LTM4622 Dual Ultrathin 2.5A or Single 5A Step-Down DC/DC Module Regulator FEATURES DESCRIPTION Complete Solution in <1cm2 n Wide Input Voltage Range: 3.6V to 20V n 3.3V Input Compatible with V Tied to INTV IN CC n 0.6V to 5.5V Output Voltage n Dual 2.5A (3A Peak) or Single 5A Output Current n 1.5% Maximum Total Output Voltage Regulation Error Over Load, Line and Temperature n Current Mode Control, Fast Transient Response n External Frequency Synchronization n Multiphase Parallelable with Current Sharing n Output Voltage Tracking and Soft-Start Capability n Selectable Burst Mode(R) Operation n Overvoltage Input and Overtemperature Protection n Power Good Indicators n 6.25mm x 6.25mm x 1.82mm LGA and 6.25mm x 6.25mm x 2.42mm BGA Packages The LTM(R)4622 is a complete dual 2.5A step-down switching mode Module(R) (powermodule) regulator in a tiny ultrathin 6.25mm x 6.25mm x 1.82mm LGA and 6.25mm x 6.25mm x 2.42mm BGA packages. Included in the package are the switching controller, power FETs, inductor and support components. Operating over an input voltage range of 3.6V to 20V, the LTM4622 supports an output voltage range of 0.6V to 5.5V, set by a single external resistor. Its high efficiency design delivers dual 2.5A continuous, 3A peak, output current. Only a few ceramic input and output capacitors are needed. APPLICATIONS Fault protection features include input overvoltage, output overcurrent and overtemperature protection. General Purpose Point-of-Load Conversion Telecom, Networking and Industrial Equipment n Medical Diagnostic Equipment n Test and Debug Systems The LTM4622 is available with SnPb (BGA) or RoHS compliant terminal finish. n The LTM4622 supports selectable Burst Mode operation and output voltage tracking for supply rail sequencing. Its high switching frequency and current mode control enable a very fast transient response to line and load changes without sacrificing stability. n n All registered trademarks and trademarks are the property of their respective owners. TYPICAL APPLICATION 1.5V and 1V Dual Output DC/DC Step-Down Module Regulator 1.5V Output Efficiency vs Load Current 95 VIN 3.6V TO 20V PGOOD2 VOUT1 4.7F 25V VIN2 RUN1 47F LTM4622 VOUT2 RUN2 INTVCC COMP1 SYNC/MODE COMP2 TRACK/SS1 FB1 TRACK/SS2 FB2 FREQ 47F VOUT2 1.5V, 2.5A 85 80 75 70 65 40.2k GND 90 VOUT1 1V, 2.5A EFFICIENCY (%) PGOOD1 VIN1 90.9k 4622 TA01a 60 VIN = 5V VIN = 12V 0 0.5 1.0 1.5 2.0 LOAD CURRENT (A) 2.5 3 4622 TA01b Rev. H Document Feedback For more information www.analog.com 1 LTM4622 ABSOLUTE MAXIMUM RATINGS (Note 1) VIN1, VIN2.................................................... -0.3V to 22V VOUT.............................................................. -0.3V to 6V PGOOD1, PGOOD2...................................... -0.3V to 18V RUN1, RUN2..................................... -0.3V to VIN + 0.3V INTVCC, TRACK/SS1, TRACK/SS2............. -0.3V to 3.6V SYNC/MODE, COMP1, COMP2, FB1, FB2................................................ -0.3V to INTVCC PIN CONFIGURATION Operating Internal Temperature Range (Note 2)................................................... -40C to 125C Storage Temperature Range................... -55C to 125C Peak Solder Reflow Body Temperature.................. 260C (See Pin Functions, Pin Configuration Table) TOP VIEW TOP VIEW SYNC/ COMP2 GND MODE GND COMP1 SYNC/ COMP2 GND MODE GND COMP1 5 PGOOD2 FB2 INTVCC 4 TRACK/SS2 VIN2 3 RUN2 2 VIN2 VOUT2 1 5 PGOOD2 FB2 INTVCC 4 TRACK/SS2 VIN2 3 RUN2 2 VIN2 VOUT2 1 FREQ PGOOD1 FB1 VIN1 TRACK/SS1 RUN1 VIN1 GND VOUT1 A FREQ PGOOD1 FB1 VIN1 TRACK/SS1 RUN1 VIN1 GND VOUT1 A B C D E LGA PACKAGE 25-LEAD (6.25mm x 6.25mm x 1.82mm) TJMAX = 125C, JCtop = 17C/W, JCbottom = 11C/W, JB + BA = 22C/W, JA = 22C/W, WEIGHT = 0.21g B C D E BGA PACKAGE 25-LEAD (6.25mm x 6.25mm x 2.42mm) TJMAX = 125C, JCtop = 17C/W, JCbottom = 11C/W, JB + BA = 22C/W, JA = 22C/W, WEIGHT = 0.25g ORDER INFORMATION PART MARKING* PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE PACKAGE TYPE MSL RATING TEMPERATURE RANGE (Note 2) LTM4622EV#PBF Au (RoHS) LTM4622V e4 LGA 4 -40C to 125C LTM4622IV#PBF Au (RoHS) LTM4622V e4 LGA 4 -40C to 125C LTM4622EY#PBF SAC305 (RoHS) LTM4622Y e1 BGA 4 -40C to 125C LTM4622IY#PBF SAC305 (RoHS) LTM4622Y e1 BGA 4 -40C to 125C LTM4622IY SnPb (63/37) LTM4622Y e0 BGA 4 -40C to 125C * Device temperature grade is indicated by a label on the shipping container. * Pad or ball finish code is per IPC/JEDEC J-STD-609. * BGA Package and Tray Drawings * This product is not recommended for second side reflow. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. Rev. H 2 For more information www.analog.com LTM4622 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full internal operating temperature range (Note 2). Specified as each individual output channel at TA = 25C, VIN1 = VIN2 = 12V, unless otherwise noted per the typical application shown in Figure24. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Switching Regulator Section: per Channel VIN1 Input DC Voltage l 3.6 VIN2 Input DC Voltage VIN_3.3 3.3V Input DC Voltage VOUT(RANGE) 3.6V < VIN1 <20V l 1.5 VIN1 = VIN2 = INTVCC l 3.1 Output Voltage Range VIN1 = VIN2 = 3.6V to 20V l 0.6 VOUT(DC) Output Voltage, Total Variation with Line and Load CIN = 22F, COUT = 100F Ceramic, RFB = 40.2k, MODE = INTVCC, VIN1 = VIN2 = 3.6V to 20V, IOUT = 0A to 2.5A l 1.477 VRUN RUN Pin On Threshold RUN Threshold Rising RUN Threshold Falling 1.20 0.97 IQ(VIN) Input Supply Bias Current VIN1 = VIN2 = 12V, VOUT = 1.5V, MODE = GND VIN1 = VIN2 = 12V, VOUT = 1.5V, MODE = INTVCC Shutdown, RUN1 = RUN2 = 0 11 500 45 mA A A IS(VIN) Input Supply Current VIN1 = VIN2 = 12V, VOUT = 1.5V, IOUT = 2.5A 0.35 A IOUT(DC) Output Continuous Current Range VIN1 = VIN2 = 12V, VOUT = 1.5V (Note 3) l VOUT (Line)/VOUT Line Regulation Accuracy VOUT = 1.5V, VIN1 = VIN2 = 3.6V to 20V, IOUT = 0A l VOUT = 1.5V, IOUT = 0A to 2.5A l VOUT (Load)/VOUT Load Regulation Accuracy 20 V 20 V 3.5 V 5.5 V 1.50 1.523 V 1.27 1.00 1.35 1.03 V V 3.3 0 2.5 A 0.01 0.1 %/V 0.2 1.0 % VOUT(AC) Output Ripple Voltage IOUT = 0A, COUT = 100F Ceramic, VIN1 = VIN2 = 12V, VOUT = 1.5V 5 mV VOUT(START) Turn-On Overshoot IOUT = 0A, COUT = 100F Ceramic, VIN1 = VIN2 = 12V, VOUT = 1.5V 30 mV tSTART Turn-On Time COUT = 100F Ceramic, No Load, TRACK/SS = 0.01F, VIN1 = VIN2 = 12V, VOUT = 1.5V 4.3 ms VOUTLS Peak Deviation for Dynamic Load Load: 0% to 50% to 0% of Full Load, COUT = 100F Ceramic, VIN1 = VIN2 = 12V, VOUT = 1.5V 100 mV tSETTLE Settling Time for Dynamic Load Step Load: 0% to 50% to 0% of Full Load, COUT = 100F Ceramic, VIN1 = VIN2 = 12V, VOUT = 1.5V 20 s IOUTPK Output Current Limit VIN1 = VIN2 = 12V, VOUT = 1.5V 3 4 A VFB Voltage at FB Pin IOUT = 0A, VOUT = 1.5V 0.592 0.60 0.608 IFB Current at FB Pin (Note 4) 30 nA RFBHI Resistor Between VOUT and FB Pins 60.00 60.40 60.80 k ITRACK/SS Track Pin Soft-Start Pull-Up Current tSS tON(MIN) l V TRACK/SS = 0V 1.4 A Internal Soft-Start Time 10% to 90% Rise Time (Note 4) 400 Minimum On-Time (Note 4) 20 ns tOFF(MIN) Minimum Off-Time (Note 4) 45 ns VPGOOD PGOOD Trip Level VFB With Respect to Set Output VFB Ramping Negative VFB Ramping Positive -8 8 700 -14 14 s % % Rev. H For more information www.analog.com 3 LTM4622 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full internal operating temperature range (Note 2). Specified as each individual output channel at TA = 25C, VIN1 = VIN2 = 12V, unless otherwise noted per the typical application shown in Figure24. SYMBOL PARAMETER CONDITIONS MIN TYP 3.1 3.3 RPGOOD PGOOD Pull-Down Resistance 1mA Load VINTVCC Internal VCC Voltage VIN1 = VIN2 = 3.6V to 20V VINTVCC Load Reg INTVCC Load Regulation ICC = 0mA to 50mA 1.3 fOSC Oscillator Frequency fSYNC Frequency Sync Range With Respect to Set Frequency 30 % IMODE MODE Input Current MODE = INTVCC -1.5 A 20 1 Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTM4622 is tested under pulsed load conditions such that TJ TA. The LTM4622E is guaranteed to meet performance specifications over the 0C to 125C internal operating temperature range. Specifications over the full -40C to 125C internal operating temperature range are assured by design, characterization and correlation with statistical process controls. The LTM4622I is guaranteed to meet specifications over the full -40C to 125C internal operating temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. MAX UNITS 3.5 V % MHz Note 3: See output current derating curves for different VIN, VOUT and TA. Note 4: 100% tested at wafer level. Note 5: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability. Rev. H 4 For more information www.analog.com LTM4622 TYPICAL PERFORMANCE CHARACTERISTICS Efficiency vs Load Current at 12VIN Efficiency vs Load Current at 3.3VIN 95 95 90 90 90 85 85 85 80 75 70 OUTPUT: 3.3V, 2MHz 1.8V, 1MHz 1.2V, 1MHz 65 60 0 0.5 EFFICIENCY (%) 95 EFFICIENCY (%) EFFICIENCY (%) Efficiency vs Load Current at 5VIN 80 75 OUTPUT: 5.0V, 2.5MHz 2.5V, 1.5MHz 1.5V, 1MHz 1.0V, 1MHz 70 2.5V, 1.5MHz 1.5V, 1MHz 1.0V, 1MHz 1.0 1.5 2.0 LOAD CURRENT (A) 2.5 65 3 60 0 0.5 4622 G01 Burst Mode Efficiency, 12VIN, 1.5VOUT 1.0 1.5 2.0 LOAD CURRENT (A) 75 70 3.3V, 2MHz 1.8V, 1MHz 1.2V, 1MHz 2.5 80 OUTPUT: 2.5V, 1.5MHz 1.5V, 1MHz 1.0V, 1MHz 65 60 3 4622 G02 0 0.5 1.0 1.5 2.0 LOAD CURRENT (A) 1.8V, 1MHz 1.2V, 1MHz 2.5 3 4622 G02b 1.2V Output Transient Response 1V Output Transient Response 100 90 Burst Mode OPERATION EFFICIENCY (%) 80 70 VOUT 100mV/DIV AC-COUPLED VOUT 100mV/DIV AC-COUPLED LOAD STEP 1A/DIV LOAD STEP 1A/DIV 60 50 CCM 40 30 20 10 0 0.01 0.1 LOAD CURRENT (A) 4622 G04 VIN = 12V 20s/DIV VOUT = 1V FS = 1MHz OUTPUT CAPACITOR = 1 x 47F CERAMIC LOAD STEP = 1.25A TO 2.5A 4622 G05 VIN = 12V 20s/DIV VOUT = 1.2V FS = 1MHz OUTPUT CAPACITOR = 1 x 47F CERAMIC LOAD STEP = 1.25A TO 2.5A 1.8V Output Transient Response 2.5V Output Transient Response 1 4622 G03 1.5V Output Transient Response VOUT 100mV/DIV AC-COUPLED LOAD STEP 1A/DIV 4622 G06 VIN = 12V 20s/DIV VOUT = 1.5V FS = 1MHz OUTPUT CAPACITOR = 1 x 47F CERAMIC LOAD STEP = 1.25A TO 2.5A VOUT 100mV/DIV AC-COUPLED VOUT 100mV/DIV AC-COUPLED LOAD STEP 1A/DIV LOAD STEP 1A/DIV 4622 G07 VIN = 12V 20s/DIV VOUT = 1.8V FS = 1MHz OUTPUT CAPACITOR = 1 x 47F CERAMIC LOAD STEP = 1.25A TO 2.5A 4622 G08 VIN = 12V 20s/DIV VOUT = 2.5V FS = 1.5MHz OUTPUT CAPACITOR = 1 x 47F CERAMIC LOAD STEP = 1.25A TO 2.5A Rev. H For more information www.analog.com 5 LTM4622 TYPICAL PERFORMANCE CHARACTERISTICS Start-Up with No Load Current Applied 5V Output Transient Response 3.3V Output Transient Response SW 10V/DIV VOUT 100mV/DIV AC-COUPLED VOUT 100mV/DIV AC-COUPLED VOUT 1V/DIV LOAD STEP 1A/DIV LOAD STEP 1A/DIV 4622 G10 VIN = 12V 20s/DIV VOUT = 5V FS = 2.5MHz OUTPUT CAPACITOR = 1 x 47F CERAMIC LOAD STEP = 1.25A TO 2.5A 4622 G09 20s/DIV VIN = 12V VOUT = 3.3V FS = 2MHz OUTPUT CAPACITOR = 1 x 47F CERAMIC LOAD STEP = 1.25A TO 2.5A RUN 10V/DIV 4622 G11 VIN = 12V 20ms/DIV VOUT = 1.8V FS = 1MHz INPUT CAPACITOR = 1 x 22F OUTPUT CAPACITOR = 1 x 22F + 1 x 47F CERAMIC SOFT-START CAP = 0.1F Short-Circuit with 2.5A Load Current Applied Short-Circuit with No Load Current Applied Start-Up with 2.5A Load Current Applied SW 10V/DIV SW 10V/DIV SW 10V/DIV VOUT 1V/DIV VOUT 1V/DIV VOUT 1V/DIV RUN 10V/DIV IIN 2A/DIV IIN 500mA/DIV 4622 G12 VIN = 12V 200ms/DIV VOUT = 1.8V FS = 1MHz INPUT CAPACITOR = 1 x 22F OUTPUT CAPACITOR = 1 x 22F + 1 x 47F CERAMIC SOFT-START CAP = 0.1F 4622 G13 VIN = 12V 20s/DIV VOUT = 1.8V FS = 1MHz INPUT CAPACITOR = 1 x 22F OUTPUT CAPACITOR = 1 x 22F + 1 x 47F CERAMIC 4622 G14 VIN = 12V 20s/DIV VOUT = 1.8V FS = 1MHz INPUT CAPACITOR = 1 x 22F OUTPUT CAPACITOR = 1 x 22F + 1 x 47F CERAMIC Recover from Short-Circuit with No Load Current Applied Steady-State Output Voltage Ripple Start-Up into Pre-Biased Output SW 10V/DIV SW 10V/DIV VOUT 10mV/DIV AC-COUPLED VOUT 1V/DIV VOUT 1V/DIV SW 5V/DIV IIN 2A/DIV 4622 G15 VIN = 12V 20s/DIV VOUT = 1.8V FS = 1MHz INPUT CAPACITOR = 1 x 22F OUTPUT CAPACITOR = 1 x 22F + 1 x 47F CERAMIC RUN 10V/DIV 4622 G16 VIN = 12V 1s/DIV VOUT = 1.8V FS = 1MHz INPUT CAPACITOR = 1 x 22F OUTPUT CAPACITOR = 1 x 22F + 1 x 47F CERAMIC 4622 G17 VIN = 12V 50ms/DIV VOUT = 1.8V FS = 1MHz INPUT CAPACITOR = 1 x 22F OUTPUT CAPACITOR = 1 x 22F + 1 x 47F CERAMIC Rev. H 6 For more information www.analog.com LTM4622 PIN FUNCTIONS PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG Module PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY. VIN1 (D3, E2), VIN2 (A2, B3): Power Input Pins. Apply input voltage between these pins and GND pins. Recommend placing input decoupling capacitance directly between BOTH VIN1 and VIN2 pins and GND pins. Please note the module internal control circuity is running off VIN1. Channel 2 will not work without a voltage higher that 3.6V present at VIN1. GND (C1 to C2, B5, D5): Power Ground Pins for Both Input and Output Returns. INTVCC (C3): Internal 3.3V Regulator Output. The internal power drivers and control circuits are powered from this voltage. This pin is internally decoupled to GND with a 2.2F low ESR ceramic capacitor. No additional external decoupling capacitor needed. SYNC/MODE (C5): Mode Select and External Synchronization Input. Tie this pin to ground to force continuous synchronous operation at all output loads. Floating this pin or tying it to INTVCC enables high efficiency Burst Mode operation at light loads. Drive this pin with a clock to synchronize the LTM4622 switching frequency. An internal phase-locked loop will force the bottom power NMOS's turn on signal to be synchronized with the rising edge of the clock signal. When this pin is driven with a clock, forced continuous mode is automatically selected. VOUT1 (D1, E1), VOUT2 (A1, B1): Power Output Pins of Each Switching Mode Regulator. Apply output load between these pins and GND pins. Recommend placing output decoupling capacitance directly between these pins and GND pins. FREQ (C4): Frequency is set internally to 1MHz. An external resistor can be placed from this pin to GND to increase frequency, or from this pin to INTVCC to reduce frequency. See the Applications Information section for frequency adjustment. RUN1 (D2), RUN2 (B2): Run Control Input of Each Switching Mode Regulator Channel. Enables chip operation by tying RUN above 1.27V. Tying this pin below 1V shuts down the specific regulator channel. Do not float this pin. PGOOD1 (D4), PGOOD2 (B4): Output Power Good with Open-Drain Logic of Each Switching Mode Regulator Channel. PGOOD is pulled to ground when the voltage on the FB pin is not within 8% (typical) of the internal 0.6V reference. TRACK/SS1 (E3), TRACK/SS2 (A3): Output Tracking and Soft-Start Pin of Each Switching Mode Regulator Channel. It allows the user to control the rise time of the output voltage. Putting a voltage below 0.6V on this pin