L6234 Three phase motor driver Features Supply voltage from 7 to 52 V 5 A peak current RDSon 0.3 typ. value at 25 C Cross conduction protection TTL compatible driver Operating frequency up to 150 kHz Thermal shutdown Intrinsic fast free wheeling diodes Input and enable function for each half bridge 10 V external reference available 32:(5',3 3RZHU62 Description The L6234 is a triple half bridge to drive a brushless DC motor. It is realized in BCDmultipower technology which combines isolated DMOS power transistors with CMOS and Bipolar circuits on the same chip. By using mixed technology it has been possible to optimize the logic circuitry and the power stage to achieve the best possible performance. Table 1. The output DMOS transistors can sustain a very high current due to the fact that the DMOS structure is not affected by the second breakdown effect, the RMS maximum current is practically limited by the dissipation capability of the package. All the logic inputs are TTL, CMOS and P compatible. Each channel is controlled by two separate logic input. L6234 is available in 20 pin PowerDIP package (16+2+2) and in PowerSO20. Device summary Order code Package Packing L6234 PowerDIP20 Tube L6234PD PowerSO20 Tube L6234PD013TR PowerSO20 Tape and reel November 2011 Doc ID 1107 Rev 10 1/16 www.st.com 16 Contents L6234 Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.1 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Circuit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 Typical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2/16 Doc ID 1107 Rev 10 L6234 1 Block diagram Block diagram Figure 1. Block diagram M) Q) 9&3 M) 95() 9%227 1 95() 9 &+$5*( 3803 9V WR9 ,1 7+ M) M) 287 (1 7/ ,1 7+ 287 (1 7/ 6(16( 7+(50$/ 3527(&7,21 ,1 7+ 287 (1 7/ 6(16( 56(16( *1' ',1$ !-V Doc ID 1107 Rev 10 3/16 Pin connections 2 L6234 Pin connections Figure 2. Pin connections *1' *1' 6(16( 6(16( (1 9%227 ,1 9&3 *1' 287 95() 287 287 287 287 ,1 ,1 (1 (1 96 *1' 6(16( *1' *1' 96 6(16( (1 ,1 287 9%227 ,1 ,1 (1 (1 96 96 *1' 9&3 *1' 95() 32:(5',3 3RZHU62 !-V Table 2. Pin functions PowerDIP PowerSO20 4/16 Name Function 1 20 10 6 5 15 OUT 1 OUT 2 OUT 3 2 19 9 7 4 14 IN 1 IN 2 IN 3 Logic input of channels 1/2/3. A logic HIGH level (when the corresponding EN pin is HIGH) switches ON the upper DMOS Power Transistor, while a logic LOW switches ON the corresponding low side DMOS Power. 3 18 8 8 3 13 EN 1 EN 2 EN 3 Enable of the channels 1/2/3. A logic LOW level on this pin switches off both power DMOS of the related channel. 4,7 9, 12 Vs 14 19 SENSE2 A sense resistor connected to this pin provides feedback for motor current control for the bridge 3. 17 2 SENSE1 A sense resistor connected to this pin provides feedback for motor current control for the bridges 1 and 2. 11 16 VREF 12 17 VCP 13 18 VBOOT 5,6 15,16 1,10 11,20 GND Output of the channels 1/2/3. Power supply voltage. Internal voltage reference. A capacitor connected from this pin to GND increases the stability of the Power DMOS drive circuit. Bootstrap oscillator. Oscillator output for the external charge pump. Overvoltage input to drive the upper DMOS Common ground terminal. In PowerDIP and SO packages these pins are used to dissipate the heat forward the PCB. Doc ID 1107 Rev 10 L6234 3 Thermal data Thermal data Table 3. Symbol Rth j-pin Thermal data Parameter Thermal resistance, junction to pin Rth j-amb1 Thermal resistance, junction to ambient Rth j-amb2 Thermal resistance, junction characteristics) to ambient Rth j-case Thermal resistance junction-case DIP16+2+2 PowerSO20 Unit 12 (1) - C/W (2) - C/W 50 (3) - C/W - 1.5 C/W 40 1. The thermal resistance is referred to the thermal path from the dissipating region on the top surface of the silicon chip, to the points along the four central pins of the package, at a distance of 1.5 mm away from the stand-offs. 2. If a dissipating surface, thick at least 35 mm, and with a surface similar or bigger than the one shown in Figure 3, is created making use of the printed circuit. Such heatsinking surface is considered on the bottom side of an horizontal PCB (worst case). 3. If the power dissipating pins (the four central ones), as well as the others, have a minimum thermal connection with the external world (very thin strips only) so that the dissipation takes place through still air and through the PCB itself. It is the same situation of note 2, without any heatsinking surface created on purpose on the board. Figure 3. Printed Heatsink !