2005-2012 Microchip Technology Inc. DS21985D-page 1
MCP131X/2X
Features:
• Low Supply Current: 1 µA (Typical),10 µA (Max.)
• Precision Monitoring Trip Point Options:
- 2.9V and 4.6V (Standard Offerings)
- 2.0V to 4.7V in 100 mV Increments,
(Contact th e loca l Microchip Sales Office)
• Resets Microcontroller in a Power-loss Event
• Reset Delay Time-Out Option:
- 1.4 ms, 30 ms, 200 ms, or 1.6s (Typical)
• Watchdog Timer Input Time-Out Options:
- 6.3 ms, 102 ms, 1.6s, or 25.6s (Typical)
• Manual Reset (MR) Input (Active-low)
• Single and Complementary Reset Output(s)
• Reset Output Options:
- Push-Pull (Active-high or Active-low)
- Open-Drain (Internal or External Pull-up)
• Temperature Range:
- -40°C to +85°C for T rip Points 2.0 to 2.4V and,
- -40°C to + 125°C for Trip Points > 2.5V
• Voltage Range: 1.0V to 5.5V
• Lead Free Packaging
Description:
The MCP131X/2X are voltage supervisor devices
designed to keep a microcontroller in Reset until the
system voltage has reached and stabilized at the
proper level for reliable system operation. The table
below shows the available features for these devices.
Package Types
Block Diagram
Device Features
1
2
3
5
4
MCP1317
1
2
3
5
4
MCP1318/18M/21
1
2
3
5
4
MCP1319/19M/22
1
2
3
5
4
MCP1316/16M/20 SOT-23-5
RST RST
VSS
MR WDI
VDD VDD
RST
VSS
MR WDI
VSS
RST WDI
VDD RST
VSS
RST MR
VDD
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Noise Filter
Watchdog
MR
WDI
Note: Features available depend on the device.
Voltage
Device
Reset Output A Reset Output B
WDI Input MR Input
Type Pull-up
Resistor Active
Level Type Pull-up
Resistor Active
Level
MCP1316 Push-Pull — Low — — — Yes Yes
MCP1316M Open-Drain Internal Low — — — Yes Yes
MCP1317 Push-Pull — High — — — Yes Yes
MCP1318 Push-Pull — Low Push-Pull — High Yes No
MCP1318M Open-Drain Internal Low Push-Pull — High Yes No
MCP1319 Push-Pull — Low Push-Pull — High No Yes
MCP1319M Open-Drain Internal Low Push-Pull — High No Yes
MCP1320 Open-Drain External Low — — — Yes Yes
MCP1321 Open-Drain External Low Push-Pull — High Yes No
MCP1322 Open-Drain External Low Push-Pull — High No Yes
Voltage Supervisor
MCP131X/2X
DS21985D-page 2 2005-2012 Microchip Technology Inc.
NOTES:
2005-2012 Microchip Technology Inc. DS21985D-page 3
MCP131X/2X
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage (VDD to VSS). . . . . . . . . . . . . . . . . . . . . . 7.0V
Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Voltage on all inputs and outputs, except Open-Drain RST
(with no internal pull-up resistor), w.r. t. VSS . .-0.6V to (VDD +
1.0V)
Voltage on Open-Drain RST
(with no internal pull-up resistor) w.r.t. VSS . . -0.6V to 13.5V
Storage temperature. . . . . . . . . . . . . . . . . . .- 65°C to +150°C
Ambient temp. with power applied . . . . . . . .-40°C to +125°C
Maximum Junction temp. with power applied. . . . . . .+150°C
Power Dissipation (TA +70°C):
5-Pin SOT-23A.................. ................... ............... ...240 mW
ESD protection on all pins 4kV
† Notice: Stresses above those listed under “ Maximum Rat-
ings” may cause permanent damage to the devic e. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to max imum rati ng conditions for extended periods may
affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Operati ng Volt age Range VDD 1.0 — 5.5 V
Specified VDD Value to VOUT Low VDD 1.0 — — V I RST = 10 µA, V RST < 0.3V
Operati ng Curren t: IDD — 5 10 µA Watchdog Timer Active
— 1 2 µA Watchdog Timer Inact ive
—12µAV
DD < VTRIP
— 5 10 µA Reset Delay Timer Active
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
MCP131X/2X
DS21985D-page 4 2005-2012 Microchip Technology Inc.
VDD Trip Point MCP13XX-20 VTRIP 1.970 2.00 2.030 V TA = +25°C (Note 1)
(Note 6)1.950 2.00 2.050 V TA = -40°C to +85°C (Note 2)
MCP13XX-21 2.069 2.10 2.132 V TA = +25°C (Note 1)
(Note 6)2.048 2.10 2.153 V TA = -40°C to +85°C (Note 2)
MCP13XX-22 2.167 2.20 2.233 V TA = +25°C (Note 1)
(Note 6)2.145 2.20 2.255 V TA = -40°C to +85°C (Note 2)
MCP13XX-23 2.266 2.30 2.335 V TA = +25°C (Note 1)
(Note 6)2.243 2.30 2.358 V TA = -40°C to +85°C (Note 2)
MCP13XX-24 2.364 2.40 2.436 V TA = +25°C (Note 1)
(Note 6)2.340 2.40 2.460 V TA = -40°C to +85°C (Note 2)
MCP13XX-25 2.463 2.50 2.538 V TA = +25°C (Note 1)
(Note 6)2.438 2.50 2.563 V TA = -40°C to +125°C (Note 2)
MCP13XX-26 2.561 2.60 2.639 V TA = +25°C (Note 1)
(Note 6)2.535 2.60 2.665 V TA = -40°C to +125°C (Note 2)
MCP13XX-27 2.660 2.70 2.741 V TA = +25°C (Note 1)
(Note 6)2.633 2.70 2.768 V TA = -40°C to +125°C (Note 2)
MCP13XX-28 2.758 2.80 2.842 V TA = +25°C (Note 1)
(Note 6)2.730 2.80 2.870 V TA = -40°C to +125°C (Note 2)
MCP13XX-29 2.857 2.90 2.944 V TA = +25°C (Note 1)
2.828 2.90 2.973 V TA = -40°C to +125°C (Note 2)
MCP13XX-30 2.955 3.00 3.045 V TA = +25°C (Note 1)
(Note 6)2.925 3.00 3.075 V TA = -40°C to +125°C (Note 2)
MCP13XX-31 3.054 3.10 3.147 V TA = +25°C (Note 1)
(Note 6)3.023 3.10 3.178 V TA = -40°C to +125°C (Note 2)
MCP13XX-32 3.152 3.20 3.248 V TA = +25°C (Note 1)
(Note 6)3.120 3.20 3.280 V TA = -40°C to +125°C (Note 2)
MCP13XX-33 3.251 3.30 3.350 V TA = +25°C (Note 1)
(Note 6)3.218 3.30 3.383 V TA = -40°C to +125°C (Note 2)
DC CHARACTERISTICS (CONTINUE D)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
2005-2012 Microchip Technology Inc. DS21985D-page 5
MCP131X/2X
VDD Trip Point (Con’t) MCP13XX-34 VTRIP 3.349 3.40 3.451 V TA = +25°C (Note 1)
(Note 6)3.315 3.40 3.385 V TA = -40°C to +125°C (Note 2)
MCP13XX-35 3.448 3.50 3.553 V TA = +25°C (Note 1)
(Note 6)3.413 3.50 3.588 V TA = -40°C to +125°C (Note 2)
MCP13XX-36 3.546 3.60 3.654 V TA = +25°C (Note 1)
(Note 6)3.510 3.60 3.690 V TA = -40°C to +125°C (Note 2)
MCP13XX-37 3.645 3.70 3.756 V TA = +25°C (Note 1)
(Note 6)3.608 3.70 3.793 V TA = -40°C to +125°C (Note 2)
MCP13XX-38 3.743 3.80 3.857 V TA = +25°C (Note 1)
(Note 6)3.705 3.80 3.895 V TA = -40°C to +125°C (Note 2)
MCP13XX-39 3.842 3.90 3.959 V TA = +25°C (Note 1)
(Note 6)3.803 3.90 3.998 V TA = -40°C to +125°C (Note 2)
MCP13XX-40 3.940 4.00 4.060 V TA = +25°C (Note 1)
(Note 6)3.900 4.00 4.100 V TA = -40°C to +125°C (Note 2)
MCP13XX-41 4.039 4.10 4.162 V TA = +25°C (Note 1)
(Note 6)3.998 4.10 4.203 V TA = -40°C to +125°C (Note 2)
MCP13XX-42 4.137 4.20 4.263 V TA = +25°C (Note 1)
(Note 6)4.095 4.20 4.305 V TA = -40°C to +125°C (Note 2)
MCP13XX-43 4.236 4.30 4.365 V TA = +25°C (Note 1)
(Note 6)4.193 4.30 4.408 V TA = -40°C to +125°C (Note 2)
MCP13XX-44 4.334 4.40 4.466 V TA = +25°C (Note 1)
(Note 6)4.290 4.40 4.510 V TA = -40°C to +125°C (Note 2)
MCP13XX-45 4.433 4.50 4.568 V TA = +25°C (Note 1)
(Note 6)4.388 4.50 4.613 V TA = -40°C to +125°C (Note 2)
MCP13XX-46 4.531 4.60 4.669 V TA = +25°C (Note 1)
4.485 4.60 4.715 V TA = -40°C to +125°C (Note 2)
MCP13XX-47 4.630 4.70 4.771 V TA = +25°C (Note 1)
(Note 6)4.583 4.70 4.818 V TA = -40°C to +125°C (Note 2)
VDD Trip Point Tempco TTPCO — ±40 — ppm/°C
DC CHARACTERISTICS (CONTINUE D)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
MCP131X/2X
DS21985D-page 6 2005-2012 Microchip Technology Inc.
