DMNH6021SPD
Document number: DS37392 Rev. 3 - 2
1 of 7
www.diodes.com
June 2016
© Diodes Incorporated
DMNH6021SPD
60V 175°C DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
PowerDI
Product Summary
V(BR)DSS
RDS(ON) Max
ID Max
TC = +25°C
60V
25m @ VGS = 10V
32A
40m @ VGS = 4.5V
25A
Description
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)), yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Applications
Backlighting
Power Management Functions
DC-DC Converters
Features and Benefits
Rated to +175°C Ideal for High Ambient Temperature
Environments
100% Unclamped Inductive Switching Ensures More Reliable
and Robust End Application
High Conversion Efficiency
Low RDS(ON) Minimizes On-State Losses
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
An Automotive-Complaint Part is Available Under Separate
Datasheet (DMNH6021SPDQ)
Mechanical Data
Case: PowerDI®5060-8 (Type C)
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)
Ordering Information (Note 4)
Part Number
Case
Packaging
DMNH6021SPD-13
PowerDI5060-8 (Type C)
2,500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
3. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Pin out
Top View
Equivalent Circuit
= Manufacturer’s Marking
H6021SD = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 16 = 2016)
WW = Week (01 - 53)
D1
S1
G1
D2
S2
G2
Bottom View
Top View
Pin1
S1
D2
D1
G2
D1
D2
G1
S2
PowerDI is a registered trademark of Diodes Incorporated.
DMNH6021SPD
Document number: DS37392 Rev. 3 - 2
2 of 7
www.diodes.com
June 2016
© Diodes Incorporated
DMNH6021SPD
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
60
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current (Note 6) VGS = 10V
TA = +25°C
TA = +70°C
ID
8.2
6.5
A
Continuous Drain Current (Note 7) VGS = 10V
TC = +25°C
TC = +100°C
ID
32
22
A
Pulsed Drain Current (38s Pulse, Duty Cycle = 1%)
IDM
80
A
Maximum Continuous Body Diode Forward Current (Note 7)
IS
32
A
Avalanche Current, L = 0.1mH (Note 8)
IAS
35
A
Avalanche Energy, L = 0.1mH (Note 8)
EAS
64
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
PD
1.5
W
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RθJA
99
°C/W
t<10s
53
Total Power Dissipation (Note 6)
PD
2.8
W
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RθJA
54
°C/W
t<10s
27
Thermal Resistance, Junction to Case (Note 7)
RθJC
2.2
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +175
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
BVDSS
60
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = +25°C
IDSS
1
µA
VDS = 60V, VGS = 0V
Gate-Source Leakage
IGSS
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
VGS(TH)
1
3
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS(ON)
15
25
m
VGS = 10V, ID = 15A
21
40
VGS = 4.5V, ID = 12A
Diode Forward Voltage
VSD
0.75
1.2
V
VGS = 0V, IS = 2.6A
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
CISS
1,143
pF
VDS = 25V, VGS = 0V,
f = 1MHz
Output Capacitance
COSS
168
pF
Reverse Transfer Capacitance
CRSS
69
pF
Gate Resistance
RG
2.1
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 10V)
QG
20.1
nC
VDS = 30V, ID = 20A,
Total Gate Charge (VGS = 6V)
QG
12
nC
Gate-Source Charge
QGS
4.3
nC
Gate-Drain Charge
QGD
5.5
nC
Turn-On Delay Time
tD(ON)
4.4
ns
VDD = 30V, VGS = 10V,
RG = 4.7, , ID = 20A
Turn-On Rise Time
tR
6.0
ns
Turn-Off Delay Time
tD(OFF)
14.2
ns
Turn-Off Fall Time
tF
5.4
ns
Body Diode Reverse Recovery Time
tRR
21.2
ns
IF=20A, di/dt=100A/μs
Body Diode Reverse Recovery Charge
QRR
15.2
nC
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = 25°C
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.
DMNH6021SPD
Document number: DS37392 Rev. 3 - 2
3 of 7
www.diodes.com
June 2016
© Diodes Incorporated
DMNH6021SPD
0
5
10
15
20
25
30
0 0.5 1 1.5 2 2.5 3
V = 3.0V
GS
V = 3.5V
GS
V = 4.5V
GS
V = 8V
GS
V = 10V
GS
V = 4V
GS
I , DRAIN CURRENT (A)
D
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 1 Typical Output Characteristic
0
5
10
15
20
25
30
1.5 2 2.5 3 3.5 4
V = 5.0V
DS
T = 150°C
A
T = 125°C
AT = 85°C
A
T = 25°C
A
T = -55°C
A
T = 175°C
A
I , DRAIN CURRENT (A)
D
V , GATE-SOURCE VOLTAGE (V)
GS
Figure 2 Typical Transfer Characteristics
5
10
15
20
25
30
510 15 20 25 30 35 40 45 50
V = 4.5V
GS
V = 10V
GS
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
I , DRAIN-SOURCE CURRENT (A)
D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
5
10
15
20
25
30
35
40
2 4 6 8 10 12 14 16 18 20
I = 12A
D
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
V , GATE-SOURCE VOLTAGE (V)
GS
Figure 4 Typical Drain-Source On-Resistance
vs. Gate-Source Voltage
0
5
10
15
20
25
30
35
40
0 5 10 15 20 25 30 35 40 45 50
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 12C
A
T = 15C
A
V = 10V
GS
T = 17C
A
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
I , DRAIN CURRENT (A)
D
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
-50 -25 0 25 50 75 100 125 150 175
V = 4.5V
GS
I = 5A
D
V = 10V
GS
I = 12A
D
R , DRAIN-SOURCE
DS(ON)
ON-RESISTANCE (NORMALIZED)
T , JUNCTION TEMPERATURE ( C)
J
Figure 6 On-Resistance Variation with Temperature
DMNH6021SPD
Document number: DS37392 Rev. 3 - 2
4 of 7
www.diodes.com
June 2016
© Diodes Incorporated
DMNH6021SPD
0
5
10
15
20
25
30
35
40
-50 -25 0 25 50 75 100 125 150 175
V = 4.5V
GS
I = 12A
D
V = 10V
GS
I = 12A
D
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
T , JUNCTION TEMPERATURE ( C)
J
Figure 7 On-Resistance Variation with Temperature
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
-50 -25 0 25 50 75 100 125 150 175
I = 1mA
D
I = 25A
D
V , GATE THRESHOLD VOLTAGE (V)
GS(th)
T , JUNCTION TEMPERATURE ( C)
J
Figure 8 Gate Threshold Variation vs. Ambient Temperature
1
8
15
22
29
36
43
50
0 0.3 0.6 0.9 1.2 1.5
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
T = 175°C
A
I , SOURCE CURRENT (A)
S
V , SOURCE-DRAIN VOLTAGE (V)
SD
Figure 9 Diode Forward Voltage vs. Current
10
100
1000
10000
0 5 10 15 20 25 30 35 40 45 50 55 60
Ciss
Coss
Crss
f=1MHz
C , JUNCTION CAPACITANCE (pF)
T
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 10 Typical Junction Capacitance
0
2
4
6
8
10
0 2 4 6 8 10 12 14 16 18 20
V = 30V
DS
I = 20A
D
V GATE THRESHOLD VOLTAGE (V)
GS
Q , TOTAL GATE CHARGE (nC)
gFigure 11 Gate Charge
0.1
1
10
100
0.1 1 10 100
RDS(on)
Limited
DC
P = 100ms
W
P = 10ms
W
P = 1ms
W
P = 10µs
W
T = 175°C
J(max)
T = 2C
C
V = 10V
GS
Single Pulse
DUT on Infinite Heatsink
P = s
W
I , DRAIN CURRENT (A)
D
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 12 SOA, Safe Operation Area
DMNH6021SPD
Document number: DS37392 Rev. 3 - 2
5 of 7
www.diodes.com
June 2016
© Diodes Incorporated
DMNH6021SPD
0.001
0.01
0.1
1
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10
D = 0.5
D = 0.7
D = 0.9
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
r(t), TRANSIENT THERMAL RESISTANCE
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
R (t) = r(t) * R
JC JC
R = 2.2°C/W
JC
Duty Cycle, D = t1/ t2
DMNH6021SPD
Document number: DS37392 Rev. 3 - 2
6 of 7
www.diodes.com
June 2016
© Diodes Incorporated
DMNH6021SPD
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8 (Type C)
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8 (Type C)
PowerDI5060-8 (Type C)
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0
0.05
0.02
b
0.33
0.51
0.41
b1
0.300
0.366
0.333
b2
0.20
0.35
0.25
c
0.23
0.33
0.277
D
5.15 BSC
D1
4.85
4.95
4.90
D2
1.40
1.60
1.50
D3
-
-
3.98
E
6.15 BSC
E1
5.75
5.85
5.80
E2
3.56
3.76
3.66
e
1.27BSC
k
-
-
1.27
k1
0.56
-
-
L
0.51
0.71
0.61
La
0.51
0.71
0.61
L1
0.05
0.20
0.175
L4
-
-
0.125
M
3.50
3.71
3.605
x
-
-
1.400
y
-
-
1.900
θ
10°
12°
11°
θ1
All Dimensions in mm
Dimensions
Value
(in mm)
C
1.270
G
0.660
G1
0.820
X
0.610
X1
3.910
X2
1.650
X3
1.650
X4
4.420
Y
1.270
Y1
1.020
Y2
3.810
Y3
6.610
DETAIL A
0(4x)
Seating Plane
A1
c
e
01(4x)
D1
E1
D
E
1
y
x
Ø1.000 Depth 0.07±0.030
A
DETAIL A
Lk
M
L1
D2
La
E2
b(8x) e/2
1
b1(8x)
b2(2x)
D2
k1
D3
L4
1
8
Y3
X4
Y1
Y2
X1
G1
X C
Y(4x)
G
X2
X3
DMNH6021SPD
Document number: DS37392 Rev. 3 - 2
7 of 7
www.diodes.com
June 2016
© Diodes Incorporated
DMNH6021SPD
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com