bypasses the internal reference input to the error amplifier, instead it servos the FB pin to the TRACK voltage. Above 0.6V, the tracking function stops and the internal reference resumes control of the error amplifier. There's an internal 1.4A pull-up current from INTVCC on this pin, so putting a capacitor here provides soft-start function. A default internal soft-start ramp forces a minimum soft-start time of 400s. FB1 (E4), FB2 (A4): The Negative Input of the Error Amplifier for Each Switching Mode Regulator Channel. Internally, this pin is connected to VOUT with a 60.4k precision resistor. Different output voltages can be programmed with an additional resistor between FB and GND pins. In PolyPhase(R) operation, tying the FB pins together allows for parallel operation. See the Applications Information section for details. COMP1 (E5), COMP2 (A5): Current Control Threshold and Error Amplifier Compensation Point of Each Switching Mode Regulator Channel. The current comparator's trip threshold is linearly proportional to this voltage, whose normal range is from 0.3V to 1.8V. Tie the COMP pins together for parallel operation. The device is internal compensated. Do not drive this pin. Rev. H For more information www.analog.com 7 LTM4622 BLOCK DIAGRAM VOUT1 VOUT2 60.4k FB1 60.4k 60.4k FB2 40.2k INTVCC PGOOD1 10k PGOOD2 10k INTVCC VIN1 2.2F 0.22F TRACK/SS1 1H VOUT1 1.2V 2.5A VOUT1 0.1F 1F TRACK/SS2 VIN 3.6V TO 20V 22F SYNC/MODE 0.1F INTVCC 47F GND RUN1 RUN2 VIN2 COMP1 0.22F POWER CONTROL INTERNAL COMP 1H 10F VOUT2 1.5V 2.5A VOUT2 1F COMP2 47F GND INTERNAL COMP FREQ 324k 4622 BD Figure1. Simplified LTM4622 Block Diagram DECOUPLING REQUIREMENTS SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS CIN External Input Capacitor Requirement (VIN = 3.6V to 20V, VOUT = 1.5V) IOUT = 2.5A 4.7 10 F COUT External Output Capacitor Requirement (VIN = 3.6V to 20V, VOUT = 1.5V) IOUT = 2.5A 22 47 F Rev. H 8 For more information www.analog.com LTM4622 OPERATION The LTM4622 is a dual output standalone non-isolated switch mode DC/DC power supply. It can deliver two 2.5A DC, 3A peak output current with few external input and output ceramic capacitors. This module provides dual precisely regulated output voltage programmable via two external resistor from 0.6V to 5.5V over 3.6V to 20V input voltage range. With INTVCC tied to VIN, this module is able to operate from 3.3V input. The typical application schematic is shown in Figure24. The LTM4622 contains an integrated controlled on-time valley current mode regulator, power MOSFETs, inductor, and other supporting discrete components. The default switching frequency is 1MHz. For output voltages between 2.5V and 5.5V, an external resistor is required between FREQ and GND pins to set the operating frequency to higher frequency to optimize inductor current ripple. For switching noise-sensitive applications, the switching frequency can be adjusted by external resistors and the Module regulator can be externally synchronized to a clock within 30% of the set frequency. See the Applications Information section. With current mode control and internal feedback loop compensation, the LTM4622 module has sufficient APPLICATIONS INFORMATION The typical LTM4622 application circuit is shown in Figure24. External component selection is primarily determined by the input voltage, the output voltage and the maximum load current. Refer to Table7 for specific external capacitor requirements for a particular application. VIN to VOUT Step-Down Ratios There are restrictions in the maximum VIN and VOUT step down ratio that can be achieved for a given input voltage due to the minimum off-time and minimum on-time limits of the regulator. The minimum off-time limit imposes a maximum duty cycle which can be calculated as stability margins and good transient performance with a wide range of output capacitors, even with all ceramic output capacitors. Current mode control provides cycle-by-cycle fast current limiting. An internal overvoltage and undervoltage comparators pull the open-drain PGOOD output low if the output feedback voltage exits a 8% window around the regulation point. Furthermore, an input overvoltage protection been utilized by shutting down both power MOSFETs when VIN rises above 22.5V to protect internal devices. Multiphase operation can be easily employed by connecting SYNC pin to an external oscillator. Up to 6 phases can be paralleled to run simultaneously a good current sharing guaranteed by current mode control loop. Pulling the RUN pin below 1V forces the controller into its shutdown state, turning off both power MOSFETs and most of the internal control circuitry. At light load currents, Burst Mode operation can be enabled to achieve higher efficiency compared to continuous mode (CCM) by setting MODE pin to INTVCC. The TRACK/SS pin is used for power supply tracking and soft-start programming. See the Applications Information section. where tOFF(MIN) is the minimum off-time, 45ns typical for LTM4622, and fSW is the switching frequency. Conversely the minimum on-time limit imposes a minimum duty cycle of the converter which can be calculated as DMIN = tON(MIN) * fSW where tON(MIN) is the minimum on-time, 20ns typical for LTM4622. In the rare cases where the minimum duty cycle is surpassed, the output voltage will still remain in regulation, but the switching frequency will decrease from its programmed value. Note that additional thermal derating may be applied. See the Thermal Considerations and Output Current Derating section in this data sheet. DMAX = 1 - tOFF(MIN) * fSW Rev. H For more information www.analog.com 9 LTM4622 APPLICATIONS INFORMATION Output Voltage Programming The PWM controller has an internal 0.6V reference voltage. As shown in the Block Diagram, a 60.4k 0.5% internal feedback resistor connects VOUT and FB pins together. Adding a resistor RFB from FB pin to GND programs the output voltage: R FB = 0.6V * 60.4k VOUT - 0.6V Table1. VFB Resistor Table vs Various Output Voltages VOUT (V) 0.6 1.0 1.2 1.5 1.8 2.5 3.3 5.0 RFB (k) OPEN 90.9 60.4 40.2 30.1 19.1 13.3 8.25 Pease note that for 2.5 to 5V output, a higher operating frequency is required to optimize inductor current ripple. See Operating Frequency section. For parallel operation of N-channels LTM4622, the following equation can be used to solve for RFB: R FB = 0.6V VOUT - 0.6V * 60.4k N Input Decoupling Capacitors The LTM4622 module should be connected to a low AC-impedance DC source. For each regulator channel, one piece 4.7F input ceramic capacitor is required for RMS ripple current decoupling. Bulk input capacitor is only needed when the input source impedance is compromised by long inductive leads, traces or not enough source capacitance. The bulk capacitor can be an electrolytic aluminum capacitor and polymer capacitor. Without considering the inductor current ripple, for each output, the RMS current of the input capacitor can be estimated as: ICIN(RMS) = IOUT(MAX) % * D * (1- D) where is the estimated efficiency of the power module. Output Decoupling Capacitors With an optimized high frequency, high bandwidth design, only single piece of 22F low ESR output ceramic capacitor 10 is required for each LTM4622 output to achieve low output voltage ripple and very good transient response. Additional output filtering may be required by the system designer, if further reduction of output ripples or dynamic transient spikes is required. Table6 shows a matrix of different output voltages and output capacitors to minimize the voltage droop and overshoot during a 1.25A (50%) load step transient. Multiphase operation will reduce effective output ripple as a function of the number of phases. Application Note 77 discusses this noise reduction versus output ripple current cancellation, but the output capacitance will be more a function of stability and transient response. The Analog Devices, Inc. LTpowerCAD(R) Design Tool is available to download online for output ripple, stability and transient response analysis and calculating the output ripple reduction as the number of phases implemented increases by N times. Burst Mode Operation In applications where high efficiency at intermediate current are more important than output voltage ripple, Burst Mode operation could be used by connecting SYNC/ MODE pin to INTVCC to improve light load efficiency. In Burst Mode operation, a current reversal comparator (IREV) detects the negative inductor current and shuts off the bottom power MOSFET, resulting in discontinuous operation and increased efficiency. Both power MOSFETs will remain off and the output capacitor will supply the load current until the COMP voltage rises above the zero current level to initiate another cycle. Force Continuous Current Mode (CCM) Operation In applications where fixed frequency operation is more critical than low current efficiency, and where the lowest output ripple is desired, forced continuous operation should be used. Forced continuous operation can be enabled by tying the SYNC/MODE pin to GND. In this mode, inductor current is allowed to reverse during low output loads, the COMP voltage is in control of the current comparator threshold throughout, and the top MOSFET always turns on with each oscillator pulse. During startup, forced continuous mode is disabled and inductor current is prevented from reversing until the LTM4622's output voltage is in regulation. For more information www.analog.com Rev. H LTM4622 APPLICATIONS INFORMATION Operating Frequency The operating frequency of the LTM4622 is optimized to achieve the compact package size and the minimum out-put ripple voltage while still keeping high efficiency. The default operating frequency is internally set to 1MHz. In most applications, no additional frequency adjusting is required. If any operating frequency other than 1MHz is required by application, the operating frequency can be increased by adding a resistor, RFSET, between the FREQ pin and GND, as shown in Figure26. The operating frequency can be calculated as: f (Hz ) = 3.2e11 324k || RFSET ( ) Please note a minimum switching frequency is required for given VIN, VOUT operating conditions to keep a maximum peak-to-peak inductor ripple current below 1.2A for the LTM4622. The peak-to-peak inductor ripple current can be calculated as: IP-P = VOUT VOUT 1 1- * 1H VIN fSW (MHz) The maximum 1.2A peak-to-peak inductor ripple current is enforced due to the nature of the valley current mode control to maintain output voltage regulation at no load. To reduce switching current ripple, 1.5MHz to 2.5MHz operating frequency is required for 2.5V to 5.5V output with RFSET to GND. VOUT 0.6V to 1.8V 2.5V fSW 1MHz RFSET Open 3.3V 5V 1.5MHz 2MHz 2.5MHz 649k 324k 215k The operating frequency can also be decreased by adding a resistor between the FREQ pin and INTVCC, calculated as: f (Hz ) = 1MHz - 5.67e11 RFSET ( ) The programmable operating frequency range is from 800kHz to 4MHz. Frequency Synchronization The power module has a phase-locked loop comprised of an internal voltage controlled oscillator and a phase detector. This allows the internal top MOSFET turn-on to be locked to the rising edge of the external clock. The external clock frequency range must be within 30% around the set operating frequency. A pulse detection circuit is used to detect a clock on the SYNC/MODE pin to turn on the phase-locked loop. The pulse width of the clock has to be at least 100ns. The clock high level must be above 2V and clock low level below 0.3V. The presence of an external clock will place both regulator channels into forced continuous mode operation. During the start-up of the regulator, the phase-locked loop function is disabled. Multiphase Operation For output loads that demand more than 2.5A of current, two outputs in the LTM4622 or even multiple LTM4622s can be paralleled to run out of phase to provide more output current without increasing input and output voltage ripples. A multiphase power supply significantly reduces the amount of ripple current in both the input and output capacitors. The RMS input ripple current is reduced by, and the effective ripple frequency is multiplied by, the number of phases used (assuming that the input voltage is greater than the number of phases used times the output voltage). The output ripple amplitude is also reduced by the number of phases used when all of the outputs are tied together to achieve a single high output current design. The two switching mode regulator channels inside the LTM4622 are internally set to operate 180 out of phase. Multiple LTM4622s could easily operate 90 degrees, 60 degrees or 45 degrees shift which corresponds to 4-phase, 6-phase or 8-phase operation by letting SYNC/ MODE of the LTM4622 synchronize to an external multiphase oscillator like LTC(R)6902. Figure2 shows a 4-phase design example for clock phasing. Rev. H For more information www.analog.com 11 LTM4622 APPLICATIONS INFORMATION Soft-Start and Output Voltage Tracking 133k, 1.5MHz 3.3V INTVCC V+ SET PH SYNC/MODE VOUT1 MOD VOUT2 LTC6902 DIV OUT1 GND OUT2 0 SYNC/MODE VOUT1 90 VOUT2 0 10A 180 90 270 4622 F02 Figure2. Example of Clock Phasing for 4-Phase Operation with LTC6902 The LTM4622 device is an inherently current mode controlled device, so parallel modules will have very good current sharing. This will balance the thermals on the design. Please tie RUN, TRACK/SS, FB and COMP pin of each paralleling channel together. Figure28 shows an example of parallel operation and pin connection. INPUT RMS Ripple Current Cancellation Application Note 77 provides a detailed explanation of multiphase operation. The input RMS ripple current cancellation mathematical derivations are presented, and a graph is displayed representing the RMS ripple current reduction as a function of the number of interleaved phases. Figure3 shows this graph. 0.60 0.55 0.50 The TRACK/SS pin provides a means to either soft-start the regulator or track it to a different power supply. A capacitor on the TRACK/SS pin will program the ramp rate of the output voltage. An internal 1.4A current source will charge up the external soft-start capacitor towards INTVCC voltage. When the TRACK/SS voltage is below 0.6V, it will take over the internal 0.6V reference voltage to control the output voltage. The total soft-start time can be calculated as: t SS = 0.6 * C SS 1.4A where CSS is the capacitance on the TRACK/SS pin. Current foldback and force continuous mode are disabled during the soft-start process. The LTM4622 has internal 400s soft-start time when TRACK/SS leave floating. Output voltage tracking can also be programmed externally using the TRACK/SS pin. The output can be tracked up and down with another regulator. Figure4 and 1-PHASE 2-PHASE 3-PHASE 4-PHASE 6-PHASE RMS INPUT RIPPLE CURRENT DC LOAD CURRENT 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9 DUTY FACTOR (VOUT/VIN) 4622 F03 Figure3. Input RMS Current Ratios to DC Load Current as a Function of Duty Cycle 12 For more information www.analog.com Rev. H LTM4622 APPLICATIONS INFORMATION Figure5 show an example waveform and schematic of a Ratiometric tracking where the slave regulator's output slew rate is proportional to the master's. The RFB(SL) is the feedback resistor and the RTR(TOP)/ RTR(BOT) is the resistor divider on the TRACK/SS pin of the slave regulator, as shown in Figure5. Since the slave regulator's TRACK/SS is connected to the master's output through a RTR(TOP)/RTR(BOT) resistor divider and its voltage used to regulate the slave output Following the upper equation, the master's output slew rate (MR) and the slave's output slew rate (SR) in Volts/ Time is determined by: R FB(SL) MR MASTER OUTPUT OUTPUT VOLTAGE SR SLAVE OUTPUT TIME PGOOD1 4622 F04 PGOOD2 VOUT1 VIN1 VIN2 10F 25V RUN1 LTM4622 VOUT1 60.4k 0.1F 40.2k INTVCC COMP1 SYNC/MODE COMP2 TRACK/SS1 FB1 TRACK/SS2 FB2 FREQ VOUT1 47F 1.5V, 2.5A 4V VOUT2 47F 1.2V, 2.5A 4V VOUT2 RUN2 60.4k GND R TR(TOP) + R TR(BOT) For example, VOUT(MA) = 1.5V, MR = 1.4V/1ms and VOUT(SL) = 1.2V, SR = 1.2V/1ms. From the equation, we could solve out that RTR(TOP) =60.4k and RTR(BOT) = 40.2k is a good combination for the Ratiometric tracking. Figure4. Output Ratiometric Tracking Waveform VIN 4V TO 20V R FB(SL) + 60.4k R TR(BOT) = 40.2k 4622 F05 The TRACK pins will have the 1.5A current source on when a resistive divider is used to implement tracking on that specific channel. This will impose an offset on the TRACK pin input. Smaller values resistors with the same ratios as the resistor values calculated from the above equation can be used. For example, where the 60.4k is used then a 6.04k can be used to reduce the TRACK pin offset to a negligible value. The Coincident output tracking can be recognized as a special Ratiometric output tracking which the master's output slew rate (MR) is the same as the slave's output slew rate (SR), as waveform shown in Figure6. Figure5. Example Schematic of Ratiometric Output Voltage Tracking MASTER OUTPUT VOUT(SL) * VOUT(MA) * R FB(SL) R FB(SL) + 60.4k OUTPUT VOLTAGE voltage when TRACK/SS voltage is below 0.6V, the slave output voltage and the master output voltage should satisfy the following equation during the start-up. SLAVE OUTPUT = R TR(BOT) R TR(TOP) + R TR(BOT) TIME 4622 F06 Figure6. Output Coincident Tracking Waveform Rev. H For more information www.analog.com 13 LTM4622 APPLICATIONS INFORMATION From the equation, we could easily find out that, in the Coincident tracking, the slave regulator's TRACK/SS pin resistor divider is always the same as its feedback divider. R FB(SL) R FB(SL) + 60.4k = R TR(BOT) R TR(TOP) + R TR(BOT) For example, RTR(TOP) = 60.4k and RTR(BOT) = 60.4k is a good combination for Coincident tracking for VOUT(MA) = 1.5V and VOUT(SL) = 1.2V application. Power Good Pre-Biased Output Start-Up There may be situations that require the power supply to start up with a pre-bias on the output capacitors. In this case, it is desirable to start up without discharging that output pre-bias. The LTM4622 can safely power up into a pre-biased output without discharging it. The LTM4622 accomplishes this by forcing discontinuous mode (DCM) operation until the TRACK/SS pin voltage reaches 0.6V reference voltage. This will prevent the BG from turning on during the pre-biased output start-up which would discharge the output. The PGOOD pins are open drain pins that can be used to monitor valid output voltage regulation. This pin monitors a 8% window around the regulation point. A resistor can be pulled up to a particular supply voltage for monitoring. To prevent unwanted PGOOD glitches during transients or dynamic VOUT changes, the LTM4622's PGOOD falling edge includes a blanking delay of approximately 40s. Overtemperature Protection Stability compensation Input Overvoltage Protection The LTM4622 module internal compensation loop is designed and optimized for low ESR ceramic output capacitors only application. Table7 is provided for most application requirements. The LTpowerCAD Design Tool is available to down for control loop optimization. In order to protect the internal power MOSFET devices against transient voltage spikes, the LTM4622 constantly monitors each VIN pin for an overvoltage condition. When VIN rises above 22.5V, the regulator suspends operation by shutting off both power MOSFETs on the corresponding channel. Once VIN drops below 21.5V, the regulator immediately resumes normal operation. The regulator executes its soft-start function when exiting an overvoltage condition. RUN Enable Pulling the RUN pin to ground forces the LTM4622 into its shutdown state, turning off both power MOSFETs and most of its internal control circuitry. Trying the RUN pin voltage above 1.27V will turn on the entire chip. Low Input Application The LTM4622 is capable to run from 3.3V input when the VIN pin is tied to INTVCC pin. See Figure27 for the application circuit. Please note the INTVCC pin has 3.6V ABS MAX voltage rating. The internal overtemperature protection monitors the junction temperature of the module. If the junction temperature reaches approximately 160C, both power switches will be turned off until the temperature drops about 15C cooler. Thermal Considerations and Output Current Derating The thermal resistances reported in the Pin Configuration section of the data sheet are consistent with those parameters defined by JESD51-9 and are intended for use with finite element analysis (FEA) software modeling tools that leverage the outcome of thermal modeling, simulation, and correlation to hardware evaluation performed on a Module package mounted to a hardware test Rev. H 14 For more information www.analog.com LTM4622 APPLICATIONS INFORMATION JUNCTION-TO-AMBIENT THERMAL RESISTANCE COMPONENTS CASE (TOP)-TO-AMBIENT RESISTANCE JUNCTION-TO-CASE (TOP) RESISTANCE JUNCTION JUNCTION-TO-BOARD RESISTANCE AMBIENT JUNCTION-TO-CASE CASE (BOTTOM)-TO-BOARD (BOTTOM) RESISTANCE RESISTANCE BOARD-TO-AMBIENT RESISTANCE 4622 F07 MODULE DEVICE Figure7. Graphical Representation of JESD 51-12 Thermal Coefficients board--also defined by JESD51-9 (Test Boards for Area Array Surface Mount Package Thermal Measurements). The motivation for providing these thermal coefficients in found in JESD51-12 (Guidelines for Reporting and Using Electronic Package Thermal Information). Many designers may opt to use laboratory equipment and a test vehicle such as the demo board to anticipate the Module regulator's thermal performance in their application at various electrical and environmental operating conditions to compliment any FEA activities. Without FEA software, the thermal resistances reported in the Pin Configuration section are in-and-of themselves not relevant to providing guidance of thermal performance; instead, the derating curves provided in the data sheet can be used in a manner that yields insight and guidance pertaining to one's application usage, and can be adapted to correlate thermal performance to one's own application. The Pin Configuration section typically gives four thermal coefficients explicitly defined in JESD 51-12; these coefficients are quoted or paraphrased below: 1. JA, the thermal resistance from junction to ambient, is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclosure. This environment is sometimes referred to as still air although natural convection causes the air to move. This value is determined with the part mounted to a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. 2. JCbottom, the thermal resistance from junction to ambient, is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclosure. This environment is sometimes referred to as still air although natural convection causes the air to move. This value is determined with the part mounted to a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. 3. JCtop, the thermal resistance from junction to top of the product case, is determined with nearly all of the component power dissipation flowing through the top of the package. As the electrical connections of the typical Module are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junction to the top of the part. As in the case of JCbottom, this value may be useful for comparing packages but the test conditions don't generally match the user's application. 4. JB, the thermal resistance from junction to the printed circuit board, is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the Module and into the board, and is really the sum of the JCbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a two sided, two layer board. This board is described in JESD 51-9. Rev. H For more information www.analog.com 15 LTM4622 APPLICATIONS INFORMATION A graphical representation of the aforementioned thermal resistances is given in Figure7; blue resistances are contained within the Module regulator, whereas green resistances are external to the Module. As a practical matter, it should be clear to the reader that no individual or sub-group of the four thermal resistance parameters defined by JESD 51-12 or provided in the Pin Configuration section replicates or conveys normal operating conditions of a Module. For example, in normal board-mounted applications, never does 100% of the device's total power loss (heat) thermally conduct exclusively through the top or exclusively through bottom of the Module--as the standard defines for JCtop and JCbottom, respectively. In practice, power loss is thermally dissipated in both directions away from the package--granted, in the absence of a heat sink and airflow, a majority of the heat flow is into the board. Within a SIP (system-in-package) module, be aware there are multiple power devices and components dissipating power, with a consequence that the thermal resistances relative to different junctions of components or die are not exactly linear with respect to total package power loss. To reconcile this complication without sacrificing modeling simplicity--but also, not ignoring practical realities--an approach has been taken using FEA software modeling along with laboratory testing in a controlled-environment 2.0 2.0 12VIN 5VIN 1.6 1.4 POWER LOSS (W) POWER LOSS (W) 1.6 1.2 1.0 0.8 0.6 1.2 1.0 0.8 0.6 0.4 0.2 0.2 0 1 4 3 2 OUTPUT CURRENT (A) 5 4622 F08 Figure8. 1V Output Power Loss 0 12VIN 5VIN 2.0 1.4 0.4 0 2.5 12VIN 5VIN 1.8 POWER LOSS (W) 1.8 chamber to reasonably define and correlate the thermal resistance values supplied in this data sheet: (1) Initially, FEA software is used to accurately build the mechanical geometry of the Module and the specified PCB with all of the correct material coefficients along with accurate power loss source definitions; (2) this model simulates a software-defined JEDEC environment consistent with JSED51-12 to predict power loss heat flow and temperature readings at different interfaces that enable the calculation of the JEDEC-defined thermal resistance values; (3) the model and FEA software is used to evaluate the Module with heat sink and airflow; (4) having solved for and analyzed these thermal resistance values and simulated various operating conditions in the software model, a thorough laboratory evaluation replicates the simulated conditions with thermo-couples within a controlled-environment chamber while operating the device at the same power loss as that which was simulated. An outcome of this process and due-diligence yields a set of derating curves provided in other sections of this data sheet. After these laboratory test have been performed and correlated to the Module model, then the JB and BA are summed together to correlate quite well with the Module model with no airflow or heat sinking in a properly define chamber. This JB + BA value is shown in the Pin Configuration section and should accurately equal the JA value because approximately 100% of power loss 1.5 1.0 0.5 0 1 4 3 2 OUTPUT CURRENT (A) 5 4622 F09 Figure9. 1.5V Output Power Loss 0 0 1 4 3 2 OUTPUT CURRENT (A) 5 4622 F10 Figure10. 2.5V Output Power Loss Rev. H 16 For more information www.analog.com LTM4622 APPLICATIONS INFORMATION 2.5 1.0 1.5 1.0 0.5 0 1.5 1.0 0 1 4 3 2 OUTPUT CURRENT (A) 0 5 4 3 2 0 1 4622 F11 4 3 2 OUTPUT CURRENT (A) 0 5 Figure12. 5V Output Power Loss 5 5 0LFM 200LFM 400LFM 1 0 40 50 OUTPUT CURRENT (A) 5 4 3 2 0LFM 200LFM 400LFM 1 0 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) 40 50 4622 F14 4 3 2 0 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) Figure15. 5V to 1.5V Derating Curve, No Heat Sink 5 5 0LFM 200LFM 400LFM 1 0 40 50 OUTPUT CURRENT (A) 5 OUTPUT CURRENT (A) 6 2 4 3 2 0LFM 200LFM 400LFM 1 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) 4622 F17 Figure17. 5V to 2.5V Derating Curve, No Heat Sink 50 0 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) Figure16. 12V to 1.5V Derating Curve, No Heat Sink 6 3 40 4622 F16 6 4 0LFM 200LFM 400LFM 1 4622 F15 Figure14. 12V to 1V Derating Curve, No Heat Sink 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) Figure13. 5V to 1V Derating Curve, No Heat Sink 6 2 50 4622 F13 6 3 40 4622 F12 6 4 0LFM 200LFM 400LFM 1 0.5 OUTPUT CURRENT (A) OUTPUT CURRENT (A) 5 1.0 Figure11. 3.3V Output Power Loss OUTPUT CURRENT (A) 6 VIN = 12V 2.5 POWER LOSS (W) POWER LOSS (W) 3.0 12VIN 5VIN OUTPUT CURRENT (A) 3.0 4 3 2 0LFM 200LFM 400LFM 1 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) 4622 F18 Figure18. 12V to 2.5V Derating Curve, No Heat Sink 0 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) 4622 F19 Figure19. 5V to 3.3V Derating Curve, No Heat Sink Rev. H For more information www.analog.com 17 LTM4622 6 6 5 5 OUTPUT CURRENT (A) OUTPUT CURRENT (A) APPLICATIONS INFORMATION 4 3 2 0LFM 200LFM 400LFM 1 0 40 50 4 3 2 0LFM 200LFM 400LFM 1 0 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) 4622 F20 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) 4622 F21 Figure20. 12V to 3.3V Derating Curve, No Heat Sink Figure21. 12V to 5V Derating Curve, No Heat Sink Table2. 1V Output DERATING CURVE VIN (V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK JA(C/W) Figure13, Figure14 5, 12 Figure8 0 None 19 - 20 Figure13, Figure14 5, 12 Figure8 200 None 17 - 18 Figure13, Figure14 5, 12 Figure8 400 None 17 - 18 Table3. 1.5V Output DERATING CURVE VIN (V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK JA(C/W) Figure15, Figure16 5, 12 Figure9 0 None 19 - 20 Figure15, Figure16 5, 12 Figure9 200 None 17 - 18 Figure15, Figure16 5, 12 Figure9 400 None 17 - 18 DERATING CURVE VIN (V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK JA(C/W) Figure17, Figure18 5, 12 Figure10 0 None 19 - 20 Figure17, Figure18 5, 12 Figure10 200 None 17 - 18 Figure17, Figure18 5, 12 Figure10 400 None 17 - 18 DERATING CURVE VIN (V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK JA(C/W) Figure19, Figure20 5, 12 Figure11 0 None 19 - 20 Figure19, Figure20 5, 12 Figure11 200 None 17 - 18 Figure19, Figure20 5, 12 Figure11 400 None 17 - 18 DERATING CURVE VIN (V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK JA(C/W) Figure21 12 Figure12 0 None 19 - 20 Figure21 12 Figure12 200 None 17 - 18 Figure21 12 Figure12 400 None 17 - 18 Table4. 2.5V Output Table5. 3.3V Output Table6. 5V Output Rev. H 18 For more information www.analog.com LTM4622 APPLICATIONS INFORMATION Table7. Output Voltage Response for Each Regulator Channel vs Component Matrix (Refer to Figure24) 1.25A Load Step Typical Measured Values CIN (CERAMIC) PART NUMBER COUT1 (CERAMIC) PART NUMBER VALUE COUT2 (BULK) VALUE Murata GRM188R61E475KE11# 4.7F, 25V, Murata 0603, X5R GRM21R60J476ME15# Murata GRM188R61E106MA73# 10F, 25V, Murata 0603, X5R GRM188R60J226MEA0# 22F, 6.3V, 0603, X5R Taiyo Yuden TMK212BJ475KG-T VOUT (V) 4.7F, 25V, Taiyo 0805, X5R Yuden COUT1 CIN (CERAMIC) CIN (CERAMIC) (F) (F) (BULK) 47F, 6.3V, 0805, X5R JMK212BJ476MG-T COUT2 (BULK) (F) CFF (pF) DROOP VIN (V) (mV) PART NUMBER VALUE Panasonic 6TPC150M 150F, 6.3V 3.5 x 2.8 x 1.4mm Sanyo 47F, 6.3V, 0805, X5R P-P DERIVATION (mV) RECOVERY TIME (S) LOAD STEP (A) LOAD STEP SLEW RATE (A/S) RFB (k) 1 10 0 1 x 47 0 0 5, 12 0 103 4 1.25 10 90.9 1 10 0 1 x 10 150 0 5, 12 0 52 10 1.25 10 90.9 1.2 10 0 1 x 47 0 0 5, 12 0 113 4 1.25 10 60.4 1.2 10 0 1 x 10 150 0 5, 12 0 56 10 1.25 10 60.4 1.5 10 0 1 x 47 0 0 5, 12 0 131 8 1.25 10 40.2 1.5 10 0 1 x 10 150 0 5, 12 0 61 14 1.25 10 40.2 1.8 10 0 1 x 47 0 0 5, 12 0 150 8 1.25 10 30.1 1.8 10 0 1 x 10 150 0 5, 12 0 67 16 1.25 10 30.1 2.5 10 0 1 x 47 0 0 5, 12 0 184 8 1.25 10 19.1 2.5 10 0 1 x 10 150 0 5, 12 0 78 20 1.25 10 19.1 3.3 10 0 1 x 47 0 0 5, 12 0 200 12 1.25 10 13.3 3.3 10 0 1 x 10 150 0 5, 12 0 78 35 1.25 10 13.3 5 10 0 1 x 47 0 0 5, 12 0 309 12 1.25 10 8.25 5 10 0 1 x 10 150 0 5, 12 0 114 60 1.25 10 8.25 Rev. H For more information www.analog.com 19 LTM4622 APPLICATIONS INFORMATION flows from the junction through the board into ambient with no airflow or top mounted heat sink. The 1V, 1.5V, 2.5V, 3.3V and 5V power loss curves in Figures 8 to 12 can be used in coordination with the load current derating curves in Figures 13 to 21 for calculating an approximate JA thermal resistance for the LTM4622 (in two-phase single output operation) with no heat sinking and various airflow conditions. The power loss curves are taken at room temperature, and are increased with multiplicative factors of 1.35 assuming junction temperature at 120C. The derating curves are plotted with the output current starting at 5A and the ambient temperature at 40C. These output voltages are chosen to include the lower and higher output voltage ranges for correlating the thermal resistance. Thermal models are derived from several temperature measurements in a controlled temperature chamber along with thermal modeling analysis. The junction temperatures are monitored while ambient temperature is increased with and without airflow. The power loss increase with ambient temperature change is factored into the derating curves. The junctions are maintained at 120C maximum while lowering output current or power with increasing ambient temperature. The decreased output current will decrease the internal module loss as ambient temperature is increased. The monitored junction temperature of 120C minus the ambient operating temperature specifies how much module temperature rise can be allowed. As an example in Figure15 the load current is derated to ~3A at ~102C with no air or heat sink and the power loss for the 5V to 1.5V at 3A output is about 0.95W. The 0.95W loss is calculated with the ~0.7W room temperature loss from the 5V to 1.5V power loss curve at 3A, and the 1.35 multiplying factor. If the 102C ambient temperature is subtracted from the 120C junction temperature, then the difference of 18C divided by 0.95W equals a 19C/W JA thermal resistance. Table3 specifies a 19 - 20C/W value which is very close. Table2 to 6 provide equivalent thermal resistances for 1V, 1.5V, 2.5V, 3.3V and 5V outputs with and without airflow. The derived thermal resistances in Table2 to 6 for the various conditions can be multiplied by the calculated power loss as a function of ambient temperature to derive temperature rise above ambient, thus maximum junction temperature. Room temperature power loss can be derived from the efficiency curves in the Typical Performance Characteristics section and adjusted with the above ambient temperature multiplicative factors. The printed circuit board is a 1.6mm thick four layer board with two ounce copper for the two outer layers and one ounce copper for the two inner layers. The PCB dimensions are 95mm x 76mm. Figure22 shows a measured temperature picture of the LTM4622 with no heatsink and no airflow, from 12V input down to 3.3V and 5V output with 2.5A DC current on each. 4622 F22 Figure22. Thermal Picture, 12V Input, 3.3V and 5V Output, 2.5A DC Each Output with No Air Flow and No Heat Sink Rev. H 20 For more information www.analog.com LTM4622 APPLICATIONS INFORMATION SAFETY CONSIDERATIONS The LTM4622 modules do not provide galvanic isolation from VIN to VOUT. There is no internal fuse. If required, a slow blow fuse with a rating twice the maximum input current needs to be provided to protect each unit from catastrophic failure. The device does support thermal shutdown and over current protection. LAYOUT CHECKLIST/EXAMPLE The high integration of LTM4622 makes the PCB board layout very simple and easy. However, to optimize its electrical and thermal performance, some layout considerations are still necessary. Use large PCB copper areas for high current paths, including VIN, GND, VOUT1 and VOUT2. It helps to minimize the PCB conduction loss and thermal stress. n Place high frequency ceramic input and output capacitors next to the VIN, PGND and VOUT pins to minimize high frequency noise. n Place a dedicated power ground layer underneath the unit. n To minimize the via conduction loss and reduce module thermal stress, use multiple vias for interconnection between top layer and other power layers. n Do not put via directly on the pad, unless they are capped or plated over. n Use a separated SGND ground copper area for components connected to signal pins. Connect the SGND to GND underneath the unit. n For parallel modules, tie the V OUT, VFB, and COMP pins together. Use an internal layer to closely connect these pins together. The TRACK pin can be tied a common capacitor for regulator soft-start. n Bring out test points on the signal pins for monitoring. Figure23 gives a good example of the recommended layout. n 4622 F23 Figure23. Recommended PCB Layout Rev. H For more information www.analog.com 21 LTM4622 APPLICATIONS INFORMATION PGOOD1 PGOOD2 VIN 4V TO 20V 10F VIN2 10F LTM4622 RUN1 VOUT2 RUN2 0.1F 0.1F VOUT1 1V, 2.5A VOUT1 VIN1 INTVCC COMP1 SYNC/MODE COMP2 TRACK/SS1 FB1 TRACK/SS2 FB2 FREQ 10F 90.6k 30.1k GND VOUT2 1.8V, 2.5A 4622 F24 Figure24. 4VIN to 20VIN, 1V and 1.8V Output at 2.5A Design PGOOD PGOOD1 PGOOD2 VOUT1 VIN1 VIN 4V TO 20V VIN2 10F LTM4622 RUN1 RUN2 VOUT2 COMP1 INTVCC SYNC/MODE 0.1F VOUT 1.2V, 5A 22F COMP2 TRACK/SS1 FB1 TRACK/SS2 FB2 FREQ 30.2k GND 4622 F25 Figure25. 4VIN to 20VIN, 1.2V Two Phase in Parallel 5A Design PGOOD1 PGOOD2 VOUT1 VIN1 VIN 8V TO 20V VIN2 10F RUN1 10F LTM4622 VOUT2 RUN2 0.1F 0.1F INTVCC COMP1 SYNC/MODE COMP2 TRACK/SS1 FB1 TRACK/SS2 FB2 FREQ 324k VOUT1 3.3V, 2.5A 10F 8.25k GND VOUT2 5V, 2.5A 13.3k 4622 F26 Figure26. 8VIN to 20VIN, 3.3V and 5V Output at 2.5A with 2MHz Switching Frequency 22 For more information www.analog.com Rev. H LTM4622 APPLICATIONS INFORMATION PGOOD1 PGOOD2 VOUT1 VIN1 VIN 3.3V VIN2 10F RUN1 10F LTM4622 VOUT2 RUN2 VOUT1 60.4k INTVCC COMP1 SYNC/MODE COMP2 TRACK/SS1 FB1 TRACK/SS2 FB2 FREQ 0.1F VOUT1 1.5V, 2.5A 10F 40.2k 60.4k GND VOUT2 1.2V, 2.5A 4622 F27 60.4k Figure27. 3.3VIN, 1.5V and 1.2V Output at 2.5A Design with Output Coincident Tracking PGOOD PGOOD1 PGOOD2 VOUT1 VIN1 VIN 4V TO 20V VIN2 22F RUN1 COMP1 RUN2 INTVCC V+ INTVCC 1F LTC6902 PH DIV SET TRACK/SS1 FB1 TRACK/SS2 FB2 FREQ MOD COMP COMP2 SYNC/MODE 200k 47F VOUT2 LTM4622 VOUT1 1V, 10A FB 22.6k GND GND OUT1 OUT4 OUT2 OUT3 PGOOD PGOOD1 PGOOD2 VOUT1 VIN1 VIN2 RUN1 LTM4622 COMP1 RUN2 INTVCC TRACK/SS1 FB1 TRACK/SS2 FB2 FREQ COMP COMP2 SYNC/MODE 0.1F VOUT2 FB GND 4622 F28 Figure28. 4 Phase, 1V Output at 10A Design with LTC6902 Rev. H For more information www.analog.com 23 LTM4622 PACKAGE DESCRIPTION PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG Module PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY. LTM4622 Component LGA and BGA Pinout PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION A1 VOUT2 A2 VIN2 A3 TRACK/SS2 A4 FB2 A5 COMP2 B1 VOUT2 B2 RUN2 B3 VIN2 B4 PGOOD2 B5 GND C1 GND C2 GND C3 INTVCC C4 FREQ C5 SYNC/MODE D1 VOUT1 D2 RUN1 D3 VIN1 D4 PGOOD1 D5 GND E1 VOUT1 E2 VIN1 E3 TRACK/SS1 E4 FB1 E5 COMP1 Rev. H 24 For more information www.analog.com 0.000 For more information www.analog.com 2.540 1.270 0.3175 0.3175 1.270 2.540 SUGGESTED PCB LAYOUT TOP VIEW 2.540 PACKAGE TOP VIEW 1.270 4 0.3175 0.000 0.3175 PIN "A1" CORNER E 1.270 aaa Z 2.540 Y D X aaa Z // bbb Z SYMBOL A b D E e F G H1 H2 aaa bbb eee H1 SUBSTRATE 0.27 1.45 MIN 1.72 0.60 NOM 1.82 0.63 6.25 6.25 1.27 5.08 5.08 0.32 1.50 DIMENSIONS O eee S Z X Y Z 0.37 1.55 0.15 0.10 0.15 MAX 1.92 0.66 TOTAL NUMBER OF LGA PADS: 25 DETAIL A Ob (25 PLACES) DETAIL B H2 MOLD CAP NOTES DETAIL B A b F 3 e SEE NOTES 4 3 2 1 PACKAGE BOTTOM VIEW 5 G DETAIL A E D C B A PIN 1 7 SEE NOTES DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 4 7 TRAY PIN 1 BEVEL ! PACKAGE IN TRAY LOADING ORIENTATION LTMXXXXXX Module LGA 25 0613 REV O PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG Module PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 6. THE TOTAL NUMBER OF PADS: 25 5. PRIMARY DATUM -Z- IS SEATING PLANE LAND DESIGNATION PER JESD MO-222, SPP-010 3 2. ALL DIMENSIONS ARE IN MILLIMETERS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 COMPONENT PIN "A1" (Reference LTC DWG # 05-08-1949 Rev O) LGA Package 25-Lead (6.25mm x 6.25mm x 1.82mm) LTM4622 PACKAGE DESCRIPTION Rev. H 25 0.000 For more information www.analog.com 2.540 1.270 0.3175 0.3175 1.270 2.540 SUGGESTED PCB LAYOUT TOP VIEW 2.540 PACKAGE TOP VIEW 1.270 4 0.3175 0.000 0.3175 PIN "A1" CORNER E 1.270 aaa Z 2.540 D X 0.630 0.025 Y // bbb Z DETAIL B H2 b1 NOM 2.42 0.60 1.82 0.75 0.63 6.25 6.25 1.27 5.08 5.08 0.32 1.50 MAX 2.62 0.70 1.92 0.90 0.66 DIMENSIONS ddd M Z X Y eee M Z H1 SUBSTRATE BALL DIMENSION PAD DIMENSION BALL HT NOTES DETAIL B PACKAGE SIDE VIEW A2 A 0.27 1.45 SUBSTRATE THK 0.37 MOLD CAP HT 1.55 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 25 MIN 2.22 0.50 1.72 0.60 0.60 DETAIL A Ob (25 PLACES) SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee aaa Z MOLD CAP ccc Z A1 (Reference LTC DWG # 05-08-1502 Rev A) Z 26 Z b F 3 e SEE NOTES 5 4 3 2 1 PACKAGE BOTTOM VIEW G DETAIL A E D C B A PIN 1 6 SEE NOTES DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 4 6 TRAY PIN 1 BEVEL ! PACKAGE IN TRAY LOADING ORIENTATION LTMXXXXXX Module BGA 25 0517 REV A PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG Module PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 5. PRIMARY DATUM -Z- IS SEATING PLANE BALL DESIGNATION PER JESD MS-028 AND JEP95 3 2. ALL DIMENSIONS ARE IN MILLIMETERS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 COMPONENT PIN "A1" BGA Package 25-Lead (6.25mm x 6.25mm x 2.42mm) LTM4622 PACKAGE DESCRIPTION Rev. H LTM4622 REVISION HISTORY REV DATE DESCRIPTION A 08/15 Added "Single 5A" to Title and Features B 01/16 Added BGA package C 11/16 Corrected equations of tracking start-up time from RTR(TOP)/[RTR(TOP) + RTR(BOT)] to RTR(BOT)/[RTR(TOP) + RTR(BOT)] D 05/17 Changed MSL Rating from 3 to 4 2 E 01/18 Removed unnecessary sentence from Pre-Biased Output Start-Up section 14 F 03/18 Corrected RFSET to GND G 09/18 Split common VIN into VIN1 and VIN2 H 02/20 Added text to Operating Frequency Changed resistors' value for LTC6902 PAGE NUMBER 1 1, 2, 25, 26 13, 14 9, 11 1, 2, 3, 7, 8, 13, 22, 23, 24 11 12, 23 Rev. H Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license For is granted implication or otherwise under any patent or patent rights of Analog Devices. more by information www.analog.com 27 LTM4622 PACKAGE PHOTO DESIGN RESOURCES SUBJECT DESCRIPTION Module Design and Manufacturing Resources Design: * Selector Guides * Demo Boards and Gerber Files * Free Simulation Tools Module Regulator Products Search 1. Sort table of products by parameters and download the result as a spread sheet. Manufacturing: * Quick Start Guide * PCB Design, Assembly and Manufacturing Guidelines * Package and Board Level Reliability 2. Search using the Quick Power Search parametric table. Digital Power System Management Analog Devices' family of digital power supply management ICs are highly integrated solutions that offer essential functions, including power supply monitoring, supervision, margining and sequencing, and feature EEPROM for storing user configurations and fault logging. RELATED PARTS PART NUMBER LTM4623 DESCRIPTION 20VIN, 3A Step-Down Module Regulator LTM4624 14VIN, 4A Step-Down Module Regulator LTM4625 20VIN, 5A Step-Down Module Regulator LTM4619 Dual 26V, 4A Step-Down Module Regulator LTM4618 26VIN, 6A Step-Down Module Regulator LTM4614 LTC6902 Dual 5V, 4A Module Regulator Multiphase Oscillator with Spread Spectrum Frequency Modulation 20VIN, Dual 4A, Step-Down Module Regulator Ultrathin, Dual 10A, Step-Down Module Regulator Ultrathin, Quad 3A, Step-Down Module Regulator LTM4642 LTM4631 LTM4643 COMMENTS 4V VIN 20V, 0.6V VOUT 5.5V, PLL Input, CLKOUT, VOUT Tracking, PGOOD, 6.25mm x 6.25mm x 1.82mm LGA 4V VIN 14V, 0.6V VOUT 5.5V, VOUT Tracking, PGOOD, 6.25mm x 6.25mm x 5.01mm BGA 4V VIN 20V, 0.6V VOUT 5.5V, PLL Input, CLKOUT, VOUT Tracking, PGOOD, 6.25mm x 6.25mm x 5.01mm BGA 4.5V VIN 26.5V, 0.8V VOUT 5V, PLL Input, VOUT Tracking, PGOOD, 15mm x 15mm x 2.82mm LGA 4.5V VIN 26.5V, 0.8V VOUT 5V, PLL Input, VOUT Tracking, 9mm x 15mm x 4.32mm LGA 2.375V VIN 5.5V, 0.8V VOUT 5V, 15mm x 15mm x 2.82mm LGA 4.5V VIN 20V, 0.6V VOUT 5.5V, 9mm x 11.25mm x 4.92mm BGA 4.5V VIN 15V, 0.6V VOUT 1.8V, 16mm x 16mm x 1.91mm LGA 4V VIN 20V, 0.6V VOUT 3.3V, 9mm x 15mm x 1.82mm LGA Rev. H 28 D16847-0-2/20(H) www.analog.com For more information www.analog.com ANALOG DEVICES, INC. 2015-2020