5962-8771001PA - NATIONAL SEMICONDUCTOR

RGRF

VIN

VOUT

= 1 +

OUT

1 + sR C

1 1

( (

((

2pR C

1 1

f =

-3 dB

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION

DATA.

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

Industry-Standard Dual Operational Amplifiers

1 Features

1• Wide supply range of 3 V to 36 V (B version)

• Quiescent current: 300 µA per amplifier (B

version, typical)

• Unity-gain bandwidth of 1.2 MHz (B version)

• Common-mode input voltage range includes

ground, enabling direct sensing near ground

• Low input offset voltage of 3 mV at 25°C (A and B

versions, maximum)

• Internal RF and EMI filter (B version)

• On products compliant to MIL-PRF-38535, all

parameters are tested unless otherwise noted. On

all other products, production processing does not

necessarily include testing of all parameters.

2 Applications

•Merchant network and server power supply units

•Multi-function printers

•Power supplies and mobile chargers

•Motor control: AC induction, brushed DC,

brushless DC, high-voltage, low-voltage,

permanent magnet, and stepper motor

•Desktop PC and motherboard

•Indoor and outdoor air conditioners

•Washers, dryers, and refrigerators

•AC inverters, string inverters, central inverters,

and voltage frequency drives

•Uninterruptible power supplies

•Programmable logic controllers

•Electronic point-of-sale systems

Single-Pole, Low-Pass Filter

3 Description

The LM358B and LM2904B devices are the next-

generation versions of the industry-standard

operational amplifiers (op amps) LM358 and LM2904,

which include two high-voltage (36-V) op amps.

These devices provide outstanding value for cost-

sensitive applications, with features including low

offset (300 µV, typical), common-mode input range to

ground, and high differential input voltage capability.

The LM358B and LM2904B op amps simplify circuit

design with enhanced features such as unity-gain

stability, lower offset voltage of 3 mV (maximum at

room temperature), and lower quiescent current of

300 µA per amplifier (typical). High ESD (2 kV, HBM)

and integrated EMI and RF filters enable the LM358B

and LM2904B devices to be used in the most rugged,

environmentally challenging applications.

The LM358B and LM2904B amplifiers are available in

micro-sized packaging, such as the SOT23-8, as well

as industry standard packages, including SOIC,

TSSOP, and VSSOP.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LM358B, LM2904B,

LM358, LM358A, LM2904,

LM2904V, LM258, LM258A SOIC (8) 4.90 mm × 3.90 mm

LM358B, LM2904B,

LM358, LM358A, LM2904,

LM2490V TSSOP (8) 3.00 mm × 4.40 mm

LM358B(2), LM2904B(2),

LM358, LM358A, LM2904,

LM2904V, LM258, LM258A VSSOP (8) 3.00 mm × 3.00 mm

LM358B(2), LM2904B(2) SOT-23 (8) 2.90 mm × 1.60 mm

LM358, LM2904 SO (8) 5.20 mm × 5.30 mm

LM358, LM2904, LM358A,

LM258, LM258A PDIP (8) 9.81 mm × 6.35 mm

LM158, LM158A CDIP (8) 9.60 mm × 6.67 mm

LM158, LM158A LCCC (20) 8.89 mm × 8.89 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

(2) Package is for preview only.

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Device Comparison Table..................................... 4

6 Pin Configuration and Functions......................... 5

7 Specifications......................................................... 6

7.1 Absolute Maximum Ratings ...................................... 6

7.2 ESD Ratings.............................................................. 6

7.3 Recommended Operating Conditions....................... 7

7.4 Thermal Information.................................................. 7

7.5 Electrical Characteristics: LM358B and LM358BA ... 8

7.6 Electrical Characteristics: LM2904B and

LM2904BA ................................................................. 9

7.7 Electrical Characteristics: LM358, LM358A............ 10

7.8 Electrical Characteristics: LM2904, LM2904V........ 11

7.9 Electrical Characteristics: LM158, LM158A............ 12

7.10 Electrical Characteristics: LM258, LM258A.......... 13

7.11 Typical Characteristics.......................................... 14

7.12 Typical Characteristics.......................................... 21

8 Parameter Measurement Information ................ 23

9 Detailed Description............................................ 24

9.1 Overview................................................................. 24

9.2 Functional Block Diagram - LM358B, LM358BA,

LM2904B, LM2904BA.............................................. 24

9.3 Feature Description................................................. 25

9.4 Device Functional Modes........................................ 25

10 Application and Implementation........................ 26

10.1 Application Information.......................................... 26

10.2 Typical Application ............................................... 26

11 Power Supply Recommendations ..................... 27

12 Layout................................................................... 27

12.1 Layout Guidelines ................................................. 27

12.2 Layout Examples................................................... 28

13 Device and Documentation Support................. 29

13.1 Documentation Support ........................................ 29

13.2 Related Links ........................................................ 29

13.3 Receiving Notification of Documentation Updates 29

13.4 Support Resources ............................................... 29

13.5 Trademarks........................................................... 29

13.6 Electrostatic Discharge Caution............................ 29

13.7 Glossary................................................................ 29

14 Mechanical, Packaging, and Orderable

Information........................................................... 30

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision W (October 2019) to Revision X Page

• Added application links to Applications section ..................................................................................................................... 1

• Deleted preview tag from LM358B and LM2904B TSSOP (8) package in Device Information table .................................... 1

• Changed section title from Community Resources to Support Resources.......................................................................... 29

Changes from Revision V (September 2018) to Revision W Page

• Added specification in the Device Comparison Table............................................................................................................ 4

• Changed CDM ESD rating for LM358B and LM2904B in ESD Ratings ................................................................................ 6

• Changed VSto V+ in Recommended Operating Conditions.................................................................................................. 7

• Changed Thermal Information for the LM158FK and LM158JG devices............................................................................... 7

• Added Typical Characteristics section for the LM358B and LM2490B op amps................................................................. 14

• Added test circuit for THD+N and small-signal step response, G = –1 in the Parameter Measurement Information

section .................................................................................................................................................................................. 23

• Changed the Functional Block Diagram............................................................................................................................... 24

• Deleted preview designator from LM358B and LM2904B in the Related Links section ...................................................... 29

Changes from Revision U (January 2017) to Revision V Page

• Changed the data sheet title ................................................................................................................................................. 1

• Changed first four items in the Features section ................................................................................................................... 1

• Changed the first item in the Applications section and added four new items ...................................................................... 1

• Changed voltage values in the first paragraph of the Description section............................................................................. 1

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

• Changed text in the second paragraph of the Description section......................................................................................... 1

• Added devices LM358B and LM2904B to data sheet............................................................................................................ 1

• Changed the first three rows of the Device Information table and added a a cross-referenced note for PREVIEW-

status devices......................................................................................................................................................................... 1

• Added Device Comparison table ........................................................................................................................................... 4

• Added a table note to the Pin Functions table ...................................................................................................................... 5

• Changed "free-air temperature" to "ambient temperature" in the Absolute Maximum Ratings condition statement ............. 6

• Changed all entries in the Absolute Maximum Ratings table except TJand Tstg .................................................................. 6

• Deleted lead temperature and case temperature from Absolute Maximum Ratings.............................................................. 6

• Changed device listings and their voltage values in the ESD Ratings table ......................................................................... 6

• Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions condition

statement ............................................................................................................................................................................... 7

• Changed table entries for all parameters in the Recommended Operating Conditions table................................................ 7

• Added rows to the Thermal Information table, and a table note regarding device-package combinations .......................... 7

• Deleted the Operating Conditions table................................................................................................................................ 13

• Added a condition statement to the Typical Characteristics section.................................................................................... 21

• Changed specific voltages to a Recommended Operating Conditions reference................................................................ 24

• Changed unity-gain bandwidth from 0.7 MHz for all devices to 1.2 MHz for B-version devices.......................................... 25

• Changed slew rate from.3 V/µs for all devices to o.5 V/µs for B-version devices................................................................ 25

• Changed the Input Common Mode Range section in multiple places throughout............................................................... 25

• Changed VCC to VSin the Application Information section .................................................................................................. 26

