1
FEATURES
DESCRIPTION
NC
NC
1GND
1IN
1IN
NC
NC
2GND
2IN
2IN
NC
NC
NC=Nointernalconnection
NC
NC
1FB/NC
1OUT
1OUT
NC
NC
NC
2OUT
2OUT
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1EN
2EN
2RESET
1RESET
PWPPACKAGE
(TOPVIEW)
0 20 20040 60 80 100 120 140 160 180
LINETRANSIENTRESPONSE
V =3.3V
C =10 F
T =25 C
OUT
L
A
m
°
5.3
4.3
10
0
-10
t Time s- - m
D -
-
V Changein
OutputVoltage mV
OUT
VInputVoltage V
IN - -
VDropoutVoltage mV
DO- -
103
102
101
10-1
10-2
10
-60 -40 -20 0 20 40 60 80 100 120 140
T Free-AirTemperature C
A- - °
V =3.3V
C =10 F
OUT
OUT mI =0
OUT
I =10mA
OUT
I =1A
OUT
DROPOUTVOLTAGE
vsFREE-AIRTEMPERATURE
TPS767D3xx
www.ti.com
......................................................................................................................................................... SLVS209H – JULY 1999 – REVISED AUGUST 2008
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATORS
Because the PMOS device behaves as a low-value23
•Dual Output Voltages for Split-Supply
resistor, the dropout voltage is very low (350mVApplications
typically at an output current of 1A for the•Output Current Range of 0mA to 1.0A per
TPS767D325) and is directly proportional to theRegulator
output current. Additionally, since the PMOS pass•3.3V/2.5V, 3.3V/1.8V, and 3.3V/Adjustable
element is a voltage-driven device, the quiescentOutput
current is very low and independent of output loading(typically 85 µA over the full range of output current,•Fast-Transient Response
0mA to 1A). These two key specifications yield a•2% Tolerance Over Load and Temperature
significant improvement in operating life for•Dropout Voltage Typically 350mV at 1A
battery-powered systems. This LDO family alsofeatures a sleep mode; applying a TTL high signal to•Ultra-low 85 µA Typical Quiescent Current
EN (enable) shuts down the regulator, reducing the•1µA Quiescent Current During Shutdown
quiescent current to 1 µA at T
J
= +25 ° C.•Dual Open-Drain Power-On Reset with 200ms
The RESET output of the TPS767D3xx initiates aDelay for Each Regulator
reset in microcomputer and microprocessor systems•28-Pin PowerPAD™ TSSOP Package
in the event of an undervoltage condition. An internal•Thermal Shutdown Protection for Each comparator in the TPS767D3xx monitors the outputvoltage of the regulator to detect an undervoltageRegulator
condition on the regulated output voltage.
The TPS767D3xx is offered in 1.8V, 2.5V, and 3.3Vfixed-voltage versions and in an adjustable versionThe TPS767D3xx family of dual voltage regulators
(programmable over the range of 1.5V to 5.5V).offers fast transient response, low dropout voltages
Output voltage tolerance is specified as a maximumand dual outputs in a compact package and
of 2% over line, load, and temperature ranges. Theincorporating stability with 10 µF low ESR output
TPS767D3xx family is available in a 28-pin PWPcapacitors.
TSSOP package. They operate over a junctionThe TPS767D3xx family of dual voltage regulators is
temperature range of – 40 ° C to +125 ° C.designed primarily for DSP applications. Thesedevices can be used in any mixed-output voltageapplication, with each regulator supporting up to 1A.Dual active-low reset signals allow resetting ofcore-logic and I/O separately.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPAD is a trademark of Texas Instruments.3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
ABSOLUTE MAXIMUM RATINGS
(1)
POWER DISSIPATION RATINGS
TPS767D3xx
SLVS209H – JULY 1999 – REVISED AUGUST 2008 .........................................................................................................................................................
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
(1)
DEVICE REGULATOR 1 V
OUT
(V) REGULATOR 2 V
OUT
(V)
TPS767D301 Adjustable (1.5V – 5.5V) 3.3VTPS767D318 1.8V 3.3VTPS767D325 2.5V 3.3V
(1) For the most current specifications and package information see the Package Option Addendum at the end of this document, or see theTI web site at www.ti.com.
Over operating temperature range (unless otherwise noted).
