PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 84151012A ACTIVE LCCC FK 20 1 TBD 8415101RA ACTIVE CDIP J 20 1 TBD 8415101RA ACTIVE CDIP J 20 1 8415101SA ACTIVE CFP W 20 1 8415101SA ACTIVE CFP W 20 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI N / A for Pkg Type 1 TBD Call TI N / A for Pkg Type 84152012A ACTIVE LCCC FK 20 1 TBD 8415201RA ACTIVE CDIP J 20 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type 8415201SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type 84153012A ACTIVE LCCC FK 20 1 TBD 8415301RA ACTIVE CDIP J 20 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type 8415301SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type SN54LS682J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SN54LS682J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SN54LS684J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type N / A for Pkg Type SN54LS688J ACTIVE CDIP J 20 1 TBD A42 SN74LS682DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS682N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS682NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS682NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS682NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS684NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS684NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS686DW OBSOLETE SOIC DW 24 TBD Call TI Call TI SN74LS686NT OBSOLETE PDIP NT 24 TBD Call TI Call TI SN74LS687NT OBSOLETE PDIP NT 24 TBD Call TI Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) SN74LS687NT OBSOLETE PDIP NT 24 TBD Call TI SN74LS688DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688N ACTIVE PDIP N 20 CU NIPDAU N / A for Pkg Type 20 Addendum-Page 2 Pb-Free PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS688N3 OBSOLETE PDIP N 20 SN74LS688NE4 ACTIVE PDIP N 20 SN74LS688NSR ACTIVE SO NS 20 SN74LS688NSRE4 ACTIVE SO NS SN74LS688NSRG4 ACTIVE SO SNJ54LS682FK ACTIVE SNJ54LS682FK ACTIVE SNJ54LS682J Lead/Ball Finish MSL Peak Temp (3) (RoHS) TBD Call TI Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type ACTIVE CDIP J 20 1 TBD 20 Call TI A42 N / A for Pkg Type SNJ54LS682J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54LS682W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type SNJ54LS682W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type SNJ54LS684FK ACTIVE LCCC FK 20 1 TBD SNJ54LS684J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54LS684W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type SNJ54LS688FK ACTIVE LCCC FK 20 1 TBD SNJ54LS688J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54LS688W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS682DWR Package Package Pins Type Drawing SOIC SPQ Reel Reel Diameter Width (mm) W1 (mm) DW 20 2000 330.0 24.4 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.8 13.0 2.7 12.0 24.0 Q1 SN74LS682NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LS684DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74LS684NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LS688DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74LS688NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS682DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74LS682NSR SO NS 20 2000 346.0 346.0 41.0 SN74LS684DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74LS684NSR SO NS 20 2000 346.0 346.0 41.0 SN74LS688DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74LS688NSR SO NS 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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