• Subscripted the suffixes fro RIand RF.................................................................................................................................. 26

• Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a dual op amp 28

• Added Preview designation to the LM358B and LM2904B devices in Table 1 ................................................................... 29

Changes from Revision T (April 2015) to Revision U Page

• Changed data sheet title......................................................................................................................................................... 1

• Added Receiving Notification of Documentation Updates section and Community Resources section ............................. 29

Changes from Revision S (January 2014) to Revision T Page

• Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes,Application

and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1

Changes from Revision R (July 2010) to Revision S Page

• Converted this data sheet from the QS format to DocZone using the PDF on the web........................................................ 1

• Deleted Ordering Information table ........................................................................................................................................ 1

• Updated Features to include Military Disclaimer.................................................................................................................... 1

• Added Typical Characteristics section.................................................................................................................................. 21

• Added ESD warning............................................................................................................................................................. 29

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

5 Device Comparison Table

PART NUMBER SUPPLY

VOLTAGE TEMPERATURE

RANGE VOS (MAXIMUM

AT 25°C) IQ/ CH (TYPICAL AT

25°C) INTEGRATED EMI

FILTER PACKAGE

LM358B 3 V–36 V –40°C to 85°C 3 mV 300 µA Yes D, DDF, DGK, PW

LM2904B 3 V–36 V –40°C to 125°C 3 mV 300 µA Yes D, DDF, DGK, PW

LM358 3 V–32 V 0°C to 70°C 7 mV 350 µA No D, PW, DGK, P, PS

LM2904 3 V–26 V –40°C to 125°C 7 mV 350 µA No D, PW, DGK, P, PS

LM358A 3 V–32 V 0°C to 70°C 3 mV 350 µA No D, PW, DGK, P

LM2904V 3 V–32 V –40°C to 125°C 7 mV 350 µA No D, PW

LM158 3 V–32 V –55°C to 125°C 5 mV 350 µA No JG, FK

LM158A 3 V–32 V –55°C to 125°C 3 mV 350 µA No JG, FK

LM258 3 V–32 V –25°C to 85°C 5 mV 350 µA No D, DGK, P

LM258A 3 V–32 V –25°C to 85°C 3 mV 350 µA No D, DGK, P

4NC

5IN1±

6NC

7IN1+

8NC

9NC

10V±

11NC

12IN2+

13NC

14 NC

15 IN2±

16 NC

17 OUT2

18 NC

19 NC

20 V+

1 NC

2 OUT1

3 NC

Not to scale

1OUT1 8 V+

2IN1±7 OUT2

3IN1+ 6 IN2±

4V±5 IN2+

Not to scale

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

6 Pin Configuration and Functions

D, DDF, DGK, P, PS, PW, and JG Packages

8-Pin SOIC, SOT23-8, VSSOP, PDIP, SO, TSSOP, and CDIP

Top View FK Package

20-Pin LCCC

Top View

NC - No internal connection

(1) For a listing of which devices are available in what packages, see Device Comparison Table.

Pin Functions

PIN I/O DESCRIPTION

NAME LCCC(1) SOIC, SOT23-8, VSSOP, CDIP,

PDIP, SO, TSSOP, CFP(1)

IN1– 5 2 I Negative input

IN1+ 7 3 I Positive input

IN2– 15 6 I Negative input

IN2+ 12 5 I Positive input

OUT1 2 1 O Output

OUT2 17 7 O Output

V– 10 4 — Negative (lowest) supply or ground (for single-

supply operation)

NC 1, 3, 4, 6, 8, 9, 11,

13, 14, 16, 18, 19 — — No internal connection

V+ 20 8 — Positive (highest) supply

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Differential voltages are at IN+, with respect to IN−.

(3) Short circuits from outputs to VScan cause excessive heating and eventual destruction.

7 Specifications

7.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)

MIN MAX UNIT

Supply voltage, VS= ([V+] – [V–])

LM358B, LM358BA,

LM2904B, LM2904BA ±20 or 40

LM158, LM258, LM358,

LM158A, LM258A, LM358A,

LM2904V ±16 or 32

LM2904 ±13 or 26

Differential input voltage, VID(2)

LM358B, LM358BA,

LM2904B, LM2904BA,LM158,

LM258, LM358, LM158A,

LM258A, LM358A, LM2904V –32 32 V

LM2904 –26 26

Input voltage, VIEither input

LM358B, LM358BA,

LM2904B, LM2904BA –0.3 40

LM158, LM258, LM358,

LM158A, LM258A, LM358A,

LM2904V –0.3 32

LM2904 –0.3 26

Duration of output short circuit (one amplifier) to ground at (or below) TA= 25°C,

VS≤15 V(3) Unlimited s

Operating ambient temperature, TA

LM158, LM158A –55 125

°C

LM258, LM258A –25 85

LM358B, LM358BA –40 85

LM358, LM358A 0 70

LM2904B, LM2904BA,

LM2904, LM2904V –40 125

Operating virtual-junction temperature, TJ150 °C

Storage temperature, Tstg –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings VALUE UNIT

LM358B, LM358BA, LM2904B, AND LM2904BA

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000

LM158, LM258, LM358, LM158, LM258A, LM358A, LM2904, AND LM2904V

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted) MIN MAX UNIT

VSSupply voltage, VS= ([V+] – [V–])

LM358B, LM358BA, LM2904B,

LM2904BA 3 36

VLM158, LM258, LM358, LM158A,

LM258A, LM358A, LM2904V 3 30

LM2904 3 26

VCM Common-mode voltage V– V+ – 2 V

TAOperating ambient temperature

LM358B, LM358BA –40 85

°C

LM2904B, LM2904BA, LM2904,

LM2904V –40 125

LM358, LM358A 0 70

LM258, LM258A –20 85

LM158, LM158A –55 125

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2) For a listing of which devices are available in what packages, see Device Comparison Table.

7.4 Thermal Information

THERMAL METRIC(1)

LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904,

LM2904B, LM2904BA, LM2904V(2) LM158, LM158A

UNITD

(SOIC) DGK

(VSSOP) P

(PDIP) PS

(SO) PW

(TSSOP) FK

(LCCC) JG

(CDIP)

8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 20 PINS 8 PINS

RθJA Junction-to-ambient thermal

resistance 124.7 181.4 80.9 116.9 171.7 84.0 112.4 °C/W

RθJC(top) Junction-to-case (top)

thermal resistance 66.9 69.4 70.4 62.5 68.8 56.9 63.6 °C/W

RθJB Junction-to-board thermal

resistance 67.9 102.9 57.4 68.6 99.2 57.5 100.3 °C/W

ψJT Junction-to-top

characterization parameter 19.2 11.8 40 21.9 11.5 51.7 35.7 °C/W

ψJB Junction-to-board

characterization parameter 67.2 101.2 56.9 67.6 97.9 57.1 93.3 °C/W

RθJC(bot) Junction-to-case (bottom)

thermal resistance — — — — — 10.6 22.3 °C/W

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

(1) Specified by characterization only

7.5 Electrical Characteristics: LM358B and LM358BA

VS= (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA= 25°C, VCM = VOUT = VS/2, RL= 10k connected to VS/2

(unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

OFFSET VOLTAGE

VOS Input offset voltage

LM358B ±0.3 ±3.0 mV

TA= –40°C to +85°C ±4 mV

LM358BA ±2.0 mV

TA= –40°C to +85°C ±2.5 mV

dVOS/dTInput offset voltage drift TA= -40°C to +85°C(1) ±3.5 11 µV/°C

PSRR Power Supply Rejection Ratio ±2 15 µV/V

Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V

INPUT VOLTAGE RANGE

VCM Common-mode voltage range VS= 3 V to 36 V (V–) (V+) – 1.5 V

VS= 5 V to 36 V TA= –40°C to +85°C (V–) (V+) – 2 V

CMRR Common-mode rejection ratio (V–) ≤VCM ≤(V+) – 1.5 V VS= 3 V to 36 V 20 100 µV/V

