CYStech Electronics Corp.
Spec. No. : C332CY
Issued Date : 2004.04.16
Revised Date :
Page No. : 1/1
CDSS355CY CYStek Product Specification
75V/150mA SURFACE MOUNT SWITCHING DIODE
CDSS355CY
Features:
● Designed for mounting on small surface
● Extremely thin / leadless package
● High mounting capability, strong surge withstand, high reliability
Mechanical data:
● Case: 0603(1608) standard package, molded plastic, JEDEC SOD-523
● Terminals : Gold plated, solderable per MIL-STD-750, method 2026.
● Polarity: Indicated by cathode band
● Mounting position: Any
● Weight: 0.003 gram (approximately)
Absolute Maximum Ratings(At Ta=25℃, unless otherwise noted)
Characteristics Symbol Min Typ Max Unit
Repetitive Peak Reverse Voltage VRRM - - 100 V
Reverse Voltage VR - - 75 V
Average Forward Current IO - - 150 mA
Peak Forward Surge Current @ tp=1µs
@ tp=1ms IFSM - 4
1 - A
Repetitive Peak Forward Current IFRM - - 300 mA
Power Dissipation PD - - 150 mW
Junction Temperature Tj -40 - +125 °C
Storage Temperature Range Tstg -40 - +125 °C
Electrical Characteristics ( At Ta=25°C, unless otherwise noted)
Parameter Conditions Symbol Min Typ Max Unit
Forward Voltage IF=50mA VF - - 1 V
Reverse Current VR=20V
VR=75V IR - -
25
2.5
nA
µA
Diode Capacitance VR=0V, f=1MHz CD - - 4 pF
Reverse Recovery Time IF=IR=10mA, RL=100Ω, Irr=1mA trr - - 4 ns
CYStech Electronics Corp.
Spec. No. : C332CY
Issued Date : 2004.04.16
Revised Date :
Page No. : 2/2
CDSS355CY CYStek Product Specification
Characteristic Curves
Forward Current vs Forward Voltage
1
10
100
1000
0 0.2 0.4 0.6 0.8 1 1.2
Forward Voltage---VF(V)
Forward Current---IF(mA)
125℃
75℃
25℃
-25℃
Reverse Leakage Current vs Temperature
1
10
100
1000
10000
0 1020304050607080
Ambient Temperature---TA(℃)
Reverse Leakage Current---IR(n
A)
125℃
75℃
25℃
Diode Capacitance vs Reverse Voltage
0
1
2
3
4
5
02468101214
Reverse Voltage---VR(V)
Diode Capacitance---CD(pF)
f=1MHz
Ta=25℃
Forward Current vs Ambient Temperature
0
25
50
75
100
125
0 25 50 75 100 125 150
Ambient Temperature---Ta(℃)
Percentage of Peak Aver
age
Forward Current(%)
Mounting on glass epoxy PCBs
CYStech Electronics Corp.
Spec. No. : C332CY
Issued Date : 2004.04.16
Revised Date :
Page No. : 3/3
CDSS355CY CYStek Product Specification
SOD-523(0603) Dimension
*:Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max.
DIM Min. Max. Min. Max.
A 0.063 0.071 1.6 1.8 D 0.027 0.033 0.70 0.85
B 0.031 0.039 0.8 1.0 E 0.012(typ) 0.30(typ)
C 0.010(typ) 0.25(typ) F 0.014(typ) 0.35(typ)
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SOD-523(0603) Plastic
Surface Mounted Package
CYStek Package Code : CY
