Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 LM2830/-Q1 High-Frequency 1.0-A Load Step-Down DC-DC Regulator 1 Features 3 Description * The LM2830 regulator is a monolithic, highfrequency, PWM step-down DC-DC converter in a 5pin SOT-23 and a 6-Pin WSON package. The device provides all the active functions to provide local DCDC conversion with fast transient response and accurate regulation in the smallest possible PCB area. With a minimum of external components, the LM2830 regulator is easy to use. The ability to drive 1.0-A loads with an internal 130-m PMOS switch using state-of-the-art 0.5-m BiCMOS technology results in the best power density available. The worldclass control circuitry allows on-times as low as 30 ns, thus supporting exceptionally high frequency conversion over the entire 3-V to 5.5-V input operating range down to the minimum output voltage of 0.6 V. Switching frequency is internally set to 1.6 MHz, or 3.0 MHz, allowing the use of extremely small surface-mount inductors and chip capacitors. Even though the operating frequency is high, efficiencies up to 93% are easy to achieve. External shutdown is included, featuring an ultra-low standby current of 30 nA. The LM2830 regulator uses current-mode control and internal compensation to provide highperformance regulation over a wide range of operating conditions. Additional features include internal soft-start circuitry to reduce inrush current, pulse-by-pulse current limit, thermal shutdown, and output overvoltage protection. 1 * * * * * * * * * * * LM2830Z-Q1 and LM2830X-Q1 in the SOT-23 Package are Automotive-Grade Products that are AEC-Q100 Grade 1 Qualified (-40C to +125C Operating Junction Temperature) Space-Saving SOT-23 Package Input Voltage Range of 3.0 V to 5.5 V Output Voltage Range of 0.6 V to 4.5 V 1.0-A Output Current High Switching Frequencies - 1.6 MHz (LM2830X) - 3.0 MHz (LM2830Z) 130-m PMOS Switch 0.6-V, 2% Internal Voltage Reference Internal Soft-Start Current Mode, PWM Operation Thermal Shutdown Overvoltage Protection 2 Applications * * * * * * Local 5-V to Vcore Step-Down Converters Core Power in HDDs Set-Top Boxes USB Powered Devices DSL Modems Automotive Device Information(1) PART NUMBER LM2830 LM2830-Q1 PACKAGE BODY SIZE (NOM) SOT (5) 2.90 mm x 1.60 mm WSON (6) 3.00 mm x 3.00 mm SOT (5) 2.90 mm x 1.60 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Typical Application Circuit FB EN LM2830 R3 VIN Efficiency vs Load Current GND L1 SW VO = 3.3V @ 1.0A VIN = 5V R1 C1 D1 C2 C3 R2 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings: LM2830 .............................................. ESD Ratings: LM2830-Q1 ........................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 9 7.1 Overview ................................................................... 9 7.2 Functional Block Diagram ....................................... 10 7.3 Feature Description................................................. 10 7.4 Device Functional Modes........................................ 11 8 Application and Implementation ........................ 12 8.1 Application Information............................................ 12 8.2 Typical Applications ................................................ 12 9 Power Supply Recommendations...................... 24 10 Layout................................................................... 24 10.1 10.2 10.3 10.4 Layout Guidelines ................................................. Layout Example .................................................... Thermal Considerations ........................................ WSON Package .................................................... 24 24 25 27 11 Device and Documentation Support ................. 28 11.1 11.2 11.3 11.4 11.5 Device Support...................................................... Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 28 28 28 28 29 12 Mechanical, Packaging, and Orderable Information ........................................................... 29 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (April 2013) to Revision E * Page Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Changes from Revision C (April 2013) to Revision D * 2 Page Changed layout of National Data Sheet to TI format ........................................................................................................... 23 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 5 Pin Configuration and Functions WSON Package 6-Pin Top View FB 1 GND 2 SW 3 6 EN DAP 5 VINA 4 VIND SOT Package 5-Pins Top View EN 4 3 FB 2 GND VIN 5 1 SW Pin Functions (5-Pin SOT) PIN NAME NO. I/O (1) DESCRIPTION SW 1 O Output switch. Connect to the inductor and catch diode. GND 2 G Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin. FB 3 I Feedback pin. Connect to external resistor divider to set output voltage. EN 4 I Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VIN + 0.3 V. VIN 5 I/P (1) Input supply voltage. I: Input Pin, O: Output Pin, P: Power Pin, G: Ground Pin Pin Functions (6-Pin WSON) PIN NAME NO. I/O (1) DESCRIPTION FB 1 I Feedback pin. Connect to external resistor divider to set output voltage. GND 2 G Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin. SW 3 O Output switch. Connect to the inductor and catch diode. VIND 4 I/P Power Input supply. VINA 5 I/P Control circuitry supply voltage. Connect VINA to VIND on PC board. EN 6 I Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VINA + 0.3V. Die Attach Pad - - Connect to system ground for low thermal impedance, but it cannot be used as a primary GND connection. (1) I: Input Pin, O: Output Pin, P: Power Pin, G: Ground Pin Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 3 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT VIN -0.5 7 V FB Voltage -0.5 3 V EN Voltage -0.5 7 V SW Voltage -0.5 Junction Temperature (3) Tstg (1) (2) (3) Storage temperature -65 7 V 150 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device. 