SCES622 - JANUARY 2005 D Member of the Texas Instruments D D D D D D D D Data and Control Inputs Provide Widebus+ Family High-Bandwidth Data Path (Up to 500 MHz) 5-V-Tolerant I/Os with Device Powered Up or Powered Down Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 5 Typical) Rail-to-Rail Switching on Data I/O Ports - 0- to 5-V Switching With 3.3-V VCC - 0- to 3.3-V Switching With 2.5-V VCC Bidirectional Data Flow, With Near-Zero Propagation Delay Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 4 pF Typical) Fast Switching Frequency (fOE = 20 MHz Max) D D D D D D D D For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, literature number SCDA008. Undershoot Clamp Diodes Low Power Consumption (ICC = 2 mA Typical) VCC Operating Range From 2.3 V to 3.6 V Data I/Os Support 0- to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 - 2000-V Human-Body Model (A114-B, Class II) - 1000-V Charged-Device Model (C101) Supports Both Digital and Analog Applications: PCI Interface, Differential Signal Interface, Memory Interleaving, Bus Isolation, Low-Distortion Signal Gating description/ordering information The SN74CB3Q32245 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q32245 provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems. The SN74CB3Q32245 is organized as four 8-bit bus switches with separate output-enable (1OE, 2OE, 3OE, 4OE) inputs. It can be used as four 8-bit bus switches, two 16-bit bus switches, or as one 32-bit bus switch. When OE is low, the associated 8-bit bus switch is ON and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the associated 8-bit bus switch is OFF, and a high-impedance state exists between the A and B ports. ORDERING INFORMATION -40C to 85C ORDERABLE PART NUMBER PACKAGE TA LFBGA - GKE Tape and reel SN74CB3Q32245GKER LFBGA - ZKE (Pb-free) Tape and reel SN74CB3Q32245ZKER TOP-SIDE MARKING BZ245 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus+ is a trademark of Texas Instruments. Copyright 2005, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"& *%$"# $ " #'&$$!"# '& "+& "&# &,!# #"%&"# #"!*!* -!!". *%$" '$&##/ *&# " &$&##!). $)%*& "&#"/ !)) '!!&"&# POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCES622 - JANUARY 2005 description/ordering information (continued) This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE (each 8-bit bus switch) GKE PACKAGE (TOP VIEW) 1 3 4 5 INPUT/OUTPUT A FUNCTION L B A port = B port H Z Disconnect terminal assignments 6 1 2 3 4 5 6 A A 1B2 1B1 NC 1OE 1A1 1A2 B B 1B4 1B3 GND GND 1A3 1A4 C C 1B6 1B5 1A6 1B8 1B7 VCC GND 1A5 D VCC GND 1A7 1A8 E 2B2 2B1 GND GND 2A1 2A2 F 2B4 2B3 2A4 2B6 2B5 VCC GND 2A3 G VCC GND 2A5 2A6 H 2B7 2B8 NC 2OE 2A8 2A7 D E F G H J 3B2 3B1 NC 3OE 3A1 3A2 J K 3B4 3B3 GND GND 3A3 3A4 K L 3B6 3B5 3A6 M 3B8 3B7 VCC GND 3A5 L VCC GND 3A7 3A8 M N 4B2 4B1 GND GND 4A1 4A2 N P 4B4 4B3 4B6 4B5 VCC GND 4A4 R VCC GND 4A3 P 4A5 4A6 R T 4B7 4B8 NC 4OE 4A8 4A7 T 2 2 INPUT OE NC - No internal connection POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCES622 - JANUARY 2005 logic diagram (positive logic) A2 A5 1A1 SW 2A1 1B8 2A8 D1 D6 1A8 SW E2 E5 1B1 H2 H5 A4 2B1 SW 2B8 SW H4 1OE 2OE J5 3A1 J2 SW 4A1 3B8 4A8 M1 M6 3A8 N5 3B1 SW N2 T2 T5 J4 4B1 SW SW 4B8 T4 3OE 4OE simplified schematic, each FET switch (SW) A B VCC Charge Pump EN EN is the internal enable signal applied to the switch. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCES622 - JANUARY 2005 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 4.6 V Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA I/O port clamp current, II/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA ON-state switch current, II/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA Continuous current through VCC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA Package thermal impedance, JA (see Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to ground, unless otherwise specified. 2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. VI and VO are used to denote specific conditions for VI/O. 4. II and IO are used to denote specific conditions for II/O. 5. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 6) VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage VI/O TA Data input/output voltage MIN MAX 2.3 3.6 VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 2.3 V to 2.7 V 1.7 5.5 2 5.5 0 0.7 VCC = 2.7 V to 3.6 V 0 0.8 0 5.5 V -40 85 C Operating free-air temperature UNIT V V V NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCES622 - JANUARY 2005 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK IIN TEST CONDITIONS MIN VCC = 3.6 V, VCC = 3.6 V, II = -18 mA VIN = 0 to 5.5 V IOZ VCC = 3.6 V, VO = 0 to 5.5 V, VI = 0, Switch OFF, VIN = VCC or GND Ioff VCC = 0, VI = 0 ICC VCC = 3.6 V, VO = 0 to 5.5 V, II/O = 0, Switch ON or OFF, Control inputs ICC Control inputs ICCD Per control input VCC = 3.6 V, One input at 3 V, VCC = 3.6 V, A and B ports open, Control input switching at 50% duty cycle Cin Control inputs VCC = 3.3 V, VIN = VCC or GND TYP 2 Other inputs at VCC or GND MAX UNIT -1.8 V 1 A 1 A 1 A 4 mA 30 VIN = 5.5 V, 3.3 V, or 0 Switch OFF, VI/O = 5.5 V, 3.3 V, or 0 VIN = VCC or GND, 0.15 0.25 3.5 5 pF 4 6 pF 10 13 pF Cio(OFF) VCC = 3.3 V, Cio(ON) VCC = 3.3 V, Switch ON, VIN = VCC or GND, VI/O = 5.5 V, 3.3 V, or 0 VCC = 2.3 V, TYP at VCC = 2.5 V VI = 0, VI = 1.7 V, IO = 30 mA IO = -15 mA 6 8 5 10 VCC = 3 V VI = 0, VI = 2.4 V, IO = 30 mA IO = -15 mA 6 8 5 9 ron# A mA/ MHz VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see Figure 2). # Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER fOE|| tpdk ten FROM (INPUT) TO (OUTPUT) VCC = 2.5 V 0.2 V MIN MAX VCC = 3.3 V 0.3 V MIN UNIT MAX OE A or B 10 20 MHz A or B B or A 0.18 0.3 ns OE A or B 7 ns 1.5 8 1.5 tdis A or B 1 8 1 7 ns OE || Maximum switching frequency for control input (VO > VCC, VI = 5 V, RL 1 M, CL = 0) k The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 SCES622 - JANUARY 2005 ron - ON-State Resistance - 16 VCC = 3.3 V TA = 25C IO = -15 mA 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VI - V Figure 1. Typical ron vs VI 12 VCC = 3.3 V TA = 25C A and B ports Open 10 ICC - mA 8 6 4 One OE Switching 2 0 0 2 4 6 8 10 12 14 OE Switching Frequency - MHz Figure 2. Typical ICC vs OE Switching Frequency 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 16 18 20 SCES622 - JANUARY 2005 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 50 VG1 TEST CIRCUIT DUT Input Generator VI S1 RL VO 50 VG2 CL (see Note A) RL TEST VCC S1 RL VI CL tpd(s) 2.5 V 0.2 V 3.3 V 0.3 V Open Open 500 500 VCC or GND VCC or GND 30 pF 50 pF tPLZ/tPZL 2.5 V 0.2 V 3.3 V 0.3 V 2 x VCC 2 x VCC 500 500 GND GND 30 pF 50 pF 0.15 V 0.3 V tPHZ/tPZH 2.5 V 0.2 V 3.3 V 0.3 V GND GND 500 500 VCC VCC 30 pF 50 pF 0.15 V 0.3 V Output Control (VIN) V VCC VCC/2 VCC VCC/2 0V tPLH VOH Output VCC/2 Output Waveform 1 S1 at 2 x VCC (see Note B) tPLZ VCC VCC/2 tPZH tPHL VCC/2 VOL VCC/2 0V tPZL VCC/2 Open GND 50 Output Control (VIN) 2 x VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES (tpd(s)) VOL + V VOL tPHZ VCC/2 VOH - V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). H. All parameters and waveforms are not applicable to all devices. Figure 3. Test Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 13-Oct-2008 PACKAGING INFORMATION Status (1) Package Type Package Drawing SN74CB3Q32245GKER NRND LFBGA GKE 96 1000 SN74CB3Q32245ZKER ACTIVE LFBGA ZKE 96 1000 Green (RoHS & no Sb/Br) Orderable Device Pins Package Eco Plan (2) Qty TBD Lead/Ball Finish MSL Peak Temp (3) SNPB Level-2-235C-1 YEAR SNAGCU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74CB3Q32245GKER LFBGA GKE 96 1000 330.0 24.4 5.7 13.7 2.0 8.0 24.0 Q1 SN74CB3Q32245ZKER LFBGA ZKE 96 1000 330.0 24.4 5.7 13.7 2.0 8.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CB3Q32245GKER LFBGA GKE 96 1000 333.2 345.9 31.8 SN74CB3Q32245ZKER LFBGA ZKE 96 1000 333.2 345.9 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps RF/IF and ZigBee(R) Solutions www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated