TPS767D3xx www.ti.com......................................................................................................................................................... SLVS209H - JULY 1999 - REVISED AUGUST 2008 DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATORS FEATURES 1 * Dual Output Voltages for Split-Supply Applications * Output Current Range of 0mA to 1.0A per Regulator * 3.3V/2.5V, 3.3V/1.8V, and 3.3V/Adjustable Output * Fast-Transient Response * 2% Tolerance Over Load and Temperature * Dropout Voltage Typically 350mV at 1A * Ultra-low 85A Typical Quiescent Current * 1A Quiescent Current During Shutdown * Dual Open-Drain Power-On Reset with 200ms Delay for Each Regulator * 28-Pin PowerPADTM TSSOP Package * Thermal Shutdown Protection for Each Regulator Because the PMOS device behaves as a low-value resistor, the dropout voltage is very low (350mV typically at an output current of 1A for the TPS767D325) and is directly proportional to the output current. Additionally, since the PMOS pass element is a voltage-driven device, the quiescent current is very low and independent of output loading (typically 85A over the full range of output current, 0mA to 1A). These two key specifications yield a significant improvement in operating life for battery-powered systems. This LDO family also features a sleep mode; applying a TTL high signal to EN (enable) shuts down the regulator, reducing the quiescent current to 1A at TJ = +25C. DESCRIPTION The TPS767D3xx is offered in 1.8V, 2.5V, and 3.3V fixed-voltage versions and in an adjustable version (programmable over the range of 1.5V to 5.5V). Output voltage tolerance is specified as a maximum of 2% over line, load, and temperature ranges. The TPS767D3xx family is available in a 28-pin PWP TSSOP package. They operate over a junction temperature range of -40C to +125C. 23 The TPS767D3xx family of dual voltage regulators offers fast transient response, low dropout voltages and dual outputs in a compact package and incorporating stability with 10F low ESR output capacitors. The TPS767D3xx family of dual voltage regulators is designed primarily for DSP applications. These devices can be used in any mixed-output voltage application, with each regulator supporting up to 1A. Dual active-low reset signals allow resetting of core-logic and I/O separately. The RESET output of the TPS767D3xx initiates a reset in microcomputer and microprocessor systems in the event of an undervoltage condition. An internal comparator in the TPS767D3xx monitors the output voltage of the regulator to detect an undervoltage condition on the regulated output voltage. LINE TRANSIENT RESPONSE VOUT = 3.3V CL = 10mF 5.3 TA = 25C 4.3 10 0 10 VDO - Dropout Voltage - mV DVOUT - Change in Output Voltage - mV VIN - Input Voltage - V PWP PACKAGE (TOP VIEW) 10 3 10 1 IOUT = 10mA 10 10 10 20 40 60 80 100 120 140 160 180 200 t - Time - ms IOUT = 1A 2 -1 -10 0 DROPOUT VOLTAGE vs FREE-AIR TEMPERATURE -2 VOUT = 3.3V COUT = 10mF IOUT = 0 -60 -40 -20 0 20 40 60 80 100 120 140 TA - Free-Air Temperature - C NC 1 28 1RESET NC 2 27 NC 1GND 3 26 NC 1EN 4 25 1FB/NC 1IN 5 24 1OUT 1IN 6 23 1OUT NC 7 22 2RESET NC 8 21 NC 2GND 9 20 NC 2EN 10 19 NC 2IN 11 18 2OUT 2IN 12 17 2OUT NC 13 16 NC NC 14 15 NC NC = No internal connection 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1999-2008, Texas Instruments Incorporated TPS767D3xx SLVS209H - JULY 1999 - REVISED AUGUST 2008......................