STPS1545 Power Schottky rectifier Main product characteristics IF(AV) 15 A VRRM 45 V Tj (max) 175 C VF(max) 0.57 V A A K K Features and Benefits Very small conduction losses Negligible switching losses Extremely fast switching Insulated package: TO-220FPAC insulating voltage = 2000V DC capacitance = 12 pF TO-220AC STPS1545D TO-220FPAC STPS1545FP K A Avalanche capability specified A I2PAK STPS1545R Description K A NC D2PAK STPS1545G Single chip Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in TO-220AC, TO-220FPAC, I2PAK or D2PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. March 2007 Rev 6 1/10 www.st.com 10 Characteristics 1 STPS1545 Characteristics Table 1. Absolute Ratings (limiting values) Symbol Parameter Value Unit 45 V 30 A 15 A 220 A 1 A 3 A 6000 W -65 to + 175 C 175 C 10000 V/s Repetitive peak reverse voltage VRRM IF(RMS) RMS forward voltage Average forward current = 0.5 IF(AV) Tc = 155 C TO-220FPAC Tc = 130 C IFSM t = 10 ms Surge non repetitive forward current p Sinusoidal IRRM Peak repetitive reverse current IRSM Non repetitive peak reverse current tp = 100 s square PARM Repetitive peak avalanche power Tj < 1 -------------------------Rth ( j - a ) thermal runaway condition for a diode on its own heatsink Thermal resistances Symbol Rth(j-c) Table 3. Symbol VF(1) (1) Critical rate of rise of reverse voltage Table 2. IR(1) tp = 1 s Tj = 25C Maximum operating junction temperature dV/dt dPtot --------------dTj tp = 2 s square F = 1 kHz Storage temperature range Tstg 1. TO-220AC I2PAK, D2PAK Parameter Junction to case Value TO-220AC, I2PAK, D2PAK 1.6 TO-220FPAC 4.0 C/W Static electrical characteristics (per diode) Parameter Reverse leakage current Test Conditions Tj = 25C Tj = 125C Forward voltage drop VR = VRRM Tj = 125C IF = 15 A Tj = 25C IF = 30 A Tj = 125C IF = 30 A 1. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.01 IF2(RMS) 2/10 Unit Min. Typ. Max. Unit 200 A 11 40 mA 0.5 0.57 0.84 0.65 0.72 V STPS1545 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) IF(AV)(A) 12 = 0.1 = 0.2 = 0.05 10 Average forward current versus ambient temperature ( = 0.5) 18 = 0.5 Rth(j-a)=Rth(j-c) 16 TO-220AC 14 TO-220FPAC 12 8 =1 10 Rth(j-a)=15C/W 6 8 4 6 T T 4 2 =tp/T IF(AV)(A) 2 tp =tp/T Tamb(C) tp 0 0 0 2 4 Figure 3. 6 8 10 12 14 16 0 18 Normalized avalanche power derating versus pulse duration 25 50 Figure 4. PARM(tp) PARM(1s) 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(C) tp(s) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AC, I2PAK D2PAK) 50 Figure 6. 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) ( TO-220FPAC) IM(A) IM(A) 120 200 180 100 160 140 80 120 100 TC=75C 60 TC=100C 40 TC=75C 80 60 40 20 0 1E-3 TC=100C TC=125C TC=125C IM IM 20 t t t(s) =0.5 1E-2 t(s) =0.5 1E-1 1E+0 0 1E-3 1E-2 1E-1 1E+0 3/10 Characteristics STPS1545 Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, I2PAK D2PAK) Figure 7. Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.8 0.8 = 0.5 0.6 = 0.5 0.6 Relative variation of thermal impedance junction to case versus pulse duration ( TO-220FPAC) 0.4 0.4 = 0.2 = 0.2 T = 0.1 0.2 tp(s) Single pulse 0.0 1E-4 1E-3 Figure 9. =tp/T 1E-2 tp 1E-1 T = 0.1 0.2 tp(s) Single pulse 1E+0 Reverse leakage current versus reverse voltage applied (typical values) 0.0 1E-3 1E-2 =tp/T 1E-1 tp 1E+0 1E+1 Figure 10. Junction capacitance versus reverse voltage applied (typical values) C(pF) IR(A) 2000 5E+4 F=1MHz VOSC=30mVRMS Tj=25C Tj=150C 1E+4 Tj=125C 1000 Tj=100C 1E+3 500 Tj=75C 1E+2 Tj=50C 200 1E+1 Tj=25C VR(V) VR(V) 1E+0 0 5 10 15 20 100 25 30 35 40 1 45 Figure 11. Forward voltage drop versus forward current (maximum values) 2 5 10 20 50 Figure 12. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, Cu=35 m) (D2PAK) IFM(A) Rth(j-a)(C/W) 100.0 80 Tj=125C (typical values) 70 Tj=25C 60 10.0 50 Tj=125C 40 30 1.0 20 10 S(Cu)(cm) VFM(V) 0 0.1 0.0 4/10 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 5 10 15 20 25 30 35 40 STPS1545 2 Package Information Package Information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm Maximum torque value: 0.7 Nm Table 4. TO-220FPAC dimensions Dimensions Ref A B H Dia L6 L7 L2 L3 Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L5 F1 D L4 L2 F E 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 G1 G 5/10 Package Information STPS1545 I2PAK dimensions Table 5. Dimensions Ref A E c2 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 E 10.0 10.4 0.394 0.409 L 13.1 13.6 0.516 0.535 L1 3.48 3.78 0.137 0.149 L2 1.27 1.40 0.050 0.055 L2 D L1 A1 b1 L b e e1 6/10 c STPS1545 Package Information Table 6. D2PAK Package dimensions Dimensions Ref A E C2 L2 D Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R 0.40 typ. 0.016 typ. Figure 13. Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 3.70 7/10 Package Information STPS1545 TO-220AC dimensions Table 7. Dimensions Ref A H2 OI C L5 L7 L6 L2 F1 Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 D L9 L4 F L2 M E G Millimeters 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STPS1545 3 Ordering Information Ordering Information Ordering type Marking Package Weight Base qty Delivery mode STPS1545D STPS1545D TO-220AC 1.86 g 50 Tube STPS1545FP STPS1545FP TO-220FPAC 1.9 g 50 Tube STPS1545R STPS1545R I PAK 1.7 g 50 Tube STPS1545G STPS1545G D2PAK 1.48 g 50 Tube STPS1545G D2 1.48 g 1000 Tape & Reel STPS1545G-TR 4 2 PAK Revision history Date Revision Description of Changes Jul-2003 5F Last release. 21-Mar-2007 6 Removed ISOWATT package. 9/10 STPS1545 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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