TPS767D3xx UNIT
Input voltage range, V
1IN
, V
2IN
(2)
– 0.3 to +13.5 VEnable voltage range, V
1EN
, V
2EN
– 0.3 to V
IN
+ 0.3 VOutput voltage range, V
1OUT
, V
2OUT
– 0.3 to +7.0 VRESET voltage range, V
1RESET
, V
2RESET
– 0.3 to +16.5 VPeak output current Internally limitedESD rating, HBM 2 kVContinuous total power dissipation See Dissipation Ratings tableOperating junction temperature range, T
J
– 40 to +125 ° CStorage temperature range, T
stg
– 65 to +150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values are with respect to network terminal ground.
AIR FLOW T
A
≤+25 ° C DERATING FACTOR T
A
= +70 ° C T
A
= +85 ° CPACKAGE (CFM) POWER RATING ABOVE t
a
= +25 ° C POWER RATING POWER RATING
0 3.58 W 35.8 mW/ ° C 1.97 W 1.43 WPWP
(1)
250 5.07 W 50.7 mW/ ° C 2.79 W 2.03 W
(1) This parameter is measured with the recommended copper heat sink pattern on a 4-layer PCB, 1oz. copper on 4-in × 4-in ground layer.For more information, refer to TI technical brief literature number SLMA002 .
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ELECTRICAL CHARACTERISTICS
TPS767D3xx
www.ti.com
......................................................................................................................................................... SLVS209H – JULY 1999 – REVISED AUGUST 2008
Over operating temperature range (T
J
= – 40 ° C to +125 ° C), V
IN
= V
OUT(nom)
+ 1V, I
OUT
= 1mA, V
EN
= 0V, andC
OUT
= 10 µF, unless otherwise noted. Adjustable channels are set to V
OUT
= 3.3V. Typical values are at T
J
= 25 ° C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
IN
Input voltage range, V
1IN
, V
2IN
(1)
2.7 10 VAdjustable V
OUT
range, V
1OUT
, V
2OUT
1.5 5.5 VV
OUT
+ 1V ≤V
IN
≤5.5V;Accuracy, adjustable V
OUT
channels
(1)
– 2.0 +2.0 %V
OUT
10 µA≤I
OUT
≤1AV
OUT
+ 1V ≤V
IN
≤10V;Accuracy, fixed V
OUT
channels
(1)
– 2.0 +2.0 %10 µA≤I
OUT
≤1A
ΔV
OUT
%/ ΔV
IN
Line regulation
(1)
V
OUT
+ 1.0V ≤V
IN
≤10V 0.01 %/V
ΔV
OUT
%/ ΔI
OUT
Load regulation 10 µA≤I
OUT
≤1A 3 mVDropout voltage
(2)V
DO
V
OUT
= 3.3V, I
OUT
= 1A 350 575 mV(V
IN
= V
OUT
(nom) – 0.1V)I
CL
Output current limit, per LDO V
OUT
= 0V, T
J
= +25 ° C 1.7 2 AI
GND
Ground pin current, per LDO 10 µA≤I
OUT
≤1A 85 125 µAI
SHDN
Standby current, per LDO 2.7V ≤V
IN
≤10V, V
EN
= V
IN
1 10 µAI
FB
FB current input (Adjustable) V
FB
= 1.5V 2 nAPSRR Power-supply ripple rejection f = 1kHz, C
OUT
= 10 µF 60 dBBW = 200Hz to 100kHz, V
OUT
= 1.8V,V
N
Output noise voltage 55 µV
RMSI
C
= 1A, C
OUT
= 10 µFV
EN(HI)
High-level enable input voltage T
J
= +25 ° C 2.0 VV
EN(LO)
Low-level enable input voltage T
J
= +25 ° C 0.8 VV
EN
= 0V, T
J
= +25 ° C – 1 0 1I
EN
Input current µAV
EN
= V
IN
, T
J
= +25 ° C – 1 1Minimum input voltage for valid
I
OUT(RESET)
= 300 µA 1.1 VRESET
Trip threshold voltage V
OUT
decreasing, T
J
= +25 ° C 92 98 %V
OUT
Hysteresis voltage Measured at V
OUT
0.5 %V
OUTReset
V
I
= 2.7V, T
J
= +25 ° C,Output low voltage 0.15 0.4 VI
OUT(RESET)
= 1mALeakage current V
(RESET)
= 7V, T
J
= +25 ° C 1 µARESET time-out delay T
J
= +25 ° C 100 200 400 msT
SD
Thermal shutdown temperature 150 ° CT
J
Operating junction temperature – 40 +125 ° C
(1) Minimum V
IN
= V
OUT
+ V
DO
or 2.7V, whichever is greater.(2) Dropout voltage (V
DO
) is not measured for channels with V
OUT(nom)
< 2.8V since minimum V
IN
= 2.7V.