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS (1) (1) DEVICE REGULATOR 1 VOUT (V) REGULATOR 2 VOUT (V) TPS767D301 Adjustable (1.5V - 5.5V) 3.3V TPS767D318 1.8V 3.3V TPS767D325 2.5V 3.3V For the most current specifications and package information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating temperature range (unless otherwise noted). TPS767D3xx UNIT Input voltage range, V1IN, V2IN (2) -0.3 to +13.5 V Enable voltage range, V1EN, V2EN -0.3 to VIN + 0.3 V Output voltage range, V1OUT, V2OUT -0.3 to +7.0 V RESET voltage range, V1RESET, V2RESET -0.3 to +16.5 V Peak output current Internally limited ESD rating, HBM 2 kV Continuous total power dissipation See Dissipation Ratings table Operating junction temperature range, TJ -40 to +125 C Storage temperature range, Tstg -65 to +150 C (1) (2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network terminal ground. POWER DISSIPATION RATINGS PACKAGE PWP (1) (1) 2 AIR FLOW (CFM) TA +25C POWER RATING DERATING FACTOR ABOVE ta = +25C TA = +70C POWER RATING TA = +85C POWER RATING 0 3.58 W 35.8 mW/C 1.97 W 1.43 W 250 5.07 W 50.7 mW/C 2.79 W 2.03 W This parameter is measured with the recommended copper heat sink pattern on a 4-layer PCB, 1oz. copper on 4-in x 4-in ground layer. For more information, refer to TI technical brief literature number SLMA002. Submit Documentation Feedback Copyright (c) 1999-2008, Texas Instruments Incorporated TPS767D3xx www.ti.com......................................................................................................................................................... SLVS209H - JULY 1999 - REVISED AUGUST 2008 ELECTRICAL CHARACTERISTICS Over operating temperature range (TJ = -40C to +125C), VIN = VOUT(nom) + 1V, IOUT = 1mA, VEN = 0V, and COUT = 10F, unless otherwise noted. Adjustable channels are set to VOUT = 3.3V. Typical values are at TJ = 25C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input voltage range, V1IN, V2IN (1) 2.7 10 V Adjustable VOUT range, V1OUT, V2OUT 1.5 5.5 V Accuracy, adjustable VOUT channels (1) VOUT + 1V VIN 5.5V; 10 A IOUT 1A -2.0 +2.0 % Accuracy, fixed VOUT channels (1) VOUT + 1V VIN 10V; 10 A IOUT 1A -2.0 +2.0 % VOUT%/VIN Line regulation (1) VOUT + 1.0V VIN 10V VOUT%/IOUT Load regulation 10 A IOUT 1A VDO Dropout voltage (2) (VIN = VOUT (nom) - 0.1V) VOUT = 3.3V, IOUT = 1A 350 ICL Output current limit, per LDO VOUT = 0V, TJ = +25C 1.7 2 A IGND Ground pin current, per LDO 10A IOUT 1A 85 125 A ISHDN Standby current, per LDO 2.7V VIN 10V, VEN = VIN 1 10 A IFB FB current input (Adjustable) VFB = 1.5V 2 nA PSRR Power-supply ripple rejection f = 1kHz, COUT = 10F 60 dB VN Output noise voltage BW = 200Hz to 100kHz, VOUT = 1.8V, IC = 1A, COUT = 10F 55 VRMS VEN(HI) High-level enable input voltage TJ = +25C VEN(LO) Low-level enable input voltage TJ = +25C VIN VOUT IEN Input current Reset -1 VOUT decreasing, TJ = +25C Hysteresis voltage Measured at VOUT Output low voltage VI = 2.7V, TJ = +25C, IOUT(RESET)= 1mA Leakage current V(RESET) = 7V, TJ = +25C RESET time-out delay TJ = +25C TSD Thermal shutdown temperature TJ Operating junction temperature (1) (2) VEN = VIN, TJ = +25C Trip threshold voltage mV 575 0 1 1 1.1 92 98 A %VOUT %VOUT 0.15 0.4 1 A 200 400 ms 150 -40 V V 0.5 100 mV V 0.8 -1 IOUT(RESET) = 300A %/V 3 2.0 VEN = 0V, TJ = +25C Minimum input voltage for valid RESET 0.01 V C +125 C Minimum VIN = VOUT + VDO or 2.7V, whichever is greater. Dropout voltage (VDO) is not measured for channels with VOUT(nom) < 2.8V since minimum VIN = 2.7V. Copyright (c) 1999-2008, Texas Instruments Incorporated Submit Documentation Feedback 3 TPS767D3xx SLVS209H - JULY 1999 - REVISED AUGUST 2008......................................................................................................................................................... www.ti.com FUNCTIONAL BLOCK DIAGRAM--Fixed Voltage Version (one regulator channel) IN EN RESET OUT 200ms Delay VREF = 1.1834V R1 R2 GND FUNCTIONAL BLOCK DIAGRAM--Adjustable Version (one regulator channel) IN EN RESET OUT 200ms Delay VREF = 1.1834V R1 FB/NC R2 GND 4 Submit Documentation Feedback External to the device Copyright (c) 1999-2008, Texas Instruments Incorporated TPS767D3xx