Order Now Product Folder Technical Documents Support & Community Tools & Software LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 Industry-Standard Dual Operational Amplifiers 1 Features 3 Description * * The LM358B and LM2904B devices are the nextgeneration versions of the industry-standard operational amplifiers (op amps) LM358 and LM2904, which include two high-voltage (36-V) op amps. These devices provide outstanding value for costsensitive applications, with features including low offset (300 V, typical), common-mode input range to ground, and high differential input voltage capability. 1 * * * * * Wide supply range of 3 V to 36 V (B version) Quiescent current: 300 A per amplifier (B version, typical) Unity-gain bandwidth of 1.2 MHz (B version) Common-mode input voltage range includes ground, enabling direct sensing near ground Low input offset voltage of 3 mV at 25C (A and B versions, maximum) Internal RF and EMI filter (B version) On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. 2 Applications * * * * * * * * * * * Merchant network and server power supply units Multi-function printers Power supplies and mobile chargers Motor control: AC induction, brushed DC, brushless DC, high-voltage, low-voltage, permanent magnet, and stepper motor Desktop PC and motherboard Indoor and outdoor air conditioners Washers, dryers, and refrigerators AC inverters, string inverters, central inverters, and voltage frequency drives Uninterruptible power supplies Programmable logic controllers Electronic point-of-sale systems Single-Pole, Low-Pass Filter RG RF The LM358B and LM2904B op amps simplify circuit design with enhanced features such as unity-gain stability, lower offset voltage of 3 mV (maximum at room temperature), and lower quiescent current of 300 A per amplifier (typical). High ESD (2 kV, HBM) and integrated EMI and RF filters enable the LM358B and LM2904B devices to be used in the most rugged, environmentally challenging applications. The LM358B and LM2904B amplifiers are available in micro-sized packaging, such as the SOT23-8, as well as industry standard packages, including SOIC, TSSOP, and VSSOP. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM358B, LM2904B, LM358, LM358A, LM2904, SOIC (8) LM2904V, LM258, LM258A 4.90 mm x 3.90 mm LM358B, LM2904B, LM358, LM358A, LM2904, LM2490V TSSOP (8) 3.00 mm x 4.40 mm LM358B(2), LM2904B(2), LM358, LM358A, LM2904, VSSOP (8) LM2904V, LM258, LM258A 3.00 mm x 3.00 mm LM358B(2), LM2904B(2) SOT-23 (8) 2.90 mm x 1.60 mm LM358, LM2904 SO (8) 5.20 mm x 5.30 mm LM358, LM2904, LM358A, LM258, LM258A PDIP (8) 9.81 mm x 6.35 mm LM158, LM158A CDIP (8) 9.60 mm x 6.67 mm LM158, LM158A LCCC (20) 8.89 mm x 8.89 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) Package is for preview only. R1 VOUT VIN C1 f-3 dB = ( RF VOUT = 1+ RG VIN (( 1 1 + sR1C1 1 2pR1C1 ( 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 9 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 4 5 6 9.1 Overview ................................................................. 9.2 Functional Block Diagram - LM358B, LM358BA, LM2904B, LM2904BA .............................................. 9.3 Feature Description................................................. 9.4 Device Functional Modes........................................ 24 24 25 25 10 Application and Implementation........................ 26 10.1 Application Information.......................................... 26 10.2 Typical Application ............................................... 26 7.1 7.2 7.3 7.4 7.5 7.6 Absolute Maximum Ratings ...................................... 6 ESD Ratings.............................................................. 6 Recommended Operating Conditions....................... 7 Thermal Information .................................................. 7 Electrical Characteristics: LM358B and LM358BA ... 8 Electrical Characteristics: LM2904B and LM2904BA ................................................................. 9 7.7 Electrical Characteristics: LM358, LM358A ............ 10 7.8 Electrical Characteristics: LM2904, LM2904V ........ 11 7.9 Electrical Characteristics: LM158, LM158A ............ 12 7.10 Electrical Characteristics: LM258, LM258A .......... 13 7.11 Typical Characteristics .......................................... 14 7.12 Typical Characteristics .......................................... 21 11 Power Supply Recommendations ..................... 27 12 Layout................................................................... 27 Parameter Measurement Information ................ 23 Detailed Description ............................................ 24 14 Mechanical, Packaging, and Orderable Information ........................................................... 30 12.1 Layout Guidelines ................................................. 27 12.2 Layout Examples................................................... 28 13 Device and Documentation Support ................. 29 13.1 13.2 13.3 13.4 13.5 13.6 13.7 Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Support Resources ............................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 29 29 29 29 29 29 29 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision W (October 2019) to Revision X Page * Added application links to Applications section ..................................................................................................................... 1 * Deleted preview tag from LM358B and LM2904B TSSOP (8) package in Device Information table .................................... 1 * Changed section title from Community Resources to Support Resources .......................................................................... 29 Changes from Revision V (September 2018) to Revision W Page * Added specification in the Device Comparison Table ............................................................................................................ 4 * Changed CDM ESD rating for LM358B and LM2904B in ESD Ratings ................................................................................ 6 * Changed VS to V+ in Recommended Operating Conditions .................................................................................................. 7 * Changed Thermal Information for the LM158FK and LM158JG devices............................................................................... 7 * Added Typical Characteristics section for the LM358B and LM2490B op amps ................................................................. 14 * Added test circuit for THD+N and small-signal step response, G = -1 in the Parameter Measurement Information section .................................................................................................................................................................................. 23 * Changed the Functional Block Diagram ............................................................................................................................... 24 * Deleted preview designator from LM358B and LM2904B in the Related Links section ...................................................... 29 Changes from Revision U (January 2017) to Revision V Page * Changed the data sheet title ................................................................................................................................................. 