fetch data at a faster frequency than the Flash block can support. Right after reset the FTMRZ192K2K FMU will be configured to run with the maximum amount of wait-states enabled; if the user application is setup to run at a slower frequency the control bits FCNFG[WSTAT] (see <st-blue>Section 22.3.2.5 Flash Configuration Register (FCNFG)) can be configured by the user to disable the generation of wait-states, so it does not impose a performance penalty to the system if the read timing of the S12Z core is setup to be within the margins of the Flash block. For a definition of the frequency values where wait-states can be disabled please look into the Reference Manual. The following sequence must be followed when the transition from a higher frequency to a lower frequency is going to happen: * * * * * Flash resets with wait-states enabled; system frequency must be configured to the lower target; user writes to FNCNF[WSTAT] to disable wait-states; user reads the value of FPSTAT[WSTATACK], the new wait-state configuration will be effective when it reads as 1; user must re-write FCLKDIV to set a new value based on the lower frequency. The following sequence must be followed on the contrary direction, going from a lower frequency to a higher frequency: * user writes to FCNFG[WSTAT] to enable wait-states; * user reads the value of FPSTAT[WSTATACK], the new wait-state configuration will be effective when it reads as 1; * user must re-write FCLKDIV to set a new value based on the higher frequency; * system frequency must be set to the upper target. CAUTION If the application is going to require the frequency setup to change, the value to be loaded on register FCLKDIV will have to be updated according to the new frequency value. In this scenario the application must take care to avoid locking the value of the FCLKDIV register: bit FDIVLCK must not be set if the value to be loaded on FDIV is going to be re-written, otherwise a reset is going to be required. Please refer to Section 22.3.2.1, "Flash Clock Divider Register (FCLKDIV) and Section 22.4.5.1, "Writing the FCLKDIV Register. 22.4.4 Internal NVM resource IFR is an internal NVM resource readable by CPU . The IFR fields are shown in Table 22-4.. The NVM Resource Area global address map is shown in Table 22-5.. MC9S12ZVC Family Reference Manual , Rev. 1.9 668 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.4.5 Flash Command Operations Flash command operations are used to modify Flash memory contents. The next sections describe: * How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from BUSCLK for Flash program and erase command operations * The command write sequence used to set Flash command parameters and launch execution * Valid Flash commands available for execution, according to MCU functional mode and MCU security state. 22.4.5.1 Writing the FCLKDIV Register Prior to issuing any Flash program or erase command after a reset, the user is required to write the FCLKDIV register to divide BUSCLK down to a target FCLK of 1 MHz. Table 22-7. shows recommended values for the FDIV field based on BUSCLK frequency. NOTE Programming or erasing the Flash memory cannot be performed if the bus clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash memory due to overstress. Setting FDIV too low can result in incomplete programming or erasure of the Flash memory cells. When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written, any Flash program or erase command loaded during a command write sequence will not execute and the ACCERR bit in the FSTAT register will set. 22.4.5.2 Command Write Sequence The Memory Controller will launch all valid Flash commands entered using a command write sequence. Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see <st-blue>Section 22.3.2.7 Flash Status Register (FSTAT)) and the CCIF flag should be tested to determine the status of the current command write sequence. If CCIF is 0, the previous command write sequence is still active, a new command write sequence cannot be started, and all writes to the FCCOB register are ignored. 22.4.5.2.1 Define FCCOB Contents The FCCOB parameter fields must be loaded with all required parameters for the Flash command being executed. The CCOBIX bits in the FCCOBIX register must reflect the amount of words loaded into the FCCOB registers (see <st-blue>Section 22.3.2.3 Flash CCOB Index Register (FCCOBIX)). The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag will remain clear until the Flash command has completed. Upon completion, the Memory Controller will MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 669 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic command write sequence is shown in Figure 22-30. MC9S12ZVC Family Reference Manual , Rev. 1.9 670 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) START Read: FCLKDIV register Clock Divider Value Check FDIV Correct? no no Read: FSTAT register yes FCCOB Availability Check CCIF Set? yes Read: FSTAT register Note: FCLKDIV must be set after each reset Write: FCLKDIV register no CCIF Set? yes Results from previous Command Access Error and Protection Violation Check ACCERR/ FPVIOL Set? no yes Write: FSTAT register Clear ACCERR/FPVIOL 0x30 Write to FCCOBIX register to indicate number of parameters to be loaded. Write to FCCOB register to load required command parameter. More Parameters? yes no Write: FSTAT register (to launch command) Clear CCIF 0x80 Read: FSTAT register Bit Polling for Command Completion Check CCIF Set? no yes EXIT Figure 22-30. Generic Flash Command Write Sequence Flowchart MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 671 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.4.5.3 Valid Flash Module Commands Table 22-28. present the valid Flash commands, as enabled by the combination of the functional MCU mode (Normal SingleChip NS, Special Singlechip SS) with the MCU security state (Unsecured, Secured). + Table 22-28. Flash Commands by Mode and Security State Unsecured FCMD Command Secured NS1 SS2 NS3 0x01 Erase Verify All Blocks 0x02 Erase Verify Block 0x03 Erase Verify P-Flash Section 0x04 Read Once 0x06 Program P-Flash 0x07 Program Once 0x08 Erase All Blocks 0x09 Erase Flash Block 0x0A Erase P-Flash Sector 0x0B Unsecure Flash 0x0C Verify Backdoor Access Key 0x0D Set User Margin Level 0x0E Set Field Margin Level 0x10 Erase Verify EEPROM Section 0x11 Program EEPROM 0x12 Erase EEPROM Sector 0x13 Protection Override SS4 1 Unsecured Normal Single Chip mode Unsecured Special Single Chip mode. 3 Secured Normal Single Chip mode. 4 Secured Special Single Chip mode.Please refer to <st-blue>Section 22.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM. 2 MC9S12ZVC Family Reference Manual , Rev. 1.9 672 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.4.5.4 P-Flash Commands Table 22-29 summarizes the valid P-Flash commands along with the effects of the commands on the P-Flash block and other resources within the Flash module. Table 22-29. P-Flash Commands FCMD Command 0x01 Erase Verify All Blocks 0x02 Erase Verify Block 0x03 Erase Verify P-Flash Section 0x04 Read Once 0x06 Program P-Flash 0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block that is allowed to be programmed only once. 0x08 Erase All Blocks Erase all P-Flash (and EEPROM) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the DPOPEN bit in the DFPROT register are set prior to launching the command. 0x09 Erase Flash Block Erase a P-Flash (or EEPROM) block. An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN bits in the FPROT register are set prior to launching the command. 0x0A Erase P-Flash Sector 0x0B Unsecure Flash 0x0C Verify Backdoor Access Key Supports a method of releasing MCU security by verifying a set of security keys. 0x0D Set User Margin Level Specifies a user margin read level for all P-Flash blocks. 0x0E Set Field Margin Level Specifies a field margin read level for all P-Flash blocks (special modes only). 0x13 Protection Override 22.4.5.5 Function on P-Flash Memory Verify that all P-Flash (and EEPROM) blocks are erased. Verify that a P-Flash block is erased. Verify that a given number of words starting at the address provided are erased. Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that was previously programmed using the Program Once command. Program a phrase in a P-Flash block. Erase all bytes in a P-Flash sector. Supports a method of releasing MCU security by erasing all P-Flash (and EEPROM) blocks and verifying that all P-Flash (and EEPROM) blocks are erased. Supports a mode to temporarily override Protection configuration (for P-Flash and/or EEPROM) by verifying a key. EEPROM Commands Table 22-30 summarizes the valid EEPROM commands along with the effects of the commands on the EEPROM block. Table 22-30. EEPROM Commands FCMD Command 0x01 Erase Verify All Blocks Function on EEPROM Memory Verify that all EEPROM (and P-Flash) blocks are erased. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 673 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-30. EEPROM Commands FCMD Command 0x02 Erase Verify Block Function on EEPROM Memory Verify that the EEPROM block is erased. 0x08 Erase All Blocks Erase all EEPROM (and P-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the DPOPEN bit in the DFPROT register are set prior to launching the command. 0x09 Erase Flash Block Erase a EEPROM (or P-Flash) block. An erase of the full EEPROM block is only possible when DPOPEN bit in the DFPROT register is set prior to launching the command. 0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all EEPROM (and P-Flash) blocks and verifying that all EEPROM (and P-Flash) blocks are erased. 0x0D Set User Margin Level Specifies a user margin read level for the EEPROM block. 0x0E Set Field Margin Level Specifies a field margin read level for the EEPROM block (special modes only). 0x10 Erase Verify EEPROM Section Verify that a given number of words starting at the address provided are erased. 0x11 Program EEPROM Program up to four words in the EEPROM block. 0x12 Erase EEPROM Sector Erase all bytes in a sector of the EEPROM block. 0x13 Protection Override 22.4.6 Supports a mode to temporarily override Protection configuration (for P-Flash and/or EEPROM) by verifying a key. Allowed Simultaneous P-Flash and EEPROM Operations Only the operations marked `OK' in Table 22-31. are permitted to be run simultaneously on the Program Flash and EEPROM blocks. Some operations cannot be executed simultaneously because certain hardware resources are shared by the two memories. The priority has been placed on permitting Program Flash reads while program and erase operations execute on the EEPROM, providing read (P-Flash) while write (EEPROM) functionality. Any attempt to access P-Flash and EEPROM simultaneously when it is not allowed will result in an illegal access that will trigger a machine exception in the CPU (please look into the Reference Manual for details). Please note that during the execution of each command there is a period, before the operation in the Flash array actually starts, where reading is allowed and valid data is returned. Even if the simultaneous operation is marked as not allowed the Flash will report an illegal access only in the cycle the read collision actually happens, maximizing the time the array is available for reading. MC9S12ZVC Family Reference Manual , Rev. 1.9 674 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-31. Allowed P-Flash and EEPROM Simultaneous Operations EEPROM Program Flash Read Margin Read2 Program Sector Erase Read OK1 OK OK OK Mass Erase2 Margin Read2 Program Sector Erase Mass Erase3 OK 1 Strictly speaking, only one read of either the P-Flash or EEPROM can occur at any given instant, but the memory controller will transparently arbitrate P-Flash and EEPROM accesses giving uninterrupted read access whenever possible. 2 A `Margin Read' is any read after executing the margin setting commands `Set User Margin Level' or `Set Field Margin Level' with anything but the `normal' level specified. See the Note on margin settings in <st-blue>Section 22.4.7.12 Set User Margin Level Command and <st-blue>Section 22.4.7.13 Set Field Margin Level Command. 3 The `Mass Erase' operations are commands `Erase All Blocks' and `Erase Flash Block' 22.4.7 Flash Command Description This section provides details of all available Flash commands launched by a command write sequence. The ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following illegal steps are performed, causing the command not to be processed by the Memory Controller: * Starting any command write sequence that programs or erases Flash memory before initializing the FCLKDIV register * Writing an invalid command as part of the command write sequence * For additional possible errors, refer to the error handling table provided for each command If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation may return invalid data resulting in an illegal access (as described on <st-blue>Section 22.4.6 Allowed Simultaneous P-Flash and EEPROM Operations). If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting any command write sequence (see <st-blue>Section 22.3.2.7 Flash Status Register (FSTAT)). CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 675 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.4.7.1 Erase Verify All Blocks Command The Erase Verify All Blocks command will verify that all P-Flash and EEPROM blocks have been erased. Table 22-32. Erase Verify All Blocks Command FCCOB Requirements Register FCCOB Parameters FCCOB0 0x01 Not required Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks operation has completed. If all blocks are not erased, it means blank check failed, both MGSTAT bits will be set. Table 22-33. Erase Verify All Blocks Command Error Handling Register FSTAT 22.4.7.2 Error Bit Error Condition ACCERR Set if CCOBIX[2:0] != 000 at command launch FPVIOL None MGSTAT1 Set if any errors have been encountered during the reador if blank check failed . MGSTAT0 Set if any non-correctable errors have been encountered during the read or if blank check failed. Erase Verify Block Command The Erase Verify Block command allows the user to verify that an entire P-Flash or EEPROM block has been erased. Table 22-34. Erase Verify Block Command FCCOB Requirements Register FCCOB0 FCCOB1 FCCOB Parameters 0x02 Global address [23:16] to identify Flash block Global address [15:0] to identify Flash block Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that the selected P-Flash or EEPROM block is erased. The CCIF flag will set after the Erase Verify Block operation has completed.If the block is not erased, it means blank check failed, both MGSTAT bits will be set. MC9S12ZVC Family Reference Manual , Rev. 1.9 676 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-35. Erase Verify Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch ACCERR FSTAT 22.4.7.3 Set if an invalid global address [23:0] is supplied see Table 22-2) FPVIOL None MGSTAT1 Set if any errors have been encountered during the read or if blank check failed. MGSTAT0 Set if any non-correctable errors have been encountered during the read or if blank check failed. Erase Verify P-Flash Section Command The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and the number of phrases. Table 22-36. Erase Verify P-Flash Section Command FCCOB Requirements Register FCCOB Parameters FCCOB0 0x03 Global address [23:16] of a P-Flash block FCCOB1 Global address [15:0] of the first phrase to be verified FCCOB2 Number of phrases to be verified Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT bits will be set. Table 22-37. Erase Verify P-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if command not available in current mode (see Table 22-28) ACCERR Set if an invalid global address [23:0] is supplied see Table 22-2) Set if a misaligned phrase address is supplied (global address [2:0] != 000) FSTAT Set if the requested section crosses a the P-Flash address boundary FPVIOL None MGSTAT1 Set if any errors have been encountered during the read or if blank check failed. MGSTAT0 Set if any non-correctable errors have been encountered during the read or if blank check failed. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 677 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.4.7.4 Read Once Command The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once command described in <st-blue>Section 22.4.7.6 Program Once Command. The Read Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 22-38. Read Once Command FCCOB Requirements Register FCCOB Parameters FCCOB0 0x04 Not Required FCCOB1 Read Once phrase index (0x0000 - 0x0007) FCCOB2 Read Once word 0 value FCCOB3 Read Once word 1 value FCCOB4 Read Once word 2 value FCCOB5 Read Once word 3 value Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the Read Once command, any attempt to read addresses within P-Flash block will return invalid data. 8 Table 22-39. Read Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch ACCERR FSTAT 22.4.7.5 Set if command not available in current mode (see Table 22-28) Set if an invalid phrase index is supplied FPVIOL None MGSTAT1 Set if any errors have been encountered during the read MGSTAT0 Set if any non-correctable errors have been encountered during the read Program P-Flash Command The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an embedded algorithm. CAUTION A P-Flash phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash phrase is not allowed. MC9S12ZVC Family Reference Manual , Rev. 1.9 678 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-40. Program P-Flash Command FCCOB Requirements Register FCCOB Parameters FCCOB0 1 0x06 Global address [23:16] to identify P-Flash block FCCOB1 Global address [15:0] of phrase location to be programmed1 FCCOB2 Word 0 program value FCCOB3 Word 1 program value FCCOB4 Word 2 program value FCCOB5 Word 3 program value Global address [2:0] must be 000 Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the data words to the supplied global address and will then proceed to verify the data words read back as expected. The CCIF flag will set after the Program P-Flash operation has completed. Table 22-41. Program P-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch ACCERR FSTAT Set if an invalid global address [23:0] is supplied see Table 22-2) Set if a misaligned phrase address is supplied (global address [2:0] != 000) FPVIOL 22.4.7.6 Set if command not available in current mode (see Table 22-28) Set if the global address [17:0] points to a protected area MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Program Once Command The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the Read Once command as described in <st-blue>Section 22.4.7.4 Read Once Command. The Program Once command must only be issued once since the nonvolatile information register in P-Flash cannot be erased. The Program Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 22-42. Program Once Command FCCOB Requirements CCOBIX[2:0] FCCOB0 FCCOB Parameters 0x07 Not Required FCCOB1 Program Once phrase index (0x0000 - 0x0007) FCCOB2 Program Once word 0 value FCCOB3 Program Once word 1 value MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 679 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-42. Program Once Command FCCOB Requirements CCOBIX[2:0] FCCOB Parameters FCCOB4 Program Once word 2 value FCCOB5 Program Once word 3 value Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed. The reserved nonvolatile information register accessed by the Program Once command cannot be erased and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program Once command, any attempt to read addresses within P-Flash will return invalid data. Table 22-43. Program Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch ACCERR Set if an invalid phrase index is supplied Set if the requested phrase has already been programmed1 FSTAT FPVIOL 1 Set if command not available in current mode (see Table 22-28) None MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will be allowed to execute again on that same phrase. 22.4.7.7 Erase All Blocks Command The Erase All Blocks operation will erase the entire P-Flash and EEPROM memory space. Table 22-44. Erase All Blocks Command FCCOB Requirements Register FCCOB0 FCCOB Parameters 0x08 Not required Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All Blocks operation has completed. MC9S12ZVC Family Reference Manual , Rev. 1.9 680 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-45. Erase All Blocks Command Error Handling Register Error Bit ACCERR FSTAT 22.4.7.7.1 FPVIOL Error Condition Set if CCOBIX[2:0] != 000 at command launch Set if command not available in current mode (see Table 22-28) Set if any area of the P-Flash or EEPROM memory is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Erase All Pin The functionality of the Erase All Blocks command is also available in an uncommanded fashion from the soc_erase_all_req input pin on the Flash module. Refer to the Reference Manual for information on control of soc_erase_all_req. The erase-all function requires the clock divider register FCLKDIV (see <st-blue>Section 22.3.2.1 Flash Clock Divider Register (FCLKDIV)) to be loaded before invoking this function using soc_erase_all_req input pin. Please refer to the Reference Manual for information about the default value of FCLKDIV in case direct writes to register FCLKDIV are not allowed by the time this feature is invoked. If FCLKDIV is not properly set the erase-all operation will not execute and the ACCERR flag in FSTAT register will set. After the execution of the erase-all function the FCLKDIV register will be reset and the value of register FCLKDIV must be loaded before launching any other command afterwards. Before invoking the erase-all function using the soc_erase_all_req pin, the ACCERR and FPVIOL flags in the FSTAT register must be clear. When invoked from soc_erase_all_req the erase-all function will erase all P-Flash memory and EEPROM memory space regardless of the protection settings. If the post-erase verify passes, the routine will then release security by setting the SEC field of the FSEC register to the unsecure state (see <st-blue>Section 22.3.2.2 Flash Security Register (FSEC)). The security byte in the Flash Configuration Field will be programmed to the unsecure state (see Table 22-8.). The status of the erase-all request is reflected in the ERSAREQ bit in the FCNFG register (see <st-blue>Section 22.3.2.5 Flash Configuration Register (FCNFG)). The ERSAREQ bit in FCNFG will be cleared once the operation has completed and the normal FSTAT error reporting will be available as described inTable 22-46.. At the end of the erase-all sequence Protection will remain configured as it was before executing the erase-all function. If the application requires programming P-Flash and/or EEPROM after the erase-all function completes, the existing protection limits must be taken into account. If protection needs to be disabled the user may need to reset the system right after completing the erase-all function. Table 22-46. Erase All Pin Error Handling Register FSTAT Error Bit Error Condition ACCERR Set if command not available in current mode (see Table 22-28) MGSTAT1 Set if any errors have been encountered during the erase verify operation, or during the program verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the erase verify operation, or during the program verify operation MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 681 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.4.7.8 Erase Flash Block Command The Erase Flash Block operation will erase all addresses in a P-Flash or EEPROM block. Table 22-47. Erase Flash Block Command FCCOB Requirements Register FCCOB0 FCCOB1 FCCOB Parameters 0x09 Global address [23:16] to identify Flash block Global address [15:0] in Flash block to be erased Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block operation has completed. Table 22-48. Erase Flash Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if command not available in current mode (see Table 22-28) ACCERR Set if the supplied P-Flash address is not phrase-aligned or if the EEPROM address is not word-aligned FSTAT FPVIOL 22.4.7.9 Set if an invalid global address [23:0] is supplied Set if an area of the selected Flash block is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Erase P-Flash Sector Command The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector. Table 22-49. Erase P-Flash Sector Command FCCOB Requirements Register FCCOB0 FCCOB1 FCCOB Parameters 0x0A Global address [23:16] to identify P-Flash block to be erased Global address [15:0] anywhere within the sector to be erased. Refer to <st-blue>Section 22.1.2.1 P-Flash Features for the P-Flash sector size. Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash Sector operation has completed. MC9S12ZVC Family Reference Manual , Rev. 1.9 682 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-50. Erase P-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch ACCERR FSTAT Set if an invalid global address [23:0] is supplied see Table 22-2) Set if a misaligned phrase address is supplied (global address [2:0] != 000) FPVIOL 22.4.7.10 Set if command not available in current mode (see Table 22-28) Set if the selected P-Flash sector is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Unsecure Flash Command The Unsecure Flash command will erase the entire P-Flash and EEPROM memory space and, if the erase is successful, will release security. Table 22-51. Unsecure Flash Command FCCOB Requirements Register FCCOB0 FCCOB Parameters 0x0B Not required Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire P-Flash and EEPROM memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. If the erase verify is not successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security state. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag is set after the Unsecure Flash operation has completed. Table 22-52. Unsecure Flash Command Error Handling Register Error Bit ACCERR FSTAT 22.4.7.11 FPVIOL Error Condition Set if CCOBIX[2:0] != 000 at command launch Set if command not available in current mode (see Table 22-28) Set if any area of the P-Flash or EEPROM memory is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Verify Backdoor Access Key Command The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the FSEC register (see Table 22-9.). The Verify Backdoor Access Key command releases security if user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see Table 22-3.). The Verify Backdoor Access Key command must not be executed from the Flash block containing the backdoor comparison key to avoid code runaway. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 683 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-53. Verify Backdoor Access Key Command FCCOB Requirements Register FCCOB Parameters FCCOB0 0x0C Not required FCCOB1 Key 0 FCCOB2 Key 1 FCCOB3 Key 2 FCCOB4 Key 3 Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash configuration field with Key 0 compared to 0xFF_FE00, etc. If the backdoor keys match, security will be released. If the backdoor keys do not match, security is not released and all future attempts to execute the Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is set after the Verify Backdoor Access Key operation has completed. Table 22-54. Verify Backdoor Access Key Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 100 at command launch Set if an incorrect backdoor key is supplied ACCERR FSTAT 22.4.7.12 Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see <st-blue>Section 22.3.2.2 Flash Security Register (FSEC)) Set if the backdoor key has mismatched since the last reset FPVIOL None MGSTAT1 None MGSTAT0 None Set User Margin Level Command The Set User Margin Level command causes the Memory Controller to set the margin level for future read operations of the P-Flash or EEPROM block. Table 22-55. Set User Margin Level Command FCCOB Requirements Register FCCOB0 FCCOB Parameters 0x0D Global address [23:16] to identify Flash block FCCOB1 Global address [15:0] to identify Flash block FCCOB2 Margin level setting. MC9S12ZVC Family Reference Manual , Rev. 1.9 684 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the user margin level for the targeted block and then set the CCIF flag. NOTE When the EEPROM block is targeted, the EEPROM user margin levels are applied only to the EEPROM reads. However, when the P-Flash block is targeted, the P-Flash user margin levels are applied to both P-Flash and EEPROM reads. It is not possible to apply user margin levels to the P-Flash block only. Valid margin level settings for the Set User Margin Level command are defined in Table 22-56.. Table 22-56. Valid Set User Margin Level Settings 1 2 FCCOB2 Level Description 0x0000 Return to Normal Level 0x0001 User Margin-1 Level1 0x0002 User Margin-0 Level2 Read margin to the erased state Read margin to the programmed state Table 22-57. Set User Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch ACCERR FSTAT Set if command not available in current mode (see Table 22-28) Set if an invalid global address [23:0] is supplied see Table 22-2) Set if an invalid margin level setting is supplied FPVIOL None MGSTAT1 None MGSTAT0 None NOTE User margin levels can be used to check that Flash memory contents have adequate margin for normal level read operations. If unexpected results are encountered when checking Flash memory contents at user margin levels, a potential loss of information has been detected. 22.4.7.13 Set Field Margin Level Command The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set the margin level specified for future read operations of the P-Flash or EEPROM block. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 685 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-58. Set Field Margin Level Command FCCOB Requirements Register FCCOB Parameters FCCOB0 0x0E Global address [23:16] to identify Flash block FCCOB1 Global address [15:0] to identify Flash block FCCOB2 Margin level setting. Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the field margin level for the targeted block and then set the CCIF flag. NOTE When the EEPROM block is targeted, the EEPROM field margin levels are applied only to the EEPROM reads. However, when the P-Flash block is targeted, the P-Flash field margin levels are applied to both P-Flash and EEPROM reads. It is not possible to apply field margin levels to the P-Flash block only. Valid margin level settings for the Set Field Margin Level command are defined in Table 22-59. Table 22-59. Valid Set Field Margin Level Settings 1 2 FCCOB2 Level Description 0x0000 Return to Normal Level 0x0001 User Margin-1 Level1 0x0002 User Margin-0 Level2 0x0003 Field Margin-1 Level1 0x0004 Field Margin-0 Level2 Read margin to the erased state Read margin to the programmed state Table 22-60. Set Field Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch ACCERR FSTAT Set if command not available in current mode (see Table 22-28) Set if an invalid global address [23:0] is supplied see Table 22-2) Set if an invalid margin level setting is supplied FPVIOL None MGSTAT1 None MGSTAT0 None MC9S12ZVC Family Reference Manual , Rev. 1.9 686 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) CAUTION Field margin levels must only be used during verify of the initial factory programming. NOTE Field margin levels can be used to check that Flash memory contents have adequate margin for data retention at the normal level setting. If unexpected results are encountered when checking Flash memory contents at field margin levels, the Flash memory contents should be erased and reprogrammed. 22.4.7.14 Erase Verify EEPROM Section Command The Erase Verify EEPROM Section command will verify that a section of code in the EEPROM is erased. The Erase Verify EEPROM Section command defines the starting point of the data to be verified and the number of words. Table 22-61. Erase Verify EEPROM Section Command FCCOB Requirements Register FCCOB Parameters FCCOB0 0x10 Global address [23:16] to identify the EEPROM block FCCOB1 Global address [15:0] of the first word to be verified FCCOB2 Number of words to be verified Upon clearing CCIF to launch the Erase Verify EEPROM Section command, the Memory Controller will verify the selected section of EEPROM memory is erased. The CCIF flag will set after the Erase Verify EEPROM Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT bits will be set. Table 22-62. Erase Verify EEPROM Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if command not available in current mode (see Table 22-28) ACCERR Set if an invalid global address [23:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) FSTAT Set if the requested section breaches the end of the EEPROM block FPVIOL None MGSTAT1 Set if any errors have been encountered during the read or if blank check failed. MGSTAT0 Set if any non-correctable errors have been encountered during the read or if blank check failed. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 687 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) 22.4.7.15 Program EEPROM Command The Program EEPROM operation programs one to four previously erased words in the EEPROM block. The Program EEPROM operation will confirm that the targeted location(s) were successfully programmed upon completion. CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed. Table 22-63. Program EEPROM Command FCCOB Requirements Register FCCOB0 FCCOB Parameters Global address [23:16] to identify the EEPROM block 0x11 FCCOB1 Global address [15:0] of word to be programmed FCCOB2 Word 0 program value FCCOB3 Word 1 program value, if desired FCCOB4 Word 2 program value, if desired FCCOB5 Word 3 program value, if desired Upon clearing CCIF to launch the Program EEPROM command, the user-supplied words will be transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index value at Program EEPROM command launch determines how many words will be programmed in the EEPROM block. The CCIF flag is set when the operation has completed. Table 22-64. Program EEPROM Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] < 010 at command launch Set if CCOBIX[2:0] > 101 at command launch ACCERR FSTAT Set if command not available in current mode (see Table 22-28) Set if an invalid global address [23:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) Set if the requested group of words breaches the end of the EEPROM block FPVIOL 22.4.7.16 Set if the selected area of the EEPROM memory is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Erase EEPROM Sector Command The Erase EEPROM Sector operation will erase all addresses in a sector of the EEPROM block. MC9S12ZVC Family Reference Manual , Rev. 1.9 688 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-65. Erase EEPROM Sector Command FCCOB Requirements Register FCCOB0 FCCOB1 FCCOB Parameters 0x12 Global address [23:16] to identify EEPROM block Global address [15:0] anywhere within the sector to be erased. See <st-blue>Section 22.1.2.2 EEPROM Features for EEPROM sector size. Upon clearing CCIF to launch the Erase EEPROM Sector command, the Memory Controller will erase the selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase EEPROM Sector operation has completed. Table 22-66. Erase EEPROM Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch ACCERR FSTAT Set if an invalid global address [23:0] is suppliedsee Table 22-2 Set if a misaligned word address is supplied (global address [0] != 0) FPVIOL 22.4.7.17 Set if command not available in current mode (see Table 22-28) Set if the selected area of the EEPROM memory is protected MGSTAT1 Set if any errors have been encountered during the verify operation MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation Protection Override Command The Protection Override command allows the user to temporarily override the protection limits, either decreasing, increasing or disabling protection limits, on P-Flash and/or EEPROM, if the comparison key provided as a parameter loaded on FCCOB matches the value of the key previously programmed on the Flash Configuration Field (see Table 22-3.). The value of the Protection Override Comparison Key must not be 16'hFFFF, that is considered invalid and if used as argument will cause the Protection Override feature to be disabled. Any valid key value that does not match the value programmed in the Flash Configuration Field will cause the Protection Override feature to be disabled. Current status of the Protection Override feature can