MCF5307UM/D
Rev. 2.0, 08/2000
MCF5307 ColdFire
®
Integrated Microprocessor
User’s Manual
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© Motorola Inc., 2000. All rights reserved.
ColdFire is a registered trademark and DigitalDNA is a trademark of Motorola, Inc.
I
2
C is a registered trademark of Philips Semiconductors
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty,
representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can
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be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent
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1
2
3
4
5
7
8
9
10
11
12
13
14
15
16
17
18
19
A
Part II
Part IV
Part III
6
GLO
IND
Part I
Overview
ColdFire Core
Hardware Multiply/Accumulate (MAC) Unit
Local Memory
Debug Support
SIM Overview
Phase-Locked Loop (PLL)
I
2
C Module
Interrupt Controller
Chip-Select Module
Synchronous/Asynchronous DRAM Controller Module
DMA Controller Module
Timer Module
UART Modules
Parallel Port (General-Purpose I/O)
Mechanical Data
Signal Descriptions
Bus Operation
IEEE 1149.1 Test Access Port (JTAG)
Electrical Specifications
Part I: MCF5307
Processor
Core
Part II: System Integration Module (
SIM)
Part IV: Hardware Interface
Part III: Peripheral Module
Glossary of Terms and Abbreviations
Index
Appendix: Memory Map
B
20
GLO
IND
IND
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Overview
ColdFire Core
Hardware Multiply/Accumulate (MAC) Unit
Local Memory
Debug Support
SIM Overview
Phase-Locked Loop (PLL)
I
2
C Module
Interrupt Controller
Chip-Select Module
Synchronous/Asynchronous DRAM Controller Module
DMA Controller Module
Timer Module
UART Modules
Parallel Port (General-Purpose I/O)
Mechanical Data
Signal Descriptions
Bus Operation
IEEE 1149.1 Test Access Port (JTAG)
Electrical Specifications
Part I: MCF5307
Processor
Core
Part II: System Integration Module (
SIM)
Part IV: Hardware Interface
Part III: Peripheral Module
Glossary of Terms and Abbreviations
Index
Appendix B: Memory Map
1
2
3
4
5
7
8
9
10
11
12
13
14
15
16
17
18
19
A
Part II
Part IV
Part III
6
Part I
20
GLO
IND
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CONTENTS
Paragraph
Number Title Page
Number
Contents
v
About This Book
Chapter 1
Overview
1.1 Features............................................................................................................... 1-1
1.2 MCF5307 Features.............................................................................................. 1-4
1.2.1 Process............................................................................................................ 1-6
1.3 ColdFire Module Description............................................................................. 1-7
1.3.1 ColdFire Core ................................................................................................. 1-7
1.3.1.1 Instruction Fetch Pipeline (IFP).................................................................. 1-7
1.3.1.2 Operand Execution Pipeline (OEP)............................................................ 1-7
1.3.1.3 MAC Module.............................................................................................. 1-7
1.3.1.4 Integer Divide Module................................................................................ 1-7
1.3.1.5 8-Kbyte Unified Cache............................................................................... 1-8
1.3.1.6 Internal 4-Kbyte SRAM ............................................................................. 1-8
1.3.2 DRAM Controller........................................................................................... 1-8
1.3.3 DMA Controller.............................................................................................. 1-8
1.3.4 UART Modules............................................................................................... 1-8
1.3.5 Timer Module................................................................................................. 1-9
1.3.6 I2C Module..................................................................................................... 1-9
1.3.7 System Interface ........................................................................................... 1-10
1.3.7.1 External Bus Interface .............................................................................. 1-10
1.3.7.2 Chip Selects .............................................................................................. 1-10
1.3.7.3 16-Bit Parallel Port Interface.................................................................... 1-10
1.3.7.4 Interrupt Controller................................................................................... 1-10
1.3.7.5 JTAG......................................................................................................... 1-11
1.3.8 System Debug Interface................................................................................ 1-11
1.3.9 PLL Module.................................................................................................. 1-11
1.4 Programming Model, Addressing Modes, and Instruction Set......................... 1-12
1.4.1 Programming Model..................................................................................... 1-13
1.4.2 User Registers............................................................................................... 1-14
1.4.3 Supervisor Registers..................................................................................... 1-14
1.4.4 Instruction Set............................................................................................... 1-15
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vi
MCF5307 User’s Manual
CONTENTS
Paragraph
Number Title Page
Number
Part I
MCF5407 Processor Core
Chapter 2
ColdFire Core
2.1 Features and Enhancements.............................................................................. 2-21
2.1.1 Clock-Multiplied Microprocessor Core........................................................ 2-22
2.1.2 Enhanced Pipelines....................................................................................... 2-22
2.1.2.1 Instruction Fetch Pipeline (IFP)................................................................ 2-23
2.1.2.1.1 Branch Acceleration ............................................................................. 2-23
2.1.2.2 Operand Execution Pipeline (OEP).......................................................... 2-24
2.1.2.2.1 Illegal Opcode Handling....................................................................... 2-24
2.1.2.2.2 Hardware Multiply/Accumulate (MAC) Unit...................................... 2-24
2.1.2.2.3 Hardware Divide Unit .......................................................................... 2-25
2.1.3 Debug Module Enhancements...................................................................... 2-25
2.2 Programming Model......................................................................................... 2-26
2.2.1 User Programming Model ............................................................................ 2-27
2.2.1.1 Data Registers (D0–D7) ........................................................................... 2-27
2.2.1.2 Address Registers (A0–A6)...................................................................... 2-27
2.2.1.3 Stack Pointer (A7, SP).............................................................................. 2-28
2.2.1.4 Program Counter (PC).............................................................................. 2-28
2.2.1.5 Condition Code Register (CCR)............................................................... 2-28
2.2.2 Supervisor Programming Model................................................................... 2-29
2.2.2.1 Status Register (SR).................................................................................. 2-29
2.2.2.2 Vector Base Register (VBR) .................................................................... 2-30
2.2.2.3 Cache Control Register (CACR) .............................................................. 2-30
2.2.2.4 Access Control Registers (ACR0–ACR1)................................................ 2-31
2.2.2.5 RAM Base Address Register (RAMBAR)............................................... 2-31
2.2.2.6 Module Base Address Register (MBAR) ................................................. 2-31
2.3 Integer Data Formats......................................................................................... 2-31
2.4 Organization of Data in Registers..................................................................... 2-31
2.4.1 Organization of Integer Data Formats in Registers...................................... 2-31
2.4.2 Organization of Integer Data Formats in Memory ....................................... 2-32
2.5 Addressing Mode Summary ............................................................................. 2-33
2.6 Instruction Set Summary................................................................................... 2-34
2.6.1 Instruction Set Summary .............................................................................. 2-37
2.7 Instruction Timing ............................................................................................ 2-40
2.7.1 MOVE Instruction Execution Times............................................................ 2-41
2.7.2 Execution Timings—One-Operand Instructions.......................................... 2-43
2.7.3 Execution Timings—Two-Operand Instructions.......................................... 2-43
2.7.4 Miscellaneous Instruction Execution Times................................................. 2-45
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CONTENTS
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Number Title Page
Number
Contents
vii
2.7.5 Branch Instruction Execution Times ............................................................ 2-46
2.8 Exception Processing Overview....................................................................... 2-47
2.8.1 Exception Stack Frame Definition................................................................ 2-49
2.8.2 Processor Exceptions.................................................................................... 2-50
Chapter 3
Hardware Multiply/Accumulate (MAC) Unit
3.1 Overview............................................................................................................. 3-1
3.1.1 MAC Programming Model............................................................................. 3-2
3.1.2 General Operation........................................................................................... 3-3
3.1.3 MAC Instruction Set Summary ...................................................................... 3-4
3.1.4 Data Representation........................................................................................ 3-4
3.2 MAC Instruction Execution Timings.................................................................. 3-5
Chapter 4
Local Memory
4.1 Interactions between Local Memory Modules ................................................... 4-1
4.2 SRAM Overview ................................................................................................ 4-1
4.3 SRAM Operation................................................................................................ 4-2
4.4 SRAM Programming Model............................................................................... 4-3
4.4.1 SRAM Base Address Register (RAMBAR)................................................... 4-3
4.5 SRAM Initialization............................................................................................ 4-4
4.5.1 SRAM Initialization Code.............................................................................. 4-5
4.6 Power Management ............................................................................................ 4-6
4.7 Cache Overview.................................................................................................. 4-6
4.8 Cache Organization............................................................................................. 4-7
4.8.1 Cache Line States: Invalid, Valid-Unmodified, and Valid-Modified............. 4-8
4.8.2 The Cache at Start-Up..................................................................................... 4-9
4.9 Cache Operation................................................................................................ 4-11
4.9.1 Caching Modes............................................................................................. 4-13
4.9.1.1 Cacheable Accesses.................................................................................. 4-13
4.9.1.2 Write-Through Mode ............................................................................... 4-14
4.9.1.3 Copyback Mode ....................................................................................... 4-14
4.9.2 Cache-Inhibited Accesses............................................................................. 4-14
4.9.3 Cache Protocol.............................................................................................. 4-15
4.9.3.1 Read Miss ................................................................................................. 4-15
4.9.3.2 Write Miss ............................................................................................... 4-16
4.9.3.3 Read Hit.................................................................................................... 4-16
4.9.3.4 Write Hit .................................................................................................. 4-16
4.9.4 Cache Coherency ......................................................................................... 4-17
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viii
MCF5307 User’s Manual
CONTENTS
Paragraph
Number Title Page
Number
4.9.5 Memory Accesses for Cache Maintenance................................................... 4-17
4.9.5.1 Cache Filling............................................................................................. 4-17
4.9.5.2 Cache Pushes ............................................................................................ 4-18
4.9.5.2.1 Push and Store Buffers ......................................................................... 4-18
4.9.5.2.2 Push and Store Buffer Bus Operation................................................... 4-18
4.9.6 Cache Locking.............................................................................................. 4-19
4.10 Cache Registers................................................................................................. 4-21
4.10.1 Cache Control Register (CACR) .................................................................. 4-21
4.10.2 Access Control Registers (ACR0–ACR1).................................................... 4-22
4.11 Cache Management........................................................................................... 4-24
4.12 Cache Operation Summary............................................................................... 4-25
4.12.1 Cache State Transitions ................................................................................ 4-25
4.13 Cache Initialization Code.................................................................................. 4-29
Chapter 5
Debug Support
5.1 Overview............................................................................................................. 5-1
5.2 Signal Description............................................................................................... 5-2
5.3 Real-Time Trace Support.................................................................................... 5-3
5.3.1 Begin Execution of Taken Branch (PST = 0x5)............................................. 5-4
5.4 Programming Model........................................................................................... 5-5
5.4.1 Address Attribute Trigger Register (AATR).................................................. 5-7
5.4.2 Address Breakpoint Registers (ABLR, ABHR)............................................ 5-8
5.4.3 BDM Address Attribute Register (BAAR)..................................................... 5-9
5.4.4 Configuration/Status Register (CSR)............................................................ 5-10
5.4.5 Data Breakpoint/Mask Registers (DBR, DBMR)......................................... 5-12
5.4.6 Program Counter Breakpoint/Mask Registers (PBR, PBMR)...................... 5-13
5.4.7 Trigger Definition Register (TDR)............................................................... 5-14
5.5 Background Debug Mode (BDM).................................................................... 5-16
5.5.1 CPU Halt....................................................................................................... 5-16
5.5.2 BDM Serial Interface.................................................................................... 5-17
5.5.2.1 Receive Packet Format ............................................................................. 5-19
5.5.2.2 Transmit Packet Format............................................................................ 5-19
5.5.3 BDM Command Set...................................................................................... 5-19
5.5.3.1 ColdFire BDM Command Format............................................................ 5-20
5.5.3.1.1 Extension Words as Required............................................................... 5-21
5.5.3.2 Command Sequence Diagrams................................................................. 5-21
5.5.3.3 Command Set Descriptions ...................................................................... 5-23
5.5.3.3.1 Read A/D Register (
RAREG
/
RDREG
) ..................................................... 5-24
5.5.3.3.2 Write A/D Register (
WAREG
/
WDREG
)................................................... 5-25
5.5.3.3.3 Read Memory Location (
READ
)............................................................ 5-26
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CONTENTS
Paragraph
Number Title Page
Number
Contents
ix
5.5.3.3.4 Write Memory Location (
WRITE
) ......................................................... 5-27
5.5.3.3.5 Dump Memory Block (
DUMP
).............................................................. 5-29
5.5.3.3.6 Fill Memory Block (
FILL
)..................................................................... 5-31
5.5.3.3.7 Resume Execution (
GO
)........................................................................ 5-33
5.5.3.3.8 No Operation (
NOP
) .............................................................................. 5-34
5.5.3.3.9 Synchronize PC to the PST/DDATA Lines (
SYNC
_
PC
) ....................... 5-35
5.5.3.3.10 Read Control Register (
RCREG
)............................................................ 5-36
5.5.3.3.11 Write Control Register (
WCREG
) .......................................................... 5-37
5.5.3.3.12 Read Debug Module Register (
RDMREG
) ............................................. 5-38
5.5.3.3.13 Write Debug Module Register (
WDMREG
) ........................................... 5-39
5.6 Real-Time Debug Support................................................................................ 5-39
5.6.1 Theory of Operation...................................................................................... 5-40
5.6.1.1 Emulator Mode......................................................................................... 5-41
5.6.2 Concurrent BDM and Processor Operation.................................................. 5-41
5.7 Motorola-Recommended BDM Pinout............................................................. 5-42
5.8 Processor Status, DDATA Definition............................................................... 5-42
5.8.1 User Instruction Set ...................................................................................... 5-43
5.8.2 Supervisor Instruction Set............................................................................. 5-46
Part II
System Integration Module (SIM)
Chapter 6
SIM Overview
6.1 Features............................................................................................................... 6-1
6.2 Programming Model........................................................................................... 6-3
6.2.1 SIM Register Memory Map............................................................................ 6-3
6.2.2 Module Base Address Register (MBAR) ....................................................... 6-4
6.2.3 Reset Status Register (RSR)........................................................................... 6-5
6.2.4 Software Watchdog Timer.............................................................................. 6-6
6.2.5 System Protection Control Register (SYPCR) ............................................... 6-8
6.2.6 Software Watchdog Interrupt Vector Register (SWIVR)............................... 6-9
6.2.7 Software Watchdog Service Register (SWSR)............................................... 6-9
6.2.8 PLL Clock Control for CPU STOP Instruction............................................ 6-10
6.2.9 Pin Assignment Register (PAR)................................................................... 6-10
6.2.10 Bus Arbitration Control................................................................................ 6-11
6.2.10.1 Default Bus Master Park Register (MPARK) .......................................... 6-11
6.2.10.1.1 Arbitration for Internally Generated Transfers (MPARK[PARK])...... 6-12
6.2.10.1.2 Arbitration between Internal and External Masters
for Accessing Internal Resources ......................................................... 6-14
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x
MCF5307 User’s Manual
CONTENTS
Paragraph
Number Title Page
Number
Chapter 7
Phase-Locked Loop (PLL)
7.1 Overview............................................................................................................. 7-1
7.1.1 PLL:PCLK Ratios........................................................................................... 7-2
7.2 PLL Operation .................................................................................................... 7-2
7.2.1 Reset/Initialization.......................................................................................... 7-2
7.2.2 Normal Mode.................................................................................................. 7-2
7.2.3 Reduced-Power Mode..................................................................................... 7-2
7.2.4 PLL Control Register (PLLCR)...................................................................... 7-3
7.3 PLL Port List ...................................................................................................... 7-3
7.4 Timing Relationships.......................................................................................... 7-4
7.4.1 PCLK, PSTCLK, and BCLKO....................................................................... 7-4
7.4.2 RSTI Timing................................................................................................... 7-5
7.5 PLL Power Supply Filter Circuit........................................................................ 7-6
Chapter 8
I
2
C Module
8.1 Overview............................................................................................................. 8-1
8.2 Interface Features................................................................................................ 8-1
8.3 I
2
C System Configuration................................................................................... 8-3
8.4 I
2
C Protocol ........................................................................................................ 8-3
8.4.1 Arbitration Procedure ..................................................................................... 8-4
8.4.2 Clock Synchronization.................................................................................... 8-5
8.4.3 Handshaking ................................................................................................... 8-5
8.4.4 Clock Stretching ............................................................................................. 8-5
8.5 Programming Model........................................................................................... 8-6
8.5.1 I
2
C Address Register (IADR)......................................................................... 8-6
8.5.2 I
2
C Frequency Divider Register (IFDR)......................................................... 8-7
8.5.3 I
2
C Control Register (I2CR)........................................................................... 8-8
8.5.4 I
2
C Status Register (I2SR).............................................................................. 8-9
8.5.5 I
2
C Data I/O Register (I2DR)....................................................................... 8-10
8.6 I
2
C Programming Examples............................................................................. 8-10
8.6.1 Initialization Sequence.................................................................................. 8-10
8.6.2 Generation of START................................................................................... 8-10
8.6.3 Post-Transfer Software Response................................................................. 8-11
8.6.4 Generation of STOP...................................................................................... 8-12
8.6.5 Generation of Repeated START................................................................... 8-12
8.6.6 Slave Mode................................................................................................... 8-13
8.6.7 Arbitration Lost............................................................................................. 8-13
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CONTENTS
Paragraph
Number Title Page
Number
Contents
xi
Chapter 9
Interrupt Controller
9.1 Overview............................................................................................................. 9-1
9.2 Interrupt Controller Registers............................................................................. 9-2
9.2.1 Interrupt Control Registers (ICR0–ICR9) ...................................................... 9-3
9.2.2 Autovector Register (AVR)............................................................................ 9-5
9.2.3 Interrupt Pending and Mask Registers (IPR and IMR)................................... 9-6
9.2.4 Interrupt Port Assignment Register (IRQPAR).............................................. 9-7
Chapter 10
Chip-Select Module
10.1 Overview........................................................................................................... 10-1
10.2 Chip-Select Module Signals ............................................................................. 10-1
10.3 Chip-Select Operation....................................................................................... 10-2
10.3.1 General Chip-Select Operation..................................................................... 10-3
10.3.1.1 8-, 16-, and 32-Bit Port Sizing.................................................................. 10-4
10.3.1.2 Global Chip-Select Operation................................................................... 10-4
10.4 Chip-Select Registers........................................................................................ 10-5
10.4.1 Chip-Select Module Registers...................................................................... 10-6
10.4.1.1 Chip-Select Address Registers (CSAR0–CSAR7)................................... 10-6
10.4.1.2 Chip-Select Mask Registers (CSMR0–CSMR7)...................................... 10-6
10.4.1.3 Chip-Select Control Registers (CSCR0–CSCR7).................................... 10-8
10.4.1.4 Code Example........................................................................................... 10-9
Chapter 11
Synchronous/Asynchronous DRAM Controller Module
11.1 Overview........................................................................................................... 11-1
11.1.1 Definitions .................................................................................................... 11-2
11.1.2 Block Diagram and Major Components....................................................... 11-2
11.2 DRAM Controller Operation............................................................................ 11-3
11.2.1 DRAM Controller Registers......................................................................... 11-3
11.3 Asynchronous Operation .................................................................................. 11-4
11.3.1 DRAM Controller Signals in Asynchronous Mode...................................... 11-4
11.3.2 Asynchronous Register Set........................................................................... 11-4
11.3.2.1 DRAM Control Register (DCR) in Asynchronous Mode ........................ 11-4
11.3.2.2 DRAM Address and Control Registers (DACR0/DACR1) ..................... 11-5
11.3.2.3 DRAM Controller Mask Registers (DMR0/DMR1)................................ 11-7
11.3.3 General Asynchronous Operation Guidelines .............................................. 11-8
11.3.3.1 Non-Page-Mode Operation..................................................................... 11-11
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MCF5307 User’s Manual
CONTENTS
Paragraph
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Number
11.3.3.2 Burst Page-Mode Operation ................................................................... 11-12
11.3.3.3 Continuous Page Mode........................................................................... 11-13
11.3.3.4 Extended Data Out (EDO) Operation..................................................... 11-15
11.3.3.5 Refresh Operation................................................................................... 11-16
11.4 Synchronous Operation................................................................................... 11-16
11.4.1 DRAM Controller Signals in Synchronous Mode...................................... 11-17
11.4.2 Using Edge Select (EDGESEL) ................................................................. 11-18
11.4.3 Synchronous Register Set........................................................................... 11-19
11.4.3.1 DRAM Control Register (DCR) in Synchronous Mode.......................... 11-19
11.4.3.2 DRAM Address and Control Registers (DACR0/DACR1)
in Synchronous Mode .........................................................................11-20
11.4.3.3 DRAM Controller Mask Registers (DMR0/DMR1).............................. 11-22
11.4.4 General Synchronous Operation Guidelines............................................... 11-23
11.4.4.1 Address Multiplexing ............................................................................. 11-23
11.4.4.2 Interfacing Example................................................................................ 11-27
11.4.4.3 Burst Page Mode..................................................................................... 11-27
11.4.4.4 Continuous Page Mode........................................................................... 11-29
11.4.4.5 Auto-Refresh Operation.......................................................................... 11-31
11.4.4.6 Self-Refresh Operation........................................................................... 11-32
11.4.5 Initialization Sequence................................................................................ 11-33
11.4.5.1 Mode Register Settings........................................................................... 11-33
11.5 SDRAM Example........................................................................................... 11-34
11.5.1 SDRAM Interface Configuration................................................................ 11-35
11.5.2 DCR Initialization....................................................................................... 11-35
11.5.3 DACR Initialization.................................................................................... 11-35
11.5.4 DMR Initialization...................................................................................... 11-37
11.5.5 Mode Register Initialization ....................................................................... 11-38
11.5.6 Initialization Code....................................................................................... 11-39
Part III
Peripheral Module
Chapter 12
DMA Controller Module
12.1 Overview........................................................................................................... 12-1
12.1.1 DMA Module Features................................................................................. 12-2
12.2 DMA Signal Description .................................................................................. 12-2
12.3 DMA Transfer Overview.................................................................................. 12-3
12.4 DMA Controller Module Programming Model................................................ 12-4
12.4.1 Source Address Registers (SAR0–SAR3).................................................... 12-6
12.4.2 Destination Address Registers (DAR0–DAR3) ........................................... 12-7
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12.4.3 Byte Count Registers (BCR0–BCR3)........................................................... 12-7
12.4.4 DMA Control Registers (DCR0–DCR3)...................................................... 12-8
12.4.5 DMA Status Registers (DSR0–DSR3)....................................................... 12-10
12.4.6 DMA Interrupt Vector Registers (DIVR0–DIVR3)................................... 12-11
12.5 DMA Controller Module Functional Description........................................... 12-11
12.5.1 Transfer Requests (Cycle-Steal and Continuous Modes)........................... 12-12
12.5.2 Data Transfer Modes .................................................................................. 12-12
12.5.2.1 Dual-Address Transfers.......................................................................... 12-12
12.5.2.2 Single-Address Transfers........................................................................ 12-13
12.5.3 Channel Initialization and Startup .............................................................. 12-13
12.5.3.1 Channel Prioritization............................................................................. 12-13
12.5.3.2 Programming the DMA Controller Module ........................................... 12-13
12.5.4 Data Transfer .............................................................................................. 12-14
12.5.4.1 External Request and Acknowledge Operation...................................... 12-14
12.5.4.2 Auto-Alignment...................................................................................... 12-17
12.5.4.3 Bandwidth Control.................................................................................. 12-18
12.5.5 Termination................................................................................................. 12-18
Chapter 13
Timer Module
13.1 Overview........................................................................................................... 13-1
13.1.1 Key Features................................................................................................. 13-2
13.2 General-Purpose Timer Units........................................................................... 13-2
13.3 General-Purpose Timer Programming Model .................................................. 13-2
13.3.1 Timer Mode Registers (TMR0/TMR1) ........................................................ 13-3
13.3.2 Timer Reference Registers (TRR0/TRR1)................................................... 13-4
13.3.3 Timer Capture Registers (TCR0/TCR1)....................................................... 13-4
13.3.4 Timer Counters (TCN0/TCN1) .................................................................... 13-5
13.3.5 Timer Event Registers (TER0/TER1)........................................................... 13-5
13.4 Code Example................................................................................................... 13-6
13.5 Calculating Time-Out Values........................................................................... 13-7
Chapter 14
UART Modules
14.1 Overview........................................................................................................... 14-1
14.2 Serial Module Overview................................................................................... 14-2
14.3 Register Descriptions........................................................................................ 14-2
14.3.1 UART Mode Registers 1 (UMR1n).............................................................. 14-4
14.3.2 UART Mode Register 2 (UMR2n)............................................................... 14-6
14.3.3 UART Status Registers (USRn) ................................................................... 14-7
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Paragraph
Number Title Page
Number
14.3.4 UART Clock-Select Registers (UCSRn)...................................................... 14-8
14.3.5 UART Command Registers (UCRn)............................................................ 14-9
14.3.6 UART Receiver Buffers (URBn) ............................................................... 14-11
14.3.7 UART Transmitter Buffers (UTBn)........................................................... 14-11
14.3.8 UART Input Port Change Registers (UIPCRn).......................................... 14-12
14.3.9 UART Auxiliary Control Register (UACRn)............................................. 14-12
14.3.10 UART Interrupt Status/Mask Registers (UISRn/UIMRn).......................... 14-13
14.3.11 UART Divider Upper/Lower Registers (UDUn/UDLn)............................ 14-14
14.3.12 UART Interrupt Vector Register (UIVRn)................................................. 14-15
14.3.13 UART Input Port Register (UIPn).............................................................. 14-15
14.3.14 UART Output Port Command Registers (UOP1n/UOP0n) ....................... 14-15
14.4 UART Module Signal Definitions.................................................................. 14-16
14.5 Operation......................................................................................................... 14-18
14.5.1 Transmitter/Receiver Clock Source............................................................ 14-18
14.5.1.1 Programmable Divider............................................................................ 14-18
14.5.1.2 Calculating Baud Rates........................................................................... 14-19
14.5.1.2.1 BCLKO Baud Rates ........................................................................... 14-19
14.5.1.2.2 External Clock.................................................................................... 14-19
14.5.2 Transmitter and Receiver Operating Modes............................................... 14-19
14.5.2.1 Transmitting ........................................................................................... 14-21
14.5.2.2 Receiver.................................................................................................. 14-22
14.5.2.3 FIFO Stack ............................................................................................. 14-24
14.5.3 Looping Modes........................................................................................... 14-25
14.5.3.1 Automatic Echo Mode............................................................................ 14-25
14.5.3.2 Local Loop-Back Mode.......................................................................... 14-25
14.5.3.3 Remote Loop-Back Mode....................................................................... 14-26
14.5.4 Multidrop Mode.......................................................................................... 14-26
14.5.5 Bus Operation............................................................................................. 14-28
14.5.5.1 Read Cycles ............................................................................................ 14-28
14.5.5.2 Write Cycles ........................................................................................... 14-28
14.5.5.3 Interrupt Acknowledge Cycles ............................................................... 14-28
14.5.6 Programming .............................................................................................. 14-28
14.5.6.1 UART Module Initialization Sequence .................................................. 14-29
Chapter 15
Parallel Port (General-Purpose I/O)
15.1 Parallel Port Operation...................................................................................... 15-1
15.1.1 Pin Assignment Register (PAR)................................................................... 15-1
15.1.2 Port A Data Direction Register (PADDR).................................................... 15-2
15.1.3 Port A Data Register (PADAT).................................................................... 15-2
15.1.4 Code Example............................................................................................... 15-3
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Number
Contents
xv
Part IV
Hardware Interface
Chapter 16
Mechanical Data
16.1 Package............................................................................................................. 16-1
16.2 Pinout................................................................................................................ 16-1
16.3 Mechanical Diagram......................................................................................... 16-8
16.4 Case Drawing.................................................................................................... 16-9
Chapter 17
Signal Descriptions
17.1 Overview........................................................................................................... 17-1
17.2 MCF5307 Bus Signals...................................................................................... 17-7
17.2.1 Address Bus.................................................................................................. 17-7
17.2.1.1 Address Bus (A[23:0]).............................................................................. 17-7
17.2.1.2 Address Bus (A[31:24]/PP[15:8]) ............................................................ 17-7
17.2.2 Data Bus (D[31:0]) ....................................................................................... 17-8
17.2.3 Read/Write (R/W)......................................................................................... 17-8
17.2.4 Size (SIZ[1:0]).............................................................................................. 17-8
17.2.5 Transfer Start (TS)........................................................................................ 17-9
17.2.6 Address Strobe (AS)..................................................................................... 17-9
17.2.7 Transfer Acknowledge (TA)......................................................................... 17-9
17.2.8 Transfer In Progress (TIP/PP7)................................................................... 17-10
17.2.9 Transfer Type (TT[1:0]/PP[1:0])................................................................ 17-10
17.2.10 Transfer Modifier (TM[2:0]/PP[4:2])......................................................... 17-10
17.3 Interrupt Control Signals................................................................................. 17-12
17.3.1 Interrupt Request (IRQ1/IRQ2, IRQ3/IRQ6, IRQ5/IRQ4, and IRQ7)....... 17-12
17.4 Bus Arbitration Signals................................................................................... 17-12
17.4.1 Bus Request (BR) ....................................................................................... 17-12
17.4.2 Bus Grant (BG).......................................................................................... 17-12
17.4.3 Bus Driven (BD)......................................................................................... 17-13
17.5 Clock and Reset Signals.................................................................................. 17-13
17.5.1 Reset In (RSTI)........................................................................................... 17-13
17.5.2 Clock Input (CLKIN).................................................................................. 17-13
17.5.3 Bus Clock Output (BCLKO) ...................................................................... 17-13
17.5.4 Reset Out (RSTO)....................................................................................... 17-13
17.5.5 Data/Configuration Pins (D[7:0])............................................................... 17-13
17.5.5.1 D[7:5Boot Chip-Select (CS0) Configuration ......................................... 17-14
17.5.5.2 D7—Auto Acknowledge Configuration (AA_CONFIG) ...................... 17-14
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17.5.5.3 D[6:5]—Port Size Configuration (PS_CONFIG[1:0])........................... 17-14
17.5.6 D4—Address Configuration (ADDR_CONFIG)....................................... 17-14
17.5.7 D[3:2]—Frequency Control PLL (FREQ[1:0]..........................................) 17-15
17.5.8 D[1:0]—Divide Control PCLK to BCLKO (DIVIDE[1:0])....................... 17-15
17.6 Chip-Select Module Signals ........................................................................... 17-15
17.6.1 Chip-Select (CS[7:0])................................................................................. 17-16
17.6.2 Byte Enables/Byte Write Enables (BE[3:0]/BWE[3:0]) ............................ 17-16
17.6.3 Output Enable (OE).................................................................................... 17-16
17.7 DRAM Controller Signals .............................................................................. 17-16
17.7.1 Row Address Strobes (RAS[1:0])............................................................... 17-16
17.7.2 Column Address Strobes (CAS[3:0])......................................................... 17-16
17.7.3 DRAM Write (DRAMW)........................................................................... 17-17
17.7.4 Synchronous DRAM Column Address Strobe (SCAS) ............................. 17-17
17.7.5 Synchronous DRAM Row Address Strobe (SRAS)................................... 17-17
17.7.6 Synchronous DRAM Clock Enable (SCKE).............................................. 17-17
17.7.7 Synchronous Edge Select (EDGESEL)...................................................... 17-17
17.8 DMA Controller Module Signals.................................................................... 17-17
17.8.1 DMA Request (DREQ[1:0]/PP[6:5]).......................................................... 17-18
17.9 Serial Module Signals..................................................................................... 17-18
17.9.1 Transmitter Serial Data Output (TxD)........................................................ 17-18
17.9.2 Receiver Serial Data Input (RxD)............................................................... 17-18
17.9.3 Clear to Send (CTS).................................................................................... 17-18
17.9.4 Request to Send (RTS) ............................................................................... 17-18
17.10 Timer Module Signals..................................................................................... 17-18
17.10.1 Timer Inputs (TIN[1:0]).............................................................................. 17-19
17.10.2 Timer Outputs (TOUT1, TOUT0).............................................................. 17-19
17.11 Parallel I/O Port (PP[15:0]) ............................................................................ 17-19
17.12 I2C Module Signals ........................................................................................ 17-19
17.12.1 I2C Serial Clock (SCL)............................................................................... 17-19
17.12.2 I2C Serial Data (SDA)................................................................................ 17-19
17.13 Debug and Test Signals .................................................................................. 17-20
17.13.1 Test Mode (MTMOD[3:0]) ........................................................................ 17-20
17.13.2 High Impedance (HIZ)................................................................................ 17-20
17.13.3 Processor Clock Output (PSTCLK)............................................................ 17-20
17.13.4 Debug Data (DDATA[3:0])........................................................................ 17-20
17.13.5 Processor Status (PST[3:0])........................................................................ 17-20
17.14 Debug Module/JTAG Signals......................................................................... 17-21
17.14.1 Test Reset/Development Serial Clock (TRST/DSCLK) ............................ 17-21
17.14.2 Test Mode Select/Breakpoint (TMS/BKPT) .............................................. 17-22
17.14.3 Test Data Input/Development Serial Input (TDI/DSI)............................... 17-22
17.14.4 Test Data Output/Development Serial Output (TDO/DSO)....................... 17-22
17.14.5 Test Clock (TCK) ....................................................................................... 17-23
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Contents
xvii
Chapter 18
Bus Operation
18.1 Features............................................................................................................. 18-1
18.2 Bus and Control Signals ................................................................................... 18-1
18.3 Bus Characteristics............................................................................................ 18-2
18.4 Data Transfer Operation ................................................................................... 18-3
18.4.1 Bus Cycle Execution..................................................................................... 18-4
18.4.2 Data Transfer Cycle States ........................................................................... 18-5
18.4.3 Read Cycle.................................................................................................... 18-7
18.4.4 Write Cycle................................................................................................... 18-8
18.4.5 Fast-Termination Cycles............................................................................... 18-9
18.4.6 Back-to-Back Bus Cycles........................................................................... 18-10
18.4.7 Burst Cycles................................................................................................ 18-11
18.4.7.1 Line Transfers......................................................................................... 18-12
18.4.7.2 Line Read Bus Cycles............................................................................. 18-12
18.4.7.3 Line Write Bus Cycles............................................................................ 18-14
18.4.7.4 Transfers Using Mixed Port Sizes.......................................................... 18-15
18.5 Misaligned Operands...................................................................................... 18-16
18.6 Bus Errors ....................................................................................................... 18-17
18.7 Interrupt Exceptions........................................................................................ 18-17
18.7.1 Level 7 Interrupts........................................................................................ 18-18
18.7.2 Interrupt-Acknowledge Cycle..................................................................... 18-19
18.8 Bus Arbitration................................................................................................ 18-20
18.8.1 Bus Arbitration Signals............................................................................... 18-21
18.9 General Operation of External Master Transfers............................................ 18-21
18.9.1 Two-Device Bus Arbitration Protocol (Two-Wire Mode)......................... 18-25
18.9.2 Multiple External Bus Device Arbitration Protocol (Three-Wire Mode)... 18-29
18.10 Reset Operation............................................................................................... 18-33
18.10.1 Master Reset ............................................................................................... 18-34
18.10.2 Software Watchdog Reset........................................................................... 18-35
Chapter 19
IEEE 1149.1 Test Access Port (JTAG)
19.1 Overview........................................................................................................... 19-1
19.2 JTAG Signal Descriptions ............................................................................... 19-2
19.3 TAP Controller.................................................................................................. 19-3
19.4 JTAG Register Descriptions............................................................................. 19-4
19.4.1 JTAG Instruction Shift Register.................................................................. 19-5
19.4.2 IDCODE Register......................................................................................... 19-6
19.4.3 JTAG Boundary-Scan Register .................................................................... 19-7
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Paragraph
Number Title Page
Number
19.4.4 JTAG Bypass Register................................................................................ 19-10
19.5 Restrictions ..................................................................................................... 19-10
19.6 Disabling IEEE Standard 1149.1 Operation................................................... 19-11
19.7 Obtaining the IEEE Standard 1149.1.............................................................. 19-12
Chapter 20
Electrical Specifications
20.1 General Parameters........................................................................................... 20-1
20.2 Clock Timing Specifications............................................................................. 20-2
20.3 Input/Output AC Timing Specifications........................................................... 20-3
20.4 Reset Timing Specifications........................................................................... 20-12
20.5 Debug AC Timing Specifications................................................................... 20-12
20.6 Timer Module AC Timing Specifications ...................................................... 20-14
20.7 I
2
C Input/Output Timing Specifications......................................................... 20-15
20.8 UART Module AC Timing Specifications..................................................... 20-16
20.9 Parallel Port (General-Purpose I/O) Timing Specifications ........................... 20-18
20.10 DMA Timing Specifications........................................................................... 20-19
20.11 IEEE 1149.1 (JTAG) AC Timing Specifications ........................................... 20-20
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ILLUSTRATIONS
Figure
Number Title Page
Number
Illustrations
xix
1-1 MCF5307 Block Diagram.............................................................................................1-2
1-2 UART Module Block Diagram.....................................................................................1-9
1-3 PLL Module................................................................................................................1-12
1-4 ColdFire MCF5307 Programming Model ..................................................................1-13
2-1 ColdFire Enhanced Pipeline .......................................................................................2-23
2-2 ColdFire Multiply-Accumulate Functionality Diagram ............................................. 2-25
2-3 ColdFire Programming Model....................................................................................2-27
2-5 Status Register (SR)....................................................................................................2-30
2-6 Vector Base Register (VBR).......................................................................................2-30
2-7 Organization of Integer Data Formats in Data Registers............................................2-32
2-8 Organization of Integer Data Formats in Address Registers......................................2-32
2-9 Memory Operand Addressing.....................................................................................2-33
2-10 Exception Stack Frame Form......................................................................................2-49
3-1 ColdFire MAC Multiplication and Accumulation........................................................3-2
3-2 MAC Programming Model...........................................................................................3-2
4-1 SRAM Base Address Register (RAMBAR).................................................................4-3
4-2 Unified Cache Organization .........................................................................................4-7
4-3 Cache Organization and Line Format........................................................................... 4-8
4-4 Cache—A: at Reset, B: after Invalidation, C and D: Loading Pattern.......................4-10
4-5 Caching Operation......................................................................................................4-11
4-6 Write-Miss in Copyback Mode...................................................................................4-16
4-7 Cache Locking............................................................................................................4-20
4-8 Cache Control Register (CACR) ................................................................................4-21
4-9 Access Control Register Format (ACRn)...................................................................4-23
4-10 A
n
Format ..................................................................................................................4-24
4-11 Cache Line State Diagram—Copyback Mode............................................................4-26
4-12 Cache Line State Diagram—Write-Through Mode....................................................4-26
5-1 Processor/Debug Module Interface...............................................................................5-1
5-2 PSTCLK Timing...........................................................................................................5-3
5-3 Example JMP Instruction Output on PST/DDATA......................................................5-5
5-4 Debug Programming Model .........................................................................................5-6
5-5 Address Attribute Trigger Register (AATR)................................................................5-7
5-6 Address Breakpoint Registers (ABLR, ABHR) ........................................................... 5-9
5-7 BDM Address Attribute Register (BAAR)...................................................................5-9
5-8 Configuration/Status Register (CSR)..........................................................................5-10
5-9 Data Breakpoint/Mask Registers (DBR and DBMR).................................................5-12
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MCF5307 User’s Manual
5-10 Program Counter Breakpoint Register (PBR).............................................................5-14
5-11 Program Counter Breakpoint Mask Register (PBMR)...............................................5-14
5-12 Trigger Definition Register (TDR).............................................................................5-15
5-13 BDM Serial Interface Timing.....................................................................................5-18
5-14 Receive BDM Packet..................................................................................................5-19
5-15 Transmit BDM Packet ................................................................................................ 5-19
5-16 BDM Command Format.............................................................................................5-21
5-17 Command Sequence Diagram.....................................................................................5-22
5-19
RAREG
/
RDREG
Command Sequence............................................................................ 5-24
5-18
RAREG
/
RDREG
Command Format ...............................................................................5-24
5-21
WAREG
/
WDREG
Command Sequence..........................................................................5-25
5-20
WAREG
/
WDREG
Command Format.............................................................................. 5-25
5-23
READ
Command Sequence..........................................................................................5-26
5-22
READ
Command/Result Formats.................................................................................5-26
5-24
WRITE
Command Format............................................................................................5-27
5-25
WRITE
Command Sequence ........................................................................................5-28
5-26
DUMP
Command/Result Formats................................................................................5-29
5-27
DUMP
Command Sequence .........................................................................................5-30
5-28
FILL
Command Format................................................................................................5-31
5-29
FILL
Command Sequence............................................................................................5-32
5-31
GO
Command Sequence.............................................................................................. 5-33
5-30 GO Command Format..................................................................................................5-33
5-33 NOP Command Sequence............................................................................................ 5-34
5-32 NOP Command Format................................................................................................ 5-34
5-35 SYNC_PC Command Sequence....................................................................................5-35
5-34 SYNC_PC Command Format........................................................................................5-35
5-37 RCREG Command Sequence........................................................................................5-36
5-36 RCREG Command/Result Formats............................................................................... 5-36
5-39 WCREG Command Sequence.......................................................................................5-37
5-38 WCREG Command/Result Formats..............................................................................5-37
5-41 RDMREG Command Sequence.....................................................................................5-38
5-40 RDMREG bdm Command/Result Formats.................................................................... 5-38
5-43 WDMREG Command Sequence....................................................................................5-39
5-42 WDMREG BDM Command Format.............................................................................. 5-39
5-44 Recommended BDM Connector.................................................................................5-42
6-1 SIM Block Diagram......................................................................................................6-1
6-2 Module Base Address Register (MBAR) .....................................................................6-4
6-3 Reset Status Register (RSR) ......................................................................................... 6-5
6-4 MCF5307 Embedded System Recovery from Unterminated Access...........................6-7
6-5 System Protection Control Register (SYPCR) .............................................................6-8
6-6 Software Watchdog Interrupt Vector Register (SWIVR)............................................. 6-9
6-7 Software Watchdog Service Register (SWSR).............................................................6-9
6-8 Pin Assignment Register (PAR) ................................................................................. 6-10
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6-9 Default Bus Master Register (MPARK).....................................................................6-11
6-10 Round Robin Arbitration (PARK = 00)...................................................................... 6-12
6-11 Park on Master Core Priority (PARK = 01) ...............................................................6-13
6-12 Park on DMA Module Priority (PARK = 10)............................................................. 6-13
6-13 Park on Current Master Priority (PARK = 01)...........................................................6-14
7-1 PLL Module Block Diagram ........................................................................................7-1
7-2 PLL Control Register (PLLCR)....................................................................................7-3
7-3 CLKIN, PCLK, PSTCLK, and BCLKO Timing..........................................................7-5
7-4 Reset and Initialization Timing.....................................................................................7-6
7-5 PLL Power Supply Filter Circuit..................................................................................7-6
8-1 I2C Module Block Diagram..........................................................................................8-2
8-2 I2C Standard Communication Protocol ........................................................................8-3
8-3 Repeated START..........................................................................................................8-4
8-4 Synchronized Clock SCL..............................................................................................8-5
8-5 I2C Address Register (IADR).......................................................................................8-6
8-6 I2C Frequency Divider Register (IFDR)....................................................................... 8-7
8-7 I2C Control Register (I2CR).........................................................................................8-8
8-8 I2CR Status Register (I2SR) .........................................................................................8-9
8-9 I2C Data I/O Register (I2DR).....................................................................................8-10
8-10 Flow-Chart of Typical I2C Interrupt Routine .............................................................8-14
9-1 Interrupt Controller Block Diagram..............................................................................9-1
9-2 Interrupt Control Registers (ICR0–ICR9) ....................................................................9-3
9-3 Autovector Register (AVR)..........................................................................................9-5
9-4 Interrupt Pending Register (IPR) and Interrupt Mask Register (IMR)......................... 9-7
9-5 Interrupt Port Assignment Register (IRQPAR)............................................................9-7
10-1 Connections for External Memory Port Sizes ............................................................10-4
10-2 Chip Select Address Registers (CSAR0–CSAR7) .....................................................10-6
10-3 Chip Select Mask Registers (CSMRn) .......................................................................10-7
10-4 Chip-Select Control Registers (CSCR0–CSCR7) ......................................................10-8
11-1 Asynchronous/Synchronous DRAM Controller Block Diagram ...............................11-2
11-2 DRAM Control Register (DCR) (Asynchronous Mode)............................................11-5
11-3 DRAM Address and Control Registers (DACR0/DACR1)........................................11-6
11-4 DRAM Controller Mask Registers (DMR0 and DMR1)............................................11-7
11-5 Basic Non-Page-Mode Operation RCD = 0, RNCN = 1 (4-4-4-4) ..........................11-11
11-6 Basic Non-Page-Mode Operation RCD = 1, RNCN = 0 (5-5-5-5) ..........................11-12
11-7 Burst Page-Mode Read Operation (4-3-3-3).............................................................11-13
11-8 Burst Page-Mode Write Operation (4-3-3-3)............................................................11-13
11-9 Continuous Page-Mode Operation............................................................................11-14
11-10 Write Hit in Continuous Page Mode.........................................................................11-15
11-11 EDO Read Operation (3-2-2-2) ................................................................................11-15
11-12 DRAM Access Delayed by Refresh .........................................................................11-16
11-13 MCF5307 SDRAM Interface....................................................................................11-18
11-14 Using EDGESEL to Change Signal Timing.............................................................11-19
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xxii MCF5307 User’s Manual
11-15 DRAM Control Register (DCR) (Synchronous Mode)............................................11-19
11-16 DACR0 and DACR1 Registers (Synchronous Mode)..............................................11-20
11-17 DRAM Controller Mask Registers (DMR0 and DMR1)..........................................11-22
11-18 Burst Read SDRAM Access.....................................................................................11-28
11-19 Burst Write SDRAM Access....................................................................................11-29
11-20 Synchronous, Continuous Page-Mode Access—Consecutive Reads....................... 11-30
11-21 Synchronous, Continuous Page-Mode Access—Read after Write...........................11-31
11-22 Auto-Refresh Operation............................................................................................11-32
11-23 Self-Refresh Operation ............................................................................................. 11-32
11-24 Mode Register Set (mrs) Command .........................................................................11-34
11-25 Initialization Values for DCR...................................................................................11-35
11-26 SDRAM Configuration.............................................................................................11-36
11-27 DACR Register Configuration..................................................................................11-36
11-28 DMR0 Register.........................................................................................................11-37
11-29 Mode Register Mapping to MCF5307 A[31:0]........................................................11-38
12-1 DMA Signal Diagram.................................................................................................12-1
12-2 Dual-Address Transfer................................................................................................12-3
12-3 Single-Address Transfers............................................................................................12-4
12-4 Source Address Registers (SARn)..............................................................................12-6
12-5 Destination Address Registers (DARn)......................................................................12-7
12-6 Byte Count Registers (BCRn)—BCR24BIT = 1........................................................12-7
12-7 BCRn—BCR24BIT = 0..............................................................................................12-8
12-8 DMA Control Registers (DCRn)...............................................................................12-8
12-9 DMA Status Registers (DSRn)................................................................................12-10
12-10 DMA Interrupt Vector Registers (DIVRn)............................................................... 12-11
12-11 DREQ Timing Constraints, Dual-Address DMA Transfer.......................................12-15
12-12 Dual-Address, Peripheral-to-SDRAM, Lower-Priority DMA Transfer................... 12-16
12-13 Single-Address DMA Transfer.................................................................................12-17
13-1 Timer Block Diagram.................................................................................................13-1
13-2 Timer Mode Registers (TMR0/TMR1) ......................................................................13-3
13-3 Timer Reference Registers (TRR0/TRR1) ................................................................. 13-4
13-4 Timer Capture Register (TCR0/TCR1) ......................................................................13-5
13-5 Timer Counters (TCN0/TCN1)...................................................................................13-5
13-6 Timer Event Registers (TER0/TER1).........................................................................13-5
14-1 Simplified Block Diagram..........................................................................................14-1
14-2 UART Mode Registers 1 (UMR1n)............................................................................14-5
14-3 UART Mode Register 2 (UMR2n).............................................................................14-6
14-4 UART Status Register (USRn)...................................................................................14-7
14-5 UART Clock-Select Register (UCSRn)......................................................................14-8
14-6 UART Command Register (UCRn)............................................................................14-9
14-7 UART Receiver Buffer (URB0)...............................................................................14-11
14-8 UART Transmitter Buffer (UTB0)........................................................................... 14-12
14-9 UART Input Port Change Register (UIPCRn)..........................................................14-12
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ILLUSTRATIONS
Figure
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Number
Illustrations xxiii
14-10 UART Auxiliary Control Register (UACRn)...........................................................14-13
14-11 UART Interrupt Status/Mask Registers (UISRn/UIMRn)........................................14-13
14-12 UART Divider Upper Register (UDUn)...................................................................14-14
14-13 UART Divider Lower Register (UDLn)...................................................................14-14
14-14 UART Interrupt Vector Register (UIVRn)............................................................... 14-15
14-15 UART Input Port Register (UIPn)............................................................................14-15
14-17 UART Block Diagram Showing External and Internal Interface Signals................ 14-16
14-16 UART Output Port Command Register (UOP1/UOP0)...........................................14-16
14-18 UART/RS-232 Interface...........................................................................................14-17
14-19 Clocking Source Diagram.........................................................................................14-18
14-20 Transmitter and Receiver Functional Diagram.........................................................14-20
14-21 Transmitter Timing Diagram....................................................................................14-22
14-22 Receiver Timing........................................................................................................14-23
14-23 Automatic Echo ........................................................................................................14-25
14-24 Local Loop-Back ......................................................................................................14-26
14-25 Remote Loop-Back...................................................................................................14-26
14-26 Multidrop Mode Timing Diagram............................................................................14-27
14-27 UART Mode Programming Flowchart.....................................................................14-30
15-1 Parallel Port Pin Assignment Register (PAR) ............................................................15-1
15-2 Port A Data Direction Register (PADDR)..................................................................15-2
15-3 Port A Data Register (PADAT)..................................................................................15-3
16-1 Mechanical Diagram................................................................................................... 16-9
16-2 MCF5307 Case Drawing (General View) ................................................................ 16-10
16-3 Case Drawing (Details).............................................................................................16-11
17-1 MCF5307 Block Diagram with Signal Interfaces ......................................................17-2
18-1 Signal Relationship to BCLKO for Non-DRAM Access...........................................18-2
18-2 Connections for External Memory Port Sizes ............................................................18-4
18-3 Chip-Select Module Output Timing Diagram ............................................................ 18-4
18-4 Data Transfer State Transition Diagram..................................................................... 18-6
18-5 Read Cycle Flowchart.................................................................................................18-7
18-6 Basic Read Bus Cycle.................................................................................................18-8
18-7 Write Cycle Flowchart................................................................................................18-9
18-8 Basic Write Bus Cycle................................................................................................18-9
18-9 Read Cycle with Fast Termination ...........................................................................18-10
18-10 Write Cycle with Fast Termination...........................................................................18-10
18-11 Back-to-Back Bus Cycles.........................................................................................18-11
18-12 Line Read Burst (2-1-1-1), External Termination .................................................... 18-12
18-13 Line Read Burst (2-1-1-1), Internal Termination .....................................................18-13
18-14 Line Read Burst (3-2-2-2), External Termination .................................................... 18-13
18-15 Line Read Burst-Inhibited, Fast, External Termination............................................18-14
18-16 Line Write Burst (2-1-1-1), Internal/External Termination...................................... 18-14
18-17 Line Write Burst (3-2-2-2) with One Wait State, Internal Termination................... 18-15
18-18 Line Write Burst-Inhibited, Internal Termination ....................................................18-15
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ILLUSTRATIONS
Figure
Number Title Page
Number
xxiv MCF5307 User’s Manual
18-19 Longword Read from an 8-Bit Port, External Termination...................................... 18-16
18-20 Longword Read from an 8-Bit Port, Internal Termination....................................... 18-16
18-21 Example of a Misaligned Longword Transfer (32-Bit Port) ....................................18-17
18-22 Example of a Misaligned Word Transfer (32-Bit Port)............................................ 18-17
18-23 Interrupt-Acknowledge Cycle Flowchart .................................................................18-20
18-24 Basic No-Wait-State External Master Access .......................................................... 18-22
18-25 External Master Burst Line Access to 32-Bit Port....................................................18-24
18-26 MCF5307 Two-Wire Mode Bus Arbitration Interface............................................. 18-25
18-27 Two-Wire Bus Arbitration with Bus Request Asserted............................................18-26
18-28 Two-Wire Implicit and Explicit Bus Mastership......................................................18-27
18-29 MCF5307 Two-Wire Bus Arbitration Protocol State Diagram................................ 18-28
18-30 Three-Wire Implicit and Explicit Bus Mastership....................................................18-30
18-31 Three-Wire Bus Arbitration...................................................................................... 18-31
18-32 Three-Wire Bus Arbitration Protocol State Diagram ............................................... 18-32
18-33 Master Reset Timing.................................................................................................18-34
18-34 Software Watchdog Reset Timing............................................................................18-36
19-1 JTAG Test Logic Block Diagram...............................................................................19-2
19-2 JTAG TAP Controller State Machine.........................................................................19-4
19-4 Disabling JTAG in JTAG Mode...............................................................................19-11
19-5 Disabling JTAG in Debug Mode..............................................................................19-11
20-1 Clock Timing..............................................................................................................20-3
20-2 PSTCLK Timing.........................................................................................................20-3
20-3 AC Timings—Normal Read and Write Bus Cycles...................................................20-5
20-4 SDRAM Read Cycle with EDGESEL Tied to Buffered BCLKO..............................20-6
20-5 SDRAM Write Cycle with EDGESEL Tied to Buffered BCLKO.............................20-7
20-6 SDRAM Read Cycle with EDGESEL Tied High.......................................................20-8
20-7 SDRAM Write Cycle with EDGESEL Tied High......................................................20-9
20-8 SDRAM Read Cycle with EDGESEL Tied Low.....................................................20-10
20-9 SDRAM Write Cycle with EDGESEL Tied Low .................................................... 20-11
20-10 AC Output Timing—High Impedance......................................................................20-11
20-11 Reset Timing.............................................................................................................20-12
20-12 Real-Time Trace AC Timing.................................................................................... 20-13
20-13 BDM Serial Port AC Timing....................................................................................20-13
20-14 Timer Module AC Timing........................................................................................20-14
20-15 I2C Input/Output Timings.........................................................................................20-16
20-16 UART0/1 Module AC Timing—UART Mode.........................................................20-17
20-17 General-Purpose I/O Timing.....................................................................................20-18
20-18 DMA Timing ............................................................................................................20-19
20-19 IEEE 1149.1 (JTAG) AC Timing.............................................................................20-21
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Tables xxv
TABLES
Table
Number Title Page
Number
1-1 User-Level Registers...................................................................................................1-14
1-2 Supervisor-Level Registers.........................................................................................1-14
2-1 CCR Field Descriptions .............................................................................................2-28
2-2 MOVEC Register Map ...............................................................................................2-29
2-3 Status Field Descriptions ............................................................................................ 2-30
2-4 Integer Data Formats...................................................................................................2-31
2-5 ColdFire Effective Addressing Modes........................................................................2-34
2-6 Notational Conventions ..............................................................................................2-34
2-7 User-Mode Instruction Set Summary ......................................................................... 2-37
2-8 Supervisor-Mode Instruction Set Summary................................................................2-40
2-9 Misaligned Operand References................................................................................. 2-41
2-10 Move Byte and Word Execution Times......................................................................2-42
2-11 Move Long Execution Times......................................................................................2-42
2-12 MAC Move Execution Times.....................................................................................2-43
2-13 One-Operand Instruction Execution Times................................................................2-43
2-14 Two-Operand Instruction Execution Times................................................................2-44
2-15 Miscellaneous Instruction Execution Times............................................................... 2-45
2-16 General Branch Instruction Execution Times.............................................................2-46
2-17 Bcc Instruction Execution Times................................................................................2-47
2-18 Exception Vector Assignments...................................................................................2-48
2-19 Format Field Encoding ...............................................................................................2-49
2-20 Fault Status Encodings................................................................................................2-50
2-21 MCF5307 Exceptions .................................................................................................2-50
3-1 MAC Instruction Summary...........................................................................................3-4
3-2 Two-Operand MAC Instruction Execution Times .......................................................3-5
3-3 MAC Move Instruction Execution Times.....................................................................3-6
4-1 RAMBAR Field Description ........................................................................................ 4-3
4-2 Examples of Typical RAMBAR Settings.....................................................................4-6
4-3 Valid and Modified Bit Settings...................................................................................4-8
4-4 CACR Field Descriptions...........................................................................................4-21
4-5 ACRn Field Descriptions............................................................................................4-23
4-6 Cache Line State Transitions......................................................................................4-27
4-7 Cache Line State Transitions (Current State Invalid)................................................. 4-28
4-8 Cache Line State Transitions (Current State Valid) ...................................................4-28
4-9 Cache Line State Transitions (Current State Modified) .............................................4-29
5-1 Debug Module Signals..................................................................................................5-2
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xxvi MCF5307 User’s Manual
TABLES
Table
Number Title Page
Number
5-2 Processor Status Encoding............................................................................................5-4
5-3 BDM/Breakpoint Registers...........................................................................................5-7
5-4 AATR Field Descriptions.............................................................................................5-8
5-5 ABLR Field Description...............................................................................................5-9
5-6 ABHR Field Description...............................................................................................5-9
5-7 BAAR Field Descriptions...........................................................................................5-10
5-8 CSR Field Descriptions .............................................................................................. 5-11
5-9 DBR Field Descriptions..............................................................................................5-13
5-10 DBMR Field Descriptions .......................................................................................... 5-13
5-11 Access Size and Operand Data Location.................................................................... 5-13
5-12 PBR Field Descriptions .............................................................................................. 5-14
5-13 PBMR Field Descriptions...........................................................................................5-14
5-14 TDR Field Descriptions..............................................................................................5-15
5-15 Receive BDM Packet Field Description.....................................................................5-19
5-16 Transmit BDM Packet Field Description ...................................................................5-19
5-17 BDM Command Summary.........................................................................................5-20
5-18 BDM Field Descriptions.............................................................................................5-21
5-19 Control Register Map..................................................................................................5-36
5-20 Definition of DRc Encoding—Read...........................................................................5-38
5-21 DDATA[3:0]/CSR[BSTAT] Breakpoint Response....................................................5-40
5-22 PST/DDATA Specification for User-Mode Instructions............................................5-43
5-23 PST/DDATA Specification for Supervisor-Mode Instructions.................................. 5-46
6-1 SIM Registers ..............................................................................................................6-3
6-2 MBAR Field Descriptions ............................................................................................ 6-5
6-3 RSR Field Descriptions ................................................................................................ 6-6
6-4 SYPCR Field Descriptions ...........................................................................................6-8
6-5 PLLIPL Settings ......................................................................................................... 6-10
6-6 MPARK Field Descriptions........................................................................................6-11
7-1 PLLCR Field Descriptions............................................................................................7-3
7-2 PLL Module Input SIgnals............................................................................................7-3
7-3 PLL Module Output Signals.........................................................................................7-4
8-1 I2C Interface Memory Map........................................................................................... 8-6
8-2 I2C Address Register Field Descriptions......................................................................8-6
8-3 IFDR Field Descriptions...............................................................................................8-7
8-4 I2CR Field Descriptions................................................................................................8-8
8-5 I2SR Field Descriptions ................................................................................................8-9
9-1 Interrupt Controller Registers.......................................................................................9-2
9-2 Interrupt Control Registers ...........................................................................................9-2
9-3 ICRn Field Descriptions ...............................................................................................9-3
9-4 Interrupt Priority Scheme..............................................................................................9-4
9-5 AVR Field Descriptions................................................................................................9-6
9-6 Autovector Register Bit Assignments...........................................................................9-6
9-7 IPR and IMR Field Descriptions...................................................................................9-7
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Tables xxvii
TABLES
Table
Number Title Page
Number
9-8 IRQPAR Field Descriptions .........................................................................................9-8
10-1 Chip-Select Module Signals .......................................................................................10-1
10-2 Byte Enables/Byte Write Enable Signal Settings ....................................................... 10-2
10-3 Accesses by Matches in CSCRs and DACRs.............................................................10-3
10-4 D7/AA, Automatic Acknowledge of Boot CS0..........................................................10-4
10-5 D[6:5]/PS[1:0], Port Size of Boot CS0.......................................................................10-4
10-6 Chip-Select Registers..................................................................................................10-5
10-7 CSARn Field Description...........................................................................................10-6
10-8 CSMRn Field Descriptions.........................................................................................10-7
10-9 CSCRn Field Descriptions..........................................................................................10-8
11-1 DRAM Controller Registers.......................................................................................11-3
11-2 SDRAM Signal Summary ......................................................................................... 11-4
11-3 DCR Field Descriptions (Asynchronous Mode).........................................................11-5
11-4 DACR0/DACR1 Field Description ............................................................................ 11-6
11-5 DMR0/DMR1 Field Descriptions............................................................................... 11-7
11-6 Generic Address Multiplexing Scheme......................................................................11-8
11-7 DRAM Addressing for Byte-Wide Memories..........................................................11-10
11-8 DRAM Addressing for 16-Bit Wide Memories........................................................11-10
11-9 DRAM Addressing for 32-Bit Wide Memories........................................................11-11
11-10 SDRAM Commands.................................................................................................11-17
11-11 Synchronous DRAM Signal Connections ................................................................11-17
11-12 DCR Field Descriptions (Synchronous Mode).........................................................11-19
11-13 DACR0/DACR1 Field Descriptions (Synchronous Mode)......................................11-21
11-14 DMR0/DMR1 Field Descriptions............................................................................. 11-23
11-15 MCF5307 to SDRAM Interface (8-Bit Port, 9-Column Address Lines)..................11-24
11-16 MCF5307 to SDRAM Interface (8-Bit Port,10-Column Address Lines).................11-24
11-17 MCF5307 to SDRAM Interface (8-Bit Port,11-Column Address Lines).................11-24
11-18 MCF5307 to SDRAM Interface (8-Bit Port,12-Column Address Lines).................11-24
11-19 MCF5307 to SDRAM Interface (8-Bit Port,13-Column Address Lines).................11-25
11-20 MCF5307 to SDRAM Interface (16-Bit Port, 8-Column Address Lines)................11-25
11-21 MCF5307 to SDRAM Interface (16-Bit Port, 9-Column Address Lines)................11-25
11-22 MCF5307 to SDRAM Interface (16-Bit Port, 10-Column Address Lines)..............11-25
11-23 MCF5307 to SDRAM Interface (16-Bit Port, 11-Column Address Lines)..............11-25
11-24 MCF5307 to SDRAM Interface (16-Bit Port, 12-Column Address Lines)..............11-26
11-25 MCF5307to SDRAM Interface (16-Bit Port, 13-Column-Address Lines) ..............11-26
11-26 MCF5307 to SDRAM Interface (32-Bit Port, 8-Column Address Lines)................11-26
11-27 MCF5307 to SDRAM Interface (32-Bit Port, 9-Column Address Lines)................11-26
11-28 MCF5307 to SDRAM Interface (32-Bit Port, 10-Column Address Lines)..............11-26
11-29 MCF5307 to SDRAM Interface (32-Bit Port, 11-Column Address Lines)..............11-27
11-30 MCF5307 to SDRAM Interface (32-Bit Port, 12-Column Address Lines)..............11-27
11-31 SDRAM Hardware Connections...............................................................................11-27
11-32 SDRAM Example Specifications .............................................................................11-34
11-33 SDRAM Hardware Connections...............................................................................11-35
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xxviii MCF5307 User’s Manual
TABLES
Table
Number Title Page
Number
11-34 DCR Initialization Values.........................................................................................11-35
11-35 DACR Initialization Values......................................................................................11-36
11-36 DMR0 Initialization Values......................................................................................11-37
11-37 Mode Register Initialization .....................................................................................11-38
12-1 DMA Signals ..............................................................................................................12-2
12-2 Memory Map for DMA Controller Module Registers................................................12-5
12-3 DCRn Field Descriptions............................................................................................12-8
12-4 DSRn Field Descriptions .......................................................................................... 12-10
13-1 General-Purpose Timer Module Memory Map .......................................................... 13-3
13-2 TMRn Field Descriptions ...........................................................................................13-4
13-3 TERn Field Descriptions.............................................................................................13-6
13-5 Calculated Time-out Values (90-MHz Processor Clock)...........................................13-7
14-1 UART Module Programming Model..........................................................................14-3
14-2 UMR1n Field Descriptions.........................................................................................14-5
14-3 UMR2n Field Descriptions.........................................................................................14-6
14-4 USRn Field Descriptions ............................................................................................ 14-7
14-5 UCSRn Field Descriptions..........................................................................................14-9
14-6 UCRn Field Descriptions............................................................................................14-9
14-7 UIPCRn Field Descriptions ...................................................................................... 14-12
14-8 UACRn Field Descriptions.......................................................................................14-13
14-9 UISRn/UIMRn Field Descriptions ...........................................................................14-14
14-10 UIVRn Field Descriptions ........................................................................................ 14-15
14-11 UIPn Field Descriptions............................................................................................14-15
14-12 UOP1/UOP0 Field Descriptions...............................................................................14-16
14-13 UART Module Signals .............................................................................................14-17
14-14 UART Module Initialization Sequence ....................................................................14-29
15-1 Parallel Port Pin Descriptions.....................................................................................15-2
15-2 PADDR Field Description..........................................................................................15-2
15-3 Relationship between PADAT Register and Parallel Port Pin (PP)...........................15-3
16-1 Pins 1–52 (Left, Top-to-Bottom)................................................................................16-1
16-2 Pins 53–104 (Bottom, Left-to-Right)..........................................................................16-3
16-3 Pins 105–156 (Right, Bottom-to-Top)........................................................................16-4
16-4 Pins 157–208 (Top, Right-to-Left).............................................................................16-6
16-5 Dimensions ...............................................................................................................16-11
17-1 MCF5307 Signal Index............................................................................................... 17-3
17-2 Data Pin Configuration...............................................................................................17-6
17-3 Bus Cycle Size Encoding............................................................................................17-7
17-4 Bus Cycle Transfer Type Encoding............................................................................ 17-9
17-5 TM[2:0] Encodings for TT = 00 (Normal Access).....................................................17-9
17-6 TM0 Encoding for DMA as Master (TT = 01)...........................................................17-9
17-7 TM[2:1] Encoding for DMA as Master (TT = 01)...................................................17-10
17-8 TM[2:0] Encodings for TT = 10 (Emulator Access)................................................17-10
17-9 TM[2:0] Encodings for TT = 11 (Interrupt Level) ...................................................17-10
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Tables xxix
TABLES
Table
Number Title Page
Number
17-10 Data Pin Configuration.............................................................................................17-12
17-11 D7 Selection of CS0 Automatic Acknowledge ........................................................17-13
17-12 D6 and D5 Selection of CS0 Port Size ..................................................................... 17-13
17-13 D4/ADDR_CONFIG, Address Pin Assignment....................................................... 17-13
17-14 CLKIN Frequency ....................................................................................................17-13
17-15 BCLKO/PSTCLK Divide Ratios..............................................................................17-14
17-16 Processor Status Signal Encodings...........................................................................17-19
18-1 ColdFire Bus Signal Summary ...................................................................................18-1
18-2 Bus Cycle Size Encoding............................................................................................18-3
18-3 Accesses by Matches in CSCRs and DACRs.............................................................18-5
18-4 Bus Cycle States .........................................................................................................18-6
18-5 Allowable Line Access Patterns ............................................................................... 18-12
18-6 MCF5307 Arbitration Protocol States......................................................................18-20
18-7 ColdFire Bus Arbitration Signal Summary...............................................................18-21
18-8 Cycles for Basic No-Wait-State External Master Access.........................................18-23
18-9 Cycles for External Master Burst Line Access to 32-Bit Port.................................. 18-24
18-10 MCF5307 Two-Wire Bus Arbitration Protocol Transition Conditions....................18-28
18-11 Three-Wire Bus Arbitration Protocol Transition Conditions ................................... 18-32
18-12 Data Pin Configuration.............................................................................................18-35
19-1 JTAG Pin Descriptions...............................................................................................19-3
19-2 JTAG Instructions.......................................................................................................19-5
19-3 IDCODE Bit Assignments..........................................................................................19-6
19-4 Boundary-Scan Bit Definitions...................................................................................19-7
20-1 Absolute Maximum Ratings.......................................................................................20-1
20-2 Operating Temperatures..............................................................................................20-1
20-3 DC Electrical Specifications....................................................................................... 20-2
20-4 Clock Timing Specification........................................................................................20-2
20-5 Input AC Timing Specification...................................................................................20-3
20-6 Output AC Timing Specification................................................................................20-4
20-7 Reset Timing Specification.......................................................................................20-12
20-8 Debug AC Timing Specification ..............................................................................20-12
20-9 Timer Module AC Timing Specification..................................................................20-14
20-10 I2C Input Timing Specifications between SCL and SDA......................................... 20-15
20-11 I2C Output Timing Specifications between SCL and SDA......................................20-15
20-12 UART Module AC Timing Specifications...............................................................20-16
20-13 General-Purpose I/O Port AC Timing Specifications...............................................20-18
20-14 DMA AC Timing Specifications..............................................................................20-19
20-15 IEEE 1149.1 (JTAG) AC Timing Specifications .....................................................20-20
A-1 SIM Registers............................................................................................................... A-1
A-2 Interrupt Controller Registers...................................................................................... A-1
A-3 Chip-Select Registers...................................................................................................A-2
A-4 DRAM Controller Registers........................................................................................ A-3
A-5 General-Purpose Timer Registers................................................................................ A-4
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TABLES
Table
Number Title Page
Number
A-6 UART0 Control Registers............................................................................................ A-4
A-7 UART1 Control Registers............................................................................................ A-6
A-8 Parallel Port Memory Map........................................................................................... A-7
A-9 I2C Interface Memory Map.......................................................................................... A-8
A-10 DMA Controller Registers........................................................................................... A-8
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About This Book xxxi
About This Book
The primary objective of this user’s manual is to define the functionality of the MCF5307
processors for use by software and hardware developers.
The information in this book is subject to change without notice, as described in the
disclaimers on the title page of this book. As with any technical documentation, it is the
readers’ responsibility to be sure they are using the most recent version of the
documentation.
To locate any published errata or updates for this document, refer to the w orld-wide web at
http://www.motorola.com/coldfire.
Audience
This manual is intended for system software and hardware developers and applications
programmers who want to de velop products for the MCF5307. It is assumed that the reader
understands operating systems, microprocessor system design, basic principles of software
and hardware, and basic details of the ColdFire architecture.
Organization
Following is a summary and a brief description of the major sections of this manual:
• Chapter 1, “Overview,” includes general descriptions of the modules and features
incorporated in the MCF5307, focussing in particular on new features.
• Part I is intended for system designers who need to understand the operation of the
MCF5307 ColdFire core.
— Chapter 2, “ColdFire Core, ” pro vides an overvie w of the microprocessor core of
the MCF5307. The chapter be gins with a description of enhancements from the
V2 ColdFire core, and then fully describes the V3 programming model as it is
implemented on the MCF5307. It also includes a full description of exception
handling, data formats, an instruction set summary, and a table of instruction
timings.
— Chapter 3, “Hardware Multiply/Accumulate (MAC) Unit,” describes the
MCF5307 multiply/accumulate unit, which executes integer multiply,
multiply-accumulate, and miscellaneous register instructions. The MAC is
integrated into the operand execution pipeline (OEP).
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xxxii MCF5307 User’s Manual
Organization
— Chapter 4, “Local Memory.” This chapter describes the MCF5307
implementation of the ColdFire V3 local memory specification. It consists of the
two following major sections.
– Section 4.2, “SRAM Overvie w, ” describes the MCF5307 on-chip static RAM
(SRAM) implementation. It covers general operations, configuration, and
initialization. It also provides information and examples showing how to
minimize power consumption when using the SRAM.
– Section 4.7, “Cache Overview,” describes the MCF5307 cache
implementation, including organization, configuration, and coherency. It
describes cache operations and how the cache interacts with other memory
structures.
— Chapter 5, “Debug Support, ” describes the Revision C enhanced hardware debug
support in the MCF5307. This revision of the ColdFire debug architecture
encompasses earlier revisions.
• Part II, “System Integration Module (SIM),” describes the system integration
module, which provides overall control of the bus and serves as the interface
between the ColdFire core processor complex and internal peripheral devices. It
includes a general description of the SIM and individual chapters that describe
components of the SIM, such as the phase-lock loop (PLL) timing source, interrupt
controller for peripherals, configuration and operation of chip selects, and the
SDRAM controller.
— Chapter 6, “SIM Overview,” describes the SIM programming model, bus
arbitration, and system-protection functions for the MCF5307.
— Chapter 7, “Phase-Locked Loop (PLL),” describes configuration and operation
of the PLL module. It describes in detail the registers and signals that support the
PLL implementation.
— Chapter 8, “I2C Module,” describes the MCF5307 I2C module, including I2C
protocol, clock synchronization, and the registers in the I2C programing model.
It also provides extensive programming examples.
— Chapter 9, “Interrupt Controller,” describes operation of the interrupt controller
portion of the SIM. Includes descriptions of the registers in the interrupt
controller memory map and the interrupt priority scheme.
— Chapter 10, “Chip-Select Module,” describes the MCF5307 chip-select
implementation, including the operation and programming model, which
includes the chip-select address, mask, and control registers.
— Chapter 11, “Synchronous/Asynchronous DRAM Controller Module,”
describes configuration and operation of the synchronous/asynchronous DRAM
controller component of the SIM. It begins with a general description and brief
glossary, and includes a description of signals involved in DRAM operations.
The remainder of the chapter is divided between descriptions of asynchronous
and synchronous operations.
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About This Book xxxiii
Organization
• Part III, “Peripheral Module,” describes the operation and configuration of the
MCF5307 DMA, timer, UART, and parallel port modules, and describes how they
interface with the system integration unit, described in Part II.
— Chapter 12, “DMA Controller Module,” provides an overview of the DMA
controller module and describes in detail its signals and registers. The latter
sections of this chapter describe operations, features, and supported data transfer
modes in detail, showing timing diagrams for various operations.
— Chapter 13, “Timer Module,” describes configuration and operation of the two
general-purpose timer modules, timer 0 and timer 1. It includes programming
examples.
— Chapter 14, “UART Modules,” describes the use of the universal
asynchronous/synchronous receiver/transmitters (UARTs) implemented on the
MCF5307 and includes programming examples.
— Chapter 15, “Parallel Port (General-Purpose I/O),” describes the operation and
programming model of the parallel port pin assignment, direction-control, and
data registers. It includes a code example for setting up the parallel port.
• Part IV, “Hardware Interface,” provides a pinout and both electrical and functional
descriptions of the MCF5307 signals. It also describes ho w these signals interact to
support the variety of bus operations shown in timing diagrams.
— Chapter 16, “Mechanical Data,” provides a functional pin listing and package
diagram for the MCF5307.
— Chapter 17, “Signal Descriptions, ” pro vides an alphabetical listing of MCF5307
signals. This chapter describes the MCF5307 signals. In particular, it shows
which are inputs or outputs, how they are multiplexed, which signals require
pull-up resistors, and the state of each signal at reset.
— Chapter 18, “Bus Operation,” describes data transfers, error conditions, bus
arbitration, and reset operations. It describes transfers initiated by the MCF5307
and by an external bus master, and includes detailed timing diagrams showing
the interaction of signals in supported bus operations. Note that Chapter 11,
“Synchronous/Asynchronous DRAM Controller Module,” describes DRAM
cycles.
— Chapter 19, “IEEE 1149.1 Test Access Port (JTAG),” describes configuration
and operation of the MCF5307 JTA G test implementation. It describes the use of
JTAG instructions and provides information on how to disable JTAG
functionality.
— Chapter 20, “Electrical Specifications,” describes AC and DC electrical
specifications and thermal characteristics for the MCF5307. Because additional
speeds may have become available since the publication of this book, consult
Motorola’s ColdFire web page, http://www.motorola.com/coldfire, to confirm
that this is the latest information.
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xxxiv MCF5307 User’s Manual
Suggested Reading
This manual includes the following appendix:
• Appendix A, “List of Memory Maps,” lists the entire address-map for MCF5307
memory-mapped registers.
This manual also includes a glossary and an index.
Suggested Reading
This section lists additional reading that provides background for the information in this
manual as well as general information about the ColdFire architecture.
General Information
The following documentation provides useful information about the ColdFire architecture
and computer architecture in general:
ColdFire Documentation
The ColdFire documentation is available from the sources listed on the back cover of this
manual. Document order numbers are included in parentheses for ease in ordering.
•ColdFire Programmers Reference Manual, R1.0 (MCF5200PRM/AD)
• User’s manuals—These books provide details about individual ColdFire
implementations and are intended to be used in conjunction with The ColdFire
Programmers Reference Manual. These include the following:
—ColdFire MCF5102 User’s Manual (MCF5102UM/AD)
—ColdFire MCF5202 User’s Manual (MCF5202UM/AD)
—ColdFire MCF5204 User’s Manual (MCF5204UM/AD)
—ColdFire MCF5206 User’s Manual (MCF5206EUM/AD)
—ColdFire MCF5206E User’s Manual (MCF5206EUM/AD)
•ColdFire Programmers Reference Manual, R1.0 (MCF5200PRM/AD)
•Using Microprocessors and Microcomputers: The Motorola Family, William C.
Wray, Ross Bannatyne, Joseph D. Greenfield
Additional literature on ColdFire implementations is being released as new processors
become available. For a current list of ColdFire documentation, refer to the World Wide
Web at http://www.motorola.com/ColdFire/.
Conventions
This document uses the following notational conventions:
MNEMONICS In text, instruction mnemonics are shown in uppercase.
mnemonics In code and tables, instruction mnemonics are shown in lowercase.
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About This Book xxxv
Acronyms and Abbreviations
italics Italics indicate variable command parameters.
Book titles in text are set in italics.
0x0 Prefix to denote hexadecimal number
0b0 Prefix to denote binary number
REG[FIELD] Abbreviations for registers are shown in uppercase. Specific bits,
fields, or ranges appear in brackets. For example, RAMBAR[BA]
identifies the base address field in the RAM base address register.
nibble A 4-bit data unit
byte An 8-bit data unit
word A 16-bit data unit
longword A 32-bit data unit
x In some contexts, such as signal encodings, x indicates a don’ t care.
nUsed to express an undefined numerical value
¬NOT logical operator
& AND logical operator
| OR logical operator
Acronyms and Abbreviations
Table i lists acronyms and abbreviations used in this document.
Table i. Acronyms and Abbreviated Terms
Term Meaning
ADC Analog-to-digital conversion
ALU Arithmetic logic unit
AVEC Autovector
BDM Background debug mode
BIST Built-in self test
BSDL Boundary-scan description language
CODEC Code/decode
DAC Digital-to-analog conversion
DMA Direct memory access
DSP Digital signal processing
EA Effective address
EDO Extended data output (DRAM)
FIFO First-in, first-out
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xxxvi MCF5307 User’s Manual
Acronyms and Abbreviations
GPIO General-purpose I/O
I2C Inter-integrated circuit
IEEE Institute for Electrical and Electronics Engineers
IFP Instruction fetch pipeline
IPL Interrupt priority level
JEDEC Joint Electron Device Engineering Council
JTAG Joint Test Action Group
LIFO Last-in, first-out
LRU Least recently used
LSB Least-significant byte
lsb Least-significant bit
MAC Multiple accumulate unit
MBAR Memory base address register
MSB Most-significant byte
msb Most-significant bit
Mux Multiplex
NOP No operation
OEP Operand execution pipeline
PC Program counter
PCLK Processor clock
PLL Phase-locked loop
PLRU Pseudo least recently used
POR Power-on reset
PQFP Plastic quad flat pack
RISC Reduced instruction set computing
Rx Receive
SIM System integration module
SOF Start of frame
TAP Test access port
TTL Transistor-to-transistor logic
Tx Transmit
UART Universal asynchronous/synchronous receiver transmitter
Table i. Acronyms and Abbreviated Terms (Continued)
Term Meaning
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About This Book xxxvii
Terminology and Notational Conventions
Terminology and Notational Conventions
Table ii shows notational conventions used throughout this document.
Table ii Notational Conventions
Instruction Operand Syntax
Opcode Wildcard
cc Logical condition (example: NE for not equal)
Register Specifications
An Any address register n (example: A3 is address register 3)
Ay,Ax Source and destination address registers, respectively
Dn Any data register n (example: D5 is data register 5)
Dy,Dx Source and destination data registers, respectively
Rc Any control register (example VBR is the vector base register)
Rm MAC registers (ACC, MAC, MASK)
Rn Any address or data register
Rw Destination register w (used for MAC instructions only)
Ry,Rx Any source and destination registers, respectively
Xi index register i (can be an address or data register: Ai, Di)
Register Names
ACC MAC accumulator register
CCR Condition code register (lower byte of SR)
MACSR MAC status register
MASK MAC mask register
PC Program counter
SR Status register
Port Name
PSTDDATA Processor status/debug data port
Miscellaneous Operands
#<data> Immediate data following the 16-bit operation word of the instruction
Í Effective address
<ea>y,<ea>x Source and destination effective addresses, respectively
<label> Assembly language program label
<list> List of registers for MOVEM instruction (example: D3–D0)
<shift> Shift operation: shift left (<<), shift right (>>)
<size> Operand data size: byte (B), word (W), longword (L)
bc Both instruction and data caches
dc Data cache
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xxxviii MCF5307 User’s Manual
Terminology and Notational Conventions
ic Instruction cache
# <vector> Identifies the 4-bit vector number for trap instructions
identifies an indirect data address referencing memory
<xxx> identifies an absolute address referencing memory
dnSignal displacement value, n bits wide (example: d16 is a 16-bit displacement)
SF Scale factor (x1, x2, x4 for indexed addressing mode, <<1n>> for MAC operations)
Operations
+ Arithmetic addition or postincrement indicator
– Arithmetic subtraction or predecrement indicator
x Arithmetic multiplication
/ Arithmetic division
~ Invert; operand is logically complemented
& Logical AND
| Logical OR
^ Logical exclusive OR
<< Shift left (example: D0 << 3 is shift D0 left 3 bits)
>> Shift right (example: D0 >> 3 is shift D0 right 3 bits)
→Source operand is moved to destination operand
←→ Two operands are exchanged
sign-extended All bits of the upper portion are made equal to the high-order bit of the lower portion
If <condition>
then
<operations>
else
<operations>
Test the condition. If true, the operations after ‘then’ are perf ormed. If the condition is f alse and the
optional ‘else’ clause is present, the operations after ‘else’ are performed. If the condition is false
and else is omitted, the instruction performs no operation. Refer to the Bcc instruction description
as an example.
Subfields and Qualifiers
{} Optional operation
() Identifies an indirect address
dnDisplacement value, n-bits wide (example: d16 is a 16-bit displacement)
Address Calculated effective address (pointer)
Bit Bit selection (example: Bit 3 of D0)
lsb Least significant bit (example: lsb of D0)
LSB Least significant byte
LSW Least significant word
msb Most significant bit
MSB Most significant byte
MSW Most significant word
Table ii Notational Conventions (Continued)
Instruction Operand Syntax
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About This Book xxxix
Terminology and Notational Conventions
Condition Code Register Bit Names
C Carry
N Negative
V Overflow
X Extend
Z Zero
Table ii Notational Conventions (Continued)
Instruction Operand Syntax
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xl MCF5307 User’s Manual
Terminology and Notational Conventions
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Chapter 1. Overview 1-1
Chapter 1
Overview
This chapter is an overview of the MCF5307 ColdFire processor. It includes general
descriptions of the modules and features incorporated in the MCF5307.
1.1 Features
The MCF5307 integrated microprocessor combines a V3 ColdFire processor core with the
following components, as shown in Figure 1-1:
• 8-Kbyte unified cache
• 4-Kbyte on-chip SRAM
• Integer/fractional multiply-accumulate (MAC) unit
• Divide unit
• System debug interface
• DRAM controller for synchronous and asynchronous DRAM
• Four-channel DMA controller
• Two general-purpose timers
•Two UARTs
•I
2C™ interface
• Parallel I/O interface
• System integration module (SIM)
Designed for embedded control applications, the MCF5307 delivers 75 Dhrystone 2.1
MIPS at 90 MHz while minimizing system costs.
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1-2 MCF5307 User’s Manual
Features
Figure 1-1. MCF5307 Block Diagram
DRAM Controller Chip-Select Module External
Bus Interface
Software
Watchdog
Two
Two UARTs
DMA
I2C Module
JTAG
Debug MAC
V3 COLDFIRE PROCESSOR COMPLEX
SYSTEM INTEGRATION MODULE (SIM)
8-Kbyte
Cache
SRAM Controller
DIV
Eight-Instruction
FIFO Buffer
Operand Execution
Pipeline (OEP)
Instruction Fetch
Pipeline (IFP)
Branch Logic
32-Bit Data Bus
4-Entry
Store
Buffer
31
0
Four
32-Bit Address Bus
CCR
General-
Purpose
31
0
31
0
A0–A7
D0–D7
IED
IAG
IC1
IC2
DSOC
AGEX
Interrupt Controller
Local Memory Bus
PLL
CLKIN
RSTI
PSTCLK
RSTO
PCLK
BCLKO
X
n
Module
CS[7:0]
888
8
10 ICRs
MBAR
IMR
Channels
General-
Purpose
Timers
(sent off-chip
Cache Controller
ACR0
ACR1
CACR
CSARs CSCRs CSMRs
IRQ[1,3,5,7]
4
DRAM Controller
AVR
IPR
IRQPAR
SWIVR
SWSR SYPCR
RSR
System Control PLL Control
PLL
Base Address
MPARK
Bus Master Park
DMR0/1
DACR0/1
Addr/Cntrl Mask
DRAM Control
DCR
Parallel Port
PLL
Control Signals
Outputs
4-Kbyte
SRAM
RAMBAR
and to on-chip
peripherals)
Local
Instruction Unit
Registers
Memory
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Chapter 1. Overview
1-3
Features
Features common to many embedded applications, such as DMAs, various DRAM
controller interfaces, and on-chip memories, are integrated using advanced process
technologies.
The MCF5307 extends the legacy of Motorola’ s 68K family by providing a compatible path
for 68K and ColdFire customers in which development tools and customer code can be
leveraged. In fact, customers moving from 68K to ColdFire can use code translation and
emulation tools that facilitate modifying 68K assembly code to the ColdFire architecture.
Based on the concept of variable-length RISC technology, the ColdFire family combines
the architectural simplicity of conventional 32-bit RISC with a memory-saving,
variable-length instruction set. In defining the ColdFire architecture for embedded
processing applications, a 68K-code compatible core combines performance adv antages of
a RISC architecture with the optimum code density of a streamlined, variable-length
M68000 instruction set.
By using a variable-length instruction set architecture, embedded system designers using
ColdFire RISC processors enjoy significant advantages over conventional fixed-length
RISC architectures. The denser binary code for ColdFire processors consumes less memory
than many fixed-length instruction set RISC processors available. This improved code
density means more ef ficient system memory use for a giv en application and allows use of
slower, less costly memory to help achieve a target performance level.
The MCF5307 is the first standard product to implement the Version 3 ColdFire
microprocessor core. To reach higher levels of frequency and performance, numerous
enhancements were made to the V2 architecture. Most notable are a deeper instruction
pipeline, branch acceleration, and a unified cache, which together provide 75 (Dhrystone
2.1) MIPS at 90 MHz. Increasing the internal speed of the core also allows higher
performance while providing the system designer with an easy-to-use lower speed system
interface. The processor complex frequency is an integer multiple, 2 to 4 times, of the
external bus frequency. The core clock can be stopped to support a low-power mode.
Serial communication channels are provided by an I
2
C interface module and two
programmable full-duplex U AR Ts. Four channels of DMA allow for fast data transfer using
a programmable burst mode independent of processor execution. The two 16-bit
general-purpose multimode timers provide separate input and output signals. For system
protection, the processor includes a programmable 16-bit software watchdog timer. In
addition, common system functions such as chip selects, interrupt control, bus arbitration,
and an IEEE 1149.1 JTAG module are included. A sophisticated debug interface supports
background-debug mode plus real-time trace and debug with expanded flexibility of
on-chip breakpoint registers. This interface is present in all ColdFire standard products and
allows common emulator support across the entire family of microprocessors.
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1-4
MCF5307 User’s Manual
MCF5307 Features
1.2 MCF5307 Features
The following list summarizes MCF5307 features:
• ColdFire processor core
— Variable-length RISC, clock-multiplied Version 3 microprocessor core
— Fully code compatible with Version 2 processors
— T wo independent decoupled pipelines: four-stage instruction fetch pipeline (IFP)
and two-stage operand execution pipeline (OEP)
— Eight-instruction FIFO buffer provides decoupling between the pipelines
— Branch prediction mechanisms for accelerating program execution
— 32-bit internal address bus supporting 4 Gbytes of linear address space
— 32-bit data bus
— 16 user-accessible, 32-bit-wide, general-purpose registers
— Supervisor/user modes for system protection
— Vector base register to relocate exception-vector table
— Optimized for high-level language constructs
• Multiply and accumulate unit (MAC)
— High-speed, complex arithmetic processing for DSP applications
— Tightly coupled to the OEP
— Three-stage execute pipeline with one clock issue rate for 16 x 16 operations
— 16 x 16 and 32 x 32 multiplies support, all with 32-bit accumulate
— Signed or unsigned integer support, plus signed fractional operands
• Hardware integer divide unit
— Unsigned and signed integer divide support
— Tightly coupled to the OEP
— 32/16 and 32/32 operation support producing quotient and/or remainder results
• 8-Kbyte unified cache
— Four-way set-associative organization
— Operates at higher processor core frequency
— Provides pipelined, single-cycle access to critical code and data
— Supports write-through and copyback modes
— Four-entry, 32-bit store buffer to improve performance of operand writes
• 4-Kbyte SRAM
— Programmable location anywhere within 4-Gbyte linear address space
— Higher core-frequency operation
— Pipelined, single-cycle access to critical code or data
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Chapter 1. Overview
1-5
MCF5307 Features
• DMA controller
— Four fully programmable channels: two support external requests
— Dual-address and single-address transfer support with 8-, 16-, and 32-bit data
capability
— Source/destination address pointers that can increment or remain constant
— 24-bit transfer counter per channel
— Operand packing and unpacking supported
— Auto-alignment transfers supported for efficient block movement
— Bursting and cycle steal support
— Two-bus-clock internal access
— Automatic DMA transfers from on-chip UARTs using internal interrupts
• DRAM controller
— Synchronous DRAM (SDRAM), extended-data-out (EDO) DRAM, and fast
page mode support
— Up to 512 Mbytes of DRAM
— Programmable timer provides CAS-before-RAS refresh for asynchronous
DRAMs
— Support for two separate memory blocks
•Two UARTs
— Full-duplex operation
— Programmable clock
— Modem control signals available (CTS, RTS)
— Processor-interrupt capability
• Dual 16-bit general-purpose multiple-mode timers
— 8-bit prescaler
— Timer input and output pins
— Processor-interrupt capability
— Up to 22-nS resolution at 45 MHz
•I
2
C module
— Interchip bus interface for EEPROMs, LCD controllers, A/D converters, and
keypads
— Fully compatible with industry-standard I
2
C bus
— Master or slave modes support multiple masters
— Automatic interrupt generation with programmable level
• System interface module (SIM)
— Chip selects provide direct interface to 8-, 16-, and 32-bit SRAM, ROM,
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1-6
MCF5307 User’s Manual
MCF5307 Features
FLASH, and memory-mapped I/O devices
— Eight fully programmable chip selects, each with a base address register
— Programmable wait states and port sizes per chip select
— User-programmable processor clock/input clock frequency ratio
— Programmable interrupt controller
— Low interrupt latency
— Four external interrupt request inputs
— Programmable autovector generator
— Software watchdog timer
• 16-bit general-purpose I/O interface
• IEEE 1149.1 test (JTAG) module
• System debug support
— Real-time trace for determining dynamic ex ecution path while in emulator mode
— Background debug mode (BDM) for debug features while halted
— Real-time debug support, including 6 user -visible hardware breakpoint re gisters
supporting a variety of breakpoint configurations
— Supports comprehensi ve emulator functions through trace and breakpoint logic
• On-chip PLL
— Supports processor clock/bus clock ratios of 66/33, 66/22, 66/16.5, 90/45, 90/30,
and 90/22.5
— Supports low-power mode
• Product offerings
— 75 Dhrystone 2.1 MIPS at 90 MHz
— Implemented in 0.35 µ, triple-layer-metal process technology with 3.3-V
operation (5.0-V compliant I/O pads)
— 208-pin plastic QFP package
— 0°–70° C operating temperature
1.2.1 Process
The MCF5307 is manufactured in a 0.35-µ CMOS process with triple-layer-metal routing
technology. This process combines the high performance and low power needed for
embedded system applications. Inputs are 3.3-V tolerant; outputs are CMOS or open-drain
CMOS with outputs operating from VDD + 0.5 V to GND - 0.5 V, with guaranteed
TTL-level specifications.
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Chapter 1. Overview
1-7
ColdFire Module Description
1.3 ColdFire Module Description
The following sections provide overviews of the various modules incorporated in the
MCF5307.
1.3.1 ColdFire Core
The Version 4 ColdFire core consists of two independent and decoupled pipelines to
maximize performance—the instruction fetch pipeline (IFP) and the operand execution
pipeline (OEP).
1.3.1.1 Instruction Fetch Pipeline (IFP)
The four-stage instruction fetch pipeline (IFP) is designed to prefetch instructions for the
operand execution pipeline (OEP). Because the fetch and execution pipelines are decoupled
by a eight-instruction FIFO buffer, the fetch mechanism can prefetch instructions in
advance of their use by the OEP, thereby minimizing the time stalled waiting for
instructions. To maximize the performance of branch instructions, the Version 3 IFP
implements a branch prediction mechanism. Backward branches are predicted to be taken.
The prediction for forward branches is controlled by a bit in the Condition Code Register
(CCR). These predictions allo w the IFP to redirect the fetch stream down the path predicted
to be taken well in advance of the actual instruction execution. The result is significantly
improved performance.
1.3.1.2 Operand Execution Pipeline (OEP)
The prefetched instruction stream is gated from the FIFO buffer into the two-stage OEP.
The OEP consists of a traditional two-stage RISC compute engine with a register file access
feeding an arithmetic/logic unit (ALU). The OEP decodes the instruction, fetches the
required operands and then executes the required function.
1.3.1.3 MAC Module
The MAC unit provides signal processing capabilities for the MCF5307 in a variety of
applications including digital audio and servo control. Inte grated as an ex ecution unit in the
processor’s OEP, the MA C unit implements a three-stage arithmetic pipeline optimized for
16 x 16 multiplies. Both 16- and 32-bit input operands are supported by this design in
addition to a full set of extensions for signed and unsigned inte gers, plus signed, fixed-point
fractional input operands.
1.3.1.4 Integer Divide Module
Integrated into the OEP, the divide module performs operations using signed and unsigned
integers. The module supports word and longword divides producing quotients and/or
remainders.
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1-8
MCF5307 User’s Manual
ColdFire Module Description
1.3.1.5 8-Kbyte Unified Cache
The MCF5307 architecture includes an 8-Kbyte unified cache. This four-way,
set-associative cache provides pipelined, single-cycle access on cached instructions and
operands.
As with all ColdFire caches, the cache controller implements a non-lockup, streaming
design. The use of processor-local memories decouples performance from external
memory speeds and increases available bandwidth for external devices or the on-chip
4-channel DMA.
The cache implements line-fill buf fers to optimize 16-byte line burst accesses. Additionally ,
the cache supports copyback, write-through, or cache-inhibited modes. A 4-entry, 32-bit
buffer is used for cache line push operations and can be configured for deferred write
buffering in write-through or cache-inhibited modes.
1.3.1.6 Internal 4-Kbyte SRAM
The 4-Kbyte on-chip SRAM module provides pipelined, single-cycle access to memory
regions mapped to these devices. The memory can be mapped to any 0-modulo-32K
location in the 4-Gbyte address space. The SRAM module is useful for storing time-critical
functions, the system stack, or heavily-referenced data operands.
1.3.2 DRAM Controller
The MCF5307 DRAM controller provides a direct interface for up to two blocks of DRAM.
The controller supports 8-, 16-, or 32-bit memory widths and can easily interface to PC-100
DIMMs. A unique addressing scheme allows for increases in system memory size without
rerouting address lines and rewiring boards. The controller operates in normal mode or in
page mode and supports SDRAMs and EDO DRAMs.
1.3.3 DMA Controller
The MCF5307 provides four fully programmable DMA channels for quick data transfer.
Dual- and single-address modes support bursting and c ycle steal. Data transfers are 32 bits
long with packing and unpacking supported along with an auto-alignment option for
efficient block transfers. Automatic block transfers from on-chip serial UARTs are also
supported through the DMA channels.
1.3.4 UART Modules
The MCF5307 contains two UARTs, which function independently. Either UART can be
clocked by the system bus clock, eliminating the need for an external crystal. Each UART
module interfaces directly to the CPU, as shown in Figure 1-2.
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Chapter 1. Overview
1-9
ColdFire Module Description
Figure 1-2. UART Module Block Diagram
Each UART module consists of the following major functional areas:
• Serial communication channel
• 16-bit divider for clock generation
• Internal channel control logic
• Interrupt control logic
Each UART contains an programmable clock-rate generator. Data formats can be 5, 6, 7,
or 8 bits with e ven, odd, or no parity, and up to 2 stop bits in 1/16 increments. The UARTs
include 4-byte and 2-byte FIFO buffers. The UART modules also provide several
error-detection and maskable-interrupt capabilities. Modem support includes
request-to-send (RTS) and clear-to-send (CTS) lines.
BCLKO provides the time base through a programmable prescaler. The UART time scale
can also be sourced from a timer input. Full-duplex, auto-echo loopback, local loopback,
and remote loopback modes allow testing of UART connections. The programmable
UARTs can interrupt the CPU on various normal or error-condition events.
1.3.5 Timer Module
The timer module includes two general-purpose timers, each of which contains a
free-running 16-bit timer for use in any of three modes. One mode captures the timer v alue
with an external e vent. Another mode triggers an external signal or interrupts the CPU when
the timer reaches a set value, while a third mode counts external events.
The timer unit has an 8-bit prescaler that allo ws programming of the clock input frequency,
which is derived from the system bus cycle or an external clock input pin (TIN). The
programmable timer-output pin generates either an active-low pulse or toggles the output.
1.3.6 I
2
C Module
The I
2
C interface is a two-wire, bidirectional serial bus used for quick data exchanges
between devices. The I
2
C minimizes the interconnection between devices in the end system
and is best suited for applications that need occasional bursts of rapid communication o v er
Serial
Interrupt Control
Logic
CTS
RTS
RxD
TxD
or
External clock (TIN)
Internal Channel
Control Logic
Programmable
Clock
Communications
Channel
Generation
System Integration
Module (SIM)
Interrupt
Controller
UART
BCLKO
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1-10
MCF5307 User’s Manual
ColdFire Module Description
short distances among several devices. The I
2
C can operate in master, slave, or
multiple-master modes.
1.3.7 System Interface
The MCF5307 processor provides a direct interf ace to 8-, 16-, and 32-bit FLASH, SRAM,
R OM, and peripheral de vices through the use of fully programmable chip selects and write
enables. Support for burst ROMs is also included. Through the on-chip PLL, users can
input a slower clock (16.6 to 45 MHz) that is internally multiplied to create the faster
processor clock (33.3 to 90 MHz).
1.3.7.1 External Bus Interface
The bus interface controller transfers information between the ColdFire core or DMA and
memory, peripherals, or other devices on the external bus. The external bus interface
provides up to 32 bits of address bus space, a 32-bit data bus, and all associated control
signals. This interf ace implements an extended synchronous protocol that supports bursting
operations.
Simple two-wire request/acknowledge bus arbitration between the MCF5307 processor
and another bus master, such as an external DMA device, is glueless with arbitration logic
internal to the MCF5307 processor. Multiple-master arbitration is also av ailable with some
simple external arbitration logic.
1.3.7.2 Chip Selects
Eight fully programmable chip select outputs support the use of external memory and
peripheral circuits with user-defined w ait-state insertion. These signals interf ace to 8-, 16-,
or 32-bit ports. The base address, access permissions, and internal b us transfer terminations
are programmable with configuration registers for each chip select. CS0 also provides
global chip select functionality of boot ROM upon reset for initializing the MCF5307.
1.3.7.3 16-Bit Parallel Port Interface
A 16-bit general-purpose programmable parallel port serves as either an input or an output
on a pin-by-pin basis.
1.3.7.4 Interrupt Controller
The interrupt controller provides user-programmable control of ten internal peripheral
interrupts and implements four external fix ed interrupt-request pins. Each internal interrupt
can be programmed to any one of se v en interrupt lev els and four priority le vels within each
of these levels. Additionally, the external interrupt request pins can be mapped to levels 1,
3, 5, and 7 or levels 2, 4, 6, and 7. Autovector capability is available for both internal and
external interrupts.
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Chapter 1. Overview
1-11
ColdFire Module Description
1.3.7.5 JTAG
To help with system diagnostics and manufacturing testing, the MCF5307 processor
includes dedicated user-accessible test logic that complies with the IEEE 1149.1a standard
for boundary-scan testability, often referred to as the Joint Test Action Group, or JTA G. For
more information, refer to the IEEE 1149.1a standard.
1.3.8 System Debug Interface
The ColdFire processor core debug interface is provided to support system debugging in
conjunction with low-cost debug and emulator development tools. Through a standard
debug interface, users can access real-time trace and debug information. This allows the
processor and system to be debugged at full speed without the need for costly in-circuit
emulators. The deb ug unit in the MCF5307 is a compatible upgrade to the MCF52xx debug
module with added flexibility in the breakpoint registers and a new command to view the
program counter (PC).
The on-chip breakpoint resources include a total of 6 programmable registers—a set of
address registers (with two 32-bit registers), a set of data registers (with a 32-bit data
register plus a 32-bit data mask re gister), and one 32-bit PC register plus a 32-bit PC mask
register. These registers can be accessed through the dedicated debug serial communication
channel or from the processor’s supervisor mode programming model. The breakpoint
registers can be configured to generate triggers by combining the address, data, and PC
conditions in a variety of single or dual-level definitions. The trigger event can be
programmed to generate a processor halt or initiate a debug interrupt exception.
The MCF5307’s new interrupt servicing options during emulator mode allow real-time
critical interrupt service routines to be serviced while processing a debug interrupt event,
thereby ensuring that the system continues to operate even during debugging.
To support program trace, the Version 3 debug module provides processor status (PST[3:0])
and debug data (DDATA[3:0]) ports. These buses and the PSTCLK output provide
execution status, captured operand data, and branch target addresses defining processor
activity at the CPU’s clock rate.
1.3.9 PLL Module
The MCF5307 PLL module is shown in Figure 1-3.
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1-12 MCF5307 User’s Manual
Programming Model, Addressing Modes, and Instruction Set
Figure 1-3. PLL Module
The PLL module’s three modes of operation are described as follows.
• Reset mode—When RSTI is asserted, the PLL enters reset mode. At reset, the PLL
asserts RSTO from the MCF5307. The core:bus frequency ratio and other MCF5307
configuration information are sampled during reset.
• Normal mode—In normal mode, the input frequency programmed at reset is
clock-multiplied to provide the processor clock (PCLK).
• Reduced-power mode—In reduced-power mode, the PCLK is disabled by executing
a sequence that includes programming a control bit in the system configuration
register (SCR) and then executing the STOP instruction. Register contents are
retained in reduced-power mode, so the system can be reenabled quickly when an
unmasked interrupt or reset is detected.
1.4 Programming Model, Addressing Modes, and
Instruction Set
The ColdFire programming model has two pri vile ge le vels—supervisor and user. The S bit
in the status register (SR) indicates the privilege level. The processor identifies a logical
address that differentiates between supervisor and user modes by accessing either the
supervisor or user address space.
• User mode—When the processor is in user mode (SR[S] = 0), only a subset of
registers can be accessed, and pri vileged instructions cannot be e xecuted. Typically ,
most application processing occurs in user mode. User mode is usually entered by
executing a return from exception instruction (RTE, assuming the value of SR[S]
saved on the stack is 0) or a MOVE, SR instruction (assuming SR[S] is 0).
• Supervisor mode—This mode protects system resources from uncontrolled access
by users. In supervisor mode, complete access is provided to all registers and the
entire ColdFire instruction set. Typically, system programmers use the supervisor
programming model to implement operating system functions and provide I/O
PLL
CLKIN
RSTI
Divide BCLKO
DIVIDE[1:0]
FREQ[1:0]
RSTO
PSTCLK
PCLK
CLKIN X 4 by 2 Divide by 2,
3, or 4
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Chapter 1. Overview 1-13
Programming Model, Addressing Modes, and Instruction Set
control. The supervisor programming model provides access to the same registers as
the user model, plus additional registers for configuring on-chip system resources,
as described in Section 1.4.3, “Supervisor Registers.”
Exceptions (including interrupts) are handled in supervisor mode.
1.4.1 Programming Model
Figure 1-4 shows the MCF5307 programming model.
Figure 1-4. ColdFire MCF5307 Programming Model
31 0 D0 Data registers
D1
D2
D3
D4
D5
D6
D7
31 0 A0 Address registers
A1
A2
A3
A4
A5
A6
A7 Stack pointer
PC Program counter
CCR Condition code register
31 0 MACSR MAC status register
ACC MAC accumulator
MASK MAC mask register
15
31 19 (CCR) SR Status register
Must be zeros VBR Vector base register
CACR Cache control register
ACR0 Access control register 0
ACR1 Access control register 1
RAMBAR RAM base address register
MBAR Module base address register
User Registers
Supervisor
Registers
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1-14 MCF5307 User’s Manual
Programming Model, Addressing Modes, and Instruction Set
1.4.2 User Registers
The user programming model is shown in Figure 1-4 and summarized in Table 1-1.
1.4.3 Supervisor Registers
Table 1-2 summarizes the MCF5307 supervisor-level registers.
Table 1-1. User-Level Registers
Register Description
Data registers
(D0–D7) These 32-bit registers are for bit, byte, word, and longword operands. They can also be used as
index registers.
Address registers
(A0–A7) These 32-bit registers serve as software stack pointers, index registers, or base address
registers. The base address registers can be used for word and longword operations. A7
functions as a hardware stac k pointer during stacking for subroutine calls and e xception handling.
Program counter
(PC) Contains the address of the instruction currently being executed by the MCF5307 processor
Condition code
register (CCR) The CCR is the lo wer b yte of the SR. It contains indicator flags that reflect the result of a previous
operation and are used for conditional instruction execution.
MAC status
register (MACSR) Defines the operating configuration of the MAC unit and contains indicator flags from the results
of MAC instructions.
Accumulator
(ACC) General-purpose register used to accumulate the results of MAC operations
Mask register
(MASK) General-purpose register provides an optional address mask for MAC instructions that fetch
operands from memory. It is useful in the implementation of circular queues in operand memory.
Table 1-2. Supervisor-Level Registers
Register Description
Status register (SR) The upper byte of the SR pro vides interrupt information in addition to a variety of mode indicators
signaling the operating state of the ColdFire processor. The lower byte of the SR is the CCR, as
shown in Figure 1-4.
Vector base register
(VBR) Defines the upper 12 bits of the base address of the exception v ector tab le used during exception
processing. The low-order 20 bits are forced to zero, locating the vector table on 0-modulo-1
Mbyte address.
Cache configuration
register (CACR) Defines the operating modes of the Version 4 cache memories. Control fields configuring the
instruction, data, and branch cache are provided by this register, along with the default attributes
for the 4-Gbyte address space.
Access control
registers (ACR0/1) Define address ranges and attributes associated with v arious memory regions within the 4-Gbyte
address space. Each ACR defines the location of a given memory region and assigns attributes
such as write-protection and cache mode (copyback, write-through, cacheability). Additionally,
CACR fields assign default attributes to the instruction and data memory spaces.
RAM base address
register (RAMBAR) Pro vide the logical base address f or the 4-Kbyte SRAM module and define attributes and access
types allowed for the SRAM.
Module base address
register (MBAR) Defines the logical base address for the memory-mapped space containing the control registers
for the on-chip peripherals.
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Chapter 1. Overview 1-15
Programming Model, Addressing Modes, and Instruction Set
1.4.4 Instruction Set
The ColdFire instruction set supports high-level languages and is optimized for those
instructions most commonly generated by compilers in embedded applications. Table 2-8
provides an alphabetized listing of the ColdFire instruction set opcodes, supported
operation sizes, and assembler syntax. For two-operand instructions, the first operand is
generally the source operand and the second is the destination.
Because the ColdFire architecture provides an upgrade path for 68K customers, its
instruction set supports most of the common 68K opcodes. A majority of the instructions
are binary compatible or optimized 68K opcodes. This feature, when coupled with the code
conversion tools from third-party developers, generally minimizes software porting issues
for customers with 68K applications.
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1-16 MCF5307 User’s Manual
Programming Model, Addressing Modes, and Instruction Set
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Part I. MCF5307 Processor Core I-xvii
Pa rt I
MCF5307 Processor Core
Intended Audience
Part I is intended for system designers who need a general understanding of the
functionality supported by the MCF5307. It also describes the operation of the MCF5307
Contents
• Chapter 2, “ColdFire Core, ” provides an o vervie w of the microprocessor core of the
MCF5307. The chapter begins with a description of enhancements from the V2
ColdFire core, and then fully describes the V3 programming model as it is
implemented on the MCF5307. It also includes a full description of exception
handling, data formats, an instruction set summary, and a table of instruction
timings.
• Chapter 3, “Hardware Multiply/Accumulate (MA C) Unit,” describes the MCF5307
multiply/accumulate unit, which executes integer multiply, multiply-accumulate,
and miscellaneous register instructions. The MAC is integrated into the operand
execution pipeline (OEP).
• Chapter 4, “Local Memory.” This chapter describes the MCF5307 implementation
of the ColdFire V3 local memory specification. It consists of the two following
major sections.
— Section 4.2, “SRAM Overview,” describes the MCF5307 on-chip static RAM
(SRAM) implementation. It covers general operations, configuration, and
initialization. It also provides information and examples showing how to
minimize power consumption when using the SRAM.
— Section 4.7, “Cache Overview,” describes the MCF5307 cache implementation,
including organization, configuration, and coherency. It describes cache
operations and how the cache interacts with other memory structures.
• Chapter 5, “Debug Support,” describes the Revision C enhanced hardware debug
support in the MCF5307. This revision of the ColdFire debug architecture
encompasses earlier revisions.
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I-xviii MCF5307 User’s Manual
Suggested Reading
The following literature may be helpful with respect to the topics in Part I:
•ColdFire Programmers Reference Manual, R1.0 (MCF5200PRM/AD)
•Using Microprocessors and Microcomputers: The Motorola Family, William C.
Wray, Ross Bannatyne, Joseph D. Greenfield
Acronyms and Abbreviations
Table I-i contains acronyms and abbreviations are used in Part I.
Table I-i. Acronyms and Abbreviated Terms
Term Meaning
ADC Analog-to-digital conversion
ALU Arithmetic logic unit
BDM Background debug mode
BIST Built-in self test
BSDL Boundary-scan description language
CODEC Code/decode
DAC Digital-to-analog conversion
DMA Direct memory access
DSP Digital signal processing
EA Effective address
EDO Extended data output (DRAM)
FIFO First-in, first-out
GPIO
I2C Inter-integrated circuit
IEEE Institute for Electrical and Electronics Engineers
IFP Instruction fetch pipeline
IPL Interrupt priority level
JEDEC Joint Electron Device Engineering Council
JTAG Joint Test Action Group
LIFO Last-in, first-out
LRU Least recently used
LSB Least-significant byte
lsb Least-significant bit
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Part I. MCF5307 Processor Core I-xix
MAC Multiple accumulate unit
MBAR Memory base address register
MSB Most-significant byte
msb Most-significant bit
Mux Multiplex
NOP No operation
OEP Operand execution pipeline
PC Program counter
PCLK Processor clock
PLL Phase-locked loop
PLRU Pseudo least recently used
POR Power-on reset
PQFP Plastic quad flat pack
RISC Reduced instruction set computing
Rx Receive
SIM System integration module
SOF Start of frame
TAP Test access port
TTL Transistor-to-transistor logic
Tx Transmit
UART Universal asynchronous/synchronous receiver transmitter
Table I-i. Acronyms and Abbreviated Terms (Continued)
Term Meaning
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I-xx MCF5307 User’s Manual
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Chapter 2. ColdFire Core 2-21
Chapter 2
ColdFire Core
This chapter provides an overview of the microprocessor core of the MCF5307. The
chapter begins with a description of enhancements from the Version 2 (V2) ColdFire core,
and then fully describes the V3 programming model as it is implemented on the MCF5307.
It also includes a full description of exception handling, data formats, an instruction set
summary, and a table of instruction timings.
2.1 Features and Enhancements
The MCF5307 is the first standard product to contain a Version 3 ColdFire microprocessor
core. To reach higher levels of frequency and performance, numerous enhancements were
made to the V2 architecture. Most notable are a deeper instruction pipeline, branch
acceleration, and a unified cache, which together provide 75 (Dhrystone 2.1) MIPS at 90
MHz.
The MCF5307 core design emphasizes performance, and backward compatibility
represents the next step on the ColdFire performance roadmap.
The following list summarizes MCF5307 features:
• Variable-length RISC, clock-multiplied Version 3 microprocessor core
• Two independent, decoupled pipelines—four-stage instruction fetch pipeline (IFP)
and two-stage operand execution pipeline (OEP)
• Eight-instruction FIFO buffer provides decoupling between the pipelines
• Branch prediction mechanisms for accelerating program execution
• 32-bit internal address bus supporting 4 Gbytes of linear address space
• 32-bit data bus
• 16 user-accessible, 32-bit-wide, general-purpose registers
• Supervisor/user modes for system protection
• Vector base register to relocate exception-vector table
• Optimized for high-level language constructs
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2-22 MCF5307 User’s Manual
Features and Enhancements
2.1.1 Clock-Multiplied Microprocessor Core
The MCF5307 incorporates a clock-multiplying phase-locked loop (PLL). Increasing the
internal speed of the core also allows higher performance while providing the system
designer with an easy-to-use lower speed system interface.
The frequency of the processor complex can be 2x, 3x, or 4x the external bus speed.
The processor, cache, integrated SRAM, and misalignment module operate at the higher
speed clock (PCLK); other system integrated modules operate at the speed of the b us clock
(BCLK O). When combined with the enhanced pipeline structure of the Version 3 ColdFire
core, the processor and its local memories provide a high level of performance for today’s
demanding embedded applications.
PCLK can be disabled to minimize dissipation when a low-power mode is entered. This is
described in Section 7.2.3, “Reduced-Power Mode.”
2.1.2 Enhanced Pipelines
The IFP prefetches instructions. The OEP decodes instructions, fetches required operands,
then executes the specified function. The two independent, decoupled pipeline structures
maximize performance while minimizing core size. Pipeline stages are shown in Figure 2-1
and are summarized as follows:
• Four-stage IFP (plus optional instruction buffer stage)
— Instruction address generation (IAG) calculates the next prefetch address.
— Instruction fetch cycle 1 (IC1) initiates prefetch on the processor’s local
instruction bus.
— Instruction fetch cycle 2 (IC2) completes prefetch on the processor’s instruction
local bus.
— Instruction early decode (IED) generates time-critical decode signals needed for
the OEP.
— Instruction buffer (IB) optional stage uses FIFO queue to minimize effects of
fetch latency.
• Two-stage OEP
— Decode, select/operand fetch (DSOC) decodes the instruction and selects the
required components for the effective address calculation, or the operand fetch
cycle.
— Address generation/execute (AGEX) Calculates the oeprand address, or
performs the execution of the instruction.
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Chapter 2. ColdFire Core 2-23
Features and Enhancements
Figure 2-1. ColdFire Enhanced Pipeline
2.1.2.1 Instruction Fetch Pipeline (IFP)
Because the fetch and execution pipelines are decoupled by an eight-instruction FIFO
buffer, the IFP can prefetch instructions before the OEP needs them, minimizing stalls.
2.1.2.1.1 Branch Acceleration
Because the IFP and the OEP are decoupled by the instruction buffer, the increased depth
of the IFP is generally hidden from the OEP’s instruction execution. The one exception is
change-of-flo w instructions such as unconditional branches or jumps, subroutine calls, and
taken conditional branches. To minimize the effects of the increased depth of the IFP, the
prefetched instruction stream is monitored for change-of-flo w opcodes. When certain types
of change-of-flo w instructions are detected, the target instruction address is calculated, and
fetching immediately begins in the target stream.
Instruction
Instruction
FIFO
Decode & Select,
Address
Data[31:0]
Instruction
Fetch Cycle 2
Instruction
IAG
IC1
IC2
IED
IB
DSOC
AGEX
Address [31:0]
Instruction Buffer
Address
Generation
Fetch Cycle 1
Early Decode
Generation,
Execute
Operand Fetch
Operand
Execution
Pipeline
Instruction
Fetch
Pipeline
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2-24 MCF5307 User’s Manual
Features and Enhancements
For e xample, if an unconditional BRA instruction is detected, the IED calculates the tar get
of the BRA instruction, and the IAG immediately begins fetching at the target address.
Because of the decoupled nature of the two pipelines, the target instruction is available to
the OEP immediately after the BRA instruction, giving it a single-cycle execution time.
The acceleration logic uses a static prediction algorithm when processing conditional
branch (Bcc) instructions. The default scheme is forward Bcc instructions are predicted as
not-taken, while backward Bcc instructions are predicted as tak en. A user-mode control bit,
CCR[7], allows users to dynamically alter the prediction algorithm for forward Bcc
instructions. See Section 2.2.1.5, “Condition Code Register (CCR).
2.1.2.2 Operand Execution Pipeline (OEP)
The OEP is a two-stage pipeline featuring a traditional RISC datapath with a register file
feeding an arithmetic/logic unit. For simple register-to-register instructions, the first stage
of the OEP performs the instruction decode and fetching of the required register operands
(OC), while the actual instruction execution is performed in the second stage (EX).
For memory-to-register instructions, the instruction is effectively staged through the OEP
twice in the following way:
• The instruction is decoded and the components of the operand address are selected
(DS).
• The operand address is generated using the “execute engine” (AG).
• The memory operand is fetched while any register operand is simultaneously
fetched (OC).
• The instruction is executed (EX).
For register-to-memory operations, the stage functions (DS/OC, AG/EX) are effectively
performed simultaneously allowing single-cycle execution. For read-modify-write
instructions, the pipeline ef fectively combines a memory-to-register operation with a store
operation.
2.1.2.2.1 Illegal Opcode Handling
To aid in conversion from M68000 code, every 16-bit operation word is decoded to ensure
that each instruction is valid. If the processor attempts execution of an illegal or
unsupported instruction, an illegal instruction exception (vector 4) is taken.
2.1.2.2.2 Hardware Multiply/Accumulate (MAC) Unit
The MAC is an optional unit in Version 3 that provides hardware support for a limited set
of digital signal processing (DSP) operations used in embedded code, while supporting the
integer multiply instructions in the ColdFire microprocessor family. The MAC features a
three-stage ex ecution pipeline, optimized for 16 x 16 multiplies. It is tightly coupled to the
OEP, which can issue a 16 x 16 multiply with a 32-bit accumulation plus fetch a 32-bit
operand in a single cycle. A 32 x 32 multiply with a 32-bit accumulation requires three
cycles before the next instruction can be issued.
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Chapter 2. ColdFire Core 2-25
Features and Enhancements
Figure 2-2 shows basic functionality of the MAC. A full set of instructions are provided for
signed and unsigned integers plus signed, fixed-point fractional input operands.
Figure 2-2. ColdFire Multiply-Accumulate Functionality Diagram
The MAC provides functionality in the following three related areas, which are described
in detail in Chapter 3, “Hardware Multiply/Accumulate (MAC) Unit.”
• Signed and unsigned integer multiplies
• Multiply-accumulate operations with signed and unsigned fractional operands
• Miscellaneous register operations
2.1.2.2.3 Hardware Divide Unit
The hardware divide unit performs the following integer division operations:
• 32-bit operand/16-bit operand producing a 16-bit quotient and a 16-bit remainder
• 32-bit operand/32-bit operand producing a 32-bit quotient
• 32-bit operand/32-bit operand producing a 32-bit remainder
2.1.3 Debug Module Enhancements
The ColdFire processor core debug interface supports system integration in conjunction
with low-cost development tools. Real-time trace and debug information can be accessed
through a standard interface, which allo ws the processor and system to be debugged at full
speed without costly in-circuit emulators. The MCF5307 debug unit is a compatible
upgrade to the MCF52xx debug module with enhancements that include:
• A new command to obtain the value of the program counter (PC)
• Allowing ORing of terms in creating breakpoints
• Increased flexibility of the breakpoint registers
X
+/-
Operand Y Operand X
Shift 0,1,-1
Accumulator
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2-26 MCF5307 User’s Manual
Programming Model
On-chip breakpoint resources include the following:
• Configuration/status register (CSR)
• Background debug mode (BDM) address attributes register (BAAR)
• Bus attributes and mask register (AATR)
• Breakpoint registers. These can be used to define triggers combining address, data,
and PC conditions in single- or dual-level definitions. They include the following:
— PC breakpoint register (PBR)
— PC breakpoint mask register (PBMR)
— Data operand address breakpoint registers (ABHR/ABLR)
— Data breakpoint register (DBR)
• Data breakpoint mask register (DBMR)
• T rigger definition register (TDR) can be programmed to generate a processor halt or
initiate a debug interrupt exception.
These registers can be accessed through the dedicated debug serial communication channel,
or from the processor’s supervisor programming model, using the WDEBUG instruction.
The enhancements of the Revision B debug specification are fully backward-compatible
with the A revision. For more information, see Chapter 5, “Debug Support.”
2.2 Programming Model
The MCF5307 programming model consists of three instruction and register groups—user ,
MAC (also user-mode), and supervisor, shown in Figure 2-2. User mode programs are
restricted to user and MAC instructions and programming models. Supervisor-mode
system software can reference all user-mode and MAC instructions and registers and
additional supervisor instructions and control registers. The user or supervisor
programming model is selected based on SR[S]. The following sections describe the
registers in the user, MAC, and supervisor programming models.
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Chapter 2. ColdFire Core 2-27
Programming Model
Figure 2-3. ColdFire Programming Model
2.2.1 User Programming Model
As Figure 2-3 shows, the user programming model consists of the following registers:
• 16 general-purpose 32-bit registers, D0–D7 and A0–A7
• 32-bit program counter
• 8-bit condition code register
2.2.1.1 Data Registers (D0–D7)
Registers D0–D7 are used as data re gisters for bit, byte (8-bit), word (16-bit), and longword
(32-bit) operations. They may also be used as index registers.
2.2.1.2 Address Registers (A0–A6)
The address registers (A0–A6) can be used as software stack pointers, index registers, or
base address registers and may be used for word and longword operations.
31 0 D0 Data registers
D1
D2
D3
D4
D5
D6
D7
31 0 A0 Address registers
A1
A2
A3
A4
A5
A6
A7 Stack pointer
PC Program counter
CCR Condition code register
31 0 MACSR MAC status register
ACC MAC accumulator
MASK MAC mask register
15
31 19 (CCR) SR Status register
Must be zeros VBR Vector base register
CACR Cache control register
ACR0 Access control register 0
ACR1 Access control register 1
RAMBAR RAM base address register
MBAR Module base address register
User Registers
Supervisor
Registers
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2-28 MCF5307 User’s Manual
Programming Model
2.2.1.3 Stack Pointer (A7, SP)
The processor core supports a single hardware stack pointer (A7) used during stacking for
subroutine calls, returns, and exception handling. The stack pointer is implicitly referenced
by certain operations and can be explicitly referenced by any instruction specifying an
address register. The initial value of A7 is loaded from the reset exception vector, address
0x0000. The same re gister is used for user and supervisor modes, and may be used for word
and longword operations.
A subroutine call saves the program counter (PC) on the stack and the return restores the
PC from the stack. The PC and the status register (SR) are saved on the stack during
exception and interrupt processing. The return from exception instruction restores SR and
PC values from the stack.
2.2.1.4 Program Counter (PC)
The PC holds the address of the executing instruction. For sequential instructions, the
processor automatically increments PC. When program flow changes, the PC is updated
with the target instruction. For some instructions, the PC specifies the base address for
PC-relative operand addressing modes.
2.2.1.5 Condition Code Register (CCR)
The CCR, Figure 2-4, occupies SR[7–0], as shown in Figure 2-3. CCR[4–0] are indicator
flags based on results generated by arithmetic operations.
Table 2-1 describes the CCR fieldsMAC Programming ModelFigure 2-3 shows the registers in the MAC portion of the user programming model. These registers are described as follows:Accumulator (ACC)—This 32-bit, read/write, general-purpose register is used to accumulate the results of MAC operations.
76543210
Field P — X N Z V C
Reset 0 00 Undefined
R/W R/W R R/W R/W R/W R/W R/W
Table 2-1. CCR Field Descriptions
Bits Name Description
7 P Branch prediction bit. Alters the static prediction algorithm used b y the branch acceleration logic in the
IFP on forward conditional branches.
0 Predicted as not-taken.
1 Predicted as taken.
6–5 — Reserved, should be cleared.
4 X Extend condition code bit. Assigned the value of the carry bit for arithmetic operations; otherwise not
affected or set to a specified result. Also used as an input operand for multiple-precision arithmetic.
3 N Negative condition code bit. Set if the msb of the result is set; otherwise cleared.
2 Z Zero condition code bit. Set if the result equals zero; otherwise cleared.
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Chapter 2. ColdFire Core 2-29
Programming Model
• Mask register (MASK)—This 16-bit general-purpose register provides an optional
address mask for MA C instructions that fetch operands from memory. It is useful in
the implementation of circular queues in operand memory.
• MAC status register (MACSR)—This 8-bit register defines configuration of the
MAC unit and contains indicator flags affected by MAC instructions. Unless noted
otherwise, MACSR indicator flag settings are based on the final result, that is, the
result of the final operation involving the product and accumulator.
2.2.2 Supervisor Programming Model
The MCF5307 supervisor programming model is shown in Figure 2-3. Typically, system
programmers use the supervisor programming model to implement operating system
functions and provide memory and I/O control. The supervisor programming model
provides access to the user registers and additional supervisor registers, which include the
upper byte of the status register (SR), the vector base register (VBR), and registers for
configuring attributes of the address space connected to the Version 3 processor core. Most
supervisor-mode registers are accessed by using the MOVEC instruction with the control
register definitions in Table 2-2.
2.2.2.1 Status Register (SR)
The SR stores the processor status, the interrupt priority mask, and other control bits.
Supervisor software can read or write the entire SR; user software can read or write only
SR[7–0], described in Section 2.2.1.5, “Condition Code Register (CCR).” The control bits
indicate processor states—trace mode (T), supervisor or user mode (S), and master or
interrupt state (M). SR is set to 0x27xx after reset.
1 V Overflow condition code bit. Set if an arithmetic overflow occurs, implying that the result cannot be
represented in the operand size; otherwise cleared.
0 C Carry condition code bit. Set if a carry-out of the data operand msb occurs for an addition or if a
borrow occurs in a subtraction; otherwise cleared.
Table 2-2. MOVEC Register Map
Rc[11–0] Register Definition
0x002 Cache control register (CACR)
0x004 Access control register 0 (ACR0)
0x005 Access control register 1 (ACR1)
0x801 Vector base register (VBR)
0xC04 RAM base address register (RAMBAR)
0xC0F Module base address register (MBAR)
Table 2-1. CCR Field Descriptions (Continued)
Bits Name Description
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2-30 MCF5307 User’s Manual
Programming Model
Table 2-3 describes SR fields.
2.2.2.2 Vector Base Register (VBR)
The VBR holds the base address of the exception v ector table in memory . The displacement
of an exception vector is added to the value in this register to access the vector table.
VBR[19–0] are not implemented and are assumed to be zero, forcing the vector table to be
aligned on a 0-modulo-1-Mbyte boundary.
2.2.2.3 Cache Control Register (CACR)
The CACR controls operation of both the instruction and data cache memory. It includes
bits for enabling, freezing, and in v alidating cache contents. It also includes bits for defining
the default cache mode and write-protect fields. See Section 4.10.1, “Cache Control
Register (CACR).”
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
System byte Condition code register (CCR)
Field T — S M — I P — X N Z V C
Reset 00100 111 0 00 —————
R/W R/W R R/W R/W R R/W R/W R R/W R/W R/W R/W R/W
Figure 2-5. Status Register (SR)
Table 2-3. Status Field Descriptions
Bits Name Description
15 T Trace enable. When T is set, the processor performs a trace exception after every instruction.
13 S Supervisor/user state. Indicates whether the processor is in supervisor or user mode
0 User mode
1 Supervisor mode
12 M Master/interrupt state. Cleared by an interrupt exception. It can be set by software during execution
of the RTE or move to SR instructions so the OS can emulate an interrupt stack pointer.
10–8 I Interrupt priority mask. Defines the current interrupt priority. Interrupt requests are inhibited for all
priority levels less than or equal to the current priority, except the edge-sensitive level-7 request,
which cannot be masked.
7–0 CCR Condition code register. See Table 2-1.
313029282726252423222120191817161514131211109876543210
Field Exception vector table base address —
Reset 0000_0000_0000_0000_0000_0000_0000_0000
R/W Written from a BDM serial command or from the CPU using the MO VEC instruction. VBR can be read from
the debug module only. The upper 12 bits are returned, the low-order 20 bits are undefined.
Rc[11–0] 0x801
Figure 2-6. Vector Base Register (VBR)
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Chapter 2. ColdFire Core 2-31
Integer Data Formats
2.2.2.4 Access Control Registers (ACR0–ACR1)
The access control registers (ACR0–ACR1) define attributes for tw o user-defined memory
regions. Attrib utes include definition of cache mode, write protect and buf fer write enables.
See Section 4.10.2, “Access Control Registers (ACR0–ACR1).”
2.2.2.5 RAM Base Address Register (RAMBAR)
The RAMB AR register determines the base address location of the internal SRAM module
and indicates the types of references mapped to it. The RAMB AR includes a base address,
write-protect bit, address space mask bits, and an enable. The RAM base address must be
aligned on a 0-modulo-32-Kbyte boundary. See Section 4.4.1, “SRAM Base Address
Register (RAMBAR).”
2.2.2.6 Module Base Address Register (MBAR)
The module base address register (MBAR) defines the logical base address for the
memory-mapped space containing the control registers for the on-chip peripherals. See
Section 6.2.2, “Module Base Address Register (MBAR).”
2.3 Integer Data Formats
Table 2-4 lists the integer operand data formats. Integer operands can reside in registers,
memory, or instructions. The operand size for each instruction is either explicitly encoded
in the instruction or implicitly defined by the instruction operation.
2.4 Organization of Data in Registers
The following sections describe data organization within the data, address, and control
registers.
2.4.1 Organization of Integer Data Formats in Registers
Figure 2-7 shows the integer format for data registers. Each integer data register is 32 bits
wide. Byte and word operands occupy the lower 8- and 16-bit portions of integer data
registers, respectively. Longword operands occupy the entire 32 bits of integer data
registers. A data register that is either a source or destination operand only uses or changes
the appropriate lower 8 or 16 bits in byte or word operations, respectively. The remaining
Table 2-4. Integer Data Formats
Operand Data Format Size
Bit 1 bit
Byte integer 8 bits
Word integer 16 bits
Longword integer 32 bits
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2-32 MCF5307 User’s Manual
Organization of Data in Registers
high-order portion does not change. The least significant bit (lsb) of all inte ger sizes is zero,
the most-significant bit (msb) of a longword integer is 31, the msb of a word integer is 15,
and the msb of a byte integer is 7.
The instruction set encodings do not allow the use of address registers for byte-sized
operands. When an address register is a source operand, either the low-order word or the
entire longword operand is used, depending on the operation size. Word-length source
operands are sign-extended to 32 bits and then used in the operation with anaddress re gister
destination. When an address register is a destination, the entire register is affected,
regardless of the operation size. Figure 2-8 shows integer formats for address registers.
The size of control registers varies according to function. Some have undefined bits
reserved for future definition by Motorola. Those particular bits read as zeros and must be
written as zeros for future compatibility.
All operations to the SR and CCR are word-size operations. For all CCR operations, the
upper byte is read as all zeros and is ignored when written, regardless of privilege mode.
2.4.2 Organization of Integer Data Formats in Memory
All ColdFire processors use a big-endian addressing scheme. The byte-addressable
organization of memory allows lower addresses to correspond to higher order bytes. The
address N of a longword data item corresponds to the address of the high-order word. The
lower order word is located at address N + 2. The address N of a word data item corresponds
to the address of the high-order byte. The lo wer order byte is located at address N + 1. This
31 30 1 0
msb lsb Bit (0 ≤ bit number ≤ 31)
31 7 0
Not used msb Low order byte lsb Byte (8 bits)
31 15 0
Not used msb Lower order word lsb Word (16 bits)
31 0
msb Longword lsb Longword (32 bits)
Figure 2-7. Organization of Integer Data Formats in Data Registers
31 16 15 0
Sign-Extended 16-Bit Address Operand
31 0
Full 32-Bit Address Operand
Figure 2-8. Organization of Integer Data Formats in Address Registers
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Chapter 2. ColdFire Core 2-33
Addressing Mode Summary
organization is shown in Figure 2-9.
2.5 Addressing Mode Summary
Addressing modes are categorized by how they are used. Data addressing modes refer to
data operands. Memory addressing modes refer to memory operands. Alterable addressing
modes refer to alterable (writable) data operands. Control addressing modes refer to
memory operands without an associated size.
These categories sometimes combine to form more restrictive categories. Two combined
classifications are alterable memory (both alterable and memory) and data alterable (both
alterable and data). Twelve of the most commonly used effective addressing modes from
the M68000 Family are available on ColdFire microprocessors. Table 2-5 summarizes
these modes and their categories;
31 23 15 7 0
Longword 0x0000_0000
Word 0x0000_0000 Word 0x0000_0002
Byte 0x0000_0000 Byte 0x0000_0001 Byte 0x0000_0002 Byte 0x0000_0003
Longword 0x0000_0004
Word 0x0000_0004 Word 0x0000_0006
Byte 0x0000_0004 Byte 0x0000_0005 Byte 0x0000_0006 Byte 0x0000_0007
.
.
.
Longword 0xFFFF_FFFC
Word 0xFFFF_FFFC Word 0xFFFF_FFFE
Byte 0xFFFF_FFFC Byte 0xFFFF_FFFD Byte 0xFFFF_FFFE Byte 0xFFFF_FFFF
Figure 2-9. Memory Operand Addressing
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2-34 MCF5307 User’s Manual
Instruction Set Summary
2.6 Instruction Set Summary
The ColdFire instruction set is a simplified version of the M68000 instruction set. The
removed instructions include BCD, bit field, logical rotate, decrement and branch, and
integer multiply with a 64-bit result. Nine new MAC instructions have been added.
Table 2-6 lists notational conventions used throughout this manual.
Table 2-5. ColdFire Effective Addressing Modes
Addressing Modes Syntax Mode
Field Reg.
Field
Category
Data Memory Control Alterable
Register direct
Data
Address Dn
An 000
001 reg. no.
reg. no. X
——
——
—X
X
Register indirect
Address
Address with
Postincrement
Address with
Predecrement
Address with
Displacement
(An)
(An)+
–(An)
(d16, An)
010
011
100
101
reg. no.
reg. no.
reg. no.
reg. no.
X
X
X
X
X
X
X
X
X
—
—
X
X
X
X
X
Address register indirect with
index
8-bit displacement (d8, An,
Xi) 110 reg. no. X X X X
Program counter indirect
with displacement (d16, PC) 111 010 X X X —
Program counter indirect
with index
8-bit displacement (d8, PC,
Xi) 111 011 X X X —
Absolute data addressing
Short
Long (xxx).W
(xxx).L 111
111 000
001 X
XX
XX
X—
—
Immediate #<xxx> 111 100 X X — —
Table 2-6. Notational Conventions
Instruction Operand Syntax
Opcode Wildcard
cc Logical condition (example: NE for not equal)
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Chapter 2. ColdFire Core 2-35
Instruction Set Summary
Register Specifications
An Any address register n (example: A3 is address register 3)
Ay,Ax Source and destination address registers, respectively
Dn Any data register n (example: D5 is data register 5)
Dy,Dx Source and destination data registers, respectively
Rc Any control register (example VBR is the vector base register)
Rm MAC registers (ACC, MAC, MASK)
Rn Any address or data register
Rw Destination register w (used for MAC instructions only)
Ry,Rx Any source and destination registers, respectively
Xi index register i (can be an address or data register: Ai, Di)
Register Names
ACC MAC accumulator register
CCR Condition code register (lower byte of SR)
MACSR MAC status register
MASK MAC mask register
PC Program counter
SR Status register
Port Name
DDATA Debug data port
PST Processor status port
Miscellaneous Operands
#<data> Immediate data following the 16-bit operation word of the instruction
Í Effective address
<ea>y,<ea>x Source and destination effective addresses, respectively
<label> Assembly language program label
<list> List of registers for MOVEM instruction (example: D3–D0)
<shift> Shift operation: shift left (<<), shift right (>>)
<size> Operand data size: byte (B), word (W), longword (L)
uc Unified cache
# <vector> Identifies the 4-bit vector number for trap instructions
identifies an indirect data address referencing memory
<xxx> identifies an absolute address referencing memory
dn Signal displacement value, n bits wide (example: d16 is a 16-bit displacement)
SF Scale factor (x1, x2, x4 for indexed addressing mode, <<1n>> for MAC operations)
Table 2-6. Notational Conventions (Continued)
Instruction Operand Syntax
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2-36 MCF5307 User’s Manual
Instruction Set Summary
Operations
+ Arithmetic addition or postincrement indicator
– Arithmetic subtraction or predecrement indicator
x Arithmetic multiplication
/ Arithmetic division
~ Invert; operand is logically complemented
& Logical AND
| Logical OR
^ Logical exclusive OR
<< Shift left (example: D0 << 3 is shift D0 left 3 bits)
>> Shift right (example: D0 >> 3 is shift D0 right 3 bits)
→Source operand is moved to destination operand
←→ Two operands are exchanged
sign-extended All bits of the upper portion are made equal to the high-order bit of the lower portion
If <condition>
then
<operations>
else
<operations>
Test the condition. If the condition is true, the operations in the then clause are performed. If the
condition is false and the optional else clause is present, the operations in the else claue are
performed. If the condition is false and the else clause is omitted, the instruction performs no
operation. Refer to the Bcc instruction description as an example.
Subfields and Qualifiers
{} Optional operation
() Identifies an indirect address
dnDisplacement value, n-bits wide (example: d16 is a 16-bit displacement)
Address Calculated effective address (pointer)
Bit Bit selection (example: Bit 3 of D0)
lsb Least significant bit (example: lsb of D0)
LSB Least significant byte
LSW Least significant word
msb Most significant bit
MSB Most significant byte
MSW Most significant word
Condition Code Register Bit Names
Table 2-6. Notational Conventions (Continued)
Instruction Operand Syntax
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Chapter 2. ColdFire Core 2-37
Instruction Set Summary
2.6.1 Instruction Set Summary
Table 2-7 lists implemented user-mode instructions by opcode.
P Branch prediction
C Carry
N Negative
V Overflow
X Extend
Z Zero
Table 2-7. User-Mode Instruction Set Summary
Instruction Operand Syntax Operand Size Operation
ADD Dy,<ea>x
<ea>y,Dx .L
.L Source + destination → destination
ADDA <ea>y,Ax .L Source + destination → destination
ADDI #<data>,Dx .L Immediate data + destination → destination
ADDQ #<data>,<ea>x .L Immediate data + destination → destination
ADDX Dy,Dx .L Source + destination + X → destination
AND Dy,<ea>x
<ea>y,Dx .L
.L Source & destination → destination
ANDI #<data>,Dx .L Immediate data & destination → destination
ASL Dy,Dx
#<data>,Dx .L
.L X/C ← (Dx << Dy) ← 0
X/C ← (Dx << #<data>) ← 0
ASR Dy,Dx
#<data>,Dx .L
.L MSB → (Dx >> Dy) → X/C
MSB → (Dx >> #<data>) → X/C
Bcc <label> .B,.W If condition true, then PC + 2 + dn → PC
BCHG Dy,<ea>x
#<data>,<ea-1>x .B,.L
.B,.L ~(<bit number> of destination) → Z,
Bit of destination
BCLR Dy,<ea>x
#<data>,<ea-1>x .B,.L
.B,.L ~(<bit number> of destination) → Z;
0 → bit of destination
BRA <label> .B,.W PC + 2 + dn → PC
BSET Dy,<ea>x
#<data>,<ea-1>x .B,.L
.B,.L ~(<bit number> of destination) → Z;
1→ bit of destination
BSR <label> .B,.W SP – 4 → SP; ne xt sequential PC→ (SP); PC + 2 + dn → PC
BTST Dy,<ea>x
#<data>,<ea-1>x .B,.L
.B,.L ~(<bit number> of destination) → Z
CLR <ea>y,Dx .B,.W,.L 0 → destination
CMP <ea>y,Ax .L Destination – source
CMPA <ea>y,Dx .L Destination – source
Table 2-6. Notational Conventions (Continued)
Instruction Operand Syntax
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Instruction Set Summary
CMPI <ea>y,Dx .L Destination – immediate data
DIVS <ea-1>y,Dx
<ea>y,Dx .W
.L Dx /<ea>y → Dx {16-bit remainder; 16-bit quotient}
Dx /<ea>y → Dx {32-bit quotient}
Signed operation
DIVU <ea-1>y,Dx
Dy,<ea>x .W
.L Dx /<ea>y → Dx {16-bit remainder; 16-bit quotient}
Dx /<ea>y → Dx {32-bit quotient}
Unsigned operation
EOR Dy,<ea>x .L Source ^ destination → destination
EORI #<data>,Dx .L Immediate data ^ destination → destination
EXT #<data>,Dx .B →.W
.W →.L Sign-extended destination → destination
EXTB Dx .B →.L Sign-extended destination → destination
HALT1None Unsized Enter halted state
JMP <ea-3>y Unsized Address of <ea> → PC
JSR <ea-3>y Unsized SP – 4 → SP; next sequential PC → (SP); <ea> → PC
LEA <ea-3>y,Ax .L <ea> → Ax
LINK Ax,#<d16> .W SP – 4 → SP; Ax → (SP); SP → Ax; SP + d16 → SP
LSL Dy,Dx
#<data>,Dx .L
.L X/C ← (Dx << Dy) ← 0
X/C ← (Dx << #<data>) ← 0
LSR Dy,Dx
#<data>,Dx .L
.L 0 → (Dx >> Dy) → X/C
0 → (Dx >> #<data>) → X/C
MAC Ry,RxSF .L + (.W × .W) → .L
.L + (.L × .L) → .L ACC + (Ry × Rx){<< 1 | >> 1} → ACC
ACC + (Ry × Rx){<< 1 | >> 1} → ACC; (<ea>y{&MASK}) →
Rw
MACL Ry,RxSF,<ea-1>y,Rw .L + (.W × .W) → .L, .L
.L + (.L × .L) → .L, .L ACC + (Ry × Rx){<< 1 | >> 1} → ACC
ACC + (Ry × Rx){<< 1 | >> 1} → ACC; (<ea-1>y{&MASK})
→ Rw
MOVE <ea>y,<ea>x .B,.W,.L <ea>y → <ea>x
MO VE from
MAC MASK,Rx
ACC,Rx
MACSR,Rx
.L Rm → Rx
MACSR,CCR .L MACSR → CCR
MOVE to
MAC Ry,ACC
Ry,MACSR
Ry,MASK
.L Ry → Rm
#<data>,ACC
#<data>,MACSR
#<data>,MASK
.L #<data> → Rm
MO VE from
CCR CCR,Dx .W CCR → Dx
MOVE to
CCR Dy,CCR
#<data>,CCR .B Dy → CCR
#<data> → CCR
MOVEA <ea>y,Ax .W,.L → .L Source → destination
Table 2-7. User-Mode Instruction Set Summary (Continued)
Instruction Operand Syntax Operand Size Operation
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Chapter 2. ColdFire Core 2-39
Instruction Set Summary
MOVEM #<list>,<ea-2>x
<ea-2>y,#<list> .L
.L Listed registers → destination
Source → listed registers
MOVEQ #<data>,Dx .B → .L Sign-extended immediate data → destination
MSAC Ry,RxSF .L - (.W × .W) → .L
.L - (.L × .L) → .L ACC – (Ry × Rx){<< 1 | >> 1} → ACC
MSACL Ry,RxSF,<ea-1>y,Rw .L - (.W × .W) → .L, .L
.L - (.L × .L) → .L, .L ACC – (Ry × Rx){<< 1 | >> 1} → ACC;
(<ea-1>y{&MASK}) → Rw
MULS <ea>y,Dx .W X .W → .L
.L X .L → .L Source × destination → destination
Signed operation
MULU <ea>y,Dx .W X .W → .L
.L X .L → .L Source × destination → destination
Unsigned operation
NEG Dx .L 0 – destination → destination
NEGX Dx .L 0 – destination – X → destination
NOP none Unsized Synchronize pipelines; PC + 2 → PC
NOT Dx .L ~ Destination → destination
OR <ea>y,Dx
Dy,<ea>x .L Source | destination → destination
ORI #<data>,Dx .L Immediate data | destination → destination
PEA <ea-3>y .L SP – 4 → SP; Address of <ea> → (SP)
PULSE none Unsized Set PST= 0x4
REMS <ea-1>,Dx .L Dx/<ea>y → Dw {32-bit remainder}
Signed operation
REMU <ea-1>,Dx .L Dx/<ea>y → Dw {32-bit remainder}
Unsigned operation
RTS none Unsized (SP) → PC; SP + 4 → SP
Scc Dx .B If condition true, then 1s destination;
Else 0s → destination
SUB <ea>y,Dx
Dy,<ea>x .L
.L Destination – source → destination
SUBA <ea>y,Ax .L Destination – source → destination
SUBI #<data>,Dx .L Destination – immediate data → destination
SUBQ #<data>,<ea>x .L Destination – immediate data → destination
SUBX Dy,Dx .L Destination – source – X → destination
SWAP Dx .W MSW of Dx ←→ LSW of Dx
TRAP #<vector> Unsized SP – 4 → SP;PC → (SP);
SP – 2 → SP;SR → (SP);
SP – 2 → SP; format → (SP);
Vector address → PC
TRAPF None
#<data> Unsized
.W
.L
PC + 2 → PC
PC + 4 → PC
PC + 6 → PC
Table 2-7. User-Mode Instruction Set Summary (Continued)
Instruction Operand Syntax Operand Size Operation
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2-40 MCF5307 User’s Manual
Instruction Timing
Table 2-8 describes supervisor-mode instructions.
2.7 Instruction Timing
The timing data presented in this section assumes the following:
• The OEP is loaded with the opword and all required extension words at the
beginning of each instruction execution. This implies that the OEP spends no time
waiting for the IFP to supply opwords and/or extension words.
• The OEP experiences no sequence-related pipeline stalls. For the MCF5307, the
most common example of this type of stall involves consecutive store operations,
excluding the MOVEM instruction. For all store operations (except MOVEM),
TST <ea>y .B,.W,.L Set condition codes
UNLK Ax Unsized Ax →SP; (SP) → Ax; SP + 4 → SP
WDDATA <ea>y .B,.W,.L <ea>y →DDATA port
1By default the HALT instruction is a supervisor-mode instruction; however, it can be configured to allow user-mode
execution by setting CSR[UHE].
Table 2-8. Supervisor-Mode Instruction Set Summary
Instruction Operand Syntax Operand Size Operation
CPUSHL (An) Unsized Invalidate instruction cache line
Push and invalidate data cache line
Push data cache line and invalidate (I,D)-cache lines
HALT1
1The HALT instruction can be configured to allow user-mode execution by setting CSR[UHE].
none Unsized Enter halted state
MOVE from SR SR, Dx .W SR → Dx
MOVE to SR Dy,SR
#<data>,SR .W Source → SR
MOVEC Ry,Rc .L Ry → Rc
Rc Register Definition
0x002 Cache control register (CACR)
0x004 Access control register 0 (ACR0)
0x005 Access control register 1 (ACR1)
0x006 Access control register 2 (ACR2)
0x007 Access control register 3 (ACR3)
0x801 Vector base register (VBR)
0xC04 RAM base address register 0 (RAMBAR0)
0xC05 RAM base address register 1 (RAMBAR1)
RTE None Unsized (SP+2) → SR; SP+4 → SP; (SP) → PC; SP + formatfield SP
STOP #<data> .W Immediate data → SR; enter stopped state
WDEBUG <ea-2>y .L <ea-2>y → debug module
Table 2-7. User-Mode Instruction Set Summary (Continued)
Instruction Operand Syntax Operand Size Operation
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Chapter 2. ColdFire Core 2-41
Instruction Timing
certain hardware resources within the processor are marked as “b usy” for two clock
cycles after the final DSOC cycle of the store instruction. If a subsequent store
instruction is encountered within this two-cycle window, it is stalled until the
resource again becomes available. Thus, the maximum pipeline stall involving
consecutive store operations is two cycles.
• The OEP can complete all memory accesses without memory causing any stall
conditions. Thus, timing details in this section assume an infinite zero-wait state
memory attached to the core.
• All operand data accesses are assumed to be aligned on the same byte boundary as
the operand size:
— 16-bit operands aligned on 0-modulo-2 addresses
— 32-bit operands aligned on 0-modulo-4 addresses
Operands that do not meet these guidelines are misaligned. T able 2-9 shows ho w the
core decomposes a misaligned operand reference into a series of aligned accesses.
2.7.1 MOVE Instruction Execution Times
The execution times for the MOVE.{B,W,L} instructions are shown in the next tables.
Table 2-12 shows the timing for the other generic move operations.
NOTE:
For all tables in this chapter, the execution time of any
instruction using the PC-relative effective addressing modes is
equivalent to the time using comparable An-relative mode.
ET with {<ea> = (d16,PC)} equals ET with {<ea> = (d16,An)}
ET with {<ea> = (d8,PC,Xi*SF)} equals ET with {<ea> = (d8,An,Xi*SF)}
The nomenclature “(xxx).wl” refers to both forms of absolute
addressing, (xxx).w and (xxx).l.
Table 2-9. Misaligned Operand References
A[1:0] Size Bus Operations Additional C(R/W) 1
1Each timing entry is presented as C(r/w), described as follows:
C is the number of processor clock cycles , including all applicab le operand f etches and writes, as
well as all internal core cycles required to complete the instruction execution.
r/w is the number of operand reads (r) and writes (w) required by the instruction. An operation
performing a read-modify write function is denoted as (1/1).
x1 Word Byte, Byte 2(1/0) if read
1(0/1) if write
x1 Long Byte, Word, Byte 3(2/0) if read
2(0/2) if write
10 Long Word, Word 2(1/0) if read
1(0/1) if write
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Instruction Timing
Table 2-10 lists execution times for MOVE.{B,W} instructions.
Table 2-11 lists timings for MOVE.L.
Table 2-12 gives execution times for MOVE.L instructions accessing program-visible
registers of the MAC unit, along with other MO VE.L timings. Ex ecution times for mo ving
contents of the ACC or MACSR into a destination location represent the best-case scenario
when the store instruction is executed and there are no load or MAC or MSAC instruction
Table 2-10. Move Byte and Word Execution Times
Source Destination
Rx (Ax) (Ax)+ -(Ax) (d16,Ax) (d8,Ax,Xi*SF) (xxx).wl
Dy 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1)
Ay 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1)
(Ay) 4(1/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1)
(Ay)+ 4(1/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1)
-(Ay) 4(1/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1)
(d16,Ay) 4(1/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) — —
(d8,Ay,Xi*SF) 5(1/0) 5(1/1) 5(1/1) 5(1/1) — — —
(xxx).w 4(1/0) 4(1/1) 4(1/1) 4(1/1) — — —
(xxx).l 4(1/0) 4(1/1) 4(1/1) 4(1/1) — — —
(d16,PC) 4(1/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) — —
(d8,PC,Xi*SF) 5(1/0) 5(1/1) 5(1/1) 5(1/1) — — —
#<xxx> 1(0/0) 2(0/1) 2(0/1) 2(0/1) — — —
Table 2-11. Move Long Execution Times
Source Destination
Rx (Ax) (Ax)+ -(Ax) (d16,Ax) (d8,Ax,Xi*SF) (xxx).wl
Dy 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1)
Ay 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1)
(Ay) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1)
(Ay)+ 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1)
-(Ay) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1)
(d16,Ay) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) — —
(d8,Ay,Xi*SF) 4(1/0) 4(1/1) 4(1/1) 4(1/1) — — —
(xxx).w 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — —
(xxx).l 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — —
(d16,PC) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) — —
(d8,PC,Xi*SF) 4(1/0) 4(1/1) 4(1/1) 4(1/1) — — —
#<xxx> 1(0/0) 2(0/1) 2(0/1) 2(0/1) — — —
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Chapter 2. ColdFire Core 2-43
Instruction Timing
in the MAC execution pipeline.
2.7.2 Execution Timings—One-Operand Instructions
Table 2-13 shows standard timings for single-operand instructions.
2.7.3 Execution Timings—Two-Operand Instructions
Table 2-14 shows standard timings for two-operand instructions.
Table 2-12. MAC Move Execution Times
Opcode Í Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
move.l <ea>,ACC 1(0/0) — — — — — — 1(0/0)
move.l <ea>,MACSR 2(0/0) — — — — — — 2(0/0)
move.l <ea>,MASK 1(0/0) — — — — — — 1(0/0)
move.l ACC,Rx 3(0/0) — — — — — — —
move.l MACSR,CCR 3(0/0) — — — — — — —
move.l MACSR,Rx 3(0/0) — — — — — — —
move.l MASK,Rx 3(0/0) — — — — — — —
Table 2-13. One-Operand Instruction Execution Times
Opcode Í Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #xxx
clr.b Í 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) —
clr.w Í 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) —
clr.l Í 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) —
ext.w Dx 1(0/0) — — — — — — —
ext.l Dx 1(0/0) — — — — — — —
extb.l Dx 1(0/0) — — — — — — —
neg.l Dx 1(0/0) — — — — — — —
negx.l Dx 1(0/0) — — — — — — —
not.l Dx 1(0/0) — — — — — — —
scc Dx 1(0/0) — — — — — — —
swap Dx 1(0/0) — — — — — — —
tst.b Í 1(0/0) 4(1/0) 4(1/0) 4(1/0) 4(1/0) 5(1/0) 4(1/0) 1(0/0)
tst.w Í 1(0/0) 4(1/0) 4(1/0) 4(1/0) 4(1/0) 5(1/0) 4(1/0) 1(0/0)
tst.l Í 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0)
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Instruction Timing
Table 2-14. Two-Operand Instruction Execution Times
Opcode Í Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
add.l <ea>,Rx 1(0/0) 4(1/0) 4(1/0) 4(1/0) 4(1/0) 5(1/0) 4(1/0) 1(0/0)
add.l Dy,<ea> — 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
addi.l #imm,Dx 1(0/0) — — — — — — —
addq.l #imm,<ea> 1(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
addx.l Dy,Dx 1(0/0) — — — — — — —
and.l <ea>,Rx 1(0/0) 4(1/0) 4(1/0) 4(1/0) 4(1/0) 5(1/0) 4(1/0) 1(0/0)
and.l Dy,<ea> — 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
andi.l #imm,Dx 1(0/0) — — — — — — —
asl.l <ea>,Dx 1(0/0) — — — — — — 1(0/0)
asr.l <ea>,Dx 1(0/0) — — — — — — 1(0/0)
bchg Dy,<ea> 2(0/0) 5(1/1) 5(1/1) 5(1/1) 5(1/1) 6(1/1) 5(1/1) —
bchg #imm,<ea> 2(0/0) 5(1/1) 5(1/1) 5(1/1) 5(1/1) — — —
bclr Dy,<ea> 2(0/0) 5(1/1) 5(1/1) 5(1/1) 5(1/1) 6(1/1) 5(1/1) —
bclr #imm,<ea> 2(0/0) 5(1/1) 5(1/1) 5(1/1) 5(1/1) — — —
bset Dy,<ea> 2(0/0) 5(1/1) 5(1/1) 5(1/1) 5(1/1) 6(1/1) 5(1/1) —
bset #imm,<ea> 2(0/0) 5(1/1) 5(1/1) 5(1/1) 5(1/1) — — —
btst Dy,<ea> 1(0/0) 4(1/0) 4(1/0) 4(1/0) 4(1/0) 5(1/0) 4(1/0) —
btst #imm,<ea> 1(0/0) 4(1/0) 4(1/0) 4(1/0) 4(1/0) — — —
cmp.l <ea>,Rx 1(0/0) 4(1/0) 4(1/0) 4(1/0) 4(1/0) 5(1/0) 4(1/0) 1(0/0)
cmpi.l #imm,Dx 1(0/0) — — — — — — —
divs.w <ea>,Dx 20(0/0) 23(1/0) 23(1/0) 23(1/0) 23(1/0) 24(1/0) 23(1/0) 20(0/0)
divu.w <ea>,Dx 20(0/0) 23(1/0) 23(1/0) 23(1/0) 23(1/0) 24(1/0) 23(1/0) 20(0/0)
divs.l <ea>,Dx 35(0/0) 35(1/0) 35(1/0) 35(1/0) 35(1/0) — — —
divu.l <ea>,Dx 35(0/0) 35(1/0) 35(1/0) 35(1/0) 35(1/0) — — —
eor.l Dy,<ea> 1(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
eori.l #imm,Dx 1(0/0) — — — — — — —
lea <ea>,Ax — 1(0/0) — — 1(0/0) 2(0/0) 1(0/0) —
lsl.l <ea>,Dx 1(0/0) — — — — — — 1(0/0)
lsr.l <ea>,Dx 1(0/0) — — — — — — 1(0/0)
mac.w Ry,Rx 1(0/0) — — — — — — —
mac.l Ry,Rx 3(0/0) — — — — — — —
msac.w Ry,Rx 1(0/0) — — — — — — —
msac.l Ry,Rx 3(0/0) — — — — — — —
mac.w Ry,Rx,ea,Rw — 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — —
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Chapter 2. ColdFire Core 2-45
Instruction Timing
2.7.4 Miscellaneous Instruction Execution Times
Table 2-15 lists timings for miscellaneous instructions.
mac.l Ry,Rx,ea,Rw — 5(1/0) 5(1/0) 5(1/0) 5(1/0) — — —
moveq #imm,Dx — — — — — — — 1(0/0)
msac.w Ry,Rx,ea,Rw — 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — —
msac.l Ry,Rx,ea,Rw — 5(1/0) 5(1/0) 5(1/0) 5(1/0) — — —
muls.w <ea>,Dx 3(0/0) 6(1/0) 6(1/0) 6(1/0) 6(1/0) 7(1/0) 6(1/0) 3(0/0)
mulu.w <ea>,Dx 3(0/0) 6(1/0) 6(1/0) 6(1/0) 6(1/0) 7(1/0) 6(1/0) 3(0/0)
muls.l <ea>,Dx 5(0/0) 8(1/0) 8(1/0) 8(1/0) 8(1/0) — — —
mulu.l <ea>,Dx 5(0/0) 8(1/0) 8(1/0) 8(1/0) 8(1/0) — — —
or.l <ea>,Rx 1(0/0) 4(1/0) 4(1/0) 4(1/0) 4(1/0) 5(1/0) 4(1/0) 1(0/0)
or.l Dy,<ea> — 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
or.l #imm,Dx 1(0/0) — — — — — — —
rems.l <ea>,Dx 35(0/0) 35(1/0) 35(1/0) 35(1/0) 35(1/0) — — —
remu.l <ea>,Dx 35(0/0) 35(1/0) 35(1/0) 35(1/0) 35(1/0) — — —
sub.l <ea>,Rx 1(0/0) 4(1/0) 4(1/0) 4(1/0) 4(1/0) 5(1/0) 4(1/0) 1(0/0)
sub.l Dy,<ea> — 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
subi.l #imm,Dx 1(0/0) — — — — — — —
subq.l #imm,<ea> 1(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
subx.l Dy,Dx 1(0/0) — — — — — — —
Table 2-15. Miscellaneous Instruction Execution Times
Opcode Í Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
cpushl (Ax) — 11(0/1) — — — — — —
link.w Ay,#imm 2(0/1) — — — — — — —
move.w CCR,Dx 1(0/0) — — — — — — —
move.w <ea>,CCR 1(0/0) — — — — — — 1(0/0)
move.w SR,Dx 1(0/0) — — — — — — —
move.w <ea>,SR 9(0/0) — — — — — — 9(0/0)1
movec Ry,Rc 11(0/1) — — — — — — —
movem.l 2<ea>,&list — 2+n(n/0) — — 2+n(n/0) — — —
movem.l &list,<ea> — 2+n(0/n) — — 2+n(0/n) — — —
Table 2-14. Two-Operand Instruction Execution Times (Continued)
Opcode Í Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
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Instruction Timing
2.7.5 Branch Instruction Execution Times
Table 2-16 shows general branch instruction timing.
For the conditional branch opcodes (bcc), a static algorithm is used to determine the
prediction state of the branch. This algorithm is:
if bcc is a forward branch && CCR[7] == 0
then the bcc is predicted as not-taken
nop 3(0/0) — — — — — — —
pea Í — 2(0/1) — — 2(0/1) 33(0/1)42(0/1) —
pulse 1(0/0) — — — — — — —
stop #imm — — — — — — — 3(0/0)5
trap #imm — — — — — — — 18(1/2)
trapf 1(0/0) — — — — — — —
trapf.w 1(0/0) — — — — — — —
trapf.l 1(0/0) — — — — — — —
unlk Ax 3(1/0) — — — — — — —
wddata.l Í — 7(1/0) 7(1/0) 7(1/0) 7(1/0) 8(1/0) 7(1/0) —
wdebug.l Í — 10(2/0) — — 10(2/0) — — —
1If a MOVE.W #imm,SR instruction is executed and #imm[13] = 1, the execution time is 1(0/0).
2n is the number of registers moved by the MOVEM opcode.
3PEA execution times are the same for (d16,PC).
4PEA execution times are the same for (d8,PC,Xi*SF).
5The execution time for STOP is the time required until the processor begins sampling continuously for
interrupts.
Table 2-16. General Branch Instruction Execution Times
Opcode Í Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
bra ————1(0/1)1
1Assumes branch acceleration. Depending on the pipeline status, execution times may vary from 1 to 3 cycles.
———
bsr — — — — 1(0/1)1———
jmp Í — 5(0/0) — — 5(0/0) 16(0/0) 1(0/0)1—
jsr Í — 5(0/1) — — 5(0/1) 6(0/1) 1(0/1) 1—
rte — — 14(2/0) — — — — —
rts — — 8(1/0) — — — — —
Table 2-15. Miscellaneous Instruction Execution Times (Continued)
Opcode Í Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
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Chapter 2. ColdFire Core 2-47
Exception Processing Overview
if bcc is a forward branch && CCR[7] == 1
then the bcc is predicted as taken
else if bcc is a backward branch
then the bcc is predicted as taken
Table 2-17 shows timing for Bcc instructions.
2.8 Exception Processing Overview
Exception processing for ColdFire processors is streamlined for performance. Differences
from previous M68000 Family processors include the following:
• A simplified exception vector table
• Reduced relocation capabilities using the vector base register
• A single exception stack frame format
• Use of a single, self-aligning system stack pointer
ColdFire processors use an instruction restart exception model but require more software
support to recover from certain access errors. See Table 2-18 for details.
Exception processing can be defined as the time from the detection of the fault condition
until the fetch of the first handler instruction has been initiated. It is comprised of the
following four major steps:
1. The processor makes an internal copy of the SR and then enters supervisor mode by
setting SR[S] and disabling trace mode by clearing SR[T]. The occurrence of an
interrupt exception also forces SR[M] to be cleared and the interrupt priority mask
to be set to the level of the current interrupt request.
2. The processor determines the exception vector number. For all faults except
interrupts, the processor performs this calculation based on the exception type. For
interrupts, the processor performs an interrupt-acknowledge (IACK) bus cycle to
obtain the vector number from a peripheral device. The IACK cycle is mapped to a
special acknowledge address space with the interrupt level encoded in the address.
3. The processor sav es the current context by creating an e xception stack frame on the
system stack. ColdFire processors support a single stack pointer in the A7 address
register; therefore, there is no notion of separate supervisor and user stack pointers.
As a result, the exception stack frame is created at a 0-modulo-4 address on the top
of the current system stack. Additionally, the processor uses a simplified
Table 2-17. Bcc Instruction Execution Times
Opcode Predicted
Correctly as Taken
Predicted
Correctly as Not
Taken
Predicted
Incorrectly
bcc 1(0/0) 1(0/0) 5(0/0)
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Exception Processing Overview
fixed-length stack frame for all e xceptions. The exception type determines whether
the program counter in the exception stack frame defines the address of the f aulting
instruction (fault) or of the next instruction to be executed (next).
4. The processor acquires the address of the first instruction of the exception handler.
The exception vector table is aligned on a 1-Mbyte boundary. This instruction
address is obtained by fetching a value from the table at the address defined in the
vector base register. The index into the exception table is calculated as
4 x vector_number. When the index value is generated, the vector table contents
determine the address of the first instruction of the desired handler. After the fetch
of the first opcode of the handler is initiated, exception processing terminates and
normal instruction processing continues in the handler.
ColdFire processors support a 1024-byte vector table aligned on any 1-Mbyte address
boundary; see Table 2-18. The table contains 256 exception vectors where the first 64 are
defined by Motorola; the remaining 192 are user-defined interrupt vectors.
Table 2-18. Exception Vector Assignments
Vector Numbers Vector Offset (Hex) Stacked Program Counter 1Assignment
0 000 — Initial stack pointer
1 004 — Initial program counter
2 008 Fault Access error
3 00C Fault Address error
4 010 Fault Illegal instruction
5 014 Fault Divide by zero
6–7 018–01C — Reserved
8 020 Fault Privilege violation
9 024 Next Trace
10 028 Fault Unimplemented line-a opcode
11 02C Fault Unimplemented line-f opcode
12 030 Next Debug interrupt
13 034 — Reserved
14 038 Fault Format error
15 03C Next Uninitialized interrupt
16–23 040–05C — Reserved
24 060 Next Spurious interrupt
25–31 064–07C Next Level 1–7 autovectored interrupts
32–47 080–0BC Next Trap #0–15 instructions
48–60 0C0–0F0 — Reserved
61 0F4 Fault Unsupported instruction
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Chapter 2. ColdFire Core 2-49
Exception Processing Overview
ColdFire processors inhibit sampling for interrupts during the first instruction of all
exception handlers. This allows any handler to effectively disable interrupts, if necessary,
by raising the interrupt mask level contained in the status register.
2.8.1 Exception Stack Frame Definition
The exception stack frame is shown in Figure 2-10. The first longword of the exception
stack frame contains the 16-bit format/vector w ord (F/V) and the 16-bit status register. The
second longword contains the 32-bit program counter address.
The 16-bit format/vector word contains three unique fields:
• Format field—This 4-bit field at the top of the system stack is al ways written with a
value of {4,5,6,7} by the processor indicating a 2-longword frame format. See
Table 2-19. This field records any longword misalignment of the stack pointer that
may have existed when the exception occurred.
• Fault status field—The 4-bit field, FS[3–0], at the top of the system stack is defined
for access and address errors along with interrupted debug service routines. See
Table 2-20.
62–63 0F8–0FC — Reserved
64–255 100–3FC Next User-defined interrupts
1The term ‘fault’ refers to the PC of the instruction that caused the exception. The term ‘next’ refers to the PC
of the instruction that immediately follows the instruction that caused the fault.
31 28 27 26 25 18 17 16 15 0
A7→Format FS[3–2] Vector[7–0] FS[1–0] Status Register
+ 0x04 Program Counter [31–0]
Figure 2-10. Exception Stack Frame Form
Table 2-19. Format Field Encoding
Original A7 at Time of
Exception, Bits 1–0 A7 at First Instruction of
Handler Format Field Bits
31–28
00 Original A[7–8] 0100
01 Original A[7–9] 0101
10 Original A[7–10] 0110
11 Original A[7–11] 0111
Table 2-18. Exception Vector Assignments (Continued)
Vector Numbers Vector Offset (Hex) Stacked Program Counter 1Assignment
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Exception Processing Overview
• Vector number—This 8-bit field, vector[7–0], defines the exception type. It is
calculated by the processor for internal faults and is supplied by the peripheral for
interrupts. See Table 2-18.
2.8.2 Processor Exceptions
Table 2-21 describes MCF5307 exceptions.
Table 2-20. Fault Status Encodings
FS[3–0] Definition
0000 Not an access or address error
0001-001x Reserved
0100 Error on instruction fetch
0101–011x Reserved
1000 Error on operand write
1001 Attempted write to write-protected space
101x Reserved
1100 Error on operand read
1101–111x Reserved
Table 2-21. MCF5307 Exceptions
Exception Description
Access Error Access errors are reported only in conjunction with an attempted store to write-protected memory.
Thus, access errors associated with instruction fetch or operand read accesses are not possible.
Address
Error Caused by an attempted ex ecution transf erring control to an odd instruction address (that is, if bit 0 of
the target address is set), an attempted use of a word-sized index register (Xi.w) or a scale factor of
8 on an index ed eff ectiv e addressing mode, or attempted e x ecution of an instruction with a full-format
indexed addressing mode.
Illegal
Instruction On Version 2 ColdFire implementations, only some illegal opcodes were decoded and generated an
illegal instruction exception. The Version 3 processor decodes the full 16-bit opcode and generates
this exception if execution of an unsupported instruction is attempted. Additionally, attempting to
execute an illegal line A or line F opcode generates unique exception types: vectors 10 and 11,
respectively.
ColdFire processors do not provide illegal instruction detection on extension w ords of any instruction,
including MOVEC. Attempting to execute an instruction with an illegal extension word causes
undefined results.
Divide by
Zero Attempted division by zero causes an e xception (v ector 5, offset = 0x014) e xcept when the PC points
to the faulting instruction (DIVU, DIVS, REMU, REMS).
Privilege
Violation Caused by attempted execution of a supervisor mode instruction while in user mode. The ColdFire
Programmer’s Reference Manual lists supervisor- and user-mode instructions.
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Chapter 2. ColdFire Core 2-51
Exception Processing Overview
Trace
Exception ColdFire processors provide instruction-by-instruction tracing. While the processor is in trace mode
(SR[T] = 1), instruction completion signals a trace exception. This allows a debugger to monitor
program execution.
The only exception to this definition is the STOP instruction. If the processor is in trace mode, the
instruction before the STOP executes and then generates a trace exception. In the exception stack
frame, the PC points to the STOP opcode. When the trace handler is exited, the STOP instruction is
executed, loading the SR with the immediate operand from the instruction. The processor then
generates a trace exception. The PC in the exception stack frame points to the instruction after
STOP, and the SR reflects the just-loaded value.
If the processor is not in trace mode and e xecutes a STOP instruction where the immediate operand
sets the trace bit in the SR, hardware loads the SR and generates a trace exception. The PC in the
exception stack frame points to the instruction after STOP, and the SR reflects the just-loaded value .
Because ColdFire processors do not support hardware stacking of multiple exceptions, it is the
responsibility of the operating system to check f or tr ace mode after processing other e xception types.
As an example, consider a TRAP instruction executing in trace mode. The processor initiates the
TRAP exception and passes control to the corresponding handler. If the system requires that a tr ace
exception be processed, the TRAP exception handler must check for this condition (SR[15] in the
exception stack frame asserted) and pass control to the trace handler before returning from the
original exception.
Debug
Interrupt Caused by a hardware breakpoint register trigger. Rather than generating an IACK cycle, the
processor internally calculates the vector number (12). Additionally, the M bit and the interrupt priority
mask fields of the SR are unaffected by the interrupt. See Section 2.2.2.1, “Status Register (SR).”
RTE and
Format Error
Exceptions
When an RTE instruction executes, the processor first examines the 4-bit format field to validate the
frame type. For a ColdFire processor, any attempted execution of an RTE where the format is not
equal to {4,5,6,7} generates a format error. The exception stack frame for the format error is created
without disturbing the original exception frame and the stac ked PC points to R TE.The selection of the
format value provides limited debug support for porting code from M68000 applications. On M68000
Family processors, the SR was at the top of the stack. Bit 30 of the longword addressed by the
system stack pointer is typically z ero; so, attempting an R TE using this old f ormat generates a f ormat
error on a ColdFire processor.
If the format field defines a valid type, the processor does the following:
1 Reloads the SR operand.
2 Fetches the second longword operand.
3 Adjusts the stack pointer b y adding the f ormat value to the auto-incremented address after the first
longword fetch.
4 Transfers control to the instruction address defined by the second longword operand in the stack
frame.
TRAP Executing TRAP always forces an exception and is useful for implementing system calls. The trap
instruction may be used to change from user to supervisor mode.
Interrupt
Exception Interrupt exception processing, with interrupt recognition and vector fetching, includes uninitialized
and spurious interrupts as well as those where the requesting device supplies the 8-bit interrupt
vector. Autovectoring may optionally be configured through the system interface module (SIM). See
Section 9.2.2, “Autovector Register (AVR).”
Table 2-21. MCF5307 Exceptions (Continued)
Exception Description
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2-52 MCF5307 User’s Manual
Exception Processing Overview
If a ColdFire processor encounters any type of fault during the exception processing of
another fault, the processor immediately halts execution with the catastrophic fault-on-f ault
condition. A reset is required to force the processor to exit this halted state.
Reset
Exception Asserting the reset input signal (RSTI) causes a reset exception. Reset has the highest exception
priority; it provides for system initialization and recovery from catastrophic failure. When assertion of
RSTI is recognized, current processing is aborted and cannot be recovered. The reset exception
places the processor in supervisor mode by setting SR[S] and disables tracing by clearing SR[T].
This exception also clears SR[M] and sets the processor’s interrupt priority mask in the SR to the
highest level (le v el 7). Next, the VBR is initializ ed to 0x0000_0000. Configuration registers controlling
the operation of all processor-local memories (cache and RAM modules on the MCF5307) are
invalidated, disabling the memories.
Note: Other implementation-specific supervisor registers are also affected. Refer to each of the
modules in this manual for details on these registers.
After RSTI is negated, the processor waits 80 cycles before beginning the actual reset exception
process. During this time, certain events are sampled, including the assertion of the debug
breakpoint signal. If the processor is not halted, it initiates the reset exception by performing two
longword read bus cycles. The longword at address 0 is loaded into the stack pointer and the
longword at address 4 is loaded into the PC. After the initial instruction is fetched from memory,
program e xecution begins at the address in the PC . If an access error or address error occurs before
the first instruction executes, the processor enters the fault-on-fault halted state.
Unsupported
Instruction
Exception
If the MCF5307 attempts to execute a valid instruction but the required optional hardware module is
not present in the OEP, a non-supported instruction exception is generated (vector 0x61). Control is
then passed to an exception handler that can then process the opcode as required by the system.
Table 2-21. MCF5307 Exceptions (Continued)
Exception Description
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Chapter 3. Hardware Multiply/Accum ulate (MAC) Unit 3-1
Chapter 3
Hardware Multiply/Accumulate (MAC)
Unit
This chapter describes the MCF5307 multiply/accumulate (MAC) unit, which executes
integer multiply, multiply-accumulate, and miscellaneous register instructions. The MAC
is integrated into the operand execution pipeline (OEP).
3.1 Overview
The MAC unit provides hardware support for a limited set of digital signal processing
(DSP) operations used in embedded code, while supporting the integer multiply
instructions in the ColdFire microprocessor family.
The MAC unit provides signal processing capabilities for the MCF5307 in a variety of
applications including digital audio and servo control. Inte grated as an ex ecution unit in the
processor’s OEP, the MA C unit implements a three-stage arithmetic pipeline optimized for
16 x 16 multiplies. Both 16- and 32-bit input operands are supported by this design in
addition to a full set of extensions for signed and unsigned inte gers plus signed, fixed-point
fractional input operands.
The MAC unit provides functionality in three related areas:
• Signed and unsigned integer multiplies
• Multiply-accumulate operations supporting signed, unsigned, and signed fractional
operands
• Miscellaneous register operations
Each of the three areas of support is addressed in detail in the succeeding sections. Logic
that supports this functionality is contained in a MAC module, as shown in Figure 3-1.
The MAC unit is tightly coupled to the OEP and features a three-stage execution pipeline.
To minimize silicon costs, the ColdFire MAC is optimized for 16 x 16 multiply
instructions. The OEP can issue a 16 x 16 multiply with a 32-bit accumulation and fetch a
32-bit operand in the same cycle. A 32 x 32 multiply with a 32-bit accumulation takes three
cycles before the ne xt instruction can be issued. Figure 3-1 shows the basic functionality of
the ColdFire MAC. A full set of instructions is provided for signed and unsigned integers
plus signed, fixed-point, fractional input operands.
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3-2 MCF5307 User’s Manual
Overview
Figure 3-1. ColdFire MAC Multiplication and Accumulation
The MA C unit is an extension of the basic multiplier found on most microprocessors. It can
perform operations native to signal processing algorithms in an acceptable number of
cycles, gi ven the application constraints. For e xample, small digital filters can tolerate some
variance in the execution time of the algorithm; larger, more complicated algorithms such
as orthogonal transforms may have more demanding speed requirements exceeding the
scope of any processor architecture and requiring a fully developed DSP implementation.
The M68000 architecture was not designed for high-speed signal processing, and a large
DSP engine would be excessive in an embedded environment. In striking a middle ground
between speed, size, and functionality, the ColdFire MAC unit is optimized for a small set
of operations that involve multiplication and cumulative additions. Specifically, the
multiplier array is optimized for single-cycle, 16 x 16 multiplies producing a 32-bit result,
with a possible accumulation cycle following. This is common in a large portion of signal
processing applications. In addition, the ColdFire core architecture has been modified to
allow for an operand fetch in parallel with a multiply, increasing overall performance for
certain DSP operations.
3.1.1 MAC Programming Model
Figure 3-2 shows the registers in the MAC portion of the user programming model.
Figure 3-2. MAC Programming Model
31 0 MACSR MAC status register
ACC MAC accumulator
MASK MAC mask register
X
+/-
Operand Y Operand X
Shift 0,1,-1
Accumulator
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Chapter 3. Hardware Multiply/Accum ulate (MAC) Unit 3-3
Overview
These registers are described as follows:
• Accumulator (ACC)—This 32-bit, read/write, general-purpose register is used to
accumulate the results of MAC operations.
• Mask register (MASK)—This 16-bit general-purpose register provides an optional
address mask for MA C instructions that fetch operands from memory. It is useful in
the implementation of circular queues in operand memory.
• MAC status register (MACSR)—This 8-bit register defines configuration of the
MAC unit and contains indicator flags affected by MAC instructions. Unless noted
otherwise, the setting of MACSR indicator flags is based on the final result, that is,
the result of the final operation involving the product and accumulator.
3.1.2 General Operation
The MA C unit supports the ColdFire integer multiply instructions (MULS and MULU) and
provides additional functionality for multiply-accumulate operations. The added MAC
instructions to the ColdFire ISA provide for the multiplication of two numbers, followed
by the addition or subtraction of this number to or from the value contained in the
accumulator. The product may be optionally shifted left or right one bit before the addition
or subtraction takes place. Hardware support for saturation arithmetic may be enabled to
minimize software o verhead when dealing with potential o v erflow conditions using signed
or unsigned operands.
These MAC operations treat the operands as one of the following formats:
• Signed integers
• Unsigned integers
• Signed, fixed-point, fractional numbers
To maintain compactness, the MAC module is optimized for 16-bit multiplications. Two
16-bit operands produce a 32-bit product. Longword operations are performed by reusing
the 16-bit multiplier array at the expense of a small amount of extra control logic. Again,
the product of two 32-bit operands is a 32-bit result. F or longword inte ger operations, only
the least significant 32 bits of the product are calculated. For fractional operations, the
entire 63-bit product is calculated and then either truncated or rounded to a 32-bit result
using the round-to-nearest (even) method.
Because the multiplier array is implemented in a 3-stage pipeline, MAC instructions can
have an effective issue rate of one clock for word operations, three for longword integer
operations, and four for 32-bit fractional operations. Arithmetic operations use
register -based input operands, and summed v alues are stored internally in the accumulator.
Thus, an additional MOVE instruction is necessary to store data in a general-purpose
register. MAC instructions can choose the upper or lower word of a register as the input,
which helps filtering operations in which one data register is loaded with input data and
another is loaded with coefficient data. Two 16-bit MAC operations can be performed
without fetching additional operands between instructions by alternating the word choice
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3-4 MCF5307 User’s Manual
Overview
during the calculations.
The need to move large amounts of data quickly can limit throughput in DSP engines.
However, data can be moved efficiently by using the MOVEM instruction, which
automatically generates line-sized burst references and is ideal for filling registers quickly
with input data, filter coefficients, and output data. Loading an operand from memory into
a register during a MAC operation makes some DSP operations, especially filtering and
convolution, more manageable.
The MACSR has a 4-bit operational mode field and three condition flags. The operational
mode bits control the overflow/saturation mode, whether operands are signed or unsigned,
whether operands are treated as integers or fractions, and how rounding is performed.
Negative, zero and overflow flags are also provided.
The three program-visible MAC registers, a 32-bit accumulator (ACC), the MAC mask
register (MASK), and MACSR, are described in Section 3.1.1, “MAC Programming
Model.”
3.1.3 MAC Instruction Set Summary
The MAC unit supports the integer multiply operations defined by the baseline ColdFire
architecture, as well as the new multiply-accumulate instructions. Table 3-1 summarizes
the MAC unit instruction set.
3.1.4 Data Representation
The MAC unit supports three basic operand types:
Table 3-1. MAC Instruction Summary
Instruction Mnemonic Description
Multiply Signed MULS <ea>y,Dx Multiplies two signed operands yielding a signed result
Multiply Unsigned MULU <ea>y,Dx Multiplies two unsigned operands yielding an unsigned result
Multiply Accumulate MAC Ry,RxSF
MSAC Ry,RxSF Multiplies two operands, then adds or subtracts the product
to/from the accumulator
Multiply Accumulate
with Load MAC Ry,RxSF,Rw
MSAC Ry,RxSF,Rw Multiplies two operands, then adds or subtracts the product
to/from the accumulator while loading a register with the
memory operand
Load Accumulator MOV.L {Ry,#imm},ACC Loads the accumulator with a 32-bit operand
Store Accumulator MOV.L ACC,Rx Writes the contents of the accumulator to a register
Load MACSR MOV.L {Ry,#imm},MACSR Writes a value to the MACSR
Store MACSR MOV.L MACSR,Rx Write the contents of MACSR to a register
Store MACSR to CCR MOV.L MACSR,CCR Write the contents of MACSR to the processor’s CCR register
Load MASK MOV.L {Ry,#imm},MASK Writes a value to MASK
Store MASK MOV.L MASK,Rx Writes the contents of MASK to a register
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Chapter 3. Hardware Multiply/Accum ulate (MAC) Unit 3-5
MAC Instruction Execution Timings
• Two’s complement signed integer: In this format, an N-bit operand represents a
number within the range -2(N-1) < operand < 2(N-1) - 1. The binary point is to the right
of the least significant bit.
• Two’s complement unsigned integer: In this format, an N-bit operand represents a
number within the range 0 < operand < 2N - 1. The binary point is to the right of the
least significant bit.
• Two’ s complement, signed fractional: In an N-bit number , the first bit is the sign bit.
The remaining bits signify the first N-1 bits after the binary point. Given an N-bit
number, aN-1aN-2aN-3... a2a1a0, its value is given by the following formula:
This format can represent numbers in the range -1 < operand < 1 - 2(N-1).
For words and longwords, the greatest negative number that can be represented is -1,
whose internal representation is 0x8000 and 0x0x8000_0000, respectively. The
most positive word is 0x7FFF or (1 - 2-15); the most positive longword is
0x7FFF_FFFF or (1 - 2-31).
3.2 MAC Instruction Execution Timings
Table 3-2 shows standard timings for two-operand MAC instructions.
Table 3-2. Two-Operand MAC Instruction Execution Times
Opcode Í Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
mac.w Ry,Rx 1(0/0) — — — — — — —
mac.l Ry,Rx 3(0/0) — — — — — — —
msac.w Ry,Rx 1(0/0) — — — — — — —
msac.l Ry,Rx 3(0/0) — — — — — — —
mac.w Ry,Rx,ea,Rw — 1(1/0) 1(1/0) 1(1/0) 1(1/0) — — —
mac.l Ry,Rx,ea,Rw — 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — —
msac.w Ry,Rx,ea,Rw — 1(1/0) 1(1/0) 1(1/0) 1(1/0) — — —
msac.l Ry,Rx,ea,Rw — 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — —
muls.w <ea>,Dx 3(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 3(0/0)
mulu.w <ea>,Dx 3(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 3(0/0)
muls.l <ea>,Dx 5(0/0) 5(1/0) 5(1/0) 5(1/0) 5(1/0) — — —
mulu.l <ea>,Dx 5(0/0) 5(1/0) 5(1/0) 5(1/0) 5(1/0) — — —
2i1N–+()
ai⋅
i0=
N2–
∑
+
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3-6 MCF5307 User’s Manual
MAC Instruction Execution Timings
Table 3-3 shows standard timings for MAC move instructions.
Table 3-3. MAC Move Instruction Execution Times
Opcode Í Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
move.l <ea>,ACC 1(0/0) — — — — — — 1(0/0)
move.l <ea>,MACSR 6(0/0) — — — — — — 6(0/0)
move.l <ea>,MASK 5(0/0) — — — — — — 5(0/0)
move.l ACC,Rx 1(0/0) — — — — — — —
move.l MACSR,CCR 1(0/0) — — — — — — —
move.l MACSR,Rx 1(0/0) — — — — — — —
move.l MASK,Rx 1(0/0) — — — — — — —
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Chapter 4. Local Memory 4-1
Chapter 4
Local Memory
This chapter describes the MCF5307 implementation of the ColdFire Version 3 local
memory specification. It consists of two major sections.
• Section 4.2, “SRAM Overview,” describes the MCF5307 on-chip static RAM
(SRAM) implementation. It covers general operations, configuration, and
initialization. It also provides information and examples showing ho w to minimize
power consumption when using the SRAM.
• Section 4.7, “Cache Overview,” describes the MCF5307 cache implementation,
including organization, con figuration, and coherenc y. It describes cache operations
and how the cache interfaces with other memory structures.
4.1 Interactions between Local Memory Modules
Depending on configuration information, instruction fetches and data read accesses may be
sent simultaneously to the RAM and cache controllers. This approach is required because
both controllers are memory-mapped devices and the hit/miss determination is made
concurrently with the read data access. Po wer dissipation can be minimized by configuring
the RAMBARs to mask unused address spaces whenever possible.
If the access address is mapped into the region defined by the RAM (and this region is not
masked), the RAM pro vides the data back to the processor , and the cache data is discarded.
Accesses from the RAM module are never cached. The complete definition of the
processor’s local bus priority scheme for read references is as follows:
if (RAM “hits”
) RAM supplies data to the processor
else if (cache “hits”)
cache supplies data to the processor
else system memory reference to access data
For data write references, the memory mapping into the local memories is resolved before
the appropriate destination memory is accessed. Accordingly, only the targeted local
memory is accessed for data write transfers.
4.2 SRAM Overview
The 4-Kbyte on-chip SRAM module is connected to the internal bus and provides pipelined,
single-cycle access to memory mapped to the module. Memory can be mapped to any
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4-2 MCF5307 User’s Manual
SRAM Operation
0-modulo-32K location in the 4-Gbyte address space and configured to respond to either
instruction or data accesses.Time-critical functions can be mapped into instruction the
system stack. Other heavily-referenced data can be mapped into memory.
The following summarizes features of the MCF5307 SRAM implementation:
• 4-Kbyte SRAM, organized as 1024 x 32 bits
• Single-cycle throughput. When the pipeline is full, one access can occur per clock
cycle.
• Physical location on the processor’s high-speed local bus
• Memory location programmable on any 0-modulo-32K address boundary
• Byte, word, and longword address capabilities
• The RAM base address register (RAMBAR) defines the logical base address,
attributes, and access types for the SRAM module.
4.3 SRAM Operation
The SRAM module provides a general-purpose memory block that the ColdFire processor
can access with single-cycle throughput. The location of the memory block can be specified
to any w ord-aligned address in the 4-Gbyte address space by RAMBAR[BA], described in
Section 4.4.1, “SRAM Base Address Register (RAMBAR).” The memory is ideal for
storing critical code or data structures or for use as the system stack. Because the SRAM
module connects physically to the processor’s high-speed local bus, it can service
processor-initiated accesses or memory-referencing debug module commands.
Instruction fetches and data reads can be sent to both the cache and SRAM blocks
simultaneously. If the reference is mapped into a region defined by the SRAM, the SRAM
provides data to the processor and any cache data is discarded. Data accessed from the
SRAM module are not cached.
Note also that the SRAM cannot be accessed by the on-chip DMAs. The on-chip system
configuration allows concurrent core and DMA execution, where the core can reference
code or data from the internal SRAM or cache while performing a DMA transfer.
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Chapter 4. Local Memory 4-3
SRAM Programming Model
Accesses are attempted in the following order:
1. SRAM
2. Cache (if space is defined as cacheable)
3. External access
4.4 SRAM Programming Model
The SRAM programming model consists of RAMBAR.
4.4.1 SRAM Base Address Register (RAMBAR)
The SRAM modules are configured through the RAMBAR, shown in Figure 4-1.
• RAMB AR holds the base address of the SRAM. The MOVEC instruction provides
write-only access to this register from the processor.
• RAMBAR can be read or written from the debug module in a similar manner.
• All undefined RAMBAR bits are reserved. These bits are ignored during writes to
the RAMBAR and return zeros when read from the debug module.
• The valid bit, RAMBAR[V], is cleared at reset, disabling the SRAM module. All
other bits are unaffected.
Figure 4-1. SRAM Base Address Register (RAMBAR)
RAMBAR fields are described in detail in Table 4-1.
31 15 14 9 8 7 6 5 4 3 2 1 0
Field BA — WP — C/I SC SD UC UD V
Reset — 0
R/W W for CPU; R/W for debug
Address CPU space + 0xC04
Table 4-1. RAMBAR Field Description
Bits Name Description
31–15 BA Base address. Defines the SRAM module’s word-aligned base address. The SRAM module
occupies a 4-Kbyte space defined by the contents of BA. SRAM may reside on any 32-Kbyte
boundary in the 4-Gbyte address space.
14–9 — Reserved, should be cleared.
8 WP Write protect. Controls read/write properties of the SRAM.
0 Allows read and write accesses to the SRAM module
1 Allows only read accesses to the SRAM module. Any attempted write reference generates an
access error exception to the ColdFire processor core.
7–6 — Reserved, should be cleared.
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4-4 MCF5307 User’s Manual
SRAM Initialization
The mapping of a given access into the RAM uses the following algorithm to determine if
the access hits in the memory:
if (RAMBAR[0] = 1)
if (requested address[31:15] = RAMBAR[31:15])
if (requested address[14:12] = 0)
if (ASn of the requested type = 0)
Access is mapped to the RAM module
if (access = read)
Read the RAM and return the data
if (access = write)
if (RAMBAR[8] = 0)
Write the data into the RAM
else Signal a write-protect access error
ASn refers to the five address space mask bits: C/I, SC, SD, UC, and UD.
4.5 SRAM Initialization
After a hardware reset, the contents of the SRAM module are undefined. The valid bit,
RAMB AR[V], is cleared, disabling the SRAM module. If the SRAM requires initialization
with instructions or data, the following steps should be performed:
1. Read the source data and write it to the SRAM. Various instructions support this
function, including memory-to-memory move instructions and the move multiple
instruction (MO VEM). MOVEM is optimized to generate line-sized burst fetches on
line-aligned addresses, so it generally provides maximum performance.
2. After the data is loaded into the SRAM, it may be appropriate to revise the
RAMB AR attrib ute bits, including the write-protect and address space mask fields.
Remember that the SRAM cannot be accessed by the on-chip DMAs. The on-chip system
configuration allo ws concurrent core and DMA ex ecution where the core can e x ecute code
5–1 C/I,
SC,
SD,
UC,
UD
Address space masks (ASn). These fields allow certain types of accesses to be masked, or
inhibited from accessing the SRAM module. These bits are useful for power management as
described in Section 4.6, “Power Management.” In particular, C/I is typically set.
The address space mask bits are follows:
C/I = CPU space/interrupt acknowledge cycle mask. Note that C/I must be set if BA = 0.
SC = Supervisor code address space mask
SD = Supervisor data address space mask
UC = User code address space mask
UD = User data address space mask
For each ASn bit:
0 An access to the SRAM module can occur for this address space
1 Disable this address space from the SRAM module. If a reference using this address space is
made, it is inhibited from accessing the SRAM module and is processed like any other
non-SRAM reference.
0 V Valid. Enables/disables the SRAM module. V is cleared at reset.
0 RAMBAR contents are not valid.
1 RAMBAR contents are valid.
Table 4-1. RAMBAR Field Description (Continued)
Bits Name Description
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Chapter 4. Local Memory 4-5
SRAM Initialization
out of internal SRAM or cache during DMA access.
The ColdFire processor or an external emulator using the deb ug module can perform these
initialization functions.
4.5.1 SRAM Initialization Code
The code segment belo w initializes the SRAM. The code sets the base address of the SRAM
at 0x2000_0000 and then initializes the RAM to zeros.
RAMBASE EQU 0x20000000 ;set this variable to 0x20000000
RAMVALID EQU 0x00000035
move.l #RAMBASE+RAMVALID,D0 ;load RAMBASE + valid bit into D0
movec.l D0, RAMBAR ;load RAMBAR and enable SRAM
The following loop initializes the entire SRAM to zero:
lea.l RAMBASE,A0 ;load pointer to SRAM
move.l #1024,D0 ;load loop counter into D0
SRAM_INIT_LOOP:
clr.l (A0)+ ;clear 4 bytes of SRAM
subq.l #1,D0 ;decrement loop counter
bne.b SRAM_INIT_LOOP ;exit if done; else continue looping
The following function copies the number of bytesToMove from the source (*src) to the
processor’s local RAM at an offset relative to the SRAM base address defined by
destinationOffset. The bytesToMove must be a multiple of 16. For best performance, source
and destination SRAM addresses should be line-aligned (0-modulo-16).
; copyToCpuRam (*src, destinationOffset, bytesToMove)
RAMBASE EQU 0x20000000 ;SRAM base address
RAMFLAGS EQU 0x00000035 ;RAMBAR valid + mask bits
lea.l -12(a7),a7 ;allocate temporary space
movem.l #0x1c,(a7) ;store D2/D3/D4 registers
; stack arguments and locations
; +0 saved d2
; +4 saved d3
; +8 saved d4
; +12 returnPc
; +16 pointer to source operand
; +20 destinationOffset
; +24 bytesToMove
move.l RAMBASE+RAMFLAGS,a0 ;define RAMBAR contents
movec.l a0,rambar ;load it
move.l 16(a7),a0 ;load argument defining *src
lea.l RAMBASE,a1 ;memory pointer to RAM base
add.l 20(a7),a1 ;include destinationOffset
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Power Management
move.l 24(a7),d4 ;load byte count
asr.l #4,d4 ;divide by 16 to convert to loop count
.align 4 ;force loop on 0-mod-4 address
loop: movem.l (a0),#0xf ;read 16 bytes from source
movem.l #0xf,(a1) ;store into RAM destination
lea.l 16(a0),a0 ;increment source pointer
lea.l 16(a1),a1 ;increment destination pointer
subq.l #1,d4 ;decrement loop counter
bne.b loop ;if done, then exit, else continue
movem.l (a7),#0x1c ;restore d2/d3/d4 registers
lea.l 12(a7),a7 ;deallocate temporary space
rts
4.6 Power Management
Because processor memory references may be simultaneously sent to an SRAM module
and cache, power can be minimized by configuring RAMBAR address space masks as
precisely as possible. For example, if an SRAM is mapped to the internal instruction bus
and contains instruction data, setting the ASn mask bits associated with operand references
can decrease power dissipation. Similarly, if the SRAM contains data, setting ASn bits
associated with instruction fetches minimizes power.
Table 4-2 shows typical RAMBAR configurations.
.
4.7 Cache Overview
This section describes the MCF5307 cache implementation, including organization,
configuration, and coherency. It describes cache operations and how the cache interacts
with other memory structures.
The MCF5307 processor contains a nonblocking, 8-Kbyte, 4-way set-associative, unified
(instruction and data) cache with a 16-byte line size. The cache improves system
performance by providing low-latency access to the instruction and data pipelines. This
decouples processor performance from system memory performance, increasing bus
availability for on-chip DMA or external devices. Figure 4-2 shows the organization and
integration of the data cache.
Table 4-2. Examples of Typical RAMBAR Settings
Data Contained in SRAM RAMBAR[5–0]
Code only 0x2B
Data only 0x35
Both code and data 0x21
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Chapter 4. Local Memory 4-7
Cache Organization
Figure 4-2. Unified Cache Organization
The cache supports operation of copyback, write-through, or cache-inhibited modes. The
cache lock feature can be used to guarantee deterministic response for critical code or data
areas.
A nonblocking cache services read hits or write hits from the processor while a fill (caused
by a cache allocation) is in progress. As Figure 4-2 shows, instruction and data accesses
use a single bus connected to the cache.
All addresses from the processor to the cache are physical addresses. A cache hit occurs
when an address matches a cache entry. For a read, the cache supplies data to the processor.
For a write, the processor updates the cache. If an access does not match a cache entry
(misses the cache) or if a write access must be written through to memory, the cache
performs a bus c ycle on the internal b us and correspondingly on the external b us by w ay of
the system integration module (SIM).
The SRAM module does not implement bus snooping; cache coherenc y with other possible
bus masters must be maintained in software.
4.8 Cache Organization
A four-way set associative cache is organized as four ways (levels). There are 128 sets in
the 8-Kbyte cache with each line containing 16 bytes (4 longwords). Entire cache lines are
loaded from memory by burst-mode accesses that cache 4 longwords of data or
instructions. All 4 longwords must be loaded for the cache line to be valid.
Figure 4-3 shows cache organization as well as terminology used.
System
Address/
Control
Cache
Control Logic
Directory Array
Data Array
Data Path
ColdFire
Address Path
Control
Data
Address
External
Bus
Data
Control
Data
Address
Integration
Module
(SIM)
Processor
Core
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4-8 MCF5307 User’s Manual
Cache Organization
Figure 4-3. Cache Organization and Line Format
A set is a group of four lines (one from each level, or way), corresponding to the same inde x
into the cache array.
4.8.1 Cache Line States: Invalid, Valid-Unmodified, and
Valid-Modified
As shown in Table 4-3, a cache line can be invalid, valid-unmodified (often called
exclusive), or valid-modified.
A valid line can be explicitly invalidated by executing a CPUSHL instruction.
Table 4-3. Valid and Modified Bit Settings
V M Description
0 x Invalid. Invalid lines are ignored during lookups.
1 0 Valid, unmodified. Cache line has valid data that matches system memory.
1 1 Valid, modified. Cache line contains most recent data, data at system memory location is stale.
Way 0 Way 1 Way 2 Way 3
Line
Set 0
Set 1
Set 126
Set 127
•
•
••
•
••
•
••
•
•
TAG V M Longword 0 Longword 1 Longword 2 Longword 3
Where:
TAG—21-bit address tag
V—Valid bit for line
M—Modified bit for line
Cache Line Format
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Chapter 4. Local Memory 4-9
Cache Organization
4.8.2 The Cache at Start-Up
As Figure 4-4 (A) shows, after power-up, cache contents are undefined; V and M may be
set on some lines even though the cache may not contain the appropriate data for start up.
Because reset and power-up do not invalidate cache lines automatically, the cache should
be cleared explicitly by setting CACR[CINVA] before the cache is enabled (B).
After the entire cache is flushed, cacheable entries are loaded first in way 0. If way 0 is
occupied, the cacheable entry is loaded into the same set in way 1, as shown in Figure 4-4
(D). This process is described in detail in Section 4.9, “Cache Operation.”
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Cache Organization
Figure 4-4. Cache—A: at Reset, B: after Invalidation, C and D: Loading Pattern
A:Cache population at
start-up B:Cache after invalidation,
before it is enabled C:Cache after loads in
Way 0 D:First load in Way 1
Way 0 Way 1 Way 2 Way 3 Way 0 Way 1 Way 2 Way 3 Way 0 Way 1 Way 2 Way 3 Way 0 Way 1 Way 2 Way 3
Invalid (V = 0)
Valid, not modified (V = 1, M = 0)
Valid, modified (V = 1, M = 1)
At reset, cache contents
are indeterminate; V and
M may be set. The cache
should be cleared
explicitly by setting
CACR[CINVA] before the
cache is enabled.
Setting CACR[CINVA]
invalidates the entire
cache.
Set 0
Set 127 Initial cacheable
accesses to memory-fill
positions in way 0.
A line is loaded in
way 1 only if that set is
full in way 0.
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Chapter 4. Local Memory 4-11
Cache Operation
4.9 Cache Operation
Figure 4-5 shows the general flow of a caching operation.
Figure 4-5. Caching Operation
The following steps determine if a cache line is allocated for a given address:
1. The cache set index, A[10:4], selects one cache set.
2. A[31:11] and the cache set index are used as a tag reference or are used to update
the cache line tag field. Note that A[31:11] can specify 21 possible addresses that
can be mapped to one of the four ways.
3. The four tags from the selected cache set are compared with the tag reference. A
cache hit occurs if a tag matches the tag reference and the V bit is set, indicating that
the cache line contains valid data. If a cacheable write access hits in a valid cache
line, the write can occur to the cache line without having to load it from memory.
If the memory space is copyback, the updated cache line is marked modified
(M = 1), because the new data has made the data in memory out of date. If the
memory location is write-through, the write is passed on to system memory and the
M bit is never used. Note that the tag does not have TT or TM bits.
To allocate a cache entry, the cache set inde x selects one of the cache’s 128 sets. The cache
control logic looks for an invalid cache line to use for the new entry. If none is available,
the cache controller uses a pseudo-round-robin replacement algorithm to choose the line to
034101131
Index
Tag Data/Tag Reference
MUX
Comparator 0123
Logical OR
Hit 3
Hit 2
Hit 1
Hit 0
Hit
Line Select
Set 0
Set 1
Set 127
•
•
•
Address
A[31:11]
Way 0
Way 1
Way 2
Way 3
TAG STATUS LW0 LW1 LW2 LW3
TAG STATUS LW0 LW1 LW2 LW3
•
•
••
•
••
•
••
•
••
•
••
•
•
Address
Set
Select
A[10:4]
Data or
Instruction
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4-12 MCF5307 User’s Manual
Cache Operation
be deallocated and replaced. First the cache controller looks for an inv alid line, with w ay 0
the highest priority . If all lines ha ve valid data, a 2-bit replacement counter is used to choose
the way. After a line is allocated, the pointer increments to point to the next way.
Cache lines from ways 0 and 1 can be protected from deallocation by enabling half-cache
locking. If CACR[HLCK] = 1, the replacement pointer is restricted to way 2 or 3.
As part of deallocation, a valid, unmodified cache line is invalidated. It is consistent with
system memory, so memory does not need to be updated. To deallocate a modified cache
line, data is placed in a push buffer (for an external cache line push) before being
invalidated. After invalidation, the new entry can replace it. The old cache line may be
written after the new line is read.
When a cache line is selected to host a ne w cache entry, the following three things happen:
1. The new address tag bits A[31:11] are written to the tag.
2. The cache line is updated with the new memory data.
3. The cache line status changes to a valid state (V = 1).
Read cycles that miss in the cache allocate normally as previously described.
Write cycles that miss in the cache do not allocate on a cacheable write-through re gion, but
do allocate for addresses in a cacheable copyback region.
A copyback byte, word, longword, or line write miss causes the following:
1. The cache initiates a line fill or flush.
2. Space is allocated for a new line.
3. V and M are both set to indicate valid and modified.
4. Data is written in the allocated space. No write to memory occurs.
Note the following:
• Read hits cannot change the status bits and no deallocation or replacement occurs;
the data or instructions are read from the cache.
• If the cache hits on a write access, data is written to the appropriate portion of the
accessed cache line. Write hits in cacheable, write-through regions generate an
external write cycle and the cache line is marked valid, but is never marked modified.
Write hits in cacheable copyback regions do not perform an external write cycle; the
cache line is marked valid and modified (V = 1 and M = 1).