6.2 ESD Ratings: LM2830 VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) 1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 ESD Ratings: LM2830-Q1 VALUE Human body model (HBM), per AEC Q100-002 (1) V(ESD) (1) Electrostatic discharge Charged device model (CDM), per AEC Q100-011 UNIT 2000 WSON corner pins (1, 3, 4, and 6) 1000 SOT-23 corner pins (1, 3, 4, and 5) 1000 Other pins 1000 V AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.4 Recommended Operating Conditions MIN VIN Junction Temperature NOM MAX UNIT 3 5.5 V -40 125 C 6.5 Thermal Information THERMAL METRIC (1) LM2830, LM2830-Q1 LM2830 DBV NGG 5 PINS 6 PINS RJA Junction-to-ambient thermal resistance 165.2 53.9 RJC(top) Junction-to-case (top) thermal resistance 69.9 51.2 RJB Junction-to-board thermal resistance 27.3 28.2 JT Junction-to-top characterization parameter 1.8 0.6 JB Junction-to-board characterization parameter 26.8 28.3 RJC(bot) Junction-to-case (bottom) thermal resistance N/A 8.1 (1) 4 UNIT C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 6.6 Electrical Characteristics VIN = 5 V unless otherwise indicated. Typical values correspond to TJ = 25C. Minimum and maximum limits apply over -40C to 125C junction temperature range unless otherwise stated. PARAMETER TEST CONDITIONS VFB Feedback Voltage WSON and SOT-23 Package VFB/VIN Feedback Voltage Line Regulation VIN = 3 V to 5 V IB Feedback Input Bias Current UVLO MIN TYP MAX UNIT 0.588 0.600 0.612 V 0.02 VIN Rising Undervoltage Lockout Switching Frequency DMAX Maximum Duty Cycle DMIN Switch On Resistance ICL Switch Current Limit VEN_TH V 1.85 LM2830-X 1.2 1.6 1.95 LM2830-Z 2.25 3.0 3.75 LM2830-X 86% 94% LM2830-Z 82% 90% LM2830-X 2.3 7% WSON Package 150 SOT-23 Package 130 VIN = 3.3 V IEN Enable Pin Current 1.2 195 1.75 0.4 100 Quiescent Current (shutdown) m A 1.8 Quiescent Current (switching) MHz 5% LM2830-Z Enable Threshold Voltage Switch Leakage TSD 2.90 Shutdown Threshold Voltage ISW IQ nA 2.73 0.43 Minimum Duty Cycle RDS(ON) 100 VIN Falling UVLO Hysteresis FSW %/V 0.1 V nA Sink/Source 100 LM2830X VFB = 0.55 3.3 5 mA LM2830Z VFB = 0.55 4.3 6.5 mA All Options VEN = 0 V Thermal Shutdown Temperature Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 nA 30 nA 165 C Submit Documentation Feedback 5 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com 6.7 Typical Characteristics All curves taken at VIN = 5.0 V with configuration in typical application circuit shown in Application Information section of this data sheet. TJ = 25C, unless otherwise specified. 6 Figure 1. vs Load "X" Vin = 5 V, Vo = 1.8 V and 3.3 V Figure 2. vs Load "Z" Vin = 5 V, Vo = 3.3 V and 1.8 V Figure 3. vs Load "X and Z" Vin = 3.3 V, Vo = 1.8 V Figure 4. Load Regulation Vin = 3.3 V, Vo = 1.8 V (All Options) Figure 5. Load Regulation Vin = 5 V, Vo = 1.8 V (All Options) Figure 6. Load Regulation Vin = 5 V, Vo = 3.3 V (All Options) Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 Typical Characteristics (continued) All curves taken at VIN = 5.0 V with configuration in typical application circuit shown in Application Information section of this data sheet. TJ = 25C, unless otherwise specified. 3.45 OSCILLATOR FREQUENCY (MHz) OSCILLATOR FREQUENCY (MHz) 1.81 1.76 1.71 1.66 1.61 1.56 1.51 1.46 1.41 1.36 -45 -40 -10 20 50 3.35 3.25 3.15 3.05 2.95 2.85 2.75 2.65 2.55 -45 -40 80 110 125 130 -10 20 50 80 110 125 130 TEMPERATURE (C) TEMPERATURE (C) Figure 7. Oscillator Frequency vs Temperature - "X" Figure 8. Oscillator Frequency vs Temperature - "Z" 2000 1950 CURRENT LIMIT (mA) 1900 1850 1800 1750 1700 1650 1600 1550 1500 -45 -40 -10 20 50 80 110 125 130 TEMPERATURE (oC) Figure 9. Current Limit vs Temperature Vin = 3.3 V Figure 10. RDSON vs Temperature (WSON Package) 3.6 3.5 IQ (mA) 3.4 3.3 3.2 3.1 3.0 -45 -40 -10 20 50 80 110 125 130 TEMPERATURE (C) Figure 11. RDSON vs Temperature (SOT-23 Package) Figure 12. LM2830X IQ (Quiescent Current) Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 7 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com Typical Characteristics (continued) All curves taken at VIN = 5.0 V with configuration in typical application circuit shown in Application Information section of this data sheet. TJ = 25C, unless otherwise specified. 4.6 4.5 IQ (mA) 4.4 4.3 4.2 4.1 4.0 -45 -40 -10 20 50 80 110 125 130 TEMPERATURE (C) Figure 13. LM2830Z IQ (Quiescent Current) Figure 14. Line Regulation Vo = 1.8 V, Io = 500 mA FEEBACK VOLTAGE (V) 0.610 0.605 0.600 0.595 0.590 -45 -40 -10 20 50 80 110 125 130 TEMPERATURE (C) Figure 15. VFB vs Temperature Figure 16. Gain vs Frequency (Vin = 5 V, Vo = 1.2 V at 1 A) Figure 17. Phase Plot vs Frequency (Vin = 5 V, Vo = 1.2 V at 1 A) 8 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 7 Detailed Description 7.1 Overview The LM2830 device is a constant frequency PWM buck regulator IC that delivers a 1.0-A load current. The regulator has a preset switching frequency of 1.6 MHz or 3.0 MHz. This high frequency allows the LM2830 device to operate with small surface-mount capacitors and inductors, resulting in a DC-DC converter that requires a minimum amount of board