be observed on FPSTAT FPOVRD bit (see Section 22.3.2.4, "Flash Protection Status Register (FPSTAT)). Table 22-67. Protection Override Command FCCOB Requirements Register FCCOB0 FCCOB Parameters 0x13 FCCOB1 Protection Update Selection [1:0] See Table 22-68. Comparison Key FCCOB2 reserved New FPROT value FCCOB3 reserved New DFPROT value MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 689 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-68. Protection Override selection description Protection Update Selection code [1:0] Protection register selection bit 0 Update P-Flash protection 0 - keep unchanged (do not update) 1 - update P-Flash protection with new FPROT value loaded on FCCOB bit 1 Update EEPROM protection 0 - keep unchanged (do not update) 1 - update EEPROM protection with new DFPROT value loaded on FCCOB If the comparison key successfully matches the key programmed in the Flash Configuration Field the Protection Override command will preserve the current values of registers FPROT and DFPROT stored in an internal area and will override these registers as selected by the Protection Update Selection field with the value(s) loaded on FCCOB parameters. The new values loaded into FPROT and/or DFPROT can reconfigure protection without any restriction (by increasing, decreasing or disabling protection limits). If the command executes successfully the FPSTAT FPOVRD bit will set. If the comparison key does not match the key programmed in the Flash Configuration Field, or if the key loaded on FCCOB is 16'hFFFF, the value of registers FPROT and DFPROT will be restored to their original contents before executing the Protection Override command and the FPSTAT FPOVRD bit will be cleared. If the contents of the Protection Override Comparison Key in the Flash Configuration Field is left in the erased state (i.e. 16'hFFFF) the Protection Override feature is permanently disabled. If the command execution is flagged as an error (ACCERR being set for incorrect command launch) the values of FPROT and DFPROT will not be modified. The Protection Override command can be called multiple times and every time it is launched it will preserve the current values of registers FPROT and DFPROT in a single-entry buffer to be restored later; when the Protection Override command is launched to restore FPROT and DFPROT these registers will assume the values they had before executing the Protection Override command on the last time. If contents of FPROT and/or DFPROT registers were modified by direct register writes while protection is overridden these modifications will be lost. Running Protection Override command to restore the contents of registers FPROT and DFPROT will not force them to the reset values. MC9S12ZVC Family Reference Manual , Rev. 1.9 690 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) Table 22-69. Protection Override Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != (001, 010 or 011) at command launch. Set if command not available in current mode (see Table 22-28). ACCERR Set if protection is supposed to be restored (if key does not match or is invalid) and Protection Override command was not run previously (bit FPSTAT FPOVRD is 0), so there are no previous valid values of FPROT and DFPROT to be re-loaded. Set if Protection Update Selection[1:0] = 00 (in case of CCOBIX[2:0] = 010 or 011) FSTAT Set if Protection Update Selection[1:0] = 00, CCOBIX[2:0] = 001 and a valid comparison key is loaded as a command parameter. 22.4.8 FPVIOL None MGSTAT1 None MGSTAT0 None Interrupts The Flash module can generate an interrupt when a Flash command operation has completed or when a Flash command operation has detected an ECC fault. Table 22-70. Flash Interrupt Sources Interrupt Source Flash Command Complete ECC Single Bit Fault on Flash Read Global (CCR) Mask Interrupt Flag Local Enable CCIF (FSTAT register) CCIE (FCNFG register) I Bit SFDIF (FERSTAT register) SFDIE (FERCNFG register) I Bit NOTE Vector addresses and their relative interrupt priority are determined at the MCU level. 22.4.8.1 Description of Flash Interrupt Operation The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the Flash command interrupt request. The Flash module uses the SFDIF flag in combination with the SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed description of the register bits involved, refer to Section 22.3.2.5, "Flash Configuration Register (FCNFG)", Section 22.3.2.6, "Flash Error Configuration Register (FERCNFG)", Section 22.3.2.7, "Flash Status Register (FSTAT)", and Section 22.3.2.8, "Flash Error Status Register (FERSTAT)". The logic used for generating the Flash module interrupts is shown in Figure 22-31. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 691 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) CCIE CCIF Flash Command Interrupt Request SFDIE SFDIF Flash Error Interrupt Request Figure 22-31. Flash Module Interrupts Implementation 22.4.9 Wait Mode The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU from wait via the CCIF interrupt (see Section 22.4.8, "Interrupts"). 22.4.10 Stop Mode If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation will be completed before the MCU is allowed to enter stop mode. 22.5 Security The Flash module provides security information to the MCU. The Flash security state is defined by the SEC bits of the FSEC register (see Table 22-10). During reset, the Flash module initializes the FSEC register using data read from the security byte of the Flash configuration field at global address 0xFF_FE0F. The security state out of reset can be permanently changed by programming the security byte assuming that the MCU is starting from a mode where the necessary P-Flash erase and program commands are available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully programmed, its new value will take affect after the next MCU reset. The following subsections describe these security-related subjects: * Unsecuring the MCU using Backdoor Key Access * Unsecuring the MCU in Special Single Chip Mode using BDM * .Mode and Security Effects on Flash Command Availability 22.5.1 Unsecuring the MCU using Backdoor Key Access The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the contents of the backdoor keys (four 16-bit words programmed at addresses 0xFF_FE00-0xFF_FE07). If the KEYEN[1:0] bits are in the enabled state (see <st-blue>Section 22.3.2.2 Flash Security Register (FSEC)), the Verify Backdoor Access Key command (see <st-blue>Section 22.4.7.11 Verify Backdoor Access Key Command) allows the user to present four prospective keys for comparison to the keys stored MC9S12ZVC Family Reference Manual , Rev. 1.9 692 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC register (see Table 22-10) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash memory and EEPROM memory will not be available for read access and will return invalid data. The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an external stimulus. This external stimulus would typically be through one of the on-chip serial ports. If the KEYEN[1:0] bits are in the enabled state (see <st-blue>Section 22.3.2.2 Flash Security Register (FSEC)), the MCU can be unsecured by the backdoor key access sequence described below: 1. Follow the command sequence for the Verify Backdoor Access Key command as explained in <st-blue>Section 22.4.7.11 Verify Backdoor Access Key Command 2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10 The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte (0xFF_FE0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor keys stored in addresses 0xFF_FE00-0xFF_FE07 are unaffected by the Verify Backdoor Access Key command sequence. The Verify Backdoor Access Key command sequence has no effect on the program and erase protections defined in the Flash protection register, FPROT. After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the contents of the backdoor keys by programming addresses 0xFF_FE00-0xFF_FE07 in the Flash configuration field. 22.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM A secured MCU can be unsecured in special single chip mode using an automated procedure described in Section 22.4.7.7.1, "Erase All Pin", For a complete description about how to activate that procedure please look into the Reference Manual. 22.5.3 .Mode and Security Effects on Flash Command Availability The availability of Flash module commands depends on the MCU operating mode and security state as shown in Table 22-28. 22.6 Initialization On each system reset the flash module executes an initialization sequence which establishes initial values for the Flash Block Configuration Parameters, the FPROT and DFPROT protection registers, and the FOPT and FSEC registers. The initialization routine reverts to built-in default values that leave the module MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 693 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) in a fully protected and secured state if errors are encountered during execution of the reset sequence. If a double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set. CCIF is cleared throughout the initialization sequence. The Flash module holds off all CPU access for a portion of the initialization sequence. Flash reads are allowed once the hold is removed. Completion of the initialization sequence is marked by setting CCIF high which enables user commands. If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. MC9S12ZVC Family Reference Manual , Rev. 1.9 694 NXP Semiconductors Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 695 Chapter 22 192 KB Flash Module (S12ZFTMRZ192K2KV2) MC9S12ZVC Family Reference Manual , Rev. 1.9 696 NXP Semiconductors Appendix A MCU Electrical Specifications Revision History A.1 Rev. No. (Item No.) Date (Submitted By) Rev 1.0 19-January-2015 Substantial Change(s) * Initial Release for Publication on nxp.com General This supplement contains the most accurate electrical information for the MC9S12ZVC-Family available at the time of publication. A.1.1 Power Pins MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 697 Appendix A MCU Electrical Specifications Table A-1. Power Supplies Mnemonic Nominal Voltage VSS 0V Ground pin for 1.8V core supply voltage generated by on chip voltage regulator 5.0 V 5V power supply output for I/O drivers generated by on chip voltage regulator VSSX1 0V Ground pin for I/O drivers VDDX2 5.0 V VSSX2 0V VDDA 5.0 V VSSA 0V VSUP 12 V/18 V VDDC 5V Power supply for CANPHY VSSC 0V Ground pin for CANPHY VDDX1/ 1 1 Description 5V power supply output for I/O drivers generated by on chip voltage regulator Ground pin for I/O drivers 5V Power supply for the analog-to-digital converter and for the reference circuit of the internal voltage regulator Ground pin for VDDA analog supply External power supply for voltage regulator All VDDX pins are internally connected by metal VDDA is connected to VDDX1 and VDDX2 pins by diodes for ESD protection such that VDDX must not exceed VDDA by more than a diode voltage drop. VSSA and VSSX1 and VSSX2 are connected by anti-parallel diodes for ESD protection. A.1.2 Pins There are 4 groups of functional pins. A.1.2.1 General Purpose I/O Pins (GPIO) The I/O pins have a level in the VDDX/VDDA range. This class of pins is comprised of all port I/O pins, BKGD and the RESET pins. A.1.2.2 High Voltage Pins These consist of the VSUP, BCTL, BCTLC, CANH, CANL, SPLIT and PL[1:0] pins. These pins are intended to interface to external components operating in the automotive battery range. They have nominal voltages above the standard 5V I/O voltage range. A.1.2.3 Oscillator If the designated EXTAL and XTAL pins are configured for external oscillator operation then these pins have a nominal voltage of 1.8 V. MC9S12ZVC Family Reference Manual , Rev. 1.9 698 NXP Semiconductors Appendix A MCU Electrical Specifications A.1.2.4 TEST This pin is used for production testing only. The TEST pin must be tied to ground in all applications. A.1.3 Current Injection Power supply must maintain regulation within operating VDDX or VDD range during instantaneous and operating maximum current conditions. Figure A-1. shows a 5 V GPIO pad driver and the on chip voltage regulator with VDDX output. It shows also the power and ground pins VSUP, VDDX, VSSX and VSSA. Px represents any 5 V GPIO pin. Assume Px is configured as an input. The pad driver transistors P1 and N1 are switched off (high impedance). If the voltage Vin on Px is greater than VDDX a positive injection current Iin will flow through diode D1 into VDDX node. If this injection current Iin is greater than ILoad, the internal power supply VDDX may go out of regulation. Ensure the external VDDX load will shunt current greater than maximum injection current. This is the greatest risk when the MCU is not consuming power; e.g., if no system clock is present, or if the clock rate is very low which would reduce overall power consumption. Figure A-1. Current Injection on GPIO Port if Vin > VDDX VSUP Voltage Regulator VBG + ISUP P2 Pad Driver IDDX VDDX ILoad C Load Iin P1 D1 Iin N1 Px Vin > VDDX VSSX VSSA A.1.4 Absolute Maximum Ratings Absolute maximum ratings are stress ratings only. A functional operation outside these ranges is not guaranteed. Stress beyond these limits may affect the reliability or cause permanent damage of the device. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 699 Appendix A MCU Electrical Specifications This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level. Table A-2. Absolute Maximum Ratings Num Rating Symbol Min Max Unit 1 Voltage regulator supply voltage VSUP -0.3 42 V 2 High voltage inputs PL[1:0] input voltage VLx -27 42 V 3 Voltage Regulator Ballast Connection VBCTL -0.3 42 V 4 Supplies VDDA, VDDC, VDDX VVDDACX -0.3 6 V 5 Base connection of bipolar for CANPHY supply VBCTLC -0.3 42 V 6 Voltage difference VDDX to VDDA1 VDDX -0.1 0.1 V 7 Voltage difference VSSX to VSSA VSSX -0.3 0.3 V 8 Digital I/O input voltage VIN -0.3 6.0 V VILV -0.3 2.16 V VTEST -0.3 10.0 V ID -25 +25 mA IPP0456 -30 +80 mA 2 9 EXTAL, XTAL 10 TEST input 11 Instantaneous current. Single pin limit for all digital I/O pins3 12 Instantaneous maximum current on PP0,PP4,PP5 & PP6 13 Instantaneous maximum current on PP2 IPP2 -80 +25 mA 14 Instantaneous maximum current. Single pin limit for EXTAL, XTAL I -25 +25 mA 15 Storage temperature range Tstg -65 155 C DL 1 VDDX and VDDA must be shorted EXTAL, XTAL pins configured for external oscillator operation only 3 All digital I/O pins are internally clamped to V SSX and VDDX, or VSSA and VDDA. 2 A.1.5 ESD Protection and Latch-up Immunity All ESD testing is in conformity with CDF-AEC-Q100 stress test qualification for automotive grade integrated circuits. During the device qualification ESD stresses were performed for the Human Body Model (HBM) and the Charged-Device Model. A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification. MC9S12ZVC Family Reference Manual , Rev. 1.9 700 NXP Semiconductors Appendix A MCU Electrical Specifications Table A-3. ESD and Latch-up Test Conditions Model Human Body ChargedDevice Spec JESD22-A114 JESD22-C101 Description Symbol Value Unit Series Resistance R 1500 Storage Capacitance C 100 pF Number of Pulse per pin positive negative - 1 1 Series Resistance R 0 Storage Capacitance C 4 pF Latch-up for 5V GPIOs Minimum Input Voltage Limit -2.5 V Maximum Input Voltage Limit +7.5 V Latch-up for BCTL/BCTLC/ CANH/CANL /SPLIT Minimum Input Voltage Limit -7 V Maximum Input Voltage Limit +21 V Table A-4. ESD Protection and Latch-up Characteristics Num Symbol Min Max Unit Human Body Model (HBM): -all pins except CANH/CANL/SPLIT/HVI -CANH/CANL/SPLIT/HVI VHBM +/-2 +/-4 - KV 2 Charged-Device Model (CDM): Corner Pins VCDM +/-750 - V 3 Charged-Device Model (CDM): all other pins VCDM +/-500 - V 4 Direct Contact Discharge IEC61000-4-2 with and without 220nF capacitor (R=330, C=150pF) CANL and CANH VESDIEC +/-6 Latch-up Current of 5V GPIOs at T=125C positive negative ILAT +100 -100 - mA Latch-up Current of 5V GPIOs at 27C positive negative ILAT +200 -200 - mA 1 5 6 A.1.6 Rating KV Operating Conditions This section describes the operating conditions of the device. Unless otherwise noted these conditions apply to the following electrical parameters. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 701 Appendix A MCU Electrical Specifications NOTE Please refer to the temperature rating of the device with regards to the ambient temperature TA and the junction temperature TJ. For power dissipation calculations refer to Section A.1.7, "Power Dissipation and Thermal Characteristics". Table A-5. Operating Conditions Num Rating Symbol Min Typ Max Unit 1 Voltage regulator supply voltage1 VSUP 3.5 12 40 V 2 Voltage difference VDDX to VDDA VDDX -0.1 -- 0.1 V 3 Voltage difference VSSX to VSSA VSSX -0.3 -- 0.3 V 4 Oscillator fosc 4 -- 20 MHz 5 Bus frequency2 TJ < 150C 150C < TJ< 175C (Temp option W only) fbus 4 -- -- 32 24 MHz fWSTAT -- -- 25 MHz 6 Bus frequency without wait states 7a Operating junction temperature range Operating ambient temperature range3 (option C) T J TA -40 -40 -- -- 105 85 C 7b Operating junction temperature range Operating ambient temperature range3 (option V) T J TA -40 -40 -- -- 125 105 C 7c Operating junction temperature range Operating ambient temperature range3 (option M) TJ TA -40 -40 -- -- 150 125 C 7d Operating junction temperature range Operating ambient temperature range3 (option W) TJ TA -40 -40 -- -- 175 150 C 1 Normal operating range is 5.5 V - 18 V. Continuous operation at 40 V is not allowed. Only Transient Conditions (Load Dump) single pulse tmax<400 ms. Operation down to 3.5V is guaranteed without reset, however some electrical parameters are specified only in the range above 4.5 V. 2 The flash program and erase operations must configure f NVMOP as specified in the NVM electrical section. 