www.ti.com......................................................................................................................................................... SLVS209H - JULY 1999 - REVISED AUGUST 2008 PWP PACKAGE (TOP VIEW) NC 1 28 1RESET NC 2 27 NC 1GND 3 26 NC 1EN 4 25 1FB/NC 1IN 5 24 1OUT 1IN 6 23 1OUT NC 7 22 2RESET NC 8 21 NC 2GND 9 20 NC 2EN 10 19 NC 2IN 11 18 2OUT 2IN 12 17 2OUT NC 13 16 NC NC 14 15 NC NC = No internal connection TERMINAL FUNCTIONS TERMINAL DESCRIPTION NAME NO. 1GND 3 Regulator #1 ground 1EN 4 Regulator #1 enable 1IN 5, 6 Regulator #1 input supply voltage 2GND 9 Regulator #2 ground 2EN 10 Regulator #2 enable 2IN 11, 12 Regulator #2 input supply voltage 2OUT 17, 18 Regulator #2 output voltage 2RESET 22 Regulator #2 reset signal 1OUT 23, 24 Regulator #1 output voltage 1FB/NC 25 Regulator #1 output voltage feedback for adjustable output; no connection for fixed output 1RESET 28 Regulator #1 reset signal NC 1, 2, 7, 8, 13-16, 19, 20, 21, 26, 27 No internal connection Copyright (c) 1999-2008, Texas Instruments Incorporated Submit Documentation Feedback 5 TPS767D3xx SLVS209H - JULY 1999 - REVISED AUGUST 2008......................................................................................................................................................... www.ti.com TPS767D3xx VIN 5 28 IN 6 250kW IN OUT C1 0.1mF 50V RESET RESET 4 OUT EN 24 VOUT 23 + COUT 10mF GND 3 Figure 1. Typical Application Circuit (Fixed Versions) for Single Channel TIMING DIAGRAM VIN VRES (1) VRES t VOUT (2) VIT+ VIT+ Threshold Voltage VIN- (2) Less than 5% of the output voltage VIN- t RESET Output 200ms Delay 200ms Delay Output Undefined Output Undefined t 6 (1) VRES is the minimum input voltage for a valid RESET. (2) VIT --Trip voltage is typically 5% lower than the output voltage (95% VOUT). Submit Documentation Feedback Copyright (c) 1999-2008, Texas Instruments Incorporated TPS767D3xx www.ti.com......................................................................................................................................................... SLVS209H - JULY 1999 - REVISED AUGUST 2008 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE vs OUTPUT CURRENT 3.2835 OUTPUT VOLTAGE vs OUTPUT CURRENT 1.7965 VOUT = 3.3V VIN = 4.3V TA = +25C 3.2830 OUTPUT VOLTAGE vs OUTPUT CURRENT 2.4960 VOUT = 1.8V VIN = 2.8V TA =+25C VOUT = 2.5V VIN = 3.5V TA = +25C 2.4955 3.2820 3.2815 3.2810 VOUT - Output Voltage - V VOUT - Output Voltage - V VOUT - Output Voltage - V 1.7960 3.2825 1.7955 1.7950 2.4950 2.4945 2.4940 2.4935 2.4930 1.7945 3.2805 2.4925 3.2800 0 0.2 0.3 0.1 0.4 0.5 0.6 0.7 0.8 0.9 1.7940 1 2.4920 0 0.1 0.2 0.3 IOUT - Output Current - A 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Figure 4. OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE 1.815 VOUT = 3.3V VIN = 4.3V 2.515 VOUT = 1.8V VIN = 2.8V IOUT = 1mA 3.28 3.27 1.805 IOUT = 1A 1.800 IOUT = 1mA 1.795 VOUT - Output Voltage - V IOUT = 1A 1.790 3.25 -60 -40 -20 0 20 40 60 80 VOUT = 2.5V VIN = 3.5V 2.505 2.500 IOUT = 1A 2.495 IOUT = 1mA 2.490 2.485 1.785 -60 -40 -20 100 120 140 0 20 40 60 80 2.480 -60 -40 100 120 140 TA - Free-Air Temperature - C TA - Free-Air Temperature - C 1 2.510 1.810 VOUT - Output Voltage - V VOUT - Output Voltage - V 1 Figure 3. 3.26 -20 0 20 40 60 80 TA - Free-Air Temperature - C 100 120 Figure 5. Figure 6. Figure 7. GROUND CURRENT vs FREE-AIR TEMPERATURE GROUND CURRENT vs FREE-AIR TEMPERATURE POWER SUPPLY RIPPLE REJECTION vs FREQUENCY 96 VOUT = 3.3V VIN = 4.3V 94 88 92 86 90 84 82 IOUT = 1mA IOUT = 1A 78 Ground Current - mA Ground Current - mA 0.9 Figure 2. 