Copyright © 1999 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
200msDelay
V =
1.1834V
REF R1
R2
GND
EN
RESET
OUT
IN
200msDelay
V =
1.1834V
REF R1
R2
GND
EN
RESET
OUT
FB/NC
IN
Externalto
thedevice
TPS767D3xx
SLVS209H – JULY 1999 – REVISED AUGUST 2008 .........................................................................................................................................................
www.ti.com
FUNCTIONAL BLOCK DIAGRAM — Fixed Voltage Version (one regulator channel)
FUNCTIONAL BLOCK DIAGRAM — Adjustable Version (one regulator channel)
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NC
NC
1GND
1IN
1IN
NC
NC
2GND
2IN
2IN
NC
NC
NC=Nointernalconnection
NC
NC
1FB/NC
1OUT
1OUT
NC
NC
NC
2OUT
2OUT
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1EN
2EN
2RESET
1RESET
PWPPACKAGE
(TOPVIEW)
TPS767D3xx
www.ti.com
......................................................................................................................................................... SLVS209H – JULY 1999 – REVISED AUGUST 2008
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTIONNAME NO.
1GND 3 Regulator #1 ground1EN 4 Regulator #1 enable1IN 5, 6 Regulator #1 input supply voltage2GND 9 Regulator #2 ground2EN 10 Regulator #2 enable2IN 11, 12 Regulator #2 input supply voltage2OUT 17, 18 Regulator #2 output voltage2RESET 22 Regulator #2 reset signal1OUT 23, 24 Regulator #1 output voltage1FB/NC 25 Regulator #1 output voltage feedback for adjustable output; no connection for fixed output1RESET 28 Regulator #1 reset signalNC 1, 2, 7, 8, No internal connection13 – 16, 19,20, 21, 26,27
Copyright © 1999 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
IN
IN
EN OUT
OUT
RESET RESET
GND
5
6
4
28
24
23
3
+
COUT
10 Fm
C1
0.1 F
50V
m
VOUT
VIN
250kW
TPS767D3xx
TIMING DIAGRAM
VIN
VOUT VIT+(2) VIT+(2)
VRES
VRES
(1)
t
t
t
Output
Undefined
Output
Undefined
200ms
Delay
200ms
Delay
VIN-VIN-
Lessthan5%of
theoutputvoltage
Threshold
Voltage
RESET
Output
TPS767D3xx
SLVS209H – JULY 1999 – REVISED AUGUST 2008 .........................................................................................................................................................
www.ti.com
Figure 1. Typical Application Circuit (Fixed Versions) for Single Channel
(1) V
RES
is the minimum input voltage for a valid RESET.(2) V
IT
— Trip voltage is typically 5% lower than the output voltage (95% V
OUT
).
