© Semiconductor Components Industries, LLC, 2012
June, 2012 − Rev. 2
1Publication Order Number:
MC74HC11A/D
MC74HC11A
Triple 3-Input AND Gate
High−Performance Silicon−Gate CMOS
The MC74HC11A is identical in pinout to the LS11. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
Features
•Output Drive Capability: 10 LSTTL Loads
•Outputs Directly Interface to CMOS, NMOS, and TTL
•Operating Voltage Range: 2 V to 6 V
•Low Input Current: 1 mA
•High Noise Immunity Characteristic of CMOS Devices
•NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•These Devices are Pb−Free, Halogen Free and are RoHS Compliant
Figure 1. Logic Diagram
Y1
A1
PIN 14 = VCC
PIN 7 = GND
Y = ABC
B1
C1
1
2
13
A2
B2
C2
3
4
5
A3
B3
C3
9
10
11
12
6
8
Y2
Y3
MARKING
DIAGRAMS
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or = Pb−Free Package
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
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TSSOP−14
DT SUFFIX
CASE 948G
14
1
SOIC−14
D SUFFIX
CASE 751A
14
1
HC11AG
AWLYWW
1
14
HC
11A
ALYW
1
14
(Note: Microdot may be in either location)
B
X
L
X
H
FUNCTION TABLE
A
L
X
X
H
Inputs Output
C
X
X
L
H
Y
L
L
L
H
11
12
13
14
8
9
105
4
3
2
1
7
6
B3
C3
Y1
C1
VCC
Y3
A3
B2
A2
B1
A1
GND
Y2
C2
PIN ASSIGNMENT
MC74HC11A
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2
MAXIMUM RATINGS*
Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V
Vin DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V
Vout DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V
Iin DC Input Current, per Pin ±20 mA
Iout DC Output Current, per Pin ±25 mA
ICC DC Supply Current, VCC and GND Pins ±50 mA
PDPower Dissipation in Still Air SOIC Package
TSSOP Package
500
450
mW
Tstg Storage Temperature −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC DC Supply Voltage (Referenced to GND) 2.0 6.0 V
Vin, Vout DC Input Voltage, Output Voltage (Referenced to GND) 0 VCC V
TAOperating Temperature, All Package Types −55 +125 °C
tr, tfInput Rise and Fall Time VCC = 2.0 V
(Figure 2) VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
0
0
0
0
1000
600
500
400
ns
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC74HC11A
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3
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol Parameter Test Conditions
VCC
V
Guaranteed Limit
Unit
− 55 to
25°Cv 85°Cv 125°C
VIH Minimum High−Level Input
Voltage
Vout = 0.1 V or VCC − 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL Maximum Low−Level Input
Voltage
Vout = 0.1 V or VCC − 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
VOH Minimum High−Level Output
Voltage
Vin = VIH or VIL
|Iout| v 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH or VIL |Iout| v 2.4 mA
|Iout| v 4.0 mA
|Iout| v 5.2 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
VOL Maximum Low−Level Output
Voltage
Vin = VIH
|Iout| v 20 mA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIH or VIL |Iout| v 2.4 mA
|Iout| v 4.0 mA
|Iout| v 5.2 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 ±0.1 ±1.0 ±1.0 mA
ICC Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 mA
6.0 1 10 40 mA
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Symbol Parameter
VCC
V
Guaranteed Limit
Unit
− 55 to
25°Cv 85°Cv 125°C
tPLH,
tPHL
Maximum Propagation Delay, Input A, B, or C to Output Y
(Figures 2 and 3)
2.0
3.0
4.5
6.0
95
45
19
16
120
60
24
20
145
75
29
25
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 2 and 3)
2.0
3.0
4.5
6.0
75
30
15
13
95
40
19
16
110
55
22
19
ns
Cin Maximum Input Capacitance −10 10 10 pF
CPD Power Dissipation Capacitance (Per Gate)*
Typical @ 25°C, VCC = 5.0 V
pF
27
*Used to determine the no−load dynamic power consumption: PD = CPD VCC2f + ICC VCC.
MC74HC11A
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4
Figure 2. Switching Waveforms
tr
VCC
GND
90%
50%
10%
90%
50%
10%
INPUT
A, B, OR C
OUTPUT Y
tPLH tPHL
tTLH tTHL
tf
A
B
C
Y
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 3. Test Circuit
Figure 4. Expanded Logic Diagram
(1/3 of the Device)
ORDERING INFORMATION
Device Package Shipping†
MC74HC11ADG SOIC−14
(Pb−Free)
55 Units / Rail
MC74HC11ADR2G SOIC−14
(Pb−Free)
2500 / Tape & Reel
MC74HC11ADTR2G TSSOP−14
(Pb−Free)
2500 / Tape & Reel
NLV74HC11ADR2G* SOIC−14
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
MC74HC11A
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5
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14 8
71
M
0.25 B M
C
h
X 45
SEATING
PLANE
A1
A
M
S
A
M
0.25 B S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D8.55 8.75 0.337 0.344
E3.80 4.00 0.150 0.157
A1.35 1.75 0.054 0.068
b0.35 0.49 0.014 0.019
L0.40 1.25 0.016 0.049
e1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M0 7 0 7
H5.80 6.20 0.228 0.244
h0.25 0.50 0.010 0.019
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74HC11A
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6
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L−U−
SEATING
PLANE
0.10 (0.004)
−T−
ÇÇÇ
ÇÇÇ
SECTION N−N
DETAIL E
JJ1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36 14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74HC11A
http://onsemi.com
7
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
MC74HC11A/D
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