SN54ALS11A, SN54AS11, SN74ALS11A, SN74AS11
TRIPLE 3-INPUT POSITIVE-AND GATES
SDAS009D – MARCH 1984 – REVISED NOVEMBER 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
4.5-V to 5.5-V VCC Operation
D
Max tpd of 5.5 ns at 5 V
SN54ALS11A, ...J OR W PACKAGE
SN54AS11 ...J PACKAGE
SN74ALS11A, SN74AS11 . . . D, N, OR NS PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
2A
2B
2C
2Y
GND
VCC
1C
1Y
3C
3B
3A
3Y
SN54ALS11A, SN54AS11 . . . FK PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
1Y
NC
3C
NC
3B
2A
NC
2B
NC
2C
1B
1A
NC
3Y
3A V
1C
2Y
NC CC
NC – No internal connection
GND
description/ordering information
These devices contain three independent 3-input positive-AND gates. They perform the Boolean functions
Y
+
ABCorY
+
A
)
B
)
C in positive logic.
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP N
Tube
SN74ALS11AN SN74ALS11AN
PDIP
N
Tube
SN74AS11N SN74AS11N
Tube SN74ALS11AD
ALS11A
0°Cto70°C
SOIC D
Tape and reel SN74ALS11ADR
ALS11A
0°C
to
70°C
SOIC
D
Tube SN74AS11D
AS11
Tape and reel SN74AS11DR
AS11
SOP NS
Ta
p
e and reel
SN74ALS11ANSR ALS11A
SOP
NS
Tape
and
reel
SN74AS11NSR 74AS11
CDIP J
Tube
SNJ54ALS11AJ SNJ54ALS11AJ
CDIP
J
Tube
SNJ54AS11J SNJ54AS11J
–55°C to 125°CCFP – W Tube SNJ54ALS11AW SNJ54ALS11AW
LCCC FK
Tube
SNJ54ALS11AFK SNJ54ALS11AFK
LCCC
FK
Tube
SNJ54AS11FK SNJ54AS11FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
Copyright 2002, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SN54ALS11A, SN54AS11, SN74ALS11A, SN74AS11
TRIPLE 3-INPUT POSITIVE-AND GATES
SDAS009D MARCH 1984 REVISED NOVEMBER 2002
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FUNCTION TABLE
(each gate)
INPUTS OUTPUT
A B C Y
H H H H
LXX L
XLX L
X X L L
logic diagram, each gate (positive logic)
12 1Y
1A
1B
1C
62Y
2A
2B
2C
83Y
3A
3B
3C
1
2
13
3
4
5
9
10
11
Pin numbers shown are for the D, J, N, NS, and W packages.
absolute maximum ratings over operating free-air temperature range (SN54ALS11A,
SN74ALS11A) (unless otherwise noted)
Supply voltage, VCC 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 1): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
SN54ALS11A SN74ALS11A
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL
Low level in
p
ut voltage
0.80.8
V
V
IL
Low
-
level
input
voltage
0.7§
V
IOH High-level output current 0.4 0.4 mA
IOL Low-level output current 4 8 mA
TAOperating free-air temperature 55 125 0 70 °C
Applies over temperature range 55°C to 70°C
§Applies over temperature range 70°C to 125°C
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN54ALS11A, SN54AS11, SN74ALS11A, SN74AS11
TRIPLE 3-INPUT POSITIVE-AND GATES
SDAS009D MARCH 1984 REVISED NOVEMBER 2002
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54ALS11A SN74ALS11A
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYPMAX MIN TYPMAX
UNIT
VIK VCC = 4.5 V, II = 18 mA 1.5 1.5 V
VOH VCC = 4.5 V to 5.5 V, IOH = 0.4 mA VCC 2 VCC 2 V
VOL
IOL = 4 mA 0.25 0.4 0.25 0.4
V
V
OL
CC =
.
IOL = 8 mA 0.35 0.5
V
IIVCC = 5.5 V, VI = 7 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL VCC = 5.5 V, VI = 0.4 V 0.1 0.1 mA
IOVCC = 5.5 V, VO = 2.25 V 20 112 30 112 mA
ICCH VCC = 5.5 V, VI = 4.5 V 1 1.8 1 1.8 mA
ICCL VCC = 5.5 V, VI = 0 1.6 3 1.6 3 mA
All typical values are at VCC = 5 V, TA = 25°C.
The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS.
