Description
The A4407 is an automotive power management IC that uses a
2.2 MHz constant on-time (COT) buck pre-regulator to supply
a 5 V linear regulator, a 5 V tracking/protected linear regulator,
a 3.3 V linear FET controller/driver, and a 1.2 V/1.5 V/1.8 V
linear FET controller/driver. The A4407 provides a pin to set
the master reference for the 5 V tracking regulator to either the
3.3 V or the 5 V output. The on-time of the buck is internally
adjusted as a function of VIN to maintain the 2.2 MHz switching
frequency. Efficient operation is achieved by using the buck
pre-regulator to drop the input voltage before supplying the
linear regulators. Designed to supply CAN and microprocessor
power supplies in high temperature environments, the A4407
is ideal for under hood applications.
The switching regulator is designed to operate at a nominal
switching frequency of 2.2 MHz. The high switching frequency
enables the customer to select low value inductors and ceramic
capacitors while avoiding EMI in the AM frequency band.
Protection features include: undervoltage lockout, pulse-by-
pulse current limit, LX short circuit protection, and thermal
shutdown. In case of a shorted load all linear regulators feature
foldback overcurrent protection. In addition, the V5P output is
protected from a short-to-battery event. The A4407 features both
a logic level and a high-voltage (current and voltage limited)
enable input. The A4407 also features a power-on-reset (NPOR)
output with adjustable delay for microprocessor control.
The A4407 is supplied in a low profile (1.1 mm) 24-lead TSSOP
package with exposed pad for enhanced thermal dissipation
(suffix LP). The package is lead (Pb) free with 100% matte-tin
leadframe plating.
A4407-DS, Rev. 3
Features and Benefits
AEC Q100 Grade 0 qualified
• Internal buck pre-regulator followed by LDO outputs
5.5 to 36 V VIN operating range (50 V maximum);
for start/stop, cold crank, and load dump requirements
Constant on-time (COT) buck pre-regulator
Valley current sensing achieves shortest buck on-times
2.2 MHz (VIN
- adjusted) switching frequency
5 V internal low-dropout tracking linear regulator with
foldback short circuit and short-to-battery protections
5 V internal low-dropout linear regulator with foldback
short circuit protection
3.3 V external FET controller/driver with programmable
current limit and foldback short circuit protection
1.2 V/1.5 V/1.8 V external FET controller/driver with
programmable current limit and foldback protection
Power-on reset (NPOR) with adjustable rising delay
Logic enable input (ENB) for microprocessor control
Ignition enable input (ENBAT) for remote startup
Ignition status indicator (ENBATS) output
Buck pulse-by-pulse overcurrent protection
Buck LX short circuit protection (latched)
Missing asynchronous diode protection (latched)
UVLO for VIN, charge pump, and the internal rail
Thermal shutdown protection
40ºC to 150ºC junction temperature range
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
Package: 24-pin TSSOP with exposed
thermal pad (suffix LP)
Simplified Functional Block Diagram
Not to scale
A4407
Applications:
Automotive Control Modules, such as:
• Electronic power steering (EPS)
• Transmission control (TCU)
Antilock braking (ABS)
• Emissions control
External
Controller
with Foldback
(1V 2)
Charge
Pump
A4407
5. 45 V
(VREG)
PWM
Control
(V5)
5 V LDO
with Foldback
Thermal
Shutdown
(TSD)
Soft Start
5 V LDO
(V5P)
with Tracking,
Foldback, and
Short to V
BAT
Protection
NPOR
Output
Tracking
Control
2:1 M UX
3V3
V5
(3V3)
External
Controller
with Foldback
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
2
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Absolute Maximum Ratings*
Characteristic Symbol Notes Rating Unit
VIN Pin 0.3 to 50 V
LX Pin VLX
–0.3 to 50 V
t < 250 ns –1.5 V
VCP, CP1, CP2 Pins 0.3 to 60 V
ISEN Pin 0.5 to 1 V
ISEN+ Pin 0.5 to 0.5 V
ENBAT Pin
The ENBAT pin is internally clamped to approximately 8.5 V
due to an ESD protection device. 0.3 V
50 to 50 mA
VREG Pin 0.3 to 8 V
G1V2 and G3V3 Pins These pins are internally clamped by an ESD protection
device. Clamp voltages range from 10 V (min) to 15 V (max). 0.3 V
CL1V2 and CL3V3 Pins 0.3 to 10 V
V5P Pin –0.3 to VIN+0.5 V
V5 Pin 0.3 to 7 V
TON Pin 0.3 to 50 V
NPOR, CPOR, ENB, ENBATS,
TRACK, 1V2, and 3V3 Pins 0.3 to 7 V
Operating Ambient Temperature TARange K 40 to 135 ºC
Junction Temperature TJ40 to 150 ºC
Storage Temperature Range Tstg 40 to 150 ºC
*Absolute Maximum Ratings are limiting values that should not be exceeded under worst case operating conditions or damage may occur. Stresses
beyond those listed in this table may cause permanent damage to the device. The Absolute Maximum ratings are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the Electrical Characteristics table is not implied. Exposure to
Absolute-Maximum–rated conditions for extended periods may affect device reliability.
Selection Guide
Part Number Operating Ambient
Temperature Range
TA, (°C) Package Packing* Leadframe
Plating
A4407KLPTR-T –40 to 135 24-pin TSSOP with
exposed thermal pad
4000 pieces per
13-in. reel 100% matte tin
*Contact Allegro for additional packing options.
Thermal Characteristics may require derating at maximum conditions, see application information
Characteristic Symbol Test Conditions* Value Unit
Package Thermal Resistance RθJA On 4-layer PCB based on JEDEC standard 28 ºC/W
*Additional thermal information available on the Allegro website.
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
3
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Functional Block Diagram
VIN
TON
CP2
CP1
VCP
F0.1 FF
CIN1 CIN2
F
FF
FF
ISENSE
ISENSE
F
k
k
k8.5 V
Microcontroller
5 V Protected
Enable
k
RTON
H
(Max)
F
COUT1
Soft
Start
IC
Power
Control
Foldback
Foldback
External
Controller
with
Foldback
External
Controller
with
Foldback
Fault Logic
and
Timing
Tracking
COUT2
RSENSE
DBUCK
DIN
F
F
FFF
VOUT3V3
Q3V3
Q1V2
COUTV5
COUTV5P
COUT3V3
COUT1V2
VOUT1V2
FF
k
k
k
k
V
Microcontroller
Reset
VOUTV5
VOUTV5P
VIGN
D1
B240A
A
.
VIN(Pin2)
D2
B240A
ProtecƟon diodes D1 and D2 are required when the V5P pin is driving a wiring harness (or excessively long
PCB trace) where parasiƟc inductance will cause the voltage at the V5P to momentarily transiƟon above
VIN or below ground during a fault condiƟon.