1 * Changed first four items in the Features section ................................................................................................................... 1 * Changed the first item in the Applications section and added four new items ...................................................................... 1 * Changed voltage values in the first paragraph of the Description section ............................................................................. 1 2 Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 * Changed text in the second paragraph of the Description section......................................................................................... 1 * Added devices LM358B and LM2904B to data sheet ............................................................................................................ 1 * Changed the first three rows of the Device Information table and added a a cross-referenced note for PREVIEWstatus devices ......................................................................................................................................................................... 1 * Added Device Comparison table ........................................................................................................................................... 4 * Added a table note to the Pin Functions table ...................................................................................................................... 5 * Changed "free-air temperature" to "ambient temperature" in the Absolute Maximum Ratings condition statement ............. 6 * Changed all entries in the Absolute Maximum Ratings table except TJ and Tstg .................................................................. 6 * Deleted lead temperature and case temperature from Absolute Maximum Ratings.............................................................. 6 * Changed device listings and their voltage values in the ESD Ratings table ......................................................................... 6 * Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions condition statement ............................................................................................................................................................................... 7 * Changed table entries for all parameters in the Recommended Operating Conditions table ................................................ 7 * Added rows to the Thermal Information table, and a table note regarding device-package combinations .......................... 7 * Deleted the Operating Conditions table................................................................................................................................ 13 * Added a condition statement to the Typical Characteristics section .................................................................................... 21 * Changed specific voltages to a Recommended Operating Conditions reference................................................................ 24 * Changed unity-gain bandwidth from 0.7 MHz for all devices to 1.2 MHz for B-version devices.......................................... 25 * Changed slew rate from.3 V/s for all devices to o.5 V/s for B-version devices................................................................ 25 * Changed the Input Common Mode Range section in multiple places throughout ............................................................... 25 * Changed VCC to VS in the Application Information section .................................................................................................. 26 * Subscripted the suffixes fro RI and RF .................................................................................................................................. 26 * Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a dual op amp 28 * Added Preview designation to the LM358B and LM2904B devices in Table 1 ................................................................... 29 Changes from Revision T (April 2015) to Revision U Page * Changed data sheet title......................................................................................................................................................... 1 * Added Receiving Notification of Documentation Updates section and Community Resources section ............................. 29 Changes from Revision S (January 2014) to Revision T * Page Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1 Changes from Revision R (July 2010) to Revision S Page * Converted this data sheet from the QS format to DocZone using the PDF on the web ........................................................ 1 * Deleted Ordering Information table ........................................................................................................................................ 1 * Updated Features to include Military Disclaimer .................................................................................................................... 1 * Added Typical Characteristics section.................................................................................................................................. 21 * Added ESD warning ............................................................................................................................................................. 29 Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 3 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 5 Device Comparison Table 4 PART NUMBER SUPPLY VOLTAGE TEMPERATURE RANGE VOS (MAXIMUM AT 25C) IQ / CH (TYPICAL AT 25C) INTEGRATED EMI FILTER PACKAGE LM358B 3 V-36 V -40C to 85C 3 mV 300 A Yes D, DDF, DGK, PW LM2904B 3 V-36 V -40C to 125C 3 mV 300 A Yes D, DDF, DGK, PW LM358 3 V-32 V 0C to 70C 7 mV 350 A No D, PW, DGK, P, PS LM2904 3 V-26 V -40C to 125C 7 mV 350 A No D, PW, DGK, P, PS LM358A 3 V-32 V 0C to 70C 3 mV 350 A No D, PW, DGK, P LM2904V 3 V-32 V -40C to 125C 7 mV 350 A No D, PW LM158 3 V-32 V -55C to 125C 5 mV 350 A No JG, FK LM158A 3 V-32 V -55C to 125C 3 mV 350 A No JG, FK LM258 3 V-32 V -25C to 85C 5 mV 350 A No D, DGK, P LM258A 3 V-32 V -25C to 85C 3 mV 350 A No D, DGK, P Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 6 Pin Configuration and Functions D, DDF, DGK, P, PS, PW, and JG Packages 8-Pin SOIC, SOT23-8, VSSOP, PDIP, SO, TSSOP, and CDIP Top View 6 IN2 V 4 5 IN2+ NC 3 19 IN1+ V+ OUT2 20 7 NC 2 1 IN1 OUT1 V+ 2 8 NC 1 3 OUT1 FK Package 20-Pin LCCC Top View NC 4 18 NC IN1 5 17 OUT2 NC 6 16 NC IN1+ 7 15 IN2 NC 8 14 NC 13 NC 12 IN2+ 11 NC 10 V NC 9 Not to scale Not to scale NC - No internal connection Pin Functions PIN I/O DESCRIPTION LCCC (1) SOIC, SOT23-8, VSSOP, CDIP, PDIP, SO, TSSOP, CFP (1) IN1- 5 2 I Negative input IN1+ 7 3 I Positive input IN2- 15 6 I Negative input IN2+ 12 5 I Positive input OUT1 2 1 O Output OUT2 17 7 O Output V- 10 4 -- Negative (lowest) supply or ground (for singlesupply operation) NC 1, 3, 4, 6, 8, 9, 11, 13, 14, 16, 18, 19 -- -- No internal connection V+ 20 8 -- Positive (highest) supply NAME (1) For a listing of which devices are available in what packages, see Device Comparison Table. Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 5 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating ambient temperature range (unless otherwise noted) (1) MIN Supply voltage, VS = ([V+] - [V-]) Differential input voltage, VID (2) Input voltage, VI Either input MAX LM358B, LM358BA, LM2904B, LM2904BA 20 or 40 LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V 16 or 32 LM2904 13 or 26 LM358B, LM358BA, LM2904B, LM2904BA,LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V -32 32 LM2904 -26 26 LM358B, LM358BA, LM2904B, LM2904BA -0.3 40 LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V -0.3 32 LM2904 -0.3 26 Duration of output short circuit (one amplifier) to ground at (or below) TA = 25C, VS 15 V (3) Operating ambient temperature, TA Unlimited LM158, LM158A -55 125 LM258, LM258A -25 85 LM358B, LM358BA -40 85 0 70 -40 125 LM358, LM358A LM2904B, LM2904BA, LM2904, LM2904V Operating virtual-junction temperature, TJ Storage temperature, Tstg (1) (2) (3) -65 UNIT V V V s C 150 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Differential voltages are at IN+, with respect to IN-. Short circuits from outputs to VS can cause excessive heating and eventual destruction. 7.2 ESD Ratings VALUE UNIT LM358B, LM358BA, LM2904B, AND LM2904BA V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) 1000 V LM158, LM258, LM358, LM158, LM258A, LM358A, LM2904, AND LM2904V V(ESD) (1) (2) 6 Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) Charged-device model (CDM), per JEDEC specification JESD22-C101 500 (2) 1000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 7.3 Recommended Operating Conditions over operating ambient temperature range (unless otherwise noted) VS Supply voltage, VS= ([V+] - [V-]) VCM Common-mode voltage MIN MAX LM358B, LM358BA, LM2904B, LM2904BA 3 36 LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V 3 30 LM2904 TA Operating ambient temperature 3 26 V- V+ - 2 LM358B, LM358BA -40 85 LM2904B, LM2904BA, LM2904, LM2904V -40 125 LM358, LM358A 0 70 LM258, LM258A -20 85 LM158, LM158A -55 125 UNIT V V C 7.4 Thermal Information LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V (2) THERMAL METRIC (1) LM158, LM158A D (SOIC) DGK (VSSOP) P (PDIP) PS (SO) PW (TSSOP) FK (LCCC) JG (CDIP) UNIT 8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 20 PINS 8 PINS RJA Junction-to-ambient thermal resistance 124.7 181.4 80.9 116.9 171.7 84.0 112.4 C/W RJC(top) Junction-to-case (top) thermal resistance 66.9 69.4 70.4 62.5 68.8 56.9 63.6 C/W RJB Junction-to-board thermal resistance 67.9 102.9 57.4 68.6 99.2 57.5 100.3 C/W JT Junction-to-top characterization parameter 19.2 11.8 40 21.9 11.5 51.7 35.7 C/W JB Junction-to-board characterization parameter 67.2 101.2 56.9 67.6 97.9 57.1 93.3 C/W RJC(bot) Junction-to-case (bottom) thermal resistance -- -- -- -- -- 10.6 22.3 C/W (1) (2) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. For a listing of which devices are available in what packages, see Device Comparison Table. Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 7 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 7.5 Electrical Characteristics: LM358B and LM358BA VS = (V+) - (V-) = 5 V - 36 V (2.5 V - 18 V), TA = 25C, VCM = VOUT = VS/2, RL = 10k connected to VS/2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 0.3 3.0 mV 4 mV 2.0 mV OFFSET VOLTAGE LM358B VOS TA = -40C to +85C Input offset voltage LM358BA TA = -40C to +85C dVOS/dT Input offset voltage drift PSRR Power Supply Rejection Ratio Channel separation, dc 2.5 TA = -40C to +85C (1) f = 1 kHz to 20 kHz mV 3.5 11 V/C 2 15 V/V 1 V/V INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 3 V to 36 V VS = 5 V to 36 V CMRR Common-mode rejection ratio TA = -40C to +85C (V-) VCM (V+) - 1.5 V VS = 3 V to 36 V (V-) VCM (V+) - 2.0 V VS = 5 V to 36 V (V-) (V+) - 1.5 V (V-) (V+) - 2 V 20 100 25 316 10 35 nA 50 nA 4 nA V/V TA = -40C to +85C INPUT BIAS CURRENT IB Input bias current TA = -40C to +85C (1) 0.5 IOS Input offset current dIOS/dT Input offset current drift TA = -40C to +85C (1) 5 TA = -40C to +85C 10 nA pA/ NOISE En Input voltage noise f = 0.1 to 10 Hz en Input voltage noise density f = 1 kHz 3 VPP 40 nV//Hz 10 || 0.1 M|| pF 4 || 1.5 G|| pF INPUT IMPEDANCE ZID Differential ZIC Common-mode OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL 10 k, connected to (V-) 70 TA = -40C to +85C 140 V/mV 35 V/mV FREQUENCY RESPONSE GBW Gain bandwidth product 1.2 MHz SR Slew rate G=+1 0.5 V/s m Phase margin G = + 1, RL = 10k, CL = 20 pF 56 tOR Overload recovery time VIN x gain > VS 10 s ts Settling time To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF 4 s THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT 50A, BW = 80 kHz 0.001 % OUTPUT Positive Rail (V+) VO Voltage output swing from rail Negative Rail (V-) VS = 5 V, RL 10 k connected to (V-) IO Output current VS = 15 V; VO = V-; VID = 1 V Source (1) VS = 15 V; VO = V+; VID = -1 V Sink (1) IOUT = 50 A 1.35 1.42 V IOUT = 1 mA 1.4 1.48 V IOUT = 5 mA (1) 1.5 1.61 V IOUT = 50 A 100 150 mV IOUT = 1 mA 0.75 1 V 5 20 mV TA = -40C to +85C -20 TA = -40C to +85C ISC Short-circuit current CLOAD Capacitive load drive RO Open-loop output resistance mA 10 TA = -40C to +85C VID = -1 V; VO = (V-) + 200 mV 20 5 60 VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V -30 -10 100 40 f = 1 MHz, IO = 0 A A 60 mA 100 pF 300 POWER SUPPLY IQ Quiescent current per amplifier VS = 5 V; IO = 0 A IQ Quiescent current per amplifier VS = 36 V; IO = 0 A (1) 8 300 TA = -40C to +85C 460 A 800 A Specified by characterization only Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 7.6 Electrical Characteristics: LM2904B and LM2904BA VS = (V+) - (V-) = 5 V - 36 V (2.5 V - 18 V), TA = 25C, VCM = VOUT = VS/2, RL = 10k connected to VS/2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 0.3 3.0 mV 4 mV 2.0 mV OFFSET VOLTAGE LM2904B VOS TA = -40C to +125C Input offset voltage LM2904BA TA = -40C to +125C dVOS/dT Input offset voltage drift PSRR Power Supply Rejection Ratio Channel separation, dc 2.5 TA = -40C to +125C (1) f = 1 kHz to 20 kHz mV 3.5 12 V/C 2 15 V/V 1 V/V INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 3 V to 36 V VS = 5 V to 36 V CMRR Common-mode rejection ratio TA = -40C to +125C (V-) VCM (V+) - 1.5 V VS = 3 V to 36 V (V-) VCM (V+) - 2.0 V VS = 5 V to 36 V (V-) (V+) - 1.5 V (V-) (V+) - 2 V 20 100 25 316 10 35 nA 50 nA 4 nA V/V TA = -40C to +125C INPUT BIAS CURRENT IB Input bias current TA = -40C to +125C (1) 0.5 IOS Input offset current dIOS/dT Input offset current drift TA = -40C to +125C (1) 5 TA = -40C to +125C 10 nA pA/ NOISE En Input voltage noise f = 0.1 to 10 Hz en Input voltage noise density f = 1 kHz 3 VPP 40 nV//Hz 10 || 0.1 M|| pF 4 || 1.5 G|| pF INPUT IMPEDANCE ZID Differential ZIC Common-mode OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL 10 k, connected to (V-) 70 TA = -40C to +125C 140 V/mV 35 V/mV FREQUENCY RESPONSE GBW Gain bandwidth product 1.2 MHz SR Slew rate G=+1 0.5 V/s m Phase margin G = + 1, RL = 10k, CL = 20 pF 56 tOR Overload recovery time VIN x gain > VS 10 s ts Settling time To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF 4 s THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT 50A, BW = 80 kHz 0.001 % OUTPUT Positive Rail (V+) VO Voltage output swing from rail Negative Rail (V-) VS = 5 V, RL 10 k connected to (V-) IO Output current VS = 15 V; VO = V-; VID = 1V Source (1) VS = 15 V; VO = V+; VID = -1 V Sink (1) IOUT = 50 A 1.35 1.42 V IOUT = 1 mA 1.4 1.48 V IOUT = 5 mA (1) 1.5 1.61 V IOUT = 50 A 100 150 mV IOUT = 1 mA 0.75 1 V 5 20 mV TA = -40C to +125C -20 TA = -40C to +125C ISC Short-circuit current CLOAD Capacitive load drive RO Open-loop output resistance mA 10 TA = -40C to +125C VID = -1 V; VO = (V-) + 200 mV 20 5 60 VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V -30 -10 100 40 f = 1 MHz, IO = 0 A A 60 mA 100 pF 300 POWER SUPPLY IQ Quiescent current per amplifier VS = 5 V; IO = 0 A IQ Quiescent current per amplifier VS = 36 V; IO = 0 A (1) 300 TA = -40C to +125C 460 A 800 A Specified by characterization only Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 9 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 7.7 Electrical Characteristics: LM358, LM358A For VS = (V+) - (V-) = 5 V, TA = 25 C, (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP (2) MAX 3 7 UNIT OFFSET VOLTAGE LM358 VOS Input offset voltage VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V TA = 0C to 70C 9 mV LM358A 2 TA = 0C to 70C dVOS/dT Input offset voltage drift PSRR Input offset voltage vs power supply (VIO/VS) VS = 5 V to 30 V VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 3 5 LM358 TA = 0C to 70C 7 LM358A TA = 0C to 70C 7 V/C 65 20 100 dB 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range CMRR Common-mode rejection ratio VS = 5 V to 30 V LM358 VS = 30 V LM358A VS = 5 V to 30 V LM358 VS = 30 V LM358A (V-) (V+) - 1.5 (V-) (V+) - 2 V TA = 0C to 70C VS = 5 V to 30 V; VCM = 0 V 65 80 dB INPUT BIAS CURRENT -20 -250 LM358 IB Input bias current TA = 0C to 70C VO = 1.4 V -500 nA -15 -100 LM358A TA = 0C to 70C -200 2 50 LM358 IOS Input offset current TA = 0C to 70C VO = 1.4 V 150 nA 2 30 LM358A TA = 0C to 70C 75 10 dIOS/dT Input offset current drift pA/C LM358A TA = 0C to 70C 300 NOISE en Input voltage noise density f = 1 kHz 40 nV/Hz OPEN-LOOP GAIN AOL Open-loop voltage gain 25 VS = 15 V; VO = 1 V to 11 V; RL 2 k 100 V/mV TA = 0C to 70C 15 FREQUENCY RESPONSE GBW Gain bandwidth product SR Slew rate G = +1 0.7 MHz 0.3 V/s OUTPUT VS = 30 V; RL = 2 k Positive rail VO Voltage output swing from rail TA = 0C to 70C 4 VS = 30 V; RL 10 k 2 VS = 5 V; RL 2 k Negative rail VS = 5 V; RL 10 k TA = 0C to 70C 5 -20 VS = 15 V; VO = 0 V; VID =1V IO Source VS = 15 V; VO = 15 V; VID = -1 V Short-circuit current 20 mV -60 -10 10 mA 20 Sink TA = 0C to 70C VID = -1 V; VO = 200 mV ISC V -30 LM358A TA = 0C to 70C Output current 3 1.5 5 12 VS = 10 V; VO = VS / 2 30 40 A 60 mA POWER SUPPLY IQ (1) (2) 10 Quiescent current per amplifier VO = 2.5 V; IO = 0 A VS = 30 V; VO = 15 V; IO = 0 A TA = 0C to 70C 350 600 500 1000 A All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM358 and LM358A. All typical values are TA = 25C. Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 7.8 Electrical Characteristics: LM2904, LM2904V For VS = (V+) - (V-) = 5 V, TA = 25 C, (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP MAX (2) UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 5 V to maximum; VCM = 0 V; VO = 1.4 V dVOS/dT Input offset voltage drift PSRR Input offset voltage vs power supply (VIO/VS) VS = 5 V to 30 V VO1/ VO2 Channel separation f = 1 kHz to 20 kHz Non-A suffix devices A-suffix devices 3 7 TA = -40C to 125C 10 mV 1 2 TA = -40C to 125C 4 TA = -40C to 125C 7 65 V/C 100 dB 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range CMRR Common-mode rejection ratio VS = 5 V to maximum (V-) (V+) - 1.5 (V-) (V+) - 2 V TA = -40C to 125C VS = 5 V to maximum; VCM = 0 V 65 80 dB INPUT BIAS CURRENT -20 IB Input bias current VO = 1.4 V Non-V suffix device IOS Input offset current VO = 1.4 V V-suffix device dIOS/dT -250 nA TA = -40C to 125C Input offset current drift -500 2 TA = -40C to 125C 50 300 nA 2 TA = -40C to 125C 50 150 TA = -40C to 125C 10 pA/C 40 nV/Hz NOISE en Input voltage noise density f = 1 kHz OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL 2 k 25 100 V/mV TA = -40C to 125C 15 FREQUENCY RESPONSE GBW Gain bandwidth product SR Slew rate G = +1 0.7 MHz 0.3 V/s OUTPUT RL 10 k Non-V suffix device Positive rail VO VS - 1.5 VS = maximum; RL = 2 k Voltage output swing from rail VS = maximum; RL = 2 k V-suffix device Negative rail 4 VS = maximum; RL 10 k 2 TA = -40C to 125C -20 VS = 15 V; VO = 0 V; VID = 1 V Source VS = 15 V; VO = 15 V; VID = -1 V Sink TA = -40C to 125C Output current TA = -40C to 125C ISC Short-circuit current 5 5 20 mV -30 mA 20 5 Non-V suffix device VID = -1 V; VO = 200 mV 4 -10 10 IO V 6 VS = maximum; RL 10 k VS = 5 V; RL 10 k 3 TA = -40C to 125C 30 A V-suffix device 12 VS = 10 V; VO = VS / 2 40 40 60 mA POWER SUPPLY IQ (1) (2) Quiescent current per amplifier VO = 2.5 V; IO = 0 A VS = maximum; VO = maximum / 2; IO = 0 A TA = -40C to 125C 350 600 500 1000 A All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 26 V for LM2904 and 32 V for LM2904V. All typical values are TA = 25C. Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 11 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 7.9 Electrical Characteristics: LM158, LM158A For VS = (V+) - (V-) = 5 V, TA = 25 C, (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP (2) MAX 3 5 UNIT OFFSET VOLTAGE LM158 VOS Input offset voltage TA = -55C to 125C VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V 7 mV 2 LM158A TA = -55C to 125C dVOS/dT Input offset voltage drift PSRR Input offset voltage vs power supply (VIO/VS) VS = 5 V to 30 V VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 4 LM158 TA = -55C to 125C 7 LM158A TA = -55C to 125C 7 65 15 (3) V/C 100 dB 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range CMRR Common-mode rejection ratio VS = 5 V to 30 V LM158 VS = 30 V LM158A VS = 5 V to 30 V LM158 VS = 30 V LM158A (V-) (V+) - 1.5 (V-) (V+) - 2 V TA = -55C to 125C VS = 5 V to 30 V; VCM = 0 V 70 80 dB INPUT BIAS CURRENT -20 -150 LM158 IB Input bias current TA = -55C to 125C VO = 1.4 V -300 nA -15 -50 LM158A TA = -55C to 125C -100 2 30 LM158 IOS Input offset current TA = -55C to 125C VO = 1.4 V 100 nA 2 10 LM158A TA = -55C to 125C 30 10 dIOS/dT Input offset current drift pA/C LM158A TA = -55C to 125C 200 NOISE en Input voltage noise density f = 1 kHz 40 nV/Hz OPEN-LOOP GAIN AOL Open-loop voltage gain 50 VS = 15 V; VO = 1 V to 11 V; RL 2 k 100 V/mV TA = -55C to 125C 25 FREQUENCY RESPONSE GBW Gain bandwidth product SR Slew rate G = +1 0.7 MHz 0.3 V/s OUTPUT VS = 30 V; RL = 2 k Positive rail VO Voltage output swing from rail TA = -55C to 125C 4 VS = 30 V; RL 10 k 2 Negative rail VS = 5 V; RL 10 k VS = 15 V; VO = 0 V; VID = 1 V Source TA = -55C to 125C 5 VS = 15 V; VO = 15 V; VID = -1 V Short-circuit current mV -60 -10 10 mA 20 Sink TA = -55C to 125C VID = -1 V; VO = 200 mV ISC 20 -30 LM158A TA = -55C to 125C Output current V 1.5 -20 IO 3 VS = 5 V; RL 2 k 5 12 VS = 10 V; VO = VS / 2 30 40 A 60 mA POWER SUPPLY IQ (1) (2) (3) 12 Quiescent current per amplifier VO = 2.5 V; IO = 0 A VS = 30 V; VO = 15 V; IO = 0 A TA = -55C to 125C 350 600 500 1000 A All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM158 and LM158A. All typical values are TA = 25C. On products compliant to MIL-PRF-38535, this parameter is not production tested. Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 7.10 Electrical Characteristics: LM258, LM258A For VS = (V+) - (V-) = 5 V, TA = 25 C, (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP (2) MAX 3 5 UNIT OFFSET VOLTAGE LM258 VOS Input offset voltage TA = -25C to 85C VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V 7 mV 2 3 LM258A TA = -25C to 85C 4 LM258 dVOS/dT Input offset voltage drift PSRR Input offset voltage vs power supply (VIO/VS) VS = 5 V to 30 V VO1/ VO2 Channel separation f = 1 kHz to 20 kHz LM258A 7 TA = -25C to 85C V/C 7 65 15 100 dB 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range CMRR Common-mode rejection ratio VS = 5 V to 30 V LM258 VS = 30 V LM258A VS = 5 V to 30 V LM258 VS = 30 V LM258A (V-) (V+) - 1.5 (V-) (V+) - 2 V TA = -25C to 85C VS = 5 V to 30 V; VCM = 0 V 70 80 dB INPUT BIAS CURRENT -20 -150 LM258 IB Input bias current TA = -25C to 85C VO = 1.4 V -300 nA -15 -80 LM258A TA = -25C to 85C -100 2 30 LM258 IOS Input offset current TA = -25C to 85C VO = 1.4 V 100 nA 2 15 LM258A TA = -25C to 85C 30 10 dIOS/dT Input offset current drift pA/C LM258A TA = -25C to 85C 200 NOISE en Input voltage noise density f = 1 kHz 40 nV/Hz OPEN-LOOP GAIN AOL Open-loop voltage gain 50 VS = 15 V; VO = 1 V to 11 V; RL 2 k 100 V/mV TA = -25C to 85C 25 FREQUENCY RESPONSE GBW Gain bandwidth product SR Slew rate G = +1 0.7 MHz 0.3 V/s OUTPUT VS = 30 V; RL = 2 k Positive rail VO Voltage output swing from rail TA = -25C to 85C 4 VS = 30 V; RL 10 k 2 Negative rail VS = 5 V; RL 10 k VS = 15 V; VO = 0 V; VID = 1 V Source TA = -25C to 85C 5 VS = 15 V; VO = 15 V; VID = -1 V Short-circuit current mV -60 -10 10 mA 20 Sink TA = -25C to 85C VID = -1 V; VO = 200 mV ISC 20 -30 LM258A TA = -25C to 85C Output current V 1.5 -20 IO 3 VS = 5 V; RL 2 k 5 12 VS = 10 V; VO = VS / 2 30 40 A 60 mA POWER SUPPLY IQ (1) (2) Quiescent current per amplifier VO = 2.5 V; IO = 0 A VS = 30 V; VO = 15 V; IO = 0 A TA = -25C to 85C 350 600 500 1000 A All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM258 and LM258A. All typical values are TA = 25C. Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 13 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 7.11 Typical Characteristics 20 30 18 27 16 24 14 21 Amplifiers (%) Amplifiers (%) Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25C, VS = 36 V (18 V), VCM = VS / 2, RLOAD = 10 k connected to VS / 2 (unless otherwise noted). 12 10 8 18 15 12 6 9 4 6 2 3 0 -1800 0 -1200 -600 0 600 Offset Voltage (V) 1200 1800 0 DC11 0.25 0.5 0.75 1 1.25 1.5 1.75 2 Offset Voltage Drift (V/C) 750 500 450 300 150 -150 -450 100 -100 -300 -750 -40 -20 0 20 40 60 Temperature (C) 80 100 -500 -18 120 80 90 60 70 80 60 70 50 60 40 50 30 40 20 30 10 20 10 Gain (dB) Phase () -20 10k 100k Frequency (Hz) Submit Documentation Feedback 12 17 DC10 40 30 20 10 0 -10 -20 -10 -30 1M G=1 G = 10 G = 100 G = 1000 G = -1 50 0 1k D012 Figure 5. Open-Loop Gain and Phase vs Frequency 14 Closed Lopp Voltage Gain (dB) 70 0 -6 0 6 Common-Mode Voltage (V) Figure 4. Offset Voltage vs Common-Mode Voltage 100 Phase ( ) Open Loop Voltage Gain (dB) Figure 3. Offset Voltage vs Temperature 1k -12 DC10 90 -10 DC12 Figure 2. Offset Voltage Drift Distribution Offset Voltage (V) Offset Voltage (V) Figure 1. Offset Voltage Production Distribution 2.25 2.5 2.75 10k 100k Frequency (Hz) 1M D017 Figure 6. Closed-Loop Gain vs Frequency Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 Typical Characteristics (continued) Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25C, VS = 36 V (18 V), VCM = VS / 2, RLOAD = 10 k connected to VS / 2 (unless otherwise noted). -5 120 IB+ IB- Input Offset Current (pA) 100 Input Bias Current (nA) -7.5 -10 -12.5 80 60 40 20 0 -20 -15 -20 -15 -10 -5 0 5 10 Common-Mode Voltage (V) 15 -40 -20 20 -10 -5 0 5 10 Common-Mode Voltage (V) -7 0.045 -8 -9 IB+ IB- 15 20 DC3I Figure 8. Input Offset Current vs Common-Mode Voltage 0.06 Input Offset Current (nA) Input Bias Current (nA) Figure 7. Input Bias Current vs Common-Mode Voltage -6 -10 -15 DC3I 0.03 0.015 0 -0.015 -11 -12 -40 -10 20 50 Temperature (C) 80 110 -0.03 -40 130 -10 20 50 Temperature (C) DCIB Figure 9. Input Bias Current vs Temperature 80 110 130 DCIO Figure 10. Input Offset Current vs Temperature V+ (V-) + 18 V -40 C 25 C 125 C (V-) + 15 V Output Voltage (V) Output Voltage (V) (V+) - 3 V (V+) - 6 V (V-) + 12 V (V-) + 9 V (V-) + 6 V (V+) - 9 V -40 C 25 C 125 C (V-) + 3 V V- (V+) - 12 V 0 10 20 30 Output Current (mA) 40 Figure 11. Output Voltage Swing vs Output Current (Sourcing) Copyright (c) 1976-2020, Texas Instruments Incorporated 50 DC13 0 5 10 15 20 25 Output Current (mA) 30 35 40 DC1- Figure 12. Output Voltage Swing vs Output Current (Sinking) Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 15 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com Typical Characteristics (continued) Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25C, VS = 36 V (18 V), VCM = VS / 2, RLOAD = 10 k connected to VS / 2 (unless otherwise noted). 120 100 90 PSRR and CMRR (dB) 80 Common-Mode Rejection Ratio (dB) PSRR+ PSRRCMRR 70 60 50 40 30 20 10 10k 100k Frequency (Hz) 110 105 100 95 90 VS = 36V VS = 5V 85 -40 0 1k 115 1M 20 50 Temperature (C) D001 Figure 13. CMRR and PSRR vs Frequency 80 110 130 DC2_ Figure 14. Common-Mode Rejection Ratio vs Temperature (dB) -118 1.6 1.2 -119 0.8 Voltage (V) Power Supply Rejection Ratio (dB) -10 -120 -121 0.4 0 -0.4 -0.8 -1.2 -122 -1.6 -123 -40 -2 -20 0 20 40 60 80 Temperature (C) 100 120 0 140 1 2 DC8_ 3 4 5 6 Time (s) 7 8 9 10 D011 VS = 5 V to 36 V Figure 16. 0.1-Hz to 10-Hz Noise 100 -32 90 -40 80 -48 70 -56 THD+N (dB) Voltage Noise Spectral Density (nV/--Hz) Figure 15. Power Supply Rejection Ratio vs Temperature (dB) 60 50 40 10 k 2k -64 -72 -80 -88 30 20 -96 10 -104 0 10 -112 100 1k Frequency (Hz) 10k 100k D010 100 1k Frequency (Hz) 10k D013 G = 1, f = 1 kHz, BW = 80 kHz, VOUT = 10 VPP, RL connected to V- Figure 17. Input Voltage Noise Spectral Density vs Frequency 16 Submit Documentation Feedback Figure 18. THD+N Ratio vs Frequency, G = 1 Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 Typical Characteristics (continued) Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25C, VS = 36 V (18 V), VCM = VS / 2, RLOAD = 10 k connected to VS / 2 (unless otherwise noted). -32 -30 10 k 2k -40 -48 -50 -56 -60 THD+N (dB) THD+N (dB) -40 -64 -72 -70 -80 -80 -90 -88 -100 -96 -110 -104 100 1k Frequency (Hz) 10k 0.01 D014 G = -1, f = 1 kHz, BW = 80 kHz, VOUT = 10 VPP, RL connected to V- 0.1 Amplitude (VPP) 1 10 20 D015 G = 1, f = 1 kHz, BW = 80 kHz, RL connected to V- Figure 19. THD+N Ratio vs Frequency, G = -1 Figure 20. THD+N vs Output Amplitude, G = 1 -20 460 -35 430 Quiescent Current (A) THD+N (dB) 10 k 2k -120 0.001 -50 -65 -80 400 370 340 310 -95 10 k 2k 280 -110 0.001 0.01 0.1 Amplitude (VPP) 1 3 10 20 9 15 21 Supply Voltage (V) D016 27 33 36 DC_S G = -1, f = 1 kHz, BW = 80 kHz, RL connected to V- Figure 21. THD+N vs Output Amplitude, G = -1 Figure 22. Quiescent Current vs Supply Voltage 540 500 VS = 36V VS = 5V Open Loop Output Impedance ( ) Quiescent Current per Amplifier (A) 600 480 420 360 300 240 -40 -20 0 20 40 60 Temperature (C) 80 100 120 Figure 23. Quiescent Current vs Temperature Copyright (c) 1976-2020, Texas Instruments Incorporated DC4_ 400 300 200 100 1k 10k 100k Frequency (Hz) 1M D006 Figure 24. Open-Loop Output Impedance vs Frequency Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 17 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com Typical Characteristics (continued) Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25C, VS = 36 V (18 V), VCM = VS / 2, RLOAD = 10 k connected to VS / 2 (unless otherwise noted). 