Threshold Hysteresis MCP13XX-20 VHYS 0.020 —0.120 V TA = +25°C (Note 3)
Note 3)(Note 6) (Note 6)V TA = -40°C to +85°C
MCP13XX-21 0.021 —0.126 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +85°C
MCP13XX-22 0.022 —0.132 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +85°C
MCP13XX-23 0.023 —0.138 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +85°C
MCP13XX-24 0.024 —0.144 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +85°C
MCP13XX-25 0.025 —0.150 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-26 0.026 —0.156 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-27 0.027 —0.162 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-28 0.028 —0.168 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-29 0.029 — 0.174 V TA = +25°C (Note 3)
(Note 6)VT
A = -40°C to +125°C
MCP13XX-30 0.030 —0.180 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-31 0.031 —0.186 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-32 0.032 —0.192 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-33 0.033 —0.198 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
DC CHARACTERISTICS (CONTINUE D)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
2005-2012 Microchip Technology Inc. DS21985D-page 7
MCP131X/2X
Threshold Hysteresis MCP13XX-34 VHYS 0.034 —0.204 V TA = +25°C (Note 3)
(Continued) Note 3)(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-35 0.035 —0.210 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-36 0.036 —0.216 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-37 0.037 —0.222 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-38 0.038 —0.228 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-39 0.039 —0.234 V TA = +25°C (Note 1)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-40 0.040 —0.240 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-41 0.041 —0.246 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-42 0.042 —0.252 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-43 0.043 —0.258 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-44 0.044 —0.264 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-45 0.045 —0.270 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
MCP13XX-46 0.046 — 0.276 V TA = +25°C (Note 3)
(Note 6)VT
A = -40°C to +125°C
MCP13XX-47 0.047 —0.282 V TA = +25°C (Note 3)
(Note 6) (Note 6)V TA = -40°C to +125°C
DC CHARACTERISTICS (CONTINUE D)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
MCP131X/2X
DS21985D-page 8 2005-2012 Microchip Technology Inc.
RST/RST Low-Level Output Voltage VOL ——0.3VI
OL = 50 µA, 1.0V VDD 1.5V
——0.3VI
OL = 100 µA,
1.5V VDD 2.5V
——0.3VI
OL = 2 mA, 2.5V VDD 4.5V
——0.3VI
OL = 4 mA, VDD 4.5V
RST/RST High-Level Output Voltage VOH VDD –
0.7 —— VI
OH = 2.5 mA, VDD 2.5V
(Pus h-Pull Outpu ts only) VDD –
0.7 —— VI
OH = 500 µA, VDD 1.5V
Input Low Voltage (MR and WDI pins) VIL V
SS —0.3V
DD V
Input H igh Volt ag e (M R a nd WDI pi ns) VIH 0.7 VDD —V
DD V
Open-Drain High Voltage on Output
(Note 4)VODH ——13.5
(4) V Open-Drain Output pin only,
VDD = 3.0V, Time voltage >
5.5V applied 100 s,
current into pin limited to 2 mA,
+25°C operation
recommended
(Note 4, Note 5)
Input Leakage Current (MR and WDI) IIL ——±1µAV
SS VPIN VDD
Open-Drai n Out put Lea ka ge Current
(MCP1316M, MCP1318M,
MCP1319M, MCP1320, MCP1321,
and MCP1322 only)
IOD —0.0031.0 µA
Pull-up Resistance MR pin RPU —52—k V
DD = 5.5V
WDI pin — 52 — k V
DD = 5.5V
RST pin — 4.7 — k V
DD = 5.5V,
MCP131XM devices only
Input Pin Capacitanc e (MR and WDI) CI —100—pF
Output Pin Capacitive Loading
(RST and RST)CO — — 50 pF This is the tester loading to
meet the AC timing
specifications.
DC CHARACTERISTICS (CONTINUE D)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
2005-2012 Microchip Technology Inc. DS21985D-page 9
MCP131X/2X
FIGURE 1-1: Device Voltage and Reset Pin Waveforms.
TABLE 1-1: DEVICE VOLTAGE AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Falling VDD Trip Point Dete ct ed
to RST or RST Active tRPD — 650 — µs VDD ramped from
VTRIPMAX + 250 mV down to
VTRIPMIN – 200 mV,
VDD falling @ 5 mV/µs,
CL = 50 pF (Note 1)
VDD Rise Rate tRR Note 3
Reset active time
(MR Rising Edge, POR/BOR
Inactive, or WDT time out) to
RST/RST Inactive
tRST 1.0 1.4 2.0 ms Note 2
20 30 40 ms Note 2
140 200 280 ms Standard Time Out
1120 1600 2240 ms Note 2
RST Rise Time after RST Active
(Push-Pull Outputs only) tRT — 5 — µs For RS T 10% to 90% of VDD,
CL = 50 pF (Note 1)
RST Rise Time after RST Inactive
(Push-Pull Outputs only) —5 —µsFor RST 10% to 90% of VDD,
CL = 50 pF (Note 1)
RST Fall T i me af te r RST Inactive tFT — 5 — µs For RST 90% to 10% of VDD,
CL = 50 pF (Note 1)
RST Fall T i me af te r RST Active — 5 — µs For RST 90% to 10% of VDD,
CL = 50 pF (Note 1)
Note 1: These parameters are for design guidance only and are not 100% tested.
2: Custom ordered Reset active time; minimum order volume requirement.
3: Designed to be independe nt of VDD rise rate. Device characterization was done with a rise rate as slow as
0.1 V/s (@ +25°C).
VTRIPMAX
VTRIPMIN
VTRIP
1V
VDD
VTRIPAC + VHYS
tRST
RST
RST
tRR
tRST
tRPD
VDD < 1 V is outs ide th e device o pera ting sp ecifi cation . The RST (or R ST) output s tat e is
unknown while VDD < 1V.
MCP131X/2X
DS21985D-page 10 2005-2012 Microchip Technology Inc.
FIGURE 1-2: MR and Reset Pin Waveforms.
TABLE 1-2: MR AND RESET PIN TIMINGS
FIGURE 1-3: WDI and Reset Pin Waveforms.
TABLE 1-3: WDI AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
MR Pulse Width tMR 1— —µs
MR Active to RST/RST Active tMRD — 235 — ns VDD = 5.0V
MR Input Noise filter tNF — 150 — ns VDD = 5.0V
Note 1: These parameters are for design guidance only and are not 100% tested.
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
WDI Puls e Width tWP 50 — — ns
Watchdog Time-Out Period tWD 4.3 6.3 9.3 ms Note 1
71 102 153 ms Note 1
1.12 1.6 2.4 se c Standa rd Time Out
17.9 25.6 38.4 sec Note 1
Note 1: Custom ordered WatchDog Timer time out; minimum order volume requirement.
MR
RST
tRST
tMR
RST
tMRD
tNF
RST
RST
WDI (Note 1)tWP
tWD tWD
tRST
Note 1: The WDI pin was a weak pull-up resistor which is disabled after the 1st falling edge on the WDI pin.
2005-2012 Microchip Technology Inc. DS21985D-page 11
MCP131X/2X
TEMP ERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1316), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Speci fied Temperatu re Range TA-40 — +85 °C MCP13XX-25 (or below)
Speci fied Temperatu re Range TA-40 — +125 °C Except MCP13XX-25 (or below)
Maximum Junction Temperature T J——+150°C
Storage Temperature Range TA-65 — +150 °C
Package Thermal Resistances
Thermal Resistance, 5L-SOT-23 JA — 220.7 — °C/W
MCP131X/2X
DS21985D-page 12 2005-2012 Microchip Technology Inc.
NOTES:
2005-2012 Microchip Technology Inc. DS21985D-page 13
MCP131X/2X
2.0 TYPICAL PERFORMANCE C URVES
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316 ;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-1: IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1318M-4.6).
FIGURE 2-2: IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1319-2.9).
FIGURE 2-3: IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1316-2.0).
FIGURE 2-4: IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1318M-4.6).
FIGURE 2-5: IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1319-2.9).
FIGURE 2-6: IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1316-2.0).
Note: The gra phs and tab les prov ided fo llow ing this note are a sta tistic al sum mary b ased on a limit ed numb er of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
0.2
0.4
0.6
0.8
1
1.2
-100 -50 0 50 100
150
I
DD
(µA)
Temperature (°C)
1.0V
1.5V
2.0V
3.0V
4.3V
4.5V
4.8V
5.0V
5.5V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-100 -50 0 50 100
150
I
DD
(µA)
Temperature (°C)
1.0V
1.5V
2.5V
2.7V
3.2V
4.0V
4.5V
5.0V
5.5V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
-100 -50 0 50 100
150
I
DD
(µA)
Temperature (°C)
1.0V
1.5V
1.8V
2.2V
2.5V
4.0V
4.5V
5.0V
5.5V
0
1
2
3
4
5
6
-100 -50 0 50 100
150
Idd (µA)
Temperature (°C)
4.8V
5.0V
5.5V
0
1
2
3
4
5
6
-100 -50 0 50 100
150
I
DD
(µA)
Temperature (°C)
3.2V
4.0V
4.5V
5.0V
5.5V
0
1
2
3
4
5
6
7
-100 -50 0 50 100
150
I
DD
(µA)
Temperature (°C)
2.2V
2.5V
4.0V
4.5V
5.0V
5.5V
MCP131X/2X
DS21985D-page 14 2005-2012 Microchip Technology Inc.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-7: IDD vs. Temperature
(Watchdog Timer Active) (MCP1318M-4.6).
