CAT3200TDI-GT3 - ON Semiconductor

September, 2011 − Rev. 14

1Publication Order Number:

CAT3200/D

CAT3200, CAT3200-5

Low Noise Regulated

Charge Pump DC-DC

Converter

Description

The CAT3200 and CAT3200−5 are switched capacitor boost

converters that deliver a low noise, regulated output voltage. The

CAT3200−5 gives a fixed regulated 5 V output. The CAT3200 has

an adjustable output using external resistors. The constant

frequency 2 MHz charge pump allows small 1 mF ceramic capacitors

to be used.

Maximum output loads of up to 100 mA can be supported over a

wide range of input supply voltages (2.7 V to 4.5 V) making the device

ideal for battery−powered applications.

A shutdown control input allows the device to be placed in

power−down mode, reducing the supply current to less than 1 mA.

In the event of short circuit or overload conditions, the device is

fully protected by both foldback current limiting and thermal overload

detection. In addition, a soft start, slew rate control circuit limits inrush

current during power−up.

The CAT3200−5 is available in a 6−lead, 1 mm max thin SOT23

package. The CAT3200 is available in an 8−lead MSOP package.

Features

•Constant High Frequency (2 MHz) Operation

•100 mA Output Current

•Regulated Output Voltage (5 V Fixed CAT3200−5, Adjustable

CAT3200)

•Low Quiescent Current (1.7 mA Typ.)

•Input Voltage Operation down to 2.7 V

•Soft Start, Slew Rate Control

•Thermal Overload Shutdown Protection

•Low Value External Capacitors (1 mF)

•Foldback Current Overload Protection

•Shutdown Current less than 1 mA

•CAT3200−5 in Low Profile (1 mm Thin) 6−lead TSOT−23 Package

•CAT3200 in MSOP−8 Package

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Applications

•3 V to 5 V Boost Conversion

•White LED Driver

•USB On−The−Go 5 V Supply

•Local 5 V Supply from Lower Rail

•Battery Backup Systems

•Handheld Portable Devices

http://onsemi.com

PIN CONFIGURATIONS

MSOP−8

Z SUFFIX

CASE 846AD

TSOT−23

TD SUFFIX

CASE 419AF

(Top Views)

CAT3200

CAT3200−5

CPOS

CNEG

SHDN

GND

OUT

SHDN

SGND

CPOS

CNEG

PGND

MSOP

SOT23

* NiPdAu lead finish

Device Package Shipping

ORDERING INFORMATION

CAT3200TDI−T3 TSOT23−6

(Pb−Free)

3,000 / Tape &

Reel

CAT3200TDI−GT3 TSOT23−6*

(Pb−Free)

CAT3200ZI−T3 MSOP−8

(Pb−Free)

3,000 / Tape &

Reel

CAT3200ZI−GT3 MSOP−8*

(Pb−Free)

3,000 / Tape &

Reel

3,000 / Tape &

Reel

CAT3200, CAT3200−5

http://onsemi.com

ABME = CAT3200ZI-T3

ABRU = CAT3200ZI-GT3

LN = CAT3200TDI-T3

VA = CAT3200TDI-GT3

Y = Production Year (Last Digit)

M = Production Month (1-9, A, B, C)

R = Production Revision

MARKING DIAGRAMS

LNYM VAYM

ABME

YMR

ABRU

YMR

Typical Application

Figure 1. Typical Application − 5 V Output

CAT3200−5

GND

−

3.3 V

CAT3200

GND

−

3.3 V

5 V

100 mA

1 mF

ON OFF

1 mF

OUT

VIN

SHDN

CNEG CPOS VOUT

1 mF

VIN

ON OFF

1 mF

IN OUT

1 mF

CNEG CPOS VOUT

SHDN

VOUT = 5 V

IOUT ≤ 50 mA, for VIN ≥ 2.8 V

IOUT ≤ 90 mA, for VIN ≥ 3 V

VOUT +1.27 V ǒ1)R1

R2Ǔ

Figure 2. Typical Application − Adjustable Output

Table 1. PIN DESCRIPTIONS

Designation Description

OUT Regulated output voltage.

GND Ground reference for all voltages.

SHDN Shutdown control logic input (Active LOW)

CNEG Negative connection for the flying capacitor.

IN Input power supply.

CPOS Positive connection for the flying capacitor.

FB Feedback to set the output voltage.

PGND Power ground.

SGND Signal ground.

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameters Ratings Units

VIN, VOUT

, SHDN, CNEG, CPOS Voltage −0.6 to +6.0 V

VOUT Short Circuit Duration Indefinite

Output Current 200 mA

ESD Protection (HBM) 2000 V

Junction Temperature 150 °C

Storage Temperature Range −65 to +160 °C

Lead Soldering Temperature (10 sec) 300 °C

Power Dissipation (SOT23−6) 0.3 W

Power Dissipation (8−MSOP) 0.5 W

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

CAT3200, CAT3200−5

http://onsemi.com

Table 3. RECOMMENDED OPERATING CONDITIONS

Parameters Ratings Units

VIN 2.7 to 4.5 V

CIN, COUT

, CFLY 1mF

ILOAD 0 to 100 mA

Ambient Temperature Range −40 to +85 °C

Table 4. ELECTRICAL SPECIFICATIONS

(Recommended operating conditions unless otherwise specified. CIN, COUT

, CFLY are 1 mF ceramic capacitors and VIN is set to 3.6 V.)

Symbol Parameter Conditions Min Typ Max Units

VOUT Regulated Output ILOAD ≤ 40 mA, VIN ≥ 2.7 V

ILOAD ≤ 100 mA, VIN ≥ 3.1 V

4.8 5.0 5.2 V

VLINE Line Regulation 3.1 V ≤ VIN ≤ 4.5 V, ILOAD = 50 mA 6 mV

VLOAD Load Regulation ILOAD = 10 mA to 100 mA, VIN = 3.6 V 20 mV

FOSC Switching Frequency 1.3 2.0 2.6 MHz

VROutput Ripple Voltage ILOAD = 100 mA

CAT3200−5 Only

30 mVp−p

hEfficiency ILOAD = 50 mA, VIN = 3 V, CAT3200−5 80 %

IGND Ground Current ILOAD = 0 mA, SHDN = VIN 1.6 4 mA

ISHDN Shutdown Input Current ILOAD = 0 mA, SHDN = 0 V 1mA

VFB FB Voltage CAT3200 Only 1.22 1.27 1.32 V

IFB FB Input Current CAT3200 Only −50 50 nA

ROL Open−Loop Resistance ILOAD = 100 mA, VIN = 3 V (Note 1) 10 W

TON VOUT Turn−on time (10% to 90%) ILOAD = 0 mA, VIN = 3 V 0.5 ms

VIHSHDN High Detect Shutdown Threshold 0.8 1.3 V

VILSHDN Low Detect Shutdown Threshold 0.4 V

IROUT Reverse Leakage into OUT pin VOUT = 5 V, Shutdown mode (Note 2) 15 30 mA

ISC Short−circuit Output VOUT = 0 V 80 mA

TSD Thermal Shutdown 160 °C

THYST Thermal Hysteresis 20 °C

1. ROL = (2VIN − VOUT)/IOUT

2. In the event of a controlled shutdown, the output will be isolated from the input, but will remain connected to the internal resistor feedback

network. This will cause a small level of reverse current to flow back into the device to ground.

CAT3200, CAT3200−5

http://onsemi.com

TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200−5)

(TAMB = 25°C, CIN = COUT = CFLY = 1 mF, V IN = 3.3 V unless specified otherwise.)

Figure 3. Shutdown Input Threshold vs.

Supply Voltage

Figure 4. Ground Current vs. Supply Voltage

(No Load)

INPUT VOLTAGE (V) INPUT VOLTAGE (V)

4.54.23.93.63.33.02.7

0.4

0.5

0.6

0.7

0.8

1.0

1.1

1.2

4.54.23.93.63.33.02.7

1.2

1.4

1.6

1.8

2.0

2.2

Figure 5. Line Regulation Figure 6. Load Regulation

INPUT VOLTAGE (V) LOAD CURRENT (mA)

4.54.23.93.63.33.02.7

4.8

4.9

5.1

5.2

150100500

4.8

4.9

5.0

5.1

5.2

Figure 7. Oscillator Frequency vs. Supply

Voltage

Figure 8. Efficiency vs. Load Current

INPUT VOLTAGE (V) LOAD CURRENT (mA)

4.54.23.93.63.33.02.7

1.6

1.8

2.0

2.2

2.4

2.6

100101

100

SHUTDOWN THRESHOLD (V)

GROUND CURRENT (mA)

OUTPUT VOLTAGE (V)

OSCILLATOR FREQUENCY (MHz)

EFFICIENCY (%)

0.9

5.0

20 mA Load

100 mA Load

VIN = 3.2 V

VIN = 3.0 V

VIN = 2.7 V

VIN = 3.2 V

VIN = 2.7 V

VIN = 3.7 V

VIN = 4.5 V

CAT3200, CAT3200−5

http://onsemi.com

TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200−5)

(TAMB = 25°C, CIN = COUT = CFLY = 1 mF, V IN = 3.3 V unless specified otherwise.)

Figure 9. Soft Start Power Up

(90 mA Load, 3.3 V Input)

Figure 10. Load Step Response (3.3 V Input)

Figure 11. Output Ripple

(100 mA Load, 3.3 V Input)

Figure 12. Short Circuit Current vs. Supply

Voltage

INPUT VOLTAGE (V)

4.54.23.93.63.33.02.7

100

150

200

250

Figure 13. Output Voltage Change vs.

Temperature

Figure 14. Oscillator Frequency Change vs.

Temperature

TEMPERATURE (°C) TEMPERATURE (°C)

8060 10040200−20−40

−2

−1

806040 100200−20−40

−4

−2

CURRENT LIMIT (mA)

OUTPUT VOLTAGE CHANGE (%)

FREQUENCY CHANGE (%)

10 mA Load

CAT3200, CAT3200−5

http://onsemi.com

Block Diagram

Figure 15. CAT3200 Adjustable Output Figure 16. CAT3200−5 5 V Fixed Output

+EN

2 MHz

Voltage

Doubler

1.25 V

SGND

5 V / 100 mA

OUT

PGND

+EN

2 MHz

Voltage

Doubler

300 k

100 k

1.25 V

GND

5 V

100 mA OUT

CNEG CPOS

2VIN

−

SHDN

−

SHDN

CNEG CPOS

2VIN

Pin Functions

IN is the power supply. During normal operation the device

draws a supply current which is almost constant. A very

brief interval of non−conduction will occur at the switching

frequency. The duration of the non−conduction interval is

set by the internal non−overlapping “break−before−make”

timing. IN should be bypassed with a 1 mF to 4.7 mF low

ESR (Equivalent Series Resistance) ceramic capacitor

For filtering, a low ESR ceramic bypass capacitor (1 mF)

in close proximity to the IN pin prevents noise from being

injected back into the power supply.

SHDN is the logic control input (Active LOW) that places

the device into shutdown mode. The internal logic is CMOS

and the pin does not use an internal pull−down resistor. The

SHDN pin should not be allowed to float.

CPOS, CNEG are the positive and negative connections

respectively for the charge pump flying capacitor. A low

ESR ceramic capacitor (1 mF) should be connected between

these pins. During initial power−up it may be possible for the

capacitor to experience a voltage reversal and for this reason,

avoid using a polarized (tantalum or aluminum) flying

capacitor.

OUT is the regulated output voltage to power the load.

During normal operation, the device will deliver a train of

current pulses to the pin at a frequency of 2 MHz. Adequate

filtering on the pin can typically be achieved through the use

a low ESR ceramic bypass capacitor (1 mF to 4.7 mF) in close

proximity to the OUT pin. The ESR of the output capacitor

will directly influence the output ripple voltage.

When the shutdown mode is entered, the output is

immediately isolated from the input supply, however, the

output will remain connected to the internal feedback

resistor network (400 kW). The feedback network will result

in a reverse current of 10 mA to 20 mA to flow back through

the device to ground.

Whenever the device is taken out of shutdown mode, the

output voltage will experience a slew rate controlled

power−up. Full operating voltage is typically achieved in

less than 0.5 msec.

GND is the ground reference for all voltages on CAT3200−5

devices.

FB (CAT3200 Only) is the feedback input pin. An output

divider should be connected from OUT to FB to program the

output voltage.

PGND (CAT3200 Only). Is the same as GND for the

CAT3200−5 except for the internal reference connection to

SGND.

SGND (CAT3200 Only) Ground pin for the internal

reference. The CNEG connection is switched to this pin

during the normal charge pump operation.

