LM2830XQMFE/NOPB - NATIONAL SEMICONDUCTOR

GND

VIN SW

VIN = 5V

C2 C3

VO = 3.3V @ 1.0A

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LM2830

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LM2830/-Q1 High-Frequency 1.0-A Load Step-Down DC-DC Regulator

1 Features 3 Description

The LM2830 regulator is a monolithic, high-

1• LM2830Z-Q1 and LM2830X-Q1 in the SOT-23 frequency, PWM step-down DC-DC converter in a 5-

Package are Automotive-Grade Products that are pin SOT-23 and a 6-Pin WSON package. The device

AEC-Q100 Grade 1 Qualified (–40°C to +125°C provides all the active functions to provide local DC-

Operating Junction Temperature) DC conversion with fast transient response and

• Space-Saving SOT-23 Package accurate regulation in the smallest possible PCB

area. With a minimum of external components, the

• Input Voltage Range of 3.0 V to 5.5 V LM2830 regulator is easy to use. The ability to drive

• Output Voltage Range of 0.6 V to 4.5 V 1.0-A loads with an internal 130-mΩPMOS switch

• 1.0-A Output Current using state-of-the-art 0.5-µm BiCMOS technology

• High Switching Frequencies results in the best power density available. The world-

class control circuitry allows on-times as low as 30

– 1.6 MHz (LM2830X) ns, thus supporting exceptionally high frequency

– 3.0 MHz (LM2830Z) conversion over the entire 3-V to 5.5-V input

• 130-mΩPMOS Switch operating range down to the minimum output voltage

of 0.6 V. Switching frequency is internally set to 1.6

• 0.6-V, 2% Internal Voltage Reference MHz, or 3.0 MHz, allowing the use of extremely small

• Internal Soft-Start surface-mount inductors and chip capacitors. Even

• Current Mode, PWM Operation though the operating frequency is high, efficiencies

up to 93% are easy to achieve. External shutdown is

• Thermal Shutdown included, featuring an ultra-low standby current of 30

• Overvoltage Protection nA. The LM2830 regulator uses current-mode control

and internal compensation to provide high-

2 Applications performance regulation over a wide range of

operating conditions. Additional features include

• Local 5-V to Vcore Step-Down Converters internal soft-start circuitry to reduce inrush current,

• Core Power in HDDs pulse-by-pulse current limit, thermal shutdown, and

• Set-Top Boxes output overvoltage protection.

• USB Powered Devices Device Information(1)

• DSL Modems PART NUMBER PACKAGE BODY SIZE (NOM)

• Automotive SOT (5) 2.90 mm × 1.60 mm

LM2830 WSON (6) 3.00 mm × 3.00 mm

LM2830-Q1 SOT (5) 2.90 mm × 1.60 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

Typical Application Circuit Efficiency vs Load Current

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

Table of Contents

7.4 Device Functional Modes........................................ 11

1 Features.................................................................. 18 Application and Implementation ........................ 12

2 Applications ........................................................... 18.1 Application Information............................................ 12

3 Description............................................................. 18.2 Typical Applications ................................................ 12

4 Revision History..................................................... 29 Power Supply Recommendations...................... 24

5 Pin Configuration and Functions......................... 310 Layout................................................................... 24

6 Specifications......................................................... 410.1 Layout Guidelines ................................................. 24

6.1 Absolute Maximum Ratings ...................................... 410.2 Layout Example .................................................... 24

6.2 ESD Ratings: LM2830 .............................................. 410.3 Thermal Considerations........................................ 25

6.3 ESD Ratings: LM2830-Q1 ........................................ 410.4 WSON Package.................................................... 27

6.4 Recommended Operating Conditions....................... 411 Device and Documentation Support................. 28

6.5 Thermal Information.................................................. 411.1 Device Support...................................................... 28

6.6 Electrical Characteristics........................................... 511.2 Related Links ........................................................ 28

6.7 Typical Characteristics.............................................. 611.3 Trademarks........................................................... 28

7 Detailed Description.............................................. 911.4 Electrostatic Discharge Caution............................ 28

7.1 Overview................................................................... 911.5 Glossary................................................................ 29

7.2 Functional Block Diagram....................................... 10 12 Mechanical, Packaging, and Orderable

7.3 Feature Description................................................. 10 Information ........................................................... 29

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (April 2013) to Revision E Page

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

Changes from Revision C (April 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 23

Product Folder Links: LM2830 LM2830-Q1

VIN SW

EN FB

GND

DAP VINA

VIND

GND

LM2830

LM2830-Q1

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SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

5 Pin Configuration and Functions

WSON Package

6-Pin

Top View

SOT Package

5-Pins

Top View

Pin Functions (5-Pin SOT)

PIN I/O(1) DESCRIPTION

NAME NO.

SW 1 O Output switch. Connect to the inductor and catch diode.

Signal and power ground pin. Place the bottom resistor of the feedback network as close as

GND 2 G possible to this pin.

FB 3 I Feedback pin. Connect to external resistor divider to set output voltage.

Enable control input. Logic high enables operation. Do not allow this pin to float or be greater

EN 4 I than VIN + 0.3 V.

VIN 5 I/P Input supply voltage.

(1) I: Input Pin, O: Output Pin, P: Power Pin, G: Ground Pin

Pin Functions (6-Pin WSON)

PIN I/O(1) DESCRIPTION

NAME NO.

FB 1 I Feedback pin. Connect to external resistor divider to set output voltage.

Signal and power ground pin. Place the bottom resistor of the feedback network as close as

GND 2 G possible to this pin.