-V Doc ID 1107 Rev 10 5/16 Maximum ratings 4 L6234 Maximum ratings Table 4. Absolute maximum ratings Symbol Parameter VS Power supply voltage VIN, VEN Input enable voltage Ipeak VSENSE Pulsed output current (1) Sensing voltage (DC voltage) Value Unit 52 V - 0.3 to 7 V 5 A -1 to 4 V Vboot Bootstrap peak voltage 62 V VOD Differential output voltage (between any of the 3 OUT pins) 60 V Commutation frequency 150 kHz Reference voltage 12 V 2.3 W fC VREF Ptot Ptot Tstg, Tj Total power dissipation L6234PD, TA = 70C Total power dissipation L6234, TA = 70C Storage and junction temperature range 1.6 (2) W -40 to 150 C Value Unit 7 to 42 V Peak to peak differential voltage (between any of the 3 out pins) 52 V DC output current powerSO20 (TA = 25C) 4 A 2.8 A Sensing voltage (pulsed tw < 300 nsec) -4 to 4 V Sensing voltage (DC) -1 to 1 V -40 to 125 C 1. Pulse width limited only by junction temperature and the transient thermal impedance 2. Mounted on board with minimized copper area 4.1 Recommended operating conditions Table 5. Recommended operating conditions Symbol VS VOD Iout VSENSE Tj 6/16 Parameter Supply voltage DC output current powerDIP (TA = 25C) with infinite heatsink Junction temperature range Doc ID 1107 Rev 10 L6234 5 Electrical characteristics Electrical characteristics VS = 42 V; Tj = 25 C unless otherwise specified. Table 6. Electrical characteristics Symbol Parameter Test condition Min. Typ. Max. Unit 52 V VS Supply voltage Vref Reference voltage 10 V IS Quiescent supply current 6.5 mA TS Thermal shutdown TD Dead time protection 7 150 C 300 ns Output dmos transistor IDSS RDSon Leakage current 1 ON resistance mA 0.3 Source drain diode VSD Forward ON voltage ISD = 4A; EN = LOW 1.2 V TRR Reverse recovery time IF = 4A 900 ns Tpr Forward recovery time 200 ns Logic levels VINL, VENL Input LOW voltage -0.3 0.8 V VINH, VENH Input HIGH voltage 2 7 V -10 A IINL, IENL Input LOW current VIN,VEN = L IINH, IENH Input HIGH current VIN,VEN = H Doc ID 1107 Rev 10 30 A 7/16 Circuit description 6 L6234 Circuit description L6234 is a triple half bridge designed to drive brushless DC motors. Each half bridge has 2 power DMOS transistors with RDSon = 0.3 . The 3 half bridges can be controlled independently by means of the 3 inputs IN1, IN2, IN3 and the 3 inputs EN1, EN2, and EN3. An external connection to the 3 common low side DMOS sources is provided to connect a sensing resistor for constant current chopping application. The driving stage and the logic stage are designed to work from 7 V to 52 V. 8/16 Doc ID 1107 Rev 10 L6234 Typical characteristics 7 Typical characteristics Figure 4. Quiescent current vs. supply voltage Figure 5. Normalized quiescent current vs. switching frequency ,T > P $ @ ,T ,T# +] 7M & 7 M & 7M & 7 M & 7M & 7 M & 7 M & 9 V >9 @ IVZ >N+]@ !-V Figure 6. Typical RDSon vs. supply voltage !-V Figure 7. Source drain forward on voltage vs. junction temperature 96 ' >9@ 5' 6 2 1 ;7 = 7 M & 7 M & 7 M & ,RXW $ ,R X W $ 9 V >9 @ !-V Doc ID 1107 Rev 10 7M>& @ !-V 9/16 Typical characteristics Figure 8. L6234 Typical diode forward ON characteristics Figure 9. ,6 ' > $ @ 9UHI>9 @ Reference voltage vs. supply voltage 7 M & '0 2 6 2 1 '0 2 6 2)) 7 M & 9 6 ' >9 @ !-V Figure 10. Reference voltage vs. junction temperature 9 V >9 @ !-V Figure 11. PowerSO-20 transient thermal resistance 9 UH I> 9 @ 9 V 9 9 V 9 9 V 9 9 V 9 7 M > & @ !-V 10/16 Doc ID 1107 Rev 10 !-V L6234 Typical characteristics Figure 12. PowerSO-20 thermal resistance Figure 13. PowerSO-20 thermal resistance (mounted on Aluminium substrate) (mounted on FR4 monolayer substrate) !-V !-V Figure 14. PowerSO-20: with external heatsink Figure 15. Thermal impedance of PowerSO-20 and standard SO20 !-V Doc ID 1107 Rev 10 !-V 11/16 Mechanical data 8 L6234 Mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 7. PowerSO20 mechanical data mm Dim. Min. Typ. A a1 3.6 0.1 0.3 a2 3.3 a3 0 0.1 b 0.4 0.53 c 0.23 0.32 D (1) 15.8 16 D1 9.4 9.8 E 13.9 14.5 e 1.27 e3 11.43 E1 (1) 10.9 11.1 E2 2.9 E3 5.8 6.2 G 0 0.1 H 15.5 15.9 h L 1.1 0.8 1.1 N 8 (typ.) S 8 (max.) T 12/16 Max. 10 Doc ID 1107 Rev 10 L6234 Mechanical data Figure 16. PowerSO20 mechanical drawing 1 5 1 D E $ H '(7$,/$ F D '(7$,/% ( H + '(7$,/$ OHDG ' VOXJ D '(7$,/% *DJH3ODQH & 6 6($7,1*3/$1( / * ( ( %277209,(: & &23/$1$5,7< 7 ( K[ 3620(& ' Doc ID 1107 Rev 10 13/16 Mechanical data L6234 Table 8. PowerDIP20 mechanical data mm Dim. Min. a1 0.51 B 0.85 b b1 Typ. 1.40 0.50 0.38 0.50 D 24.80 E 8.80 e 2.54 e3 22.86 F 7.10 I 5.10 L 3.30 Z 1.27 Figure 17. PowerDIP20 mechanical drawing 14/16 Max. Doc ID 1107 Rev 10 L6234 9 Revision history Revision history Table 9. Document revision history Date Revision 01-Aug-2003 9 15-Nov-2011 10 Changes Updated Features in coverpage and Table 4 Doc ID 1107 Rev 10 15/16 L6234 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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