• Misaligned accesses are broken into at least two cache accesses.
• Validity is provided only on a line basis. Unless a whole line is loaded on a cache
miss, the cache controller does not validate data in the cache line.
Write accesses designated as cache-inhibited by the CACR or ACR bypass the cache and
perform a corresponding external write.
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Cache Operation
Normally, cache-inhibited reads bypass the cache and are performed on the external bus.
The exception to this normal operation occurs when all of the follo wing conditions are true
during a cache-inhibited read:
• The cache-inhibited fill buffer bit, CACR[DNFB], is set.
• The access is an instruction read.
• The access is normal (that is, transfer type (TT) equals 0).
In this case, an entire line is fetched and stored in the fill buffer. It remains valid there, and
the cache can service additional read accesses from this buffer until either another fill or a
cache-invalidate-all operation occurs.
Valid cache entries that match during cache-inhibited address accesses are neither pushed
nor invalidated. Such a scenario suggests that the associated cache mode for this address
space was changed. To avoid this, it is generally recommended to use the CPUSHL
instruction to push or invalidate the cache entry or set CACR[CINVA] to invalidate the
cache before switching cache modes.
4.9.1 Caching Modes
For e v ery memory reference generated by the processor or debug module, a set of ef fecti v e
attributes is determined based on the address and the ACRs. Caching modes determine ho w
the cache handles an access. An access can be cacheable in either write-through or
copyback mode; it can be cache-inhibited in precise or imprecise modes. For normal
accesses, the ACRn[CM] bit corresponding to the address of the access specifies the
caching modes. If an address does not match an ACR, the default caching mode is defined
by CACR[DCM]. The specific algorithm is as follows:
if (address == ACR0-address including mask)
effective attributes = ACR0 attributes
else if (address == ACR1-address including mask)
effective attributes = ACR1 attributes
else effective attributes = CACR default attributes
Addresses matching an ACR can also be write-protected using ACR[W]. Addresses that do
not match either ACR can be write-protected using CACR[DW].
Reset disables the cache and clears all CACR bits. As shown in Figure 4-4, reset does not
automatically invalidate cache entries; they must be invalidated through software.
The ACRs allow the defaults selected in the CACR to be overridden. In addition, some
instructions (for example, CPUSHL) and processor core operations perform accesses that
have an implicit caching mode associated with them. The following sections discuss the
different caching accesses and their associated cache modes.
4.9.1.1 Cacheable Accesses
If ACRn[CM] or the default field of the CACR indicates write-through or copyback, the
access is cacheable. A read access to a write-through or copyback region is read from the
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Cache Operation
cache if matching data is found. Otherwise, the data is read from memory and the cache is
updated. When a line is being read from memory for either a write-through or copyback
read miss, the longword within the line that contains the core-requested data is loaded first
and the requested data is given immediately to the processor, without waiting for the three
remaining longwords to reach the cache.
The following sections describe write-through and copyback modes in detail.
4.9.1.2 Write-Through Mode
Write accesses to regions specified as write-through are always passed on to the external
bus, although the cycle can be buffered, depending on the state of CACR[ESB]. Writes in
write-through mode are handled with a no-write-allocate policy—that is, writes that miss
in the cache are written to the external bus but do not cause the corresponding line in
memory to be loaded into the cache. Write accesses that hit always write through to
memory and update matching cache lines. The cache supplies data to data-read accesses
that hit in the cache; read misses cause a new cache line to be loaded into the cache.
4.9.1.3 Copyback Mode
Copyback re gions are typically used for local data structures or stacks to minimize external
bus use and reduce write-access latency. Write accesses to regions specified as copyback
that hit in the cache update the cache line and set the corresponding M bit without an
external bus access.
Be sure to flush the cache using the CPUSHL instruction before invalidating the cache in
copyback mode. Modified cache data is written to memory only if the line is replaced
because of a miss or a CPUSHL instruction pushes the line. If a byte, word, longword, or
line write access misses in the cache, the required cache line is read from memory, thereby
updating the cache. When a miss selects a modified cache line for replacement, the
modified cache data moves to the push buffer. The replacement line is read into the cache
and the push buffer contents are then written to memory.
4.9.2 Cache-Inhibited Accesses
Memory regions can be designated as cache-inhibited, which is useful for memory
containing targets such as I/O devices and shared data structures in multiprocessing
systems. It is also important to not cache the MCF5307 memory mapped registers. If the
corresponding ACRn[CM] or CACR[DCM] indicates cache-inhibited, precise or
imprecise, the access is cache-inhibited. The caching operation is identical for both
cache-inhibited modes, which differ only regarding recovery from an external bus error.
In determining whether a memory location is cacheable or cache-inhibited, the CPU checks
memory-control registers in the following order:
1. RAMBAR
2. ACR0
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Chapter 4. Local Memory 4-15
Cache Operation
3. ACR1
4. If an access does not hit in the RAMBAR or the ACRs, the default is provided for
all accesses in CACR.
Cache-inhibited write accesses bypass the cache and a corresponding external write is
performed. Cache-inhibited reads bypass the cache and are performed on the external bus,
except when all of the following conditions are true:
• The cache-inhibited fill-buffer bit, CACR[DNFB], is set.
• The access is an instruction read.
• The access is normal (that is, TT = 0).
In this case, a fetched line is stored in the fill buffer and remains valid there; the cache can
service additional read accesses from this buffer until another fill occurs or a
cache-invalidate-all operation occurs.
If ACRn[CM] indicates cache-inhibited mode, precise or imprecise, the controller bypasses
the cache and performs an external transfer. If a line in the cache matches the address and
the mode is cache-inhibited, the cache does not automatically push the line if it is modified,
nor does it invalidate the line if it is valid. Before switching cache mode, execute a
CPUSHL instruction or set CACR[CINVA] to invalidate the entire cache.
If ACRn[CM] indicates precise mode, the sequence of read and write accesses to the re gion
is guaranteed to match the instruction sequence. In imprecise mode, the processor core
allows read accesses that hit in the cache to occur before completion of a pending write
from a previous instruction. Writes are not deferred past data-read accesses that miss the
cache (that is, that must be read from the bus).
Precise operation forces data-read accesses for an instruction to occur only once by
preventing the instruction from being interrupted after data is fetched. Otherwise, if the
processor is not in precise mode, an exception aborts the instruction and the data may be
accessed again when the instruction is restarted. These guarantees apply only when
ACRn[CM] indicates precise mode and aligned accesses.
CPU space-register accesses, such as MOVEC, are treated as cache-inhibited and precise.
4.9.3 Cache Protocol
The follo wing sections describe the cache protocol for processor accesses and assumes that
the data is cacheable (that is, write-through or copyback).
4.9.3.1 Read Miss
A processor read that misses in the cache requests the cache controller to generate a bus
transaction. This bus transaction reads the needed line from memory and supplies the
required data to the processor core. The line is placed in the cache in the valid state.
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Cache Operation
4.9.3.2 Write Miss
The cache controller handles processor writes that miss in the cache differently for
write-through and copyback regions. Write misses to copyback regions cause the cache line
to be read from system memory, as shown in Figure 4-6.
Figure 4-6. Write-Miss in Copyback Mode
The ne w cache line is then updated with write data and the M bit is set for the line, lea ving
it in modified state. Write misses to write-through regions write directly to memory without
loading the corresponding cache line into the cache.
4.9.3.3 Read Hit
On a read hit, the cache provides the data to the processor core and the cache line state
remains unchanged. If the cache mode changes for a specific region of address space, lines
in the cache corresponding to that region that contain modified data are not pushed out to
memory when a read hit occurs within that line. First ex ecute a CPUSHL instruction or set
CACR[CINVA] before switching the cache mode.
4.9.3.4 Write Hit
The cache controller handles processor writes that hit in the cache differently for
write-through and copyback regions. For write hits to a write-through region, portions of
cache lines corresponding to the size of the access are updated with the data. The data is
Cache Line
System
V = 1
M = 0
1
. Writing character X to 0x0B generates a write miss. Data cannot be written to an invalid line.
Memory
V = 0
M = 0
0x0C 0x000x08 0x04
2. The cache line (characters A–P) is updated from system memory, and line is marked valid.
X
ABCD EFGH IJKL MNOP
3. After the cache line is filled, the write that initiated the write miss (the character X) completes to 0x0B.
V = 1
M = 1
0x0C 0x000x08 0x04
0x0C 0x000x08 0x04
ABCD EXGH IJKL MNOP
MCF5307
MCF5307
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Chapter 4. Local Memory 4-17
Cache Operation
also written to external memory. The cache line state is unchanged. For cop yback accesses,
the cache controller updates the cache line and sets the M bit for the line. An external write
is not performed and the cache line state changes to (or remains in) the modified state.
4.9.4 Cache Coherency
The MCF5307 provides limited cache coherenc y support in multiple-master en vironments.
Both write-through and copyback memory update techniques are supported to maintain
coherency between the cache and memory.
The cache does not support snooping (that is, cache coherency is not supported while
external or DMA masters are using the bus). Therefore, on-chip DMAs of the MCF5307
cannot access local memory and do not maintain coherency with the unified cache.
4.9.5 Memory Accesses for Cache Maintenance
The cache controller performs all maintenance acti vities that supply data from the cache to
the core, including requests to the SIM for reading new cache lines and writing modified
lines to memory. The following sections describe memory accesses resulting from cache
fill and push operations. Chapter 18, “Bus Operation,” describes required bus cycles in
detail.
4.9.5.1 Cache Filling
When a ne w cache line is required, a line read is requested from the SIM, which generates
a burst-read transfer by indicating a line access with the size signals, SIZ[1:0].
The responding device supplies 4 consecutive longwords of data. Burst operations can be
inhibited or enabled through the burst read/write enable bits (BSTR/BSTW) in the
chip-select control registers (CSCR0–CSCR7).
SIM line accesses implicitly request burst-mode operations from memory. For more
information regarding external b us burst-mode accesses, see Chapter 18, “Bus Operation.”
The first c ycle of a cache-line read loads the longword entry corresponding to the requested
address. Subsequent transfers load the remaining longword entries.
A burst operation is aborted by an a write-protection f ault, which is the only possible access
error. Exception processing proceeds immediately. Because the write cycle can be
decoupled from the processor’s issuing of the operation, error signaling appears to be
decoupled from the instruction that generated the write. Accordingly, the PC in the
exception stack frame represents the program location when the access error w as signaled.
See Section 2.8.2, “Processor Exceptions.”
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Cache Operation
4.9.5.2 Cache Pushes
Cache pushes occur for line replacement and as required for the ex ecution of the CPUSHL
instruction. To reduce the requested data’s latency in the new line, the modified line being
replaced is temporarily placed in the push buffer while the new line is fetched from
memory . After the bus transfer for the new line completes, the modified cache line is written
back to memory and the push buffer is invalidated.
4.9.5.2.1 Push and Store Buffers
The 16-byte push buf fer reduces latenc y for requested new data on a cache miss by holding
a displaced modified cache line while the new data is read from memory.
If a cache miss displaces a modified line, a miss read reference is immediately generated.
While waiting for the response, the current contents of the cache location load into the push
buf fer . When the b urst-read bus transaction completes, the cache controller can generate the
appropriate line-write bus transaction to write the push buffer contents into memory.
In imprecise mode, the FIFO store buffer can defer pending writes to maximize
performance. The store b uffer can support as man y as four entries (16 bytes maximum) for
this purpose.
Data writes destined for the store buffer cannot stall the core. The store buffer effectively
provides a measure of decoupling between the pipeline’s ability to generate writes (one per
cycle maximum) and the external bus’s ability to retire those writes. In imprecise mode,
writes stall only if the store buffer is full and a write operation is on the internal bus. The
internal write cycle is held, stalling the data execution pipeline.
If the store buf fer is not used (that is, store buf fer disabled or cache-inhibited precise mode),
external b us cycles are generated directly for each pipeline write operation. The instruction
is held in the pipeline until external bus transfer termination is received. Therefore, each
write is stalled for 5 cycles, making the minimum write time equal to 6 cycles when the
store buffer is not used. See Section 2.1.2.2, “Operand Execution Pipeline (OEP).”
The store buffer enable bit, CACR[ESB], controls the enabling of the store buffer. This bit
can be set and cleared by the MOVEC instruction. ESB is zero at reset and all writes are
performed in order (precise mode). ACRn[CM] or CACR[DCM] generates the mode used
when ESB is set. Cacheable write-through and cache-inhibited imprecise modes use the
store buffer.
The store buffer can queue data as much as 4 bytes wide per entry. Each entry matches the
corresponding bus cycle it generates; therefore, a misaligned longword write to a
write-through region creates two entries if the address is to an odd-word boundary. It
creates three entries if it is to an odd-byte boundary—one per bus cycle.
4.9.5.2.2 Push and Store Buffer Bus Operation
As soon as the push or store buffer has valid data, the internal bus controller uses the next
available external bus cycle to generate the appropriate write cycles. In the event that
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Chapter 4. Local Memory 4-19
Cache Operation
another cache fill is required (for example, cache miss to process) during the continued
instruction execution by the processor pipeline, the pipeline stalls until the push and store
buffers are empty, then generate the required external bus transaction.
Supervisor instructions, the NOP instruction, and exception processing synchronize the
processor core and guarantee the push and store buf fers are empty before proceeding. Note
that the NOP instruction should be used only to synchronize the pipeline. The preferred
no-operation function is the TPF instruction.
4.9.6 Cache Locking
Ways 0 and 1 of the cache can be locked by setting CACR[HLCK]. If the cache is locked,
cache lines in ways 0 and 1 are not subject to being deallocated by normal cache operations.
As Figure 4-7 (B and C) shows, the algorithm for updating the cache and for identifying
cache lines to be deallocated is otherwise unchanged. If ways 2 and 3 are entirely invalid,
cacheable accesses are first allocated in way 2. Way 3 is not used until the location in way 2
is occupied.
Ways 0 and 1 are still updated on write hits (D in Figure 4-7) and may be pushed or cleared
only explicitly by using specific cache push/invalidate instructions. However, new cache
lines cannot be allocated in ways 0 and 1.
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4-20 MCF5307 User’s Manual
Cache Operation
Figure 4-7. Cache Locking
A:W ays 0 and 1 are filled.
Ways 2 and 3 are
invalid.
B:CACR[DHLCK] is set,
locking ways 0 and 1. C:When a set in Way 2 is
occupied, the set in wa y 3
is used for a cacheable
access.
Way 0 Way 1 Way 2 Way 3 Way 0 Way 1 Way 2 Way 3 Way 0 Way 1 Way 2 Way 3
Invalid (V = 0)
Valid, not modified (V = 1, M = 0)
Valid, modified (V = 1, M = 1)
After reset, the cache is
invalidated, ways 0 and 1
are then written with data
that should not be
deallocated.
After CACR[HLCK] is
set, subsequent cache
accesses go to ways 2
and 3.
S
et 0
S
et 127 While the cache is
locked and after a
position in ways is full,
the set in Way 3 is
updated.
D:Write hits to ways 0
and 1 update cache
lines.
Way 0 Way 1 Way 2 Way 3
While the cache is
lock ed, ways 0 and 1 ca
n
be updated by write hits.
In this example , memor
y
is configured as
copyback, so updated
cache lines are marked
modified.
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Chapter 4. Local Memory 4-21
Cache Registers
4.10 Cache Registers
This section describes the MCF5307 implementation of the Version 3 cache registers.
4.10.1 Cache Control Register (CACR)
The CACR in Figure 4-8 contains bits for configuring the cache. It can be written by the
MO VEC re gister instruction and can be read or written from the debug f acility. A hardware
reset clears CACR, which disables the cache; however, reset does not affect the tags, state
information, or data in the cache.
Table 4-4 describes CACR fields.
31 30 29 28 27 26 25 24 23 20 19 18 17 16
Field EC — ESB DPI HLCK — CINVA —
Reset 0000_0000_0000_0000
R/W Write (R/W by debug module)
15 14 13 12 11 10 9 8 7 0
Field — DNFB DCM — DW —
Reset 0000_0000_0000_0000
R/W Write (R/W by debug module)
Rc 0x002
Figure 4-8. Cache Control Register (CACR)
Table 4-4. CACR Field Descriptions
Bits Name Description
31 EC Enable cache.
0 Cache disabled. The cache is not operational, but data and tags are preserved.
1 Cache enabled.
30 — Reserved, should be cleared.
29 ESB Enable store buffer.
0 Writes to write-through or noncachable in imprecise mode bypass the store buffer and
generate bus cycles directly. Section 4.9.5.2.1, “Push and Store Buffers,” describes the
performance penalty for this.
1 The four-entry FIFO store buffer is enabled; when imprecise mode is used, this buffer defers
pending writes to write-through or cache-inhibited regions to maximize performance.
Cache-inhibited, precise-mode accesses always bypass the store buffer.
28 DPI Disable CPUSHL invalidation.
0 Normal operation. A CPUSHL instruction causes the selected line to be pushed if modified and
then invalidated.
1 No clear operation. A CPUSHL instruction causes the selected line to be pushed if modified,
then left valid.
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4-22 MCF5307 User’s Manual
Cache Registers
4.10.2 Access Control Registers (ACR0–ACR1)
The ACRs, Figure 4-9, assign control attributes, such as cache mode and write protection,
to specified memory regions. Re gisters are accessed with the MOVEC instruction with the
Rc encodings in Figure 4-9.
For o verlapping re gions, A CR0 tak es priority. Data transfers to and from these registers are
longword transfers. Bits 12–7, 4, 3, 1, and 0 are always read as zeros.
27 HLCK Half-cache lock mode
0 Normal operation. The cache allocates the lowest invalid way. If all ways are valid, the cache
allocates the way pointed at by the counter and then increments this counter modulo-4.
1 Half-cache operation. The cache allocates to the lower inv alid wa y of levels 2 and 3; if both are
valid, the cache allocates to way 2 if the high-order bit of the round-robin counter is zero;
otherwise, it allocates way 3 and increments the round-robin counter modulo-2. This locks the
content of ways 0 and 1. Ways 0 and 1 are still updated on write hits and may be pushed or
cleared by specific cache push/invalidate instructions.
This implementation allows maximum use of available cache memory and provides the flexibility
of setting HLCK before, during, or after allocations occur.
26–25 — Reserved, should be cleared.
24 CINVA Cache invalidate all. Writing a 1 to this bit initiates entire cache invalidation. Once invalidation is
complete, this bit automatically returns to 0; it is not necessary to clear it explicitly. Note the
caches are not cleared on power-up or normal reset, as shown in Figure 4-4.
0 No invalidation is performed.
1 Initiate inv alidation of the entire cache. The cache controller sequentially clears V and M bits in
all sets. Subsequent accesses stall until the invalidation is finished, at which point, this bit is
automatically cleared. In copyback mode, the cache should be flushed using a CPUSHL
instruction before setting this bit.
23–11 — Reserved, should be cleared.
10 DNFB Default noncacheable fill buffer. Determines if the fill buffer can store noncacheable accesses
0 Fill buffer not used to store noncacheable instruction accesses (16 or 32 bits).
1 Fill buffer used to store noncacheable accesses. The fill buffer is used only for normal (TT = 0)
instruction reads of a noncacheable region. Instructions are loaded into the fill buffer b y a b urst
access (same as a line fill). They stay in the buffer until they are displaced, so subsequent
accesses may not appear on the external bus.
Note that this feature can cause a coherency problem f or self-modifying code . If DNFB = 1 and a
cache-inhibited access uses the fill buffer, instructions remain valid in the fill buffer until a
cache-inv alidate-all instruction, another cache-inhibited burst, or a miss that initiates a fill. A write
to the line in the fill buffer goes to the external bus without updating or invalidating the buffer.
Subsequent reads of that written data are serviced by the fill b uffer and receiv e stale information.
9–8 DCM Default cache mode. Selects the default cache mode and access precision as follows:
00 Cacheable, write-through
01 Cacheable, copy-back
10 Cache-inhibited, precise exception model
11 Cache-inhibited, imprecise exception model. Precise and imprecise modes are described in
Section 4.9.2, “Cache-Inhibited Accesses.”
7–6 — Reserved, should be cleared.
5 DW Default write protect. Use of this bit is described in Section 4.9.1, “Caching Modes.”
0 Read and write accesses permitted
1 Write accesses not permitted
4–0 — Reserved, should be cleared.
Table 4-4. CACR Field Descriptions (Continued)
Bits Name Description
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Chapter 4. Local Memory 4-23
Cache Registers
NOTE:
The SIM MBAR region should be mapped as cache-inhibited
through an ACR.
Table 4-5 describes ACRn fields.
I
31 2423 1615141312 76543 2 10
Field Address Base Address Mask E S — CM — W —
Reset Uninitialized 0 Uninitialized
R/W Write (R/W by debug module)
Rc ACR0: 0x004; ACR1: 0x005
Figure 4-9. Access Control Register Format (ACRn)
Table 4-5. ACRn Field Descriptions
Bits Name Description
31–24 Address
base Address base. Compared with address bits A[31:24]. Eligible addresses that match are
assigned the access control attributes of this register.
23–16 Address
mask Address mask. Setting a mask bit causes the corresponding address base bit to be ignored.
The low-order mask bits can be set to define contiguous regions larger than 16 Mbytes. The
mask can define multiple noncontiguous regions of memory.
15 E Enable. Enables or disables the other ACRn bits.
0 Access control attributes disabled
1 Access control attributes enabled
14–13 S Supervisor mode. Specifies whether only user or supervisor accesses are allowed in this
address range or if the type of access is a don’t care.
00 Match addresses only in user mode
01 Match addresses only in supervisor mode
1x Execute cache matching on all accesses
12–7 — Reserved; should be cleared.
6–5 CM Cache mode. Selects the cache mode and access precision. Precise and imprecise modes are
described in Section 4.9.2, “Cache-Inhibited Accesses.”
00 Cacheable, write-through
01 Cacheable, copyback
10 Cache-inhibited, precise
11 Cache-inhibited, imprecise
4–3 — Reserved, should be cleared.
2 W Write protect. Selects the write privilege of the memory region.
0 Read and write accesses permitted
1 Write accesses not permitted
1–0 — Reserved, should be cleared.
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4-24 MCF5307 User’s Manual
Cache Management
4.11 Cache Management
The cache can be enabled and configured by using a MOVEC instruction to access CACR.
A hardware reset clears CACR, disabling the cache and removing all configuration
information; however , reset does not affect the tags, state information, and data in the cache.
Set CACR[CINVA] to invalidate the cache before enabling it.
The privileged CPUSHL instruction supports cache management by selectively pushing
and in validating cache lines. The address register used with CPUSHL directly addresses the
cache’s directory array. The CPUSHL instruction flushes a cache line.
The value of CACR[DPI] determines whether CPUSHL invalidates a cache line after it is
pushed. To push the entire cache, implement a software loop to index through all sets and
through each of the four lines within each set (a total of 512 lines). The state of CACR[EC]
does not affect the operation of CPUSHL or CA CR[CINVA]. Disabling the cache by setting
CACR[EC] makes the cache nonoperational without affecting tags, state information, or
contents.
The contents of An used with CPUSHL specify cache row and line indexes. This differs
from the MC68040 where a physical address is specified. Figure 4-10 shows the An format.
The following code example flushes the entire cache:
_cache_disable:
nop
move.w #0x2700,SR ;mask off IRQs
jsr _cache_flush ;flush the cache completely
clr.l d0
movec d0,ACR0 ;ACR0 off
movec d0,ACR1 ;ACR1 off
move.l #0x01000000,d0 ;Invalidate and disable cache
movec d0,CACR
rts
_cache_flush:
nop ;synchronize—flush store buffer
moveq.l #0,d0 ;initialize way counter
moveq.l #0,d1 ;initialize set counter
move.l d0,a0 ;initialize cpushl pointer
setloop:
cpushl bc,(a0) ;push cache line a0
add.l #0x0010,a0 ;increment set index by 1
addq.l #1,d1 ;increment set counter
cmpi.l #128,d1 ;are sets for this way done?
bne setloop
moveq.l #0,d1 ;set counter to zero again
addq.l #1,d0 ;increment to next way
31 11 10 4 3 0
0 Set Index Line Index
Figure 4-10. An Format
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Chapter 4. Local Memory 4-25
Cache Operation Summary
move.l d0,a0 ;set = 0, way = d0
cmpi.l #4,d0 ;flushed all the ways?
bne setloop
rts
The following CACR loads assume the default cache mode is copyback.
CacheLoadAndLock:
move.l #0xA1000100,d0; enable and invalidate cache ...
movec d0,cacr ; ... in the CACR
The follo wing code preloads half of the cache (4 Kbytes). It assumes a contiguous block of
data is to be mapped into the cache, starting at a 0-modulo-4K address.
move.l #256,d0 ;256 16-byte lines in 4K space
lea data_,a0 ; load pointer defining data area
CacheLoop:
tst.b (a0) ;touch location + load into data cache
lea 16(a0),a0 ;increment address to next line
subq.l #1,d0 ;decrement loop counter
bne.b CacheLoop ;if done, then exit, else continue
; A 4K region has been loaded into levels 0 and 1 of the 8K cache. lock it!
move.l #0xA8000100,d0 ;set the cache lock bit ...
movec d0,cacr ; ... in the CACR
rts
align 16
4.12 Cache Operation Summary
This section gi ves operational details for the cache and presents cache-line state diagrams.
4.12.1 Cache State Transitions
Using the V and M bits, the cache supports a line-based protocol allo wing individual cache
lines to be invalid, valid, or modified. To maintain memory coherency, the cache supports
both write-through and copyback modes, specified by the corresponding ACR[CM], or
CACR[DCM] if no ACR matches.
Read or write misses to copyback regions cause the cache controller to read a cache line
from memory into the cache. If available, tag and data from memory update an invalid line
in the selected set. The line state then changes from invalid to valid by setting the V bit. If
all lines in the row are already valid or modified, the pseudo-round-robin replacement
algorithm selects one of the four lines and replaces the tag and data. Before replacement,
modified lines are temporarily buffered and later copied back to memory after the new line
has been read from memory.
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4-26 MCF5307 User’s Manual
Cache Operation Summary
Figure 4-11 shows the three possible cache line states and possible processor-initiated
transitions for memory configured as copyback. T ransitions are labeled with a capital letter
indicating the pre vious state and a number indicating the specific case listed in Table 4-11.
Figure 4-11. Cache Line State Diagram—Copyback Mode
Figure 4-12 shows the two possible states for a cache line in write-through mode.
Figure 4-12. Cache Line State Diagram—Write-Through Mode
Table 4-6 describes cache line transitions and the accesses that cause them.
Invalid
CD1—CPU
CI3—CPU
Valid
V = 1
Modified
read miss
write miss
CI5—CINVA
CI6—CPUSHL & DPI
CI7—CPUSHL & DPI
CV1—CPU read miss
CV2—CPU read hit
CV7—CPUSHL & DPI
CD2—CPU read hit
CD3—CPU write miss
CD4—CPU write hit
CD5—CINVA
CD6—CPUSHL & DPI CV3—CPU write miss
CV4—CPU write hit
CI1—CPU read miss
CV5—CINVA
CV6—CPUSHL & DPI
V = 0 M = 0
V = 1
M = 1
CD7—CPUSHL
& DPI
WI1—CPU read miss
Invalid Valid
WI3—CPU write miss
WI5—CINVA
WI6—CPUSHL & DPI
WI7—CPUSHL & DPI
WV1—CPU read miss
WV2—CPU read hit
WV3—CPU write miss
WV4—CPU write hit
WV7—CPUSHL & DPI
WV5—CINVA
WV6—CPUSHL & DPI
V = 0 V = 1
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Chapter 4. Local Memory 4-27
Cache Operation Summary
Table 4-6. Cache Line State Transitions
Access Current State
Invalid (V = 0) Valid (V = 1, M = 0) Modified (V = 1, M = 1)
Read
miss (C,W)I1 Read line from
memory and update
cache;
supply data to
processor;
go to valid state.
(C,W)V1 Read new line from
memory and update
cache;
supply data to processor;
stay in valid state.
CD1 Push modified line to
buffer;
read new line from memory
and update cache;
supply data to processor;
write push buffer contents
to memory;
go to valid state.
Read hit (C,W)I2 Not possible. (C,W)V2 Supply data to processor;
stay in valid state. CD2 Supply data to processor;
stay in modified state.
Write
miss
(copy-
back)
CI3 Read line from
memory and update
cache;
write data to cache;
go to modified state.
CV3 Read new line from
memory and update
cache;
write data to cache;
go to modified state.
CD3 Push modified line to
buffer;
read new line from memory
and update cache;
write push buffer contents
to memory;
stay in modified state.
Write
miss
(write-
through)
WI3 Write data to
memory;
stay in invalid state.
WV3 Write data to memory;
stay in valid state. WD3 Write data to memory;
stay in modified state.
Cache mode changed for
the region corresponding to
this line. To av oid this state,
execute a CPUSHL
instruction or set
CACR[CINVA] before
switching modes.
Write hit
(copy-
back)
CI4 Not possible. CV4 Write data to cache;
go to modified state. CD4 Write data to cache;
stay in modified state.
Write hit
(write-
through)
WI4 Not possible . WV4 Write data to memory and
to cache;
stay in valid state.
WD4 Write data to memory and
to cache;
go to valid state.
Cache mode changed for
the region corresponding to
this line. To av oid this state,
execute a CPUSHL
instruction or set
CACR[CINVA] before
switching modes.
Cache
invalidate (C,W)I5 No action;
stay in invalid state. (C,W)V5 No action;
go to invalid state. CD5 No action (modified data
lost);
go to invalid state.
Cache
push (C,W)I6
(C,W)I7 No action;
stay in invalid state. (C,W)V6 No action;
go to invalid state. CD6 Push modified line to
memory;
go to invalid state.
(C,W)V7 No action;
stay in valid state. CD7 Push modified line to
memory;
go to valid state.
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4-28 MCF5307 User’s Manual
Cache Operation Summary
The following tables present the same information as Table 4-6, organized by the current
state of the cache line. In Table 4-7 the current state is invalid.
In Table 4-8 the current state is valid.
Table 4-7. Cache Line State Transitions (Current State Invalid)
Access Response
Read miss (C,W)I1 Read line from memory and update cache;
supply data to processor;
go to valid state.
Read hit (C,W)I2 Not possible
Write miss (copyback) CI3 Read line from memory and update cache;
write data to cache;
go to modified state.
Write miss (write-through) WI3 Write data to memory;
stay in invalid state.
Write hit (copyback) CI4 Not possible
Write hit (write-through) WI4 Not possible
Cache invalidate (C,W)I5 No action;
stay in invalid state.
Cache push (C,W)I6 No action;
stay in invalid state.
Cache push (C,W)I7 No action;
stay in invalid state.
Table 4-8. Cache Line State Transitions (Current State Valid)
Access Response
Read miss (C,W)V1 Read new line from memory and update cache;
supply data to processor; stay in valid state.
Read hit (C,W)V2 Supply data to processor;
stay in valid state.
Write miss (copyback) CV3 Read new line from memory and update cache;
write data to cache;
go to modified state.
Write miss (write-through) WV3 Write data to memory;
stay in valid state.
Write hit (copyback) CV4 Write data to cache;
go to modified state.
Write hit (write-through) WV4 Write data to memory and to cache;
stay in valid state.
Cache invalidate (C,W)V5 No action;
go to invalid state.
Cache push (C,W)V6 No action;
go to invalid state.
Cache push (C,W)V7 No action;
stay in valid state.
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Chapter 4. Local Memory 4-29
Cache Initialization Code
In the current state is modified.
4.13 Cache Initialization Code
The following example sets up the cache for FLASH or ROM space only.
move.l#0x81000300,D0 //enable cache, invalidate it,
//default mode is cache-inhibited imprecise
movecD0, CACR
move.l #0xFF00C000,D0//cache FLASH space, enable,
//ignore FC2, cacheable, writethrough
movecD0,ACR0
Table 4-9. Cache Line State Transitions (Current State Modified)
Access Response
Read miss CD1 Push modified line to buffer;
read new line from memory and update cache;
supply data to processor;
write push buffer contents to memory;
go to valid state.
Read hit CD2 Supply data to processor;
stay in modified state.
Write miss
(copyback) CD3 Push modified line to buffer;
read new line from memory and update cache;
write push buffer contents to memory;
stay in modified state.
Write miss
(write-through) WD3 Write data to memory;
stay in modified state.
Cache mode changed for the region corresponding to this line. To avoid this state,
execute a CPUSHL instruction or set CACR[CINVA] before switching modes.
Write hit
(copyback) CD4 Write data to cache;
stay in modified state.
Write hit
(write-through) WD4 Write data to memory and to cache;
go to valid state.
Cache mode changed for the region corresponding to this line. To avoid this state,
execute a CPUSHL instruction or set CACR[CINVA] before switching modes.
Cache invalidate CD5 No action (modified data lost);
go to invalid state.
Cache push CD6 Push modified line to memory;
go to invalid state.
Cache push CD7 Push modified line to memory;
go to valid state.
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4-30 MCF5307 User’s Manual
Cache Initialization Code
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Chapter 5. Debug Support 5-1
Chapter 5
Debug Suppor t
This chapter describes the Revision B enhanced hardware debug support in the MC5307.
This revision of the ColdFire debug architecture encompasses the earlier revision.
5.1 Overview
The debug module is shown in Figure 5-1.
Figure 5-1. Processor/Debug Module Interface
Debug support is divided into three areas:
• Real-time trace support—The ability to determine the dynamic execution path
through an application is fundamental for debugging. The ColdFire solution
implements an 8-bit parallel output bus that reports processor execution status and
data to an external emulator system. See Section 5.3, “Real-Time Trace Support.”
• Background debug mode (BDM)—Provides low-level debugging in the ColdFire
processor complex. In BDM, the processor complex is halted and a variety of
commands can be sent to the processor to access memory and registers. The external
emulator uses a three-pin, serial, full-duplex channel. See Section 5.5, “Background
Debug Mode (BDM),” and Section 5.4, “Programming Model.”
• Real-time debug support—BDM requires the processor to be halted, which many
real-time embedded applications cannot do. Debug interrupts let real-time systems
execute a unique service routine that can quickly save the contents of key registers
and variables and return the system to normal operation. The emulator can access
sav ed data because the hardware supports concurrent operation of the processor and
BDM-initiated commands. See Section 5.6, “Real-Time Debug Support.”
ColdFire CPU Core
Debug Module
High-speed
Communication Port
DSCLK, DSI, DSO
Control
BKPT
local bus
Trace Port
PST[3:0], DDATA[3:0]
PSTCLK
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5-2 MCF5307 User’s Manual
Signal Description
The Version 2 ColdFire core implemented the original debug architecture, now called
Revision A. Based on feedback from customers and third-party developers, enhancements
have been added to succeeding generations of ColdFire cores. The Version 3 core
implements Revision B of the debug architecture, providing more flexibility for configuring
the hardware breakpoint trigger registers and removing the restrictions involving
concurrent BDM processing while hardware breakpoint registers are active.
5.2 Signal Description
Table 5-1 describes debug module signals. All ColdFire debug signals are unidirectional
and related to a rising edge of the processor core’s clock signal. The standard 26-pin debug
connector is shown in Section 5.7, “Motorola-Recommended BDM Pinout.”
Table 5-1. Debug Module Signals
Signal Description
Dev elopment Serial
Clock (DSCLK) Internally synchronized input. (The logic le v el on DSCLK is v alidated if it has the same value on
two consecutive rising CLKIN edges.) Clocks the serial communication port to the debug
module. Maximum frequency is 1/5 the processor CLK speed. At the synchronized rising edge
of DSCLK, the data input on DSI is sampled and DSO changes state.
Dev elopment Serial
Input (DSI) Internally synchronized input that provides data input for the serial communication port to the
debug module.
Dev elopment Serial
Output (DSO) Provides serial output communication for debug module responses. DSO is registered
internally.
Breakpoint (BKPT) Input used to request a manual breakpoint. Assertion of BKPT puts the processor into a halted
state after the current instruction completes. Halt status is reflected on processor status/debug
data signals (PST[3:0]) as the value 0xF. If CSR[BKD] is set (disabling normal BKPT
functionality), asserting BKPT generates a debug interrupt exception in the processor.
Processor Status
Clock (PSTCLK) Delayed version of the processor clock. Its rising edge appears in the center of valid PST and
DDATA output. See Figure 5-2. PSTCLK indicates when the development system should
sample PST and DDATA values.
If real-time trace is not used, setting CSR[PCD] keeps PSTCLK, PST and DDATA outputs from
toggling without disabling triggers. Non-quiescent operation can be reenabled by clearing
CSR[PCD], although the emulator must resynchronize with the PST and DDATA outputs.
PSTCLK starts clocking only when the first non-zero PST value (0xC, 0xD, or 0xF) occurs
during system reset exception processing. Table 5-2 describes PST values. Chapter 7,
“Phase-Locked Loop (PLL),” describes PSTCLK generation.
Debug Data
(DDATA[3:0]) These output signals display the hardw are register breakpoint status as a default, or optionally,
captured address and operand v alues. The capturing of data values is controlled by the setting
of the CSR. Additionally, execution of the WDDATA instruction by the processor captures
operands which are displayed on DDATA. These signals are updated each processor cycle.
Processor Status
(PST[3:0]) These output signals report the processor status. Table 5-2 shows the encoding of these
signals. These outputs indicate the current status of the processor pipeline and, as a result, are
not related to the current bus transfer. The PST value is updated each processor cycle.
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Chapter 5. Debug Support 5-3
Real-Time T race Support
Figure 5-2 shows PSTCLK timing with respect to PST and DDATA.
Figure 5-2. PSTCLK Timing
5.3 Real-Time Trace Suppor t
Real-time trace, which defines the dynamic execution path, is a fundamental debug
function. The ColdFire solution is to include a parallel output port providing encoded
processor status and data to an external development system. This port is partitioned into
two 4-bit nibbles: one nibble allows the processor to transmit processor status, (PST), and
the other allows operand data to be displayed (debug data, DDATA). The processor status
may not be related to the current bus transfer.
External de v elopment systems can use PST outputs with an external image of the program
to completely track the dynamic execution path. This tracking is complicated by any
change in flow, especially when branch target address calculation is based on the contents
of a program-visible register (variant addressing). DDATA outputs can be configured to
display the target address of such instructions in sequential nibble increments across
multiple processor clock cycles, as described in Section 5.3.1, “Begin Execution of Taken
Branch (PST = 0x5).” Two 32-bit storage elements form a FIFO buffer connecting the
processor’s high-speed local bus to the external de v elopment system through PST[3:0] and
DDATA[3:0]. The buffer captures branch target addresses and certain data values for
eventual display on the DDATA port, one nibble at a time starting with the lsb.
Execution speed is affected only when both storage elements contain valid data to be
dumped to the DDATA port. The core stalls until one FIFO entry is available.
Table 5-2 shows the encoding of these signals.
PSTCLK
PST or DDATA
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5-4 MCF5307 User’s Manual
Real-Time Trace Support
5.3.1 Begin Execution of Taken Branch (PST = 0x5)
PST is 0x5 when a taken branch is executed. For some opcodes, a branch target address may
be displayed on DDATA depending on the CSR settings. CSR also controls the number of
address bytes displayed, which is indicated by the PST marker value immediately
preceding the DDATA nibble that begins the data output.
Table 5-2. Processor Status Encoding
PST[3:0] Definition
Hex Binary
0x0 0000 Continue execution. Many instructions execute in one processor cycle. If an instruction requires more
clock cycles, subsequent clock cycles are indicated by driving PST outputs with this encoding.
0x1 0001 Begin execution of one instruction. For most instructions, this encoding signals the first clock cycle of
an instruction’ s ex ecution. Certain change-of-flow opcodes, plus the PULSE and WDD ATA instructions,
generate different encodings.
0x2 0010 Reserved
0x3 0011 Entry into user-mode. Signaled after ex ecution of the instruction that caused the ColdFire processor to
enter user mode.
0x4 0100 Begin ex ecution of PULSE and WDDATA instructions. PULSE defines logic analyzer triggers for debug
and/or performance analysis. WDDATA lets the core write any operand (byte, word, or longword)
directly to the DD ATA port, independent of debug module configuration. When WDDATA is executed, a
value of 0x4 is signaled on the PST port, follow ed by the appropriate marker , and then the data transf er
on the DDATA port. Transfer length depends on the WDDATA operand size.
0x5 0101 Begin execution of taken branch. For some opcodes, a branch target address may be displayed on
DDATA depending on the CSR settings. CSR also controls the number of address bytes displayed,
indicated by the PST marker value preceding the DDATA nibble that begins the data output. See
Section 5.3.1, “Begin Execution of Taken Branch (PST = 0x5).”
0x6 0110 Reserved
0x7 0111 Begin execution of return from exception (RTE) instruction.
0x8–
0xB 1000–
1011 Indicates the number of bytes to be displayed on the DDATA port on subsequent clock cycles. The
value is driven onto the PST port one clock PSTCLK cycle before the data is displayed on DDATA.
0x8 Begin 1-byte transfer on DDATA.
0x9 Begin 2-byte transfer on DDATA.
0xA Begin 3-byte transfer on DDATA.
0xB Begin 4-byte transfer on DDATA.
0xC 1100 Exception processing. Exceptions that enter emulation mode (debug interrupt or optionally trace)
generate a diff erent encoding, as described below. Because the 0xC encoding defines a multiple-cycle
mode, PST outputs are driven with 0xC until exception processing completes.
0xD 1101 Entry into emulator mode. Displayed during emulation mode (debug interrupt or optionally trace).
Because this encoding defines a multiple-cycle mode, PSToutputs are driven with 0xD until exception
processing completes.
0xE 1110 Processor is stopped. Appears in multiple-cycle format when the MCF5307 executes a STOP
instruction. The ColdFire processor remains stopped until an interrupt occurs, thus PST outputs
display 0xE until the stopped mode is exited.
0xF 1111 Processor is halted. Because this encoding defines a multiple-cycle mode, the PST outputs display
0xF until the processor is restarted or reset. (see Section 5.5.1, “CPU Halt”)
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Bytes are displayed in least-to-most-significant order. The processor captures only those
target addresses associated with taken branches which use a variant addressing mode, that
is, RTE and RTS instructions, JMP and JSR instructions using address register indirect or
indexed addressing modes, and all exception vectors.
The simplest example of a branch instruction using a variant address is the compiled code
for a C language case statement. Typically , the e valuation of this statement uses the v ariable
of an expression as an inde x into a table of offsets, where each of fset points to a unique case
within the structure. For such change-of-flo w operations, the MCF5307 uses the debug pins
to output the following sequence of information on successive processor clock cycles:
1. Use PST (0x5) to identify that a taken branch was executed.
2. Using the PST pins, optionally signal the target address to be displayed sequentially
on the DDATA pins. Encodings 0x9–0xB identify the number of bytes displayed.
3. The new target address is optionally available on subsequent cycles using the
DDATA port. The number of bytes of the target address displayed on this port is
configurable (2, 3, or 4 bytes).
Another example of a variant branch instruction would be a JMP (A0) instruction.
Figure 5-3 shows when the PST and DDATA outputs that indicate when a JMP (A0)
executed, assuming the CSR was programmed to display the lower 2 bytes of an address.
Figure 5-3. Example JMP Instruction Output on PST/DDATA
PST is dri v en with a 0x5 in the first cycle and 0x9 in the second. The 0x5 indicates a tak en
branch and the marker v alue 0x9 indicates a 2-byte address. Thus, the 4 subsequent DD ATA
nibbles display the lower 2 bytes of address register A0 in least-to-most-significant nibble
order. The PST output after the JMP instruction completes depends on the target
instruction. The PST can continue with the next instruction before the address has
completely displayed on DDATA because of the DDATA FIFO. If the FIFO is full and the
next instruction has captured values to display on DDATA, the pipeline stalls (PST = 0x0)
until space is available in the FIFO.
5.4 Programming Model
In addition to the existing BDM commands that pro vide access to the processor’s registers
and the memory subsystem, the debug module contains nine registers to support the
required functionality. These registers are also accessible from the processor’s supervisor
DDATA
PSTCLK
0x0 0x0 A[3:0]
0x5 0x9
PST
A[7:4] A[11:8] A[15:12]
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5-6 MCF5307 User’s Manual
Programming Model
programming model by executing the WDEBUG instruction. Thus, the breakpoint
hardware in the debug module can be accessed by the external development system using
the debug serial interface or by the operating system running on the processor core.
Software is responsible for guaranteeing that accesses to these resources are serialized and
logically consistent. Hardware provides a locking mechanism in the CSR to allow the
external development system to disable any attempted writes by the processor to the
breakpoint registers (setting CSR[IPW]). BDM commands must not be issued if the
MCF5307 is using the WDEBUG instruction to access debug module registers or the
resulting behavior is undefined.
These registers, shown in Figure 5-4, are treated as 32-bit quantities, regardless of the
number of implemented bits.
Figure 5-4. Debug Programming Model
These registers are accessed through the BDM port by ne w BDM commands, WDMREG and
RDMREG, described in Section 5.5.3.3, “Command Set Descriptions.” These commands
contain a 5-bit field, DRc, that specifies the register, as shown in Table 5-3.
PC breakpoint mask register
PC breakpoint register
Data breakpoint register
Data breakpoint mask register
Trigger definition register
Configuration/status register
BDM address attribute register
Note: Each debug register is accessed as a 32-bit register; shaded fields above are not used (don’t care).
All debug control registers are writable from the external development system or the CPU via the
WDEBUG instruction.
CSR is write-only from the programming model. It can be read or written through the BDM port using the
RDMREG and WDMREG commands.
Address attribute trigger register
Address low breakpoint register
Address high breakpoint register
31 15 7 0
31 15 7 0
31 15 0
31 15 0
31 15 0
31 15 0
31 15 0
31 15 0
AATR
ABLR
ABHR
BAAR
CSR
DBR
DBMR
PBR
PBMR
TDR
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Chapter 5. Debug Support 5-7
Programming Model
NOTE:
Debug control registers can be written by the external
development system or the CPU through the WDEBUG
instruction.
CSR is write-only from the programming model. It can be read
or written through the BDM port using the RDMREG and
WDMREG commands.
5.4.1 Address Attribute Trigger Register (AATR)
The address attribute trigger register (AATR) defines address attributes and a mask to be
matched in the trigger. The register value is compared with address attribute signals from
the processor’s local high-speed bus, as defined by the setting of the trigger definition
register (TDR).
Table 5-4 describes AATR fields.
Table 5-3. BDM/Breakpoint Registers
DRc[4–0] Register Name Abbreviation Initial State Page
0x00 Configuration/status register CSR 0x0010_0000 p. 5-10
0x01–0x04 Reserved — — —
0x05 BDM address attribute register BAAR 0x0000_0005 p. 5-9
0x06 Address attribute trigger register AATR 0x0000_0005 p. 5-7
0x07 Trigger definition register TDR 0x0000_0000 p. 5-14
0x08 Program counter breakpoint register PBR — p. 5-13
0x09 Program counter breakpoint mask register PBMR — p. 5-13
0x0A–0x0B Reserved — — —
0x0C Address breakpoint high register ABHR — p. 5-8
0x0D Address breakpoint low register ABLR — p. 5-8
0x0E Data breakpoint register DBR — p. 5-12
0x0F Data breakpoint mask register DBMR — p. 5-12
1514131211109876543210
Field RM SZM TTM TMM R SZ TT TM
Reset 0000_0000_0000_0101
R/W Write only. AATR is accessible in supervisor mode as debug control register 0x06 using the WDEBUG
instruction and through the BDM port using the WDMREG command.
DRc[4–0] 0x06
Figure 5-5. Address Attribute Trigger Register (AATR)
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5-8 MCF5307 User’s Manual
Programming Model
5.4.2 Address Breakpoint Registers (ABLR, ABHR)
The address breakpoint lo w and high registers (ABLR, ABHR), Figure 5-6, define regions
in the processor’s data address space that can be used as part of the trigger. These register
v alues are compared with the address for each transfer on the processor’s high-speed local
bus. The trigger definition register (TDR) identifies the trigger as one of three cases:
1. identically the value in ABLR
2. inside the range bound by ABLR and ABHR inclusive
3. outside that same range
Table 5-4. AATR Field Descriptions
Bits Name Description
15 RM Read/write mask. Setting RM masks R in address comparisons.
14–13 SZM Size mask. Setting an SZM bit masks the corresponding SZ bit in address comparisons.
12–11 TTM Transfer type mask. Setting a TTM bit masks the corresponding TT bit in address comparisons.
10–8 TMM Transfer modifier mask. Setting a TMM bit masks the corresponding TM bit in address comparisons.
7 R Read/write. R is compared with the R/W signal of the processor’s local bus.
6–5 SZ Size. Compared to the processor’s local bus size signals.
00 Longword
01 Byte
10 Word
11 Reserved
4–3 TT Transfer type. Compared with the local bus transfer type signals.
00 Normal processor access
01 Reserved
10 Emulator mode access
11 Acknowledge/CPU space access
These bits also define the TT encoding for BDM memory commands. In this case, the 01 encoding
indicates an external or DMA access (for backward compatibility). These bits affect the TM bits.
2–0 TM Transfer modifier. Compared with the local bus transfer modifier signals, which give supplemental
information for each transfer type.
TT = 00 (normal mode):
000 Explicit cache line push
001 User data access
010 User code access
011 Reserved
100 Reserved
101 Supervisor data access
110 Supervisor code access
111 Reserved
TT = 10 (emulator mode):
0xx–100 Reserved
101 Emulator mode data access
110 Emulator mode code access
111 Reserved
TT = 11 (acknowledge/CPU space transfers):
000 CPU space access
001–111 Interrupt acknowledge levels 1–7
These bits also define the TM encoding for BDM memory commands (for backward compatibility).
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Table 5-5 describes ABLR fields.
Table 5-6 describes ABHR fields.
5.4.3 BDM Address Attribute Register (BAAR)
The BAAR defines the address space for memory-referencing BDM commands. See
Figure 5-7. The reset value of 0x5 sets supervisor data as the default address space.
Table 5-7 describes BAAR fields.
31 0
Field Address
Reset —
R/W Write only. ABHR is accessible in supervisor mode as debug control register 0x0C using the WDEBUG
instruction and via the BDM port using the RDMREG and WDMREG commands.
ABLR is accessible in supervisor mode as debug control register 0x0D using the WDEBUG instruction and
via the BDM port using the WDMREG command.
DRc[4–0] 0x0D (ABLR); 0x0C (ABHR)
Figure 5-6. Address Breakpoint Registers (ABLR, ABHR)
Table 5-5. ABLR Field Description
Bits Name Description
31–0 Address Low address. Holds the 32-bit address marking the lower bound of the address breakpoint r ange .
Breakpoints for specific addresses are programmed into ABLR.
Table 5-6. ABHR Field Description
Bits Name Description
31–0 Address High address. Holds the 32-bit address marking the upper bound of the address breakpoint range.
76543210
Field R SZ TT TM
Reset 0000_0101
R/W Write only. BAAR[R,SZ] are loaded directly from the BDM command; BAAR[TT,TM] can be programmed as
debug control register 0x05 from the external development system. For compatibility with Rev. A, BAAR is
loaded each time AATR is written.
DRc[4–0] 0x05
Figure 5-7. BDM Address Attribute Register (BAAR)
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Programming Model
5.4.4 Configuration/Status Register (CSR)
The configuration/status register (CSR) defines the debug configuration for the processor
and memory subsystem and contains status information from the breakpoint logic.
Table 5-8 describes CSR fields.
Table 5-7. BAAR Field Descriptions
Bits Name Description
7 R Read/write
0 Write
1 Read
6–5 SZ Size
00 Longword
01 Byte
10 Word
11 Reserved
4–3 TT Transfer type. See the TT definition in Table 5-4.
2–0 TM Transfer modifier. See the TM definition in Table 5-4.
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Field BSTAT FOF TRG HALT BKPT HRL — BKD — IPW
Reset 0000 0 0 0 0 0001 — — — 0
R/W1R RRRR R ———R/W
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Field MAP TRC EMU DDC UHE BTB —2NPL IPI SSM —
Reset 0 0 0 00 0 00 0 0 — 0 —
R/W R/W R/W R/W R/W R/W R/W R R/W — R/W —
DRc[4–0] 0x00
1CSR is write-only from the programming model. It can be read from and written to through the BDM port. CSR
is accessible in supervisor mode as debug control register 0x00 using the WDEBUG instruction and through
the BDM port using the RDMREG and WDMREG commands.
2Bit 7 is reserved for Motorola use and must be written as a zero.
Figure 5-8. Configuration/Status Register (CSR)
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Table 5-8. CSR Field Descriptions
Bit Name Description
31–28 BSTAT Breakpoint status. Provides read-only status information concerning hardware breakpoints. BSTAT
is cleared by a TDR write or by a CSR read when either a level-2 breakpoint is triggered or a
level-1 breakpoint is triggered and the level-2 breakpoint is disabled.
0000 No breakpoints enabled
0001 Waiting for level-1 breakpoint
0010 Level-1 breakpoint triggered
0101 Waiting for level-2 breakpoint
0110 Level-2 breakpoint triggered
27 FOF Fault-on-fault. If FOF is set, a catastrophic halt occurred and forced entry into BDM.
26 TRG Hardware breakpoint trigger. If TRG is set, a hardware breakpoint halted the processor core and
forced entry into BDM. Reset and the debug GO command clear TRG.
25 HALT Processor halt. If HALT is set, the processor executed a HALT and forced entry into BDM. Reset
and the debug GO command reset HALT.
24 BKPT Breakpoint assert. If BKPT is set, BKPT w as asserted, forcing the processor into BDM. Reset and
the debug GO command clears this bit.
23–20 HRL Hardware revision level. Indicates the level of debug module functionality. An emulator could use
this information to identify the level of functionality supported.
0000 Initial debug functionality (Revision A)
0001 Revision B (this is the only valid value for the MCF5307)
19 — Reserved, should be cleared.
18 BKD Breakpoint disable. Used to disable the normal BKPT input functionality and to allow the assertion
of BKPT to generate a debug interrupt.
0 Normal operation
1 BKPT is edge-sensitive: a high-to-low edge on BKPT signals a debug interrupt to the processor.
The processor makes this interrupt request pending until the next sample point, when the
exception is initiated. In the ColdFire architecture, the interrupt sample point occurs once per
instruction. There is no support for nesting debug interrupts.
17 PCD PSTCLK disable. Setting PCD disables generation of PSTCLK, PST and DDATA outputs and
forces them to remain quiescent.
16 IPW Inhibit processor writes. Setting IPW inhibits processor-initiated writes to the debug module’s
programming model registers. IPW can be modified only by commands from the external
development system.
15 MAP Force processor references in emulator mode.
0 All emulator-mode references are mapped into supervisor code and data spaces.
1 The processor maps all references while in em ulator mode to a special address space , TT = 10,
TM = 101 or 110.
14 TRC Force emulation mode on tr ace e xception. If TRC = 1, the processor enters emulator mode when a
trace exception occurs.
13 EMU Force emulation mode. If EMU = 1, the processor begins executing in emulator mode. See
Section 5.6.1.1, “Emulator Mode.”
12–11 DDC Deb ug data control. Controls operand data capture for DD ATA, which displays the number of b ytes
defined by the operand ref erence siz e bef ore the actual data; b yte displa ys 8 bits, w ord displa ys 16
bits, and long displays 32 bits (one nibble at a time across multiple clock cycles). See Table 5-2.
00 No operand data is displayed.
01 Capture all write data.
10 Capture all read data.
11 Capture all read and write data.
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Programming Model
5.4.5 Data Breakpoint/Mask Registers (DBR, DBMR)
The data breakpoint registers, Figure 5-9, specify data patterns used as part of the trigger
into debug mode. Only DBR bits not masked with a corresponding zero in DBMR are
compared with the data from the processor’s local bus, as defined in TDR.
10 UHE User halt enable. Selects the CPU privilege level required to execute the HALT instruction.
0 HALT is a supervisor-only instruction.
1 HALT is a supervisor/user instruction.
9–8 BTB Branch target bytes. Defines the number of bytes of branch target address DDATA displays.
00 0 bytes
01 Lower 2 bytes of the target address
10 Lower 3 bytes of the target address
11 Entire 4-byte target address
See Section 5.3.1, “Begin Execution of Taken Branch (PST = 0x5).”
7 — Reserved, should be cleared.
6 NPL Non-pipelined mode. Determines whether the core operates in pipelined or mode or not.
0 Pipelined mode
1 Nonpipelined mode. The processor eff ectiv ely e x ecutes one instruction at a time with no ov erlap .
This adds at least 5 cycles to the execution time of each instruction. Instruction folding is
disabled. Given an average execution latency of 1.6, throughput in non-pipeline mode would be
6.6, approximately 25% or less of pipelined performance.
Regardless of the NPL state, a triggered PC breakpoint is always reported before the triggering
instruction executes. In normal pipeline operation, the occurrence of an address and/or data
breakpoint trigger is imprecise. In non-pipeline mode , triggers are always reported before the next
instruction begins execution and trigger reporting can be considered precise.
An address or data breakpoint should always occur before the next instruction begins execution.
Therefore the occurrence of the address/data breakpoints should be guaranteed.
5 IPI Ignore pending interrupts.
1 Core ignores any pending interrupt requests signalled while in single-instruction-step mode.
0 Core services any pending interrupt requests that were signalled while in single-step mode.
4 SSM Single-step mode. Setting SSM puts the processor in single-step mode.
0 Normal mode.
1 Single-step mode. The processor halts after execution of each instruction. While halted, any
BDM command can be executed. On receipt of the GO command, the processor executes the
next instruction and halts again. This process continues until SSM is cleared.
3–0 — Reserved, should be cleared.
31 0
Field Data (DBR); Mask (DBMR)
Reset Uninitialized
R/W DBR is accessible in supervisor mode as debug control register 0x0E, using the WDEBUG instruction and
through the BDM port using the RDMREG and WDMREG commands.
DBMR is accessible in supervisor mode as debug control register 0x0F using the WDEBUG instruction and
via the BDM port using the WDMREG command.
DRc[4–0] 0x0E (DBR), 0x0F (DBMR)
Figure 5-9. Data Breakpoint/Mask Registers (DBR and DBMR)
Table 5-8. CSR Field Descriptions (Continued)
Bit Name Description
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Table 5-9 describes DBR fields.
Table 5-10 describes DBMR fields.
The DBR supports both aligned and misaligned references. Table 5-11 shows relationships
between processor address, access size, and location within the 32-bit data bus.
5.4.6 Program Counter Breakpoint/Mask Registers
(PBR, PBMR)
The PC breakpoint register (PBR) defines an instruction address for use as part of the
trigger . This register’s contents are compared with the processor’ s program counter re gister
when TDR is configured appropriately. PBR bits are masked by clearing corresponding
PBMR bits. Results are compared with the processor’ s program counter re gister , as defined
in TDR. Figure 5-10 shows the PC breakpoint register.
Table 5-9. DBR Field Descriptions
Bits Name Description
31–0 Data Data breakpoint v alue. Contains the value to be compared with the data value from the processor’s
local bus as a breakpoint trigger.
Table 5-10. DBMR Field Descriptions
Bits Name Description
31–0 Mask Data breakpoint mask. The 32-bit mask for the data breakpoint trigger. Clearing a DBR bit allows
the corresponding DBR bit to be compared to the appropriate bit of the processor’s local data bus.
Setting a DBMR bit causes that bit to be ignored.
Table 5-11. Access Size and Operand Data Location
A[1:0] Access Size Operand Location
00 Byte D[31:24]
01 Byte D[23:16]
10 Byte D[15:8]
11 Byte D[7:0]
0x Word D[31:16]
1x Word D[15:0]
xx Longword D[31:0]
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Programming Model
Table 5-12 describes PBR fields.
Figure 5-11 shows PBMR.
Table 5-13 describes PBMR fields.
5.4.7 Trigger Definition Register (TDR)
The TDR, shown in Table 5-12, configures the operation of the hardware breakpoint logic
that corresponds with the ABHR/ABLR/AATR, PBR/PBMR, and DBR/DBMR registers
within the debug module. The TDR controls the actions taken under the defined conditions.
Breakpoint logic may be configured as a one- or two-level trigger. TDR[31–16] define the
second-level trigger and bits 15–0 define the first-level trigger.
31 10
Field Program Counter
Reset —
R/W Write. PC breakpoint register is accessible in supervisor mode using the WDEBUG instruction and through
the BDM port using the RDMREG and WDMREG commands using v alues shown in Section 5.5.3.3, “Command
Set Descriptions.”
DRc[4–0] 0x08
Figure 5-10. Program Counter Breakpoint Register (PBR)
Table 5-12. PBR Field Descriptions
Bits Name Description
31–0 Address PC breakpoint address. The 32-bit address to be compared with the PC as a breakpoint trigger.
31 0
Field Mask
Reset —
R/W Write. PBMR is accessible in supervisor mode as debug control register 0x09 using the WDEBUG
instruction and via the BDM port using the wdmreg command.
DRc[4–0] 0x09
Figure 5-11. Program Counter Breakpoint Mask Register (PBMR)
Table 5-13. PBMR Field Descriptions
Bits Name Description
31–0 Mask PC breakpoint mask. A zero in a bit position causes the corresponding PBR bit to be compared to
the appropriate PC bit. Set PBMR bits cause PBR bits to be ignored.
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Programming Model
NOTE:
The debug module has no hardware interlocks, so to prevent
spurious breakpoint triggers while the breakpoint registers are
being loaded, disable TDR (by clearing TDR[29,13] before
defining triggers.
A write to TDR clears the CSR trigger status bits, CSR[BSTAT].
Section Table 5-14., “TDR Field Descriptions,” describes how to handle multiple
breakpoint conditions.
Table 5-14 describes TDR fields.
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Field TRC EBL EDLW EDWL EDWU EDLL EDLM EDUM EDUU DI EAI EAR EAL EPC PCI
Reset 0000_0000_0000_0000
15141312 11 10 9 8 7 6 543210
Field LxT EBL EDLW EDWL EDWU EDLL EDLM EDUM EDUU DI EAI EAR EAL EPC PCI
Reset 0000_0000_0000_0000
R/W Write only. Accessible in supervisor mode as debug control register 0x07 using the WDEBUG instruction and
through the BDM port using the WDMREG command.
DRc[4–0] 0x07
Figure 5-12. Trigger Definition Register (TDR)
Table 5-14. TDR Field Descriptions
Bits Name Description
31–30 TRC Trigger response control. Determines how the processor responds to a completed trigger condition. The
trigger response is always displayed on DDATA.
00 Display on DDATA only
01 Processor halt
10 Debug interrupt
11 Reserved
15:14 LxT Level-x trigger. This is a Rev. B function. The Level-x Trigger bit determines the logic operation for the
trigger between the PC_condition and the (Address_range & Data_condition) where the inclusion of a
Data condition is optional. The ColdFire debug architecture supports the creation of single or double-level
triggers.
TDR[15]
0 Level-2 trigger = PC_condition & Address_range & Data_condition
1 Level-2 trigger = PC_condition | (Address_range & Data_condition)
TDR[14]
0 Level-1 trigger = PC_condition & Address_range & Data_condition
1 Level-1 trigger = PC_condition | (Address_range & Data_condition)
29/13 EBL Enable breakpoint. Global enable for the breakpoint trigger. Setting TDR[EBL] enables a breakpoint
trigger. Clearing it disables all breakpoints.
Second-Lev el Trigger
First-Lev el Trigger
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5-16 MCF5307 User’s Manual
Background Debug Mode (BDM)
5.5 Background Debug Mode (BDM)
The ColdFire Family implements a low-level system debugger in the microprocessor
hardware. Communication with the development system is handled through a dedicated,
high-speed serial command interface. The ColdFire architecture implements the BDM
controller in a dedicated hardware module. Although some BDM operations, such as CPU
register accesses, require the CPU to be halted, other BDM commands, such as memory
accesses, can be executed while the processor is running.
5.5.1 CPU Halt
Although many BDM operations can occur in parallel with CPU operations, unrestricted
BDM operation requires the CPU to be halted. The sources that can cause the CPU to halt
are listed below in order of priority:
1. A catastrophic fault-on-fault condition automatically halts the processor.
28–22
12–6 EDxSetting an EDx bit enables the corresponding data breakpoint condition based on the size and placement
on the processor’s local data bus. Clearing all EDx bits disables data breakpoints.
28/12 EDLW Data longword. Entire processor’s local data bus.
27/11 EDWL Lower data word.
26/10 EDWU Upper data word.
25/9 EDLL Lower lower data byte. Low-order byte of the low-order word.
24/8 EDLM Lower middle data byte. High-order byte of the low-order word.
23/7 EDUM Upper middle data byte. Low-order byte of the high-order word.
22/6 EDUU Upper upper data byte. High-order byte of the high-order word.
21/5 DI Data breakpoint invert. Provides a way to invert the logical sense of all the data breakpoint comparators.
This can develop a trigger based on the occurrence of a data value other than the DBR contents.
20–18/
4–2 EAxEnable address bits. Setting an EA bit enables the corresponding address breakpoint. Clearing all three
bits disables the breakpoint.
20/4 EAI Enable address breakpoint inverted. Breakpoint is based outside the range between ABLR and
ABHR.
19/3 EAR Enable address breakpoint range. The breakpoint is based on the inclusive range defined by
ABLR and ABHR.
18/2 EAL Enable address breakpoint low. The breakpoint is based on the address in the ABLR.
17/1 EPC Enable PC breakpoint. If set, this bit enables the PC breakpoint.
16/0 PCI Breakpoint invert. If set, this bit allows execution outside a given region as defined by PBR and PBMR to
enable a trigger. If cleared, the PC breakpoint is defined within the region defined by PBR and PBMR.
Table 5-14. TDR Field Descriptions (Continued)
Bits Name Description
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Chapter 5. Debug Support 5-17
Background Debug Mode (BDM)
2. A hardware breakpoint can be configured to generate a pending halt condition
similar to the assertion of BKPT. This type of halt is always first made pending in
the processor . Ne xt, the processor samples for pending halt and interrupt conditions
once per instruction. When a pending condition is asserted, the processor halts
execution at the next sample point. See Section 5.6.1, “Theory of Operation.”
3. The execution of a HALT instruction immediately suspends execution. Attempting
to ex ecute HALT in user mode while CSR[UHE] = 0 generates a privile ge violation
exception. If CSR[UHE] = 1, HALT can be executed in user mode. After HALT
executes, the processor can be restarted by serial shifting a GO command into the
debug module. Execution continues at the instruction after HALT.
4. The assertion of the BKPT input is treated as a pseudo-interrupt; that is, the halt
condition is postponed until the processor core samples for halts/interrupts. The
processor samples for these conditions once during the execution of each
instruction. If there is a pending halt condition at the sample time, the processor
suspends execution and enters the halted state.
The assertion of BKPT should be considered in the following two special cases:
• After the system reset signal is negated, the processor waits for 16 processor clock
cycles before beginning reset exception processing. If the BKPT input is asserted
within eight cycles after RSTI is negated, the processor enters the halt state,
signaling halt status (0xF) on the PST outputs. While the processor is in this state,
all resources accessible through the debug module can be referenced. This is the
only chance to force the processor into emulation mode through CSR[EMU].
After system initialization, the processor’ s response to the GO command depends on
the set of BDM commands performed while it is halted for a breakpoint.
Specifically, if the PC register was loaded, the GO command causes the processor to
exit halted state and pass control to the instruction address in the PC, bypassing
normal reset exception processing. If the PC was not loaded, the GO command
causes the processor to exit halted state and continue reset exception processing.
• The ColdFire architecture also handles a special case of BKPT being asserted while
the processor is stopped by execution of the STOP instruction. For this case, the
processor exits the stopped mode and enters the halted state, at which point, all BDM
commands may be ex ercised. When restarted, the processor continues by ex ecuting
the next sequential instruction, that is, the instruction following the STOP opcode.
CSR[27–24] indicates the halt source, sho wing the highest priority source for multiple halt
conditions.
5.5.2 BDM Serial Interface
When the CPU is halted and PST reflects the halt status, the de velopment system can send
unrestricted commands to the debug module. The debug module implements a synchronous
protocol using two inputs (DSCLK and DSI) and one output (DSO), where DSCLK and
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5-18 MCF5307 User’s Manual
Background Debug Mode (BDM)
DSI must meet the required input setup and hold timings and the DSO is specified as a delay
relative to the rising edge of the processor clock. See Table 5-1. The development system
serves as the serial communication channel master and must generate DSCLK.
The serial channel operates at a frequency from DC to 1/5 of the processor frequency. The
channel uses full-duplex mode, where data is sent and received simultaneously by both
master and slave devices. The transmission consists of 17-bit packets composed of a
status/control bit and a 16-bit data word. As shown in Figure 5-13, all state transitions are
enabled on a rising edge of the processor clock when DSCLK is high; that is, DSI is
sampled and DSO is driven.
Figure 5-13. BDM Serial Interface Timing
DSCLK and DSI are synchronized inputs. DSCLK acts as a pseudo clock enable and is
sampled on the rising edge of the processor CLK as well as the DSI. DSO is delayed from
the DSCLK-enabled CLK rising edge (registered after a BDM state machine state change).
All events in the debug module’s serial state machine are based on the processor clock
rising edge. DSCLK must also be sampled low (on a positive edge of CLK) between each
bit exchange. The MSB is transferred first. Because DSO changes state based on an
internally-recognized rising edge of DSCLK, DSDO cannot be used to indicate the start of
a serial transfer. The development system must count clock cycles in a given transfer.
C1–C4 are described as follows:
• C1—First synchronization cycle for DSI (DSCLK is high).
• C2—Second synchronization cycle for DSI (DSCLK is high).
• C3—BDM state machine changes state depending upon DSI and whether the entire
input data transfer has been transmitted.
• C4—DSO changes to next value.
NOTE:
A not-ready response can be ignored except during a
memory-referencing cycle. Otherwise, the debug module can
accept a new serial transfer after 32 processor clock periods.
PSTCLK
DSCLK
CPU CLK
Next State
BDM State
Machine
DSO
DSI
Current State
Current Next
Past Current
C1 C2 C3 C4
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Chapter 5. Debug Support 5-19
Background Debug Mode (BDM)
5.5.2.1 Receive Packet Format
The basic receive packet, Figure 5-14, consists of 16 data bits and 1 status bit.
Table 5-15 describes receive BDM packet fields.
5.5.2.2 Transmit Packet Format
The basic transmit packet, Figure 5-15, consists of 16 data bits and 1 control bit.
Table 5-16 describes transmit BDM packet fields.
5.5.3 BDM Command Set
Table 5-17 summarizes the BDM command set. Subsequent paragraphs contain detailed
descriptions of each command. Issuing a BDM command when the processor is accessing
debug module registers using the WDEBUG instruction causes undefined behavior.
16 15 0
S Data Field [15:0]
Figure 5-14. Receive BDM Packet
Table 5-15. Receive BDM Packet Field Description
Bits Name Description
16 S Status. Indicates the status of CPU-generated messages listed below. The not-ready response can
be ignored unless a memory-referencing cycle is in progress. Otherwise, the debug module can
accept a new serial transfer after 32 processor clock periods.
SData Message
0 xxxx Valid data transfer
0 0xFFFF Status OK
1 0x0000 Not ready with response; come again
1 0x0001 Error—Terminated bus cycle; data invalid
1 0xFFFF Illegal command
15–0 Data Data. Contains the message to be sent from the debug module to the development system. The
response message is always a single word, with the data field encoded as shown above.
16 15 0
C D[15:0]
Figure 5-15. Transmit BDM Packet
Table 5-16. Transmit BDM Packet Field Description
Bits Name Description
16 C Control. This bit is reserved. Command and data transfers initiated by the development system
should clear C.
15–0 Data Contains the data to be sent from the development system to the debug module.
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5-20 MCF5307 User’s Manual
Background Debug Mode (BDM)
Unassigned command opcodes are reserved by Motorola. All unused command formats
within any revision level perform a NOP and return the illegal command response.
5.5.3.1 ColdFire BDM Command Format
All ColdFire Family BDM commands include a 16-bit operation word followed by an
optional set of one or more extension words, as shown in Figure 5-16.
Table 5-17. BDM Command Summary
Command Mnemonic Description CPU
State1
1General command effect and/or requirements on CPU operation:
- Halted. The CPU must be halted to perform this command.
- Steal. Command generates bus cycles that can be interleaved with bus accesses.
- Parallel. Command is executed in parallel with CPU activity.
Section Command
(Hex)
Read A/D
register RAREG/
RDREG Read the selected address or data register and
return the results through the serial interface. Halted 5.5.3.3.1 0x218 {A/D,
Reg[2:0]}
Write A/D
register WAREG/
WDREG Write the data operand to the specified address or
data register. Halted 5.5.3.3.2 0x208 {A/D,
Reg[2:0]}
Read
memory
location
READ Read the data at the memory location specified by
the longword address. Steal 5.5.3.3.3 0x1900—byte
0x1940—word
0x1980—lword
Write
memory
location
WRITE Write the operand data to the memory location
specified by the longword address. Steal 5.5.3.3.4 0x1800—byte
0x1840—word
0x1880—lword
Dump
memory
block
DUMP Used with READ to dump large blocks of memory.
An initial READ is executed to set up the starting
address of the block and to retrieve the first result.
A DUMP command retrieves subsequent operands.
Steal 5.5.3.3.5 0x1D00—byte
0x1D40—word
0x1D80—lword
Fill memory
block FILL Used with WRITE to fill large blocks of memory. An
initial WRITE is executed to set up the starting
address of the bloc k and to supply the first operand.
A FILL command writes subsequent operands.
Steal 5.5.3.3.6 0x1C00—byte
0x1C40—word
0x1C80—lword
Resume
execution GO The pipeline is flushed and refilled bef ore resuming
instruction execution at the current PC. Halted 5.5.3.3.7 0x0C00
No operation NOP Perform no operation; may be used as a null
command. Parallel 5.5.3.3.8 0x0000
Output the
current PC SYNC_PC Capture the current PC and display it on the
PST/DDATA output pins. Parallel 5.5.3.3.9 0x0001
Read control
register RCREG Read the system control register. Halted 5.5.3.3.10 0x2980
Write control
register WCREG Write the operand data to the system control
register. Halted 5.5.3.3.11 0x2880
Read debug
module
register
RDMREG Read the debug module register. Parallel 5.5.3.3.12 0x2D {0x42
DRc[4:0]}
20x4 is a three-bit field.
Write debug
module
register
WDMREG Write the operand data to the debug module
register. Parallel 5.5.3.3.13 0x2C {0x42
Drc[4:0]}
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Chapter 5. Debug Support 5-21
Background Debug Mode (BDM)
Table 5-18 describes BDM fields.
5.5.3.1.1 Extension Words as Required
Some commands require extension words for addresses and/or immediate data. Addresses
require two extension words because only absolute long addressing is permitted. Longword
accesses are forcibly longword-aligned and word accesses are forcibly word-aligned.
Immediate data can be 1 or 2 words long. Byte and word data each requires a single
extension word and longword data requires two extension words.
Operands and addresses are transferred most-significant word first. In the following
descriptions of the BDM command set, the optional set of extension words is defined as
address, data, or operand data.
5.5.3.2 Command Sequence Diagrams
The command sequence diagram in Figure 5-17 shows serial bus traffic for commands.
Each bubble represents a 17-bit bus transfer. The top half of each b ubble indicates the data
the development system sends to the debug module; the bottom half indicates the debug
module’s response to the previous development system commands. Command and result
transactions overlap to minimize latency.
15 1098765432 0
Operation 0 R/W Op Size 0 0 A/D Register
Extension Word(s)
Figure 5-16. BDM Command Format
Table 5-18. BDM Field Descriptions
Bit Name Description
15–10 Operation Specifies the command. These values are listed in Table 5-17.
9 0 Reserved
8 R/W Direction of operand transfer.
0 Data is written to the CPU or to memory from the development system.
1 The transfer is from the CPU to the development system.
7–6 Operand
Size Operand data size for sized operations. Addresses are expressed as 32-bit absolute values.
Note that a command performing a byte-sized memory read leaves the upper 8 bits of the
response data undefined. Referenced data is returned in the lower 8 bits of the response.
Operand Size Bit Values
00 Byte 8 bits
01 Word 16 bits
10 Longword 32 bits
11 Reserved —
5–4 00 Reserved
3 A/D Address/data. Determines whether the register field specifies a data or address register.
0 Indicates a data register.
1 Indicates an address register.
2–0 Register Contains the register number in commands that operate on processor registers.
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5-22 MCF5307 User’s Manual
Background Debug Mode (BDM)
Figure 5-17. Command Sequence Diagram
The sequence is as follows:
• In cycle 1, the de v elopment system command is issued (READ in this example). The
debug module responds with either the low-order results of the previous command
or a command complete status of the previous command, if no results are required.
• In cycle 2, the development system supplies the high-order 16 address bits. The
debug module returns a not-ready response unless the recei ved command is decoded
as unimplemented, which is indicated by the illegal command encoding. If this
occurs, the development system should retransmit the command.
NOTE:
A not-ready response can be ignored except during a
memory-referencing cycle. Otherwise, the debug module can
accept a new serial transfer after 32 processor clock periods.
• In cycle 3, the development system supplies the low-order 16 address bits. The
debug module always returns a not-ready response.
• At the completion of cycle 3, the debug module initiates a memory read operation.
Any serial transfers that be gin during a memory access return a not-ready response.
COMMANDS TRANSMITTED TO THE DEBUG MODULE
COMMAND CODE TRANSMITTED DURING THIS CYCLE
HIGH-ORDER 16 BITS OF MEMORY ADDRESS
LOW-ORDER 16 BITS OF MEMORY ADDRESS
SEQUENCE TAKEN IF
OPERATION HAS NOT
COMPLETED
DATA UNUSED FROM
THIS TRANSFER
SEQUENCE TAKEN IF
ILLEGAL COMMAND
IS RECEIVED BY DEBUG MODULE
RESULTS FROM PREVIOUS COMMAND
RESPONSES FROM THE DEBUG MODULE
NONSERIAL-RELATED ACTIVITY
MS ADDR
"NOT READY"
XXX
"ILLEGAL"
LS ADDR
"NOT READY"
NEXT CMD
"NOT READY"
READ (LONG)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXXXX
XXX
BERR
MS RESULT NEXT CMD
LS RESULT
READ
MEMORY
LOCATION
NEXT
COMMAND
CODE
SEQUENCE TAKEN IF BUS
ERROR OCCURS ON
MEMORY ACCESS
HIGH- AND LOW-ORDER
16 BITS OF RESULT
XXX
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Chapter 5. Debug Support 5-23
Background Debug Mode (BDM)
• Results are returned in the two serial transfer cycles after the memory access
completes. For any command performing a byte-sized memory read operation, the
upper 8 bits of the response data are undefined and the referenced data is returned in
the lo wer 8 bits. The next command’s opcode is sent to the debug module during the
final transfer. If a memory or register access is terminated with a bus error, the error
status (S = 1, DATA = 0x0001) is returned instead of result data.
5.5.3.3 Command Set Descriptions
The following sections describe the commands summarized in Table 5-17.
NOTE:
The BDM status bit (S) is 0 for normally completed
commands; S = 1 for illegal commands, not-ready responses,
and transfers with bus-errors. Section 5.5.2, “BDM Serial
Interface,” describes the receive packet format.
Motorola reserves unassigned command opcodes for future expansion. Unused command
formats in any revision level perform a NOP and return an illegal command response.
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5-24 MCF5307 User’s Manual
Background Debug Mode (BDM)
5.5.3.3.1 Read A/D Register (RAREG/RDREG)
Read the selected address or data register and return the 32-bit result. A bus error response
is returned if the CPU core is not halted.
Command/Result Formats:
Command Sequence:
Figure 5-19. RAREG/RDREG Command Sequence
Operand Data: None
Result Data: The contents of the selected register are returned as a longword
value, most-significant word first.
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Command 0x2 0x1 0x8 A/D Register
Result D[31:16]
D[15:0]
Figure 5-18. RAREG/RDREG Command Format
XXX
MS RESULT NEXT CMD
LS RESULT
RAREG/RDREG
???
XXX
BERR NEXT CMD
"NOT READY"
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Chapter 5. Debug Support 5-25
Background Debug Mode (BDM)
5.5.3.3.2 Write A/D Register (WAREG/WDREG)
The operand longword data is written to the specified address or data re gister . A write alters
all 32 register bits. A bus error response is returned if the CPU core is not halted.
Command Format:
Command Sequence
Figure 5-21. WAREG/WDREG Command Sequence
Operand Data Longword data is written into the specified address or data register.
The data is supplied most-significant word first.
Result Data Command complete status is indicated by returning 0xFFFF (with S
cleared) when the register write is complete.
1514131211109876543210
0x2 0x0 0x8 A/D Register
D[31:16]
D[15:0]
Figure 5-20. WAREG/WDREG Command Format
MS DATA
"NOT READY"
XXX
LS DATA
"NOT READY"
NEXT CMD
"NOT READY"
WDREG/WAREG
??? NEXT CMD
"CMD COMPLETE"
BERR
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5-26 MCF5307 User’s Manual
Background Debug Mode (BDM)
5.5.3.3.3 Read Memory Location (READ)
Read data at the longword address. Address space is defined by B AAR[TT,TM]. Hardware
forces low-order address bits to zeros for word and longword accesses to ensure that word
addresses are word-aligned and longword addresses are longword-aligned.
Command/Result Formats:
Command Sequence:
Figure 5-23. READ Command Sequence
Operand Data The only operand is the longword address of the requested location.
Result Data W ord results return 16 bits of data; longword results return 32. Bytes
are returned in the LSB of a word result, the upper byte is undefined.
0x0001 (S = 1) is returned if a bus error occurs.
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Byte
Command 0x1 0x9 0x0 0x0
A[31:16]
A[15:0]
Result XXXXXXXX D[7:0]
Word Command 0x1 0x9 0x4 0x0
A[31:16]
A[15:0]
Result D[15:0]
Longword Command 0x1 0x9 0x8 0x0
A[31:16]
A[15:0]
Result D[31:16]
D[15:0]
Figure 5-22. READ Command/Result Formats
MS ADDR
"NOT READY" LS ADDR
"NOT READY"
READ (B/W)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
RESULT
NEXT CMD
READ
MEMORY
LOCATION
MS ADDR
"NOT READY" LS ADDR
"NOT READY"
READ (LONG)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
MS RESULT
XXX
READ
MEMORY
LOCATION NEXT CMD
LS RESULT
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Chapter 5. Debug Support 5-27
Background Debug Mode (BDM)
5.5.3.3.4 Write Memory Location (WRITE)
Write data to the memory location specified by the longword address. The address space is
defined by BAAR[TT,TM]. Hardware forces low-order address bits to zeros for word and
longword accesses to ensure that word addresses are w ord-aligned and longword addresses
are longword-aligned.
Command Formats:
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Byte 0x1 0x8 0x0 0x0
A[31:16]
A[15:0]
X X X X X X X X D[7:0]
Word 0x1 0x8 0x4 0x0
A[31:16]
A[15:0]
D[15:0]
Longword 0x1 0x8 0x8 0x0
A[31:16]
A[15:0]
D[31:16]
D[15:0]
Figure 5-24. WRITE Command Format
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5-28 MCF5307 User’s Manual
Background Debug Mode (BDM)
Command Sequence:
Figure 5-25. WRITE Command Sequence
Operand Data This two-operand instruction requires a longword absolute address
that specifies a location to which the data operand is to be written.
Byte data is sent as a 16-bit word, justified in the LSB; 16- and 32-bit
operands are sent as 16 and 32 bits, respectively
Result Data Command complete status is indicated by returning 0xFFFF (with S
cleared) when the register write is complete. A value of 0x0001 (with
S set) is returned if a bus error occurs.
MS ADDR
"NOT READY" LS ADDR
"NOT READY"
WRITE (B/W)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
"CMD COMPLETE"
NEXT CMD
WRITE
MEMORY
LOCATION
DATA
"NOT READY"
MS ADDR
"NOT READY" LS ADDR
"NOT READY"
WRITE (LONG)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
"CMD COMPLETE"
NEXT CMD
WRITE
MEMORY
LOCATION
MS DATA
"NOT READY"
LS DATA
"NOT READY"
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Chapter 5. Debug Support 5-29
Background Debug Mode (BDM)
5.5.3.3.5 Dump Memory Block (DUMP)
DUMP is used with the READ command to access large blocks of memory. An initial READ
is executed to set up the starting address of the block and to retrieve the first result. If an
initial READ is not e xecuted before the first DUMP, an ille gal command response is returned.
The DUMP command retrieves subsequent operands. The initial address is incremented by
the operand size (1, 2, or 4) and sav ed in a temporary register . Subsequent DUMP commands
use this address, perform the memory read, increment it by the current operand size, and
store the updated address in the temporary register.
NOTE:
DUMP does not check for a v alid address; it is a v alid command
only when preceded by NOP, READ, or another DUMP command.
Otherwise, an illegal command response is returned. NOP can
be used for intercommand padding without corrupting the
address pointer.
The size field is examined each time a DUMP command is processed, allowing the operand
size to be dynamically altered.
Command/Result Formats:
1514131211109876543210
Byte Command 0x1 0xD 0x0 0x0
Result XXXXXXXX D[7:0]
Word Command 0x1 0xD 0x4 0x0
Result D[15:0]
Longword Command 0x1 0xD 0x8 0x0
Result D[31:16]
D[15:0]
Figure 5-26. DUMP Command/Result Formats
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5-30 MCF5307 User’s Manual
Background Debug Mode (BDM)
Command Sequence:
Figure 5-27. DUMP Command Sequence
Operand Data: None
Result Data: Requested data is returned as either a word or longw ord. Byte data is
returned in the least-significant byte of a word result. Word results
return 16 bits of significant data; longword results return 32 bits. A
value of 0x0001 (with S set) is returned if a bus error occurs.
XXX
"NOT READY"
NEXT CMD
RESULT
XXX
BERR
XXX
"ILLEGAL" NEXT CMD
"NOT READY" NEXT CMD
"NOT READY"
READ
MEMORY
LOCATION
DUMP (B/W)
???
XXX
"NOT READY"
NEXT CMD
MS RESULT
XXX
BERR
XXX
"ILLEGAL" NEXT CMD
"NOT READY" NEXT CMD
"NOT READY"
READ
MEMORY
LOCATION
DUMP (LONG)
???
NEXT CMD
LS RESULT
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Chapter 5. Debug Support 5-31
Background Debug Mode (BDM)
5.5.3.3.6 Fill Memory Block (FILL)
A FILL command is used with the WRITE command to access large blocks of memory. An
initial WRITE is executed to set up the starting address of the block and to supply the first
operand. The FILL command writes subsequent operands. The initial address is incremented
by the operand size (1, 2, or 4) and saved in a temporary register after the memory write.
Subsequent FILL commands use this address, perform the write, increment it by the current
operand size, and store the updated address in the temporary register.
If an initial WRITE is not executed preceding the first FILL command, the illegal command
response is returned.
NOTE:
The FILL command does not check for a valid address—FILL is
a valid command only when preceded by another FILL, a NOP,
or a WRITE command. Otherwise, an illegal command response
is returned. The NOP command can be used for intercommand
padding without corrupting the address pointer.
The size field is examined each time a FILL command is processed, allowing the operand
size to be altered dynamically.
Command Formats:
1514131211109876543210
Byte 0x1 0xC 0x0 0x0
XXXXXXXX D[7:0]
Word 0x1 0xC 0x4 0x0
D[15:0]
Longword 0x1 0xC 0x8 0x0
D[31:16]
D[15:0]
Figure 5-28. FILL Command Format
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5-32 MCF5307 User’s Manual
Background Debug Mode (BDM)
Command Sequence:
Figure 5-29. FILL Command Sequence
Operand Data: A single operand is data to be written to the memory location. Byte
data is sent as a 16-bit word, justified in the least-significant byte; 16-
and 32-bit operands are sent as 16 and 32 bits, respectively.
Result Data: Command complete status (0xFFFF) is returned when the register
write is complete. A value of 0x0001 (with S set) is returned if a b us
error occurs.
NEXT CMD
"NOT READY"
"NOT READY"
XXX
BERR
"CMD COMPLETE"
DATA
"NOT READY" XXX
NEXT CMD
XXX
"ILLEGAL" NEXT CMD
"NOT READY"
FILL (LONG)
???
WRITE
MEMORY
LOCATION
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
BERR
"CMD COMPLETE"
MS DATA
"NOT READY"
NEXT CMDXXX
"ILLEGAL" NEXT CMD
"NOT READY"
LS DATA
"NOT READY"
WRITE
MEMORY
LOCATION
FILL (B/W)
???
FILL (LONG)
FILL (B/W)
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Chapter 5. Debug Support 5-33
Background Debug Mode (BDM)
5.5.3.3.7 Resume Execution (GO)
The pipeline is flushed and refilled before normal instruction execution resumes.
Prefetching begins at the current address in the PC and at the current privile ge lev el. If an y
register (such as the PC or SR) is altered by a BDM command while the processor is halted,
the updated value is used when prefetching resumes. If a GO command is issued and the
CPU is not halted, the command is ignored.
Command Sequence:
Figure 5-31. GO Command Sequence
Operand Data: None
Result Data: The command-complete response (0xFFFF) is returned during the
next shift operation.
1514131211109876543210
0x0 0xC 0x0 0x0
Figure 5-30. GO Command Format
GO
??? NEXT CMD
"CMD COMPLETE"
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5-34 MCF5307 User’s Manual
Background Debug Mode (BDM)
5.5.3.3.8 No Operation (NOP)
NOP performs no operation and may be used as a null command where required.
Command Formats:
Command Sequence:
Figure 5-33. NOP Command Sequence
Operand Data: None
Result Data: The command-complete response, 0xFFFF (with S cleared), is
returned during the next shift operation.
15 12 11 8 7 4 3 0
0x0 0x0 0x0 0x0
Figure 5-32. NOP Command Format
NOP
??? NEXT CMD
"CMD COMPLETE"
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Chapter 5. Debug Support 5-35
Background Debug Mode (BDM)
5.5.3.3.9 Synchronize PC to the PST/DDATA Lines (SYNC_PC)
The SYNC_PC command captures the current PC and displays it on the PST/DDATA
outputs. After the debug module receives the command, it sends a signal to the ColdFire
processor that the current PC must be displayed. The processor then forces an instruction
fetch at the next PC with the address being captured in the DDATA logic under control of
CSR[BTB]. The specific sequence of PST and DDATA values is as follows:
1. Debug signals a SYNC_PC command is pending.
2. CPU completes the current instruction.
3. CPU forces an instruction fetch to the next PC, generates a PST = 0x5 value
indicating a taken branch and signals the capture of DDATA.
4. The instruction address corresponding to the PC is captured.
5. The PST marker (0x9–0xB) is generated and displayed as defined by CSR[BTB]
followed by the captured PC address.
The SYNC_PC command can be used to dynamically access the PC for performance
monitoring. The execution of this command is considerably less obtrusive to the real-time
operation of an application than a HALT-CPU/READ-PC/RESUME command sequence.
Command Formats:
Command Sequence:
Figure 5-35. SYNC_PC Command Sequence
Operand Data: None
Result Data: Command complete status (0xFFFF) is returned when the register
write is complete.
15 12 11 8 7 4 3 0
0x0 0x0 0x0 0x1
Figure 5-34. SYNC_PC Command Format
NOP
??? NEXT CMD
"CMD COMPLETE"
SYNC_PC
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5-36 MCF5307 User’s Manual
Background Debug Mode (BDM)
5.5.3.3.10 Read Control Register (RCREG)
Read the selected control register and return the 32-bit result. Accesses to the
processor/memory control registers are always 32 bits wide, regardless of register width.
The second and third words of the command form a 32-bit address, which the debug
module uses to generate a special bus cycle to access the specified control register. The
12-bit Rc field is the same as that used by the MOVEC instruction.
Command/Result Formats:
Rc encoding:
Command Sequence:
Figure 5-37. RCREG Command Sequence
Operand Data: The only operand is the 32-bit Rc control register select field.
Result Data: Control register contents are returned as a longword,
most-significant word first. The implemented portion of registers
smaller than 32 bits is guaranteed correct; other bits are undefined.
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Command 0x2 0x9 0x8 0x0
0x0 0x0 0x0 0x0
0x0 Rc
Result D[31:16]
D[15:0]
Figure 5-36. RCREG Command/Result Formats
Table 5-19. Control Register Map
Rc Register Definition Rc Register Definition
0x002 Cache control register (CACR) 0x805 MAC mask register (MASK)1
0x004 Access control register 0 (ACR0) 0x806 MAC accumulator (ACC)1
0x005 Access control register 1 (ACR1) 0x80E Status register (SR)
0x801 Vector base register (VBR) 0x80F Program register (PC)
0x804 MAC status register (MACSR)1
1Available if the optional MAC unit is present.
0xC04 RAM base address register (RAMBAR)
EXT WORD
"NOT READY" EXT WORD
"NOT READY"
RCREG
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
MS RESULT
READ
MEMORY
LOCATION NEXT CMD
LS RESULT
XXX
MS ADDR CONTROL
REGISTER
MS ADDR
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Chapter 5. Debug Support 5-37
Background Debug Mode (BDM)
5.5.3.3.11 Write Control Register (WCREG)
The operand (longword) data is written to the specified control re gister. The write alters all
32 register bits.
Command/Result Formats:
Command Sequence:
Figure 5-39. WCREG Command Sequence
Operand Data: This instruction requires two longword operands. The first selects the
register to which the operand data is to be written; the second
contains the data.
Result Data: Successful write operations return 0xFFFF. Bus errors on the write
cycle are indicated by the setting of bit 16 in the status message and
by a data pattern of 0x0001.
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Command 0x2 0x8 0x8 0x0
0x0 0x0 0x0 0x0
0x0 Rc
Result D[31:16]
D[15:0]
Figure 5-38. WCREG Command/Result Formats
EXT WORD
"NOT READY" EXT WORD
"NOT READY"
WCREG
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
"CMD COMPLETE"
NEXT CMD
WRITE
MEMORY
LOCATION
MS DATA
"NOT READY"
LS DATA
"NOT READY" CONTROL
REGISTER
WRITE
MS ADDR MS ADDR
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5-38 MCF5307 User’s Manual
Background Debug Mode (BDM)
5.5.3.3.12 Read Debug Module Register (RDMREG)
Read the selected debug module re gister and return the 32-bit result. The only v alid register
selection for the RDMREG command is CSR (DRc = 0x00). Note that this read of the CSR
clears the trigger status bits (CSR[BSTAT]) if either a level-2 breakpoint has been triggered
or a level-1 breakpoint has been triggered and no level-2 breakpoint has been enabled.
Command/Result Formats:
Table 5-20 shows the definition of DRc encoding.
Command Sequence:
Figure 5-41. RDMREG Command Sequence
Operand Data: None
Result Data: The contents of the selected debug register are returned as a
longword value. The data is returned most-significant word first.
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Command 0x2 0xD 0x41
1Note 0x4 is a 3-bit field
DRc
Result D[31:16]
D[15:0]
Figure 5-40. RDMREG BDM Command/Result Formats
Table 5-20. Definition of DRc Encoding—Read
DRc[4:0] Debug Register Definition Mnemonic Initial State Page
0x00 Configuration/Status CSR 0x0 p. 5-10
0x01–0x1F Reserved ———
XXX
MS RESULT
XXX
"ILLEGAL"
NEXT CMD
LS RESULT
NEXT CMD
"NOT READY"
RDMREG
???
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Chapter 5. Debug Support 5-39
Real-Time Debug Support
5.5.3.3.13 Write Debug Module Register (WDMREG)
The operand (longword) data is written to the specified debug module register. All 32 bits
of the register are altered by the write. DSCLK must be inactive while the debug module
register writes from the CPU accesses are performed using the WDEBUG instruction.
Command Format:
Table 5-3 shows the definition of the DRc write encoding.
Command Sequence:
Figure 5-43. WDMREG Command Sequence
Operand Data: Longw ord data is written into the speci fied debug re gister. The data
is supplied most-significant word first.
Result Data: Command complete status (0xFFFF) is returned when register write
is complete.
5.6 Real-Time Debug Suppor t
The ColdFire Family pro vides support debugging real-time applications. F or these types of
embedded systems, the processor must continue to operate during debug. The foundation
of this area of debug support is that while the processor cannot be halted to allow
debugging, the system can generally tolerate small intrusions into the real-time operation.
The debug module provides three types of breakpoints—PC with mask, operand address
range, and data with mask. These breakpoints can be configured into one- or two-level
triggers with the exact trigger response also programmable. The debug module
programming model can be written from either the external development system using the
debug serial interface or from the processor’s supervisor programming model using the
WDEBUG instruction. Only CSR is readable using the external development system.
Figure 5-42. WDMREG BDM Command Format
1514131211109876543210
0x2 0xC 0x41
1Note: 0x4 is a three-bit field
DRc
D[31:16]
D[15:0]
MS DATA
"NOT READY"
XXX
"ILLEGAL"
LS DATA
"NOT READY"
NEXT CMD
"NOT READY"
WDMREG
??? NEXT CMD
"CMD COMPLETE"
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5-40 MCF5307 User’s Manual
Real-Time Debug Support
5.6.1 Theory of Operation
Breakpoint hardware can be configured to respond to triggers in se veral ways. The response
desired is programmed into TDR. As shown in Table 5-21, when a breakpoint is triggered,
an indication (CSR[BSTAT]) is provided on the DDATA output port when it is not
displaying captured processor status, operands, or branch addresses.
The breakpoint status is also posted in CSR. Note that CSR[BSTAT] is cleared by a CSR
read when either a le vel-2 breakpoint is triggered or a level-1 breakpoint is triggered and a
level-2 breakpoint is not enabled. Status is also cleared by writing to TDR.
BDM instructions use the appropriate registers to load and configure breakpoints. As the
system operates, a breakpoint trigger generates the response defined in TDR.
PC breakpoints are treated in a precise manner—exception recognition and processing are
initiated before the excepting instruction is executed. All other breakpoint events are
recognized on the processor’ s local b us, but are made pending to the processor and sampled
like other interrupt conditions. As a result, these interrupts are imprecise.
In systems that tolerate the processor being halted, a BDM-entry can be used. With
TDR[TRC] = 01, a breakpoint trigger causes the core to halt (PST = 0xF).
If the processor core cannot be halted, the debug interrupt can be used. With this
configuration, TDR[TRC] = 10, the breakpoint trigger becomes a debug interrupt to the
processor, which is treated higher than the nonmaskable level-7 interrupt request. As with
all interrupts, it is made pending until the processor reaches a sample point, which occurs
once per instruction. Again, the hardware forces the PC breakpoint to occur before the
targeted instruction executes. This is possible because the PC breakpoint is enabled when
interrupt sampling occurs. For address and data breakpoints, reporting is considered
imprecise because several instructions may execute after the triggering address or data is
detected.
As soon as the debug interrupt is recognized, the processor aborts execution and initiates
exception processing. This event is signaled externally by the assertion of a unique PST
value (PST = 0xD) for multiple cycles. The core enters emulator mode when exception
processing begins. After the standard 8-byte exception stack is created, the processor
Table 5-21. DDATA[3:0]/CSR[BSTAT] Breakpoint Response
DDATA[3:0]/CSR[BSTAT] 1
1Encodings not shown are reserved for future use.
Breakpoint Status
0000/0000 No breakpoints enabled
0010/0001 Waiting for level-1 breakpoint
0100/0010 Level-1 breakpoint triggered
1010/0101 Waiting for level-2 breakpoint
1100/0110 Level-2 breakpoint triggered
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Chapter 5. Debug Support 5-41
Real-Time Debug Support
fetches a unique exception vector, 12, from the vector table.
Execution continues at the instruction address in the v ector corresponding to the breakpoint
triggered. All interrupts are ignored while the processor is in emulator mode. The debug
interrupt handler can use supervisor instructions to save the necessary context such as the
state of all program-visible registers into a reserved memory area.
When debug interrupt operations complete, the RTE instruction executes and the processor
exits emulator mode. After the debug interrupt handler completes execution, the external
development system can use BDM commands to read the reserved memory locations.
The generation of another debug interrupt during the first instruction after the RTE exits
emulator mode is inhibited. This behavior is consistent with the existing logic involving
trace mode where the first instruction ex ecutes before another trace e xception is generated.
Thus, all hardware breakpoints are disabled until the first instruction after the RTE
completes execution, regardless of the programmed trigger response.
5.6.1.1 Emulator Mode
Emulator mode is used to facilitate non-intrusi v e emulator functionality. This mode can be
entered in three different ways:
• Setting CSR[EMU] forces the processor into emulator mode. EMU is examined
only if RSTI is negated and the processor begins reset exception processing. It can
be set while the processor is halted before reset exception processing begins. See
Section 5.5.1, “CPU Halt.”
• A debug interrupt always puts the processor in emulation mode when debug
interrupt exception processing begins.
• Setting CSR[TRC] forces the processor into emulation mode when trace exception
processing begins.
While operating in emulation mode, the processor exhibits the following properties:
• All interrupts are ignored, including level-7 interrupts.
• If CSR[MAP] = 1, all caching of memory and the SRAM module are disabled. All
memory accesses are forced into a specially mapped address space signaled by
TT = 0x2, TM = 0x5 or 0x6. This includes stack frame writes and the vector fetch
for the exception that forced entry into this mode.
The RTE instruction exits emulation mode. The processor status output port provides a
unique encoding for emulator mode entry (0xD) and exit (0x7).
5.6.2 Concurrent BDM and Processor Operation
The debug module supports concurrent operation of both the processor and most BDM
commands. BDM commands may be ex ecuted while the processor is running, except those
following operations that access processor/memory registers:
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5-42 MCF5307 User’s Manual
Motorola-Recommended BDM Pinout
• Read/write address and data registers
• Read/write control registers
For BDM commands that access memory, the debug module requests the processor’s local
bus. The processor responds by stalling the instruction fetch pipeline and waiting for
current bus activity to complete before freeing the local bus for the debug module to
perform its access. After the debug module bus cycle, the processor reclaims the bus.
Breakpoint registers must be carefully configured in a de v elopment system if the processor
is executing. The debug module contains no hardware interlocks, so TDR should be
disabled while breakpoint registers are loaded, after which TDR can be written to define the
exact trigger. This prevents spurious breakpoint triggers.
Because there are no hardware interlocks in the deb ug unit, no BDM operations are allowed
while the CPU is writing the debug’s registers (DSCLK must be inactive).
5.7 Motorola-Recommended BDM Pinout
The ColdFire BDM connector, Figure 5-44, is a 26-pin Berg connector arranged 2 x 13.