SW 3 O Output switch. Connect to the inductor and catch diode.

VIND 4 I/P Power Input supply.

VINA 5 I/P Control circuitry supply voltage. Connect VINA to VIND on PC board.

Enable control input. Logic high enables operation. Do not allow this pin to float or be greater

EN 6 I than VINA + 0.3V.

Die Attach Connect to system ground for low thermal impedance, but it cannot be used as a primary

– –

Pad GND connection.

(1) I: Input Pin, O: Output Pin, P: Power Pin, G: Ground Pin

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SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT

VIN –0.5 7 V

FB Voltage –0.5 3 V

EN Voltage –0.5 7 V

SW Voltage –0.5 7 V

Junction Temperature(3) 150 °C

Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.

6.2 ESD Ratings: LM2830 VALUE UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000

V(ESD) Electrostatic discharge V

Charged device model (CDM), per JEDEC specification JESD22-C101, all ±1000

pins(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings: LM2830-Q1 VALUE UNIT

Human body model (HBM), per AEC Q100-002(1) ±2000

WSON corner pins (1, 3, 4, and 6) ±1000

V(ESD) Electrostatic discharge V

Charged device model (CDM), per SOT-23 corner pins (1, 3, 4, and 5) ±1000

AEC Q100-011 Other pins ±1000

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions MIN NOM MAX UNIT

VIN 3 5.5 V

Junction Temperature –40 125 °C

6.5 Thermal Information LM2830, LM2830

LM2830-Q1

THERMAL METRIC(1) UNIT

DBV NGG

5 PINS 6 PINS

RθJA Junction-to-ambient thermal resistance 165.2 53.9

RθJC(top) Junction-to-case (top) thermal resistance 69.9 51.2

RθJB Junction-to-board thermal resistance 27.3 28.2 °C/W

ψJT Junction-to-top characterization parameter 1.8 0.6

ψJB Junction-to-board characterization parameter 26.8 28.3

RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 8.1

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Product Folder Links: LM2830 LM2830-Q1

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SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

6.6 Electrical Characteristics

VIN = 5 V unless otherwise indicated. Typical values correspond to TJ = 25°C. Minimum and maximum limits apply over

–40°C to 125°C junction temperature range unless otherwise stated.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VFB Feedback Voltage WSON and SOT-23 Package 0.588 0.600 0.612 V

ΔVFB/VIN Feedback Voltage Line Regulation VIN = 3 V to 5 V 0.02 %/V

IBFeedback Input Bias Current 0.1 100 nA

VIN Rising 2.73 2.90 V

Undervoltage Lockout

UVLO VIN Falling 1.85 2.3

UVLO Hysteresis 0.43

LM2830-X 1.2 1.6 1.95

FSW Switching Frequency MHz

LM2830-Z 2.25 3.0 3.75

LM2830-X 86% 94%

DMAX Maximum Duty Cycle LM2830-Z 82% 90%

LM2830-X 5%

DMIN Minimum Duty Cycle LM2830-Z 7%

WSON Package 150

RDS(ON) Switch On Resistance mΩ

SOT-23 Package 130 195

ICL Switch Current Limit VIN = 3.3 V 1.2 1.75 A

Shutdown Threshold Voltage 0.4

VEN_TH V

Enable Threshold Voltage 1.8

ISW Switch Leakage 100 nA

IEN Enable Pin Current Sink/Source 100 nA

LM2830X VFB = 0.55 3.3 5 mA

Quiescent Current (switching)

IQLM2830Z VFB = 0.55 4.3 6.5 mA

Quiescent Current (shutdown) All Options VEN = 0 V 30 nA

TSD Thermal Shutdown Temperature 165 °C

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6.7 Typical Characteristics

All curves taken at VIN = 5.0 V with configuration in typical application circuit shown in Application Information section of this

data sheet. TJ= 25°C, unless otherwise specified.

Figure 1. ηvs Load "X" Vin = 5 V, Vo = 1.8 V and 3.3 V Figure 2. ηvs Load "Z" Vin = 5 V, Vo = 3.3 V and 1.8 V

Figure 4. Load Regulation Vin = 3.3 V, Vo = 1.8 V (All

Figure 3. ηvs Load "X and Z" Vin = 3.3 V, Vo = 1.8 V Options)

Figure 5. Load Regulation Vin = 5 V, Vo = 1.8 V (All Options) Figure 6. Load Regulation Vin = 5 V, Vo = 3.3 V (All Options)

Product Folder Links: LM2830 LM2830-Q1

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

3.0

3.1

3.2

3.3

3.4

3.5

3.6

IQ (mA)

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (oC)

CURRENT LIMIT (mA)

1500

1550

1600

1650

1700

1750

1800

1850

1900

1950

2000

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

OSCILLATOR FREQUENCY (MHz)

1.36

1.41

1.46

1.51

1.56

1.61

1.66

1.71

1.76

1.81

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

OSCILLATOR FREQUENCY (MHz)

2.55

2.65

2.75

2.85

2.95

3.05

3.15

3.25

3.35

3.45

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LM2830-Q1

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SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

Typical Characteristics (continued)

All curves taken at VIN = 5.0 V with configuration in typical application circuit shown in Application Information section of this

data sheet. TJ= 25°C, unless otherwise specified.

