CYStech Electronics Corp.
Spec. No. : C332SN
Issued Date : 2003.04.15
Revised Date :
Page No. : 1/3
CDSS355ASN CYStek Product Specification
100V/100mA SURFACE MOUNT SWITCHING DIODE
CDSS355A
Features:
● Designed for mounting on small surface
● High speed switching
● High mounting capability, strong surge withstand, high reliability
Mechanical data:
● Case: 0805(2012) Standard package, molded plastic
● Terminals : Solder plated, solderable per MIL-STD-750, method 2026.
● Polarity: Indicated by cathode band
● Mounting position: Any
● Weight: 4.8mg (approximately)
Absolute Maximum Ratings(Ta=25℃)
Characteristics Symbol Value Unit
Repetitive Peak Reverse Voltage VRRM 110 V
Reverse Voltage VR 100 V
Average Forward Current @ 8.3ms single half sinewave
superimposed on rated load(JEDEC method) IO 100 mA
Peak Forward Surge Current @ single sinewave, 60Hz IFSM 1.0 A
Power Dissipation PD 300 mW
Junction Temperature Tj -55 to +125 °C
Storage Temperature Range Tstg -55 to +125 °C
Electrical Characteristics ( Tj=25°C)
Characteristics Symbol Min Typ Max Unit
Forward Voltage at IF=100mA VF - - 1 V
Reverse Leakage Current at VR=100V IR - - 100 nA
Diode Capacitance at VR = 1V CD - - 3 pF
Reverse Recovery Time From
IF=-IR=10mA to IRR=-1mA, VR=6V, RL=50Ω trr - - 4 ns
CYStech Electronics Corp.
Spec. No. : C332SN
Issued Date : 2003.04.15
Revised Date :
Page No. : 2/3
CDSS355ASN CYStek Product Specification
Characteristic Curves
Forward Current vs Forward Voltage
1
10
100
1000
0 0.2 0.4 0.6 0.8 1 1.2
Forward Voltage---VF(V)
Forward Current---IF(mA)
125℃
75℃
25℃
-25℃
Reverse Leakage Current vs Temperature
1
10
100
1000
10000
0 1020304050607080
Ambient Temperature---TA(℃)
Reverse Leakage Current---IR(n
A)
125℃
75℃
25℃
Diode Capacitance vs Reverse Voltage
0
1
2
3
4
5
02468101214
Reverse Voltage---VR(V)
Diode Capacitance---CD(pF)
f=1MHz
Ta=25℃
Forward Current vs Ambient Temperature
0
25
50
75
100
125
0 25 50 75 100 125 150
Ambient Temperature---Ta(℃)
Percentage of Peak Aver
age
Forward Current(%)
Mounting on glass epoxy PCBs
CYStech Electronics Corp.
Spec. No. : C332SN
Issued Date : 2003.04.15
Revised Date :
Page No. : 3/3
CDSS355ASN CYStek Product Specification
0805(2012) Dimension
*:Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max.
DIM Min. Max. Min. Max.
A 0.079 0.087 2.00 2.20 C 0.047 0.055 1.20 1.40
B 0.016(typ.) 0.40(typ.) D 0.035 0.043 0.90 1.10
R 0.008(tup.) 0.20(typ.)
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
A
B
C
D
R
0805 surface mount package
CYStek package code:SN