CAT3200, CAT3200−5

http://onsemi.com

Device Operation

The CAT3200/CAT3200−5 use a switched capacitor

charge pump to boost the voltage at IN to a regulated output

voltage. Regulation is achieved by sensing the output

voltage through an internal resistor divider (CAT3200−5)

and modulating the charge pump output current based on the

error signal. A 2−phase non−overlapping clock activates the

charge pump switches. The flying capacitor is charged from

the IN voltage on the first phase of the clock. On the second

phase of the clock it is stacked in series with the input voltage

and connected to OUT. The charging and discharging the

flying capacitor continues at a free running frequency of

typically 2 MHz.

In shutdown mode all circuitry is turned off and the

CAT3200/CAT3200−5 draw only leakage current from the

VIN supply. OUT is disconnected from IN. The SHDN pin

is a CMOS input with a threshold voltage of approximately

0.8 V. The CAT3200/CAT3200−5 is in shutdown when a

logic LOW is applied to the SHDN pin. The SHDN pin is a

high impedance CMOS input. SHDN does not have an

internal pull−down resistor and should not be allowed to

float and. It must always be driven with a valid logic level.

Short−Circuit and Thermal Protection

The CAT3200 and CAT3200−5 have built−in

short−circuit current limiting and over temperature

protection. During overload conditions, output current is

limited to approximately 225 mA. At higher temperatures,

or if the input voltage is high enough to cause excessive chip

self heating, the thermal shutdown circuit shuts down the

charge pump as the junction temperature exceeds

approximately 160°C. Once the junction temperature drops

back to approximately 140°C, the charge pump is enabled.

The CAT3200 and CAT3200−5 will cycle in and out of

thermal shutdown indefinitely without latch−up or damage

until a short−circuit on OUT is removed.

Programming the CAT3200 Output Voltage (FB Pin)

The CAT3200−5 version has an internal resistive divider

to program the output voltage. The programmable CAT3200

may be set to an arbitrary voltage via an external resistive

divider. Since it employs a voltage doubling charge pump,

it is not possible to achieve output voltages greater than

twice the available input voltage. Figure 17 shows the

required voltage divider connection. The voltage divider

ratio is given by the formula:

R2 +VOUT

1.27 V *1

Typical values for total voltage divider resistance can

range from several kWs up to 1 MW.

Figure 17. Programming the Adjustable CAT3200

OUT

1.27 V

CPOS CNEG

SHDN

PGND

SGND

COUT

VOUT

ǒ1)R1

R2Ǔ

CAT3200, CAT3200−5

http://onsemi.com

Application Information

Ceramic Capacitors

Ceramic capacitors of different dielectric materials lose

their capacitance with higher temperature and voltage at

different rates. For example, a capacitor made of X5R or

X7R material will retain most of its capacitance from – 40°C

to 85°C whereas a Z5U or Y5V style capacitor will lose

considerable capacitance over that range.

Z5U and Y5V capacitors may also have voltage

coefficient causing them to lose 60% or more of their

capacitance when the rated voltage is applied. When

comparing different capacitors it is often useful consider the

amount of achievable capacitance for a given case size rather

than discussing the specified capacitance value. For

example, over rated voltage and temperature conditions, a

1mF, 10 V, Y5V ceramic capacitor in an 0603 case may not

provide any more capacitance than a 0.22 mF, 10 V, X7R

available in the same 0603 case. For many CAT3200/

CAT3200−5 applications these capacitors can be considered

roughly equivalent.

The capacitor manufacturer’s data sheet should be

consulted to determine what value of capacitor is needed to

ensure the desired capacitance at all temperatures and

voltages. Below is a list of ceramic capacitor

manufacturers and how to contact them:

Table 5. CERAMIC CAPACITOR MANUFACTURERS

Capacitor

Manufacturer Web Phone

Murata www.murata.com 814.237.1431

AVX/Kemet www.avxcorp.com 843.448.9411

Vishay www.vishay.com

Kemet www.kemet.com 408.986.0424

Taiyo Yuden www.t−yuden.com 408.573.4150

Thermal Management

For higher input voltages and maximum output current

there can be substantial power dissipation in the CAT3200/

CAT3200−5. If the junction temperature increases to 160°C,

the thermal shutdown circuitry will automatically turn off

the output.

A good thermal connection to the PC board is

recommended to reduce the chip temperature. Connecting

the GND pin (Pins 4/5 for CAT3200, Pin 2 for CAT3200−5)

to a ground plane, and maintaining a solid ground plane

under the device reduces the overall thermal resistance.