44 18 Overshoot (+) Overshoot (-) 36 14 32 12 28 24 20 10 8 6 16 4 12 2 8 0 40 80 Overshoot (+) Overshoot (-) 16 Overshoot (%) Overshoot (%) 40 120 160 200 240 Capacitance load (pF) 280 320 0 40 360 G = 1, 100-mV output step, RL = open 120 160 200 240 Capacitance load (pF) 280 320 360 D020 G = -1, 100-mV output step, RL = open Figure 25. Small-Signal Overshoot vs Capacitive Load Figure 26. Small-Signal Overshoot vs Capacitive Load 20 60 Input Output 57 54 10 51 Voltage (V) Phase Margin () 80 D019 48 45 42 39 0 -10 36 33 -20 30 0 40 80 120 160 200 240 Capacitance Load (pF) 280 320 0 360 200 D018 400 600 Time ( s) 800 1000 D021 G = -10 Figure 28. Overload Recovery 10 7.5 7.5 5 5 Voltage (mV) Voltage (mV) Figure 27. Phase Margin vs Capacitive Load 10 2.5 0 -2.5 -5 0 -2.5 -5 -7.5 -7.5 Input Output -10 Input Output -10 0 20 40 60 80 Time ( s) G = 1, RL = open Figure 29. Small-Signal Step Response, G = 1 18 2.5 Submit Documentation Feedback 100 D022 0 20 40 60 80 100 Time ( s) D023 G = -1, RL = open, RFB = 10K Figure 30. Small-Signal Step Response, G = -1 Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 Typical Characteristics (continued) 20 40 16 32 Output Delta from Final Value (mV) Output Delta from Final Value (mV) Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25C, VS = 36 V (18 V), VCM = VS / 2, RLOAD = 10 k connected to VS / 2 (unless otherwise noted). 12 8 4 0 -4 -8 -12 -16 24 16 8 0 -8 -16 -24 -32 -20 -40 0 0.5 1 1.5 2 2.5 3 Time ( s) 3.5 4 4.5 5 0 0.5 1 1.5 G = 1, RL = open 2.5 3 Time ( s) 3.5 4 4.5 5 D004 G = 1, RL = open Figure 31. Large-Signal Step Response (Rising) Figure 32. Large-Signal Step Response (Falling) 2.5 0.675 Output Input 2 Positive Negative 1.5 0.625 Slew Rate(V/ s) 1 Votlage (V) 2 D003 0.5 0 -0.5 -1 -1.5 0.575 0.525 0.475 -2 -2.5 0 20 40 60 80 100 Time (s) 0.425 -40 -25 -10 5 20 AC_S 35 50 65 Temp( C) 80 95 110 125 D009 G = 1, RL = open Figure 34. Slew Rate vs Temperature Figure 33. Large-Signal Step Response Short-Circuit Current (mA) 40 20 Sinking Sourcing 0 -20 -40 -60 -40 -25 -10 5 20 35 50 65 Temperature (C) 80 95 110 125 DC7_ Maximum Output Voltage (V PP) 60 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1k 10k 100k Frequency (Hz) 1M D005 VS = 15 V Figure 35. Short-Circuit Current vs Temperature Copyright (c) 1976-2020, Texas Instruments Incorporated Figure 36. Maximum Output Voltage vs Frequency Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 19 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com Typical Characteristics (continued) Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25C, VS = 36 V (18 V), VCM = VS / 2, RLOAD = 10 k connected to VS / 2 (unless otherwise noted). -75 90 84 78 72 -95 EMIRR (dB) Channel Separation (dB) -85 -105 -115 66 60 54 48 42 36 -125 30 -135 1k 10k 100k Frequency (Hz) Figure 37. Channel Separation vs Frequency 20 Submit Documentation Feedback 24 1M 1M D008 10M 100M Frequency (Hz) 1G D007 Figure 38. EMIRR (Electromagnetic Interference Rejection Ratio) vs Frequency Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 7.12 Typical Characteristics Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V. 20 0.36 18 0.34 -55C 0C 125C Supply Current (mA) Input Current (nAdc) 16 14 12 10 8 5Vdc 15Vdc 30Vdc 6 4 0.32 0.3 0.28 0.26 0.24 0.22 2 0 -55 -35 -15 5 45 25 65 Temperature (C) 85 105 0.2 125 0 5 Figure 39. Input Current vs Temperature 25 30 Figure 40. Supply Current vs Supply Voltage 160 100 CMRR 90 RL=20K RL=2K 140 80 120 70 100 CMRR (dB) Avol Voltage Gain (dB) 10 15 20 Supply Voltage (Vdc) 80 60 50 40 30 40 20 20 10 0 0 0 5 10 15 20 25 30 V+ Supply Voltage (Vdc) 35 0.1 40 1 10 100 1000 Frequency (kHz) Figure 41. Voltage Gain vs Supply Voltage C001 Figure 42. Common-Mode Rejection Ratio vs Frequency 0.50 3.5 VOUT 3.0 0.45 Voltage (V) 2.5 Voltage (V) 60 2.0 1.5 0.40 0.35 0.30 1.0 0.25 0.5 VOUT 0.20 0.0 0 4 8 12 16 20 24 Time ( s) 28 32 36 40 C001 Figure 43. Voltage Follower Large Signal Response (50 pF) Copyright (c) 1976-2020, Texas Instruments Incorporated 0 2 4 6 8 Time ( s) 10 C001 Figure 44. Voltage Follower Small Signal Response (50 pF) Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 21 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com Typical Characteristics (continued) Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V. 8 Output Voltage (Vdc) relative to Vcc 20 17.5 Output Swing (Vp-p) 15 12.5 10 7.5 5 2.5 0 1 10 100 Frequency (kHz) 7 6 5 4 3 2 1 0.001 1k Figure 45. Maximum Output Swing vs Frequency (VCC = 15 V) 0.1 1 Output Sink Current (mAdc) 10 100 Figure 46. Output Sourcing Characteristics 90 10 5Vdc 15Vdc 30Vdc 80 Output Current (mAdc) Output Voltage (Vdc) 0.01 1 0.1 70 60 50 40 30 20 10 0.01 0.001 0 0.01 0.1 1 10 Output Sink Current (mAdc) Figure 47. Output Sinking Characteristics 22 Submit Documentation Feedback 100 -55 -35 -15 5 45 25 65 Temperature (C) 85 105 125 Figure 48. Source Current Limiting Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 8 Parameter Measurement Information 900 VCC+ VCC+ - VI VO + 100 - VI = 0 V RS VCC- CL RL VO + VCC- Figure 49. Unity-Gain Amplifier 10 k - Figure 50. Noise-Test Circuit +18V VIN + RL -18V GND GND Figure 51. Test Circuit, G = -1, for THD+N and Small-Signal Step Response Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 23 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 9 Detailed Description 9.1 Overview These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is within the supply voltage range specified in the Recommended Operating Conditions section, and VS is at least 1.5 V more positive than the input common-mode voltage. The low supplycurrent drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required interface electronics without additional 5-V supplies. 9.2 Functional Block Diagram - LM358B, LM358BA, LM2904B, LM2904BA VCC+ ~6 A Curren t Regula tor ~6 A Curren t Regula tor ~100 A Curren t Regula tor IN- OUT IN+ 24 ~120 A Curren t Regula tor Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 9.3 Feature Description 9.3.1 Unity-Gain Bandwidth The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without greatly distorting the signal. These devices have a 1.2-MHz unity-gain bandwidth (B Version). 9.3.2 Slew Rate The slew rate is the rate at which an operational amplifier can change its output when there is a change on the input. These devices have a 0.5-V/s slew rate (B Version). 9.3.3 Input Common Mode Range The valid common mode range is from device ground to VS - 1.5 V (VS - 2 V across temperature). Inputs may exceed VS up to the maximum VS without device damage. At least one input must be in the valid input commonmode range for the output to be the correct phase. If both inputs exceed the valid range, then the output phase is undefined. If either input more than 0.3 V below V- then input current should be limited to 1 mA and the output phase is undefined. 9.4 Device Functional Modes These devices are powered on when the supply is connected. This device can be operated as a single-supply operational amplifier or dual-supply amplifier, depending on the application. Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 25 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information The LMx58 and LM2904 operational amplifiers are useful in a wide range of signal conditioning applications. Inputs can be powered before VS for flexibility in multiple supply circuits. 10.2 Typical Application A typical application for an operational amplifier is an inverting amplifier. This amplifier takes a positive voltage on the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes negative voltages positive. RF RI Vsup+ VOUT VIN + Vsup- Figure 52. Application Schematic 10.2.1 Design Requirements The supply voltage must be chosen such that it is larger than the input voltage range and output range. For instance, this application scales a signal of 0.5 V to 1.8 V. Setting the supply at 12 V is sufficient to accommodate this application. 10.2.2 Detailed Design Procedure Determine the gain required by the inverting amplifier using Equation 1 and Equation 2: VOUT AV VIN 1.8 AV 3.6 0.5 (1) (2) Once the desired gain is determined, choose a value for RI or RF. [Subscripts should be fixed in the accompanying figures and equations also.] Choosing a value in the kilohm range is desirable because the amplifier circuit uses currents in the milliampere range. This ensures the part does not draw too much current. This example uses 10 k for RI which means 36 k is used for RF. This was determined by Equation 3. RF AV (3) RI 26 Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 Typical Application (continued) 10.2.3 Application Curve 2 VIN 1.5 VOUT 1 Volts 0.5 0 -0.5 -1 -1.5 -2 0 0.5 1 Time (ms) 1.5 2 Figure 53. Input and Output Voltages of the Inverting Amplifier 11 Power Supply Recommendations CAUTION Supply voltages larger than specified in the recommended operating region can permanently damage the device (see the Absolute Maximum Ratings). Place 0.1-F bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or highimpedance power supplies. For more detailed information on bypass capacitor placement, see the Layout section. 12 Layout 12.1 Layout Guidelines For best operational performance of the device, use good PCB layout practices, including: * Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. - Connect low-ESR, 0.1-F ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for singlesupply applications. * Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current. * To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace. [Things in parallel never cross, by definition] * Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance, as shown in Layout Examples. * Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit. * Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 27 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 12.2 Layout Examples Place components close to device and to each other to reduce parasitic errors Run the input traces as far away from the supply lines as possible VS+ RF OUT1 V+ GND IN1i OUT2 VIN IN1+ IN2i Vi IN2+ RG GND R IN Only needed for dual-supply operation GND Use low-ESR, ceramic bypass capacitor VSi (or GND for single supply) Ground (GND) plane on another layer Figure 54. Operational Amplifier Board Layout for Noninverting Configuration RIN VIN + VOUT RG RF Figure 55. Operational Amplifier Schematic for Noninverting Configuration 28 Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X - JUNE 1976 - REVISED JUNE 2020 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation * Texas Instruments, Circuit Board Layout Techniques. 13.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now. Table 1. Related Links PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM158 Click here Click here Click here Click here Click here LM158A Click here Click here Click here Click here Click here LM258 Click here Click here Click here Click here Click here LM258A Click here Click here Click here Click here Click here LM358 Click here Click here Click here Click here Click here LM358A Click here Click here Click here Click here Click here LM358B Click here Click here Click here Click here Click here LM2904 Click here Click here Click here Click here Click here LM2904B Click here Click here Click here Click here Click here LM2904V Click here Click here Click here Click here Click here 13.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 13.4 Support Resources TI E2ETM support forums are an engineer's go-to source for fast, verified answers and design help -- straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 13.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 13.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 13.7 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms and definitions. Copyright (c) 1976-2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V 29 LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X - JUNE 1976 - REVISED JUNE 2020 www.ti.com 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and without revision of this document. For browser based versions of this data sheet, see the left-hand navigation pane. 30 Submit Documentation Feedback Copyright (c) 1976-2020, Texas Instruments Incorporated Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) 5962-87710012A ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 596287710012A LM158FKB 5962-8771001PA ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8771001PA LM158 5962-87710022A ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 596287710022A LM158AFKB 5962-8771002PA ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8771002PA LM158A LM158 MW8 ACTIVE WAFERSALE YS 0 1 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 LM158AFKB ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 596287710022A LM158AFKB LM158AJG ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 LM158AJG LM158AJGB ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8771002PA LM158A LM158FKB ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 596287710012A LM158FKB LM158JG ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 LM158JG LM158JGB ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8771001PA LM158 LM258AD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3 U) LM258ADR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258A LM258ADRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM258AP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -25 to 85 LM258AP LM258APE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM258AP LM258D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2 U) LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2 U) LM258DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258 LM258DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -25 to 85 LM258 LM258DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -25 to 85 LM258P LM258PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM258P LM2904AVQDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904BAIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA LM2904BIDGKR PREVIEW VSSOP DGK 8 2500 RoHS (In work) & Green (In work) Call TI Call TI -40 to 125 LM2904BIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904BIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM2904DE4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB U) LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB U) LM2904DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -40 