MMBT100
MMBT100A
PN100
PN100A
NPN General Purpose Amplifier
This device is designed for general purpose amplifier applications
at collector currents to 300 mA. Sourced from Process 10.
Absolute Maximum Ratings* TA = 25°C unless otherwise noted
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Symbol Parameter Value Units
VCEO Collec t or-Emitter V ol tage 45 V
VCBO Collec t or-Bas e Voltage 75 V
VEBO Emi tter-Base Volt age 6.0 V
ICCollect or Current - Cont i nuous 500 mA
TJ, Tstg Operating and Storage Junc tion Temperature Range -55 to +150 °C
Thermal Characteristics TA = 25°C unless otherwise noted
*Device mounted on FR-4 PCB 1.6" X 1.6" X 0.06."
Symbol Characteristic Max Units
PN100
PN100A *MMBT100
*MMBT100A
PDTotal Device Dissipation
Derate above 25°C625
5.0 350
2.8 mW
mW/°C
RθJC Thermal Resistanc e, Junct i on to Case 83.3 °C/W
RθJA Thermal Resistanc e, Junct i on to Ambient 200 357 °C/W
CBETO-92
C
B
E
SOT-23
Mark: NA / NA1
1998 Fairchild Semiconductor Corporation
PN100 / MMBT100 / PN100A / MMBT100A
NPN General Purpose Amplifier
(continued)
Electrical Characteristics TA = 25°C unless otherwise noted
OFF CHARACTERISTICS
Symbol Parameter Test Conditions Min Max Units
ON CHARACTERISTICS
SMALL SIGNAL CHARACTERISTICS
*Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
BVCBO Collector-Base Breakdown Voltage IC = 10
µ
A, IB = 0 75 V
BVCEO Collector-Emitter Breakdown Voltage* IC = 1 mA, IE = 0 45 V
BVEBO Emitter-Base Breakdown Voltage IE = 10
µ
A, IC = 0 6.0 V
ICBO Collector Cutoff Current VCB = 60 V 50 nA
ICES Collector Cutoff Current VCE = 40 V 50 nA
IEBO Emitter Cuto ff Current VEB = 4 V 50 nA
hFE DC Current Gain IC = 100 µA, VCE = 1.0 V 100
100A
IC = 10 mA , V CE = 1.0 V 100
100A
IC = 100 mA , V CE = 1.0 V *
IC = 150 mA , V CE = 5.0 V * 100
100A
80
240
100
300
100
100
100
450
600
350
VCE(sat)Collector-Emitter Sat urat ion V oltage IC = 10 mA, IB = 1. 0 m A
IC = 200 mA , I B = 20 m A * 0.2
0.4 V
V
VBE(sat)Base-Emitter Saturati on V olt age IC = 10 mA , IB = 1. 0 m A
IC = 200 mA , I B = 20 m A * 0.85
1.0 V
V
fTCurrent Gain - Bandwidth Product VCE = 20 V, IC = 20 m A 250 MHz
Cobo Output Capacitance VCB = 5.0 V , f = 1.0 MHz 4.5 pF
NF Noise Figure IC = 100 µA, VCE = 5.0 V, 100
RG = 2.0 kΩ, f = 1.0 kHz 100A 5.0
4.0 dB
dB
Typical Characteristics
Typical Pulsed Current Gain
vs Collector Current
10 20 30 50 100 200 300 500
0
100
200
300
400
I - COLLECTOR CURRENT (mA)
h - TYPICAL PULSED CURRENT GAIN
C
FE
125 °C
25 °C
- 40 °C
Vce = 5V
Collector-Emitter Saturation
Volt age vs Collecto r Cu rren t
110100400
0.1
0.2
0.3
0.4
I - COLL EC TO R CUR RENT (m A)
V - COLL ECTOR- EMITTER VOLTAGE (V)
C
CESAT
25 °C
- 40 °C
125 °C
β = 10
PN100 / MMBT100 / PN100A / MMBT100A
Typical Characteristics (continued)
Switching Times vs
Collector Current
10 20 30 50 100 200 300
0
30
60
90
120
150
180
210
240
270
300
I - COLLECTOR CURRENT (mA)
TI ME (n S)
IB1 = IB2 = Ic / 10
V = 10 V
C
cc
ts
td
tftr
Power Dissipation vs
Am bient Tem p erature
0 25 50 75 100 125 150
0
100
200
300
400
500
600
700
TEMPERATURE ( C)
P - POWER DISSIPATION (mW)
D
o
TO-92
SOT-23
Base-Emitter Saturation
Vol t age v s Col lect o r Cu r rent
0.1 1 10 100 300
0.2
0.4
0.6
0.8
1
I - CO LLECTOR CUR RE NT ( m A)
