MC74LCX08 Low-Voltage CMOS Quad 2-Input AND Gate With 5 V-Tolerant Inputs The MC74LCX08 is a high performance, quad 2-input AND gate operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX08 inputs to be safely driven from 5 V devices. Current drive capability is 24 mA at the outputs. * * * * * * http://onsemi.com MARKING DIAGRAMS 14 SO-14 D SUFFIX CASE 751A 14 Designed for 2.3 V to 3.6 V VCC Operation LCX08 AWLYWW 1 5 V Tolerant Inputs - Interface Capability With 5 V TTL Logic 1 LVTTL Compatible 14 LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current (10 A) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA * * ESD Performance: Human Body Model >2000 V; LCX 08 ALYW TSSOP-14 DT SUFFIX CASE 948G 14 1 Machine Model >200 V 1 14 EIAJ SO-14 M SUFFIX CASE 965 14 74LCX08 ALYW 1 1 A L, WL Y W, WW = = = = Assembly Location Wafer Lot Year Work Week ORDERING INFORMATION Device Package Shipping MC74LCX08D SO-14 55 Units/Rail MC74LCX08DR2 SO-14 2500 Units/Reel TSSOP-14 96 Untis/Rail MC74LCX08DT MC74LCX08DTR2 TSSOP-14 Semiconductor Components Industries, LLC, 2001 July, 2001 - Rev. 4 1 2500 Units/Reel MC74LCX08M EIAJ SO-14 50 Units/Rail MC74LCX08MEL EIAJ SO-14 2000 Units/Reel Publication Order Number: MC74LCX08/D MC74LCX08 VCC 14 A2 B2 13 O2 12 A3 11 10 B3 9 A0 O3 B0 8 A1 B1 A2 B2 1 A0 2 3 B0 O0 4 A1 5 B1 6 O1 7 A3 GND B3 1 3 2 O0 4 6 5 O1 13 11 12 O2 10 8 9 Figure 1. Pinout: 14-Lead (Top View) O3 Figure 2. Logic Diagram PIN NAMES TRUTH TABLE Pins Function An, Bn Data Inputs On Outputs Inputs Outputs An Bn On L L L L H L H L L H H H H = High Voltage Level L = Low Voltage Level For ICC reasons, DO NOT FLOAT Inputs MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK Value Condition Unit -0.5 to +7.0 V -0.5 VI +7.0 V -0.5 VO VCC + 0.5 Output in HIGH or LOW State (Note 1.) V DC Input Diode Current -50 VI < GND mA IOK DC Output Diode Current -50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current 50 mA ICC DC Supply Current Per Supply Pin 100 mA IGND DC Ground Current Per Ground Pin 100 mA TSTG Storage Temperature Range -65 to +150 C Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. IO absolute maximum rating must be observed. http://onsemi.com 2 MC74LCX08 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Type Max Unit 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 V 0 5.5 V 0 VCC V VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V VCC = 2.3 V - 2.7 V -24 -12 -8 mA VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V VCC = 2.3 V - 2.7 V +24 +12 +8 mA -40 +85 C 0 10 ns/V VCC Supply Voltage Operating Data Retention Only VI Input Voltage VO Output Voltage (HIGH or LOW State) (3-State) IOH HIGH Level Output Current IOL LOW Level Output Current TA Operating Free-Air Temperature t/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V DC ELECTRICAL CHARACTERISTICS TA = -40C to +85C Symbol VIH VIL VOH VOL Characteristic HIGH Level Input Voltage (Note 2.) LOW Level Input Voltage (Note 2.) HIGH Level Output Voltage LOW Level Output Voltage Condition Min 2.3 V VCC 2.7 V 1.7 2.7 V VCC 3.6 V 2.0 Max V 2.3 V VCC 2.7 V 0.7 2.7 V VCC 3.6 V 0.8 2.3 V VCC 3.6 V; IOH = -100 A VCC - 0.2 VCC = 2.3 V; IOH = -8 mA 1.8 VCC = 2.7 V; IOH = -12 mA 2.2 VCC = 3.0 V; IOH = -18 mA 2.4 VCC = 3.0 V; IOH = -24 mA 2.2 Unit V V 2.3 V VCC 3.6 V; IOL = 100 A 0.2 VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 V II Input Leakage Current 2.3 V VCC 3.6 V; 0 V VI 5.5 V 5 A ICC Quiescent Supply Current 2.3 VCC 3.6 V; VI = GND or VCC 10 A 2.3 VCC 3.6 V; 3.6 VI or VO 5.5 V 10 2.3 VCC 3.6 V; VIH = VCC - 0.6 V 500 ICC Increase in ICC per Input 2. These values of VI are used to test DC electrical characteristics only. http://onsemi.com 3 A MC74LCX08 AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 Limits TA = -40C to +85C Symbol VCC = 3.3 V 0.3 V VCC = 2.7 V VCC = 2.5 V 0.2 V CL = 50 pF CL = 50 pF CL = 30 pF Parameter Waveform Min Max Min Max Min Max Unit tPLH Propagation Delay Time 1 1.5 5.5 1.5 6.2 1.5 6.6 ns tPHL Input to Output 1.5 5.5 1.5 6.2 1.5 6.6 tOSHL Output-to-Output Skew 1.0 tOSLH (Note 3.) 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25C Symbol VOLP VOLV Characteristic Condition Min Typ Max Unit Dynamic LOW Peak Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V (Note 4.) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.6 V Dynamic LOW Valley Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V -0.8 V (Note 4.) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V -0.6 V 4. Number of outputs defined as "n". Measured with "n-1" outputs switching from HIGH-to-LOW or LOW-to-HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF http://onsemi.com 4 MC74LCX08 Vcc Vmi An, Bn Vmi 0V tPHL tPLH VOH Vmo On Vmo VOL WAVEFORM 1 - PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Vcc Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V Vmi 1.5 V 1.5 V Vcc/2 Vmo 1.5 V 1.5 V Vcc/2 Figure 3. AC Waveforms VCC PULSE GENERATOR DUT RT CL = CL = RL = RT = CL RL 50 pF at VCC = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 or equivalent ZOUT of pulse generator (typically 50 ) Figure 4. Test Circuit http://onsemi.com 5 MC74LCX08 PACKAGE DIMENSIONS SO-14 D SUFFIX CASE 751A-03 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- 14 8 -B- 1 P 7 PL 0.25 (0.010) 7 G B M M F R X 45 C -T- SEATING PLANE D 14 PL 0.25 (0.010) T B M J M K S A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 TSSOP-14 DT SUFFIX CASE 948G-01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B -U- L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E CCC EEE CCC EEE CCC K A -V- K1 J J1 SECTION N-N -W- C 0.10 (0.004) -T- SEATING PLANE D G H DETAIL E http://onsemi.com 6 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.193 0.200 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 MC74LCX08 PACKAGE DIMENSIONS EIAJ SO-14 M SUFFIX CASE 965-01 ISSUE O 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 8 Q1 E HE L 7 1 M DETAIL P Z D VIEW P A e c A1 b 0.13 (0.005) M 0.10 (0.004) http://onsemi.com 7 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 --1.42 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 --0.056 MC74LCX08 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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