CYStech Electronics Corp.
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 1/4
CMBD2004/A/C/SN3 CYStek Product Specification
High voltage switching (double) diodes
CMBD2004/A/C/SN3
Description
High voltage switching diodes encapsulated in a SOT-23 small plastic SMD package.
Single diodes and double diodes with different pinning are available.
Features
•Fast switching speed
•Low forward voltage drop
•Small plastic SMD package
Mechanical Data
•Case : SOT-23, molded plastic
•Terminals : Solderable per MIL-STD-202 Method 208
•Weight : 0.008 grams(approx.)
Pinning Outline
Description Pin
CMBD2004 CMBD2004A CMBD2004C CMBD2004S
1 A K1 A1 A1
2 NC K2 A2 K2
3 K A1,A2 K1,K2 K1,A1
SOT-23
1 2
3
(1) CMBD2004
(3)CMBD2004C
(2)CMBD2004A
(4)CMBD2004S
Diode configuration and symbol
Marking:
Type Marking Code
CMBD2004 N3 D53
CMBD2004AN3 DB8
CMBD2004CN3 DB7
CMBD2004SN3 DB6
CYStech Electronics Corp.
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 2/4
CMBD2004/A/C/SN3 CYStek Product Specification
Absolute Maximum Ratings(Ta=25℃, unless otherwise specified)
• Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -65~+150 °C
Junction Temperature Tj ............................................................................................................. +150 °C
• Maximum Power Dissipation
Total Power Dissipation Ptot (Note)........................................................................................... 350 mW
• Maximum Voltages and Currents
Repetitive Peak Reverse Voltage VRRM ............................................................................................ 300 V
DC Blocking Voltage VR………………………………………………………………………….. 240V
RMS Reverse Voltage VR(RMS)…………………………………………………………………….. 170V
Continuous Forward Current IF (Note)…………………………………………………………… 225 mA
Peak Repetitive Forward Current IFRM (Note)………..………………………………………….625 mA.
Surge Non-repetitive Forward Current IFSM @ tp=1µs........................................................................ 4A
@ tp=1s…….…………………………………………. 1A
• Thermal Resistance, Junction to Ambient Air RθJA……………………………………….……357℃/W
Note : Parts mounted on FR-4 board. For double diodes, Ptot is the total power dissipation of both diodes.
Characteristics (Ta=25°C)
Characteristic Symbol Condition Min. Max. Unit
Reverse Breakdown Voltage VBR I
R=100µA 300 - V
VF(1) IF=20mA - 870 mV
Forward Voltage (Note) VF(2) IF=100mA - 1000 mV
IR(1) VR=240V,Tj=25℃ - 100 nA
Reverse Leakage Current (Note) IR(2) VR=240V,Tj=150℃ 100 µA
Diode Capacitance CD V
R=0V, f=1MHz - 5 pF
Reverse Recovery Time trr IF=IR=30mA RL=100Ω
measured at IR=3mA - 50 ns
Notes: Pulse test, tp=380µs, duty cycle<2%.
CYStech Electronics Corp.
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 3/4
CMBD2004/A/C/SN3 CYStek Product Specification
Characteristic Curves
Forward Characteristics
0.01
0.1
1
10
100
1000
012
Instantaneous Forward Voltage---VF(V)
Instantaneous Forward Current---I F(mA)
Reverse Leakage Current vs Junction Temperature
0.01
0.1
1
10
100
0 100 200
Junction Temperature---Tj(℃)
Reverse Leakage Current---I R(μA)
Power Derating Curve
0
50
100
150
200
250
300
350
400
0 50 100 150 200
Ambient Temperature---TA(℃)
Power Dissipation---PD(mW)
CYStech Electronics Corp.
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 4/4
CMBD2004/A/C/SN3 CYStek Product Specification
SOT-23 Dimension
• CMBD2004 N3 : Single Diode (Marking Code D53)
• CMBD2004AN3 : Common Anode. (Marking Code DB8)
• CMBD2004CN3 : Common Cathode. (Marking Code DB7)
• CMBD2004SN3 : Series Connected. (Marking Code DB6)
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max.
DIM Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.85 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HJ
K
D
A
L
G
V
C
B
3
2
1
S
Marking:
L4_
Diagram:
3-Lead SOT-23 Plastic Surface Mounted
Package. CYStek Package Code: N3
DXX