V - CO LL EC TOR-EMITTER VOLT A GE ( V)
β = 10
C
BESAT
25 °C
- 40 °C
125 °C
Base-Emitter ON Voltage vs
Collector Current
110100500
0.2
0.4
0.6
0.8
1
I - COLLEC TOR CURRENT (m A)
V - B AS E-E MITTER O N VOLT A GE (V)
C
BEON
V = 5V
CE
25 °C
- 40 °C
125 °C
Input and Output Capacitance
vs Revers e Voltage
0.1 1 10 100
0.1
1
10
100
V - COLLECTOR VOLTAG E (V)
CA PACITANCE (pF)
Cib
Cob
f = 1.0 MHz
ce
Collect or -Cutoff Current
vs A m b ient Temp erat u re
25 50 75 100 125 150
0.1
1
10
T - A MBIENT TEMPERATUR E ( C)
I - COLLECTOR CURREN T (nA)
A
CBO
V = 6 0V
°
CB
PN100 / MMBT100 / PN100A / MMBT100A
NPN General Purpose Amplifier
(continued)
TO-92 Tape and Reel Data
September 1999, Rev. B
TO-92 Packaging
Configuration: Figure 1.0
AMMO PACK OPTION
See Fig 3.0 for 2 Ammo
Pack Options
2000 units per
EO70 box for
std option
FSCINT Label
530mm x 130m m x
83mm
Inter med iate box
10,000 units maximum
per
intermediate box
for std option
FSCINT Label
114mm x 102m m x 51mm
Immed iate Box
Anti-static
Bubble Sheets
(TO-92) BULK PACKING INFORMATION
EOL
CODE DESCRIPTION LEADCLIP
DIMENSION QUANTITY
J18Z TO-18 OPTION STD NO LEAD CLIP 2.0 K / BOX
J05Z TO-5 OPTION STD NO LEAD CLIP 1.5 K / BOX
NO EOL
CODE TO-92 STANDARD
STRAIGHT NO LE A DCLIP 2.0 K / BOX
BULK OPTION
See Bulk Packing
Information table
375mm x 267m m x 375mm
Inter med iate Box
FSCINT
Label
Customized
Label
333mm x 231m m x 183mm
Inter med iate Box
FSCINT
Label
Customized
Label
TO-92 TNR/AMMO PACKING INFROMATION
Pack ing Style Q u antity EOL code
Reel A 2,000 D26Z
E2,000 D27Z
Ammo M 2,000 D74Z
P2,000 D75Z
U nit w eight = 0.22 gm
Reel w e i g ht with com ponents = 1 .0 4 kg
Ammo wei g ht with components = 1.02 kg
Max quantity p er interme d iate box = 10,000 units
F63TNR
Label
5 Ammo boxes per
Inter med iate Box
Customized
Label
327mm x 158m m x 135mm
Immed iate Box
LOT: CBVK741B019
NSID: PN2222N
D/C1:
D9842 SPEC REV: B2
SPEC:
QTY: 10000
QA REV:
FAIRCHILD SEMICONDUCTOR CORPORATI ON
HTB:B
(FSCINT)
F63TNR
Label
Customized
Label
5 Reels per
Inter med iate Box
TAPE and REEL OPTION
See Fig 2.0 for various
Reeling Styles
LOT: CBVK741B019
FSID: PN222N
D/C1: D9842 QTY1: SPEC REV:
SPEC:
QTY: 2000
D/C2: QTY2: CPN: N/F: F (F63TNR)3
F63TNR Label sample
FSCINT Label sample
C
5 EO70 boxes per
intermediate Box
ustomized
Label
©2000 Fairchild Semiconductor International
TO-92 Tape and Reel Data, continued
September 1999, Rev. B
TO-92 Reeling Style
Configuration: Figure 2.0
Style “A”, D26Z, D70 Z (s/h)
Machine Option “A” (H)
Style “E ”, D27 Z, D 71Z (s/ h)
Machine Option “E” (J)
FIRST WIRE OFF IS EMITTER
ADHESIVE TAPE IS ON THE TOP SIDE
FLAT OF TRANSISTOR IS ON BOTTOM
ORDER STYLE
D75Z (P)
FIRST WIRE OFF IS COLLECTOR
ADHESIVE TAPE IS ON THE TOP SIDE
FLAT OF TRANSISTOR IS ON TOP
ORDER STYLE
D74Z (M)
TO-92 Radial Ammo Packaging
Configuration: Figure 3.0
FIRST WIRE OFF IS EMITTER (ON PKG. 92)
ADHESIVE TAPE IS ON BOTTOM SIDE
FLAT OF TRANSISTOR IS ON BOTTOM
FIRST WIRE OFF IS COLLECTOR (ON PKG. 92)
ADHESIVE TAPE IS ON BOTTOM SIDE
FLAT OF TRANSISTOR IS ON TOP
ITEM DESCRIPTION
Base of Package to Lead Bend
Com p on en t He ig ht
Lead Clinc h Height
Component Base Height
Component Alignment ( side/side )
