3M™ Through-Board Socket
2.54 mm, Single Row, Dual Entry, Surface Mount 963 Series
•High temperature dielectric
•“No lead” reow solder compatible
•Single row design, 3–30 pins
• Mates with pin headers for board stacking
applications
•Dual entry design allows mating from top side
orbottom side through the printed circuit board
•RoHS Compliant. See the Regulatory Information
Appendix (RIA) in the RoHS compliance section of
www.3Mconnectors.com for compliance information
(RIA E1 & C1 apply)
TS-2190-F
Sheet 1 of 2
Physical
Insulation
Material: High Temperature Thermo plastic
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 1.25–2.5 µm [50–100 µ"] Nickel
Wiping Area: Flash Gold
Solder Tail Area: 1–3 µm [40–118 µ"] Matte Tin
Electrical
Current Rating: 2 A
Insulation Resistance: > 5 x 108 Ohm at 100 VDC
Withstanding Voltage: 1000 VDC
Environmental
Temperature Range: -25 °C to +105 °C
Processing Temperature: max. 260 °C (Prole per J-STD-020C)
Moisture Sensitivity Level: 1 (per J-STD-020C)
Interconnect Solutions
www.3Mconnectors.com
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For technical, sales or ordering information
call your Local 3M Service Center
Date Modied: Auguts 27, 2013
UL File No.: E68080