3 Please refer to Section A.1.7, "Power Dissipation and Thermal Characteristics" for more details about the relation between ambient temperature TA and device junction temperature TJ. 4 Refer to f ATDCLK for minimum ADC operating frequency. This is derived from the bus clock. NOTE Operation is guaranteed when powering down until low voltage reset assertion. MC9S12ZVC Family Reference Manual , Rev. 1.9 702 NXP Semiconductors Appendix A MCU Electrical Specifications A.1.7 Power Dissipation and Thermal Characteristics Power dissipation and thermal characteristics are closely related. The user must assure that the maximum operating junction temperature is not exceeded. The average chip-junction temperature (TJ) in C can be obtained from: T = T + P J A D JA T = Junction Temperature, [C J T = Ambient Temperature, [C A P = Total Chip Power Dissipation, [W] D = Package Thermal Resistance, [C/W] JA The total power dissipation PD can be calculated from the equation below. Table A-6 below lists the power dissipation components. Table A-6 gives an overview of the supply currents. PD = PVSUP + PBCTL + PINT - PGPIO + PCANPHY Table A-6. Power Dissipation Components Power Component Description PVSUP = VSUP ISUP Internal Power through VSUP pin PBCTL = VBCTL IBCTL Internal Power through BCTL pin PINT = VDDX IVDDX + VDDA IVDDA Internal Power through VDDX/A pins. PGPIO = VI/O II/O Power dissipation of external load driven by GPIO Port. Assuming the load is connected between GPIO and ground. This power component is included in PINT and is subtracted from overall MCU power dissipation PD PCANPHY = [VDDC -(VCANH - VCANL)] IVDDC Power dissipation of CANPHY MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 703 Appendix A MCU Electrical Specifications Figure A-2. Supply Currents Overview MC9S12ZVC-Family VBAT ISUP IRBATP GND IDDC VSUP VDDC BCTL CANH VDDA IVDDX VDDX1 SPLIT VCANH - VCANL VDDX2 CANL VSSX1 II/O IEVDD EVDD1 VDDX GPIO RL1 RL2 VI/O MC9S12ZVC Family Reference Manual , Rev. 1.9 704 NXP Semiconductors Appendix A MCU Electrical Specifications Table A-7. Thermal Package Characteristics Num Rating Symbol Min Typ Max Unit 64 LQFP-EP 1 1 Thermal resistance 64LQFP-EP, single sided PCB Natural Convection JA -- 64 -- C/W 2 Thermal resistance 64LQFP-EP, double sided PCB2 with 2 internal planes. Natural Convection. JA -- 30 -- C/W 3 Thermal resistance 64LQFP-EP, single sided PCB2 (@200 ft./min) JA -- 51 -- C/W 4 Thermal resistance 64LQFP-EP, double sided PCB2 with 2 internal planes (@200 ft./min). JA -- 24 -- C/W 5 Junction to Board 64LQFP-EP3 JB -- 13 -- C/W 6 Junction to Case Top 64LQFP-EP4 JCtop -- 16 -- C/W 7 Junction to Case Bottom 64LQFP-EP5 JCbottom -- 1.6 -- C/W 8 6 JT -- 4 -- C/W Junction to Package Top 64LQFP-EP 48 LQFP 9 Thermal resistance 48LQFP, single sided PCB1 Natural Convection JA -- 70 -- C/W 10 Thermal resistance 48LQFP, double sided PCB2 with 2 internal planes. Natural Convection. JA -- 46 -- C/W 11 Thermal resistance 48LQFP, single sided PCB2 (@200 ft./min) JA -- 58 -- C/W 12 Thermal resistance 48LQFP, double sided PCB2 with 2 internal planes (@200 ft./min). JA -- 40 -- C/W 13 Junction to Board 48LQFP3 JB -- 23 -- C/W 14 Junction to Case Top 48LQFP4 JCtop -- 16 -- C/W JT -- 2 -- C/W 15 1 2 3 4 5 6 Junction to Package Top 48LQFP 6 Junction to ambient thermal resistance, JA was simulated to be equivalent to JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal. Junction to ambient thermal resistance, JA was simulated to be equivalent to the JEDEC specification JESD51-6 with the board (JESD51-7) horizontal. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). Thermal resistance between the die and the solder pad on the bottom of the package based on simulation without any interface resistance Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 705 Appendix A MCU Electrical Specifications A.1.8 I/O Characteristics This section describes the characteristics of I/O pins. Table A-8. 5V I/O Characteristics (Junction Temperature From -40C To +175C) Conditions are 4.5 V < VDDX< 5.5 V , unless otherwise noted. I/O Characteristics for all GPIO pins (defined in A.1.2.1/A-698). Num Rating /Classification Symbol Min Typ Max Unit 0.65*VDDX -- -- V 1 Input high voltage V 2 Input high voltage VIH -- -- VDDX+0.3 V 3 Input low voltage VIL -- -- 0.35*VDDX V 4 Input low voltage VIL VSSX-0.3 -- -- V 5 Input hysteresis VHYS -- 250 -- mV 6 Input leakage current (All GPIO except PAD3,PP0,PP2,PP4,PP5 and PP6, Pins in high impedance input mode)1 V = V or V Iin -1 -- 1 A 7 Input leakage current PAD3,PP0,PP2,PP4,PP5 and PP6, Pins in high impedance input mode)2 V = V or VSSX in DDX Iin -2.5 -- 2.5 A IH in DDX SSX MC9S12ZVC Family Reference Manual , Rev. 1.9 706 NXP Semiconductors Appendix A MCU Electrical Specifications Table A-8. 5V I/O Characteristics (Junction Temperature From -40C To +175C) Conditions are 4.5 V < VDDX< 5.5 V , unless otherwise noted. I/O Characteristics for all GPIO pins (defined in A.1.2.1/A-698). 8 Output high voltage (All GPIO except PP0,PP2,PP4,PP5 and PP6) IOH = -4 mA VOH VDDX - 0.8 -- -- V 9 Output low voltage (All GPIO except PP0, PP2, PP4, PP5 and PP6) IOL = +4mA V -- -- 0.8 V V VDDX - 0.8 VDDX - 0.2 VDDX - 0.1 -- -- -- -- -- -- V -- -- 0.8 Iin -2.5 -- 2.5 A IOCD -80 -- -40 mA IPP -20 -- 10 mA OL I/O Characteristic PP2 10 11 V Output high voltage Partial Drive IOH = -2mA IOH = -15mA IOH = -10mA OH Output low voltage Partial drive IOL = +2mA Full drive IOL = +20mA V OL 12 Input leakage current (pin in high impedance input mode)3 Vin = VDDX or VSSX 13 Over-current Detect Threshold 14 Maximum allowed continous current I/O Characteristic PP0, PP4, PP5, PP6 15 16 Output high voltage Partial Drive IOH = -2mA Full Drive IOH = -18mA V VDDX -0.8 -- -- Output low voltage Partial drive IOL = +2mA Full drive IOL = +20mA V -- -- -- -- 0.8 0.25 Iin -2.5 -- 2.5 A IOCD 40 -- 80 mA IPP -10 -- 25 mA V OH V OL 17 Input leakage current (pin in high impedance input mode) V =V or VSSX in DDX 18 Over-current Detect Threshold 19 Maximum allowed continous current 20 Internal pull up current (All GPIO except RESET) VIH min > input voltage > VIL max IPUL -10 -- -130 A 21 Internal pull up resistance (RESET pin) RPUL 2.5 5 10 K 22 Internal pull down current VIH min > input voltage > VIL max IPDH 10 -- 130 A 23 Input capacitance Cin -- 7 -- pF 24 Injection current4 Single pin limit Total device limit, sum of all injected currents IICS IICP -2.5 -25 -- mA 2.5 25 1 Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each 8C to 12C in the temperature range from 50C to 125C. 2 Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each 8C to 12C in the temperature range from 50C to 125C. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 707 Appendix A MCU Electrical Specifications 3 Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each 8C to 12C in the temperature range from 50C to 125C. 4 For sake of ADC conversion accuracy, the application should avoid to inject any current into pins PAD3/VREFH. Refer to Section A.1.3, "Current Injection" for more details. This following tables describe the timing characteristics of I/O pins. Table A-9. Pin Timing Characteristics (Junction Temperature From -40C To +175C) Conditions are 4.5 V < VDDX< 5.5 V unless otherwise noted. I/O Characteristics for all GPIO pins (defined in A.1.2.1/A-698). Num 1 Rating Symbol Min Typ Max Unit 1 Port P, S, AD, L interrupt input pulse filtered 1 tP_MASK -- -- 3 s 2 Port P, S, AD, L interrupt input pulse passed 1 tP_PASS 10 -- -- s 3 Port P, S, AD, L interrupt input pulse filtered in number of bus clock cycles of period 1/fbus nP_MASK -- -- 3 4 Port P, S, AD, L interrupt input pulse passed in number of bus clock cycles of period 1/fbus nP_PASS 4 -- -- 5 IRQ pulse width, edge-sensitive mode in number of bus clock cycles of period 1/fbus nIRQ 1 -- -- 6 RESET pin input pulse filtered RP_MASK -- -- 12 ns 7 RESET pin input pulse passed RP_PASS 22 -- -- ns Parameter only applies in stop or pseudo stop mode. A.1.9 Supply Currents This section describes the current consumption characteristics of the device as well as the conditions for the measurements. A.1.9.1 Measurement Conditions Current is measured on VSUP. VDDX is connected to VDDA. It does not include the current to drive external loads. Unless otherwise noted the currents are measured in special single chip mode and the CPU code is executed from RAM. For Run and Wait current measurements PLL is on and the reference clock is the IRC1M trimmed to 1MHz. For the junction temperature range from -40C to +150C the bus frequency is 32MHz. Table A-10, Table A-11 and Table A-12 show the configuration of the CPMU module and the peripherals for Run, Wait and Stop current measurement. Table A-10. CPMU Configuration for Pseudo Stop Current Measurement CPMU REGISTER Bit settings/Conditions CPMUCLKS PLLSEL=0, PSTP=1, CSAD=0, PRE=PCE=RTIOSCSEL=1 COPOSCSEL[1:0]=01 MC9S12ZVC Family Reference Manual , Rev. 1.9 708 NXP Semiconductors Appendix A MCU Electrical Specifications Table A-10. CPMU Configuration for Pseudo Stop Current Measurement CPMU REGISTER Bit settings/Conditions CPMUOSC OSCE=1, Quartz oscillator fEXTAL=4MHz CPMURTI RTDEC=0, RTR[6:4]=111, RTR[3:0]=1111 CPMUCOP WCOP=1, CR[2:0]=111 Table A-11. CPMU Configuration for Run/Wait and Full Stop Current Measurement CPMU REGISTER Bit settings/Conditions CPMUSYNR VCOFRQ[1:0]= 1,SYNDIV[5:0] = 31 CPMUPOSTDIV POSTDIV[4:0]=0 CPMUCLKS PLLSEL=1, CSAD=0 CPMUOSC OSCE=0, Reference clock for PLL is fref=firc1m trimmed to 1MHz API settings for STOP current measurement CPMUAPICTL APIEA=0, APIFE=1, APIE=0 CPMUACLKTR trimmed to >=20Khz CPMUAPIRH/RL set to 0xFFFF Table A-12. Peripheral Configurations for Run and Wait Current Measurement Peripheral Configuration SCI Continuously transmit data (0x55) at speed of 19200 baud SPI Configured to master mode, continuously transmit data (0x55) at 1Mbit/s ACMP0 & 1 The module is enabled and the plus & minus inputs are toggling with 0-1 and 1-0 at 1MHz DAC The module is enabled in buffered mode at full voltage range ADC The peripheral is configured to operate at its maximum specified frequency and to continuously convert voltages on a single input channel MSCAN The module is connected to CANPHY and continously transmit data (0x55 or 0xAA) with a bit rate of 500kbit/s. CANPHY The module is enabled and connect to MSCAN module IIC Operate in master mode and contiously transmit data (0x55 or 0xAA) at the bit rate of 100Kbit/s PWM0 The module is configured with a modulus rate of 10 kHz PWM1 The module is configured with a modulus rate of 10 kHz MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 709 Appendix A MCU Electrical Specifications Table A-12. Peripheral Configurations for Run and Wait Current Measurement Peripheral Configuration TIM0 Channel 7:4 are configured to output compare mode, channel 3:0 are configured to input capture mode channel 1:0 connected to SENTTX, channel 2 connected to ACLK and channel 3 connected to RXD0 TIM1 Channel 3:0 are configured to output compare mode SENT Continously transmit data 0 at maximum rate COP & RTI Enabled BATS Enabled Table A-13. Run and Wait Current Characteristics Conditions see Table A-11 and Table A-12, VSUP=18 V Num Rating Symbol Min Typ Max Unit 1 Run Current, -40C < TJ < 150C, fbus= 32MHz ISUPR -- 25 35 mA 2 Wait Current, -40C < TJ < 150C, fbus= 32MHz ISUPW -- 18 25 mA Min Typ Max Unit Table A-14. Stop Current Characteristics Conditions are: VSUP=18 V Rating1 Num Symbol Stop Current all modules off 1 TA = TJ= -40C ISUPS -- 16 30 A 2 TA = TJ= 150C ISUPS -- 200 1600 A 3 TA = TJ= 175C ISUPS -- -- 2200 A 4 TA = TJ = 25C ISUPS -- 18 -- A 5 TA = TJ = 85C ISUPS -- 41 120 A 6 TA = TJ = 105C ISUPS -- 73 210 A -- 23 -- A Stop Current API enabled 7 1 TA = TJ = 25C ISUPS If MCU is in STOP long enough then TA = TJ . Die self heating due to stop current can be ignored. Table A-15. Pseudo Stop Current Characteristics Conditions are: VSUP=12V, API, COP & RTI enabled Num 1 A.1.10 Rating TJ = 25C Symbol Min Typ Max Unit ISUPPS -- 270 -- A ADC Calibration Configuration The reference voltage VBG is measured under the conditions shown in Table A-16. The values stored in the IFR are the average of eight consecutive conversions at Tj=150 C and eight consecutive conversions MC9S12ZVC Family Reference Manual , Rev. 1.9 710 NXP Semiconductors Appendix A MCU Electrical Specifications at Tj=-40 C. The code is executed from RAM. The result is programmed to the IFR, otherwise there is no flash activity. Table A-16. Measurement Conditions Description Symbol Max Unit Regulator Supply Voltage at VSUP VSUP 5 V Supply Voltage at VDDX and VDDA VDDX,A 5 V ADC reference voltage high VRH 5 V ADC reference voltage low VRL 0 V ADC clock fATDCLK 2 MHz ADC sample time tSMP 4 ADC clock cycles Bus clock frequency fbus 48 MHz Junction temperature Tj -40 and 150 C MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 711 Appendix A MCU Electrical Specifications MC9S12ZVC Family Reference Manual , Rev. 1.9 712 NXP Semiconductors Appendix B ADC Electrical Specifications Appendix B ADC Electrical Specifications This section describes the characteristics of the analog-to-digital converter. B.1 ADC Operating Characteristics The Table B-1 shows conditions under which the ADC operates. The following constraints exist to obtain full-scale, full range results: VSSA VRLVINVRHVDDA This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that it ties to. If the input level goes outside of this range it will effectively be clipped. Table B-1. ADC Operating Characteristics Supply voltage 4.5 V < VDDA < 5.5 V, Junction Temperature From -40oC To +175oC Num 1 Rating Reference potential Low High Symbol Min Typ Max Unit VRL VRH VSSA VDDA/2 -- -- VDDA/2 VDDA V V 2 Voltage difference VDDX to VDDA VDDX -0.1 0 0.1 V 3 Voltage difference VSSX to VSSA VSSX -0.1 0 0.1 V VRH-VRL 3.13 5.0 5.5 V 1 4 Differential reference voltage 5a ADC Clock Frequency (derived from bus clock via the prescaler). Junction temperature from -40oC to +150oC fATDCLK 0.25 -- 8.33 MHz 5b ADC Clock Frequency (derived from bus clock via the prescaler). Junction temperature from 150oC to +175oC fATDCLK 0.25 -- 6.67 MHz 6 Buffer amplifier turn on time (delay after module start/recovery from Stop mode) tREC -- -- 1 s 7 ADC disable time tDISABLE -- -- 3 bus clock cycles 8 ADC Conversion Period 2 12 bit resolution: 10 bit resolution: 8 bit resolution: NCONV12 NCONV10 NCONV8 19 18 16 -- -- -- 39 38 36 ADC clock cycles 1 Full accuracy is not guaranteed when differential voltage is less than 4.50 V The minimum time assumes a sample time of 4 ATD clock cycles. The maximum time assumes a sample time of 24 ATD clock cycles. 2 B.1.1 Factors Influencing Accuracy Source resistance, source capacitance and current injection have an influence on the accuracy of the ADC .Figure B-1. A further factor is that PortAD pins that are configured as output drivers switching. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 713 Appendix B ADC Electrical Specifications B.1.1.1 Port AD Output Drivers Switching PortAD output drivers switching can adversely affect the ADC accuracy whilst converting the analog voltage on other PortAD pins because the output drivers are supplied from the VDDA/VSSA ADC supply pins. Although internal design measures are implemented to minimize the effect of output driver noise, it is recommended to configure PortAD pins as outputs only for low frequency, low load outputs. The impact on ADC accuracy is load dependent and not specified. The values specified are valid under condition that no PortAD output drivers switch during conversion. B.1.1.2 Source Resistance Due to the input pin leakage current as specified in conjunction with the source resistance there will be a voltage drop from the signal source to the ADC input. The maximum source resistance RS specifies results in an error (10-bit resolution) of less than 1/2 LSB (2.5 mV) at the maximum leakage current. If device or operating conditions are less than worst case or leakage induced error is acceptable, larger values of source resistance of up to 10Kohm are allowed. B.1.1.3 Source Capacitance When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due to charge sharing with the external capacitance and the pin capacitance. For a maximum sampling error of the input voltage 1LSB (10-bit resolution), then the external filter capacitor, Cf 1024 * (CINS-CINN). B.1.1.4 Current Injection There are two cases to consider. 1. A current is injected into the channel being converted. The channel being stressed has conversion values of 0x3FF (in 10-bit mode) for analog inputs greater than VRH and 0x000 for values less than VRL unless the current is higher than specified as a disruptive condition. 2. Current is injected into pins in the neighborhood of the channel being converted. A portion of this current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy of the conversion depending on the source resistance. The additional input voltage error on the converted channel can be calculated as: VERR = K * RS * IINJ with IINJ being the sum of the currents injected into the two pins adjacent to the converted channel. MC9S12ZVC Family Reference Manual , Rev. 1.9 714 NXP Semiconductors Appendix B ADC Electrical Specifications Table B-2. ADC Electrical Characteristics (Junction Temperature From -40C To +175C) Supply voltage 3.13 V < VDDA < 5.5 V Num Rating Symbol Min Typ Max Unit RS -- -- 1 K 1 Max input source resistance 2 Total input capacitance Non sampling Total input capacitance Sampling CINN CINS -- -- -- -- 10 16 pF 3 Input internal Resistance RINA - 5 15 k 4 Disruptive analog input current INA -2.5 -- 2.5 mA 5 Coupling ratio positive current injection Kp -- -- 1E-4 A/A 6 Coupling ratio negative current injection Kn -- -- 5E-3 A/A VDDA direct sampling time is 2 to 22 adc clock cycles of 0.25MHz to 8.34MHz -> 88s >= tsample >= 240ns Ileakp < 1A sampling via buffer amp 2 adc clock cycles 920 < Rpathdirect < 9.9K (incl parasitics) PAD00PAD08 + Ileakn < 1A - Ctop 3.7pF < S/H Cap < 6.2pF (incl parasitics) Cstray < 1.8pF VSSA Cbottom connected to low ohmic supply during sampling Switch resistance depends on input voltage, corner ranges are shown. Tjmax=150oC Leakage current is guaranteed by specification. Figure B-1. B.1.2 ADC Accuracy Table B-3. specifies the ADC conversion performance excluding any errors due to current injection, input capacitance and source resistance. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 715 Appendix B ADC Electrical Specifications B.1.2.1 ADC Accuracy Definitions For the following definitions see also Figure B-2.. Differential non-linearity (DNL) is defined as the difference between two adjacent switching steps. V -V i i-1 DNL i = --------------------------- - 1 1LSB The integral non-linearity (INL) is defined as the sum of all DNLs: n INL n = V -V n 0 DNL i = --------------------- - n 1LSB i=1 MC9S12ZVC Family Reference Manual , Rev. 1.9 716 NXP Semiconductors Appendix B ADC Electrical Specifications DNL Vi-1 10-Bit Absolute Error Boundary LSB Vi $3FF 8-Bit Absolute Error Boundary $3FE $3FD $FF $3FC $3FB $3FA $3F9 $FE $3F8 $3F7 $3F6 $3F5 10-Bit Resolution $3F3 9 Ideal Transfer Curve 2 8 8-Bit Resolution $FD $3F4 7 10-Bit Transfer Curve 6 5 1 4 3 8-Bit Transfer Curve 2 1 0 5 10 15 20 25 30 35 40 45 55 60 65 70 75 80 85 90 5000 + 95 100 105 110 115 120 Vin mV Figure B-2. ADC Accuracy Definitions MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 717 Appendix B ADC Electrical Specifications Table B-3. ADC Conversion Performance 5 V range (Junction Temperature From -40C To +175C) Supply voltage 4.5 < VDDA < 5.5V, 4.5V < VREF < 5.5 V. fADCCLK = 8.0 MHz The values are tested to be valid with no PortAD output drivers switching simultaneous with conversions. Rating1 Num 1 2 Symbol Min Typ Max Unit 1 Resolution (VREF=5.12V) 12-Bit LSB -- 1.25 -- mV 2 Differential Nonlinearity 12-Bit DNL -4 2 4 counts 3 Integral Nonlinearity 12-Bit INL -5 2.5 5 counts 4 Absolute Error2 12-Bit AE -7 4 7 counts 5 Resolution (VREF=5.12V) 10-Bit LSB -- 5 -- mV 6 Differential Nonlinearity 10-Bit DNL -1 0.5 1 counts 7 Integral Nonlinearity 10-Bit INL -2 1 2 counts 8 Absolute Error<st-blue>2 10-Bit AE -3 2 3 counts 9 Resolution (VREF=5.12V) 8-Bit LSB -- 20 -- mV 10 Differential Nonlinearity 8-Bit DNL -0.5 0.3 0.5 counts 11 Integral Nonlinearity 8-Bit INL -1 0.5 1 counts 12 Absolute Error<st-blue>2 8-Bit AE -1.5 1 1.5 counts The 8-bit and 10-bit mode operation is structurally tested in production test. Absolute values are tested in 12-bit mode. These values include the quantization error which is inherently 1/2 count for any A/D converter. MC9S12ZVC Family Reference Manual , Rev. 1.9 718 NXP Semiconductors Appendix C MSCAN Electrical Specifications Table C-1. MSCAN Wake-up Pulse Characteristics (Junction Temperature From -40C To +175C) Conditions are 4.5 V < VDDX< 5.5 V, unless otherwise noted. Num Rating Symbol Min Typ Max Unit 1 MSCAN wake-up dominant pulse filtered tWUP -- -- 1.5 s 2 MSCAN wake-up dominant pulse pass tWUP 5 -- -- s MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 719 Appendix C MSCAN Electrical Specifications MC9S12ZVC Family Reference Manual , Rev. 1.9 720 NXP Semiconductors Appendix D SPI Electrical Specifications Appendix D SPI Electrical Specifications This section provides electrical parametrics and ratings for the SPI. In Figure D-1. the measurement conditions are listed. Figure D-1. Measurement Conditions Description Value Unit full drive mode -- 50 pF (35% / 65%) VDDX V Drive mode Load capacitance on all outputs CLOAD1, Thresholds for delay measurement points 1Timing D.0.1 specified for equal load on all SPI output pins. Avoid asymmetric load. Master Mode In Figure D-2. the timing diagram for master mode with transmission format CPHA=0 is depicted. SS1 (OUTPUT) 2 1 SCK (CPOL 0) (OUTPUT) 5 12 13 3 6 MSB IN2 10 MOSI (OUTPUT) 13 4 SCK (CPOL 1) (OUTPUT) MISO (INPUT) 12 4 BIT 6 . . . 1 LSB IN 9 MSB OUT2 BIT 6 . . . 1 11 LSB OUT 1. If enabled. 2. LSBFE = 0. For LSBFE = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure D-2. SPI Master Timing (CPHA=0) In Figure D-3. the timing diagram for master mode with transmission format CPHA=1 is depicted. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 721 Appendix D SPI Electrical Specifications SS1 (OUTPUT) 1 2 SCK (CPOL 0) (OUTPUT) 4 SCK (CPOL 1) (OUTPUT) 5 MISO (INPUT) 4 12 13 12 13 6 MSB IN2 BIT 6 . . . 1 LSB IN 11 9 MOSI (OUTPUT) 3 MASTER MSB OUT2 BIT 6 . . . 1 MASTER LSB OUT 1. If enabled. 2. LSBFE = 0. For LSBFE = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure D-3. SPI Master Timing (CPHA=1) In Table D-1. the timing characteristics for master mode are listed. Table D-1. SPI Master Mode Timing Characteristics (Junction Temperature From -40C To +175C) Num Characteristic Symbol Min Typ Max Unit SCK Frequency fsck 1/2048 -- 12 fbus 1 SCK Period tsck 2 -- 2048 tbus 2 Enable Lead Time tlead -- 1/2 -- tsck 3 Enable Lag Time tlag -- 1/2 -- tsck 4 Clock (SCK) High or Low Time twsck -- 1/2 -- tsck 5 Data Setup Time (Inputs) tsu 8 -- -- ns 6 Data Hold Time (Inputs) thi 8 -- -- ns 9 Data Valid after SCK Edge tvsck -- -- 15 ns 10 Data Valid after SS fall (CPHA=0) tvss -- -- 15 ns 11 Data Hold Time (Outputs) tho 0 -- -- ns 12 Rise and Fall Time Inputs trfi -- -- 8 ns 13 Rise and Fall Time Outputs trfo -- -- 8 ns 1 D.0.2 Slave Mode In Figure D-4. the timing diagram for slave mode with transmission format CPHA=0 is depicted. MC9S12ZVC Family Reference Manual , Rev. 1.9 722 NXP Semiconductors Appendix D SPI Electrical Specifications SS (INPUT) 1 12 13 12 13 3 SCK (CPOL 0) (INPUT) 4 2 SCK (CPOL 1) (INPUT)10 4 8 7 MISO (OUTPUT) 9 see note BIT 6 . . . 1 SLAVE MSB 5 11 11 SLAVE LSB OUT see note 6 MOSI (INPUT) BIT 6 . . . 1 MSB IN LSB IN NOTE: Not defined! Figure D-4. SPI Slave Timing (CPHA=0) In Figure D-5. the timing diagram for slave mode with transmission format CPHA=1 is depicted. SS (INPUT) 3 1 2 SCK (CPOL 0) (INPUT) 4 SCK (CPOL 1) (INPUT) 4 see note 7 MOSI (INPUT) SLAVE 13 12 13 11 9 MISO (OUTPUT) 12 MSB OUT 5 BIT 6 . . . 1 8 SLAVE LSB OUT 6 MSB IN BIT 6 . . . 1 LSB IN NOTE: Not defined! Figure D-5. SPI Slave Timing (CPHA=1) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 723 Appendix D SPI Electrical Specifications In Table D-2. the timing characteristics for slave mode are listed. Table D-2. SPI Slave Mode Timing Characteristics (Junction Temperature From -40C To +175C) Num Characteristic Symbol Min Typ Max Unit 1 SCK Frequency fsck DC -- 14 fbus 1 SCK Period tsck 4 -- tbus 2 Enable Lead Time tlead 4 -- -- tbus 3 Enable Lag Time tlag 4 -- -- tbus 4 Clock (SCK) High or Low Time twsck 4 -- -- tbus 5 Data Setup Time (Inputs) tsu 8 -- -- ns 6 Data Hold Time (Inputs) thi 8 -- -- ns 7 Slave Access Time (time to data active) ta -- -- 20 ns 8 Slave MISO Disable Time tdis -- -- 22 ns 1 ns 9 Data Valid after SCK Edge tvsck -- -- 30 + tbus 10 Data Valid after SS fall tvss -- -- 30 + tbus 1 ns 11 Data Hold Time (Outputs) tho 20 -- -- ns Rise and Fall Time Inputs trfi -- -- 8 ns Rise and Fall Time Outputs trfo -- -- 8 ns 12 13 1t bus added due to internal synchronization delay MC9S12ZVC Family Reference Manual , Rev. 1.9 724 NXP Semiconductors Appendix E CPMU Electrical Specifications (VREG, OSC, IRC, PLL) E.1 VREG Electrical Specifications Table E-1. Voltage Regulator Electrical Characteristics (Junction Temperature From -40C To +175C) VDDA and VDDX must be shorted on the application board. Num Characteristic 1 Input Voltages 2 Output Voltage VDDX (with external PNP) Full Performance Mode VSUP > =6V Full Performance Mode 5.5V <= VSUP <=6V Full Performance Mode 3.5V <= VSUP <=5.5V Reduced Performance Mode (stop mode) VSUP > =3.5V 3 Output Voltage VDDX (without external PNP) Full Performance Mode VSUP > =6V Full Performance Mode 5.5V <= VSUP <=6V Full Performance Mode 3.5V <= VSUP <=5.5V Reduced Performance Mode (stop mode) VSUP > =3.5V Symbol Min Typical Max Unit VSUP 3.5 -- 40 V VDDX 4.85 4.50 3.13 2.5 5.0 5.0 -- 5.5 5.15 5.15 5.15 5.75 V V V V VDDX 4.80 4.50 3.13 2.5 4.95 4.95 -- 5.5 5.10 5.10 5.10 5.70 V V V V 0 0 -- -- 70 25 Load Current VDDX1 (without external PNP) (-40oC < TJ < 150oC) Full Performance Mode VSUP > 6V Full Performance Mode 3.5V <= VSUP <=6V IDDX Load Current VDDX(1) (without external PNP) Full Performance Mode VSUP > 6V Full Performance Mode 3.5V <= VSUP <=6V Reduced Performance Mode (stop mode) IDDX 0 0 0 -- -- -- 55 20 5 mA mA mA 6 Short circuit VDDX fall back current VDDX<=0.5V IDDX -- 100 -- mA 7 Output Voltage VDDC with external PNP Full Performance Mode VSUP > =6V Full Performance Mode 5.5V <= VSUP <=6V Full Performance Mode 3.5V <= VSUP <=5.5V Reduced Performance Mode (stop mode) VSUP > =3.5V VDDC 4.85 4.50 3.13 2.5 5.0 5.0 -- 5.5 5.15 5.15 5.15 5.75 V V V V IDDC 0 -- 2.5 mA 4 5 8 Load Current VDDC Reduced Performance Mode (stop mode) 2 mA 9 Low Voltage Interrupt Assert Level Low Voltage Interrupt Deassert Level VLVIA VLVID 4.04 4.19 4.23 4.38 4.40 4.49 V V 10a VDDX Low Voltage Reset deassert3 VLVRXD -- 3.05 3.13 V VLVRXA 2.95 3.02 -- V 10b VDDX Low Voltage Reset assert MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 725 Appendix E CPMU Electrical Specifications (VREG, OSC, IRC, PLL) Table E-1. Voltage Regulator Electrical Characteristics (Junction Temperature From -40C To +175C) VDDA and VDDX must be shorted on the application board. Num 11 2 Characteristic Trimmed ACLK output frequency 4 Symbol Min Typical Max Unit fACLK -- 20 -- KHz dfACLK - 6% -- + 6% -- tsdel -- -- 100 s 12 Trimmed ACLK internal clock f / fnominal 13 The first period after enabling the counter by APIFE might be reduced by API start up delay 14 Temperature Sensor Slope dVHT 5.05 5.25 5.45 mV/oC 15 Temperature Sensor Output Voltage TJ=150oC untrimmed VHT -- 2.4 -- V 16 High Temperature Interrupt Assert5 High Temperature Interrupt Deassert THTIA THTID 120 110 132 122 144 134 o 17 Bandgap output voltage VBG 1.14 1.20 1.28 V 18 Bandgap output voltage VSUP dependency TJ =150oC, 3.5V < VSUP<18V VBGV -5 -- 5 mV 19 Bandgap output voltage temperature dependency VSUP<18V, -40oC < TJ < 150oC VBGT -20 -- 20 mV 20 Max. Base Current For External PNP (VDDX)6 -40oC < TJ < 150oC IBCTLMAX 2.3 -- -- mA 21 Max. Base Current For External PNP (VDDX) 150oC < TJ < 175oC IBCTLMAX 1.5 -- -- mA 22 Max. Base Current For External PNP (VDDC) -40oC < TJ < 150oC IBCTLCMAX 2.3 -- -- mA 23 Max. Base Current For External PNP (VDDC) 150oC < TJ < 175oC IBCTLCMAX 1.5 -- -- mA 24 Recovery time from STOP tSTP_REC -- 23 -- s C C o 1Please note that the core current is derived from VDDX LVI is monitored on the VDDA supply domain LVRX is monitored on the VDDX supply domain only active during full performance mode. During reduced performance mode (stop mode) voltage supervision is solely performed by the POR block monitoring core VDD. The ACLK trimming must be set that the minimum period equals to 0.2ms VREGHTTR=0x88 This is the minimum base current that can be guaranteed when the external PNP is delivering maximum current. 3 4 5 6 E.2 IRC and OSC Electrical Specifications Table E-2. IRC electrical characteristics Num Symbol Min Typ Max Unit 1a Internal Reference Frequency, factory trimmed -40oC < TJ < 150oC Rating fIRC1M_TRIM 0.9895 1.002 1.0145 MHz 1b Internal Reference Frequency, factory trimmed 150oC < TJ < 175oC fIRC1M_TRIM 0.9855 1.0145 MHz MC9S12ZVC Family Reference Manual , Rev. 1.9 726 NXP Semiconductors Appendix E CPMU Electrical Specifications (VREG, OSC, IRC, PLL) Table E-3. OSC electrical characteristics (Junction Temperature From -40C To +175C) Num 2 Symbol Min Typ Max Unit 1 Nominal crystal or resonator frequency fOSC 4.0 -- 20 MHz 2 Startup Current iOSC 100 -- -- A 3a Oscillator start-up time (4MHz)1 tUPOSC -- 2 10 ms 3b Oscillator start-up time (8MHz)1 tUPOSC -- 1.6 8 ms 3c Oscillator start-up time (16MHz)1 tUPOSC -- 1 5 ms 3d Oscillator start-up time (20MHz)1 tUPOSC -- 1 4 ms 4 Clock Monitor Failure Assert Frequency fCMFA 200 450 1200 KHz 5 Input Capacitance (EXTAL, XTAL pins) CIN -- 7 -- pF 6 EXTAL Pin Input Hysteresis VHYS,EXTAL -- 120 -- mV 7 EXTAL Pin oscillation amplitude (loop controlled Pierce) VPP,EXTAL -- 1 -- V VPP,EXTAL 0.8 -- 1.5 V 8 1 Rating EXTAL Pin oscillation required amplitude2 These values apply for carefully designed PCB layouts with capacitors that match the crystal/resonator requirements. Needs to be measured at room temperature on the application board using a probe with very low (<=5pF) input capacitance. E.3 Phase Locked Loop E.3.1 Jitter Information With each transition of the feedback clock, the deviation from the reference clock is measured and the input voltage to the VCO is adjusted accordingly.The adjustment is done continuously with no abrupt changes in the VCOCLK frequency. Noise, voltage, temperature and other factors cause slight variations in the control loop resulting in a clock jitter. This jitter affects the real minimum and maximum clock periods as illustrated in Figure E-1.. 1 0 2 3 N-1 N tmin1 tnom tmax1 tminN tmaxN Figure E-1. Jitter Definitions The relative deviation of tnom is at its maximum for one clock period, and decreases towards zero for larger number of clock periods (N). Defining the jitter as: MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 727 Appendix E CPMU Electrical Specifications (VREG, OSC, IRC, PLL) t N t N max min J N = max 1 - ---------------------- , 1 - ---------------------- Nt Nt nom nom The following equation is a good fit for the maximum jitter: j1 J N = -------------------------------------------------N POSTDIV + 1 J(N) 1 5 10 20 N Figure E-2. Maximum Bus Clock Jitter Approximation (N = Number of Bus Cycles) NOTE Peripheral module prescalers eliminate the effect of jitter to a large extent. Table E-4. PLL Characteristics (Junction Temperature From -40C To +175C) Conditions are 4.5 V < VDDX< 5.5 V unless otherwise noted Num Rating Symbol Min Typ Max Unit fVCORST 8 -- 32 MHz 1 VCO frequency during system reset 2 VCO locking range fVCO 32 -- 64 MHz 3 Reference Clock fREF 1 -- -- MHz 4 Lock Detection Lock| 0 -- 1.5 %1 5 Un-Lock Detection Threshold unl| 0.5 -- 2.5 %1 7 Time to lock tlock -- -- 150 + 256/fREF s 8 Jitter fit parameter 12 40C < TJ < 150C j1 -- -- 2 % 9a PLL Clock Monitor Failure assert frequency fPMFA 0.45 1.1 1.6 MHz MC9S12ZVC Family Reference Manual , Rev. 1.9 728 NXP Semiconductors Appendix E CPMU Electrical Specifications (VREG, OSC, IRC, PLL) 1 2 % deviation from target frequency fREF = 1MHz, fBUS = 32MHz MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 729 Appendix E CPMU Electrical Specifications (VREG, OSC, IRC, PLL) MC9S12ZVC Family Reference Manual , Rev. 1.9 730 NXP Semiconductors Appendix F BATS Electrical Specifications Appendix F BATS Electrical Specifications F.1 Static Electrical Characteristics Table F-1. Static Electrical Characteristics - BATS (Junction Temperature From -40C To +150C) Characteristics noted under conditions 5.5V VSUP 18 V, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C1 under nominal conditions unless otherwise noted. Num 1 2 3 4 5 6 7 8 1 2 Ratings Symbol Min Typ Max Unit Low Voltage Warning (LBI 1) Assert (Measured on VSUP pin, falling edge) Deassert (Measured on VSUP pin, rising edge) Hysteresis (measured on VSUP pin) VLBI1_A VLBI1_D VLBI1_H 4.75 - - 5.5 - 0.4 6 6.5 - V V V Low Voltage Warning (LBI 2) Assert (Measured on VSUP pin, falling edge) Deassert (Measured on VSUP pin, rising edge) Hysteresis (measured on VSUP pin) VLBI2_A VLBI2_D VLBI2_H 6 - - 6.75 - 0.4 7.25 7.75 - V V V Low Voltage Warning (LBI 3) Assert (Measured on VSUP pin, falling edge) Deassert (Measured on VSUP pin, rising edge) Hysteresis (measured on VSUP pin) VLBI3_A VLBI3_D VLBI3_H 7 - - 7.75 - 0.4 8.5 9 - V V V Low Voltage Warning (LBI 4) Assert (Measured on VSUP pin, falling edge) Deassert (Measured on VSUP pin, rising edge) Hysteresis (measured on VSUP pin) VLBI4_A VLBI4_D VLBI4_H 8 - - 9 - 0.4 10 10.5 - V V V High Voltage Warning (HBI 1) Assert (Measured on VSUP pin, rising edge) Deassert (Measured on VSUP pin, falling edge) Hysteresis (measured on VSUP pin) VHBI1_A VHBI1_D VHBI1_H 14.5 14.0 - 16.5 - 1.0 18 - - V V V High Voltage Warning (HBI 2) Assert (Measured on VSUP pin, rising edge) Deassert (Measured on VSUP pin, falling edge) Hysteresis (measured on VSUP pin) VHBI2_A VHBI2_D VHBI2_H 25 24 - 27.5 - 1.0 30 - - V V V RatioVSUP - 9 - - AIMatching - +-2% +-5% - Pin Input Divider Ratio2 RatioVSUP = VSUP / VADC 5.5V < VSUP < 29 V Analog Input Matching Absolute Error on VADC - compared to VSUP / RatioVSUP TA: Ambient Temperature VADC: Voltage accessible at the ADC input channel MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 731 Appendix F BATS Electrical Specifications Table F-2. Static Electrical Characteristics - BATS (Junction Temperature From 150C To +175C) Characteristics noted under conditions 5.5V VSUP 18 V, unless otherwise noted. Num 1 2 3 4 5 6 7 8 1 Ratings Symbol Min Typ Max Unit Low Voltage Warning (LBI 1) Assert (Measured on VSUP pin, falling edge) Deassert (Measured on VSUP pin, rising edge) Hysteresis (measured on VSUP pin) VLBI1_A VLBI1_D VLBI1_H 4.75 - - 5.5 - 0.4 6 6.5 - V V V Low Voltage Warning (LBI 2) Assert (Measured on VSUP pin, falling edge) Deassert (Measured on VSUP pin, rising edge) Hysteresis (measured on VSUP pin) VLBI2_A VLBI2_D VLBI2_H 6 - - 6.75 - 0.4 7.25 7.75 - V V V Low Voltage Warning (LBI 3) Assert (Measured on VSUP pin, falling edge) Deassert (Measured on VSUP pin, rising edge) Hysteresis (measured on VSUP pin) VLBI3_A VLBI3_D VLBI3_H 7 - - 7.75 - 0.4 8.5 9 - V V V Low Voltage Warning (LBI 4) Assert (Measured on VSUP pin, falling edge) Deassert (Measured on VSUP pin, rising edge) Hysteresis (measured on VSUP pin) VLBI4_A VLBI4_D VLBI4_H 8 - - 9 - 0.4 10 10.5 - V V V High Voltage Warning (HBI 1) Assert (Measured on VSUP pin, rising edge) Deassert (Measured on VSUP pin, falling edge) Hysteresis (measured on VSUP pin) VHBI1_A VHBI1_D VHBI1_H 14.5 14 - 16.5 - 1.0 18 - - V V V High Voltage Warning (HBI 2) Assert (Measured on VSUP pin, rising edge) Deassert (Measured on VSUP pin, falling edge) Hysteresis (measured on VSUP pin) VHBI2_A VHBI2_D VHBI2_H 25 24 - 27.5 - 1.0 30 - - V V V RatioVSUP - 9 - - AIMatching - +-2% +-5% - Pin Input Divider Ratio1 RatioVSUP = VSUP / VADC 5.5V < VSUP < 29 V Analog Input Matching Absolute Error on VADC - compared to VSUP / RatioVSUP VADC: Voltage accessible at the ADC input channel MC9S12ZVC Family Reference Manual , Rev. 1.9 732 NXP Semiconductors Appendix F BATS Electrical Specifications F.2 Dynamic Electrical Characteristics Table F-3. Dynamic Electrical Characteristics - (BATS). Characteristics noted under conditions 5.5V VSUP 18 V, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C1 under nominal conditions.. Num 1 Ratings 1 Enable Uncertainty Time 2 Voltage Warning Low Pass Filter Symbol Min Typ Max Unit TEN_UNC - 1 - us fVWLP_filter - 0.5 - Mhz TA: Ambient Temperature MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 733 Appendix F BATS Electrical Specifications MC9S12ZVC Family Reference Manual , Rev. 1.9 734 NXP