A
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
4
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Pin-out Diagram
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
CP2
CP1
LX
ISEN+
ISEN
VREG
CL3V3
G3V3
3V3
CL1V2
G1V2
1V2
VCP
VIN
GND
TON
ENBAT
ENB
ENBATS
NPOR
CPOR
TRACK
V5
V5P
PAD
Terminal List Table
Number Name Function
1 VCP Charge pump reservoir capacitor
2 VIN Input voltage
3 GND Ground
4 TON Buck regulator on-time programming pin
5 ENBAT Ignition enable input from the key/switch via a 1 k resistor
6 ENB Logic enable input from the microcontroller
7 ENBATS Open drain ignition status output
8 NPOR Open-drain fault indication output; active low
9 CPOR NPOR delay programming pin
10 TRACK Sets the V5P tracking to either the 3V3 or V5 linear regulator
11 V5 5 V regulator output
12 V5P 5 V tracking/protected regulator output
13 1V2 1.2 V/1.5 V/1.8 V regulator output
14 G1V2 Gate driver to the external MOSFET for 1.2 V/1.5 V/1.8 V regulation
15 CL1V2 1.2 V/1.5 V/1.8 V current sense/limit input
16 3V3 3.3 V regulator output
17 G3V3 Gate driver to the external MOSFET for 3.3 V regulation
18 CL3V3 3.3 V current sense/limit input
19 VREG Buck regulator DC output and input to the 3.3 V external regulator
20 ISENBuck negative current sense pin, sense resistor and diode node
21 ISEN+Buck positive current sense pin, sense resistor/ground node
22 LX Buck regulator switching node
23 CP1 Charge pump capacitor connection
24 CP2 Charge pump capacitor connection
PAD Exposed thermal pad for enhanced heat dissipation
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
5
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
General Specifications
Functional Input Voltage VIN(FUNC) A4407 functional, parameters not guaranteed 5.5 46 V
Operating Input Voltage VIN(OP) 5.5 13.5 36 V
Supply Quiescent Current1
IQ
VIN = 13.5 V, VIGN > VIGN(H) or VENB > VENB(H)
,
no load on VREG –10–mA
IQ(SLEEP)
VIN = 13.5 V, VIGN < VIGN(L) and VENB < VENB(L) ,
no load on VREG ––10A
Buck Switching Regulator (VREG)
Switcher Output – Regulating VREG(PWM)
VIN(SWNOM) < VIN < 27 V, VENB = high,
100 mA < IVREG < 1100 mA 5.30 5.45 5.60 V
Switcher Output – Dropout VREG(100%)
VIN = 5.5 V, LX at 100% duty cycle,
IVREG = 1100 mA 5.03 V
VIN = 6.4 V and LX at 100% duty cycle,
IVREG = 200 mA 6.38 V
Switcher Period2
TSW(L) VIN(SWL) < VIN < VIN(SWNOM) , RTON = 412 k 1.6 s
TSW(NOM) VIN(SWNOM) < VIN < VIN(SWH) , RTON = 412 k 450 ns
TSW(H) VIN(SWH) < VIN < 36 V, RTON = 412 k 1.6 s
Switcher On-Time tON
VIN = 7.5 V, RTON = 412 k1030 1290 1550 ns
VIN = 13.5 V, RTON = 412 k160 200 240 ns
VIN = 27 V, RTON = 412 k80 118 135 ns
VIN = 35 V, RTON = 412 k225 280 335 ns
Switcher Period Threshold
VIN(SWL)
VIN falling, TSW changes from
TSW(L) to 100% duty cycle 6.2 6.5 6.8 V
VIN(SWNOM)
VIN falling, TSW changes from
TSW(NOM) to TSW(L)
8.0 8.6 9.2 V
VIN(SWH)
VIN rising, TSW changes from
TSW(NOM) to TSW(H)
28 31 34 V
Switcher Period Hysteresis
VIN(SWL)hys
Relative to the VIN voltage that initially caused
the switcher period to change 250 mV
VIN(SWNOM)
hys
Relative to the VIN voltage that initially caused
the switcher period to change 250 mV
VIN(SWH)hys
Relative to the VIN voltage that initially caused
the switcher period to change 700 mV
Switch On-Resistance RDS(on)
TJ = 25°C, IDS = 0.1 A 135 180 m
TJ = 150°C, IDS = 0.1 A 270 360 m
Minimum On-Time tON(min) VIN = 13.5 V, RTON = 49.9 k–6590ns
Minimum Off-Time tOFF(min) VIN = 13.5 V 85 110 140 ns
ELECTRICAL CHARACTERISTICS Valid at 5.5 V < VIN < 36 V, 40ºC < TJ < 150ºC; unless otherwise specified
Characteristic Symbol Test Conditions Min. Typ. Max. Unit
Continued on the next page…
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
6
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ELECTRICAL CHARACTERISTICS (continued) Valid at 5.5 V < VIN < 36 V, 40ºC < TJ < 150ºC; unless otherwise specified
Characteristic Symbol Test Conditions Min. Typ. Max. Unit
Buck Switching Regulator (VREG) (continued)
Current Feedback Gain2GISEN 4.0 V/V
Error Amplifier Transconductance2gm 7.5 A/V
Error Amplifier Open Loop Gain2AVOL –57–dB
0 dB Crossover Frequency2fC
VIN = 13.5 V, RSENSE = 300 m, CO = 10 F,
RL = 5.5 65 kHz
Soft Start Ramp Time tSS –10–ms
5 V and 5VP Linear Regulators
V5 Accuracy and Load Regulation errV5 10 mA < IV5 < 215 mA, VREG 5.25 V 4.9 5.0 5.1 V
V5P Accuracy and Load Regulation errV5P 10 mA < IV5P < 280 mA, VREG 5.25 V 4.9 5.0 5.1 V
V5P/3V3 Tracking Ratio VV5P / V3V3 1.507 1.515 1.523
V5P/3V3 Tracking Accuracy errTrack3V3
2.69 V < V3V3 < 3.37 V, IV5P = 75 mA,
5.5 V < VIN < 27 V 0.5 +0.5 %
V5P/V5 Tracking Accuracy3errTrackV5
IV5P = IV5 = 75 mA, 5.5 V < VIN < 27 V,
–20°C < TJ < 150°C 25 +25 mV
IV5P = IV5 = 75 mA, 5.5 V < VIN < 27 V,
TJ = –40°C 32 +32 mV
3.3 V Linear Regulator and FET Driver
3V3 Accuracy err3V3 10 mA < I3V3 < 700 mA 3.23 3.30 3.37 V
3V3 Input Resistance RIN3V3 300 k
G3V3 Source Current1IG3V3(SRC) V3V3 = 3.0 V, VG3V3 = VG3V3(MAX) – 1 V 160 320 –480 A
G3V3 Sink Current1IG3V3(SINK) V3V3 = 3.6 V, VG3V3 = 6 V 0.5 4 mA
G3V3 Maximum Voltage VG3V3(MAX) V3V3 = 3.0 V 9 15 V
G3V3 Minimum Voltage VG3V3(MIN) V3V3 = 3.6 V 0.7 1.0 V
G3V3 Output Impedance2ROUT(G3V3) 175
3V3 External FET Gate Capacitance2CISS3V3 250 5200 pF
1.2 V/1.5 V/1.8 V Linear Regulator and FET Driver
1V2 Accuracy err1V2 10 mA < I1V2 < 500 mA 1.174 1.205 1.236 V
1V2 Bias Current1I1V2 100 nA
G1V2 Source Current1IG1V2(SRC) V1V2 = 0.9 V, VG1V2 = VG1V2(MAX) – 1V 120 240 –360 A
G1V2 Sink Current1IG1V2(SINK) V1V2 = 1.5 V, VG1V2 = 6 V 0.5 3 mA
G1V2 Maximum Voltage VG1V2(MAX) V1V2 = 0.9 V 9 15 V
G1V2 Minimum Voltage VG1V2(MIN) V1V2 = 1.5 V 0.7 1.0 V
G1V2 Output Impedance2ROUT(G1V2) 175
1V2 External FET Gate Capacitance2CISS1V2 250 3900 pF
Charge Pump (VCP)
VCP Output Voltage VCP VCP VIN 4.1 6.6 V
VCP Switching Frequency fSW(CP) 100 kHz
Continued on the next page…
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
7
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ELECTRICAL CHARACTERISTICS (continued) Valid at 5.5 V < VIN < 36 V, 40ºC < TJ < 150ºC; unless otherwise specified
Characteristic Symbol Test Conditions Min. Typ. Max. Unit
Continued on the next page…
Logic Enable Input (ENB)
ENB Logic Input Threshold VENB(H) VENB rising 2.0 V
VENB(L) VENB falling 0.8 V
ENB Logic Input Current1IENB(IN) VENB = 3.3 V 100 A
ENB Pulldown Resistance RENB –60–k
Ignition Enable Input (ENBAT) and Ignition Status Output (ENBATS)
ENBAT and ENBATS Thresholds
VIGN(H)
VIGN rising via a 1 k series resistance,
measure VIGN when IQ occurs 3.3 4.0 V
VIGN(L)
VIGN falling via a 1 k series resistance,
measure VIGN when IQ(SLEEP) occurs 2.2 2.7 V
ENBAT Input Current1IENBAT(IN)
VIGN = 5.5 V via a 1 k series resistance 50 100 A
VIGN = 0.8 V via a 1 k series resistance 0.5 5 A
ENBAT Input Resistance RENBAT 650 k
ENBATS Output Voltage VENBATS(L) IENBATS = 4 mA 400 mV
ENBATS Leakage Current1IENBATS(LKG) VENBATS = 3.3 V 1 A
ENBATS Turn-On Delay tENBATS Sleep mode to VENBATS = 3.3 V 11 ms
TRACK Input
TRACK Voltage Threshold VTRACK(H) VTRACK rising 2.0 V
VTRACK(L) VTRACK falling 0.8 V
TRACK Bias Current1ITRACK(BIAS) 100 A
NPOR Output
NPOR Power-Up Delay tNPOR CPOR = 0.22 F 20 ms
NPOR Output Voltage VNPOR(L)
VENB = high or VENBAT = high,
VREG < VREGUV(L) or V3V3 < V3V3UV(L)
,
INPOR 4mA
400 mV
VENBAT = low, VENB transitioning low,
VREG = 5.45 V, INPOR 0.3 mA,
0.8 V < V3V3 < err3V3
, 0°C TJ 150°C
350 800 mV
VENBAT = low, VENB transitioning low,
VREG = 5.45 V, INPOR 0.3 mA,
1.0 V < V3V3 < err3V3
