Publication Number S29WS064R_SP Revision 01 Issue Date December 6, 2010
This supplement contains information on the S29WS064R offerings for Industrial temperature range; -40°C to +85°C. Refer to
the S29WS064R standard data sheet (Publication Number S29WS064R_00) for complete device specification.
General Description
The Spansion® S29WS064R is a burst-mode MirrorBit® flash product fabricated on 65 nm process technology. These products
can operate up to 108 MHz using a VCC range of 1.7V to 1.95V. when used in the Industrial temperature range, -40°C to +85°C.
S29WS064R
64 Megabit (4M x 16-bit), CMOS 1.8 Volt-Only,
Simultaneous Read/Write, Multiplexed, Burst-Mode
MirrorBit® Flash Memory
Supplement
2 S29WS064R S29WS064R_SP_01 December 6, 2010
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1. Ordering Information for Industrial Temperature Range
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Notes:
1. Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading “S29” and packing type designator from ordering part number.
S29WS 064 R AB BH I 00 0
Packing Type
0 = Tray (standard) (Note 1)
2 = 7-inch Tape and Reel
3 = 13-inch Tape and Reel
Model Number
00 = Top Boot
01 = Bottom Boot
Temperature Range
I = Industrial (–40°C to +85°C)
Package Type and Material Set
BH = Very Thin Fine-Pitch BGA, Low Halogen Lead (Pb)-free Package
Speed Option (Burst Frequency)
0S = 83 MHz
AA = 104 MHz
AB = 108 MHz
Process Technology
R = 65 nm MirrorBit Technology
Flash Density
064 = 64 Mb
Product Family
S29WS =1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory
S29WS-R Valid Combinations Notes (1), (2)
Base OPN Speed Option Package Type
and Material
Temperature
Range Model Type Packing Type Package Type
(Note 2)
S29WS064R
0S
AA
AB
BH I 00
01
0
2
3
11.6 mm x 8 mm,
84-ball
December 6, 2010 S29WS064R_SP_01 S29WS064R 3
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2. Industrial Temperature Range Specification Exceptions
There are a few specification differences for the industrial temperature range devices when compared to the
wireless temperature range devices. The differences apply to operation of the device between -40°C
to -26°C, and are described below.
2.1 Programming Performance
Notes:
1. Typical program time assumes the following conditions: 25°C, 1.8V VCC, 10,000 cycles. Additionally, programming typically assumes a
checkerboard pattern.
2. Under worst case conditions of –40°C, VCC = 1.70V, 100,000 cycles.
3. System-level overhead is the time required to execute the bus-cycle sequence for the program command. Refer to Table 12.1 of the
S29WS064R standard data sheet (Publication Number S29WS064R_00) for further information on command definitions.
Parameter Typ (Note 1) Max (Note 2) Unit Comments
Single Word Program Time
(using Program Buffer) VCC 170 1600
µs
Excludes system
level
overhead (Note 3)
Total 32-Word Buffer
Programming Time VCC 450 6000
4 S29WS064R S29WS064R_SP_01 December 6, 2010
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3. Revision History
Section Description
Revision 01 (December 6, 2010)
Initial release.
December 6, 2010 S29WS064R_SP_01 S29WS064R 5
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Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2010 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™, EcoRAM™
and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names
used are for informational purposes only and may be trademarks of their respective owners.