space. The LM2830 device is internally compensated, so it is simple to use and requires few external components. The LM2830 device uses current-mode control to regulate the output voltage. The following operating description of the LM2830 device will refer to the Simplified Block Diagram (Functional Block Diagram) and to the waveforms in Figure 18. The LM2830 device supplies a regulated output voltage by switching the internal PMOS control switch at constant frequency and variable duty cycle. A switching cycle begins at the falling edge of the reset pulse generated by the internal oscillator. When this pulse goes low, the output control logic turns on the internal PMOS control switch. During this on-time, the SW pin voltage (VSW) swings up to approximately VIN, and the inductor current (IL) increases with a linear slope. IL is measured by the current sense amplifier, which generates an output proportional to the switch current. The sense signal is summed with the regulator's corrective ramp and compared to the error amplifier's output, which is proportional to the difference between the feedback voltage and VREF. When the PWM comparator output goes high, the output switch turns off until the next switching cycle begins. During the switch off-time, inductor current discharges through the Schottky catch diode, which forces the SW pin to swing below ground by the forward voltage (VD) of the Schottky catch diode. The regulator loop adjusts the duty cycle (D) to maintain a constant output voltage. VSW D = TON/TSW VIN SW Voltage TOFF TON 0 VD IL t TSW IPK Inductor Current 0 t Figure 18. Typical Waveforms Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 9 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com 7.2 Functional Block Diagram EN VIN + ENABLE and UVLO ThermalSHDN I SENSE - + - I LIMIT - 1 .15 x VREF + OVPSHDN Ramp Artificial Control Logic cv FB S R R Q 1.6 MHz + I SENSE PFET - + DRIVER Internal - Comp SW VREF = 0.6V SOFT - START Internal - LDO GND 7.3 Feature Description 7.3.1 Soft-Start This function forces VOUT to increase at a controlled rate during start up. During soft-start, the error reference voltage of the amplifier ramps from 0 V to its nominal value of 0.6 V in approximately 600 s. This forces the regulator output to ramp up in a controlled fashion, which helps reduce inrush current. 7.3.2 Output Overvoltage Protection The overvoltage comparator compares the FB pin voltage to a voltage that is 15% higher than the internal reference VREF. Once the FB pin voltage goes 15% above the internal reference, the internal PMOS control switch is turned off, which allows the output voltage to decrease toward regulation. 7.3.3 Undervoltage Lockout Undervoltage lockout (UVLO) prevents the LM2830 device from operating until the input voltage exceeds 2.73 V (typical). The UVLO threshold has approximately 430 mV of hysteresis, so the part will operate until VIN drops below 2.3V (typical). Hysteresis prevents the part from turning off during power up if VIN is nonmonotonic. 10 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 Feature Description (continued) 7.3.4 Current Limit The LM2830 device uses cycle-by-cycle current limiting to protect the output switch. During each switching cycle, a current limit comparator detects if the output switch current exceeds 1.75 A (typical), and turns off the switch until the next switching cycle begins. 7.3.5 Thermal Shutdown Thermal shutdown limits total power dissipation by turning off the output switch when the IC junction temperature exceeds 165C. After thermal shutdown occurs, the output switch does not turn on until the junction temperature drops to approximately 150C. 7.4 Device Functional Modes In normal operational mode, the device will regulate output voltage to the value set with resistive divider. In addition, this device has an enable (EN) pin that lets the user turn the device on and off by driving this pin high and low. Default setup is that this pin is connected to VIN through pull up resistor (typically 100 k). When enable pin is low the device is in shutdown mode consuming typically only 30 nA, making it ideal for applications where low power consumption is desirable. Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 11 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The device operates with input voltage in the range of 3.3 V to 5.5 V and provide regulated output voltage up to 1 A of continuous DC load. This device is optimized for high efficiency operation with minimum number of external components. Also, high switching frequency allows use of small surface-mount components enabling very small solution size. For component selection, see Detailed Design Procedure. 8.2 Typical Applications 8.2.1 LM2830X Design Vo = 1.2 V at 1.0A FB EN LM2830 R3 GND L1 VIN VO = 1.2V @ 1.0A SW VIN = 5V R1 C1 D1 C2 R2 Figure 19. LM2830X (1.6 MHz): Vin = 5 V, Vo = 1.2 V at 1.0-A Schematic 8.2.1.1 Design Requirements This device must be able to operate at any voltage within input voltage range. Load Current must be defined to properly size the inductor, input and output capacitors. Inductor should be able to handle full expected load current as well as the peak current generated during load transients and start up. Inrush current at startup will depend on the output capacitor selection. More details are provided in Detailed Design Procedure. Device has an enable (EN) pin that is used to enable and disable the device. This pin is active high and should not be left floating in application. 8.2.1.2 Detailed Design Procedure Table 1. Bill of Materials 12 PART ID PART VALUE MANUFACTURER PART NUMBER U1 1.0-A Buck Regulator TI LM2830X C1, Input Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M C2, Output Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M D1, Catch Diode 0.3 Vf Schottky 1.5 A, 30 VR TOSHIBA CRS08 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 Typical Applications (continued) Table 1. Bill of Materials (continued) PART ID PART VALUE MANUFACTURER PART NUMBER L1 3.3 H, 1.3 A Coilcraft ME3220-332 R2 15.0 k, 1% Vishay CRCW08051502F R1 15.0 k, 1% Vishay CRCW08051502F R3 100 k, 1% Vishay CRCW08051003F 8.2.1.2.1 Inductor Selection The Duty Cycle (D) can be approximated quickly using the ratio of output voltage (VO) to input voltage (VIN): D= VOUT VIN (1) The catch diode (D1) forward voltage drop and the voltage drop across the internal PMOS must be included to calculate a more accurate duty cycle. Calculate D by using the following formula: VOUT + VD D= VIN + VD - VSW (2) VSW can be approximated by: VSW = IOUT x RDSON (3) The diode forward drop (VD) can range from 0.3 V to 0.7 V depending on the quality of the diode. The lower the VD, the higher the operating efficiency of the converter. The inductor value determines the output ripple current. Lower inductor values decrease the size of the inductor, but increase the output ripple current. An increase in the inductor value will decrease the output ripple current. One must ensure that the minimum current limit (1.2 A) is not exceeded, so the peak current in the inductor must be calculated. The peak current (ILPK) in the inductor is calculated by: ILPK = IOUT + iL (4) 'i L I OUT VIN - VOUT VOUT L L DTS TS t Figure 20. Inductor Current VIN - VOUT L = 2'iL DTS (5) In general, iL = 0.1 x (IOUT) 0.2 x (IOUT) (6) If iL = 20% of 1 A, the peak current in the inductor will be 1.2 A. The minimum ensured current limit over all operating conditions is 1.2 A. One can either reduce iL, or make the engineering judgment that zero margin will be safe enough. The typical current limit is 1.75 A. Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 13 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com The LM2830 device operates at frequencies allowing the use of ceramic output capacitors without compromising transient response. Ceramic capacitors allow higher inductor ripple without significantly increasing output ripple. See the Output Capacitor for more details on calculating output voltage ripple. Now that the ripple current is determined, the inductance is calculated by: DTS x (VIN - VOUT) L= 2'iL where * Ts = 1/fs (7) When selecting an inductor, make sure that it is capable of supporting the peak output current without saturating. Inductor saturation will result in a sudden reduction in inductance and prevent the regulator from operating correctly. Because of the speed of the internal current limit, it is necessary to specify the peak current of the inductor only required maximum output current. For example, if the designed maximum output current is 1.0 A and the peak current is 1.25 A, then the inductor should be specified with a saturation current limit of > 1.25 A. There is no need to specify the saturation or peak current of the inductor at the 1.75-A typical switch current limit. The difference in inductor size is a factor of 5. Because of the operating frequency of the LM2830 device, ferrite based inductors are preferred to minimize core losses. This presents little restriction because the variety of ferrite-based inductors is huge. Lastly, inductors with lower series resistance (RDCR) will provide better operating efficiency. 8.2.1.2.2 Input Capacitor An input capacitor is necessary to ensure that VIN does not drop excessively during switching transients. The primary specifications of the input capacitor are capacitance, voltage, RMS current rating, and ESL (Equivalent Series Inductance). The recommended input capacitance is 22 F. The input voltage rating is specifically stated by the capacitor manufacturer. Make sure to check any recommended deratings and also verify if there is any significant change in capacitance at the operating input voltage and the operating temperature. The input capacitor maximum RMS input current rating (IRMS-IN) must be greater than: IRMS_IN D IOUT2 (1-D) + 'i2 3 (8) Neglecting inductor ripple simplifies the above equation to: IRMS_IN = IOUT x D(1 - D) (9) From Equation 9, it can be shown that maximum RMS capacitor current occurs when D = 0.5. Always calculate the RMS at the point where the duty cycle D is closest to 0.5. The ESL of an input capacitor is usually determined by the effective cross sectional area of the current path. A large leaded capacitor will have high ESL and a 0805 ceramic chip capacitor will have very low ESL. At the operating frequencies of the LM2830 device, leaded capacitors may have an ESL so large that the resulting impedance (2fL) will be higher than that required to provide stable operation. As a result, surface-mount capacitors are strongly recommended. Sanyo POSCAP, Tantalum or Niobium, Panasonic SP, and multilayer ceramic capacitors (MLCC) are all good choices for both input and output capacitors and have very low ESL. For MLCCs it is recommended to use X7R or X5R type capacitors due to their tolerance and temperature characteristics. Consult the capacitor manufacturer data sheets to see how rated capacitance varies over operating conditions. 8.2.1.2.3 Output Capacitor The output capacitor is selected based upon the desired output ripple and transient response. The initial current of a load transient is provided mainly by the output capacitor. The output ripple of the converter is: 1 'VOUT = 'IL RESR + 8 x FSW x COUT (10) When using MLCCs, the ESR is typically so low that the capacitive ripple may dominate. When this occurs, the output ripple will be approximately sinusoidal and 90 phase shifted from the switching action. Given the availability and quality of MLCCs and the expected output voltage of designs using the LM2830 device, there is really no need to review any other capacitor technologies. Another benefit of ceramic capacitors is their ability to bypass high frequency noise. A certain amount of switching edge noise will couple through parasitic 14 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 capacitances in the inductor to the output. A ceramic capacitor will bypass this noise while a tantalum will not. Because the output capacitor is one of the two external components that control the stability of the regulator control loop, most applications will require a minimum of 22 F of output capacitance. Capacitance often, but not always, can be increased significantly with little detriment to the regulator stability. Like the input capacitor, recommended multilayer ceramic capacitors are X7R or X5R types. 8.2.1.2.4 Catch Diode The catch diode (D1) conducts during the switch off-time. A Schottky diode is recommended for its fast switching times and low forward voltage drop. The catch diode should be chosen so that its current rating is greater than: ID1 = IOUT x (1-D) (11) The reverse breakdown rating of the diode must be at least the maximum input voltage plus appropriate margin. To improve efficiency, choose a Schottky diode with a low forward voltage drop. 8.2.1.2.5 Output Voltage The output voltage is set using Equation 12, where R2 is connected between the FB pin and GND, and R1 is connected between VO and the FB pin. A good value for R2 is 10 k. When designing a unity gain converter (Vo = 0.6 V), R1 should be between 0 and 100 , and R2 should be equal or greater than 10 k. VOUT - 1 x R2 R1 = VREF (12) VREF = 0.60 V (13) 8.2.1.2.6 Calculating Efficiency, and Junction Temperature The complete LM2830 DC-DC converter efficiency can be calculated in the following manner. K= POUT PIN (14) Or K= POUT POUT + PLOSS (15) Calculations for determining the most significant power losses are shown below. Other losses totaling less than 2% are not discussed. Power loss (PLOSS) is the sum of two basic types of losses in the converter: switching and conduction. Conduction losses usually dominate at higher output loads, whereas switching losses remain relatively fixed and dominate at lower output loads. The first step in determining the losses is to calculate the duty cycle (D): D= VOUT + VD VIN + VD - VSW (16) VSW is the voltage drop across the internal PFET when it is on, and is equal to: VSW = IOUT x RDSON (17) VD is the forward voltage drop across the Schottky catch diode. It can be obtained from the diode manufacturer's Electrical Characteristics section. If the voltage drop across the inductor (VDCR) is accounted for, the equation becomes: D= VOUT + VD + VDCR VIN + VD + VDCR - VSW (18) The conduction losses in the free-wheeling Schottky diode are calculated as follows: PDIODE = VD x IOUT x (1-D) (19) Often this is the single most significant power loss in the circuit. Care should be taken to choose a Schottky diode that has a low forward voltage drop. Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 15 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com Another significant external power loss is the conduction loss in the output inductor. The equation can be simplified to: PIND = IOUT2 x RDCR (20) The conduction loss of the LC2830 device is mainly associated with the internal PFET: PCOND= (IOUT2 x D) 1 + 'iL 1 x 3 IOUT 2 RDSON (21) If the inductor ripple current is fairly small, the conduction losses can be simplified to: PCOND = IOUT2 x RDSON x D (22) Switching losses are also associated with the internal PFET. They occur during the switch on and off transition periods, where voltages and currents overlap resulting in power loss. The simplest means to determine this loss is to empirically measuring the rise and fall times (10% to 90%) of the switch at the switch node. Switching Power Loss is calculated as follows: PSWR = 1/2(VIN x IOUT x FSW x TRISE) PSWF = 1/2(VIN x IOUT x FSW x TFALL) PSW = PSWR + PSWF (23) (24) (25) Another loss is the power required for operation of the internal circuitry: PQ = IQ x VIN (26) IQ is the quiescent operating current, and is typically around 3.3 mA for the 1.6-MHz frequency option. Table 2 lists typical application power losses. Table 2. Power Loss Tabulation Design Parameter Value VIN 5.0 V VOUT 3.3 V IOUT 1.0A Design Parameter Value POUT 3.3 W PDIODE 150 mW VD 0.45 V FSW 1.6 MHz IQ 3.3 mA PQ 17 mW TRISE 4 nS PSWR 6 mW TFALL 4 nS PSWF 6 mW RDS(ON) 150 m PCOND 100 mW INDDCR 70 m PIND 70 mW D 0.667 PLOSS 345 mW 88% PINTERNAL 125 mW PCOND + PSW + PDIODE + PIND + PQ = PLOSS PCOND + PSWF + PSWR + PQ = PINTERNAL PINTERNAL = 125mW 16 Submit Documentation Feedback (27) (28) (29) Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 8.2.1.3 Application Curves Figure 21 and Figure 22 show start-up waveforms. Figure 21. VIN = 5.0 V, VOUT = 0.6 V, Iload = 250 mA at 25C Figure 22. VIN = 5.0 V, VOUT = 0.9 V, Iload = 1 A at -40C Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 17 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com 8.2.2 LM2830X Design Vo = 0.6 V at 1.0-A Figure 23 shows typical application circuit for step-down solution from VIN=5 to VOUT=0.6 V, 1.0-A load current. FB EN GND LM2830 R3 L1 VIN VO = 0.6V @ 1.0A SW VIN = 5V R1 C1 D1 C2 R2 Figure 23. LM2830X (1.6 MHz): Vin = 5 V, Vo = 0.6 V at 1.0-A Schematic Table 3. Bill of Materials 18 PART ID PART VALUE MANUFACTURER U1 1.0-A Buck Regulator TI PART NUMBER LM2830X C1, Input Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M C3216X5ROJ226M C2, Output Cap 22 F, 6.3 V, X5R TDK D1, Catch Diode 0.3 Vf Schottky 1.5 A, 30 VR TOSHIBA CRS08 L1 3.3 H, 1.3 A Coilcraft ME3220-332 R2 10.0 k, 1% Vishay CRCW08051000F R1 0 R3 100 k, 1% Vishay CRCW08051003F Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 8.2.3 LM2830X Design Vo = 3.3 V at 1.0-A Figure 24 shows typical application circuit for step down solution from VIN=5 to VOUT=3.3 V, 1.0-A load current. FB EN LM2830 R3 GND L1 VIN VO = 3.3V @ 1.0A SW VIN = 5V R1 C1 D1 C2 R2 Figure 24. LM2830X (1.6 MHz): Vin = 5 V, Vo = 3.3 V at 1.0-A Schematic Table 4. Bill of Materials PART ID PART VALUE MANUFACTURER U1 1.0-A Buck Regulator TI PART NUMBER LM2830X C1, Input Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M C3216X5ROJ226M C2, Output Cap 22 F, 6.3 V, X5R TDK D1, Catch Diode 0.3 Vf Schottky 1.5 A, 30 VR TOSHIBA CRS08 L1 2.2 H, 1.8 A Coilcraft ME3220-222 R2 10.0 k, 1% Vishay CRCW08051002F R1 45.3 k, 1% Vishay CRCW08054532F R3 100 k, 1% Vishay CRCW08051003F Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 19 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com 8.2.4 LM2830Z Design Vo = 3.3 V at 1.0-A Figure 25 shows typical application circuit for step down solution from VIN=5 to VOUT=3.3 V, 1.0-A load current when using device version with higher switching frequency. FB EN LM2830 R3 GND L1 VIN VO = 3.3V @ 1.0A SW VIN = 5V R1 C1 D1 C2 R2 Figure 25. LM2830Z (3 MHz): Vin = 5 V, Vo = 3.3 V at 1.0-A Schematic Table 5. Bill of Materials 20 PART ID PART VALUE MANUFACTURER U1 1.0-A Buck Regulator TI LM2830Z C1, Input Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M C2, Output Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M D1, Catch Diode 0.3 Vf Schottky 1.5 A, 30VR TOSHIBA CRS08 L1 1.6 H, 2.0 A TDK VLCF4018T-1R6N1R7-2 R2 10.0 k, 1% Vishay CRCW08051002F R1 45.3 k, 1% Vishay CRCW08054532F R3 100 k, 1% Vishay CRCW08051003F Submit Documentation Feedback PART NUMBER Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 8.2.5 LM2830Z Design Vo = 1.2 V at 1.0-A Figure 26 shows a typical application circuit for step down solution from VIN=5 to VOUT=1.2 V, 1.0-A load current when using device version with higher switching frequency. FB EN LM2830 R3 GND L1 VIN VO = 1.2V @ 1.0A SW VIN = 5V R1 C1 D1 C2 R2 Figure 26. LM2830Z (3 MHz): Vin = 5 V, Vo = 1.2 V at 1.0-A Schematic Table 6. Bill of Materials PART ID PART VALUE MANUFACTURER U1 1.0-A Buck Regulator TI LM2830Z C1, Input Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M C2, Output Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M D1, Catch Diode 0.3Vf Schottky 1.5 A, 30VR TOSHIBA CRS08 L1 1.6 H, 2.0 A TDK VLCF4018T-1R6N1R7-2 R2 10.0 k, 1% Vishay CRCW08051002F R1 10.0 k, 1% Vishay CRCW08051002F R3 100 k, 1% Vishay CRCW08051003F Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 PART NUMBER Submit Documentation Feedback 21 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com 8.2.6 LM2830X Dual Converters With Delayed Enabled Design Figure 27 shows proposed solution with two LM2830 devices. Output of device on top (3.3-V output) is used to control the enable pin of the lower device, thus ensuring that the second device (1.2-V output) can not turn on before the output of first device (3.3-V in this example) reaches steady state. Additionally, small POR supervisory (LP3470) circuit is used to monitor enable voltage for lower device. The RESET pin on POR circuit is open drain and requires typically 20-k pullup resistor to the monitored voltage. VIN U1 C1 VIND R3 VINA L1 VO = 3.3V @ 1.0A SW R1 EN LM2830 D1 C2 R2 GND FB U3 4 R6 3 LP3470M5X-3.08 LP3470 RESET 5 2 1 VIN C7 U2 C3 VIND VINA L2 VO = 1.2V @ 1.0A SW R4 LM2830 D2 C4 EN R5 GND FB Figure 27. LM2830X (1.6 MHz): Vin = 5 V, Vo = 1.2 V at 1.0 A and 3.3 V at 1.0-A Schematic Table 7. Bill of Materials 22 PART ID PART VALUE MANUFACTURER PART NUMBER U1, U2 1.0-A Buck Regulator TI LM2830X U3 Power on Reset TI LP3470M5X-3.08 C1, C3 Input Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M C2, C4 Output Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M C7 Trr delay capacitor TDK D1, D2 Catch Diode 0.3 Vf Schottky 1.5 A, 30 VR TOSHIBA CRS08 L1, L2 3.3 H, 1.3 A Coilcraft ME3220-332 R2, R4, R5 10.0 k, 1% Vishay CRCW08051002F R1, R6 45.3 k, 1% Vishay CRCW08054532F R3 100 k, 1% Vishay CRCW08051003F Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 8.2.7 LM2830X Buck Converter and Voltage Double Circuit With LDO Follower Figure 28 shows an example where the LM2830 device is used to provide regulated output voltage (3.3 V) as well as input voltage for an LDO, effectively providing solution with two output voltages. VO = 5V @ 150mA U2 L2 LDO D2 C6 U1 C3 LM2830 VIN = 5V VIND SW VINA GND C5 C4 L1 R1 C1 VO = 3.3V @ 1.0A EN FB C2 D1 R2 Figure 28. LM2830X (1.6 MHz): Vin = 5 V, Vo = 3.3 V at 1.0 A and LP2986-5.0 at 150-mA Schematic Table 8. Bill of Materials PART ID PART VALUE MANUFACTURER PART NUMBER U1 1.0-A Buck Regulator TI LM2830X U2 200-mA LDO TI LP2986-5.0 C1, Input Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M C2, Output Cap 22 F, 6.3 V, X5R TDK C3216X5ROJ226M C1608X5R0J225M C3 - C6 2.2 F, 6.3 V, X5R TDK D1, Catch Diode 0.3 Vf Schottky 1.5 A, 30 VR TOSHIBA CRS08 D2 0.4 Vf Schottky 20 VR, 500 mA ON Semi MBR0520 L2 10 H, 800 mA CoilCraft ME3220-103 L1 3.3 H, 2.2 A TDK VLCF5020T-3R3N2R0-1 R2 45.3 k, 1% Vishay CRCW08054532F R1 10.0 k, 1% Vishay CRCW08051002F Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 23 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com 9 Power Supply Recommendations The LM2830 is designed to operate from an input voltage supply range between 3.0 V and 5.5 V. This input supply should be able to withstand the maximum input current and maintain a voltage above 3.0 V. If the input supply is located farther away (more than a few inches) from the LM2830, additional bulk capacitance may be required in addition to the ceramic bypass capacitors. 10 Layout 10.1 Layout Guidelines When planning layout there are a few things to consider when trying to achieve a clean, regulated output. The most important consideration is the close coupling of the GND connections of the input capacitor and the catch diode D1. These ground ends should be close to one another and be connected to the GND plane with at least two through-holes. Place these components as close to the IC as possible. Next in importance is the location of the GND connection of the output capacitor, which should be near the GND connections of CIN and D1. There should be a continuous ground plane on the bottom layer of a two-layer board except under the switching node island. The FB pin is a high-impedance node and care should be taken to make the FB trace short to avoid noise pickup and inaccurate regulation. The feedback resistors should be placed as close as possible to the IC, with the GND of R1 placed as close as possible to the GND of the IC. The VOUT trace to R2 should be routed away from the inductor and any other traces that are switching. High AC currents flow through the VIN, SW and VOUT traces, so they should be as short and wide as possible. However, making the traces wide increases radiated noise, so the designer must make this trade-off. Radiated noise can be decreased by choosing a shielded inductor. The remaining components should also be placed as close as possible to the IC. See Application Note AN-1229 SNVA054 for further considerations and the LM2830 demo board as an example of a four-layer layout. 10.2 Layout Example Figure 29. Example Schematic 24 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 Layout Example (continued) Figure 30. PCB Layout Example 10.3 Thermal Considerations The PCB size, weight of copper used to route traces and ground plane, and number of layers within the PCB can greatly effect RJA. The type and number of thermal vias can also make a large difference in the thermal impedance. Thermal vias are necessary in most applications. They conduct heat from the surface of the PCB to the ground plane. Four to six thermal vias should be placed under the exposed pad to the ground plane if the WSON package is used. Thermal impedance also depends on the thermal properties of the application operating conditions (Vin, Vo, Io etc), and the surrounding circuitry. Silicon Junction Temperature Determination Method 1: To accurately measure the silicon temperature for a given application, two methods can be used. The first method requires the user to know the thermal impedance of the silicon junction to top case temperature. Some clarification needs to be made before we go any further. RJC is the thermal impedance from all six sides of an IC package to silicon junction. RJC is the thermal impedance from top case to the silicon junction. In this data sheet we will use RJC so that it allows the user to measure top case temperature with a small thermocouple attached to the top case. Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 25 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com Thermal Considerations (continued) RJC is approximately 30C/Watt for the 6-pin WSON package with the exposed pad. Knowing the internal dissipation from the efficiency calculation given previously, and the case temperature, which can be empirically measured on the bench we have: TJ - TC R)JC= Power (30) Therefore: Tj = (RJC x PLOSS) + TC (31) From the previous example: Tj = (RJC x PINTERNAL) + TC Tj = 30C/W x 0.189W + TC (32) (33) The second method can give a very accurate silicon junction temperature. The first step is to determine RJA of the application. The LM2830 device has over-temperature protection circuitry. When the silicon temperature reaches 165C, the device stops switching. The protection circuitry has a hysteresis of about 15C. Once the silicon temperature has decreased to approximately 150C, the device will start to switch again. Knowing this, the RJA for any application can be characterized during the early stages of the design one may calculate the RJA by placing the PCB circuit into a thermal chamber. Raise the ambient temperature in the given working application until the circuit enters thermal shutdown. If the SW-pin is monitored, it will be obvious when the internal PFET stops switching, indicating a junction temperature of 165C. Knowing the internal power dissipation from the above methods, the junction temperature, and the ambient temperature RJA can be determined. RTJA= 165 - Ta PINTERNAL (34) Once this is determined, the maximum ambient temperature allowed for a desired junction temperature can be found. An example of calculating RJA for an application using the Texas Instruments LM2830 WSON demonstration board is shown below. The four layer PCB is constructed using FR4 with 1/2 oz copper traces. The copper ground plane is on the bottom layer. The ground plane is accessed by two vias. The board measures 3-cm x 3-cm. It was placed in an oven with no forced airflow. The ambient temperature was raised to 144C, and at that temperature, the device went into thermal shutdown. From the previous example: PINTERNAL = 189mW o RTJA= (35) o 165 C - 144 C = 111o C/W 189 mW (36) If the junction temperature was to be kept below 125C, then the ambient temperature could not go above 109C Tj - (RJA x PLOSS) = TA 125C - (111C/W x 189mW) = 104C 26 Submit Documentation Feedback (37) (38) Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 10.4 WSON Package Figure 31. Internal WSON Connection For certain high-power applications, the PCB land may be modified to a "dog bone" shape (see Figure 32). By increasing the size of ground plane, and adding thermal vias, the RJA for the application can be reduced. FB GND 6 EN 1 2 GND PLANE SW 3 5 VINA 4 VIND Figure 32. 6-Lead WSON PCB "Dog Bone" Layout Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 27 LM2830, LM2830-Q1 SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 www.ti.com 11 Device and Documentation Support 11.1 Device Support 11.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 11.1.2 Thermal Definitions TJ Chip junction temperature TA Ambient temperature RJC Thermal resistance from chip junction to device case RJA Thermal resistance from chip junction to ambient air Heat in the LM2830 device due to internal power dissipation is removed through conduction and/or convection. Conduction: Heat transfer occurs through cross sectional areas of material. Depending on the material, the transfer of heat can be considered to have poor to good thermal conductivity properties (insulator vs. conductor). Heat Transfer goes as: Silicon package lead frame PCB Convection: Heat transfer is by means of airflow. This could be from a fan or natural convection. Natural convection occurs when air currents rise from the hot device to cooler air. Thermal impedance is defined as: RT= 'T Power (39) Thermal impedance from the silicon junction to the ambient air is defined as: RTJA= TJ - TA Power (40) 11.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 9. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM2830 Click here Click here Click here Click here Click here LM2830-Q1 Click here Click here Click here Click here Click here 11.3 Trademarks All trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 28 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 LM2830, LM2830-Q1 www.ti.com SNVS454E - AUGUST 2006 - REVISED DECEMBER 2014 11.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LM2830 LM2830-Q1 Submit Documentation Feedback 29 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM2830XMF NRND SOT-23 DBV 5 1000 Non-RoHS & Non-Green Call TI Call TI -40 to 125 SKTB LM2830XMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SKTB LM2830XMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SKTB LM2830XQMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SUFB LM2830XQMFE/NOPB ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SUFB LM2830XQMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SUFB LM2830ZMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SKXB LM2830ZQMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SURB LM2830ZQMFE/NOPB ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SURB LM2830ZQMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SURB LM2830ZSD/NOPB ACTIVE WSON NGG 6 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L192B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 10-Dec-2020 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. 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OTHER QUALIFIED VERSIONS OF LM2830, LM2830-Q1 : * Catalog: LM2830 * Automotive: LM2830-Q1 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM2830XMF SOT-23 DBV 5 1000 178.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 LM2830XMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2830XMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2830XQMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2830XQMFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2830XQMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2830ZMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2830ZQMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2830ZQMFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2830ZQMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2830ZSD/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2830XMF SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2830XMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2830XMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM2830XQMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2830XQMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0 LM2830XQMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM2830ZMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2830ZQMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2830ZQMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0 LM2830ZQMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM2830ZSD/NOPB WSON NGG 6 1000 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 0.90 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. 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