, 40°C TJ 150°C
800 mV
NPOR Leakage Current1INPOR(LEAK) VNPOR = 3.3 V 1 A
CPOR Characteristics
CPOR Charge Current1ICPOR(SRC) 13 A
CPOR Voltage Threshold VCPOR(H) VCPOR rising 1.0 1.2 1.4 V
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
8
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ELECTRICAL CHARACTERISTICS (continued) Valid at 5.5 V < VIN < 36 V, 40ºC < TJ < 150ºC; unless otherwise specified
Characteristic Symbol Test Conditions Min. Typ. Max. Unit
NPOR Thresholds
VREG UVLO Thresholds VREGUV(H) VREG rising, NPOR transitions high 4.80 5.00 5.20 V
VREGUV(L) VREG falling, NPOR transitions low 4.75 4.94 5.14 V
VREG UVLO Hysteresis VREGUVHYS –60–mV
3V3 UVLO Thresholds V3V3UV(H) V3V3 rising, NPOR transitions high 2.80 2.95 3.10 V
V3V3UV(L) V3V3 falling, NPOR transitions low 2.83 V
3V3 UVLO Hysteresis V3V3UVHYS 125 mV
1V2 UVLO Thresholds
V1V2UV(H)
Measured as percentage of err1V2 ;
V1V2 rising, NPOR transitions high 85 89 93 %
V1V2UV(L)
Measured as percentage of err1V2 ;
V1V2 falling, NPOR transitions low –84–%
1V2 UVLO Hysteresis V1V2UVHYS –5–%
Buck (VREG) Current Protection
VREG ISEN Voltage Threshold VISEN(th) VISEN+ – VISEN– 265 350 435 mV
VREG Valley Current Limit ILIM(VALLEY) RSENSE = 300 m, VIN > VINSW(L) 883 1167 1450 mA
VREG Peak Current Limit ILIM(PEAK) 3.0 5.5 A
3.3 V Overcurrent Protection
3V3 Overcurrent Threshold VCL3V3 VREG – VCL3V3 210 235 280 mV
3V3 Current Limit I3V3LIM RCL3V3 = 300 m700 783 mA
3V3 Foldback Threshold I3V3FB V3V3 = 0 V, VREG – VCL3V3 48 65 90 mV
1.2 V/1.5 V/1.8 V Overcurrent Protection
1V2 Overcurrent Threshold VCL1V2 V1V2 = 1.2 V, V3V3 – VCL1V2 179 218 245 mV
1V2 Current Limit I1V2LIM RCL1V2 = 390 m459 559 mA
1V2 Foldback Threshold I1V2FB V1V2 = 0 V, V3V3 – VCL1V2 45 60 84 mV
5VP Overcurrent Protection
V5P Current Limit1IV5PLIM VV5P = 5 V 280 415 mA
V5P Foldback Current1IV5PFB VV5P = 0 V 70 110 150 mA
5V Overcurrent Protection
V5 Current Limit1IV5LIM VV5 = 5 V 215 310 mA
V5 Foldback Current1IV5FB VV5 = 0 V 74 92 135 mA
Thermal Protection
Thermal Shutdown Threshold TJTSD TJ rising 155 170 ºC
Thermal Shutdown Hysteresis TJTSDHYS –20–ºC
1For input and output current specifications, negative current is defined as coming out of the node or pin (sourcing), positive current is defined as
going into the node or pin (sinking).
2Ensured by design and characterization, not production tested.
3–20°C ensured by design and characterization, not production tested.
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
9
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Characteristic Performance
VREG Output versus Temperature TON versus Temperature
V5 Output versus Temperature V5P Output versus Temperature
3V3 Output versus Temperature 1V2 Output versus Temperature
5.40
5.41
5.42
5.43
5.44
5.45
5.46
5.47
5.48
5.49
5.50
-40 -20 0 20 40 60 80 100 120 140
VREG Output Voltage (V)
Temperature
(°C)
0
100
200
300
400
500
600
700
800
900
1,000
1,100
1,200
1,300
1,400
-40 -20 0 20 40 60 80 100 120 140
TON Pulse Width (ns)
Temperature
(°C)
7.5
13.5
27
35
4.95
4.96
4.97
4.98
4.99
5.00
5.01
5.02
5.03
5.04
5.05
-40 -20 0 20 40 60 80 100 120 140
V5 Output Voltage (V)
Temperature
(°C)
4.95
4.96
4.97
4.98
4.99
5.00
5.01
5.02
5.03
5.04
5.05
-40 -20 0 20 40 60 80 100 120 140
V5P Output Voltage (V)
Temperature
(°C)
3.27
3.28
3.29
3.30
3.31
3.32
3.33
-40 -20 0 20 40 60 80 100 120 140
3V3 Output Voltage (V)
Temperature
(°C)
1.190
1.195
1.200
1.205
1.210
1.215
1.220
-40 -20 0 20 40 60 80 100 120 140
1V2 Output Voltage (V)
Temperature
(°C)
V
IN
(V)
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
10
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ENBAT Start / Stop Thresholds versus Tempera ture ENABLE Start / Stop Thresholds versus Temperature
CPOR Charging Current versus Temperature ENBATS (Low) Voltage versus Temperature
VREG Valley Current Limit versus Temperature 1V2 and 3V3 Overcurrent Threshold versus Temperature
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
-40 -20 0 20 40 60 80 100 120 140
ENBAT Threshold (V)
Temperature (°C)
START
STOP
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-40-20 0 20406080100120140
ENABLE Threshold (V)
Temperature (°C)
START
STOP
10
11
12
13
14
15
16
-40 -20 0 20 40 60 80 100 120 140
CPOR Charging Current (uA)
Temperature (°C)
0
50
100
150
200
250
300
350
400
-40 -20 0 20 40 60 80 100 120 140
NPOR Voltage at 4 mA (mV)
Temperature (°C)
250
275
300
325
350
375
400
425
450
-40 -20 0 20 40 60 80 100 120 140
VREG Valley Current Limit (mV)
Temperature (°C)
180
190
200
210
220
230
240
250
260
270
-40 -20 0 20 40 60 80 100 120 140
Overcurrent Threshold (mV)
Temperature (°C)
1V2
3V3
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
11
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Functional Description
Overview
The A4407 contains a constant on-time (COT), buck switch-
ing pre-regulator with valley sensing current mode control, two
integrated 5 V linear regulators, and two N-channel FET drivers:
one for a 1.2 V, 1.5 V, or 1.8 V linear regulator, and the other for
a 3.3 V linear regulator. The COT converter maintains a constant
output frequency because the on-time is inversely proportional
to the supply voltage. As the input voltage decreases, the on-time
is increased, which maintains a relatively constant period and
frequency. Valley mode current control allows the converter to
achieve very short on-times because current is measured during
the off-time, so there is no requirement for blanking.
With very low input voltages, the buck switch transitions to a
100% duty cycle. This turns the buck switch on 100% of the time
(no switching), and allows the regulator to operate in dropout
mode.
The device is enabled via the logic level input (ENB) or the high
voltage ignition input (ENBAT). When the device is enabled,
the converter starts up under the control of a 10 ms internal soft
start ramp. The two enable inputs are logically ORed together, so
either of the inputs can be used to enable the device. Both inputs
must be low to disable the device.
Under light load conditions, the switch enters pulse-skipping
mode to ensure regulation is maintained. In order to accept a
wide input voltage range, the switcher period is extended when
either the minimum on- or off-time is reached, or when the input
supply is at either end of its range.
The A4407 features overcurrent protection on all regulators
including the VREG pre-regulator. The buck switch current
limit is determined by the selection of the sense resistor between
the ISENx pins. Output current from the internal 5 V and 5 V
protected linear regulators is also monitored, and if shorted the
outputs would fold back. The external FET drivers have current
limit sensing that can be used with a sense resistor to trigger
fold back protection.
Buck Dropout Mode
The topology of a COT timer is ideal for systems that have high
input voltages. Because current is measured during the off-time,
very short on-times can be achieved. With low input voltages,
the switcher must maintain very short off-times. To prevent
the switcher from reaching its minimum off-time, the switcher
is designed to enter a 100% duty cycle mode. This causes the
switcher to stop acting as a buck switch. The voltage at the
VREG pin then becomes simply the supply voltage minus the
drop across the buck switch and inductor. In this mode, maximum
available current may be lower, depending on ambient tempera-
ture and supply voltage while in dropout mode.
Soft Start
An internal ramp generator and counter allow the output voltages
to ramp up. This limits the maximum demand on the external
power supply by controlling the inrush current required to charge
the external capacitor and any DC load at startup. Internally,
the ramp is set to 10 ms typical. The following conditions are
required to trigger a soft start:
• ENBAT or ENB transition high, and
• There is no thermal shutdown (TSD = 0), and
• 3V3 voltage is below its undervoltage lockout (UV)
threshold, and
• 1V2 voltage is below its UV threshold, and
• VREG voltage is below its UV threshold
Buck Pulse Width (TON)
A resistor from the TON input to VIN sets the on-time of the
converter for a given input voltage. When the supply voltage
is between 8.6 and 31 V, the switcher period remains constant,
based on the selected value of RTON
. At voltages lower than
6.5 V, the switch is in dropout mode (100% duty cycle). Within
reasonable input voltage ranges, the period of the converter is
held constant. This results in a constant operating frequency
across the input supply range. More information on how to
choose RTON can be found in the Application Information section.
The formula to calculate the on-time resistor value is:
ton = ( RTON / VIN
) × 6.36 × 10–12 + 5 × 10–9 (ns) (1)
Buck Current Sense (ISEN+, ISEN–)
The sense inputs are used to sense the current in the buck regula-
tor free-wheeling diode during the off-time. The value of the
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
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sense resistor, RSENSE , between the ISENx pins, can be calcu-
lated from:
RSENSE = VISEN / ILIM(VALLEY) (2)
where VISEN is documented in the Electrical Characteristics table,
350 mV typical, and ILIM(VALLEY) is the lowest current measured
during the off-time.
It is recommended that the current sense resistor be sized so that,
at peak output current, the voltage at the ISEN– pin does not
exceed –0.75 V during PWM operation (that is, a transient condi-
tion). Because the diode current is measured when the inductor
current is at the valley, the average output current is greater than
the ILIM(VALLEY) value. The value for ILIM(VALLEY) should be:
I
LIM(VALLEY) = IOUT(avg) – 0.5 × IRIPPLE + K (3)
where IOUT(avg) is the average of all the regulator outputs cur-
rents, IRIPPLE is the inductor ripple current, and K is a design
margin allowing for component tolerances.
The peak current in the switch is simply:
IPEAK = ILIM(VALLEY) + IRIPPLE (4)
Information on how to calculate the ripple current is included in
the Application Information section.
Buck Overcurrent Protection
The converter utilizes pulse-by-pulse valley current limiting,
which is activated when the current through the sense resis-
tor (that is, the buck output current) is high enough to create
–350 mV at the ISEN pin. During an overload condition, the
switch is turned on for a period determined by the constant
on-time circuitry. The switch off-time is extended until the cur-
rent decays to the current limit value set by the selection of the
sense resistor, at which point the switch is allowed to turn-on
again. Because no slope compensation is required in this control
scheme, the current limit is maintained at a reasonably constant
level across the input voltage range.
Figure 1 illustrates how the current is limited during an overload
condition. The current decay (period with switch off) is propor-
tional to the output voltage. As the overload is increased, the out-
put voltage tends to decrease and the switching period increases.
LX Short Circuit Protection
If the LX node is shorted to ground, there would be a relatively
high peak current in the buck MOSFET within a very short time.
The A4407 protects itself by detecting the unusually high current,
turning off the buck MOSFET, and latching itself off. To avoid
false tripping, the current required to activate the peak current
protection, ILIM(PEAK) , 5.5 A typical, is set well above the normal
range of currents. After peak current limiting is activated, the
A4407 will be latched off until either: VIN is cycled below its
UVLO threshold, or the A4407 is disabled (both ENBAT and
ENB must be brought low) and re-enabled. NPOR is not directly
activated (pulled low) by the peak current protection circuitry.
However, NPOR will be in the correct state depending on the
VREG, 3V3, and 1V2 outputs.
Time
Current Limit level
Current Limit level
Inductor CurrentInductor Current
Constant On-Time
Constant Period
Extended Period
Maximum load
Overload
Time
Constant On-Time
Figure 1. Buck current limiting during overload conditions: (upper) with
inductor current operating at maximum load, and (lower) inductor current
operating in a “soft” overload.
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
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Missing Asynchronous Diode Protection
In most high voltage asynchronous buck regulators, if the asyn-
chronous diode is missing or damaged the LX pin will transition
to a very high negative voltage when the upper MOSFET turns
off, resulting in damage to the regulator. The A4407 includes pro-
tection circuitry to detect when the asynchronous diode is missing
or damaged. If the LX pin becomes more negative than 1.6 V at
25°C for more than 157 ns, the A4407 will latch itself in the off
state to prevent damage. After a missing diode fault occurs, the
latch must be reset by either cycling VIN or ENBAT or ENB. See
figure 2 for the missing diode voltage threshold and time filtering
versus temperature.
Thermal Shutdown
If the A4407 junction temperature becomes too high, a thermal
shutdown circuit would disable the VREG output, thus protect-
ing the A4407 from damage. When a thermal shutdown occurs,
the buck regulator stops switching and the VREG voltage decays.
When VREG crosses UVLO threshold for it, the NPOR signal is
pulled low. Thermal shutdown is not a latched condition, so when
the junction temperature cools to an acceptable level, the A4407
automatically restarts.
Power On Reset (NPOR)
The NPOR output is an open drain pin that can be used to signal
a reset event to a DSP or microcontroller. The NPOR block
actively monitors ENBAT, ENB, 3V3, 1V2, VCP, and VREG.
During power-up, NPOR is held low for a programmable amount
of time ( tNPOR
) after VREG, 3V3, and 1V2 all transition above
the upper UVLO threshold for each. The rising edge delay allows
time for the regulators to be within specification when the DSP or
microcontroller begins processing. The amount of the rising edge
delay is determined by the value of the external capacitor from
the CPOR pin to ground. The rising delay can be calculated from
the following equation:
tNPOR = 92.3 × 103 × CPOR (seconds) (5)
Any of the following conditions forces NPOR to transition low
immediately (within a few microseconds):
• 3V3 voltage falls below its UVLO threshold, or
• 1V2 voltage falls below its UVLO threshold, or
• VREG voltage falls below its UVLO threshold, or
• ENBAT and ENB are both low, or
• Charge pump voltage, VCP
, is too low, or
• Internal IC power rail voltage, VRAIL , is too low
When a thermal shutdown (TSD) occurs: PWM switching termi-
nates; VREG, or 3V3, or 1V2 decay below the UVLO threshold
for it; and NPOR transitions low. Thus, a TSD event indirectly
causes NPOR to transition low.
When the A4407 is disabled (ENB and ENBAT are both low or
VIN is removed) the NPOR output is held low until the voltage
from the 3.3V regulator (3V3) falls below 1.0 V (see figure 3).
This assumes maximum initial current (4 mA) in the NPOR open
drain DMOS. The NPOR voltages would be somewhat lower for
lower values of INPOR
.
Figure 3. NPOR and 3V3 shutdown characteristics
Figure 2. Missing diode protection versus device junction temperature
ENB, ENBAT
V3V3
INPOR
VNPOR
3.3 V
1.0 V
0.3 mA
800 mV
4mA
350 mV TYP
400 mV
120
130
140
150
160
170
180
190
200
210
1.10
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
-50 -25 0 25 50 75 100 125 150
Time Filtering (ns)
NegaƟve Voltage Threshold (V)
JuncƟon Temperature (°C)
Voltage Threshold
Time Filtering
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
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5 V Regulator (V5)
The 5V linear regulator is provided to supply local circuitry. This
regulator can deliver 310 mA typical, 215 mA minimum. When
a direct short is applied to this regulator, the output current folds
back to 0 V at approximately 92 mA typical (figure 4).
5 V Protected Tracking Regulator (V5P)
The 5VP linear tracking regulator is provided to supply remote
circuitry such as off-board sensors. The output is monitored and
in case of a short to battery condition the output is disabled and
protected until the short is removed. The regulator can deliver
415 mA typical, 280 mA minimum. When a direct short is
applied to this regulator, the output the current folds back to 0 V
at approximately 110 mA typical (figure 5).
The V5P regulator is designed to track the either the 3V3 output
or the V5 output. The V5P master reference is set by the status of
the TRACK pin. The V5P regulator will track the 3.3V output to
within ±0.5% and the V5 output to within ±25 mV under normal
steady state operating conditions. If the master reference (either
3V3 or V5) is decreasing, the V5P regulator will accurately
track the master reference down to the point at which the master
reference crosses its undervoltage threshold (either V3V3UV(L) or
V1V2UV(L) in the Electrical Characteristic tables).
