DS30506 Rev. 11 - 2 1 of 4 BZT52C5V1LP - BZT52C24LP
www.diodes.com Diodes Incorporated
•Ultra-Small Leadless Surface Mount Package
•Ideally Suited for Automated Assembly Processes
•Lead Free By Design/RoHS Compliant (Note 1)
•"Green" Device (Note 2)
Maximum Ratings @ TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage (Note 3) @ IF = 10mA VF0.9 V
Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C
Mechanical Data
BZT52C5V1LP - BZT52C24LP
SURFACE MOUNT ZENER DIODE
•Case: DFN1006-2
•Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
•Moisture Sensitivity: Level 1 per J-STD-020C
•Terminal Connections: Cathode Dot (See marking
information)
•Terminals: Finish NiPdAu annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
•Marking: See Electrical Characteristics Table, Dot Denotes
Cathode Side (See marking information)
•Ordering Information: See Page 3
•Weight: 0.001 grams
Features
TCUDORP WEN
Characteristic Symbol Value Unit
Power Dissipation Pd250 mW
Thermal Resistance, Junction to Ambient Air RθJA 500 °C/W
Thermal Characteristi cs @ TA = 25°C unless otherwise specified
DFN1006-2
Dim Min Max Typ
A0.95 1.075 1.00
B0.55 0.675 0.60
C0.45 0.55 0.50
D0.20 0.30 0.25
G0.47 0.53 0.50
H0 0.05 0.03
N 0.40
R0.05 0.15 0.10
All Dimensions in mm
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Short duration pulse test used to minimize self-heating effect.
SPICE MODELS: BZT52C24LP BZT52C5V1LP BZT52C5V6LP BZT52C6V2LP BZT52C6V8LP BZT52C7V5LP BZT52C8V2LP BZT52C9V1LP BZT52C10LP
BZT52C11LP BZT52C12LP BZT52C13LP BZT52C15LP BZT52C16LP BZT52C18LP BZT52C20LP BZT52C22LP