SCES622 – JANUARY 2005
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DMember of the Texas Instruments
Widebus+ Family
DHigh-Bandwidth Data Path
(Up to 500 MHz†)
D5-V-Tolerant I/Os with Device Powered Up
or Powered Down
DLow and Flat ON-State Resistance (ron)
Characteristics Over Operating Range
(ron = 5 Ω Typical)
DRail-to-Rail Switching on Data I/O Ports
− 0- to 5-V Switching With 3.3-V VCC
− 0- to 3.3-V Switching With 2.5-V VCC
DBidirectional Data Flow, With Near-Zero
Propagation Delay
DLow Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 4 pF Typical)
DFast Switching Frequency
(fOE = 20 MHz Max)
†For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI
application report, CBT-C, CB3T, and CB3Q
Signal-Switch Families, literature number SCDA008.
DData and Control Inputs Provide
Undershoot Clamp Diodes
DLow Power Consumption
(ICC = 2 mA Typical)
DVCC Operating Range From 2.3 V to 3.6 V
DData I/Os Support 0- to 5-V Signaling
Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V,
5 V)
DControl Inputs Can be Driven by TTL or
5-V/3.3-V CMOS Outputs
DIoff Supports Partial-Power-Down Mode
Operation
DLatch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
DSupports Both Digital and Analog
Applications: PCI Interface, Differential
Signal Interface, Memory Interleaving, Bus
Isolation, Low-Distortion Signal Gating
description/ordering information
The SN74CB3Q32245 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage
of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance
allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. Th e
device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data
bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q32245 provides an optimized
interface solution ideally suited for broadband communications, networking, and data-intensive computing
systems.
The SN74CB3Q32245 is organized as four 8-bit bus switches with separate output-enable (1OE, 2OE, 3OE,
4OE) inputs. It can be used as four 8-bit bus switches, two 16-bit bus switches, or as one 32-bit bus switch. When
OE is lo w, the associated 8-bit bus switch is ON and the A port is connected to the B port, allowing bidirectional
data flow between ports. When OE is high, the associated 8-bit bus switch is OFF, and a high-impedance state
exists between the A and B ports.
ORDERING INFORMATION
TAPACKAGE‡ORDERABLE
PART NUMBER TOP-SIDE
MARKING
−40°C to 85°C
LFBGA − GKE Tape and reel SN74CB3Q32245GKER
BZ245
−40
°
C to 85
°
C
LFBGA − ZKE (Pb-free) Tape and reel SN74CB3Q32245ZKER
BZ245
‡Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus+ is a trademark of Texas Instruments.
!" # $%&" !# '%()$!" *!"&
*%$"# $ " #'&$$!"# '& "+& "&# &,!# #"%&"#
#"!*!* -!!". *%$" '$&##/ *&# " &$&##!). $)%*&
"&#"/ !)) '!!&"&#
SCES622 – JANUARY 2005
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging
current backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each 8-bit bus switch)
INPUT
INPUT/OUTPUT
FUNCTION
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L B A port = B port
H Z Disconnect
terminal assignments
123456
A1B2 1B1 NC 1OE 1A1 1A2
B1B4 1B3 GND GND 1A3 1A4
C1B6 1B5 VCC VCC 1A5 1A6
D1B8 1B7 GND GND 1A7 1A8
E2B2 2B1 GND GND 2A1 2A2
F2B4 2B3 VCC VCC 2A3 2A4
G2B6 2B5 GND GND 2A5 2A6
H2B7 2B8 NC 2OE 2A8 2A7
J3B2 3B1 NC 3OE 3A1 3A2
K3B4 3B3 GND GND 3A3 3A4
L3B6 3B5 VCC VCC 3A5 3A6
M3B8 3B7 GND GND 3A7 3A8
N4B2 4B1 GND GND 4A1 4A2
P4B4 4B3 VCC VCC 4A3 4A4
R4B6 4B5 GND GND 4A5 4A6
T4B7 4B8 NC 4OE 4A8 4A7
NC − No internal connection
GKE PACKAGE
(TOP VIEW)
123456
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
SCES622 – JANUARY 2005
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
1A1 SW 1B1
1A8
1OE
SW 1B8
3A1 SW 3B1
3A8
3OE
SW 3B8
A5
D6
A4
J5
M6
J4
A2
D1
J2
M1
2A1 SW 2B1
2A8
2OE
SW 2B8
4A1 SW 4B1
4A8
4OE
SW 4B8
E5
H5
H4
N5
T5
T4
E2
H2
N2
T2
simplified schematic, each FET switch (SW)
A
EN†
B
†EN is the internal enable signal applied to the switch.