6
5
4
3
2
1
0
50 100 150 200 250 300 350 500450400
Output Voltage (V)
Output Current (mA)
Typical
Minimum
Figure 5. Fold back current limiting of the 5VP regulator
Figure 4. Fold back current limiting of the 5 V regulator
6
5
4
3
2
1
0
50 75 100 125 150 175 200 225 250 275 300 325 350 375 400
Output Voltage (V)
Output Current (mA)
Typical
Minimum
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
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Allegro MicroSystems, LLC
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Figures 6 and 7 show the A4407 operation when the V5P pin is
shorted to ground and VIN (battery). In both cases, the V5P output
is disabled and/or disconnected while the other outputs (VREG,
V5, V33, and 1V5) remain active.
Tracking Control
The TRACK input sets the master reference for the V5P track-
ing regulator. TRACK is meant to be either connected to ground
or left unconnected by the PCB routing. When TRACK is left
unconnected, it is pulled high by an internal current source and
V5P tracks the 3V3 regulator. When TRACK is connected to
ground, then V5P tracks the V5 regulator.
3V3 Linear Regulator (3V3)
A 3.3 V linear regulator can be implemented using an external
MOSFET. In the event the 3.3 V regulator output is shorted to
ground, the A4407 protects the external MOSFET by folding
back when the programmed current limit, I3V3LIM
, is exceeded.
The current limit is determined by the voltage developed across
the external sense resistor, RCL1
, shown in the Functional Block
diagram. The 3.3 V regulator current limit can be calculated using
the following formula:
I3V3LIM =VCL3V3 / RCL1 (6)
where VCL3V3 is documented in the Electrical Characteristics
table, 235 mV typical. Usually, RCL1 has a fairly low value so it
will not dissipate significant power (1/4 W should be adequate)
but the tolerance should be 1% or less. When I3V3LIM is exceeded,
the maximum load current through the external MOSFET is
folded back to 27% typical of I3V3LIM as shown in figure 8.
3.5
3.0
2.5
2.0
1.5
1.0
05
0
50 10 20 30 40 50 60 12090 100 1108070
Output Voltage (V)
Percentage of Normal Current Seng (%)
Typical
Minimum
Maximum
Figure 8. Fold back current limiting of the 3V3 regulator
Figure 6. V5P shorted to ground in 5 s (DV5P is populated); shows VREG
(ch1, 2 V/div.), V3V3 (ch2, 1 V/div.), VV5 (ch3, 2 V/div.), V1V5 (ch4, 1 V/div.),
VV5P (ch5, 2 V/div.), t = 10 s/div.
t
VREG
V3V3
VV5
V1V5
VV5P
C1
C3
C5
C4
C2
Figure 7. V5P is shorted to a 25 V battery; shows VVREG (ch1, 2 V/div.),
V3V3 (ch2, 2 V/div.), VIN pin (ch3, 5 V/div.), VV5P (ch4, 5 V /div.),
t = 10 s/div.
t
V3V3
VREG
VV5P
5 V
25 V
30 V
VIN pin
Ringing due to parasitics from a long wire
V5P is clamped to a safe level above VIN
by D2 (see application schematic)
All
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
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Allegro MicroSystems, LLC
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1.2 V/1.5 V/1.8 V Linear Regulator (1V2)
A 1.2 V, 1.5 V, or 1.8 V linear regulator can be implemented using
an external MOSFET. In the event this regulator output is shorted
to ground, the A4407 protects the external MOSFET by folding
back when the programmed current limit, I1V2LIM
, is exceeded.
The current limit is determined by the voltage developed across
the external sense resistor, RCL2 , shown in the Functional Block
diagram. The 1.2 V/1.5 V/1.8 V regulator current limit can be
calculated using the following formula:
I1V2LIM = VCL1V2 / RCL2 (7)
where VCL1V2 is documented in the Electrical Characteristic
table, 218 mV typical. Usually RCL2 has a fairly low value so it
will not dissipate significant power (1/4W should be adequate) but
the tolerance should be 1% or less. When I1V2LIM is exceeded, the
maximum load current through the external MOSFET is folded
back to 27% typical of I1V2LIM , as shown in figure 9.
This regulator is designed to provide 1.2 V, but by using an exter-
nal resistive divider between VOUT1V2 and the 1V2 pin, other
voltages can be achieved, such as1.5 V or 1.8 V.
Charge Pump
The charge pump is used to generate a supply above VIN . A
0.22 μF monolithic ceramic capacitor should be connected
between VCP and VIN to act as a reservoir to run the internal
DMOS and the external MOSFETs. The VCP voltage is internally
monitored to ensure that the switching regulator would be dis-
abled in the case of a fault condition. A 0.22 μF ceramic mono-
lithic capacitor should be connected between CP1 and CP2.
ENBAT
ENBAT is a level-triggered enable input, used to enable the
device based on a high voltage ignition or battery switch (via a
1 kΩ resistor). The ENBAT comparator thresholds are VIGN(L) =
2.2 V minimum and VIGN(H) = 4.0 V maximum. ENBAT is used
only as a momentary switch to enable, or wake up, the A4407.
The ENB and ENBAT signals are logically ORed together inter-
nally, so individually either can wake up the A4407, that is, only
one of these two inputs must be pulled high in order to enable the
A4407. However, when ENBAT is removed, ENB must be high
to keep the A4407 enabled. If there is no need for the ignition
switch, ENBAT can be pulled low, making ENB a single reset
control. Power-up and power-down scenarios using these inputs
are shown in figures 10 and 11.
When an external resistor and capacitor are used to form a
low-pass filter to the ENBAT pin, then a 100 Ω resistor must be
used to prevent the external capacitor from discharging into and
damaging the ENBAT pin. See the Functional Block diagram for
connection of these three components.
ENBATS
When a logic high is sensed on the ENBAT input, the ENBATS
open drain output goes high, signaling to the user that the ignition
input is high. When a logic low is sensed on the ENBAT input,
then ENBATS transitions low. The ENBATS input logic levels
are identical to the ENBAT input logic levels.
ENB
This pin can be used as an enable input from either a DSP or a
microcontroller. This input has an internal pull down resistor so it
can be left unconnected if not needed.
Figure 9. Fold back current limiting of the 1V2 regulator
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50 10 20 30 40 50 60 12090 100 1108070
Output Voltage (V)
Percentage of Normal Current Seng (%)
Typical
Minimum
Maximum
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
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Worcester, Massachusetts 01615-0036 U.S.A.