Component Alignment ( front/back )
Com p on en t Pi tc h
Feed Hole Pitch
Hole Center to First Lead
Hole Center to Component Center
Lead Spread
Lead Th ickness
Cut Lead Length
Taped L ead Length
Taped L ead Th ickness
Carrier Tape Thickness
Carrier Tape Width
Hold - down Tape Width
Hold - down Tape position
Feed Hole Position
Sprocket Hole Diameter
Lead Spring O ut
SYMBOL
b
Ha
HO
H1
Pd
Hd
P
PO
P1
P2
F1/F2
d
L
L1
t
t1
W
WO
W1
W2
DO
S
DIMENSION
0. 09 8 (m ax )
0. 92 8 (+ /- 0.025)
0. 63 0 (+ /- 0.020)
0. 74 8 (+ /- 0.020)
0. 04 0 (m ax )
0. 03 1 (m ax )
0. 50 0 (+ /- 0.020)
0. 50 0 (+ /- 0.008)
0.150 (+0.009, -0.010)
0. 24 7 (+ /- 0.007)
0. 10 4 (+ /- 0 . 01 0)
0.018 (+0.002, -0.003)
0. 42 9 (m ax )
0.209 (+0.051, -0.052)
0. 03 2 (+ /- 0.006)
0. 02 1 (+ /- 0.006)
0.708 (+0.020, -0.019)
0. 23 6 (+ /- 0.012)
0. 03 5 (m ax )
0. 36 0 (+ /- 0.025)
0.157 (+0.008, -0.007)
0. 00 4 (m ax )
Note : A ll dimensio ns ar e in inches.
ITEM DESCRIPTION SYSMBOL MINIMUM MAXIMUM
Ree l Diam eter D1 13.975 14. 02 5
Arb or Hol e Di am et er (St a nd ard) D2 1. 16 0 1.200
(Small Hole) D2 0.650 0.700
Core Diameter D3 3.100 3.300
Hub Recess Inner Diameter D4 2.700 3.100
Hub Recess Depth W1 0.370 0.570
Flange to Flange Inner Wid th W2 1.630 1.690
Hub to H ub Center Width W3 2.090
Not e: All dime ns io ns ar e inch es
TO-92 Tape and Reel Taping
Dimension Configuration: Figure 4.0
Ha
H1 HO
PO
P2
P1 F1
DO
PPd
b
d
L1
LS
WO W2
W
t
t1
Hd
W1
TO-92 Reel
Configuration: Figure 5.0
User Direction of Feed
SENSITIVE DEV ICES
ELECTROSTATIC
D1
D3
Customi zed Label
W2
W1 W3
F63 TNR Label
D4
D2
TO-92 Tape and Reel Data, continued
July 1999, Rev. A
TO-92 (FS PKG Code 92, 94, 96)
TO-92 Package Dimensions
January 2000, Rev. B
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.1977
©2000 Fairchild Semiconductor International
SOT-23 Packaging
Confi guration: Figure 1.0
Components Leader Tape
500mm mini mum or
125 emp ty pocket s
Tr aile r Tape
300mm mini mum or
75 empty pocke t s
SOT-23 Tape Leader and Trailer
Configuration: Figure 2.0
Cover Tape
Carrier Tape
Note/Comments
Packaging Option
SOT-23 Packaging Information
Standard
(no flow code) D87Z
Packaging type
Reel Si ze
TNR
7" Dia
TNR
13"
Qty per Reel/Tube /Bag 3,000 10,000
Bo x Dimens i on (mm) 187x107x183 343x343x64
Max qt y per B o x 24,000 30,000
Weight per unit (gm) 0.0082 0.0082
Weight per Reel (kg) 0.1175 0.4006
Human readable
Label
Human Readable Label
Human Readable Label sample
343mm x 342mm x 64mm
Intermediate box for L87Z Option
187mm x 107mm x 183mm
Intermediate Box for Standard Option
SOT-23 Unit Orientation
3P 3P 3P 3P
Human Readable
Label
Customized Label
Embossed
Carrier Tape
Antistatic Cover Tape
Packaging Description:
SOT-23
made from a dissipative (carbon filled) polycarbonate
resin. The cover tape is a multilayer film (H eat A cti vated
Adhesive in nature) primaril y composed of polyester film ,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
3,000 uni ts per 7" or 177cm diameter reel. The reels are
dark blue in color and is made of poly styrene plastic (anti-
static coated). Other option comes in 10,000 units per 13"
or 330cm diameter reel. Thi s and some other opt i ons are
described in the Packaging I nformati on table.
These full reel s are individually labeled and pl aced insi de
a standard intermediate made of recyclable corrugated
brown paper w i th a Fai rchil d l ogo pri nti ng. One pizza box
contains eight reels maximum. And these intermediate
boxes are placed inside a labeled shipping box which
comes i n different sizes dependin g on the number of parts
shipped.
parts are shipped in tape. The carrier tape is
SOT-23 Tape and Reel Data
September 1999, Rev . C
©2000 Fairchild Semiconductor International
Dimensions are in millimeter
Pkg type
A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
SOT-23
(8mm)
3.15
+/-0.10 2.77
+/-0.10 8.0
+/-0.3 1.55
+/-0.05 1.125
+/-0.125 1.75
+/-0.10 6.25
min 3.50
+/-0.05 4.0
+/-0.1 4.0
+/-0.1 1.30
+/-0.10 0.228
+/-0.013 5.2
+/-0.3 0.06
+/-0.02
Dimensions are in inches and millimeters
Tape Size Reel
Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL- USL)
8mm 7" Dia 7.00
177.8 0.059
1.5 512 +0.020/-0.008
13 +0.5/-0.2 0.795
20.2 2.165
55 0.331 +0.059/-0.000
8.4 +1.5/0 0.567
14.4 0.311 – 0.429
7.9 – 1 0.9
8m m 13" Dia 13.00
330 0.059
1.5 512 +0.020/-0.008
13 +0.5/-0.2 0.795
20.2 4.00
100 0.331 +0.059/-0.000
8.4 +1.5/0 0.567
14.4 0.311 – 0.429
7.9 – 1 0.9
See detail AA
Dim A
max
13" Diameter Option
7" Diameter Option
Dim A
Max
See detail AA
W3
W2 max Measured at Hub
W1 Measured at Hub
Dim N
Dim D
min
Dim C
B Min
DETAIL AA
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum component rotation
0.5mm
maximum
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
Typical
component
cavity
center line
20 deg maxim um
Typical
component
center line
B0
A0
Sketch B (Top View)
Component Rotation
Sketch A (Side or Front Sectional View)
Component Rotation
User Direction of Feed
SOT-23 Embossed Carrier Tape
Configuration: Figure 3.0
SOT-23 Reel Configuration: Figure 4.0
P1 A0
D1
FW
E1
E2
Tc
Wc
K0
T
B0
D0P0 P2
SOT-23 Tape and Reel Data, continued
September 1999, Rev . C
SOT-23 (FS PKG Code 49)
SOT-23 Package Dimensions
September 1998, Rev . A1
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Par t Weight per unit (gram): 0.0082
©2000 Fairchild Semiconductor International
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF F AIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
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Contents
General description | Product
status/pricing/packaging
General description
NPN General Purpose Amplifier
This device is designed for general purpose
amplifier applications at collector currents to
300 mA. Sourced from Process 10.
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Product status/pricing/packaging
Product Product status Pricing* Package type Leads Package marking Packing method
PN100A Full Production $0.078 TO-92 3 $Y&3
PN100
A BULK
PN100RM Full Production $0.078 TO-92 3 $Y&3
PN100 AMMO
* 1,000 piece Budgetary Pricing
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