(V–) ≤VCM ≤(V+) – 2.0 V VS= 5 V to 36 V TA= –40°C to +85°C 25 316

INPUT BIAS CURRENT

IBInput bias current ±10 ±35 nA

TA= –40°C to +85°C(1) ±50 nA

IOS Input offset current 0.5 4 nA

TA= –40°C to +85°C(1) 5 nA

dIOS/dTInput offset current drift TA= –40°C to +85°C 10 pA/℃

NOISE

EnInput voltage noise f = 0.1 to 10 Hz 3 µVPP

enInput voltage noise density f = 1 kHz 40 nV/√/Hz

INPUT IMPEDANCE

ZID Differential 10 || 0.1 MΩ|| pF

ZIC Common-mode 4 || 1.5 GΩ|| pF

OPEN-LOOP GAIN

AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥10 kΩ, connected to (V-) 70 140 V/mV

TA= –40°C to +85°C 35 V/mV

FREQUENCY RESPONSE

GBW Gain bandwidth product 1.2 MHz

SR Slew rate G = + 1 0.5 V/µs

ΘmPhase margin G = + 1, RL= 10kΩ, CL= 20 pF 56 °

tOR Overload recovery time VIN × gain > VS10 µs

tsSettling time To 0.1%, VS= 5 V, 2-V Step , G = +1, CL= 100 pF 4 µs

THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO= 3.53 VRMS, VS= 36V, RL= 100k, IOUT ≤±50µA, BW = 80 kHz 0.001 %

OUTPUT

VOVoltage output swing from rail

Positive Rail (V+)

IOUT = 50 µA 1.35 1.42 V

IOUT = 1 mA 1.4 1.48 V

IOUT = 5 mA(1) 1.5 1.61 V

Negative Rail (V-)

IOUT = 50 µA 100 150 mV

IOUT = 1 mA 0.75 1 V

VS= 5 V, RL ≤10 kΩconnected to (V–) TA= –40°C to +85°C 5 20 mV

IOOutput current

VS= 15 V; VO= V-;

VID = 1 V Source(1) -20 -30

TA= –40°C to +85°C -10

VS= 15 V; VO= V+;

VID = -1 V Sink(1) 10 20

TA= –40°C to +85°C 5

VID = -1 V; VO= (V-) + 200 mV 60 100 μA

ISC Short-circuit current VS= 20 V, (V+) = 10 V, (V-) = -10 V, VO= 0 V ±40 ±60 mA

CLOAD Capacitive load drive 100 pF

ROOpen-loop output resistance f = 1 MHz, IO= 0 A 300 Ω

POWER SUPPLY

IQQuiescent current per amplifier VS= 5 V; IO= 0 A TA= –40°C to +85°C 300 460 µA

IQQuiescent current per amplifier VS= 36 V; IO= 0 A 800 µA

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

(1) Specified by characterization only

7.6 Electrical Characteristics: LM2904B and LM2904BA

VS= (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA= 25°C, VCM = VOUT = VS/2, RL= 10k connected to VS/2

(unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

OFFSET VOLTAGE

VOS Input offset voltage

LM2904B ±0.3 ±3.0 mV

TA= –40°C to +125°C ±4 mV

LM2904BA ±2.0 mV

TA= –40°C to +125°C ±2.5 mV

dVOS/dTInput offset voltage drift TA= –40°C to +125°C(1) ±3.5 12 µV/°C

PSRR Power Supply Rejection Ratio ±2 15 µV/V

Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V

INPUT VOLTAGE RANGE

VCM Common-mode voltage range VS= 3 V to 36 V (V–) (V+) – 1.5 V

VS= 5 V to 36 V TA= –40°C to +125°C (V–) (V+) – 2 V

CMRR Common-mode rejection ratio (V–) ≤VCM ≤(V+) – 1.5 V VS= 3 V to 36 V 20 100 µV/V

(V–) ≤VCM ≤(V+) – 2.0 V VS= 5 V to 36 V TA= –40°C to +125°C 25 316

INPUT BIAS CURRENT

IBInput bias current ±10 ±35 nA

TA= –40°C to +125°C(1) ±50 nA

IOS Input offset current 0.5 4 nA

TA= –40°C to +125°C(1) 5 nA

dIOS/dTInput offset current drift TA= –40°C to +125°C 10 pA/℃

NOISE

EnInput voltage noise f = 0.1 to 10 Hz 3 µVPP

enInput voltage noise density f = 1 kHz 40 nV/√/Hz

INPUT IMPEDANCE

ZID Differential 10 || 0.1 MΩ|| pF

ZIC Common-mode 4 || 1.5 GΩ|| pF

OPEN-LOOP GAIN

AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥10 kΩ, connected to (V-) 70 140 V/mV

TA= –40°C to +125°C 35 V/mV

FREQUENCY RESPONSE

GBW Gain bandwidth product 1.2 MHz

SR Slew rate G = + 1 0.5 V/µs

ΘmPhase margin G = + 1, RL= 10kΩ, CL= 20 pF 56 °

tOR Overload recovery time VIN × gain > VS10 µs

tsSettling time To 0.1%, VS= 5 V, 2-V Step , G = +1, CL= 100 pF 4 µs

THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO= 3.53 VRMS, VS= 36V, RL= 100k, IOUT ≤±50µA, BW = 80 kHz 0.001 %

OUTPUT

VOVoltage output swing from rail

Positive Rail (V+)

IOUT = 50 µA 1.35 1.42 V

IOUT = 1 mA 1.4 1.48 V

IOUT = 5 mA(1) 1.5 1.61 V

Negative Rail (V-)

IOUT = 50 µA 100 150 mV

IOUT = 1 mA 0.75 1 V

VS= 5 V, RL ≤10 kΩconnected to (V–) TA= –40°C to +125°C 5 20 mV

IOOutput current

VS= 15 V; VO= V-; VID =

1 V Source(1) -20 -30

TA= –40°C to +125°C -10

VS= 15 V; VO= V+; VID

= -1 V Sink(1) 10 20

TA= –40°C to +125°C 5

VID = -1 V; VO= (V-) + 200 mV 60 100 μA

ISC Short-circuit current VS= 20 V, (V+) = 10 V, (V-) = -10 V, VO= 0 V ±40 ±60 mA

CLOAD Capacitive load drive 100 pF

ROOpen-loop output resistance f = 1 MHz, IO= 0 A 300 Ω

POWER SUPPLY

IQQuiescent current per amplifier VS= 5 V; IO= 0 A TA= –40°C to +125°C 300 460 µA

IQQuiescent current per amplifier VS= 36 V; IO= 0 A 800 µA

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.

Maximum VSfor testing purposes is 30 V for LM358 and LM358A.

(2) All typical values are TA= 25°C.

7.7 Electrical Characteristics: LM358, LM358A

For VS= (V+) – (V–) = 5 V, TA= 25 °C, (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT

OFFSET VOLTAGE

VOS Input offset voltage VS= 5 V to 30 V; VCM = 0 V; VO= 1.4

LM358 3 7

TA= 0°C to 70°C 9

LM358A 2 3

TA= 0°C to 70°C 5

dVOS/dTInput offset voltage drift LM358 TA= 0°C to 70°C 7 µV/°C

LM358A TA= 0°C to 70°C 7 20

PSRR Input offset voltage vs power

supply (ΔVIO/ΔVS)VS= 5 V to 30 V 65 100 dB

VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB

INPUT VOLTAGE RANGE

VCM Common-mode voltage range

VS= 5 V to 30 V LM358 (V–) (V+) – 1.5

VS= 30 V LM358A

VS= 5 V to 30 V LM358 TA= 0°C to 70°C (V–) (V+) – 2

VS= 30 V LM358A

CMRR Common-mode rejection ratio VS= 5 V to 30 V; VCM = 0 V 65 80 dB

INPUT BIAS CURRENT

IBInput bias current VO= 1.4 V

LM358 –20 –250

TA= 0°C to 70°C –500

LM358A –15 –100

TA= 0°C to 70°C –200

IOS Input offset current VO= 1.4 V

LM358 2 50

TA= 0°C to 70°C 150

LM358A 2 30

TA= 0°C to 70°C 75

dIOS/dTInput offset current drift 10 pA/°C

LM358A TA= 0°C to 70°C 300

NOISE

enInput voltage noise density f = 1 kHz 40 nV/√Hz

OPEN-LOOP GAIN

AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥2 kΩ25 100 V/mV

TA= 0°C to 70°C 15

FREQUENCY RESPONSE

GBW Gain bandwidth product 0.7 MHz

SR Slew rate G = +1 0.3 V/µs

OUTPUT

VOVoltage output swing from rail Positive rail

VS= 30 V; RL= 2 kΩTA= 0°C to 70°C 4

VVS= 30 V; RL≥10 kΩ2 3

VS= 5 V; RL≥2 kΩ1.5

Negative rail VS= 5 V; RL≤10 kΩTA= 0°C to 70°C 5 20 mV

IOOutput current

VS= 15 V; VO= 0 V; VID

= 1 V Source

–20 –30

LM358A –60

TA= 0°C to 70°C –10

VS= 15 V; VO= 15 V;