Figure 5-44. Recommended BDM Connector
5.8 Processor Status, DDATA Definition
This section specifies the ColdFire processor and debug module’s generation of the
processor status (PST) and debug data (DDATA) output on an instruction basis. In general,
the PST/DDATA output for an instruction is defined as follows:
PST = 0x1, {PST = [0x89B], DDATA= operand}
where the {...} definition is optional operand information defined by the setting of the CSR.
1
3
5
7
9
11
13
15
17
19
21
23
25
2
4
6
8
10
12
14
16
18
20
22
24
26
Developer reserved 1
GND
GND
RESET
Pad-Voltage2
GND
PST2
PST0
DDATA2
DDATA0
Motorola reserved
GND
Core-Voltage
BKPT
DSCLK
Developer reserved
1
DSI
DSO
PST3
PST1
DDATA3
DDATA1
GND
Motorola reserved
CLK_CPU
TA
2Supplied by target
1Pins reserved for BDM developer use.
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Chapter 5. Debug Support 5-43
Processor Status, DDATA Definition
The CSR provides capabilities to display operands based on reference type (read, write, or
both). Additionally, for certain change-of-flow branch instructions, another CSR field
provides the capability to display {0x2, 0x3, 0x4} bytes of the target instruction address.
For both situations, an optional PST v alue {0x8, 0x9, 0xB} provides the marker identifying
the size and presence of valid data on the DDATA output.
5.8.1 User Instruction Set
Table 5-22 shows the PST/DDATA specification for user-mode instructions. Rn represents
any {Dn, An} register. In this definition, the ‘y’ suffix generally denotes the source and ‘x’
denotes the destination operand. For a given instruction, the optional operand data is
displayed only for those effective addresses referencing memory. The ‘DD’ nomenclature
refers to the DDATA outputs.
Table 5-22. PST/DDATA Specification for User-Mode Instructions
Instruction Operand Syntax PST/DDATA
add.l <ea>y,Rx PST = 0x1, {PST = 0xB, DD = source operand}
add.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
addi.l #imm,Dx PST = 0x1
addq.l #imm,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
addx.l Dy,Dx PST = 0x1
and.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
and.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
andi.l #imm,Dx PST = 0x1
asl.l {Dy,#imm},Dx PST = 0x1
asr.l {Dy,#imm},Dx PST = 0x1
bcc.{b,w} if taken, then PST = 0x5, else PST = 0x1
bchg #imm,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bchg Dy,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bclr #imm,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bclr Dy,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bra.{b,w} PST = 0x5
bset #imm,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bset Dy,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bsr.{b,w} PST = 0x5, {PST = 0xB, DD = destination operand}
btst #imm,<ea>x PST = 0x1, {PST = 0x8, DD = source operand}
btst Dy,<ea>x PST = 0x1, {PST = 0x8, DD = source operand}
clr.b <ea>x PST = 0x1, {PST = 0x8, DD = destination operand}
clr.l <ea>x PST = 0x1, {PST = 0xB, DD = destination operand}
clr.w <ea>x PST = 0x1, {PST = 0x9, DD = destination operand}
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Processor Status, DDATA Definition
cmp.l <ea>y,Rx PST = 0x1, {PST = 0xB, DD = source operand}
cmpi.l #imm,Dx PST = 0x1
divs.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
divs.w <ea>y,Dx PST = 0x1, {PST = 0x9, DD = source operand}
divu.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
divu.w <ea>y,Dx PST = 0x1, {PST = 0x9, DD = source operand}
eor.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
eori.l #imm,Dx PST = 0x1
ext.l Dx PST = 0x1
ext.w Dx PST = 0x1
extb.l Dx PST = 0x1
jmp <ea>x PST = 0x5, {PST = [0x9AB], DD = target address} 1
jsr <ea>x PST = 0x5, {PST = [0x9AB], DD = target address},
{PST = 0x B , DD = destination operand}1
lea <ea>y,Ax PST = 0x1
link.w Ay,#imm PST = 0x1, {PST = 0xB, DD = destination operand}
lsl.l {Dy,#imm},Dx PST = 0x1
lsr.l {Dy,#imm},Dx PST = 0x1
mac.l PST = 0x1
mac.l Ry,Rx PST = 0x1
mac.l Ry,Rx,ea,Rw PST = 0x1, {PST = 0xB, DD = source operand}
mac.w PST = 0x1
mac.w Ry,Rx PST = 0x1
mac.w Ry,Rx,ea,Rw PST = 0x1, {PST = 0xB, DD = source operand}
move.b <ea>y,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
move.l <ea>y,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
move.l <ea>y,ACC PST = 0x1
move.l <ea>y,MACSR PST = 0x1
move.l <ea>y,MASK PST = 0x1
move.l ACC,Rx PST = 0x1
move.l MACSR,CCR PST = 0x1
move.l MACSR,Rx PST = 0x1
move.l MASK,Rx PST = 0x1
move.w <ea>y,<ea>x PST = 0x1, {PST = 0x9, DD = source}, {PST = 0x9, DD = destination}
move.w CCR,Dx PST = 0x1
move.w {Dy,#imm},CCR PST = 0x1
Table 5-22. PST/DDATA Specification for User-Mode Instructions (Continued)
Instruction Operand Syntax PST/DDATA
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Chapter 5. Debug Support 5-45
Processor Status, DDATA Definition
movem.l #list,<ea>x PST = 0x1, {PST = 0xB, DD = destination},... 2
movem.l <ea>y,#list PST = 0x1, {PST = 0xB, DD = source},... 2
moveq #imm,Dx PST = 0x1
msac.l Ry,Rx PST = 0x1
msac.l Ry,Rx,ea,Rw PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
msac.w Ry,Rx PST = 0x1
msac.w Ry,Rx,ea,Rw PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
muls.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
muls.w <ea>y,Dx PST = 0x1, {PST = 0x9, DD = source operand}
mulu.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
mulu.w <ea>y,Dx PST = 0x1, {PST = 0x9, DD = source operand}
neg.l Dx PST = 0x1
negx.l Dx PST = 0x1
nop PST = 0x1
not.l Dx PST = 0x1
or.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
or.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
ori.l #imm,Dx PST = 0x1
pea <ea>y PST = 0x1, {PST = 0xB, DD = destination operand}
pulse PST = 0x4
rems.l <ea>y,Dx:Dw PST = 0x1, {PST = 0xB, DD = source operand}
remu.l <ea>y,Dx:Dw PST = 0x1, {PST = 0xB, DD = source operand}
rts PST = 0x1, {PST = 0xB, DD = source operand},
PST = 0x5, {PST = [0x9AB], DD = target address}
scc Dx PST = 0x1
sub.l <ea>y,Rx PST = 0x1, {PST = 0xB, DD = source operand}
sub.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
subi.l #imm,Dx PST = 0x1
subq.l #imm,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
subx.l Dy,Dx PST = 0x1
swap Dx PST = 0x1
trap #imm PST = 0x1 3
trapf PST = 0x1
tst.b <ea>x PST = 0x1, {PST = 0x8, DD = source operand}
tst.l <ea>x PST = 0x1, {PST = 0xB, DD = source operand}
tst.w <ea>x PST = 0x1, {PST = 0x9, DD = source operand}
Table 5-22. PST/DDATA Specification for User-Mode Instructions (Continued)
Instruction Operand Syntax PST/DDATA
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5-46 MCF5307 User’s Manual
Processor Status, DDATA Definition
Exception Processing PST = 0xC, {PST = 0xB, DD = destination},// stack frame
{PST = 0xB, DD = destination},// stack frame
{PST = 0xB, DD = source},// vector read
PST = 0x5, {PST = [0x9AB], DD = target}// PC of handler
The PST/DDATA specification for the reset exception is shown below:
Exception Processing PST = 0xC,
PST = 0x5,{PST = [0x9AB], DD = target}// PC of handler
The initial references at address 0 and 4 are never captured nor displayed since these
accesses are treated as instruction fetches.
For all types of e xception processing, the PST = 0xC value is dri v en at all times, unless the
PST output is needed for one of the optional marker v alues or for the taken branch indicator
(0x5).
5.8.2 Supervisor Instruction Set
The supervisor instruction set has complete access to the user mode instructions plus the
opcodes shown below. The PST/DDATA specification for these opcodes is shown in
Table 5-23.
unlk Ax PST = 0x1, {PST = 0xB, DD = destination operand}
wddata.b <ea>y PST = 0x4, {PST = 0x8, DD = source operand
wddata.l <ea>y PST = 0x4, {PST = 0xB, DD = source operand
wddata.w <ea>y PST = 0x4, {PST = 0x9, DD = source operand
1For JMP and JSR instructions, the optional target instruction address is displayed only for those effective
address fields defining variant addressing modes. This includes the following <ea>x values: (An), (d16,An),
(d8,An,Xi), (d8,PC,Xi).
2For Move Multiple instructions (MOVEM), the processor automatically generates line-sized transfers if the
operand address reaches a 0-modulo-16 boundary and there are four or more registers to be transferred. For
these line-sized transfers, the operand data is never captured nor displayed, regardless of the CSR value.
The automatic line-sized burst transfers are provided to maximize performance during these sequential
memory access operations.
3During normal exception processing, the PST output is driven to a 0xC indicating the exception processing
state. The exception stack write operands, as well as the vector read and target address of the exception
handler may also be displayed.
Table 5-23. PST/DDATA Specification for Supervisor-Mode Instructions
Instruction Operand Syntax PSTDDATA
cpushl PST = 0x1
halt PST = 0x1,
PST = 0xF
move.w SR,Dx PST = 0x1
move.w {Dy,#imm},SR PST = 0x1, {PST = 3}
Table 5-22. PST/DDATA Specification for User-Mode Instructions (Continued)
Instruction Operand Syntax PST/DDATA
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Chapter 5. Debug Support 5-47
Processor Status, DDATA Definition
The move-to-SR and RTE instructions include an optional PST = 0x3 value, indicating an
entry into user mode. Additionally, if the execution of a RTE instruction returns the
processor to emulator mode, a multiple-cycle status of 0xD is signaled.
Similar to the exception processing mode, the stopped state (PST = 0xE) and the halted
state (PST = 0xF) display this status throughout the entire time the ColdFire processor is in
the given mode.
movec Ry,Rc PST = 0x1
rte PST = 0x7, {PST = 0xB, DD = source operand}, {PST = 3}, { PST = 0xB,
DD = source operand},
PST = 0x5, {[PST = 0x9AB], DD = target address}
stop #imm PST = 0x1,
PST = 0xE
wdebug <ea>y PST = 0x1, {PST = 0xB, DD = source, PST = 0xB, DD = source}
Table 5-23. PST/DDATA Specification for Supervisor-Mode Instructions
Instruction Operand Syntax PSTDDATA
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5-48 MCF5307 User’s Manual
Processor Status, DDATA Definition
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Part II. System Integration Module (SIM) II-i
Par t II
System Integration Module (SIM)
Intended Audience
Part II is intended for users who need to understand the interface between the ColdFire core
processor complex, described in Part I, and internal peripheral devices, described in
Part III. It includes a general description of the SIM and individual chapters that describe
components of the SIM, such as the phase-lock loop (PLL) timing source, interrupt
controller for both on-chip and external peripherals, configuration and operation of chip
selects, and the SDRAM controller.
Contents
Part II contains the following chapters:
• Chapter 6, “SIM Overview,” describes the SIM programming model, bus
arbitration, and system-protection functions for the MCF5307.
• Chapter 7, “Phase-Locked Loop (PLL),” describes configuration and operation of
the PLL module. It describes in detail the registers and signals that support the PLL
implementation.
• Chapter 8, “I2C Module,” describes the MCF5307 I2C module, including I2C
protocol, clock synchronization, and the registers in the I2C programing model. It
also provides extensive programming examples.
• Chapter 9, “Interrupt Controller,” describes operation of the interrupt controller
portion of the SIM. Includes descriptions of the registers in the interrupt controller
memory map and the interrupt priority scheme.
• Chapter 10, “Chip-Select Module,” describes the MCF5307 chip-select
implementation, including the operation and programming model, which includes
the chip-select address, mask, and control registers.
• Chapter 11, “Synchronous/Asynchronous DRAM Controller Module,” describes
configuration and operation of the synchronous/asynchronous DRAM controller
component of the SIM. It begins with a general description and brief glossary, and
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II-ii MCF5307 User’s Manual
includes a description of signals involved in DRAM operations. The remainder of
the chapter is divided between descriptions of asynchronous and synchronous
operations.
Suggested Reading
The following literature may be helpful with respect to the topics in Part II:
• The I2C Bus Specification, Version 2.1 (January 2000)
Acronyms and Abbreviations
Table II-i contains acronyms and abbreviations are used in Part II.
Table II-i. Acronyms and Abbreviated Terms
Term Meaning
ADC Analog-to-digital conversion
BDM Background debug mode
CODEC Code/decode
DAC Digital-to-analog conversion
DMA Direct memory access
DSP Digital signal processing
EDO Extended data output (DRAM)
FIFO First-in, first-out
GPIO
I2C Inter-integrated circuit
IEEE Institute for Electrical and Electronics Engineers
IPL Interrupt priority level
JEDEC Joint Electron Device Engineering Council
LIFO Last-in, first-out
LRU Least recently used
LSB Least-significant byte
lsb Least-significant bit
MBAR Memory base address register
MSB Most-significant byte
msb Most-significant bit
Mux Multiplex
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Part II. System Integration Module (SIM) II-iii
NOP No operation
PCLK Processor clock
PLL Phase-locked loop
POR Power-on reset
Rx Receive
SIM System integration module
SOF Start of frame
TAP Test access port
TTL Transistor-to-transistor logic
Tx Transmit
UART Universal asynchronous/synchronous receiver transmitter
Table II-i. Acronyms and Abbreviated Terms (Continued)
Term Meaning
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II-iv MCF5307 User’s Manual
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Chapter 6. SIM Overview 6-1
Chapter 6
SIM Overview
This chapter provides detailed operation information regarding the system integration
module (SIM). It describes the SIM programming model, bus arbitration, and
system-protection functions for the MCF5307.
6.1 Features
The SIM, shown in Figure 6-1, provides overall control of the bus and serves as the
interface between the ColdFire core processor comple x and the internal peripheral devices.
Figure 6-1. SIM Block Diagram
DRAM Controller External
Bus Interface
SYSTEM INTEGRATION MODULE (SIM)
32-Bit Address Bus
32-Bit Data Bus
Interrupt Controller
PLL
CLKIN
RSTI RSTO
PCLK
Xn
CS[7:0]
888
8
10 ICRs
MBAR
IMR
CSARs CSCRs CSMRs
IRQ[1,3,5,7]
4
DRAM Controller Outputs
AVR
IPR
IRQPAR
SWIVR
SWSR SYPCR
RSR
System Control PLL Control
PLL Base Address MPARK
Bus Master Park
DMR0/1DACR0/1
Addr/Cntrl Mask
DRAM Control
DCR
Parallel Port
PAR Software
Watchdog
Two
Two UARTs
DMA
I2C Module
Four
Channels
General-
Purpose
Timers
V3 COLDFIRE PROCESSOR COMPLEX
BCLKO (to on-chip peripherals)
Control Signals
Chip Select Module
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6-2 MCF5307 User’s Manual
Features
The following is a list of the key SIM features:
• Module base address register (MBAR)
— Base address location of all internal peripherals and SIM resources
— Address space masking to internal peripherals and SIM resources
• Phase-locked loop (PLL) clock control register (PLLCR) for CPU STOP instruction
— Control for turning off clocks to core and interrupt lev els that turn clocks back on
Chapter 7, “Phase-Locked Loop (PLL).”
• Interrupt controller
— Programmable interrupt level (1–7) for internal peripheral interrupts
— Programmable priority level (0–3) within each interrupt level
— Four external interrupts; one set to interrupt le vel 7; three others programmable
to two interrupt levels
See Chapter 9, “Interrupt Controller.”
• Chip select module
— Eight independent, user-programmable chip-select signals (CS[7:0]) that can
interface with SRAM, PROM, EPROM, EEPROM, Flash, and peripherals
— Address masking for 64-Kbyte to 4-Gbyte memory block sizes
— Programmable wait states and port sizes
— External master access to chip selects
See Chapter 10, “Chip-Select Module.”
• System protection and reset status
— Reset status indicating the cause of last reset
— Software watchdog timer with programmable secondary bus monitor
See Section 6.2.4, “Software Watchdog Timer.”
• Pin assignment register (PAR) configures the parallel port. See Section 6.2.9, “Pin
Assignment Register (PAR).”
• Bus arbitration
— Default bus master park register (MPARK) controls internal and external bus
arbitration and enables display of internal accesses on the external bus for
debugging
— Supports several arbitration algorithms
See Section 6.2.10, “Bus Arbitration Control.”
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Chapter 6. SIM Overview 6-3
Programming Model
6.2 Programming Model
The following sections describe the registers incorporated into the SIM.
6.2.1 SIM Register Memory Map
Table 6-1 shows the memory map for the SIM registers. The internal registers in the SIM
are memory-mapped registers offset from the MBAR address pointer defined in
MBAR[BA]. This supervisor-level register is described in Section 6.2.2, “Module Base
Address Register (MBAR).” Because SIM registers depend on the base address defined in
MBAR[BA], MBAR must be programmed before SIM registers can be accessed.
NOTE:
Although external masters cannot access the MCF5307’s
on-chip memories or MBAR, they can access any of the SIM
memory map and peripheral registers, such as those belonging
to the interrupt controller, chip-select module, UARTs, timers,
DMA, and I2C.
Table 6-1. SIM Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x000 Reset status register
(RSR) [p. 6-5] System protection
control register
(SYPCR) [p. 6-8]
Software watchdog
interrupt vector register
(SWIVR) [p. 6-9]
Software watchdog
service register (SWSR)
[p. 6-9]
0x004 Pin assignment register (PAR) [p. 6-10] Interrupt port
assignment register
(IRQPAR) [p. 9-7]
Reserved
0x008 PLL control (PLLCR)
[p. 7-3] Reserved
0x00C Def ault bus master park
register (MPARK)
[p. 6-11]
Reserved
0x010–
0x03C Reserved
Interrupt Controller Registers [p. 9-2]
0x040 Interrupt pending register (IPR) [p. 9-6]
0x044 Interrupt mask register (IMR) [p. 9-6]
0x048 Reserved Autovector register
(AVR) [p. 9-5]
Interrupt Control Registers (ICRs) [p. 9-3]
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6-4 MCF5307 User’s Manual
Programming Model
6.2.2 Module Base Address Register (MBAR)
The supervisor-level MBAR, Figure 6-2, specifies the base address and allowable access
types for all internal peripherals. It is written with a MOVEC instruction using the CPU
address 0xC0F. (See the ColdFire Family Programmer’s Reference Manual.) MBAR can
be read or written through the debug module as a read/write register, as described in
Chapter 5, “Debug Support.” Only the debug module can read MBAR.
The valid bit, MBAR[V], is cleared at system reset to prevent incorrect references before
MB AR is written; other MBAR bits are uninitialized at reset. To access internal peripherals,
write MB AR with the appropriate base address (BA) and set MBAR[V] after system reset.
All internal peripheral registers occupy a single relocatable memory block along 4-Kbyte
boundaries. If MBAR[V] is set, MBAR[BA] is compared to the upper 20 bits of the full
32-bit internal address to determine if an internal peripheral is being accessed. MBAR
masks specific address spaces using the address space fields. Attempts to access a masked
address space generate an external bus access.
Addresses hitting overlapping memory spaces take the following priority:
1. MBAR
2. SRAM and caches
3. Chip select
NOTE:
The MBAR region must be mapped to non-cacheable space.
0x04C Software watchdog
timer (ICR0) [p. 9-3] Timer0 (ICR1) [p. 9-3] Timer1 (ICR2) [p. 9-3] I2C (ICR3) [p. 9-3]
0x050 UART0 (ICR4) [p. 9-3] UART1 (ICR5) [p. 9-3] DMA0 (ICR6) [p. 9-3] DMA1 (ICR7) [p. 9-3]
0x054 DMA2 (ICR8) [p. 9-3] DMA3 (ICR9) [p. 9-3] Reserved
31 12 11 10 9 8 7 6 5 4 3 2 1 0
Field BA —WP —AM C/I SC SD UC UD V
Reset Undefined 0
R/W W (supervisor only); R/W through debug module (only the debug module can read MBAR)
Address CPU + 0x0C0F
Figure 6-2. Module Base Address Register (MBAR)
Table 6-1. SIM Registers (Continued)
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
A
ttr
ib
ute
M
as
k
Bi
ts
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Chapter 6. SIM Overview 6-5
Programming Model
Table 6-2 describes MBAR fields.
The follo wing example shows ho w to set the MB AR to location 0x1000_0000 using the D0
register. Setting MBAR[V] validates the MBAR location. This example assumes all
accesses are valid:
move.1 #0x10000001,DO
movec DO,MBAR
6.2.3 Reset Status Register (RSR)
The reset status register (RSR), Figure 6-3, contains two status bits, HRST and SWTR.
Reset control logic sets one of the bits depending on whether the last reset was caused by
an external device asserting RSTI (HRST = 1) or by the software watchdog timer
(SWTR = 1). Only one RSR bit can be set at any time. If a reset occurs, reset control logic
sets only the bit that indicates the cause of reset.
Table 6-2. MBAR Field Descriptions
Bits Field Description
31–12 BA Base address. Defines the base address for a 4-Kbyte address range.
11–9—Reserved, should be cleared.
8 WP Write protect. Mask bit for write cycles in the MBAR-mapped register address range.
0 Module address range is read/write.
1 Module address range is read only.
7—Reserved, should be cleared.
6 AM Alternate master mask. When AM = 0 and an alternate master (external master or DMA) accesses
MBAR-mapped registers, MBAR[SC,SD,UC,UD] are ignored in address decoding. These fields
mask address space, placing the MBAR-mapped register in a specific address space or spaces.
5 C/I Mask CPU space and interrupt acknowledge cycles.
0 Activates the corresponding MBAR-mapped register
1 Regular external bus access
4 SC Setting masks supervisor code space in MBAR address range
3 SD Setting masks supervisor data space in MBAR address range
2 UC Setting masks user code space in MBAR address range
1 UD Setting masks user data space in MBAR address range
0 V Valid. Determines whether MBAR settings are valid.
0 MBAR contents are invalid.
1 MBAR contents are valid.
7654 0
Field HRST —SWTR —
Reset 1/0 0 1/0 0_0000
R/W Read/Write
Address MBAR + 0x000
Figure 6-3. Reset Status Register (RSR)
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6-6 MCF5307 User’s Manual
Programming Model
Table 6-3 describes RSR fields.
6.2.4 Software Watchdog Timer
The software watchdog timer prevents system lockup should the software become trapped
in loops with no controlled exit. The software watchdog timer can be enabled or disabled
through SYPCR[SWE]. If enabled, the watchdog timer requires the periodic execution of
a software watchdog servicing sequence. If this periodic servicing action does not occur,
the timer times out, resulting in a watchdog timer IRQ or hardware reset with RST O dri ven
low, as programmed by SYPCR[SWRI].
If the timer times out and the software watchdog transfer acknowledge enable bit
(SYPCR[SWTA]) is set, a watchdog timer IRQ is asserted. Note that the software watchdog
timer IACK cycle cannot be autovectored.
If a software watchdog timer IACK cycle has not occurred after another timeout, SWT TA
is asserted in an attempt to terminate the bus cycle and allow the IACK cycle to proceed.
The setting of SYPCR[SWTAVAL] indicates that the watchdog timer TA was asserted.
Figure 6-4 shows termination of a locked bus.
Table 6-3. RSR Field Descriptions
Bits Name Description
7 HRST Hardware or system reset
1 An external device driving RSTI caused the last reset. Assertion of reset by an external
device causes the core processor to take a reset exception. All registers in internal
peripherals and the SIM are reset.
6—Reserved, should be cleared.
5 SWTR Software watchdog timer reset
1 The last reset was caused by the software watchdog timer. If SYPCR[SWRI] = 1 and the
software watchdog timer times out, a hardware reset occurs.
4–0—Reserved, should be cleared.
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Chapter 6. SIM Overview 6-7
Programming Model
Figure 6-4. MCF5307 Embedded System Recovery from Unterminated Access
When the watchdog timer times out and SYPCR[SWRI] is programmed for a software
reset, an internal reset is asserted and RSR[SWTR] is set.
To prevent the watchdog timer from interrupting or resetting, the SWSR must be serviced
by performing the following sequence:
1. Write 0x55 to SWSR.
2. Write 0xAA to the SWSR.
Both writes must occur in order before the timeout, but any number of instructions or
SWSR accesses can be executed between the two writes. This order allows interrupts and
exceptions to occur, if necessary, between the two writes.
Caution should be exercised when changing SYPCR values after the software watchdog
timer has been enabled with the setting of SYPCR[SWE], because it is difficult to
determine the state of the watchdog timer while it is running. The countdown value is
constantly compared with the timeout period specified by SYPCR[SWP,SWT]. Therefore,
altering SWP and SWT improperly causes unpredictable processor behavior . The following
steps must be taken to change SWP or SWT:
Code enables software watchdog timer interrupt and
1. Watchdog timer times out due to unterminated bus
2. Watchdog timer interrupt cannot be serviced due to hung bus
cycle. Wait for another timeout before setting SYPCR[SWTA].
Timeout
Timeout
Software
SWTA functionality by writing SYPCR.
SYPCR[SWTAVAL] 1
Watchdog timer
3. TA held until another
bus cycle starts
Problem:
NOTE: The w atchdog timer IRQ should
be set to the highest level in the system.
1 SWTAVAL is set if watchdog timer TA is asserted.
Software
watchdog
timer IRQ
watchdog
timer TA
IACK cycle
Code in the watchdog timer interrupt
handler polls SYPCR[SWTAVAL] to
determine if SWT TA was needed. If so,
execute code to identify bad address.
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6-8 MCF5307 User’s Manual
Programming Model
1. Disable the software watchdog timer by clearing SYPCR[SWE].
2. Reset the counter by writing 0x55 and then 0xAA to SWSR.
3. Update SYPCR[SWT,SWP].
4. Reenable the watchdog timer by setting SYPCR[SWE]. This can be done in step 3.
6.2.5 System Protection Control Register (SYPCR)
The SYPCR, Figure 6-5, controls the software watchdog timer, timeout periods, and
software watchdog timer transfer acknowledge. The SYPCR can be read at any time, but
can be written only if a software watchdog timer IRQ is not pending. At system reset, the
software watchdog timer is disabled.
Table 6-4 describes SYPCR fields.
76543210
Field SWE SWRI SWP SWT SWTA SWTAVAL —
Reset 0000_0000
R/W R/W
Address MBAR + 0x01
Figure 6-5. System Protection Control Register (SYPCR)
Table 6-4. SYPCR Field Descriptions
Bits Name Description
7 SWE Software watchdog timer enable
0 Software watchdog timer disabled
1 Software watchdog timer enabled
6 SWRI Software watchdog reset/interrupt select
0 If a timeout occurs, the watchdog timer generates an interrupt to the core processor at the
level programmed into ICR0[IL].
1 The software watchdog timer causes soft reset to be asserted for all modules of the part
except for the PLL (reset mode selects, such as PP_RESET_SEL or chip-select settings,
should not change).
5 SWP Software watchdog prescaler. This bit interacts with SYPCR[SWT].
0 Software watchdog timer clock not prescaled.
1 Software watchdog timer clock prescaled by 8192.
4–3 SWT Software watchdog timing delay. SWT and SWP select the timeout period for the watchdog
timer. At system reset, the software watchdog timer is set to the minimum timeout period.
SWP = 0
00 29/system frequency
01 211/system frequency
10 213/system frequency
11 215/system frequency
SWP = 1
00 222/system frequency
01 224/system frequency
10 226/system frequency
11 228/system frequency
Note that if SWP and SWT are modified to select a new software timeout, the software service
sequence must be performed (0x55 followed by 0xAA written to the SWSR) before the new
timeout period takes effect.
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Chapter 6. SIM Overview 6-9
Programming Model
6.2.6 Software Watchdog Interrupt Vector Register (SWIVR)
The SWIVR, sho wn in Figure 6-6, contains the 8-bit interrupt vector (SWIV) that the SIM
returns during an interrupt-acknowledge cycle in response to a software watchdog
timer-generated interrupt. SWIVR is set to the uninitialized vector 0x0F at system reset.
Note that the software watchdog interrupt cannot be autovectored.
6.2.7 Software Watchdog Service Register (SWSR)
The SWSR, sho wn in Figure 6-7, is where the software watchdog timer servicing sequence
should be written. To prevent a watchdog timer timeout, the software service sequence must
be performed (0x55 followed by 0xAA written to the SWSR). Both writes must be
performed in order before the timeout, but any number of instructions or accesses to the
SWSR can be ex ecuted between the two writes. If the timer has timed out, writing to SWSR
does not cancel the interrupt (that is, IPR[SWT] remains set). The interrupt is cancelled
(and SWT is cleared) automatically when the IACK cycle is run.
2 SWTA Software watchdog transfer acknowledge enable
0 SWTA transfer acknowledge disabled
1 SWTA asserts transfer ac knowledge enab led. After one timeout period of the unackno wledged
assertion of the software watchdog timer interrupt, the software watchdog transfer
ackno wledge asserts, which allows the watchdog timer to terminate a bus cycle and allow the
IACK to occur.
1 SWTAVAL Software watchdog transfer acknowledge valid
0 SWTA transfer acknowledge has not occurred.
1 SWTA transfer acknowledge has occurred. Write a 1 to clear this flag bit.
7 0
Field SWIV
Reset 0000_1111
R/W Supervisor write only
Address MBAR + 0x002
Figure 6-6. Software Watchdog Interrupt Vector Register (SWIVR)
7 0
Field SWSR
Reset Undetermined
R/W Supervisor write only
Address MBAR + 0x003
Figure 6-7. Software Watchdog Service Register (SWSR)
Table 6-4. SYPCR Field Descriptions (Continued)
Bits Name Description
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6-10 MCF5307 User’s Manual
Programming Model
6.2.8 PLL Clock Control for CPU STOP Instruction
The SIM contains the PLL clock control register, which is described in detail in
Section 7.2.4, “PLL Control Register (PLLCR).” PLLCR[ENBSTOP,PLLIPL] are
significant to the operation of the SIM, and are described as follows:
• PLLCR[ENBSTOP] must be set for the ColdFire CPU STOP instruction to be
ackno wledged. This bit is cleared at reset and must be set for the MCF5307 to enter
low-power modes. The CPU STOP instruction stops only clocks to the core
processor . All internal modules remain clocked and can generate interrupts to restart
the ColdFire core. For example, the on-chip timer can be used to interrupt the
processor after a given timer countdown.
• PLLCR[PLLIPL] determines the minimum le vel at which an interrupt (decoded as
an interrupt priority level or IPL) must occur to awaken the PLL. The PLL then turns
clocks back on to the core processor and interrupt exception processing tak es place.
T able 6-5 describes PLLIPL settings to be compared against the interrupt ranges that
awaken the core processor from a CPU STOP instruction.
6.2.9 Pin Assignment Register (PAR)
The pin assignment register (PAR), Figure 6-8, allows the selection of pin assignments.
Table 6-5. PLLIPL Settings
PLLIPL Description
000 Any interrupts can wake core
001 Interrupts 2–7
010 Interrupts 3–7
011 Interrupts 4–7
100 Interrupts 5–7
101 Interrupts 6–7
110 Interrupt 7 only
111 No interrupts can wake core
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Field PAR15 PAR14 PAR13 PAR12 PAR11 PAR10 PAR9 PAR8 PAR7 PAR6 PAR5 PAR4 PAR3 PAR2 PAR1 PAR0
PARn = 0 PP15 PP14 PP13 PP12 PP11 PP10 PP9 PP8 PP7 PP6 PP5 PP4 PP3 PP2 PP1 PP0
PARn = 1 A31 A30 A29 A28 A27 A26 A25 A24 TIP DREQ0 DREQ1 TM2 TM1 TM0 TT1 TT0
Reset Determined by driving D4/ADDR_CONFIG with a 1 or 0 when RSTI negates. The system is configured as PP[15:0] if
D4 is low; otherwise alternate pin functions selected by PAR = 1 are used.
R/W R/W
Address Address MBAR + 0x004
Figure 6-8. Pin Assignment Register (PAR)
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Chapter 6. SIM Overview 6-11
Programming Model
6.2.10 Bus Arbitration Control
This section describes the bus arbitration register and the four arbitration schemes.
6.2.10.1 Default Bus Master Park Register (MPARK)
The MPARK, shown in Figure 6-9, determines the default bus master arbitration between
internal transfers (core and DMA module) and between internal and external transfers to
internal resources. This arbitration is needed because external masters can access internal
registers within the MCF5307 peripherals.
Figure 6-9. Default Bus Master Register (MPARK)
Table 6-6 describes MPARK bits.
765432 0
Field PARK IARBCTRL EARBCTRL SHOWDATA —BCR24BIT
Reset 0000_0000
R/W R/W
Address MBAR + 0x0C
Table 6-6. MPARK Field Descriptions
Bits Name Description
7–6 PARK Park. Indicates the arbitration priority of internal transfers among MCF5307 resources.
00 Round-robin between DMA and ColdFire core
01 Park on master ColdFire core
10 Park on master DMA module
11 Park on current master
Use of this field is described in detail in Section 6.2.10.1.1, “Arbitration for Internally
Generated Transfers (MPARK[PARK]). ”
5 IARBCTRL Internal bus arbitration control. Controls external device access to the MCF5307 internal bus.
0 Arbitration disabled (single-master system)
1 Arbitration enabled. IARBCTRL must be set if external masters are using internal
resources like the DRAM controller or chip selects.
Use of this bit depends on whether the system has single or multiple masters, as follows:
• In a single-master system, IARBCTRL should stay cleared, disabling internal arbitration
by external masters. In this scenario, MPARK[PARK] applies only to priority of internal
masters over one another. Note that the internal DMA (master 3) has priority over the
ColdFire core (master 2), if internal DMA bandwidth is at its maximum (BWC = 000).
• In multiple master systems that e xpect to use internal resources like the DRAM controller
or chip selects, internal arbitration should be enabled. The e xternal master defaults to the
highest priority internal master anytime BG is negated.
4 EARBCTRL External bus arbitration control. Enables internal register memory space to external bus
arbitration. Internal registers are those accessed at offsets to the MBAR. These include the
SIM, DMA, chip selects, timers, UARTs, I2C, and parallel port registers. These registers do
not include the MBAR; only the core can access the MBAR.
0 Arbitration disabled
1 Arbitration enabled
The use of this field is described in detail in Section 6.2.10.1.2, “Arbitration between Internal
and External Masters for Accessing Internal Resources.”
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6-12 MCF5307 User’s Manual
Programming Model
6.2.10.1.1 Arbitration for Internally Generated Transfers (MPARK[PARK])
MPARK[PARK] prioritizes internal transfers, which can be initiated by the core and the
on-chip DMA module, which contains all four DMA channels. Priority among the four
DMA channels in the module is determined by the BWC bits in their respective DMA
control registers (see Chapter 12, “DMA Controller Module”).
The four arbitration schemes for internally generated transfers are described as follows:
• Round-robin scheme (PARK = 00)—Figure 6-10 shows round-robin arbitration
between the core and DMA module. Bus mastership alternates between the core and
DMA module.
Figure 6-10. Round Robin Arbitration (PARK = 00)
The DMA module presents only the highest-priority DMA request, and bus
mastership alternates between the core and DMA channel as long as both are
requesting bus mastership. Section 12.5.4.1, “External Request and Acknowledge
Operation,” includes a timing diagram showing a lower-priority DMA transfer.
When the processor is initialized, the core has first priority. If DMA channels 0 and
1 (both set to BWC = 010) assert an internal bus request during a core-generated b us
transfer, DMA channel 0 would gain bus mastership next. However, if the core
requests the bus during this DMA transfer, bus mastership returns to the core rather
than being granted to DMA channel 1.
3 SHOWDATA Enable internal register data bus to be driven on external bus. EARBCTRL must be set for
this function to work. Section 6.2.10.1.2, “Arbitration between Internal and External Masters
for Accessing Internal Resources,” describes the proper use of SHOWDATA.
0 Do not drive internal register data bus values to external bus.
1 Drive internal register data bus values to external bus.
2–1—Reserved, should be cleared.
0 BCR24BIT Controls the BCR and address mapping for DMA. Allows the BCR to be used as a 24-bit
register. Chapter 12, “DMA Controller Module,” describes the BCRs.
0 DMA BCRs function as 16-bit counters.
1 DMA BCRs function as 24-bit counters.
Table 6-6. MPARK Field Descriptions (Continued)
Bits Name Description
CORE Channel 0
Channel 1
Channel 2
Channel 3
DMA MODULE
Internal Bus Mastership
(Alternates between Core and DMA Module)
1st 2nd
3rd 4th
5th
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Chapter 6. SIM Overview 6-13
Programming Model
Note that the internal DMA has higher priority than the core if the internal DMA has
its bandwidth BWC bits set to 000 (maximum bandwidth).
• Park on master core priority (PARK = 01)—The core retains bus mastership as long
as it needs it. After it negates its internal bus request, the core does not have to
rearbitrate for the bus unless the DMA module has requested the b us when it is idle.
The DMA module can be granted bus mastership only when the core is not asserting
its bus request. See Figure 6-11.
Figure 6-11. Park on Master Core Priority (PARK = 01)
• Park on master DMA priority (PARK = 10)—The DMA module retains bus
mastership as long as it needs it. After it negates its internal bus request, the DMA
module does not hav e to rearbitrate for the bus unless the core has requested the b us
when it is idle. The core can be granted b us mastership only when the DMA module
is not asserting its bus request. See Figure 6-12.
Figure 6-12. Park on DMA Module Priority (PARK = 10)
Core DMA Module
Core BR asserted
Core BR negated
DMA module BR negated
DMA module BR negated/asserted
Core BR negated
DMA module BR asserted
Core DMA Module
Core BR asserted
DMA BR negated
Core BR negated
DMA module BR negated
DMA module BR asserted
Core BR negated/asserted
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6-14 MCF5307 User’s Manual
Programming Model
• Park on current master priority (PARK = 11)—The current bus master retains
mastership as long as it needs the bus. The other device can become the b us master
only when the bus is idle. For example, if the core is b us master out of reset, it retains
mastership as long as it needs the bus. It loses mastership only when it negates its
bus request signal and the DMA asserts its internal bus request signal. At this point
the DMA module is the bus master, and retains bus mastership as long as it needs
the bus. See Figure 6-13.
Figure 6-13. Park on Current Master Priority (PARK = 01)
6.2.10.1.2 Arbitration between Internal and External Masters for
Accessing Internal Resources
If an external device is programmed to access internal MCF5307 resources
(EARBCTRL = 1), the external device can gain bus mastership only when BG is negated.
This means neither the core nor the DMA controller can access the external bus until the
external device asserts BG. After the external master finishes its bus transfer and asserts
BG, the core has priority on the next available bus cycle regardless of the value of PARK.
Thus if the core asserts its internal bus request on this first b us c ycle, it ex ecutes a bus c ycle
even if PARK indicates the DMA should have priority. Then, after the bus transfer, the
PARK scheme returns to programmed functioning and the DMA is given bus mastership.
NOTE:
In all arbitration modes, if BG is negated, the external master
interface has highest priority . In this case, the ColdFire core has
second-highest priority, until the internal bus grant is asserted.
• In a single-master system, the setting of EARBCTRL does not affect arbitration
performance. Typically , BG is tied low and the MCF5307 alw ays o wns the e xternal
bus and internal re gister transfers are already shown on the e xternal bus. In a system
where MCF5307 is the only master, this bit may remain cleared.
If the system needs external visibility of the data b us values during internal re gister
transfers for system debugging, both EARBCTRL and SHOWDATA must be set.
Note that when an internal register transfer is driven externally, TA becomes an
output, which is asserted (normally an input) to prevent external devices and
Core DMA Module
Core BR asserted
DMA module BR negated
Core BR negated
DMA module BR negated
DMA module BR asserted
Core BR negated
Core BR negated
DMA module BR negated
DMA module BR asserted
Core BR asserted
Core BR asserted
DMA module BR asserted
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Chapter 6. SIM Overview 6-15
Programming Model
memories from responding to internal register transfers that go to the external bus.
The AS signal and all chip-select-related strobe signals are not asserted.
Do not immediately follo w a cycle in which SHOWDATA is set with a cycle using
fast termination.
• In multiple-master systems, disabling arbitration with EARBCTRL allows
performance improvement because internal register bus transfer cycles do not
interfere with the external bus.
Having internal transfers go external may affect performance in two ways:
— If the internal de vice does not control the bus immediately, the core stalls until it
wins arbitration of the external bus.
— If the core wins arbitration instantly, it may kick the external master off of the
external bus unnecessarily for a transfer that did not need the external bus. For
debug, where this performance penalty is not a concern, setting EARBCTRL and
SHOWDATA provides external visibility of the internal bus cycles.
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6-16 MCF5307 User’s Manual
Programming Model
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Chapter 7. Phase-Locked Loop (PLL) 7-1
Chapter 7
Phase-Locked Loop (PLL)
This chapter describes configuration and operation of the phase-locked loop (PLL) module.
It describes in detail the registers and signals that support the PLL implementation.
7.1 Overview
The basic features of the MCF5307 PLL implementation are as follows:
• The PLL locks to the clock input (CLKIN) frequency. It provides a processor clock
(PCLK) that is twice the input clock frequency and a programmable system bus
clock output (BCLKO) that is 1/2, 1/3, or 1/4 the PCLK frequency.
• A buffered processor status clock (PSTCLK) is equal to the PCLK frequency, as
indicated in Figure 7-1. This signal is made available for system development.
The PLL module has the following three modes of operation:
• Reset mode—In reset mode, the core/bus frequency ratio and other configuration
information is sampled. At reset, the PLL asserts the reset out signal, RSTO.
• Normal mode—During normal operations, the divide ratio is programmed at reset
and is clock-multiplied to provide a maximum frequency of 90 MHz
• Reduced-power mode—In reduced-power mode, the high-speed processor core
clocks are turned off without losing the register contents so that the system can be
reenabled by an unmasked interrupt or reset.
Figure 7-1 shows the frequency relationships of PLL module clock signals.
z
Figure 7-1. PLL Module Block Diagram
PLL
CLKIN
RSTI
Divide BCLKO
DIVIDE[1:0]
FREQ[1:0]
RSTO
PSTCLK
PCLK
CLKIN X 4 by 2 Divide by 2,
3, or 4
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7-2 MCF5307 User’s Manual
PLL Operation
7.1.1 PLL:PCLK Ratios
The specifications for the clocks in the PLL module are summarized in Table 0-1.
7.2 PLL Operation
The following sections provide detailed information about the three PLL modes.
7.2.1 Reset/Initialization
The PLL receives RSTI as an input directly from the pin. Additionally, signals are
multiplexed with D[3:0]/FREQ[1:0]:DIVIDE[1:0] while RSTI is asserted. These signals
are sampled during reset and registered by the PLL on the negation of RSTI to provide
initialization information. FREQ[1:0] and DIVIDE[1:0] are used by the PLL to select the
CLKIN frequency range and set the CLKIN/PCLK ratio, respectively.
7.2.2 Normal Mode
PCLK is divided to create the system bus clock, BCLKO. At reset, the logic level of
DIVIDE[1:0]/D[1:0] determines the BCLKO di visor. The bus clock can be 1/2, 1/3, or 1/4
of the PCLK frequency.
7.2.3 Reduced-Power Mode
The PCLK can be turned off in a predictable manner to conserve system power. To allow
fast restart of the MCF5307 processor core, the PLL continues to operate at the frequency
configured at reset. PCLK is disabled using the CPU STOP instruction and resumes normal
operation on interrupt, as described in Section 7.2.4, “PLL Control Register (PLLCR).”
Table 0-1. PLL Clock Specifications
Symbol Description Frequency
—PLL lock time 2.2 mS with CLKIN running at 45 MHz
CLKIN Input clock 16.67 MHz–45 MHz
PCLK Internal processor clock 33.34 MHz–90 MHz (CLKIN x 2)
PSTCLK Processor status clock 33.34 MHz–90 MHz (CLKIN x 2)
BCLKO Output clock 16.67 MHz–45 MHz 11.11 MHz–30 MHz 8.24 MHz–22.5 MHz
BCLKO/PCLK ratio 1/2 1/3 1/4
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Chapter 7. Phase-Locked Loop (PLL) 7-3
PLL Port List
7.2.4 PLL Control Register (PLLCR)
The PLL control register (PLLCR), Figure 7-2, provides control over the PLL.
Table 7-1 describes PLLCR bits.
7.3 PLL Por t List
Table 7-2 describes PLL module inputs.
76543210
Field ENBSTOP PLLIPL —
Reset 0000_0000
R/W R/W
Address MBAR + 0x08
Figure 7-2. PLL Control Register (PLLCR)
Table 7-1. PLLCR Field Descriptions
Bit Name Description
7 ENBSTOP Enable CPU STOP instruction. Must be set for the ColdFire CPU STOP instruction to be
acknowledged. Cleared at reset and must be subsequently set for the processor to enter
low-power modes. Only clocks to the core are turned off because of the CPU STOP instruction.
Internal modules remain clocked and can generate interrupts to restart the ColdFire core.
0 Disable CPU STOP
1 Enable CPU STOP; STOP instruction turns off clocks to the ColdFire core.
6–4 PLLIPL PLL interrupt priority level to wake up from CPU STOP. Determines the minimum level an
interrupt (decoded as an interrupt priority level) must be to waken the PLL. The PLL then turns
clocks back on to the core processor and interrupt exception processing occurs.
000 Any interrupts can wake core
001 Interrupts 2–7
010 Interrupts 3–7
011 Interrupts 4–7
100 Interrupts 5–7
101 Interrupts 6–7
110 Interrupt 7 only
111 No interrupts can wake core. Any reset, including a watchdog reset, can wake the core.
No PLL phase lock time is required.
3–0—Reserved, should be cleared.
Table 7-2. PLL Module Input SIgnals
SIgnal Description
CLKIN Input clock to the PLL. Input frequency must not be changed during operation. Changes are
recognized only at reset.
RSTI Active-low asynchronous input that, when asserted, indicates PLL is to enter reset mode. As long as
RSTI is asserted, the PLL is held in reset and does not begin to lock.
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7-4 MCF5307 User’s Manual
Timing Relationships
Table 7-3 describes PLL module outputs.
7.4 Timing Relationships
The MCF5307 uses CLKIN and BCLK O, which is generated by the PLL and may be used
as the bus timing reference for external devices. The MCF5307 BCLKO frequency can be
1/2, 1/3, or 1/4 the processor clock. In this document, bus timings are referenced from
BCLKO. Furthermore, depending on the user configuration, the BCLKO-to-processor
clock ratio may differ from the CLKIN-to-processor clock ratio.
7.4.1 PCLK, PSTCLK, and BCLKO
Figure 7-3 shows the frequency relationships between PCLK, PSTCLK,CLKIN, and the
three possible versions of BCLKO. This figure does not show the skew between CLKIN
and PCLK, PSTCLK, and BCLK O. PSTCLK is equal to frequency of PCLK. Similarly , the
skew between PCLK and BCLKO is unspecified.
FREQ[1:0] Input bus indicating the CLKIN frequency range. FREQ[1:0] are multiplexed with D[3:2] and are
sampled while RSTI is asserted. FREQ[1:0] must be correctly set for proper operation. These signals
do not affect CLKIN frequency but are required to set up the analog PLL to handle the input clock
frequency.
00 16.6–27.999 MHz
01 28–38.999 MHz
10 39–45 MHz
11 Not used
DIVIDE[1:0] The MCF5307 samples clock ratio encodings on the lower data bits of the bus to determine the
CLKIN-to-processor clock ratio. D[1:0]/DIVIDE[1:0] support the divide-ratio combinations.
00 1/4
01 Not used
10 1/2
11 1/3
Table 7-3. PLL Module Output Signals
Output Description
BCLKO This bus clock output provides a divided version of the processor clock frequency, determined by
DIVIDE[1:0].
PSTCLK Provides a b uffered processor status cloc k at 2X the CLKIN frequency. PSTCLK is a dela yed v ersion of
PCLK. See Section 7.4.1, “PCLK, PSTCLK, and BCLKO,” and Figure 7-1.
RSTO This output provides an external reset for peripheral devices.
Table 7-2. PLL Module Input SIgnals
SIgnal Description
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Chapter 7. Phase-Locked Loop (PLL) 7-5
Timing Relationships
Figure 7-3. CLKIN, PCLK, PSTCLK, and BCLKO Timing
7.4.2 RSTI Timing
Figure 7-4 shows PLL timing during reset. As shown, RSTI must be asserted for at least 80
CLKIN cycles to give the MCF5307 time to begin its initialization sequence. At this time,
the configuration pins should be asserted (D[3:2] for FREQ[1:0] and D[1:0] for
DIVIDE[1:0]), meeting the minimum setup and hold times to RSTI given in Chapter 20,
“Electrical Specifications.”
On the rising edge of BCLK O before the rising edge of RSTI, the data on D[7:0] is latched
and the PLL begins ramping to its final operating frequency. During this ramp and lock
time, BCLKO and PSTCLK are held low. The PLL locks in about 2.2 mS with a 45-MHz
CLKIN, at which time BCLK Oand PSTCLK begin normal operation in the specified mode.
The PLL requires 100,000 CLKIN cycles to guarantee PLL lock. To allow for reset of
external peripherals requiring a clock source, RSTO remains asserted for a number of
BCLKO cycles, as shown in Figure 7-4.
PCLK
BCLKO (/2)
BCLKO (/3)
BCLKO (/4)
CLKIN
PSTCLK
NOTE: The clock signals are shown with edges aligned to show frequency relationships only.
Actual signal edges have some skew between them.
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7-6 MCF5307 User’s Manual
PLL Power Supply Filter Circuit
Figure 7-4. Reset and Initialization Timing
7.5 PLL Power Supply Filter Circuit
To ensure PLL stability, the power supply to the PLL power pin should be filtered using a
circuit similar to the one in Figure 7-5. The circuit should be placed as close as possible to
the PLL power pin to ensure maximum noise filtering.
Figure 7-5. PLL Power Supply Filter Circuit
100K CLKIN
>80 CLKIN
BCLKO
CLKIN
RSTI
BCLKO
BCLKO
PSTCLK
RSTO
30 BCLKO
20 BCLKO
15 BCLKO
(1/2 MODE)
(1/3 MODE)
(1/4 MODE)
D[7:0]
Cycle Lock Time
D[7:0] latched
10 Ω
10 µF 0.1 µF
PLL power pinVdd
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Chapter 8. I2C Module 8-1
Chapter 8
I2C Module
This chapter describes the MCF5307 I2C module, including I2C protocol, clock
synchronization, and the registers in the I2C programing model. It also provides extensive
programming examples.
8.1 Overview
I2C is a two-wire, bidirectional serial bus that provides a simple, efficient method of data
exchange, minimizing the interconnection between devices. This bus is suitable for
applications requiring occasional communications over a short distance between many
devices. The flexible I2C allows additional de vices to be connected to the b us for expansion
and system development.
The I2C system is a true multiple-master bus including arbitration and collision detection
that pre vents data corruption if multiple devices attempt to control the bus simultaneously.
This feature supports complex applications with multiprocessor control and can be used for
rapid testing and alignment of end products through external connections to an
assembly-line computer.
8.2 Interface Features
The I2C module has the following key features:
• Compatibility with I2C bus standard
• Support for 3.3-V tolerant devices
• Multiple-master operation
• Software-programmable for one of 64 different serial clock frequencies
• Software-selectable acknowledge bit
• Interrupt-driven, byte-by-byte data transfer
• Arbitration-lost interrupt with automatic mode switching from master to slave
• Calling address identification interrupt
• Start and stop signal generation/detection
• Repeated START signal generation
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8-2 MCF5307 User’s Manual
Interface Features
• Acknowledge bit generation/detection
• Bus-busy detection
Figure 8-1 is a block diagram of the I2C module.
Figure 8-1. I2C Module Block Diagram
Figure 8-1 shows the relationships of the I2C registers, listed below:
•I
2C address register (IADR)
•I
2C frequency divider register (IFDR)
•I
2C control register (I2CR)
•I
2C status register (I2SR)
•I
2C data I/O register (I2DR)
These registers are described in Section 8.5, “Programming Model.”
Address
Compare
In/Out
Data
Shift
Start, Stop,
Input
Sync
Clock
Control
Registers and ColdFire Interface
Address Decode
I2C Address
Data MUX
SDASCL
AddressIRQ Data
and
Arbitration
Control
Register
Internal Bus
Register
(IADR)
I2C Frequency
Divider Register
(IFDR)
I2C Data
I/O Register
(I2DR)
I2C Status
Register
(I2SR)
I2C Control
Register
(I2CR)
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Chapter 8. I2C Module 8-3
I2C System Configuration
8.3 I2C System Configuration
The I2C module uses a serial data line (SD A) and a serial clock line (SCL) for data transfer .
For I2C compliance, all devices connected to these two signals must have open drain or
open collector outputs. (There is no such requirement for inputs.) The logic AND function
is exercised on both lines with external pull-up resistors.
Out of reset, the I2C default is as sla ve recei ver. Thus, when not programmed to be a master
or responding to a slav e transmit address, the I2C module should return to the def ault sla v e
receiver state. See Section 8.6.1, “Initialization Sequence,” for exceptions.
NOTE:
The I2C module is designed to be compatible with the Philips
I2C bus protocol. For information on system configuration,
protocol, and restrictions, see The I2C Bus Specification,
Version 2.1.
8.4 I2C Protocol
Normally, a standard communication is composed of the following parts:
1. START signal—When no other device is bus master (both SCL and SDA lines are
at logic high), a de vice can initiate communication by sending a START signal (see
A in Figure 8-2). A START signal is defined as a high-to-low transition of SDA
while SCL is high. This signal denotes the beginning of a data transfer (each data
transfer can be several bytes long) and awakens all slaves.
Figure 8-2. I2C Standard Communication Protocol
2. Slave address transmission—The master sends the slave address in the first byte
after the START signal (B). After the se v en-bit calling address, it sends the R/W bit
(C), which tells the slave data transfer direction.
Each slav e must ha ve a unique address. An I2C master must not transmit an address
that is the same as its slave address; it cannot be master and sla ve at the same time.
12345678 123456789 9
AD7 AD6AD5 AD4 AD3 AD2 AD1R/W XXX D7 D6 D5 D4 D3 D2 D1 D0
Calling Address R/W ACK
Bit Data Byte No
ACK
Bit STOP
Signal
lsbmsblsbmsb
SDA
SCL
START
Signal
ABDC E
F
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8-4 MCF5307 User’s Manual
I2C Protocol
The slav e whose address matches that sent by the master pulls SD A lo w at the ninth
clock (D) to return an acknowledge bit.
3. Data transfer—When successful slave addressing is achieved, the data transfer can
proceed (E) on a byte-by-byte basis in the direction specified by the R/W bit sent by
the calling master.
Data can be changed only while SCL is low and must be held stable while SCL is
high, as Figure 8-2 sho ws. SCL is pulsed once for each data bit, with the msb being
sent first. The receiving de vice must acknowledge each byte by pulling SDA low at
the ninth clock; therefore, a data byte transfer takes nine clock pulses.
If it does not ackno wledge the master, the slave receiv er must leav e SDA high. The
master can then generate a STOP signal to abort the data transfer or generate a
START signal (repeated start, shown in Figure 8-3) to start a new calling sequence.
If the master receiver does not acknowledge the slave transmitter after a byte
transmission, it means end-of-data to the slave. The slave releases SDA for the
master to generate a STOP or START signal.
4. STOP signal—The master can terminate communication by generating a STOP
signal to free the bus. A STOP signal is defined as a low-to-high transition of SDA
while SCL is at logical high (F). Note that a master can generate a STOP e v en if the
slave has made an acknowledgment, at which point the slave must release the bus.
Instead of signalling a STOP, the master can repeat the STAR T signal, follo wed by a calling
command, (A in Figure 8-3). A repeated START occurs when a STAR T signal is generated
without first generating a STOP signal to end the communication.
Figure 8-3. Repeated START
The master uses a repeated START to communicate with another slave or with the same
slave in a different mode (transmit/receive mode) without releasing the bus.
8.4.1 Arbitration Procedure
If multiple devices simultaneously request the bus, the bus clock is determined by a
synchronization procedure in which the low period equals the longest clock-low period
among the devices and the high period equals the shortest. A data arbitration procedure
SCL 12345678 12 5 67834
AD7 AD6AD5 AD4 AD3 AD2 AD1R/W AD7 AD6 AD5 AD4 AD3 AD2 AD1R/W
99
XX
New Calling Address R/W No
Stop
ACK
Bit STOP
Signal
Repeated
START
Signal
ACK
Bit
R/W
Calling Address
START
SDA
msb lsb msb lsb
Signal A
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Chapter 8. I2C Module 8-5
I2C Protocol
determines the relative priority of competing devices. A device loses arbitration if it sends
logic high while another sends logic low; it immediately switches to slave-receive mode
and stops driving SDA. In this case, the transition from master to slave mode does not
generate a STOP condition. Meanwhile, hardware sets I2SR[IAL] to indicate loss of
arbitration.
8.4.2 Clock Synchronization
Because wire-AND logic is used, a high-to-low transition on SCL affects devices
connected to the bus. Devices start counting their low period when the master drives SCL
low. When a device clock goes low, it holds SCL low until the clock high state is reached.
However, the low-to-high change in this device clock may not change the state of SCL if
another device clock is still in its low period. Therefore, the device with the longest low
period holds the synchronized clock SCL low . Devices with shorter low periods enter a high
wait state during this time (See Figure 8-4). When all devices involved have counted off
their lo w period, the synchronized clock SCL is released and pulled high. There is then no
difference between device clocks and the state of SCL, so all of the devices start counting
their high periods. The first device to complete its high period pulls SCL low again.
Figure 8-4. Synchronized Clock SCL
8.4.3 Handshaking
The clock synchronization mechanism can be used as a handshake in data transfers. Slave
devices can hold SCL low after completing one byte transfer (9 bits). In such a case, the
clock mechanism halts the bus clock and forces the master clock into wait states until the
slave releases SCL.
8.4.4 Clock Stretching
Slaves can use the clock synchronization mechanism to slow down the transfer bit rate.
After the master has driven SCL low, the slave can drive SCL low for the required period
and then release it. If the slave SCL low period is longer than the master SCL low period,
the resulting SCL bus signal low period is stretched.
Internal Counter Reset
SCL1
SCL2
SCL
Wait Start counting high period
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8-6 MCF5307 User’s Manual
Programming Model
8.5 Programming Model
Table 8-1 lists the configuration registers used in the I2C interface.
NOTE:
External masters cannot access the MCF5307’s on-chip
memories or MBAR, but can access any I2C module register.
8.5.1 I2C Address Register (IADR)
The IADR holds the address the I2C responds to when addressed as a slave. Note that it is
not the address sent on the bus during the address transfer.
Table 8-2 describes IADR fields.
Table 8-1. I2C Interface Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x280 I2C address register (IADR) [p. 8-6] Reserved
0x284 I2C frequency divider register (IFDR) [p. 8-7] Reserved
0x288 I2C control register (I2CR) [p. 8-8] Reserved
0x28C I2C status register (I2SR) [p. 8-9] Reserved
0x290 I2C data I/O register (I2DR) [p. 8-10] Reserved
76543210
Field ADR —
Reset 0000_0000
R/W Read/Write
Address MBAR + 0x280
Figure 8-5. I2C Address Register (IADR)
Table 8-2. I2C Address Register Field Descriptions
Bits Name Description
7–1 ADR Slave address. Contains the specific slave address to be used by the I2C module. Slave mode is
the default I2C mode for an address match on the bus.
0—Reserved, should be cleared.
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Chapter 8. I2C Module 8-7
Programming Model
8.5.2 I2C Frequency Divider Register (IFDR)
The IFDR, Figure 8-6, provides a programmable prescaler to configure the clock for
bit-rate selection.
Table 8-3 describes IFDR[IC].
76543210
Field —IC
Reset 0000_0000
R/W Read/Write
Address MBAR + 0x284
Figure 8-6. I2C Frequency Divider Register (IFDR)
Table 8-3. IFDR Field Descriptions
Bits Name Description
7–6—Reserved, should be cleared.
5–0IC I
2C clock rate. Prescales the clock f or bit-rate selection. Due to potentially slo w SCL and SDA rise and
fall times , b us signals are sampled at the prescaler frequency. The serial bit clock frequency is equal to
BCLK0 divided by the divider shown below. Note that IC can be changed anywhere in a program.
IC Divider IC Divider IC Divider IC Divider
0x00 28 0x10 288 0x20 20 0x30 160
0x01 30 0x11 320 0x21 22 0x31 192
0x02 34 0x12 384 0x22 24 0x32 224
0x03 40 0x13 480 0x23 26 0x33 256
0x04 44 0x14 576 0x24 28 0x34 320
0x05 48 0x15 640 0x25 32 0x35 384
0x06 56 0x16 768 0x26 36 0x36 448
0x07 68 0x17 960 0x27 40 0x37 512
0x08 80 0x18 1152 0x28 48 0x38 640
0x09 88 0x19 1280 0x29 56 0x39 768
0x0A 104 0x1A 1536 0x2A 64 0x3A 896
0x0B 128 0x1B 1920 0x2B 72 0x3B 1024
0x0C 144 0x1C 2304 0x2C 80 0x3C 1280
0x0D 160 0x1D 2560 0x2D 96 0x3D 1536
0x0E 192 0x1E 3072 0x2E 112 0x3E 1792
0x0F 240 0x1F 3840 0x2F 128 0x3F 2048
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8-8 MCF5307 User’s Manual
Programming Model
8.5.3 I2C Control Register (I2CR)
The I2CR is used to enable the I2C module and the I2C interrupt. It also contains bits that
govern operation as a slave or a master.
Table 8-4 describes I2CR fields.
76543210
Field IEN IIEN MSTA MTX TXAK RSTA —
Reset 0000_0000
R/W Read/Write
Address MBAR + 0x288
Figure 8-7. I2C Control Register (I2CR)
Table 8-4. I2CR Field Descriptions
Bits Name Description
7 IEN I2C enable. Controls the software reset of the entire I2C module. If the module is enabled in the
middle of a byte transfer, sla ve mode ignores the current b us transfer and starts operating when the
next start condition is detected. Master mode is not aware that the bus is busy; so initiating a start
cycle may corrupt the current bus cycle, ultimately causing either the current master or the I2C
module to lose arbitration, after which bus operation returns to normal.
0 The module is disabled, but registers can still be accessed.
1 The I2C module is enabled. This bit must be set before any other I2CR bits have any effect.
6 IIEN I2C interrupt enable.
0 I2C module interrupts are disabled, but currently pending interrupt condition are not cleared.
1 I2C module interrupts are enabled. An I2C interrupt occurs if I2SR[IIF] is also set.
5 MSTA Master/slave mode select bit. If the master loses arbitration, MSTA is cleared without generating a
STOP signal.
0 Slave mode. Changing MSTA from 1 to 0 generates a STOP and selects slave mode.
1 Master mode. Changing MSTA from 0 to 1 signals a START on the b us and selects master mode.
4 MTX Transmit/receive mode select bit. Selects the direction of master and slave transfers.
0 Receive
1 Transmit. When a slave is addressed, software should set MTX according to I2SR[SRW]. In
master mode, MTX should be set according to the type of transf er required. Theref ore, f or address
cycles, MTX is always 1.
3 TXAK Transmit acknowledge enable. Specifies the value driven onto SDA during acknowledge cycles for
both master and slav e receivers. Note that writing TXAK applies only when the I2C bus is a receiv er.
0 An acknowledge signal is sent to the bus at the ninth clock bit after receiving one byte of data.
1 No acknowledge signal response is sent (that is, acknowledge bit = 1).
2 RSTA Repeat start. Always read as 0. Attempting a repeat start without bus mastership causes loss of
arbitration.
0 No repeat start
1 Generates a repeated START condition.
1–0—Reserved, should be cleared.
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Chapter 8. I2C Module 8-9
Programming Model
8.5.4 I2C Status Register (I2SR)
This I2SR contains bits that indicate transaction direction and status.
Table 8-5 describes I2SR fields.
76543210
Field ICF IAAS IBB IAL —SRW IIF RXAK
Reset 1000_0001
R/W R R/W R R/W R
Address MBAR + 0x28C
Figure 8-8. I2CR Status Register (I2SR)
Table 8-5. I2SR Field Descriptions
Bits Name Description
7 ICF Data transferring bit. While one byte of data is transferred, ICF is cleared.
0 Transfer in progress
1 Transfer complete. Set by the falling edge of the ninth clock of a byte transfer.
6 IAAS I2C addressed as a slav e bit. The CPU is interrupted if I2CR[IIEN] is set. Next, the CPU must check
SRW and set its TX/RX mode accordingly. Writing to I2CR clears this bit.
0 Not addressed.
1 Addressed as a slave. Set when its own address (IADR) matches the calling address.
5 IBB I2C bus busy bit. Indicates the status of the bus.
0 Bus is idle. If a STOP signal is detected, IBB is cleared.
1 Bus is busy. When START is detected, IBB is set.
4 IAL Arbitration lost. Set b y hardware in the f ollo wing circumstances. (IAL must be cleared by software b y
writing zero to it.)
• SDA sampled low when the master drives high during an address or data-transmit cycle.
• SDA sampled low when the master drives high during the acknowledge bit of a data-receive
cycle.
• A start cycle is attempted when the bus is busy.
• A repeated start cycle is requested in slave mode.
• A stop condition is detected when the master did not request it.
3—Reserved, should be cleared.
2 SRW Slave read/write. When IAAS is set, SR W indicates the value of the R/W command bit of the calling
address sent from the master. SRW is valid only when a complete transfer has occurred, no other
transfers have been initiated, and the I2C module is a slave and has an address match.
0 Slave receive, master writing to slave.
1 Slave transmit, master reading from slave.
1 IIF I2C interrupt. Must be cleared by software by writing a zero to it in the interrupt routine.
0 No I2C interrupt pending
1 An interrupt is pending, which causes a processor interrupt request (if IIEN = 1). Set when one of
the following occurs:
• Complete one byte transfer (set at the falling edge of the ninth clock)
• Reception of a calling address that matches its own specific address in slave-receive mode
• Arbitration lost
0 RXAK Received acknowledge. The value of SDA during the acknowledge bit of a bus cycle.
0 An acknowledge signal was received after the completion of 8-bit data transmission on the bus
1 No acknowledge signal was detected at the ninth clock.
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8-10 MCF5307 User’s Manual
I2C Programming Examples
8.5.5 I2C Data I/O Register (I2DR)
In master-receive mode, reading the I2DR, Figure 8-9, allows a read to occur and initiates
next byte data receiving. In sla v e mode, the same function is available after it is addressed.
8.6 I2C Programming Examples
The following examples show programming for initialization, signalling START,
post-transfer software response, signalling STOP, and generating a repeated START.
8.6.1 Initialization Sequence
Before the interface can transfer serial data, registers must be initialized, as follows:
1. Set IFDR[IC] to obtain SCL frequency from the system bus clock. See
Section 8.5.2, “I2C Frequency Divider Register (IFDR).”
2. Update the IADR to define its slave address.
3. Set I2CR[IEN] to enable the I2C bus interface system.
4. Modify the I2CR to select master/slave mode, transmit/receive mode, and
interrupt-enable or not.
NOTE:
If IBSR[IBB] when the I2C bus module is enabled, e x ecute the
following code sequence before proceeding with normal
initialization code. This issues a STOP command to the slave
device, placing it in idle state as if it were just power -cycled on.
I2CR = 0x0
I2CR = 0xA
dummy read of I2DR
IBSR = 0x0
I2CR = 0x0
8.6.2 Generation of START
After completion of the initialization procedure, serial data can be transmitted by selecting
the master transmitter mode. On a multiple-master bus system, IBSR[IBB] must be tested
to determine whether the serial bus is free. If the bus is free (IBB = 0), the START signal
76543210
Field D
Reset 0000_0000
R/W Read/Write
Address MBAR + 0x290
Figure 8-9. I2C Data I/O Register (I2DR)
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Chapter 8. I2C Module 8-11
I2C Programming Examples
and the first byte (the slave address) can be sent. The data written to the data register
comprises the address of the desired slave and the lsb indicates the transfer direction.
The free time between a STOP and the ne xt STAR T condition is built into the hardw are that
generates the START cycle. Depending on the relativ e frequencies of the system clock and
the SCL period, it may be necessary to wait until the I2C is busy after writing the calling
address to the I2DR before proceeding with the following instructions.
The follo wing e xample signals START and transmits the first byte of data (slav e address):
CHFLAG MOVE.B I2SR,-(A0);Check I2SR[MBB]
BTST.B #5, (A0)+
BNE.S CHFLAG;If I2SR[MBB] = 1, wait until it is clear
TXSTART MOVE.B I2CR,-(A0);Set transmit mode
BSET.B #4,(A0)
MOVE.B (A0)+, I2CR
MOVE.B I2CR, -(A0);Set master mode
BSET.B #5, (A0);Generate START condition
MOVE.B (A0)+, I2CR
MOVE.B CALLING,-(A0);Transmit the calling address, D0=R/W
MOVE.B (A0)+, I2DR
IFREE MOVE.B I2SR,-(A0);Check I2SR[MBB]
;If it is clear, wait until it is set.
BTST.B #5, (A0)+;
BEQ.S IFREE;
8.6.3 Post-Transfer Software Response
Sending or receiving a byte sets the I2SR[ICF], which indicates one byte communication
is finished. I2SR[IIF] is also set. An interrupt is generated if the interrupt function is
enabled during initialization by setting I2CR[IIEN]. Software must first clear IIF in the
interrupt routine. ICF is cleared either by reading from I2DR in recei ve mode or by writing
to I2DR in transmit mode.
Software can service the I2C I/O in the main program by monitoring IIF if the interrupt
function is disabled. Polling should monitor IIF rather than ICF because that operation is
different when arbitration is lost.
When an interrupt occurs at the end of the address cycle, the master is always in transmit
mode; that is, the address is sent. If master receive mode is required (I2DR[R/W],
I2CR[MTX] should be toggled.
During slav e-mode address cycles (I2SR[IAAS] = 1), I2SR[SRW] is read to determine the
direction of the next transfer . MTX is programmed accordingly. For sla ve-mode data cycles
(IAAS = 0), SRW is invalid. MTX should be read to determine the current transfer
direction.
The follo wing is an e xample of a software response by a master transmitter in the interrupt
routine (see Figure 8-10).
I2SR LEA.L I2SR,-(A7);Load effective address
BCLR.B #1,(A7)+;Clear the IIF flag
MOVE.B I2CR,-(A7);Push the address on stack,
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8-12 MCF5307 User’s Manual
I2C Programming Examples
BTST.B #5,(A7)+;check the MSTA flag
BEQ.S SLAVE;Branch if slave mode
MOVE.B I2CR,-(A7);Push the address on stack
BTST.B #4,(A7)+;check the mode flag
BEQ.S RECEIVE;Branch if in receive mode
MOVE.B I2SR,-(A7);Push the address on stack,
BTST.B #0,(A7)+;check ACK from receiver
BNE.B END;If no ACK, end of transmission
TRANSMITMOVE.B DATABUF,-(A7);Stack data byte
MOVE.B (A7)+, I2DR;Transmit next byte of data
8.6.4 Generation of STOP
A data transfer ends when the master signals a STOP, which can occur after all data is sent,
as in the following example.
MASTX MOVE.B I2SR, -(A7);If no ACK, branch to end
BTST.B #0,(A7)+
BNE.B END
MOVE.B TXCNT,D0;Get value from the transmitting counter
BEQ.S END;If no more data, branch to end
MOVE.B DATABUF,-(A7);Transmit next byte of data
MOVE.B (A7)+,I2DR
MOVE.B TXCNT,D0;Decrease the TXCNT
SUBQ.L #1,D0
MOVE.B D0,TXCNT
BRA.S EMASTX;Exit
END LEA.L I2CR,-(A7);Generate a STOP condition
BCLR.B #5,(A7)+
EMASTX RTE;Return from interrupt
For a master recei ver to terminate a data transfer , it must inform the sla ve transmitter by not
acknowledging the last data byte. This is done by setting I2CR[TXAK] before reading the
next-to-last byte. Before the last byte is read, a STOP signal must be generated, as in the
following example.
MASR MOVE.B RXCNT,D0;Decrease RXCNT
SUBQ.L #1,D0
MOVE.B D0,RXCNT
BEQ.S ENMASR;Last byte to be read
MOVE.B RXCNT,D1;Check second-to-last byte to be read
EXTB.L D1
SUBI.L #1,D1;
BNE.S NXMAR;Not last one or second last
LAMAR BSET.B #3,I2CR;Disable ACK
BRA NXMAR
ENMASR BCLR.B #5,I2CR;Last one, generate STOP signal
NXMAR MOVE.B I2DR,RXBUF;Read data and store RTE
8.6.5 Generation of Repeated START
After the data transfer, if the master still wants the bus, it can signal another START
follo wed by another slave address without signalling a STOP, as in the following example.
RESTART MOVE.B I2CR,-(A7);Repeat START (RESTART)
BSET.B #2, (A7)
MOVE.B (A7)+, I2CR
MOVE.B CALLING,-(A7);Transmit the calling address, D0=R/W-
MOVE.B CALLING,-(A7);
MOVE.B (A7)+, I2DR
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Chapter 8. I2C Module 8-13
I2C Programming Examples
8.6.6 Slave Mode
In the slave interrupt service routine, the module addressed as slave bit (IAAS) should be
tested to check if a calling of its own address has just been receiv ed. If IAAS is set, software
should set the transmit/recei ve mode select bit (I2CR[MTX]) according to the I2SR[SR W].
Writing to the I2CR clears the IAAS automatically. The only time IAAS is read as set is
from the interrupt at the end of the address cycle where an address match occurred;
interrupts resulting from subsequent data transfers will have IAAS cleared. A data transfer
can no w be initiated by writing information to I2DR for slav e transmits, or read from I2DR
in slave-receive mode. A dummy read of I2DR in slave/receive mode releases SCL,
allowing the master to send data.
In the slave transmitter routine, I2SR[RXAK] must be tested before sending the next byte
of data. Setting RXAK means an end-of-data signal from the master receiver, after which
software must switch it from transmitter to receiver mode. Reading I2DR then releases SCL
so that the master can generate a STOP signal.
8.6.7 Arbitration Lost
If several devices try to engage the bus at the same time, one becomes master. Hardware
immediately switches devices that lose arbitration to slave receive mode. Data output to
SDA stops, but SCL is still generated until the end of the byte during which arbitration is
lost. An interrupt occurs at the falling edge of the ninth clock of this transfer with
I2SR[IAL] = 1 and I2CR[MSTA] = 0.
If a device that is not a master tries to transmit or do a START, hardware inhibits the
transmission, clears MSTA without signalling a STOP, generates an interrupt to the CPU,
and sets IAL to indicate a failed attempt to engage the bus. When considering these cases,
the slave service routine should first test IAL and software should clear it if it is set.
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8-14 MCF5307 User’s Manual
I2C Programming Examples
Figure 8-10. Flow-Chart of Typical I2C Interrupt Routine
Clear
Master
Mode?
TX/Rx
?
Last Byte
Transmitted
?
RXAK= 0
?
End of
ADDR Cycle
(Master RX)
?
Write Next
Byte to I2DR
Switch to
Rx Mode
Dummy Read
from I2DR Generate
STOP Signal Read Data
from I2DR
And Store
Set TXAK =1 Generate
STOP Signal
2nd Last
Byte to be
Last
Byte to be
?
Arbitration
Lost?
Clear IAL
IAAS=1
?
IAAS=1
?
SRW=1
?Tx/Rx
?
Set TX
Mode
Write Data
to I2DR
Set RX
Mode
Dummy Read
from I2DR
ACK from
Receiver
?
Tx Next
Byte Read Data
from I2DR
and Store
Switch to
Rx Mode
Dummy Read
from I2DR
RTE
YN
Y
YY
Y
Y
Y
Y
Y
Y
N
N
N
N
N
N
N
N
N
Y
TX RX
RX
TX
(WRITE)
(Read)
N
IIF
Address
Cycle Data
Cycle
Read
Read?
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Chapter 9. Interrupt Controller 9-1
Chapter 9
Interrupt Controller
This chapter describes the operation of the interrupt controller portion of the system
integration module (SIM). It includes descriptions of the re gisters in the interrupt controller
memory map and the interrupt priority scheme.
9.1 Overview
The SIM provides a centralized interrupt controller for all MCF5307 interrupt sources,
which consist of the following:
• External interrupts
• Software watchdog timer
• Timer modules
•I
2C module
• UART modules
• DMA module
Figure 9-1 is a block diagram of the interrupt controller.
Figure 9-1. Interrupt Controller Block Diagram
Interrupt Controller
12 ICRs
IMR
IRQ[1,3,5,7]
4
AVR
IPR
IRQPAR
Software
Watchdog
Two
Two UARTs
DMA
I2C Module
Four
Channels
General-
Purpose
Timers
System Integration Module (SIM)
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9-2 MCF5307 User’s Manual
Interrupt Controller Registers
The SIM provides the following registers for managing interrupts:
• Each potential interrupt source is assigned one of the 10 interrupt control registers
(ICR0–ICR9), which are used to prioritize the interrupt sources.
• The interrupt mask register (IMR) provides bits for masking individual interrupt
sources.
• The interrupt pending register (IPR) provides bits for indicating when an interrupt
request is being made (regardless of whether it is masked in the IMR).
• The autov ector register (AVEC) controls whether the SIM supplies an autovector or
executes an external interrupt acknowledge cycle for each IRQ.
• The interrupt port assignment register (IRQPAR) provides the level assignment of
the primary external interrupt pins—IRQ5, IRQ3, and IRQ1.
9.2 Interrupt Controller Registers
The interrupt controller register portion of the SIM memory map is shown in Table 9-2.
Each internal interrupt source has its o wn interrupt control register (ICR0–ICR9), sho wn in
Table 9-2 and described in Section 9.2.1, “Interrupt Control Registers (ICR0–ICR9).”
Table 9-1. Interrupt Controller Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x040 Interrupt pending register (IPR) [p. 9-6]
0x044 Interrupt mask register (IMR) [p. 9-6]
0x048 Reserved Autovector register
(AVR) [p. 9-5]
Interrupt Control Registers (ICRs) [p. 9-3]
0x04C Software watchdog
timer (ICR0) [p. 9-3] Timer0 (ICR1) [p. 9-3] Timer1 (ICR2) [p. 9-3] I2C (ICR3) [p. 9-3]
0x050 UART0 (ICR4) [p. 9-3] UART1 (ICR5) [p. 9-3] DMA0 (ICR6) [p. 9-3] DMA1 (ICR7) [p. 9-3]
0x054 DMA2 (ICR8) [p. 9-3] DMA3 (ICR9) [p. 9-3] Reserved
Table 9-2. Interrupt Control Registers
MBAR Offset Register Name
0x04C ICR0 Software watchdog timer
0x04D ICR1 Timer0
0x04E ICR2 Timer1
0x04F ICR3 I2C
0x050 ICR4 UART0
0x051 ICR5 UART1
0x052 ICR6 DMA0
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Chapter 9. Interrupt Controller 9-3
Interrupt Controller Registers
Internal interrupts are programmed to a level and priority. Each internal interrupt has a
unique ICR. Each of the 7 interrupt le vels has 5 priorities, for a total of 35 possible priority
le v els, encompassing internal and external interrupts. The four e xternal interrupt pins of fer
seven possible settings at a fixed interrupt level and priority.
The IRQPAR determines these settings for external interrupt request levels. External
interrupts can be programmed to supply an autovector or execute an external interrupt
acknowledge cycle. This is described in Section 9.2.2, “Autovector Register (AVR).”
9.2.1 Interrupt Control Registers (ICR0–ICR9)
The interrupt control registers (ICR0–ICR9) pro vide bits for defining the interrupt level and
priority for the interrupt source assigned to the ICR, shown in Table 9-2.
Table 9-3 describes ICR fields.
0x053 ICR7 DMA1
0x054 ICR8 DMA2
0x055 ICR9 DMA3
76543210
Field AVEC —IL IP
Reset 0 —0_00 00
R/W R/W
Address MBAR + 0x04C (ICR0); 0x04D (ICR1); 0x04E (ICR2); 0x04F (ICR3); 0x050 (ICR4); 0x051 (ICR5);
0x052 (ICR6); 0x053 (ICR7); 0x054 (ICR8); 0x055 (ICR9)
Figure 9-2. Interrupt Control Registers (ICR0–ICR9)
Table 9-3. ICRn Field Descriptions
Bits Field Description
7 AVEC Autovector enable. Determines whether the interrupt-acknowledge cycle input (for the internal
interrupt level indicated in IL for each interrupt) requires an autovector response.
0 Interrupting source returns vector during interrupt-acknowledge cycle.
1 SIM generates autovector during interrupt acknowledge cycle.
6–5—Reserved, should be cleared.
4–2 IL Interrupt level. Indicates the interrupt level assigned to each interrupt input. See Table 9-4.
1–0 IP Interrupt priority. Indicates the interrupt priority for internal modules within the interrupt-level
assignment. See Table 9-4.
00 Lowest
01 Low
10 High
11 Highest
Table 9-2. Interrupt Control Registers (Continued)
MBAR Offset Register Name
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9-4 MCF5307 User’s Manual
Interrupt Controller Registers
NOTE:
Assigning the same interrupt level and priority to multiple
ICRs causes unpredictable system behavior.
Table 9-4 shows possible priority schemes for internal and external sources of the
MCF5307. The internal module interrupt source in this table can be any internal interrupt
source programmed to the given level and priority.
This table shows how external interrupts are prioritized with respect to internal interrupt
sources within the same level. For example, UART0 and UART1 sources are programmed
to IL = 110; in this case, U AR T0 is gi v en lower priority than U ART1, so ICR4[IP] = 01 and
the ICR5[IP] = 10. IRQ3 is programmed to le vel 6. If all three assert an interrupt request at
the same time, they are serviced in the following order:
1. ICR5[IL] = 110 and ICR5[IP] = 10, so UART1 is serviced first (priority 7 in
Table 9-4).
2. External interrupt IRQ3, set to level 6, is serviced next (priority 8).
3. ICR4[IL] = 110 and ICR5[IP] = 01, so UART0 is serviced last (priority 9).
Table 9-4. Interrupt Priority Scheme
Priority Interrupt
Level
ICR Interrupt Source IRQPAR[IRQPAR]
IL IP
1 7 111 11 Internal module xxx
2 111 10 xxx
3xxx xx External interrupt pin IRQ7 xxx
4 111 01 Internal module xxx
5 111 00 xxx
6 6 110 11 Internal module xxx
7 110 10 xxx
8xxx xx External interrupt pin IRQ3 (programmed as IRQ6) x1x
9 110 01 Internal module xxx
10 110 00 xxx
11 5 101 11 Internal module xxx
12 101 10 xxx
13 xxx xx External interrupt pin IRQ5 0xx
14 101 01 Internal module xxx
15 101 00 xxx
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Chapter 9. Interrupt Controller 9-5
Interrupt Controller Registers
9.2.2 Autovector Register (AVR)
The autovector register (AVR), shown in Figure 9-3, enables external interrupt sources to
be autovectored, using the vector offset defined in Table 2-19 in Section 2.8, “Exception
Processing Overvie w. ” Note that the autov ector enable for internal interrupt sources applies
for respective ICRs.
16 4 100 11 Internal module xxx
17 100 10 xxx
18 xxx xx External interrupt pin IRQ5 (programmed as IRQ4) 1xx
19 100 01 Internal module xxx
20 100 00 xxx
21 3 011 11 Internal module xxx
22 011 10 xxx
23 xxx xx External interrupt pin IRQ3 x0x
24 011 01 Internal module xxx
25 011 00 xxx
26 2 010 11 Internal module xxx
27 010 10 xxx
28 xxx xx External interrupt pin IRQ1 (programmed as IRQ2) xx1
29 010 01 Internal module xxx
30 010 00 xxx
31 1 001 11 Internal module xxx
32 001 10 xxx
33 xxx xx External interrupt pin IRQ1 xx0
34 001 01 Internal module xxx
35 001 00 xxx
76543210
Field AVEC BLK
Reset 0000_0000
R/W R/W
Address MBAR + 0x04B
Figure 9-3. Autovector Register (AVR)
Table 9-4. Interrupt Priority Scheme (Continued)
Priority Interrupt
Level
ICR Interrupt Source IRQPAR[IRQPAR]
IL IP
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9-6 MCF5307 User’s Manual
Interrupt Controller Registers
Table 9-5 describes AVR fields.
.
Table 9-6 sho ws the correlation between AVR[AVEC] and the external interrupts. Note that
an AVECn bit is valid only when the corresponding external interrupt request level is
enabled in the IRQPAR.
9.2.3 Interrupt Pending and Mask Registers (IPR and IMR)
The interrupt pending register (IPR), Figure 9-4, makes visible the interrupt sources that
have an interrupt pending. The interrupt mask register (IMR), also shown in Figure 9-4, is
used to mask the internal and external interrupt sources.
NOTE:
To mask interrupt sources, first set the core’s status register
interrupt mask level to that of the source being masked in the
IMR. Then, the IMR bit can be masked.
An interrupt is masked by setting, and enabled by clearing, the corresponding IMR bit.
When a masked interrupt occurs, the corresponding IPR bit is still set, but no interrupt
request is passed to the core.
Table 9-5. AVR Field Descriptions
Bit Name Description
7–1 AVEC Autovector control. Determines whether the external interrupt at that level is autovectored.
0 Interrupting source returns vector during interrupt-acknowledge cycle.
1 SIM generates autovector during interrupt-acknowledge cycle.
0 BLK Block address strobe (AS) for external AVEC access. Available for users who use AS as a global
chip select for peripherals and do not want to enable them during an AVEC cycle.
0 Do not block address strobe.
1 Block address strobe from asserting.
Table 9-6. Autovector Register Bit Assignments
Autovector Interrupt Source Autovector Register Bit Location Vector Offset
External interrupt request 1 AVEC1 0x64
External interrupt request 2 AVEC2 0x68
External interrupt request 3 AVEC3 0x6C
External interrupt request 4 AVEC4 0x70
External interrupt request 5 AVEC5 0x74
External interrupt request 6 AVEC6 0x78
External interrupt request 7 AVEC7 0x7C
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Chapter 9. Interrupt Controller 9-7
Interrupt Controller Registers
Table 9-7 describes IPR and IMR fields.
9.2.4 Interrupt Port Assignment Register (IRQPAR)
The interrupt port assignment register (IRQPAR), shown in Figure 9-5, provides the level
assignment of the primary external interrupt pins—IRQ5, IRQ3, and IRQ1. The setting of
IRQPAR2–IRQPAR0 determines the interrupt level of these external interrupt pins.
Table 9-8 describes IRQPAR fields.
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Field —DMA3 DMA2
Reset —11
R/W Read-only (IPR); R/W (IMR)
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Field DMA1 DMA0 UART1 UART0 I2C TIMER2 TIMER1 SWT EINT7 EINT6 EINT5 EINT4 EINT3 EINT2 EINT1 —
Reset 1111 1111 1111 1 1 1 —
R/W Read-only (IPR); R/W (IMR)
Addr MBAR + 0x040 (IPR); + 0x044 (IMR)
Figure 9-4. Interrupt Pending Register (IPR) and Interrupt Mask Register (IMR)
Table 9-7. IPR and IMR Field Descriptions
Bits Name Description
31–18 —Reserved, should be cleared.
17–1 See
Figure
9-4
Interrupt pending/mask. Each bit corresponds to an interrupt source defined by the ICR. The
corresponding IMR bit determines whether an interrupt condition can generate an interrupt. At
every clock, the IPR samples the signal generated b y the interrupting source. The corresponding
IPR bit reflects the state of the interrupt signal even if the corresponding IMR bit is set.
0 The corresponding interrupt source is not masked (IMR) and has no interrupt pending (IPR).
1 The corresponding interrupt source is masked (IMR) and has an interrupt pending (IPR)
76543210
Field IRQPAR2 IRQPAR1 IRQPAR0 —
Reset 0000_0000
R/W R/W
Address MBAR + 0x06
Figure 9-5. Interrupt Port Assignment Register (IRQPAR)
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9-8 MCF5307 User’s Manual
Interrupt Controller Registers
Table 9-8. IRQPAR Field Descriptions
Bits Name Description
7–5 IRQPARnConfigures the IRQ pin assignments and priorities
IRQPARnExternal Pin IRQPARn = 0 IRQPARn = 1
IRQPAR2 IRQ5 Level 5 Level 4
IRQPAR1 IRQ3 Level 3 Level 6
IRQPAR0 IRQ1 Level 1 Level 2
4–0—Reserved, should be cleared.
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Chapter 10. Chip-Select Module 10-1
Chapter 10
Chip-Select Module
This chapter describes the MCF5307 chip-select module, including the operation and
programming model of the chip-select registers, which include the chip-select address,
mask, and control registers.
10.1 Overview
The following list summarizes the key chip-select features:
• Eight independent, user-programmable chip-select signals (CS[7:0]) that can
interface with SRAM, PROM, EPROM, EEPROM, Flash, and peripherals
• Address masking for 64-Kbyte to 4-Gbyte memory block sizes
• Programmable wait states and port sizes
• External master access to chip selects
10.2 Chip-Select Module Signals
Table 10-1 lists signals used by the chip-select module.
Table 10-2 sho ws the interaction of the byte enable/byte-write enables with related signals.
Table 10-1. Chip-Select Module Signals
Signal Description
Chip Selects
(CS[7:0]) Each CSn can be independently programmed for an address location as well as for masking, port
size, read/write burst-capability, wait-state generation, and internal/external termination. Only CS0
is initialized at reset when it acts as a global chip select that allows boot ROM to be at any defined
address space. Port size and termination (internal versus external) and byte enables for CS0 are
configured by the logic levels of D[7:5] when RSTI negates.
Output
Enable (OE)Interfaces to memory or to peripheral devices and enables a read transfer. It is asserted and
negated on the falling edge of the cloc k. OE is asserted only when one of the chip selects matches
for the current address decode.
Byte Enables/
Byte Write
Enables
(BE[3:0]/
BWE[3:0])
These multiplexed signals are individually programmed through the byte enable mode bit,
CSCRn[BEM], described in Section 10.4.1.3, “Chip-Select Control Registers (CSCR0–CSCR7).”
These generated signals provide byte data select signals, which are decoded from the transfer
size, A1, and A0 signals in addition to the programmed port size and burstability of the memory
accessed, as Table 10-2 shows.
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10-2 MCF5307 User’s Manual
Chip-Select Operation
10.3 Chip-Select Operation
Each chip select has a dedicated set of the follo wing registers for configuration and control.
• Chip-select address registers (CSARn) control the base address space of the chip
select. See Section 10.4.1.1, “Chip-Select Address Registers (CSAR0–CSAR7).”
Table 10-2. Byte Enables/Byte Write Enable Signal Settings
Transfer Size Port Size A1 A0 BE0/BWE0 BE1/BWE1 BE2/BWE2 BE3/BWE3
D[31:24] D[23:16] D[15:8] D[7:0]
Byte 8-bit 0 0 0111
010111
100111
110111
16-bit 0 0 0 1 1 1
011011
100111
111011
32-bit 0 0 0 1 1 1
011011
101101
111110
Word 8-bit 0 0 0 1 1 1
010111
100111
110111
16-bit 0 0 0 0 1 1
100011
32-bit 0 0 0 0 1 1
101100
Longword 8-bit 0 0 0111
010111
100111
110111
16-bit 0 0 0 0 1 1
100011
32-bit 0 0 0 0 0 0
Line 8-bit 0 0 0111
010111
100111
110111
16-bit 0 0 0 0 1 1
100011
32-bit 0 0 0 0 0 0
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Chapter 10. Chip-Select Module 10-3
Chip-Select Operation
• Chip-select mask registers (CSMRn) provide 16-bit address masking and access
control. See Section 10.4.1.2, “Chip-Select Mask Registers (CSMR0–CSMR7).”
• Chip-select control registers (CSCRn) provide port size and burst capability
indication, wait-state generation, and automatic acknowledge generation features.
See Section 10.4.1.3, “Chip-Select Control Registers (CSCR0–CSCR7).”
Each CSn can assert during specific CPU space accesses such as interrupt-acknowledge
cycles and each can be accessed by an e xternal master . CS0 is a global chip select after reset
and provides relocatable boot ROM capability.
10.3.1 General Chip-Select Operation
When a bus c ycle is initiated, the MCF5307 first compares its address with the base address
and mask configurations programmed for chip selects 0–7 (configured in CSCR0–CSCR7)
and DRAM block 0 and 1 address and control registers (configured in DACR0 and
DACR1). If the driven address matches a programmed chip select or DRAM block, the
appropriate chip select is asserted or the DRAM block is selected using the specifications
programmed in the respective configuration register. Otherwise, the following occurs:
• If the address and attributes do not match in CSCR or D A CR, the MCF5307 runs an
external burst-inhibited bus cycle with a def ault of external termination on a 32-bit
port.
• Should an address and attribute match in multiple CSCRs, the matching chip-select
signals are driven; ho wever , the MCF5307 runs an external b urst-inhibited bus cycle
with external termination on a 32-bit port.
• Should an address and attribute match both DACRs or a DACR and a CSCR, the
operation is undefined.
Table 10-3 shows the type of access as a function of match in the CSCRs and DACRs.
Table 10-3. Accesses by Matches in CSCRs and DACRs
Number of CSCR Matches Number of DACR Matches Type of Access
0 0 External
10 Defined by CSCR
Multiple 0 External, burst-inhibited, 32-bit
01 Defined by DACRs
1 1 Undefined
Multiple 1 Undefined
0 Multiple Undefined
1 Multiple Undefined
Multiple Multiple Undefined
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10-4 MCF5307 User’s Manual
Chip-Select Operation
10.3.1.1 8-, 16-, and 32-Bit Port Sizing
Static bus sizing is programmable through the port size bits, CSCR[PS]. See
Section 10.4.1.3, “Chip-Select Control Registers (CSCR0–CSCR7).” Figure 10-1 shows
the correspondence between data byte lanes and the external chip-select memory. Note that
all lanes are driven, although unused lines are undefined.
Figure 10-1. Connections for External Memory Port Sizes
10.3.1.2 Global Chip-Select Operation
CS0, the global (boot) chip select, allows address decoding for boot ROM before system
initialization. Its operation differs from other external chip-select outputs after system reset.
After system reset, CS0 is asserted for every external access. No other chip-select can be
used until the v alid bit, CSMR0[V], is set, at which point CS0 functions as configured and
CS[7:1] can be used. At reset, the port size and automatic acknowledge functions of the
global chip-select are determined by the logic levels of the inputs on D[7:5]. Table 10-4 and
Table 10-5list the various reset encodings for the configuration signals multiplexed with
D[7:5].
Provided the required address range is in the chip-select address register (CSAR0), CS0 can
Table 10-4. D7/AA, Automatic Acknowledge of Boot CS0
D7/AA Boot CS0 AA Configuration at Reset
0 Disabled
1 Enable with 15 wait states
Table 10-5. D[6:5]/PS[1:0], Port Size of Boot CS0
D[6:5]/PS[1:0] Boot CS0 Port Size at Reset
00 32-bit port
01 8-bit port
1x 16-bit port
Byte 0
8-bit port
16-bit port
32-bit port
Byte 1
Byte 2
Byte 3
Byte 0 Byte 1
Byte 2 Byte 3
Byte 0 Byte 1 Byte 2 Byte 3
D[31:24] D[23:16] D[15:8] D[7:0]
External
memory
memory
memory
data bus
BE0 BE1 BE2 BE3
Driven, undefined
Driven, undefined
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Chapter 10. Chip-Select Module 10-5
Chip-Select Registers
be programmed to continue decoding for a range of addresses after the CSMR0[V] is set,
after which the global chip-select can be restored only by a system reset.
10.4 Chip-Select Registers
Table 10-6Table 10-6 is the chip-select register memory map. Reading reserved locations
returns zeros.
Table 10-6. Chip-Select Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x080 Chip-select address register—bank 0 (CSAR0) [p. 10-6] Reserved1
0x084 Chip-select mask register—bank 0 (CSMR0) [p. 10-6]
0x088 Reserved1Chip-select control register—bank 0
(CSCR0) [p. 10-8]
0x08C Chip-select address register—bank 1 (CSAR1) [p. 10-6] Reserved1
0x090 Chip-select mask register—bank 1 (CSMR1) [p. 10-6]
0x094 Reserved1Chip-select control register—bank 1
(CSCR1) [p. 10-8]
0x098 Chip-select address register—bank 2 (CSAR2) [p. 10-6] Reserved1
0x09C Chip-select mask register—bank 2 (CSMR2) [p. 10-6]
0x0A0 Reserved1Chip-select control register—bank 2
(CSCR2) [p. 10-8]
0x0A4 Chip-select address register—bank 3 (CSAR3) [p. 10-6] Reser ved1
0x0A8 Chip-select mask register—bank 3 (CSMR3) [p. 10-6]
0x0AC Reserved1Chip-select control register—bank 3
(CSCR3) [p. 10-8]
0x0B0 Chip-select address register—bank 4 (CSAR4) [p. 10-6] Reser ved1
0x0B4 Chip-select mask register—bank 4 (CSMR4) [p. 10-6]
0x0B8 Reserved1Chip-select control register—bank 4
(CSCR4) [p. 10-8]
0x0BC Chip-select address register—bank 5 (CSAR5) [p. 10-6] Reserved1
0x0C0 Chip-select mask register—bank 5 (CSMR5) [p. 10-6]
0x0C4 Reserved Chip-select control register—bank 5
(CSCR5) [p. 10-8]
0x0C8 Chip-select address register—bank 6 (CSAR6) [p. 10-6] Reserved1
0x0CC Chip-select mask register—bank 6 (CSMR6) [p. 10-6]
0x0D0 Reserved1Chip-select control register—bank 6
(CSCR6) [p. 10-8]
0x0D4 Chip-select address register—bank 7 (CSAR7) [p. 10-6] Reserved1
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10-6 MCF5307 User’s Manual
Chip-Select Registers
NOTE:
External masters cannot access MCF5307 on-chip memories or
MB AR, but can access an y of the chip-select module re gisters.
10.4.1 Chip-Select Module Registers
The chip-select module is programmed through the chip select address registers
(CSAR0–CSAR7), chip select mask registers (CSMR0–CSMR7), and the chip select
control registers (CSCR0–CSCR7).
10.4.1.1 Chip-Select Address Registers (CSAR0–CSAR7)
Chip select address registers, Figure 10-2, specify the chip select base addresses.
Table 10-7 describes CSAR[BA].
10.4.1.2 Chip-Select Mask Registers (CSMR0–CSMR7)
The chip select mask registers, Figure 10-3, are used to specify the address mask and
allowable access types for the respective chip selects.
0x0D8 Chip-select mask register—bank 7 (CSMR7) [p. 10-6]
0x0DC Reserved1Chip-select control register—bank 7
(CSCR7) [p. 10-8]
1Addresses not assigned to a register and undefined register bits are reserved for expansion. Write accesses to
these reserved address spaces and reserved register bits have no effect.
15 0
Field BA
Reset Uninitialized
R/W R/W
Addr 0x080 (CSAR0); 0x08C (CSAR1); 0x098 (CSAR2); 0x0A4 (CSAR3);
0x0B0 (CSAR4); 0x0BC (CSAR5); 0x0C8 (CSAR6); 0x0D4 (CSAR7)
Figure 10-2. Chip Select Address Registers (CSAR0–CSAR7)
Table 10-7. CSARn Field Description
Bits Name Description
15–0 BA Base address. Defines the base address f or memory dedicated to chip select CS[7:0]. BA is compared
to bits 31–16 on the internal address bus to determine if chip-select memory is being accessed.
Table 10-6. Chip-Select Registers (Continued)
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
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Chapter 10. Chip-Select Module 10-7
Chip-Select Registers
.
Table 10-8 describes CSMR fields.
31 1615 9876543210
Field BAM —WP —AM C/I SC SD UC UD V
Reset Unitialized 0
R/W R/W
Addr 0x084 (CSMR0); 0x090 (CSMR1); 0x09C (CSMR2); 0x0A8 (CSMR3);
0x0B4 (CSMR4); 0x0C0 (CSMR5); 0x0CC (CSMR6); 0x0D8 (CSMR7)
Figure 10-3. Chip Select Mask Registers (CSMRn)
Table 10-8. CSMRn Field Descriptions
Bits Name Description
31–16 BAM Base address mask. Defines the chip select block by masking address bits. Setting a BAM bit
causes the corresponding CSAR bit to be ignored in the decode.
0 Corresponding address bit is used in chip-select decode.
1 Corresponding address bit is a don’t care in chip-select decode.
The block size for CS[7:0] is 2n; n = (number of bits set in respective CSMR[BAM]) + 16.
So, if CSAR0 = 0x0000 and CSMR0[BAM] = 0x0008, CS0 would address two discontinuous
64-Kbyte memory blocks: one from 0x0000–0xFFFF and one from 0x8_0000–0x8_FFFF.
Likewise, for CS0 to access 32 Mbytes of address space starting at location 0x0, CS1 must begin
at the next byte after CS0 for a 16-Mbyte address space. Then CSAR0 = 0x0000,
CSMR0[BAM] = 0x01FF, CSAR1 = 0x0200, and CSMR1[BAM] = 0x00FF.
8 WP Write protect. Controls write accesses to the address range in the corresponding CSAR.
Attempting to write to the range of addresses for which CSARn[WP] = 1 results in the appropriate
chip select not being selected. No exception occurs.
0 Both read and write accesses are allowed.
1 Only read accesses are allowed.
7—Reserved, should be cleared.
6 AM Alternate master. When AM = 0 during an external master or DMA access, SC, SD, UC, and UD
are don’t cares in the chip-select decode.
5–1 C/I,
SC,
SD,
UC,
UD
Address space mask bits. These bits determine whether the specified accesses can occur to the
address space defined by the BAM for this chip select.
C/I CPU space and interrupt acknowledge cycle mask
SC Supervisor code address space mask
SD Supervisor data address space mask
UC User code address space mask
UD User data address space mask
0 The address space assigned to this chip select. is available to the specified access type.
1 The address space assigned to this chip select. is not a vailab le (masked) to the specified access
type. If this address space is accessed, chip select is not activated and a regular external bus
cycle occurs.
Note that if if AM = 0, SC, SD, UC, and UD are ignored in the chip select decode on external
master or DMA access.
0 V Valid bit. Indicates whether the corresponding CSAR, CSMR, and CSCR contents are valid.
Programmed chip selects do not assert until V is set (e xcept for CS0, which acts as the global chip
select). Reset clears each CSMRn[V].
0 Chip select invalid
1 Chip select valid
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10-8 MCF5307 User’s Manual
Chip-Select Registers
10.4.1.3 Chip-Select Control Registers (CSCR0–CSCR7)
Each chip-select control register, Figure 10-4, controls the auto acknowledge, external
master support, port size, burst capability, and activation of each chip select. Note that to
support the global chip select, CS0, the CSCR0 reset values differ from the other CSCRs.
CS0 allows address decoding for boot ROM before system initialization.
Figure 10-4. Chip-Select Control Registers (CSCR0–CSCR7)
Table 10-9 describes CSCRn fields.
151413 1098765 4 3 2 0
Field —WS —AA PS1 PS0 BEM BSTR BSTW —
Reset: CSCR0 —11_11 —D7 D6 D5 ——
Reset: Other CSCRs Unitialized
R/W R/W
Address 0x08A (CSCR0); 0x096 (CSCR1); 0x0A2 (CSCR2); 0x0AE (CSCR3);
0x0BA (CSCR4); 0x0C6 (CSCR5); 0x0D2 (CSCR6); 0x0DE (CSCR7)
Table 10-9. CSCRn Field Descriptions
Bits Name Description
15–14 —Reserved, should be cleared.
13–10 WS Wait states. The n umber of w ait states inserted before an internal transfer ac kno wledge is gener ated
(WS = 0 inserts zero wait states , WS = 0xF inserts 15 wait states). If AA = 0, TA must be asserted by
the external system regardless of the number of wait states generated. In that case, the external
transfer acknowledge ends the cycle. An external TA supersedes the generation of an internal TA.
9—Reserved, should be cleared.
8 AA Auto-acknowledge enable. Determines the assertion of the internal transfer acknowledge for
accesses specified by the chip-select address.
0 No internal TA is asserted. Cycle is terminated externally.
1 Internal TA is asserted as specified by WS. Note that if AA = 1 for a corresponding CSn and the
external system asserts an external TA before the w ait-state countdown asserts the internal TA, the
cycle is terminated. Burst cycles increment the address bus between each internal termination.
7–6 PS Port size. Specifies the width of the data associated with each chip select. It determines where data
is driven during write cycles and where data is sampled during read cycles. See Section 10.3.1.1,
“8-, 16-, and 32-Bit Port Sizing.”
00 32-bit port size. Valid data sampled and driven on D[31:0]
01 8-bit port size. Valid data sampled and driven on D[31:24]
1x 16-bit port size. Valid data sampled and driven on D[31:16]
5 BEM Byte enable mode. Specifies the byte enable operation. Certain SRAMs have b yte enab les that must
be asserted during reads as well as writes. BEM can be set in the relevant CSCR to provide the
appropriate mode of byte enable in support of these SRAMs.
0 Neither BE nor BWE is asserted for read. BWE is generated for data write only.
1BE
is asserted for read; BWE is asserted for write.
4 BSTR Burst read enable. Specifies whether burst reads are used for memory associated with each CSn.
0 Data exceeding the specified port size is broken into individual, port-sized non-burst reads. For
example, a longword read from an 8-bit port is broken into four 8-bit reads.
1 Enables data burst reads larger than the specified port size, including longword reads from 8- and
16-bit ports, word reads from 8-bit ports, and line reads from 8-, 16-, and 32-bit ports.
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Chapter 10. Chip-Select Module 10-9
Chip-Select Registers
10.4.1.4 Code Example
The code belo w provides an example of ho w to initialize the chip-selects. Only chip selects
0, 1, 2, and 3 are programmed here; chip selects 4, 5, 6, and 7 are left invalid. MBARx
defines the base of the module address space.
CSAR0 EQU MBARx+0x080 ;Chip select 0 address register
CSMR0 EQU MBARx+0x084 ;Chip select 0 mask register
CSCR0 EQU MBARx+0x08A ;Chip select 0 control register
CSAR1 EQU MBARx+0x08C ;Chip select 1 address register
CSMR1 EQU MBARx+0x090 ;Chip select 1 mask register
CSCR1 EQU MBARx+0x096 ;Chip select 1 control register
CSAR2 EQU MBARx+0x098 ;Chip select 2 address register
CSMR2 EQU MBARx+0x09C ;Chip select 2 mask register
CSCR2 EQU MBARx+0x0A2 ;Chip select 2 control register
CSAR3 EQU MBARx+0x0A4 ;Chip select 3 address register
CSMR3 EQU MBARx+0x0A8 ;Chip select 3 mask register
CSCR3 EQU MBARx+0x0AE ;Chip select 3 control register
CSAR4 EQU MBARx+0x0B0 ;Chip select 4 address register
CSAR4 EQU MBARx+0x0B4 ;Chip select 4 mask register
CSMR4 EQU MBARx+0x0BA ;Chip select 4 control register
CSAR5 EQU MBARx+0x0BC ;Chip select 5 address register
CSMR5 EQU MBARx+0x0C0 ;Chip select 5 mask register
CSCR5 EQU MBARx+0x0C6 ;Chip select 5 control register
CSAR6 EQU MBARx+0x0C8 ;Chip select 6 address register
CSMR6 EQU MBARx+0x0CC ;Chip select 6 mask register
CSCR6 EQU MBARx+0x0D2 ;Chip select 6 control register
CSAR7 EQU MBARx+0x0D4 ;Chip select 7 address register
CSMR7 EQU MBARx+0x0D8 ;Chip select 7 mask register
CSCR7 EQU MBARx+0x0DE ;Chip select 7 control register
; All other chip selects should be programmed and made valid before global
; chip select is de-activated by validating CS0
; Program Chip Select 3 Registers
move.w #0x0040,D0 ;CSAR3 base address 0x00400000
move.w D0,CSAR3
move.w #0x00A0,D0 ;CSCR3 = no wait states, AA=0, PS=16-bit, BEM=1,
move.w D0,CSCR3 ;BSTR=0, BSTW=0
move.l #0x001F016B,D0 ;Address range from 0x00400000 to 0x005FFFFF
move.l D0,CSMR3 ;WP,EM,C/I,SD,UD,V=1; SC,UC=0
; Program Chip Select 2 Registers
move.w #0x0020,D0 ;CSAR2 base address 0x00200000 (to 0x003FFFFF)
3 BSTW Burst write enable. Specifies whether burst writes are used for memory associated with each CSn.
0 Break data larger than the specified port size into individual port-sized, non-burst writes. For
example, a longword write to an 8-bit port takes four byte writes.
1 Enables burst write of data larger than the specified port size, including longword writes to 8 and
16-bit ports, word writes to 8-bit ports and line writes to 8-, 16-, and 32-bit ports.
2–0—Reserved, should be cleared.
Table 10-9. CSCRn Field Descriptions
Bits Name Description
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10-10 MCF5307 User’s Manual
Chip-Select Registers
move.w D0,CSAR2
move.w #0x0538,D0 ;CSCR2 = 1 wait state, AA=1, PS=32-bit, BEM=1,
move.w D0,CSCR2 ;BSTR=1, BSTW=1
move.l #0x001F0001,D0 ;Address range from 0x00200000 to 0x003FFFFF
move.l D0,CSMR2 ;WP,EM,C/I,SC,SD,UC,UD=0; V=1
; Program Chip Select 1 Registers
move.w #0x0000,D0 ;CSAR1 base addresses 0x00000000 (to 0x001FFFFF)
move.w D0,CSAR1 ;and 0x80000000 (to 0x801FFFFF)
move.w #0x09B0,D0 ;CSCR1 = 2 wait states, AA=1, PS=16-bit, BEM=1,
move.w D0,CSCR1 ;BSTR=1, BSTW=0
move.l #0x801F0001,D0 ;Address range from 0x00000000 to 0x001FFFFF and
move.l D0,CSMR1 ;0x80000000 to 0x801FFFFF
;WP, EM, C/I, SC, SD, UC, UD=0, V=1
; Program Chip Select 0 Registers
move.w #0x0080,D0 ;CSAR0 base address 0x00800000 (to 0x009FFFFF)
move.w D0,CSAR0
move.w #0x0D80,D0 ;CSCR0 = three wait states, AA=1, PS=16-bit, BEM=0,
move.w D0,CSCR0 ;BSTR=0, BSTW=0
; Program Chip Select 0 Mask Register (validate chip selects)
move.l #0x001F0001,D0 ;Address range from 0x00800000 to 0x009FFFFF
move.l D0,CSMR0 ;WP,EM,C/I,SC,SD,UC,UD=0; V=1
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-1
Chapter 11
Synchronous/Asynchronous DRAM
Controller Module
This chapter describes configuration and operation of the synchronous/asynchronous
DRAM controller component of the system integration module (SIM). It begins with a
general description and brief glossary, and includes a description of signals involved in
DRAM operations. The remainder of the chapter consists of the two following parts:
• Section 11.3, “Asynchronous Operation,” describes the programming model and
signal timing for the four basic asynchronous modes.
— Non-page mode
— Burst page mode
— Continuous page mode
— Extended data-out mode
• Section 11.4, “Synchronous Operation,” describes the programming model and
signal timing, as well as the command set required for synchronous operations. This
section also includes extensive examples the designer can follow to better
understand how to configure the DRAM controller for synchronous operations.
11.1 Overview
The DRAM controller module provides glueless integration of DRAM with the ColdFire
product. The key features of the DRAM controller include the following:
• Support for two independent blocks of DRAM
• Interface to standard synchronous/asynchronous dynamic random access memory
(ADRAM/SDRAM) components
• Programmable SRAS, SCAS, and refresh timing
• Support for page mode
• Support for 8-, 16-, and 32-bit wide DRAM blocks
• Support for synchronous and asynchronous DRAMs, including EDO DRAM,
SDRAM, and fast page mode
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11-2 MCF5307 User’s Manual
Overview
11.1.1 Definitions
The following terminology is used in this chapter:
• A/SDRAM block—Any group of DRAM memories selected by one of the
MCF5307 RAS[1:0] signals. Thus, the MCF5307 can support two independent
memory blocks. The base address of each block is programmed in the DRAM
address and control registers (DACR0 and DACR1).
• SDRAM—RAMs that operate like asynchronous DRAMs but with a synchronous
clock, a pipelined, multiple-bank architecture, and faster speed.
• SDRAM bank—An internal partition in an SDRAM device. For example, a 64-Mbit
SDRAM component might be configured as four 512K x 32 banks. Banks are
selected through the SDRAM component’s bank select lines.
11.1.2 Block Diagram and Major Components
The basic components of the DRAM controller are shown in Figure 11-1.
Figure 11-1. Asynchronous/Synchronous DRAM Controller Block Diagram
The DRAM controller’s major components, shown in Figure 11-1, are described as
follows:
• DRAM address and control registers (DACR0 and DACR1)—The DRAM
controller consists of two configuration register units, one for each supported
memory block. DACR0 is accessed at MBAR + 0x0108; DACR1 is accessed at
0x010. The register information is passed on to the hit logic.
Memory Block 0 Hit Logic
DRAM Address/Control Register 0
(DACR0)
A[31:0]
Internal Address
Control Logic
and RAS[1:0]
CAS[3:0]
DRAMW
DRAM Controller Module
Refresh Counter
SCAS
SRAS
SCKE
State Machine
Multiplexing
Page Hit
Logic
DRAM Control
Register (DCR)
Bus
Memory Block 1 Hit Logic
DRAM Address/Control Register 1
(DACR1)
These signals
A[31:0]
are used for
SDRAM only
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-3
DRAM Controller Operation
• Control logic and state machine—Generates all DRAM signals, taking bus cycle
characteristic data from the block logic, along with hit information to generate
DRAM accesses. Handles refresh requests from the refresh counter.
— DRAM control register (DCR)—Contains data to control refresh operation of
the DRAM controller. Both memory blocks are refreshed concurrently as
controlled by DCR[RC].
— Refresh counter—Determines when refresh should occur, determined by the
value of DCR[RC]. It generates a refresh request to the control block.
• Hit logic—Compares address and attribute signals of a current DRAM b us c ycle to
both D ACRs to determine if a DRAM block is being accessed. Hits are passed to the
control logic along with characteristics of the bus cycle to be generated.
• Page hit logic—Determines if the ne xt DRAM access is in the same DRAM page as
the previous one. This information is passed on to the control logic.
• Address multiplexing—Multiplexes addresses to allow column and row addresses
to share pins. This allows glueless interface to DRAMs.
11.2 DRAM Controller Operation
The DRAM controller mode is programmed through DCR[SO]. Asynchronous mode
(SO = 0) includes support for page mode and EDO DRAMs. Synchronous mode is
designed to work with industry-standard SDRAMs. These modes act v ery differently from
one another, especially regarding the use of DRAM registers and pins. Memory blocks
cannot operate in different modes; both are either synchronous or asynchronous.
11.2.1 DRAM Controller Registers
The DRAM controller registers memory map, Table 11-1, is the same regardless of whether
asynchronous or synchronous DRAM is used, although bit configurations may vary.
NOTE:
External masters cannot access MCF5307 on-chip memories or
MBAR, but they can access DRAM controller registers.
Table 11-1. DRAM Controller Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x100 DRAM control register (DCR) [p. 11-4] Reserved
0x104 Reserved
0x108 DRAM address and control register 0 (DACR0) [p. 11-5]
0x10C DRAM mask register block 0 (DMR0) [p. 11-7]
0x110 DRAM address and control register 1 (DACR1) [p. 11-5]
0x114 DRAM mask register block 1 (DMR1) [p. 11-7]
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11-4 MCF5307 User’s Manual
Asynchronous Operation
11.3 Asynchronous Operation
The DRAM controller supports asynchronous DRAMs for cost-effective systems. Typical
access times for the DRAM controller interfacing to ADRAM are 4-3-3-3. The DRAM
controller supports the following four asynchronous modes:
• Non-page mode
• Burst page mode
• Continuous page mode
• Extended data-out mode
In asynchronous mode, RAS and CAS always transition at the falling clock edge. As
summarized previously, operation and timing of each ADRAM block is controlled by
separate registers, but refresh is the same for both. All ADRAM accesses should be
terminated by the DRAM controller. There is no priority encoding between memory
blocks, so programming blocks to overlap with other blocks or with other internal resources
causes undefined behavior.
11.3.1 DRAM Controller Signals in Asynchronous Mode
Table 11-2 summarizes DRAM signals used in asynchronous mode.
11.3.2 Asynchronous Register Set
The following register configurations apply when DCR[SO] is 0, indicating the DRAM
controller is interfacing to asynchronous DRAMs.
11.3.2.1 DRAM Control Register (DCR) in Asynchronous Mode
The DCR provides programmable options for the refresh logic as well as the control bit to
determine if the module is operating with synchronous or asynchronous DRAMs. The DCR
is shown in Figure 11-2.
Table 11-2. SDRAM Signal Summary
Signal Description
RAS[1:0] Row address strobes . Interface to RAS inputs on industry-standard ADRAMs. When SDRAMs are used,
these signals interface to the chip-select lines within an SDRAM’s memory block. Thus , there is one RAS
line for each of the two blocks.
CAS[3:0] Column address strobes. Interface to CAS inputs on industry-standard DRAMs. These provide CAS for
a given ADRAM b lock. When SDRAMs are used, CAS[3:0] control the b yte enables (DQM x) for standard
SDRAMs. CAS[3:0] strobes data in least-to-most significant byte order (CAS0 is MSB).
DRAMW DRAM read/write. Asserted when a DRAM write cycle is underway. Negated for read bus cycles.
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-5
Asynchronous Operation
Table 11-3 describes DCR fields.
11.3.2.2 DRAM Address and Control Registers (DACR0/DACR1)
DACR0 and DACR1, Figure 11-3, contain the base address compare value and the control
bits for memory blocks 0 and 1. Address and timing are also controlled by these registers.
Memory areas defined for each block should not overlap; operation is undefined for
accesses in overlapping regions.
15 14 13 12 11 10 9 8 0
Field SO —NAM RRA RRP RC
Reset 0 Uninitialized
R/W R/W
Address MBAR + 0x100
Figure 11-2. DRAM Control Register (DCR) (Asynchronous Mode)
Table 11-3. DCR Field Descriptions (Asynchronous Mode)
Bits Name Description
15 SO Synchronous operation. Selects synchronous or asynchronous mode. A DRAM controller in
synchronous mode can be switched to ADRAM mode only by resetting the MCF5307.
0 Asynchronous DRAMs. Default at reset.
1 Synchronous DRAMs
14 —Reserved, should be cleared.
13 NAM No address multiplexing. Some implementations require external multiplexing. For example, when
linear addressing is required, the DRAM should not multiplex addresses on DRAM accesses.
0 The DRAM controller multiplexes the external address bus to provide column addresses.
1 The DRAM controller does not multiplex the external address bus to provide column addresses.
12–11 RRA Refresh RAS asserted. Determines how long RAS is asserted during a refresh operation.
00 2 clocks
01 3 clocks
10 4 clocks
11 5 clocks
10–9 RRP Refresh RAS precharge. Controls how many clocks RAS is precharged after a refresh operation
before accesses are allowed to DRAM.
00 1 clock
01 2 clocks
10 3 clocks
11 4 clocks
8–0 RC Refresh count. Controls refresh frequency. The number of bus clocks between refresh cycles is
(RC + 1) * 16. Refresh can range from 16–8192 bus clocks to accommodate both standard and
low-power DRAMs with bus clock operation from less than 2 MHz to greater than 50 MHz.
The following example calculates RC for an auto-refresh period for 4096 rows to receive 64 mS of
refresh every 15.625 µs for each row (625 bus clocks at 40 MHz).
# of bus clocks = 625 = (RC field + 1) * 16
RC = (625 bus clocks/16) -1 = 38.06, which rounds to 38; therefore, RC = 0x26.
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11-6 MCF5307 User’s Manual
Asynchronous Operation
Table 11-4 describes DACRn fields.
31 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Field BA —RE —CAS RP RNCN RCD —EDO PS PM —
Reset Unitialized 0 Unitialized
R/W R/W
Addr MBAR + 0x10C (DACR0); 0x110 (DACR1)
Figure 11-3. DRAM Address and Control Registers (DACR0/DACR1)
Table 11-4. DACR0/DACR1 Field Description
Bits Name Description
31–18 BA Base address. Used with DMR[BAM] to determine the address range in which the associated
DRAM bloc k is located. Each BA bit is compared with the corresponding address of the b us cycle in
progress. If each bit matches, or if bits that do not match are masked in the BAM, the address
selects the associated DRAM block.
17–16 —Reserved, should be cleared.
15 RE Refresh enable. Determines whether the DRAM controller generates a refresh to the associated
DRAM block. DRAM contents are not preserved during hard reset or software watchdog reset.
0 Do not refresh associated DRAM block. (Default at reset)
1 Refresh associated DRAM block.
14 —Reserved, should be cleared.
13–12 CAS CAS timing. Determines how long CAS is asserted during a DRAM access.
00 1 clock cycle
01 2 clock cycles
10 3 clock cycles
11 4 clock cycles
11–10 RP RAS precharge timing. Determines how long RAS is precharged between accesses. Note that RP
is different from DCR[RRP].
00 1 clock cycle
01 2 clock cycles
10 3 clock cycles
11 4 clock cycles
9 RNCN RAS-negate-to-CAS-negate. Controls whether RAS and CAS negate concurrently or one clock
apart. RNCN is ignored if CAS is asserted for only one clock and both RAS and CAS are negated.
RNCN is used only for non-page-mode accesses and single accesses in page mode.
0 RAS negates concurrently with CAS.
1 RAS negates one clock before CAS.
8 RCD RAS-to-CAS delay. Determines the number of system clocks betw een assertions of RAS and CAS.
0 1 clock cycle
1 2 clock cycles
7—Reserved, should be cleared.
6 EDO Extended data out. Determines whether the DRAM block operates in a mode to take advantage of
industry-standard EDO DRAMs. Do not use EDO mode with non-EDO DRAM.
0 EDO operation disabled.
1 EDO operation enabled.
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-7
Asynchronous Operation
11.3.2.3 DRAM Controller Mask Registers (DMR0/DMR1)
The DRAM controller mask registers (DMR0 and DMR1), shown in Figure 11-4, include
mask bits for the base address and for address attributes.
Table 11-5 describes DMRn fields.
5–4 PS Port size. Determines the port size of the associated DRAM block. For example, if two 16-bit wide
DRAM components form one DRAM block, the port size is 32 bits. Programming PS allows the
DRAM controller to execute dynamic bus sizing for associated accesses.
00 32-bit port
01 8-bit port
1x 16-bit port
3–2 PM Page mode. Configures page-mode operation for the memory block.
00 No page mode
01 Burst page mode (page mode for bursts only)
10 Reserved
11 Continuous page mode
1–0—Reserved, should be cleared.
31 1817 9876543210
Field BAM —WP —C/I AM SC SD UC UD V
Reset Uninitialized 0
R/W R/W
Addr MBAR + 0x10C (DMR0), 0x114 (DMR1)
Figure 11-4. DRAM Controller Mask Registers (DMR0 and DMR1)
Table 11-5. DMR0/DMR1 Field Descriptions
Bits Name Description
31–18 BAM Base address mask. Masks the associated DA CR n[BA]. Lets the DRAM controller connect to v arious
DRAM sizes. Mask bits need not be contiguous (see Section 11.5, “SDRAM Example.”)
0 The associated address bit is used in decoding the DRAM hit to a memory block.
1 The associated address bit is not used in the DRAM hit decode.
17–9—Reserved, should be cleared.
8 WP Write protect. Determines whether the associated block of DRAM is write protected.
0 Allow write accesses
1 Ignore write accesses. The DRAM controller ignores write accesses to the memory block and an
address exception occurs. Write accesses to a write-protected DRAM region are compared in the
chip select module for a hit. If no hit occurs, an external bus cycle is generated. If this external bus
cycle is not acknowledged, an access exception occurs.
7—Reserved, should be cleared.
Table 11-4. DACR0/DACR1 Field Description (Continued)
Bits Name Description
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11-8 MCF5307 User’s Manual
Asynchronous Operation
11.3.3 General Asynchronous Operation Guidelines
The DRAM controller provides control for RAS, CAS, and DRAMW signals, as well as
address multiplexing and bus cycle termination. Whether the mode is synchronous or
asynchronous determines signal control and termination. To reduce complexity,
multiplexing is the same for both modes. Table 11-6 shows the scheme for DRAM
configurations. This scheme works for symmetric configurations (in which the number of
rows equals the number of columns) as well as asymmetric configurations (in which the
number of rows and columns are different).
6–1AMxAddress modifier masks. Determine which accesses can occur in a given DRAM block.
0 Allow access type to hit in DRAM
1 Do not allow access type to hit in DRAM
Bit Associated Access Type Access Definition
C/I CPU space/interrupt acknowledge MOVEC instruction or interrupt acknowledge cycle
AM Alternate master External or DMA master
SC Supervisor code Any supervisor-only instruction access
SD Supervisor data Any data fetched during the instruction access
UC User code Any user instruction
UD User data Any user data
0 V Valid. Cleared at reset to ensure that the DRAM block is not erroneously decoded.
0 Do not decode DRAM accesses.
1 Registers controlling the DRAM block are initialized; DRAM accesses can be decoded.
Table 11-6. Generic Address Multiplexing Scheme
Address Pin Row Address Column Address Notes Relating to Port Sizes
17 17 0 8-bit port only
16 16 1 8- and 16-bit ports only
15 15 2
14 14 3
13 13 4
12 12 5
11 11 6
10 10 7
99 8
17 17 16 32-bit port only
18 18 17 16-bit port only or 32-bit port with only 8 column address lines
19 19 18 16-bit port only when at least 9 column address lines are used
Table 11-5. DMR0/DMR1 Field Descriptions (Continued)
Bits Name Description
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-9
Asynchronous Operation
Note the following:
• Each MCF5307 address bit drives both a row address and a column address bit.
• As the user upgrades ADRAM, corresponding MCF5307 address bits must be
connected. This multiplexing scheme allows various memory widths to be
connected to the address bus.
• Some dif ferences exist for each of the three possible port sizes. Note that only 8-bit
ports use an A0 address from the MCF5307. Because 16- and 32-bit ports issue
either words or longwords when accessed, the y do not use the MCF5307 A0 signal.
Likewise, the configuration for 32-bit ports uses neither A0 or A1. This presents a
slight problem because DRAM address signal A0 is issued on physical pin A17 of
the MCF5307 along with the ADRAM address signal A17. Although A0 is not used
for larger ports, A17 is still needed. The MCF5307 DRAM controller provides for
this by changing the column address that appears on physical pin A17 of the
processor whenever an 8-bit port is not selected. This is determined by the
DACRn[PS] settings. For 8-bit ports, MCF5307 physical pin A17 drives logical
address A0 during the CAS cycle. When 16- or 32-bit port sizes are programmed,
the CAS cycle pin A17 drives logical address A16, as indicated in the generic
connection scheme.
• If a 32-bit port is used with only eight column address lines, A18 must dri ve DRAM
address bit A18. Otherwise, in 32-bit port configurations, the MCF5307 physical
address line is not connected with more than eight column address lines.
• All ADRAM blocks have a fixed page size of 512 bytes for page-mode operation.
The addresses are connected differently for various width combinations.
Table 11-7, Table 11-8, and T able 11-9 show ho w 8-, 16-, and 32-bit symmetrical ADRAM
memories are connected to the address bus. The memory sizes show what DRAM size is
accessed if the corresponding bits are connected to the memory . In each case, there is a base
memory size. This limitation exists to allow simple page-mode multiplexing. Notice also
that MCF5307 pin 17 is treated differently in byte-wide operations. In byte-wide
operations, address bits 16 and 17 are dri ven on MCF5307 physical address pins 16 and 17,
rather than the two bits being driven solely on A17, as they are for 32-wide memories.
20 20 19
21 21 20
22 22 21
23 23 22
24 24 23
25 25 24
Table 11-6. Generic Address Multiplexing Scheme (Continued)
Address Pin Row Address Column Address Notes Relating to Port Sizes
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11-10 MCF5307 User’s Manual
Asynchronous Operation
Note that in Table 11-8, MCF5307 pin A19 is not connected because DRAM address bit 18
is already provided on MCF5307 pin A18; thus, the next MCF5307 pin used should be A20.
Table 11-7. DRAM Addressing for Byte-Wide Memories
MCF5307 Address Pin MCF5307 Address Bit
Driven for RAS MCF5307 Address Bit Driven
when CAS is Asserted Memory Size
17 17 0 Base memory size of
256 Kbytes
16 16 1
15 15 2
14 14 3
13 13 4
12 12 5
11 11 6
10 10 7
99 8
19 19 18 1 Mbyte
21 21 20 4 Mbytes
23 23 22 16 Mbytes
25 25 24 64 Mbytes
Table 11-8. DRAM Addressing for 16-Bit Wide Memories
MCF5307 Address Pin MCF5307 Address Bit
Driven for RAS MCF5307 Address Bit Driven
when CAS is Asserted Memory Size
16 16 1 Base memory size of
128 Kbytes
15 15 2
14 14 3
13 13 4
12 12 5
11 11 6
10 10 7
99 8
18 18 17 512 Kbytes
20 20 19 2 Mbytes
22 22 21 8 Mbytes
24 24 23 32 Mbytes
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-11
Asynchronous Operation
11.3.3.1 Non-Page-Mode Operation
In non-page mode, the simplest mode, the DRAM controller provides termination and runs
a separate bus cycle for each data transfer. Figure 11-5 shows a non-page-mode access in
which a DRAM read is follo wed by a write. Addresses for a new bus c ycle are dri ven at the
rising clock edge.
For a DRAM block hit, the associated RAS is driven at the next falling edge. Here
DACRn[RCD] = 0, so the address is multiplexed at the next rising edge to provide the
column address. The required CAS signals are then driven at the next falling edge and
remain asserted for the period programmed in DACRn[CAS]. Here, DACRn[RNCN] = 1,
so it is precharged one clock before CAS is negated. On a read, data is sampled on the last
rising edge of the clock that CAS is valid.
Figure 11-5. Basic Non-Page-Mode Operation RCD = 0, RNCN = 1 (4-4-4-4)
Table 11-9. DRAM Addressing for 32-Bit Wide Memories
MCF5307 Address
Pin MCF5307 Address Bit
Driven for RAS MCF5307 Address Bit Driven
when CAS is Asserted Memory Size
15 15 2
Base Memory Size of
64 Kbytes
14 14 3
13 13 4
12 12 5
11 11 6
10 10 7
99 8
17 17 16 256 Kbytes
19 19 18 1 Mbyte
21 21 20 4 Mbytes
23 23 22 16 Mbytes
25 25 24 64 Mbytes
A[31:0]
RAS[1] or [0]
CAS[3:0]
DRAMW
D[31:0]
DACRn[RCD] = 0 DACRn[RNCN] = 1
DACRn[CAS] = 01]
Row Column
BCLKO
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11-12 MCF5307 User’s Manual
Asynchronous Operation
Figure 11-6 shows a variation of the basic cycle. In this case, RCD is 1, so there are two
clocks between RAS and CAS. Note that the address is multiplexed on the rising clock
immediately before CAS is asserted. Because RNCN = 0, RAS and CAS are negated
together. The next bus cycle is initiated, but because DACRn[RP] requires RAS to be
precharged for two clocks, RAS is delayed for a clock in the bus cycle. Note that this does
not delay the address signals, only RAS.
Figure 11-6. Basic Non-Page-Mode Operation RCD = 1, RNCN = 0 (5-5-5-5)
11.3.3.2 Burst Page-Mode Operation
Burst page-mode operation (DACRn[PM] = 01) optimizes memory accesses in page mode
by allowing a row address to remain registered in the DRAM while accessing data in
different columns. This eliminates the setup and hold times associated with the need to
precharge and assert RAS. Therefore, only the first bus cycle in the page takes the full
access time; subsequent accesses are streamlined. Single accesses look the same as
non-page-mode accesses.
Burst page-mode accesses of any size—byte, word, longword, or line—are assumed to
reside in the same page. In this mode, the DRAM controller generates a burst transfer only
when the operand is larger than the DRAM block port size (such as, a line transfer to a
32-bit port or a longword transfer to an 8-bit port). The primary cycle asserts RAS and
CAS; subsequent cycles assert only CAS. At the end of the access, RAS is precharged. The
DRAM controller increments addresses between cycles.
Figure 11-7 shows a read access in b urst page mode. F our accesses take place, which could
be a 32-bit access to an 8-bit port or a line access to a 32-bit port. Other burst page-mode
operations may be from 2 to 16 accesses long, depending on the access and port sizes. In
those cases, timing is similar with more or fewer accesses.
A[31:0]
RAS[1] or [0]
CAS[3:0]
DRAMW
D[31:0]
RCD = 1 RNCN = 0
CAS = 01
RP = 01
Row Column
BCLKO
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-13
Asynchronous Operation
Figure 11-7. Burst Page-Mode Read Operation (4-3-3-3)
Figure 11-8 shows the write operation with the same configuration.
Figure 11-8. Burst Page-Mode Write Operation (4-3-3-3)
11.3.3.3 Continuous Page Mode
Continuous page mode (DACRn[PM] = 11) is a type of page mode that balances
performance, complexity, and size. In typical page-mode implementations, sequential
addresses are checked for multiple hits in a DRAM block. On a hit, RAS remains asserted
and CAS is asserted with the new column address. On a miss, RAS must be precharged
again before the bus cycle begins.
Continuous page mode supports page-mode operation without requiring an address holding
register per memory block and eliminates the delay for a miss-to-precharge RAS for the
upcoming bus c ycle. Because the internal MCF5307 address bus is pipelined, addresses for
A[31:0]
RAS[1] or [0]
CAS[3:0]
DRAMW
D[31:0]
RCD = 0
CAS = 01
Row ColumnColumn Column Column
BCLKO
A[31:0]
RAS[1] or [0]
CAS[3:0]
DRAMW
D[31:0]
RCD = 0
CAS = 01
Row ColumnColumn Column Column
BCLKO
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11-14 MCF5307 User’s Manual
Asynchronous Operation
the next b us cycle are often a vailable before the current c ycle completes. The two addresses
are compared at the end of the cycle to determine if the next address hits the same page. If
so, RAS remains asserted. If not, or if no access is pending, RAS is precharged before the
next bus cycle is active on the external bus. As a result, a page miss suffers no penalty.
Single accesses not followed by a hit in the page look like non-page-mode accesses.
Figure 11-9 shows a write cycle followed by a read cycle in continuous page mode. The
read hits in the same page as the write so RAS is not negated before the second c ycle. Note
that the row address does not appear on the pins for a bus c ycle that hits in the page. Column
addresses are immediately multiplex ed onto the pins. The third b us cycle is a page miss, so
RAS is precharged before the end of the b us cycle and no extra prechar ge delay is incurred.
Figure 11-9. Continuous Page-Mode Operation
If a write cycle hits in the page, CAS must be delayed by one clock to allo w data to become
valid, as shown in Figure 11-10.
A[31:0]
RAS[1] or [0]
CAS[3:0]
DRAMW
D[31:0]
RCD=0 RNCN=1
CAS=01
Bus Cycle 1 Bus Cycle 2 Bus Cycle 3
Page Hit Page Miss
Row Column Column Row Column
BCLKO
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-15
Asynchronous Operation
Figure 11-10. Write Hit in Continuous Page Mode
11.3.3.4 Extended Data Out (EDO) Operation
EDO is a v ariation of page mode that allo ws the DRAM to continue driving data out of the
device while CAS is precharging. To support EDO DRAMs, the DRAM controller delays
internal termination of the cycle by one clock so data can continue to be captured as CAS
is being precharged. For data to be driven by the DRAMs, RAS is held after CAS is
negated. EDO operation does not affect write operations. EDO DRAMs can be used in
continuous page or burst page modes. Single accesses not follo wed by a hit in the page look
like non-page-mode accesses.
Figure 11-11 shows four consecutive EDO accesses. Note that data is sampled after CAS
is negated and that on the last page access, CAS is held until after data is sampled to assure
that the data is driven. This allows RAS to be precharged before the end of the cycle.
Figure 11-11. EDO Read Operation (3-2-2-2)
A[31:0]
RAS[1] or [0]
CAS[3:0]
DRAMW
D[31:0]
RCD = 0
CAS = 01
Bus Cycle 1 Bus Cycle 2
Page Hit Page Miss
Row Column Column
BCLKO
A[31:0]
RAS[1] or [0]
CAS[3:0]
DRAMW
D[31:0]
RCD = 0
CAS = 00
BCLKO
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11-16 MCF5307 User’s Manual
Synchronous Operation
11.3.3.5 Refresh Operation
The DRAM controller supports CAS-before-RAS refresh operations that are not
synchronized to bus activity. A special DRAMW pin is provided so refresh can occur
regardless of the state of the processor bus.
When the refresh counter rolls over, it sets an internal flag to indicate that a refresh is
pending. If that happens during a continuous page-mode access, the page is closed (RAS
precharged) when the data transfer completes to allow the refresh to occur. The flag is
cleared when the refresh cycle is run. Both memory blocks are simultaneously refreshed as
determined by the DCR. DRAM accesses are delayed during refresh. Only an active bus
access to a DRAM block can delay refresh.
Figure 11-12 shows a bus cycle delayed by a refresh operation. Notice that DRAMW is
forced high during refresh. The row address is held until the pending DRAM access.
Figure 11-12. DRAM Access Delayed by Refresh
11.4 Synchronous Operation
By running synchronously with the system clock instead of responding to asynchronous
control signals, SDRAM can (after an initial latency period) be accessed on every clock;
5-1-1-1 is a typical MCF5307 burst rate to SDRAM.
Note that because the MCF5307 cannot hav e more than one page open at a time, it does not
support interleaving.
SDRAM controllers are more sophisticated than asynchronous DRAM controllers. Not
only must they manage addresses and data, but they must send special commands for such
functions as precharge, read, write, burst, auto-refresh, and various combinations of these
functions. Table 11-10 lists common SDRAM commands.
A[31:0]
RAS[1] or [0]
CAS[3:0]
DRAMW
RRA = 01 RRP = 01
BCLKO
Refresh Access
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-17
Synchronous Operation
SDRAMs operate differently than asynchronous DRAMs, particularly in the use of data
pipelines and commands to initiate special actions. Commands are issued to memory using
specific encodings on address and control pins. Soon after system reset, a command must
be sent to the SDRAM mode register to configure SDRAM operating parameters. Note that,
after synchronous operation is selected by setting DCR[SO], DRAM controller registers
reflect the synchronous operation and there is no way to return to asynchronous operation
without resetting the processor.
11.4.1 DRAM Controller Signals in Synchronous Mode
Table 11-11 shows the behavior of DRAM signals in synchronous mode.
Table 11-10. SDRAM Commands
Command Definition
ACTV Activate. Executed before READ or WRITE executes; SDRAM registers and decodes row address.
MRS Mode register set.
NOP No-op . Does not affect SDRAM state machine; DRAM controller control signals negated; RAS asserted.
PALL Precharge all. Precharges all internal banks of an SDRAM component; executed before new page is
opened.
READ Read access. SDRAM registers column address and decodes that a read access is occurring.
REF Refresh. Refreshes internal bank rows of an SDRAM component.
SELF Self refresh. Refreshes internal bank rows of an SDRAM component when it is in low-power mode.
SELFX Exit self refresh. This command is sent to the DRAM controller when DCR[IS] is cleared.
WRITE Write access. SDRAM registers column address and decodes that a write access is occurring.
Table 11-11. Synchronous DRAM Signal Connections
Signal Description
SRAS Synchronous row address strobe. Indicates a valid SDRAM row address is present and can be latched
by the SDRAM. SRAS should be connected to the corresponding SDRAM SRAS. Do not confuse SRAS
with the DRAM controller’s RAS[1:0], which should not be interfaced to the SDRAM SRAS signals.
SCAS Synchronous column address strobe. Indicates a v alid column address is present and can be latched b y
the SDRAM. SCAS should be connected to the corresponding signal labeled SCAS on the SDRAM. Do
not confuse SCAS with the DRAM controller’s CAS[3:0] signals.
DRAMW DRAM read/write. Asserted for write operations and negated for read operations.
RAS[1:0] Row address strobe. Select each memory block of SDRAMs connected to the MCF5307. One RAS
signal selects one SDRAM block and connects to the corresponding CS signals.
SCKE Synchronous DRAM clock enable. Connected directly to the CKE (clock enable) signal of SDRAMs.
Enables and disables the clock internal to SDRAM. When CKE is low, memory can enter a power-down
mode where operations are suspended or they can enter self-refresh mode. SCKE functionality is
controlled by DCR[COC]. For designs using external multiplexing, setting COC allows SCKE to provide
command-bit functionality.
CAS[3:0] Column address strobe. For synchronous operation, CAS[3:0] function as byte enables to the SDRAMs.
They connect to the DQM signals (or mask qualifiers) of the SDRAMs.
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11-18 MCF5307 User’s Manual
Synchronous Operation
Figure 11-13 shows a typical signal configuration for synchronous mode.
Figure 11-13. MCF5307 SDRAM Interface
11.4.2 Using Edge Select (EDGESEL)
EDGESEL can ease system-level timings (note that the optional buffer in Figure 11-13 is
for memories that need extra delay). The clock at the input to the SDRAM is monitored and
data is held until the next edge of the bus clock, adding required output hold time to the
address, data, and control signals.
To generate SDRAM interface timing, address, data, and control signals are clocked
through a two-stage shift register. The first stage is clocked on the rising edge of BCLKO;
the second is clocked on the falling edge. This makes the signal available for up to an
additional half bus clock c ycle, of which only a small amount is needed for proper timing.
Using the connection shown in Figure 11-13 ensures that data remains held for a longer
time after the rising edge of the SDRAM clock input. This helps to match the MCF5307
output timing with the SDRAM clock.
Figure 11-14 shows the output wave forms for the interface signals changing on the rising
edge (A) and falling edge (B) of BCLK O as determined by whether EDGESEL is tied high
or low. It also shows timing (C) with EDGESEL tied to buffered BCLKO.
BCLKO Bus clock output. Connects to the CLK input of SDRAMs.
EDGESEL Synchronous edge select. Provides additional output hold time for signals that interface to external
SDRAMs. EDGESEL supports the three following modes for SDRAM interface signals:
• Tied high. Signals change on the rising edge of BCLKO.
• Tied low. Signals change on the falling edge of BCLKO.
• Tied to buffered BCLKO. Signals change on the rising edge of the buffered clock.
EDGESEL can provide additional output hold time for SDRAM interface signals, however the SDRAM
clock and BCLKO frequencies must be the same. See Section 11.4.2, “Using Edge Select (EDGESEL).”
Table 11-11. Synchronous DRAM Signal Connections (Continued)
Signal Description
EDGESEL
A[31:0]
CAS
DRAMW
SCAS
SRAS
SCKE CKE
CAS
RAS
DQM
WE
ADDRESS
DATA
CLK
MCF5307
BCLKO
D[31:0]
SDRAM
1 Trace length from buffer to CLK must equal length from buffer to EDGESEL.
1
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-19
Synchronous Operation
Figure 11-14. Using EDGESEL to Change Signal Timing
11.4.3 Synchronous Register Set
The memory map in Table 11-1 is the same for both synchronous and asynchronous
operation. However, some bits are different, as noted in the following sections.
11.4.3.1 DRAM Control Register (DCR) in Synchronous Mode
The DRAM control register (DCR), Figure 11-15, controls refresh logic.
Table 11-12 describes DCR fields.
1514131211109876543210
Field SO —NAM COC IS RTIM RC
Reset 0 Uninitialized
R/W R/W
Addr MBAR + 0x100
Figure 11-15. DRAM Control Register (DCR) (Synchronous Mode)
Table 11-12. DCR Field Descriptions (Synchronous Mode)
Bits Name Description
15 SO Synchronous operation. Selects synchronous or asynchronous mode. When in synchronous mode,
the DRAM controller can be switched to ADRAM mode only by resetting the MCF5307.
0 Asynchronous DRAMs. Default at reset.
1 Synchronous DRAMs
14 —Reserved, should be cleared.
13 NAM No address multiplexing. Some implementations require external multiplexing. For example, when
linear addressing is required, the DRAM should not multiplex addresses on DRAM accesses.
0 The DRAM controller multiplexes the external address bus to provide column addresses.
1 The DRAM controller does not multiplex the external address bus to provide column addresses.
VALID VALID VALID VALID
BCLKO
Address/ VALID VALID VALID
Buffered
VALID VALID VALIDVALID
A: Address and Data Timing with EDGESEL Tied High B: Address and Data Timing with EDGESEL Tied Low
Data
Address/
Data
C: Address and Data Timing with EDGESEL Tied to Buffered Clock
Address/
Data
BCLKO
Buffer Delay
BCLKO
BCLKO
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11-20 MCF5307 User’s Manual
Synchronous Operation
11.4.3.2 DRAM Address and Control Registers (DACR0/DACR1) in
Synchronous Mode
The DRAM address and control registers (DACR0 and DACR1), shown in Figure 11-16,
contain the base address compare v alue and the control bits for both memory blocks 0 and
1 of the DRAM controller. Address and timing are also controlled by bits in DACRn.
12 COC Command on SDRAM clock enable (SCKE). Implementations that use external multiplexing
(NAM = 1) must support command information to be multiplexed onto the SDRAM address bus.
0 SCKE functions as a clock enab le; self-refresh is initiated b y the DRAM controller through DCR[IS].
1 SCKE drives command information. Because SCKE is not a clock enable, self-refresh cannot be
used (setting DCR[IS]). Thus, external logic must be used if this functionality is desired. External
multiplexing is also responsible for putting the command information on the proper address bit.
11 IS Initiate self-refresh command.
0 Take no action or issue a SELFX command to exit self refresh.
1 If DCR[COC] = 0, the DRAM controller sends a SELF command to both SDRAM bloc ks to put them
in low-power, self-refresh state where they remain until IS is cleared, at which point the controller
sends a SELFX command for the SDRAMs to exit self-refresh. The refresh counter is suspended
while the SDRAMs are in self-refresh; the SDRAM controls the refresh period.
10–9 RTIM Refresh timing. Determines the timing operation of auto-refresh in the DRAM controller. Specifically,
it determines the number of clocks inserted between a REF command and the next possible ACTV
command. This same timing is used for both memory blocks controlled by the DRAM controller. This
corresponds to tRC in the SDRAM specifications.
00 3 clocks
01 6 clocks
1x 9 clocks
8–0 RC Refresh count. Controls refresh frequency. The number of bus clocks between refresh cycles is
(RC + 1) * 16. Refresh can range from 16–8192 bus clocks to accommodate both standard and
low-power DRAMs with bus clock operation from less than 2 MHz to greater than 50 MHz.
The following example calculates RC for an auto-refresh period for 4096 rows to receive 64 mS of
refresh every 15.625 µs for each row (625 bus clocks at 40 MHz). This operation is the same as in
asynchronous mode.
# of bus clocks = 625 = (RC field + 1) * 16
RC = (625 bus clocks/16) -1 = 38.06, which rounds to 38; therefore, RC = 0x26.
31 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Field BA —RE —CASL —CBM —IMRS PS IP PM —
Reset Uninitialized 0 Uninitialized 0 Uninitialized
R/W R/W
Addr MBAR+0x108 (DACR0); 0x110(DACR1)
Figure 11-16. DACR0 and DACR1 Registers (Synchronous Mode)
Table 11-12. DCR Field Descriptions (Synchronous Mode) (Continued)
Bits Name Description
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-21
Synchronous Operation
Table 11-13 describes DACRn fields.
Table 11-13. DACR0/DACR1 Field Descriptions (Synchronous Mode)
Bit Name Description
31–18 BA Base address register. With DCMR[BAM], determines the address range in which the associated
DRAM block is located. Each BA bit is compared with the corresponding address of the current bus
cycle. If all unmasked bits match, the address hits in the associated DRAM block. BA functions the
same as in asynchronous operation.
17–16 —Reserved, should be cleared.
15 RE Refresh enable. Determines when the DRAM controller generates a refresh cycle to the DRAM
block.
0 Do not refresh associated DRAM block
1 Refresh associated DRAM block
14 —Reserved, should be cleared.
13–12 CASL CAS latency. Affects the following SDRAM timing specifications. Timing nomenclature varies with
manufacturers. Refer to the SDRAM specification for the appropriate timing nomenclature:
Parameter Number of Bus Clocks
CASL= 00 CASL = 01 CASL= 10 CASL= 11
tRCD—SRAS assertion to SCAS assertion 1 2 3 3
tCASL—SCAS assertion to data out 1 2 3 3
tRAS—ACTV command to precharge command 2 4 6 6
tRP—Precharge command to ACTV command 1 2 3 3
tRWL,tRDL—Last data input to precharge
command 1111
tEP—Last data out to precharge command) 1 1 1 1
11 —Reserved, should be cleared.
10–8 CBM Command and bank MUX [2:0]. Because different SDRAM configurations cause the command and
bank select lines to correspond to different addresses, these resources are programmable. CBM
determines the addresses onto which these functions are multiplexed.
CBM Command Bit Bank Select Bits
000 17 18 and up
001 18 19 and up
010 19 20 and up
011 20 21 and up
100 21 22 and up
101 22 23 and up
110 23 24 and up
111 24 25 and up
This encoding and the address multiplexing scheme handle common SDRAM organizations. Bank
select bits include a base bit and all address bits above for SDRAMs with multiple bank select bits.
7—Reserved, should be cleared.
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11-22 MCF5307 User’s Manual
Synchronous Operation
11.4.3.3 DRAM Controller Mask Registers (DMR0/DMR1)
The DMRn, Figure 11-17, include mask bits for the base address and for address attributes.
They are the same as in asynchronous operation.
Table 11-14 describes DMRn fields.
6 IMRS Initiate mode register set (MRS) command. Setting IMRS generates a MRS command to the
associated SDRAMs. In initialization, IMRS should be set only after all DRAM controller registers are
initialized and PALL and REFRESH commands have been issued. After IMRS is set, the next access to
an SDRAM block programs the SDRAM’s mode register. Thus, the address of the access should be
programmed to place the correct mode information on the SDRAM address pins. Because the
SDRAM does not register this information, it doesn’t matter if the IMRS access is a read or a write or
what, if any, data is put onto the data bus. The DRAM controller clears IMRS after the MRS command
finishes.
0 Take no action
1 Initiate MRS command
5–4 PS Port size. Indicates the port size of the associated block of SDRAM, which allows for dynamic sizing
of associated SDRAM accesses. PS functions the same in asynchronous operation.
00 32-bit port
01 8-bit port
1x 16-bit port
3 IP Initiate precharge all (PALL) command. The DRAM controller clears IP after the PALL command is
finished. Accesses via IP should be no wider than the port size programmed in PS.
0 Take no action.
1A
PALL command is sent to the associated SDRAM block. During initialization, this command is
executed after all DRAM controller registers are programmed. After IP is set, the next write to an
appropriate SDRAM address generates the PALL command to the SDRAM block.
2 PM Page mode. Indicates how the associated SDRAM block supports page-mode operation.
0 Page mode on bursts only. The DRAM controller dynamically bursts the transfer if it falls within a
single page and the transfer size exceeds the port size of the SDRAM block. After the burst, the
page closes and a precharge is issued.
1 Continuous page mode. The page stays open and only SCAS needs to be asserted for sequential
SDRAM accesses that hit in the same page, regardless of whether the access is a burst.
1–0—Reserved, should be cleared.
31 1817 9876543210
Field BAM —WP —C/I AM SC SD UC UD V
Reset Uninitialized 0
R/W R/W
Addr MBAR + 0x10C (DMR0), 0x114 (DMR1)
Figure 11-17. DRAM Controller Mask Registers (DMR0 and DMR1)
Table 11-13. DACR0/DACR1 Field Descriptions (Synchronous Mode) (Continued)
Bit Name Description
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-23
Synchronous Operation
11.4.4 General Synchronous Operation Guidelines
To reduce system logic and to support a variety of SDRAM sizes, the DRAM controller
provides SDRAM control signals as well as a multiple xed ro w address and column address
to the SDRAM.
When SDRAM blocks are accessed, the DRAM controller can operate in either burst or
continuous page mode. The following sections describe the DRAM controller interface to
SDRAM, the supported bus transfers, and initialization.
11.4.4.1 Address Multiplexing
Table 11-6 sho ws the generic address multiplexing scheme for SDRAM configurations. All
possible address connection configurations can be derived from this table.
The following tables provide a more comprehensive, step-by-step way to determine the
correct address line connections for interfacing the MCF5307 to SDRAM. To use the
Table 11-14. DMR0/DMR1 Field Descriptions
Bits Name Description
31–18 BAM Base address mask. Masks the associated DACRn[BA]. Lets the DRAM controller connect to various
DRAM sizes. Mask bits need not be contiguous (see Section 11.5, “SDRAM Example.”)
0 The associated address bit is used in decoding the DRAM hit to a memory block.
1 The associated address bit is not used in the DRAM hit decode.
17–9—Reserved, should be cleared.
8 WP Write protect. Determines whether the associated block of DRAM is write protected.
0 Allow write accesses
1 Ignore write accesses. The DRAM controller ignores write accesses to the memory block and an
address exception occurs. Write accesses to a write-protected DRAM region are compared in the
chip select module for a hit. If no hit occurs, an external bus cycle is generated. If this external bus
cycle is not acknowledged, an access exception occurs.
7—Reserved, should be cleared.
6–1AMxAddress modifier masks. Determine which accesses can occur in a given DRAM block.
0 Allow access type to hit in DRAM
1 Do not allow access type to hit in DRAM
Bit Associated Access Type Access Definition
C/I CPU space/interrupt acknowledge MOVEC instruction or interrupt acknowledge cycle
AM Alternate master External or DMA master
SC Supervisor code Any supervisor-only instruction access
SD Supervisor data Any data fetched during the instruction access
UC User code Any user instruction
UD User data Any user data
0 V Valid. Cleared at reset to ensure that the DRAM block is not erroneously decoded.
0 Do not decode DRAM accesses.
1 Registers controlling the DRAM block are initialized; DRAM accesses can be decoded.
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11-24 MCF5307 User’s Manual
Synchronous Operation
tables, find the one that corresponds to the number of column address lines on the SDRAM
and to the port size as seen by the MCF5307, which is not necessarily the SDRAM port
size. For example, if two 1M x 16-bit SDRAMs together form a 2M x 32-bit memory, the
port size is 32 bits. Most SDRAMs likely have fewer address lines than are shown in the
tables, so follo w only the connections shown until all SDRAM address lines are connected.
Table 11-15. MCF5307 to SDRAM Interface (8-Bit Port, 9-Column Address Lines)
MCF5307
Pins A17 A16 A15 A14 A13 A12 A11 A10 A9 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 17161514131211109 1819202122232425262728293031
Column 012345678
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22
Table 11-16. MCF5307 to SDRAM Interface (8-Bit Port,10-Column Address Lines)
MCF5307
Pins A17 A16 A15 A14 A13 A12 A11 A10 A9 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 1716151413121110 9 19202122232425262728293031
Column 01234567818
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21
Table 11-17. MCF5307 to SDRAM Interface (8-Bit Port,11-Column Address
Lines)
MCF5307
Pins A17 A16 A15 A14 A13 A12 A11 A10 A9 A19 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 1716151413121110 9 192122232425262728293031
Column 0123456781820
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20
T able 11-18. MCF5307 to SDRAM Interface (8-Bit Port,12-Column Address Lines)
MCF5307
Pins A17 A16 A15 A14 A13 A12 A11 A10 A9 A19 A21 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 1716151413121110 9 1921232425262728293031
Column 012345678182022
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-25
Synchronous Operation
Table 11-19. MCF5307 to SDRAM Interface (8-Bit Port,13-Column Address
Lines)
MCF5307
Pins A17 A16 A15 A14 A13 A12 A11 A10 A9 A19 A21 A23 A25 A26 A27 A28 A29 A30 A31
Row 1716151413121110 9 19212325262728293031
Column 01234567818202224
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18
Table 11-20. MCF5307 to SDRAM Interface (16-Bit Port, 8-Column Address Lines)
MCF5307
Pins A16 A15 A14 A13 A12 A11 A10 A9 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 16151413121110 9 171819202122232425262728293031
Column 12345678
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22
Table 11-21. MCF5307 to SDRAM Interface (16-Bit Port, 9-Column Address Lines)
MCF5307
Pins A16 A15 A14 A13 A12 A11 A10 A9 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 16151413121110 9 1819202122232425262728293031
Column 1234567817
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21
Table 11-22. MCF5307 to SDRAM Interface (16-Bit Port, 10-Column Address Lines)
MCF5307
Pins A16 A15 A14 A13 A12 A11 A10 A9 A18 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 16151413121110 9 18202122232425262728293031
Column 123456781719
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20
Table 11-23. MCF5307 to SDRAM Interface (16-Bit Port, 11-Column Address Lines)
MCF5307
Pins A16 A15 A14 A13 A12 A11 A10 A9 A18 A20 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 16151413121110 9 182022232425262728293031
Column 12345678171921
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19
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11-26 MCF5307 User’s Manual
Synchronous Operation
Table 11-24. MCF5307 to SDRAM Interface (16-Bit Port, 12-Column Address Lines)
MCF5307
Pins A16 A15 A14 A13 A12 A11 A10 A9 A18 A20 A22 A24 A25 A26 A27 A28 A29 A30 A31
Row 16151413121110 9 1820222425262728293031
Column 1234567817192123
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18
Table 11-25. MCF5307to SDRAM Interface (16-Bit Port, 13-Column-Address Lines)
MCF5307
Pins A16 A15 A14 A13 A12 A11 A10 A9 A18 A20 A22 A24 A26 A27 A28 A29 A30 A31
Row 16151413121110 9 18202224262728293031
Column 123456781719212325
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17
Table 11-26. MCF5307 to SDRAM Interface (32-Bit Port, 8-Column Address Lines)
MCF5307
Pins A15 A14 A13 A12 A11 A10 A9 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 151413121110 9 171819202122232425262728293031
Column 234567816
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21
Table 11-27. MCF5307 to SDRAM Interface (32-Bit Port, 9-Column Address Lines)
MCF5307
Pins A15 A14 A13 A12 A11 A10 A9 A17 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 151413121110 9 1719202122232425262728293031
Column 23456781618
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20
Table 11-28. MCF5307 to SDRAM Interface (32-Bit Port, 10-Column Address Lines)
MCF5307
Pins A15 A14 A13 A12 A11 A10 A9 A17 A19 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 151413121110 9 17192122232425262728293031
Column 2345678161820
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-27
Synchronous Operation
11.4.4.2 Interfacing Example
The tables in the previous section can be used to configure the interface in the following
example. To interface one 2M x 32-bit x 4 bank SDRAM component (8 columns) to the
MCF5307, the connections would be as shown in Table 11-31.
11.4.4.3 Burst Page Mode
SDRAM can efficiently provide data when an SDRAM page is opened. As soon as SCAS
is issued, the SDRAM accepts a new address and asserts SCAS every clock for as long as
accesses are in that page. In burst page mode, there are multiple read or write operations for
every ACTV command in the SDRAM if the requested transfer size exceeds the port size of
the associated SDRAM. The primary c ycle of the transfer generates the ACTV and READ or
WRITE commands; secondary cycles generate only READ or WRITE commands. As soon as
the transfer completes, the PALL command is generated to prepare for the next access.
Note that in synchronous operation, burst mode and address incrementing during burst
cycles are controlled by the MCF5307 DRAM controller. Thus, instead of the SDRAM
enabling its internal burst incrementing capability, the MCF5307 controls this function.
This means that the burst function that is enabled in the mode re gister of SDRAMs must be
disabled when interfacing to the MCF5307.
Figure 11-18 shows a burst read operation. In this example, DACR[CASL] = 01, for an
SRAS-to-SCAS delay (tRCD) of 2 BCLKO cycles. Because tRCD is equal to the read CAS
Table 11-29. MCF5307 to SDRAM Interface (32-Bit Port, 11-Column Address Lines)
MCF5307
Pins A15 A14 A13 A12 A11 A10 A9 A17 A19 A21 A23 A24 A25 A26 A27 A28 A29 A30 A31
Row 151413121110 9 171921232425262728293031
Column 234567816182022
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18
Table 11-30. MCF5307 to SDRAM Interface (32-Bit Port, 12-Column Address Lines)
MCF5307
Pins A15 A14 A13 A12 A11 A10 A9 A17 A19 A21 A23 A25 A26 A27 A28 A29 A30 A31
Row 151413121110 9 1719212325262728293031
Column 23456781618202224
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17
Table 11-31. SDRAM Hardware Connections
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 = CMD BA0 BA1
MCF5307
Pins A15 A14 A13 A12 A11 A10 A9 A17 A18 A19 A20 A21 A22
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11-28 MCF5307 User’s Manual
Synchronous Operation
latency (SCAS assertion to data out), this value is also 2 BCLKO cycles. Notice that NOPs
are ex ecuted until the last data is read. A PALL command is executed one c ycle after the last
data transfer.
Figure 11-18. Burst Read SDRAM Access
Figure 11-19 sho ws the burst write operation. In this example, DACR[CASL] = 01, which
creates an SRAS-to-SCAS delay (tRCD) of 2 BCLKO cycles. Note that data is available
upon SCAS assertion and a burst write c ycle completes two c ycles sooner than a b urst read
cycle with the same tRCD. The next bus cycle is initiated sooner, but cannot begin an
SDRAM cycle until the precharge-to-ACTV delay completes.
A[31:0]
SRAS
SCAS
DRAMW
D[31:0]
tCASL = 2
ACTV READ NOPNOP
RAS[0] or [1]
CAS[3:0]
NOP PALL
Row Column Column Column Column
tRCD = 2
tEP
BCLKO
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-29
Synchronous Operation
Figure 11-19. Burst Write SDRAM Access
Accesses in synchronous burst page mode always cause the following sequence:
1. ACTV command
2. NOP commands to assure SRAS-to-SCAS delay (if CAS latency is 1, there are no
NOP commands).
3. Required number of READ or WRITE commands to service the transfer size with the
given port size.
4. Some transfers need more NOP commands to assure the ACTV-to-precharge delay.
5. PALL command
6. Required number of idle clocks inserted to assure precharge-to-ACTV delay.
11.4.4.4 Continuous Page Mode
Continuous page mode is identical to burst page mode, except that it allows the processor
core to handle successive b us cycles that hit the same page without having to close the page.
When the current bus cycle finishes, the MCF5307 core internal pipelined bus can predict
whether the upcoming cycle will hit in the same page.
• If the next bus cycle is not pending or misses in the page, the PALL command is
generated to the SDRAM.
• If the next bus cycle is pending and hits in the page, the page is left open, and the
next SDRAM access begins with a READ or WRITE command.
A[31:0]
SRAS
SCAS
DRAMW
D[31:0]
ACTV WRITE PALLNOP
RAS[0] or [1]
CAS[3:0]
tCASL = 2
Row Column Column Column Column
tRP
tRWL
BCLKO
NOP
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11-30 MCF5307 User’s Manual
Synchronous Operation
• Because of the nature of the internal CPU pipeline this condition does not occur
often; however, the use of continuous page mode is recommended because it can
provide a slight performance increase.
Figure 11-20 shows two read accesses in continuous page mode. Note that there is no
precharge between the two accesses. Also notice that the second cycle begins with a read
operation with no ACTV command.
Figure 11-20. Synchronous, Continuous Page-Mode Access—Consecutive Reads
Figure 11-21 shows a write followed by a read in continuous page mode. Because the bus
cycle is terminated with a WRITE command, the second cycle begins sooner after the write
than after the read. A read requires data to be returned before the bus cycle can terminate.
Note that in continuous page mode, secondary accesses output the column address only.
A[31:0]
SRAS
SCAS
DRAMW
D[31:0]
ACTV NOP READNOP
RAS[0] or [1]
CAS[3:0]
READ NOP NOP PALL
tCASL = 2
tRCD = 2
tCASL = 2
tEP
Row Column Column
BCLKO
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-31
Synchronous Operation
Figure 11-21. Synchronous, Continuous Page-Mode Access—Read after Write
11.4.4.5 Auto-Refresh Operation
The DRAM controller is equipped with a refresh counter and control. This logic is
responsible for providing timing and control to refresh the SDRAM. Once the refresh
counter is set, and refresh is enabled, the counter counts to zero. At this time, an internal
refresh request flag is set and the counter begins counting down again. The DRAM
controller completes any active burst operation and then performs a PALL operation. The
DRAM controller then initiates a refresh cycle and clears the refresh request flag. This
refresh cycle includes a delay from any precharge to the auto-refresh command, the
auto-refresh command, and then a delay until any ACTV command is allo wed. Any SDRAM
access initiated during the auto-refresh cycle is delayed until the cycle is completed.
Figure 11-22 shows the auto-refresh timing. In this case, there is an SDRAM access when
the refresh request becomes active. The request is delayed by the precharge to ACTV delay
programmed into the active SDRAM bank by the CAS bits. The REF command is then
generated and the delay required by DCR[RTIM] is inserted before the next ACTV
command is generated. In this example, the ne xt bus cycle is initiated, b ut does not generate
an SDRAM access until TRC is finished. Because both chip selects are acti ve during the REF
command, it is passed to both blocks of external SDRAM.
A[31:0]
SRAS
SCAS
DRAMW
D[31:0]
ACTV NOP READNOP
RAS[0] or [1]
CAS[3:0]
WRITE NOP NOP NOP PALL
Row Column Column
tCASL = 3
tRCD = 3 tEP
BCLKO
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11-32 MCF5307 User’s Manual
Synchronous Operation
Figure 11-22. Auto-Refresh Operation
11.4.4.6 Self-Refresh Operation
Self-refresh is a method of allowing the SDRAM to enter into a low-power state, while at
the same time to perform an internal refresh operation and to maintain the integrity of the
data stored in the SDRAM. The DRAM controller supports self-refresh with DCR[IS].
When IS is set, the SELF command is sent to the SDRAM. When IS is cleared, the SELFX
command is sent to the DRAM controller. Figure 11-23 shows the self-refresh operation.
Figure 11-23. Self-Refresh Operation
A[31:0]
SRAS
SCAS
DRAMW
PALL NOPNOP
RAS[0] or [1]
REF ACTV
tRCD = 2 tRC = 6
BCLKO
SRAS
SCAS
DRAMW
PALL NOPNOP
RAS[0] or [1]
SELF First
SCKE
Possible
ACTV
SELFX
Self-
Refresh
Active
tRCD = 2 tRC = 6
BCLKO
(DCR[COC] = 0)
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-33
Synchronous Operation
11.4.5 Initialization Sequence
Synchronous DRAMs have a prescribed initialization sequence. The DRAM controller
supports this sequence with the following procedure:
1. SDRAM control signals are reset to idle state. Wait the prescribed period after reset
before any action is taken on the SDRAMs. This is normally around 100 µs.
2. Initialize the DCR, DACR, and DMR in their operational configuration. Do not yet
enable PALL or REF commands.
3. Issue a PALL command to the SDRAMs by setting DCR[IP] and accessing a
SDRAM location. Wait the time (determined by tRP) before any other execution.
4. Enable refresh (set DACR[RE]) and wait for at least 8 refreshes to occur.
5. Before issuing the MRS command, determine if the DMR mask bits need to be
modified to allow the MRS to execute properly
6. Issue the MRS command by setting DACR[IMRS] and accessing a location in the
SDRAM. Note that mode register settings are dri ven on the SDRAM address bus, so
care must be taken to change DMR[BAM] if the mode register configuration does
not fall in the address range determined by the address mask bits. After the mode
register is set, DMR mask bits can be restored to their desired configuration.
11.4.5.1 Mode Register Settings
It is possible to configure the operation of SDRAMs, namely their burst operation and CAS
latency, through the SDRAM component’s mode re gister. CAS latency is a function of the
speed of the SDRAM and the bus clock of the DRAM controller. The DRAM controller
operates at a CAS latency of 1, 2, or 3.
Although the MCF5307 DRAM controller supports bursting operations, it does not use the
bursting features of the SDRAMs. Because the MCF5307 can burst operand sizes of 1, 2,
4, or 16 bytes long, the concept of a fixed burst length in the SDRAMs mode register
becomes problematic. Therefore, the MCF5307 DRAM controller generates the burst
cycles rather than the SDRAM de vice. Because the MCF5307 generates a ne w address and
a READ or WRITE command for each transfer within the burst, the SDRAM mode register
should be set either to a burst length of one or to not burst. This allows bursting to be
controlled by the MCF5307 instead.
The SDRAM mode register is written by setting the associated block’s DACR[IMRS].
First, the base address and mask registers must be set to the appropriate configuration to
allow the mode register to be set. Note that improperly set DMR mask bits may prevent
access to the mode register address. Thus, the user should determine the mapping of the
mode register address to the MCF5307 address bits to find out if an access is block ed. If the
DMR setting prohibits mode register access, the DMR should be reconfigured to enable the
access and then set to its necessary configuration after the MRS command executes.
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11-34 MCF5307 User’s Manual
SDRAM Example
The associated CBM bits should also be initialized. After DACR[IMRS] is set, the next
access to the SDRAM address space generates the MRS command to that SDRAM. The
address of the access should be selected to place the correct mode information on the
SDRAM address pins. The address is not multiplexed for the MRS command. The MRS
access can be a read or write. The important thing is that the address output of that access
needs the correct mode programming information on the correct address bits.
Figure 11-24 shows the MRS command, which occurs in the first clock of the bus cycle.
Figure 11-24. Mode Register Set (MRS) Command
11.5 SDRAM Example
This example interfaces a 2M x 32-bit x 4 bank SDRAM component to a MCF5307
operating at 40 MHz. Table 11-32 lists design specifications for this example.
Table 11-32. SDRAM Example Specifications
Parameter Specification
Speed grade (-8E) 40 MHz (25-nS period)
10 rows, 8 columns
Two bank-select lines to access four internal banks
ACTV-to-read/write delay (tRCD) 20 nS (min.)
Period between auto refresh and ACTV command (tRC) 70 nS
ACTV command to precharge command (tRAS) 48 nS (min.)
Precharge command to ACTV command (tRP) 20 nS (min.)
Last data input to PALL command (tRWL) 1 bus clock (25 nS)
Auto refresh period for 4096 rows (tREF) 64 mS
A[31:0]
SRAS, SCAS
DRAMW
D[31:0]
MRS
RAS[1] or [0]
BCLKO
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-35
SDRAM Example
11.5.1 SDRAM Interface Configuration
To interface this component to the MCF5307 DRAM controller, use the connection table
that corresponds to a 32-bit port size with 8 columns (Table 11-26). Two pins select one of
four banks when the part is functional. Table 11-33 shows the proper hardware hook-up.
11.5.2 DCR Initialization
At power-up, the DCR has the following configuration if synchronous operation and
SDRAM address multiplexing is desired.
This configuration results in a value of 0x8026 for DCR, as shown in Table 11-34.
11.5.3 DACR Initialization
As shown in Figure 11-26, in this example the SDRAM is programmed to access only the
second 512-Kbyte block of each 1-Mbyte partition in the SDRAM (each 16 Mbytes). The
starting address of the SDRAM is 0xFF80_0000. Continuous page mode feature is used.
Table 11-33. SDRAM Hardware Connections
MCF5307
Pins A15 A14 A13 A12 A11 A10 A9 A17 A18 A19 A20 A21 A22
SDRAM
Pins A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 = CMD BA0 BA1
15 14 13 12 11 10 9 8 0
Field SO res NAM COC IS RTIM RC
Setting 1 X 00000000100110
(hex)8026
Figure 11-25. Initialization Values for DCR
Table 11-34. DCR Initialization Values
Bits Name Setting Description
15 SO 1 Indicating synchronous operation
14 —x Don’t care (reserved)
13 NAM 0 Indicating SDRAM controller multiplexes address lines internally
12 COC 0 SCKE is used as clock enable instead of command bit because user is not multiplexing
address lines externally and requires external command feed.
11 IS 0 At power-up, allowing power self-refresh state is not appropriate because registers are
being set up.
10–9 RTIM 00 Because tRC value is 70 nS, indicating a 3-clock refresh-to-ACTV timing.
8–0 RC 0x26 Specification indicates auto-refresh period for 4096 rows to be 64 mS or refresh every
15.625 µs for each ro w, or 625 bus clocks at 40 MHz. Because DCR[RC] is incremented by
1 and multiplied by 16, RC = (625 bus clocks/16) -1 = 38.06 = 0x38
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11-36 MCF5307 User’s Manual
SDRAM Example
Figure 11-26. SDRAM Configuration
The DACRs should be programmed as shown in Figure 11-27.
This configuration results in a value of DACR0 = 0xFF88_0304, as described in
Table 11-35. DACR1 initialization is not needed because there is only one block.
Subsequently, DACR1[RE,IMRS,IP] should be cleared; everything else is a don’t care.
31 18 17 16
Field BA —
Setting 1111_1111_1000_10 xx
(hex) 15 15 8 8
151413121110 876543210
Field RE —CASL —CBM —IMRS PS IP PM —
Setting 0 X 00 X 011 X 0 00 0 1 xx
(hex) 0 3 0 4
Figure 11-27. DACR Register Configuration
Table 11-35. DACR Initialization Values
Bits Name Setting Description
31–18 BA Base address. So DA CR0[31–16] = 0xFF88, which places the starting address of the
SDRAM accessible memory at 0xFF88_0000.
17–16 —Reserved. Don’t care.
15 RE 0 0, which keeps auto-refresh disabled because registers are being set up at this time.
14 —Reserved. Don’t care.
13–12 CASL 00 Indicates a delay of data 1 cycle after CAS is asserted
11 —Reserved. Don’t care.
10–8 CBM 011 Command bit is pin 20 and bank selects are 21 and up.
7—Reserved. Don’t care.
6 IMRS 0 Indicates MRS command has not been initiated.
5–4 PS 00 32-bit port.
3 IP 0 Indicates precharge has not been initiated.
Bank 0
1 Mbyte 512 Kbyte
512 Kbyte
SDRAM Component Accessible
Memory
Bank 1
1 Mbyte 512 Kbyte
512 Kbyte
Bank 2
1 Mbyte 512 Kbyte
512 Kbyte
Bank 3
1 Mbyte 512 Kbyte
512 Kbyte
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-37
SDRAM Example
11.5.4 DMR Initialization
In this example, again, only the second 512-Kbyte block of each 1-Mbyte space is accessed
in each bank. In addition the SDRAM component is mapped only to readable and writable
supervisor and user data. The DMRs have the following configuration.
With this configuration, the DMR0 = 0x0074_0075, as described in Table 11-36.
2 PM 1 Indicates continuous page mode
1–0—Reserved. Don’t care.
31 18 17 16
Field BAM —
Setting 00000000011101XX
(hex) 0 0 7 4
15 9876543210
Field —WP —C/I AM SC SD UC UD V
Setting XXXXXXX0X1110101
(hex)0075
Figure 11-28. DMR0 Register
Table 11-36. DMR0 Initialization Values
Bits Name Setting Description
31–16 BAM With bits 17 and 16 as don’t cares, BAM = 0x0074, which leaves bank select bits and
upper 512K select bits unmasked. Note that bits 22 and 21 are set because they are used
as bank selects; bit 20 is set because it controls the 1-Mbyte boundary address.
15–9—Reserved. Don’t care.
8 WP 0 Allow reads and writes
7—Reserved
6 C/I 1 Disable CPU space access
5 AM 1 Disable alternate master access
4 SC 1 Disable supervisor code accesses
3 SD 0 Enable supervisor data accesses
2 UC 1 Disable user code accesses
1 UD 0 Enable user data accesses
0 V 1 Enable accesses.
Table 11-35. DACR Initialization Values
Bits Name Setting Description
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11-38 MCF5307 User’s Manual
SDRAM Example
11.5.5 Mode Register Initialization
When DACR[IMRS] is set, a bus cycle initializes the mode register. If the mode register
setting is read on A[10:0] of the SDRAM on the first bus cycle, the bit settings on the
corresponding MCF5307 address pins must be determined while being aware of masking
requirements.
Table 11-37 lists the desired initialization setting:
Next, this information is mapped to an address to determine the hexadecimal value.
Although A[31:20] corresponds to the address programmed in DACR0, according to how
DACR0 and DMR0 are initialized, bit 19 must be set to hit in the SDRAM. Thus, before
the mode register bit is set, DMR0[19] must be set to enable masking.
Table 11-37. Mode Register Initialization
MCF5307 Pins SDRAM Pins Mode Register Initialization
A20 A10 Reserved X
A19 A9 WB 0
A18 A8 Opmode 0
A17 A7 Opmode 0
A9 A6 CASL 0
A10 A5 CASL 0
A11 A4 CASL 1
A12 A3 BT 0
A13 A2 BL 0
A14 A1 BL 0
A15 A0 BL 0
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Field
Setting XXXXXXXXXXXX000X
(hex)0000
1514131211109876543210
Field V
Setting 0000100XXXXXXXXX
(hex)0800
Figure 11-29. Mode Register Mapping to MCF5307 A[31:0]
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Chapter 11. Synchronous/Asynchronous DRAM Controller Module 11-39
SDRAM Example
11.5.6 Initialization Code
The following assembly code initializes the SDRAM example.
Power-Up Sequence:
move.w #0x8026, d0 //Initialize DCR
move.w d0, DCR
move.l #0xFF880300, d0 //Initialize DACR0
move.l d0, DACR0
move.l #0x00740075, d0 //Initialize DMR0
move.l d0, DMR0
Precharge Sequence:
move.l #0xFF880308, d0 //Set DACR0[IP]
move.l d0, DACR0
move.l #0xBEADDEED, d0 //Write to memory location to init. precharge
move.l d0, 0xFF880000
Refresh Sequence:
move.l #0xFF888300, d0 //Enable refresh bit in DACR0
move.l d0, DACR0
Mode Register Initialization Sequence:
move.l #0x00600075, d0 //Mask bit 19 of address
move.l d0, DMR0
move.l #0xFF888340, d0 //Enable DACR0[IMRS]; DACR0[RE] remains set
move.l d0, DACR0
move.l #0x00000000, d0 //Access SDRAM address to initialize mode
register
move.l d0, 0xFF800800
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11-40 MCF5307 User’s Manual
SDRAM Example
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Part III. Peripheral Module III-i
Par t III
Peripheral Module
Intended Audience
Part III describes the operation and configuration of the MCF5307 DMA, timer, U AR T , and
parallel port modules, and describes how they interface with the system integration unit,
described in Part II.
Contents
Part III contains the following chapters:
• Chapter 12, “DMA Controller Module,” provides an overview of the DMA
controller module and describes in detail its signals and registers. The latter sections
of this chapter describe operations, features, and supported data transfer modes in
detail, showing timing diagrams for various operations.
• Chapter 13, “Timer Module,” describes configuration and operation of the two
general-purpose timer modules, timer 0 and timer 1. It includes programming
examples.
• Chapter 14, “UART Modules,” describes the use of the universal
asynchronous/synchronous receiver/transmitters (UARTs) implemented on the
MCF5307 and includes programming examples.
• Chapter 15, “Parallel Port (General-Purpose I/O),” describes the operation and
programming model of the parallel port pin assignment, direction-control, and data
registers. It includes a code example for setting up the parallel port.
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III-ii MCF5307 User’s Manual
Acronyms and Abbreviations
Table III-i describes acronyms and abbreviations used in Part III.
Table III-i. Acronyms and Abbreviated Terms
Term Meaning
ADC Analog-to-digital conversion
BIST Built-in self test
CODEC Code/decode
DAC Digital-to-analog conversion
DMA Direct memory access
DSP Digital signal processing
EDO Extended data output (DRAM)
FIFO First-in, first-out
GPIO
I2C Inter-integrated circuit
IEEE Institute for Electrical and Electronics Engineers
IFP Instruction fetch pipeline
IPL Interrupt priority level
JEDEC Joint Electron Device Engineering Council
JTAG Joint Test Action Group
LIFO Last-in, first-out
LRU Least recently used
LSB Least-significant byte
lsb Least-significant bit
MAC Multiple accumulate unit
MBAR Memory base address register
MSB Most-significant byte
msb Most-significant bit
Mux Multiplex
NOP No operation
OEP Operand execution pipeline
PC Program counter
PCLK Processor clock
PLL Phase-locked loop
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Part III. Peripheral Module III-iii
PLRU Pseudo least recently used
POR Power-on reset
PQFP Plastic quad flat pack
RISC Reduced instruction set computing
Rx Receive
SIM System integration module
SOF Start of frame
TAP Test access port
TTL Transistor-to-transistor logic
Tx Transmit
UART Universal asynchronous/synchronous receiver transmitter
Table III-i. Acronyms and Abbreviated Terms (Continued)
Term Meaning
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III-iv MCF5307 User’s Manual
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Chapter 12. DMA Controller Module 12-1
Chapter 12
DMA Controller Module
This chapter describes the MCF5307 DMA controller module. It provides an overview of
the module and describes in detail its signals and registers. The latter sections of this
chapter describe operations, features, and supported data transfer modes in detail.
12.1 Overview
The direct memory access (DMA) controller module provides an efficient way to move
blocks of data with minimal processor interaction. The DMA module, shown in
Figure 12-1, provides four channels that allow byte, word, or longword operand transfers.
Each channel has a dedicated set of registers that define the source and destination
addresses (SARn and DARn), byte count (BCRn), and control and status (DCRn and
DSRn). Transfers can be dual or single address to off-chip devices or dual address to
on-chip devices, such as UART, SDRAM controller, and parallel port.
Figure 12-1. DMA Signal Diagram
MUX
Arbitration/
Interface Bus
Data Path Control
Internal
External
ChannelChannel
MUX
Registered
Data Path
SAR0
DAR0
BCR0
DCR0
DSR0
Channel 0
Interrupts
SAR1
DAR1
BCR1
DCR1
DSR1
Channel 1
SAR2
DAR2
BCR2
DCR2
DSR2
Channel 2
SAR3
DAR3
BCR3
DCR3
DSR3
Channel 3
Bus
Requests
Attributes
Current Master Attributes
Write Bus DataRead Bus Data
External Bus Address
External Bus Size
Channel
Enables
Requests
Bus Signals
Control
Control
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12-2 MCF5307 User’s Manual
DMA Signal Description
12.1.1 DMA Module Features
The DMA controller module features are as follows:
• Four fully independent, programmable DMA controller channels/bus modules
• Auto-alignment feature for source or destination accesses
• Dual- and single-address transfers
• Two external request pins (DREQ[1:0]) provided for channels 1 and 0
• Channel arbitration on transfer boundaries
• Data transfers in 8-, 16-, 32-, or 128-bit blocks using a 16-byte buffer
• Continuous-mode and cycle-steal transfers
• Independent transfer widths for source and destination
• Independent source and destination address registers
• Data transfer can occur in as few as two clocks
12.2 DMA Signal Description
Table 12-1 briefly describes the DMA module signals that provide handshake control for
either a source or destination external device.
Table 12-1. DMA Signals
Signal I/O Description
DREQ[1:0]/
PP[6:5] I External DMA request. DREQ[1:0] can serve as the DMA request inputs or as two parallel port
bits. They are programmable individually through the PAR. A peripheral device asserts these
inputs to request an operand transfer between it and memory.
DREQ signals are asserted to initiate DMA accesses in the respective channels. The system
should drive unused DREQ signals to logic high. Although each channel has an individual
DREQ signal, in the MCF5307 only channels 0 and 1 connect to external DREQ pins.DREQ
signals for channels 2 and 3 are connected to the UART0 and UART1 bus interrupt signals.
TT[1:0]/
PP[1:0] O Transfer type. A DMA access is indicated by the transfer type pins, TT[1:0] = 01. The transfer
modifier , TM[2:0] configurations shown below are meaningful only if TT[1:0] = 01, indicating an
external master or DMA access.
TM[2:0]
/PP[4:2] O Multiplexed transfer attribute pins. The encodings below are valid when TT[1:0] = 01 and
internal DMA channels are driving the bus. DMA transfer information on TM[2:1] can be
provided on every DMA transfer or only on the last transfer by programming DCR[AT].
TM[2:1]Encoding
00 DMA acknowledge information not provided
01 DMA transfer, channel 0
10 DMA transfer, channel 1
11 Reserved
TM0 Encoding for DMA as master (TT = 01)
0 Single-address access negated
1 Single-address access
For TT[1:0] = 01, the TM0 encoding is independent of TM[2:1]. If DCR[SAA] is set, TM0
designates a single-address DMA access.
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Chapter 12. DMA Controller Module 12-3
DMA T ransfer Overview
12.3 DMA Transfer Overview
The DMA module usually transfers data faster than the ColdFire core can under software
control. The term ‘direct memory access’ refers to peripheral device’s ability to access
system memory directly , greatly impro ving overall system performance. The DMA module
consists of four independent, functionally equivalent channels, so references to DMA in
this chapter apply to any of the channels. It is not possible to implicitly address all four
channels at once. The MCF5307 on-chip peripherals do not support single-address
transfers.
The processor generates DMA requests internally by setting DCR[START]; a device can
generate a DMA request externally by using DREQ pins. The processor can program bus
bandwidth for each channel. The channels support cycle-steal and continuous transfer
modes; see Section 12.5.1, “Transfer Requests (Cycle-Steal and Continuous Modes).”
The DMA controller supports dual- and single-address transfers as follows. In both, the
DMA channel supports 32 address bits and 32 data bits.
• Dual-address transfers—A dual-address transfer consists of a read followed by a
write and is initiated by an internal request using the START bit or by an external
de vice using DREQ. Two types of transfer can occur , a read from a source de vice or
a write to a destination device; see Figure 12-2.
Figure 12-2. Dual-Address Transfer
• Single-address transfers—An external device can initiate a single-address transfer
by asserting DREQ. The MCF5307 provides address and control signals for
single-address transfers. The external device reads to or writes from the specified
address, as Figure 12-3 shows. External logic is required.
DMADMA
Memory/
Peripheral
Memory/
Peripheral
Control and Data
Control and Data
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12-4 MCF5307 User’s Manual
DMA Controller Module Programming Model
Figure 12-3. Single-Address Transfers
Any operation involving the DMA module follows the same three steps:
1. Channel initialization—Channel registers are loaded with control information,
address pointers, and a byte-transfer count.
2. Data transfer—The DMA accepts requests for operand transfers and provides
addressing and bus control for the transfers.
3. Channel termination—Occurs after the operation is finished, either successfully or
due to an error. The channel indicates the operation status in the channel’s DSR,
described in Section 12.4.5, “DMA Status Registers (DSR0–DSR3).”
12.4 DMA Controller Module Programming Model
This section describes each internal register and its bit assignment. Note that there is no way
to prevent a write to a control register during a DMA transfer. Table 12-2 shows the
mapping of DMA controller registers. Note the differences for the byte count registers
depending on the value of MPARK[BCR24BIT].
DMA
Memory
DMA
Peripheral
Control Signals Control Signals
Control Signals Control Signals
Data
Memory Peripheral
Data
Write:
Read:
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Chapter 12. DMA Controller Module 12-5
DMA Controller Module Programming Model
Table 12-2. Memory Map for DMA Controller Module Registers
DMA
Channel MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0 0x300 Source address register 0 (SAR0) [p. 12-6]
0x304 Destination address register 0 (DAR0) [p. 12-7]
0x308 DMA control register 0 (DCR0) [p. 12-8]
0x30C Byte count register 0 (BCR24BIT = 0) 1 Reserved
0x30C Reserved Byte count register 0 (BCR24BIT = 1) 1 (BCR0) [p. 12-7]
0x310 DMA status register 0
(DSR0) [p. 12-10] Reserved
0x314 DMA interrupt vector
register 0 (DIVR0)
[p. 12-11]
Reserved
1 0x340 Source address register 1 (SAR1) [p. 12-6]
0x344 Destination address register 1 (DAR1) [p. 12-7]
0x348 DMA control register 1 (DCR1) [p. 12-8]
0x34C Byte count register 1 (BCR24BIT = 0) 1Reserved
0x34C Reserved Byte count register 1 (BCR24BIT = 1) 1 (BCR1) [p. 12-7]
0x350 DMA status register 1
(DSR1) [p. 12-10] Reserved
0x354 DMA interrupt vector
register 1 (DIVR1)
[p. 12-11]
Reserved
2 0x380 Source address register 2 (SAR2) [p. 12-6]
0x384 Destination address register 2 (DAR2) [p. 12-7]
0x388 DMA control register 2 (DCR2) [p. 12-8]
0x38C Byte count register 2 (BCR24BIT = 0) 1Reserved
0x38C Reserved Byte count register 2 (BCR24BIT = 1) 1 (BCR2) [p. 12-7]
0x390 DMA status register 2
(DSR2) [p. 12-10] Reserved
0x394 DMA interrupt vector
register 2 (DIVR2)
[p. 12-11]
Reserved
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12-6 MCF5307 User’s Manual
DMA Controller Module Programming Model
NOTE:
External masters cannot access MCF5307 on-chip memories or
MBAR, but they can access DMA module registers.
12.4.1 Source Address Registers (SAR0–SAR3)
SARn, Figure 12-4, contains the address from which the DMA controller requests data. In
single-address mode, SARn provides the address regardless of the direction.
NOTE:
SAR/DAR address ranges cannot be programmed to on-chip
SRAM because it cannot be accessed by on-chip DMA.
3 0x3C0 Source address register 3 (SAR3) [p. 12-6]
0x3C4 Destination address register 3 (DAR3) [p. 12-7]
0x3C8 DMA control register 3 (DCR3) [p. 12-8]
0x3CC Byte count register 3 (BCR24BIT = 0) 1Reserved
0x3CC Reserved Byte count register 3 (BCR24BIT = 1) 1 (BCR3) [p. 12-7]
0x3D0 DMA status register 3
(DSR3) [p. 12-10] Reserved
0x3D4 DMA interrupt vector
register 3 (DIVR3)
[p. 12-11]
Reserved
1On the original MCF5307 mask set (H55J), the BCR of the DMA channels can accommodate only 16 bits.
However, because the revised MCF5307 supports a 24-bit byte count range, the position of the BCR in the
memory map depends on whether a 16- or 24-bit byte counter is selected. The 24-bit byte count can be
selected by setting BCR24BIT = 1, making DCR[AT] available. The AT bit selects whether DMA channels
assert acknowledge during the entire transfer or only at the final transfer of a DMA transaction.
New applications should take advantage of the full range of the 24-bit byte counter, including the AT bit. The
16-bit byte count option (BCR24BIT = 0) retains compatibility with older MCF5307 revisions.
31 0
Field SAR
Reset 0000_0000_0000_0000_0000_0000_0000_0000
R/W R/W
Address MBAR + 0x300, 0x340, 0x380, 0x3C0
Figure 12-4. Source Address Registers (SARn)
Table 12-2. Memory Map for DMA Controller Module Registers (Continued)
DMA
Channel MBAR
Offset [31:24] [23:16] [15:8] [7:0]
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Chapter 12. DMA Controller Module 12-7
DMA Controller Module Programming Model
12.4.2 Destination Address Registers (DAR0–DAR3)
For dual-address transfers only, DARn, Figure 12-5, holds the address to which the DMA
controller sends data.
Figure 12-5. Destination Address Registers (DARn)
NOTE:
On-chip DMAs do not maintain coherency with MCF5307
caches and so must not transfer data to cacheable memory.
12.4.3 Byte Count Registers (BCR0–BCR3)
BCRn, Figure 12-6 and Figure 12-7, holds the number of bytes yet to be transferred for a
given block.The offset within the memory map is based on the value of
MPARK[BCR24BIT]. BCRn decrements on the successful completion of the address
transfer of either a write transfer in dual-address mode or any transfer in single-address
mode. BCRn decrements by 1, 2, 4, or 16 for byte, word, longword, or line accesses,
respectively.
Figure 12-6 shows BCR for BCR24BIT = 1.
Figure 12-6. Byte Count Registers (BCRn)—BCR24BIT = 1
Figure 12-7 shows BCR for BCR24BIT = 0.
31 0
Field DAR
Reset 0000_0000_0000_0000_0000_0000_0000_0000
R/W R/W
Address MBAR + 304, 0x344, 0x384, 0x3C4
31 24 23 0
Field —BCR
Reset —0000_0000_0000_0000_0000_0000
R/W R/W
Address MBAR + 0x30C, 0x34C, 0x38C, 0x3AC
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12-8 MCF5307 User’s Manual
DMA Controller Module Programming Model
Figure 12-7. BCRn—BCR24BIT = 0
DSR[DONE], shown in Figure 12-9, is set when the block transfer is complete.
When a transfer sequence is initiated and BCRn[BCR] is not divisible by 16, 4, or 2 when
the DMA is configured for line, longword, or word transfers, respecti v ely , DSRn[CE] is set
and no transfer occurs. See Section 12.4.5, “DMA Status Registers (DSR0–DSR3).”
12.4.4 DMA Control Registers (DCR0–DCR3)
DCRn, Figure 12-8, is used for configuring the DMA controller module. Note that
DCR[AT] is available only if BCR24BIT = 1.
Table 12-3 describes DCR fields.
Bit 151413 1211109876543210
Field BCR
Reset 0000_0000_0000_0000
R/W
Addr MBAR + 0x30C, 0x34C, 0x38C, 0x3AC
31 30 29 28 27 25 24 23 22 21 20 19 18 17 16
Field INT EEXT CS AA BWC SAA S_RW SINC SSIZE DINC DSIZE START
Reset 0000_0000_0000_0000
R/W R/W
15 14 0
Field AT 1
1Available only if BCR24BIT = 1, otherwise reserved.
—
Reset 0 N/A
R/W R/W
Address MBAR + 0x308, 0x348, 0x388, 0x3A8
Figure 12-8. DMA Control Registers (DCRn)
Table 12-3. DCRn Field Descriptions
Bits Name Description
31 INT Interrupt on completion of transfer. Determines whether an interrupt is generated by completing a
transfer or by the occurrence of an error condition.
0 No interrupt is generated.
1 Internal interrupt signal is enabled.
30 EEXT Enable external request. Care should be taken because a collision can occur between the START
bit and DREQ when EEXT = 1.
0 External request is ignored.
1 Enables external request to initiate transfer. Internal request is always enabled. It is initiated by
writing a 1 to the START bit.
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Chapter 12. DMA Controller Module 12-9
DMA Controller Module Programming Model
29 CS Cycle steal.
0 DMA continuously makes read/write transfers until the BCR decrements to 0.
1 Forces a single read/write transf er per request. The request ma y be internal by setting the START
bit, or external by asserting DREQ.
28 AA Auto-align. AA and SIZE determine whether the source or destination is auto-aligned, that is,
transfers are optimized based on the address and size. See Section 12.5.4.2, “Auto-Alignment.”
0 Auto-align disabled
1 If SSIZE indicates a transfer no smaller than DSIZE, source accesses are auto-aligned;
otherwise, destination accesses are auto-aligned. Source alignment takes precedence over
destination alignment. If auto-alignment is enabled, the appropriate address register increments,
regardless of DINC or SINC.
27–25 BWC Bandwidth control. Indicates the number of bytes in a block transfer. When the byte count reaches
a multiple of the BWC value, the DMA releases the bus. For example, if BCR24BIT is 0, BWC is
001 (512 bytes or v alue of 0x0200), and BCR is 0x1000, the bus is relinquished after BCR v alues of
0x2000, 0x1E00, 0x1C00, 0x1A00, 0x1800, 0x1600, 0x1400, 0x1200, 0x1000, 0x0E00, 0x0C00,
0x0A00, 0x0800, 0x0600, 0x0400, and 0x0200. If BCR24BIT is 0, BWC is 110, and BCR is 33000,
the bus is released after 232 bytes because the BCR is at 32768, a multiple of 16384.
BWC BCR24BIT = 0 BCR24BIT = 1
000 DMA has priority. It does not negate its request until its transfer completes.
001 512 16384
010 1024 32768
011 2048 65536
100 4096 131072
101 8192 262144
110 16384 524288
111 32768 1048576
24 SAA Single-address access. Determines whether the DMA channel is in dual- or single-address mode
0 Dual-address mode.
1 Single-address mode. The DMA provides an address from the SAR and directional control, bit
S_RW, to allow two peripherals (one might be memory) to exchange data within a single access.
Data is not stored by the DMA.
23 S_RW Single-address access read/write value . Valid only if SAA = 1. Specifies the v alue of the read signal
during single-address accesses. This provides directional control to the bus controller.
0 Forces the read signal to 0.
1 Forces the read signal to 1.
22 SINC Source increment. Controls whether a source address increments after each successful transfer.
0 No change to SAR after a successful transfer.
1 The SAR increments by 1, 2, 4, or 16, as determined by the transfer size.
21–20 SSIZE Source size. Determines the data size of the source bus cycle for the DMA control module.
00 Longword
01 Byte
10 Word
11 Line
19 DINC Destination increment. Controls whether a destination address increments after each successful
transfer.
0 No change to the DAR after a successful transfer.
1 The DAR increments by 1, 2, 4, or 16, depending upon the size of the transfer.
18–17 DSIZE Destination size. Determines the data size of the destination bus cycle for the DMA controller.
00 Longword
01 Byte
10 Word
11 Line
Table 12-3. DCRn Field Descriptions (Continued)
Bits Name Description
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12-10 MCF5307 User’s Manual
DMA Controller Module Programming Model
12.4.5 DMA Status Registers (DSR0–DSR3)
In response to an event, the DMA controller writes to the appropriate DSRn bit,
Figure 12-9. Only a write to DSRn[DONE] results in action.
Table 12-4 describes DSRn fields.
16 START Start transfer.
0 DMA inactive
1 The DMA begins the transfer in accordance to the values in the control registers. START is
cleared automatically after one clock and is always read as logic 0.
15 AT AT is available only if BCR24BIT = 1.
DMA acknowledge type. Controls whether acknowledge information is provided for the entire
transfer or only the final transfer.
0 Entire transf er . DMA acknowledge inf ormation is displayed an ytime the channel is selected as the
result of an external request.
1 Final transfer (when BCR reaches zero). For dual-address transfer, the acknowledge information
is displayed for both the read and write cycles.
14–0—Reserved, should be cleared.
76543210
Field —CE BES BED —REQ BSY DONE
Reset —000—000
R/W R/W
Address MBAR + 0x310, 0x350, 0x390, 0x3D0
Figure 12-9. DMA Status Registers (DSRn)
Table 12-4. DSRn Field Descriptions
Bits Name Description
7—Reserved, should be cleared.
6 CE Configuration error. Occurs when BCR, SAR, or DAR does not match the requested transfer size,
or if BCR = 0 when the DMA receives a start condition. CE is cleared at hardware reset or by
writing a 1 to DSR[DONE].
0 No configuration error exists.
1 A configuration error has occurred.
5 BES Bus error on source
0 No bus error occurred.
1 The DMA channel terminated with a bus error either during the read portion of a transfer or
during an access in single-address mode (SAA = 1).
4 BED Bus error on destination
0 No bus error occurred.
1 The DMA channel terminated with a bus error during the write portion of a transfer.
3—Reserved, should be cleared.
Table 12-3. DCRn Field Descriptions (Continued)
Bits Name Description
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Chapter 12. DMA Controller Module 12-11
DMA Controller Module Functional Description
12.4.6 DMA Interrupt Vector Registers (DIVR0–DIVR3)
The contents of a DMA interrupt vector re gister (DIVRn), Figure 12-10, are driv en onto the
internal bus in response to an interrupt acknowledge cycle.
12.5 DMA Controller Module Functional Description
In the following discussion, the term ‘DMA request’ implies that DCR[START] or
DCR[EEXT] is set, followed by assertion of DREQ. The START bit is cleared when the
channel begins an internal access.
Before initiating a dual-address access, the DMA module verifies that DCR[SSIZE,DSIZE]
are consistent with the source and destination addresses. If the source and destination are
not the same size, the configuration error bit, DSR[CE], is also set. If misalignment is
detected, no transfer occurs, CE is set, and, depending on the DCR configuration, an
interrupt e vent is issued. Note that if the auto-align bit, DCR[AA], is set, error checking is
performed on appropriate registers.
A read/write transfer reads bytes from the source address and writes them to the destination
address. The number of bytes is the larger of the sizes specified by SSIZE and DSIZE. See
Section 12.4.4, “DMA Control Registers (DCR0–DCR3).”
Source and destination address registers (SAR and DAR) can be programmed in the DCR
2 REQ Request
0 No request is pending or the channel is currently active. Cleared when the channel is selected.
1 The DMA channel has a transfer remaining and the channel is not selected.
1 BSY Busy
0 DMA channel is inactive. Cleared when the DMA has finished the last transaction.
1 BSY is set the first time the channel is enabled after a transfer is initiated.
0 DONE Transactions done. Set when all DMA controller transactions complete normally, as determined by
transfer count and error conditions. When BCR reaches zero, DONE is set when the final transfer
completes successfully. DONE can also be used to abort a transfer by resetting the status bits.
When a transfer completes, software must clear DONE before reprogramming the DMA.
0 Writing or reading a 0 has no effect.
1 DMA transf er completed. Writing a 1 to this bit clears all DMA status bits and can be used as an
interrupt handler to clear the DMA interrupt and error bits.
7 0
Field Interrupt V ector Bits
Reset 0000_1111
R/W R/W
Address MBAR + 0x314, 0x354, 0x394, 0x3D4
Figure 12-10. DMA Interrupt Vector Registers (DIVRn)
Table 12-4. DSRn Field Descriptions (Continued)
Bits Name Description
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12-12 MCF5307 User’s Manual
DMA Controller Module Functional Description
to increment at the completion of a successful transfer. BCR decrements when an address
transfer write completes for a single-address access (DCR[SAA] = 0) or when SAA = 1.
12.5.1 Transfer Requests (Cycle-Steal and Continuous
Modes)
The DMA channel supports internal and external requests. A request is issued by setting
DCR[START] or by asserting DREQ. Setting DCR[EEXT] enables recognition of external
interrupts. Internal interrupts are always recognized. Bus usage is minimized for either
internal or external requests by selecting between cycle-steal and continuous modes.
• Cycle-steal mode (DCR[CS] = 1)—Only one complete transfer from source to
destination occurs for each request. If DCR[EEXT] is set, a request can be either
internal or external. Internal request is selected by setting DCR[START]. An
external request is initiated by asserting DREQ while EEXT is set.
• Continuous mode (DCR[CS] = 0)—After an internal or external request, the DMA
continuously transfers data until BCR reaches zero or a multiple of DCR[BWC] or
DSR[DONE] is set. If BCR is a multiple of BWC, the DMA request signal is
negated until the b us cycle terminates to allo w the internal arbiter to switch masters.
DCR[BWC] = 000 specifies the maximum transfer rate; other values specify a
transfer rate limit.
The DMA performs the specified number of transfers, then relinquishes bus control.
The DMA negates its internal bus request on the last transfer before the BCR reaches
a multiple of the boundary specified in BWC. On completion, the DMA reasserts its
bus request to re gain mastership at the earliest opportunity. The minimum time that
the DMA loses bus control is one bus cycle.
12.5.2 Data Transfer Modes
Each channel supports dual- and single-address transfers, described in the next sections.
12.5.2.1 Dual-Address Transfers
Dual-address transfers consist of a source operand read and a destination operand write.
The DMA controller module begins a dual-address transfer sequence when DCR[SAA] is
cleared during a DMA request. If no error condition exists, DSR[REQ] is set.
• Dual-address read—The DMA controller drives the SAR value onto the internal
address bus. If DCR[SINC] is set, the SAR increments by the appropriate number
of bytes upon a successful read cycle. When the appropriate number of read cycles
complete (multiple reads if the destination size is wider than the source), the DMA
initiates the write portion of the transfer.
If a termination error occurs, DSR[BES,DONE] are set and DMA transactions stop.
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Chapter 12. DMA Controller Module 12-13
DMA Controller Module Functional Description
• Dual-address write—The DMA controller drives the DAR value onto the address
bus. If DCR[DINC] is set, DAR increments by the appropriate number of bytes at
the completion of a successful write cycle. The BCR decrements by the appropriate
number of bytes. DSR[DONE] is set when BCR reaches zero. If the BCR is greater
than zero, another read/write transfer is initiated. If the BCR is a multiple of
DCR[BWC], the DMA request signal is negated until termination of the bus cycle
to allow the internal arbiter to switch masters.
If a termination error occurs, DSR[BES,DONE] are set and DMA transactions stop.
12.5.2.2 Single-Address Transfers
Single-address transfers consist of one DMA bus cycle, allowing either a read or a write
cycle to occur. The DMA controller begins a single-address transfer sequence when
DCR[SAA] is set during a DMA request. If no error condition exists, DSR[REQ] is set.