FIGURE 2-8: IDD vs. Temperature
(Watchdog Timer Active) (MCP1319-2.9).
FIGURE 2-9: IDD vs. Temperature
(Watchdog Timer Active) (MCP1316-2.0).
0
1
2
3
4
5
6
7
-100 -50 0 50 100
150
I
DD
(µA)
Temperature (°C)
4.8V
5.0V
5.5V
MCP1319 does not
have a Watchdog Timer
0
1
2
3
4
5
6
7
-100 -50 0 50 100
150
I
DD
(µA)
Temperature (°C)
2.2V
2.5V
4.0V
4.5V
5.0V
5.5V
2005-2012 Microchip Technology Inc. DS21985D-page 15
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-10: IDD vs. VDD (Reset Power-
up Timer Inactive and Watchdog Timer Inactive)
(MCP1318M-4.6).
FIGURE 2-11: IDD vs. VDD (Reset Power-
up Timer Inactive and Watchdog Timer Inactive)
(MCP1319-2.9).
FIGURE 2-12: IDD vs. VDD (Reset Power-
up Timer Inactive and Watchdog Timer Inactive)
(MCP1316-2.0).
FIGURE 2-13: IDD vs. VDD (Reset Power-
up Timer Active or Watchdog Timer Active)
(MCP1318M-4.6).
FIGURE 2-14: IDD vs. VDD (Reset Power-
up Timer Active or Watchdog Timer Active)
(MCP1319-2.9).
FIGURE 2-15: IDD vs. VDD (Reset Power-
up Timer Active or Watchdog Timer Active)
(MCP1316-2.0).
0
0.2
0.4
0.6
0.8
1
1.2
0.0 2.0 4.0
6.0
I
DD
(µA)
V
DD
(V)
-45°C
+25°C
+90°C
+130°C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0.0 2.0 4.0
6.0
I
DD
(µA)
V
DD
(V)
-45°C
+25°C
+90°C
+130°C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0.0 2.0 4.0
6.0
I
DD
(µA)
V
DD
(V)
-45°C
+25°C
+90°C
+130°C
0
1
2
3
4
5
6
4.6 4.8 5.0 5.2 5.4
5.6
I
DD
(µA)
V
DD
(V)
-45°C
+25°C +90°C +130°C
0
1
2
3
4
5
6
0.0 2.0 4.0
6.0
I
DD
(µA)
V
DD
(V)
-45°C
+25°C +90°C +130°C
0
1
2
3
4
5
6
7
2.0 3.0 4.0 5.0
6.0
I
DD
(µA)
V
DD
(V)
-45°C
+25°C +90°C +130°C
MCP131X/2X
DS21985D-page 16 2005-2012 Microchip Technology Inc.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1 316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-16: VTRIP and VHYST vs.
Temperature (MCP1318M-4.6).
FIGURE 2-17: VTRIP and VHYST vs.
Temperature (MCP1319-2.9).
FIGURE 2-18: VTRIP and VHYST vs.
Temperature (MCP1316-2.0).
FIGURE 2-19: VOL vs. IOL
(MCP1318M-4.6).
FIGURE 2-20: VOL vs. IOL
(MCP1319-2.9).
FIGURE 2-21: VOL vs. IOL
(MCP1316-2.0).
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.550
4.600
4.650
4.700
4.750
4.800
-50 0 50 100 150
V
TRIP
Hyst (%)
V
TRIP
(V)
Temperature (°C)
VHYST
VTRIP Down
VTRIP Up
3.0
3.1
3.1
3.2
3.2
3.3
3.3
3.4
3.4
3.5
2.880
2.900
2.920
2.940
2.960
2.980
3.000
3.020
-50 0 50 100 150
V
TRIP
Hyst (%)
V
TRIP
(V)
Temperature (°C)
VHYST
VTRIP Down
VTRIP Up
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.990
2.000
2.010
2.020
2.030
2.040
2.050
-50 0 50 100 150
V
TRIP
Hyst (%)
V
TRIP
(V)
Temperature (°C)
VHYST
VTRIP Down
VTRIP Up
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.00 2.00 4.00 6.00 8.00
10.00
V
OL
(V)
I
OL
(mA)
1V
2V
3V
4.3V
4.5V
4.8V
5V
5.5V
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.00 2.00 4.00 6.00 8.00
10.00
V
OL
(V)
I
OL
(mA)
1V
2.5V
2.7V
3.2V
4V
4.5V
5V
5.5V
0
0.002
0.004
0.006
0.008
0.01
0.012
0.014
0.016
0.018
0.02
0.00 0.05 0.10 0.15 0.20
0.25
V
OL
(V)
I
OL
(mA)
1V
1.8V
2005-2012 Microchip Technology Inc. DS21985D-page 17
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1 316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-22: VOL vs. Temperature
(MCP1318M-4.6 @ VDD = 4.5V).
FIGURE 2-23: VOL vs. Temperature
(MCP1319-2.9 @ VDD = 2.7V).
FIGURE 2-24: VOL vs. Temperature
(MCP1316-2-0 @ VDD = 1.8V).
FIGURE 2-25: VOH vs. IOH
(MCP1318M-4.6 @ +25°C).
FIGURE 2-26: VOH vs. IOH
(MCP1319-2.9 @ +25°C).
FIGURE 2-27: VOH vs. IOH
(MCP1316-2.0 @ +25°C).
0.14
01
0.12
3A
4 mA
0.08
0
.
1
L
(V)
2mA
3
m
A
0.04
0.06
VO
L
1 mA
2mA
0.02
0 mA
0
-50 0 50 100 150
0.25
0.2
4 mA
0.15
L
(V)
3 mA
0.1
V
O
L
1mA
2 mA
0.05
0mA
1mA
0
-50 0 50 100 150
0mA
0
0.002
0.004
0.006
0.008
0.01
0.012
0.014
0.016
-50 0 50 100
150
V
OL
(V)
Temperature (°C)
0 mA
0.05 mA
0.1 mA
0.15 mA
0.2 mA
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0.00 2.00 4.00
6.00
V
OH
(V)
I
OH
(mA)
1.5V
3V
4.5V
4.3V
2V
0
1
2
3
4
5
6
0.00 2.00 4.00
6.00
V
OH
(V)
I
OH
(mA)
1.5V
3.2V
2.7V
2.5V
5.5V
5V
4.5V
4V
0
1
2
3
4
5
6
0.00 2.00 4.00
6.00
V
OH
(V)
I
OH
(mA)
5.5V
5V
4.5V
4V
2.5V
2.2V
MCP131X/2X
DS21985D-page 18 2005-2012 Microchip Technology Inc.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1 316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-28: tRPD vs. Temperature
(MCP1318M-4.6).
FIGURE 2-29: tRPD vs. Temperature
(MCP1319-2.9).
FIGURE 2-30: tRPD vs. Temperature
(MCP1316-2.0).
FIGURE 2-31: tRPU vs. Temperature
(MCP1318M-4.6).
FIGURE 2-32: tRPU vs. Temperature
(MCP1319-2.9).
FIGURE 2-33: tRPU vs. Temperature
(MCP1316-2.0).
0
50
100
150
200
250
300
350
-100 -50 0 50 100
150
t
RPD
(µs)
Temperature (°C)
5V
5.5V
0
50
100
150
200
250
300
350
400
450
-100 -50 0 50 100
150
t
RPD
(µs)
Temperature (°C)
3.2V
4V
4.5V
5V
5.5V
0
50
100
150
200
250
300
350
-100 -50 0 50 100
150
t
RPD
(µs)
Temperature (°C)
2.5V
4V
4.5V
5V
5.5V
190
195
200
205
210
215
220
225
230
-100 -50 0 50 100
150
t
RPU
(ms)
Temperature (°C)
4.8 V
5 V
5.5 V
200
205
210
215
220
225
230
235
240
245
250
-100 -50 0 50 100
150
t
RPU
(ms)
Temperature (°C)
3.2 V
4 V
4.5 V
5 V
5.5 V
200
205
210
215
220
225
230
235
240
245
250
-100 -50 0 50 100
150
t
RPU
(ms)
Temperature (°C)
2.5 V
4 V
4.5 V
5 V
5.5 V
2.2 V
2005-2012 Microchip Technology Inc. DS21985D-page 19
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1 316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-34: Transient Duration vs.
VTRIP (min) – VDD.
FIGURE 2-35: Open-Drain Leakage
Current vs. Temperature (MCP1320-2.0).
FIGURE 2-36: MR Low to Reset
Propagation Delay (MCP1318M-4.6).
FIGURE 2-37: MR Low to Rese t
Propagation Delay (MCP1319-2.9).
FIGURE 2-38: MR Low to Rese t
Propagation Delay (MCP1316-2.0).