6Submit Documentation Feedback Copyright © 1999 – 2008, Texas Instruments Incorporated
TYPICAL CHARACTERISTICS
3.2830
3.2815
3.2800
0.1 0.3
3.2825
3.2820
3.2810
0.2 0.8 1
3.2835
0 0.9
3.2805
0.4 0.5 0.6 0.7
V OutputVoltage V
OUT
--
I OutputCurrent A
OUT
--
V =3.3V
V =4.3V
T =+25 C
OUT
IN
A
°
0.1 0.30.2 0.8 10 0.90.4 0.5 0.6 0.7
1.7965
1.7960
1.7955
1.7950
1.7945
1.7940
V OutputVoltage V
OUT
--
I OutputCurrent A
OUT
--
V =1.8V
V =2.8V
T =+25 C
OUT
IN
A
°
2.4955
2.4940
2.4920
0.1 0.3
2.4950
2.4945
2.4935
0.2 0.4 0.6
2.4960
0 0.5
2.4930
2.4925
0.80.7 0.9 1
V OutputVoltage V
OUT
--
I OutputCurrent A
OUT
--
V =2.5V
V =3.5V
T =+25 C
OUT
IN
A
°
3.31
3.28
3.25
−40 0
3.30
3.29
3.27
−20 100 140
3.32
−60 120
3.26
20 40 60 80
V OutputVoltage V
OUT
--
T Free-AirTemperature
A
-- C°
V =3.3V
V =4.3V
OUT
IN
I =1A
OUT
I =1mA
OUT
−40 0−20 100−60 12020 40 60 80
2.515
2.500
2.480
2.510
2.505
2.495
2.490
2.485
VOutputVoltage V
OUT
--
T Free-AirTemperature
A
-- C°
V =2.5V
V =3.5V
OUT
IN
I =1mA
OUT
I =1A
OUT
100k10k
70
60
50
40
30
20
10
0
−10
90
80
1k10010 1M
PSRR Power-SupplyRippleRejection dB--
f Frequency Hz--
V =3.3V
V =4.3V
C =10 F
I =1A
T =+25 C
OUT
IN
OUT
OUT
A
m
°
94
86
74
92
90
84
82
80
78
76
88
−40 0−20 100−60 12020 40 60 80 140
96
GroundCurrent A- m
T Free-AirTemperature
A-- C°
V =1.8V
V =2.8V
OUT
IN
I =1mA
OUT
I =1A
OUT
I =500mA
OUT
92
84
72
90
88
82
80
78
76
74
86
−40 0−20 100−60 12020 40 60 80 140
GroundCurrent A- m
T Free-AirTemperature
A-- C°
V =3.3V
V =4.3V
OUT
IN
I =1mA
OUT
I =1A
OUT
I =500mA
OUT
TPS767D3xx
www.ti.com
......................................................................................................................................................... SLVS209H – JULY 1999 – REVISED AUGUST 2008
OUTPUT VOLTAGE OUTPUT VOLTAGE OUTPUT VOLTAGEvs vs vsOUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 2. Figure 3. Figure 4.
OUTPUT VOLTAGE OUTPUT VOLTAGE OUTPUT VOLTAGEvs vs vsFREE-AIR TEMPERATURE FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE
Figure 5. Figure 6. Figure 7.
GROUND CURRENT GROUND CURRENT POWER SUPPLY RIPPLE REJECTIONvs vs vsFREE-AIR TEMPERATURE FREE-AIR TEMPERATURE FREQUENCY
Figure 8. Figure 9. Figure 10.
Copyright © 1999 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
102103104105
10−5
10−6
10−8
10−7
V OutputSpectralNoiseDensity V/
n-
-ÖHz
f Frequency Hz--
V =4.3V
C =10 F
T =+25 C
IN
OUT
A
m
°
I =1A
OUT
I =7mA
OUT
−40 0 20 120
103
−60 40 60 80 100
102
101
100
10−1
10−2
−20 140
T Free-AirTemperature
A-- C°
V DropoutVoltage mV
DO --
V =3.3V
C =10 F
OUT
OUT m
I =0
OUT
I =1A
OUT
I =10mA
OUT
101102105106
0
10−1
10−2
104
103
V =4.3V
C =10 F
T =25 C
IN
OUT
A
m
°
I =1A
OUT
I =1mA
OUT
Z OutputImpedance
OUT - W-
f Frequency Hz--
5.3
604020 80 100 140120 160 180 200
0
4.3
10
0
−10
D
-
VChangein
OutputVoltage mV
O-
VInputVoltage V
I--
V =3.3V
C =10 F
OUT
OUT m
T =+25 C
A°
t Time- - ms
1
0.5
0
0 604020 80 100 140120 160 180 200
0
50
100
−50
−100
D
-
VChangein
OutputVoltage mV
O-
I OutputCurrent A
O--
V =1.8V
V =2.8V
C =100 F
OUT
OUT
IN
A
m
T =+25 C
°
t Time- - ms
1
0.5
604020 80 100 140120 160 180 2000
0
0
50
100
−50
−100
D
-
V Changein
OutputVoltage mV
O-
IOutputCurrent A
O--
V =3.3V
C =100 F
OUT
OUT m
T =+25 C
A°
t Time- - ms
600
300
0
3 4
500
400
200
3.52.5
100
4.5 5
900
800
700
V DropoutVoltage mV
DO
--
V InputVoltage V
I
--
T =+25 C
A
°T =+125 C
A
°
T = 40 C
A
-°
I =1A
OUT
3
2
604020 80 100 140120 160 180 2000
0
1
4
0
VOutputVoltage V
O--
EnablePulse V-
t Time- - ms
TPS767D3xx
SLVS209H – JULY 1999 – REVISED AUGUST 2008 .........................................................................................................................................................
www.ti.com
TYPICAL CHARACTERISTICS (continued)
OUTPUT SPECTRAL NOISE DENSITY OUTPUT IMPEDANCE DROPOUT VOLTAGEvs vs vsFREQUENCY FREQUENCY FREE-AIR TEMPERATURE
Figure 11. Figure 12. Figure 13.