3.29 80 0.8 IOUT - Output Current - A 3.30 90 0.6 0.7 IOUT - Output Current - A 3.31 92 0.5 90 VOUT = 1.8V VIN = 2.8V IOUT = 1mA 88 86 IOUT = 500mA 84 82 80 IOUT = 500mA 76 78 74 76 72 -60 -40 -20 0 20 40 60 80 100 120 140 TA - Free-Air Temperature - C Figure 8. Copyright (c) 1999-2008, Texas Instruments Incorporated IOUT = 1A 74 -60 -40 -20 0 20 40 60 80 100 120 140 TA - Free-Air Temperature - C Figure 9. PSRR - Power-Supply Ripple Rejection - dB 3.32 0.4 VOUT = 3.3V VIN = 4.3V COUT = 10mF IOUT = 1A TA = +25C 80 70 60 50 40 30 20 10 0 -10 10 100 1k 10k 100k 1M f - Frequency - Hz Figure 10. Submit Documentation Feedback 7 TPS767D3xx SLVS209H - JULY 1999 - REVISED AUGUST 2008......................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY 0 IOUT = 1A 10-7 10-8 102 103 104 IOUT = 1A 102 IOUT = 1mA 10-1 102 103 104 f - Frequency - Hz Figure 11. 0 -20 20 40 60 -50 VOUT = 3.3V COUT = 10mF TA = +25C 5.3 4.3 -100 1 0.5 0 20 40 60 10 0 -10 80 100 120 140 160 180 200 0 20 40 t - Time - ms 60 80 100 120 140 160 180 200 t - Time - ms Figure 16. LOAD TRANSIENT RESPONSE OUTPUT VOLTAGE vs TIME (AT START-UP) DROPOUT VOLTAGE vs INPUT VOLTAGE 0 -50 900 4 IOUT = 1A 800 3 VDO - Dropout Voltage - mV VO - Output Voltage - V DVO - Change in Output Voltage - mV 2 1 0 Enable Pulse - V IO - Output Current - A 80 100 120 140 Figure 15. -100 1 0.5 0 20 40 60 Figure 17. Submit Documentation Feedback 700 600 500 0 TA = +125C TA = +25C 400 300 200 TA = -40C 100 0 80 100 120 140 160 180 200 t - Time - ms 8 60 LINE TRANSIENT RESPONSE 0 0 40 Figure 14. VOUT = 3.3V COUT = 100mF TA = +25C 0 20 Figure 13. VOUT = 1.8V VIN = 2.8V COUT = 100mF TA = +25C 50 80 100 120 140 160 180 200 t - Time - ms 100 50 0 TA - Free-Air Temperature - C DVO - Change in Output Voltage - mV DVO - Change in Output Voltage - mV IO - Output Current - A VI - Input Voltage - V DVO - Change in Output Voltage - mV 20 0 -60 -40 -20 106 LOAD TRANSIENT RESPONSE 100 VOUT = 1.8V IOUT = 10mA COUT = 10mF TA = +25C 105 IOUT = 0 VOUT = 3.3V COUT = 10mF Figure 12. LINE TRANSIENT RESPONSE 2.8 IOUT = 10mA 100 10-2 f - Frequency - Hz 3.8 101 10-1 IOUT = 1A 10-2 101 105 103 VIN = 4.3V COUT = 10mF TA = 25C VI - Input Voltage - V IOUT = 7mA 10-6 DROPOUT VOLTAGE vs FREE-AIR TEMPERATURE VDO - Dropout Voltage - mV VIN = 4.3V COUT = 10mF TA = +25C ZOUT - Output Impedance - W Vn - Output Spectral Noise Density - V/OHz 10-5 OUTPUT IMPEDANCE vs FREQUENCY 0 20 40 60 80 100 120 140 160 180 200 t - Time - ms Figure 18. 2.5 3 3.5 4 4.5 5 VI - Input Voltage - V Figure 19. Copyright (c) 1999-2008, Texas Instruments Incorporated TPS767D3xx www.ti.com......................................................................................................................................................... SLVS209H - JULY 1999 - REVISED AUGUST 2008 VIN IN To Load OUT + EN COUT RL GND ESR Figure 20. Test Circuit for Typical Regions of Stability (Figure 21 through Figure 24) (Fixed Output Options) Equivalent series resistance (ESR) refers to the total series resistance, including the ESR of the capacitor, any resistance added externally, and PWB trace resistance to COUT. TYPICAL REGION OF STABILITY ESR vs OUTPUT CURRENT TYPICAL REGION OF STABILITY ESR vs OUTPUT CURRENT 10 10 ESR - Equivalent Series Resistance - W ESR - Equivalent Series Resistance - W Region of Instability Region of Instability 1 VOUT = 3.3V COUT = 4.7mF VIN = 4.3V TA = +25C Region of Stability 0.1 Region of Instability VOUT = 3.3V COUT = 4.7mF VIN = 4.3V TA = +125C Region of Stability 0.1 Region of Instability 0.01 0.01 0 200 400 600 800 0 1000 200 400 600 800 IOUT - Output Current - mA IOUT - Output Current - mA Figure 21. Figure 22. TYPICAL REGION OF STABILITY ESR vs OUTPUT CURRENT TYPICAL REGION OF STABILITY ESR vs OUTPUT CURRENT 1000 10 ESR - Equivalent Series Resistance - W 10 ESR - Equivalent Series Resistance - W 1 Region of Instability 1 VOUT = 3.3V COUT = 22mF VIN = 4.3V TA = +25C Region of Stability 0.1 Region of Instability Region of Instability 1 VOUT = 3.3V COUT = 22mF