0
500
1000
1500
2000
2500
3000
3500
0.001 0.01 0.1 1
10
Transient Duration (µs)
Reset Threshold Overdrive (V) V
TRIP
Min - VDD
VRST=2.0V
VRST=2.9V
VRST=4.6V
2.0V
2.9V
0
0.002
0.004
0.006
0.008
0.01
0.012
-100 -50 0 50 100
150
Open-Drain Leakage (µA)
Temperature (°C)
2.2 V
2.5 V
4 V
4.5 V
5 V
5.5 V
MCP1318M does not
have an MR pin
0
50
100
150
200
250
300
350
-100 -50 0 50 100
150
t
MRD
(ns)
Temperature (°C)
3.2 V
4 V
4.5 V
5 V
5.5 V
0
50
100
150
200
250
300
350
400
450
-100 -50 0 50 100
150
t
MRD
(ns)
Temperature (°C)
2.2 V
2.5 V
4 V
4.5 V
5 V
5.5 V
MCP131X/2X
DS21985D-page 20 2005-2012 Microchip Technology Inc.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1 316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-39: VDD Falling to Reset
Propagation Delay vs. Temperature
(MCP1318M-4.6).
FIGURE 2-40: VDD Falling to Reset
Propagation Delay vs. Temperature (MCP1319-
2.9).
FIGURE 2-41: VDD Falling to Reset
Propagation Delay vs. Temperature (MCP1316-
2.0).
FIGURE 2-42: Normal iz ed Re se t Time-Out
Period vs. Temperature (MCP1318M-4.6).
FIGURE 2-43: Normal iz ed Re se t Time-Out
Period vs. Temperature (MCP1319-2.9).
FIGURE 2-44: Normal iz ed Re se t Time-Out
Period vs. Temperature (MCP1316-2.0).
0
100
200
300
400
500
600
700
800
900
1000
-100 -50 0 50 100
150
t
RPD
(µs)
Temperature (°C)
5V to 0V
5V to 4.5V
0
50
100
150
200
250
-100 -50 0 50 100
150
t
RPD
(µs)
Temperature (°C)
5V to 2.7V
5V to 0V
VTRIP Typ + 0.3V to
VTRIP Min - 0.2V
0
50
100
150
200
250
-100 -50 0 50 100
150
t
RPD
(µs)
Temperature (°C)
5V to 0V
5V to 1.8V
V
TRIP
Typ + 0.2V to
V
TRIP
Min - 0.2V
0.115
0.12
0.125
0.13
0.135
0.14
0.145
-100 -50 0 50 100
150
Normalized Reset Timeout
Period
Temperature (°C)
MCP1318M-4.6
0.125
0.13
0.135
0.14
0.145
0.15
-100 -50 0 50 100
150
Normalized Reset Timeout
Period
Temperature (°C)
MCP1319-2.9
0.125
0.13
0.135
0.14
0.145
0.15
-100 -50 0 50 100
150
Normalized Reset Timeout
Period
Temperature (°C)
MCP1316-2.0
2005-2012 Microchip Technology Inc. DS21985D-page 21
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1 316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-45: Normalized Watchdog Time-
Out Period vs. Temperature (MCP1318M-4.6).
FIGURE 2-46: Normalized Watchdog Time-
Out Period vs. Temperature (MCP1319-2.9).
FIGURE 2-47: Normalized Watchdog Time-
Out Period vs. Temperature (MCP1316-2.0).
FIGURE 2-48: Max VDD Transient Duration
vs. Reset Threshold Overdrive.
FIGURE 2-49: “M” Part Number Pull-up
Characteristics (MCP1318M-4.6).
0.9
0.95
1
1.05
1.1
1.15
1.2
1.25
-100 -50 0 50 100
150
Normalized Watchdog
Timeout Period
Temperature (°C)
`
MCP1318M-4.6
MCP1319 does not
have a Watchdog Timer
0.9
0.95
1
1.05
1.1
1.15
1.2
1.25
-100 -50 0 50 100
150
Normalized Watchdog Timeout
Period
Temperature (°C)
`
MCP1316-2.0
0
100
200
300
400
500
600
0.001 0.01 0.1 1
10
Transient Duration (µS)
Reset Threshold Overdrive (V) V
TRIP
Min - VDD
VRST=2.0V
VRST=2.9V
VRST=4.6V
MCP131X/2X
DS21985D-page 22 2005-2012 Microchip Technology Inc.
NOTES:
2005-2012 Microchip Technology Inc. DS21985D-page 23
MCP131X/2X
3.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin No. Device Symbol Pin
Type
Buffer/
Driver
Type Function
SOT23-5
1MCP1316M (1),
MCP1318M (1),
MCP1319M (1),
MCP1320,
MCP1321,
MCP1322
RST O Open-Dr ai n Reset Ou tput (activ e-l ow)
Goes active (Low) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
wit hin th e minimum selected time-out peri od.
4. Duri ng pow e r-up.
VDD Falling:
Open-Drain = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
Open-Drain = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
MCP1316,
MCP1318,
MCP1319
O Push-Pull VDD Falling:
H = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
H = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
MCP1317 RST O Push-Pu ll R eset Ou tput (active-h igh)
Goes active (High) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
wit hin th e minimum selected time-out peri od.
4. Duri ng pow e r-up.
VDD Falling:
H = VDD < VTRIP
L = VDD > VTRIP
VDD Rising:
H = VDD < VTRIP + VHYS
L = VDD > VTRIP + VHYS
2AllV
SS — P The ground reference for the device.
Note 1: Open-Drain output with internal pull-up resistor.
MCP131X/2X
DS21985D-page 24 2005-2012 Microchip Technology Inc.
3MCP1316,
MCP1316M,
MCP1317,
MCP1320
MR I ST Manual Reset input for a Reset switch.
This input allows a push button switch to be directly con-
nected to the MCP131X/2X MR pin, which can then be
used to force a sy ste m Reset. Thi s inp ut fil ters (igno res )
noise pulses that occur on the MR pin.
L = Switc h i s depre ss ed (s ho rted to g roun d). This fo rces
the RST/RST pins Active.
H = Switch is open (internal pull-up resistor pulls signal
high). State of the RST/RST pins determined by
other system conditions.
MCP1318,
MCP1318M,
MCP1319,
MCP1319M,
MCP1321,
MCP1322
RST O Push-Pu ll Res et Ou tput (active-h igh )
Goes active (High) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time-out period.
4. Duri ng pow e r-up.
VDD Falling:
H = VDD < VTRIP
L = VDD > VTRIP
VDD Rising:
H = VDD < VTRIP + VHYS
L = VDD > VTRIP + VHYS
4 MCP1316,
MCP1316M,
MCP1317,
MCP1318,
MCP1318M,
MCP1320,
MCP1321
WDI I ST Watchdog Timer Input
The WDT period is specified at the time of device order.
The Standard WDT period is 1.6s typical.
An edge transition on the WDI pin resets the Watchdog
T imer cou nter (no tim e out). A Fa lling Edge is requir ed to
start the WD T Timer.
MCP1319,
MCP1319M,
MCP1322
MR I ST Manual Reset input for a Reset switch.
This input allows a push button switch to be directly con-
nected to the MCP131X/2X MR pin, which can then be
used to force a sy ste m Reset. Thi s inp ut fil ters (igno res )
noise pulses that occur on the MR pin.
L = Switc h i s depre ss ed (s ho rted to g roun d). This fo rces
the RST/RST pins Active.
H = Switch is open (internal pull-up resistor pulls signal
high). State of the RST/RST pins determined by
other system conditions.
5AllV
DD — P The positive supply for the device.
TABLE 3-1: PIN FUNCTION TABLE (CONTINUED)
Pin No. Device Symbol Pin
Type
Buffer/
Driver
Type Function
SOT23-5
Note 1: Open-Drain output with internal pull-up resistor.
2005-2012 Microchip Technology Inc. DS21985D-page 25
MCP131X/2X
3.1 Ground Terminal (VSS)
VSS provides the negative reference for the analog
input voltage. Typically, the circuit ground is used.
3.2 Supply Voltage (VDD)
VDD can be used for power supply monitoring or a
voltage level that requires monitoring.
3.3 Reset Output (RST and RST)
There are four types of Reset output pins. These are:
1. Open-Drain active-low Reset, External pull-up
resistor required
2. Open-Drain active-low Reset, Internal pull-up
resistor
3. Push-Pull active-low Reset
4. Push-Pull active-high Reset
Some dev ic es ha ve both an ac tiv e-l ow an d a cti ve -high
Reset output.
3.3. 1 ACTIV E-LOW (RST ) – OPEN-DRAIN,
EXTERN AL PUL L- UP RES IST OR
The RST open-drain output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level
(VTRIP +V
HYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will float, and an external pull-up resistor is
required to bring the output to the high state.
3.3. 2 ACTIV E-LOW (RST ) – OPEN-DRAIN,
INTERNAL PULL-UP RESISTOR
The RST open-drain output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level
(VTRIP +V
HYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will be pulled high by an internal pull-up
resistor (typically 4.7 k).
3.3.3 ACTIVE-LOW (RST) – PUSH-PULL
The RST push-pull output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level
(VTRIP +V
HYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will be driven to the high state.
3.3.4 ACTIVE-HIGH ( RST) – PUSH-PULL
The RST push-pull output remains high while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level
(VTRIP +V
HYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will be driven to the low state.
3.4 Manual Reset Input (MR)
The Manu al R e set (MR ) i npu t pin all ows a pus h b utto n
switch to eas ily be conne cte d to the sys t em. W hen the
push button is depressed, it forces a system Reset.
This pin has circuitry that filters noise that may be
present on the MR signal.
The MR pin is active-low and has an internal pull-up
resistor.