LINE TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE LINE TRANSIENT RESPONSE
Figure 14. Figure 15. Figure 16.
OUTPUT VOLTAGE DROPOUT VOLTAGEvs vsLOAD TRANSIENT RESPONSE TIME (AT START-UP) INPUT VOLTAGE
Figure 17. Figure 18. Figure 19.
8Submit Documentation Feedback Copyright © 1999 – 2008, Texas Instruments Incorporated
+
EN
GND
IN
OUT
VIN
COUT
RL
ESR
ToLoad
0.1
0 200 400 600 800 1000
10
1
0.01
RegionofInstability
RegionofStability
RegionofInstability
V =3.3V
C =4.7 F
V =4.3V
T =+125 C
OUT
OUT
IN
A
m
°
ESR EquivalentSeriesResistance - W-
I OutputCurrent mA
OUT --
0.1
0 200 400 600 800 1000
10
1
0.01
RegionofStability
RegionofInstability
RegionofInstability
V =3.3V
C =4.7 F
V =4.3V
T =+25 C
OUT
OUT
IN
A
m
°
ESR EquivalentSeriesResistance - W-
I OutputCurrent mA
OUT --
0.1
0 200 400 600 800 1000
10
1
0.01
RegionofInstability
RegionofStability
RegionofInstability
V =3.3V
C =22 F
V =4.3V
T =+25 C
OUT
OUT
IN
A
m
°
ESR EquivalentSeriesResistance - W-
I OutputCurrent mA
OUT --
0.1
0 200 400 600 800 1000
10
1
0.01
RegionofStability
RegionofInstability
RegionofInstability
V =3.3V
C =22 F
V =4.3V
T =+125 C
OUT
OUT
IN
A
m
°
ESR EquivalentSeriesResistance - W-
I OutputCurrent mA
OUT --
TPS767D3xx
www.ti.com
......................................................................................................................................................... SLVS209H – JULY 1999 – REVISED AUGUST 2008
Figure 20. Test Circuit for Typical Regions of Stability (Figure 21 through Figure 24 )(Fixed Output Options)
Equivalent series resistance (ESR) refers to the total series resistance, including the ESR of the capacitor, anyresistance added externally, and PWB trace resistance to C
OUT
.
TYPICAL REGION OF STABILITY TYPICAL REGION OF STABILITYESR vs OUTPUT CURRENT ESR vs OUTPUT CURRENT
Figure 21. Figure 22.
TYPICAL REGION OF STABILITY TYPICAL REGION OF STABILITYESR vs OUTPUT CURRENT ESR vs OUTPUT CURRENT
Figure 23. Figure 24.
Copyright © 1999 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
APPLICATION INFORMATION
NC
NC
1GND
1IN
1IN
NC
NC
2GND
2IN
2IN
NC
NC
NC
NC
1FB/NC
1OUT
1OUT
NC
NC
NC
2OUT
2OUT
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1EN
2EN
2RESET
1RESET
U1
TPS767D325
+
VI/O
VCORE
GND
2.5V
3.3V
C
33 F
3
m
C
33 F
2
m
C
1 F
1
m
C
1 F
0
m
5V
GND
R
100k
1
W
R
100k
2
W
PG
RESET toDSP
DSP
DEVICE OPERATION
TPS767D3xx
SLVS209H – JULY 1999 – REVISED AUGUST 2008 .........................................................................................................................................................
www.ti.com
The features of the TPS767D3xx family (low-dropout voltage, ultra low quiescent current, power-saving shutdownmode, and a supply-voltage supervisor) and the power-dissipation properties of the TSSOP PowerPAD packagehave enabled the integration of the dual LDO regulator with high output current for use in DSP and other multiplevoltage applications. Figure 25 shows a typical dual-voltage DSP application.
Figure 25. Dual-Voltage DSP Application
DSP power requirements include very high transient currents that must be considered in the initial design. Thisdesign uses higher-valued output capacitors to handle the large transient currents.
The TPS767D3xx features very low quiescent current, which remain virtually constant even with varying loads.Conventional LDO regulators use a pnp pass element, the base current of which is directly proportional to theload current through the regulator (I
B
= I
C
/β). Close examination of the data sheets reveals that these devices aretypically specified under near no-load conditions; actual operating currents are much higher as evidenced bytypical quiescent current versus load current curves. The TPS767D3xx uses a PMOS transistor to pass current;because the gate of the PMOS is voltage driven, operating current is low and invariable over the full load range.The TPS767D3xx specifications reflect actual performance under load condition.
Another pitfall associated with the pnp pass element is its tendency to saturate when the device goes intodropout. The resulting drop in βforces an increase in I
B
to maintain the load. During power-up, this translates tolarge start-up currents. Systems with limited supply current may fail to start up. In battery-powered systems, itmeans rapid battery discharge when the voltage decays below the minimum required for regulation. TheTPS767D3xx quiescent current remains low even when the regulator drops out, eliminating both problems.
10 Submit Documentation Feedback Copyright © 1999 – 2008, Texas Instruments Incorporated
MINIMUM LOAD REQUIREMENTS
FB-PIN CONNECTION (ADJUSTABLE VERSION ONLY)
EXTERNAL CAPACITOR REQUIREMENTS
PROGRAMMING THE TPS767D301 ADJUSTABLE LDO REGULATOR
VOUT +VREF ǒ1)R1
R2Ǔ
(1)
TPS767D3xx
www.ti.com
......................................................................................................................................................... SLVS209H – JULY 1999 – REVISED AUGUST 2008
The TPS767D3xx family also features a shutdown mode that places the output in the high-impedance state(essentially equal to the feedback-divider resistance) and reduces quiescent current to under 2 µA. If theshutdown feature is not used, EN should be tied to ground. Response to an enable transition is quick; regulatedoutput voltage is typically re-established in 120 µs.
The TPS767D3xx family is stable even at zero load; no minimum load is required for operation.
The FB pin is an input pin to sense the output voltage and close the loop for the adjustable option. The outputvoltage is sensed through a resistor divider network as is shown in Figure 26 to close the loop. Normally, thisconnection should be as short as possible; however, the connection can be made near a critical circuit toimprove performance at that point. Internally, FB connects to a high-impedance, wide-bandwidth amplifier andnoise pickup feeds through to the regulator output. Routing the FB connection to minimize/avoid noise pickup isessential. In fixed output options, this pin is not connected.
An input capacitor is not required; however, a ceramic bypass capacitor (0.047pF to 0.1 µF) improves loadtransient response and noise rejection when the TPS767D3xx is located more than a few inches from the powersupply. A higher-capacitance electrolytic capacitor may be necessary if large (hundreds of milliamps) loadtransients with fast rise times are anticipated.
Like all low dropout regulators, the TPS767D3xx requires an output capacitor connected between OUT and GNDto stabilize the internal control loop. The minimum recommended capacitance value is 10 µF and the ESR(equivalent series resistance) must be between 60m Ωand 1.5 Ω. Capacitor values of 10 µF or larger areacceptable, provided the ESR is less than 1.5 Ω. Solid tantalum electrolytic, aluminum electrolytic, and multilayerceramic capacitors are all suitable, provided they meet the requirements described previously.
When necessary to achieve low height requirements along with high output current and/or high ceramic loadcapacitance, several higher ESR capacitors can be used in parallel to meet the previous guidelines.
The output voltage of the TPS767D301 adjustable regulator is programmed using an external resistor divider asshown in Figure 26 . The output voltage is calculated using:
Resistors R
1
and R
2
should be chosen for approximately 40 µA divider current. Lower-value resistors can be usedbut offer no inherent advantage and waste more power. Higher values should be avoided as leakage currents atFB increase the output voltage error.