VIN = 4.3V TA = +125C Region of Stability 0.1 Region of Instability 0.01 0.01 0 200 400 600 IOUT - Output Current - mA Figure 23. Copyright (c) 1999-2008, Texas Instruments Incorporated 800 1000 0 200 400 600 800 1000 IOUT - Output Current - mA Figure 24. Submit Documentation Feedback 9 TPS767D3xx SLVS209H - JULY 1999 - REVISED AUGUST 2008......................................................................................................................................................... www.ti.com APPLICATION INFORMATION The features of the TPS767D3xx family (low-dropout voltage, ultra low quiescent current, power-saving shutdown mode, and a supply-voltage supervisor) and the power-dissipation properties of the TSSOP PowerPAD package have enabled the integration of the dual LDO regulator with high output current for use in DSP and other multiple voltage applications. Figure 25 shows a typical dual-voltage DSP application. U1 TPS767D325 R1 100kW 1 NC 1RESET 28 2 NC NC 27 3 1GND NC 26 4 1EN 1FB/NC 25 5 1IN 1OUT 24 6 1IN 1OUT 23 7 NC 2RESET 22 8 NC NC 21 9 2GND NC 20 10 2EN NC 19 11 2IN 2OUT 18 12 2IN 2OUT 17 13 NC NC 16 14 NC NC 15 R2 100kW PG RESET to DSP 5V DSP C0 1m F 2.5V + C3 33mF 3.3V C1 1mF VCORE VI/O C2 33mF GND GND Figure 25. Dual-Voltage DSP Application DSP power requirements include very high transient currents that must be considered in the initial design. This design uses higher-valued output capacitors to handle the large transient currents. DEVICE OPERATION The TPS767D3xx features very low quiescent current, which remain virtually constant even with varying loads. Conventional LDO regulators use a pnp pass element, the base current of which is directly proportional to the load current through the regulator (IB = IC/). Close examination of the data sheets reveals that these devices are typically specified under near no-load conditions; actual operating currents are much higher as evidenced by typical quiescent current versus load current curves. The TPS767D3xx uses a PMOS transistor to pass current; because the gate of the PMOS is voltage driven, operating current is low and invariable over the full load range. The TPS767D3xx specifications reflect actual performance under load condition. Another pitfall associated with the pnp pass element is its tendency to saturate when the device goes into dropout. The resulting drop in forces an increase in IB to maintain the load. During power-up, this translates to large start-up currents. Systems with limited supply current may fail to start up. In battery-powered systems, it means rapid battery discharge when the voltage decays below the minimum required for regulation. The TPS767D3xx quiescent current remains low even when the regulator drops out, eliminating both problems. 10 Submit Documentation Feedback Copyright (c) 1999-2008, Texas Instruments Incorporated TPS767D3xx www.ti.com......................................................................................................................................................... SLVS209H - JULY 1999 - REVISED AUGUST 2008 The TPS767D3xx family also features a shutdown mode that places the output in the high-impedance state (essentially equal to the feedback-divider resistance) and reduces quiescent current to under 2A. If the shutdown feature is not used, EN should be tied to ground. Response to an enable transition is quick; regulated output voltage is typically re-established in 120s. MINIMUM LOAD REQUIREMENTS The TPS767D3xx family is stable even at zero load; no minimum load is required for operation. FB-PIN CONNECTION (ADJUSTABLE VERSION ONLY) The FB pin is an input pin to sense the output voltage and close the loop for the adjustable option. The output voltage is sensed through a resistor divider network as is shown in Figure 26 to close the loop. Normally, this connection should be as short as possible; however, the connection can be made near a critical circuit to improve performance at that point. Internally, FB connects to a high-impedance, wide-bandwidth amplifier and noise pickup feeds through to the regulator output. Routing the FB connection to minimize/avoid noise pickup is essential. In fixed output options, this pin is not connected. EXTERNAL CAPACITOR REQUIREMENTS An input capacitor is not required; however, a ceramic bypass capacitor (0.047pF to 0.1F) improves load transient response and noise rejection when the TPS767D3xx is located more than a few inches from the power supply. A higher-capacitance electrolytic capacitor may be necessary if large (hundreds of milliamps) load transients with fast rise times are anticipated. Like all low dropout regulators, the TPS767D3xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. The minimum recommended capacitance value is 10F and the ESR (equivalent series resistance) must be between 60m and 1.5. Capacitor values of 10F or larger are acceptable, provided the ESR is less than 1.5. Solid tantalum electrolytic, aluminum electrolytic, and multilayer ceramic capacitors are all suitable, provided they meet the requirements described previously. When necessary to achieve low height requirements along with high output current and/or high ceramic load capacitance, several higher ESR capacitors can be used in parallel to meet the previous guidelines. PROGRAMMING THE TPS767D301 ADJUSTABLE LDO REGULATOR The output voltage of the TPS767D301 adjustable regulator is programmed using an external resistor divider as shown in Figure 26. The output voltage is calculated using: V OUT + VREF 1) RR 1 2 (1) Resistors R1 and R2 should be chosen for approximately 40A divider current. Lower-value resistors can be used but offer no inherent advantage and waste more power. Higher values should be avoided as leakage currents at FB increase the output voltage error. Copyright (c) 1999-2008, Texas Instruments Incorporated Submit Documentation Feedback 11 TPS767D3xx SLVS209H - JULY 1999 - REVISED AUGUST 2008......................................................................................................................................................... www.ti.com The recommended design procedure is to choose R2 = 30.1 k to set the divider current at 40A and then calculate R1 using: R1 + VV OUT REF R2 *1 (2) TPS767D301 VIN IN RESET Output RESET 250kW 0.1mF VOUT OUT > 2.7V R1 EN < 0.5V FB/NC GND R2 + COUT 10mF OUTPUT VOLTAGE PROGRAMMING GUIDE OUTPUT VOLTAGE R1 R2 UNIT 2.5V 33.2 30.1 kW 3.3V 53.6 30.1 kW 3.6V 61.9 30.1 kW 4.75V 90.8 30.1 kW Figure 26. TPS767D301 Adjustable LDO Regulator Programming RESET INDICATOR The TPS767D3xx features a RESET output that can be used to monitor the status of the regulator. The internal comparator monitors the output voltage: when the output drops to 95% (typical) of its regulated value, the RESET output transistor turns on, taking the signal low. The open-drain output requires a pullup resistor. If not used, it can be left floating. RESET can be used to drive power-on reset circuitry or as a low-battery indicator. REGULATOR PROTECTION The TPS767D3xx PMOS-pass transistor has a built-in back-gate diode that safely conducts reverse currents when the input voltage drops below the output voltage (for example, during power-down). Current is conducted from the output to the input and is not internally limited. When extended reverse voltage is anticipated, external limiting may be appropriate. The TPS767D3xx also features internal current limiting and thermal protection. During normal operation, the TPS767D3xx limits output current to approximately 1.7A. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be taken not to exceed the power dissipation ratings of the package. If the temperature of the device exceeds +150C (typ), thermal-protection circuitry shuts it down. Once the device has cooled below +130C (typ), regulator operation resumes. 12 Submit Documentation Feedback Copyright (c) 1999-2008, Texas Instruments Incorporated TPS767D3xx www.ti.com......................................................................................................................................................... SLVS209H - JULY 1999 - REVISED AUGUST 2008 POWER DISSIPATION AND JUNCTION TEMPERATURE Specified regulator operation is assured to a junction temperature of +125C; the maximum junction temperature should be restricted to +125C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PDmax, and the actual dissipation, PD, which must be less than or equal to PDmax. The maximum-power-dissipation limit is determined using the following equation: PD max + T J max *T A RQJA (3) Where: * TJmax is the maximum allowable junction temperature. * RJA is the thermal resistance junction-to-ambient for the package, that is, 28C/W for the 28-terminal PWP with no airflow. * TA is the ambient temperature. The regulator dissipation is calculated using: PD + V IN*VOUT I OUT (4) Power dissipation resulting from quiescent current is negligible. Excessive power dissipation will trigger the thermal protection circuit. Copyright (c) 1999-2008, Texas Instruments Incorporated Submit Documentation Feedback 13 TPS767D3xx SLVS209H - JULY 1999 - REVISED AUGUST 2008......................................................................................................................................................... www.ti.com Revision History Changes from Revision F (February 2008) to Revision G ............................................................................................. Page * 14 Changed Corrected symbol for FB current in Electrical Characteristics................................................................................ 3 Submit Documentation Feedback Copyright (c) 1999-2008, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 3-Apr-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS767D301PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D301PWPG4 ACTIVE HTSSOP PWP 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D301PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D301PWPRG4 ACTIVE HTSSOP PWP 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D318PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D318PWPG4 ACTIVE HTSSOP PWP 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D318PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D318PWPRG4 ACTIVE HTSSOP PWP 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D325PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D325PWPG4 ACTIVE HTSSOP PWP 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D325PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS767D325PWPRG4 ACTIVE HTSSOP PWP 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 3-Apr-2009 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS767D301, TPS767D318, TPS767D325 : TPS767D301-Q1, TPS767D318-Q1, TPS767D325-Q1 * Automotive: * Enhanced Product: TPS767D301-EP NOTE: Qualified Version Definitions: - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Automotive * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS767D301PWPR HTSSOP PWP 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1 TPS767D318PWPR HTSSOP PWP 28 2000 330.0 TPS767D325PWPR HTSSOP PWP 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1 16.4 6.9 10.2 1.8 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS767D301PWPR HTSSOP PWP 28 2000 367.0 367.0 38.0 TPS767D318PWPR HTSSOP PWP 28 2000 367.0 367.0 38.0 TPS767D325PWPR HTSSOP PWP 28 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated