BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 18 - 2 1 of 5
www.diodes.com September 2011
© Diodes Incorporated
BZT52C2V4LP - BZT52C39LP
SURFACE MOUNT ZENER DIO DE
Features
• Ultra-Small Leadless Surface Mount Package
• Ideally Suited for Automated Assembly Processes
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: X1-DFN1006-2
• Case Material: Molded Plastic, "Green" Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Marking Information
• Terminals: Finish ⎯ NiPdAu Over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
• Weight: 0.001 grams (Approximate)
Ordering Information (Note 3)
Part Number Case Packaging
(Type Number)-7* X1-DFN1006-2 3,000/Tape & Reel
(Type Number)-7B** X1-DFN1006-2 10,000/Tape & Reel
*Add “-7” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7.
**Add “-7B” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7B.
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Bottom View
xx = Product Type Marking Code
xx xx
Top View
Dot Denotes
Cathode Side
Top View
Bar Denotes
Cathode Side
BZT52CxxLP-7BZT52CxxLP-7B
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 18 - 2 2 of 5
www.diodes.com September 2011
© Diodes Incorporated
BZT52C2V4LP - BZT52C39LP
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage (Note 4) @ IF = 10mA VF 0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5) TA = 25°C PD 250 mW
Thermal Resistance, Junction to Ambient Air (Note 5) TA = 25°C R
θ
JA 500 °C/W
Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Type
Number Marking
Code
Zener Voltage Range
(Note 4) Maximum Zener Impedance
f = 1kHz
Maximum
Reverse
Current
(Note 4)
Typical
Temperature
Coefficient
@ IZTC
mV/°C
Test
Current
IZTC
VZ @ IZT IZT Z
ZT @ IZT ZZ
K
@ IZK IZ
K
IR @ VR
Nom (V) Min (V) Max (V) mA ΩmA uA V Min Max mA
BZT52C2V4LP WX 2.4 2.20 2.60 5 100 600 1.0 50 1.0 -3.5 0 5
BZT52C2V7LP W1 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0 5
BZT52C3V0LP W2 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0 5
BZT52C3V3LP W3 3.3 3.1 3.5 5 95 600 1.0 5 1.0 -3.5 0 5
BZT52C3V6LP W4 3.6 3.4 3.8 5 90 600 1.0 5 1.0 -3.5 0 5
BZT52C3V9LP W5 3.9 3.7 4.1 5 90 600 1.0 3 1.0 -3.5 0 5
BZT52C4V3LP W6 4.3 4.0 4.6 5 90 600 1.0 3 1.0 -3.5 0 5
BZT52C4V7LP W7 4.7 4.4 5.0 5 80 500 1.0 3 2.0 -3.5 0.2 5
BZT52C5V1LP 9Y 5.1 4.8 5.4 5 60 480 1.0 2.0 2.0 -2.7 1.2 5
BZT52C5V6LP 9A 5.6 5.2 6.0 5 40 400 1.0 1.0 2.0 -2 2.5 5
BZT52C6V2LP 9B 6.2 5.8 6.6 5 10 150 1.0 3.0 4.0 0.4 3.7 5
BZT52C6V8LP 9C 6.8 6.4 7.2 5 15 80 1.0 2.0 4.0 1.2 4.5 5
BZT52C7V5LP 9D 7.5 7.0 7.9 5 15 80 1.0 1.0 5.0 2.5 5.3 5
BZT52C8V2LP 9E 8.2 7.7 8.7 5 15 80 1.0 0.7 5.0 3.2 6.2 5
BZT52C9V1LP 9F 9.1 8.5 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0 5
BZT52C10LP 9G 10 9.4 10.6 5 20 150 1.0 0.2 7.0 4.5 8.0 5
BZT52C11LP 9H 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0 5
BZT52C12LP 9J 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0 5
BZT52C13LP 9K 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 5
BZT52C15LP 9L 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0 5
BZT52C16LP 9M 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0 5
BZT52C18LP 9N 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0 5
BZT52C20LP 9P 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0 5
BZT52C22LP 9R 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 20.0 5
BZT52C24LP 9S 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 22.0 5
BZT52C36LP 9W 36 34.0 38.0 2 90 350 0.5 0.1 25.2 36.5 45.5 5
BZT52C39LP 9X 39 37.0 41.0 2 130 350 0.5 0.1 27.3 36.8 49.8 5
Notes: 4. Short duration pulse test used to minimize self-heating effect.
5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can
be found on our website at http://www.diodes.com.
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 18 - 2 3 of 5
www.diodes.com September 2011
© Diodes Incorporated
BZT52C2V4LP - BZT52C39LP
0
50
100
150
200
250
300
0 25 50 75 100 125 150
Note 5
T , AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
A
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N (mW)
D
0.1
1
10
100
1000
0 0.3 0.6 0.9 1.2 1.5
T = 25°C
A
T = -65°C
A
T = -40°C
A
T = 85°C
A
T = 105°C
A
T = 125°C
A
T = 150°C
A
I , INSTANTANEOUS FORWARD VOLTAGE (mA)
F
V , INSTANTA NEOUS FORWARD VOL TAGE (V)
Fig. 2 Typical Fo r ward C haracter istics
F
0.01
0.1
1
10
100
012 3456
T = 25°C
A
C4V7LP
0
10
20
30
40
50
012345678910
I, ZE
N
E
R
C
U
R
R
E
N
T
(mA)
Z
V , ZENER VOLTAGE (V)
Fi g. 4 Typ ical Zener Br eak dow n Char ac t er i s t ics
Z
0
10
20
30
0
I, ZENE
R
C
U
R
R
EN
T
(mA)
Z
V , ZENER VOLTAGE (V)
Fig. 5 Typical Zener Breakdown Characteristics
Z
10 20 30
Test Current I
5.0mA
Z
C10LP
C12LP
C18LP
C22LP
C15LP
I , ZENER CURRENT (mA)
Z
C39LP
C36LP
V , ZENER VOLTAGE (V)
Fi g. 6 Typ ical Zener Br eak dow n Char ac t er i s t ics
Z
Test Current I
Z
2.0mA
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 18 - 2 4 of 5
www.diodes.com September 2011
© Diodes Incorporated
BZT52C2V4LP - BZT52C39LP
Package Outline Dimensions
Suggested Pad Layout
X1-DFN1006-2
Dim Min Max Typ
A 0.47 0.53 0.50
A1 0 0.05 0.03
b 0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e - - 0.40
L 0.20 0.30 0.25
R 0.05 0.15 0.10
All Dimensions in mm
Dimensions Value (in mm)
Z 1.1
G 0.3
X 0.7
Y 0.4
C 0.7
L
Eb
R
e
D
A1
A
Z
X
C
G
Y
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 18 - 2 5 of 5
www.diodes.com September 2011
© Diodes Incorporated
BZT52C2V4LP - BZT52C39LP
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated p roducts for any unintended or una uthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign p atents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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