VID = –1 V Sink 10 20

TA= 0°C to 70°C 5

VID = –1 V; VO= 200 mV 12 30 µA

ISC Short-circuit current VS= 10 V; VO= VS/ 2 ±40 ±60 mA

POWER SUPPLY

IQQuiescent current per

amplifier VO= 2.5 V; IO= 0 A TA= 0°C to 70°C 350 600 µA

VS= 30 V; VO= 15 V; IO= 0 A 500 1000

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.

Maximum VSfor testing purposes is 26 V for LM2904 and 32 V for LM2904V.

(2) All typical values are TA= 25°C.

7.8 Electrical Characteristics: LM2904, LM2904V

For VS= (V+) – (V–) = 5 V, TA= 25 °C, (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) MIN TYP (2) MAX UNIT

OFFSET VOLTAGE

VOS Input offset voltage VS= 5 V to maximum; VCM = 0 V; VO= 1.4

Non-A suffix

devices 3 7

TA= –40°C to 125°C 10

A-suffix

devices 1 2

TA= –40°C to 125°C 4

dVOS/dTInput offset voltage drift TA= –40°C to 125°C 7 µV/°C

PSRR Input offset voltage vs power

supply (ΔVIO/ΔVS)VS= 5 V to 30 V 65 100 dB

VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB

INPUT VOLTAGE RANGE

VCM Common-mode voltage range VS= 5 V to maximum (V–) (V+) – 1.5 V

TA= –40°C to 125°C (V–) (V+) – 2

CMRR Common-mode rejection ratio VS= 5 V to maximum; VCM = 0 V 65 80 dB

INPUT BIAS CURRENT

IBInput bias current VO= 1.4 V –20 –250 nA

TA= –40°C to 125°C –500

IOS Input offset current VO= 1.4 V

Non-V suffix

device 2 50

TA= –40°C to 125°C 300

V-suffix

device 2 50

TA= –40°C to 125°C 150

dIOS/dTInput offset current drift TA= –40°C to 125°C 10 pA/°C

NOISE

enInput voltage noise density f = 1 kHz 40 nV/√Hz

OPEN-LOOP GAIN

AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥2 kΩ25 100 V/mV

TA= –40°C to 125°C 15

FREQUENCY RESPONSE

GBW Gain bandwidth product 0.7 MHz

SR Slew rate G = +1 0.3 V/µs

OUTPUT

VOVoltage output swing from rail Positive rail

RL≥10 kΩVS– 1.5

Non-V suffix

device

VS= maximum; RL=

2 kΩ

TA= –40°C to 125°C

VS= maximum; RL≥

10 kΩ2 3

V-suffix device

VS= maximum; RL=

2 kΩ6

VS= maximum; RL≥

10 kΩ4 5

Negative rail VS= 5 V; RL≤10 kΩTA= –40°C to 125°C 5 20 mV

IOOutput current

VS= 15 V; VO= 0 V; VID = 1 V Source –20 –30

TA= –40°C to 125°C –10

VS= 15 V; VO= 15 V; VID = –1 V Sink 10 20

TA= –40°C to 125°C 5

VID = -1 V; VO= 200 mV Non-V suffix device 30 µA

V-suffix device 12 40

ISC Short-circuit current VS= 10 V; VO= VS/ 2 ±40 ±60 mA

POWER SUPPLY

IQQuiescent current per amplifier VO= 2.5 V; IO= 0 A TA= –40°C to 125°C 350 600 µA

VS= maximum; VO= maximum / 2; IO= 0 A 500 1000

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.

Maximum VSfor testing purposes is 30 V for LM158 and LM158A.

(2) All typical values are TA= 25°C.

(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.

7.9 Electrical Characteristics: LM158, LM158A

For VS= (V+) – (V–) = 5 V, TA= 25 °C, (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT

OFFSET VOLTAGE

VOS Input offset voltage VS= 5 V to 30 V; VCM = 0 V; VO= 1.4 V

LM158 3 5

TA= –55°C to 125°C 7

LM158A 2

TA= –55°C to 125°C 4

dVOS/dTInput offset voltage drift LM158 TA= –55°C to 125°C 7 µV/°C

LM158A TA= –55°C to 125°C 7 15(3)

PSRR Input offset voltage vs power supply

(ΔVIO/ΔVS)VS= 5 V to 30 V 65 100 dB

VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB

INPUT VOLTAGE RANGE

VCM Common-mode voltage range

VS= 5 V to 30 V LM158 (V–) (V+) – 1.5

VS= 30 V LM158A

VS= 5 V to 30 V LM158 TA= –55°C to 125°C (V–) (V+) – 2

VS= 30 V LM158A

CMRR Common-mode rejection ratio VS= 5 V to 30 V; VCM = 0 V 70 80 dB

INPUT BIAS CURRENT

IBInput bias current VO= 1.4 V

LM158 –20 –150

TA= –55°C to 125°C –300

LM158A –15 –50

TA= –55°C to 125°C –100

IOS Input offset current VO= 1.4 V

LM158 2 30

TA= –55°C to 125°C 100

LM158A 2 10

TA= –55°C to 125°C 30

dIOS/dTInput offset current drift 10 pA/°C

LM158A TA= –55°C to 125°C 200

NOISE

enInput voltage noise density f = 1 kHz 40 nV/√Hz

OPEN-LOOP GAIN

AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥2 kΩ50 100 V/mV

TA= –55°C to 125°C 25

FREQUENCY RESPONSE

GBW Gain bandwidth product 0.7 MHz

SR Slew rate G = +1 0.3 V/µs

OUTPUT

VOVoltage output swing from rail Positive rail

VS= 30 V; RL= 2 kΩTA= –55°C to 125°C 4

VVS= 30 V; RL≥10 kΩ2 3

VS= 5 V; RL≥2 kΩ1.5

Negative rail VS= 5 V; RL≤10 kΩTA= –55°C to 125°C 5 20 mV

IOOutput current

VS= 15 V; VO= 0 V; VID = 1 V Source

–20 –30

LM158A –60

TA= –55°C to 125°C –10

VS= 15 V; VO= 15 V; VID = –1

VSink 10 20

TA= –55°C to 125°C 5

VID = –1 V; VO= 200 mV 12 30 µA

ISC Short-circuit current VS= 10 V; VO= VS/ 2 ±40 ±60 mA

POWER SUPPLY

IQQuiescent current per amplifier VO= 2.5 V; IO= 0 A TA= –55°C to 125°C 350 600 µA

VS= 30 V; VO= 15 V; IO= 0 A 500 1000

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.

Maximum VSfor testing purposes is 30 V for LM258 and LM258A.

(2) All typical values are TA= 25°C.

7.10 Electrical Characteristics: LM258, LM258A

For VS= (V+) – (V–) = 5 V, TA= 25 °C, (unless otherwise noted)

PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT

OFFSET VOLTAGE

VOS Input offset voltage VS= 5 V to 30 V; VCM = 0 V; VO= 1.4 V

LM258 3 5

TA= –25°C to 85°C 7

LM258A 2 3

TA= –25°C to 85°C 4

dVOS/dTInput offset voltage drift LM258 TA= –25°C to 85°C 7µV/°C

LM258A 7 15

PSRR Input offset voltage vs power supply

(ΔVIO/ΔVS)VS= 5 V to 30 V 65 100 dB

VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB

INPUT VOLTAGE RANGE

VCM Common-mode voltage range

VS= 5 V to 30 V LM258 (V–) (V+) – 1.5

VS= 30 V LM258A

VS= 5 V to 30 V LM258 TA= –25°C to 85°C (V–) (V+) – 2

VS= 30 V LM258A

CMRR Common-mode rejection ratio VS= 5 V to 30 V; VCM = 0 V 70 80 dB

INPUT BIAS CURRENT

IBInput bias current VO= 1.4 V

LM258 –20 –150

TA= –25°C to 85°C –300

LM258A –15 –80

TA= –25°C to 85°C –100

IOS Input offset current VO= 1.4 V

LM258 2 30

TA= –25°C to 85°C 100

LM258A 2 15

TA= –25°C to 85°C 30

dIOS/dTInput offset current drift 10 pA/°C

LM258A TA= –25°C to 85°C 200

NOISE

enInput voltage noise density f = 1 kHz 40 nV/√Hz

OPEN-LOOP GAIN

AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥2 kΩ50 100 V/mV

TA= –25°C to 85°C 25

FREQUENCY RESPONSE

GBW Gain bandwidth product 0.7 MHz

SR Slew rate G = +1 0.3 V/µs

OUTPUT

VOVoltage output swing from rail Positive rail

VS= 30 V; RL= 2 kΩTA= –25°C to 85°C 4

VVS= 30 V; RL≥10 kΩ2 3

VS= 5 V; RL≥2 kΩ1.5

Negative rail VS= 5 V; RL≤10 kΩTA= –25°C to 85°C 5 20 mV

IOOutput current

VS= 15 V; VO= 0 V; VID = 1 V Source

–20 –30

LM258A –60

TA= –25°C to 85°C –10

VS= 15 V; VO= 15 V; VID = –1

VSink 10 20

TA= –25°C to 85°C 5

VID = –1 V; VO= 200 mV 12 30 µA

ISC Short-circuit current VS= 10 V; VO= VS/ 2 ±40 ±60 mA

POWER SUPPLY

IQQuiescent current per amplifier VO= 2.5 V; IO= 0 A TA= –25°C to 85°C 350 600 µA

VS= 30 V; VO= 15 V; IO= 0 A 500 1000

Frequency (Hz)

Open Loop Voltage Gain (dB)

Phase ()

-20 -10

-10 0

0 10

10 20

20 30

30 40

40 50

50 60

60 70

70 80

80 90

90 100

1k 10k 100k 1M

D012

Gain (dB)

Phase (°)

Frequency (Hz)

Closed Lopp Voltage Gain (dB)

-30

-20

-10

1k 10k 100k 1M

D017

G = 1

G = 10

G = 100

G = 1000

G = –1

Temperature (°C)

Offset Voltage (µV)

-40 -20 0 20 40 60 80 100 120

-750

-450

-150

150

450

750

DC10

Common-Mode Voltage (V)

Offset Voltage (µV)

-18 -12 -6 0 6 12 17

-500

-300

-100

100

300

500

DC10

Offset Voltage (µV)

Amplifiers (%)

-1800 -1200 -600 0 600 1200 1800

DC11

Offset Voltage Drift (µV/°C)

Amplifiers (%)

0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75

DC12

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

7.11 Typical Characteristics

Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with

TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).

Figure 1. Offset Voltage Production Distribution Figure 2. Offset Voltage Drift Distribution

Figure 3. Offset Voltage vs Temperature Figure 4. Offset Voltage vs Common-Mode Voltage

Figure 5. Open-Loop Gain and Phase vs Frequency Figure 6. Closed-Loop Gain vs Frequency

Output Current (mA)

Output Voltage (V)

0 10 20 30 40 50

V+

(V+) – 3 V

(V+) – 6 V

(V+) – 9 V

(V+) – 12 V

DC13

–40C

25C

125C

Output Current (mA)

Output Voltage (V)

0 5 10 15 20 25 30 35 40

V–

(V–) + 3 V

(V–) + 6 V

(V–) + 9 V

(V–) + 12 V

(V–) + 15 V

(V–) + 18 V

DC1-

–40C

25C

125C

Temperature (°C)

Input Bias Current (nA)

-40 -10 20 50 80 110 130

-12

-11

-10

-9

-8

-7

-6

DCIB

IB+

IB–

Temperature (°C)

Input Offset Current (nA)

-40 -10 20 50 80 110 130

-0.03

-0.015

0.015

0.03

0.045

0.06

DCIO

Common-Mode Voltage (V)

Input Bias Current (nA)

-20 -15 -10 -5 0 5 10 15 20

-15

-12.5

-10

-7.5

-5

DC3I

IB+

IB–

Common-Mode Voltage (V)

Input Offset Current (pA)

-20 -15 -10 -5 0 5 10 15 20

-40

-20

100

120

DC3I

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

Typical Characteristics (continued)

Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with

TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).

Figure 7. Input Bias Current vs Common-Mode Voltage Figure 8. Input Offset Current vs Common-Mode Voltage

Figure 9. Input Bias Current vs Temperature Figure 10. Input Offset Current vs Temperature

Figure 11. Output Voltage Swing vs

Output Current (Sourcing) Figure 12. Output Voltage Swing vs

Output Current (Sinking)

Frequency (Hz)

Voltage Noise Spectral Density (nV/—Hz)

100

10 100 1k 10k 100k

D010

Frequency (Hz)

THD+N (dB)

-112

-104

-96

-88

-80

-72

-64

-56

-48

-40

-32

100 1k 10k

D013

10 k

2 k

Temperature (°C)

Power Supply Rejection Ratio (dB)

-40 -20 0 20 40 60 80 100 120 140

-123

-122

-121

-120

-119

-118

DC8_

Time (s)

Voltage (µV)

0 1 2 3 4 5 6 7 8 9 10

-2

-1.6

-1.2

-0.8

-0.4

0.4

0.8

1.2

1.6

D011

Frequency (Hz)

PSRR and CMRR (dB)

100

1k 10k 100k 1M

D001

PSRR+

PSRR-

CMRR

Temperature (°C)

Common-Mode Rejection Ratio (dB)

-40 -10 20 50 80 110 130

100

105

110

115

120

DC2_

VS= 36V

VS= 5V

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

Typical Characteristics (continued)

Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with

TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).

Figure 13. CMRR and PSRR vs Frequency Figure 14. Common-Mode Rejection Ratio vs

Temperature (dB)

VS= 5 V to 36 V

Figure 15. Power Supply Rejection Ratio vs

Temperature (dB) Figure 16. 0.1-Hz to 10-Hz Noise

Figure 17. Input Voltage Noise Spectral Density vs

Frequency

G = 1, f = 1 kHz, BW = 80 kHz,

VOUT = 10 VPP, RLconnected to V–

Figure 18. THD+N Ratio vs Frequency, G = 1

Temperature (°C)

Quiescent Current per Amplifier (µA)

-40 -20 0 20 40 60 80 100 120

240

300

360

420

480

540

600

DC4_

VS= 36V

VS= 5V

Frequency (Hz)

Open Loop Output Impedance ()

100

200

300

400

500

1k 10k 100k 1M

D006

Supply Voltage (V)

Quiescent Current (µA)

3 9 15 21 27 33 36

280

310

340

370

400

430

460

DC_S

Amplitude (VPP)

THD+N (dB)

0.001 0.01 0.1 1 10 2020

-110

-95

-80

-65

-50

-35

-20

D016

10 k

2 k

Frequency (Hz)

THD+N (dB)

-104

-96

-88

-80

-72

-64

-56

-48

-40

-32

100 1k 10k

D014

10 k

2 k

Amplitude (VPP)

THD+N (dB)

0.001 0.01 0.1 1 10 2020

-120

-110

-100

-90

-80

-70

-60

-50

-40

-30

D015

10 k

2 k

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

Typical Characteristics (continued)

Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with

TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).