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Figure 10. Typical power-up and power-down by ENBAT and ENB with VIN = 13.5 V; ENBATS is assumed to be connected to 3V3 via a pull up resistor
VIN
NPOR
CPOR
ENBATS
ENBAT
ENB
V5
V5P
3V3
Internal
V
RAIL
or VCP
VREG
V
H
=4.0V
V
L
=2.2V
10 ms
20 ms
1. 2 V
13.5 V
V
H
=5.00V
V
H
=2.95V
Clamped at 8.5 V via 1 k
V
L
=4.94V
V
L
=2.83V
V
H
=2V
V
L
=0.8V
Internal
UVLO
1.0 V
0.8 V
MAX
Internal
UVLO
1V2
V
H
=1.07V
V
L
=1.01 V
VREG > 5.00V and
3V3 > 2.95V and
1V2 > 1.07V
ENB < 0.8V or
VREG < 4.94V or
3V3 < 2.83V or
1V2 < 1.01V or
VCP low or
INT. VRAIL low
NPOR is open-drain, pulled up to 3V3
Decay rates of VREG, V5, V5P,
3V3, and 1V2 depend on output
capacitances and loading
ENBATS is open-drain, pulled up to 3V3
V5, V5P, 3V3, 1V2 ramp
at approximately the
same rate as VREG
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
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VIN
NPOR
CPOR
ENBATS
ENBAT
ENB
V5
V5P
3V3
Internal
V
RAIL
or VCP
VREG 10 ms
20 ms
1. 2 V
13.5 V
V
H
=5.00V
V
H
=2.95V
V
L
=4.94V
V
L
=2.83 V
6.5 V
Internal
UVLO
5.2 V 5.5 V 4.9 V
V
ENBAT
= 0V
ENBATS is not connected
100 % Duty
Cycle
Internal regulators
collapse
0.8 V
MAX
1.0 V
Internal
UVLO
1V2 V
H
=1.07V V
L
=1.01 V
V
ENB
2V prior to
V
IN
ramping up
VREG > 5.00V and
3V3 > 2.95V and
1V2 > 1.07V
ENB < 0.8V or
VREG < 4.94V or
3V3 < 2.83V or
1V2 < 1.01V or
VCP low or
VRAIL low
V5P tracks 3V3 until
V
3V3UV(L)
or V
IN
< 5.5 V
V5, V5P, 3V3, 1V2 ramp at
approximately the same
rate as VREG
NPOR is open-drain, pulled up to 3V3
Decay rates of VREG, V5, V5P,
3V3, and 1V2 depend on output
capacitances and loading
Figure 11. Typical power up and power down via VIN with ENB always logic high; ENBAT and ENBATS are not used
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
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Component Selection
Buck On-Time and Switching Frequency
In order for the switcher to maintain regulation, the energy that is
transferred to the inductor during the on-time must be transferred
to the capacitor during the off-time. Because of this relationship,
the load current and IR drops, as well as the input and output
voltages, affect the on-time of the converter. The equation that
governs switcher on-time is:
=
tON VIN + Vf – (RDS(on) × Ipeak)
TSW [VREG + (RL × Ipeak) +Vf + (RSENSE × Ip
e
(8)
The effects of the voltage drop on the inductor and trace resis-
tance affect the switching frequency. However, the frequency
variation due to these factors is small, and is covered in the varia-
tion of the switcher period, which is ±25% of the target. Remov-
ing these current dependant terms simplifies the equation:
= ×
tON VIN + Vf – (RDS(on) × Ipeak)fSW
VREG + Vf + (RSENSE × Ipeak)1
(9)
Be sure to use worst-case sense voltage and forward voltage
of the diode including any effects due to temperature. For the
example provided, assume a 1 A converter with a supply voltage
of 13.5 V. The output voltage is 5.45 V, Vf is 0.45 V, RSENSE ×
Ipeak is 0.34 V, RDS(on) × Ipeak is 0.15 V, and the target frequency
is 2.2 MHz. Applying equation 9, we can solve for tON:
=
=
×
tON 13.5 (V) + 0.45 (V) – 0.15 (V)
205 ns
2.2 (MHz)
5.45 (V) + 0.45 (V) + 0.34 (V) 1
The formulas above describe how tON changes based on input and
load conditions. Because load changes are minimal and the out-
put voltage is fixed, the only factor that affects the on-time is the
input voltage. The converter is able to maintain a constant period
over a varying supply voltage because the on-time changes based
on the input voltage. The current into the TON pin is derived
from a resistor tied to VIN, which sets the on-time proportional to
the supply voltage. Selecting the resistor value based on the tON
calculated above is done using the following formula:
=
RTON
VIN × (tON 5 (ns)
)
6.36 × 10–12
(10)
When the resistor is selected and a suitable tON is found, tON must
be demonstrated that it does not, under worst-case conditions,
exceed the minimum on-time or minimum off-time of the con-
verter. The minimum on-time occurs at maximum input voltage
and minimum load. The maximum off-time occurs at minimum
supply voltage and maximum load. For supply voltages above
6.5 V but below 8.6 V, refer to the section entitled Low Voltage
Operation.
Low Voltage Operation
The converter can run at very low input voltages; for example,
with a 5.25 V output, the minimum input supply can be as low
as 5.5 V. When operating at high frequencies, the on-time of the
converter must be very short because the available period is short.
At high input voltages the converter should not violate the mini-
mum on-time, tON(min)
, and at low input voltages the converter
should not violate the minimum off-time, tOFF(min)
. Rather than
limit the supply voltage range, the converter solves this problem
by automatically increasing the period. With the period extended,
the converter does not violate the minimum on-time or off-time
specifications. If the input voltage is between 8.6 and 31 V, the
converter will maintain a constant period. When calculating worst
case on- and off-times, make sure to use the highest switching
frequency if the supply voltage is in that range.
When operating at voltages below 8.6 V, additional care must
be taken when selecting the inductor and diode. At low voltages
the maximum current may be limited, due to the IR drops in the
current path. When selecting external components for low voltage
operation, the IR drops must be considered when determining
on-time, so the complete formula (equation 8) should be used to
make sure the converter does not violate the timing specification.
Inductor Selection
Choosing the proper inductor is critical to the correct operation of
the switcher. The converter is capable of running at frequencies
above 2 MHz, making it possible to use small inductor values and
reducing cost and board area.
The inductor value determines the ripple current. It is important
to size the inductor so that under worst-case conditions the over-
current threshold equals the average current minus half the ripple
current plus reasonable margin. When the ripple current is too
large, the converter reaches current limit. Typically, peak-to-peak
ripple current should be limited to 20% to 25% of the maximum
average load current.
Application Information
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
20
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Worst-case ripple current occurs at maximum supply voltage.
After calculating the duty cycle for this condition, the ripple cur-
rent can be calculated:
=
DVIN(max) + Vf – (RDS(on) × Ipeak)
VREG + Vf + (RSENSE × Ipeak)
(11)
Using the duty cycle, the inductor value can be calculated using
the formula below:
= × ×
LD
Iripple
VIN fSW (min)
VREG 1
(12)
Where Iripple is 25% of the maximum load current, and fSW(min)
is the minimum switching frequency, nominal frequency minus
25%. Continuing the example used above (using equation 9), a
1 A converter with a supply voltage of 13.5 V is the design objec-
tive. Assume the supply voltage can vary by ±10%, the output
voltage is 5.45 V, Vf is 0.5 V, VSENSE is 0.20, and the target fre-
quency is 2.2 MHz. Using equation 11, the duty cycle is calcu-
lated to be 36.45%. Assume the worst-case frequency is 2.2 MHz
minus 20%, or 1.76 MHz. Using these numbers in equation 12
shows that the minimum inductance for this converter is 9.6 μH.
Output Capacitor
The buck converter is designed to operate with a low-ESR
ceramic output capacitor. When choosing a ceramic capacitor,
make sure the rated voltage is at least 3 times the maximum
output voltage of the converter. This is because the capacitance of
a ceramic decreases the closer it is operated to its rated voltage. It
is recommended that the output be decoupled with a 10 μF, 16 V,
X7R ceramic capacitor. Larger capacitance may be required on
the outputs if load surges dramatically influence the output volt-
age.
Output voltage ripple is determined by the output capacitance;
and the effects of ESR and ESL can be ignored, assuming recom-
mended layout techniques are followed. The output voltage ripple
is approximated by:
Vripple = Iripple / (8 × fsw × COUT) (13)
Input Capacitor
The value of the input capacitance affects the amount of cur-
rent ripple on the input. This current ripple is usually the source
of supply-side EMI. The amount of interference depends on the
impedance from the input capacitor and the bulk capacitance
located on the supply bus. In addition to the two 4.7 μF capaci-
tors, placing a small 0.1 μF ceramic capacitor very close to the
input supply pin helps reduce EMI effects. The small capacitor
helps reduce the very high frequency transient currents on the
supply line.
Non-Synchronous Diode
The non-synchronous diode (DBUCK in the Functional Block dia-
gram) conducts the current during the off-time. A Schottky diode
is required to minimize the forward drop and switching losses. In
order to size the diode correctly, it is necessary to find the aver-
age diode conduction current using the following formula:
ID(avg) = I load × (1 – D(min
)) (14)
where D(min) is the minimum duty cycle, defined as:
D(min
) = (VREG + Vf ) / (VIN + Vf ) (15)
where VIN is the maximum input voltage and Vf is the maximum
forward voltage of the diode.
The average power dissipation in the diode is:
PDBUCK(avg) = IBUCK(avg) × D(min
) × Vf (16)
The power dissipation in the sense resistor must also be consid-
ered using I2R and the minimum duty cycle.
External MOSFET Selections
To choose an external MOSFET for the 3.3 V or for the
1.2 V/1.5 V/1.8 V linear regulator, consider: the maximum drain-
to-source voltage, VDS
, the maximum continuous drain current,
ID , the threshold voltage, VGSTH
, the on-resistance (RDS(on)(FET)),
and the thermal resistance (RJC(FET)).
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
21
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
The buck switcher pre-regulates the voltage to the external
MOSFET, so even under worst-case conditions, it does not have
to support more than 7 V from drain to source. Also, the external
LDOs usually deliver 500 mA to 1 A. Numerous MOSFETs are
available, with VDS ratings of at least 20 V, that can support much
more than 1A. These two goals should not be difficult to achieve.
The A4407 gate drive circuitry is guaranteed to pull the G3V3
and G1V2 voltage down to 1 V, maximum. Therefore, Allegro
recommends using external MOSFETs with a VGS threshold
higher than 1 V. Do not use a MOSFET that will conduct signifi-
cant current when VGS is at 1 V and the system is at the highest
expected ambient temperature.
