SCES345D − DECEMBER 2000 − REVISED APRIL 2005
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D2-V to 5.5-V VCC Operation
DMax tpd of 7 ns at 5 V
DTypical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
DTypical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
DSupport Mixed-Mode Voltage Operation on
All Ports
DIoff Supports Partial-Power-Down Mode
Operation
DLatch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
These triple 3-input positive-AND gates are
designed for 2-V to 5.5-V VCC operation.
The ’ LV11A devices perform the Boolean function
Y+A•B•CorY+A)B)C in positive
logic.
These devices are fully specified for
partial-power-down applications using Ioff. The Ioff
circuitry disables the outputs, preventing
damaging current backflow through the devices
when they are powered down.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SOIC − D
Tube of 50 SN74LV11AD
LV11A
SOIC − D Reel of 2500 SN74LV11ADR LV11A
SOP − NS Reel of 2000 SN74LV11ANSR 74LV11A
−40°C to 85°C
SSOP − DB Reel of 2000 SN74LV11ADBR LV11A
−40°C to 85°CTube of 90 SN74LV11APW
TSSOP − PW Reel of 2000 SN74LV11APWR LV11A
TSSOP − PW
Reel of 250 SN74LV11APWT
LV11A
TVSOP − DGV Reel of 2000 SN74LV11ADGVR LV11A
CDIP − J Tube of 25 SNJ54LV11AJ SNJ54LV11AJ
−55°C to 125°CCFP − W Tube of 150 SNJ54LV11AW SNJ54LV11AW
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54LV11AFK SNJ54LV11AFK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright 2005, Texas Instruments Incorporated
SN54LV11A ...FK PACKAGE
(TOP VIEW)
SN54LV11A ...J OR W PACKAGE
SN74LV11A ... D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
2A
2B
2C
2Y
GND
VCC
1C
1Y
3C
3B
3A
3Y
3212019
910111213
4
5
6
7
8
18
17
16
15
14
1Y
NC
3C
NC
3B
2A
NC
2B
NC
2C
1B
1A
NC
3Y
3A V
1C
2Y
GND
NC
CC
NC − No internal connection
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
!"# #$# %
#&'!$# ''"# $ & ()*$# $"+ ' #&'!
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SCES345D − DECEMBER 2000 − REVISED APRIL 2005
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
A B C
OUTPUT
Y
H H H H
LXX L
XLX L
X X L L
logic diagram, each gate (positive logic)
A
CY
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range applied in high or low state, VO (see Notes 1 and 2) −0.5 V to VCC + 0.5 V. . . . . . . . . .
Voltage range applied to any output in the power-off state, VO (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) −20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 3): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 127°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
SCES345D − DECEMBER 2000 − REVISED APRIL 2005
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 4)
SN54LV11A SN74LV11A
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 2 5.5 2 5.5 V
VCC = 2 V 1.5 1.5
VIH
High-level input voltage
VCC = 2.3 V to 2.7 V VCC ×0.7 VCC ×0.7
V
VIH High-level input voltage VCC = 3 V to 3.6 V VCC ×0.7 VCC ×0.7 V
VCC = 4.5 V to 5.5 V VCC ×0.7 VCC ×0.7
VCC = 2 V 0.5 0.5
VIL
Low-level input voltage
VCC = 2.3 V to 2.7 V VCC ×0.3 VCC ×0.3
V
VIL Low-level input voltage VCC = 3 V to 3.6 V VCC ×0.3 VCC ×0.3 V
VCC = 4.5 V to 5.5 V VCC ×0.3 VCC ×0.3
VIInput voltage 0 5.5 0 5.5 V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V −50 −50 µA
IOH
High-level output current
VCC = 2.3 V to 2.7 V −2 −2
IOH High-level output current VCC = 3 V to 3.6 V −6 −6 mA
VCC = 4.5 V to 5.5 V −12 −12
mA
VCC = 2 V 50 50 µA
IOL
Low-level output current
VCC = 2.3 V to 2.7 V 2 2
IOL Low-level output current VCC = 3 V to 3.6 V 6 6 mA
VCC = 4.5 V to 5.5 V 12 12
mA
VCC = 2.3 V to 2.7 V 200 200
∆t/∆vInput transition rise or fall rate VCC = 3 V to 3.6 V 100 100 ns/V
∆t/∆v
Input transition rise or fall rate
VCC = 4.5 V to 5.5 V 20 20
ns/V
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
SN54LV11A SN74LV11A
UNIT
PARAMETER
TEST CONDITIONS
VCC MIN TYP MAX MIN TYP MAX