to 125 LM2904P LM2904PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 LM2904P LM2904PSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWRG3 ACTIVE TSSOP PW 8 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWRG4-JF ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1 LM2904QDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1 LM2904VQDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM358AD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADE4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6 U) LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6 U) LM358ADR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358A LM358ADRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358AP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM358AP LM358APE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM358AP LM358APW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358APWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358A LM358APWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358BAIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM358BIDGKR PREVIEW VSSOP DGK 8 2500 RoHS (In work) & Green (In work) Call TI Call TI -40 to 85 LM358BIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 Addendum-Page 4 L358BA Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM358DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5 U) LM358DGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5 U) LM358DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358 LM358DRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM358 LM358DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM358P LM358PE3 ACTIVE PDIP P 8 50 RoHS & Non-Green SN N / A for Pkg Type 0 to 70 LM358P LM358PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM358P LM358PSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358 LM358PWRG3 ACTIVE TSSOP PW 8 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 L358 LM358PWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PWRG4-JF ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358 PLM2904BIDGKR ACTIVE VSSOP DGK 8 2500 RoHS (In work) & Green (In work) Call TI Call TI -40 to 125 PLM358BIDGKR ACTIVE VSSOP DGK 8 2500 RoHS (In work) & Green (In work) Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 5 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM258A, LM2904, LM2904B : * Automotive: LM2904-Q1, LM2904B-Q1 * Enhanced Product: LM258A-EP, LM2904-EP NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 6 PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 7 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2020 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258ADR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM258DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904AVQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1 LM2904AVQDRG4 SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2020 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2904AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904AVQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904PWRG4-JF TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904VQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1 LM2904VQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM358ADR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358APWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2020 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM358DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM358DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358PWRG4-JF TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM258ADR SOIC D 8 2500 853.0 449.0 35.0 LM258ADR SOIC D 8 2500 333.2 345.9 28.6 LM258ADR SOIC D 8 2500 364.0 364.0 27.0 LM258ADR SOIC D 8 2500 340.5 338.1 20.6 LM258ADRG4 SOIC D 8 2500 853.0 449.0 35.0 LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 Pack Materials-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2020 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM258DR SOIC D 8 2500 340.5 338.1 20.6 LM258DR SOIC D 8 2500 364.0 364.0 27.0 LM258DR SOIC D 8 2500 853.0 449.0 35.0 LM258DR SOIC D 8 2500 333.2 345.9 28.6 LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM258DRG3 SOIC D 8 2500 333.2 345.9 28.6 LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM258DRG4 SOIC D 8 2500 853.0 449.0 35.0 LM2904AVQDR SOIC D 8 2500 340.5 338.1 20.6 LM2904AVQDRG4 SOIC D 8 2500 340.5 338.1 20.6 LM2904AVQPWR TSSOP PW 8 2000 853.0 449.0 35.0 LM2904AVQPWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 LM2904BAIDR SOIC D 8 2500 340.5 338.1 20.6 LM2904BIDR SOIC D 8 2500 340.5 338.1 20.6 LM2904BIPWR TSSOP PW 8 2000 853.0 449.0 35.0 LM2904DGKR VSSOP DGK 8 2500 358.0 335.0 35.0 LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM2904DR SOIC D 8 2500 853.0 449.0 35.0 LM2904DR SOIC D 8 2500 333.2 345.9 28.6 LM2904DR SOIC D 8 2500 364.0 364.0 27.0 LM2904DR SOIC D 8 2500 340.5 338.1 20.6 LM2904DRG3 SOIC D 8 2500 333.2 345.9 28.6 LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM2904DRG4 SOIC D 8 2500 853.0 449.0 35.0 LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM2904PWR TSSOP PW 8 2000 853.0 449.0 35.0 LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM2904PWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 LM2904PWRG4-JF TSSOP PW 8 2000 853.0 449.0 35.0 LM2904QDR SOIC D 8 2500 350.0 350.0 43.0 LM2904VQDR SOIC D 8 2500 340.5 338.1 20.6 LM2904VQPWR TSSOP PW 8 2000 853.0 449.0 35.0 LM2904VQPWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM358ADR SOIC D 8 2500 340.5 338.1 20.6 LM358ADR SOIC D 8 2500 853.0 449.0 35.0 LM358ADR SOIC D 8 2500 364.0 364.0 27.0 LM358ADR SOIC D 8 2500 333.2 345.9 28.6 LM358ADRG4 SOIC D 8 2500 853.0 449.0 35.0 LM358ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0 LM358APWR TSSOP PW 8 2000 853.0 449.0 35.0 LM358APWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 Pack Materials-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2020 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM358BAIDR SOIC D 8 2500 340.5 338.1 20.6 LM358BIDR SOIC D 8 2500 340.5 338.1 20.6 LM358BIPWR TSSOP PW 8 2000 853.0 449.0 35.0 LM358DGKR VSSOP DGK 8 2500 358.0 335.0 35.0 LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM358DR SOIC D 8 2500 333.2 345.9 28.6 LM358DR SOIC D 8 2500 853.0 449.0 35.0 LM358DR SOIC D 8 2500 340.5 338.1 20.6 LM358DR SOIC D 8 2500 364.0 364.0 27.0 LM358DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM358DRG3 SOIC D 8 2500 333.2 345.9 28.6 LM358DRG4 SOIC D 8 2500 853.0 449.0 35.0 LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM358PWR TSSOP PW 8 2000 853.0 449.0 35.0 LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM358PWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 LM358PWRG4-JF TSSOP PW 8 2000 853.0 449.0 35.0 Pack Materials-Page 5 PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP 6.2 SEATING PLANE PIN 1 ID AREA A 0.1 C 6X 0.65 8 1 3.1 2.9 NOTE 3 2X 1.95 4 5 B 4.5 4.3 NOTE 4 SEE DETAIL A 8X 0.30 0.19 0.1 C A 1.2 MAX B (0.15) TYP 0.25 GAGE PLANE 0 -8 0.15 0.05 0.75 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM 1 8 (R0.05) TYP SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) TYP 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. 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