One of the more critical specifications is the MOSFET on-
resistance, RDS(on)(FET). If the on-resistance were too high, then
the external regulator would not be able to maintain its output at
the maximum load current. Calculate the typical RDS(on)(FET) (at
25°C) using the following formula:
<–
RDS(on)(FET)25C RDROP1
0.6 × I3V3LIM
1.56 (V)
(17)
where I3V3LIM is the maximum current from the 3.3 V regula-
tor and RDROP1 is the value of the resistor connected from the
CL3V3 pin to the drain of the MOSFET. The multiplier of 0.6
in the equation allows a 66% increase in RDS(on)(FET) when the
MOSFET is very hot.
The necessity and value of RDROP1 is closely related to the
thermal resistance of the MOSFET, RJC(FET) . For a medium size
MOSFET (like a SOT-223) including RDROP1 in the PCB layout
is highly recommended. For a large size MOSFET with a very
low thermal resistance (like a D2PAK) RDROP1 is probably not
necessary.
The thermal resistance of a MOSFET is a function of die size,
package size, and cost. So choosing RDROP1 and RJC(FET)
together should result in optimal performance, minimal compo-
nent sizes, and lowest system cost. Determining the value and
power dissipated by the series dropping resistor and MOSFET
thermal resistance are addressed in detail in the next section.
3.3V Regulator External Resistors (RCL1, RDROP1)
In the Functional Block diagram, there are two resistors, RCL1
and RDROP1 from the output of the buck regulator to the drain
of the 3.3 V external MOSFET. RCL1 must always be pres-
ent because it sets the 3.3 V regulator current limit threshold.
However, RDROP1 , if used, prevents the external MOSFET from
dissipating too much power during certain conditions. In particu-
lar, when the battery voltage is extremely low (VBAT 6.5 V) and
the buck regulator transitions to dropout mode (100% duty cycle)
then VREG is approximately 1 V higher than normal. In this situ-
ation, without RDROP1
, the MOSFET could dissipate too much
power.
The value of RDROP1 depends on the maximum PCB temperature,
the maximum current load on the 3.3 V regulator, the maximum
allowable junction temperature of the MOSFET, and the thermal
resistance of the MOSFET. The 3.3 V regulator must conduct its
own load current (250 mA in the Functional Block diagram) plus
the load planned for the 1.2 V/1.5 V/1.8 V regulator (450 mA to
525 mA in the Functional Block diagram).
As the thermal resistance of the MOSFET decreases, the required
value of RDROP1 also decreases. If the MOSFET is relatively
large and has a very low thermal resistance then RDROP1 is not
required (0 Ω).
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
22
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Figure 12 shows recommended values of RDROP1 versus the
MOSFET thermal resistance at various 3.3 V regulator maxi-
mum current settings, I3V3LIM . This graph assumes: steady-state
operation (that is, for t >> 50 ms), a PCB temperature of 135°C, a
maximum MOSFET junction temperature of 175°C, a duty cycle
for tON of 100% , a VBAT of 6.69 V, and an output of 3.23 V from
the 3.3 V linear regulator. This graph takes into account the volt-
age drop across the 3.3 V current limit resistor, RCL1.
After a value for RDROP1 is determined, the designer should
calculate its maximum power dissipation (I2 × R) and select
an appropriate component, allowing adequate design margin.
Assuming the RDROP1 value was chosen from figure 12, then
figure 13 shows the power dissipated by RDROP1 versus the
MOSFET thermal resistance at various 3.3 V regulator current
settings.
The exact value of RDROP1 is not critical, so a component with
1% or 5% tolerance could be used.
1.2 V/1.5 V/1.8 V Regulator External Resistors
(RCL2, RDROP2)
In the Functional Block diagram, there are two resistors, RCL2
and RDROP2 from the output of the 3.3 V regulator to the drain
of the 1.2 V/1.5 V/1.8 V external MOSFET. RCL2 must always
be present because it sets the 1.2 V/1.5 V/1.8 V regulator current
limit threshold. However, RDROP2
, if used, prevents the external
MOSFET from dissipating too much power.
The value of RDROP2 depends on the maximum PCB temperature,
the maximum current load on the 1.2 V/1.5 V/1.8 V regulator
(I1V2LIM), the maximum allowable junction temperature of the
MOSFET, and the thermal resistance of the MOSFET.
As the thermal resistance of the MOSFET decreases, the required
value of RDROP2 also decreases. If the MOSFET is relatively
large and has a very low thermal resistance, then RDROP2 is not
required (0 Ω).
Figure 12. RDROP1 value versus 3.3 V MOSFET thermal resistance
at various 3.3 V regulator maximum current settings
Figure 13. RDROP1 power dissipation versus 3.3 V MOSFET thermal
resistance at various 3.3 V regulator maximum current settings
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
15 20 25 30 35 40 45 806560 70 755550
PD(RDROP2) (W)
MOSFET Thermal Resistance (°C/W)
635 mA
710 mA
785 mA
850 mA
935 mA
3.0
2.8
2.5
2.3
2.0
1.8
1.5
1.3
1.0
0.8
0.5
0.3
0
15 20 25 30 35 40 45 806560 70 755550
R
DROP1
(Ω)
MOSFET Thermal Resistance (°C/W)
635 mA
710 mA
785 mA
850 mA
935 mA
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
23
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Figure 14 shows recommended values of RDROP2 versus
MOSFET thermal resistance at various 1.5 V regulator maximum
current settings, I1V2LIM . This graph assumes a PCB temperature
of 135°C, a maximum MOSFET junction temperature of 175°C,
and 3.37 V from the upstream (3.3 V) linear regulator. This graph
takes into account the voltage drop across the 1.5 V current limit
resistor, RCL2
.
After a value of RDROP2 is determined the designer should calcu-
late its maximum power dissipation (I2 × R) and select an appro-
priate component, allowing adequate design margin. Assuming
the RDROP2 value was chosen from figure 14, then figure 15
shows the power dissipated by RDROP2 versus the MOSFET ther-
mal resistance at various 1.5 V regulator current settings.
The exact value of RDROP2 is not critical, so a component with
1% or 5% tolerance could be used.
2.0
1.8
1.5
1.3
1.0
0.8
0.5
0.3
0
30 35 40 45 80 85 90 95 1006560 70 755550
R
DROP2
(Ω)
MOSFET Thermal Resistance (°C/W)
675 mA
600 mA
525 mA
450 mA
375 mA
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
P
D(RDROP2)
(W)
MOSFET Thermal Resistance (°C/W)
30 35 40 45 80 85 90 95 1006560 70 755550
675 mA
600 mA
525 mA
450 mA
375 mA
Figure 14. RDROP2 value versus 1.5 V MOSFET thermal resistance
at various 1.5 V regulator maximum current settings
Figure 15. RDROP2 power dissipation versus 1.5 V MOSFET thermal
resistance at various 1.5 V regulator maximum current settings
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
24
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
PCB Component Placement and Routing
The board layout has a large impact on the performance of the
device. It is important to isolate high current ground returns to
minimize ground bounce that could produce reference errors in
the device. The method used to isolate power ground from noise
sensitive circuitry is to use a star ground. This approach makes
sure that the high current components such as the input capacitor,
output capacitor, and diode have very low impedance paths to
each other. Figure 16 illustrates the technique.
The ground traces for each of the components should be very
close to each other and should be connected to each other on the
same surface as the components. Internal ground planes should
not be used for the star ground connection, because vias add
impedance to the current path.
In order to further reduce noise effects on the PCB, noise sensi-
tive traces should not be connected to internal ground planes.
The feedback network from the switcher output should have an
independent ground trace that goes directly to the exposed pad
underneath the device. The exposed pad should be connected to
internal ground planes and to any exposed copper used for heat
dissipation. If the grounds from the device are also connected
directly to the exposed pad, the ground reference from the feed-
back network will be less susceptible to noise injection or ground
bounce.
To reduce radiated emissions from the high frequency switching
nodes, it is important to have an internal ground plane directly
under the LX node. That ground plane should not be broken
directly under the node, because the lowest impedance path back
to the star ground is directly under the signal trace. If another
trace does break the return path, the energy would have to find
another path, which would be through radiated emissions.
The peak-to-peak amplitude of the buck current sense signal
will typically be only tens of millivolts. The current sense pins,
ISEN+ and ISEN–, and internal differential amplifier comprise a
differential signal receiver, and balanced pair of traces should be
routed from the pins of the buck current sense resistor, RSENSE ,
as shown in figure 17 (upper panel). The ISEN+ pin and the sense
resistor ground should not be separated by simply using local via
connections to the ground plane (figure 17 lower panel). Incorrect
routing of the ISEN+ pin would likely add an offset error to the
buck current sense signal.