Copyright © 1999 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 11
R1+ǒVOUT
VREF *1Ǔ R2
(2)
IN
EN
FB/NC
OUT
RESET RESET Output
GND
+
COUT
10 Fm
VOUT
VIN
250kW
TPS767D301
0.1 Fm
R2
R1
>2.7V
<0.5V
OUTPUTVOLTAGE
PROGRAMMINGGUIDE
2.5V
3.3V
3.6V
4.75V
33.2
53.6
61.9
90.8
30.1
30.1
30.1
30.1
R2
R1
OUTPUT
VOLTAGE UNIT
kW
kW
kW
kW
RESET INDICATOR
REGULATOR PROTECTION
TPS767D3xx
SLVS209H – JULY 1999 – REVISED AUGUST 2008 .........................................................................................................................................................
www.ti.com
The recommended design procedure is to choose R
2
= 30.1 k Ωto set the divider current at 40 µA and thencalculate R
1
using:
Figure 26. TPS767D301 Adjustable LDO Regulator Programming
The TPS767D3xx features a RESET output that can be used to monitor the status of the regulator. The internalcomparator monitors the output voltage: when the output drops to 95% (typical) of its regulated value, theRESET output transistor turns on, taking the signal low. The open-drain output requires a pullup resistor. If notused, it can be left floating. RESET can be used to drive power-on reset circuitry or as a low-battery indicator.
The TPS767D3xx PMOS-pass transistor has a built-in back-gate diode that safely conducts reverse currentswhen the input voltage drops below the output voltage (for example, during power-down). Current is conductedfrom the output to the input and is not internally limited. When extended reverse voltage is anticipated, externallimiting may be appropriate.
The TPS767D3xx also features internal current limiting and thermal protection. During normal operation, theTPS767D3xx limits output current to approximately 1.7A. When current limiting engages, the output voltagescales back linearly until the overcurrent condition ends. While current limiting is designed to prevent grossdevice failure, care should be taken not to exceed the power dissipation ratings of the package. If thetemperature of the device exceeds +150 ° C (typ), thermal-protection circuitry shuts it down. Once the device hascooled below +130 ° C (typ), regulator operation resumes.
12 Submit Documentation Feedback Copyright © 1999 – 2008, Texas Instruments Incorporated
POWER DISSIPATION AND JUNCTION TEMPERATURE
PDmax +TJmax*TA
RQJA
(3)
PD+ǒVIN*VOUTǓ IOUT
(4)
TPS767D3xx
www.ti.com
......................................................................................................................................................... SLVS209H – JULY 1999 – REVISED AUGUST 2008
Specified regulator operation is assured to a junction temperature of +125 ° C; the maximum junction temperatureshould be restricted to +125 ° C under normal operating conditions. This restriction limits the power dissipation theregulator can handle in any given application. To ensure the junction temperature is within acceptable limits,calculate the maximum allowable dissipation, P
D
max, and the actual dissipation, P
D
, which must be less than orequal to P
D
max.
The maximum-power-dissipation limit is determined using the following equation:
Where:
•T
J
max is the maximum allowable junction temperature.•R
θJA
is the thermal resistance junction-to-ambient for the package, that is, 28 ° C/W for the 28-terminal PWPwith no airflow.•T
A
is the ambient temperature.
The regulator dissipation is calculated using:
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation will trigger thethermal protection circuit.
Copyright © 1999 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 13
TPS767D3xx
SLVS209H – JULY 1999 – REVISED AUGUST 2008 .........................................................................................................................................................
www.ti.com
Revision History
Changes from Revision F (February 2008) to Revision G ............................................................................................. Page
•Changed Corrected symbol for FB current in Electrical Characteristics................................................................................ 3
14 Submit Documentation Feedback Copyright © 1999 – 2008, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPS767D301PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D301PWPG4 ACTIVE HTSSOP PWP 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D301PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D301PWPRG4 ACTIVE HTSSOP PWP 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D318PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D318PWPG4 ACTIVE HTSSOP PWP 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D318PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D318PWPRG4 ACTIVE HTSSOP PWP 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D325PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D325PWPG4 ACTIVE HTSSOP PWP 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D325PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS767D325PWPRG4 ACTIVE HTSSOP PWP 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 3-Apr-2009
Addendum-Page 1
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS767D301, TPS767D318, TPS767D325 :
•Automotive: TPS767D301-Q1,TPS767D318-Q1,TPS767D325-Q1
•Enhanced Product: TPS767D301-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 3-Apr-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS767D301PWPR HTSSOP PWP 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
TPS767D318PWPR HTSSOP PWP 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
TPS767D325PWPR HTSSOP PWP 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS767D301PWPR HTSSOP PWP 28 2000 367.0 367.0 38.0
TPS767D318PWPR HTSSOP PWP 28 2000 367.0 367.0 38.0
TPS767D325PWPR HTSSOP PWP 28 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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