Charge
Pump
VCC
SCES622 – JANUARY 2005
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control input voltage range, VIN (see Notes 1 and 2) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control input clamp current, IIK (VIN < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O port clamp current, II/OK (VI/O < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ON-state switch current, II/O (see Note 4) ±64 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND terminals ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 5) 40°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground, unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 6)
MIN MAX UNIT
VCC Supply voltage 2.3 3.6 V
VIH
High-level control input voltage
VCC = 2.3 V to 2.7 V 1.7 5.5
V
VIH High-level control input voltage VCC = 2.7 V to 3.6 V 2 5.5 V
VIL
Low-level control input voltage
VCC = 2.3 V to 2.7 V 0 0.7
V
VIL Low-level control input voltage VCC = 2.7 V to 3.6 V 0 0.8 V
VI/O Data input/output voltage 0 5.5 V
TAOperating free-air temperature −40 85 °C
NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SCES622 – JANUARY 2005
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VIK VCC = 3.6 V, II = −18 mA −1.8 V
IIN Control inputs VCC = 3.6 V, VIN = 0 to 5.5 V ±1µA
IOZ‡VCC = 3.6 V, VO = 0 to 5.5 V,
VI = 0, Switch OFF,
VIN = VCC or GND ±1µA
Ioff VCC = 0, VO = 0 to 5.5 V, VI = 0 1µA
ICC VCC = 3.6 V, II/O = 0,
Switch ON or OFF, VIN = VCC or GND 2 4 mA
∆ICC§Control inputs VCC = 3.6 V, One input at 3 V, Other inputs at VCC or GND 30 µA
ICCD¶
Per control
input
VCC = 3.6 V, A and B ports open,
0.15
0.25
mA/
MHz
I
CCD
¶
Per control
input Control input switching at 50% duty cycle
0.15
0.25
mA/
MHz
Cin Control inputs VCC = 3.3 V, VIN = 5.5 V, 3.3 V, or 0 3.5 5 pF
Cio(OFF) VCC = 3.3 V, Switch OFF,
VIN = VCC or GND, VI/O = 5.5 V, 3.3 V, or 0 4 6 pF
Cio(ON) VCC = 3.3 V, Switch ON,
VIN = VCC or GND, VI/O = 5.5 V, 3.3 V, or 0 10 13 pF
VCC = 2.3 V,
VI = 0, IO = 30 mA 6 8
ron#
VCC = 2.3 V,
TYP at VCC = 2.5 V VI = 1.7 V, IO = −15 mA 5 10
Ω
r
on
#
VCC = 3 V
VI = 0, IO = 30 mA 6 8 Ω
V
CC
= 3 V
VI = 2.4 V, IO = −15 mA 5 9
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
†All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
‡For I/O ports, the parameter IOZ includes the input leakage current.
§This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
¶This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see Figure 2).
#Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 3)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 2.5 V
± 0.2 V VCC = 3.3 V
± 0.3 V
UNIT
PARAMETER
(INPUT)
(OUTPUT)
MIN MAX MIN MAX
UNIT
fOE|| OE A or B 10 20 MHz
tpdkA or B B or A 0.18 0.3 ns
ten OE A or B 1.5 8 1.5 7 ns
tdis OE A or B 1 8 1 7 ns
|| Maximum switching frequency for control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0)
kThe propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
SCES622 – JANUARY 2005
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0
2
4
6
8
10
12
14
16
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
ron− ON−State Resistance −
VI − V
Ω
VCC = 3.3 V
TA = 25°C
IO = −15 mA
Figure 1. Typical ron vs VI
0
2
4
6
8
10
12
02468101214161820
OE Switching Frequency − MHz
CC
I − mA
VCC = 3.3 V
TA = 25°C
A and B ports Open
One OE Switching
Figure 2. Typical ICC vs OE Switching Frequency
SCES622 – JANUARY 2005
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
CL
(see Note A)
TEST CIRCUIT
S1 2 × VCC
Open
GND
RL
RL
tPLH tPHL
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
VCC
0 V
VOH
VOL
0 V
VOL + V∆
VOH − V∆
0 V
Output
Control
(VIN)
VCC
VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤10 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤2.5 ns
.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state
resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
50 Ω
VG1
V
CC
DUT
50 Ω
VIN
50 Ω
VG2 50 Ω
VI
TEST RL
S1 V∆
CL
2.5 V ±0.2 V
3.3 V ±0.3 V
VCC VI
tPHZ/tPZH
tPLZ/tPZL
tpd(s)
2.5 V ±0.2 V
3.3 V ±0.3 V
2.5 V ±0.2 V
3.3 V ±0.3 V
Open
Open
2 × VCC
2 × VCC
GND
GND
500 Ω
500 Ω
500 Ω
500 Ω
500 Ω
500 Ω
VCC or GND
VCC or GND
GND
GND
VCC
VCC
30 pF
50 pF
30 pF
50 pF
30 pF
50 pF
0.15 V
0.3 V
0.15 V
0.3 V
Output
Control
(VIN)
Input Generator
Input Generator
VCC/2 VCC/2
VCC/2 VCC/2
VCC/2 VCC/2 VCC/2
VCC/2
VO
Figure 3. Test Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74CB3Q32245GKER NRND LFBGA GKE 96 1000 TBD SNPB Level-2-235C-1 YEAR
SN74CB3Q32245ZKER ACTIVE LFBGA ZKE 96 1000 Green (RoHS &
no Sb/Br) SNAGCU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 13-Oct-2008
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74CB3Q32245GKER LFBGA GKE 96 1000 330.0 24.4 5.7 13.7 2.0 8.0 24.0 Q1
SN74CB3Q32245ZKER LFBGA ZKE 96 1000 330.0 24.4 5.7 13.7 2.0 8.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jul-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74CB3Q32245GKER LFBGA GKE 96 1000 333.2 345.9 31.8
SN74CB3Q32245ZKER LFBGA ZKE 96 1000 333.2 345.9 31.8
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jul-2011
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and www.ti.com/automotive
Automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions www.ti.com/lprfTI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