Figure 8. Oscillator Frequency vs Temperature - "Z"

Figure 7. Oscillator Frequency vs Temperature - "X"

Figure 10. RDSON vs Temperature (WSON Package)

Figure 9. Current Limit vs Temperature Vin = 3.3 V

Figure 11. RDSON vs Temperature (SOT-23 Package) Figure 12. LM2830X IQ(Quiescent Current)

Product Folder Links: LM2830 LM2830-Q1

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

FEEBACK VOLTAGE (V)

0.590

0.595

0.600

0.605

0.610

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

4.0

4.1

4.2

4.3

4.4

4.5

4.6

IQ (mA)

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

Typical Characteristics (continued)

All curves taken at VIN = 5.0 V with configuration in typical application circuit shown in Application Information section of this

data sheet. TJ= 25°C, unless otherwise specified.

Figure 14. Line Regulation Vo = 1.8 V, Io = 500 mA

Figure 13. LM2830Z IQ(Quiescent Current)

Figure 16. Gain vs Frequency (Vin = 5 V, Vo = 1.2 V at 1 A)

Figure 15. VFB vs Temperature

Figure 17. Phase Plot vs Frequency (Vin = 5 V, Vo = 1.2 V at 1 A)

Product Folder Links: LM2830 LM2830-Q1

VIN

TON

Inductor

Current

D = TON/TSW

VSW

TOFF

TSW

IPK

Voltage

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SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

7 Detailed Description

7.1 Overview

The LM2830 device is a constant frequency PWM buck regulator IC that delivers a 1.0-A load current. The

regulator has a preset switching frequency of 1.6 MHz or 3.0 MHz. This high frequency allows the LM2830

device to operate with small surface-mount capacitors and inductors, resulting in a DC-DC converter that

requires a minimum amount of board space. The LM2830 device is internally compensated, so it is simple to use

and requires few external components. The LM2830 device uses current-mode control to regulate the output

voltage.

The following operating description of the LM2830 device will refer to the Simplified Block Diagram (Functional

Block Diagram) and to the waveforms in Figure 18. The LM2830 device supplies a regulated output voltage by

switching the internal PMOS control switch at constant frequency and variable duty cycle. A switching cycle

begins at the falling edge of the reset pulse generated by the internal oscillator. When this pulse goes low, the

output control logic turns on the internal PMOS control switch. During this on-time, the SW pin voltage (VSW)

swings up to approximately VIN, and the inductor current (IL) increases with a linear slope. ILis measured by the

current sense amplifier, which generates an output proportional to the switch current. The sense signal is

summed with the regulator’s corrective ramp and compared to the error amplifier’s output, which is proportional

to the difference between the feedback voltage and VREF. When the PWM comparator output goes high, the

output switch turns off until the next switching cycle begins. During the switch off-time, inductor current

discharges through the Schottky catch diode, which forces the SW pin to swing below ground by the forward

voltage (VD) of the Schottky catch diode. The regulator loop adjusts the duty cycle (D) to maintain a constant

output voltage.

Figure 18. Typical Waveforms

Product Folder Links: LM2830 LM2830-Q1

GND

VIN



DRIVER

Artificial

Ramp

SHDN

Thermal

SHDN

OVP

1.6 MHz

CompInternal-

SENSE

LIMIT

LDOInternal-

STARTSOFT-

PFET

SENSE

ENABLE and UVLO

15.1 x REF

VControl Logic

VREF = 0.6V

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 Soft-Start

This function forces VOUT to increase at a controlled rate during start up. During soft-start, the error reference

voltage of the amplifier ramps from 0 V to its nominal value of 0.6 V in approximately 600 µs. This forces the

regulator output to ramp up in a controlled fashion, which helps reduce inrush current.

7.3.2 Output Overvoltage Protection

The overvoltage comparator compares the FB pin voltage to a voltage that is 15% higher than the internal

reference VREF. Once the FB pin voltage goes 15% above the internal reference, the internal PMOS control

switch is turned off, which allows the output voltage to decrease toward regulation.

7.3.3 Undervoltage Lockout

Undervoltage lockout (UVLO) prevents the LM2830 device from operating until the input voltage exceeds 2.73 V

(typical). The UVLO threshold has approximately 430 mV of hysteresis, so the part will operate until VIN drops

below 2.3V (typical). Hysteresis prevents the part from turning off during power up if VIN is nonmonotonic.

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SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

Feature Description (continued)

7.3.4 Current Limit

The LM2830 device uses cycle-by-cycle current limiting to protect the output switch. During each switching cycle,

a current limit comparator detects if the output switch current exceeds 1.75 A (typical), and turns off the switch

until the next switching cycle begins.

7.3.5 Thermal Shutdown

Thermal shutdown limits total power dissipation by turning off the output switch when the IC junction temperature

exceeds 165°C. After thermal shutdown occurs, the output switch does not turn on until the junction temperature

drops to approximately 150°C.

7.4 Device Functional Modes

In normal operational mode, the device will regulate output voltage to the value set with resistive divider.

In addition, this device has an enable (EN) pin that lets the user turn the device on and off by driving this pin high

and low. Default setup is that this pin is connected to VIN through pull up resistor (typically 100 kΩ). When enable

pin is low the device is in shutdown mode consuming typically only 30 nA, making it ideal for applications where

low power consumption is desirable.

Product Folder Links: LM2830 LM2830-Q1

GND

VIN SW

VIN = 5V

LM2830

VO = 1.2V @ 1.0A

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SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The device operates with input voltage in the range of 3.3 V to 5.5 V and provide regulated output voltage up to

1 A of continuous DC load. This device is optimized for high efficiency operation with minimum number of

external components. Also, high switching frequency allows use of small surface-mount components enabling

very small solution size. For component selection, see Detailed Design Procedure.