3.5 W atchdog Input
In some systems, it is desirable to have an external
Watchdog Timer to monitor the operation of the
system. This is done by requiring the embedded
controller to “pet” the Watchdog Timer within a
predetermined time frame (TWD). If the MCP131X/2X is
not “petted” within this time frame, the MCP131X/2X
will force the Reset pin(s) active.
The embedded controller “pets” the MCP131X/2X by
forcing an edge transition on the WDI pin. The WDT
Timer is activated by the first falling edge on the WDI
pin.
The st andard o ffering devices hav e a typical W atchdog
Timer period (TWD) of 1.6 s. Table 1-3 shows the
available Watchdog Timer periods.
MCP131X/2X
DS21985D-page 26 2005-2012 Microchip Technology Inc.
NOTES:
2005-2012 Microchip Technology Inc. DS21985D-page 27
MCP131X/2X
4.0 OPERATIONAL DESCRIPTION
For many of today’s microcontroller applications, care
must be taken to pre vent low-pow er conditions tha t can
cause many different system problems. The most
common causes are brown-out conditions, where the
system supply dr ops belo w the operatin g level mo men-
tarily. The second most common cause is when a
slowly decaying power supply causes the
microcontroller to begin executing instructions without
sufficient voltage to sustain volatile memory (RAM),
thus produ cing indetermina te results. Figure 4-1 shows
a typical application circuit.
The MC P13 1X/2X fam ily of voltage sup erv is or de vi ce s
are designed to keep a microcontroller in Reset, until
the system voltage has reached and stabilized at the
proper level for reliable system operation. These
devices also operate as protection from brown-out
conditions when the system supply voltage drops
below a safe operating level.
Some MCP131X/2X family members include a Watch-
dog Timer feature that after being enabled (by a falling
edge on the WDI pin), monitors the WDI pin for falling
or rising edges. If an edge transition is not detected
within the expected time frame, the MCP131X/2X
devices wil l fo rce the R es et p in a cti ve . This is us eful to
ensure that the embedded system’s Host Controller
progra m is ope rati ng as ex pected.
Some MC P1 31X/2X family m em bers i ncl ud e a Manual
Reset feature that allow a push button switch to be
directly connec ted to the M CP131X/2X devic es (o n the
MR pin). This all ows the sy stem to easily be res et from
the external control of the push button switch.
A superset block diagram is shown in Figure 4-2, with
device specific block diagrams shown in Figure 4-3
through Figure 4-12.
FIGURE 4-1: Typical Appl ication Circuit.
FIGURE 4-2: Family Block Diagram.
VDD
VDD
MCLR
(Reset input)
(active-low)
VSS
PIC®
Microcontroller
RPU(1)
Note 1: Resistor RPU may be requi red with the
MCP1320, MCP1321 or MCP1322 due
to the open-drain output.
Resistor RPU may not be required with
the MCP1316M, MCP1318M or
MCP1319M due to the internal pull-up
resistor.
The MCP1316, MCP1317, MCP1318
and MCP1319 do not requ ire the
external pull-up resistor.
2: Not all devices offer the active-high
Reset out put pin .
0.1
µF MCP13XX
VDD
RST
VSS
RST (2)
WDI I/O
To system
device that
requires active-
high rese ts
Push button
switch
MR
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Noise Filter
Watchdog
MR
WDI
Note: Features available depend on the device.
Voltage
MCP131X/2X
DS21985D-page 28 2005-2012 Microchip Technology Inc.
4.0.1 DEVICE SPECIFIC BLOCK
DIAGRAMS
FIGURE 4-3: MCP1316 Block Diagram.
FIGURE 4-4: MCP1316M Bl oc k Diag ra m.
FIGURE 4-5: MCP1317 Block Diagram.
FIGURE 4-6: MCP1318 Block Diagram.
FIGURE 4-7: MCP1318M Block Diagram.
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
Noise Fil ter
Watchdog
MR
WDI
Voltage
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
Noise Filter
Watchdog
MR
WDI
Voltage
VDD
Comparator
+
–Output
Driver
Reference
VSS
RST
Noise Filt er
Watchdog
MR
WDI
Voltage
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Watchdog
WDI
Voltage
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Watchdog
WDI
Voltage
2005-2012 Microchip Technology Inc. DS21985D-page 29
MCP131X/2X
FIGURE 4-8: MCP1319 Block Diagram.
FIGURE 4-9: MCP1319M Block Diagram.
.
FIGURE 4-10: MCP1320 Block Diagram.
FIGURE 4-11: MCP1321 Block Diagram.
FIGURE 4-12: MCP1322 Block Diagram.
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Noise Filt er
MR
Voltage
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Noise Filt er
MR
Voltage
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
Noise Filter
Watchdog
MR
WDI
Voltage
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
RST
Watchdog
WDI
Voltage
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
RST
Noise Filt er
MR
Voltage
MCP131X/2X
DS21985D-page 30 2005-2012 Microchip Technology Inc.
4.1 Reset Voltage Trip Point (VTRIP)
Operation
The devic e’ s Rese t volt age trip poi nt (VTRIP) is s ele cte d
when the device is ordered. As the voltage on the
device’s VDD pin is above or below this selected trip
point, the output of the Reset pin (RST/RST) will be
forced to either the inactive or active state.
For the voltage trip point, there is a minimum trip voltage
(VTRIPMIN) and a maximum trip voltage (VTRIPMAX). The
voltage that the device “actually” trips at will be referred
to as VTRIP. The trip voltage is specified for the falling of
the device VDD.
There is a ls o a h ys ter esis (VHYS) on the trip poin t. This
is so that noise on the device voltage (VDD) does not
cause the Reset pin (RST/RST) to “jitter” (change
between driving an active and inactive state).
The Reset p in (RST or R ST) will be f orced ac tive i f any
of the following occur :
• The Manual Reset input (MR) goes low
• The Watchdog Timer times out
•V
DD goes below the threshold
• During device power-up
After the device exits the Reset condition, the delay
circuit ry wil l hold the RST and RST pin s activ e until the
appropriate Reset delay time (tRST) has elapsed .
TABLE 4-1: RESET PIN STATES
Device
State of RST Pin when: State of RST (3) Pin when:
Output Driver
VDD <
VTRIP VDD > VTRIP +
VHYS VDD <
VTRIP VDD > VTRIP +
VHYS
MCP1316 L H — — Push-pull
MCP1316M LH
(2) — — Open-drain
(2)
MCP1317 — — H L Push-pull
MCP1318 L H H L Push-pull
MCP1318M LH
(2) H L Open-drain
(2)
MCP1319 L H H L Push-pull
MCP1319M LH
(2) H L Open-drain
(2)
MCP1320 LH
(1) — — Open-drain
(1)
MCP1321 LH
(1) H L Open-drain
(1)
MCP1322 LH
(1) H L Open-drain
(1)
Note 1: Requires Ext ernal Pull-up resistor.
2: Has Internal Pull-up resistor.
3: The RST pin output is always push-pull.
2005-2012 Microchip Technology Inc. DS21985D-page 31
MCP131X/2X
4.1. 1 POWER-UP/RISING VDD
As th e de vice V DD rises, the device’s Reset circuit will
remain active until the voltage rises above the “actual”
trip point (VTRIP) plus the hysteresis (VHYS).
Figure 4-13 shows a power-up sequence and the
waveform of the RST and RST pins.
As the device powers up, the voltage will start below
the valid operating voltage of the device. At this
voltage, the Reset output value is not valid. Once the
voltage is above the minimum operating voltage (1V)
and below the selected VTRIP, the Reset output will be
active.
Once the device voltage rises above the “actual” trip
point (VTRIP) plus the hyste resis (VHYS), the Reset d elay
timer (tRST) starts. When the Reset delay timer times
out, the Reset output (RST/RST) is driven inactive.
FIGURE 4-13: Reset Pin Operation on a
Power-up.
4.1.2 POWER-DOWN/BROWN-OUTS
As the device powers-down/brown-outs, the voltage
(VDD) falls from a voltage above the device’s trip point
(VTRIP). The device’s “actual” trip point voltage (VTRIP)
will be between the minimum trip point (VTRIPMIN) and
the maximum trip point (VTRIPMAX). Once the device
volt age (VDD) goes below this volt age, the Reset p in(s)
will be forced to the active state. There is a hysteresis
on this tri p point. Thi s is s o n oi se on th e d ev ic e v ol t ag e
(VDD) does not cause the Reset pin (RST/RST) to
“jitter” (change between driving an active and inactive).
Figure 4-14 shows the waveform of the RST pin as
determined by the VDD voltage, while Table 4-1 shows
the state of the RST pin.
4.1.2.1 Operation of RST pin with Internal
Pull-Up Resistor
The internal pull-up resistor has a typical value of
4.7 k. The internal pull-up eliminates the need for an
external resistor.
To reduce th e cu rrent c onsumpt ion of th e dev ice, when
the RST pin is drivin g low , the res istor is disconnec ted.
FIGURE 4-14: RST Operation as Determined by the VTRIP and VHYS.
Note: While the Reset delay timer (tRST) is
active, additional system current is
consumed.
VTRIPMAX
VTRIPMIN
VTRIP
1V
VDD
VTRIP + VHYS
tRST
RST
RST
Note: Only the MCP1316M, MCP1318M and
MCP1319M devices have an open-drain
RST output pin with an internal pull-up
resistor.
VDD VTRIPMAX
VTRIPMIN VTRIP
VTRIP
VTRIP + VHYS
RST
1V
< 1V is outside the
device spe cif ic atio ns
tRPD
tRST
tRPD tRST
MCP131X/2X
DS21985D-page 32 2005-2012 Microchip Technology Inc.
4.2 Reset Delay Timer (tRST)
The Reset delay timer ensures that the MCP131X/2X
device will “hold” the embedded system in Reset until
the system voltage has stabilized. There are several
time-out options to better meet the requirements of
different applications. These Reset delay timer time-
outs are shown in Table 4-2. The Standard offering
time-out is typically 200 ms.
The Reset delay timer (tRST) starts after the device volt-
age rises above the “actual” trip point (VTRIP) plus the
hyste resis ( VHYS). When the Reset delay timer times-
out, the Reset output pin (RST/RST) is driven inactive.
TABLE 4-2: RESET DELAY TIMER
TIME OUTS (1)
Figure 4-15 illustrates when the Reset delay timer
(tRST) is active or inactive.
FIGURE 4-15: Reset Pow er-up Timer
Waveform.
4.2. 1 EFFECT OF TEMPERATURE ON
RESET POWER-UP TIMER (TRPU)
The Reset delay timer time-out period (tRST)
determines how long the device remains in the Reset
condition. This time-out is affected by both the device
VDD and temperature. Typical responses for different
VDD values and temperatures are shown in Figures 2-
33, 2-32 and 2-31.
Note: While the Reset delay timer (tRST) is
active, additional system current is con-
sumed.
tRST Units
Min Typ Max
1.0 1.4 2.0 ms
20 30 40 ms
140 200 280 ms
1120 1.6 2.24 sec
This is the
minimu m time tha t
the Reset delay
timer wil l “hold” the
Reset pin activ e
after VDD rises
above
VTRIP + VHYS
This is the
maximum time
that the Reset
delay timer will
“hold” the Reset
pin active after
VDD rises above
VTRIP + VHYS
Note 1: Shaded rows are custom ordered time
outs.
VTRIP
VDD
RST tRST
Reset Delay
Timer Inactive
Reset
Delay
Timer
Inactive
Reset Delay
Timer Active
See Figures 2-12,
2-10 and 2-11
See Figures 2-15,
2-14 and 2-13
See Figures 2-12,
2-10 and 2-11
2005-2012 Microchip Technology Inc. DS21985D-page 33
MCP131X/2X
4.3 Negative Going VDD Transients
The minimum pulse width (time) required to cause a
Reset may be an important criteria in the
implementation of a Power-on Reset (POR) circuit.
This time is referred to as transient duration. The
MCP131X/2X devices are designed to reject a level of
negative-going transients (glitches) on the power
supply line.
Transient duration is the amount of time needed for
these s up erv iso ry devic es to res po nd to a dro p i n VDD.
The tr ansient durat ion time (tTRAN) is dependa nt on the
magnitude of VTRIP – VDD (overdrive). Any combination
of duration and overdrive that lies under the
duration/overdrive curve will not generate a Reset
signal. Generally speaking, the transient duration time
decreases with, and increases in, the VTRIP –V
DD
volt age. Comb inations o f duration a nd overdriv e that lie
above the duration/overdrive curve are detected as a
brow n-ou t or power-down conditio n.
Figure 4-16 shows a typical transient duration versus
Reset comparator overdrive, for which the
MCP13 1X/2X will not gen erate a R ese t pulse . It sho ws
that the farther below the trip point the transient pulse
goes, the duration of the pulse required to cause a
Reset gets shorter. Figure 4-16 shows the transient
response characteristics for the MCP131X/2X.
Transient immunity can be improved by adding a
byp ass cap acito r (typically 0.1 µF) as close as poss ible
to the VDD pin of the MCP131X/2X device.
FIGURE 4-16: Example of Typical
Transient Duration Waveform.
4.4 Manual Reset Input
The Manua l Reset input p in (MR) allows the Reset pins
(RST/RST) to be ma nuall y fo rced to th eir acti ve st at es.
The MR pin has circuitry to filter noise pulses that may
be present on the pin. Figure 4-17 shows a block
diagram for using the MCP131 X/2X with a pus h-button
switch. To minimize the required external components,
the MR input has an internal pull-up resistor.
A mechanical push button or active logic signal can
drive the MR input.
Once MR has been low for a time, tMRD (the Manual
Reset delay time), the Reset output pins are forced
active . The Rese t output pins wil l rem ai n in thei r ac tive
states for the Reset delay timer time-out period (tRST).
Figure 4-18 shows a waveform for the Manual Reset
switch input and the Reset pins output.
FIGURE 4-17: Push Button Reset and
Watchdog Timer.
FIGURE 4-18: MR Input – Push Button.
4.4.1 NOISE FILTER
The noise filter filters out noise spikes (glitches) on the
Manual Reset pin (MR). N ois e sp ik es le ss than 100 ns
(typical ) are filtered.
Time (µs)
0V
Supply Vol tage
5V
VTRIP(MIN) - VDD
tTRANS
VTRIP(MAX)
VTRIP(MIN)
(Overdrive)
(Duration)
VDD
MR
VSS
RST
WDI I/O
MCLR
+5V
MCP13XX PIC® MCU
RST
VIL
tMR
RST
tMRD
VIH
tRST
MR
The MR input typically ignores input pulses
of 100 ns.
MCP131X/2X
DS21985D-page 34 2005-2012 Microchip Technology Inc.
4.5 Watchdog Timer
The purpose of the Watchdog Timer (WDT) is to
increase system reliability. The Watchdog Timer
feature can be used to detect when the Host
Controller’s program flow is not as expected. The
Watchdog Timer monitors for activity on the Watchdog
Input pin (WDI). The WD I pin is e xpec ted to b e strobe d
within a given time frame. When this time frame is
exceeded, without an edge transition on the WDI pin,
the Reset pin is driven active to reset the system. This
stops the Host Controller from continuing its erratic
behavior (“run-away” code execution).
The Watchdog Timer is external to the main portion of
the control system and monitors the operation of the
system . This f eature is enabled by a fal ling edge on the
WDI pin (after d evice PO R). Monitori ng is then done by
requiring the embedded controller to force an edge
transition (falling or rising) on the WDI pin (“pet the
Watchdog”) within a predetermined time frame (TWD).
If the MCP131X/2X does not detect an edge on the
WDI pin within the expected time frame, the
MCP131X/2X device will force the Reset pin active.
The Watchdog Timer is in the disabled state when:
• The Device Powers up
• A P OR event occurred
• A WDT event occurred
• A Manual Reset (MR) event occurred
When t h e Watchd o g Timer is in th e d is a bl ed sta t e, the
WDI pin has an int erna l s ma rt pul l-up resist or e na ble d.
This p ull- up res istor h as a ty pical value o f 52 k . Th is
pull- up resi stor holds the WD I signal in the hi gh state,
until it is forced to another state.
After the embedded controller has initialized, if the
Watchdog Timer feature is to be used, then the embed-
ded controller can force the WDI pin low (VIL). This also
enables the Watchdog Timer feature and disables the
WDI pull-up resistor. Disabling the pull-up resistor
reduces the device’s current consumption. The pull-up
resistor will rem ain di sc onnected unti l th e device has a
power-on, a R eset even t occurs , or af ter the WDT tim e
out.
Once th e Watchdog Timer has been enabled, the H os t
Controller must force an edge transition (falling or ris-
ing) on the WDI pin before the minimum Watchdog
T imer tim e out to e nsure tha t the W atch dog T imer does
not force the Reset pins (RST/R ST) to the a ctive st ate.
If an edge transition does not occur before the maxi-
mum time out occurs, then the MCP131X/2X will force
the Reset pins to their active state.
The MCP131X/2X supports four time outs. The stan-
dard offering devices have a typical Watchdog Timer
period (TWDT) of 1.6 s. Table 4-3 shows the available
Watchdog Timer periods. The tWDT time-out is a
function of the device voltage and temperature.
Figure 4-19 shows a block diagram for using the
MCP131X/2X with a PIC® microcontroller (MCU) and
the Watchdog input.
TABLE 4-3: WATCHDOG TIMER
PERIODS (1)
FIGURE 4-19: Watchdog Timer.
The software routine that strobes WDI is critical. The
code must be in a section of software that is executed
frequently enough so the time between edge
transitions is less than the Watchdog time-out period.
One common technique controls the Host Controllers
I/O line fro m two section s of the program . The softwa re
might set the I/O line high while operating in the
Foreground mode and set it low while in the
Background or Interrupt modes. If both modes do not
execute correctly, the Watchdog Timer issues Reset
pulses.
tWDT Units
Min Typ Max
4.3 6.3 9.3 ms
71 102 153 ms
1.12 1.6 2.4 sec
17.9 25.6 38.4 sec
If the time between
WDI edges is less
than this, it
ensures that the
MCP131X/2X
never forces a
Reset
If the time
between WDI
edges is greater
than this, it
ensures that the
MCP131X/2X
always forces a
Reset
Note 1: Shaded rows are custom ordered Watch-
dog Timer Periods (tWDT) time outs. For
information on orderi ng devices with
these tWDT time o ut s , pl eas e c ontact your
local Microchip sales office. Minimum
purchas e vol ume s are required.
VCC
GND
RST
WDI
MCLR
+5V MCP13XX
0.1
10 k
I/O
PIC®
3-Terminal
Regulator
+5V
µF MCU
(example:
MCP1700)
2005-2012 Microchip Technology Inc. DS21985D-page 35
MCP131X/2X
5.0 APPLICATION INFORMATION
This sec tio n sh ow s a ppl ic atio n-re lated inform ati on th at
may be useful for your particular design requirements.
5.1 Supply Monitor Noise Sensitiv ity
The MCP131X/2X devices are optimized for fast
response to negative-going changes in VDD. Systems
with an inordinate amount of electrical noise on VDD
(such as systems using relays) may require a 0.01 µF
or 0.1 µF bypass capacitor to reduce detection
sensitivity. This capacitor should be installed as close
to the MCP131X/2X as possible to keep the capacitor
lead length short.
FIGURE 5-1: Typical App lica tio n Circui t
with Bypass Capacitor.
5.2 Conventional Voltage Monit oring
Figure 5-2 and Figure 5-3 show the MCP131X/2X in
conventional voltage monitoring applications.
FIGURE 5-2: Battery Voltage Monitor.
FIGURE 5-3: Power Good Monitor.
5.3 Using in PIC® Microcontroller,
ICSP ™ A p plic a t io n s
Figure 5-4 shows the typi cal application circui t for using
the MCP132X for a voltage supervisory function when
the PIC® microcontroller will be programmed via the In-
Circuit Serial Programming™ (ICSP™) feature. Addi-
tional in formati on is av ailab le in TB08 7, “Using Voltag e
Supervisors with PIC® Microcontroller Systems which
Implement In-Circuit Serial Programming™”
(DS91087).
FIGURE 5-4: Typical Appl ication Circuit
for PIC® Microcontroller with the ICSP™ Feature.
MCP131X/2X
VDD
RST
VSS
0.1 µF
RST
WDI
MR
VDD
RST
VSS
BATLOW
MCP131X/2X
+
––
VDD
RST
VSS
Power Good
MCP131X/2X
+
–
Pwr
Sply
Note: This operati on ca n only be don e usi ng the
device with the Open-Drain RST pin
(MCP1320, MCP1321, and MCP1322).
Devices that have the internal pull-up
resi stor are n ot recomm ended du e to the
current p ath of th e internal pu ll-up resist or .
Note: It is recommended that the current into the
RST pin be current limited by a 1 k
resistor.
MCP132X
VDD
VDD/VPP
VDD
RST MCLR
Reset input)
(Active-Low)
VSS VSS
PIC®
Microcontroller
RPU
0.1 µF
1k
MCP131X/2X
DS21985D-page 36 2005-2012 Microchip Technology Inc.
5.4 Modifying The Trip Point, VTRIP
Although the MCP131X/2X device has a fixed voltage
trip point (VTRIP), it is sometimes necessary to make
custom adjustments. This can be accomplished by
connecting an external resistor divider to the
MCP131X/2X VDD pin. This causes the VSOURCE
voltage to be at a higher voltage than when the
MCP131X/2X input equals its VTRIP voltage
(Figure 5-5).
To maintain detector accuracy, the bleeder current
through the divider should be significantly higher than
the 10 µA maximum operating current required by the
MCP131X/2X. A reasonable value for this bleeder
current is 1 mA (100 times the 10 µA required by the
MCP131X/2X). For example, if VTRIP = 2V and the
desired trip poi nt is 2 .5V, the value of R1 + R2 is 2.5 k
(2.5V/1 mA). The value of R1 + R2 can be rounded to
the nearest standard value and plugged into the
equation of Figure 5-5 to calculate values for R1 and
R2. 1% tolerance resistors are recommended.
FIGURE 5-5: Modify Trip-Point using
External Resistor Divider.
5.5 MOSFET Low-Drive Protection
Low o pera t in g pow e r an d smal l p hy si ca l s iz e make the
MCP131X/2X series ideal for many voltage detector
applications. Figure 5-6 shows a low-voltage gate drive
protecti on circuit th at prevent s overheati ng of the logic -
level MOSFET due to insufficient gate voltage. When
the input signal is below the threshold of the
MCP131X/2X, its output grounds the gate of the
MOSFET.
FIGURE 5-6: MOSFET Low-Drive
Protection.
5.6 Low-Power Applications
In some low-power applications, the longer the micro-
controller (such as a PIC® MCU) ca n be i n the “S leep
mode”, t he lower the average system current consum p-
tion will be.
The WDT feature can be used to “wake-up” the PIC MCU
at a regular interval to service the required tasks before
returning to sleep. This “wake-up” occurs after the PIC
MCU detects a MCLR reset during Sleep mode (for mid-
range family; POR = 1, BOR = 1, T O = 1, and PD = 1).
Note: In this example, VSOURCE must be
greater than (VTRIP)
MCP131X/2X
VDD RST
VSS
R1
VSOURCE
R2
or RST
VSOURCE
R1
R1R2
+
--------------------
VTRIP
Where:
VSOURCE = Voltage to be monitored
VTRIP = Threshold Voltage setting
VDD
RST
VSS
MCP131X/2X
270
MTP3055EL
VDD
RL
VTRIP
2005-2012 Microchip Technology Inc. DS21985D-page 37
MCP131X/2X
5.7 Controllers and Processors With
Bidirectional I/O Pins
Some microcontrollers have bidirectional Reset pins.
Depending on the current drive capability of the
controller pin, an indeterminate logic level may result if
there is a logic conflict. This can be avoided by adding
a 4.7 k resistor in series with the output of the
MCP131X/2X (Figure 5-7). If there are other
components in the system that require a Reset signal,
they sho uld be buffered so as not to load the Reset line.
If the other components are required to follow the
Reset I/O of the microcontroller, the buffer should be
connected as shown with the solid line.
FIGURE 5-7: Interfacing the
MCP131X/2X Push-Pull Outputs to a
Bidirecti on al Res et I/O.
5.8 RESET Signal Integrity During
Power-Down
The MCP131X/2X Reset output is valid to VDD = 1.0V.
Below this 1.0V, the output becomes an "open circuit"
and does not sink or source current. This means
CMOS l ogic input s to the micr ocontroller wil l be floating
at an undetermined voltage. Most digital systems are
completely shut down well above this voltage.
However, in situations where the Reset signal must be
maintained valid to VDD = 0V, external circuitry is
required.
For devices where the Reset signal is active-low , a pull-
down resistor must be connected from the
MCP131X/2X R eset pin(s ) to ground to di scharge stra y
capacitances and hold the output low (Figure 5-8).
Similarly, for devices where the Reset signal is active-
high, a pull-up resistor to VDD is required to ensure a
valid high Reset signal for VDD below 1.0V.
This resistor value, though not critical, should be
chosen such that it does not appreciably load the Reset
pin(s) under normal operation (100 k will be suitable
for most applications).
FIGURE 5-8: Ensuring a Valid Active-low
Reset Pin Output State as VDD Approaches 0V.
MCP13XX
VDD
RST
GND
MCLR
GND
Buffered Reset
To Other System
Components
MCU
4.7 k
Buffer
PIC®
MCP13XX
VDD
VDD
R1
100 k
RST
GND
MCP131X/2X
DS21985D-page 38 2005-2012 Microchip Technology Inc.
NOTES:
2005-2012 Microchip Technology Inc. DS21985D-page 39
MCP131X/2X
6.0 STANDARD DE VICE
OFFERINGS
Table 6-1 shows the standard devices that are
available and their respective configuration. The
configu r ati on inc lu des :
• Voltage Trip Point (VTRIP)
• Reset Time Out (tRST)
• Watchdog Time Out (tWDT)
Table 6-1 also shows the order number for that given
device configuration.
6.1 Custom Configurations
Table 6-2 shows the codes that specify the desired
Reset time out (tRST) and Watchdog Timer time-out
(tWDT) f or custom devices.
The voltage trip point (VTRIP) is specified by the two
digits of the desired typical trip point voltage. As an
example, if the desired VTRIP selection has a typical
VTRIP of 2.7V, the code is 27.
TABLE 6-1: STANDARD VERSIONS
TABLE 6-2: DELAY TIME-OUT ORDERING CODES
Device Reset
Threshold (V)
Reset Time Out (ms) Watchdog Time Out (s)
Minimum Typical Minimum Typical Orde r Numb er
MCP1316 2.90 140 200 1.12 1.6 MCP1316T-29LE/OT
MCP1316 4.60 140 200 1.12 1.6 MCP1316T-46LE/OT
MCP1316M 2.90 140 200 1.12 1.6 MCP1316MT-29LE/OT
MCP1316M 4.60 140 200 1.12 1.6 MCP1316MT-46LE/OT
MCP1317 2.90 140 200 1.12 1.6 MCP1317T-29LE/OT
MCP1317 4.60 140 200 1.12 1.6 MCP1317T-46LE/OT
MCP1318 2.90 140 200 1.12 1.6 MCP1318T-29LE/OT
MCP1318 4.60 140 200 1.12 1.6 MCP1318T-46LE/OT
MCP1318M 2.90 140 200 1.12 1.6 MCP1318MT-29LE/OT
MCP1318M 4.60 140 200 1.12 1.6 MCP1318MT-46LE/OT
MCP1319 2.90 140 200 — — MCP1319T-29LE/OT
MCP1319 4.60 140 200 — — MCP1319T-46LE/OT
MCP1319M 2.90 140 200 — — MCP1319MT-29LE/OT
MCP1319M 4.60 140 200 — — MCP1319MT-46LE/OT
MCP1320 2.90 140 200 1.12 1.6 MCP1320T-29LE/OT
MCP1320 4.60 140 200 1.12 1.6 MCP1320T-46LE/OT
MCP1321 2.90 140 200 1.12 1.6 MCP1321T-29LE/OT
MCP1321 4.60 140 200 1.12 1.6 MCP1321T-46LE/OT
MCP1322 2.90 140 200 — — MCP1322T-29LE/OT
MCP1322 4.60 140 200 — — MCP1322T-46LE/OT
Typical Delay Time (ms) Typical Delay Time (ms)
Code Reset WDT Comment Code Reset WDT Comment
A1.6 6.3 Note 1 J200.0 6.3 Note 1
B1.6 102.0 Note 1 K200.0 102.0 Note 1
C1.6 1600.0 Note 1 L 200.0 1600. 0 Del ay timings f or standard
device offerings
D1.6 25600.0 Note 1 M200.0 25600.0 Note 1
E30.0 6.3 Note 1 N1600.0 6.3 Note 1
F30.0 102.0 Note 1 P1600.0 102.0 Note 1
G30.0 1600.0 Note 1 Q1600.0 1600.0 Note 1
H30.0 25600.0 Note 1 R1600.0 25600.0 Note 1
Note 1: This delay timing combination is not the standard offering. For information on ordering devices with these
delay times, contact your local Microchip sales office. Minimum purchase volumes are required.