Semiconductors Appendix G PIM Electrical Specifications G.1 High-Voltage Inputs (HVI) Electrical Characteristics Table G-1. Static Electrical Characteristics - High Voltage Input Pins - Port L Characteristics are 5.5V VSUP 18 V, -40C TJ 175C1 unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C2 under nominal conditions unless otherwise noted. Num 25 Ratings Typ Max Unit 2.8 2.0 3.5 2.5 4.5 3.8 V V mV VTH_HVI 26 Input Hysteresis VHYS_HVI _ 250 _ 27 Pin Input Divider Ratio with external series REXT_HVI Ratio = VHVI / VInternal(ADC) RatioL_HVI RatioH_HVI - - 2 6 - - AIML_HVI - 2 5 % AIMH_HVI - 2 5 % AIMD_HVI - 2 5 % Analog Input Matching Absolute Error on VADC * Compared to VHVI / RatioL_HVI (1V < VHVI < 7V) * Compared to VHVI / RatioH_HVI (3V < VHVI < 21V) * Direct Mode (PTADIRL=1) (0.5V < VHVI < 3.5V) 2 Min Digital Input Threshold * VSUP 6.5V * 5.5V VSUP 6.5V 28 1 Symbol 29 High Voltage Input Series Resistor Note: Always required externally at HVI pins. REXT_HVI - 10 - k 30 Enable Uncertainty Time tUNC_HVI - 1 - s 31 Input capacitance CIN_HVI - 8 - pF TJ: Junction Temperature TA: Ambient Temperature Table G-2. Absolute Maximum Ratings - High Voltage Input Pins - Port L Num 1 Ratings VHVI Voltage Range Symbol Min Typ Max Unit VHVI -27 - 42 V MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 735 Appendix G PIM Electrical Specifications MC9S12ZVC Family Reference Manual , Rev. 1.9 736 NXP Semiconductors Appendix H ACMP Electrical Specifications This section describe the electrical characteristics of the analog comparator module. H.1 Maximum Ratings Table H-1. Maximum Ratings of the analog comparator - (ACMP). Characteristics noted under conditions 3.13V <= VDDA <= 5.5V>, -40C TJ 175C1 unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C2 under nominal conditions unless otherwise noted. Num 1 1 2 Ratings Symbol Min Typ Max Unit Max Rating (relative to supply) VACMP_MAX -0.3 - V Max Rating (absolute) VACMP_0 VACMP_1 Vacmpi_0 Vacmpi_1 VACMP_MAXA -0.3 - VDD A+0.3 6 V TJ: Junction Temperature TA: Ambient Temperature H.2 Static Electrical Characteristics Table H-2. Static Electrical Characteristics of the analog comparator - (ACMP). Characteristics noted under conditions 3.13V <= VDDA <= 5.5V>, -40C TJ 150C1 unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C2 under nominal conditions unless otherwise noted. Num 2 3 Ratings Symbol Min Typ Max Unit Supply Current of ACMP TJ 150C * Module disabled * Module enabled Vin > 5*Vhyst IACMP_off IACMP_run 80 - 3 160 A A Supply Current of ACMP TJ 175C * Module disabled * Module enabled Vin > 5*Vhyst IACMP_off IACMP_run 80 - 5 160 A A MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 737 Appendix H ACMP Electrical Specifications Table H-2. Static Electrical Characteristics of the analog comparator - (ACMP). Characteristics noted under conditions 3.13V <= VDDA <= 5.5V>, -40C TJ 150C1 unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C2 under nominal conditions unless otherwise noted. Num 4 Ratings Pad Input Current in VACMP_in range * -40C TJ 80C * -40C TJ 150C * -40C TJ 175C Symbol Min Typ Max Unit IACMP_pad_in -1 -2 -3 - 1 2 3 A A A VACMP_offset -25 -25 0 0 25 25 mV mV VACMP_hyst -3 -10 -30 -50 -12 -24 -60 -125 -22 -40 -100 -200 mV mV mV mV For 0V < Vpad_in < VDDA 5 6 1 Input Offset * -40C TJ 150C * -40C TJ 175C Input Hysteresis in run mode * [ACHYS] = 00 * [ACHYS] = 01 * [ACHYS] = 10 * [ACHYS] = 11 7 Common Mode Input range * VACMP_0 * VACMP_1 * Vacmpi_0 * Vacmpi_1 VACMP_in 0 VDDA/ 2 VDDA V 8 Common Mode Input range 150C TJ 175C * VACMP_0 * VACMP_1 * Vacmpi_0 * Vacmpi_1 VACMP_in 0 VDDA/ 2 VDDA V TJ: Junction Temperature MC9S12ZVC Family Reference Manual , Rev. 1.9 738 NXP Semiconductors Appendix H ACMP Electrical Specifications 2 TA: Ambient Temperature Input Offset and Hysteresis V Hysteresis Offset VACMPN VACMPO VACMPP t MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 739 Appendix H ACMP Electrical Specifications H.3 Dynamic Electrical Characteristics Table H-3. Dynamic Electrical Characteristics of the analog comparator - (ACMP). Characteristics noted under conditions 3.13V <= VDDA <= 5.5V>, -40C TJ 150C1 unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C2 under nominal conditions unless otherwise noted. Num Ratings 1 Output uncertain time after module enable 2 ACMP Propagation Delay of Inputs ACMP0 and ACMP1 for -2*Vhyst(typ) to +2*Vhyst(typ) input step (w/o synchronize delay) * ACDLY=0 Low speed mode * ACDLY=1 High speed mode Symbol Min Typ Max Unit tACMP_dly_en - 1 2 s tACMP_delay 130 20 300 70 750 400 ns ns tACMP_delay - - 800 450 ns ns ACMPP is crossing ACMPN in positive direction 3 ACMP Propagation Delay of Inputs ACMP0 and ACMP1 for -2*Vhyst(typ) to +2*Vhyst(typ) input step (w/o synchronize delay) 150C TJ 175C * ACDLY=0 Low speed mode * ACDLY=1 High speed mode ACMPP is crossing ACMPN in positive direction 1 2 TJ: Junction Temperature TA: Ambient Temperature MC9S12ZVC Family Reference Manual , Rev. 1.9 740 NXP Semiconductors Appendix I S12CANPHY Electrical Specifications I.1 Maximum Ratings Table I-1. Maximum Ratings Characteristics noted under conditions 5.5V <= VSUP <=18 V >, -40C <= Tj <= 150C > unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions unless otherwise noted. Num Ratings Symbol Value Unit VBUS -32 to +40 V 1 DC voltage on CANL, CANH, SPLIT 2 Continuous current on CANH and CANL ILH 200 mA 3 ESD on CANH, CANL and SPLIT (HBM) VESDCH 4000 V 4 ESD on CANH, CANL (IEC61000-4, Czap = 150 pF, Rzap = 330 ) VESDIEC 6000 V I.2 Static Electrical Characteristics Table I-2. Static Electrical Characteristics Characteristics noted under conditions 5.5V <= VSUP <=18 V >, -40C <= Tj <= 150C > unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions unless otherwise noted. Num Ratings Symbol Min Typ Max Unit CAN TRANSCEIVER CURRENT 1 Supply Current of canphy_ll18uhv Normal mode, Bus Recessive State Normal mode, Bus Dominant State without Bus Load Standby mode Shutdown mode mA IRES IDOM ISTB ISDN 1.7 3.8 0.022 0 PINS (CANH AND CANL) 2 Bus Pin Common Mode Voltage 3a 3b 4 VCOM -12 - 12 V Differential Input Voltage (Normal mode) Recessive State at RXD Dominant State at RXD VCANH VCANL -1.0 0.9 - 0.5 5.0 V V Differential Input Voltage (Standby mode) Recessive State at RXD Dominant State at RXD VCANH VCANL -1.0 1.1 - 0.4 5.0 V V Differential Input Hysteresis VHYS 175 mV MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 741 Appendix I S12CANPHY Electrical Specifications Table I-2. Static Electrical Characteristics Characteristics noted under conditions 5.5V <= VSUP <=18 V >, -40C <= Tj <= 150C > unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions unless otherwise noted. Num Ratings Symbol Min Typ Max Unit 5 Input Resistance RIN 5 32.5 50 k 6 Differential Input Resistance RIND 10 65 100 k 7 Common mode input resistance matching RINM -3 0 +3 % 8 CANH Output Voltage (RL = 60), (Normal mode) TXD Dominant State TXD Recessive State VCANH 2.75 2.0 3.5 2.5 4.5 3.0 V V CANL Output Voltage (RL = 60), (Normal mode) TXD Dominant State TXD Recessive State VCANL 0.5 2.0 1.5 2.5 2.25 3.0 V V Differential Output Voltage (RL = 60), (Normal mode) TXD Dominant State TXD Recessive State VOH VOL 1.5 -0.5 2.0 0 3.0 0.05 V V CANH, CANL driver symmetry (Normal mode) (VCANH + VCANL) / VDDC VSYM 0.9 1 1.1 - Output Current Capability (Dominant State) CANH CANL ICANH ICANL 9 10 11 12 13 14 15 16 17 18 CANH, CANL Overcurrent Detection (Tj >=25oC) CANH CANL CANH, CANL Output Voltage (no load, Standby mode) CANH CANL CANH and CANL Input Current (Standby mode) VCANH, VCANL from 0 V to 5.0 V VCANH, VCANL = - 2.0 V VCANH, VCANL = 7.0 V CANH and CANL Input Current (Device unsupplied) (VSUP tied to ground or left open) VCANH, VCANL from 0V to 5 V VCANH, VCANL = - 2.0 V VCANH, VCANL = 7.0 V 55 55 mA mA ICANHOC ICANLOC 70 70 85 85 100 100 mA mA VCANH VCANL -0.1 -0.1 0 0 0.1 0.1 V V ICAN1 20 -75 250 uA uA uA ICAN2 10 -75 250 uA uA uA CANH, CANL Input capacitance (Normal mode) CANH CANL CCANH CCANL 14 16 pF pF CANH to CANL differential capacitance (Normal mode) CHLDIFF 6 pF DIAGNOSTIC INFORMATION (CANH AND CANL) 19 CANL to 0 V Threshold VL0 -0.75 -0.15 0 V MC9S12ZVC Family Reference Manual , Rev. 1.9 742 NXP Semiconductors Appendix I S12CANPHY Electrical Specifications Table I-2. Static Electrical Characteristics Characteristics noted under conditions 5.5V <= VSUP <=18 V >, -40C <= Tj <= 150C > unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions unless otherwise noted. Num Ratings Symbol Min Typ Max Unit 20 CANH to 0 V Threshold VH0 -0.75 -0.15 0 V 21 CANL to 5.0 V Threshold VL5 VDDC VDDC +0.15 VDDC + 0.75 V 22 CANH to 5.0 V Threshold VH5 VDDC VDDC +0.15 VDDC +0.75 V Output voltage Loaded condition ISPLIT= +/- 500 uA Unloaded condition Rmeasure > 1 M VSPLIT 0.3 0.45 0.5 0.5 0.7 0.55 VDDC VDDC Leakage current -12 V < VSPLIT < +12 V -22 V < VSPLIT < +35 V ILSPLIT - 0 - 5 25 A A SPLIT 23 24 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 743 Appendix I S12CANPHY Electrical Specifications I.3 Dynamic Electrical Characteristics Table I-3. Dynamic Electrical Characteristics Characteristics noted under conditions 5.5V <= VSUP <=18 V >, -40C <= Tj <= 150C > unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions unless otherwise noted. Num Ratings Symbol Min Typ Max Unit SIGNAL EDGE RISE AND FALL TIMES (CANH, CANL) 1 Propagation Loop Delay TXD to RXD (Recessive to Dominant) Slew Rate 6 Slew Rate 5 Slew Rate 4 Slew Rate 2 Slew Rate 1 Slew Rate 0 tLRD Propagation Delay TXD to CAN (Recessive to Dominant) Slew Rate 6 Slew Rate 5 Slew Rate 4 Slew Rate 2 Slew Rate 1 Slew Rate 0 tTRD 3 Propagation Delay CAN to RXD (Recessive to Dominant, using slew rate 0) tRRD 4 Propagation Loop Delay TXD to RXD (Dominant to Recessive) Slew Rate 6 Slew Rate 5 Slew Rate 4 Slew Rate 2 Slew Rate 1 Slew Rate 0 tLDR Propagation Delay TXD to CAN (Dominant to Recessive) Slew Rate 6 Slew Rate 5 Slew Rate 4 Slew Rate 2 Slew Rate 1 Slew Rate 0 tTDR Propagation Delay CAN to RXD (Dominant to Recessive, using slew rate 0) tRDR 2 5 6 ns 146 112 89 83 72 64 (255) ns 98 63 43 38 28 23 42 ns ns 366 224 153 139 114 102 (255) ns 280 152 90 81 56 46 56 ns MC9S12ZVC Family Reference Manual , Rev. 1.9 744 NXP Semiconductors Appendix I S12CANPHY Electrical Specifications Table I-3. Dynamic Electrical Characteristics Characteristics noted under conditions 5.5V <= VSUP <=18 V >, -40C <= Tj <= 150C > unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions unless otherwise noted. Num 7 Ratings Symbol Min Typ Max Unit Non-Differential Slew Rate (CANL or CANH) Slew Rate 6 Slew Rate 5 Slew Rate 4 Slew Rate 2 Slew Rate 1 Slew Rate 0 tSL6 tSL5 tSL4 tSL2 tSL1 tSL0 8 Bus Communication Rate tBUS 1.0 M bps 9 Settling time after entering Normal mode tCP_set 10 s 10 CPTXD-dominant timeout 11 CANPHY wake-up dominant pulse filtered tCPWUP 12 CANPHY wake-up dominant pulse pass tCPWUP V/s 6 10 19 23 35 55 tCPTXDDT 2 ms 1.5 5 s s MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 745 Appendix I S12CANPHY Electrical Specifications MC9S12ZVC Family Reference Manual , Rev. 1.9 746 NXP Semiconductors Appendix J DAC8B5V Electrical Specifications Table J-1. Static Electrical Characteristics - DAC8B5V Characteristics noted under conditions 4.75V <= VDDA <= 5.25V>, -40C < Tj < 175C , VRH=VDDA, VRL=VSSA unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions unless otherwise noted. Num 1 2 Ratings Supply Current of DAC8B5V buffer disabled buffer enabled FVR=0 DRIVE=1 buffer enabled FVR=1 DRIVE=0 Reference current (-40oC <TJ< +150oC) reference disabled reference enabled Symbol Min Typ Max Unit Ibuf - 365 215 5 800 800 A Iref - 50 1 150 A 3 Resolution 4 Relative Accuracy measured at AMP INL -0.5 +0.5 LSB 5 Differential Nonlinearity measured at AMP DNL -0.5 +0.5 LSB 6 Relative Accuracy measured at AMP 150C < Tj < 175C INL -0.75 +0.75 LSB 7 Differential Nonlinearity measured at AMP 150C < Tj < 175C DNL -0.75 +0.75 LSB 8 DAC Range A (FVR bit = 1) Vout 0...255/256(VRH-VRL)+VRL V 9 DAC Range B (FVR bit = 0) Vout 32...287/320(VRH-VRL)+VRL V 10 Output Voltage unbuffered range A or B (load >= 50M) Vout full DAC Range A or B V - V 11 8 Output Voltage (DRIVE bit = 0) *) buffered range A (load >= 100K to VSSA) buffered range A (load >= 100Kto VDDA) buffered range B (load >= 100K to VSSA) buffered range B (load >= 100K to VDDA) 12 Output Voltage (DRIVE bit = 1) **) buffered range B with 6.4K load into resistor divider of 800 /6.56K between VDDA and VSSA. (equivalent load is >= 65Kto VSSA) or (equivalent load is >= 7.5K to VDDA) 0 0.15 bit VDDA-0.15 VDDA Vout full DAC Range B Vout full DAC Range B V MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 747 Appendix J DAC8B5V Electrical Specifications Table J-1. Static Electrical Characteristics - DAC8B5V Characteristics noted under conditions 4.75V <= VDDA <= 5.25V>, -40C < Tj < 175C , VRH=VDDA, VRL=VSSA unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25C under nominal conditions unless otherwise noted. Num Ratings Symbol Min Typ Max Unit 13 Buffer Output Capacitive load Cload 0 - 100 pF 14 Buffer Output Offset Voffset -30 - +30 mV 15 Settling time tdelay - 3 5 s 16 Reverence voltage high Vrefh VDDA-0.1V VDDA VDDA+0.1 V V *) DRIVE bit = 1 is not recomended in this case. **) DRIVE bit = 0 is not allowed with this high load. MC9S12ZVC Family Reference Manual , Rev. 1.9 748 NXP Semiconductors Appendix K NVM Electrical Parameters Appendix K NVM Electrical Parameters K.1 NVM Timing Parameters The time base for all NVM program or erase operations is derived from the bus clock using the FCLKDIV register. The frequency of this derived clock must be set within the limits specified as fNVMOP. The NVM module does not have any means to monitor the frequency and will not prevent program or erase operation at frequencies above or below the specified minimum. When attempting to program or erase the NVM module at a lower frequency, a full program or erase transition is not assured. The device bus frequency, below which the flash wait states can be disabled, is specified in the device operating condition table in Table A-5. The following sections provide equations which can be used to determine the time required to execute specific flash commands. All timing parameters are a function of the bus clock frequency, fNVMBUS. All program and erase times are also a function of the NVM operating frequency, fNVMOP. A summary of key timing parameters can be found in Table K. K.2 NVM Reliability Parameters The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process monitors and burn-in to screen early life failures. The data retention and program/erase cycling failure rates are specified at the operating conditions noted. The program/erase cycle count on the sector is incremented every time a sector or mass erase event is executed. Table K-1. NVM Clock Timing Characteristics Num Rating Symbol Min Typ Max Unit 1 Bus frequency fNVMBUS 1 32 32 MHz 2 Operating frequency fNVMOP 0.8 1.0 1.05 MHz Table K-2. NVM Timing Characteristics 32 MHz (Junction Temperature From -40C To +175C) N u m fNVMOP cycle Command fNVMB US Symbol Min1 Typ2 Max3 cycle Lfmax 4 Unit 1 Erase Verify All Blocks5,6 0 51101 tRD1ALL 1.60 1.60 3.19 102.20 ms 2 Erase Verify Block (Pflash)5 0 49894 tRD1BLK_P 1.56 1.56 3.12 99.79 ms 3 Erase Verify Block (EEPROM)6 0 1608 tRD1BLK_D 0.05 0.05 0.10 3.22 ms 4 Erase Verify P-Flash Section 0 624 tRD1SEC 0.02 0.02 0.04 1.25 ms 5 Read Once 0 512 tRDONCE 16.00 16.00 16.00 512.00 us MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 749 Appendix K NVM Electrical Parameters Table K-2. NVM Timing Characteristics 32 MHz (Junction Temperature From -40C To +175C) N u m fNVMOP cycle Command fNVMB US Symbol Min1 Typ2 Max3 cycle Lfmax 4 Unit 6 Program P-Flash (4 Word) 164 3215 tPGM_4 0.26 0.26 0.57 13.07 ms 7 Program Once 164 3138 tPGMONCE 0.25 0.26 0.26 3.34 ms 8 Erase All Blocks5,6 200126 51914 tERSALL 192.22 201.75 203.37 353.99 ms 9 Erase Flash Block (Pflash)5 200120 50464 tERSBLK_P 192.17 201.70 203.27 351.08 ms 10 Erase Flash Block (EEPROM)6 100060 1905 tERSBLK_D 95.35 100.12 100.18 128.89 ms 11 Erase P-Flash Sector 20015 1016 tERSPG 19.09 20.05 20.08 27.05 ms 12 Unsecure Flash 200126 51992 tUNSECU 192.22 201.75 203.38 354.14 ms 13 Verify Backdoor Access Key 0 524 tVFYKEY 16.38 16.38 16.38 524.00 us 14 Set User Margin Level 0 465 tMLOADU 14.53 14.53 14.53 465.00 us 15 Set Factory Margin Level 0 474 tMLOADF 14.81 14.81 14.81 474.00 us 16 Erase Verify EEPROM Section 0 608 tDRD1SEC 0.02 0.02 0.04 1.22 ms 17 Program EEPROM (1 Word) 68 1689 tDPGM_1 0.12 0.12 0.28 6.84 ms 18 Program EEPROM (2 Word) 136 2713 tDPGM_2 0.21 0.22 0.48 11.02 ms 19 Program EEPROM (3 Word) 204 3737 tDPGM_3 0.31 0.32 0.67 15.20 ms 20 Program EEPROM (4 Word) 272 4761 tDPGM_4 0.41 0.42 0.87 19.38 ms 21 Erase EEPROM Sector 5015 834 tDERSPG 4.80 5.04 20.50 39.25 ms 22 Protection Override 0 506 tPRTOVRD 15.81 15.81 15.81 506.00 us 1 2 3 4 5 6 Minimum times are based on maximum fNVMOP and maximum fNVMBUS Typical times are based on typical fNVMOP and typical fNVMBUS Maximum times are based on typical fNVMOP and typical fNVMBUS plus aging Lowest-frequency max times are based on minimum fNVMOP and minimum fNVMBUS plus aging Affected by Pflash size Affected by EEPROM size MC9S12ZVC Family Reference Manual , Rev. 1.9 750 NXP Semiconductors Appendix K NVM Electrical Parameters Table K-3. NVM Reliability Characteristics (Junction Temperature From -40C To +175C) NU M C Rating Symbol Min Typ Max Unit tNVMRET 20 1002 -- Years nFLPE 10K 100K3 -- Cycles Program Flash Arrays 1 C Data retention at an average junction temperature of TJavg = 85C1 after up to 10,000 program/erase cycles 2 C Program Flash number of program/erase cycles (-40C Tj 150C EEPROM Array 3 C Data retention at an average junction temperature of TJavg = 85C1 after up to 100,000 program/erase cycles tNVMRET 5 1002 -- Years 4 C Data retention at an average junction temperature of TJavg = 85C1 after up to 10,000 program/erase cycles tNVMRET 10 1002 -- Years 5 C Data retention at an average junction temperature of TJavg = 85C1 after less tNVMRET than 100 program/erase cycles 20 1002 -- Years 6 C EEPROM number of program/erase cycles (-40C Tj 150C 100K 500K3 -- Cycles nFLPE 1 TJavg does not exceed 85C in a typical temperature profile over the lifetime of a consumer, industrial or automotive application. Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25C using the Arrhenius equation. For additional information on how NXP defines Typical Data Retention, please refer to Engineering Bulletin EB618 3 Spec table quotes typical endurance evaluated at 25C for this product family. For additional information on how NXP defines Typical Endurance, please refer to Engineering Bulletin EB619. 2 K.3 NVM Factory Shipping Condition Devices are shipped from the factory with flash and EEPROM in the erased state. Data retention specifications begin at time of this erase operation. For additional information on how NXP defines Typical Data Retention, please refer to Engineering Bulletin EB618. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 751 Appendix K NVM Electrical Parameters MC9S12ZVC Family Reference Manual , Rev. 1.9 752 NXP Semiconductors Appendix L Package Information Appendix L Package Information Figure L-1. 64 LQFP Exposed Pad Package MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 753 Appendix L Package Information Figure L-2. 64 LQFP Exposed Pad Package MC9S12ZVC Family Reference Manual , Rev. 1.9 754 NXP Semiconductors Appendix L Package Information Figure L-3. 64 LQFP Exposed Pad Package MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 755 Appendix L Package Information Figure L-4. 48 LQFP Package MC9S12ZVC Family Reference Manual , Rev. 1.9 756 NXP Semiconductors Appendix L Package Information Figure L-5. 48 LQFP Package Figure L-6. MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 757 Appendix M Ordering Information Appendix M Ordering Information Customers can choose either the mask-specific partnumber or the generic, mask-independent partnumber. Ordering a mask-specific partnumber enables the customer to specify which particular maskset they receive whereas ordering the generic partnumber means that the currently preferred maskset (which may change over time) is shipped. In either case, the marking on the device always shows the generic, mask-independent partnumber and the mask set number. The below figure illustrates the structure of a typical mask-specific ordering number. MC9S12ZVC Family Reference Manual , Rev. 1.9 758 NXP Semiconductors Appendix M Ordering Information NOTES Not every combination is offered. Table 1-4 lists available derivatives.The mask identifier suffix and the Tape & Reel suffix are always both omitted from the partnumber which is actually marked on the device. S 9 12ZV C 12 F0 M LH R Tape & Reel: R = Tape & Reel " "(blank) = Trays Package Option: KH = 64LQFP-EP LF = 48LQFP Temperature Option: V = -40C to 105C M = -40C to 125C W = -40C to 150C (64-LQFP-EP only) C = -40C to 85C (48-LQFP only) Maskset identifier Suffix: First digit usually references wafer fab Second digit usually differentiates mask rev (This suffix is omitted in generic partnumbers) Memory Size 12 = 128K Flash 64 = 64K Flash 19 = 192K Flash 96 = 96K Flash Device Title C = Standard (10Bit ADC, no DAC, no Comparator) CA= Enhanced analog(12Bit ADC, with DAC & Comparator Core Family: 12Z = S12Z -16-Bit MCU Core V = MagniV Family Main Memory Type: 9 = S12Z 16-Bit MCU Core Qualification Status: S or SC = Maskset specific partnumber MC = Generic / mask-independent partnumber P or PC = prototype status (pre qualification) MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 759 Appendix M Ordering Information MC9S12ZVC Family Reference Manual , Rev. 1.9 760 NXP Semiconductors Appendix N Detailed Register Address Map Appendix N Detailed Register Address Map Table N-1. Revision History Table Revision Number Revision Date 0.01 22-Aug-2013 Initial version 0.02 25-Oct-2013 Added instance suffix to SENTTX register names Sections Affected Description Of Changes The following tables show the detailed register map of the MC9S12ZVC-Family. NOTE Smaller derivatives within the MC9S12ZVC-Family feature a subset of the listed modules. N.1 Address 0x0000-0x0003 Part ID Name 0x0000 PARTID0 0x0001 PARTID1 0x0002 PARTID2 0x0003 PARTID3 N.2 Address R W R W R W R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 0 0 0 1 0 1 1 1 0 0 0 0 0 0 0 0 2 1 Bit 0 Revision Dependent 0x0010-0x001F S12ZINT Name Bit 7 0x0016 R W IVBR R W R INT_XGPRIO W 0x0017 INT_CFADDR R W 0x0018 INT_CFDATA0 R W RQST 0x0019 INT_CFDATA1 R W RQST 0x0010 0x0011 6 5 4 3 IVB_ADDR[15:8] 0 IVB_ADDR[7:1] 0 0 0 0 0 0 XILVL[2:0] 0 INT_CFADDR[6:3] 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] PRIOLVL[2:0] MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 761 Appendix N Detailed Register Address Map N.2 Address 0x0010-0x001F S12ZINT Name Bit 7 0x001A R INT_CFDATA2 W RQST 0x001B INT_CFDATA3 R W RQST 0x001C INT_CFDATA4 R W RQST 0x001D INT_CFDATA5 R W RQST 0x001E INT_CFDATA6 R W RQST 0x001F INT_CFDATA7 R W RQST 6 0 5 0 4 0 3 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2 1 Bit 0 PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] MC9S12ZVC Family Reference Manual , Rev. 1.9 762 NXP Semiconductors Appendix N Detailed Register Address Map N.3 0x0070-0x008F S12ZMMC Address Name 0x0070 MODE Bit 7 R W 0x00710x007F Reserved 0x0080 MMCECH R MODC 0 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W 0x0081 MMCECL R W 0x0082 MMCCCRH R ITR[3:0] TGT[3:0] ACC[3:0] ERR[3:0] CPUU 0 0 0 0 0 0 0 0 CPUX 0 CPUI 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W 0x0083 MMCCCRL R W 0x0084 Reserved R W 0x0085 MMCPCH R CPUPC[23:16] W 0x0086 MMCPCM R CPUPC[15:8] W 0x0087 MMCPCL R CPUPC[7:0] W 0x00880x00FF N.4 Reserved R 0 0 0 0 W 0x0100-0x017F S12ZDBG Address Name 0x0100 DBGC1 0x0101 DBGC2 0x0102 Reserved R W R W R W Bit 7 6 5 4 3 2 1 Bit 0 ARM 0 TRIG reserved BDMBP BRKCPU reserved EEVE1 0 0 0 0 0 0 0 0 0 0 0 0 0 ABCM 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 763 Appendix N Detailed Register Address Map N.4 Address 0x0100-0x017F S12ZDBG (continued) Name Bit 7 0 6 0 5 0 4 0 3 0 2 0 1 0 Bit 0 0 0x0103 Reserved R W 0x0104 Reserved R W 0 0 0 0 0 0 0 0 0x0105 Reserved R W 0 0 0 0 0 0 0 0 0x0106 Reserved R W 0 0 0 0 0 0 0 0 0x0107 DBGSCR1 R W C3SC1 C3SC0 0 0 C1SC1 C1SC0 C0SC1 C0SC0 0x0108 DBGSCR2 R W C3SC1 C3SC0 0 0 C1SC1 C1SC0 C0SC1 C0SC0 0x0109 DBGSCR3 R W C3SC1 C3SC0 0 0 C1SC1 C1SC0 C0SC1 C0SC0 0x010A DBGEFR R W 0 TRIGF 0 EEVF ME3 0 ME1 ME0 0x010B DBGSR R W 0 0 0 0 0 SSF2 SSF1 SSF0 0x010C0x010F Reserved R W 0 0 0 0 0 0 0 0 0x0110 DBGACTL R W 0 NDB INST RW RWE reserved COMPE 0x01110x0114 Reserved R W 0 0 0 0 0 0 0 0x0115 DBGAAH R W DBGAA[23:16] 0x0116 DBGAAM R W DBGAA[15:8] 0x0117 DBGAAL R W DBGAA[7:0] 0x0118 DBGAD0 R W Bit 31 30 29 28 27 26 25 Bit 24 0x0119 DBGAD1 R W Bit 23 22 21 20 19 18 17 Bit 16 0x011A DBGAD2 R W Bit 15 14 13 12 11 10 9 Bit 8 0x011B DBGAD3 R W Bit 7 6 5 4 3 2 1 Bit 0 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 764 NXP Semiconductors Appendix N Detailed Register Address Map N.4 Address 0x0100-0x017F S12ZDBG (continued) Name Bit 7 6 5 4 3 2 1 Bit 0 0x011C R DBGADM0 W Bit 31 30 29 28 27 26 25 Bit 24 0x011D DBGADM1 R W Bit 23 22 21 20 19 18 17 Bit 16 0x011E DBGADM2 R W Bit 15 14 13 12 11 10 9 Bit 8 0x011F DBGADM3 R W Bit 7 6 5 4 3 2 1 Bit 0 0x0120 DBGBCTL R W 0 0 RW RWE reserved COMPE 0x01210x0124 Reserved R W 0 0 0 0 0 0 0x0125 DBGBAH R W DBGBA[23:16] 0x0126 DBGBAM R W DBGBA[15:8] 0x0127 DBGBAL R W DBGBA[7:0] 0x01280x012F Reserved R W 0 0 0 0 0 0 0 0 0x01300x013F Reserved R W 0 0 0 0 0 0 0 0 0x0140 DBGDCTL R W 0 0 RW RWE reserved COMPE 0x01410x0144 Reserved R W 0 0 0 0 0 0 0x0145 DBGDAH R W DBGDA[23:16] 0x0146 DBGDAM R W DBGDA[15:8] 0x0147 DBGDAL R W DBGDA[7:0] 0x01480x017F Reserved R W 0 0 0 0 0 INST 0 INST 0 0 0 0 0 0 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 765 Appendix N Detailed Register Address Map N.5 Global Address 0x0200-0x037F S12ZVCPIM Register Name 0x0200 MODRR0 0x0201 MODRR1 0x0202 MODRR2 0x0203 MODRR3 0x0204- 0x0207 Reserved 0x0208 ECLKCTL 0x0209 IRQCR 0x020A- 0x020D Reserved 0x020E Reserved 0x020F Reserved 0x0210- 0x025F Reserved 0x0260 PTE 0x0261 Reserved 0x0262 PTIE 0x0263 Reserved Bit 7 5 4 3 SCI1RR SCI0RR SPI0RR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R IIC0RR1-0 W R W R W R 6 T1IC3RR P0C7RR T1IC2RR 1 Bit 0 M0C0RR2-0 TRIG0NEG TRIG0RR1-0 0 0 T0IC2RR T0IC1RR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R 2 P0C3RR T0IC3RR1 T0IC3RR0 0 0 W R W R W R NECLK IRQE IRQEN 0 0 0 0 0 0 0 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTE1 PTE0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTIE1 PTIE0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 766 NXP Semiconductors Appendix N Detailed Register Address Map Global Address Register Name 0x0264 DDRE 0x0265 Reserved 0x0266 PERE 0x0267 Reserved 0x0268 PPSE 0x0269- 0x027F Reserved 0x0280 PTADH 0x0281 PTADL 0x0282 PTIADH 0x0283 PTIADL 0x0284 DDRADH 0x0285 DDRADL 0x0286 PERADH 0x0287 PERADL 0x0288 PPSADH 0x0289 PPSADL Bit 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTADH7 PTADH6 PTADH5 PTADH4 PTADL7 PTADL6 PTADL5 R PTIADH7 PTIADH6 PTIADL6 R 1 Bit 0 DDRE1 DDRE0 0 0 PERE1 PERE0 0 0 PPSE1 PPSE0 0 0 0 PTADH3 PTADH2 PTADH1 PTADH0 PTADL4 PTADL3 PTADL2 PTADL1 PTADL0 PTIADH5 PTIADH4 PTIADH3 PTIADH2 PTIADH1 PTIADH0 PTIADL5 PTIADL4 PTIADL3 PTIADL2 PTIADL1 PTIADL0 W R W R W R W R W R W R W R W W R PTIADL7 W R W R W R W R W R W R W DDRADH7 DDRADH6 DDRADH5 DDRADH4 DDRADH3 DDRADH2 DDRADH1 DDRADH0 DDRADL7 DDRADL6 DDRADL5 DDRADL4 DDRADL3 DDRADL2 DDRADL1 DDRADL0 PERADH7 PERADH6 PERADH5 PERADH4 PERADH3 PERADH2 PERADH1 PERADH0 PERADL7 PERADL6 PERADL5 PERADL4 PERADL3 PERADL2 PERADL1 PERADL0 PPSADH7 PPSADH6 PPSADH5 PPSADH4 PPSADH3 PPSADH2 PPSADH1 PPSADH0 PPSADL7 PPSADL6 PPSADL5 PPSADL4 PPSADL3 PPSADL2 PPSADL1 PPSADL0 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 767 Appendix N Detailed Register Address Map Global Address Register Name 0x028A- 0x028B Reserved 0x028C PIEADH 0x028D PIEADL 0x028E PIFADH 0x028F PIFADL 0x0290- 0x0297 Reserved 0x0298 DIENADH 0x0299 DIENADL 0x029A- 0x02BF Reserved 0x02C0 PTT 0x02C1 PTIT 0x02C2 DDRT 0x02C3 PERT 0x02C4 PPST 0x02C5- 0x02CE Reserved 0x02CF Reserved R Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 PIEADH7 PIEADH6 PIEADH5 PIEADH4 PIEADH3 PIEADH2 PIEADH1 PIEADH0 PIEADL7 PIEADL6 PIEADL5 PIEADL4 PIEADL3 PIEADL2 PIEADL1 PIEADL0 PIFADH7 PIFADH6 PIFADH5 PIFADH4 PIFADH3 PIFADH2 PIFADH1 PIFADH0 PIFADL7 PIFADL6 PIFADL5 PIFADL4 PIFADL3 PIFADL2 PIFADL1 PIFADL0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W R DIENADH7 DIENADH6 DIENADH5 DIENADH4 DIENADH3 DIENADH2 DIENADH1 DIENADH0 DIENADL7 DIENADL6 DIENADL5 DIENADL4 DIENADL3 DIENADL2 DIENADL1 DIENADL0 0 0 0 0 0 0 0 0 PTT7 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0 PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0 DDRT7 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0 PERT7 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0 PPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 768 NXP Semiconductors Appendix N Detailed Register Address Map Global Address Register Name 0x02D0 PTS 0x02D1 PTIS 0x02D2 DDRS 0x02D3 PERS 0x02D4 PPSS 0x02D5 Reserved 0x02D6 PIES 0x02D7 PIFS 0x02D8- 0x02DE Reserved 0x02DF WOMS 0x02E0- 0x02EF Reserved 0x02F0 PTP 0x02F1 PTIP 0x02F2 DDRP 0x02F3 PERP 0x02F4 PPSP R W R Bit 7 6 5 4 3 2 1 Bit 0 PTS7 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0 PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0 DDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0 PERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0 PPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0 0 0 0 0 0 0 0 0 PIES7 PIES6 PIES5 PIES4 PIES3 PIES2 PIES1 PIES0 PIFS7 PIFS6 PIFS5 PIFS4 PIFS3 PIFS2 PIFS1 PIFS0 0 0 0 0 0 0 0 0 WOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0 0 0 0 0 0 0 0 0 PTP7 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0 PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0 DDRP7 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0 PERP7 PERP6 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0 PPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0 W R W R W R W R W R W R W R W R W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 769 Appendix N Detailed Register Address Map Global Address Register Name 0x02F5 Reserved 0x02F6 PIEP 0x02F7 PIFP 0x02F8 Reserved 0x02F9 OCPEP 0x02FA OCIEP 0x02FB OCIFP 0x02FC Reserved 0x02FD RDRP 0x02FE- 0x02FF Reserved 0x0300- 0x030F Reserved 0x0310 PTJ 0x0311 PTIJ 0x0312 DDRJ 0x0313 PERJ 0x0314 PPSJ R Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 PIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0 PIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0 0 0 0 0 0 0 0 0 OCPEP6 OCPEP5 OCPEP4 OCIEP6 OCIEP5 OCIEP4 OCIFP6 OCIFP5 OCIFP4 0 0 0 RDRP6 RDRP5 RDRP4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTJ1 PTJ0 0 0 0 0 0 0 PTIJ1 PTIJ0 0 0 0 0 0 0 DDRJ1 DDRJ0 0 0 0 0 0 0 PERJ1 PERJ0 0 0 0 0 0 0 PPSJ1 PPSJ0 W R W R W R W R 0 W R 0 W R 0 W R 0 0 0 0 0 OCPEP2 OCIEP2 OCIFP2 0 0 0 0 0 OCPEP0 OCIEP0 OCIFP0 0 W R 0 W R 0 RDRP2 0 RDRP0 W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 770 NXP Semiconductors Appendix N Detailed Register Address Map Global Address Register Name 0x0315- 0x031E Reserved 0x031F WOMJ 0x0320- 0x032F Reserved 0x0330 Reserved 0x0331 PTIL 0x0332 Reserved 0x0333 PTPSL 0x0334 PPSL 0x0335 Reserved 0x0336 PIEL 0x0337 PIFL 0x0338- 0x0339 Reserved 0x033A PTABYPL 0x033B PTADIRL 0x033C DIENL 0x033D PTAENL R Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 WOMJ1 WOMJ0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTIL1 PTIL0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PTPSL1 PTPSL0 0 0 0 0 0 0 PPSL1 PPSL0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PIEL1 PIEL0 0 0 0 0 0 0 PIFL1 PIFL0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W PTABYPL1 PTABYPL0 PTADIRL1 PTADIRL0 DIENL1 DIENL0 PTAENL1 PTAENL0 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 771 Appendix N Detailed Register Address Map Global Address Register Name 0x033E PIRL 0x033F PTTEL 0x0340- 0x037F Reserved N.6 Address R Bit 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R 1 Bit 0 PIRL1 PIRL0 PTTEL1 PTTEL0 0 0 W 0x0380-0x039F FTMRZ192K2K Name 7 FDIVLD 6 5 4 3 2 1 0 FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 RNV2 SEC1 SEC0 CCOBIX2 CCOBIX1 CCOBIX0 0 0 WSTAT ACK FDFD FSFD DFDIE SFDIE 0x0380 FCLKDIV R W 0x0381 FSEC R W KEYEN1 KEYEN0 RNV5 RNV4 RNV3 0x0382 FCCOBIX R W 0 0 0 0 0 0x0383 FPSTAT R FPOVRD 0 0 0 0 0 ERSAREQ 0 0 0 ACCERR FPVIOL 0 W 0x0384 FCNFG R W 0x0385 FERCNFG R W 0x0386 FSTAT R W 0x0387 FERSTAT R W 0x0388 FPROT R W FPOPEN 0x0389 DFPROT R W DPOPEN 0x038A FOPT R W 0x038B FRSV1 R W CCIE 0 IGNSF WSTAT[1:0] 0 0 MGBUSY RSVD 0 0 0 FPHDIS FPHS1 FPHS0 0 0 0 NV7 NV6 NV5 0 0 0 0 CCIF 0 0 RNV6 MGSTAT1 MGSTAT0 DFDIF SFDIF FPLDIS FPLS1 FPLS0 DPS3 DPS2 DPS1 DPS0 NV4 NV3 NV2 NV1 NV0 0 0 0 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 772 NXP Semiconductors Appendix N Detailed Register Address Map N.6 Address 0x0380-0x039F FTMRZ192K2K (continued) Name 7 6 5 4 3 2 1 0 CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 0x038C FCCOB0HI R W 0x038D FCCOB0LO R W CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 0x038E FCCOB1HI R W CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 0x038F FCCOB1LO R W CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 0x0390 FCCOB2HI R W CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 0x0391 FCCOB2LO R W CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 0x0392 FCCOB3HI R W CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 0x0393 FCCOB3LO R W CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 0x0394 FCCOB4HI R W CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 0x0395 FCCOB4LO R W CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 0x0396 FCCOB5HI R W CCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 0x0397 FCCOB5LO R W CCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 N.7 0x03C0-0x03CF SRAM_ECC_32D7P Address Name Bit 7 6 5 4 3 2 1 Bit 0 0x03C0 ECCSTAT R W 0 0 0 0 0 0 0 RDY 0x03C1 ECCIE R W 0 0 0 0 0 0 0 0x03C2 ECCIF R W 0 0 0 0 0 0 0 0x03C3 0x03C6 Reserved R W 0 0 0 0 0 0 0 SBEEIE SBEEIF 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 773 Appendix N Detailed Register Address Map N.7 Address 0x03C0-0x03CF SRAM_ECC_32D7P Name Bit 7 6 5 4 3 ECCDPTRH R W DPTR[23:16] 0x03C8 ECCDPTRM R W DPTR[15:8] 0x03C9 ECCDPTRL R W 0x03CA 0x03CB Reserved R W 0x03CC ECCDDH R W DDATA[15:8] 0x03CD ECCDDL R W DDATA[7:0] 0x03CE ECCDE R W 0x03C7 0x03CF ECCDCMD 2 1 0 DPTR[7:1] 0 0 0 0 0 0 0 R ECCDRR W 0 Bit 0 0 0 0 ECCDW ECCDR DECC[5:0] 0 0 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 774 NXP Semiconductors Appendix N Detailed Register Address Map N.8 0x0400-0x042F TIM1 Register Name 0x0400 TIOS 0x0401 CFORC 0x0402 Reserved 0x0403 Reserved 0x0404 TCNTH 0x0405 TCNTL 0x0406 TSCR1 0x0407 TTOV 0x0408 TCTL1 0x0409 TCTL2 0x040A TCTL3 0x040B TCTL4 0x040C TIE 0x040D TSCR2 0x040E TFLG1 0x040F TFLG2 0x0410-0x041F TCxH-TCxL1 0x0420-0x042B Reserved 0x042C OCPD 0x042D Reserved 0x042E PTPSR Bit 7 R W R W R 6 5 4 3 2 1 Bit 0 IOS3 IOS2 IOS1 IOS0 0 0 0 0 0 FOC3 0 FOC2 0 FOC1 0 FOC0 TCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8 TCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0 TEN TSWAI TSFRZ TFFCA PRNT 0 0 0 TOV3 TOV2 TOV1 TOV0 R R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R R W OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A C3I C2I C1I C0I PR2 PR1 PR0 C3F C2F C1F C0F TOI 0 0 0 0 0 0 0 0 0 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 OCPD3 OCPD2 OCPD1 OCPD0 PTPS3 PTPS2 PTPS1 PTPS0 TOF PTPS7 PTPS6 PTPS5 PTPS4 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 775 Appendix N Detailed Register Address Map Register Name Bit 7 0x042F Reserved 1 6 5 4 3 2 1 Bit 0 R W The register is available only if corresponding channel exists. N.9 Address 0x0480-0x04AF PWM0 Name 0x0480 PWME 0x0481 PWMPOL 0x0482 PWMCLK 0x0483 PWMPRCLK 0x0484 PWMCAE 0x0485 PWMCTL R W R W R W R Bit 7 6 5 4 3 2 1 Bit 0 PWME7 PWME6 PWME5 PWME4 PWME3 PWME2 PWME1 PWME0 PPOL7 PPOL6 PPOL5 PPOL4 PPOL3 PPOL2 PPOL1 PPOL0 PCLK7 PCLKL6 PCLK5 PCLK4 PCLK3 PCLK2 PCLK1 PCLK0 PCKB2 PCKB1 PCKB0 PCKA2 PCKA1 PCKA0 CAE7 CAE6 CAE5 CAE4 CAE3 CAE2 CAE1 CAE0 CON67 CON45 CON23 CON01 PSWAI PFRZ 0 0 0 W R W R W 0 0x0486 PWMCLKA R PCLKAB7 PCLKAB6 PCLKAB5 PCLKAB4 PCLKAB3 PCLKAB2 PCLKAB1 PCLKAB0 B W 0x0487 RESERVED 0x0488 PWMSCLA 0x0489 PWMSCLB 0x048A 0x048B RESERVED 0x048C PWMCNT0 0x048D PWMCNT1 0x048E PWMCNT2 R 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 W R W R W R W R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 776 NXP Semiconductors Appendix N Detailed Register Address Map N.9 Address 0x0480-0x04AF PWM0 (continued) Name 0x048F PWMCNT3 0x0490 PWMCNT4 0x0491 PWMCNT5 0x0492 PWMCNT6 0x0493 PWMCNT7 0x0494 PWMPER0 0x0495 PWMPER1 0x0496 PWMPER2 0x0497 PWMPER3 0x0498 PWMPER4 0x0499 PWMPER5 0x049A PWMPER6 0x049B PWMPER7 0x049C PWMDTY0 0x049D PWMDTY1 0x049E PWMDTY2 0x049F PWMDTY32 Bit 7 6 5 4 3 2 1 Bit 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 R W R W R W R W R W R W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 777 Appendix N Detailed Register Address Map N.9 Address 0x0480-0x04AF PWM0 (continued) Name 0x04A0 PWMDTY42 0x04A1 PWMDTY52 0x04A2 PWMDTY62 0x04A3 PWMDTY72 0x04A4 0x04AF RESERVED N.10 R W R W R W R W R Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 W 0x0500-0x052F PWM1 Address Name 0x0500 PWME 0x0501 PWMPOL 0x0502 PWMCLK 0x0503 PWMPRCLK 0x0504 PWMCAE 0x0505 PWMCTL R W R W R W R Bit 7 6 5 4 3 2 1 Bit 0 PWME7 PWME6 PWME5 PWME4 PWME3 PWME2 PWME1 PWME0 PPOL7 PPOL6 PPOL5 PPOL4 PPOL3 PPOL2 PPOL1 PPOL0 PCLK7 PCLKL6 PCLK5 PCLK4 PCLK3 PCLK2 PCLK1 PCLK0 PCKB2 PCKB1 PCKB0 PCKA2 PCKA1 PCKA0 CAE7 CAE6 CAE5 CAE4 CAE3 CAE2 CAE1 CAE0 CON67 CON45 CON23 CON01 PSWAI PFRZ 0 0 0 W R W R W 0 0x0506 PWMCLKA R PCLKAB7 PCLKAB6 PCLKAB5 PCLKAB4 PCLKAB3 PCLKAB2 PCLKAB1 PCLKAB0 B W 0x0507 RESERVED 0x0508 PWMSCLA 0x0509 PWMSCLB 0x050A 0x050B RESERVED R 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 778 NXP Semiconductors Appendix N Detailed Register Address Map N.10 0x0500-0x052F PWM1 Address Name 0x050C PWMCNT0 0x050D PWMCNT1 0x050E PWMCNT2 0x050F PWMCNT3 0x0510 PWMCNT4 0x0511 PWMCNT5 0x0512 PWMCNT6 0x0513 PWMCNT7 0x0514 PWMPER0 0x0515 PWMPER1 0x0516 PWMPER2 0x0517 PWMPER3 0x0518 PWMPER4 0x0519 PWMPER5 0x051A PWMPER6 0x051B PWMPER7 0x051C PWMDTY0 Bit 7 6 5 4 3 2 1 Bit 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 R Bit 7 6 5 4 3 2 1 Bit 0 W 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 R W R W R W R W R W R W R W R W R W MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 779 Appendix N Detailed Register Address Map N.10 Address 0x0500-0x052F PWM1 Name 0x051D PWMDTY1 0x051E PWMDTY2 0x051F PWMDTY32 0x0520 PWMDTY42 0x0521 PWMDTY52 0x0522 PWMDTY62 0x0523 PWMDTY72 0x0524 0x052F RESERVED N.11 R W R W R W R W R W R W R W R Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 3 2 1 Bit 0 IOS3 IOS2 IOS1 IOS0 W 0x05C0-0x05EF TIM0 Address Name Bit 7 6 5 4 0x05C0 TIM0TIOS R W 0 0 0 0 0x05C1 TIM0CFORC R W 0 0 0 0 0 FOC3 0 FOC2 0 FOC1 0 FOC0 0x05C2 Reserved R W 0x05C3 Reserved R W 0x05C4 TIM0TCNTH R W TCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8 0x05C5 TIM0TCNTL R W TCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0 0x05C6 TIM0TSCR1 R W TEN TSWAI TSFRZ TFFCA PRNT 0 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 780 NXP Semiconductors Appendix N Detailed Register Address Map N.11 Address 0x05C0-0x05EF TIM0 (continued) Name Bit 7 0 6 0 5 0 4 0 3 2 1 Bit 0 TOV3 TOV2 TOV1 TOV0 0 0 0 0 0 0 0 0 OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 0 0 0 0 0 0 0 0 EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A 0 0 0 0 C3I C2I C1I C0I 0 0 0 PR2 PR1 PR0 0 0 0 C3F C2F C1F C0F 0 0 0 0 0 0 0 0x05C7 TIM0TTOV R W 0x05C8 TIM0TCTL1 R W 0x05C9 TIM0TCTL2 R W 0x05CA TIM0TCTL3 R W 0x05CB TIM0TCTL4 R W 0x05CC TIM0TIE R W 0x05CD TIM0TSCR2 R W 0x05CE TIM0TFLG1 R W 0x05CF TIM0TFLG2 R W TOF 0x05D0 TIM0TC0H R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0x05D1 TIM0TC0L R W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x05D2 TIM0TC1H R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0x05D3 TIM0TC1L R W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x05D4 TIM0TC2H R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0x05D5 TIM0TC2L R W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x05D6 TIM0TC3H R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0x05D7 TIM0TC3L R W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x05D8- 0x05DF Reserved R W TOI 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 781 Appendix N Detailed Register Address Map N.11 0x05C0-0x05EF TIM0 (continued) Address Name 0x05E0 Reserved R W 0x05E1 Reserved R W 0x05E2 Reserved R W 0x05E3 Reserved R W 0x05E4- 0x05EB Reserved R W 0x05EC TIM0OCPD R W 0x05ED Reserved R W 0x05EE TIM0PTPSR R W 0x05EF Reserved R W N.12 Address 0x0600 0x0601 0x0602 0x0603 0x0604 0x0605 0x0606 0x0607 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 OCPD3 OCPD2 OCPD1 OCPD0 PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 5 4 3 2 0x0600-0x063F ADC0 Name Bit 7 6 1 Bit 0 STR_SEQ MOD_CFG A 0 0 R ADC_EN ADC_SR FRZ_MOD SWAI ACC_CFG[1:0] W R CSL_BMO RVL_BMO SMOD_AC AUT_RST 0 0 ADC0CTL_1 D D C A W DBECC_E Reserved READY 0 0 R RR ADC0STS CSL_SEL RVL_SEL W R 0 ADC0TIM PRS[6:0] W R 0 0 0 0 ADC0FMT DJM SRES[2:0] W R 0 0 0 ADC0FLWCTL SEQA TRIG RSTA LDOK W R RSTAR_EI ADC0EIE IA_EIE CMD_EIE EOL_EIE Reserved TRIG_EIE LDOK_EIE E W R 0 0 0 0 CONIF_OI ADC0IE SEQAD_IE Reserved E W ADC0CTL_0 0 0 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 782 NXP Semiconductors Appendix N Detailed Register Address Map N.12 0x0600-0x063F ADC0 (continued) Address Name 0x0608 ADC0EiF 0x0609 ADC0IF 0x060A ADC0CONIE_0 0x060B ADC0CONIE_1 0x060C ADC0CONIF_0 0x060D ADC0CONIF_1 0x060E ADC0IMDRI_0 0x060F ADC0IMDRI_1 0x0610 ADC0EOLRI 0x0611 Reserved 0x0612 Reserved 0x0613 Reserved 0x0614 ADC0CMD_0 0x0615 ADC0CMD_1 0x0616 ADC0CMD_2 0x0617 ADC0CMD_3 0x0618 Reserved 0x0619 Reserved 0x061A Reserved 0x061B Reserved 0x061C ADC0CIDX 0x061D ADC0CBP_0 0x061E ADC0CBP_1 0x061F ADC0CBP_2 Bit 7 6 R IA_EIF CMD_EIF W R CONIF_OI SEQAD_IF F W R W R W R W R W R CSL_IMD RVL_IMD R 0 W R CSL_EOL RVL_EOL W R 0 0 W R 0 0 W R W R CMD_SEL W R VRH_SEL VRL_SEL W R W R Reserved Reserved W R W R W R W R W R 0 0 W R W R W R W 5 4 3 EOL_EIF Reserved 0 Reserved 2 1 RSTAR_EI TRIG_EIF LDOK_EIF F 0 0 0 Bit 0 0 0 CON_IE[15:8] CON_IE[7:1] EOL_IE CON_IF[15:8] CON_IF[7:1] 0 EOL_IF 0 0 0 0 0 RIDX_IMD 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Reserved 0 0 INTFLG_SEL[3:0] CH_SEL[5:0] 0 SMP[4:0] 0 Reserved Reserved Reserved Reserved Reserved Reserved CMD_IDX[5:0] CMD_PTR[23:16] CMD_PTR[15:8] CMD_PTR[7:2] 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 783 Appendix N Detailed Register Address Map N.12 0x0600-0x063F ADC0 (continued) Address 0x0620 0x0621 0x0622 0x0623 0x0624 0x0625 0x0626 0x0627 0x0628 0x0629 0x062A0x063F N.13 Name R ADC0RIDX W R ADC0RBP_0 W R ADC0RBP_1 W R ADC0RBP_2 W R ADC0CROFF0 W R ADC0CROFF1 W R Reserved W R Reserved W R Reserved W R Reserved W R Reserved W Bit 7 0 6 0 5 4 0 0 0 0 3 2 RES_IDX[5:0] 1 Bit 0 RES_PTR[19:16] RES_PTR[15:8] RES_PTR[7:2] 0 0 0 0 0 0 0 CMDRES_OFF0[6:0] 0 CMDRES_OFF1[6:0] 0 0 0 0 Reserved Reserved Reserved Reserved 0 0 0 Reserved 0 0 0 0 0x0680-0x0687 DAC8B5V 0 Address Offset Register Name Bit 7 6 0x0680 DACCTL R W FVR DRIVE 0x0681 Reserved R 0 0 0x0682 DACVOL R 0x0683 - 0x0686 Reserved R 5 4 3 0 0 0 2 1 Bit 0 DACM[2:0] 0 0 0 0 0 0 0 0 0 W VOLTAGE[7:0] W 0 0 0 0 0 W = Unimplemented MC9S12ZVC Family Reference Manual , Rev. 1.9 784 NXP Semiconductors Appendix N Detailed Register Address Map Address Offset Register Name 0x0687 DACDEBUG Bit 7 6 5 4 3 2 1 Bit 0 0 BUF_EN DAC_EN S3 S2n S2p S1n S1p R W = Unimplemented MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 785 Appendix N Detailed Register Address Map N.14 Address Offset 0x0690-0x0697 ACMP0 Register Name 0x0690 ACMPC0 0x0691 ACMPC1 0x0692 ACMPC2 0x0693 ACMPS 0x0694- 0x0697 Reserved N.15 Address Offset R W R Bit 7 6 5 4 ACE ACOPE ACOPS ACDLY 0 0 0 0 0 ACO 0 0 0 W R 3 2 ACHYS1-0 1 ACMOD1-0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 3 2 1 Bit 0 ACPSEL1-0 ACNSEL1-0 W R W R Bit 0 ACIE ACIF W 0x0698-0x069F ACMP1 Register Name 0x0698 ACMPC0 0x0699 ACMPC1 0x069A ACMPC2 0x069B ACMPS 0x069C- 0x069F Reserved R W R Bit 7 6 5 4 ACE ACOPE ACOPS ACDLY 0 0 0 0 0 ACO 0 0 0 W R ACHYS1-0 ACMOD1-0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ACPSEL1-0 ACNSEL1-0 W R W R ACIE ACIF 0 W MC9S12ZVC Family Reference Manual , Rev. 1.9 786 NXP Semiconductors Appendix N Detailed Register Address Map N.16 Address 0x06C0-0x06DF CPMU Name Bit 7 6 5 4 3 2 1 Bit 0 0x06C0 R CPMU RESERVED00 W 0 0 0 0 0 0 0 0 0x06C1 R CPMU RESERVED01 W 0 0 0 0 0 0 0 0 0x06C2 R CPMU RESERVED02 W 0 0 0 0 0 0 0 0 R 0 PORF LVRF OMRF PMRF 0x06C3 CPMURFLG 0x06C4 CPMU SYNR W 0x06C5 CPMU REFDIV W 0x06C6 CPMU POSTDIV 0x06C7 CPMUIFLG 0x06C8 CPMUINT 0x06C9 CPMUCLKS 0x06CA CPMUPLL 0x06CB CPMURTI 0x06CC CPMUCOP W R R R 0 VCOFRQ[1:0] REFFRQ[1:0] 0 COPRF SYNDIV[5:0] 0 0 0 0 0 0 0 0 PLLSEL PSTP CSAD COP OSCSEL1 0 0 FM1 FM0 RTDEC RTR6 RTR5 0 WCOP RSBCK WRTMAS K REFDIV[3:0] POSTDIV[4:0] W R W R W R W R RTIF RTIE W R W R W 0 LOCK 0 0 0 PRE PCE RTI OSCSEL COP OSCSEL0 0 0 0 0 RTR4 RTR3 RTR2 RTR1 RTR0 0 0 CR2 CR1 CR0 LOCKIF LOCKIE OSCIF OSCIE UPOSC 0 0x06CD RESERVED R CPMUTEST0 W 0 0 0 0 0 0 0 0 0x06CE RESERVED R CPMUTEST1 W 0 0 0 0 0 0 0 0 R 0 0 0 0 0 0 0 0 W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 R 0 0 HTIE HTIF 0 0 0 LVIE LVIF 0 0 APIE APIF 0x06CF CPMU ARMCOP 0x06D0 CPMU HTCTL 0x06D1 CPMU LVCTL 0x06D2 CPMU APICTL W R VSEL 0 HTE HTDS 0 0 LVDS APIES APIEA APIFE W R W APICLK MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 787 Appendix N Detailed Register Address Map N.16 Address 0x06C0-0x06DF CPMU (continued) Name Bit 7 6 5 4 3 2 0x06D3 CPMUACLKT R ACLKTR5 ACLKTR4 ACLKTR3 ACLKTR2 ACLKTR1 ACLKTR0 R W 0x06D4 CPMUAPIRH 0x06D5 CPMUAPIRL 0x06D6 RESERVED R CPMUTEST3 W 0x06D7 CPMUHTTR 0x06D8 CPMU IRCTRIMH W 0x06D9 CPMU IRCTRIML W 0x06DA CPMUOSC 0x06DB CPMUPROT 0x06DC 0x06DD R W R W R W Bit 0 0 0 APIR15 APIR14 APIR13 APIR12 APIR11 APIR10 APIR9 APIR8 APIR7 APIR6 APIR5 APIR4 APIR3 APIR2 APIR1 APIR0 0 0 0 0 0 0 0 0 0 0 0 HTTR3 HTTR2 HTTR1 HTTR0 HTOE R 0 TCTRIM[4:0] R R 1 IRCTRIM[9:8] IRCTRIM[7:0] OSCE Reserved Reserved 0 0 0 0 0 0 0 RESERVED R CPMUTEST2 W 0 0 0 0 0 0 0 R 0 0 0 0 0 EXTCON EXTXON INTXON CPMU VREGCTL W R Reserved W W PROT 0 0x06DE R CPMU RESERVED1E W 0 0 0 0 0 0 0 0 0x06DF R CPMU RESERVED1F W 0 0 0 0 0 0 0 0 MC9S12ZVC Family Reference Manual , Rev. 1.9 788 NXP Semiconductors Appendix N Detailed Register Address Map N.17 0x06F0-0x06F7 BATS Address Name 0x06F0 BATE R W 0 0x06F1 BATSR R W 0 0 0 0x06F2 BATIE R W 0 0 0x06F3 BATIF R W 0 0x06F4 0x06F5 Reserved R W 0x06F6 0x06F7 Reserved R W N.18 Address Bit 7 6 5 3 2 BSUAE BSUSE 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Reserved Reserved Reserved Reserved BVHS 4 BVLS[1:0] 1 Bit 0 0 0 BVHC BVLC BVHIE BVLIE BVHIF BVLIF 0 0 0 Reserved Reserved Reserved Reserved 0x0700-0x0707 SCI0 Name Bit 7 6 5 4 3 2 1 Bit 0 SBR15 SBR14 SBR13 SBR12 SBR11 SBR10 SBR9 SBR8 0x0700 SCI0BDH1 R W 0x0701 SCI0BDL1 R W SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 0x0702 SCI0CR11 R W LOOPS SCISWAI RSRC M WAKE ILT PE PT 0x0700 SCI0ASR12 R RXEDGIF W 0 0 0 0 BERRV BERRIF BKDIF 0x0701 SCI0ACR12 R RXEDGIE W 0 0 0 0 BERRIE BKDIE 0x0702 SCI0ACR22 R W IREN TNP1 TNP0 0 0 BERRM1 BERRM0 BKDFE 0x0703 SCI0CR2 R W TIE TCIE RIE ILIE TE RE RWU SBK 0x0704 SCI0SR1 R W TDRE TC RDRF IDLE OR NF FE PF 0x0705 SCI0SR2 R W 0 0 TXPOL RXPOL BRK13 TXDIR AMAP 0 RAF MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 789 Appendix N Detailed Register Address Map N.18 Address 0x0706 0x0700-0x0707 SCI0 (continued) Name SCI0DRH R W Bit 7 R8 6 T8 5 0 4 0 R R7 R6 R5 R4 W T7 T6 T5 T4 1 These registers are accessible if the AMAP bit in the SCISR2 register is set to zero. 2 These registers are accessible if the AMAP bit in the SCISR2 register is set to one. 0x0707 N.19 Address SCI0DRL 3 0 2 0 1 0 Bit 0 0 R3 T3 R2 T2 R1 T1 R0 T0 0x0710-0x0717 SCI1 Name Bit 7 6 5 4 3 2 1 Bit 0 SBR15 SBR14 SBR13 SBR12 SBR11 SBR10 SBR9 SBR8 0x0710 SCI1BDH1 R W 0x0711 SCI1BDL1 R W SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 0x0712 SCI1CR11 R W LOOPS SCISWAI RSRC M WAKE ILT PE PT 0x0710 SCI1ASR12 R RXEDGIF W 0 0 0 0 BERRV BERRIF BKDIF 0x0711 SCI1ACR12 R RXEDGIE W 0 0 0 0 BERRIE BKDIE 0x0712 SCI1ACR22 R W IREN TNP1 TNP0 0 0 BERRM1 BERRM0 BKDFE 0x0713 SCI1CR2 R W TIE TCIE RIE ILIE TE RE RWU SBK 0x0714 SCI1SR1 R W TDRE TC RDRF IDLE OR NF FE PF 0x0715 SCI1SR2 R W 0 0 TXPOL RXPOL BRK13 TXDIR 0x0716 SCI1DRH R W 0 0 0 0 0 R3 T3 R2 T2 R1 T1 R0 T0 AMAP R8 T8 0 R R7 R6 R5 R4 W T7 T6 T5 T4 1 These registers are accessible if the AMAP bit in the SCISR2 register is set to zero. 2 These registers are accessible if the AMAP bit in the SCISR2 register is set to one. 0x0717 SCI1DRL 0 RAF MC9S12ZVC Family Reference Manual , Rev. 1.9 790 NXP Semiconductors Appendix N Detailed Register Address Map N.20 0x0780-0x0787 SPI0 Address Register Name 0x0780 SPI0CR1 R W 0x0781 SPI0CR2 R W 0 0x0782 SPI0BR R W 0 0x0783 SPI0SR R W 0x0784 SPI0DRH 0x0785 Bit 7 6 5 4 3 2 1 Bit 0 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE MODFEN BIDIROE SPISWAI SPC0 SPR2 SPR1 SPR0 XFRW 0 0 0 SPPR2 SPPR1 SPPR0 SPIF 0 SPTEF MODF 0 0 0 0 R W R15 T15 R14 T14 R13 T13 R12 T12 R11 T11 R10 T10 R9 T9 R8 T8 SPI0DRL R W R7 T7 R6 T6 R5 T5 R4 T4 R3 T3 R2 T2 R1 T1 R0 T0 0x0786 Reserved R W 0x0787 Reserved R W Bit 7 6 5 4 3 2 1 Bit 0 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE MODFEN BIDIROE SPISWAI SPC0 SPR2 SPR1 SPR0 N.21 0x0790-0x0797 SPI1 Address Register Name 0x0790 SPI0CR1 R W 0x0791 SPI0CR2 R W 0 0x0792 SPI0BR R W 0 0x0793 SPI0SR R W 0x0794 SPI0DRH 0x0795 SPI0DRL XFRW 0 0 0 SPPR2 SPPR1 SPPR0 SPIF 0 SPTEF MODF 0 0 0 0 R W R15 T15 R14 T14 R13 T13 R12 T12 R11 T11 R10 T10 R9 T9 R8 T8 R W R7 T7 R6 T6 R5 T5 R4 T4 R3 T3 R2 T2 R1 T1 R0 T0 MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 791 Appendix N Detailed Register Address Map N.21 0x0790-0x0797 SPI1 Address Register Name 0x0796 Reserved R W 0x0797 Reserved R W N.22 Address Bit 7 6 5 4 3 2 1 Bit 0 Bit 0 0 0x07C0-0x07C7 IIC0 Name Bit 7 6 5 4 3 2 1 ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 IBC2 IBC1 0 0 0x07C0 IBAD R W 0x07C1 IBFD R W IBC7 IBC6 IBC5 IBC4 IBC3 0x07C2 IBCR R W IBEN IBIE MS/SL Tx/Rx TXAK 0x07C3 IBSR R W TCF IAAS IBB 0x07C4 IBDR R W D7 D6 D5 0x07C5 IBCR2 R W GCEN ADTYPE 0x07C6 0x07C7 Reserved R W 0 0 RSTA IBC0 IBSWAI 0 SRW D4 D3 D2 D1 D0 0 0 0 ADR10 ADR9 ADR8 0 0 0 0 0 0 IBAL IBIF RXAK MC9S12ZVC Family Reference Manual , Rev. 1.9 792 NXP Semiconductors Appendix N Detailed Register Address Map N.23 0x0800-0x083F CAN0 Register Name Bit 7 0x0800 CANCTL0 R 0x0001 CANCTL1 R 0x0802 CANBTR0 R 0x0803 CANBTR1 R 0x0804 CANRFLG R 0x0805 CANRIER R 0x0806 CANTFLG W W W W W W R RXACT 5 CSWAI 4 SYNCH 3 2 1 Bit 0 TIME WUPE SLPRQ INITRQ SLPAK INITAK CANE CLKSRC LOOPB LISTEN BORM WUPM SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0 SAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10 WUPIF CSCIF RSTAT1 RSTAT0 TSTAT1 TSTAT0 OVRIF RXF WUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE 0 0 0 0 0 TXE2 TXE1 TXE0 0 0 0 0 0 TXEIE2 TXEIE1 TXEIE0 0 0 0 0 0 ABTRQ2 ABTRQ1 ABTRQ0 0 0 0 0 0 ABTAK2 ABTAK1 ABTAK0 0 0 0 0 0 TX2 TX1 TX0 0 0 IDAM1 IDAM0 0 IDHIT2 IDHIT1 IDHIT0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 W 0x0807 CANTIER R 0x0808 CANTARQ R W 0x0809 CANTAAK W 0x080A CANTBSEL RXFRM 6 W R R W 0x080B CANIDAC R 0x080C Reserved R 0x000D CANMISC R 0x080E CANRXERR R W W W BOHOLD RXERR0 W = Unimplemented or Reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 793 Appendix N Detailed Register Address Map Register Name 0x080F CANTXERR R 0x0810-0x0813 CANIDAR0-3 R 0x0814-0x0817 CANIDMRx R 0x0818-0x081B CANIDAR4-7 R 0x081C-0x081F CANIDMR4-7 R 0x0820-0x082F CANRXFG R 0x0830-0x083F CANTXFG Bit 7 6 5 4 3 2 1 Bit 0 TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0 AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0 AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0 AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0 AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0 W W W W W W R W See Section 17.3.3, "Programmer's Model of Message Storage" See Section 17.3.3, "Programmer's Model of Message Storage" = Unimplemented or Reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 794 NXP Semiconductors Appendix N Detailed Register Address Map N.24 0x0990-0x0997 CANPHY Address Offset Register Name 0x0990 CPDR R W 0x0991 CPCR 0x0992 Reserved 0x0993 CPSR 0x0994 Reserved R W 0x0995 Reserved R W 0x0996 CPIE R W 0x0997 CPIF R W Bit 7 6 5 4 3 2 1 CPDR7 0 0 0 0 0 R W CPE SPE R W Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved R CPCHVH W CPCHVL CPCLVH CPCLVL CPDT 0 0 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 0 0 0 CPVFIE CPDTIE 0 0 CHVHIF CHVLIF CLVHIF CLVLIF CPDTIF CPDR1 0 WUPE1-0 Bit 0 CPDR0 SLR2-0 0 CHOCIF CPOCIE CLOCIF = Unimplemented or Reserved N.25 Address Offset 0x09A0-0x09AF SENTTX Register Name R 0x09A0 STTICKRATE Bit 7 6 0 0 5 4 R R STPPULSE W PPEN PPFIXED 0 0 R 0x09A4 STCONFIG W R STINTEN R W Bit 0 0 PPCOUNT[10:8] PPCOUNT[7:0] 0 TXINIT TXEN 0 0 0 0 0 0 W 0x09A6 1 PRE[7:0] W R 2 PRE[13:8] W W 0x09A2 3 0 0 OPTEDGE SINGLE CRCSCN CRCLEG CRCBYP PPREIE TUIE CSIE TCIE TBEIE DNIBBLECOUNT[2:0] = Unimplemented or Reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 NXP Semiconductors 795 Appendix N Detailed Register Address Map Address Offset Register Name 0x09A7 STINTFLG R Bit 7 6 5 0 0 0 W R W 0x09A8 R STTXBUF W R W 0x09AA R W 0x09AC 0x09AF Reserved R 0 4 3 2 1 Bit 0 PPRE TU CS TC TBE STATCONF[3:0] CRC[3:0] DATA0[3:0] DATA1[3:0] DATA2[3:0] DATA3[3:0] DATA4[3:0] DATA5[3:0] 0 0 0 0 0 0 0 W = Unimplemented or Reserved MC9S12ZVC Family Reference Manual , Rev. 1.9 796 NXP Semiconductors How to Reach Us: Home Page: nxp.com Web Support nxp.com/support Information in this document is provided solely to enable system and software implementers to use NXP products. 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All other product or service names are the property of their respective owners. ARM, AMBA, ARM Powered, Artisan, Cortex, Jazelle, Keil, SecurCore, Thumb, TrustZone, and Vision are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. ARM7, ARM9, ARM11, big.LITTLE, CoreLink, CoreSight, DesignStart, Mali, mbed, NEON, POP, Sensinode, Socrates, ULINK and Versatile are trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. Oracle and Java are registered trademarks of Oracle and/or its affiliates. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. (c) 2018 NXP B.V. Document Number: MC9S12ZVCRMV1 Rev. 1.9 January 29, 2018