8.2 Typical Applications

8.2.1 LM2830X Design Vo = 1.2 V at 1.0A

Figure 19. LM2830X (1.6 MHz): Vin = 5 V, Vo = 1.2 V at 1.0-A Schematic

8.2.1.1 Design Requirements

This device must be able to operate at any voltage within input voltage range.

Load Current must be defined to properly size the inductor, input and output capacitors. Inductor should be able

to handle full expected load current as well as the peak current generated during load transients and start up.

Inrush current at startup will depend on the output capacitor selection. More details are provided in Detailed

Design Procedure.

Device has an enable (EN) pin that is used to enable and disable the device. This pin is active high and should

not be left floating in application.

8.2.1.2 Detailed Design Procedure

Table 1. Bill of Materials

PART ID PART VALUE MANUFACTURER PART NUMBER

U1 1.0-A Buck Regulator TI LM2830X

C1, Input Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

C2, Output Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

D1, Catch Diode 0.3 VfSchottky 1.5 A, 30 VRTOSHIBA CRS08

Product Folder Links: LM2830 LM2830-Q1

VIN - VOUT

L=2'iL

DTS

OUT

VOUT

- VOUT

VIN

D = VOUT + VD

VIN + VD - VSW

D =VOUT

VIN

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SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

Typical Applications (continued)

Table 1. Bill of Materials (continued)

PART ID PART VALUE MANUFACTURER PART NUMBER

L1 3.3 µH, 1.3 A Coilcraft ME3220-332

R2 15.0 kΩ, 1% Vishay CRCW08051502F

R1 15.0 kΩ, 1% Vishay CRCW08051502F

R3 100 kΩ, 1% Vishay CRCW08051003F

8.2.1.2.1 Inductor Selection

The Duty Cycle (D) can be approximated quickly using the ratio of output voltage (VO) to input voltage (VIN):

(1)

The catch diode (D1) forward voltage drop and the voltage drop across the internal PMOS must be included to

calculate a more accurate duty cycle. Calculate D by using the following formula:

(2)

VSW can be approximated by:

VSW = IOUT × RDSON (3)

The diode forward drop (VD) can range from 0.3 V to 0.7 V depending on the quality of the diode. The lower the

VD, the higher the operating efficiency of the converter. The inductor value determines the output ripple current.

Lower inductor values decrease the size of the inductor, but increase the output ripple current. An increase in the

inductor value will decrease the output ripple current.

One must ensure that the minimum current limit (1.2 A) is not exceeded, so the peak current in the inductor must

be calculated. The peak current (ILPK) in the inductor is calculated by:

ILPK = IOUT +ΔiL(4)

Figure 20. Inductor Current

(5)

In general,

ΔiL= 0.1 × (IOUT)→0.2 × (IOUT) (6)

If ΔiL= 20% of 1 A, the peak current in the inductor will be 1.2 A. The minimum ensured current limit over all

operating conditions is 1.2 A. One can either reduce ΔiL, or make the engineering judgment that zero margin will

be safe enough. The typical current limit is 1.75 A.

Product Folder Links: LM2830 LM2830-Q1

'VOUT = 'ILRESR + 8 x FSW x COUT

IRMS_IN = IOUT x D(1 - D)

IRMS_IN DIOUT2 (1-D) + 'i2

x (VIN - VOUT)

L = 2'iL

DTS

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LM2830-Q1

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The LM2830 device operates at frequencies allowing the use of ceramic output capacitors without compromising

transient response. Ceramic capacitors allow higher inductor ripple without significantly increasing output ripple.

See the Output Capacitor for more details on calculating output voltage ripple. Now that the ripple current is

determined, the inductance is calculated by:

where

• Ts= 1/fs(7)

When selecting an inductor, make sure that it is capable of supporting the peak output current without saturating.

Inductor saturation will result in a sudden reduction in inductance and prevent the regulator from operating

correctly. Because of the speed of the internal current limit, it is necessary to specify the peak current of the

inductor only required maximum output current. For example, if the designed maximum output current is 1.0 A

and the peak current is 1.25 A, then the inductor should be specified with a saturation current limit of > 1.25 A.

There is no need to specify the saturation or peak current of the inductor at the 1.75-A typical switch current limit.

The difference in inductor size is a factor of 5. Because of the operating frequency of the LM2830 device, ferrite

based inductors are preferred to minimize core losses. This presents little restriction because the variety of

ferrite-based inductors is huge. Lastly, inductors with lower series resistance (RDCR) will provide better operating

efficiency.

8.2.1.2.2 Input Capacitor

An input capacitor is necessary to ensure that VIN does not drop excessively during switching transients. The

primary specifications of the input capacitor are capacitance, voltage, RMS current rating, and ESL (Equivalent

Series Inductance). The recommended input capacitance is 22 µF. The input voltage rating is specifically stated

by the capacitor manufacturer. Make sure to check any recommended deratings and also verify if there is any

significant change in capacitance at the operating input voltage and the operating temperature. The input

capacitor maximum RMS input current rating (IRMS-IN) must be greater than:

(8)

Neglecting inductor ripple simplifies the above equation to:

(9)

From Equation 9, it can be shown that maximum RMS capacitor current occurs when D = 0.5. Always calculate

the RMS at the point where the duty cycle D is closest to 0.5. The ESL of an input capacitor is usually

determined by the effective cross sectional area of the current path. A large leaded capacitor will have high ESL

and a 0805 ceramic chip capacitor will have very low ESL. At the operating frequencies of the LM2830 device,

leaded capacitors may have an ESL so large that the resulting impedance (2πfL) will be higher than that required

to provide stable operation. As a result, surface-mount capacitors are strongly recommended.

