Product family data sheet
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and
XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.COM/XLAMP
CLD-DS28 REV 6H
Cree® XLamp® MX-3 LEDs
PRODUCT DESCRIPTION
The Cree XLamp® MX-3 LED provides the
proven lighting-class performance and
reliability of Cree XLamp LEDs in a at‑top
PLCC package. The XLamp MX-3 LED
continues Crees history of innovation in
LEDs for lighting applications with a wide
viewing angle, unlimited oor life, uniform
light output without secondary optics and
electrically neutral thermal path.
The XLamp MX-3 LED brings high
performance and quality of light to a wide
range of lighting applications, including
linear lighting, LED light bulbs, uorescent
retrots and retail‑display lighting.
FEATURES
Available in white (2600K to 8300K
CCT)
Maximum drive current: 500mA
Wide viewing angle: 120°
Electrically neutral thermal path
Qualication at maximum drive
current
RoHS and REACh compliant
UL® recognized component
(E349212)
TABLE OF CONTENTS
Characteristics ....................................... 2
Flux Characteristics ............................... 2
Relative Spectral Power Distribution .... 3
Relative Flux vs. Junction
Temperature ........................................... 3
Electrical Characteristics ....................... 4
Relative Flux vs. Current ........................ 4
Typical Spatial Distribution .................... 5
Thermal Design ...................................... 5
Reow Soldering Characteristics .......... 6
Notes ...................................................... 7
Mechanical Dimensions ........................ 9
Tape and Reel ....................................... 10
Packaging ............................................. 11
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
2
XLamp® mX-3 LED
22
CHARACTERISTICS
Characteristics Unit Minimum Typical Maximum
Thermal resistance, junction to solder point °C/W 11
Viewing angle (FWHM) degrees 120
Temperature coefcient of voltage mV/ °C -2.7
ESD classication (HBM per Mil‑Std‑883D) Class 2
DC forward current mA 500
Reverse voltage V -5
Reverse current mA -0.1
Forward voltage (@ 350mA) V 3.7 4.0
LED junction temperature °C 150
FLUX CHARACTERISTICS (TJ = 25°C)
The following table provides several base order codes for XLamp MX-3 LEDs. It is important to note that the base order codes listed here
are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-
code nomenclature, please consult the XLamp MX Family LED Binning and Labeling document.
Color
CCT Range Minimum Luminous Flux
(lm) @ 350mA
Calculated Minimum
Luminous Flux (lm)
@ 300mA* Order Code
Minimum Maximum Group Flux (lm) Flux (lm)
Cool White 5000 K 8300 K
R2 114 100 MX3AWT-A1-0000-000E51
Q5 107 93.9 MX3AWT-A1-0000-000D51
Warm White
3700 K 4300 K Q4 100 87 MX3AWT-A1-0000-000CE5
2600 K 3700 K Q3 93.9 82 MX3AWT‑A1‑0000‑000BE7
Notes:
Cree maintains a tolerance of ±7% on ux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on
CRI measurements. See the Measurements section (page 7).
Typical CRI for Cool White (4300K – 8300K CCT) is 75.
Typical CRI for Warm White (2600K – 4300K CCT) is 80.
* Calculated values for reference purposes only.
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
3
XLamp® mX-3 LED
33
RELATIVE SPECTRAL POWER DISTRIBUTION
RELATIVE FLUX VS. JUNCTION TEMPERATURE (IF = 350mA)
Relative Spectral Power
0
20
40
60
80
100
380 430 480 530 580 630 680 730 780
Relative Radiant Power (%)
Wavelength (nm)
5000 K - 8300 K CCT
3500 K - 5000 K CCT
2600 K - 3500 K CCT
Relative Flux Output vs. Junction Temperature
0%
20%
40%
60%
80%
100%
25 50 75 100 125 150
Relative Luminous Flux
Junction Temperature (ºC)
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
4
XLamp® mX-3 LED
44
ELECTRICAL CHARACTERISTICS (TJ = 25°C)
RELATIVE FLUX VS. CURRENT (TJ = 25°C)
Electrical Characteristics (Tj = 25ºC)
0
50
100
150
200
250
300
350
400
450
500
2.50 2.75 3.00 3.25 3.50 3.75 4.00 4.25 4.50
Forward Current (mA)
Forward Voltage (V)
Relative Intensity vs. Current (Tj = 25ºC)
0
20
40
60
80
100
120
140
050 100 150 200 250 300 350 400 450 500
Relative Luminous Flux (%)
Forward Current (mA)
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
5
XLamp® mX-3 LED
55
TYPICAL SPATIAL DISTRIBUTION
THERMAL DESIGN
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
Typical Spatial Radiation Pattern
0
20
40
60
80
100
-90 -70 -50 -30 -10 10 30 50 70 90
Relative Luminous Intensity (%)
Angle (º)
Thermal Design
0
50
100
150
200
250
300
350
400
450
020 40 60 80 100 120 140 160
Maximum Current (mA)
Ambient Temperature (ºC)
Rj-a = 15° C/W
Rj-a = 20° C/W
Rj-a = 25° C/W
Rj-a = 30° C/W
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
6
XLamp® mX-3 LED
66
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp MX-3 LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering prole provided by the manufacturer of the solder paste used,
and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Profile Feature Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp)1.2°C/second
Preheat: Temperature Min (Tsmin) 120 °C
Preheat: Temperature Max (Tsmax) 170 °C
Preheat: Time (tsmin to tsmax) 65-150 seconds
Time Maintained Above: Temperature (TL) 217 °C
Time Maintained Above: Time (tL) 45-90 seconds
Peak/Classication Temperature (Tp) 235 - 245 °C
Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 - 6 °C/second
Time 25°C to Peak Temperature 4 minutes max.
Note: All temperatures refer to the topside of the package, measured on the package body surface.
TP
TL
Temperature
Time
t 25˚C to Peak
Preheat
ts
tS
tP
25
Ramp-down
Ramp-up
Critical Zone
TL to TP
Tsmax
Tsmin
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
7
XLamp® mX-3 LED
77
NOTES
Measurements
The luminous ux, radiant power, chromaticity, forward voltage and CRI measurements in this document are binning specications only
and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number
of factors that are not within Crees control and are not intended or provided as operational specications for the products. Calculated
values are provided for informational purposes only and are not intended or provided as specications.
Pre‑Release Qualication Testing
Please read the LED Reliability Overview for details of the qualication process Cree applies to ensure long‑term reliability for XLamp
LEDs and details of Crees pre‑release qualication testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specic LM‑80 data sets available for this LED, refer to the public LM-80 results document.
Please read the Long-Term Lumen Maintenance application note for more details on Crees lumen maintenance testing and forecasting.
Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect
the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp MX‑3 LEDs in the provided, resealable moisture‑barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp MX‑3 LEDs should be handled and stored as MSL 2a per JEDEC J‑STD‑033, meaning they have limited
exposure time before damage to the LED may occur during the soldering
operation. The table on the right species the maximum exposure time
in days depending on temperature and humidity conditions. LEDs with
exposure time longer than the specied maximums must be baked
according to the baking conditions listed below.
Baking Conditions
It is not necessary to bake all XLamp MX-3 LEDs. Only the LEDs that meet all of the following criteria must be baked:
1. LEDs that have been removed from the original MBP.
2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3. LEDs that have not been soldered.
LEDs should be baked at 70ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do
not bake parts at temperatures higher than 70ºC. This baking operation resets the exposure time as dened in the Moisture Sensitivity
section above.
Temp. Maximum Percent Relative Humidity
30% 40% 50% 60% 70% 80% 90%
35 ºC - - - 17 1 .5 .5
30 ºC - - - 28 1 1 1
25 ºC - - - - 2 1 1
20 ºC - - - - 2 1 1
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
8
XLamp® mX-3 LED
Storage Conditions
XLamp MX‑3 LEDs that have been removed from the original MBP but not soldered should be stored in one of the following ways:
Store the parts in a rigid metal container with a tight‑tting lid. Verify that the storage temperature is <30°C, and place fresh desiccant
and an RH indicator in the container to verify that the RH is no greater than 60%.
Store the parts in a dry, nitrogen‑purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater
than 60%.
For short‑term store only: LEDs can be resealed in the original MBP soon after opening. Fresh desiccant may be needed. Use the
included humidity indicator card to verify <60% RH.
If an environment of <60% RH is not available for storage, XLamp MX‑3 LEDs should be baked (described above) before reow soldering.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Ecology section of the Cree website.
REACh Compliance
REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)
has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
UL® Recognized Component
This product meets the requirements to be considered a UL Recognized Component with Level 4 enclosure consideration. The LED
package or a portion thereof has been investigated as a re and electrical enclosure per ANSI/UL 8750.
Vision Advisory
WARNING: Do not look at an exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please
refer to the LED Eye Safety application note.
NOTES - CONTINUED
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
9
XLamp® mX-3 LED
MECHANICAL DIMENSIONS
All measurements are ±.13 mm unless otherwise indicated.
Top View
Bottom View Side View
Top View
Recommended MCPCB Solder Pad Alternative Solder Pad
Recommended FR4 Solder Pad
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
10
XLamp® mX-3 LED
TAPE AND REEL
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm.
Loaded Pockets
(1,000 Lamps)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(50 empty pockets min.)
Trailer
160mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
START
END
Cathode Side
Anode Side
(denoted by + and circle)
160.0
A
A
B
2.5
±.1
SECTION A-A
SCALE 2 : 1
1.5
±.1
8.0
±.1
4.0
±.1
1.75
±.10
12.0 .0
+
.3
DETAIL B
SCALE 2 : 1
13
mm
7"
Cover Tape
Pocket Tape
User Feed Direction
User Feed Direction
(8 )
(12 )
(1.75 )
(4 )
( )1.5
(1.55 )
Trailer Loaded Pockets Leader
160mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(50 empty pockets min.)
(1,400 pcs /Reel
CATHODE SIDE
ANODE SIDE
Cathode Mark
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
11
XLamp® mX-3 LED
PACKAGING
Patent Label
(on bottom of box)
Label with Cree Bin Code,
Quantity, Reel ID
Label with Cree Bin
Code, Quantity, Reel ID
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Unpackaged Reel
Packaged Reel
Boxed Reel
CREE Bin Code
& Barcode Label
Vacuum-Sealed
Moisture Barrier Bag
Label with Customer
P/N, Qty, Lot #, PO #
Label with Cree Bin
Code, Qty, Lot #
Label with Cree Bin
Code, Qty, Lot #
Vacuum-Sealed
Moisture Barrier Bag
Patent Label
Label with Customer Order
Code, Qty, Reel ID, PO #
Humidity Indicator Card
(inside bag)
Dessicant
(inside bag)