BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2 1 of 4
www.diodes.com May 2012
© Diodes Incorporated
BZT52C2V0S - BZT52C39S
SURFACE MOUNT ZENER DIO DE
Features
• Planar Die Construction
• Small Surface Mount Package
• Ideally Suited for Automated Assembly Processes
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOD323
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: Cathode Band
• Weight: 0.0049 grams (approximate)
Ordering Information (Note 5)
Part Number Qualification Case Packaging
(Type Number)-7-F* Commercial SOD323 3000/Tape & Reel
(Type Number)Q-7-F* Automotive SOD323 3000/Tape & Reel
*Add “-7-F” to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener – BZT52C6V2S-7-F.
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Top View
xx = Product Type Marking Code
(See Electrical Characteristics Table)
XX
SOD323
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2 2 of 4
www.diodes.com May 2012
© Diodes Incorporated
BZT52C2V0S - BZT52C39S
Maximum Ratings @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Forward Voltage (Note 6) @ IF= 10mA VF 0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 7) PD 200 mW
Thermal Resistance, Junction to Ambient Air (Note 7) R
θ
JA 625 °C/W
Operating and Storage Temperature Range TJ,TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Type Number Marking
Code
Zener Voltage
Range (Note 4) Maximum Zener Impedance
f = 1kHz
Maximum
Reverse Current
(Note 6)
Temperature
Coefficient of
Zener Voltage
@ IZT = 5mA
mV/°C
VZ @ IZT I
ZT ZZT @ IZT ZZK @ IZK IZK IR @ VR
Nom (V) Min (V) Max (V) (mA) ΩmA uA V Min Max
BZT52C2V0S WY 2.0 1.91 2.09 5 100 600 1.0 150 1.0 -3.5 0
BZT52C2V4S WX 2.4 2.20 2.60 5 100 600 1.0 50 1.0 -3.5 0
BZT52C2V7S W1 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0
BZT52C3V0S W2 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0
BZT52C3V3S W3 3.3 3.1 3.5 5 95 600 1.0 5 1.0 -3.5 0
BZT52C3V6S W4 3.6 3.4 3.8 5 90 600 1.0 5 1.0 -3.5 0
BZT52C3V9S W5 3.9 3.7 4.1 5 90 600 1.0 3 1.0 -3.5 0
BZT52C4V3S W6 4.3 4.0 4.6 5 90 600 1.0 3 1.0 -3.5 0
BZT52C4V7S W7 4.7 4.4 5.0 5 80 500 1.0 2 2.0 -3.5 0.2
BZT52C5V1S W8 5.1 4.8 5.4 5 60 480 1.0 1 2.0 -2.7 1.2
BZT52C5V6S W9 5.6 5.2 6.0 5 40 400 1.0 3 2.0 -2.0 2.5
BZT52C6V2S WA 6.2 5.8 6.6 5 10 150 1.0 2 4.0 0.4 3.7
BZT52C6V8S WB 6.8 6.4 7.2 5 15 80 1.0 1 4.0 1.2 4.5
BZT52C7V5S WC 7.5 7.0 7.9 5 15 80 1.0 0.7 5.0 2.5 5.3
BZT52C8V2S WD 8.2 7.7 8.7 5 15 80 1.0 0.5 5.0 3.2 6.2
BZT52C9V1S WE 9.1 8.5 9.6 5 15 100 1.0 0.2 6.0 3.8 7.0
BZT52C10S WF 10 9.4 10.6 5 20 150 1.0 0.1 7.0 4.5 8.0
BZT52C11S WG 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0
BZT52C12S WH 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0
BZT52C13S WI 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0
BZT52C15S WJ 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0
BZT52C16S WK 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0
BZT52C18S WL 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0
BZT52C20S WM 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0
BZT52C22S WN 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 20.0
BZT52C24S WO 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 -
BZT52C27S WP 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 -
BZT52C30S WQ 30 28.0 32.0 2 80 300 0.5 0.1 21.0 24.4 -
BZT52C33S WR 33 31.0 35.0 2 80 325 0.5 0.1 23.1 27.4 -
BZT52C36S WS 36 34.0 38.0 2 90 350 0.5 0.1 25.2 30.4 -
BZT52C39S WT 39 37.0 41.0 2 130 350 0.5 0.1 27.3 33.4 -
Notes: 6. Short duration pulse test used to minimize self-heating effect.
7. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com.
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2 3 of 4
www.diodes.com May 2012
© Diodes Incorporated
BZT52C2V0S - BZT52C39S
T , AMBIENT TEMPERA TURE, °C
Fig. 1 Power Derating Curve
A
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N (mW)
D
200
100
0
300
0120 200
40 80 160
Note 7
0
10
20
30
40
50
012345678910
I, ZE
N
E
R
C
U
R
R
E
N
T
(mA)
Z
V , ZENER VOL TAGE (V)
Fi g. 2 Typic a l Zener Br eakdo w n C ha r act e r i stics
Z
T = 25°C
J
C2V7
C3V3
C3V9
C4V7
C5V6
C6V8
C8V2
Test Current I
5.0mA
Z
C2V0
0
10
20
30
0
I, ZENE
R
C
U
R
R
EN
T
(mA)
Z
V , ZENER VOLTAGE (V)
Fig . 3 Typical Zene r Br eakdown Ch a r acter is ti cs
Z
10 20 30 40
T = 25°C
J
Test current I
5mA
Z
C10
C12
C18
C22
C27
C33 C36
C15
C39
C , TOT AL CAP ACITANCE (pF)
T
10
100
1,000
10 100
1V , NOMINAL ZENER VOLTAGE (V)
Fig. 4 T ypical Total Capacitance vs. Nominal Zener Voltage
Z
T = 25 °C
J
V = 1V
R
V = 2V
R
V = 1V
R
V = 2V
R
Package Outline Dimensions
SOD323
Dim Min Max
A 0.25 0.35
B 1.20 1.40
C 2.30 2.70
H 1.60 1.80
J 0.00 0.10
K 1.0 1.1
L 0.20 0.40
M 0.10 0.15
α 0° 8°
All Dimensions in mm
K
L
MJ
C
H
BA
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2 4 of 4
www.diodes.com May 2012
© Diodes Incorporated
BZT52C2V0S - BZT52C39S
Suggested Pad Layout
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated p roducts for any unintended or una uthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign p atents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
Dimensions Value (in mm)
Z 3.75
G 1.05
X 0.65
Y 1.35
C 2.40
Z
X
C
G
Y