When the channel is enabled, DSR[BSY] is set and REQ is cleared. SAR contents are then
driven onto the address bus and the value of DCR[S_RW] is driven on R/W. The BCR
decrements on each successful address access until it is zero, when DSR[DONE] is set.
If a termination error occurs, DSR[BES,DONE] are set and DMA transactions stop.
12.5.3 Channel Initialization and Star tup
Before a block transfer starts, channel registers must be initialized with information
describing configuration, request-generation method, and the data block.
12.5.3.1 Channel Prioritization
The four DMA channels are prioritized in ascending order (channel 0 having highest
priority and channel 3 having the lowest) or as determined by DCR[BWC]. If BWC for a
DMA channel is 000, that channel has priority only over the channel immediately
preceding it. For example, if DCR3[BWC] = 000, DMA channel 3 has priority over DMA
channel 2 (assuming DCR2[BWC] ≠ 000) but not over DMA channel 1.
If DCR1[BWC] = DCR2[BWC] = 000, DMA 1 has priority over DMA 0 and DMA 2.
DCR2[BWC] = 000 in this case does not affect prioritization.
Prioritization of simultaneous external requests is either ascending or as determined by
each channel’s BWC bits as described in the previous paragraphs.
12.5.3.2 Programming the DMA Controller Module
Note the following general guidelines for programming the DMA:
• No mechanism exists to prevent writes to control registers during DMA accesses.
• If the BWC of sequential channels are equal, channel priority is in ascending order.
The SAR is loaded with the source (read) address. If the transfer is from a peripheral de vice
to memory, the source address is the location of the peripheral data register. If the transfer
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12-14 MCF5307 User’s Manual
DMA Controller Module Functional Description
is from memory to either a peripheral device or memory, the source address is the starting
address of the data block. This can be an y aligned byte address. In single-address mode, this
data register is used regardless of transfer direction.
The D AR should contain the destination (write) address. If the transfer is from a peripheral
device to memory, or memory to memory, the DAR is loaded with the starting address of
the data block to be written. If the transfer is from memory to a peripheral device, DAR is
loaded with the address of the peripheral data register. This address can be an y aligned byte
address. DAR is not used in single-address mode.
SAR and DAR change after each cycle depending on DCR[SSIZE,DSIZE,SINC,DINC]
and on the starting address. Increment v alues can be 1, 2, 4, or 16 for byte, word, longword,
or line transfers, respectively. If the address register is programmed to remain unchanged
(no count), the register is not incremented after the data transfer.
BCRn[BCR] must be loaded with the number of byte transfers to occur. It is decremented
by 1, 2, 4, or 16 at the end of each transfer, depending on the transfer size. DSR must be
cleared for channel startup.
As soon as the channel has been initialized, it is started by writing a one to DCR[START]
or asserting DREQ, depending on the status of DCR[EEXT]. Programming the channel for
internal request causes the channel to request the bus and start transferring data
immediately. If the channel is programmed for external request, DREQ must be asserted
before the channel requests the bus.
Changes to DCR are effective immediately while the channel is active. To avoid problems
with changing a DMA channel setup, write a one to DSR[DONE] to stop the DMA channel.
12.5.4 Data Transfer
This section includes timing diagrams that illustrate the interaction of signals in DMA data
transfers. It also describes auto-alignment and bandwidth control.
12.5.4.1 External Request and Acknowledge Operation
Channels 0 and 1 initiate transfers to an external module by means of DREQ[1:0]. The
request for channels 2 and 3 are connected internally to the UART0 and UART1 interrupt
signals, respectively. If DCR[EEXT] = 1 and the channel is idle, the DMA initiates a
transfer when DREQ is asserted.
Figure 12-11 shows the minimum 4-clock cycle delay from when DREQ is sampled
asserted to when a DMA bus cycle begins. This delay may be longer, depending on DMA
priority, bus arbitration, DRAM refresh operations, and other factors.
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Chapter 12. DMA Controller Module 12-15
DMA Controller Module Functional Description
Figure 12-11. DREQ Timing Constraints, Dual-Address DMA Transfer
Although Figure 12-11 does not show TM0 signaling a DMA ackno wledgement, this signal
can provide an external request acknowledge response, as sho wn in subsequent diagrams.
To initiate a request, DREQ need only be asserted long enough to be sampled on one rising
clock edge. However, note the following regarding the negation of DREQ:
• In cycle-steal mode (DCR[CS] = 1), the read/write transaction is limited to a single
transfer. DREQ must be negated appropriately to avoid generating another request.
— For dual-address transfers, DREQ must be ne gated before TS is asserted for the
write portion, as shown in Figure 12-11, clock cycle 7.
— For single-address transfers, DREQ must be negated before TS is asserted for the
transfer, as shown in Figure 12-13, clock cycle 4.
• In burst mode, (DCR[CS] = 0), multiple read/write transfers can occur on the b us as
programmed. DREQ need not be negated until DSR[DONE] is set, indicating the
block transfer is complete. Another transfer cannot be initiated until the DMA
registers are reprogrammed.
Figure 12-12 shows a dual-address, peripheral-to-SDRAM DMA transfer. The DMA is not
parked on the bus, so the diagram shows how the CPU can generate multiple bus cycles
during DMA transfers. It also shows TM0 timing. The TT signals indicate whether the CPU
(0) or DMA (1) has bus mastership. TM2 indicates dual-address mode.
If DCR[AT] is 1, TM is asserted during the final transfer. If DCR[AT] is 0, TM asserts
during all DMA accesses.
DREQ0
TT1
TT0
TS
CS
TA
R/W
0
CLKIN
1234567891011
A[31:0]
Read Write
TM0
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12-16 MCF5307 User’s Manual
DMA Controller Module Functional Description
Figure 12-12. Dual-Address, Peripheral-to-SDRAM, Lower-Priority DMA Transfer
Figure 12-13 sho ws a single-address DMA transfer in which the peripheral is reading from
memory. Note that TM2 is high, indicating a single-address transfer. Note that DREQ is
negated in clock 4, before the assertion of TS in clock 6.
AS
TIP
A[31:0]
SIZ[1:0]
D[31:0]
CSx
TA
DRAMW
SRAS
SCAS
RAS[1:0]
CAS[3:0]
TT[1:0]
TM2
DREQ0
TS
R/W
CLKIN
001 01
Precharge
CPU DMA Read CPU DMA Write CPU
TM0
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Chapter 12. DMA Controller Module 12-17
DMA Controller Module Functional Description
Figure 12-13. Single-Address DMA Transfer
12.5.4.2 Auto-Alignment
Auto-alignment allows block transfers to occur at the optimal size based on the address,
byte count, and programmed size. To use this feature, DCR[AA] must be set. The source is
auto-aligned if SSIZE indicates a transfer size larger than DSIZE. Source alignment takes
precedence ov er the destination when the source and destination sizes are equal. Otherwise,
the destination is auto-aligned. The address register chosen for alignment increments
regardless of the increment value. Configuration error checking is performed on registers
not chosen for alignment.
If BCR is greater than 16, the address determines transfer size. Bytes, words, or longwords
are transferred until the address is aligned to the programmed size boundary, at which time
accesses begin using the programmed size.
If BCR is less than 16 at the start of a transfer, the number of bytes remaining dictates
transfer size. For example, AA = 1, SAR = 0x0001, BCR = 0x00F0, SSIZE = 00
(longword), and DSIZE = 01 (byte). Because SSIZE > DSIZE, the source is auto-aligned.
Error checking is performed on destination registers. The access sequence is as follows:
1. Read byte from 0x0001—write 1 byte, increment SAR.
2. Read word from 0x0002—write 2 bytes, increment SAR.
3. Read longword from 0x0004—write 4 bytes, increment SAR.
0
CLKIN
1234567891011
DREQ0
TS
A[31:0], SIZ[1:0]
TA
CSx, AS
TIP
D[31:0]
OE, BE/BWE
R/W
TM2
TT0
TT1
TM0
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12-18 MCF5307 User’s Manual
DMA Controller Module Functional Description
4. Repeat longwords until SAR = 0x00F0.
5. Read byte from 0x00F0—write byte, increment SAR.
If DSIZE is another size, data writes are optimized to write the largest size allowed based
on the address, but not exceeding the configured size.
12.5.4.3 Bandwidth Control
Bandwidth control makes it possible to force the DMA off the bus to allow access to
another device. DCR[BWC] provides seven levels of block transfer sizes. If the BCR
decrements to a multiple of the decode of the BWC, the DMA bus request ne gates until the
bus cycle terminates. If a request is pending, the arbiter may then pass bus mastership to
another device. If auto-alignment is enabled, DCR[AA] = 1, the BCR may skip over the
programmed boundary, in which case, the DMA bus request is not negated.
If BWC = 000, the request signal remains asserted until BCR reaches zero. DMA has
priority over the core. Note that in this scheme, the arbiter can always force the DMA to
relinquish the bus. See Section 6.2.10.1, “Default Bus Master Park Register (MPARK).”
12.5.5 Termination
An unsuccessful transfer can terminate for one of the following reasons:
• Error conditions—When the MCF5307 encounters a read or write cycle that
terminates with an error condition, DSR[BES] is set for a read and DSR[BED] is set
for a write before the transfer is halted. If the error occurred in a write cycle, data in
the internal holding register is lost.
• Interrupts—If DCR[INT] is set, the DMA drives the appropriate internal interrupt
signal. The processor can read DSR to determine whether the transfer terminated
successfully or with an error. DSR[DONE] is then written with a one to clear the
interrupt and the DONE and error bits.
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Chapter 13. Timer Module 13-1
Chapter 13
Timer Module
This chapter describes the configuration and operation of the two general-purpose timer
modules (timer 0 and timer 1). It includes programming examples.
13.1 Overview
The timer module incorporates two independent, general-purpose 16-bit timers, timer 0 and
timer 1. The output of an 8-bit prescaler clocks each timer. There are two sets of registers,
one for each timer. The timers can operate from the system bus clock (BCLKO) or from an
external clocking source using one of the TIN signals. If BCLKO is selected, it can be
divided by 16 or 1.
Figure 13-1 is a block diagram of one of the two identical ti5mer modules.
Figure 13-1. Timer Block Diagram
Timer
Divider
Timer Mode Register (TMRn)
Prescaler Mode Bits
Timer Counter (TCNn)
15 0
Timer Reference Register (TRRn)
15 0
Timer Capture Register (TCRn)15 0
Timer Event Register (TERn)
Capture
Detection
TIN
TOUT
GENERAL-PURPOSE TIMER
clock
(contains incrementing value)
(reference value for comparison with TCN)(latches TCN value when triggered by TIN)
(indicates capture or when TCN = TRRn)
IRQn
Clock
Generator
System Bus
Clock
(÷1 or ÷16)
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13-2 MCF5307 User’s Manual
General-Purpose Timer Units
13.1.1 Key Features
Each general-purpose 16-bit timer unit has the following features:
• Maximum period of 5.96 seconds at 45 MHz
• 27-nS resolution at 45 MHz
• Programmable sources for the clock input, including external clock
• Input-capture capability with programmable trigger edge on input pin
• Output-compare with programmable mode for the output pin
• Free run and restart modes
• Maskable interrupts on input capture or reference-compare
13.2 General-Purpose Timer Units
The general-purpose timer units provide the following features:
• Each timer can be programmed to count and compare to a reference v alue stored in
a register or capture the timer value at an edge detected on TIN.
• System bus clock can be divided by 16 or 1. This clock is input to the prescaler.
• TIN is fed directly into the 8-bit prescaler. The maximum value of TIN is 1/5 of
CLKIN, as described in Chapter 20, “Electrical Specifications.”
• The 8-bit prescaler clock divides the clocking source and is user-programmable
from 1 to 256.
• Programmed events generate interrupts.
• The timer output signal (TOUT) can be configured to toggle or pulse on an event.
13.3 General-Purpose Timer Programming Model
The follo wing features are programmable through the timer registers, sho wn in Table 13-1:
• Prescaler—The prescaler clock input is selected from BCLK O (di vided by 1 or 16)
or from the corresponding timer input, TIN. TIN is synchronized to BCLKO. The
synchronization delay is between two and three BCLK O clocks. The corresponding
TMRn[ICLK] selects the clock input source. A programmable prescaler di vides the
clock input by values from 1 to 256. The prescaler is an input to the 16-bit counter.
• Capture mode—Each timer has a 16-bit timer capture register (TCR0 and TCR1)
that latches the counter value when the corresponding input capture edge detector
senses a defined TIN transition. The capture edge bits (TMRn[CE]) select the type
of transition that triggers the capture, sets the timer e v ent re gister capture ev ent bit,
TERn[CAP], and issues a maskable interrupt.
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Chapter 13. Timer Module 13-3
General-Purpose Timer Programming Model
• Reference compare—A timer can be configured to count up to a reference v alue, at
which point TERn[REF] is set. If TMRn[ORI] is one, an interrupt is issued. If the
free run/restart bit TMRn[FRR] is set, a new count starts. If it is clear, the timer
keeps running.
• Output mode—When a timer reaches the reference value selected by TMRn[OM],
it can send an output signal on TOUTn. T OUTn can be an active-low pulse or a
toggle of the current output under program control.
NOTE:
Although external devices cannot access MCF5307 on-chip
memories or MBAR, they can access timer module registers.
The timer module registers, shown in Table 13-1, can be modified at any time.
13.3.1 Timer Mode Registers (TMR0/TMR1)
Timer mode registers (TMR0/TMR1), Figure 13-2, program the prescaler and various
timer modes.
Table 13-2 describes TMRn fields.
Table 13-1. General-Purpose Timer Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x140 Timer 0 mode register (TMR0) [p. 13-3] Reserved
0x144 Timer 0 reference register (TRR0) [p. 13-4] Reser ved
0x148 Timer 0 capture register (TCR0) [p. 13-4] Reserved
0x14C Timer 0 counter (TCN0) [p. 13-5] Reserved
0x150 Reserved Timer 0 event register
(TER0) [p. 13-5] Reserved
0x180 Timer 1 mode register (TMR1) [p. 13-3] Reserved
0x184 Timer 1 reference register (TRR1) [p. 13-4] Reser ved
0x188 Timer 1 capture register (TCR1) [p. 13-4] Reserved
0x18C Timer 1 counter (TCN1) [p. 13-5] Reserved
0x190 Reserved Timer 1 event register
(TER1) [p. 13-5] Reserved
15 876543210
Field PS CE OM ORI FRR CLK RST
Reset 0000_0000_0000_0000
R/W R/W
Address MBAR + 0x140 (TMR0); + 0x180 (TMR1)
Figure 13-2. Timer Mode Registers (TMR0/TMR1)
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13-4 MCF5307 User’s Manual
General-Purpose Timer Programming Model
13.3.2 Timer Reference Registers (TRR0/TRR1)
Each timer reference register (TRR0/TRR1), Figure 13-3, contains the reference value
compared with the respective free-running timer counter (TCN0/TCN1) as part of the
output-compare function. The reference value is not matched until TCNn equals TRRn.
=
13.3.3 Timer Capture Registers (TCR0/TCR1)
Each timer capture register (TCR0/TCR1), Figure 13-4, latches the corresponding TCNn
value during a capture operation when an edge occurs on TIN, as programmed in TMRn.
Table 13-2. TMRn Field Descriptions
Bits Name Description
15–8 PS Prescaler value. The prescaler is prog rammed to divide the cloc k input (BCLKO/(16 or 1) or clock on
TIN) by values from 1 (PS = 0000_0000) to 256 (PS = 1111_1111).
7–6 CE Capture edge and enable interrupt
00 Disable interrupt on capture event
01 Capture on rising edge only and enable interrupt on capture event
10 Capture on falling edge only and enable interrupt on capture event
11 Capture on any edge and enable interrupt on capture event
5 OM Output mode
0 Active-low pulse for one BCLKO cycle (22 nS at 45 MHz, 33 nS at 30 MHz, 44 nS at 22.5 MHz).
1 Toggle output.
4 ORI Output reference interrupt enable. If ORI is set when TERn[REF] = 1, an interrupt occurs.
0 Disable interrupt for reference reached (does not affect interrupt on capture function).
1 Enable interrupt upon reaching the reference value.
3 FRR Free run/restart
0 Free run. Timer count continues to increment after reaching the reference value.
1 Restart. Timer count is reset immediately after reaching the reference value.
2–1 CLK Input clock source for the timer
00 Stop count
01 System bus clock divided by 1
10 System bus clock divided by 16. Note that this clock source is not synchronized to the timer; thus
successive time-outs may vary slightly.
11 TIN pin (falling edge)
0 RST Reset timer. Performs a software timer reset similar to an external reset, although other register
values can still be written while RST = 0. A transition of RST from 1 to 0 resets register values. The
timer counter is not clocked unless the timer is enabled.
0 Reset timer (software reset)
1 Enable timer
15 0
Field REF
Reset 1111_1111_1111_1111
R/W R/W
Address MBAR + 0x144 (TRR0),+ 0x184 (TRR1)
Figure 13-3. Timer Reference Registers (TRR0/TRR1)
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Chapter 13. Timer Module 13-5
General-Purpose Timer Programming Model
BCLKO is assumed to be the clock source. TIN cannot simultaneously function as a
clocking source and as an input capture pin.
13.3.4 Timer Counters (TCN0/TCN1)
The current value of the 16-bit, incrementing timer counters (TCN0/TCN1), Figure 13-5,
can be read anytime without affecting counting. Writing to TCNn clears it. The timer
counter decrements on the clock source rising edge (BCLKO ÷ 1, BCLKO ÷ 16, or TIN).
13.3.5 Timer Event Registers (TER0/TER1)
Each timer event register (TER0/TER1), Figure 13-6, reports capture or reference events
e vents the timer recognizes by setting TERn[CAP] or TERn[REF], which it does regardless
of the corresponding interrupt-enable bit values, TMRn[ORI,CE].
Writing a 1 to either REF or CAP clears it (writing a 0 does not affect bit value); both bits
can be cleared at the same time. REF and CAP must be cleared early in the exception
handler, before the timer negates the IRQn to the interrupt controller.
15 0
Field CAP (16-bit capture counter value)
Reset 0000_0000_0000_0000
R/W Read only
Address MBAR + 0x148 (TCR0); + 0x188 (TCR1)
Figure 13-4. Timer Capture Register (TCR0/TCR1)
15 0
Field 16-bit timer counter value count
Reset 0000_0000_0000_0000
R/W R/W (to reset)
Address MBAR + 0x14C (TCN0); + 0x18C (TCN1)
Figure 13-5. Timer Counters (TCN0/TCN1)
7210
Field —REF CAP
Reset 0000_0000
R/W R/W (ones clear/zeros have no effect)
Address MBAR + 0x151 (TER0); + 0x191 (TER1)
Figure 13-6. Timer Event Registers (TER0/TER1)
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13-6 MCF5307 User’s Manual
Code Example
Table 13-3 describes TERn fields.
13.4 Code Example
The following code provides an example of how to initialize timer 0 and how to use the
timer for counting time-out periods.
MBARx EQU 0x10000 ;Defines the module base address at 0x10000
TMR0 EQU MBARx+0x140;Timer 0 register
TMR1 EQU MBARx+0x180 ;Timer 1 register
TRR0 EQU MBARx+0x144 ;Timer 0 reference register
TRR1 EQU MBARx+0x184 ;Timer 1 reference register
TCR0 EQU MBARx+0x148 ;Timer 0 capture register
TCR1 EQU MBARx+0x188 ;Timer 1 capture register
TCN0 EQU MBARx+0x14C ;Timer 0 counter
TCN1 EQU MBARx+0x18C ;Timer 1 counter
TER0 EQU MBARx+0x151 ;Timer 0 event register
TER1 EQU MBARx+0x191 ;Timer 1 event register
* TMR0 is defined as: *
*[PS]= 0xFF, divide clock by 256
*[CE] = 00disable interrupt
*[OM] = 0 output=active-low pulse
*[ORI] = 0, disable ref.interrupt
*[FRR] = 1, restart mode enabled
*[CLK] = 10, BCLKO/16
*[RST] = 0, timer 0 disabled
move.w #0xFF0C,D0
move.w D0,TMR0
move.w #0x0000,D0;writing to the timer counter with any
move.w DO,TCN0 ;value resets it to zero
move.w #AFAF,DO ;set the timer 0 reference to be
move.w #D0,TRR0 ;defined as 0xAFAF
The simple example below uses 0 to count time-out loops. A time-out occurs when the
reference value, 0xAFAF, is reached.
timer0_ex
clr.l DO
clr.l D1
clt.l D2
move.w #0x0000,D0
move,w D0,TCN0;reset the counter to 0x0000
move.b #0x03,D0 ;writing ones to TER0[REF,CAP]
move.b D0,TER0 ;clears the event flags
Table 13-3. TERn Field Descriptions
Bits Name Description
7–2—Reserved
1 REF Output reference event. The counter has reached the TRRn value. Setting TMRn[ORI] enables the
interrupt request caused by this event. Writing a one to REF clears the event condition.
0 CAP Capture event. The counter value has been latched into TCRn. Setting TMRn[CE] enables the
interrupt request caused by this event. Writing a 1 to CAP clears the event condition.
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Chapter 13. Timer Module 13-7
Calculating Time-Out Values
move.w TMR0,D0;save the contents of TMR0 while setting
bset #0,D0 ;the 0 bit. This enables timer 0 and starts counting
move.w D0, TMR0 ;load the value back into the register, setting TMR0[RST]
T0_LOOP
move.b TER0,D1 ;load TER0 and see if
btst #1,D1 ;TER0[REF] has been set
beq T0_LOOP
addi.l #1,D2;Increment D2
cmp.l #5,D2;Did D2 reach 5? (i.e. timer ref has timed)
beq T0_FINISH;If so, end timer0 example. Otherwise jump back.
move.b #0x02,D0 ;writing one to TER0[REF] clears the event flag
move.b D0,TER0
jmp T0_LOOP
T0_FINISH
HALT;End processing. Example is finished
13.5 Calculating Time-Out Values
The formula below determines time-out periods for various reference values:
Time-out period = (1/clock frequency) x (1 or 16) x (TMRn[PS] + 1) x
(TRRn[REF])
When calculating time-out periods, add 1 to the prescaler to simplify calculating, because
TMRn[PS] = 0x00 yields a prescaler of 1 and TMRn[PS] = 0xFF yields a prescaler of 256.
For example, if a 45-MHz timer clock is divided by 16, TMRn[PS] = 0x7F, and the timer
is referenced at 0xABCD (43,981 decimal), the time-out period is as follows:
Time-out period = (1/45) x (16) x (127 + 1) x (43,981) = 1.67 S
The time-out values in Table 13-5 represent the time it takes the counter value in TCNn
value to go from 0x0000 to the default reference value, TRRn[REF] = 0xFFFF. Time-out
values shown for BCLKO are divided by 1 and by 16 (TMRn[CLK] is 01 or 10,
respectively).
Any clock source (BCLK O ÷ 1, BCLKO ÷ 16, or TIN) can be prescaled using TMRn[PS].
The BCLK O frequency depends on the prescaler value (TMRn[PS]) and on the PLL clock
setting, as described inChapter 7, “Phase-Locked Loop (PLL).”
Table 13-5. Calculated Time-out Values (90-MHz Processor Clock)
TMR[PS] TMR[CLK] = 10 (System Bus Clock/16) TMR[CLK] = 01 (System Bus Clock/1)
Decimal Hex 45 MHz 30 MHz 22.5 MHz 45 MHz 30 MHz 22.5 MHz
0 0 0.0233 0.03495 0.0466 0.00146 0.00218 0.00291
1 1 0.0466 0.06991 0.09321 0.00291 0.00437 0.00583
2 2 0.06991 0.10486 0.13981 0.00437 0.00655 0.00874
3 3 0.09321 0.13981 0.18641 0.00583 0.00874 0.01165
4 4 0.11651 0.17476 0.23302 0.00728 0.01092 0.01456
5 5 0.13981 0.20972 0.27962 0.00874 0.01311 0.01748
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13-8 MCF5307 User’s Manual
Calculating Time-Out Values
6 6 0.16311 0.24467 0.32622 0.01019 0.01529 0.02039
7 7 0.18641 0.27962 0.37283 0.01165 0.01748 0.0233
8 8 0.20972 0.31457 0.41943 0.01311 0.01966 0.02621
9 9 0.23302 0.34953 0.46603 0.01456 0.02185 0.02913
10 0A 0.25632 0.38448 0.51264 0.01602 0.02403 0.03204
11 0B 0.27962 0.41943 0.55924 0.01748 0.02621 0.03495
12 0C 0.30292 0.45438 0.60584 0.01893 0.0284 0.03787
13 0D 0.32622 0.48934 0.65245 0.02039 0.03058 0.04078
14 0E 0.34953 0.52429 0.69905 0.02185 0.03277 0.04369
15 0F 0.37283 0.55924 0.74565 0.0233 0.03495 0.0466
16 10 0.39613 0.59419 0.79226 0.02476 0.03714 0.04952
17 11 0.41943 0.62915 0.83886 0.02621 0.03932 0.05243
18 12 0.44273 0.6641 0.88546 0.02767 0.04151 0.05534
19 13 0.46603 0.69905 0.93207 0.02913 0.04369 0.05825
20 14 0.48934 0.734 0.97867 0.03058 0.04588 0.06117
21 15 0.51264 0.76896 1.02527 0.03204 0.04806 0.06408
22 16 0.53594 0.80391 1.07188 0.0335 0.05024 0.06699
23 17 0.55924 0.83886 1.11848 0.03495 0.05243 0.06991
24 18 0.58254 0.87381 1.16508 0.03641 0.05461 0.07282
25 19 0.60584 0.90877 1.21169 0.03787 0.0568 0.07573
26 1A 0.62915 0.94372 1.25829 0.03932 0.05898 0.07864
27 1B 0.65245 0.97867 1.30489 0.04078 0.06117 0.08156
28 1C 0.67575 1.01362 1.3515 0.04223 0.06335 0.08447
29 1D 0.69905 1.04858 1.3981 0.04369 0.06554 0.08738
30 1E 0.72235 1.08353 1.4447 0.04515 0.06772 0.09029
31 1F 0.74565 1.11848 1.49131 0.0466 0.06991 0.09321
32 20 0.76896 1.15343 1.53791 0.04806 0.07209 0.09612
33 21 0.79226 1.18839 1.58451 0.04952 0.07427 0.09903
34 22 0.81556 1.22334 1.63112 0.05097 0.07646 0.10194
35 23 0.83886 1.25829 1.67772 0.05243 0.07864 0.10486
36 24 0.86216 1.29324 1.72432 0.05389 0.08083 0.10777
37 25 0.88546 1.3282 1.77093 0.05534 0.08301 0.11068
38 26 0.90877 1.36315 1.81753 0.0568 0.0852 0.1136
39 27 0.93207 1.3981 1.86414 0.05825 0.08738 0.11651
40 28 0.95537 1.43305 1.91074 0.05971 0.08957 0.11942
41 29 0.97867 1.46801 1.95734 0.06117 0.09175 0.12233
42 2A 1.00197 1.50296 2.00395 0.06262 0.09393 0.12525
43 2B 1.02527 1.53791 2.05055 0.06408 0.09612 0.12816
44 2C 1.04858 1.57286 2.09715 0.06554 0.0983 0.13107
45 2D 1.07188 1.60782 2.14376 0.06699 0.10049 0.13398
Table 13-5. Calculated Time-out Values (90-MHz Processor Clock) (Continued)
TMR[PS] TMR[CLK] = 10 (System Bus Clock/16) TMR[CLK] = 01 (System Bus Clock/1)
Decimal Hex 45 MHz 30 MHz 22.5 MHz 45 MHz 30 MHz 22.5 MHz
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Chapter 13. Timer Module 13-9
Calculating Time-Out Values
46 2E 1.09518 1.64277 2.19036 0.06845 0.10267 0.1369
47 2F 1.11848 1.67772 2.23696 0.06991 0.10486 0.13981
48 30 1.14178 1.71267 2.28357 0.07136 0.10704 0.14272
49 31 1.16508 1.74763 2.33017 0.07282 0.10923 0.14564
50 32 1.18839 1.78258 2.37677 0.07427 0.11141 0.14855
51 33 1.21169 1.81753 2.42338 0.07573 0.1136 0.15146
52 34 1.23499 1.85248 2.46998 0.07719 0.11578 0.15437
53 35 1.25829 1.88744 2.51658 0.07864 0.11796 0.15729
54 36 1.28159 1.92239 2.56319 0.0801 0.12015 0.1602
55 37 1.30489 1.95734 2.60979 0.08156 0.12233 0.16311
56 38 1.3282 1.99229 2.65639 0.08301 0.12452 0.16602
57 39 1.3515 2.02725 2.703 0.08447 0.1267 0.16894
58 3A 1.3748 2.0622 2.7496 0.08592 0.12889 0.17185
59 3B 1.3981 2.09715 2.7962 0.08738 0.13107 0.17476
60 3C 1.4214 2.1321 2.84281 0.08884 0.13326 0.17768
61 3D 1.4447 2.16706 2.88941 0.09029 0.13544 0.18059
62 3E 1.46801 2.20201 2.93601 0.09175 0.13763 0.1835
63 3F 1.49131 2.23696 2.98262 0.09321 0.13981 0.18641
64 40 1.51461 2.27191 3.02922 0.09466 0.14199 0.18933
65 41 1.53791 2.30687 3.07582 0.09612 0.14418 0.19224
66 42 1.56121 2.34182 3.12243 0.09758 0.14636 0.19515
67 43 1.58451 2.37677 3.16903 0.09903 0.14855 0.19806
68 44 1.60782 2.41172 3.21563 0.10049 0.15073 0.20098
69 45 1.63112 2.44668 3.26224 0.10194 0.15292 0.20389
70 46 1.65442 2.48163 3.30884 0.1034 0.1551 0.2068
71 47 1.67772 2.51658 3.35544 0.10486 0.15729 0.20972
72 48 1.70102 2.55153 3.40205 0.10631 0.15947 0.21263
73 49 1.72432 2.58649 3.44865 0.10777 0.16166 0.21554
74 4A 1.74763 2.62144 3.49525 0.10923 0.16384 0.21845
75 4B 1.77093 2.65639 3.54186 0.11068 0.16602 0.22137
76 4C 1.79423 2.69135 3.58846 0.11214 0.16821 0.22428
77 4D 1.81753 2.7263 3.63506 0.1136 0.17039 0.22719
78 4E 1.84083 2.76125 3.68167 0.11505 0.17258 0.2301
79 4F 1.86414 2.7962 3.72827 0.11651 0.17476 0.23302
80 50 1.88744 2.83116 3.77487 0.11796 0.17695 0.23593
81 51 1.91074 2.86611 3.82148 0.11942 0.17913 0.23884
82 52 1.93404 2.90106 3.86808 0.12088 0.18132 0.24176
83 53 1.95734 2.93601 3.91468 0.12233 0.1835 0.24467
84 54 1.98064 2.97097 3.96129 0.12379 0.18569 0.24758
85 55 2.00395 3.00592 4.00789 0.12525 0.18787 0.25049
Table 13-5. Calculated Time-out Values (90-MHz Processor Clock) (Continued)
TMR[PS] TMR[CLK] = 10 (System Bus Clock/16) TMR[CLK] = 01 (System Bus Clock/1)
Decimal Hex 45 MHz 30 MHz 22.5 MHz 45 MHz 30 MHz 22.5 MHz
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13-10 MCF5307 User’s Manual
Calculating Time-Out Values
86 56 2.02725 3.04087 4.05449 0.1267 0.19005 0.25341
87 57 2.05055 3.07582 4.1011 0.12816 0.19224 0.25632
88 58 2.07385 3.11078 4.1477 0.12962 0.19442 0.25923
89 59 2.09715 3.14573 4.1943 0.13107 0.19661 0.26214
90 5A 2.12045 3.18068 4.24091 0.13253 0.19879 0.26506
91 5B 2.14376 3.21563 4.28751 0.13398 0.20098 0.26797
92 5C 2.16706 3.25059 4.33411 0.13544 0.20316 0.27088
93 5D 2.19036 3.28554 4.38072 0.1369 0.20535 0.27379
94 5E 2.21366 3.32049 4.42732 0.13835 0.20753 0.27671
95 5F 2.23696 3.35544 4.47392 0.13981 0.20972 0.27962
96 60 2.26026 3.3904 4.52053 0.14127 0.2119 0.28253
97 61 2.28357 3.42535 4.56713 0.14272 0.21408 0.28545
98 62 2.30687 3.4603 4.61373 0.14418 0.21627 0.28836
99 63 2.33017 3.49525 4.66034 0.14564 0.21845 0.29127
100 64 2.35347 3.53021 4.70694 0.14709 0.22064 0.29418
101 65 2.37677 3.56516 4.75354 0.14855 0.22282 0.2971
102 66 2.40007 3.60011 4.80015 0.15 0.22501 0.30001
103 67 2.42338 3.63506 4.84675 0.15146 0.22719 0.30292
104 68 2.44668 3.67002 4.89335 0.15292 0.22938 0.30583
105 69 2.46998 3.70497 4.93996 0.15437 0.23156 0.30875
106 6A 2.49328 3.73992 4.98656 0.15583 0.23375 0.31166
107 6B 2.51658 3.77487 5.03316 0.15729 0.23593 0.31457
108 6C 2.53988 3.80983 5.07977 0.15874 0.23811 0.31749
109 6D 2.56319 3.84478 5.12637 0.1602 0.2403 0.3204
110 6E 2.58649 3.87973 5.17297 0.16166 0.24248 0.32331
111 6F 2.60979 3.91468 5.21958 0.16311 0.24467 0.32622
112 70 2.63309 3.94964 5.26618 0.16457 0.24685 0.32914
113 71 2.65639 3.98459 5.31279 0.16602 0.24904 0.33205
114 72 2.67969 4.01954 5.35939 0.16748 0.25122 0.33496
115 73 2.703 4.05449 5.40599 0.16894 0.25341 0.33787
116 74 2.7263 4.08945 5.4526 0.17039 0.25559 0.34079
117 75 2.7496 4.1244 5.4992 0.17185 0.25777 0.3437
118 76 2.7729 4.15935 5.5458 0.17331 0.25996 0.34661
119 77 2.7962 4.1943 5.59241 0.17476 0.26214 0.34953
120 78 2.8195 4.22926 5.63901 0.17622 0.26433 0.35244
121 79 2.84281 4.26421 5.68561 0.17768 0.26651 0.35535
122 7A 2.86611 4.29916 5.73222 0.17913 0.2687 0.35826
123 7B 2.88941 4.33411 5.77882 0.18059 0.27088 0.36118
124 7C 2.91271 4.36907 5.82542 0.18204 0.27307 0.36409
125 7D 2.93601 4.40402 5.87203 0.1835 0.27525 0.367
Table 13-5. Calculated Time-out Values (90-MHz Processor Clock) (Continued)
TMR[PS] TMR[CLK] = 10 (System Bus Clock/16) TMR[CLK] = 01 (System Bus Clock/1)
Decimal Hex 45 MHz 30 MHz 22.5 MHz 45 MHz 30 MHz 22.5 MHz
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Chapter 13. Timer Module 13-11
Calculating Time-Out Values
126 7E 2.95931 4.43897 5.91863 0.18496 0.27744 0.36991
127 7F 2.98262 4.47392 5.96523 0.18641 0.27962 0.37283
128 80 3.00592 4.50888 6.01184 0.18787 0.2818 0.37574
129 81 3.02922 4.54383 6.05844 0.18933 0.28399 0.37865
130 82 3.05252 4.57878 6.10504 0.19078 0.28617 0.38157
131 83 3.07582 4.61373 6.15165 0.19224 0.28836 0.38448
132 84 3.09912 4.64869 6.19825 0.1937 0.29054 0.38739
133 85 3.12243 4.68364 6.24485 0.19515 0.29273 0.3903
134 86 3.14573 4.71859 6.29146 0.19661 0.29491 0.39322
135 87 3.16903 4.75354 6.33806 0.19806 0.2971 0.39613
136 88 3.19233 4.7885 6.38466 0.19952 0.29928 0.39904
137 89 3.21563 4.82345 6.43127 0.20098 0.30147 0.40195
138 8A 3.23893 4.8584 6.47787 0.20243 0.30365 0.40487
139 8B 3.26224 4.89335 6.52447 0.20389 0.30583 0.40778
140 8C 3.28554 4.92831 6.57108 0.20535 0.30802 0.41069
141 8D 3.30884 4.96326 6.61768 0.2068 0.3102 0.4136
142 8E 3.33214 4.99821 6.66428 0.20826 0.31239 0.41652
143 8F 3.35544 5.03316 6.71089 0.20972 0.31457 0.41943
144 90 3.37874 5.06812 6.75749 0.21117 0.31676 0.42234
145 91 3.40205 5.10307 6.80409 0.21263 0.31894 0.42526
146 92 3.42535 5.13802 6.8507 0.21408 0.32113 0.42817
147 93 3.44865 5.17297 6.8973 0.21554 0.32331 0.43108
148 94 3.47195 5.20793 6.9439 0.217 0.3255 0.43399
149 95 3.49525 5.24288 6.99051 0.21845 0.32768 0.43691
150 96 3.51856 5.27783 7.03711 0.21991 0.32986 0.43982
151 97 3.54186 5.31279 7.08371 0.22137 0.33205 0.44273
152 98 3.56516 5.34774 7.13032 0.22282 0.33423 0.44564
153 99 3.58846 5.38269 7.17692 0.22428 0.33642 0.44856
154 9A 3.61176 5.41764 7.22352 0.22574 0.3386 0.45147
155 9B 3.63506 5.4526 7.27013 0.22719 0.34079 0.45438
156 9C 3.65837 5.48755 7.31673 0.22865 0.34297 0.4573
157 9D 3.68167 5.5225 7.36333 0.2301 0.34516 0.46021
158 9E 3.70497 5.55745 7.40994 0.23156 0.34734 0.46312
159 9F 3.72827 5.59241 7.45654 0.23302 0.34953 0.46603
160 A0 3.75157 5.62736 7.50314 0.23447 0.35171 0.46895
161 A1 3.77487 5.66231 7.54975 0.23593 0.35389 0.47186
162 A2 3.79818 5.69726 7.59635 0.23739 0.35608 0.47477
163 A3 3.82148 5.73222 7.64295 0.23884 0.35826 0.47768
164 A4 3.84478 5.76717 7.68956 0.2403 0.36045 0.4806
165 A5 3.86808 5.80212 7.73616 0.24176 0.36263 0.48351
Table 13-5. Calculated Time-out Values (90-MHz Processor Clock) (Continued)
TMR[PS] TMR[CLK] = 10 (System Bus Clock/16) TMR[CLK] = 01 (System Bus Clock/1)
Decimal Hex 45 MHz 30 MHz 22.5 MHz 45 MHz 30 MHz 22.5 MHz
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13-12 MCF5307 User’s Manual
Calculating Time-Out Values
166 A6 3.89138 5.83707 7.78276 0.24321 0.36482 0.48642
167 A7 3.91468 5.87203 7.82937 0.24467 0.367 0.48934
168 A8 3.93799 5.90698 7.87597 0.24612 0.36919 0.49225
169 A9 3.96129 5.94193 7.92257 0.24758 0.37137 0.49516
170 AA 3.98459 5.97688 7.96918 0.24904 0.37356 0.49807
171 AB 4.00789 6.01184 8.01578 0.25049 0.37574 0.50099
172 AC 4.03119 6.04679 8.06238 0.25195 0.37792 0.5039
173 AD 4.05449 6.08174 8.10899 0.25341 0.38011 0.50681
174 AE 4.0778 6.11669 8.15559 0.25486 0.38229 0.50972
175 AF 4.1011 6.15165 8.20219 0.25632 0.38448 0.51264
176 B0 4.1244 6.1866 8.2488 0.25777 0.38666 0.51555
177 B1 4.1477 6.22155 8.2954 0.25923 0.38885 0.51846
178 B2 4.171 6.2565 8.342 0.26069 0.39103 0.52138
179 B3 4.1943 6.29146 8.38861 0.26214 0.39322 0.52429
180 B4 4.21761 6.32641 8.43521 0.2636 0.3954 0.5272
181 B5 4.24091 6.36136 8.48181 0.26506 0.39759 0.53011
182 B6 4.26421 6.39631 8.52842 0.26651 0.39977 0.53303
183 B7 4.28751 6.43127 8.57502 0.26797 0.40195 0.53594
184 B8 4.31081 6.46622 8.62162 0.26943 0.40414 0.53885
185 B9 4.33411 6.50117 8.66823 0.27088 0.40632 0.54176
186 BA 4.35742 6.53612 8.71483 0.27234 0.40851 0.54468
187 BB 4.38072 6.57108 8.76144 0.27379 0.41069 0.54759
188 BC 4.40402 6.60603 8.80804 0.27525 0.41288 0.5505
189 BD 4.42732 6.64098 8.85464 0.27671 0.41506 0.55342
190 BE 4.45062 6.67593 8.90125 0.27816 0.41725 0.55633
191 BF 4.47392 6.71089 8.94785 0.27962 0.41943 0.55924
192 C0 4.49723 6.74584 8.99445 0.28108 0.42161 0.56215
193 C1 4.52053 6.78079 9.04106 0.28253 0.4238 0.56507
194 C2 4.54383 6.81574 9.08766 0.28399 0.42598 0.56798
195 C3 4.56713 6.8507 9.13426 0.28545 0.42817 0.57089
196 C4 4.59043 6.88565 9.18087 0.2869 0.43035 0.5738
197 C5 4.61373 6.9206 9.22747 0.28836 0.43254 0.57672
198 C6 4.63704 6.95555 9.27407 0.28981 0.43472 0.57963
199 C7 4.66034 6.99051 9.32068 0.29127 0.43691 0.58254
200 C8 4.68364 7.02546 9.36728 0.29273 0.43909 0.58545
201 C9 4.70694 7.06041 9.41388 0.29418 0.44128 0.58837
202 CA 4.73024 7.09536 9.46049 0.29564 0.44346 0.59128
203 CB 4.75354 7.13032 9.50709 0.2971 0.44564 0.59419
204 CC 4.77685 7.16527 9.55369 0.29855 0.44783 0.59711
205 CD 4.80015 7.20022 9.6003 0.30001 0.45001 0.60002
Table 13-5. Calculated Time-out Values (90-MHz Processor Clock) (Continued)
TMR[PS] TMR[CLK] = 10 (System Bus Clock/16) TMR[CLK] = 01 (System Bus Clock/1)
Decimal Hex 45 MHz 30 MHz 22.5 MHz 45 MHz 30 MHz 22.5 MHz
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Chapter 13. Timer Module 13-13
Calculating Time-Out Values
206 CE 4.82345 7.23517 9.6469 0.30147 0.4522 0.60293
207 CF 4.84675 7.27013 9.6935 0.30292 0.45438 0.60584
208 D0 4.87005 7.30508 9.74011 0.30438 0.45657 0.60876
209 D1 4.89335 7.34003 9.78671 0.30583 0.45875 0.61167
210 D2 4.91666 7.37498 9.83331 0.30729 0.46094 0.61458
211 D3 4.93996 7.40994 9.87992 0.30875 0.46312 0.61749
212 D4 4.96326 7.44489 9.92652 0.3102 0.46531 0.62041
213 D5 4.98656 7.47984 9.97312 0.31166 0.46749 0.62332
214 D6 5.00986 7.51479 10.01973 0.31312 0.46967 0.62623
215 D7 5.03316 7.54975 10.06633 0.31457 0.47186 0.62915
216 D8 5.05647 7.5847 10.11293 0.31603 0.47404 0.63206
217 D9 5.07977 7.61965 10.15954 0.31749 0.47623 0.63497
218 DA 5.10307 7.6546 10.20614 0.31894 0.47841 0.63788
219 DB 5.12637 7.68956 10.25274 0.3204 0.4806 0.6408
220 DC 5.14967 7.72451 10.29935 0.32185 0.48278 0.64371
221 DD 5.17297 7.75946 10.34595 0.32331 0.48497 0.64662
222 DE 5.19628 7.79441 10.39255 0.32477 0.48715 0.64953
223 DF 5.21958 7.82937 10.43916 0.32622 0.48934 0.65245
224 E0 5.24288 7.86432 10.48576 0.32768 0.49152 0.65536
225 E1 5.26618 7.89927 10.53236 0.32914 0.4937 0.65827
226 E2 5.28948 7.93423 10.57897 0.33059 0.49589 0.66119
227 E3 5.31279 7.96918 10.62557 0.33205 0.49807 0.6641
228 E4 5.33609 8.00413 10.67217 0.33351 0.50026 0.66701
229 E5 5.35939 8.03908 10.71878 0.33496 0.50244 0.66992
230 E6 5.38269 8.07404 10.76538 0.33642 0.50463 0.67284
231 E7 5.40599 8.10899 10.81198 0.33787 0.50681 0.67575
232 E8 5.42929 8.14394 10.85859 0.33933 0.509 0.67866
233 E9 5.4526 8.17889 10.90519 0.34079 0.51118 0.68157
234 EA 5.4759 8.21385 10.95179 0.34224 0.51337 0.68449
235 EB 5.4992 8.2488 10.9984 0.3437 0.51555 0.6874
236 EC 5.5225 8.28375 11.045 0.34516 0.51773 0.69031
237 ED 5.5458 8.3187 11.0916 0.34661 0.51992 0.69323
238 EE 5.5691 8.35366 11.13821 0.34807 0.5221 0.69614
239 EF 5.59241 8.38861 11.18481 0.34953 0.52429 0.69905
240 F0 5.61571 8.42356 11.23141 0.35098 0.52647 0.70196
241 F1 5.63901 8.45851 11.27802 0.35244 0.52866 0.70488
242 F2 5.66231 8.49347 11.32462 0.35389 0.53084 0.70779
243 F3 5.68561 8.52842 11.37122 0.35535 0.53303 0.7107
244 F4 5.70891 8.56337 11.41783 0.35681 0.53521 0.71361
245 F5 5.73222 8.59832 11.46443 0.35826 0.5374 0.71653
Table 13-5. Calculated Time-out Values (90-MHz Processor Clock) (Continued)
TMR[PS] TMR[CLK] = 10 (System Bus Clock/16) TMR[CLK] = 01 (System Bus Clock/1)
Decimal Hex 45 MHz 30 MHz 22.5 MHz 45 MHz 30 MHz 22.5 MHz
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13-14 MCF5307 User’s Manual
Calculating Time-Out Values
246 F6 5.75552 8.63328 11.51103 0.35972 0.53958 0.71944
247 F7 5.77882 8.66823 11.55764 0.36118 0.54176 0.72235
248 F8 5.80212 8.70318 11.60424 0.36263 0.54395 0.72527
249 F9 5.82542 8.73813 11.65084 0.36409 0.54613 0.72818
250 FA 5.84872 8.77309 11.69745 0.36555 0.54832 0.73109
251 FB 5.87203 8.80804 11.74405 0.367 0.5505 0.734
252 FC 5.89533 8.84299 11.79065 0.36846 0.55269 0.73692
253 FD 5.91863 8.87794 11.83726 0.36991 0.55487 0.73983
254 FE 5.94193 8.9129 11.88386 0.37137 0.55706 0.74274
255 FF 5.96523 8.94785 11.93046 0.37283 0.55924 0.74565
Table 13-5. Calculated Time-out Values (90-MHz Processor Clock) (Continued)
TMR[PS] TMR[CLK] = 10 (System Bus Clock/16) TMR[CLK] = 01 (System Bus Clock/1)
Decimal Hex 45 MHz 30 MHz 22.5 MHz 45 MHz 30 MHz 22.5 MHz
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Chapter 14. U ART Modules 14-1
Chapter 14
UART Modules
This chapter describes the use of the universal asynchronous/synchronous
receiver/transmitters (UARTs) implemented on the MCF5307 and includes programming
examples. All references to UART refer to one of these modules.
14.1 Overview
The MCF5307 contains two independent UAR Ts. Each UAR T can be clocked by BCLKO,
eliminating the need for an external crystal. As Figure 14-1 shows, each UART module
interfaces directly to the CPU and consists of the following:
• Serial communication channel
• Programmable transmitter and receiver clock generation
• Internal channel control logic
• Interrupt control logic
Figure 14-1. Simplified Block Diagram
The serial communication channel provides a full-duplex asynchronous/synchronous
recei ver and transmitter deri ving an operating frequency from BCLK O or an external clock
using the timer pin. The transmitter converts parallel data from the CPU to a serial bit
stream, inserting appropriate start, stop, and parity bits. It outputs the resulting stream on
the channel transmitter serial data output (TxD). See Section 14.5.2.1, “Transmitting.”
The receiver converts serial data from the channel receiver serial data input (RxD) to
parallel format, checks for a start, stop, and parity bits, or break conditions, and transfers
the assembled character onto the bus during read operations. The receiver may be polled-
or interrupt-driven. See Section 14.5.2.2, “Receiver.”
Serial
Interrupt Control
Logic
CTS
RTS
RxD
TxD
or
External clock (TIN)
Internal Channel
Control Logic
Programmable
Clock
Communications
Channel
Generation
System Integration
Module (SIM)
Interrupt
Controller
UART
BCLKO
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14-2 MCF5307 User’s Manual
Serial Module Overview
14.2 Serial Module Overview
The MCF5307 contains two independent UART modules, whose features are as follows:
• Each can be clocked by BCLKO, eliminating a need for an external crystal
• Full-duplex asynchronous/synchronous receiver/transmitter channel
• Quadruple-buffered receiver
• Double-buffered transmitter
• Independently programmable receiver and transmitter clock sources
• Programmable data format:
— 5–8 data bits plus parity
— Odd, even, no parity, or force parity
— One, one-and-a-half, or two stop bits
• Each channel programmable to normal (full-duplex), automatic echo, local
loop-back, or remote loop-back mode
• Automatic wake-up mode for multidrop applications
• Four maskable interrupt conditions
• UART0 and UART1 have interrupt capability to DMA channels 2 and 3,
respectively, when either the RxRDY or FFULL bit is set in the USR.
• Parity, framing, and overrun error detection
• False-start bit detection
• Line-break detection and generation
• Detection of breaks originating in the middle of a character
• Start/end break interrupt/status
14.3 Register Descriptions
This section contains a detailed description of each register and its specific function.
Flowcharts in Section 14.5.6, “Programming, ” describe basic U AR T module programming.
The operation of the UART module is controlled by writing control bytes into the
appropriate registers. Table 14-1 is a memory map for UART module registers.
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Chapter 14. U ART Modules 14-3
Register Descriptions
Table 14-1. UART Module Programming Model
MBAR Offset [31:24] [23:16] [15:8] [7:0]
UART0 UART1
0x1C0 0x200 UART mode
registers1—(UMR1n)
[p. 14-4], (UMR2n) [p.
14-6]
—
0x1C4 0x204 (Read) UART status
registers—(USRn) [p.
14-7]
—
(Write) UART
clock-select
register1—(UCSRn)
[p. 14-8]
—
0x1C8 0x208 (Read) Do not access2—
(Write) UART
command
registers—(UCRn) [p.
14-9]
—
0x1CC 0x20C (UART/Read) UART
receiver
buffers—(URBn) [p.
14-11]
—
(UART/Write) UART
transmitter
buffers—(UTBn) [p.
14-11]
—
0x1D0 0x210 (Read) UART input
port change
registers—(UIPCRn)
[p. 14-12]
—
(Write) UART auxiliary
control
registers1—(UACRn)
[p. 14-12]
—
0x1D4 0x214 (Read) UAR T interrupt
status
registers—(UISRn) [p.
14-13]
—
(Write) UART interrupt
mask
registers—(UIMRn) [p .
14-13]
—
0x1D8 0x218 UART divider upper
registers—(UDUn) [p.
14-14]
—
0x1DC 0x21C UART divider lower
registers—(UDLn) [p.
14-14]
—
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14-4 MCF5307 User’s Manual
Register Descriptions
NOTE:
U ART registers are accessible only as bytes. Although external
masters cannot access on-chip memories or MBAR, they can
access any UART registers.
14.3.1 UART Mode Registers 1 (UMR1n)
The UART mode registers 1 (UMR1n) control configuration. UMR1n can be read or
written when the mode register pointer points to it, at RESET or after a RESET MODE
REGISTER POINTER command using UCRn[MISC]. After UMR1n is read or written, the
pointer points to UMR2n.
0x1E0–
0x1EC 0x220–
0x22C Do not access2—
0x1F0 0x230 UART interrupt vector
register—(UIVRn) [p.
14-15]
—
0x1F4 0x234 (Read) UART input
port registers—(UIPn)
[p. 14-15]
—
(Write) Do not access2—
0x1F8 0x238 (Read) Do not access2—
(Write) UART output
port bit set command
registers—(UOP1n3)
[p. 14-15]
—
0x1FC 0x23C (Read) Do not access2—
(Write) UART output
port bit reset
command
registers—(UOP0n3)
[p. 14-15]
—
1UMR1n, UMR2n, and UCSRn should be changed only after the receiver/transmitter is issued a software reset
command. That is, if channel operation is not disabled, undesirable results may occur.
2This address is for factory testing. Reading this location results in undesired effects and possible incorrect
transmission or reception of characters. Register contents may also be changed.
3Address-triggered commands
Table 14-1. UART Module Programming Model (Continued)
MBAR Offset [31:24] [23:16] [15:8] [7:0]
UART0 UART1
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Chapter 14. U ART Modules 14-5
Register Descriptions
Table 14-2 describes UMR1n fields.
7 6 543210
Field RxRTS RxIRQ/FFULL ERR PM PT B/C
Reset 0000_0000
R/W R/W
Address MBAR + 0x1C0 (UART0), 0x200 (UART1). After UMR1n is read or written, the pointer points to UMR2n.
Figure 14-2. UART Mode Registers 1 (UMR1n)
Table 14-2. UMR1n Field Descriptions
Bits Name Description
7 RxRTS Receiver request-to-send. Allows the RTS output to control the CTS input of the transmitting device
to prevent receiver overrun. If both the receiver and transmitter are incorrectly programmed for RTS
control, RTS control is disabled for both. Transmitter RTS control is configured in UMR2n[TxRTS].
0 The receiver has no effect on RTS.
1 When a valid start bit is received, RTS is negated if the UART's FIFO is full. RTS is reasserted
when the FIFO has an empty position available.
6 RxIRQ/
FFULL Receiver interrupt select.
0 RxRDY is the source that generates IRQ.
1 FFULL is the source that generates IRQ.
5 ERR Error mode. Configures the FIFO status bits, USRn[RB,FE,PE].
0 Character mode. The USRn values reflect the status of the character at the top of the FIFO. ERR
must be 0 for correct A/D flag information when in multidrop mode.
1 Block mode. The USRn values are the logical OR of the status for all char acters reaching the top of
the FIFO because the last RESET ERROR STATUS command for the channel was issued. See
Section 14.3.5, “UART Command Registers (UCRn).”
4–3 PM Parity mode. Selects the parity or multidrop mode for the channel. The parity bit is added to the
transmitted character, and the receiver performs a parity check on incoming data. The value of PM
affects PT, as shown below.
2 PT Parity type. PM and PT together select parity type (PM = 0x) or determine whether a data or address
character is transmitted (PM = 11).
PM Parity Mode Parity Type (PT= 0) Parity Type (PT= 1)
00 With parity Even parity Odd parity
01 Force parity Low parity High parity
10 No parity n/a
11 Multidrop mode Data character Address character
1–0 B/C Bits per character. Select the number of data bits per character to be sent. The values shown do not
include start, parity, or stop bits.
00 5 bits
01 6 bits
10 7 bits
11 8 bits
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14-6 MCF5307 User’s Manual
Register Descriptions
14.3.2 UART Mode Register 2 (UMR2n)
UART mode registers 2 (UMR2n) control UART module configuration. UMR2n can be
read or written when the mode register pointer points to it, which occurs after an y access to
UMR1n. UMR2n accesses do not update the pointer.
Table 14-3 describes UMR2n fields.
76543 0
Field CM TxRTS TxCTS SB
Reset 0000_0000
R/W R/W
Address MBAR + 0x1C0, 0x200. After UMR1n is read or written, the pointer points to UMR2n.
Figure 14-3. UART Mode Register 2 (UMR2n)
Table 14-3. UMR2n Field Descriptions
Bits Name Description
7–6 CM Channel mode. Selects a channel mode. Section 14.5.3, “Looping Modes,” describes individual
modes.
00 Normal
01 Automatic echo
10 Local loop-back
11 Remote loop-back
5 TxRTS Transmitter ready-to-send. Controls negation of RTS to automatically terminate a message
transmission. Attempting to program a receiver and transmitter in the same channel for RTS control is
not permitted and disables RTS control for both.
0 The transmitter has no effect on RTS.
1 In applications where the transmitter is disabled after transmission completes, setting this bit
automatically clears UOP[RTS] one bit time after any characters in the channel transmitter shift and
holding registers are completely sent, including the programmed number of stop bits.
4 TxCTS Transmitter clear-to-send. If both TxCTS and TxRTS are enabled, TxCTS controls the operation of the
transmitter.
0 CTS has no effect on the transmitter.
1 Enables clear-to-send operation. The transmitter checks the state of CTS each time it is ready to
send a character. If CTS is asserted, the character is sent; if it is negated, the channel TxD remains
in the high state and transmission is dela yed until CTS is asserted. Changes in CTS as a character is
being sent do not affect its transmission.
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Chapter 14. U ART Modules 14-7
Register Descriptions
14.3.3 UART Status Registers (USRn)
The USRn, Figure 14-4, shows status of the transmitter, the receiver, and the FIFO.
Table 14-4 describes USRn fields.
3–0 SB Stop-bit length control. Selects the length of the stop bit appended to the transmitted character.
Stop-bit lengths of 9/16th to 2 bits are programmable for 6–8 bit characters. Lengths of 1 1/16th to 2
bits are programmab le for 5-bit characters . In all cases, the receiver chec ks only for a high condition at
the center of the first stop-bit position, that is, one bit time after the last data bit or after the parity bit, if
parity is enabled. If an external 1x clock is used for the transmitter, clearing bit 3 selects one stop bit
and setting bit 3 selects 2 stop bits for transmission.
SB 5 Bits 6–8 Bits SB 5 Bits 6–8 Bits SB 5–8 Bits SB 5–8 Bits
0000 1.063 0.563 0100 1.313 0.813 1000 1.563 1100 1.813
0001 1.125 0.625 0101 1.375 0.875 1001 1.625 1101 1.875
0010 1.188 0.688 0110 1.438 0.938 1010 1.688 1110 1.938
0011 1.250 0.750 0111 1.500 1.000 1011 1.750 1111 2.000
76543210
Field RB FE PE OE TxEMP TxRDY FFULL RxRDY
Reset 0000_0000
R/W Read only
Address MBAR + 0x1C4 (USR0), 0x204 (USR1)
Figure 14-4. UART Status Register (USRn)
Table 14-4. USRn Field Descriptions
Bits Name Description
7 RB Received break. The received break circuit detects breaks that originate in the middle of a received
character. However, a break in the middle of a character must persist until the end of the next
detected character time.
0 No break was received.
1 An all-zero character of the programmed length was received without a stop bit. RB is valid only
when RxRDY = 1. Only a single FIFO position is occupied when a break is received. Further
entries to the FIFO are inhibited until RxD returns to the high state for at least one-half bit time,
which is equal to two successive edges of the UART clock.
6 FE Framing error.
0 No framing error occurred.
1 No stop bit was detected when the corresponding data character in the FIFO was received. The
stop-bit check occurs in the middle of the first stop-bit position. FE is valid only when RxRDY = 1.
Table 14-3. UMR2n Field Descriptions (Continued)
Bits Name Description
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14-8 MCF5307 User’s Manual
Register Descriptions
14.3.4 UART Clock-Select Registers (UCSRn)
The UART clock-select registers (UCSRn) select an external clock on the TIN input
(divided by 1 or 16) or a prescaled BCLKO as the clocking source for the transmitter and
receiver. See Section 14.5.1, “Transmitter/Receiver Clock Source.” The transmitter and
receiver can use different clock sources. To use BCLKO for both, set UCSRn to 0xDD.
5 PE Parity error. Valid only if RxRDY = 1.
0 No parity error occurred.
1 If UMR1n[PM] = 0x (with parity or force parity), the corresponding character in the FIFO was
received with incorrect parity. If UMR1n[PM] = 11 (multidrop), PE stores the received A/D bit.
4 OE Overrun error. Indicates whether an overrun occurs.
0 No overrun occurred.
1 One or more characters in the received data stream have been lost. OE is set upon receipt of a
new character when the FIFO is full and a character is already in the shift register waiting for an
empty FIFO position. When this occurs, the character in the receiver shift register and its break
detect, framing error status, and parity error, if any, are lost. OE is cleared by the RESET ERROR
STATUS command in UCRn.
3 TxEMP Transmitter empty.
0 The transmitter buffer is not empty. Either a character is being shifted out, or the transmitter is
disabled. The transmitter is enabled/disabled by programming UCRn[TC].
1 The transmitter has underrun (both the transmitter holding register and transmitter shift registers
are empty). This bit is set after transmission of the last stop bit of a character if there are no
characters in the transmitter holding register awaiting transmission.
2 TxRDY Transmitter ready.
0 The CPU loaded the transmitter holding register or the transmitter is disabled.
1 The transmitter holding register is empty and ready for a character. TxRDY is set when a
character is sent to the transmitter shift register and when the transmitter is first enabled. If the
transmitter is disabled, characters loaded into the transmitter holding register are not sent.
1 FFULL FIFO full.
0 The FIFO is not full but may hold up to two unread characters.
1 A character was received and is waiting in the receiver buffer FIFO.
0 RxRDY Receiver ready
0 The CPU has read the receiver buffer and no characters remain in the FIFO after this read.
1 One or more characters were received and are waiting in the receiver buffer FIFO.
7430
Field RCS TCS
Reset 0000_0000
R/W Write only
Address MBAR + 0x1C4 (UCSR0), 0x204 (UCSR1)
Figure 14-5. UART Clock-Select Register (UCSRn)
Table 14-4. USRn Field Descriptions (Continued)
Bits Name Description
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Chapter 14. U ART Modules 14-9
Register Descriptions
Table 14-5 describes UCSRn fields.
14.3.5 UART Command Registers (UCRn)
The U AR T command registers (UCRn), Figure 14-6, supply commands to the U AR T. Only
multiple commands that do not conflict can be specified in a single write to a UCRn. For
example, RESET TRANSMITTER and ENABLE TRANSMITTER cannot be specified in one
command.
Table 14-6 describes UCRn fields and commands. Examples in Section 14.5.2,
“Transmitter and Receiver Operating Modes,” show how these commands are used.
Table 14-5. UCSRn Field Descriptions
Bits Name Description
7–4 RCS Receiver clock select. Selects the clock source for the receiver channel.
1101 Prescaled BCLKO
1110 TIN divided by 16
1111 TIN
3–0 TCS Transmitter clock select. Selects the clock source for the transmitter channel.
1101 Prescaled BCLKO
1110 TIN divided by 16
1111 TIN
76 43210
Field —MISC TC RC
Reset 0000_0000
R/W Write only
Address MBAR + 0x1C8, 0x208
Figure 14-6. UART Command Register (UCRn)
Table 14-6. UCRn Field Descriptions
Bits Value Command Description
7——Reserved, should be cleared.
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14-10 MCF5307 User’s Manual
Register Descriptions
6–4 MISC Field (This field selects a single command.)
000 NO COMMAND —
001 RESET MODE
REGISTER POINTER Causes the mode register pointer to point to UMR1n.
010 RESET RECEIVER Immediately disables the receiv er , clears USRn[FFULL,RxRDY], and reinitializes
the receiver FIFO pointer. No other registers are altered. Because it places the
receiver in a known state, use this command instead of RECEIVER DISABLE when
reconfiguring the receiver.
011 RESET
TRANSMITTER disables the transmitter and clears USRn[TxEMP,TxRDY]. No other registers
are altered. Because it places the transmitter in a known state, use this
command instead of TRANSMITTER DISABLE when reconfiguring the transmitter.
100 RESET ERROR
STATUS lears USRn[RB,FE,PE,OE]. Also used in block mode to clear all error bits after a
data block is received.
101 RESET BREAK–
CHANGE INTERRUPT Clears the delta break bit, UISRn[DB].
110 START BREAK Forces TxD low. If the transmitter is empty, the break may be delayed up to one
bit time. If the transmitter is active, the break starts when character transmission
completes. The break is delayed until any character in the transmitter shift
register is sent. Any character in the transmitter holding register is sent after the
break. The transmitter must be enabled for the command to be accepted. This
command ignores the state of CTS.
111 STOP BREAK Causes TxD to go high (mark) within two bit times. Any characters in the
transmitter buffer are sent.
3–2TC Field (This field selects a single command)
00 NO ACTION TAKEN Causes the transmitter to stay in its current mode: if the transmitter is enabled, it
remains enabled; if the transmitter is disabled, it remains disabled.
01 TRANSMITTER
ENABLE Enables operation of the channel’s transmitter. USRn[TxEMP,TxRDY] are set. If
the transmitter is already enabled, this command has no effect.
10 TRANSMITTER
DISABLE Terminates transmitter operation and clears USRn[TxEMP,TxRD Y]. If a char acter
is being sent when the transmitter is disabled, tr ansmission completes before the
transmitter becomes inactiv e. If the tr ansmitter is already disabled, the command
has no effect.
11 —Reserved, do not use.
Table 14-6. UCRn Field Descriptions (Continued)
Bits Value Command Description
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Chapter 14. U ART Modules 14-11
Register Descriptions
14.3.6 UART Receiver Buffers (URBn)
The receiver buffers contain one serial shift register and three receiver holding registers,
which act as a FIFO. RxD is connected to the serial shift register. The CPU reads from the
top of the stack while the receiver shifts and updates from the bottom when the shift re gister
is full (see Figure 14-20). RB contains the character in the receiver.
14.3.7 UART Transmitter Buffers (UTBn)
The transmitter buffers consist of the transmitter holding register and the transmitter shift
register. The holding register accepts characters from the bus master if channel’s
USRn[TxRDY] is set. A write to the transmitter buffer clears TxRDY, inhibiting any more
characters until the shift register can accept more data. When the shift register is empty, it
checks if the holding register has a v alid character to be sent (TxRD Y = 0). If there is a valid
character , the shift re gister loads it and sets USRn[TxRDY] again. Writes to the transmitter
buffer when the channel’s TxRDY = 0 and when the transmitter is disabled have no effect
on the transmitter buffer.
Figure 14-8 shows UTB0. TB contains the character in the transmitter buffer.
1–0RC (This field selects a single command)
00 NO ACTION TAKEN Causes the receiver to stay in its current mode. If the receiver is enabled, it
remains enabled; if disabled, it remains disabled.
01 RECEIVER ENABLE If the UART module is not in multidrop mode (UMR1n[PM] ≠ 11), RECEIVER
ENABLE enables the channel's receiv er and f orces it into search-for-start-bit state.
If the receiver is already enabled, this command has no effect.
10 RECEIVER DISABLE Disables the receiver immediately. Any character being received is lost. The
command does not affect receiver status bits or other control registers. If the
U ART module is prog rammed f or local loop-back or m ultidrop mode, the receiv er
operates even though this command is selected. If the receiver is already
disabled, the command has no effect.
11 —Reserved, do not use.
7 0
Field RB
Reset 0000_0000
R/W Read only
Address MBAR + 0x1CC,0x20C
Figure 14-7. UART Receiver Buffer (URB0)
Table 14-6. UCRn Field Descriptions (Continued)
Bits Value Command Description
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14-12 MCF5307 User’s Manual
Register Descriptions
14.3.8 UART Input Por t Change Registers (UIPCRn)
The input port change registers (UIPCRn), Figure 14-9, hold the current state and the
change-of-state for CTS.
Table 14-7 describes UIPCRn fields.
14.3.9 UART Auxiliary Control Register (UACRn)
The UART auxiliary control registers (UACRn), Figure 14-7, control the input enable.
7 0
Field TB
Reset 0000_0000
R/W Write only
Address MBAR + 0x1CC,0x20C
Figure 14-8. UART Transmitter Buffer (UTB0)
7 543 10
Field —COS 111 CTS
Reset 0000 0 11 CTS
R/W Read only
Address MBAR + 0x1D0 (UIPCR0), 0x210 (UIPCR1)
Figure 14-9. UART Input Port Change Register (UIPCRn)
Table 14-7. UIPCRn Field Descriptions
Bits Name Description
7–5—Reserved, should be cleared.
4 COS Change of state (high-to-low or low-to-high transition).
0 No change-of-state since the CPU last read UIPCRn. Reading UIPCRn clears UISRn[COS].
1 A change-of-state longer than 25–50 µs occurred on the CTS input. UA CRn can be prog rammed to
generate an interrupt to the CPU when a change of state is detected.
3–1—Reserved, should be cleared.
0 CTS Current state. Starting two serial clock periods after reset, CTS reflects the state of CTS. If CTS is
detected asserted at that time, COS is set, which initiates an interrupt if UACRn[IEC] is enabled.
0 The current state of the CTS input is asserted.
1 The current state of the CTS input is negated.
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Chapter 14. U ART Modules 14-13
Register Descriptions
Table 14-8 describes UACRn fields.
14.3.10 UART Interrupt Status/Mask Registers
(UISRn/UIMRn)
The UART interrupt status registers (UISRn), Figure 14-11, provide status for all potential
interrupt sources. UISRn contents are masked by UIMRn. If corresponding UISRn and
UIMRn bits are set, the internal interrupt output is asserted. If a UIMRn bit is cleared, the
state of the corresponding UISRn bit has no effect on the output.
NOTE:
True status is provided in the UISRn regardless of UIMRn
settings. UISRn is cleared when the UART module is reset.
Table 14-9 describes UISRn and UIMRn fields.
710
Field —IEC
Reset 0000_0000
R/W Write only
Address MBAR + 0x1D0 (UACR0), 0x210 (UACR1)
Figure 14-10. UART Auxiliary Control Register (UACRn)
Table 14-8. UACRn Field Descriptions
Bits Name Description
7–1—Reserved, should be cleared.
0 IEC Input enable control.
0 Setting the corresponding UIPCRn bit has no effect on UISRn[COS].
1 UISRn[COS] is set and an interrupt is generated when the UIPCRn[COS] is set by an external
transition on the CTS input (if UIMRn[COS] = 1).
76 32 1 0
Field COS —DB FFULL/RxRDY TxRDY
Reset 0000_0000
R/W Read only for status, write only for mask.
Address MBAR + 0x1D4 (UISR0), 0x214 (UISR1); MBAR + 0x1D4 (UIMR0), 0x214 (UIMR1)
Figure 14-11. UART Interrupt Status/Mask Registers (UISRn/UIMRn)
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14-14 MCF5307 User’s Manual
Register Descriptions
14.3.11 UART Divider Upper/Lower Registers (UDUn/UDLn)
The UDUn registers (formerly called UBG1n) holds the MSB, and the UDLn registers
(formerly UBG2n) hold the LSB of the preload value. UDUn and UDLn concatenate to
provide a divider to BCLKO for transmitter/receiver operation, as described in
Section 14.5.1.2.1, “BCLKO Baud Rates.”
NOTE:
The minimum v alue that can be loaded on the concatenation of
UDUn with UDLn is 0x0002. Both UDUn and UDLn are
write-only and cannot be read by the CPU.
Table 14-9. UISRn/UIMRn Field Descriptions
Bits Name Description
7 COS Change-of-state.
0 UIPCRn[COS] is not selected.
1 Change-of-state occurred on CTS and was programmed in UACRn[IEC] to cause an interrupt.
6–3—Reserved, should be cleared.
2 DB Delta break.
0 No new break-change condition to report. Section 14.3.5, “UART Command Registers (UCRn),”
describes the RESET BREAK-CHANGE INTERRUPT command.
1 The receiver detected the beginning or end of a received break.
1 FFULL/
RxRDY RxRDY (receiver ready) if UMR1n[FFULL/RxRDY] = 0; FIFO full (FFULL) if UMR1n[FFULL/RxRDY]
= 1. Duplicate of USRn[FFULL/RxRDY]. If FFULL is enabled for UART0 or UART1, DMA channels 2
or 3 are respectively interrupted when the FIFO is full.
0 TxRDY Transmitter ready. This bit is the duplication of USRn[TxRDY].
0 The transmitter holding register was loaded by the CPU or the transmitter is disabled. Characters
loaded into the transmitter holding register when TxRDY = 0 are not sent.
1 The transmitter holding register is empty and ready to be loaded with a character.
7 0
Field Divider MSB
Reset 0000_0000
R/W R/W
Address MBAR + 0x1D8 (UDU0), 0x218 (UDU1)
Figure 14-12. UART Divider Upper Register (UDUn)
7 0
Field Divider LSB
Reset 0000_0000
R/W R/W
Address MBAR + 0x1DC (UDL0), 0x21C (UDL1)
Figure 14-13. UART Divider Lower Register (UDLn)
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Chapter 14. U ART Modules 14-15
Register Descriptions
14.3.12 UART Interrupt Vector Register (UIVRn)
The UIVRn, Figure 14-14, contain the 8-bit internal interrupt vector number (IVR).
Table 14-10 describes UIVRn fields.
14.3.13 UART Input Por t Register (UIPn)
The UART input port registers (UIPn), Figure 14-15, show the current state of the CTS
input.
Table 14-11 describes UIPn fields.
14.3.14 UART Output Por t Command Registers
(UOP1n/UOP0n)
In U AR T mode, the RTS output can be asserted by writing a 1 to UOP1n[R TS] and neg ated
by writing a 1 to UOP0n[RTS]. See Figure 14-16.
7 0
Field IVR
Reset 0000_1111
R/W R/W
Address MBAR + 0x1F0 (UIVR0), 0x230 (UIVR1)
Figure 14-14. UART Interrupt Vector Register (UIVRn)
Table 14-10. UIVRn Field Descriptions
Bits Name Description
7–0 IVR Interrupt vector. Indicates the vector number where the address of the exception handler for the
specified interrupt is located. UIVRn is reset to 0x0F, indicating an uninitialized interrupt condition.
710
Field —CTS
Reset 1111_1111
R/W Read only
Address MBAR + 0x1F4 (UIP0), 0x234 (UIP1)
Figure 14-15. UART Input Port Register (UIPn)
Table 14-11. UIPn Field Descriptions
Bits Name Description
7–1—Reserved, should be cleared.
0 CTS Current state. The CTS value is latched and reflects the state of the input pin when UIPn is read.
Note: This bit has the same function and value as UIPCRn[RTS].
0 The current state of the CTS input is logic 0.
1 The current state of the CTS input is logic 1.
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14-16 MCF5307 User’s Manual
UART Module Signal Definitions
Table 14-12 describes UOP1 fields.
14.4 UART Module Signal Definitions
Figure 14-17 shows both the external and internal signal groups.
Figure 14-17. UART Block Diagram Showing External and Internal Interface Signals
An internal interrupt request signal (IRQ) is provided to notify the interrupt controller of an
interrupt condition. The output is the logical NOR of unmasked UISRn bits. The interrupt
le vel of a U ART module is programmed in the interrupt controller in the system integration
module (SIM). The UART can use the autovector for the programmed interrupt level or
supply the vector from the UIVRn when the UART interrupt is acknowledged.
710
Field —RTS
Reset 0000_0000
R/W Write only
Addr UART0: MBAR + 0x1F8 (UOP1), 0x1FC (UOP0); UART1 0x238 (UOP1), 0x23C (UOP0)
Figure 14-16. UART Output Port Command Register (UOP1/UOP0)
Table 14-12. UOP1/UOP0 Field Descriptions
Bits Name Description
7–1—Reserved, should be cleared.
0 RTS Output port parallel output. Controls assertion (UOP1)/negation (UOP0) of RTS output.
0 Not affected.
1 Asserts RTS (UOP1). Negates RTS (UOP0).
Internal Four-Character
Receive Buffer
Two-Character
Transmit Buffer
Input Port
Output Port
Interface
UART Module
Address Bus
Control
CTS
RTS
RxD
TxD
Control
Logic
or
External Clock (TIN)
Internal Bus
Data
to CPU
IRQ
To Interrupt
Controller
(SIM)
External
Interface
Signals
BCLKO Clock Source
Generator
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Chapter 14. U ART Modules 14-17
UART Module Signal Definitions
The interrupt level, priority, and auto-vectoring capability is programmed in SIM register
ICR4 for UART0 and ICR5 for UART1. See Section 9.2.1, “Interrupt Control Registers
(ICR0–ICR9).”
Note that the UARTs can also automatically transfer data by using the DMA rather than
interrupting the core. When UIMR[FFULL] is 1 and a receiver’s FIFO is full, it can send
an interrupt to a DMA channel so the FIFO data can be transferred to memory. Note also
that UART0 and UART1’s interrupt requests are connected to DMA channel 2 and
channel 3, respectively.
Table 14-13 briefly describes the UART module signals.
NOTE:
The terms ‘assertion’ and ‘negation’ are used to avoid
confusion between active-low and active-high signals.
‘Asserted’ indicates that a signal is active, independent of the
voltage level; ‘negated’ indicates that a signal is inactive.
Figure 14-18 shows a signal configuration for a UART/RS-232 interface.
Figure 14-18. UART/RS-232 Interface
Table 14-13. UART Module Signals
Signal Description
Transmitter
Serial Data
Output (TxD)
TxD is held high (mark condition) when the transmitter is disabled, idle, or operating in the local
loop-back mode. Data is shifted out on TxD on the falling edge of the clock source, with the least
significant bit (lsb) sent first.
Receiver
Serial Data
Input (RxD)
Data received on RxD is sampled on the rising edge of the clock source, with the lsb received first.
Clear-to-
Send (CTS) This input can generate an interrupt on a change of state.
Request-to-
Send (RTS) This output can be programmed to be negated or asserted automatically by either the receiver or the
transmitter. When connected to a transmitter’s CTS, RTS can control serial data flow.
RTS
DO2
DI1
CTS
TxD
RxD
DI2
DO1
RS-232 TransceiverUART
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14-18 MCF5307 User’s Manual
Operation
14.5 Operation
This section describes operation of the clock source generator, transmitter, and receiver.
14.5.1 Transmitter/Receiver Clock Source
BCLKO serves as the basic timing reference for the clock source generator logic, which
consists of a clock generator and a programmable 16-bit divider dedicated to the UART.
The clock generator cannot produce standard baud rates if BCLKO is used, so the 16-bit
divider should be used.
14.5.1.1 Programmable Divider
As Figure 14-19 shows, the UART transmitter and receiver can use the following clock
sources:
• An external clock signal on the TIN pin that can be divided by 16. When not divided,
TIN provides a synchronous clock mode; when divided by 16, it is asynchronous.
• BCLKO supplies an asynchronous clock source that is divided by 32 and then
di vided by the 16-bit v alue programmed in UDUn and UDLn. See Section 14.3.11,
“UART Divider Upper/Lower Registers (UDUn/UDLn).”
The choice of TIN or BCLKO is programmed in the UCSR.
Figure 14-19. Clocking Source Diagram
NOTE:
If TIN is a clocking source for either the timer or UART, the
timer module cannot use TIN for timer capture.
UART
On-Chip
TIN
x1
Prescaler
x16
Prescaler
Clock
Generator 16-Bit
Divider x32
Prescaler
TIN
Clocking sources programmed in UCSR
Timer Module
TOUT
TIN
TxD
RxD
Tx
Rx
Rx Buffer
Tx Buffer
BCLKO
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Chapter 14. U ART Modules 14-19
Operation
14.5.1.2 Calculating Baud Rates
The following sections describe how to calculate baud rates.
14.5.1.2.1 BCLKO Baud Rates
When BCLKO is the UART clocking source, it goes through a divide-by-32 prescaler and
then passes through the 16-bit divider of the concatenated UDUn and UDLn registers.
Using a 45-MHz BCLKO, the baud-rate calculation is as follows:
let baud rate = 9600, then
therefore UDU = 0x00 and UDL = 0x92.
14.5.1.2.2 External Clock
An external source clock (TIN) can be used as is or divided by 16.
14.5.2 Transmitter and Receiver Operating Modes
Figure 14-20 is a functional block diagram of the transmitter and receiver showing the
command and operating registers, which are described generally in the following sections
and described in detail in Section 14.3, “Register Descriptions.”
Baudrate 45MHz
32 divider×[]
------------------------------------=
Divider 45MHz
32 9600×[]
----------------------------- 146 decimal()0092 hexadecimal()== =
Baudrate Externalclockfrequency
16or1
---------------------------------------------------------------------=
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14-20 MCF5307 User’s Manual
Operation
Figure 14-20. Transmitter and Receiver Functional Diagram
Receiver Shift Register
UART Command Register (UCR0) W
UART Status Register (USR0) R
Transmitter Shift Register
UART Mode Register 1 (UMR1) R/W
UART Mode Register 2 (UMR2) R/W
Transmitter Holding Register W
Receiver Holding Register 3
Receiver Holding Register 2
Receiver Holding Register 1 R
UART Receive
UART
Buffer (URB0)
(4 Registers)
UART0
External
Interface
RXD
TXD
Transmitter Buffer
(UTB0)
(2 Registers)
FIFO
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Chapter 14. U ART Modules 14-21
Operation
14.5.2.1 Transmitting
The transmitter is enabled through the UART command register (UCRn). When it is ready
to accept a character , the U ART sets USRn[TxRD Y]. The transmitter converts parallel data
from the CPU to a serial bit stream on TxD. It automatically sends a start bit followed by
the programmed number of data bits, an optional parity bit, and the programmed number
of stop bits. The lsb is sent first. Data is shifted from the transmitter output on the falling
edge of the clock source.
After the stop bits are sent, if no new character is in the transmitter holding register , the TxD
output remains high (mark condition) and the transmitter empty bit, USRn[TxEMP], is set.
T ransmission resumes and TxEMP is cleared when the CPU loads a new character into the
UART transmitter buffer (UTBn). If the transmitter receives a disable command, it
continues until any character in the transmitter shift register is completely sent.
If the transmitter is reset through a software command, operation stops immediately (see
Section 14.3.5, “UART Command Registers (UCRn)”). The transmitter is reenabled
through the UCRn to resume operation after a disable or software reset.
If the clear-to-send operation is enabled, CTS must be asserted for the character to be
transmitted. If CTS is negated in the middle of a transmission, the character in the shift
register is sent and TxD remains in mark state until CTS is reasserted. If the transmitter is
forced to send a continuous low condition by issuing a SEND BREAK command, the
transmitter ignores the state of CTS.
If the transmitter is programmed to automatically negate RTS when a message transmission
completes, RTS must be asserted manually before a message is sent. In applications in
which the transmitter is disabled after transmission is complete and RTS is appropriately
programmed, RTS is negated one bit time after the character in the shift register is
completely transmitted. The transmitter must be manually reenabled by reasserting RTS
before the next message is to be sent.
Figure 14-21 shows the functional timing information for the transmitter.
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14-22 MCF5307 User’s Manual
Operation
Figure 14-21. Transmitter Timing Diagram
14.5.2.2 Receiver
The receiver is enabled through its UCRn, as described in Section 14.3.5, “UART
Command Registers (UCRn).” Figure 14-22 shows receiver functional timing.
C1
1
C2 C3 Break C4 C6
TxD
Transmitter
Enabled
USRn[TxRDY]
W
2
WWWWWWW
CTS
3
RTS
4
Manually asserted
by
BIT
-
SET
command Manually
asserted
Start
break C5
not
transmitted
C6C4 Stop
break
C3C2C1
1
C1 in transmission
3
UMR2n[TxCTS] = 1
1
Cn = transmit characters
2
W = write
4
UMR2n
[TxRTS] = 1
internal
module
select
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Chapter 14. U ART Modules 14-23
Operation
Figure 14-22. Receiver Timing
When the recei ver detects a high-to-low (mark-to-space) transition of the start bit on RxD,
the state of RxD is sampled each 16× clock for eight clocks, starting one-half clock after
the transition (asynchronous operation) or at the next rising edge of the bit time clock
(synchronous operation). If RxD is sampled high, the start bit is invalid and the search for
the valid start bit begins again.
If RxD is still lo w, a valid start bit is assumed and the recei ver continues sampling the input
at one-bit time interv als, at the theoretical center of the bit, until the proper number of data
bits and parity, if any, is assembled and one stop bit is detected. Data on the RxD input is
sampled on the rising edge of the programmed clock source. The lsb is received first. The
data is then transferred to a receiver holding register and USRn[RxRDY] is set. If the
character is less than eight bits, the most significant unused bits in the receiver holding
register are cleared.
After the stop bit is detected, the recei ver immediately looks for the next start bit. Ho we ver ,
if a non-zero character is received without a stop bit (framing error) and RxD remains low
for one-half of the bit period after the stop bit is sampled, the receiver operates as if a new
start bit were detected. Parity error, framing error, overrun error, and received break
conditions set the respective PE, FE, OE, RB error and break flags in the USRn at the
received character boundary and are valid only if USRn[RxRDY] is set.
If a break condition is detected (RxD is lo w for the entire character including the stop bit),
a character of all zeros is loaded into the receiver holding register (RHR) and
USRn[RB,RxRDY] are set. RxD must return to a high condition for at least one-half bit
time before a search for the next start bit begins.
C1 C2 C4 C6 C7 C8
C3 C5
C6, C7, and C8 will be los
t
(C2)
Status
Data (C3)
Status
Data (C4)
Status
Data
C5 will
be lost
Reset by
command
TxD
Receiver
Enabled
USRn
[RxRDY]
Overrun
RTS4
internal
module
select
USRn
[FFULL]
(C1)
Status
Data
USRn
[OE]
Automatically asserted
when ready to receive
Manually asserted first time,
automatically negated if overrun occurs
UOP0[RTS] = 1
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14-24 MCF5307 User’s Manual
Operation
The receiver detects the beginning of a break in the middle of a character if the break
persists through the next character time. If the break be gins in the middle of a character , the
receiver places the damaged character in the Rx FIFO stack and sets the corresponding
USRn error bits and USRn[RxRDY]. Then, if the break lasts until the next character time,
the receiver places an all-zero character into the Rx FIFO and sets USRn[RB,RxRDY].
14.5.2.3 FIFO Stack
The FIFO stack is used in the UART’s receiver buffer logic. The stack consists of three
receiver holding registers. The receive buffer consists of the FIFO and a receiver shift
register connected to the RxD (see Figure 14-20). Data is assembled in the receiver shift
register and loaded into the top empty recei v er holding re gister position of the FIFO. Thus,
data flowing from the receiver to the CPU is quadruple-buffered.
In addition to the data byte, three status bits, parity error (PE), framing error (FE), and
received break (RB), are appended to each data character in the FIFO; OE (overrun error)
is not appended. By programming the ERR bit in the channel’s mode register (UMR1n),
status is provided in character or block modes.
USRn[RxRD Y] is set when at least one character is a vailable to be read by the CPU. A read
of the receiver buffer produces an output of data from the top of the FIFO stack. After the
read cycle, the data at the top of the FIFO stack and its associated status bits are popped and
the recei v er shift register can add new data at the bottom of the stack. The FIFO-full status
bit (FFULL) is set if all three stack positions are filled with data. Either the RxRDY or
FFULL bit can be selected to cause an interrupt.
The two error modes are selected by UMR1n[ERR] as follows:
• In character mode (UMR1n[ERR] = 0, status is gi ven in the USRn for the character
at the top of the FIFO.
• In block mode, the USRn shows a logical OR of all characters reaching the top of
the FIFO stack since the last RESET ERROR STATUS command. Status is updated as
characters reach the top of the FIFO stack. Block mode offers a data-reception speed
adv antage where the softw are overhead of error-checking each character cannot be
tolerated. Ho wever , errors are not detected until the check is performed at the end of
an entire message—the faulting character is not identified.
In either mode, reading the USRn does not af fect the FIFO. The FIFO is popped only when
the recei ve b uffer is read. The USRn should be read before reading the receiv e b uffer. If all
three recei ver holding re gisters are full, a ne w character is held in the receiv er shift re gister
until space is available. Howev er, if a second new character is receiv ed, the contents of the
the character in the recei ver shift register is lost, the FIFOs are unaf fected, and USRn[OE]
is set when the receiver detects the start bit of the new overrunning character.
To support flow control, the recei ver can be programmed to automatically ne gate and assert
RTS, in which case the receiv er automatically negates R TS when a v alid start bit is detected
and the FIFO stack is full. The receiver asserts RTS when a FIFO position becomes
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Chapter 14. U ART Modules 14-25
Operation
available; therefore, overrun errors can be prevented by connecting RTS to the CTS input
of the transmitting device.
NOTE:
The receiver can still read characters in the FIFO stack if the
receiver is disabled. If the recei ver is reset, the FIFO stack, R TS
control, all recei v er status bits, and interrupt requests are reset.
No more characters are recei ved until the recei ver is reenabled.
14.5.3 Looping Modes
The U AR T can be configured to operate in various looping modes as sho wn in Figure 14-22
on page 14-23. These modes are useful for local and remote system diagnostic functions.
The modes are described in the following paragraphs and in Section 14.3, “Register
Descriptions.”
The UART’s transmitter and receiver should be disabled when switching between modes.
The selected mode is activated immediately upon mode selection, regardless of whether a
character is being received or transmitted.
14.5.3.1 Automatic Echo Mode
In automatic echo mode, sho wn in Figure 14-23, the U ART automatically resends receiv ed
data bit by bit. The local CPU-to-receiver communication continues normally, but the
CPU-to-transmitter link is disabled. In this mode, received data is clocked on the receiver
clock and resent on TxD. The receiver must be enabled, but the transmitter need not be.
Figure 14-23. Automatic Echo
Because the transmitter is inacti ve, USRn[TxEMP,TxRDY] are inactive and data is sent as
it is recei ved. Recei ved parity is check ed but is not recalculated for transmission. Character
framing is also checked, but stop bits are sent as they are received. A received break is
echoed as received until the next valid start bit is detected.
14.5.3.2 Local Loop-Back Mode
Figure 14-24 shows how TxD and RxD are internally connected in local loop-back mode.
This mode is for testing the operation of a local UART module channel by sending data to
the transmitter and checking data assembled by the receiver to ensure proper operations.
CPU Disabled Disabled
RxD Input
TxD Input
Tx
Rx
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14-26 MCF5307 User’s Manual
Operation
Figure 14-24. Local Loop-Back
Features of this local loop-back mode are as follows:
• Transmitter and CPU-to-receiver communications continue normally in this mode.
• RxD input data is ignored
• TxD is held marking
• The receiver is clocked by the transmitter clock. The transmitter must be enabled,
but the receiver need not be.
14.5.3.3 Remote Loop-Back Mode
In remote loop-back mode, shown in Figure 14-25, the channel automatically transmits
received data bit by bit on the TxD output. The local CPU-to-transmitter link is disabled.
This mode is useful in testing receiver and transmitter operation of a remote channel. For
this mode, the transmitter uses the receiver clock.
Because the recei ver is not acti v e, receiv ed data cannot be read by the CPU and error status
conditions are inactive. Received parity is not checked and is not recalculated for
transmission. Stop bits are sent as they are recei v ed. A received break is echoed as recei v ed
until the next valid start bit is detected.
Figure 14-25. Remote Loop-Back
14.5.4 Multidrop Mode
Setting UMR1n[PM] programs the UART to operate in a wake-up mode for multidrop or
multiprocessor applications. In this mode, a master can transmit an address character
followed by a block of data characters targeted for one of up to 256 slave stations.
Although slave stations have their channel receivers disabled, they continuously monitor
the master’s data stream. When the master sends an address character, the slave receiver
channel notifies its respective CPU by setting USRn[RxRDY] and generating an interrupt
(if programmed to do so). Each slav e station CPU then compares the recei ved address to its
station address and enables its recei ver if it wishes to receiv e the subsequent data characters
or block of data from the master station. Slave stations not addressed continue monitoring
the data stream. Data fields in the data stream are separated by an address character. After
CPU Disabled
Disabled RxD Input
TxD Input
Tx
Rx
CPU Disabled
Disabled RxD Input
TxD Input
Tx
Rx
Disabled
Disabled
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Chapter 14. U ART Modules 14-27
Operation
a slave receives a block of data, its CPU disables the receiver and repeats the
process.Functional timing information for multidrop mode is shown in Figure 14-26.
Figure 14-26. Multidrop Mode Timing Diagram
A character sent from the master station consists of a start bit, a programmed number of
data bits, an address/data (A/D) bit flag, and a programmed number of stop bits. A/D = 1
indicates an address character; A/D = 0 indicates a data character. The polarity of A/D is
selected through UMR1n[PT]. UMR1n should be programmed before enabling the
transmitter and loading the corresponding data bits into the transmit buffer.
In multidrop mode, the recei ver continuously monitors the recei v ed data stream, regardless
of whether it is enabled or disabled. If the receiver is disabled, it sets the RxRDY bit and
loads the character into the recei ver holding re gister FIFO stack pro vided the recei v ed A/D
bit is a one (address tag). The character is discarded if the received A/D bit is zero (data
tag). If the receiver is enabled, all received characters are transferred to the CPU through
the receiver holding register stack during read operations.
In either case, the data bits are loaded into the data portion of the stack while the A/D bit is
loaded into the status portion of the stack normally used for a parity error (USRn[PE]).
Framing error, overrun error, and break detection operate normally. The A/D bit takes the
place of the parity bit; therefore, parity is neither calculated nor checked. Messages in this
ADD1TxD
Transmitter
Enabled
USRn
[TxRDY]
C0 ADD211
internal
module
select
A/D A/D A/D
ADD1RxD
Receiver
Enabled
USRn
[RxRDY]
C0 ADD211
internal
module
select
A/D A/D A/D
0
A/D
0
A/D
(C0)
Status Data (ADD 2)
Status DataADD 1
Peripheral Station
Master Station
UMR1n[PM] = 11
UMR1n[PM] = 11
UMR1n[PT] = 1 ADD 1
UMR1n[PT] = 0
C0 UMR1n[PT] = 2
ADD 2
UMR1n[PM] = 11
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14-28 MCF5307 User’s Manual
Operation
mode may still contain error detection and correction information. One way to provide error
detection, if 8-bit characters are not required, is to use software to calculate parity and
append it to the 5-, 6-, or 7-bit character.
14.5.5 Bus Operation
This section describes bus operation during read, write, and interrupt acknowledge cycles
to the UART module.
14.5.5.1 Read Cycles
The UART module responds to reads with byte data. Reserved registers return zeros.
14.5.5.2 Write Cycles
The UART module accepts write data as bytes. Write cycles to read-only or reserved
registers complete normally without exception processing, but data is ignored.
NOTE:
The UART module is accessed by the CPU with zero wait
states, as BCLKO is used for the UART module.
14.5.5.3 Interrupt Acknowledge Cycles
The UART module supplies the interrupt vector in response to a UART IACK cycle. If
UIVRn is not initialized to provide a vector number, a spurious exception is taken if an
interrupt is generated. This w orks in conjunction with the interrupt controller , which allows
a programmable priority level.
14.5.6 Programming
The software flowchart, Figure 14-27, consists of the following:
• U AR T module initialization—These routines consist of SINIT and CHCHK (sheets
1 and 2). Before SINIT is called at system initialization, the calling routine allocates
2 words on the system stack. On return to the calling routine, SINIT passes UART
status data on the stack. If SINIT finds no errors, the transmitter and receiver are
enabled. SINIT calls CHCHK to perform the checks. When called, SINIT places the
UART in local loop-back mode and checks for the following errors:
— Transmitter never ready
— Receiver never ready
— Parity error
— Incorrect character received
• I/O driver routine—This routine (sheets 4 and 5) consists of INCH, the terminal
input character routine which gets a character from the receiver , and OUTCH, which
sends a character to the transmitter.
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Chapter 14. U ART Modules 14-29
Operation
• Interrupt handling—Consists of SIRQ (sheet 4), which is executed after the UART
module generates an interrupt caused by a change-in-break (beginning of a break).
SIRQ then clears the interrupt source, waits for the next change-in-break interrupt
(end of break), clears the interrupt source again, then returns from exception
processing to the system monitor.
14.5.6.1 UART Module Initialization Sequence
NOTE:
UART module registers can be accessed by word or byte
operations, but only data byte D[7:0] is valid.
Table 14-14 shows the UART module initialization sequence.
Table 14-14. UART Module Initialization Sequence
Register Setting
UCRnReset the receiver and transmitter.
Reset the mode pointer (MISC[2–0] = 0b001).
UIVRnProgram the vector number for a UART module interrupt.
UIMRnEnable the preferred interrupt sources.
UACRnInitialize the input enable control (IEC bit).
UCSRnSelect the receiver and transmitter clock. Use timer as source if required.
UMR1nIf preferred, program operation of receiver ready-to-send (RxRTS bit).
Select receiver-ready or FIFO-full notification (RxRDY/FFULL bit).
Select character or block error mode (ERR bit).
Select parity mode and type (PM and PT bits).
Select number of bits per character (B/Cx bits).
UMR2nSelect the mode of operation (CMx bits).
If preferred, program operation of transmitter ready-to-send (TxRTS).
If preferred, program operation of clear-to-send (TxCTS bit).
Select stop-bit length (SBx bits).
UCR
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14-30 MCF5307 User’s Manual
Operation
Figure 14-27. UART Mode Programming Flowchart (Sheet 1 of 5)
SERIAL MODULE
INITIATE:
CHANNEL
INTERRUPTS
SAVE CHANNEL
STATUS
ANY
ERRORS
?
ENABLE RECEIVER
ASSERT
REQUEST TO SEND
RETURN
SINIT
CHK1
ENABLA
Y
N
SINITR
CALL CHCHK
ENABLE
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Chapter 14. U ART Modules 14-31
Operation
Figure 14-27. UART Mode Programming Flowchart (Sheet 2 of 5)
Y
N
CHCHK
PLACE CHANNEL IN
LOCAL LOOPBACK
MODE
ENABLE
TRANSMITTER CLEAR
STATUS WORD
IS
TRANSMITTER
READY
?
WAITED
TOO LONG
?
WAITED
TOO LONG
?
N
Y
SEND CHARACTER
TO TRANSMITTER
HAS
CHARACTER BEEN
RECEIVED
?
CHCHK
TxCHK
SNDCHR
RxCHK N
YN
SET TRANSMITTER-
NEVER-READY FLAG
SET RECEIVER-
NEVER-READY FLAG
AB
Y
Y
N
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14-32 MCF5307 User’s Manual
Operation
Figure 14-27. UART Mode Programming Flowchart (Sheet 3 of 5)
B
Y
N
N
A
Y
AB
Y
N
RETURN
HAVE
FRAMING ERROR
?
SET FRAMING
ERROR FLAG
HAVE
PARITY ERROR
?
SET PARITY
ERROR FLAG
GET CHARACTER
FROM RECEIVER
SAME AS
TRANSMITTED
CHARACTER
?
SET INCORRECT
CHARACTER FLAG
DISABLE
TRANSMITTER
RESTORE
TO ORIGINAL MODE
FRCHK RSTCHN
PRCHK
CHRCHK
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Chapter 14. U ART Modules 14-33
Operation
Figure 14-27. UART Mode Programming Flowchart (Sheet 4 of 5)
WAS
IRQ CAUSED
BY BEGINNING
OF A BREAK
?
CLEAR CHANGE-IN-
BREAK STATUS BIT
HAS
END-OF-BREAK
IRQ ARRIVED
YET
?
CLEAR CHANGE-IN-
BREAK STATUS BIT
REMOVE BREAK
CHARACTER FROM
RECEIVER FIFO
REPLACE RETURN
ADDRESS ON SYSTEM
STACK AND MONITOR
WARM START ADDRESS
RTE
SIRQR
N
Y
N
DOES
CHANNEL A
RECEIVER HAVE A
CHARACTER
?
PLACE CHARACTER
IN D0
N
Y
ABRKI1
ABRKI
Y
INCH
RETURN
SIRQ
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14-34 MCF5307 User’s Manual
Operation
Figure 14-27. UART Mode Programming Flowchart (Sheet 5 of 5)
OUTCH
N
Y
IS
TRANSMITTER
READY
?
SEND CHARACTER
TO TRANSMITTER
RETURN
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Chapter 15. Parallel P ort (General-Purpose I/O) 15-1
Chapter 15
Parallel Por t (General-Purpose I/O)
This chapter describes the operation and programming model of the parallel port pin
assignment, direction-control, and data registers. It includes a code example for setting up
the parallel port.
15.1 Parallel Por t Operation
The MCF5307 parallel port module has 16 signals, which are programmed as follows:
• The pin assignment register (PAR) selects the function of the 16 multiplexed pins.
• Port A data direction register (PADDR) determines whether pins configured as
parallel port signals are inputs or outputs.
• The Port A data register (PADAT) shows the status of the parallel port signals.
The operations of the PAR, PADDR, and PADAT are described in the following sections.
15.1.1 Pin Assignment Register (PAR)
The pin assignment register (PAR), which is part of the system integration module (SIM),
defines how each PAR bit determines each pin function, as shown in Figure 15-1.
If PP[9:8]/A[25:24] are unavailable because A[25:0] are needed for external addressing,
PP[15:10]/A[31:26] can be configured as general-purpose I/O. Table 15-1 summarizes
MCF5307 parallel port pins, described in detail in Chapter 17, “Signal Descriptions.”
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Field PAR15 PAR14 PAR13 PAR12 PAR11 PAR10 PAR9 PAR8 PAR7 PAR6 PAR5 PAR4 PAR3 PAR2 PAR1 PAR0
PAR[n] = 0PP15 PP14 PP13 PP12 PP11 PP10 PP9 PP8 PP7 PP6 PP5 PP4 PP3 PP2 PP1 PP0
PAR[n] = 1A31 A30 A29 A28 A27 A26 A25 A24 TIP DREQ0 DREQ1 TM2 TM1 TM0 TT1 TT0
Reset Determined by driving D4/ADDR_CONFIG with a 1 or 0 when RSTI negates. The system is configured as
PP[15:0] if D4 is low; otherwise alternate pin functions selected by PAR[n] = 1 are used.
R/W R/W
Address Address MBAR + 0x004
Figure 15-1. Parallel Port Pin Assignment Register (PAR)
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15-2 MCF5307 User’s Manual
Parallel Port Operation
15.1.2 Port A Data Direction Register (PADDR)
The PADDR determines the signal direction of each parallel port pin programmed as a
general-purpose I/O port in the PAR.
Table 15-2 describes PADDR fields.
15.1.3 Port A Data Register (PADAT)
The PAD AT value for inputs corresponds to the logic le v el at the pin; for outputs, the v alue
corresponds to the logic level driven onto the pin. Note the following:
• PADAT has no effect on pins not configured for general-purpose I/O.
• PADAT settings do not affect inputs. PAD AT bit values determine the corresponding
logic levels of pins configured as outputs.
Table 15-1. Parallel Port Pin Descriptions
Pin Description
PP[15:8]/
A[31:24] MSB of the address bus/parallel port. Programmed through PAR[15–8]. If a PAR bit is 0, the associated
pin functions as a parallel port signal. If a bit is 1, the pin functions as an address bus signal. If all pins
are address signals, as much as 4 Gbytes of memory space are available.
TIP/PP7 Transfer-in-progress output/parallel port bit 7. Programmed through PAR[7]. Assertion indicates a bus
transfer is in progress; negation indicates an idle bus cycle if the bus is still granted to the processor.
Note that TIP is held asserted on back-to-back bus cycles.
DREQ[1:0]/
PP[6:5] DMA request inputs/two bits of the parallel port. Programmed through PAR[6–5]. These inputs are
asserted by a peripheral device to request a DMA transfer.
TM[2:0]/
PP[4:2]] Transfer type outputs/parallel port bits 4–2. Programmed through PAR[4–2]. For DMA transfers, these
signals provide ac knowledge inf ormation. F or em ulation transf ers , TM[2:0] indicate user or data tr ansf er
types. For CPU space transf ers , TM[2:0] are low . For interrupt ackno wledge transfers , TM[2:0] carry the
interrupt level being acknowledged.
TT[1:0]/
PP[1:0] Transfer type outputs/parallel port bits 1–0. Programmed through PAR[1–0].
When the MCF5307 is bus master, it outputs these signals. They indicate the current bus access type.
15 0
Field PADDR
Reset 0000_0000_0000_0000
R/W R/W
Address Address MBAR + 0x244
Figure 15-2. Port A Data Direction Register (PADDR)
Table 15-2. PADDR Field Description
Bits Name Description
15–0 PADDR Data direction bits. Each data direction bit selects the direction of the signal as follows:
0 Signal is defined as an input.
1 Signal is defined as an output.
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Chapter 15. Parallel P ort (General-Purpose I/O) 15-3
Parallel Port Operation
• PADAT can be written to anytime. A read from PADAT returns values of
corresponding pins configured as general-purpose I/O in the PAR and designated as
inputs by the PADDR.
Table 15-3 shows relationships between PAD AT bits and parallel port pins when PADAT is
accessed. The effect differs when the parallel port pin is an input or output.
The following results occur when a parallel port pin is configured as an input:
• When the PADAT is read, the value returned is the logic value on the pin.
• When the PAD AT is written, the register contents are updated without affecting the
logic value on the pin.
The following results occur when a parallel port pin is configured as an output:
• When the PADAT is read, the register contents are returned and the pin is the logic
value of the register.
• When the PADAT is written, the register contents are updated and the pin is the logic
value of the register.
These relationships are also described in Table 15-3.
NOTE:
Although external devices cannot access the MCF5307’s
on-chip memories or MBAR, they can access any parallel port
module registers in the SIM.
15.1.4 Code Example
The following code example shows how to set up the parallel port. Here, PP[7:0] are
general-purpose I/O, PP[3:0] are inputs, and PP[7:4] are outputs.
15 0
Field PADAT
Reset 0000_0000_0000_0000
R/W R/W
Address Address MBAR+0x248
Figure 15-3. Port A Data Register (PADAT)
Table 15-3. Relationship between PADAT Register and Parallel Port Pin (PP)
PP Status PADAT R/W Effect on PADAT Effect on PP
Input Read Register bit value is the pin’s logic value No effect. Source of logic value
Write Register contents updated No effect on the logic value at the pin
Output Read Register contents are returned Pin is the logic value of the register bit
Write Register contents updated Pin is the logic value of the register bit
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15-4 MCF5307 User’s Manual
Parallel Port Operation
MBARx EQU 0x00010000
PAR EQU MBARx+0x004
PADDR EQU MBARx+0x244
PADAT EQU MBARx+0x248
move.l #MBARx,D0 ;because MBAR is an internal register, MBARx is used as
movec D0, MBAR ;label for the memory map address
move.w #0x00FF,D0
move.w D0,PAR ;set up the PAR. PP[7:0] set up as I/O
move.w #0x00F0,D0
move.w D0,PADDR ;set PP[7:4] as outputs; PP[3:0] as inputs
move.b #0xA0,D0
move.b D0,PADAT ;0xA0 written into PADAT; PP[7:4] being outputs,
;PP[7:4] becomes 1010; i.e. PP7, PP5 = 1 and
;PP6, PP4 = 0
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Part IV . Hardware Interface IV-i
Par t IV
Hardware Interface
Intended Audience
Part IV is intended for hardware designers who need to know the functions and electrical
characteristics of the MCF5407 interface. It includes a pinout, and both electrical and
functional descriptions of the MCF5307 signals. It also describes ho w these signals interact
to support the variety of bus operations shown in timing diagrams.
Contents
Part IV contains the following chapters:
• Chapter 16, “Mechanical Data,” provides a functional pin listing and package
diagram for the MCF5307.
• Chapter 17, “Signal Descriptions,” provides an alphabetical listing of MCF5307
signals. This chapter describes the MCF5307 signals. In particular, it shows which
are inputs or outputs, how they are multiplexed, which signals require pull-up
resistors, and the state of each signal at reset.
• Chapter 18, “Bus Operation,” describes data transfers, error conditions, bus
arbitration, and reset operations. It describes transfers initiated by the MCF5307 and
by an external bus master, and includes detailed timing diagrams showing the
interaction of signals in supported bus operations. Note that Chapter 11,
“Synchronous/Asynchronous DRAM Controller Module, ” describes DRAM c ycles.
• Chapter 19, “IEEE 1149.1 Test Access Port (JTAG),” describes configuration and
operation of the MCF5307 JTA G test implementation. It describes the use of JTAG
instructions and provides information on how to disable JTAG functionality.
• Chapter 20, “Electrical Specifications,” describes AC and DC electrical
specifications and thermal characteristics for the MCF5307. Because additional
speeds may have become available since the publication of this book, consult
Motorola’s ColdFire web page, http://www.motorola.com/coldfire, to confirm that
this is the latest information.
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IV-ii MCF5307 User’s Manual
Suggested Reading
The following literature may be helpful with respect to the topics in Part IV:
• IEEE Standard Test Access Port and Boundary-Scan Architecture
• IEEE Supplement to Standard Test Access Port and Boundary-Scan Architecture
(1149.1)
Acronyms and Abbreviations
Table IV-i describes acronyms and abbreviations used in Part IV.
Table IV-i. Acronyms and Abbreviated Terms
Term Meaning
BDM Background debug mode
BIST Built-in self test
BSDL Boundary-scan description language
DMA Direct memory access
DSP Digital signal processing
EDO Extended data output (DRAM)
GPIO
I2C Inter-integrated circuit
IEEE Institute for Electrical and Electronics Engineers
IPL Interrupt priority level
JEDEC Joint Electron Device Engineering Council
JTAG Joint Test Action Group
LSB Least-significant byte
lsb Least-significant bit
MAC Multiple accumulate unit
MBAR Memory base address register
MSB Most-significant byte
msb Most-significant bit
Mux Multiplex
PCLK Processor clock
PLL Phase-locked loop
POR Power-on reset
PQFP Plastic quad flat pack
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Part IV . Hardware Interface IV-iii
RISC Reduced instruction set computing
Rx Receive
SIM System integration module
TAP Test access port
TTL Transistor-to-transistor logic
Tx Transmit
Table IV-i. Acronyms and Abbreviated Terms (Continued)
Term Meaning
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IV-iv MCF5307 User’s Manual
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Chapter 16. Mechanical Data 16-1
Chapter 16
Mechanical Data
This chapter provides a function pin listing and package diagram for the MCF5307. See the
website [http://www.motorola.com/coldfire] for any updated information.
16.1 Package
The MCF5307 is assembled in a 208-pin, thermally enhanced plastic QFP package.
16.2 Pinout
The MCF5307 pinout is detailed in the following tables, including the primary and
secondary functions of multiplexed signals. Additional columns indicate the output drive
capability of each pin, whether it is internally synchronized, and if the signal can change
on a negative clock transition.
These tables show MCF5307 pin numbers, including signal multiplexing. Additional
columns indicate the direction, description, and output drive capability of each pin.
Table 16-1. Pins 1–52 (Left, Top-to-Bottom)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
1 VCC ——Power input —
2A0 —I/O Address bus bit 8
3A1 —I/O Address bus bit 8
4 GND ——Ground pin —
5A2 —I/O Address bus bit 8
6A3 —I/O Address bus bit 8
7 VCC ——Power input —
8A4 —I/O Address bus bit 8
9A5 —I/O Address bus bit 8
10 GND ——Ground pin —
11 A6 —I/O Address bus bit 8
12 A7 —I/O Address bus bit 8
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16-2 MCF5307 User’s Manual
Pinout
13 VCC ——Power input —
14 A8 —I/O Address bus bit 8
15 A9 —I/O Address bus bit 8
16 A10 —I/O Address bus bit 8
17 GND ——Ground pin —
18 A11 —I/O Address bus bit 8
19 A12 —I/O Address bus bit 8
20 A13 —I/O Address bus bit 8
21 VCC ——Power input —
22 A14 —I/O Address bus bit 8
23 A15 —I/O Address bus bit 8
24 A16 —I/O Address bus bit 8
25 GND ——Ground pin —
26 A17 —I/O Address bus bit 8
27 A18 —I/O Address bus bit 8
28 A19 —I/O Address bus bit 8
29 VCC ——Power input —
30 A20 —I/O Address bus bit 8
31 A21 —I/O Address bus bit 8
32 A22 —I/O Address bus bit 8
33 GND ——Ground pin —
34 A23 —I/O Address bus bit 8
35 PP8 A24 I/O Parallel port bit/Address bus bit 8
36 PP9 A25 I/O Parallel port bit/Address bus bit 8
37 VCC ——Power input —
38 PP10 A26 I/O Parallel port bit/Address bus bit 8
39 PP11 A27 I/O Parallel port bit/Address bus bit 8
40 PP12 A28 I/O Parallel port bit/Address bus bit 8
41 GND ——Ground pin —
42 PP13 A29 I/O Parallel port bit/Address bus bit 8
43 PP14 A30 I/O Parallel port bit/Address bus bit 8
44 PP15 A31 I/O Parallel port bit/Address bus bit 8
45 VCC ——Power input —
46 SIZ0 —I/O Size attribute 8
47 SIZ1 —I/O Size attribute 8
Table 16-1. Pins 1–52 (Left, Top-to-Bottom) (Continued)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
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Chapter 16. Mechanical Data 16-3
Pinout
48 GND ——Ground pin —
49 OE —O Output enable for chip selects 8
50 CS0 —O Chip select 8
51 CS1 —O Chip select 8
52 VCC ——Power input —
Table 16-2. Pins 53–104 (Bottom, Left-to-Right)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
53 GND ——Ground pin —
54 CS2 —O Chip select 8
55 CS3 —O Chip select 8
56 CS4 —O Chip select 8
57 VCC ——Power input —
58 CS5 —O Chip select 8
59 CS6 —O Chip select 8
60 CS7 —O Chip select 8
61 GND ——Ground pin —
62 AS —I/O Address strobe 8
63 R/W —I/O Read/Write 8
64 TA—I/O Transfer acknowledge 8
65 VCC ——Power input —
66 TS —I/O Transfer start 8
67 RSTI —I Reset —
68 IRQ7 —I Interrupt request —
69 GND ——Ground pin —
70 IRQ5 IRQ4 I Interrupt request —
71 IRQ3 IRQ6 I Interrupt request —
72 IRQ1 IRQ2 I Interrupt request —
73 VCC ——Power input —
74 BR —O Bus request 8
75 BD —O Bus driven 8
76 BG —I Bus grant —
77 GND ——Ground pin —
Table 16-1. Pins 1–52 (Left, Top-to-Bottom) (Continued)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
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16-4 MCF5307 User’s Manual
Pinout
78 TOUT1 —O Timer output 8
79 TOUT0 —O Timer output 8
80 TIN0 —I Timer input —
81 VCC ——Power input —
82 TIN1 —I Timer input —
83 RAS0 —O DRAM row address strobe 16
84 RAS1 —O DRAM row address strobe 16
85 GND ——Ground pin —
86 CAS0 —O DRAM column address strobe 16
87 CAS1 —O DRAM column address strobe 16
88 CAS2 —O DRAM column address strobe 16
89 VCC ——Power input —
90 CAS3 —O DRAM column address strobe 16
91 DRAMW —O DRAM write 16
92 SRAS —O SDRAM row address strobe 16
93 GND ——Ground pin —
94 SCAS —O SDRAM column address strobe 16
95 SCKE —O SDRAM clock enable 16
96 BE0 BWE0 O Byte enable/byte write enable 8
97 VCC ——Power input —
98 BE1 BWE1 O Byte enable/byte write enable 8
99 BE2 BWE2 O Byte enable/byte write enable 8
100 BE3 BWE3 O Byte enable/byte write enable 8
101 GND ——Ground pin —
102 SCL —I/OD 1Serial clock line 8
103 SDA —I/OD 1Serial data line 8
104 GND ——Ground pin —
1OD: Open-drain output
Table 16-3. Pins 105–156 (Right, Bottom-to-Top)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
105 VCC ——Power input —
106 D31 —I/O Data bus 8
Table 16-2. Pins 53–104 (Bottom, Left-to-Right) (Continued)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
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Chapter 16. Mechanical Data 16-5
Pinout
107 D30 —I/O Data bus 8
108 D29 —I/O Data bus 8
109 GND ——Ground pin —
110 D28 —I/O Data bus 8
111 D27 —I/O Data bus 8
112 D26 —I/O Data bus 8
113 VCC ——Power input —
114 D25 —I/O Data bus 8
115 D24 —I/O Data bus 8
116 D23 —I/O Data bus 8
117 GND ——Ground pin —
118 D22 —I/O Data bus 8
119 D21 —I/O Data bus 8
120 D20 —I/O Data bus 8
121 VCC ——Power input —
122 D19 —I/O Data bus 8
123 D18 —I/O Data bus 8
124 D17 —I/O Data bus 8
125 GND ——Ground pin —
126 D16 —I/O Data bus 8
127 D15 —I/O Data bus 8
128 D14 —I/O Data bus 8
129 VCC ——Power input —
130 D13 —I/O Data bus 8
131 D12 —I/O Data bus 8
132 D11 —I/O Data bus 8
133 GND ——Ground pin —
134 D10 —I/O Data bus 8
135 D9 —I/O Data bus 8
136 D8 —I/O Data bus 8
137 VCC ——Power input —
138 D7 CS_CONF2 I/O Data bus/Chip select configuration 8
139 D6 CS_CONF1 I/O Data bus/Chip select configuration 8
140 D5 CS_CONF0 I/O Data bus/Chip select configuration 8
141 GND ——Ground pin —
Table 16-3. Pins 105–156 (Right, Bottom-to-Top) (Continued)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
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16-6 MCF5307 User’s Manual
Pinout
142 D4 ADDR_CONF I/O Data bus/Address configuration 8
143 D3 FREQ1 I/O Data bus/CLKIN Frequency 8
144 D2 FREQ0 I/O Data bus/CLKIN Frequency 8
145 VCC ——Power input —
146 D1 DIVIDE1 I/O Data bus/Divide control PCLK:BCLKO 8
147 D0 DIVIDE0 I/O Data bus/Divide control PCLK:BCLKO 8
148 GND ——Ground pin —
149 DSCLK TRST I Debug serial clock/JTAG Reset —
150 TCK TCK I JTAG clock —
151 DSO TDO O Debug serial out/JTAG data out 8
152 VCC ——Power input —
153 DSI TDI I Debug serial input/JTAG data in —
154 BKPT TMS I Debug breakpoint/JTAG mode select —
155 HIZ —I High impedance override —
156 GND ——Ground pin —
Table 16-4. Pins 157–208 (Top, Right-to-Left)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
157 VCC ——Power input —
158 CTS1 —I UART1 clear-to-send —
159 RTS1 —O UART1 request-to-send 8
160 RXD1 —I UART1 receive data —
161 TXD1 —O UART1 transmit data 8
162 GND ——Ground pin —
163 CTS0 —I UART0 clear-to-send —
164 RTS0 —O UART0 request-to-send 8
165 RXD0 —I UART0 receive data —
166 TXD0 —O UART0 transmit data 8
167 VCC ——Power input —
168 EDGESEL —I SDRAM bus clock edge select —
169 GND ——Ground pin —
170 BCLKO —O Bus clock output 16
Table 16-3. Pins 105–156 (Right, Bottom-to-Top) (Continued)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
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Chapter 16. Mechanical Data 16-7
Pinout
171 VCC ——Power input —
172 RSTO—O Processor reset output 8
173 GND ——Ground pin —
174 CLKIN —I Clock input —
175 VCC ——Power input —
176 MTMOD0 —I JTAG/BDM select (Tie high or low) —
177 MTMOD1 —I Tie high or low —
178 PGND ——PLL ground pin —
179 NC —O—
180 PVCC ——Filter supply for PLL —
181 MTMOD2 —I Tie high or low —
182 MTMOD3 —I Tie high or low —
183 GND ——Ground pin —
184 PSTCLK —O Processor status clock 8
185 VCC ——Power input —
186 DDATA0 —O Debug data 8
187 DDATA1 —O Debug data 8
188 GND ——Ground pin —
189 DDATA2 —O Debug data 8
190 DDATA3 —O Debug data 8
191 VCC ——Power input —
192 PST0 —O Processor status 8
193 PST1 —O Processor status 8
194 GND ——Ground pin —
195 PST2 —O Processor status 8
196 PST3 —O Processor status 8
197 VCC ——Power input —
198 PP7 TIP I/O Parallel port bit/transfer in progress 8
199 PP6 DREQ0 I/O Parallel port bit/DMA request 8
200 PP5 DREQ1 I/O Parallel port bit/DMA request 8
201 GND ——Ground pin —
202 PP4 TM2 I/O Parallel port bit/Transfer modifier 8
203 PP3 TM1 I/O Parallel port bit/Transfer modifier 8
204 PP2 TM0 I/O Parallel port bit/Transfer modifier 8
205 VCC ——Power input —
Table 16-4. Pins 157–208 (Top, Right-to-Left) (Continued)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
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16-8 MCF5307 User’s Manual
Mechanical Diagram
16.3 Mechanical Diagram
Figure 16-1 is a mechanical diagram of the 208-pin QFP MCF5307.
206 PP1 TT1 I/O Parallel port bit/Transfer type 8
207 PP0 TT0 I/O Parallel port bit/Transfer type 8
208 GND ——Ground pin —
Table 16-4. Pins 157–208 (Top, Right-to-Left) (Continued)
Pin Alternate
Function I/O Description Drive
(mA)
No Name
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Chapter 16. Mechanical Data 16-9
Case Drawing
Figure 16-1. Mechanical Diagram
16.4 Case Drawing
Figure 16-2 and Figure 16-3 show the MCF5307 case drawings.
VCC
A0
A1
GND
A2
A3
VCC
A4
A5
GND
A6
A7
VCC
A8
A9
A10
GND
A11
A12
A13
VCC
A14
A15
A16
GND
A17
A18
A19
VCC
A20
A21
A22
GND
A23
PP8
PP9
VCC
PP10
PP11
PP12
GND
PP13
PP14
PP15
VCC
SIZ0
SIZ1
GND
OE
CS0
CS1
VCC
GND
CS2
CS3
CS4
VCC
CS5
CS6
CS7
GND
AS
R/W
TA
VCC
TS
RSTI
IRQ7
GND
IRQ5
IRQ3
IRQ1
VCC
BR
BD
BG
GND
TOUT1
TOUT0
TIN0
VCC
TIN1
RAS0
RAS1
GND
CAS0
CAS1
CAS2
VCC
CAS3
DRAMW
SRAS
GND
SCAS
SCKE
BE0
VCC
BE1
BE2
BE3
GND
SCL
SDA
GND
VCC
D31
D30
D29
GND
D28
D27
D26
VCC
D25
D24
D23
GND
D22
D21
D20
VCC
D19
D18
D17
GND
D16
D15
D14
VCC
D13
D12
D11
GND
D10
D9
D8
VCC
D7
D6
D5
GND
D4
D3
D2
VCC
D1
D0
GND
DSCLK
TCK
DSO
VCC
DSI
BKPT
HIZ
GND
VCC
CTS1
RTS1
RXD1
TXD1
GND
CTS0
RTS0
RXD0
TXD0
VCC
EDGESEL
GND
BCLKO
VCC
RSTO
GND
CLKIN
VCC
MTMOD0
MTMOD1
PGND
NC
PVCC
MTMOD2
MTMOD3
GND
PSTCLK
VCC
DDATA0
DDATA1
GND
DDATA2
DDATA3
EVCC
PST0
PST1
GND
PST2
PST3
VCC
PP7
PP6
PP5
GND
PP4
PP3
PP2
VCC
PP1
PP0
GND
1
52
53 104
105
208 157
156
10
5
10
15
20
25
30
35
40
45
50
145
150
140
135
130
125
120
115
110
105
155
60
55
65
70
75
80
85
90
95
100
200
205
195
190
185
180
175
170
165
160
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16-10 MCF5307 User’s Manual
Case Drawing
Figure 16-2. MCF5307 Case Drawing (General View)
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Chapter 16. Mechanical Data 16-11
Case Drawing
Figure 16-3. Case Drawing (Details)
The dimensions in Figure 16-2 and Figure 16-3 are referenced in Table 16-5.
Table 16-5. Dimensions
Reference Dimension (Millimeters)
Minimum Maximum
A—4.10
A1 0.25 0.50
A2 3.20 3.60
b 0.17 0.27
b1 0.17 0.23
c 0.09 0.20
c1 0.09 0.16
D 30.60 BSC
View A: Three Places Section A-A: 160 Places Rotated 90° CW
View B
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16-12 MCF5307 User’s Manual
Case Drawing
D1 28.00 BSC
e 0.50 BSC
E 30.60 BSC
E1 28.00 BSC
L 0.45 0.75
L1 1.30 REF
R1 0.08 —
R2 0.08 0.25
S 0.20 —
ϑ0* 8*
ϑ10* —
ϑ2 5* 16*
Table 16-5. Dimensions (Continued)
Reference Dimension (Millimeters)
Minimum Maximum
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Chapter 17. Signal Descriptions 17-1
Chapter 17
Signal Descriptions
This chapter describes MCF5307 signals. It includes an alphabetical listing of signals,
showing multiplexing, whether it is an input or output to the MCF5307, the state at reset,
and whether a pull-up resistor should be used. The following chapter, Chapter 18, “Bus
Operation,” describes how these signals interact.
NOTE:
The terms ‘assertion’ and ‘negation’ are used to avoid
confusion when dealing with a mixture of active-low and
active-high signals. The term ‘asserted’ indicates that a signal
is active, independent of the voltage level. The term ‘negated’
indicates that a signal is inactive.
Active-low signals, such as SRAS and TA, are indicated with
an overbar.
17.1 Overview
Figure 17-1 shows the block diagram of the MCF5307 with the signal interface.
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17-2 MCF5307 User’s Manual
Overview
Figure 17-1. MCF5307 Block Diagram with Signal Interfaces
Table 17-1 lists the MCF5307 signals grouped by functionality.
TDO/DSO
TDI/DSI
TMS/BKPT
TCK
Parallel
Interface
Chip
UART0
Serial
I/O
CLKIN
TIN[1:0]
TOUT[1:0]
TA
R/W
SIZ[1:0]
D[31:0]
A[23:0]
IRQ7
IRQ5
IRQ3
JTAG
Port
Selects
ColdFire V3 Core
4-Kbyte SRAM
MAC
Bus
TxD0
RxD0
RTS0
CTS0
TxD1
RxD1
RTS1
CTS1
RAS[1:0]
CAS[3:0]
DRAMW
2
4
24
32
BE[3:0]/BWE[3:0]
CS[7:0] 8
4
2
AS
BR
BG
BD
TRST/DSCLK
HIZ
RSTI
Port1
2
2
2
Test
Controller
IRQ1
OE
DMA
PSTCLK
BCLKO
2
DREQ[1:0]/
SRAS
SCAS
SCKE
A[31:24]/PP[15:8] 8
TS
TM[2:0]/PP[4:2] 2
4
MTMOD[3:0]
4
EDGESEL
TT[1:0]]/PP[1:0]
RSTO
TIP/PP7
I2C
Module 2
SCL
SDA
1 Note: Parallel port pins (PPn) are multiplexed with other bus functions as shown.
2 I2C is a Philips proprietary interface
Internal Bus Arbiter
External
to Internal
Bus
UART1
Serial
I/O
Dual
Timer
Module
Interrupt
Controller
DRAM
Controller
System
Module
8-Kbyte
PP[6:5]
Integration
Module
DDATA[3:0]
Debug Module
DIV
(SIM)
PLL
Unified Cache
4PST[3:0]
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Chapter 17. Signal Descriptions 17-3
Overview
Table 17-1. MCF5307 Signal Index
Signal Name Abbreviation Function I/O Reset Pull-Up Page
Section 17.2, “MCF5307 Bus Signals” 17-7
Address A[31:0] 32-bit address bus. A[4:2] indicate
the interrupt level for external
interrupts.
I/O Three
state 17-7
Data D[31:0] Data bus. D[7:0] are loaded at reset
for bus configuration. I/O Three
state 17-8
Read/Write R/W Identifies read and write transfers I/O Three
state Up 17-8
Size SIZ[1:0] Indicates the data transfer size I/O Three
state 17-8
Transfer start TS Indicates the start of a bus transfer I/O Three
state 17-9
Address strobe AS Indicates a bus cycle has been
initiated and address is stable I/O Three
state Up 17-9
Transfer acknowledge TA Assertion terminates transfer
synchronously I/O Three
state Up 17-9
Transfer in progress TIP/PP7 Indicates a bus cycle is in progress;
multiplexed with PP7 O Parallel
port 17-10
Transfer type TT[1:0] Indicates transfer type: normal, CPU
space, emulator mode, or DMA;
multiplexed with PP[1:0]
O Parallel
port 17-10
Transfer modifier TM[2:0] Provides transfer modifier
information; Multiplexed with
PP[4:2].
O Parallel
port 17-10
Section 17.3, “Interrupt Control Signals” 17-12
Interrupt request IRQ7, IRQ5,
IRQ3, IRQ1 Four external interrupts are set to
default le v els 1,3,5,7; user-alterable. I—Up 17-12
Section 17.4, “Bus Arbitration Signals” 17-12
Bus request BR Indicates processor needs bus O High 17-12
Bus grant BG Arbiter asserts to grant mastership. I —Note 117-12
Bus driven BD Indicates processor is driving bus O High 17-13
Section 17.5, “Clock and Reset Signals” 17-13
Reset in RSTI Processor reset input I —Up 17-13
Clock input CLKIN Input used to clock internal logic I —17-13
Bus clock out BCLKO Bus clock reference output O —17-13
Reset out RSTO Processor reset output O Low 17-13
Auto-acknowledge
configuration 2AA_CONFIG Controls auto acknowledge timing
for CS0 at reset I—17-14
Port size configuration 2PS_CONFIG[1:0] Controls port size for CS0 at reset I —User cfg 17-14
Address configuration 2ADDR_CONFIG Programs parallel I/O ports I —User cfg 17-14
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17-4 MCF5307 User’s Manual
Overview
Frequency control PLL FREQ[1:0] Indicates CLKIN frequency range. I 17-15
Divide control PCLK to
BCLKO DIVIDE[1:0] Indicates the BCLK O/PSTCLK ratio. I 17-15
Section 17.6, “Chip-Select Module Signals” 17-15
Chip selects[7:0] CS[7:0] Enables peripherals at programmed
addresses; CS0 pro vides boot ROM
selection.
O High 17-16
Byte enable[3:0]/
Byte write enable[3:0] BE[3:0]/
BWE[3:0] BE[3:0] select bytes in memory. O High 17-16
Output enable OE Output enable for chip select read
cycles O High 17-16
Section 17.7, “DRAM Controller Signals” 17-16
Row address strobe RAS[1:0] DRAM row address strobe O High 17-16
Column address strobe CAS[3:0] DRAM column address strobe O High 17-16
DRAM write DRAMW Asserted for DRAM write; negated
for DRAM read O High 17-17
Synchronous column
address strobe SCAS SDRAM column address strobe O High 17-17
Synchronous row
address strobe SRAS SDRAM row address strobe O High 17-17
Synchronous clock
enable SCKE Clock enable for external SDRAM O Low 17-17
Synchronous edge
select EDGESEL Timing select for external SDRAM I —User cfg 17-17
Section 17.8, “DMA Controller Module Signals” 17-17
DMA request DREQ[1:0] External DMA transfer request;
multiplexed with PP[6:5] I—17-18
Section 17.9, “Serial Module Signals” 17-18
Receive data RxD[1:0] Receive serial data input for UART I —17-18
Transmit data TxD[1:0] Transmit serial data output for UART O High 17-18
Request-to-send RTS[1:0] UART asserts when ready to
receive data query. O High 17-18
Clear-to-send CTS[1:0] Signals UART that data can be sent
to peripheral I—17-18
Section 17.10, “Timer Module Signals” 17-18
Timer input TIN[1:0] Clock input to timer or trigger to
timer value capture logic I—17-19
Timer outputs TOUT[1:0] Outputs waveform or pulse. O High 17-19
Section 17.11, “Parallel I/O Port (PP[15:0])” 17-19
Table 17-1. MCF5307 Signal Index (Continued)
Signal Name Abbreviation Function I/O Reset Pull-Up Page
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Chapter 17. Signal Descriptions 17-5
Overview
Table 17-2 lists signals in alphabetical order by abbreviated name.
Parallel port PP[15:0] Interfaces with I/O; multiplexed with
bus address and attribute signals. I/O Input 17-19
Section 17.12, “I2C Module Signals” 17-19
Serial clock line SCL Clock signal for I2C operation I/O Open
drain Up 17-19
Serial data line SDA Serial data port for I2C operation I/O Open
drain Up 17-19
Section 17.13, “Debug and Test Signals” 17-20
Motorola test mode MTMOD0 Puts processor in functional or
emulator mode I—User cfg 17-20
Motorola test mode MTMOD[3:1] Reserved I —Down 17-20
High impedance HIZ Assertion three-states all outputs I —Up 17-20
Processor clock out PSTCLK Output clock used for PSTDDATA O —17-20
Processor status PST[3:0] Displays captured processor data . O Driven 17-20
Debug data DDATA[3:0] Displays captured processor data
and breakpoint status. O Driven 17-20
Section 17.14, “Debug Module/JTAG Signals” 17-21
Test clock TCK Clock signal for IEEE 1149.1 JTAG I —Low 17-23
Test reset/
Development serial
clock
TRST/DSCLK Asynchronous reset for JTAG;
debug module clock input I—Up 17-21
Test mode select/
Breakpoint TMS/BKPT TMS (JTAG)/hardware breakpoint
(debug) I—Up 17-22
Test data input/
Development serial
input
TDI/DSI Multiplex ed serial input f or the JTA G
or background debug module I—Up 17-22
Test data output/
Development serial
output
TDO/DSO Multiplexed serial output for the
JTAG or background debug module O Driven 17-22
1If there is no arbiter, BG should be tied low; otherwise, it should be negated.
2These data pins are sampled at reset for configuration.
Table 17-2. MCF507 Alphabetical Signal Index
Abbreviation Signal Name Function I/O Page
AA_CONFIG Auto-acknowledge configuration Clock/reset I 17-14
ADDR_CONFIG Address configuration Clock/reset I 17-14
AS Address strobe Bus I/O 17-9
A[31:0] Address Bus I/O 17-7
Table 17-1. MCF5307 Signal Index (Continued)
Signal Name Abbreviation Function I/O Reset Pull-Up Page
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17-6 MCF5307 User’s Manual
Overview
BCLKO Bus clock out Clock/reset O 17-13
BD Bus driven Bus arbitration O 17-13
BE[3:0]/BWE[3:0] Byte enable[3:0]/Byte write enable[3:0] Chip select O 17-16
BG Bus grant Bus arbitration I 17-12
BR Bus request Bus arbitration O 17-12
CAS[3:0] Column address strobe DRAM O 17-16
CLKIN Clock input Clock/reset I 17-13
CS[7:0] Chip selects[7:0] UART O 17-16
CTS[1:0] Clear-to-send Serial module I 17-18
DDATA[3:0] Debug data Debug O 17-20
Clock/Reset I 17-15
DRAMW DRAM write DRAM O 17-17
DREQ[1:0] DMA request DMA I 17-18
D[31:0] Data Bus I/O 17-8
EDGESEL Sync edge select DRAM I 17-17
Clock/Reset I 17-15
HIZ High impedance Debug I 17-20
IRQ7, IRQ5,
IRQ3, IRQ1 Interrupt request Interrupt control I 17-12
MTMOD[3:0] Motorola test mode Debug I 17-20
OE Output enable Chip select O 17-16
PP[15:0] Parallel port Parallel port I/O 17-19
PSTCLK Processor clock out Debug O 17-20
PST[:0] Processor status Debug O 17-20
PS_CONFIG[1:0] Port size configuration Clock/reset I 17-14
R/W Read/Write Bus I/O 17-8
RAS[1:0] Row address strobe DRAM O 17-16
RSTI Reset In Clock/reset I 17-13
RSTO Reset Out Clock/reset O 17-13
RTS[1:0] Request-to-send Serial module O 17-18
RxD[1:0] Receive data Serial module I 17-18
SCAS Synchronous column address strobe DRAM O 17-17
SCKE Synchronous clock enable DRAM O 17-17
SCL Serial clock line I2C I/O 17-19
SDA Serial data line I2C I/O 17-19
SIZ[1:0] Size Bus I/O 17-8
Table 17-2. MCF507 Alphabetical Signal Index (Continued)
Abbreviation Signal Name Function I/O Page
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Chapter 17. Signal Descriptions 17-7
MCF5307 Bus Signals
17.2 MCF5307 Bus Signals
The bus signals provide the external bus interface to the MCF5307.
17.2.1 Address Bus
The address bus provides the address of the byte or most-significant byte (MSB) of the
word or longword being transferred. The address lines also serve as the DRAM addressing,
providing multiplexed row and column address signals. When an external device has
o wnership of the MCF5307 b us, the device must driv e the address b us and assert TS or AS
to indicate the start of a bus c ycle. During an interrupt ackno wledge access, A[4:2] indicate
the interrupt level being acknowledged.
17.2.1.1 Address Bus (A[23:0])
The lo wer 24 bits of the address b us become valid when TS is asserted. A[4:2] indicate the
interrupt level during interrupt acknowledge cycles.
17.2.1.2 Address Bus (A[31:24]/PP[15:8])
These multiplexed pins can serve as the most-significant byte of the address bus, or as the
most-significant byte of the parallel port. Programming the PAR in the system integration
module (SIM) determines the function of each of these eight multiplexed pins. These pins
are programmable on a bit-by-bit basis.
SRAS Synchronous row address strobe DRAM O 17-17
TA Transfer acknowledge Bus I/O 17-9
TCK Test clock JTAG I 17-23
TDI/DSI Test data input/Development serial input JTAG I 17-22
TDO/DSO Test data output/Development serial output JTAG O 17-22
TIN[1:0] Timer input Timer I 17-19
TIP Transfer in progress Bus O 17-10
TMS/BKPT Test mode select/Breakpoint JTAG I 17-22
TM[2:0] Transfer modifier Bus O 17-10
TOUT[1:0] Timer outputs Timer O 17-19
TRST/DSCLK Test reset/Development serial clock JTAG I 17-21
TS Transfer start Bus I/O 17-9
TT[1:0] Transfer type Bus O 17-10
TxD[1:0] Transmit data Serial module O 17-18
Table 17-2. MCF507 Alphabetical Signal Index (Continued)
Abbreviation Signal Name Function I/O Page
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17-8 MCF5307 User’s Manual
MCF5307 Bus Signals
• A[31:24]—Pins are configured as address bits by setting corresponding PAR bits;
they represent the most-significant address bus bits. As much as 4 Gbytes of
memory are available when all of these pins are programmed as address signals.
• PP[15:8]—Pins are configured as parallel port signals by clearing corresponding
PAR bits; these represent the most-significant parallel port bits.
17.2.2 Data Bus (D[31:0])
The data bus is bidirectional and non-multiple xed. Data is sampled by the MCF5307 on the
rising BCLKO edge. The data bus port width, wait states, and internal termination are
initially defined for the boot chip select by D[7:0] during reset. The port width for each chip
select and DRAM bank are programmable. The data b us uses a default configuration if none
of the chip selects or DRAM bank match the address decode. The default configuration is
a 32-bit port with external termination and burst-inhibited transfers. The data bus can
transfer byte, word, or longword data widths. All 32 data bus signals are driven during
writes, regardless of port width and operand size.
D[7:0] are used during reset initialization as inputs to configure the functions as described
in Table 17-3. They are defined in Section 17.5.5, “Data/Configuration Pins (D[7:0]).”
17.2.3 Read/Write (R/W)
When the MCF5307 is the bus master, it drives the R/W signal to indicate the direction of
subsequent data transfers. It is driven high during read bus cycles and driven low during
write bus cycles. This signal is an input during an external master access.
17.2.4 Size (SIZ[1:0])
When it is the bus master , the MCF5307 outputs these signals to indicate the requested data
transfer size. Table 17-4 shows the definition of the bus request size encodings. When the
MCF5307 device is not the bus master, these signals function as inputs.
Note that for misaligned transfers, SIZ[1:0] indicate the size of each transfer. For example,
if a longword access occurs at a misaligned of fset of 0x1, a byte is transferred first (SIZ[1:0]
Table 17-3. Data Pin Configuration
Pin Function Section
D7 Auto-acknowledge configuration
(AA_CONFIG) Section 17.5.5.2, “D7—Auto Acknowledge Configuration
(AA_CONFIG)”
D[6:5] Port size configuration (PS_CONFIG[1:0]) Section 17.5.5.3, “D[6:5]—Port Size Configuration
(PS_CONFIG[1:0])”
D4 Address configuration (ADDR_CONFIG/D4) Section 17.5.6, “D4—Address Configuration
(ADDR_CONFIG)”
D[3:2] Frequency Control PLL (FREQ[1:0]) Section 17.5.7, “D[3:2]—Frequency Control PLL (FREQ[1:0] )
D[1:0] Divide Control (DIVIDE[1:0]) Section 17.5.8, “D[1:0]—Divide Control PCLK to BCLKO
(DIVIDE[1:0])
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Chapter 17. Signal Descriptions 17-9
MCF5307 Bus Signals
= 01), a word is next transferred at offset 0x2 (SIZ[1:0] = 10), then the final byte is
transferred at offset 0x4 (SIZ[1:0] = 01).
For aligned transfers larger than the port size, SIZ[1:0] behaves as follows:
• If bursting is used, SIZ[1:0] stays at the size of transfer.
• If bursting is inhibited, SIZ[1:0] first shows the size of the transfer and then shows
the port size.
For burst-inhibited transfers, SIZ[1:0] changes with each TS assertion to reflect the next
transfer size. For transfers to port sizes smaller than the transfer size, SIZ[1:0] indicates the
size of the entire transfer on the first access and the size of the current port transfer on
subsequent transfers. For example, for a longword write to an 8-bit port, SIZ[1:0] = 00 for
the first byte transfer and 01 for the next three.
17.2.5 Transfer Start (TS)
The MCF5307 asserts TS during the first clock c ycle when address and attrib utes (TM, TT,
TIP, R/W, and SIZ) are valid. TS is negated in the following clock cycle. When the
MCF5307 is not the bus master, TS is an input.
17.2.6 Address Strobe (AS)
Address strobe (AS) is asserted to indicate when the address is stable at the start of a bus
cycle. The address and attributes are guaranteed to be v alid during the entire period that AS
is asserted. This signal is asserted and negated on the falling edge of the clock. When the
MCF5307 is not the bus master, AS is an input.
17.2.7 Transfer Acknowledge (TA)
When the MCF5307 is bus master , the e xternal system driv es this input to terminate the bus
transfer. The bus continues to be driven until this synchronous signal is asserted. For write
cycles, the processor continues to drive data one clock after TA is asserted. During read
cycles, the peripheral must continue to drive data until TA is recognized.
If all bus c ycles support fast termination, TA can be tied lo w. Howe v er , note that TA cannot
be tied low if potential external bus masters are present. The MCF5307 drives TA for an
Table 17-4. Bus Cycle Size Encoding
SIZ[1:0] Port Size
00 Longword
01 Byte
10 Word
11 Line
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17-10 MCF5307 User’s Manual
MCF5307 Bus Signals
external master access. This condition is indicated by the AM bit in the chip-select mask
register (CSMR) being cleared. See Chapter 10, “Chip-Select Module.”
17.2.8 Transfer In Progress (TIP/PP7)
The TIP/PP7 pin is programmed in the PAR to serve as the transfer-in-progress output or
as a parallel port bits. The TIP output is asserted indicating a bus transfer is in progress. It
is negated during idle b us c ycles if the b us is still granted to the processor. It is three-stated
for external master accesses. Note that TIP is held asserted on back-to-back bus cycles.
17.2.9 Transfer Type (TT[1:0]/PP[1:0])
The TT[1:0]/PP[1:0] pins are programmed in the PAR to serve as the transfer type outputs
or as two parallel port bits. When the MCF5307 is bus master and TT[1:0] are enabled,
these signals are dri ven as outputs only. If an external master o wns the b us and TT[1:0] are
enabled, these pins are three-stated by the MCF5307 and can be driven by the external
master. Table 17-5 shows the definition of the encodings.
17.2.10 Transfer Modifier (TM[2:0]/PP[4:2])
The TM[2:0]/PP[4:2] pins are programmed in the PAR to serve as the transfer modifier
outputs or as three parallel port bits. These outputs provide supplemental information for
each transfer type; see Table 17-6 through Table 17-10.
When the MCF5307 is the bus master and TM[2:0] are enabled, these signals are driv en as
outputs only. If an external device is bus master and TM[2:0] are enabled, these pins are
three-stated by the MCF5307 and can be driven by the external master.
Table 17-5. Bus Cycle Transfer Type Encoding
TT[1:0] T ransfer Type
00 Normal access
01 DMA access
10 Emulator access
11 CPU space or interrupt acknowledge
Table 17-6. TM[2:0] Encodings for TT = 00 (Normal Access)
TM[2:0] Transfer Modifier
000 Cache push access
001 User data access
010 User code access
011–100 Reserved
101 Supervisor data access
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Chapter 17. Signal Descriptions 17-11
MCF5307 Bus Signals
As sho wn in Table 17-7, if the DMA is bus master (TT = 01), TM[2:0] indicate the type of
DMA access and provide the DMA acknowledgement information for channels 0 and 1.
NOTE:
When TT= 01, the TM0 encoding is independent from TM[2:1]
encoding.
Table 17-9 shows TM[2:0] encodings for emulator mode accesses.
The TM signals indicate user or data transfer types during emulation transfers, while for
interrupt acknowledge transfers, the TM signals carry the interrupt level being
acknowledged; see Table 17-10.
110 Supervisor code access
111 Reserved
Table 17-7. TM0 Encoding for DMA as Master (TT = 01)
TM0 Transfer Modifier Encoding
0 Single-address access negated
1 Single-address access
Table 17-8. TM[2:1] Encoding for DMA as Master (TT = 01)
TM[2:1] Transfer Modifier Encoding
00 DMA acknowledges negated
01 DMA acknowledge, channel 0
10 DMA acknowledge, channel 1
11 Reserved
Table 17-9. TM[2:0] Encodings for TT = 10 (Emulator Access)
TM[2:0] Transfer Modifier
000–100 Reserved
101 Emulator mode data access
110 Emulator mode code access
111 Reserved
Table 17-10. TM[2:0] Encodings for TT = 11 (Interrupt Level)
TM[2:0] Transfer Modifier
000 CPU Space
001 Interrupt level 1 acknowledge
Table 17-6. TM[2:0] Encodings for TT = 00 (Normal Access) (Continued)
TM[2:0] Transfer Modifier
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17-12 MCF5307 User’s Manual
Interrupt Control Signals
17.3 Interrupt Control Signals
The interrupt control signals supply the external interrupt level to the MCF5307 device.
17.3.1 Interrupt Request (IRQ1/IRQ2, IRQ3/IRQ6, IRQ5/IRQ4,
and IRQ7)
The IRQ1, IRQ3, IRQ5, and IRQ7 signals are the default interrupt request signals (IRQn).
Ho wev er , by setting the appropriate bit in the interrupt port assignment re gister (IRQPAR),
IRQ1, IRQ3, and IRQ5 can be changed to function as IRQ2, IRQ6, and IRQ4, respecti vely.
See Section 9.2.4, “Interrupt Port Assignment Register (IRQPAR).”
17.4 Bus Arbitration Signals
The bus arbitration signals provide the external bus arbitration control for the MCF5307.
17.4.1 Bus Request (BR)
The BR output indicates to an external arbiter that the processor is requesting to be bus
master for one or more bus cycles. BR is negated when the MCF5307 begins an access to
the external b us with no other internal accesses pending. BR remains ne g ated until another
internal request occurs.
17.4.2 Bus Grant (BG)
An external arbiter asserts the BG input to indicate that the MCF5307 can take control of
the bus on the ne xt rising edge of BCLKO. When the arbiter negates BG, the MCF5307 will
release the bus as soon as the current transfer completes. The external arbiter must not grant
the bus to any other master until both BD and BG are negated.
010 Interrupt level 2 acknowledge
011 Interrupt level 3 acknowledge
100 Interrupt level 4 acknowledge
101 Interrupt level 5 acknowledge
110 Interrupt level 6 acknowledge
111 Interrupt level 7 acknowledge
Table 17-10. TM[2:0] Encodings for TT = 11 (Interrupt Level) (Continued)
TM[2:0] Transfer Modifier
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Chapter 17. Signal Descriptions 17-13
Clock and Reset Signals
17.4.3 Bus Driven (BD)
The MCF5307 asserts BD to indicate that it is the current master and is dri ving the bus. The
MCF5307 behaves as follows:
• If the MCF5307 is the bus master but is not using the bus, BD is asserted.
• If the MCF5307 loses mastership during a transfer, it completes the last transfer of
the access, negates BD, and three-states all bus signals on the rising edge of
BCLKO.
• If the MCF5307 loses bus mastership during an idle clock cycle, it three-states all
bus signals on the rising edge of BCLKO.
•BD
cannot be negated unless BG is negated.
17.5 Clock and Reset Signals
The clock and reset signals configure the MCF5307 and provide interface signals to the
external system.
17.5.1 Reset In (RSTI)
Asserting RSTI causes the MCF5307 to enter reset exception processing. When RSTI is
recognized, BR and BD are negated and the address bus, data bus, TT, SIZ, R/W, AS, and
TS are three-stated. RSTO is asserted automatically when RSTI is asserted.
17.5.2 Clock Input (CLKIN)
CLKIN is the MCF5307 input clock frequency to the on-board phase-locked-loop (PLL)
clock generator. CLKIN is used to internally clock or sequence the MCF5307 internal bus
interface at a selected multiple of the input frequency used for internal module logic.
17.5.3 Bus Clock Output (BCLKO)
The internal PLL generates BCLKO and can be programmed to be 1/2, 1/3, or 1/4 of the
processor clock frequency. BCLKO should be used as the bus timing reference.
17.5.4 Reset Out (RSTO)
After RSTI is asserted, the PLL temporarily loses its lock, during which time RSTO is
asserted. When the PLL regains its lock, RSTO negates again. This signal can be used to
reset external devices.
17.5.5 Data/Configuration Pins (D[7:0])
This section describes data pins, D[7:0], that are read at reset for configuration. Table 17-11
shows pin assignments.
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17-14 MCF5307 User’s Manual
Clock and Reset Signals
17.5.5.1 D[7:5Boot Chip-Select (CS0) Configuration
D[7:5] determine defaults for the global chip select (CS0), the only chip select v alid at reset.
These signals correspond to bits in chip-select configuration register 0 (CSCR0).
17.5.5.2 D7—Auto Acknowledge Configuration (AA_CONFIG)
At reset, the enabling and disabling of auto ackno wledge for boot CS0 is determined by the
logic level driven on D7 at the rising edge of RSTI. AA_CONFIG is multiplexed with D7
and sampled only at reset. The D7 logic level is reflected as the reset value of CSCR[AA].
Table 17-12 shows ho w the D7 logic level corresponds to the auto acknowledge timing for
CS0 at reset. Note that auto acknowledge can be disabled by driving a logic 0 on D7 at reset.
17.5.5.3 D[6:5]—Port Size Configuration (PS_CONFIG[1:0])
The default port size value of the boot CS0 is determined by the logic levels driven on
D[6:5] at the rising edge of RSTI, which are reflected as the reset value of CSCR[PS]. Table
17-13 shows how the logic levels of D[6:5] correspond to the CS0 port size at reset.
17.5.6 D4—Address Configuration (ADDR_CONFIG)
The address configuration signal (ADDR_CONFIG) programs the PAR of the parallel I/O
port to be either parallel I/O or to be the upper address bus bits along with various attrib ute
and control signals at reset to gi ve the user the option to access a broader addressing range
Table 17-11. Data Pin Configuration
Pin Function
D7 Auto-acknowledge configuration (AA_CONFIG)
D[6:5] Port size configuration (PS_CONFIG[1:0])
D4 Address configuration (ADDR_CONFIG/D4)
D[3:2] Frequency Control PLL (FREQ[1:0])
D[1:0] Divide Control (DIVIDE[1:0])
Table 17-12. D7 Selection of CS0 Automatic Acknowledge
D7 (CSCR0[AA]) Boot CS0 AA
0 Disabled
1 Enabled with 15 wait states
Table 17-13. D6 and D5 Selection of CS0 Port Size
D[6:5] (CSCR0[PS]) Boot CS0 Port Size
00 32-bit port
01 8-bit port
1x 16-bit port
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Chapter 17. Signal Descriptions 17-15
Chip-Select Module Signals
of memory if desired. ADDR_CONFIG is multiplexed with D4 and its configuration is
sampled at reset as shown in Table 17-14.
17.5.7 D[3:2]—Frequency Control PLL (FREQ[1:0])
The frequency control PLL input bus (FREQ[1:0]) indicates the CLKIN frequency range.
These signals are multiplex ed with D[3:2] and are sampled during the assertion of RESET.
These signals indicate the operating frequency range to the PLL, as shown in Table 17-15.
Note that these signals do not af fect the PLL frequency but are required to set up the analog
PLL.
17.5.8 D[1:0]—Divide Contr ol PCLK to BCLK O (DIVIDE[1:0])
This 2-bit input bus indicates the BCLK O/PSTCLK ratio. These signals are sampled during
the assertion of RESET and indicate the ratios shown in Table 17-16.
17.6 Chip-Select Module Signals
The MCF5307 device provides eight programmable chip-select signals that can directly
interface with SRAM, EPROM, EEPROM, and peripherals. These signals are asserted and
negated on the falling edge of the clock.
Table 17-14. D4/ADDR_CONFIG, Address Pin Assignment
D4/ADDR_CONFIG PAR Configuration at Reset
0 PP[15:0], defaulted to inputs upon reset
1 A[31:24]/TIP/DREQ[1:0]/TM[2:0]/TT[1:0]
Table 17-15. CLKIN Frequency
FREQ[1:0]/D[3:2] CLKIN Frequency (MHz)
00 16.6–27.999
01 28–38.999
10 39–45
11 Reserved
Table 17-16. BCLKO/PSTCLK Divide Ratios
DIVIDE[1:0]/D[1:0] Ratio of BCLKO/PSTCLK
00 1/4
01 Reserved
10 1/2
11 1/3
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17-16 MCF5307 User’s Manual
DRAM Controller Signals
17.6.1 Chip-Select (CS[7:0])
Each chip select can be programmed for a base address location and for masking addresses,
port size and burst-capability indication, wait-state generation, and internal/external
termination.
Reset clears all chip select programming; CS0 is the only chip select initialized out of reset.
CS0 is also unique because it can function at reset as a global chip select that allows boot
ROM to be selected at any defined address space. Port size and termination (internal vs.
external) for boot CS0 are configured by the levels on D[7:5] on the rising edge of RSTI,
as described in Section 17.5.5.1, “D[7:5Boot Chip-Select (CS0) Configuration.”
The chip-select implementation is described in Chapter 10, “Chip-Select Module.”
17.6.2 Byte Enables/Byte Write Enables (BE[3:0]/BWE[3:0])
The four byte enables are multiplexed with the MCF5307 byte-write-enable signals. Each
pin can be indi vidually programmed through the chip-select control registers (CSCRs). For
each chip select, assertion of byte enables for reads and byte-write enables for write cycles
can be programmed. Alternati vely, users can program byte-write enables to assert on writes
and no byte enable assertion for read transfers.
17.6.3 Output Enable (OE)
The output enable (OE) signal is sent to the interfacing memory and/or peripheral to enable
a read transfer. OE is asserted only when a chip select matches the current address decode.
17.7 DRAM Controller Signals
The DRAM signals in the following sections interface to external DRAM. DRAM with
widths of 8, 16, and 32 bits are supported and can access as much as 512 Mbytes of DRAM.
17.7.1 Row Address Strobes (RAS[1:0])
The row address strobes (RAS[1:0]) interface to RAS inputs on industry-standard
ADRAMs. When SDRAMs are used, these signals interface to the chip-select lines of the
SDRAMs within a memory block. Thus, there is one RAS line for each memory block.
17.7.2 Column Address Strobes (CAS[3:0])
The column address strobes (CAS[3:0]) interface to CAS inputs on industry-standard
DRAMs. These provide CAS for a given ADRAM block. When SDRAMs are used, CAS
signals control the byte enables for standard SDRAMs (referred to as DQMx). CAS3
accesses the LSB and CAS0 accesses the MSB of data.
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Chapter 17. Signal Descriptions 17-17
DMA Controller Module Signals
17.7.3 DRAM Write (DRAMW)
The DRAM write signal (DRAMW) is asserted to signify that a DRAM write cycle is
underway. A read bus cycle is indicated by the negation of DRAMW.
17.7.4 Synchronous DRAM Column Address Strobe (SCAS)
The synchronous DRAM column address strobe (SCAS) is registered during synchronous
mode to route directly to the SCAS signal of SDRAMs.
17.7.5 Synchronous DRAM Row Address Strobe (SRAS)
The synchronous DRAM row address strobe output (SRAS) is registered during
synchronous mode to route directly to the SRAS signal of external SDRAMs.
17.7.6 Synchronous DRAM Clock Enable (SCKE)
The synchronous DRAM clock enable output (SCKE) is registered during synchronous
mode to route directly to the SCKE signal of external SDRAMs. This signal provides the
clock enable to the SDRAM.
17.7.7 Synchronous Edge Select (EDGESEL)
The synchronous edge select input (EDGESEL) helps select additional output hold times
for signals that interface to external SDRAMs. It provides the following three modes of
operation for SDRAM control signals:
• When EDGESEL is tied high, SDRAM control signals change on the rising edge of
BCLKO.
• When EDGESEL is tied lo w , SDRAM control signals change on the f alling edge of
BCLKO.
• When EDGESEL is tied to the external clock (normally buffered BCLKO), which
drives the SDRAM and other devices, SDRAM signals are generated within the
MCF5307 make a transition on the rising edge of the SDRAM clock. See
Figure 11-14 on page 11-19. This loop-back configuration provides additional
output hold time for MCF5307 interface signals provided to the SDRAM. In this
case, the SDRAM clock operates at the BCLKO frequency, with a possible slight
phase delay.
17.8 DMA Controller Module Signals
The DMA controller module uses the signals in the following subsections to provide
external request for either a source or destination.
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17-18 MCF5307 User’s Manual
Serial Module Signals
17.8.1 DMA Request (DREQ[1:0]/PP[6:5])
The DMA request pins (DREQ[1:0]/PP[6:5]) can serve as the DMA request inputs or as
two bits of the parallel port, as determined by individually programmable bits in the PAR.
These inputs are asserted by a peripheral de vice to request an operand transfer between that
peripheral and memory by either channel 0 or 1 of the on-chip DMA.
Note that DMA ackno wledge indication is displayed on TM[2:0], during DMA transfers of
channel 0 and 1.
17.9 Serial Module Signals
The signals in the follo wing sections are used to transfer serial data between the two U ART
modules and external peripherals.
17.9.1 Transmitter Serial Data Output (TxD)
TxD is held high (mark condition) when the transmitter is disabled, idle, or operating in the
local loop-back mode. Data is shifted out least-significant bit (lsb) first on TxD on the
falling edge of the clock source.
17.9.2 Receiver Serial Data Input (RxD)
Data received on RxD is sampled on the rising edge of the clock source, with the lsb
received first.
17.9.3 Clear to Send (CTS)
This input can generate an interrupt on a change of state.
17.9.4 Request to Send (RTS)
This output can be programmed to be negated or asserted automatically by either the
receiver or the transmitter. When connected to a transmitter’s CTS, RTS can control serial
data flow .
17.10 Timer Module Signals
The signals in the following sections are external interfaces to the two general-purpose
MCF5307 timers. These 16-bit timers can capture timer values, trigger external events or
internal interrupts, or count external events.
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Chapter 17. Signal Descriptions 17-19
Parallel I/O Port (PP[15:0])
17.10.1 Timer Inputs (TIN[1:0])
TIN[1:0] can be programmed as clocks that cause events in the counter and prescalers.
They can also cause captures on the rising edge, falling edge, or both edges.
17.10.2 Timer Outputs (TOUT1, TOUT0)
The programmable timer outputs (TOUT1 and TOUT0) pulse or toggle on various timer
events.
17.11 Parallel I/O Por t (PP[15:0])
This 16-bit bus is dedicated for general-purpose I/O. The parallel port is multiplexed with
the A[31:24], TT[1:0], TM[2:0], TIP, and DREQ[1:0]. These 16 bits are programmed for
functionality with the PAR in the SIM.
The system designer controls the reset v alue of this register by driving D4 with a 1 or 0 on
the rising edge of RSTI (reset input to MCF5307 de vice). At reset, the system is configured
as PP[15:0] if D4 is 0; otherwise alternate pin functions selected by PAR = 1 are used.
Motorola recommends that D4 be driven during reset to a logic level.
17.12 I2C Module Signals
The I2C module acts as a two-wire, bidirectional serial interface between the MCF5307 and
peripherals with an I2C interface (such as LED controller, A-to-D converter, or D-to-A
converter). Devices connected to the I2C must have open-drain or open-collector outputs.
17.12.1 I2C Serial Clock (SCL)
The bidirectional, open-drain I2C serial clock signal (SCL) is the clock signal for I2C
module operation. The I2C module controls this signal when the bus is in master mode; all
I2C devices drive this signal to synchronize I2C timing.
17.12.2 I2C Serial Data (SDA)
The bidirectional, open-drain I2C serial data signal (SDA) is the data input/output for the
serial I2C interface.
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17-20 MCF5307 User’s Manual
Debug and Test Signals
17.13 Debug and Test Signals
The signals in this section interface with external I/O to provide processor status signals.
17.13.1 Test Mode (MTMOD[3:0])
The test mode signals choose between multiplexed debug module and JTAG signals. If
MTMOD0 is low, the part is in normal and background debug mode (BDM); if it is high,
it is in normal and JTAG mode. All other MTMOD values are reserved; MTMOD[3:1]
should be tied to ground and MTMOD[3:0] should not be changed while RSTI is negated.
17.13.2 High Impedance (HIZ)
The assertion of HIZ forces all output drivers to high-impedance state. The timing on HIZ
is independent of the clock. Note that HIZ does not override the JTAG operation;
TDO/DSO can be forced to high impedance by asserting TRST.
17.13.3 Processor Clock Output (PSTCLK)
The internal PLL generates this output signal, and is the processor clock output that is used
as the timing reference for the debug bus timing (DDATA[3:0] and PST[3:0]). PSTCLK is
at the same frequency as the core processor and cache memory. The frequency is 2x the
CLKIN.
17.13.4 Debug Data (DDATA[3:0])
The debug data signals (DDATA[3:0]) display captured processor data and breakpoint
status. See Chapter 5, “Debug Support,” for additional information on this bus.
17.13.5 Processor Status (PST[3:0])
The processor status pins indicate the MCF5307 processor status. During debug mode, the
timing is synchronous with the processor clock (PSTCLK) and the status is not related to
the current bus transfer. Table 2-11 shows the encodings of these signals.
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Chapter 17. Signal Descriptions 17-21
Debug Module/JTAG Signals
.
17.14 Debug Module/JTAG Signals
The MCF5307 complies with the IEEE 1149.1a JTAG testing standard. JTAG test pins are
multiplex ed with background debug pins. Except for TCK, these signals are selected by the
value of MTMOD0. If MTMOD0 is high, JTAG signals are chosen; if it is low, debug
module signals are chosen. MTMOD0 should be changed only while RSTI is asserted.
17.14.1 Test Reset/Development Serial Clock
(TRST/DSCLK)
If MTMOD0 is high, TRST is selected. TRST asynchronously resets the internal JTAG
controller to the test logic reset state, causing the JTAG instruction register to choose the
bypass instruction. When this occurs, JTAG logic is benign and does not interfere with
normal MCF5307 functionality.
Although TRST is asynchronous, Motorola recommends that it makes an
asserted-to-negated transition only while TMS is held high. TRST has an internal pull-up
resistor so if it is not dri ven low, it defaults to a logic level of 1. If TRST is not used, it can
be tied to ground or, if TCK is clocked, to VDD. Tying TRST to ground places the JTAG
Table 17-17. Processor Status Signal Encodings
PST[3:0] Definition
Hex Binary
0x0 0000 Continue execution
0x1 0001 Begin execution of an instruction
0x2 0010 Reserved
0x3 0011 Entry into user-mode
0x4 0100 Begin execution of PULSE and WDDATA instructions
0x5 0101 Begin execution of taken branch or Synch_PC1
1Rev. B enhancement.
0x6 0110 Reserved
0x7 0111 Begin execution of RTE instruction
0x8 1000 Begin 1-byte data transfer on DDATA
0x9 1001 Begin 2-byte data transfer on DDATA
0xA 1010 Begin 3-byte data transfer on DDATA
0xB 1011 Begin 4-byte data transfer on DDATA
0xC 1100 Exception processing2
2These encodings are asserted for multiple cycles.
0xD 1101 Emulator mode entry exception processing2
0xE 1110 Processor is stopped, waiting for interrupt2
0xF 1111 Processor is halted2
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17-22 MCF5307 User’s Manual
Debug Module/JTAG Signals
controller in test logic reset state immediately. Tying it to VDD causes the JTAG controller
(if TMS is a logic level of 1) to eventually enter test logic reset state after 5 TCK clocks.
If MTMOD0 is low, DSCLK is selected. DSCLK is the development serial clock for the
serial interface to the deb ug module. The maximum DSCLK frequenc y is 1/5 CLKIN. See
Chapter 5, “Debug Support.”
17.14.2 Test Mode Select/Breakpoint (TMS/BKPT)
If MTMOD0 is high, TMS is selected. The TMS input provides information to determine
the JTAG test operation mode. The state of TMS and the internal 16-state JTAG controller
state machine at the rising edge of TCK determine whether the JTAG controller holds its
current state or advances to the next state. This directly controls whether JTAG data or
instruction operations occur. TMS has an internal pull-up resistor so that if it is not driven
low, it defaults to a logic level of 1. But if TMS is not used, it should be tied to VDD.
If MTMOD0 is low, BKPT is selected. BKPT signals a hardware breakpoint to the
processor in debug mode. See Chapter 5, “Debug Support.”
17.14.3 Test Data Input/Development Serial Input (TDI/DSI)
If MTMOD0 is high, TDI is selected. TDI provides the serial data port for loading the
v arious JTA G boundary scan, bypass, and instruction re gisters. Shifting in data depends on
the state of the JTA G controller state machine and the instruction in the instruction register.
Shifts occur on the TCK rising edge. TDI has an internal pull-up resistor, so when not
driven low it defaults to high. But if TDI is not used, it should be tied to VDD.
If MTMOD0 is lo w, DSI is selected. DSI provides the single-bit communication for debug
module commands. See Chapter 5, “Debug Support.”
17.14.4 Test Data Output/Development Serial Output
(TDO/DSO)
If MTMOD0 is high, TDO is selected. The TDO output provides the serial data port for
outputting data from JTAG logic. Shifting out data depends on the JTAG controller state
machine and the instruction in the instruction register. Data shifting occurs on the falling
edge of TCK. When TDO is not outputting test data, it is three-stated. TDO can be
three-stated to allow bused or parallel connections to other devices having JTAG.
If MTMOD0 is low, DSO is selected. DSO provides single-bit communication for debug
module responses. See Chapter 5, “Debug Support.”
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Chapter 17. Signal Descriptions 17-23
Debug Module/JTAG Signals
17.14.5 Test Clock (TCK)
TCK is the dedicated JTAG test logic clock independent of the MCF5307 processor clock.
Various JTAG operations occur on the rising or f alling edge of TCK. Holding TCK high or
lo w for an indefinite period does not cause JT A G test logic to lose state information. If TCK
is not used, it must be tied to ground.
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17-24 MCF5307 User’s Manual
Debug Module/JTAG Signals
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Chapter 18. Bus Operation 18-1
Chapter 18
Bus Operation
This chapter describes data-transfer operations, error conditions, bus arbitration, and reset
operations. It describes transfers initiated by the MCF5307 and by an external bus master,
and includes detailed timing diagrams showing the interaction of signals in supported bus
operations. Chapter 11, “Synchronous/Asynchronous DRAM Controller Module,”
describes DRAM cycles.
18.1 Features
The following list summarizes bus operation features:
• Up to 32 bits of address and data
• 8-, 16-, and 32-bit port sizes
• Byte, word, longword, and line size transfers
• Bus arbitration for external devices
• Burst and burst-inhibited transfer support
• Internal termination for core and DMA bus cycles
• External termination of bus cycles controlled by an external bus master
Note that, throughout this manual, an overbar indicates an active-low signal.
18.2 Bus and Control Signals
Table 18-1 summarizes MCF5307 bus signals described in Chapter 17, “Signal
Descriptions.”
Table 18-1. ColdFire Bus Signal Summary
Signal Name Description MCF5307 Master External Master Edge
AS Address strobe O I Falling
A[31:0] Address bus O I Rising
BE/BWE 1Byte enable/Byte write enable O O Falling
CS[7:0] 1Chip selects O O Falling
D[31:0] Data bus I/O I/O Rising
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18-2 MCF5307 User’s Manual
Bus Characteristics
18.3 Bus Characteristics
The MCF5307 uses an input clock signal (CLKIN) to generate its internal clock. BCLKO
is the bus clock rate, where all bus operations are synchronous to the rising edge of
BCLK O. Some of the b us control signals (BE/BWE, OE, CSx, and AS) are synchronous to
the falling edge, shown in Figure 18-1. Bus characteristics may differ somewhat for
interfacing with external DRAM.
Figure 18-1. Signal Relationship to BCLKO for Non-DRAM Access
IRQ[7,5,3,1] Interrupt request I I Rising
OE 1Output enable O I Falling
R/W Read/write O I Rising
SIZ[1:0] Transfer size O I Rising
TA Transfer acknowledge I O Rising
TIP Transfer in progress O Three-state Rising
TM[2:0] Transfer modifier O Three-state Rising
TS Transfer start O I Rising
TT[1:0] Transfer type O Three-state Rising
1These signals change after the falling edge . In Chapter 20, “Electrical Specifications,” these signals are specified
off the rising edge because CLKIN is squared up internally.
Table 18-1. ColdFire Bus Signal Summary (Continued)
Signal Name Description MCF5307 Master External Master Edge
Rising-Edge
Signals
Falling-Edge
Signals
Inputs
tvo tho
tvo tho
tsi thi
BCLKO
tvo=Propagation delay of signal relative to BCLKO edge
tho=Output hold time relative to BCLKO edge
tsi=Required input setup time relative to BCLKO edge
thi=Required input hold time relative to BCLKO edge
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Chapter 18. Bus Operation 18-3
Data T ransfer Operation
18.4 Data Transfer Operation
Data transfers between the MCF5307 and other devices involve the following signals:
• Address bus (A[31:0])
• Data bus (D[31:0])
• Control signals (TS and TA)
•AS
, CSx, OE, BE/BWE
• Attribute signals (R/W, SIZ, TT, TM, and TIP)
The address bus, write data, TS, and all attribute signals change on the rising edge of
BCLKO. Read data is latched into the MCF5307 on the rising edge of BCLKO. AS, CSx,
OE, and BE/BWE change on the falling edge.
The MCF5307 bus supports byte, word, and longword operand transfers and allows
accesses to 8-, 16-, and 32-bit data ports. Transfer parameters such as port size, the number
of wait states for the external slave being accessed, and whether internal transfer
termination is enabled, can be programmed in the chip-select control registers (CSCRs) and
DRAM control registers (DACRs).
For aligned transfers larger than the port size, SIZ[1:0] behaves as follows:
• If bursting is used, SIZ[1:0] stays at the size of transfer.
• If bursting is inhibited, SIZ[1:0] first shows the size of the transfer and then shows
the port size.
Table 18-2 shows encoding for SIZ[1:0].
Figure 18-2 shows the byte lanes that external memory should be connected to and the
sequential transfers if a longword is transferred for three port sizes. For example, an 8-bit
memory should be connected to D[31:24] (BE0). A longword transfer takes four transfers
on D[31:24], starting with the MSB and going to the LSB.
Table 18-2. Bus Cycle Size Encoding
SIZ[1:0] Port Size
00 Longword
01 Byte
10 Word
11 Line
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18-4 MCF5307 User’s Manual
Data Transfer Operation
Figure 18-2. Connections for External Memory Port Sizes
The timing relationships between BCLKOchip select (CS[7:0]), byte enable/byte write
enables (BE/BWE[3:0]), and output enable (OE) are similar to their relationships with
address strobe (AS) in that all transitions occur during the lo w phase of BCLK O. Ho wev er ,
as shown in Figure 18-3, differences in on-chip signal routing and external loading may
prevent signals from asserting simultaneously.
Figure 18-3. Chip-Select Module Output Timing Diagram
18.4.1 Bus Cycle Execution
When a bus c ycle is initiated, the MCF5307 first compares its address with the base address
and mask configurations programmed for chip selects 0–7 (CSCR0–CSCR7) and for
DRAM blocks 0 and 1 address and control registers (DACR0 and DACR1). If the driven
address matches a programmed chip select or DRAM block, the appropriate chip select is
asserted or the DRAM block is selected using the specifications programmed in the
respective configuration register. Otherwise, the following occurs:
• If the address and attributes do not match in CSCR or D A CR, the MCF5307 runs an
external burst-inhibited bus cycle with a def ault of external termination on a 32-bit
port.
• If an address and attribute match in multiple CSCRs, the matching chip-select
signals are driven; ho wever , the MCF5307 runs an external b urst-inhibited bus cycle
with external termination on a 32-bit port.
• If an address and attribute match both D ACRs or a DA CR and a CSCR, the operation
is undefined.
Processor
Data Bus
Byte 0
8-Bit Port
16-Bit Port
32-Bit Port
Byte 1
Byte 2
Byte 3
Byte 0 Byte 1
Byte 2 Byte 3
Byte 0 Byte 1 Byte 2 Byte 3
D[31:24] D[23:16] D[15:8] D[7:0]
External
Memory
Memory
Memory
Byte Enable BE0 BE1 BE2 BE3
Driven with
indeterminate values
Driven with
indeterminate values
CS[7:0]
BCLKO
BE/BWE[3:0]
AS, OE
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Chapter 18. Bus Operation 18-5
Data T ransfer Operation
Table 18-3 shows the type of access as a function of match in the CSCRs and DACRs.
Basic bus operations occur in three clocks, as follows:
1. During the first clock, the address, attributes, and TS are driven. AS is asserted at the
falling edge of the clock to indicate that address and attributes are valid and stable.
2. Data and TA are sampled during the second clock of a bus-read cycle. During a read,
the external device pro vides data and is sampled at the rising edge at the end of the
second bus clock. This data is concurrent with TA, which is also sampled at the
rising clock edge.
During a write, the MCF5307 drives data from the rising clock edge at the end of the
first clock to the rising clock edge at the end of the bus cycle. Wait states can be
added between the first and second clocks by delaying the assertion of TA. TA can
be configured to be generated internally through the DACRs and CSCRs. If TA is
not generated internally, the system must provide it externally.
3. The last clock of the bus cycle uses what would be an idle clock between cycles to
provide hold time for address, attributes, and write data. Figure 18-6 and
Figure 18-8 show the basic read and write operations.
18.4.2 Data Transfer Cycle States
The data transfer operation in the MCF5307 is controlled by an on-chip state machine. Each
bus clock c ycle is divided into tw o states. Ev en states occur when BCLKO is high and odd
states occur when BCLKO is low. The state transition diagram for basic and
fast-termination read and write cycles is shown in Figure 18-4.
Table 18-3. Accesses by Matches in CSCRs and DACRs
Number of CSCR Matches Number of DACR Matches Type of Access
0 0 External
10 Defined by CSCRs
Multiple 0 External, burst-inhibited, 32-bit
01 Defined by DACRs
1 1 Undefined
Multiple 1 Undefined
0 Multiple Undefined
1 Multiple Undefined
Multiple Multiple Undefined
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18-6 MCF5307 User’s Manual
Data Transfer Operation
Figure 18-4. Data Transfer State Transition Diagram
Table 18-4 describes the states as they appear in subsequent timing diagrams. Note that the
TT[1:0], TM[2:0], and TIP functions are chosen in the PAR, as described in Section 15.1.1,
“Pin Assignment Register (PAR).”
Table 18-4. Bus Cycle States
State Cycle BCLKO Description
S0 All High The read or write cycle is initiated. On the rising edge of BCLK O, the MCF5307
places a valid address on the address b us, asserts TIP, and drives R/W high f or
a read and low for a write, if these signals are not already in the appropriate
state. The MCF5307 asserts TT[1:0], TM[2:0], SIZ[1:0], and TS on the rising
edge of BCLKO.
S1 All Low AS asserts on the falling edge of BCLKO, indicating that the address and
attributes are stable. The appropriate CSx, BE/BWE, and OE signals assert on
the BCLKO falling edge.
Fast termination TA must be asserted during S1. Data is made available by the external device
and is sampled on the rising edge of BCLKO with TA asserted.
S2 Read/write
(skipped for f ast
termination)
High TS is negated on the rising edge of BCLKO.
Write The data bus is driven out of high impedance as data is placed on the bus on
the rising edge of BCLKO.
S3 Read/write
(skipped for f ast
termination)
Low The MCF5307 waits for TA assertion. If TA is not sampled as asserted before
the rising edge of BCLKO at the end of the first clock cycle, the MCF5307
inserts wait states (full clock cycles) until TA is sampled as asserted.
Read Data is made a v ailable b y the e xternal device on the f alling edge of BCLK O and
is sampled on the rising edge of BCLKO with TA asserted.
S4 All High The external device should negate TA.
Read (including
fast termination) The external device can stop driving data after the rising edge of BCLKO.
However, data could be driven up to S5.
S0
S3
S5
S4
S1
S2
Basic
Next Cycle
Wait
States
Read/Write
Fast
Termination
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Chapter 18. Bus Operation 18-7
Data T ransfer Operation
NOTE:
An external device has at most two BCLKO cycles after the
start of S4 to three-state the data bus after data is sampled in S3.
This applies to basic read cycles, fast-termination cycles, and
the last transfer of a burst.
18.4.3 Read Cycle
During a read cycle, the MCF5307 recei ves data from memory or from a peripheral de vice.
Figure 18-5 is a read cycle flowchart.
Figure 18-5. Read Cycle Flowchart
The read cycle timing diagram is shown in Figure 18-6.
NOTE:
In the following timing diagrams, TA waveforms apply for chip
selects programmed to enable either internal or external
termination. TA assertion should look the same in either case.
S5 S5 Low AS, CS, BE/BWE, and OE are negated on the BCLKO falling edge. The
MCF5307 stops driving address lines and R/W on the rising edge of BCLKO,
terminating the read or write cycle. At the same time, the MCF5307 negates
TT[1:0], TM[2:0], TIP, and SIZ[1:0] on the rising edge of BCLKO.
Note that the rising edge of BCLKO may be the start of S0 for the next access
cycle; in this case, TIP remains asserted and R/W may not transition,
depending on the nature of the back-to-back cycles.
Read The external device stops driving data between S4 and S5.
Write The data bus returns to high impedance on the rising edge of BCLKO. The
rising edge of BCLKO may be the start of S0 for the next access.
Table 18-4. Bus Cycle States (Continued)
State Cycle BCLKO Description
System
1. Set R/W to read
2. Place address on A[31:0]
3. Assert TT[1:0], TM[2:0], TIP,
and SIZ[1:0]
4. Assert TS
5. Assert AS
6. Negate TS 1. Decode address and select the
appropriate slave device.
2. Drive data on D[31:0]
3. Assert TA
1. Sample TA low and latch data
1. Negate TA.
2. Stop driving D[31:0]
1. Start next cycle
MCF5307
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18-8 MCF5307 User’s Manual
Data Transfer Operation
Figure 18-6. Basic Read Bus Cycle
Note the following characteristics of a basic read:
• In S3, data is made available by the external device on the falling edge of BCLKO
and is sampled on the rising edge of BCLKO with TA asserted.
• In S4, the external device can stop driving data after the rising edge of BCLKO.
However, data could be driven up to S5.
• For a read cycle, the external device stops driving data between S4 and S5.
States are described in Table 18-4.
18.4.4 Write Cycle
During a write cycle, the MCF5307 sends data to memory or to a peripheral device. The
write cycle flowchart is shown in Figure 18-7.
R/W
TT[1:0], TM[2:0]
TIP
TS
D[31:0]
TA
Read
S0 S1 S2 S3 S4 S5
BCLKO
AS, CSx
BEx, OE
S
IZ[1:0], A[31:0]
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Chapter 18. Bus Operation 18-9
Data T ransfer Operation
Figure 18-7. Write Cycle Flowchart
The write cycle timing diagram is shown in Figure 18-8.
Figure 18-8. Basic Write Bus Cycle
Table 18-4 describes the six states of a basic write cycle.
18.4.5 Fast-Termination Cycles
Two clock-cycle transfers are supported on the MCF5307 bus. In most cases, this is
impractical to use in a system because the termination must take place in the same half
clock during which AS is asserted. Because this is atypical, it is not referred to as the
zero-wait-state case but is called the fast-termination case. A fast-termination cycle is one
in which an external device or memory asserts TA as soon as TS is detected. This means
that the MCF5307 samples TA on the rising edge of the second cycle of the bus transfer.
Figure 18-9 shows a read cycle with fast termination. Note that fast termination cannot be
used with internal termination.
1. Sample TA low
1. Tree-state D[31:0]
2. Start next cycle
System
1. Set R/W to write
2. Place address on A[31:0]
3. Assert TT[1:0], TM[2:0], TIP,
and SIZ[1:0]
4. Assert TS
5. Assert AS
6. Place data on D[31:0]
7. Negate TS 1. Decode address
2. Store data on D[31:0]
3. Assert TA
1. Negate TA
MCF5307
A[31:0], TT[1:0]
R/W
TIP
TS
D[31:0]
TA
S0 S1 S2 S3 S4 S5
Write
BCLKO
AS, CSx
BWEx
TM[2:0], SIZ[1:0]
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18-10 MCF5307 User’s Manual
Data Transfer Operation
Figure 18-9. Read Cycle with Fast Termination
Figure 18-10 shows a write cycle with fast termination.
Figure 18-10. Write Cycle with Fast Termination
18.4.6 Back-to-Back Bus Cycles
The MCF5307 runs back-to-back bus cycles whenever possible. For example, when a
longword read is started on a word-size b us, the processor performs two back-to-back word
read accesses. Back-to-back accesses are distinguished by the continuous assertion of TIP
throughout the cycle. Figure 18-11 shows a read back-to-back with a write.
A[31:0],TT[1:0]
R/W
TIP
TS
D[31:0]
TA
S0 S1 S4 S5
Read
BCLKO
AS, CSx
BEx, OE
TM[2:0, SIZ[1:0]]
A[31:0], TT[1:0]
R/W
TIP
TS
AS, CSx
D[31:0]
TA
S0 S1 S4 S5
Write
BCLKO
BWEx, OE
TM[2:0], SIZ[1:0]
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Chapter 18. Bus Operation 18-11
Data T ransfer Operation
Figure 18-11. Back-to-Back Bus Cycles
Basic read and write cycles are used to sho w a back-to-back cycle, but there is no restriction
as to the type of operations to be placed back to back. The initiation of a back-to-back c ycle
is not user definable.
18.4.7 Burst Cycles
The MCF5307 can be programmed to initiate burst cycles if its transfer size exceeds the
size of the port it is transferring to. For example, with bursting enabled, a word transfer to
an 8-bit port would take a 2-byte burst cycle for which SIZ[1:0] = 10 throughout. A line
transfer to a 32-bit port would take a 4-longword burst cycle, for which SIZ[1:0] = 11
throughout.
The MCF5307 bus can support 2-1-1-1 burst cycles to maximize cache performance and
optimize DMA transfers. A user can add wait states by delaying termination of the cycle.
The initiation of a burst cycle is encoded on the size pins. For b urst transfers to smaller port
sizes, SIZ[1:0] indicates the size of the entire transfer. For example, if the MCF5307 writes
a longword to an 8-bit port, SIZ[1:0] = 00 for the first byte transfer and does not change.
CSCRs are used to enable bursting for reads, writes, or both. MCF5307 memory space can
be declared burst-inhibited for reads and writes by clearing the appropriate
CSCRx[BSTR,BSTW]. A line access to a burst-inhibited region is broken into separate
port-width accesses. Unlike a burst access, SIZ[1:0] = 11 only for the first port-width
access; for the remaining accesses, SIZ[1:0] reflects the port width, with individual
accesses separated by AS ne gations. The address changes if internal termination is used b ut
does not change if external termination is used, as sho wn in Figure 18-12 and Figure 18-14.
A[31:0], TT[1:0]
R/W
TIP
TS
AS, CSx
D[31:0]
TA
Read
S0 S1 S2 S3 S4 S5 S0 S1 S2 S3 S4 S5
Write
OE
BCLKO
BE/BWEx
TM[2:0], SIZ[1:0]
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18-12 MCF5307 User’s Manual
Data Transfer Operation
18.4.7.1 Line Transfers
A line is a 16-byte-aligned, 16-byte value. Despite the alignment, a line access may not
begin on the aligned address; therefore, the b us interface supports line transfers on multiple
address boundaries. Table 18-5 shows allowable patterns for line accesses.
18.4.7.2 Line Read Bus Cycles
Figure 18-12 shows line read with zero wait states. The access starts like a basic read bus
cycle with the first data transfer sampled on the rising edge of S4, but the next pipelined
burst data is sampled a c ycle later on the rising edge of S6. Each subsequent pipelined data
burst is single cycle until the last one, which can be held for up to 2 BCLKO cycles after
TA is asserted. Note that AS and CSx are asserted throughout the burst transfer. This
example shows the timing for external termination, which differs only from the internal
termination example in Figure 18-13 in that the address lines change only at the beginning
(assertion of TS and TIP) and end (negation of TIP) of the transfer.
Figure 18-12. Line Read Burst (2-1-1-1), External Termination
Figure 18-13 shows timing when internal termination is used.
Table 18-5. Allowable Line Access Patterns
A[3:2] Longword Accesses
00 0–4–8–C
01 4–8–C–0
10 8–C–0–4
11 C–0–4–8
A[31:0], TT[1:0]
R/W
TIP
TS
AS, CSx
D[31:0]
TA
Read Read
S0 S1 S2 S3 S4 S5 S10S9S8S7S6 S11 S12
Read Read
BCLKO
BE/BWEx, OE
TM[2:0], SIZ[1:0]
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Chapter 18. Bus Operation 18-13
Data T ransfer Operation
Figure 18-13. Line Read Burst (2-1-1-1), Internal Termination
Figure 18-14 shows a line access read with one wait state programmed in CSCRx to give
the peripheral or memory more time to return read data. This figure follows the same
execution as a zero-wait state read burst with the exception of an added wait state.
.
Figure 18-14. Line Read Burst (3-2-2-2), External Termination
Figure 18-15 shows a burst-inhibited line read access with fast termination. The external
device executes a basic read cycle while determining that a line is being transferred. The
external device uses fast termination for subsequent transfers.
TT[1:0]
R/W
TIP
TS
AS, CSx
D[31:0]
TA
Read Read
S0 S1 S2 S3 S4 S5 S10S9S8S7S6 S11 S12
Read Read
BCLKO
BE/BWEx, OE
TM[2:0], SIZ[1:0]
A[31:0]
A[31:0], TT[1:0]
R/W
TIP
TS
AS, CSx
D[31:0]
TA
Read
S0 S1 S2 S3 S4 S5 S10
S9S8
S7
S6 S11S12S13
WS WS WS WS
Read Read Read
BCLKO
TM[2:0], SIZ[1:0]
BE/BWEx, OE
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18-14 MCF5307 User’s Manual
Data Transfer Operation
Figure 18-15. Line Read Burst-Inhibited, Fast, External Termination
18.4.7.3 Line Write Bus Cycles
Figure 18-16 shows a line access write with zero w ait states. It begins like a basic write b us
cycle with data driven one clock after TS. The next pipelined burst data is driven a cycle
after the write data is registered (on the rising edge of S6). Each subsequent burst takes a
single cycle. Note that as with the line read example in Figure 18-12, AS and CSx remain
asserted throughout the burst transfer. This example sho ws the behavior of the address lines
for both internal and external termination. Note that with external termination, address
lines, like SIZ, TT, and TM, hold the same value for the entire transfer.
Figure 18-16. Line Write Burst (2-1-1-1), Internal/External Termination
A[31:0]
R/W
TT[1:0]
TIP
SIZ[1:0]
TS
D[31:0]
TA
Line Longword
Basic Fast Fast Fast
A[3:2] = 00 A[3:2] = 01 A[3:2] = 10 A[3:2] = 11
S0 S1 S2 S3 S4 S5 S0 S1 S4 S5 S0 S1 S4 S5 S0 S1 S4 S5 S7S6
Read Read Read Read
BCLKO
TM[2:0]
AS, CSx
BE/BWEx, OE
A[31:0]
SIZ[1:0]
TS
AS, CSx
D[31:0]
TA
WriteWrite Write Write
S0 S1 S2 S3 S4 S5 S10S9S8S7S6 S11
TM[1:0], TT[1:0]
BCLKO
OE, BE/BWE
A[31:0]
Internal Termination
External Termination
R/W, TIP
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Chapter 18. Bus Operation 18-15
Data T ransfer Operation
Figure 18-17 shows a line burst write with one wait-state insertion.
Figure 18-17. Line Write Burst (3-2-2-2) with One Wait State, Internal Termination
Figure 18-18 shows a burst-inhibited line write. The external device executes a basic write
cycle while determining that a line is being transferred. The external device uses fast
termination to end each subsequent transfer.
Figure 18-18. Line Write Burst-Inhibited, Internal Termination
18.4.7.4 Transfers Using Mixed Por t Siz es
Figure 18-19 shows timing for a longword read from an 8-bit port using external
termination. Figure 18-20 shows the same transfer with internal termination. For both,
SIZ[1:0] change only at the start of a ne w transfer because this burst is implemented as one
A[31:0]
R/W, TIP
TM[2:0], TT[1:0]
TS
AS, CSx
D[31:0]
TA
Write Write Write Write
S0 S1 S2 S3 S4 S5 S10S9S8S7S6 S11
WS WS WS WS
BCLKO
SIZ[1:0]
OE, BWE
A[31:0]
R/W, TIP
TT[1:0]
SIZ[1:0]
TS
D[31:0]
TA
Line Longword
Basic Fast Fast Fast
A[3:2] = 00 A[3:2] = 01 A[3:2] = 10 A[3:2] = 11
Write Write Write Write
S0 S1 S2 S3 S4 S5 S0 S1 S4 S5 S0 S1 S4 S5 S0 S1 S4 S5
BCLKO
TM[2:0]
AS, CSx
O
E, BWE
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18-16 MCF5307 User’s Manual
Misaligned Operands
transfer.
Figure 18-19. Longword Read from an 8-Bit Port, External Termination
Note that with external termination, address signals do not change. With internal
termination, Figure 18-20, A[1:0] increment for the same longword transfer.
Figure 18-20. Longword Read from an 8-Bit Port, Internal Termination
18.5 Misaligned Operands
Because operands, unlike opcodes, can reside at an y byte boundary, they are allo wed to be
misaligned. A byte operand is properly aligned at any address, a word operand is
misaligned at an odd address, and a longword is misaligned at an address not a multiple of
four. Although the MCF5307 enforces no alignment restrictions for data operands
(including program counter (PC) relative data addressing), additional bus cycles are
required for misaligned operands.
A[31:0], TT[1:0]
R/W
TIP
TS
AS, CSx
D[31:0]
TA
Read Read
S0 S1 S2 S3 S4 S5 S10S9S8S7S6 S11 S12
Read Read
BCLKO
BE/BWEx, OE
TM[2:0], SIZ[1:0]
A[31:2], TT[1:0]
R/W
TIP
TS
AS, CSx
D[31:0]
TA
Read Read
Read Read
BE/BWEx, OE
TM[2:0], SIZ[1:0]
A[1:0]
S0 S1 S2 S3 S4 S5 S10S9S8S7S6 S11 S12
BCLKO
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Chapter 18. Bus Operation 18-17
Bus Errors
Instruction words and extension words (opcodes) must reside on word boundaries.
Attempting to prefetch a misaligned instruction word causes an address error exception.
The MCF5307 converts misaligned, cache-inhibited operand accesses to multiple aligned
accesses. Figure 18-21 shows the transfer of a longword operand from a byte address to a
32-bit port. In this example, SIZ[1:0] specify a byte transfer and a byte offset of 0x1. The
slave device supplies the byte and acknowledges the data transfer. When the MCF5307
starts the second cycle, SIZ[1:0] specify a w ord transfer with a byte of fset of 0x2. The next
two bytes are transferred in this cycle. In the third cycle, byte 3 is transferred. The byte
offset is now 0x0, the port supplies the final byte, and the operation is complete.
Figure 18-21. Example of a Misaligned Longword Transfer (32-Bit Port)
If an operand is cacheable and is misaligned across a cache-line boundary, both lines are
loaded into the cache. The e xample in Figure 18-22 differs from the one in Figure 18-21 in
that the operand is word-sized and the transfer takes only two bus cycles.
Figure 18-22. Example of a Misaligned Word Transfer (32-Bit Port)
NOTE:
External masters using internal MCF5307 chip selects and
default memory control signals must initiate aligned transfers.
18.6 Bus Errors
The MCF5307 has no bus monitor. If the auto-acknowledge feature is not enabled for the
address that generates the error , the bus c ycle can be terminated by asserting TA or by using
the software watchdog timer. If it is required that the MCF5307 handle a bus error
differently, an interrupt handler can be invoked by asserting an interrupt to the core along
with TA when the bus error occurs.
18.7 Interrupt Exceptions
A peripheral device uses the interrupt-request signals (IRQx) to signal the core to take an
interrupt exception when it needs the MCF5307 or is ready to send information to it. The
interrupt transfers control to an appropriate routine.
Transfer 1
Transfer 2
Transfer 3
—
—
Byte 3
Byte 0
—
—
—
Byte 1
—
—
Byte 2
—
31 24 23 16 15 8 7 0
001
010
100
A[2:0]
Transfer 1
Transfer 2
—
Byte 0
—
—
—
—
Byte 0
—
31 24 23 16 15 8 7 0
001
100
A[2:0]
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18-18 MCF5307 User’s Manual
Interrupt Exceptions
The MCF5307 has the following two levels of interrupt masking:
• Interrupt mask registers in the SIM compare interrupt inputs with programmable
interrupt mask levels. The SIM outputs only unmasked interrupts.
• The status register uses a 3-bit interrupt priority mask. The core recognizes only
interrupt requests of higher priority than the v alue in the mask. See Section 2.2.2.1,
“Status Register (SR).”
NOTE:
To mask a level 1–6 interrupt source, write a higher-level SR
interrupt mask before setting IMR. Then restore the mask to its
previous value. Do not mask a level 7 interrupt source.
The MCF5307 continuously samples and synchronizes external interrupt inputs. An
interrupt request must be held for at least two consecuti ve BCLK O periods to be considered
valid. To guarantee that the interrupt is recognized, the request level must be maintained
until the MCF5307 acknowledges the interrupt with an interrupt-acknowledge cycle.
NOTE:
Interrupt levels 1–7 are level-sensitive. Level 7 is also
edge-triggered. See Section 18.7.1, “Level 7 Interrupts.”
The MCF5307 takes an interrupt exception for a pending interrupt within one instruction
boundary after processing any higher-priority pending exception. Thus, the MCF5307
executes at least one instruction in an interrupt exception handler before recognizing
another interrupt request.
If autovector generation is used for internal interrupts (ICRn[AVEC] = 1), the interrupt
acknowledge vector is generated internally and no interrupt ackno wledge cycle is generated
on the external bus.
If autovector generation is used for external interrupts, no interrupt acknowledge cycle is
shown on the external bus (AS is not asserted) unless AVR[BLK] is 0. Consequently, the
external interrupt must be cleared in the interrupt service routine. See Section 9.2.2,
“Autovector Register (AVR).”
18.7.1 Level 7 Interrupts
Level 7 interrupts are nonmaskable and are handled differently than other interrupts.
Level 7 interrupts are edge triggered by a transition from a lower priority request to the
level 7 request. Interrupts at all other levels are level sensitive. Therefore, if IRQ7 remains
asserted, the MCF5307 recognizes only one level 7 interrupt because only one transition
from a lower level request to a level 7evel 7 request occurred. For the processor to
recognize two consecutive level 7 interrupts, one of the following must occur:
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Chapter 18. Bus Operation 18-19
Interrupt Exceptions
• The interrupt request on the interrupt control pins is raised to le vel 7 and stays there
until an interrupt-acknowledge cycle begins. The le vel later drops but then returns to
level 7, causing a second transition on the interrupt control lines.
• The interrupt request on the interrupt control pins is raised to level 7 and stays there.
If the level 7 interrupt routine lowers the mask level, a second level 7 interrupt is
recognized without a transition of the interrupt control pins. After the level 7 routine
completes, the MCF5307 compares the mask le v el to the request lev el on the IRQ x
signals. Because the mask le vel is lo wer than the requested lev el, the interrupt mask
is set back to le vel 7. To ensure it is recognized, the level 7 request on IRQ7 must be
held until the second interrupt-acknowledge bus cycle begins.
18.7.2 Interrupt-Acknowledge Cycle
When the MCF5307 processes an interrupt exception, it performs an interrupt-
ackno wledge bus cycle to obtain the v ector number that contains the starting location of the
interrupt exception handler. The interrupt-acknowledge bus cycle is a read transfer that
differs from normal read cycles in the following respects:
• TT[1:0] = 0x3 to indicate a CPU space or acknowledge bus cycle.
• TM[2:0] = the level of interrupt being acknowledged.
• A[31:5] = 0x7F_FFFF.
• A[4:2] = the interrupt request level being acknowledged (same as TM[2:0]).
• A[1:0] = 00.
During the interrupt-acknowledge bus cycle (a read cycle), the responding de vice places the
vector number on D[31:24] and the cycle is terminated normally with TA. Figure 18-23 is
a flow diagram for an interrupt-acknowledge cycle terminated with TA.
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18-20 MCF5307 User’s Manual
Bus Arbitration
Figure 18-23. Interrupt-Acknowledge Cycle Flowchart
18.8 Bus Arbitration
The MCF5307 bus protocol gives either the MCF5307 or an external device access to the
external b us. If more than one external de vice uses the bus, an e xternal arbiter can prioritize
requests and determine which device is bus master. When the MCF5307 is bus master, it
uses the bus to fetch instructions and transfer data to and from external memory. When an
external de vice is bus master, the MCF5307 can monitor the external master’ s transfers and
interact through its chip-select, DRAM control, and transfer termination signals. See
Section 10.4.1.3, “Chip-Select Control Registers (CSCR0–CSCR7),” and Chapter 11,
“Synchronous/Asynchronous DRAM Controller Module.”
Two-wire bus arbitration is used where the MCF5307 shares the bus with a single external
device. This mode uses BG and BD. The external device can ignore BR. Three-wire mode
is used where the MCF5307 shares the bus with multiple e xternal de vices. This requires an
external bus arbiter and uses BG, BD, and BR. In either mode, the MCF5307 bus arbiter
operates synchronously and transitions between states on the rising edge of BCLKO.
Table 18-6 shows the four arbitration states the MCF5307 can be in during bus operation.
Table 18-6. MCF5307 Arbitration Protocol States
State Master Bus BD Description
Reset None Not
driven Negated The MCF5307 enters reset state from any other state when RSTI or
software watchdog reset is asserted. If both are negated, the MCF5307
enters implicit or external device mastership state, depending on BG.
Implicit
master MCF5307 Not
driven Negated The MCF5307 is bus master (BG input is asserted) but is not ready to
begin a bus cycle . It continues to three-state the bus until an internal bus
request.
SYSTEM
1. Decode address and select the appropriate slave
device.
2. Drive data on D[31:24]
3. Assert TA for one BCLKO cycle
1. Read and store data (D[31:24])
2. Recognize the transfer is done
1. Negate TS
2. Drive TM[2:0] to indicate interrupt
acknowledge (TM[2:0] = interrupt level)
1. Drive 0x7FFFFF on A[31:5]
2. Drive 0x0 on A[1:0]
3. Drive interrupt level on A[4:2]
4. Drive R/W to read (R/W = 1)
5. Drive SIZ[1:0] to indicate byte (SIZ[1:0] = 01)
6. Drive TT[1:0] and TM[2:0] to indicate interrupt
acknowledge (TT[1:0] = 11; TM[2:0] = interrupt
level)
7. Assert TS for one BCLKO cycle
MCF5307
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Chapter 18. Bus Operation 18-21
General Operation of External Master Transfers
If the MCF5307 is the only possible master , BG can be tied to GND—no arbiter is needed.
18.8.1 Bus Arbitration Signals
Bus arbitration signal timings in Table 18-7 are referenced to the system clock, which is not
considered a bus signal. Clock routing is expected to meet application requirements.
18.9 General Operation of External Master Transfers
An external master asserts its hold signal (such as HOLDREQ) when it executes a bus
cycle, driving BG high and forcing the MCF5307 to hold all bus requests. During an
external master cycle, the MCF5307 can provide memory control signals (OE, CS[7:0],
BE/BWE[3:0], RAS[1:0], CAS[3:0]) and TA while the external master drives the address
and data bus and other required b us control signals. When the e xternal master asserts TS or
AS to the MCF5307, the beginning of a bus cycle is identified and the MCF5307 starts
decoding the address driven.
Explicit
master MCF5307 Driven Asserted The MCF5307 is explicit bus master when BG is asserted and at least
one bus cycle has been initiated. It asserts BD and retains explicit
mastership until BG is negated ev en if no activ e b us cycles are e xecuted.
It releases the bus at the end of the current bus cycle, then negates BD
and three-states the bus signals.
External
master External Not
driven Negated An external device is bus master (BG negated to MCF5307). The
MCF5307 can assert OE, CS[7:0], BE/BWE[3:0], TA, and all DRAM
controller signals (RAS[1:0], CAS[3:0], SRAS, SCAS, DRAMW, SCKE).
Table 18-7. ColdFire Bus Arbitration Signal Summary
Signal I/O Description
BR O Bus request. Indicates to an external arbiter that the processor needs to become bus master. BR is
negated when the MCF5307 begins an access to the external bus with no other internal accesses
pending. BR remains negated until another internal request occurs.
BG I Bus grant. An external arbiter asserts BG to indicate that the MCF5307 can control the bus at the
next rising edge of BCLKO. When the arbiter negates BG, the MCF5307 must release the bus as
soon as the current transfer completes. The external arbiter must not grant the bus to any other
device until both BD and BG are negated.
BD O Bus driven. The MCF5307 asserts BD to indicate it is current master and is driving the bus . If it loses
bus mastership during a transfer, it completes the last transfer of the current access, negates BD,
and three-states all bus signals on the rising edge of BCLKO. If it loses mastership during an idle
clock cycle, it three-states all bus signals on the rising edge of BCLKO.
Table 18-6. MCF5307 Arbitration Protocol States (Continued)
State Master Bus BD Description
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18-22 MCF5307 User’s Manual
General Operation of External Master Transfers
Note the following regarding external master accesses:
• For the MCF5307 to assert a CSx during external master accesses, CSMRn[AM]
must be set. External master hits use the corresponding CSCRn settings for
auto-acknowledge, byte enables, and wait states. See Section 10.4.1.3, “Chip-Select
Control Registers (CSCR0–CSCR7).”
• To enable DRAM control signals during external master accesses, DCMRn[AM]
must be set.
• During external master bus cycles, either TS or AS (but not both) should be driven
to the MCF5307. Driving both during a bus cycle causes indeterminate results.
External master transfers that use the MCF5307 to drive memory control signals and TA
are like normal MCF5307 transfers. Figure 18-24 shows timing for basic back-to-back b us
cycles during an external master transfer.
Figure 18-24. Basic No-Wait-State External Master Access
R/W is asserted high for reads and low for writes; otherwise, the transfers are the same. In
Figure 18-24, the MCF5307 chip select’s internal transfer acknowledge is enabled and the
MCF5307 drives TA as an output after a programmed number of wait states.
R/W
A[31:0], TT[1:0]
TIP
TS
AS
D[31:0]
TA 1
BG, BD 2
External Master
C1 C2 C4 C5 C6 C7C3 C8 C9
CS 1
BE/BWE 1
1 Depending on programming, these signals may or may not be driven by the processor.
C10 C11
BR 2
2 This signal is driven by the processor for an external master transfer.
BCLKO
HOLDREQ
S
IZ[1:0], TM[2:0]
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Chapter 18. Bus Operation 18-23
General Operation of External Master Transfers
NOTE:
Bus timing diagrams for external master transfers are not valid
for on-chip internal four-channel DMA accesses on the
MCF5307.
Timing diagrams describe transactions in general terms of bus
cycles (Cn) rather than the states (Sn) used in the bus diagrams.
Table 18-8 defines the cycles for Figure 18-24.
Figure 18-25 shows a burst line access for an external master transfer with the chip select
set to no-wait states and with internal transfer-acknowledge assertion enabled.
Table 18-8. Cycles for Basic No-Wait-State External Master Access
Cycle Definition
C1 The external master asserts HOLDREQ, signaling the MCF5307 to hold bus requests. BD should not be
asserted. The external master drives address, TS, R/W, TT[1:0], TM[2:0], TIP, and SIZ[1:0] as MCF5307
inputs.
C2–C3 The MCF5307 decodes the external master’s address and control signals to identify the proper chip select
and byte enable assertion. The external master negates TS in C2.
C4 On the falling edge of BCLKO, the MCF5307 asserts the appropriate chip select for the external master
access along with the appropriate byte enables.
C5 On the rising edge of BCLKO, data is driven onto the bus by the device selected b y CS. On the rising edge,
the MCF5307 asserts TA to indicate the cycle is complete.
C6 TA negates on the rising edge of BCLKO. On the falling edge, the MCF5307 negates the chip select and
byte enables and the next cycle can begin.
C7 The external master negates TIP on the rising edge of BCLKO.
C8 The external device retains b us mastership and driv es the address b us, TS , R/W, TT[1:0], TM[2:0], TIP, and
SIZ[1:0] as inputs to the MCF5307.
C9 The MCF5307 decodes the external master’s address and control signals to identify the proper chip select
and byte enab le assertion. The external master negates TS . The MCF5307 asserts BR on the rising edge of
BCLKO, signalling that it wants to arbitrate for the bus when the current cycle completes.
C10 The MCF5307 continues to decode the external device’s address and control signals to identify the proper
chip select and byte enable assertion.
C11 On the falling edge of BCLKO, the MCF5307 asserts the appropriate chip select for the external master
access along with the appropriate byte enables.
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18-24 MCF5307 User’s Manual
General Operation of External Master Transfers
Figure 18-25. External Master Burst Line Access to 32-Bit Port
Table 18-9 defines the cycles for Figure 18-25.
Table 18-9. Cycles for External Master Burst Line Access to 32-Bit Port
Cycle Definition
C1 The external device is bus master and asserts HOLDREQ, indicating to the MCF5307 to hold all bus
requests. In other words, BD should not be asserted. The external master drives address , TS , R/W, TT[1:0],
TM[2:0], TIP, and SIZ[1:0] as inputs to the MCF5307. SIZ[1:0] inputs indicate a line transfer. The MCF5307
is not asserting BR.
C2–C3 The MCF5307 decodes the external device’s address and control signals to identify the proper chip-select
and byte-enable assertion. The external device negates TS in C2. Address and R/W are latched in the
MCF5307 on the rising edge of BCLK O in C2. After C2, the address and R/W are ignored for the rest of the
burst transfer.
C4 On the falling edge of BCLKO, the MCF5307 asserts the appropriate chip select for the external device
access along with the appropriate byte enables.
C5 On the rising edge of BCLKO, data is driven onto the bus by the device selected by CS. The MCF5307
asserts TA on the rising edge of BCLKO, indicating the first data transfer is complete.
A[31:0]
R/W
TT[1:0], TM[2:0]
TIP
TS
AS, BR 2
D[31:0]
TA 1
BG, BD 2
External Master
C1 C2 C4 C5 C6 C7C3 C8 C9
CS 1
BE/BWE 1
1 Depending on programming, these signals may or may not be driven by the processor.
C10 C11
2 These signals are driven by the processor for an external master transfer.
BCLKO
SIZ[1:0]
HOLDREQ
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Chapter 18. Bus Operation 18-25
General Operation of External Master Transfers
18.9.1 Two-Device Bus Arbitration Protocol (Two-Wire
Mode)
Two-wire mode bus arbitration lets the MCF5307 share the external bus with a single
external bus device without requiring an external bus arbiter. Figure 18-26 shows the
MCF5307 connecting to an external device using the two-wire mode. The MCF5307 BG
input is connected to the HOLDREQ output of the external device; the MCF5307 BD
output is connected to the HOLDACK input of the external device. Because the external
device controls the state of HOLDREQ, it controls when the MCF5307 is granted the bus,
giving the MCF5307 lower priority.
Figure 18-26. MCF5307 Two-Wire Mode Bus Arbitration Interface
When the external device is not using the bus, it negates HOLDREQ, driving BG low and
granting the bus to the MCF5307. When the MCF5307 has an internal bus request pending
and BG is low, the MCF5307 drives BD low, negating HOLDACK to the external device.
When the external bus device needs the external bus, it asserts HOLDREQ, driving BG
high, requesting the MCF5307 to release the bus. If BG is negated while a bus cycle is in
progress, the MCF5307 releases the bus at the completion of the bus cycle. Note that the
MCF5307 considers the individual transfers of a burst or burst-inhibited access to be a
single bus cycle and does not release the bus until the last transfer of the series completes.
When the bus has been granted to the MCF5307, one of tw o situations can occur . In the first
case, if the MCF5307 has an internal bus request pending, the MCF5307 asserts BD to
indicate explicit bus mastership and begins the pending bus cycle by asserting TS. As
C6–C8 No-wait state data transfers 2–4 occur on the rising edges of BCLKO. TA continues to be asserted
indicating completion of each transfer. TIP, CSx, and BE/BWE[3:0] are driven.
C9 TA negates on the rising edge of BCLKO along with external device’s negation of TIP. On the falling edge,
the MCF5307 negates chip select and byte enables, creating an opportunity for another cycle to begin.
Table 18-9. Cycles for External Master Burst Line Access to 32-Bit Port (Continued)
Cycle Definition
BG
BD
BR
HOLDREQ
HOLDACK
External Bus Master
A[31:0]
R/W
SIZ[1:0]
D[31:0]
TS
TA
A[31:0]
R/W
SIZ[1:0]
D[31:0]
TS
TA
To/from external memory and control
MCF5307
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18-26 MCF5307 User’s Manual
General Operation of External Master Transfers
shown in Figure 18-25, the MCF5307 continues to assert BD until the completion of the
bus cycle. If BG is negated by the end of the bus cycle, the MCF5307 negates BD. While
BG is asserted, BD remains asserted to indicate the MCF5307 is master , and it continuously
drives the address bus, attributes, and control signals.
s
Figure 18-27. Two-Wire Bus Arbitration with Bus Request Asserted
In the second situation, the bus is granted to the MCF5307, but it does not ha ve an internal
bus request pending, so it takes implicit bus mastership. The MCF5307 does not drive the
bus and does not assert BD if the bus has an implicit master. If an internal bus request is
generated, the MCF5307 assumes explicit bus mastership. If explicit mastership was
assumed because an internal request was generated, the MCF5307 immediately begins an
access and asserts BD.
In Figure 18-28, the external device is bus master during C1 and C2. During C3 the e xternal
device releases control of the bus by asserting BG to the MCF5307. At this point, there is
an internal access pending so the MCF5307 asserts BD during C4 and begins the access.
Thus, the MCF5307 becomes the explicit e xternal b us master. Also during C4, the e xternal
device removes the grant from the MCF5307 by negating BG. As the current bus master,
the MCF5307 continues to assert BD until the current transfer completes. Because BG is
negated, the MCF5307 negates BD during C9 and three-states the external bus, thereby
returning external bus mastership to the external device.
A[31:0], TT[1:0]
R/W
TIP
TS
AS
D[31:0]
TA
BG
BD
External Master
C1 C2 C4 C5 C6 C7C3 C8 C9
MCF5307
BCLKO
SIZ[1:0], TM[2:0]
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Chapter 18. Bus Operation 18-27
General Operation of External Master Transfers
Figure 18-28. Two-Wire Implicit and Explicit Bus Mastership
In Figure 18-28, the external device is master during C1 and C2. It releases bus control in
C3 by asserting BG to the MCF5307. During C4 and C5, the MCF5307 is implicit master
because no internal access is pending. In C5, an internal bus request becomes pending,
causing the MCF5307 to become explicit bus master in C6 by asserting BD. In C7, the
external de vice remo ves the b us grant to the MCF5307. The MCF5307 does not release the
bus (the MCF5307 continues to assert BD) until the transfer ends.
NOTE:
The MCF5307 can start a transfer in the clock cycle after BG
is asserted. The external master must not assert BG to the
MCF5307 while driving the bus or the part may be damaged.
Chapter 5, “Debug Support is a MCF5307 bus arbitration state diagram. States are
described in Table 18-6.
R/W
TIP
TS
AS
D[31:0]
TA
BG
BD
External Master
Explicit
Mastership
Implicit
Mastership
C1 C2 C4 C5 C6 C7C3 C8 C9
MCF5307
BCLKO
A[31:0], TT[1:0]
SIZ[1:0], TM[2:0]
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18-28 MCF5307 User’s Manual
General Operation of External Master Transfers
Figure 18-29. MCF5307 Two-Wire Bus Arbitration Protocol State Diagram
Table 18-10 describes the two-wire bus arbitration protocol transition conditions.
Table 18-10. MCF5307 Two-Wire Bus Arbitration Protocol Transition Conditions
Present
State Condition
Label RSTI Software Watchdog
Reset BG Bus
Request Transfer in
Progress End of
Cycle1Next
State
Reset
A1 A2— — — — — Reset
A2 N3A — — — — Reset
A3NNN———
EM 4
A4 N N A — — — Implicit mas
Implicit
Master
B1NNN———EM
B2 N N A — — — Explicit mas
B3 N N A N — — Implicit mas
B4 N N A A — — Explicit mas
Explicit
Master
C1 N N A — — — Explicit mas
C2 N N N — — — Explicit mas
C3NNN—N—EM
C4 N N N — A N Explicit mas
C5 N N N — A A EM
External
Master
D1 N N N — — — EM mas
D2 N N A — — —Explicit mas
D3 N N A N — — Implicit mas
D4 N N A A — — Explicit mas
Reset
Implicit
Master
Explicit
Master
External
A1
A2
A3 A4
C3
C1
C2
C5
C4
B2
B1
B4
D2
D4
D3 B3
D1 Master
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Chapter 18. Bus Operation 18-29
General Operation of External Master Transfers
18.9.2 Multiple External Bus Device Arbitration Protocol
(Three-Wire Mode)
Three-wire mode lets the MCF5307 share the external bus with multiple external devices.
This mode requires an external arbiter to assign priorities to each potential master and to
determine which device accesses the external bus. The arbiter uses the MCF5307 bus
arbitration signals, BR, BD, and BG, to control use of the external bus by the MCF5307.
The MCF5307 requests the bus from the e xternal bus arbiter by asserting BR when the core
requests an access. It continues to assert BR until after the transfer starts. It can negate BR
at any time re gardless of the BG status. If the MCF5307 is granted the bus when an internal
bus request is generated, it asserts BD and the access begins immediately. The MCF5307
always drives BR and BD, which cannot be directly wire-ORed with other devices.
The external arbiter asserts BG to grant the bus to MCF5307, which can begin a bus cycle
after the next rising edge of BCLKO. If BG is negated during a bus cycle, the MCF5307
releases the bus when the cycle completes. To guarantee that the bus is released, BG must
be negated before the rising edge of the BCLKO in which the last TA is asserted. Note that
the MCF5307 treats any series of burst or a burst-inhibited transfers as a single bus cycle
and does not release the bus until the last transfer of the series completes.
When the MCF5307 is granted the bus after it asserts BR, one of two things can occur. If
the MCF5307 has an internal bus request pending, it asserts BD, indicating explicit bus
mastership, and begins the pending bus cycle by asserting TS. The MCF5307 continues to
assert BD until the external bus arbiter negates BG, after which BD is negated at the
completion of the bus c ycle. As long as BG is asserted, BD remains asserted to indicate that
the MCF5307 is bus master, and the MCF5307 continuously drives the address bus,
attributes, and control signals.
If no internal request is pending, the MCF5307 takes implicit bus mastership. It does not
drive the bus and does not assert BD if the bus has an implicit master. If an internal bus
request is generated, the MCF5307 assumes explicit bus mastership and immediately
begins an access and asserts BD. Figure 18-30 shows implicit and explicit bus mastership
due to generation of an internal bus request.
1Both normal terminations and terminations due to bus errors generate an end of cycle. Bus cycles resulting from
a burst-inhibited transfer are considered part of that original transfer.
2A means asserted.
3N means negated.
4EM means external master.
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18-30 MCF5307 User’s Manual
General Operation of External Master Transfers
Figure 18-30. Three-Wire Implicit and Explicit Bus Mastership
In Figure 18-30, the external device is bus master during C1 and C2, releasing control in
C3, at which time the external arbiter asserts BG to the MCF5307. During C4 and C5, the
MCF5307 is implicit master because no internal access is pending. In C5, an internal bus
request becomes pending, causing the MCF5307 to take explicit bus mastership in C6 by
asserting BR and BD. In C7, the external device removes the bus grant to the MCF5307.
The MCF5307 does not release the bus (the MCF5307 asserts BD) until the transfer ends.
NOTE:
The MCF5307 can start a transfer in the cycle after BG is
asserted. The external arbiter should not assert BG to the
MCF5307 until the previous external master stops driving the
bus. Asserting BG during another external master’s transfer
may damage the part.
R/W
TIP
TS
AS
D[31:0]
TA
BG
BD
External Master
Explicit
Mastership
Implicit
Mastership
C1 C2 C4 C5 C6 C7C3 C8 C9
BR
MCF5307
BCLKO
A[31:0], TT[1:0]
SIZ[1:0], TM[2:0]
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Chapter 18. Bus Operation 18-31
General Operation of External Master Transfers
Figure 18-31. Three-Wire Bus Arbitration
In Figure 18-31, the external device is bus master during C1 and C2. During C2, the
MCF5307 requests the external bus because of a pending internal transfer. On C3, the
external releases mastership and the external arbiter grants the bus to the MCF5307 by
asserting BG. At this point, an internal is access pending so the MCF5307 asserts BD
during C4 and begins the access. Thus, the MCF5307 becomes the explicit bus master. Also
during C4, the external arbiter removes the grant from the MCF5307 by negating BG.
Because the MCF5307 is bus master, it continues to assert BD until the current transfer
completes. Because BG is negated, the MCF5307 negates BD during C9 and three-states
the external bus, thereby passing mastership to an external device.
The MCF5307 can assert BR to signal the external arbiter that it needs the bus. However,
there is no guarantee that when the bus is granted to the MCF5307 that a bus cycle will be
performed. At best, BR must be used as a status output that indicates when the MCF5307
needs the bus, b ut not as an indication that the MCF5307 is in a certain bus arbitration state.
Figure 18-32 is a high-level state diagram for MCF5307 bus arbitration protocol.
Table 18-6 describes the four states shown in Figure 18-32.
R/W
TIP
TS
AS
D[31:0]
TA
BG
BD
External
Master
C1 C2 C4 C5 C6 C7C3 C8 C9
BR
MCF5307
BCLKO
A[31:0], TT[1:0]
SIZ[1:0], TM[2:0]
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18-32 MCF5307 User’s Manual
General Operation of External Master Transfers
Figure 18-32. Three-Wire Bus Arbitration Protocol State Diagram
Table 18-11 lists conditions that cause state transitions.
Table 18-11. Three-Wire Bus Arbitration Protocol Transition Conditions
Current
State Condition
Label RSTI Software
Watchdog
Reset BG Bus
Request
Transfer
in
Progress
End of
Cycle 1Next State
Reset A1 Asserted —————Reset
A2 Negated Asserted ————Reset
A3 Negated Negated Negated ———EM
A4 Negated Negated Asserted ———Implicit
master
Implicit
master B1 Negated Negated Negated ———External
device
master
B2 Negated Negated Asserted ———Explicit
master
B3 Negated Negated Asserted Negated ——Implicit
master
B4 Negated Negated Asserted Asserted ——Explicit
master
Reset
Implicit
Master
Explicit
Master
External
A1
A2
A3 A4
C3
C1
C2
C5
C4
B2
B1
B4
D2
D4
D3 B3
D1 Master
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Chapter 18. Bus Operation 18-33
Reset Operation
The bus arbitration state diagram can be used for the MCF5307 three-wire bus arbitration
protocol to approximate the high-le vel beha vior of the MCF5307. It is assumed that all TS
or AS signals in a system are tied together and each bus device’s BD and BR signals are
connected individually to the external arbiter. The external arbiter must ensure that any
external masters will ha ve released the bus after the ne xt rising edge of before asserting BG
to the MCF5307. The MCF5307 does not monitor e xternal bus master operation re g arding
bus arbitration.
NOTE:
The MCF5307 can start a transfer on the rising edge of the
cycle after BG is asserted. The external arbiter should not assert
BG to the MCF5307 until the previous external master stops
driving the bus or the part may be damaged.
18.10 Reset Operation
The MCF5307 supports two types of reset. Asserting RSTI resets the entire MCF5307. A
software watchdog reset resets everything but the internal PLL module.
Explicit
master C1 Negated Negated Asserted ———Explicit
master
C2 Negated Negated Negated ———Explicit
master
C3 Negated Negated Negated —Negated —External
device
master
C4 Negated Negated Negated —Yes Negated Explicit
master
C5 Negated Negated Negated —Yes Yes External
device
master
External
master D1 Negated Negated Negated1———External
device
master
D2 Negated Negated Asserted ———Explicit
master
D3 Negated Negated Asserted Negated ——Implicit
master
D4 Negated Negated Asserted Asserted ——Explicit
master
1Both normal terminations and terminations due to bus errors generate an end of cycle . Bus cycles resulting from
a burst-inhibited transfer are considered part of that original transfer.
Table 18-11. Three-Wire Bus Arbitration Protocol Transition Conditions (Continued)
Current
State Condition
Label RSTI Software
Watchdog
Reset BG Bus
Request
Transfer
in
Progress
End of
Cycle 1Next State
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18-34 MCF5307 User’s Manual
Reset Operation
18.10.1 Master Reset
To perform a master reset, an external device asserts RSTI. When power is applied to the
system, external circuitry should assert RSTI for a minimum of 80 CLKIN c ycles after Vcc
is within tolerance. Figure 18-33 is a functional timing diagram of the master reset
operation, sho wing relationships among Vcc, RSTI, mode selects, and bus signals. CLKIN
must be stable by the time Vcc reaches the minimum operating specification. CLKIN
should start oscillating as Vcc is ramped up to clear out contention internal to the MCF5307
caused by the random states of internal flip-flops on power up. RSTI is internally
synchronized for two CLKIN cycles before being used and must meet the specified setup
and hold times in relationship to CLKIN to be recognized.
Figure 18-33. Master Reset Timing
During the master reset period, all signals capable of being three-stated are driven to a
high-impedance; all others are negated. When RSTI negates, all bus signals remain in a
high-impedance state until the MCF5307 is granted the bus and the core be gins the first bus
cycle for reset e xception processing. A master reset causes any bus c ycle (including DRAM
refresh cycle) to terminate and initializes registers appropriately for a reset exception.
Note that during reset D[7:0] are sampled on the negating edge of RSTI for initial
MCF5307 configurations listed in Table 18-12.
RSTI
D[7:0]
Bus Signals
BD
BR
RSTO
100K CLKIN cycles
PLL lock time
>80 CLKIN cycles
VCC
CLKIN
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Chapter 18. Bus Operation 18-35
Reset Operation
See Section 17.5.5, “Data/Configuration Pins (D[7:0]).” Motorola recommends that the
data pins be driven rather than using a weak pull-up or pull-down resistor. Table 17-1 lists
the encoding of these pins sampled at reset.
18.10.2 Software Watchdog Reset
A software watchdog reset is performed if the executing software does not provide the
correct write data sequence with the enable-control bit set. This reset helps pre vent runaway
software or unterminated bus cycles. Figure 18-34 is a functional timing diagram of the
software watchdog reset operation, showing RSTO and bus signal relationships.
Table 18-12. Data Pin Configuration
Pin Function
D7 Auto-Acknowledge Configuration (AA_CONFIG)
D[6:5] Port Size Configuration (PS_CONFIG[1:0])
D4 Address Configuration (ADDR_CONFIG/D4)
D[3:2] Frequency of CLKIN (FREQ[1:0])
D[1:0] Ratio of BCLKO/Processor Clock {DIVIDE[1:0])
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18-36 MCF5307 User’s Manual
Reset Operation
Figure 18-34. Software Watchdog Reset Timing
During the software watchdog reset period, all signals that can be are driven to a
high-impedance state; all those that cannot be are negated. When RSTO negates, bus
signals remain in a high-impedance state until the MCF5307 is granted the bus and the
ColdFire core begins the first bus cycle for reset exception processing.
100K CLKIN
D[7:0] latched
>80 CLKIN
BCLKO
CLKIN
RSTI
BCLKO
BCLKO
PSTCLK
RSTO
30 BCLKO
20 BCLKO
15 BCLKO
(1/2 MODE)
(1/3 MODE)
(1/4 MODE)
D[7:0]
Cycle Lock Time
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Chapter 19. IEEE 1149.1 T est Access P ort (JT A G) 19-1
Chapter 19
IEEE 1149.1 Test Access Por t (JTAG)
This chapter describes configuration and operation of the MCF5307 JTAG test
implementation. It describes the use of JTA G instructions and provides information on ho w
to disable JTAG functionality.
19.1 Overview
The MCF5307 dedicated user-accessible test logic is fully compliant with the publication
Standard Test Access Port and Boundary-Scan Ar chitectur e, IEEE Standard 1149.1. Use the
follo wing description in conjunction with the supporting IEEE document listed above. This
section includes the description of those chip-specific items that the IEEE standard requires
as well as those items specific to the MCF5307 implementation.
The MCF5307 JTAG test architecture supports circuit board test strategies based on the
IEEE standard. This architecture provides access to all data and chip control pins from the
board-edge connector through the standard four-pin test access port (TAP) and the JTAG
reset pin, TRST. Test logic design is static and is independent of the system logic except
where the JTAG is subordinate to other complimentary test modes, as described in
Chapter 5, “Debug Support.” When in subordinate mode, JTAG test logic is placed in reset
and the TAP pins can be used for other purposes, as described in Table 19-1.
The MCF5307 JTAG implementation can do the following:
• Perform boundary-scan operations to test circuit board electrical continuity
• Bypass the MCF5307 by reducing the shift register path to a single cell
• Set MCF5307 output drive pins to fixed logic values while reducing the shift register
path to a single cell
• Sample MCF5307 system pins during operation and transparently shift out the result
• Protect MCF5307 system output and input pins from backdriving and random
toggling (such as during in-circuit testing) by placing all system pins in high-
impedance state
NOTE:
IEEE Standard 1149.1 may interfere with system designs that do
not incorporate JTAG capability. Section 19.6, “Disabling IEEE
Standard 1149.1 Operation,” describes precautions for ensuring
that this logic does not affect system or debug operation.
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19-2 MCF5307 User’s Manual
JTAG Signal Descriptions
Figure 19-1 is a block diagram of the MCF5307 implementation of the 1149.1 IEEE
standard. The test logic includes several test data registers, an instruction register,
instruction register control decode, and a 16-state dedicated TAP controller.
Figure 19-1. JTAG Test Logic Block Diagram
19.2 JTAG Signal Descriptions
JTA G operation on the MCF5307 is enabled when MTMOD0 is high (logic 1), as described
in Table 19-1. Otherwise, JTAG TAP signals, TCK, TMS, TDI, TDO, and TRST, are
interpreted as the debug port pins. MTMOD0 should not be changed while RSTI is
asserted.
Table 19-1. JTAG Pin Descriptions
Pin Description
TCK Test clock. The dedicated JTAG test logic clock is independent of the MCF5307 processor clock. Various
JTAG operations occur on the rising or falling edge of TCK. Internal JTAG controller logic is designed such
that holding TCK high or low indefinitely does cause the JTAG test logic to lose state information. If TCK is
not used, it should be tied to ground.
TMS/
BKPT Test mode select (MTMOD0 high)/breakpoint (MTMOD0 low). TMS provides the JTAG controller with
information to determine the test operation mode. The states of TMS and of the internal 16-state JTAG
controller state machine at the rising edge of TCK determine whether the JTAG controller holds its current
state or advances to the next state. This directly controls whether JTAG data or instruction operations
occur. TMS has an internal pull-up, so if it is not driven low, its value defaults to a logic level of 1. If TMS is
not used, it should be tied to VDD. BKPT signals a hardware breakpoint to the processor in debug mode.
See Chapter 5, “Debug Support.”
Test Data Registers
TDI
TMS
TRST
TDO
V+
V+
V+ Boundary Scan Register
ID Code
Bypass
3-Bit Instruction Register
3-Bit Instruction Decode M
U
X
TAP
M
U
X
TCK
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Chapter 19. IEEE 1149.1 T est Access P ort (JT A G) 19-3
TAP Controller
19.3 TAP Controller
The state of TMS at the rising edge of TCK determines the current state of the TAP
controller. The TAP controller can follow two basic two paths, one for executing JTAG
instructions and the other for manipulating JTAG data based on JTAG instructions. The
v arious states of the TAP controller are shown in Figure 19-2. For more detail on each state,
see the IEEE Standard 1149.1 JTAG document. Note that regardless of the TAP controller
state, test-logic-reset can be entered if TMS is held high for at least five rising edges of
TCK. Figure 19-2 shows the JTAG TAP controller state machine.
TDI/DSI Test data input (MTMOD0 high)/dev elopment serial input (MTMOD0 low). TDI pro vides the serial data port
for loading the JTAG boundary-scan, bypass, and instruction registers. Shifting in of data depends on the
state of the JTAG controller state machine and the instruction in the instruction register. This shift occurs on
the rising edge of TCK. TDI has an internal pull-up so if it is not driven low its v alue defaults to a logical 1. If
TDI is not used, it should be tied to VDD.
DSI provides single-bit communication for debug module commands. See Chapter 5, “Debug Support.”
TDO/
DSO Test data output (MTMOD0 high)/development serial output (MTMOD0 low). TDO is the serial data port for
outputting data from JTAG logic. Shifting data out depends on the state of the JTAG controller state
machine and the instruction currently in the instruction register. This shift occurs on the f alling edge of TCK.
When not outputting test data, TDO is three-stated. It can also be placed in three-state mode to allow
bussed or parallel connections to other devices having JTAG. DSO provides single-bit communication for
debug module commands. See Chapter 5, “Debug Support.”
TRST/
DSCLK Test reset (MTMOD0 high)/development serial clock (MTMOD0 low). As TRST, this pin asynchronously
resets the internal JTAG controller to the test logic reset state, causing the JTAG instruction register to
choose the IDCODE instruction. When this occurs, all JTAG logic is benign and does not interfere with
normal MCF5307 functionality. Although this signal is asynchronous, Motorola recommends that TRST
make only an asserted-to-negated transition while TMS is held at a logic 1 value. TRST has an internal
pull-up; if it is not driven low its value defaults to a logic level of 1. However, if TRST is not used, it can
either be tied to ground or, if TCK is clocked, to VDD. The former connection places the JTAG controller in
the test logic reset state immediately; the latter connection eventually puts the JTAG controller (if TMS is a
logic 1) into the test logic reset state after 5 TCK cycles.
DSCLK is the development serial clock for the serial interface to the debug module.The maximum DSCLK
frequency is 1/2 the BCLKO frequency. See Chapter 5, “Debug Support.”
Table 19-1. JTAG Pin Descriptions
Pin Description
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19-4 MCF5307 User’s Manual
JTAG Register Descriptions
Figure 19-2. JTAG TAP Controller State Machine
19.4 JTAG Register Descriptions
The following sections describe the JTAG registers implemented on the MCF5307.
Test-Logic-Reset
TLR
Run-Test-Idle
RTI Select-DR-Scan
SeDR
Capture-IR
Update-IR
Exit2-IR
Pause-IR
Exit1-IR
Shift-IR
Capture-DR
Update-DR
Exit2-DR
Pause-DR
Exit1-DR
Shift-DR
0
0
0
1
0
1
1
0
0
0
1
1
0
11
11
0
11
11
00
0
1
CaDR
ShDR
E1DR
PaDR
CaIR
ShIR
E1IR
PaIR
<-- Value of TMS at rising edge of TCK
Select-IR-Scan
SeIR
1
0
0 0
1
0
UpIRUpDR
E2DR E2IR
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Chapter 19. IEEE 1149.1 T est Access P ort (JT A G) 19-5
JTAG Register Descriptions
19.4.1 JTAG Instruction Shift Register
The MCF5307 IEEE Standard 1149.1 implementation uses a 3-bit instruction-shift register
(IR) without parity. This register transfers its value to a parallel hold register and applies
one of six instructions on the falling edge of TCK when the TAP state machine is in
Update-IR state. To load instructions into the shift portion of the register, place the serial
data on TDI before each rising edge of TCK. The msb of the instruction shift re gister is the
bit closest to the TDI pin, and the lsb is the bit closest to TDO.
Table 19-2 describes customer-usable instructions.
Table 19-2. JTAG Instructions
Instruction Class IR Description
EXTEST
(EXT) Required 000 Selects the boundary-scan register. Forces all output pins and bidirectional pins
configured as outputs to the preloaded fixed values (with the SAMPLE/PRELOAD
instruction) and held in the boundary-scan update registers. EXTEST can also
configure the direction of bidirectional pins and establish high-impedance states on
some pins. EXTEST becomes active on the falling edge of TCK in the Update-IR state
when the data held in the instruction-shift register is equivalent to octal 0.
IDCODE
(IDC) Optional 001 Selects the IDCODE register for connection as a shift path between TDI and TDO.
Interrogates the MCF5307 for version number and other part identification. The
IDCODE register is implemented in accordance with IEEE Standard 1149.1 so the lsb
of the shift register stage is set to logic 1 on the rising edge of TCK f ollowing entry into
the capture-DR state. Therefore, the first bit shifted out after selecting the IDCODE
register is always a logic 1. The remaining 31-bits are also set to fixed values. See
Section 19.4.2, “IDCODE Register.”
IDCODE is the default value in the IR when a JTAG reset occurs by either asserting
TRST or holding TMS high while clocking TCK through at least five rising edges and
the falling edge after the fifth rising edge. A JTAG reset causes the TAP state machine
to enter test-logic-reset state (normal operation of the TAP state machine into the
test-logic-reset state also places the default value of octal 1 into the instruction
register). The shift register portion of the instruction register is loaded with the default
value of octal 1 in Capture-IR state and a TCK rising edge occurs.
SAMPLE/
PRELOAD
(SMP)
Required 100 Provides two separate functions. It obtains a sample of the system data and control
signals at the MCF5307 input pins and before the boundary-scan cell at the output
pins. This sampling occurs on the rising edge of TCK in the capture-DR state when an
instruction encoding of octal 4 is in the instruction register. Sampled data is observed
by shifting it through the boundary-scan register to TDO by using shift-DR state. The
data capture and shift are transparent to system operation. The users must provide
external synchronization to achieve meaningful results because there is no internal
synchronization between TCK and CLK.
SAMPLE/PRELOAD also initializes the boundary-scan register update cells before
selecting EXTEST or CLAMP. This is done by ignoring data shifted out of TDO while
shifting in initialization data. The Update-DR state in conjunction with the falling edge
of TCK can then transfer this data to the update cells. This data is applied to external
outputs when an instruction listed above is applied.
HIGHZ
(HIZ) Optional 101 Anticipates the need to backdrive outputs and protects inputs from random toggling
during board testing. Selects the bypass register, forcing all output and bidirectional
pins into high-impedance.
HIGHZ goes active on the falling edge of TCK in the Update-IR state when instruction
shift register data held is equivalent to octal 5.
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19-6 MCF5307 User’s Manual
JTAG Register Descriptions
The IEEE Standard 1149.1 requires the EXTEST, SAMPLE/PRELOAD, and BYPASS
instructions. IDCODE, CLAMP, and HIGHZ are optional standard instructions that the
MCF5307 implementation supports and are described in the IEEE Standard 1149.1.
19.4.2 IDCODE Register
The MCF5307 includes an IEEE Standard 1149.1-compliant JTAG identification register,
IDCODE, which is read by the MCF5307 JTAG instruction encoded as octal 1.
Table 19-3 describes IDCODE bit assignments.
CLAMP
(CMP) Optional 110 Selects the bypass register and asserts functional reset while forcing all output and
bidirectional pins configured as outputs to fixed, preloaded values in the
boundary-scan update registers. Enhances test efficiency b y reducing the o v erall shift
path to one bit (the bypass register) while conducting an EXTEST type of instruction
through the boundary-scan register. CLAMP becomes active on the falling edge of
TCK in the Update-IR state when instruction-shift register data is equivalent to octal 6.
BYPASS
(BYP) Required 111 Selects the single-bit bypass register, creating a single-bit shift register path from TDI
to the bypass register to TDO. Enhances test efficiency by reducing the overall shift
path when a device other than the MCF5307 is under test on a board design with
multiple chips on the ov erall 1149.1 defined boundary-scan chain. The b ypass register
is implemented in accordance with 1149.1 so the shift register stage is set to logic 0
on the rising edge of TCK f ollowing entry into the capture-DR state. Therefore, the first
bit shifted out after selecting the bypass register is always a logic 0 (to differentiate a
part that supports an IDCODE register from a part that supports only the bypass
register).
BYPASS goes active on the falling edge of TCK in the Update-IR state when
instruction shift register data is equivalent to octal 7.
31 30 29 28 2
72
62
52
42
32
22
12
01
91
81
71
61
51
41
31
21
11
09876543210
Version Number
(0000 forH55J, 0001 for J20C) 0100110000000011000000011101
Table 19-3. IDCODE Bit Assignments
Bits Description
31–28 Version number. Indicates the revision number of the MCF5307
27–22 Design center. Indicates the ColdFire design center
21–12 Device number. Indicates an MCF5307
11–1 Indicates the reduced JEDEC ID for Motorola. Joint Electron Device Engineering Council (JEDEC)
Publication 106-A and Chapter 11 of the IEEE Standard 1149.1 give more information on this field.
0 Identifies this as the JTAG IDCODE register (and not the bypass register) according to the IEEE Standard
1149.1
Table 19-2. JTAG Instructions (Continued)
Instruction Class IR Description
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Chapter 19. IEEE 1149.1 T est Access P ort (JT A G) 19-7
JTAG Register Descriptions
19.4.3 JTAG Boundary-Scan Register
The MCF5307 model includes an IEEE Standard 1149.1-compliant boundary-scan register
connected between TDI and TDO when the EXTEST or SAMPLE/PRELO AD instructions
are selected. This register captures signal data on the input pins, forces fixed values on the
output pins, and selects the direction and drive characteristics (a logic value or high
impedance) of the bidirectional and three-state pins. Table 19-4 shows MCF5307
boundary-scan register bits.
Table 19-4. Boundary-Scan Bit Definitions
Bit Cell Type Pin Cell Pin Type Bit Cell Type Pin Cell Pin Type
0 O.Ctl PP0 enable —120 O.Pin BE0 O
1 O.Pin PP0 I/O 121 O.Pin SCKE O
2 I.Pin PP0 I/O 122 O.Pin SCAS O
3 IO.Ctl PP1 enable —123 O.Pin SRAS O
4 O.Pin PP1 I/O 124 O.Pin DRAMW O
5 I.Pin PP1 I/O 125 O.Pin CAS3 O
6 IO.Ctl PP2 enable —126 O.Pin CAS2 O
7 O.Pin PP2 I/O 127 O.Pin CAS1 O
8 I.Pin PP2 I/O 128 O.Pin CAS0 O
9 IO.Ctl PP3 enable —129 O.Pin RAS1 O
10 O.Pin PP3 I/O 130 O.Pin RAS0 O
11 I.Pin PP3 I/O 131 I.Pin TIN1 I
12 IO.Ctl PP4 enable —132 I.Pin TIN0 I
13 O.Pin PP4 I/O 133 O.Pin TOUT0 O
14 I.Pin PP4 I/O 134 O.Pin TOUT1 O
15 IO.Ctl PP5 enable —135 I.Pin BG I
16 O.Pin PP5 I/O 136 O.Pin BD O
17 I.Pin PP5 I/O 137 O.Pin BR O
18 IO.Ctl PP6 enable —138 I.Pin IRQ1 I
19 O.Pin PP6 I/O 139 I.Pin IRQ3 I
20 I.Pin PP6 I/O 140 I.Pin IRQ5 I
21 IO.Ctl PP7 enable —141 I.Pin IRQ7 I
22 O.Pin PP7 I/O 142 I.Pin RSTI I
23 I.Pin PP7 I/O 143 O.Pin TS I/O
24 O.Pin PST3 O 144 I.Pin TS I/O
25 O.Pin PST2 O 145 IO.Ctl TA enable —
26 O.Pin PST1 O 146 O.Pin TA I/O
27 O.Pin PST0 O 147 I.Pin TA I/O
28 O.Pin DDATA3 O 148 O.Pin R/W I/O
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19-8 MCF5307 User’s Manual
JTAG Register Descriptions
29 O.Pin DDATA2 O 149 I.Pin R/W I/O
30 O.Pin DDATA1 O 150 O.Pin AS I/O
31 O.Pin DDATA0 O 151 I.Pin AS I/O
32 O.Pin PSTCLK O 152 O.Pin CS7 O
33 I.Pin CLKIN I 153 O.Pin CS6 O
34 IO.Ctl RSTO enable —154 O.Pin CS5 O
35 O.Pin RSTO I/O 155 O.Pin CS4 O
36 I.Pin RSTO I/O 156 O.Pin CS3 O
37 O.Pin BCLKO O 157 O.Pin CS2 O
38 I.Pin EDGESEL I 158 O.Pin CS1 O
39 O.Pin TXD0 O 159 O.Pin CS0 O
40 I.Pin RXD0 I 160 O.Pin OE O
41 O.Pin RTS0 O 161 O.Pin SIZ1 I/O
42 I.Pin CTS0 I 162 I.Pin SIZ1 I/O
43 O.Pin TXD1 O 163 O.Pin SIZ0 I/O
44 I.Pin RXD1 I 164 I.Pin SIZ0 I/O
45 O.Pin RTS1 O 165 IO.Ctl PP15 enable —
46 I.Pin CTS1 I 166 I.Pin PP15 I/O
47 I.Pin HIZ I 167 O.Pin PP15 I/O
48 IO.Ctl Data enable —168 IO.Ctl PP14 enable —
49 O.Pin D0 I/O 169 I.Pin PP14 I/O
50 I.Pin D0 I/O 170 O.Pin PP14 I/O
51 O.Pin D1 I/O 171 IO.Ctl PP13 enable —
52 I.Pin D1 I/O 172 I.Pin PP13 I/O
53 O.Pin D2 I/O 173 O.Pin PP13 I/O
54 I.Pin D2 I/O 174 IO.Ctl PP12 enable —
55 O.Pin D3 I/O 175 I.Pin PP12 I/O
56 I.Pin D3 I/O 176 O.Pin PP12 I/O
57 O.Pin D4 I/O 177 IO.Ctl PP11 enable —
58 I.Pin D4 I/O 178 I.Pin PP11 I/O
59 O.Pin D5 I/O 179 O.Pin PP11 I/O
60 I.Pin D5 I/O 180 IO.Ctl PP10 enable —
61 O.Pin D6 I/O 181 I.Pin PP10 I/O
62 I.Pin D6 I/O 182 O.Pin PP10 I/O
63 O.Pin D7 I/O 183 IO.Ctl PP9 enable —
64 I.Pin D7 I/O 184 I.Pin PP9 I/O
Table 19-4. Boundary-Scan Bit Definitions
Bit Cell Type Pin Cell Pin Type Bit Cell Type Pin Cell Pin Type
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Chapter 19. IEEE 1149.1 T est Access P ort (JT A G) 19-9
JTAG Register Descriptions
65 O.Pin D8 I/O 185 O.Pin PP9 I/O
66 I.Pin D8 I/O 186 IO.Ctl PP8 enable —
67 O.Pin D9 I/O 187 I.Pin PP8 I/O
68 I.Pin D9 I/O 188 O.Pin PP8 I/O
69 O.Pin D10 I/O 189 IO.Ctl TS/R/W/SIZ enable —
70 I.Pin D10 I/O 190 IO.Ctl Address enable —
71 O.Pin D11 I/O 191 O.Pin A23 I/O
72 I.Pin D11 I/O 192 I.Pin A23 I/O
73 O.Pin D12 I/O 193 O.Pin A22 I/O
74 I.Pin D12 I/O 194 I.Pin A22 I/O
75 O.Pin D13 I/O 195 O.Pin A21 I/O
76 I.Pin D13 I/O 196 I.Pin A21 I/O
77 O.Pin D14 I/O 197 O.Pin A20 I/O
78 I.Pin D14 I/O 198 I.Pin A20 I/O
79 O.Pin D15 I/O 199 O.Pin A19 I/O
80 I.Pin D15 I/O 200 I.Pin A19 I/O
81 O.Pin D16 I/O 201 O.Pin A18 I/O
82 I.Pin D16 I/O 202 I.Pin A18 I/O
83 O.Pin D17 I/O 203 O.Pin A17 I/O
84 I.Pin D17 I/O 204 I.Pin A17 I/O
85 O.Pin D18 I/O 205 O.Pin A16 I/O
86 I.Pin D18 I/O 206 I.Pin A16 I/O
87 O.Pin D19 I/O 207 O.Pin A15 I/O
88 I.Pin D19 I/O 208 I.Pin A15 I/O
89 O.Pin D20 I/O 209 O.Pin A14 I/O
90 I.Pin D20 I/O 210 I.Pin A14 I/O
91 O.Pin D21 I/O 211 O.Pin A13 I/O
92 I.Pin D21 I/O 212 I.Pin A13 I/O
93 O.Pin D22 I/O 213 O.Pin A12 I/O
94 I.Pin D22 I/O 214 I.Pin A12 I/O
95 O.Pin D23 I/O 215 O.Pin A11 I/O
96 I.Pin D23 I/O 216 I.Pin A11 I/O
97 O.Pin D24 I/O 217 O.Pin A10 I/O
98 I.Pin D24 I/O 218 I.Pin A10 I/O
99 O.Pin D25 I/O 219 O.Pin A9 I/O
100 I.Pin D25 I/O 220 I.Pin A9 I/O
Table 19-4. Boundary-Scan Bit Definitions
Bit Cell Type Pin Cell Pin Type Bit Cell Type Pin Cell Pin Type
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19-10 MCF5307 User’s Manual
Restrictions
19.4.4 JTAG Bypass Register
The IEEE Standard 1149.1-compliant bypass register creates a single-bit shift re gister path
from TDI to the bypass register to TDO when the BYPASS instruction is selected.
19.5 Restrictions
Test logic design is static, so TCK can be stopped in high or low state with no data loss.
However, system logic uses a different system clock not internally synchronized to TCK.
Operation mixing 1149.1 test logic with system functional logic that uses both clocks must
coordinate and synchronize these clocks externally to the MCF5307.
101 O.Pin D26 I/O 221 O.Pin A8 I/O
102 I.Pin D26 I/O 222 I.Pin A8 I/O
103 O.Pin D27 I/O 223 O.Pin A7 I/O
104 I.Pin D27 I/O 224 I.Pin A7 I/O
105 O.Pin D28 I/O 225 O.Pin A6 I/O
106 I.Pin D28 I/O 226 I.Pin A6 I/O
107 O.Pin D29 I/O 227 O.Pin A5 I/O
108 I.Pin D29 I/O 228 I.Pin A5 I/O
109 O.Pin D30 I/O 229 O.Pin A4 I/O
110 I.Pin D30 I/O 230 I.Pin A4 I/O
111 O.Pin D31 I/O 231 O.Pin A3 I/O
112 I.Pin D31 I/O 232 I.Pin A3 I/O
113 O.Pin SDA OD 233 O.Pin A2 I/O
114 I.Pin SDA I 234 I.Pin A2 I/O
115 O.Pin SCL OD 235 O.Pin A1 I/O
116 I.Pin SCL I 236 I.Pin A1 I/O
117 O.Pin BE3 O 237 O.Pin A0 I/O
118 O.Pin BE2 O 238 I.Pin A0 I/O
119 O.Pin BE1 O
Table 19-4. Boundary-Scan Bit Definitions
Bit Cell Type Pin Cell Pin Type Bit Cell Type Pin Cell Pin Type
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Chapter 19. IEEE 1149.1 T est Access P ort (JT A G) 19-11
Disabling IEEE Standard 1149.1 Operation
19.6 Disabling IEEE Standard 1149.1 Operation
There are two ways to use the MCF5307 without IEEE Standard 1149.1 test logic being
active:
• Nonuse of JTA G test logic by either nontermination (disconnection) or intentionally
fixing TAP logic values. The following issues must be addressed if IEEE Standard
1149.1 logic is not to be used when the MCF5307 is assembled onto a board.
— IEEE Standard 1149.1 test logic must remain transparent and benign to the
system logic during functional operation. To ensure that the part enters the
test-logic-reset state requires either connecting TRST to logic 0 or connecting
TCK to a source that supplies five rising edges and a falling edge after the fifth
rising edge. The recommended solution is to connect TRST to logic 0.
— TCK has no internal pull-up as is required on TMS, TDI, and TRST; therefore,
it must be terminated to preclude mid-le v el input v alues. Figure 19-4 sho ws pin
values recommended for disabling JTAG with the MCF5307 in JTAG mode.
Figure 19-4. Disabling JTAG in JTAG Mode
• Disabling JTAG test logic by holding MTMOD0 low during reset (debug mode).
This allows the IEEE Standard 1149.1 test controller to enter test-logic-reset state
when TRST is internally asserted to the controller . TAP pins function as debug mode
pins. In JTAG mode, inputs TDI/DSI, TMS/BKPT, and TRST/DSCLK have internal
pull-ups enabled. Figure 19-5 shows pin values recommended for disabling JTAG in
debug mode.
Figure 19-5. Disabling JTAG in Debug Mode
TDI/DSI
TCK
VDD
TRST/DSCLK
TMS/BKPT
•
•
•
Note: MTMOD0 high allows JTAG mode.
TDI/DSI
TCK
Debug Interface
TRST/DSCLK
TMS/BKPT
Note: MTMOD0 low prohibits JTAG.
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19-12 MCF5307 User’s Manual
Obtaining the IEEE Standard 1149.1
19.7 Obtaining the IEEE Standard 1149.1
The IEEE Standard 1149.1 JTAG specification is a copyrighted document and must be
obtained directly from the IEEE:
IEEE Standards Department
445 Hoes Lane
P.O. Box 1331
Piscataway, NJ 08855-1331
USA
http://stdsbbs.ieee.org/
FAX: 908-981-9667
Information: 908-981-0060 or 1-800-678-4333
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Chapter 20. Electrical Specifications 20-1
Chapter 20
Electrical Specifications
This chapter describes the AC and DC electrical specifications and thermal characteristics
for the MCF5307. Note that this information was correct at the time this book was
published. As process technologies improve, there is a likelihood that this information may
change. To confirm that this is the latest information, see Motorola’s ColdFire webpage,
http://www.motorola.com/coldfire.
20.1 General Parameters
Table 20-1 lists maximum and minimum ratings for supply and operating voltages and
storage temperature. Operating outside of these ranges may cause erratic behavior or
damage to the processor.
Table 20-2 lists junction and ambient operating temperatures.
Table 20-3 lists DC electrical operating temperatures. This table is based on an operating
Table 20-1. Absolute Maximum Ratings
Rating Symbol Value Units
Supply voltage Vcc -0.3 to +4.0 V
Maximum operating voltage Vcc +3.6 V
Minimum operating voltage Vcc +3.0 V
Input voltage Vin -0.5 to +5.5 V
Storage temperature range Tstg -55 to +150 oC
Table 20-2. Operating Temperatures
Characteristic Symbol Value Units
Maximum operating junction temperature Tj105 oC
Maximum operating ambient temperature TAmax 70 1
1This published maximum operating ambient temperature should be used only as a system design guideline. All
device operating parameters are guaranteed only when the junction temperature lies within the specified range.
oC
Minimum operating ambient temperature TAmin 0oC
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20-2 MCF5307 User’s Manual
Clock Timing Specifications
voltage of Vcc = 3.3 Vdc ± 0.3 Vdc.
20.2 Clock Timing Specifications
Table 20-4 lists specifications for the clock timing parameters shown in Figure 20-1 and
Figure 20-2.
Table 20-3. DC Electrical Specifications
Characteristic Symbol Min Max Units
Operation voltage range Vcc 3.0 3.6 V
Input high voltage VIH 2.0 3.6 V
Input low voltage VIL -0.5 0.8 V
Input signal undershoot ——0.8 V
Input signal overshoot ——0.8 V
Input leakage current @ 0.5/2.4 V during normal operation Iin —20 µA
High impedance (three-state) leakage current @ 0.5/2.4 V during
normal operation ITSI —20 µA
Signal low input current, VIL = 0.8 V 1
1BKPT/TMS, DSI/TDI, DSCLK/TRST
IIL 01 mA
Signal high input current, VIH = 2.0 V 1IIH 01 mA
Output high voltage IOH = 6 mA 2, 12 mA 3
2D[31:0], A[23:0], PP[15:0],TS, TA, SIZ[1:0], R/W, BR, BD, RSTO, AS, CS[7:0], BE[3:0], OE, PSTCLK,
PST[3:0], DDATA[3:0], DSO, TOUT[1:0], SCL, SDA, RTS[1:0], TXD[1:0]
3BCLKO, RAS[1:0], CAS[3:0], DRAMW, SCKE, SRAS, SCAS
VOH 2.4 — V
Output low voltage IOL = 6 mA 2, 12 mA 3 VOL —0.5 V
Load capacitance (all outputs) CL—50 pF
Capacitance 4, Vin = 0 V, f = 1 MHz
4Capacitance CIN is periodically sampled rather than 100% tested.
CIN —10 pF
Table 20-4. Clock Timing Specification
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
C1 CLKIN cycle time 30 —22 —nS
C2 CLKIN rise time (0.5V to 2.4 V) —5—5nS
C3 CLKIN fall time (2.4V to 0.5 V) —5—5nS
C4 CLKIN duty cycle (at 1.5 V) 40 60 40 60 %
C5 PSTCLK cycle time 15 —11 —nS
C6 PSTCLK duty cycle (at 1.5 V) 40 60 40 60 %
C7 BCLKO cycle time 30 —22 —nS
C8 BCLKO duty cycle (at 1.5 V) 45 55 45 55 %
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Chapter 20. Electrical Specifications 20-3
Input/Output AC Timing Specifications
Figure 20-1 shows timings for the parameters listed in Table 20-4.
Figure 20-1. Clock Timing
Figure 20-2 shows PSTCLK timings for parameters listed in Table 20-4.
Figure 20-2. PSTCLK Timing
20.3 Input/Output AC Timing Specifications
Table 20-5 lists specifications for parameters shown in Figure 20-3 and Figure 20-4. Note
that inputs IRQ[7,5,3,1], BKPT, and AS are synchronized internally; that is, the logic lev el
is validated if the value does not change for two consecutive rising BCLKO edges. Setup
and hold times must be met only if recognition on a particular clock edge is required.
Table 20-5. Input AC Timing Specification
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
B1 1Valid to BCLKO rising (setup) 7.5 —5.5 —nS
B2 1 BCLKO rising to invalid (hold) 3 —2—nS
B3 2Valid to BCLKO falling (setup) 7.5 —5.5 —nS
B4 2BCLKO falling to invalid (hold) 3 —2—nS
BCLKO
BCLKO
C1
C4 C4
C3
C2
C7
C8 C8
Note: Input and output AC timing specifications are measured to BCLKO with a 50-pF load capacitance
(not including pin capacitance).
PSTCLK C6 C6
C5
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20-4 MCF5307 User’s Manual
Input/Output AC Timing Specifications
Table 20-6 lists specifications for timings in Figure 20-3, Figure 20-4, and Figure 20-10.
Although output signals that share a specification number have approximately the same
timing, due to loading differences, they do not necessarily change at the same time.
However, they have similar timings; that is, minimum and maximum times are not mixed.
Note that these figures show two representative bus operations and do not attempt to show
all cases. For explanations of the states, S0–S5, see Section 18.4, “Data Transfer
B5 3 BCLKO to input high impedance —2—2 Bus clock
B6 BCLKO to EDGESEL delay 0 7.5 0 5.5 nS
1Inputs: BG, TA, A[23:0], PP[15:0], SIZ[1:0], R/W, TS, EDGESEL, D[31:0], IRQ[7,5,3,1], and BKPT
2Inputs: AS
3Inputs: D[31:0]
Table 20-6. Output AC Timing Specification
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
B10 1,2,3
1Outputs that only change on rising edge of BCLKO: RSTO, TS, BR, BD, TA, R/W, SIZ[1:0], PP[7:0] (and
PP[15:8] when configured as parallel port outputs).
2Outputs that can change on either BCLKO edge depending only upon EDGESEL: D[31:0], A[23:0], SCKE,
SRAS, SCAS, DRAMW (and PP[15:8] when individually configured as address outputs).
3Outputs that can change on either BCLKO edge depending only upon EDGESEL: D[31:0], A[23:0], SCKE,
SRAS, SCAS, DRAMW (and PP[15:8] when individually configured as address outputs).
BCLKO rising to valid —15 —11 nS
B11 1,2,3,4
4Applies to D[31:0], A[23:0], RSTO, TS, BR, BD, TA, R/W, SIZ[1:0], PP[7:0] (and PP[15:8] when configured as
parallel port outputs).
BCLKO rising to invalid (hold) 1 —1—nS
B11a 1,2,3,5
5Applies to RAS[1:0], CAS[1:0], SCKE, SRAS, SCAS, DRAMW
BCLKO rising to invalid (hold) 0.5 —0.5 —
B12 6,7
6High Impedance (three-state): D[31:0]
7Outputs that transition to high-impedance due to bus arbitration: A[23:0], R/W, SIZ[1:0], TS, AS, TA, (and
PP[15:0] when individually configured as address outputs)
BCLKO to high impedance (three-state) —15 —11 nS
B13 8,2,3
8Outputs that only change on falling edge of BCLKO: AS, CS[7:0], BE[3:0], OE
BCLKO rising to valid —15 —11 nS
B14 8,2,3 BCLKO rising to invalid (hold) 3 —2—nS
B15 2,3 EDGESEL to valid —18.5 —13.5 nS
B16 2,3 EDGESEL to invalid (hold) 3 —2—nS
H1 HIZ to high impedance —60 —60 nS
H2 HIZ to low Impedance —60 —60 nS
Table 20-5. Input AC Timing Specification
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
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Chapter 20. Electrical Specifications 20-5
Input/Output AC Timing Specifications
Operation.” Note that Figure 20-4 does not show all signals that apply to each timing
specification. See the previous tables for a complete listing.
Figure 20-3 shows AC timings for normal read and write bus cycles.
Figure 20-3. AC Timings—Normal Read and Write Bus Cycles
Figure 20-4 shows timings for a read cycle with EDGESEL tied to buffered BCLKO.
BCLKO
A[31:0]
R/W
TS
AS, CS, OE
D[31:0]
TA
B10
B13
B11
B2
B1
B14
B5
B10
B11
B12
S0 S1 S2 S3 S4 S5 S0 S1 S2 S3 S4 S5
TM[2:0]
TT[1:0]
SIZ[1:0]
BE/BWE[3:0]
TIP
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20-6 MCF5307 User’s Manual
Input/Output AC Timing Specifications
Figure 20-4. SDRAM Read Cycle with EDGESEL Tied to Buffered BCLKO
Figure 20-5 shows an SDRAM write cycle with EDGESEL tied to buffered BCLKO.
A[31:0]
TS
SRAS
SCAS 1
D[31:0]
ACTV NOP PALLNOP
RAS
READ
Row Column
EDGESEL
DRAMW
CAS
B16
B15
B15
B16
B2
B1
B16
B16
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14
BCLKO
1 DACR[CASL]
=
2
B6
NOP NOP
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Chapter 20. Electrical Specifications
20-7
Input/Output AC Timing Specifications
Figure 20-5. SDRAM Write Cycle with EDGESEL Tied to Buffered BCLKO
Figure 20-6 shows an SDRAM read cycle with EDGESEL tied high.
A[31:0]
TS
SRAS
SCAS
1
D[31:0]
ACTV PALL
NOP
RAS
WRITE
Row Column
EDGESEL
DRAMW
CAS
B16
B15
B15
B16
B16
B16
01 2 3 4 5 6 7 8 9 10 11 12
BCLKO
B15
1
DACR[CASL]
=
2
B6
NOP
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20-8
MCF5307 User’s Manual
Input/Output AC Timing Specifications
Figure 20-6. SDRAM Read Cycle with EDGESEL Tied High
Figure 20-7 shows an SDRAM write cycle with EDGESEL tied high.
A[31:0]
TS
SRAS
D[31:0]
ACTV NOP PALLNOP
RAS
READ
Row Column
BCLKO
0
DRAMW
CAS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
B11
B10
B10
B11a
B2
B1
B11a
B11a
1 DACR[CASL]
=
2
SCAS
1
NOP
B11a
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Chapter 20. Electrical Specifications
20-9
Input/Output AC Timing Specifications
Figure 20-7. SDRAM Write Cycle with EDGESEL Tied High
Figure 20-8 shows an SDRAM read cycle with EDGESEL tied low.
A[31:0]
TS
SRAS
SCAS
1
D[31:0]
ACTV PALLNOP
RAS
WRITE
Row Column
BCLKO
DRAMW
CAS
B10
B10
B11a
B11
B11a
01 2 3 4 5 6 7 8 9 10 11 12
B10
NOP
1
DACR[CASL]
=
2
B11a
B11
B11a
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20-10
MCF5307 User’s Manual
Input/Output AC Timing Specifications
Figure 20-8. SDRAM Read Cycle with EDGESEL Tied Low
Figure 20-9 shows an SDRAM write cycle with EDGESEL tied low.
A[31:0]
TS
SRAS
D[31:0]
ACTV NOP PALLNOP
RAS
READ
Row Column
BCLKO
0
DRAMW
CAS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
B14
B13
B13
B14
B2
B1
B14
B14
SCAS
1
1
DACR[CASL]
=
2
NOP
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Chapter 20. Electrical Specifications
20-11
Input/Output AC Timing Specifications
Figure 20-9. SDRAM Write Cycle with EDGESEL Tied Low
Figure 20-10 shows AC timing showing high impedance.
Figure 20-10. AC Output Timing—High Impedance
A[31:0]
TS
SRAS
SCAS
1
D[31:0]
ACTV PALLNOP
RAS
WRITE
Row Column
BCLKO
DRAMW
CAS
B14
B13
B13
B14
B14
B14
01 2 3 4 5 6 7 8 9 10 11 12
B13
1
DACR[CASL]
=
2
NOP
H1 H2
HIZ
OUTPUTS
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20-12
MCF5307 User’s Manual
Reset Timing Specifications
20.4 Reset Timing Specifications
Table 20-7 lists specifications for the reset timing parameters shown in Figure 20-11.
Figure 20-11 shows reset timing for the values in Table 20-7.
Figure 20-11. Reset Timing
20.5 Debug AC Timing Specifications
Table 20-8 lists specifications for the debug AC timing parameters shown in Figure 20-13.
Table 20-7. Reset Timing Specification
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
R1
1
1
RSTI and D[7:0] are synchronized internally. Setup and hold times must be met
only if recognition on a particular clock is required.
Valid to CLKIN (setup) 7.5 —5.5 —nS
R2 CLKIN to invalid (hold) 3 —2—nS
R3 RSTI to invalid (hold) 3 —2—nS
Table 20-8. Debug AC Timing Specification
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
D1 PST, DDATA to PSTCLK setup 7.5 5.5 nS
D2 PSTCLK to PST, DDATA hold 7.5 5.5 nS
D3
DSI-to-DSCLK setup 1 1 PSTCLKs
CLKIN
RSTI
D[7:0]
R2
R1
R1
R3
Note: Mode selects are registered on the rising CLKIN edge before the cycle in which RSTI is
recognized as being negated.
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Chapter 20. Electrical Specifications
20-13
Debug AC Timing Specifications
Figure 20-12 shows real-time trace timing for the values in Table 20-8.
Figure 20-12. Real-Time Trace AC Timing
Figure 20-13 shows BDM serial port AC timing for the values in Table 20-8.
Figure 20-13. BDM Serial Port AC Timing
D4
1
DSCLK-to-DSO hold 4 4 PSTCLKs
D5 DSCLK cycle time 5 5 PSTCLKs
1
DSCLK and DSI are synchronized internally. D4 is measured from the synchronized
DSCLK input relative to the rising edge of PSTCLK.
Table 20-8. Debug AC Timing Specification
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
PSTCLK
PST[3:0]
D2
D1
DDATA[3:0]
DSI
DSO
Current Next
PSTCLK
Past Current
DSCLK
D3
D4
D5
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20-14
MCF5307 User’s Manual
Timer Module AC Timing Specifications
20.6 Timer Module AC Timing Specifications
Table 20-9 lists specifications for timer module AC timing parameters shown in
Figure 20-14.
Figure 20-14 shows timings for Table 20-9.
Figure 20-14. Timer Module AC Timing
Table 20-9. Timer Module AC Timing Specification
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
T1 TIN cycle time 3 —3—Bus clocks
T2 TIN valid to BCLKO (input setup) 7.5 —5.5 —nS
T3 BCLKO to TIN invalid (input hold) 3 —2—nS
T4 BCLKO to TOUT valid (output valid) —15 —11 nS
T5 BCLKO to TOUT invalid (output hold) 1.5 —1.5 —nS
T6 TIN pulse width 1 —1—Bus clocks
T7 TOUT pulse width 1 —1—Bus clocks
BCLKO T6
T2 T3
T1
T7
T4 T5
TIN
TIN
TOUT
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Chapter 20. Electrical Specifications
20-15
I
2
C Input/Output Timing Specifications
20.7 I
2
C Input/Output Timing Specifications
Table 20-10 lists specifications for the I
2
C input timing parameters shown in Figure 20.8.
Table 20-11 lists specifications for the I
2
C output timing parameters sho wn in Figure 20.8.
Table 20-10. I
2
C Input Timing Specifications between SCL and SDA
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
I1 Start condition hold time 2 —2—Bus clocks
I2 Clock low period 8 —8—Bus clocks
I3 SCL/SDA rise time (V
IL
=
0.5 V to V
IH
= 2.4 V) —1—1mS
I4 Data hold time 0 —0—nS
I5 SCL/SDA fall time (V
IH
=
2.4 V to V
IL
= 0.5 V) —1—1mS
I6 Clock high time 4 —4—Bus clocks
I7 Data setup time 0 —0—nS
I8 Start condition setup time (for repeated start condition only) 2 —2—Bus clocks
I9 Stop condition setup time 2 —2—Bus clocks
Table 20-11. I
2
C Output Timing Specifications between SCL and SDA
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
I1
1
1
Note: Output numbers depend on the value programmed into the IFDR; an IFDR programmed with the maximum
frequency (IFDR = 0x20) results in minimum output timings as shown in Table 20-11. The I
2
C interface is
designed to scale the actual data transition time to move it to the middle of the SCL low period. The actual
position is affected by the prescale and division values programmed into the IFDR; however, the numbers given
in Table 20-11 are minimum values.
Start condition hold time 6 —6—Bus clocks
I2
1
Clock low period 10 —10 —Bus clocks
I3
2
2
Because SCL and SD A are open-collector-type outputs, which the processor can only activ ely drive lo w, the time
SCL or SDA take to reach a high level depends on external signal capacitance and pull-up resistor values.
SCL/SDA rise time (V
IL
= 0.5 V to V
IH
= 2.4 V) ———— µS
I4
1
Data hold time 7 —7—Bus clocks
I5
3
3
Specified at a nominal 50-pF load.
SCL/SDA fall time (V
IH
= 2.4 V to V
IL
= 0.5 V) —3—3nS
I6
1
Clock high time 10 —10 —Bus clocks
I7
1
Data setup time 2 —2—Bus clocks
I8
1
Start condition setup time (for repeated start
condition only) 20 —20 —Bus clocks
I9
1
Stop condition setup time 10 —10 —Bus clocks
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20-16
MCF5307 User’s Manual
UART Module AC Timing Specifications
Figure 20.8 shows timing for the values in Table 20-10 and Table 20-11.
Figure 20-15. I
2
C Input/Output Timings
20.8 UART Module AC Timing Specifications
Table 20-12 lists specifications for UART module AC timing parameters in Figure 20-16.
Figure 20-16 shows UART timing for the values in Table 20-12.
Table 20-12. UART Module AC Timing Specifications
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
U1 RXD valid to BCLKO (input setup) 7.5 —5.5 —nS
U2 BCLKO to RXD invalid (input hold) 3 —2—nS
U3 CTS valid to BCLKO (input setup) 7.5 —5.5 —nS
U4 BCLKO to CTS invalid (input hold) 3 —2—nS
U5 BCLKO to TXD valid (output valid) —15 —11 nS
U6 BCLKO to TXD invalid (output hold) 1.5 —1.5 —nS
U7 BCLKO to RTS valid (output valid) —15 —11 nS
U8 BCLKO to RTS invalid (output hold) 1.5 —1.5 —nS
I2 I6
I1 I4 I7 I8 I9
I5
I3
SCL
SDA
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Chapter 20. Electrical Specifications
20-17
UART Module AC Timing Specifications
Figure 20-16. UART0/1 Module AC Timing—UART Mode
BCLKO
RXD
CTS
TXD
RTS
U1
U2
U3
U4
U5
U6
U7
U8
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20-18
MCF5307 User’s Manual
Parallel Port (General-Purpose I/O) Timing Specifications
20.9 Parallel Por t (General-Purpose I/O) Timing
Specifications
Table 20-13 lists specifications for general-purpose I/O timing parameters in Figure 20-17.
Figure 20-17 shows general-purpose I/O timing.
Figure 20-17. General-Purpose I/O Timing
Table 20-13. General-Purpose I/O Port AC Timing Specifications
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
P1 PP valid to BCLKO (input setup) 7.5 —5.5 —nS
P2 BCLKO to PP invalid (input hold) 3 —2—nS
P3 BCLKO to PP valid (output valid) —15 —11 nS
P4 BCLKO to PP invalid (output hold) 1 —1—nS
BCLKO
PP IN
PP OUT
P1
P2
P4
P3
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Chapter 20. Electrical Specifications
20-19
DMA Timing Specifications
20.10 DMA Timing Specifications
Table 20-14 lists specifications for DMA timing parameters shown in Figure 20-17.
Figure 20-18 shows DMA AC timing.
Figure 20-18. DMA Timing
Table 20-14. DMA AC Timing Specifications
Num Characteristic 66 MHz 90 MHz Units
Min Max Min Max
M1 DREQ valid to BCLKO (input setup) 7.5 —5.5 —nS
M2 BCLKO to DREQ invalid (input hold) 3 —2—nS
BCLKO
DREQ M1
M2
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20-20
MCF5307 User’s Manual
IEEE 1149.1 (JTAG) AC Timing Specifications
20.11 IEEE 1149.1 (JTAG) AC Timing Specifications
Table 20-15 lists specifications for JTAG AC timing parameters shown in Figure 20-19.
Figure 20-19 shows JTAG timing.
Table 20-15. IEEE 1149.1 (JTAG) AC Timing Specifications
Num Characteristic
All
Frequencies Units
Min Max
—TCK frequency of operation 0 10 MHz
J1 TCK cycle time 100 —nS
J2a TCK clock pulse high width (measured at 1.5 V) 40 —nS
J2b TCK clock pulse low width (measured at 1.5 V) 40 —nS
J3a TCK fall time (VIH = 2.4 V to VIL = 0.5V) —5nS
J3b TCK rise time (VIL = 0.5v to VIH = 2.4V) —5nS
J4 TDI, TMS to TCK rising (input setup) 10 —nS
J5 TCK rising to TDI, TMS invalid (hold) 15 —nS
J6 Boundary scan data valid to TCK (setup) 10 —nS
J7 TCK to boundary-scan data invalid (hold) 15 —nS
J8 TRST pulse width (asynchronous to clock edges) 15 ——
J9 TCK falling to TDO valid (signal from driven or
three-state) —30 nS
J10 TCK falling to TDO high impedance —30 nS
J11 TCK falling to boundary scan data valid (signal from
driven or three-state) —30 nS
J12 TCK falling to boundary scan data high impedance —30 nS
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Chapter 20. Electrical Specifications 20-21
IEEE 1149.1 (JTAG) AC Timing Specifications
Figure 20-19. IEEE 1149.1 (JTAG) AC Timing
J1
J2a J2b
J4
J5
J6
J7
J8
J9
J10
J11
J12
J3a
J3b
TCK
TDI, TMS
TRST
TDO
BOUNDARY
SCAN DATA
OUTPUT
BOUNDARY
SCAN DATA
INPUT
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20-22 MCF5307 User’s Manual
IEEE 1149.1 (JTAG) AC Timing Specifications
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Appendix A. List of Memory Maps A-1
Appendix A
List of Memory Maps
Table A-1. SIM Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x000 Reset status register
(RSR) [p. 6-5] System protection
control register
(SYPCR) [p. 6-8]
Software watchdog
interrupt vector register
(SWIVR) [p. 6-9]
Software watchdog
service register (SWSR)
[p. 6-9]
0x004 Pin assignment register (PAR) [p. 6-10] Interrupt port
assignment register
(IRQPAR) [p. 9-7]
Reserved
0x008 PLL control (PLLCR)
[p. 7-3] Reserved
0x00C Def ault bus master park
register (MPARK)
[p. 6-11]
Reserved
0x010–
0x03C Reserved
Table A-2. Interrupt Controller Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
Interrupt Registers [p. 9-3]
0x040 Interrupt pending register (IPR) [p. 9-6]
0x044 Interrupt mask register (IMR) [p. 9-6]
0x048 Reserved Autovector register
(AVR) [p. 9-5]
Interrupt Control Registers (ICRs) [p. 9-3]
0x04C Software watchdog
timer (ICR0) [p. 6-6] Timer0 (ICR1) [p. 9-2] Timer1 (ICR2) [p. 9-3] I2C (ICR3) [p. 9-3]
0x050 UART0 (ICR4) [p. 9-3] UART1 (ICR5) [p. 9-3] DMA0 (ICR6) [p. 9-3] DMA1 (ICR7) [p. 9-3]
0x054 DMA2 (ICR8) [p. 9-3] DMA3 (ICR9) [p. 9-3] Reserved
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A-2 MCF5307 User’s Manual
Table A-3. Chip-Select Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x080 Chip-select address register—bank 0 (CSAR0)
[p. 10-6] Reserved1
0x084 Chip-select mask register—bank 0 (CSMR0) [p. 10-6]
0x088 Reserved1Chip-select control register—bank 0 (CSCR0)
[p. 10-8]
0x08C Chip-select address register—bank 1 (CSAR1)
[p. 10-6] Reserved1
0x090 Chip-select mask register—bank 1 (CSMR1) [p. 10-6]
0x094 Reserved1Chip-select control register—bank 1 (CSCR1)
[p. 10-8]
0x098 Chip-select address register—bank 2 (CSAR2)
[p. 10-6] Reserved1
0x09C Chip-select mask register—bank 2 (CSMR2) [p. 10-6]
0x0A0 Reserved1Chip-select control register—bank 2 (CSCR2)
[p. 10-8
0x0A4 Chip-select address register—bank 3 (CSAR3)
[p. 10-6] Reserved1
0x0A8 Chip-select mask register—bank 3 (CSMR3) [p. 10-6]
0x0AC Reserved1Chip-select control register—bank 3 (CSCR3)
[p. 10-8]
0x0B0 Chip-select address register—bank 4 (CSAR4)
[p. 10-6] Reserved1
0x0B4 Chip-select mask register—bank 4 (CSMR4) [p. 10-6]
0x0B8 Reserved1Chip-select control register—bank 4 (CSCR4)
[p. 10-8]
0x0BC Chip-select address register—bank 5 (CSAR5)
[p. 10-6] Reserved1
0x0C0 Chip-select mask register—bank 5 (CSMR5) [p. 10-6]
0x0C4 Reserved Chip-select control register—bank 5 (CSCR5)
[p. 10-8]
0x0C8 Chip-select address register—bank 6 (CSAR6)
[p. 10-6] Reserved1
0x0CC Chip-select mask register—bank 6 (CSMR6) [p. 10-6]
0x0D0 Reserved1Chip-select control register—bank 6 (CSCR6)
[p. 10-8]
0x0D4 Chip-select address register—bank 7 (CSAR7)
[p. 10-6] Reserved1
0x0D8 Chip-select mask register—bank 7 (CSMR7) [p. 10-6]
0x0DC Reserved1Chip-select control register—bank 7 (CSCR7)
[p. 10-8
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Appendix A. List of Memory Maps A-3
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x080 Chip-select address register—bank 0 (CSAR0)
[p. 10-6] Reserved1
0x084 Chip-select mask register—bank 0 (CSMR0) [p. 10-6]
0x088 Reserved1Chip-select control register—bank 0 (CSCR0)
[p. 10-8]
0x08C Chip-select address register—bank 1 (CSAR1)
[p. 10-6] Reserved1
0x090 Chip-select mask register—bank 1 (CSMR1) [p. 10-6]
0x094 Reserved1Chip-select control register—bank 1 (CSCR1)
[p. 10-8]
0x098 Chip-select address register—bank 2 (CSAR2)
[p. 10-6] Reserved1
0x09C Chip-select mask register—bank 2 (CSMR2) [p. 10-6]
0x0A0 Reserved1Chip-select control register—bank 2 (CSCR2)
[p. 10-8]
0x0A4 Chip-select address register—bank 3 (CSAR3)
[p. 10-6] Reserved1
0x0A8 Chip-select mask register—bank 3 (CSMR3) [p. 10-6]
0x0AC Reserved1Chip-select control register—bank 3 (CSCR3)
[p. 10-8]
0x0B0 Chip-select address register—bank 4 (CSAR4)
[p. 10-6] Reserved1
0x0B4 Chip-select mask register—bank 4 (CSMR4) [p. 10-6]
0x0B8 Reserved1Chip-select control register—bank 4 (CSCR4)
[p. 10-8]
1Addresses not assigned to a register and undefined register bits are reserved for expansion. Write accesses to
these reserved address spaces and reserved register bits have no effect.
Table A-4. DRAM Controller Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x100 DRAM control register (DCR) [p. 11-3] Reserved
0x104 Reserved
0x108 DRAM address and control register 0 (DACR0) [p. 11-3]
0x10C DRAM mask register block 0 (DMR0) [p. 11-3]
0x110 DRAM address and control register 1 (DACR1) [p. 11-3]
0x114 DRAM mask register block 1 (DMR1) [p. 11-3]
Table A-3. Chip-Select Registers (Continued)
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
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A-4 MCF5307 User’s Manual
Table A-5. General-Purpose Timer Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x140 Timer 0 mode register (TMR0) [p. 13-3] Reserved
0x144 Timer 0 reference register (TRR0) [p. 13-4] Reser ved
0x148 Timer 0 capture register (TCR0) [p. 13-4] Reserved
0x14C Timer 0 counter (TCN0) [p. 13-5] Reserved
0x150 Reserved Timer 0 event register
(TER0) [p. 13-5] Reserved
0x180 Timer 1 mode register (TMR1) [p. 13-3] Reserved
0x184 Timer 1 reference register (TRR1) [p. 13-4] Reser ved
0x188 Timer 1 capture register (TCR1) [p. 13-4] Reserved
0x18C Timer 1 counter (TCN1) [p. 13-5] Reserved
0x190 Reserved Timer 1 event register
(TER1) [p. 13-5] Reserved
Table A-6. UART0 Module Programming Model
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x1C0 UART mode
registers1—(UMR1n)
[p. 14-4], (UMR2n)
[p. 14-6]
—
0x1C4 (Read) UART status
registers—(USRn)
[p. 14-7]
—
(Write) UART clock-select
register1—(UCSRn)
[p. 14-8]
—
0x1C8 (Read) Do not access2—
(Write) UART command
registers—(UCRn)
[p. 14-9]
—
0x1CC (UART/Read) UART
receiver buffers—(URBn)
[p. 14-11]
—
(UART/Write) UART
transmitter
buffers—(UTBn) [p. 14-11]
—
0x1D0 (Read) UART input port
change
registers—(UIPCRn)
[p. 14-12]
—
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Appendix A. List of Memory Maps A-5
(Write) UART auxiliary
control
registers1—(UACRn)
[p. 14-12]
—
0x1D4 (Read) UART interrupt
status registers—(UISRn)
[p. 14-13]
—
(Write) UART interrupt
mask registers—(UIMRn)
[p. 14-13]
—
0x1D8 UART divider upper
registers—(UDUn)
[p. 14-14]
—
0x1DC UART divider lower
registers—(UDLn)
[p. 14-14]
—
0x1E0–
0x1EC Do not access2—
0x1F0 UART interrupt vector
register—(UIVRn)
[p. 14-15]
—
0x1F4 (Read) UART input port
registers—(UIPn)
[p. 14-15]
—
(Write) Do not access2—
0x1F8 (Read) Do not access2—
(Write) UART output port
bit set command
registers—(UOP1n3)
[p. 14-15]
—
0x1FC (Read) Do not access2—
(Write) UART output port
bit reset command
registers—(UOP0n3)
[p. 14-15]
—
1UMR1n, UMR2n, and UCSRn should be changed only after the receiver/transmitter is issued a software
reset command. That is, if channel operation is not disabled, undesirable results may occur.
2This address is for factory testing. Reading this location results in undesired effects and possible
incorrect transmission or reception of characters. Register contents may also be changed.
3Address-triggered commands
Table A-6. UART0 Module Programming Model (Continued)
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
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A-6 MCF5307 User’s Manual
Table A-7. UART1 Module Programming Model
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x200 UART mode
registers1—(UMR1n)
[p. 14-4], (UMR2n)
[p. 14-6]
—
0x204 (Read) UART status
registers—(USRn)
[p. 14-7]
—
(Write) UART
clock-select
register1—(UCSRn)
[p. 14-8]
—
0x208 (Read) Do not access2—
(Write) UART
command
registers—(UCRn)
[p. 14-9]
—
0x20C (UART/Read) UART
receiver
buffers—(URBn)
[p. 14-11]
—
(UART/Write) UART
transmitter
buffers—(UTBn)
[p. 14-11]
—
0x210 (Read) UART input
port change
registers—(UIPCRn)
[p. 14-12]
—
(Write) UART auxiliary
control
registers1—(UACRn)
[p. 14-12]
—
0x214 (Read) U AR T interrupt
status
registers—(UISRn)
[p. 14-13]
—
(Write) UART interrupt
mask
registers—(UIMRn)
[p. 14-13]
—
0x218 UART divider upper
registers—(UDUn)
[p. 14-14]
—
0x21C UART divider lower
registers—(UDLn)
[p. 14-14]
—
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Appendix A. List of Memory Maps A-7
0x220–
0x22C Do not access2—
0x230 UART interrupt vector
register—(UIVRn)
[p. 14-15]
—
0x234 (Read) UART input
port registers—(UIPn)
[p. 14-15]
—
(Write) Do not access2—
0x238 (Read) Do not access2—
(Write) UART output
port bit set command
registers—(UOP1n3)
[p. 14-15]
—
0x23C (Read) Do not access2—
(Write) UART output
port bit reset
command
registers—(UOP0n3)
[p. 14-15]
—
1UMR1n, UMR2n, and UCSRn should be changed only after the receiver/transmitter is issued a
software reset command. That is, if channel operation is not disabled, undesirable results may occur.
2This address is for factory testing. Reading this location results in undesired effects and possible
incorrect transmission or reception of characters. Register contents may also be changed.
3Address-triggered commands
Table A-8. Parallel Port Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x244 Parallel port data direction register (PADDR)
[p. 15-2] Reserved
0x248 Parallel port data register (PADAT) [p. 15-2] Reserved
Table A-9. I2C Interface Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x280 I2C address register
(IADR) [p. 8-6] Reserved
0x284 I2C frequency divider
register (IFDR) [p. 8-7] Reserved
Table A-7. UART1 Module Programming Model (Continued)
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
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A-8 MCF5307 User’s Manual
0x288 I2C control register
(I2CR) [p. 8-8] Reserved
0x28C I2C status register
(I2SR) [p. 8-9] Reserved
0x290 I2C data I/O register
(I2DR) [p. 8-10] Reserved
Table A-10. DMA Controller Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x300 Source address register 0 (SAR0) [p. 12-6]
0x304 Destination address register 0 (DAR0) [p. 12-7]
0x308 DMA control register 0 (DCR0) [p. 12-8]
0x30C Byte count register 0 (BCR24BIT = 0) 1 Reserved
0x30C Reserved Byte count register 0 (BCR24BIT = 1) 1 (BCR0) [p. 12-7]
0x310 DMA status register 0
(DSR0) [p. 12-10] Reserved
0x314 DMA interrupt vector
register 0 (DIVR0)
[p. 12-11]
Reserved
0x340 Source address register 1 (SAR1) [p. 12-6]
0x344 Destination address register 1 (DAR1) [p. 12-7]
0x348 DMA control register 1 (DCR1) [p. 12-8]
0x34C Byte count register 1 (BCR24BIT = 0) 1Reserved
0x34C Reserved Byte count register 1 (BCR24BIT = 1) 1 (BCR1) [p. 12-7]
0x350 DMA status register 1
(DSR1) [p. 12-10] Reserved
0x354 DMA interrupt vector
register 1 (DIVR1)
[p. 12-11]
Reserved
0x380 Source address register 2 (SAR2) [p. 12-6]
0x384 Destination address register 2 (DAR2) [p. 12-7]
0x388 DMA control register 2 (DCR2) [p. 12-8]
0x38C Byte count register 2 (BCR24BIT = 0) 1Reserved
0x38C Reserved Byte count register 2 (BCR24BIT = 1) 1 (BCR2) [p. 12-7]
0x390 DMA status register 2
(DSR2) [p. 12-10] Reserved
Table A-9. I2C Interface Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
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Appendix A. List of Memory Maps A-9
0x394 DMA interrupt vector
register 2 (DIVR2)
[p. 12-11]
Reserved
0x3C0 Source address register 3 (SAR3) [p. 12-6]
0x3C4 Destination address register 3 (DAR3) [p. 12-7]
0x3C8 DMA control register 3 (DCR3) [p. 12-8]
0x3CC Byte count register 3 (BCR24BIT = 0) 1Reserved
0x3CC Reserved Byte count register 3 (BCR24BIT = 1) 1 (BCR3) [p. 12-7]
0x3D0 DMA status register 3
(DSR3) [p. 12-10] Reserved
0x3D4 DMA interrupt vector
register 3 (DIVR3)
[p. 12-11]
Reserved
1On the 0H55J and 1H55J revisions of the MCF5307, the byte count register of the DMA channels can
accommodate only 16 bits. However, on the newest revision of the MCF5307, an expanded 24-bit byte count
range provides greater flexibility. For this reason, the position of the byte count register (BCR) in the memory
map depends on whether a 16- or 24-bit byte counter is chosen. The selection is made by programming
MPARK[BCR24BIT] in the SIM module.
In the new MCF5307, the 24-bit byte count can be selected by setting BCR24BIT = 1, making DCR[AT]
available. The AT bit selects whether the DMA channels assert an acknowledge during the entire transfer or
only at the final transfer of a DMA transaction.
New applications should take advantage of the full range of the 24-bit byte counter, including the AT bit. The
16-bit byte count option (BCR24BIT = 0) is kept to retain compatibility with older revisions of the MCF5307.
Table A-10. DMA Controller Registers (Continued)
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
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A-10 MCF5307 User’s Manual
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Glossary of Terms and Abbreviations Glossary-11
Glossary of Terms and Abbreviations
The glossary contains an alphabetical list of terms, phrases, and abbreviations used in this
book.
Architecture. A detailed specification of requirements for a processor or
computer system. It does not specify details of ho w the processor or
computer system must be implemented; instead it provides a
template for a family of compatible implementations.
Autovector. A method of determining the starting address of the service
routine by fetching the value from a lookup table internal to the
processor instead of requesting the value from the system.
Branch prediction.The process of guessing whether a branch will be taken.
Such predictions can be correct or incorrect; the term ‘predicted’ as
it is used here does not imply that the prediction is correct
(successful).
Branch resolution.The determination of whether a branch is taken or not
taken. A branch is said to be resolved when the processor can
determine which instruction path to take. If the branch is resolv ed as
predicted, the instructions following the predicted branch that may
have been speculatively executed can complete (see completion). If
the branch is not resolved as predicted, instructions on the
mispredicted path, and any results of speculative execution, are
purged from the pipeline and fetching continues from the
nonpredicted path.
Burst. A multiple-beat data transfer.
Cache. High-speed memory containing recently accessed data and/or
instructions (subset of main memory).
Cache coherency. An attribute wherein an accurate and common view of
memory is provided to all devices that share the same memory
system. Caches are coherent if a processor performing a read from
A
B
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Glossary-12 MCF5307 User’s Manual
its cache is supplied with data corresponding to the most recent value
written to memory or to another processor’s cache.
Cache flush. An operation that removes from a cache any data from a
specified address range. This operation ensures that any modified
data within the specified address range is written back to main
memory.
Cache line. The smallest unit of consecuti ve data or instructions that is stored
in a cache. For ColdFire processors a line consists of 16 bytes.
Caching-inhibited. A memory update policy in which the cache is bypassed
and the load or store is performed to or from main memory.
Cast outs. Cache lines that must be written to memory when a cache miss
causes a cache line to be replaced.
Clear. To cause a bit or bit field to register a value of zero. See also Set.
Copyback. A cache memory update policy in which processor write cycles
are directly written only to the cache. External memory is updated
only indirectly, for example, when a modified cache line is cast out
to make room for newer data.
Effective address (EA). The 32-bit address specified for an instruction.
Exception. A condition encountered by the processor that requires special,
supervisor-level processing.
Exception handler. A software routine that executes when an exception is
taken. Normally, the exception handler corrects the condition that
caused the exception, or performs some other meaningful task (that
may include aborting the program that caused the exception). The
address for each exception handler is identified by an exception
vector defined by the ColdFire architecture.
Fetch. The act of retrieving instructions from either the cache or main
memory and making them available to the instruction unit.
Flush. An operation that causes a modified cache line to be invalidated and
the data to be written to memory.
Illegal instructions. A class of instructions that are not implemented for a
particular processor. These include instructions not defined by the
ColdFire architecture.
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Glossary of Terms and Abbreviations Glossary-13
Implementation. A particular processor that conforms to the ColdFire
architecture, but may differ from other architecture-compliant
implementations for example in design, feature set, and
implementation of optional features. The ColdFire architecture has
many different implementations.
Imprecise mode. A memory access mode that allows write accesses to a
specified memory region to occur out of order.
Instruction queue. A holding place for instructions fetched from the current
instruction stream.
Instruction latency. The total number of clock cycles necessary to execute
an instruction and make the results of that instruction available.
Interrupt. An asynchronous exception. On ColdFire processors, interrupts
are a special case of exceptions. See also asynchronous exception.
Invalid state. State of a cache entry that does not currently contain a valid
copy of a cache line from memory.
Least-significant bit (lsb). The bit of least value in an address, register, data
element, or instruction encoding.
Least-significant byte (LSB). The byte of least value in an address, re gister,
data element, or instruction encoding.
Longword. A 32-bit data element
Master. A device able to initiate data transfers on a b us. Bus mastering refers
to a feature supported by some bus architectures that allow a
controller connected to the bus to communicate directly with other
devices on the bus without going through the CPU.
Memory coherency. An aspect of caching in which it is ensured that an
accurate vie w of memory is provided to all de vices that share system
memory.
Modified state. Cache state in which only one caching device has the valid
data for that address.
Most-significant bit (msb). The highest-order bit in an address, registers,
data element, or instruction encoding.
Most-significant byte (MSB). The highest-order byte in an address,
registers, data element, or instruction encoding.
L
L
M
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Glossary-14 MCF5307 User’s Manual
Nop. No-operation. A single-cycle operation that does not affect registers or
generate bus activity.
Overflow. An condition that occurs during arithmetic operations when the
result cannot be stored accurately in the destination register(s). For
example, if tw o 16-bit numbers are multiplied, the result may not be
representable in 16 bits.
Pipelining. A technique that breaks operations, such as instruction
processing or bus transactions, into smaller distinct stages or tenures
(respectively) so that a subsequent operation can begin before the
previous one completes.
Precise mode. A memory access mode that ensures that all write accesses to
a specified memory region occur in order.
Set (v) To write a nonzero v alue to a bit or bit field; the opposite of clear. The
term ‘set’ may also be used to generally describe the updating of a
bit or bit field.
Set (n). A subdivision of a cache. Cacheable data can be stored in a given
location in any one of the sets, typically corresponding to its lower-
order address bits. Because se veral memory locations can map to the
same location, cached data is typically placed in the set whose cache
line corresponding to that address was used least recently. See Set-
associativity.
Set-associativity. Aspect of cache organization in which the cache space is
divided into sections, called sets. The cache controller associates a
particular main memory address with the contents of a particular set,
or region, within the cache.
Slave. The de vice addressed by a master device. The sla v e is identi fied in the
address tenure and is responsible for supplying or latching the
requested data for the master during the data tenure.
Static branch prediction. Mechanism by which software (for example,
compilers) can hint to the machine hardware about the direction a
branch is likely to take.
Supervisor mode. The privileged operation state of a processor. In
supervisor mode, software, typically the operating system, can
access all control registers and can access the supervisor memory
space, among other privileged operations.
N
O
P
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Glossary of Terms and Abbreviations Glossary-15
System memory. The physical memory available to a processor.
Tenure. A tenure consists of three phases: arbitration, transfer, termination.
There can be separate address bus tenures and data bus tenures.
Throughput. The measure of the number of instructions that are processed
per clock cycle.
Transfer termination. The successful or unsuccessful conclusion of a data
transfer.
Underflow. A condition that occurs during arithmetic operations when the
result cannot be represented accurately in the destination register.
User mode. The operating state of a processor used typically by application
software. In user mode, software can access only certain control
registers and can access only user memory space. No privileged
operations can be performed.
Word. A 16-bit data element.
Write-through. A cache memory update policy in which all processor write
cycles are written to both the cache and memory.
T
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Glossary-16 MCF5307 User’s Manual
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INDEX
Index Index-17
A
Accumulator (ACC), 2-28
Addressing
mode summary, 2-33
variant, 5-5
Arbitration
between masters, 6-14
bus control, 6-11
for internal transfers, 6-12
B
Baud rates
calculating, 14-19
Bus operation
arbitration control, 6-11
characteristics, 18-2
control signals, 18-1
data transfer
back-to-back cycles, 18-10
burst cycles
line read bus, 18-12
line transfers, 18-12
line write bus, 18-14
mixed port sizes, 18-15
overview, 18-11
cycle execution, 18-4
cycle states, 18-5
fast-termination cycles, 18-9
operation, 18-3
read cycle, 18-7
write cycle, 18-8
errors, 18-17
external master transfers
general, 18-21
two-device arbitration protocol, 18-25
two-wire mode, 18-25
features, 18-1
interrupt exceptions, 18-17
master park register, 6-11
misaligned operands, 18-16
reset
master, 18-34
overview, 18-33
software watchdog, 18-35
C
CCR, 2-28
Chip-select module
8-, 16-, and 32-bit port sizing, 10-4
enable signals, 17-15
operation, 10-2
general, 10-3
global, 10-4
overview, 10-1
registers, 10-5, 10-6, A-2
code example, 10-9
control, 10-8
mask, 10-6
signals, 10-1
Clock
PLL control, 6-10
ColdFire core
addressing mode summary, 2-33
condition code register (CCR), 2-28
exception processing overview, 2-47
features and enhancements, 2-21
instruction set summary, 2-34
integer data formats, 2-31
MAC registers, 1-14
programming model, 2-26
status register, 2-29
supervisor programming model, 2-29
user programming mode, 2-27
CPU STOP instruction, 6-10
D
Debug
attribute trigger register, 5-7
BDM command set summary, 5-20
breakpoint operation, 5-40
real-time support, 5-39
taken branch, 5-4
theory, 5-40
DMA controller module
byte count registers, 12-7
programming model, 12-4
signal description, 12-2
source address registers, 12-6
timing specifications, 20-19
transfer overview, 12-3
DRAM controller
asynchronous operation
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INDEX
Index-18 MCF5307 User’s Manual
burst page mode, 11-12
continuous page mode, 11-13
extended data out, 11-15
general, 11-4
mode signals, 11-4
register set, 11-4
general guidelines, 11-8
non-page mode, 11-11
refresh operation, 11-16
registers, 11-3
address and control, 11-5
mask, 11-7
signals, 17-16
synchronous operation
address and control registers, 11-20
address multiplexing, 11-23
auto-refresh, 11-31
burst page mode, 11-27
continuous page mode, 11-29
controller signals, 11-17
edge select, 11-18
general guidelines, 11-23
initialization, 11-33
interfacing, 11-27
mask registers, 11-22
mode register settings, 11-33
register set, 11-19
self-refresh, 11-32
DSCLK, 5-2
E
Electrical specifications
clock timing, 20-2
debug AC timing, 20-12
DMA timing, 20-19
general parameters, 20-1
I2C input/output timing, 20-15
input/iutput AC timing, 20-3
JTAG AC timing, 20-20
parallel port timing, 20-18
reset timing, 20-12
timer module AC timing, 20-14
UART module AC timing, 20-16
F
Fault-on-fault halt, 5-16
H
Halt
fault-on-fault, 5-16
I
I2C
address register, 8-6
arbitration procedure, 8-4
clock
stretching, 8-5
synchronization, 8-5
control register, 8-8
data I/O register, 8-10
features, 8-1
frequency divider register, 8-7
handshaking, 8-5
interface memory map, A-7
lost arbitration, 8-13
overview, 8-1
programming
examples, 8-10
model, 8-6
protocol, 8-3
repeated START generation, 8-12
slave mode, 8-13
software response, 8-11
START generation, 8-10
status register, 8-9
STOP generation, 8-12
system configuration, 8-3
timing specifications, 20-15
IEEE Standard 1149.1 Test Access Port, see JTAG
Instruction set
general summary, 2-34
MAC summary, 3-4
MAC unit execution times, 3-5
Integer data formats
memory, 2-32
registers, 2-31
Interrupt controller
autovector register, 9-5
overview, 9-1
pending and mask registers, 9-6
port assignment register, 9-7
J
JTAG
AC timing, 20-20
obtaining IEEE Standard 1149.1, 19-12
overview, 19-1
registers
boundary scan, 19-7
bypass, 19-10
descriptions, 19-4
IDCODE, 19-6
instruction shift, 19-5
restrictions, 19-10
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INDEX
Index Index-19
signal descriptions, 19-2
TAP controller, 19-3
test logic disabling, 19-11
M
MAC
data representation, 3-4
instruction execution timings, 3-5
instruction set summary, 3-4
operation, 3-3
programming model, 2-26, 3-2
status register (MACSR), 1-14, 2-29
Mask registers
DRAM, 11-7, 11-22
MAC, 1-14, 2-29
MBAR, 6-4
Mechanical data
case drawing, 16-9
diagram, 16-8
pinout, 16-1
Memory SIM register, 6-3
MOVEC instruction, 5-36
O
Output port command registers, 14-15
P
Parallel port
code example, 15-3
data direction register, 15-2
data register, 15-2
operation, 15-1
Pin assignment register, 6-10, 15-1
PLL, 7-2
clock control for STOP, 6-10
clock frequency relationships, 7-4
control register, 7-3
modes, 7-2
operation, 7-2
overview, 7-1
port list, 7-3
power supply filter circuit, 7-6
reset/initialization, 7-2
timing relationships, 7-4
Power supply filter circuit, 7-6
Privilege level modes, 1-12
Programming models
overview, 2-26
SIM, 6-3
summary, A-1
supervisor, 2-29
user, 2-27
PST outputs, 5-3
PULSE instruction, 5-4
R
Registers
ABLR/ABHR, 5-7, 5-8
address (A0 – A6), 2-27
AVR, 9-5
BDM address attribute, 5-9
bus master park, 6-11
chip-select
control, 10-8
mask, 10-6
module, 10-5
condition code, 2-28
condition code (CCR), 2-28
data breakpoint/mask, 5-12
data D0 - D7, 2-27
DBR/DBMR, 5-7
debug attribute trigger, 5-7
DMA
byte count, 12-7
source address, 12-6
DRAM
asynchronous
address and control, 11-5
DACR, 11-5
DCR, 11-4
DMR, 11-7
mode signals, 11-4
general operation, 11-3
synchronous
DACR, 11-20
DCR, 11-19
DMR, 11-22
mode settings, 11-33
I2C
address, 8-6
control, 8-8
data I/O, 8-10
frequency divider, 8-7
status, 8-9
I2CR, 8-8
I2DR, 8-10
I2SR, 8-9
IADR, 8-6
IFDR, 8-7
interrupt controller
autovector, 9-5
pending and mask, 9-6
port assignment, 9-7
IPR and IMR, 9-6
IRQPAR, 9-7
JTAG
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INDEX
Index-20 MCF5307 User’s Manual
boundary scan, 19-7
bypass, 19-10
descriptions, 19-4
IDCODE, 19-6
instruction shift, 19-5
MAC status, 1-14, 2-29
MASK, 2-29
MBAR, 6-4
MPARK, 6-11
output port command, 14-15
PADAT, 15-2
PADDR, 15-2
PAR, 6-10, 15-1
parallel port
data, 15-2
pin assignment, 6-10, 15-1
PLL control, 7-3
PLLCR, 7-3
read control, 5-36
read debug module, 5-38
reset status, 6-5
RSR, 6-5
S bit, 1-12
SDRAM mode initialization, 11-38
SIM
base address, 6-4
memory map, 6-3
software watchdog interrupt, 6-9
status, 2-29
SWIVR, 6-9
SWSR, 6-9
SYPCR, 6-8
system protection control, 6-8
TCR, 13-4
TER, 13-5
timer module
capture, 13-4
event, 13-5
mode, 13-3
reference, 13-4
TMR, 13-3
trigger definition, 5-14
UACR, 14-12
UART modules, 14-2–14-16
UCR, 14-9
UCSR, 14-8
UDU/UDL, 14-14
UIP, 14-15
UIPCR, 14-12
UISR, 14-13
UIVR, 14-15
vector base, 2-30
write control, 5-37
write debug module, 5-39
RSTI timing, 7-5
S
SDRAM
block diagram and major components, 11-2
controller registers, A-3
DACR initialization, 11-35
DCR initialization, 11-35
definitions, 11-2
DMR initialization, 11-37
example, 11-34
initialization code, 11-39
interface configuration, 11-35
mode register initialization, 11-38
overview, 11-1
Signal descriptions, 17-1
address
bus, 17-7
configuration, 17-14
strobe, 17-9
bus
arbitration, 17-12
clock output, 17-13
data, 17-8
driven, 17-13
grant, 17-12
request, 17-12
chip-select module, 17-15
clock, 17-13
clock and reset signals
divide control, 17-15
data bus, 17-8
data/configuration pins, 17-13
debug
high impedance, 17-20
JTAG, 17-21
processor clock output, 17-20
test
clock, 17-23
mode, 17-20
overview, 17-20
DMA controller module, 17-17
DRAM controller
address strobes, 17-16
overview, 17-16
synchronous
clock enable, 17-17
column address strobe, 17-17
edge select, 17-17
row address strobe, 17-17
write, 17-17
I2C module
general, 17-19
serial data and clock, 17-19
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INDEX
Index Index-21
interrupt
control signals, 17-12
request, 17-12
JTAG, 19-2
parallel I/O port, 17-19
read/write, 17-8
reset in, out, 17-13
serial module
general, 17-18
receiver serial data input, 17-18
send, 17-18
transmitter serial data output, 17-18
size, 17-8
timer module, 17-18
transfer
acknowledge, 17-9
in progress, 17-10
modifier, 17-10
start, 17-9
Signals
overview, 17-1
SIM
features, 6-1
programming model, 6-3
register memory map, 6-3
Software watchdog
interrupt vector register, 6-9
service register, 6-9
timer, 6-6
STOP instruction, 5-4, 5-17
System protection control register, 6-8
T
Timer module
calculating time-out values, 13-7
capture registers, 13-4
code example, 13-6
counters, 13-5
event registers, 13-5
general-purpose programming model, 13-2
mode registers, 13-3
reference registers, 13-4
Timing
MAC unit instructions, 3-5
PLL, 7-4
RSTI, 7-5
Transfers generated internally, 6-12
U
UART modules
bus operation
interrupt acknowledge cycles, 14-28
read cycles, 14-28
write cycles, 14-28
clock source baud rates, 14-19
external clock, 14-19
FIFO stack in UART0, 14-24
initialization sequence, 14-29
looping modes, 14-25
automatic echo, 14-25
local loop-back, 14-25
remote loop-back, 14-26
mode registers, 14-4
multidrop mode, 14-26
programming, 14-28
receiver
enabled, 14-22
register description, 14-2
serial overview, 14-2
signal definitions, 14-16
transmitter/receiver
clock source, 14-18
modes, 14-19
transmitting in UART mode, 14-21
User programming model, 2-27
V
Variant address, 5-5
Vector base register, 2-30
W
WDDATA execution, 5-4
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INDEX
Index-22 MCF5307 User’s Manual
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1
2
3
4
5
7
8
9
10
11
12
13
14
15
16
17
18
19
A
Part II
Part IV
Part III
6
GLO
IND
Part I
Overview
ColdFire Core
Hardware Multiply/Accumulate (MAC) Unit
Local Memory
Debug Support
SIM Overview
Phase-Locked Loop (PLL)
I2C Module
Interrupt Controller
Chip-Select Module
Synchronous/Asynchronous DRAM Controller Module
DMA Controller Module
Timer Module
UART Modules
Parallel Port (General-Purpose I/O)
Mechanical Data
Signal Descriptions
Bus Operation
IEEE 1149.1 Test Access Port (JTAG)
Electrical Specifications
Part I: MCF5307
Processor
Core
Part II: System Integration Module (
SIM)
Part IV: Hardware Interface
Part III: Peripheral Module
Glossary of Terms and Abbreviations
Index
Appendix: Memory Map
B
20
GLO
IND
IND
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Overview
ColdFire Core
Hardware Multiply/Accumulate (MAC) Unit
Local Memory
Debug Support
SIM Overview
Phase-Locked Loop (PLL)
I2C Module
Interrupt Controller
Chip-Select Module
Synchronous/Asynchronous DRAM Controller Module
DMA Controller Module
Timer Module
UART Modules
Parallel Port (General-Purpose I/O)
Mechanical Data
Signal Descriptions
Bus Operation
IEEE 1149.1 Test Access Port (JTAG)
Electrical Specifications
Part I: MCF5307
Processor
Core
Part II: System Integration Module (
SIM)
Part IV: Hardware Interface
Part III: Peripheral Module
Glossary of Terms and Abbreviations
Index
Appendix: Memory Map
1
2
3
4
5
7
8
9
10
11
12
13
14
15
16
17
18
19
A
Part II
Part IV
Part III
6
Part I
20
GLO
IND
Freescale Semiconductor, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...
Freescale Semiconductor, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...
Freescale Semiconductor, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...