Sanyo POSCAP, Tantalum or Niobium, Panasonic SP, and multilayer ceramic capacitors (MLCC) are all good

choices for both input and output capacitors and have very low ESL. For MLCCs it is recommended to use X7R

or X5R type capacitors due to their tolerance and temperature characteristics. Consult the capacitor

manufacturer data sheets to see how rated capacitance varies over operating conditions.

8.2.1.2.3 Output Capacitor

The output capacitor is selected based upon the desired output ripple and transient response. The initial current

of a load transient is provided mainly by the output capacitor. The output ripple of the converter is:

(10)

When using MLCCs, the ESR is typically so low that the capacitive ripple may dominate. When this occurs, the

output ripple will be approximately sinusoidal and 90° phase shifted from the switching action. Given the

availability and quality of MLCCs and the expected output voltage of designs using the LM2830 device, there is

really no need to review any other capacitor technologies. Another benefit of ceramic capacitors is their ability to

bypass high frequency noise. A certain amount of switching edge noise will couple through parasitic

Product Folder Links: LM2830 LM2830-Q1

D = VOUT + VD + VDCR

VIN + VD + VDCR - VSW

D = VOUT + VD

VIN + VD - VSW

K = POUT

POUT + PLOSS

K =POUT

x R2

R1 = VREF

VOUT - 1

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SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

capacitances in the inductor to the output. A ceramic capacitor will bypass this noise while a tantalum will not.

Because the output capacitor is one of the two external components that control the stability of the regulator

control loop, most applications will require a minimum of 22 µF of output capacitance. Capacitance often, but not

always, can be increased significantly with little detriment to the regulator stability. Like the input capacitor,

recommended multilayer ceramic capacitors are X7R or X5R types.

8.2.1.2.4 Catch Diode

The catch diode (D1) conducts during the switch off-time. A Schottky diode is recommended for its fast switching

times and low forward voltage drop. The catch diode should be chosen so that its current rating is greater than:

ID1 = IOUT × (1-D) (11)

The reverse breakdown rating of the diode must be at least the maximum input voltage plus appropriate margin.

To improve efficiency, choose a Schottky diode with a low forward voltage drop.

8.2.1.2.5 Output Voltage

The output voltage is set using Equation 12, where R2 is connected between the FB pin and GND, and R1 is

connected between VOand the FB pin. A good value for R2 is 10 kΩ. When designing a unity gain converter (Vo

= 0.6 V), R1 should be between 0 Ωand 100 Ω, and R2 should be equal or greater than 10 kΩ.

(12)

VREF = 0.60 V (13)

8.2.1.2.6 Calculating Efficiency, and Junction Temperature

The complete LM2830 DC-DC converter efficiency can be calculated in the following manner.

(14)

(15)

Calculations for determining the most significant power losses are shown below. Other losses totaling less than

2% are not discussed.

Power loss (PLOSS) is the sum of two basic types of losses in the converter: switching and conduction.

Conduction losses usually dominate at higher output loads, whereas switching losses remain relatively fixed and

dominate at lower output loads. The first step in determining the losses is to calculate the duty cycle (D):

(16)

VSW is the voltage drop across the internal PFET when it is on, and is equal to:

VSW = IOUT × RDSON (17)

VDis the forward voltage drop across the Schottky catch diode. It can be obtained from the diode manufacturer's

Electrical Characteristics section. If the voltage drop across the inductor (VDCR) is accounted for, the equation

becomes:

(18)

The conduction losses in the free-wheeling Schottky diode are calculated as follows:

PDIODE = VD× IOUT × (1-D) (19)

Often this is the single most significant power loss in the circuit. Care should be taken to choose a Schottky

diode that has a low forward voltage drop.

Product Folder Links: LM2830 LM2830-Q1

PCOND= (IOUT2 x D) 1

1 + x'iL

IOUT

2RDSON

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

Another significant external power loss is the conduction loss in the output inductor. The equation can be

simplified to:

PIND = IOUT2× RDCR (20)

The conduction loss of the LC2830 device is mainly associated with the internal PFET:

(21)

If the inductor ripple current is fairly small, the conduction losses can be simplified to:

PCOND = IOUT2× RDSON × D (22)

Switching losses are also associated with the internal PFET. They occur during the switch on and off transition

periods, where voltages and currents overlap resulting in power loss. The simplest means to determine this loss

is to empirically measuring the rise and fall times (10% to 90%) of the switch at the switch node.

Switching Power Loss is calculated as follows:

PSWR = 1/2(VIN × IOUT × FSW × TRISE) (23)

PSWF = 1/2(VIN × IOUT × FSW × TFALL) (24)

PSW = PSWR + PSWF (25)

Another loss is the power required for operation of the internal circuitry:

PQ= IQ× VIN (26)

IQis the quiescent operating current, and is typically around 3.3 mA for the 1.6-MHz frequency option.

Table 2 lists typical application power losses.

Table 2. Power Loss Tabulation

Design Parameter Value Design Parameter Value

VIN 5.0 V

VOUT 3.3 V POUT 3.3 W

IOUT 1.0A

VD0.45 V PDIODE 150 mW

FSW 1.6 MHz

IQ3.3 mA PQ17 mW

TRISE 4 nS PSWR 6 mW

TFALL 4 nS PSWF 6 mW

RDS(ON) 150 mΩPCOND 100 mW

INDDCR 70 mΩPIND 70 mW

D 0.667 PLOSS 345 mW

η88% PINTERNAL 125 mW

ΣPCOND + PSW + PDIODE + PIND + PQ= PLOSS (27)

ΣPCOND + PSWF + PSWR + PQ= PINTERNAL (28)

PINTERNAL = 125mW (29)

Product Folder Links: LM2830 LM2830-Q1

LM2830

LM2830-Q1

www.ti.com

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

8.2.1.3 Application Curves

Figure 21 and Figure 22 show start-up waveforms.

Figure 22. VIN = 5.0 V, VOUT = 0.9 V, Iload = 1 A at –40°C

Figure 21. VIN = 5.0 V, VOUT = 0.6 V, Iload = 250 mA at 25°C

Product Folder Links: LM2830 LM2830-Q1

GND

VIN SW

VIN = 5V

LM2830

VO = 0.6V @ 1.0A

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

8.2.2 LM2830X Design Vo = 0.6 V at 1.0-A

Figure 23 shows typical application circuit for step-down solution from VIN=5 to VOUT=0.6 V, 1.0-A load current.

Figure 23. LM2830X (1.6 MHz): Vin = 5 V, Vo = 0.6 V at 1.0-A Schematic

Table 3. Bill of Materials

PART ID PART VALUE MANUFACTURER PART NUMBER

U1 1.0-A Buck Regulator TI LM2830X

C1, Input Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

C2, Output Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

D1, Catch Diode 0.3 VfSchottky 1.5 A, 30 VRTOSHIBA CRS08

L1 3.3 µH, 1.3 A Coilcraft ME3220-332

R2 10.0 kΩ, 1% Vishay CRCW08051000F

R1 0 Ω

R3 100 kΩ, 1% Vishay CRCW08051003F

Product Folder Links: LM2830 LM2830-Q1

GND

VIN SW

VIN = 5V

LM2830

VO = 3.3V @ 1.0A

LM2830

LM2830-Q1

www.ti.com

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

8.2.3 LM2830X Design Vo = 3.3 V at 1.0-A

Figure 24 shows typical application circuit for step down solution from VIN=5 to VOUT=3.3 V, 1.0-A load current.

Figure 24. LM2830X (1.6 MHz): Vin = 5 V, Vo = 3.3 V at 1.0-A Schematic

Table 4. Bill of Materials

PART ID PART VALUE MANUFACTURER PART NUMBER

U1 1.0-A Buck Regulator TI LM2830X

C1, Input Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

C2, Output Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

D1, Catch Diode 0.3 VfSchottky 1.5 A, 30 VRTOSHIBA CRS08

L1 2.2 µH, 1.8 A Coilcraft ME3220-222

R2 10.0 kΩ, 1% Vishay CRCW08051002F

R1 45.3 kΩ, 1% Vishay CRCW08054532F

R3 100 kΩ, 1% Vishay CRCW08051003F

Product Folder Links: LM2830 LM2830-Q1

GND

VIN SW

VIN = 5V

LM2830

VO = 3.3V @ 1.0A

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

8.2.4 LM2830Z Design Vo = 3.3 V at 1.0-A

Figure 25 shows typical application circuit for step down solution from VIN=5 to VOUT=3.3 V, 1.0-A load current

when using device version with higher switching frequency.

Figure 25. LM2830Z (3 MHz): Vin = 5 V, Vo = 3.3 V at 1.0-A Schematic

Table 5. Bill of Materials

PART ID PART VALUE MANUFACTURER PART NUMBER

U1 1.0-A Buck Regulator TI LM2830Z

C1, Input Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

C2, Output Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

D1, Catch Diode 0.3 VfSchottky 1.5 A, 30VRTOSHIBA CRS08

L1 1.6 µH, 2.0 A TDK VLCF4018T-1R6N1R7-2

R2 10.0 kΩ, 1% Vishay CRCW08051002F

R1 45.3 kΩ, 1% Vishay CRCW08054532F

R3 100 kΩ, 1% Vishay CRCW08051003F

Product Folder Links: LM2830 LM2830-Q1

GND

VIN SW

VIN = 5V

LM2830

VO = 1.2V @ 1.0A

LM2830

LM2830-Q1

www.ti.com

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

8.2.5 LM2830Z Design Vo = 1.2 V at 1.0-A

Figure 26 shows a typical application circuit for step down solution from VIN=5 to VOUT=1.2 V, 1.0-A load current

when using device version with higher switching frequency.

Figure 26. LM2830Z (3 MHz): Vin = 5 V, Vo = 1.2 V at 1.0-A Schematic

Table 6. Bill of Materials

PART ID PART VALUE MANUFACTURER PART NUMBER

U1 1.0-A Buck Regulator TI LM2830Z

C1, Input Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

C2, Output Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

D1, Catch Diode 0.3VfSchottky 1.5 A, 30VRTOSHIBA CRS08

L1 1.6 µH, 2.0 A TDK VLCF4018T-1R6N1R7-2

R2 10.0 kΩ, 1% Vishay CRCW08051002F

R1 10.0 kΩ, 1% Vishay CRCW08051002F

R3 100 kΩ, 1% Vishay CRCW08051003F

Product Folder Links: LM2830 LM2830-Q1

LP3470M5X-3.08

VINA

VIND

LM2830

GND

C3 VINAVIND

GND

R6 3

VIN

RESET

LP3470

VIN

VO = 3.3V @ 1.0A

VO = 1.2V @ 1.0A

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

8.2.6 LM2830X Dual Converters With Delayed Enabled Design

Figure 27 shows proposed solution with two LM2830 devices. Output of device on top (3.3-V output) is used to

control the enable pin of the lower device, thus ensuring that the second device (1.2-V output) can not turn on

before the output of first device (3.3-V in this example) reaches steady state. Additionally, small POR supervisory

(LP3470) circuit is used to monitor enable voltage for lower device. The RESET pin on POR circuit is open drain

and requires typically 20-kΩpullup resistor to the monitored voltage.

Figure 27. LM2830X (1.6 MHz): Vin = 5 V, Vo = 1.2 V at 1.0 A and 3.3 V at 1.0-A Schematic

Table 7. Bill of Materials

PART ID PART VALUE MANUFACTURER PART NUMBER

U1, U2 1.0-A Buck Regulator TI LM2830X

U3 Power on Reset TI LP3470M5X-3.08

C1, C3 Input Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

C2, C4 Output Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

C7 Trr delay capacitor TDK

D1, D2 Catch Diode 0.3 VfSchottky 1.5 A, 30 VRTOSHIBA CRS08

L1, L2 3.3 µH, 1.3 A Coilcraft ME3220-332

R2, R4, R5 10.0 kΩ, 1% Vishay CRCW08051002F

R1, R6 45.3 kΩ, 1% Vishay CRCW08054532F

R3 100 kΩ, 1% Vishay CRCW08051003F

Product Folder Links: LM2830 LM2830-Q1

LDO

EN FB

VINA

VIND

GND VO = 3.3V @ 1.0A

VO = 5V @ 150mA

LM2830

VIN = 5V

LM2830

LM2830-Q1

www.ti.com

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

8.2.7 LM2830X Buck Converter and Voltage Double Circuit With LDO Follower

Figure 28 shows an example where the LM2830 device is used to provide regulated output voltage (3.3 V) as

well as input voltage for an LDO, effectively providing solution with two output voltages.

Figure 28. LM2830X (1.6 MHz): Vin = 5 V, Vo = 3.3 V at 1.0 A and LP2986-5.0 at 150-mA Schematic

Table 8. Bill of Materials

PART ID PART VALUE MANUFACTURER PART NUMBER

U1 1.0-A Buck Regulator TI LM2830X

U2 200-mA LDO TI LP2986-5.0

C1, Input Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

C2, Output Cap 22 µF, 6.3 V, X5R TDK C3216X5ROJ226M

C3 – C6 2.2 µF, 6.3 V, X5R TDK C1608X5R0J225M

D1, Catch Diode 0.3 VfSchottky 1.5 A, 30 VRTOSHIBA CRS08

D2 0.4 VfSchottky 20 VR, 500 mA ON Semi MBR0520

L2 10 µH, 800 mA CoilCraft ME3220-103

L1 3.3 µH, 2.2 A TDK VLCF5020T-3R3N2R0-1

R2 45.3 kΩ, 1% Vishay CRCW08054532F

R1 10.0 kΩ, 1% Vishay CRCW08051002F

Product Folder Links: LM2830 LM2830-Q1

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

9 Power Supply Recommendations

The LM2830 is designed to operate from an input voltage supply range between 3.0 V and 5.5 V. This input

supply should be able to withstand the maximum input current and maintain a voltage above 3.0 V. If the input

supply is located farther away (more than a few inches) from the LM2830, additional bulk capacitance may be

required in addition to the ceramic bypass capacitors.

10 Layout

10.1 Layout Guidelines

When planning layout there are a few things to consider when trying to achieve a clean, regulated output. The

most important consideration is the close coupling of the GND connections of the input capacitor and the catch

diode D1. These ground ends should be close to one another and be connected to the GND plane with at least

two through-holes. Place these components as close to the IC as possible. Next in importance is the location of

the GND connection of the output capacitor, which should be near the GND connections of CIN and D1.

There should be a continuous ground plane on the bottom layer of a two-layer board except under the switching

node island.

The FB pin is a high-impedance node and care should be taken to make the FB trace short to avoid noise pickup

and inaccurate regulation. The feedback resistors should be placed as close as possible to the IC, with the GND

of R1 placed as close as possible to the GND of the IC. The VOUT trace to R2 should be routed away from the

inductor and any other traces that are switching.

High AC currents flow through the VIN, SW and VOUT traces, so they should be as short and wide as possible.

However, making the traces wide increases radiated noise, so the designer must make this trade-off. Radiated

noise can be decreased by choosing a shielded inductor.

The remaining components should also be placed as close as possible to the IC. See Application Note AN-1229

SNVA054 for further considerations and the LM2830 demo board as an example of a four-layer layout.

10.2 Layout Example

Figure 29. Example Schematic

Product Folder Links: LM2830 LM2830-Q1

LM2830

LM2830-Q1

www.ti.com

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

Layout Example (continued)

Figure 30. PCB Layout Example

10.3 Thermal Considerations

The PCB size, weight of copper used to route traces and ground plane, and number of layers within the PCB can

greatly effect RθJA. The type and number of thermal vias can also make a large difference in the thermal

impedance. Thermal vias are necessary in most applications. They conduct heat from the surface of the PCB to

the ground plane. Four to six thermal vias should be placed under the exposed pad to the ground plane if the

WSON package is used.

Thermal impedance also depends on the thermal properties of the application operating conditions (Vin, Vo, Io

etc), and the surrounding circuitry.

Silicon Junction Temperature Determination Method 1:

To accurately measure the silicon temperature for a given application, two methods can be used. The first

method requires the user to know the thermal impedance of the silicon junction to top case temperature.

Some clarification needs to be made before we go any further.

RθJC is the thermal impedance from all six sides of an IC package to silicon junction.

RΦJC is the thermal impedance from top case to the silicon junction.

In this data sheet we will use RΦJC so that it allows the user to measure top case temperature with a small

thermocouple attached to the top case.

Product Folder Links: LM2830 LM2830-Q1

RTJA=165oC - 144oC

189 mW = 111o C/W

RTJA=165° - Ta

PINTERNAL

R)JC=TJ - TC

Power

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

Thermal Considerations (continued)

RΦJC is approximately 30°C/Watt for the 6-pin WSON package with the exposed pad. Knowing the internal

dissipation from the efficiency calculation given previously, and the case temperature, which can be empirically

measured on the bench we have:

(30)

Therefore:

Tj= (RΦJC x PLOSS)+TC(31)

From the previous example:

Tj= (RΦJC x PINTERNAL)+TC(32)

Tj= 30°C/W x 0.189W + TC(33)

The second method can give a very accurate silicon junction temperature.

The first step is to determine RθJA of the application. The LM2830 device has over-temperature protection

circuitry. When the silicon temperature reaches 165°C, the device stops switching. The protection circuitry has a

hysteresis of about 15°C. Once the silicon temperature has decreased to approximately 150°C, the device will

start to switch again. Knowing this, the RθJA for any application can be characterized during the early stages of

the design one may calculate the RθJA by placing the PCB circuit into a thermal chamber. Raise the ambient

temperature in the given working application until the circuit enters thermal shutdown. If the SW-pin is monitored,

it will be obvious when the internal PFET stops switching, indicating a junction temperature of 165°C. Knowing

the internal power dissipation from the above methods, the junction temperature, and the ambient temperature

RθJA can be determined.

(34)

Once this is determined, the maximum ambient temperature allowed for a desired junction temperature can be

found.

An example of calculating RθJA for an application using the Texas Instruments LM2830 WSON demonstration

board is shown below.

The four layer PCB is constructed using FR4 with ½ oz copper traces. The copper ground plane is on the bottom

layer. The ground plane is accessed by two vias. The board measures 3-cm × 3-cm. It was placed in an oven

with no forced airflow. The ambient temperature was raised to 144°C, and at that temperature, the device went

into thermal shutdown.

From the previous example:

PINTERNAL = 189mW (35)

(36)

If the junction temperature was to be kept below 125°C, then the ambient temperature could not go above 109°C

Tj- (RθJA x PLOSS)=TA(37)

125°C - (111°C/W x 189mW) = 104°C (38)

Product Folder Links: LM2830 LM2830-Q1

VINA

VIND

GND GND

PLANE

LM2830

LM2830-Q1

www.ti.com

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

10.4 WSON Package

Figure 31. Internal WSON Connection

For certain high-power applications, the PCB land may be modified to a "dog bone" shape (see Figure 32). By

increasing the size of ground plane, and adding thermal vias, the RθJA for the application can be reduced.

Figure 32. 6-Lead WSON PCB "Dog Bone" Layout

Product Folder Links: LM2830 LM2830-Q1

RTJA=TJ - TA

Power

RT='T

Power

LM2830

LM2830-Q1

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

www.ti.com

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Thermal Definitions

TJChip junction temperature

TAAmbient temperature

RθJC Thermal resistance from chip junction to device case

RθJA Thermal resistance from chip junction to ambient air

Heat in the LM2830 device due to internal power dissipation is removed through conduction and/or convection.

Conduction: Heat transfer occurs through cross sectional areas of material. Depending on the material, the

transfer of heat can be considered to have poor to good thermal conductivity properties (insulator

vs. conductor).

Heat Transfer goes as:

Silicon →package →lead frame →PCB

Convection: Heat transfer is by means of airflow. This could be from a fan or natural convection. Natural

convection occurs when air currents rise from the hot device to cooler air.

Thermal impedance is defined as:

(39)

Thermal impedance from the silicon junction to the ambient air is defined as:

(40)

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 9. Related Links

TECHNICAL TOOLS & SUPPORT &

PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

LM2830 Click here Click here Click here Click here Click here

LM2830-Q1 Click here Click here Click here Click here Click here

11.3 Trademarks

All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LM2830 LM2830-Q1

LM2830

LM2830-Q1

www.ti.com

SNVS454E –AUGUST 2006–REVISED DECEMBER 2014

11.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LM2830 LM2830-Q1

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2830XMF NRND SOT-23 DBV 5 1000 Non-RoHS &

Non-Green Call TI Call TI -40 to 125 SKTB

LM2830XMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SKTB

LM2830XMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SKTB

LM2830XQMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SUFB

LM2830XQMFE/NOPB ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SUFB

LM2830XQMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SUFB

LM2830ZMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SKXB

LM2830ZQMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SURB

LM2830ZQMFE/NOPB ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SURB

LM2830ZQMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SURB

LM2830ZSD/NOPB ACTIVE WSON NGG 6 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L192B

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM2830, LM2830-Q1 :

•Catalog: LM2830

•Automotive: LM2830-Q1

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM2830XMF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830XMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830XMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830XQMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830XQMFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830XQMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830ZMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830ZQMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830ZQMFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830ZQMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM2830ZSD/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM2830XMF SOT-23 DBV 5 1000 210.0 185.0 35.0

LM2830XMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM2830XMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM2830XQMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM2830XQMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0

LM2830XQMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM2830ZMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM2830ZQMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM2830ZQMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0

LM2830ZQMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM2830ZSD/NOPB WSON NGG 6 1000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

0.22

0.08 TYP

0.25

3.0

2.6

2X 0.95

1.9

1.45

0.90

0.15

0.00 TYP

5X 0.5

0.3

0.6

0.3 TYP

0 TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/E 09/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/E 09/2019

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/E 09/2019

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

8. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

MECHANICAL DATA

NGG0006A

www.ti.com

SDE06A (Rev A)

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