UNIT
IOH = −50 µA2 V to 5.5 V VCC−0.1 VCC−0.1
VOH
IOH = −2 mA 2.3 V 2 2
V
VOH IOH = −6 mA 3 V 2.48 2.48 V
IOH = −12 mA 4.5 V 3.8 3.8
IOL = 50 µA2 V to 5.5 V 0.1 0.1
VOL
IOL = 2 mA 2.3 V 0.4 0.4
V
VOL IOL = 6 mA 3 V 0.44 0.44 V
IOL = 12 mA 4.5 V 0.55 0.55
IIVI = 5.5 V or GND 0 to 5.5 V ±1±1µA
ICC VI = VCC or GND, IO = 0 5.5 V 20 20 µA
Ioff VI or VO = 0 to 5.5 V 0 V 5 5 µA
CiVI = VCC or GND 3.3 V 1.9 1.9 pF
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SCES345D − DECEMBER 2000 − REVISED APRIL 2005
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
LOAD
TA = 25°C SN54LV11A SN74LV11A
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
tpd A, B, or C Y CL = 15 pF 6.9* 13.8* 1* 16* 1 16 ns
tpd A, B, or C Y CL = 50 pF 9.9 17.5 1 21 1 21 ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
LOAD
TA = 25°C SN54LV11A SN74LV11A
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
tpd A, B, or C Y CL = 15 pF 5.2* 8.8* 1* 10.5* 1 10.5 ns
tpd A, B, or C Y CL = 50 pF 7.2 12.3 1 14 1 14 ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
LOAD
TA = 25°C SN54LV11A SN74LV11A
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
tpd A, B, or C Y CL = 15 pF 3.9* 5.9* 1* 7* 1 7 ns
tpd A, B, or C Y CL = 50 pF 5.4 7.9 1 9 1 9 ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 5)
PARAMETER
SN74LV11A
UNIT
PARAMETER
MIN TYP MAX
UNIT
VOL(P) Quiet output, maximum dynamic VOL 0.2 0.8 V
VOL(V) Quiet output, minimum dynamic VOL 0 −0.8 V
VOH(V) Quiet output, minimum dynamic VOH 3.2 V
VIH(D) High-level dynamic input voltage 2.31 V
VIL(D) Low-level dynamic input voltage 0.99 V
NOTE 5: Characteristics are for surface-mount packages only.
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS VCC TYP UNIT
Cpd
Power dissipation capacitance
CL = 50 pF,
f = 10 MHz
3.3 V 13.9
pF
C
pd
Power dissipation capacitance
C
L
= 50 pF,
f = 10 MHz
5 V 15.4
pF
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("&$# $'" "/# /$*+ ",$ #'!"# '""'0" " '/
$#/" ' ##" "" (' - #"+
SCES345D − DECEMBER 2000 − REVISED APRIL 2005
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
50% VCC
VCC
VCC
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VCC
0 V
50% VCC
50% VCC
Input
Out-of-Phase
Output
In-Phase
Output
Timing Input
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
≈VCC
0 V
50% VCC VOL + 0.3 V
50% VCC ≈0 V
VCC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
TEST S1
VCC
0 V
50% VCC
tw
VOLTAGE WAVEFORMS
PULSE DURATION
Input
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
From Output
Under Test CL
(see Note A)
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
S1
V
CC
RL = 1 kΩ
GND
From Output
Under Test CL
(see Note A)
Test
Point
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Open
50% VCC
50% VCC 50% VCC
50% VCC
50% VCC 50% VCC
50% VCC 50% VCC
VOH − 0.3 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LV11AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ANSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11APW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11APWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV11APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LV11A :
•Automotive: SN74LV11A-Q1
•Enhanced Product: SN74LV11A-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LV11ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LV11ADGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74LV11ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LV11ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74LV11APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LV11ADBR SSOP DB 14 2000 367.0 367.0 38.0
SN74LV11ADGVR TVSOP DGV 14 2000 367.0 367.0 35.0
SN74LV11ADR SOIC D 14 2500 367.0 367.0 38.0
SN74LV11ANSR SO NS 14 2000 367.0 367.0 38.0
SN74LV11APWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
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