MCP131X/2X
DS21985D-page 40 2005-2012 Microchip Technology Inc.
NOTES:
2005-2012 Microchip Technology Inc. DS21985D-page 41
MCP131X/2X
7.0 DEVELOPMENT TOOLS
7.1 Evaluation/Demonstration Boards
The SOT-23-5/6 Evaluation Board (VSUPEV2) can be
used to evaluate the characteristics of the
MCP131X/2X dev ic es .
This blank PCB has footprints for:
• Pull-up Res i stor
• Pull-down Resistor
• Loading Capacitor
• In-line Resistor
There is also a power supply filtering capacitor.
For evaluating the MCP131X/2X devices, the selected
device should be installed into the Option A footprint.
FIGURE 1: SOT-23-5/6 Voltage
Supervisor Evaluation Board (VSUPEV2).
This board may be purchased directly from the
Microchip web site at www.microchip.com.
MCP131X/2X
DS21985D-page 42 2005-2012 Microchip Technology Inc.
NOTES:
2005-2012 Microchip Technology Inc. DS21985D-page 43
MCP131X/2X
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
5-Pin SOT-23
Part Numb er SOT-23
MCP1316T-29LE/OT QANN
MCP1316MT-29LE/OT QBNN
MCP1317T-29LE/OT QCNN
MCP1318T-29LE/OT QDNN
MCP1318MT-29LE/OT QENN
MCP1319T-29LE/OT QFNN
MCP1319MT-29LE/OT QGNN
MCP1320T-29LE/OT QHNN
MCP1321T-29LE/OT QJNN
MCP1322T-29LE/OT QKNN
MCP1316T-46LE/OT QLNN
MCP1316MT-46LE/OT QMNN
MCP1317T-46LE/OT QPNN
MCP1318T-46LE/OT QQNN
MCP1318MT-46LE/OT QRNN
MCP1319T-46LE/OT QSNN
MCP1319MT-46LE/OT QTNN
MCP1320T-46LE/OT QUNN
MCP1321T-46LE/OT QVNN
MCP1322T-46LE/OT QWNN
Example:
Legend: XX...X Customer-specifi c info rma tio n
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the f ull Microc hip p art num ber cann ot be marked on one lin e, it will
be carried over to the next line, thus limiting the number of available
characte rs for cus tomer-specifi c informatio n.
3
e
3
e
QA25
MCP131X/2X
DS21985D-page 44 2005-2012 Microchip Technology Inc.
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N
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A2 c
L
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0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
2005-2012 Microchip Technology Inc. DS21985D-page 45
MCP131X/2X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP131X/2X
DS21985D-page 46 2005-2012 Microchip Technology Inc.
8.2 Product Tape and Reel Specifications
FIGURE 8-1: EMBOSSED CARRIER DIMENSIONS (8 MM TAPE ONLY)
FIGURE 8-2: 5-LEAD SOT-23 DEVICE TAPE AND REEL SPECIFICATIONS
Top
Cover
Tape
K0
P
W
B0
A0
TABLE 8-1: CARRIER TAPE/CAVITY DIMENSIONS
Case
Outline Package
Type
Carrier
Dimensions Cavity
Dimensions Output
Quantity
Units
Reel
Diameter in
mm
W
mm P
mm A0
mm B0
mm K0
mm
OT SOT-23 3L 8 4 3.23 3.17 1.37 3000 180
User Direction of Feed
P, Pitch
Standard Reel Component Orientation Reverse Reel Component Orientation
W, Width
of Carrier
Tape
Pin 1
Pin 1
Device
Marking
2005-2012 Microchip Technology Inc. DS21985D-page 47
MCP131X/2X
APPENDIX A: RE VISION HISTORY
Revision D (August 2012)
The following is the list of modifications:
1. Updated Figure 2-22 and Figure 2-23.
Revision C (February 2012)
The following is the list of modifications:
1. Updated package temperature in the
Temp erature Chara cteristics table.
2. Corrected text in Section 4.0, Operational
Description.
3. Updated package specification in Section 8.0,
Packaging Information to show all drawings
available.
4. Other minor typographical corrections.
Revision B (October 2007)
The following is the list of modifications:
1. Clarified that devices with a Voltage Trip Point
2.4V are tested from -40C to + 85C. Devices
with a Voltage Trip Point 2.5V are tested from
-40C to +125C.
Revision A (November 2005)
• Original Rel ease of this Document.
MCP131X/2X
DS21985D-page 48 2005-2012 Microchip Technology Inc.
NOTES:
2005-2012 Microchip Technology Inc. DS21985D-page 49
MCP131X/2X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP1316T: MicroPower Voltage Detector
(Tape an d Reel)
MCP1316MT: MicroPower Voltage Detector
(Tape an d Reel)
MCP1317T: MicroPower Voltage Detector
(Tape an d Reel)
MCP1318T: MicroPower Voltage Detector
(Tape an d Reel)
MCP1318MT: MicroPower Voltage Detector
(Tape an d Reel)
MCP1319T: MicroPower Voltage Detector
(Tape an d Reel)
MCP1319MT: MicroPower Voltage Detector
(Tape an d Reel)
MCP1320T: MicroPower Voltage Detector
(Tape an d Reel)
MCP1321T: MicroPower Voltage Detector
(Tape an d Reel)
MCP1322T: MicroPower Voltage Detector
(Tape an d Reel)
VTRIP Options:
(Note 1)29 = 2.90V
46 = 4.60V
Time-Out Op tions:
(Note 1)L=t
RST = 200 ms (typ.),
tWDT = 1.6 s (typ.)
Temperature Range: I = -40°C to +85°C
(Only for trip points 2.0V to 2.4V)
E = -40°C to +125°C
(For trip point 2.5V)
Package: OT = SOT-23, 5-lead
Note 1: Custom ordered voltage trip points and time outs available. Please
contact your local Microchip sales office for additional information.
Minimum purchase volumes are required.
PART NO. XX X
Temperature
VTRIP
Options
Device
Examples:
a) MCP1316T-29LE/OT: 5-Lead SOT-23-5
b) MCP1316T-46LE/OT: 5-Lead SOT-23-5
c) MCP1316MT -29LE/OT: 5-Lead SOT-23-5
d) MCP1316MT-46LE/OT: 5-Lead SOT-23-5
a) MCP1317T-29LE/OT: 5-Lead SOT-23-5
b) MCP1317T-46LE/OT: 5-Lead SOT-23-5
a) MCP1318T-29LE/OT: 5-Lead SOT-23-5
b) MCP1318MT-29LE/OT: 5-Lead SOT-23-5
c) MCP1318T-46LE/OT: 5-Lead SOT-23-5
d) MCP1318MT-46LE/OT: 5-Lead SOT-23-5
a) MCP1319T-29LE/OT: 5-Lead SOT-23-5
b) MCP1318MT-29LE/OT: 5-Lead SOT-23-5
c) MCP1319T-46LE/OT: 5-Lead SOT-23-5
d) MCP1318MT-46LE/OT: 5-Lead SOT-23-5
a) MCP1320T-29LE/OT: 5-Lead SOT-23-5
b) MCP1320T-46LE/OT: 5-Lead SOT-23-5
a) MCP1321T-29LE/OT: 5-Lead SOT-23-5
b) MCP1321T-46LE/OT: 5-Lead SOT-23-5
a) MCP1322T-29LE/OT: 5-Lead SOT-23-5
b) MCP1322T-46LE/OT: 5-Lead SOT-23-5
Range
XX
Package
X
Tape/Reel
Option
/
X
Time-Out
Options
MCP131X/2X
DS21985D-page 50 2005-2012 Microchip Technology Inc.
NOTES:
2012 Microchip Technology Inc. DS21985D-page 51
Information contained in this publication regarding device
applications a nd the lik e is provided only f or yo ur convenience
and may be supers ed ed by u pda t es . It is y our responsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PI CSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM ,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI- TIDE, In-Circu it Se rial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2012, Microchip Technology Inc orporated, Pr inted in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-513-5
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure famili es of its kind on t he market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPI C® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21985D-page 52 2005-2012 Microchip Technology Inc.
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Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohs iung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangko k
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921- 5820
Worldwide Sales and Service
11/29/11