The overall junction to ambient thermal resistance (qJA)

for device power dissipation (PD) consists primarily of two

paths in series. The first path is the junction to the case (qJC)

which is defined by the package style, and the second path

is case to ambient (qCA) thermal resistance which is

dependent on board layout. The final operating junction

temperature for any set of conditions can be estimated by the

following thermal equation:

TJUNC = TAMB + PD (QJC) + PD (QCA)

TJUNC = TAMB + PD (QJA)

The CAT3200 in SOT23 package, when mounted on

printed circuit board with two square inches of copper

allocated for “heat spreading”, will result with an overall θJA

of less than 150°C/W.

For a typical application operating from a 3.8 V input

supply, the maximum power dissipation is 260 mW

(100 mA x 3 V). This would result if a maximum junction

temperature of:

TJUNC = TAMB + PD (qJA)

TJUNC = 85°C + 0.26 W (150°C/W)

TJUNC = 85°C + 39°C = 124°C

The use of multi−layer board construction with power

planes will further enhance the overall thermal performance.

In the event of no dedicated copper area being used for heat

spreading, a multi−layer board will typically provide the

CAT3200 with an overall qJA of 200°C/W. This level of

thermal conduction would allow up to 200 mW be safely

dissipated within the device.

CAT3200, CAT3200−5

http://onsemi.com

Typical Applications

Figure 18. 3.3 V Supply to 5 V Figure 19. USB Port to Regulated 5 V Power Supply

Figure 20. Lithium−Ion Battery to 5 V White or Blue LED Driver

Figure 21. White or Blue LED Driver with LED Current Control

CAT3200−5

100 mA

GND

CAT3200−5

GND

IN OUT

SGND

100 Ω100 Ω100 Ω100 Ω

CAT3200−5

Apply PWM Waveform for

Adjustable Brightness Control

3 V to 4.4 V

Li−ion

Battery

Drive up to 5 LEDs

100 Ω

C+ C−

SGND

PGND 82 Ω82 Ω82 Ω82 Ω82 Ω

CAT3200

Apply PWM Waveform for

Adjustable Brightness Control

3 V to 4.4 V

Li−ion

Battery

Up to 6 LEDs

1 mF

IN OUT

1 mF

3.3 V ± 10%

SHDN

1 mF

VOUT

5 V ± 4%

SHDN

1 mF

4 V ≤ VIN ≤ 5 V

IN OUT

1 mFVOUT

5 V ± 4%

1 mF

C−C+

1 mF

SHDN

ON OFF

VSHDN

1 mF

IN OUT

1 mF

SHDN

VSHDN

ON OFF

CAT3200, CAT3200−5

http://onsemi.com

PACKAGE DIMENSIONS

TSOT−23, 6 LEAD

CASE 419AF−01

ISSUE O

E1 E

TOP VIEW

SIDE VIEW END VIEW

LL2

Notes:

(1) All dimensions are in millimeters. Angles in degrees.

(2) Complies with JEDEC MO-193.

SYMBOL

MIN NOM MAX

0º 8º

0.01

0.80

0.30

0.12

0.30

0.05

0.87

0.15

2.90 BSC

2.80 BSC

1.60 BSC

0.95 TYP

0.40

0.60 REF

0.25 BSC

1.00

0.10

0.90

0.45

0.20

0.50

CAT3200, CAT3200−5

http://onsemi.com

PACKAGE DIMENSIONS

MSOP 8, 3x3

CASE 846AD−01

ISSUE O

E1E

A1 e b

TOP VIEW

SIDE VIEW END VIEW

DETAIL A

Notes:

(1) All dimensions are in millimeters. Angles in degrees.

(2) Complies with JEDEC MO-187.

SYMBOL MIN NOM MAX

0º 6º

0.05

0.75

0.22

0.13

0.40

2.90

4.80

2.90

0.65 BSC

0.25 BSC

1.10

0.15

0.95

0.38

0.23

0.80

3.10

5.00

3.10

0.60

3.00

4.90

3.00

L1 0.95 REF

0.10

0.85

CAT3200, CAT3200−5

http://onsemi.com

3. All packages are RoHS−compliant (Lead−free, Halogen−free).

4. The standard lead finish is NiPdAu.

5. For Matte−Tin package option, please contact your nearest ON Semiconductor Sales office.

6. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

CAT3200/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative