S29WS064R 64 Megabit (4M x 16-bit), CMOS 1.8 Volt-Only, Simultaneous Read/Write, Multiplexed, Burst-Mode MirrorBit(R) Flash Memory Supplement This supplement contains information on the S29WS064R offerings for Industrial temperature range; -40C to +85C. Refer to the S29WS064R standard data sheet (Publication Number S29WS064R_00) for complete device specification. General Description The Spansion(R) S29WS064R is a burst-mode MirrorBit(R) flash product fabricated on 65 nm process technology. These products can operate up to 108 MHz using a VCC range of 1.7V to 1.95V. when used in the Industrial temperature range, -40C to +85C. Publication Number S29WS064R_SP Revision 01 Issue Date December 6, 2010 Supplement 1. Ordering Information for Industrial Temperature Range S29WS 064 R AB BH I 00 0 Packing Type 0 = Tray (standard) (Note 1) 2 = 7-inch Tape and Reel 3 = 13-inch Tape and Reel Model Number 00 = Top Boot 01 = Bottom Boot Temperature Range I = Industrial (-40C to +85C) Package Type and Material Set BH = Very Thin Fine-Pitch BGA, Low Halogen Lead (Pb)-free Package Speed Option (Burst Frequency) 0S = 83 MHz AA = 104 MHz AB = 108 MHz Process Technology R = 65 nm MirrorBit Technology Flash Density 064 = 64 Mb Product Family S29WS =1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. S29WS-R Valid Combinations Notes (1), (2) Base OPN Speed Option Package Type and Material Temperature Range 0S S29WS064R AA BH AB I Model Type Packing Type Package Type (Note 2) 0 00 2 01 11.6 mm x 8 mm, 84-ball 3 Notes: 1. Type 0 is standard. Specify other options as required. 2. BGA package marking omits leading "S29" and packing type designator from ordering part number. 2 S29WS064R S29WS064R_SP_01 December 6, 2010 Supplement 2. Industrial Temperature Range Specification Exceptions There are a few specification differences for the industrial temperature range devices when compared to the wireless temperature range devices. The differences apply to operation of the device between -40C to -26C, and are described below. 2.1 Programming Performance Parameter Single Word Program Time (using Program Buffer) VCC Total 32-Word Buffer Programming Time VCC Typ (Note 1) Max (Note 2) 170 1600 Unit s 450 6000 Comments Excludes system level overhead (Note 3) Notes: 1. Typical program time assumes the following conditions: 25C, 1.8V VCC, 10,000 cycles. Additionally, programming typically assumes a checkerboard pattern. 2. Under worst case conditions of -40C, VCC = 1.70V, 100,000 cycles. 3. System-level overhead is the time required to execute the bus-cycle sequence for the program command. Refer to Table 12.1 of the S29WS064R standard data sheet (Publication Number S29WS064R_00) for further information on command definitions. December 6, 2010 S29WS064R_SP_01 S29WS064R 3 Supplement 3. Revision History Section Description Revision 01 (December 6, 2010) Initial release. 4 S29WS064R S29WS064R_SP_01 December 6, 2010 Supplement Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright (c) 2010 Spansion Inc. All rights reserved. Spansion(R), the Spansion logo, MirrorBit(R), MirrorBit(R) EclipseTM, ORNANDTM, EcoRAMTM and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners. December 6, 2010 S29WS064R_SP_01 S29WS064R 5