BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data * * * * * * * * Planar Die Construction Small Surface Mount Package Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Notes 3 & 4) Qualified to AEC-Q101 Standards for High Reliability * * * * Case: SOD323 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Weight: 0.0049 grams (approximate) SOD323 Top View Ordering Information (Note 5) Part Number (Type Number)-7-F* (Type Number)Q-7-F* Qualification Commercial Automotive Case SOD323 SOD323 Packaging 3000/Tape & Reel 3000/Tape & Reel *Add "-7-F" to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener - BZT52C6V2S-7-F. Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 5. For packaging details, go to our website at http://www.diodes.com. Marking Information XX BZT52C2V0S - BZT52C39S Document number: DS30093 Rev. 18 - 2 xx = Product Type Marking Code (See Electrical Characteristics Table) 1 of 4 www.diodes.com May 2012 (c) Diodes Incorporated BZT52C2V0S - BZT52C39S Maximum Ratings @TA = 25C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Forward Voltage (Note 6) @ IF = 10mA Symbol VF Value 0.9 Unit V Characteristic Power Dissipation (Note 7) Thermal Resistance, Junction to Ambient Air (Note 7) Symbol PD RJA Value 200 625 Unit mW C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 C Thermal Characteristics Electrical Characteristics @TA = 25C unless otherwise specified Type Number BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S BZT52C18S BZT52C20S BZT52C22S BZT52C24S BZT52C27S BZT52C30S BZT52C33S BZT52C36S BZT52C39S Notes: Zener Voltage Range (Note 4) Marking Code WY WX W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WQ WR WS WT VZ @ IZT Nom (V) Min (V) 2.0 1.91 2.4 2.20 2.7 2.5 3.0 2.8 3.3 3.1 3.6 3.4 3.9 3.7 4.3 4.0 4.7 4.4 5.1 4.8 5.6 5.2 6.2 5.8 6.8 6.4 7.5 7.0 8.2 7.7 9.1 8.5 10 9.4 11 10.4 12 11.4 13 12.4 15 13.8 16 15.3 18 16.8 20 18.8 22 20.8 24 22.8 27 25.1 30 28.0 33 31.0 36 34.0 39 37.0 Max (V) 2.09 2.60 2.9 3.2 3.5 3.8 4.1 4.6 5.0 5.4 6.0 6.6 7.2 7.9 8.7 9.6 10.6 11.6 12.7 14.1 15.6 17.1 19.1 21.2 23.3 25.6 28.9 32.0 35.0 38.0 41.0 Maximum Zener Impedance f = 1kHz IZT ZZT @ IZT (mA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 2 100 100 100 95 95 90 90 90 80 60 40 10 15 15 15 15 20 20 25 30 30 40 45 55 55 70 80 80 80 90 130 Maximum Reverse Current (Note 6) ZZK @ IZK IZK IR @ VR 600 600 600 600 600 600 600 600 500 480 400 150 80 80 80 100 150 150 150 170 200 200 225 225 250 250 300 300 325 350 350 mA 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.5 0.5 0.5 0.5 0.5 uA 150 50 20 10 5 5 3 3 2 1 3 2 1 0.7 0.5 0.2 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 2.0 4.0 4.0 5.0 5.0 6.0 7.0 8.0 8.0 8.0 10.5 11.2 12.6 14.0 15.4 16.8 18.9 21.0 23.1 25.2 27.3 Temperature Coefficient of Zener Voltage @ IZT = 5mA mV/C Min Max -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0.2 -2.7 1.2 -2.0 2.5 0.4 3.7 1.2 4.5 2.5 5.3 3.2 6.2 3.8 7.0 4.5 8.0 5.4 9.0 6.0 10.0 7.0 11.0 9.2 13.0 10.4 14.0 12.4 16.0 14.4 18.0 16.4 20.0 18.4 21.4 24.4 27.4 30.4 33.4 - 6. Short duration pulse test used to minimize self-heating effect. 7. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com. BZT52C2V0S - BZT52C39S Document number: DS30093 Rev. 18 - 2 2 of 4 www.diodes.com May 2012 (c) Diodes Incorporated BZT52C2V0S - BZT52C39S 300 50 T J = 25C C2V7 C2V0 C3V3 C5V6 C4V7 C6V8 40 IZ, ZENER CURRENT (mA) PD, POWER DISSIPATION (mW) Note 7 C3V9 200 100 0 160 120 40 80 TA, AMBIENT TEMPERATURE, C Fig. 1 Power Derating Curve 0 30 TJ = 25C C8V2 30 20 Test Current IZ 5.0mA 10 0 200 0 1 2 3 4 5 6 8 9 10 7 VZ, ZENER VOLTAGE (V) Fig. 2 Typical Zener Breakdown Characteristics 1,000 C10 TJ = 25 C CT, TOTAL CAPACITANCE (pF) IZ, ZENER CURRENT (mA) C12 C15 20 C22 C27 Test current IZ 5mA 0 0 VR = 2V 100 C18 10 VR = 1V C39 C36 C33 VR = 1V VR = 2V 10 1 10 100 VZ, NOMINAL ZENER VOLTAGE (V) Fig. 4 Typical Total Capacitance vs. Nominal Zener Voltage 10 20 30 40 VZ, ZENER VOLTAGE (V) Fig. 3 Typical Zener Breakdown Characteristics Package Outline Dimensions C H B A K M J L BZT52C2V0S - BZT52C39S Document number: DS30093 Rev. 18 - 2 3 of 4 www.diodes.com SOD323 Dim Min Max A 0.25 0.35 B 1.20 1.40 C 2.30 2.70 H 1.60 1.80 J 0.00 0.10 K 1.0 1.1 L 0.20 0.40 M 0.10 0.15 0 8 All Dimensions in mm May 2012 (c) Diodes Incorporated BZT52C2V0S - BZT52C39S Suggested Pad Layout C Dimensions Value (in mm) Z 3.75 G 1.05 X 0.65 Y 1.35 C 2.40 X Y G Z IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 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