Star Ground
LX
Q1
A4407
DBUCK Current path
(off-cycle)
Current path (on-cycle)
RSENSE
L1
VIN
CIN
RLOAD
COUT1
Figure 16. Illustration of star ground connection
Figure 17. Comparison of routing paths for the traces between the
A4407 ISEN+ and ISEN– traces and the sense resistor, RSENSE
LX
ISEN
ISEN+
A4407
Differential
Amplifier DBUCK
(Asynchronous)
RSENSE
L1
+
LX
ISEN
ISEN+
Ground plane
A4407
Differential
Amplifier DBUCK
(Asynchronous)
RSENSE
L1
+
Correct routing of ISEN+ and ISEN– traces
(direct on same plane)
Incorrect routing of ISEN+ and ISEN– traces
(using vias to a ground plane)
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
25
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Application Circuit Performance
Application schematic is shown in Functional Block diagram.
B
uc
k
R
egu
l
a
t
or
B
o
d
e
Pl
o
t
s
At ILOAD = 215 mA and 1.1 A
60
65
70
75
80
85
90
95
0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.10
Eciency (%)
Output Current, I
OUT
(A)
-0.50
-0.45
-0.40
-0.35
-0.30
-0.25
-0.20
-0.15
-0.10
-0.05
0.00
0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.10
Drop (%)
Output Current, I
OUT
(A)
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.000 0.100 0.200 0.300 0.400 0.500
VOUT Percentage
VOUT Percentage
Drop (%)
Output Current, I
OUT
(A)
B
uc
k
R
egu
l
a
t
or
(VREG)
Effi
c
i
ency
Buck Regulator (VREG) Load Regulation Linear Regulator Load Regulation
V
IN
= 8 V
V
IN
= 12 V
V
IN
= 16 V
V
IN
= 8 V
V
IN
=
12
V
V
IN
= 16 V
V5
V5P
3V3
1V5
Frequency (kHz)
Phase (°)
Gain (dB)
103
10010110–1
60
48
36
24
12
0
-12
-24
-36
-48
-60
200
160
120
80
40
0
-40
-80
-120
-160
-200
Gain 215 mA
Gain 1.1 A
Gain Margin 15 dB
Phase 215 mA
Phase Margin 215 mA (46°)
Phase Margin 1.1 A (51°)
Phase 1.1 A
Gain 0 dB ( 65 kHz)
Bill of Materials for Critical Components
This design is capable of full load, 135°C ambient, and 5.5 VBAT indefinitely with an adequate thermal solution
Component Description Package Manufacturer Part Number
Q3V3 MOSFET, 40 V, 90 A, 4.3 m, TJ 175°C DPAK Infineon IPD90N04S3-04
Q1V5 MOSFET, 30 V, 30 A, 13.5 , TJ 175°C DPAK Infineon IPD135N03LG
RSENSE
, RCL1 Resistor, 0.300 , 1/4 W, 1% 1206
RCL2 Resistor, 0.390 , 1/4 W, 1% 1206
RDROP1 Resistor, 2.2 total, 2 W total, 5% Multiple SMT components may be used in parallel or series
RDROP2 Resistor, 1.5 , 1 W, 5% 2512 Vishay/Dale CRCW25121R50JNEG
CIN1
, CIN2 Capacitor, Ceramic, 4.7 F, 50 V, 10%, X7R 1210 Murata GCM32ER71H475KA55L
C
OUT1 Capacitor, Ceramic, 10 F, 16 V, 10%, X7R 1206 Kemet C1206C106K4RACTU
C
OUT2 Capacitor, Ceramic, 0.47 F, 16 V, 10%, X7R 0603
COUT3V3, COUT1V5, COUTV5, COUTV5P Capacitor, Ceramic, 2.2 F, 16 V, 10%, X7R 1206 Murata GRM31MR71C225KA35L
DBUCK , DIN Diode, Schottky, 2 A, 40 V SMA Diodes, Inc. B240A-13-F
L1 Inductor, 10 H, 64 m, 2.39 Asat
, 165°C 7.6 x 7.6 mm Cooper/Bussman DRA73-100-R
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
26
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Startup at VBAT = 13.5 V; shows VREG (ch1, 2 V/div.), V3V3 (ch2, 2 V/div.),
V1V5 (ch3, 1 V/div.), NPOR (ch4, 2 V /div.), t = 5 ms/div.
t
V3V3
V1V5
NPOR
VREG
C1
C3
C4
C2
PWM at VBAT = 12 V with a 25 mA load; shows VREG (ch1, 5 V/div.),
VLX (ch2, 5 V/div.), IL (ch3, 100 mA/div.), t = 2 s/div.
t
VREG
VLX
IL
C1
C3
C2
PWM at VBAT = 12 V with a 1.0 A load; shows VREG (ch1, 5 V/div.),
VLX (ch2, 5 V/div.), IL (ch3, 100 mA/div.), t = 200 ns/div.
t
VREG
VLX
IL
C1
C3
C2
Startup at VBAT = 13.5 V; shows VREG (ch1, 2 V/div.), VV5 (ch2, 2 V/div.),
VV5P (ch3, 2 V/div.), NPOR (ch4, 2 V /div.), t = 5 ms/div.
C1
C3
C4
C2
t
VV5
VV5P
NPOR
VREG
Startup at VBAT = 6.5 V; shows VREG (ch1, 2 V/div.), VV5 (ch2, 2 V/div.),
VV5P (ch3, 2 V/div.), NPOR (ch4, 2 V /div.), t = 5 ms/div.
C1
C3
C4
C2
t
VV5
VV5P
NPOR
VREG
Startup at VBAT = 6.5 V; shows VREG (ch1, 2 V/div.), V3V3 (ch2, 2 V/div.),
V1V5 (ch3, 1 V/div.), NPOR (ch4, 2 V /div.), t = 5 ms/div.
t
V3V3
V1V5
NPOR
VREG
C1
C3
C4
C2
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
27
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
t
V3.3V
I3.3V
C1
C2
V3.3V transient response, 125 to 250 mA; shows V3.3V (ch1, 50 mV/div.),
I3.3V (ch2, 100 mA/div.), t = 50 s/div.
t
V1.5V transient response, 225 to 450 mA; shows V1.5V (ch1, 50 mV/div.),
I1.5V (ch2, 200 mA/div.), t = 50 s/div.
V1.5V
I1.5V
C1
C2
t
VV5
IV5
C1
C2
VV5 transient response, 100 to 200 mA; shows VV5 (ch1, 50 mV/div.),
IV5 (ch2, 100 mA/div.), t = 50 s/div.
t
VREG
IL
C1
C2
VREG short circuit operation at VIN = 12 V; shows VREG (ch1, 2 V/div.),
IL (ch2, 500 mA/div.), t = 5 s/div.
t
VV5P transient response, 125 to 250 mA; shows VV5P (ch1, 50 mV/div.),
IV5P (ch2, 100 mA/div.), t = 50 s/div.
VV5P
IV5P
C1
C2
t
VREG normal (left) and overload (right) operation at VIN = 12 V; shows
VREG (ch1, 2 V/div.), IL (ch2, 250 mA/div.)
VREG
VREG
Normal operation
(before overcurrent event)
Overloaded operation
(during overcurrent condition)
IL
IL
C1
C2
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
28
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Package LP, 24-Pin TSSOP
with Exposed Thermal Pad
A
1.20 MAX
0.15
0.00
0.30
0.19
0.20
0.09
0.60 ±0.15
1.00 REF
C
SEATING
PLANE
C0.10
24X
0.65 BSC
0.25 BSC
21
24
7.80±0.10
4.40±0.10 6.40±0.20
GAUGE PLANE
SEATING PLANE
ATerminal #1 mark area
B
For Reference Only; not for tooling use (reference MO-153 ADT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
B
Exposed thermal pad (bottom surface)
4.32 NOM
3 NOM
0.65
6.103.00
4.32
1.65
0.45
Reference land pattern layout (reference IPC7351
TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
PCB Layout Reference View
C
C
2.2 MHz Constant On-T ime Buck Regulator
W ith Two External and T wo Internal Linear Regulators
A4407
29
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Copyright ©2012-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to
permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, LLC assumes no re spon si bil i ty for its use;
nor for any in fringe ment of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
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Revision History
Revision Revision Date Description of Revision
Rev. 3 February 11, 2013 Update asynchronous diode description