March 2007 Rev 6 1/10
10
STPS1545
Power Schottky rectifier
Main product characteristics
Features and Benefits
■Very small conduction losses
■Negligible switching losses
■Extremely fast switching
■Insulated package: TO-220FPAC
insulating voltage = 2000V DC
capacitance = 12 pF
■Avalanche capability specified
Description
Single chip Schottky rectifier suited for Switch
Mode Power Supply and high frequency DC to
DC converters.
Packaged in TO-220AC, TO-220FPAC, I2PA K o r
D2PAK, this device is intended for use in low
voltage, high frequency inverters, free wheeling
and polarity protection applications.
IF(AV) 15 A
VRRM 45 V
Tj (max) 175° C
VF(max) 0.57 V
NC
K
A
TO-220AC
STPS1545D
TO-220FPAC
STPS1545FP
D2PAK
STPS1545G
I2PAK
STPS1545R
AK
A
A
K
A
K
www.st.com
Characteristics STPS1545
2/10
1 Characteristics
Table 1. Absolute Ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 45 V
IF(RMS) RMS forward voltage 30 A
IF(AV)
Average forward current
δ = 0.5
TO-220AC
I2PAK , D 2PA K Tc = 155° C 15 A
TO-220FPAC Tc = 130° C
IFSM Surge non repetitive forward current tp = 10 ms
Sinusoidal 220 A
IRRM Peak repetitive reverse current tp = 2 µs square
F = 1 kHz 1A
IRSM Non repetitive peak reverse current tp = 100 µs square 3 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25°C 6000 W
Tstg Storage temperature range -65 to + 175 °C
TjMaximum operating junction temperature (1)
1. thermal runaway condition for a diode on its own heatsink
175 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
Table 2. Thermal resistances
Symbol Parameter Value Unit
Rth(j-c) Junction to case
TO-220AC, I2PAK,
D2PA K 1.6 °C/W
TO-220FPAC 4.0
Table 3. Static electrical characteristics (per diode)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.42 x IF(AV) + 0.01 IF2(RMS)
Reverse leakage current Tj = 25°C VR = VRRM 200 µA
Tj = 125°C 11 40 mA
VF(1) Forward voltage drop
Tj = 125°C IF = 15 A 0.5 0.57
V Tj = 25°C IF = 30 A 0.84
Tj = 125°C IF = 30 A 0.65 0.72
d
Ptot
dTj
-
-------------- 1
Rth j a–()
--------------------------
<
STPS1545 Characteristics
3/10
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
0 2 4 6 8 1012141618
0
2
4
6
8
10
12
P (W)
F(AV)
T
δ=tp/T tp
I (A)
F(AV)
δ= 0.05
δ= 0.1 δ= 0.2 δ= 0.5
δ= 1
0 25 50 75 100 125 150 175
I (A)
F(AV)
R =15°C/W
th(j-a)
T (°C)
amb
T
δ=tp/T tp
0
2
4
6
8
10
12
14
16
18
R=R
th(j-a) th(j-c) TO-220AC
TO-220FPAC
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t)
P (1µs)
ARM p
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(t)
P (25°C)
ARM p
ARM
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
(TO-220AC, I2PAK D 2PAK)
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values) ( TO-220FPAC)
I (A)
M
IM
t
δ=0.5 t(s)
T =75°C
C
T =100°C
C
T =125°C
C
1E-3 1E-2 1E-1 1E+0
0
20
40
60
80
100
120
140
160
180
200
1E-3 1E-2 1E-1 1E+0
0
20
40
60
80
100
120
I (A)
M
IM
t
δ=0.5 t(s)
T =75°C
C
T =100°C
C
T =125°C
C
Characteristics STPS1545
4/10
Figure 7. Relative variation of thermal
impedance junction to case versus
pulse duration
(TO-220AC, I2PAK D 2PAK)
Figure 8. Relative variation of thermal
impedance junction to case versus
pulse duration
( TO-220FPAC)
1E-4 1E-3 1E-2 1E-1 1E+0
0.0
0.2
0.4
0.6
0.8
1.0
Z/R
th(j-c) th(j-c)
T
δ=tp/T tp
t (s)
p
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse
1E-3 1E-2 1E-1 1E+0 1E+1
0.0
0.2
0.4
0.6
0.8
1.0
Z/R
th(j-c) th(j-c)
T
δ=tp/T tp
t (s)
p
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse
Figure 9. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 11. Forward voltage drop versus
forward current (maximum values)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, Cu=35 µm) (D2PAK)
0 5 10 15 20 25 30 35 40 45
1E+0
1E+1
1E+2
1E+3
1E+4
5E+4
I (µA)
R
V (V)
R
T =125°C
j
T =150°C
j
T =100°C
j
T =25°C
j
T =50°C
j
T =75°C
j
C(pF)
12 51020 50
100
200
500
1000
2000
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
0.1
1.0
10.0
100.0
I (A)
FM
T =125°C
(typical values)
j
T =25°C
j
T =125°C
j
V (V)
FM
0 5 10 15 20 25 30 35 40
0
10
20
30
40
50
60
70
80
R (°C/W)
th(j-a)
S(Cu)(cm²)
STPS1545 Package Information
5/10
2 Package Information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque value: 0.55 Nm
●Maximum torque value: 0.7 Nm
Table 4. TO-220FPAC dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
H
A
B
Dia
L7
L6
L5
F1
F
D
E
L4
G1
G
L2
L3
Package Information STPS1545
6/10
Table 5. I2PAK dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
b 0.70 0.93 0.028 0.037
b1 1.14 1.17 0.044 0.046
b2 1.14 1.17 0.044 0.046
c 0.45 0.60 0.018 0.024
c2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
E 10.0 10.4 0.394 0.409
L 13.1 13.6 0.516 0.535
L1 3.48 3.78 0.137 0.149
L2 1.27 1.40 0.050 0.055
E
L2
L1
b1
D
A1
c
c2
A
b
e
e1
L
STPS1545 Package Information
7/10
Table 6. D2PAK Package dimensions
Figure 13. Footprint (dimensions in millimeters)
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
G
L
L3
L2
B
B2
E
* FLAT ZONE NO LESS THAN 2m
m
A
C2
D
R
A2
M
V2
C
A1
*
16.90
10.30
8.90 3.70
5.08
1.30
Package Information STPS1545
8/10
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 7. TO-220AC dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
A
C
D
L7
Ø I
L5
L6
L9
L4
F
H2
G
L2
F1
E
M
STPS1545 Ordering Information
9/10
3 Ordering Information
4 Revision history
Ordering type Marking Package Weight Base qty Delivery
mode
STPS1545D STPS1545D TO-220AC 1.86 g 50 Tube
STPS1545FP STPS1545FP TO-220FPAC 1.9 g 50 Tube
STPS1545R STPS1545R I2PAK 1.7 g 50 Tube
STPS1545G STPS1545G D2PA K 1.48 g 50 Tube
STPS1545G-TR STPS1545G D2PA K 1.48 g 1000 Tape & Reel
Date Revision Description of Changes
Jul-2003 5F Last release.
21-Mar-2007 6 Removed ISOWATT package.
STPS1545
10/10
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