SCDS028M − JULY 1995 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DMember of the Texas Instruments
Widebus Family
D5-Ω Switch Connection Between Two Ports
DTTL-Compatible Input Levels
description/ordering information
The SN74CBT16211A provides 24 bits of
high-speed TTL-compatible bus switching. The
low on-state resistance of the switch allows
connections t o be made with minimal propagation
delay.
The device operates as a dual 12-bit bus switch or
single 24-bit bus switch. When 1OE is low, 1A is
connected to 1B. When 2OE is low, 2A is
connected to 2B.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SSOP − DL
Tube SN74CBT16211ADL
CBT16211A
SSOP − DL Tape and reel SN74CBT16211ADLR CBT16211A
−40°C to 85°C
TSSOP − DGG Tape and reel SN74CBT16211ADGGR CBT16211A
−40°C to 85°CTVSOP − DGV Tape and reel SN74CBT16211ADGVR CY211A
VFBGA − GQL
Tape and reel
SN74CBT16211AGQLR
CY211A
VFBGA − ZQL (Pb-free)
Tape and reel
SN74CBT16211AZQLR
CY211A
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright 2003, Texas Instruments Incorporated
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
NC
1A1
1A2
1A3
1A4
1A5
1A6
GND
1A7
1A8
1A9
1A10
1A11
1A12
2A1
2A2
VCC
2A3
GND
2A4
2A5
2A6
2A7
2A8
2A9
2A10
2A11
2A12
1OE
2OE
1B1
1B2
1B3
1B4
1B5
GND
1B6
1B7
1B8
1B9
1B10
1B11
1B12
2B1
2B2
2B3
GND
2B4
2B5
2B6
2B7
2B8
2B9
2B10
2B11
2B12
NC − No internal connection
Widebus is a trademark of Texas Instruments.
SCDS028M − JULY 1995 − REVISED SEPTEMBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
terminal assignments
123456
A1A2 1A1 NC 1OE 2OE 1B1
B1A5 1A4 1A3 1B2 1B3 1B4
C1A7 GND 1A6 1B5 GND 1B6
D1A10 1A8 1A9 1B8 1B7 1B9
E1A12 1A11 1B10 1B11
F2A1 2A2 2B1 1B12
GVCC GND 2A3 2B3 GND 2B2
H2A4 2A5 2A6 2B6 2B5 2B4
J2A7 2A8 2A9 2B9 2B8 2B7
K2A10 2A11 2A12 2B12 2B11 2B10
NC − No internal connection
FUNCTION TABLE
(each 12-bit bus switch)
INPUTS INPUTS/OUTPUTS
1OE 2OE 1A, 1B 2A, 2B
L L 1A = 1B 2A = 2B
LH 1A = 1B Z
HLZ2A = 2B
H H Z Z
logic diagram (positive logic)
2A1
2A12
1OE
1B1
1B12
2
14
56
54
42
2B1
2B12
15
28
55
41
29
1A1
1A12
2OE
Pin numbers shown are for the DGG, DGV, and DL packages.
GQL OR ZQL PACKAGE
(TOP VIEW)
A
B
C
D
E
F
G
H
J
K
123456
SCDS028M − JULY 1995 − REVISED SEPTEMBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DGG package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 48°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package 56°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GQL/ZQL package 42°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN MAX UNIT
VCC Supply voltage 4 5.5 V
VIH High-level control input voltage 2 V
VIL Low-level control input voltage 0.8 V
TAOperating free-air temperature −40 85 °C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP‡MAX UNIT
VIK VCC = 4.5 V, II = −18 mA −1.2 V
II
VCC = 0 V, VI = 5.5 V 10
A
IIVCC = 5.5 V, VI = 5.5 V or GND ±1µA
ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 3µA
∆ICC§Control inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND 2.5 mA
CiControl inputs VI = 3 V or 0 3 pF
Cio(off) VO = 3 V or 0, OE = VCC 5.5 pF
VCC = 4 V,
TYP at VCC = 4 V VI = 2.4 V, II = 15 mA 14 20
ron
¶
VI = 0
II = 64 mA 5 7 Ω
ron¶
V
CC
= 4.5 V
V
I
= 0
II = 30 mA 5 7
Ω
VCC = 4.5 V
VI = 2.4 V, II = 15 mA 8 12
‡All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
§This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
¶Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.
SCDS028M − JULY 1995 − REVISED SEPTEMBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 4 V VCC = 5 V
± 0.5 V
UNIT
PARAMETER
(INPUT)
(OUTPUT)
MIN MAX MIN MAX
UNIT
tpd†A or B B or A 0.35 0.25 ns
ten OE A or B 9.3 3.3 8.6 ns
tdis OE A or B 7.1 2.8 7.9 ns
†The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
7 V
Open
GND
500 Ω
500 Ω
tPLH tPHL
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
3 V
0 V
VOH
VOL
0 V
VOL + 0.3 V
VOH − 0.3 V
0 V
Input
3 V
3.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤10 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤2.5 ns
.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 20-Aug-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
74CBT16211ADGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBT16211ADGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBT16211ADGVRE4 ACTIVE TVSOP DGV 56 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBT16211ADGVRG4 ACTIVE TVSOP DGV 56 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16211ADGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16211ADGVR ACTIVE TVSOP DGV 56 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16211ADL ACTIVE SSOP DL 56 20 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16211ADLG4 ACTIVE SSOP DL 56 20 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16211ADLR ACTIVE SSOP DL 56 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16211ADLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16211AZQLR ACTIVE BGA
MICROSTAR
JUNIOR
ZQL 56 1000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 20-Aug-2011
Addendum-Page 2
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74CBT16211ADGGR TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1
SN74CBT16211ADGVR TVSOP DGV 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.0 Q1
SN74CBT16211ADLR SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
SN74CBT16211AZQLR BGA MI
CROSTA
R JUNI
OR
ZQL 56 1000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74CBT16211ADGGR TSSOP DGG 56 2000 367.0 367.0 45.0
SN74CBT16211ADGVR TVSOP DGV 56 2000 367.0 367.0 45.0
SN74CBT16211ADLR SSOP DL 56 1000 367.0 367.0 55.0
SN74CBT16211AZQLR BGA MICROSTAR
JUNIOR ZQL 56 1000 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
4828
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0°–ā8°
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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