G = –1, f = 1 kHz, BW = 80 kHz,

VOUT = 10 VPP, RLconnected to V–

Figure 19. THD+N Ratio vs Frequency, G = –1

G = 1, f = 1 kHz, BW = 80 kHz,

RLconnected to V–

Figure 20. THD+N vs Output Amplitude, G = 1

G = –1, f = 1 kHz, BW = 80 kHz,

RLconnected to V–

Figure 21. THD+N vs Output Amplitude, G = –1 Figure 22. Quiescent Current vs Supply Voltage

Figure 23. Quiescent Current vs Temperature Figure 24. Open-Loop Output Impedance vs Frequency

Time (s)

Voltage (mV)

0 20 40 60 80 100

-10

-7.5

-5

-2.5

2.5

7.5

D022

Input

Output

Time (s)

Voltage (mV)

0 20 40 60 80 100

-10

-7.5

-5

-2.5

2.5

7.5

D023

Input

Output

Capacitance Load (pF)

Phase Margin (°)

0 40 80 120 160 200 240 280 320 360

D018

Time (s)

Voltage (V)

0 200 400 600 800 1000

-20

-10

D021

Input

Output

Capacitance load (pF)

Overshoot (%)

0 40 80 120 160 200 240 280 320 360

D019

Overshoot (+)

Overshoot (-)

Capacitance load (pF)

Overshoot (%)

40 80 120 160 200 240 280 320 360

D020

Overshoot (+)

Overshoot (–)

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

Typical Characteristics (continued)

Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with

TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).

G = 1, 100-mV output step, RL= open

Figure 25. Small-Signal Overshoot vs Capacitive Load

G = –1, 100-mV output step, RL= open

Figure 26. Small-Signal Overshoot vs Capacitive Load

Figure 27. Phase Margin vs Capacitive Load

G = –10

Figure 28. Overload Recovery

G = 1, RL= open

Figure 29. Small-Signal Step Response, G = 1

G = –1, RL= open, RFB = 10K

Figure 30. Small-Signal Step Response, G = –1

Temperature (°C)

Short-Circuit Current (mA)

-40 -25 -10 5 20 35 50 65 80 95 110 125

-60

-40

-20

DC7_

Sinking

Sourcing

Frequency (Hz)

Maximum Output Voltage (VPP)

1k 10k 100k 1M

D005

Time (µs)

Votlage (V)

0 20 40 60 80 100

-2.5

-2

-1.5

-1

-0.5

0.5

1.5

2.5

AC_S

Output

Input

Temp(C)

Slew Rate(V/s)

-40 -25 -10 5 20 35 50 65 80 95 110 125

0.425

0.475

0.525

0.575

0.625

0.675

D009

Positive

Negative

Time (s)

Output Delta from Final Value (mV)

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

-20

-16

-12

-8

-4

D003

Time (s)

Output Delta from Final Value (mV)

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

-40

-32

-24

-16

-8

D004

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

Typical Characteristics (continued)

Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with

TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).

G = 1, RL= open

Figure 31. Large-Signal Step Response (Rising)

G = 1, RL= open

Figure 32. Large-Signal Step Response (Falling)

G = 1, RL= open

Figure 33. Large-Signal Step Response Figure 34. Slew Rate vs Temperature

Figure 35. Short-Circuit Current vs Temperature

VS= 15 V

Figure 36. Maximum Output Voltage vs Frequency

Frequency (Hz)

EMIRR (dB)

1M 10M 100M 1G

D007

Frequency (Hz)

Channel Separation (dB)

-135

-125

-115

-105

-95

-85

-75

1k 10k 100k 1M

D008

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

Typical Characteristics (continued)

Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with

TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).

Figure 37. Channel Separation vs Frequency Figure 38. EMIRR (Electromagnetic Interference Rejection

Ratio) vs Frequency

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0 4 8 12 16 20 24 28 32 36 40

Voltage (V)

Time (s)

VOUT

C001

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0 2 4 6 8 10

Voltage (V)

Time (s)

VOUT

C001

100

0.1 1 10 100 1000

CMRR (dB)

Frequency (kHz)

CMRR

C001

100

120

140

160

0 5 10 15 20 25 30 35 40

Avol Voltage Gain (dB)

V+ Supply Voltage (Vdc)

RL=20K

RL=2K

0.2

0.22

0.24

0.26

0.28

0.3

0.32

0.34

0.36

0 5 10 15 20 25 30

Supply Current (mA)

Supply Voltage (Vdc)

–55C

125C

–55 –35 –15 525 45 65 85 105 125

Input Current (nAdc)

Temperature (°C)

5Vdc

15Vdc

30Vdc

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

7.12 Typical Characteristics

Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.

Figure 39. Input Current vs Temperature Figure 40. Supply Current vs Supply Voltage

Figure 41. Voltage Gain vs Supply Voltage Figure 42. Common-Mode Rejection Ratio vs Frequency

Figure 43. Voltage Follower Large Signal Response (50 pF) Figure 44. Voltage Follower Small Signal Response (50 pF)

0.01

0.1

0.001 0.01 0.1 1 10 100

Output Voltage (Vdc)

Output Sink Current (mAdc)

5Vdc

15Vdc

30Vdc

–55 –35 –15 525 45 65 85 105 125

Output Current (mAdc)

Temperature (°C)

2.5

7.5

12.5

17.5

1 10 100 1k

Output Swing (Vp-p)

Frequency (kHz)

0.001 0.01 0.1 1 10 100

Output Voltage (Vdc) relative to Vcc

Output Sink Current (mAdc)

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

Typical Characteristics (continued)

Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.

Figure 45. Maximum Output Swing vs Frequency

(VCC = 15 V) Figure 46. Output Sourcing Characteristics

Figure 47. Output Sinking Characteristics Figure 48. Source Current Limiting

10 k



+18V

-18V

–

GNDGND

VIN

−

VCC+

VCC−

−

100 Ω

VCC+

VCC−

900 Ω

VI= 0 V

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

8 Parameter Measurement Information

Figure 49. Unity-Gain Amplifier Figure 50. Noise-Test Circuit

Figure 51. Test Circuit, G = –1, for THD+N and Small-Signal Step Response

VCC+

~100 µA

Current

Regula tor

~6 µA

Current

Regula tor

IN-

IN+

OUT

~6 µA

Current

Regulator

~120 µA

Curren t

Regulator

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

9 Detailed Description

9.1 Overview

These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to

operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the

difference between the two supplies is within the supply voltage range specified in the Recommended Operating

Conditions section, and VSis at least 1.5 V more positive than the input common-mode voltage. The low supply-

current drain is independent of the magnitude of the supply voltage.

Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier

circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices

can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required

interface electronics without additional ±5-V supplies.

9.2 Functional Block Diagram - LM358B, LM358BA, LM2904B, LM2904BA

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

9.3 Feature Description

9.3.1 Unity-Gain Bandwidth

The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without

greatly distorting the signal. These devices have a 1.2-MHz unity-gain bandwidth (B Version).

9.3.2 Slew Rate

The slew rate is the rate at which an operational amplifier can change its output when there is a change on the

input. These devices have a 0.5-V/µs slew rate (B Version).

9.3.3 Input Common Mode Range

The valid common mode range is from device ground to VS– 1.5 V (VS– 2 V across temperature). Inputs may

exceed VSup to the maximum VSwithout device damage. At least one input must be in the valid input common-

mode range for the output to be the correct phase. If both inputs exceed the valid range, then the output phase is

undefined. If either input more than 0.3 V below V– then input current should be limited to 1 mA and the output

phase is undefined.

9.4 Device Functional Modes

These devices are powered on when the supply is connected. This device can be operated as a single-supply

operational amplifier or dual-supply amplifier, depending on the application.



1.8

A 3.6

0.5



VOUT

VIN

Vsup+

VOUT

VIN

Vsup-

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

10.1 Application Information

The LMx58 and LM2904 operational amplifiers are useful in a wide range of signal conditioning applications.

Inputs can be powered before VSfor flexibility in multiple supply circuits.

10.2 Typical Application

A typical application for an operational amplifier is an inverting amplifier. This amplifier takes a positive voltage on

the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes negative

voltages positive.

Figure 52. Application Schematic

10.2.1 Design Requirements

The supply voltage must be chosen such that it is larger than the input voltage range and output range. For

instance, this application scales a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to

accommodate this application.

10.2.2 Detailed Design Procedure

Determine the gain required by the inverting amplifier using Equation 1 and Equation 2:

(1)

(2)

Once the desired gain is determined, choose a value for RIor RF. [Subscripts should be fixed in the

accompanying figures and equations also.] Choosing a value in the kilohm range is desirable because the

amplifier circuit uses currents in the milliampere range. This ensures the part does not draw too much current.

This example uses 10 kΩfor RIwhich means 36 kΩis used for RF. This was determined by Equation 3.

(3)

-2

-1.5

-1

-0.5

0.5

1.5

0 0.5 1 1.5 2

Volts

Time (ms)

VIN

VOUT

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

Typical Application (continued)

10.2.3 Application Curve

Figure 53. Input and Output Voltages of the Inverting Amplifier

11 Power Supply Recommendations

CAUTION

Supply voltages larger than specified in the recommended operating region can

permanently damage the device (see the Absolute Maximum Ratings).

Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-

impedance power supplies. For more detailed information on bypass capacitor placement, see the Layout

section.

12 Layout

12.1 Layout Guidelines

For best operational performance of the device, use good PCB layout practices, including:

• Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the

operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance

power sources local to the analog circuitry.

– Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as

close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-

supply applications.

• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective

methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.

A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital

and analog grounds, paying attention to the flow of the ground current.

• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If

it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as

opposed to in parallel with the noisy trace. [Things in parallel never cross, by definition]

• Place the external components as close to the device as possible. Keeping RFand RGclose to the inverting

input minimizes parasitic capacitance, as shown in Layout Examples.

• Keep the length of input traces as short as possible. Always remember that the input traces are the most

sensitive part of the circuit.

• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce

leakage currents from nearby traces that are at different potentials.

RIN

VOUT

VIN

OUT1

OUT2

IN1í

IN1+

Ví

V+

IN2í

IN2+

RIN

GND

VIN

VSí

GND

VS+

GND

Run the input traces as far

away from the supply lines

as possible

Only needed for

dual-supply

operation

Place components close to

device and to each other to

reduce parasitic errors

Use low-ESR, ceramic

bypass capacitor

(or GND for single supply) Ground (GND) plane on another layer

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

12.2 Layout Examples

Figure 54. Operational Amplifier Board Layout for Noninverting Configuration

Figure 55. Operational Amplifier Schematic for Noninverting Configuration

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

www.ti.com

SLOS068X –JUNE 1976–REVISED JUNE 2020

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

• Texas Instruments, Circuit Board Layout Techniques.

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to order now.

Table 1. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

LM158 Click here Click here Click here Click here Click here

LM158A Click here Click here Click here Click here Click here

LM258 Click here Click here Click here Click here Click here

LM258A Click here Click here Click here Click here Click here

LM358 Click here Click here Click here Click here Click here

LM358A Click here Click here Click here Click here Click here

LM358B Click here Click here Click here Click here Click here

LM2904 Click here Click here Click here Click here Click here

LM2904B Click here Click here Click here Click here Click here

LM2904V Click here Click here Click here Click here Click here

13.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

13.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

13.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.7 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms and definitions.

LM158

LM158A

LM258

LM258A

LM358

LM358A

LM358B

LM358BA

LM2904

LM2904B

LM2904BA

LM2904V

SLOS068X –JUNE 1976–REVISED JUNE 2020

www.ti.com

Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B

LM2904BA LM2904V

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most-

current data available for the designated devices. This data is subject to change without notice and without

revision of this document. For browser based versions of this data sheet, see the left-hand navigation pane.

PACKAGE OPTION ADDENDUM

www.ti.com 21-Jan-2021

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

5962-87710012A ACTIVE LCCC FK 20 1 Non-RoHS

& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-

87710012A

LM158FKB

5962-8771001PA ACTIVE CDIP JG 8 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 8771001PA

LM158

5962-87710022A ACTIVE LCCC FK 20 1 Non-RoHS

& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-

87710022A

LM158AFKB

5962-8771002PA ACTIVE CDIP JG 8 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 8771002PA

LM158A

LM158 MW8 ACTIVE WAFERSALE YS 0 1 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125

LM158AFKB ACTIVE LCCC FK 20 1 Non-RoHS

& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-

87710022A

LM158AFKB

LM158AJG ACTIVE CDIP JG 8 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 LM158AJG

LM158AJGB ACTIVE CDIP JG 8 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 8771002PA

LM158A

LM158FKB ACTIVE LCCC FK 20 1 Non-RoHS

& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-

87710012A

LM158FKB

LM158JG ACTIVE CDIP JG 8 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 LM158JG

LM158JGB ACTIVE CDIP JG 8 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 8771001PA

LM158

LM258AD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A

LM258ADGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3

LM258ADR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258A

LM258ADRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A

LM258ADRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A

PACKAGE OPTION ADDENDUM

www.ti.com 21-Jan-2021

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM258AP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -25 to 85 LM258AP

LM258APE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM258AP

LM258D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258

LM258DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258

LM258DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2

LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2

LM258DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258

LM258DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -25 to 85 LM258

LM258DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258

LM258P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -25 to 85 LM258P

LM258PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM258P

LM2904AVQDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV

LM2904AVQDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV

LM2904AVQPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV

LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV

LM2904BAIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA

LM2904BIDGKR PREVIEW VSSOP DGK 8 2500 RoHS (In

work) & Green

(In work)

Call TI Call TI -40 to 125

LM2904BIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B

LM2904BIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B

LM2904D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

PACKAGE OPTION ADDENDUM

www.ti.com 21-Jan-2021

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2904DE4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB

LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB

LM2904DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM2904

LM2904DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904

LM2904P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -40 to 125 LM2904P

LM2904PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 LM2904P

LM2904PSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904

LM2904PW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904

LM2904PWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2904

LM2904PWRG3 ACTIVE TSSOP PW 8 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L2904

LM2904PWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904

LM2904PWRG4-JF ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904

LM2904QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1

LM2904QDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1

LM2904VQDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V

LM2904VQDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V

LM2904VQPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V

PACKAGE OPTION ADDENDUM

www.ti.com 21-Jan-2021

Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V

LM358AD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADE4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6

LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6

LM358ADR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358ADRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A

LM358AP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM358AP

LM358APE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM358AP

LM358APW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358A

LM358APWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358A

LM358APWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358A

LM358BAIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA

LM358BIDGKR PREVIEW VSSOP DGK 8 2500 RoHS (In

work) & Green

(In work)

Call TI Call TI -40 to 85

LM358BIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B

LM358BIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B

LM358D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358

LM358DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358

PACKAGE OPTION ADDENDUM

www.ti.com 21-Jan-2021

Addendum-Page 5

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM358DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5

LM358DGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5

LM358DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358

LM358DRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358

LM358DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM358

LM358DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358

LM358P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM358P

LM358PE3 ACTIVE PDIP P 8 50 RoHS &

Non-Green SN N / A for Pkg Type 0 to 70 LM358P

LM358PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM358P

LM358PSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358

LM358PW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358

LM358PWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358

LM358PWRG3 ACTIVE TSSOP PW 8 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 L358

LM358PWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358

LM358PWRG4-JF ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358

PLM2904BIDGKR ACTIVE VSSOP DGK 8 2500 RoHS (In

work) & Green

(In work)

Call TI Call TI -40 to 125

PLM358BIDGKR ACTIVE VSSOP DGK 8 2500 RoHS (In

work) & Green

(In work)

Call TI Call TI -40 to 85

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

PACKAGE OPTION ADDENDUM

www.ti.com 21-Jan-2021

Addendum-Page 6

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM258A, LM2904, LM2904B :

•Automotive: LM2904-Q1, LM2904B-Q1

•Enhanced Product: LM258A-EP, LM2904-EP

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

PACKAGE OPTION ADDENDUM

www.ti.com 21-Jan-2021

Addendum-Page 7

•Enhanced Product - Supports Defense, Aerospace and Medical Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258ADR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM258DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904AVQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1

LM2904AVQDRG4 SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Dec-2020

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM2904AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904AVQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904PWRG4-JF TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM2904VQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1

LM2904VQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM2904VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM358ADR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358APWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM358DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Dec-2020

Pack Materials-Page 2

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM358DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1

LM358DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

LM358PWRG4-JF TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0

LM258ADR SOIC D 8 2500 853.0 449.0 35.0

LM258ADR SOIC D 8 2500 333.2 345.9 28.6

LM258ADR SOIC D 8 2500 364.0 364.0 27.0

LM258ADR SOIC D 8 2500 340.5 338.1 20.6

LM258ADRG4 SOIC D 8 2500 853.0 449.0 35.0

LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6

LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Dec-2020

Pack Materials-Page 3

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM258DR SOIC D 8 2500 340.5 338.1 20.6

LM258DR SOIC D 8 2500 364.0 364.0 27.0

LM258DR SOIC D 8 2500 853.0 449.0 35.0

LM258DR SOIC D 8 2500 333.2 345.9 28.6

LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0

LM258DRG3 SOIC D 8 2500 333.2 345.9 28.6

LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6

LM258DRG4 SOIC D 8 2500 853.0 449.0 35.0

LM2904AVQDR SOIC D 8 2500 340.5 338.1 20.6

LM2904AVQDRG4 SOIC D 8 2500 340.5 338.1 20.6

LM2904AVQPWR TSSOP PW 8 2000 853.0 449.0 35.0

LM2904AVQPWRG4 TSSOP PW 8 2000 853.0 449.0 35.0

LM2904BAIDR SOIC D 8 2500 340.5 338.1 20.6

LM2904BIDR SOIC D 8 2500 340.5 338.1 20.6

LM2904BIPWR TSSOP PW 8 2000 853.0 449.0 35.0

LM2904DGKR VSSOP DGK 8 2500 358.0 335.0 35.0

LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0

LM2904DR SOIC D 8 2500 853.0 449.0 35.0

LM2904DR SOIC D 8 2500 333.2 345.9 28.6

LM2904DR SOIC D 8 2500 364.0 364.0 27.0

LM2904DR SOIC D 8 2500 340.5 338.1 20.6

LM2904DRG3 SOIC D 8 2500 333.2 345.9 28.6

LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0

LM2904DRG4 SOIC D 8 2500 853.0 449.0 35.0

LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6

LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0

LM2904PWR TSSOP PW 8 2000 853.0 449.0 35.0

LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0

LM2904PWRG4 TSSOP PW 8 2000 853.0 449.0 35.0

LM2904PWRG4-JF TSSOP PW 8 2000 853.0 449.0 35.0

LM2904QDR SOIC D 8 2500 350.0 350.0 43.0

LM2904VQDR SOIC D 8 2500 340.5 338.1 20.6

LM2904VQPWR TSSOP PW 8 2000 853.0 449.0 35.0

LM2904VQPWRG4 TSSOP PW 8 2000 853.0 449.0 35.0

LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0

LM358ADR SOIC D 8 2500 340.5 338.1 20.6

LM358ADR SOIC D 8 2500 853.0 449.0 35.0

LM358ADR SOIC D 8 2500 364.0 364.0 27.0

LM358ADR SOIC D 8 2500 333.2 345.9 28.6

LM358ADRG4 SOIC D 8 2500 853.0 449.0 35.0

LM358ADRG4 SOIC D 8 2500 340.5 338.1 20.6

LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0

LM358APWR TSSOP PW 8 2000 853.0 449.0 35.0

LM358APWRG4 TSSOP PW 8 2000 853.0 449.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Dec-2020

Pack Materials-Page 4

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM358BAIDR SOIC D 8 2500 340.5 338.1 20.6

LM358BIDR SOIC D 8 2500 340.5 338.1 20.6

LM358BIPWR TSSOP PW 8 2000 853.0 449.0 35.0

LM358DGKR VSSOP DGK 8 2500 358.0 335.0 35.0

LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0

LM358DR SOIC D 8 2500 333.2 345.9 28.6

LM358DR SOIC D 8 2500 853.0 449.0 35.0

LM358DR SOIC D 8 2500 340.5 338.1 20.6

LM358DR SOIC D 8 2500 364.0 364.0 27.0

LM358DRG3 SOIC D 8 2500 364.0 364.0 27.0

LM358DRG3 SOIC D 8 2500 333.2 345.9 28.6

LM358DRG4 SOIC D 8 2500 853.0 449.0 35.0

LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6

LM358PWR TSSOP PW 8 2000 853.0 449.0 35.0

LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0

LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0

LM358PWRG4 TSSOP PW 8 2000 853.0 449.0 35.0

LM358PWRG4-JF TSSOP PW 8 2000 853.0 449.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Dec-2020

Pack Materials-Page 5

www.ti.com

PACKAGE OUTLINE

.228-.244 TYP

[5.80-6.19]

.069 MAX

[1.75]

6X .050

[1.27]

8X .012-.020

[0.31-0.51]

.150

[3.81]

.005-.010 TYP

[0.13-0.25]

0 - 8 .004-.010

[0.11-0.25]

.010

[0.25]

.016-.050

[0.41-1.27]

4X (0 -15 )

.189-.197

[4.81-5.00]

NOTE 3

B .150-.157

[3.81-3.98]

NOTE 4

4X (0 -15 )

(.041)

[1.04]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.

Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed .006 [0.15] per side.

4. This dimension does not include interlead flash.

5. Reference JEDEC registration MS-012, variation AA.

.010 [0.25] C A B

PIN 1 ID AREA

SEATING PLANE

.004 [0.1] C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.800

www.ti.com

EXAMPLE BOARD LAYOUT

.0028 MAX

[0.07]

ALL AROUND

.0028 MIN

[0.07]

ALL AROUND

(.213)

[5.4]

6X (.050 )

[1.27]

8X (.061 )

[1.55]

8X (.024)

[0.6]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

EXPOSED

METAL

OPENING

SOLDER MASK METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:8X

SYMM

SEE

DETAILS

SYMM

www.ti.com

EXAMPLE STENCIL DESIGN

8X (.061 )

[1.55]

8X (.024)

[0.6]

6X (.050 )

[1.27] (.213)

[5.4]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL

SCALE:8X

SYMM

MECHANICAL DATA

MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE

0.310 (7,87)

0.290 (7,37)

0.014 (0,36)

0.008 (0,20)

Seating Plane

4040107/C 08/96

0.065 (1,65)

0.045 (1,14)

0.020 (0,51) MIN

0.400 (10,16)

0.355 (9,00)

0.015 (0,38)

0.023 (0,58)

0.063 (1,60)

0.015 (0,38)

0.200 (5,08) MAX

0.130 (3,30) MIN

0.245 (6,22)

0.280 (7,11)

0.100 (2,54)

0°–15°

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Index point is provided on cap for terminal identification.

E. Falls within MIL STD 1835 GDIP1-T8

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PACKAGE OUTLINE

TYP

6.6

6.2

1.2 MAX

6X 0.65

8X 0.30

0.19

1.95

0.15

0.05

(0.15) TYP

0 - 8

0.25

GAGE PLANE

0.75

0.50

NOTE 3

3.1

2.9

NOTE 4

4.5

4.3

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SMALL OUTLINE PACKAGE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-153, variation AA.

0.1 C A B

PIN 1 ID

AREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.800

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EXAMPLE BOARD LAYOUT

(5.8)

0.05 MAX

ALL AROUND 0.05 MIN

ALL AROUND

8X (1.5)

8X (0.45)

6X (0.65)

(R )

TYP

0.05

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SMALL OUTLINE PACKAGE

SYMM

LAND PATTERN EXAMPLE

SCALE:10X

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

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EXAMPLE STENCIL DESIGN

(5.8)

6X (0.65)

8X (0.45)

8X (1.5)

(R ) TYP0.05

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SMALL OUTLINE PACKAGE

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:10X

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