switching characteristics (see Figure 1)
PARAMETER FROM
(
INPUT
)
TO
(
OUTPUT
)
VCC = 4.5 V TO 5.5 V,
CL = 50 PF,
RL = 500 ,
TA = MIN TO MAX§UNIT
(INPUT)
(OUTPUT)
SN54ALS11A SN74ALS11A
MIN MAX MIN MAX
tPLH
ABorC
Y
2 14 2 13
ns
tPHL
A
,
B
,
or
C
Y
2 12.5 2 10
ns
§For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
absolute maximum ratings over operating free-air temperature range (SN54AS11, SN74AS11)
(unless otherwise noted)
Supply voltage, VCC 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 1): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
SN54ALS11A, SN54AS11, SN74ALS11A, SN74AS11
TRIPLE 3-INPUT POSITIVE-AND GATES
SDAS009D MARCH 1984 REVISED NOVEMBER 2002
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 2)
SN54AS11 SN74AS11
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
IOH High-level output current 22 mA
IOL Low-level output current 20 20 mA
TAOperating free-air temperature 55 125 0 70 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54AS11 SN74AS11
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYPMAX MIN TYPMAX
UNIT
VIK VCC = 4.5 V, II = 18 mA 1.2 1.2 V
VOH VCC = 4.5 V to 5.5 V, IOH = 2 mA VCC2 VCC2 V
VOL VCC = 4.5 V, IOL = 20 mA 0.35 0.5 0.35 0.5 V
IIVCC = 5.5 V, VI = 7 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL VCC = 5.5 V, VI = 0.4 V 0.5 0.5 mA
IOVCC = 5.5 V, VO = 2.25 V 30 112 30 112 mA
ICCH VCC = 5.5 V, VI = 4.5 V 4.3 7 4.3 7 mA
ICCL VCC = 5.5 V, VI = 0 11.2 18 11.2 18 mA
All typical values are at VCC = 5 V, TA = 25°C.
The output conditions have been chosen to produce a current that closely approximates one-half of the true short-circuit output current, IOS.
switching characteristics (see Figure 1)
PARAMETER FROM
(
INPUT
)
TO
(
OUTPUT
)
VCC = 4.5 V TO 5.5 V,
CL = 50 PF,
RL = 500 ,
TA = MIN TO MAX§UNIT
(INPUT)
(OUTPUT)
SN54AS11 SN74AS11
MIN MAX MIN MAX
tPLH
ABorC
Y
1 6.5 1 6
ns
tPHL
A
,
B
,
or
C
Y
1 6.5 1 5.5
ns
§For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
SN54ALS11A, SN54AS11, SN74ALS11A, SN74AS11
TRIPLE 3-INPUT POSITIVE-AND GATES
SDAS009D MARCH 1984 REVISED NOVEMBER 2002
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
SERIES 54ALS/74ALS AND 54AS/74AS DEVICES
tPHZ
tPLZ
tPHL tPLH
0.3 V
tPZL
tPZH
tPLH tPHL
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
From Output
Under Test Test
Point
R1
S1
CL
(see Note A)
7 V
1.3 V
1.3 V1.3 V
3.5 V
3.5 V
0.3 V
0.3 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Timing
Input
Data
Input
1.3 V 1.3 V 3.5 V
3.5 V
0.3 V
0.3 V
High-Level
Pulse
Low-Level
Pulse
tw
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
Out-of-Phase
Output
(see Note C)
1.3 V 1.3 V
1.3 V1.3 V
1.3 V 1.3 V
1.3 V1.3 V
1.3 V
1.3 V
3.5 V
3.5 V
0.3 V
0.3 V
VOL
VOH
VOH
VOL
Output
Control
(low-level
enabling)
W aveform 1
S1 Closed
(see Note B)
W aveform 2
S1 Open
(see Note B) 0 V
VOH
VOL
3.5 V
In-Phase
Output
0.3 V
1.3 V 1.3 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
R2
VCC
RL
Test
Point
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT FOR
BI-STATE
TOTEM-POLE OUTPUTS
From Output
Under Test Test
Point
CL
(see Note A) RL
RL = R1 = R2
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-86841012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
86841012A
SNJ54ALS
11AFK
5962-8684101CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8684101CA
SNJ54ALS11AJ
5962-8684101DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8684101DA
SNJ54ALS11AW
5962-9756101Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9756101Q2A
SNJ54AS
11FK
5962-9756101QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9756101QC
A
SNJ54AS11J
JM38510/37402B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
37402B2A
JM38510/37402BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
37402BCA
M38510/37402B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
37402B2A
M38510/37402BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
37402BCA
SN54ALS11AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54ALS11AJ
SN54AS11J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54AS11J
SN74ALS11AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS11A
SN74ALS11ADE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS11A
SN74ALS11ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS11A
SN74ALS11ADR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS11A
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74ALS11ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS11A
SN74ALS11ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS11A
SN74ALS11AN ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS11AN
SN74ALS11ANE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS11AN
SN74ALS11ANSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS11A
SN74ALS11ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS11A
SN74ALS11ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS11A
SN74AS11D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AS11
SN74AS11DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AS11
SN74AS11DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AS11
SN74AS11DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AS11
SN74AS11DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AS11
SN74AS11DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AS11
SN74AS11N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74AS11N
SN74AS11NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74AS11N
SN74AS11NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74AS11
SN74AS11NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74AS11
SN74AS11NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74AS11
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54ALS11AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
86841012A
SNJ54ALS
11AFK
SNJ54ALS11AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8684101CA
SNJ54ALS11AJ
SNJ54ALS11AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8684101DA
SNJ54ALS11AW
SNJ54AS11FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9756101Q2A
SNJ54AS
11FK
SNJ54AS11J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9756101QC
A
SNJ54AS11J
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 4
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ALS11A, SN54AS11, SN74ALS11A, SN74AS11 :
Catalog: SN74ALS11A, SN74AS11
Military: SN54ALS11A, SN54AS11
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ALS11ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74ALS11ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AS11DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AS11NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ALS11ADR SOIC D 14 2500 367.0 367.0 38.0
SN74ALS11ANSR SO NS 14 2000 367.0 367.0 38.0
SN74AS11DR SOIC D 14 2500 367.0 367.0 38.0
SN74AS11NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated