MIL SPECS WUE D MM 0000125 0032445 5 MMILS | The documentation and process conversion, INCH POUND | measures necessary to comply with this _ | revision shall be completed by . MIL-$-19500/116J 24 Aug 92 23 July 1992 SUPERSED ING MIL-$5-19500/176H 9 june 1989 MILITARY SPECIFICATION SEMICONDUCTOR DEVILE, DIODE, SILICON, SWITCHING TYPES IN914, 1N&148-1 AND 1N4531 JAN, JANTX, AND JANTXV JANSI1NG148-1 15 a superseded by MIL~S-19500/578 | | | JANS16642 (see 6.3 and 6 3.1) Device types 1N914j | and 1N4531 are inactive for new design after the | | date of this specification. | L J This specification 1s approved for use by all Depart- ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for silicon, diffused, computer diodes. Three levels of product assurance are provided for each device type as specified in MIL-S-19500 12 Physical dimensions. See figure 1. 41.3. Maximum ratings. | | | | | | Type icgey | Yawn | FE | Tegy | Tse | fey ERs | It, = 85C |[t F 1/120s | | ; ee 1 ! | | L | | ! | | | am | | | | | | | | | | | vide | Vitpk) | mA | Ap) | fC | 2 } Sc/yw of lee, | | | | | | | | | {1N916 =|: 100 | 75 | 75 WV | 1 |-65 to +200/-65 to +175 | 50 | 250 | {7N4531 | 100 | 75 | 125 2/ | 1 |-65 to +200|-65 to +175 | | | {1N4148-1{ 100 | 75 { 200 3/ | 2 [-65 to +200|-65 to +200 | I | 1/ Derate at 0.5 mA/C above T, = 25C. 2/ Derate at 0.83 maA/C above ts = 25C. 3/ Derate at 1.14 mA/C above T, = 25C. | Beneficial comments (recommendations, additions, deletions) and any pertinent data | | which may be of use in improving this document should be addressed to: Commander, | | Defense Electronics Supply Center, ATTN: DESC-ECT, 1507 Wilmington Pike, Dayton, OH | | 45444-5280, by using the Standardization Document Improvement Proposal DD Form 1426) | | appearing at the end of this document or by letter. { AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution 1s unlimited.MIL SPECS QUE D MM O00012eS 0032470 5 MBMILS MIL-S-19500/116J 1.4 Primary electrical characteristics at T, = +25C, unless otherwise indicated. <= i | | i | | Type F1 | Yeo | Ip, at Ippo at | [gpg at | Ig, at \ te, at itnp iVp Ve iV ive iV, | | Fs 20 | ="75 v de [220 Vide j= 75 V de |= 5.0 (pk) | | | | | Vde | IT, = 150C iT, = 150Cjand I, | | i | | | i | [= 50 mA de | H | | | | | | | | ' i fe vide | I, vde | nade | bAde | BAde {| pAdce | ns | ns | icmA de) | (mA de) \ | | | | \ | | 1N91G / 10 08 | sO 1.2 | 2 | OS | 50 | oo | 20 i 5 4 j1Ng148-1 | 10 0.8 | 100 1.2 | 2 | O05 | 30 | 100 | 20 1 5 | {1N4531 | 10 0.8 | 100 1.2 | 25 | 0.5 | 50 | 100 | 20 15 | 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those Listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 ~ Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STO-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Document Order Oesk, Building 40, 700 Robbins Avenue, Philadeiphia, PA 19120-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated detail specifications, specification sheets, or MS standards), the text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Detail specification. The individual item requirements shall be in accordance with MIL-S-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500. Vep ttt Forward recovery voltage. Specified maximum forward voltage used to determine forward recovery time. Tp -- 7-77 Temperature coefficient of forward voltage. iS ----4--7- Lead spacing distance between device body and electrical/mechanical contact on lead.MIL SPECS 44E D MM 0000125 0032471 7 MMMILS MIL-S-19500/116) 3 3 Ses-gn, construction, and physical dimensions. The design, construction, and physical dimensions snall be as specified in MIL-S-19500, and figure 1 herein. 33.1 VCead finish Lead finish shalt be solderable in accordance with MIL-STO-750, MIL-S-19500, and here vead finish may be specified in the contract (see 6.2), without affecting the qualified product status of the device or applicable JAN marking 33.2 Diode canstruction. All devices shail be metallurgically bonded double plug construction in accordance with tne requirements of category [ or II, (see MIL-S-19500) 3.4 Marking Marking shall be in accordance with MIL-S-19500, except at the option of the manufacturer, the following marking may be omitted from the body of the device: a Country of origin. b The 1N" portion of the type designation. c "=" portion of the type designation. d Lot identification code. 35 Polarity. The polarity shall be indicated with a contrasting color band to denote the cathode end. No color coding will be permitted. 4. QUALITY ASSURANCE PROVISIONS 4 1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. 4 11 Process control monitors. fach vendor by means of Process Control shalt derive an I limit. When three successive production lots (minimum) have exhibited control in accordance with EIAS57, the data from these lots shall be used to establish an Ip3 monitor on all date codes. 42 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500, and as specified herein. 421 Construction verification. Cross sectional photos from 3 devices shall be submitted in the qualification report. 4.2.2 Group E inspection. Group E Inspection shall be in accordance with MIL-S-19500 and table IV herein,MIL SPECS GUE D MM O0001eS 0032472 9 MBMILS MIL-S-19500/116J oor - = 8 fh SEE NOTE 5 t Ls OIA | types | ponensions | notes | | [utr | inches | mittineters | ! | | Lwin [max | in | tox | | | snare | G .140 .180 | 3.56 | 4.57 Ha 2.5 | | on | ge | 056 | ors | 1.42 1.90 a 2, 5, 4 | | L 1.000 {1.500 | 25.40 38.10 a 2 ! | po | 018 | 022 | 0.46 0.56 a 2, 6 | 1N4531 6 | 080 | 120 | 2.03 | 3.05 I 2 | ! | $8 L 050 | 075 | 127 | 1.90 a 2, 3, 4 | L L 1.000 [1.500 | 25.40 38.10 Hy, 2 | | | $0 018 | 022 | 0.46 0.56 i 2, 6 ! NOTES: 1. Dimensions are in inches. Metric equivalents are given for general information only. The maxiaua dimension of $8 shall apply for dimension G. The minimus dimension of 6 shali apply over at least .075 (1.90 am) of dimension G. Ferrule is optional on types 1N4148-1 and 1N4531 for dimension G. The specified lead diameter applies in the zone between .050 (1.27 mm) for 1N914, and 1N4148-1, and .010 (0.25 mm) for 1N4531 from the diode body to the end of the lead. Outside of this zone the lead shall not exceed $6. Ow & why FIGURE 1. Semiconductor device, diode, types 1N914, 1N4148-1, and 1N4531.MIL SPECS WUE D MM 0000125 0032473 O M@MMILS MIL-S-19500/116J 4 3 Screening (JAN, JANTX, and JANTXV Levels only) Screening shall be in accordance with MIL-S-19500 (table 11), and as specified herein The following measurements shall be made in accordance with table | herein Devices that exceed the Limits of table I herein shall not be acceptable. Screen (see table I! Measurement of MIL-S-19500) JAN Level Option A 3/ Option B JANTX and JANTXV level JANTX and JANTXV Level 3A Temperature cycling 1n Temperature cycling Temperature cycling accordance with MIL-S-19500 V 3 Thermal impedance Thermal impedance Thermal impedance (see 4.5 5) (see 4.5.5) (see 4.5.5) 9 Not applicable Not applicable Not applicable 10 Not applicable Method 1038, condition Method 1038, condition A, t = 48 hours A, t = 48 hours 1 Not applicable 2/ Inq, Veq and Ip, and Ve4 subgroup 2 of table | 12 Not applicable Not applicable Method 1038, condition 8, t = 48 hours (see 4.3.1) 13 Not applicable Not applicable 4/ Subgroup 2 of table I herein Av., = +0.025 Vv.) F1 Le Aly, = 100% of iRitial value or #15 nA, whichever 1s greater 1/ Thermal impedance shall be performed any time after sealing provided temperature cycling 1s performed in accordance with MIL-S-19500, screen 3 prior to this thermal test. 2/ For option A only, POA = 4% shall apply to screen 11 Ina, Veq and subgroup 2 of table I[ herein. 3/ See 4.5.7. 4/ Thermal impedance (Za yy? 1s not required in screen 13. 4.3.1 Power burn-in test conditions. ALL devices shall be operated under one af the following conditions (see 4.5.1). Type TZ! 30C 5C, Ta = 30C #5C Youm 75 Wipk), f = 60 Hz mA mA_dc INO14 Ig = 75 i, = 150 1N4531 Ig = 125 tp = 175 1N4148-1 Ip = 200 1, = 475MIL SPECS QUE D MM OO0O0O1eS 0032474 2 MMMILS MIL-S-19500/116J 44 Quality conformance inspection. Quality conformance inspection shall be 1n accordance with MIL-S-19500, and as specified herein. 4 41 Group A inspection. Group A inspection shall be conducted 1n accordance with MIL-S-19500, and table I herein (end-point electrical measurements shall be tn accordance with the applicable steps of table I11 herein ) 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing 1n table IVb (JAN, JANTX and JANTXV) of MIL-$-19500, as follows. Electrical measurements (end points) and delta requirements shall be 1n accordance with the applicable steps of table Ill herein. 4 4.2.1 Group 8 inspection, table IVb of MIL-5-19500. a. Subgroup 3 Steady-state operational iife, method 1027, T, 3oc 5C, Veum = 75 V(pk) f = 60 Hz (see 4.5.1) for: IN9O14 Ig = 75 mA 1N4531 Ig = 125 mA = 200 mA 1N4148-1 Ig b. Subgroup 4 Decap internal visual design verification and (scribe and break), method 2075, see 4.5.4 herein. c. Thermal resistance, method 3101 or 4081, see 4.5.6 herein. 4.4.3 Group C inspection. Group C inspectron shall be conducted 1n accordance with the conditions specified for subgroup testing 1n table V of MIL-S-19500, and as follows. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table II] herein. 4.4.3.1 Group C inspection, table V of MIL-S-19500. a. Subgroup 1 Physical dimensions: Method 2066, see figure 1 herein. b. Subgroup 2 Thermal shock (glass strain): Method 1056, 100 cycies. Terminal strength (tensian): Method 2036, test condition A, t = 15s, weight = 10 pounds. Lead fatigue, test condition E. c. Subgroup 6, steady-state operation Life: Method 1026, Ts = 30C 25C. Vews = 75 V(pk), f = 60 Hz (see 4.5.1) for: AN914 In = 75 mA 1N4531 Ig = 125 mA 1N4148-1 Ig = 200 mA 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.5.1 Life tests. AC tests shall be conducted with a haif-sine wave of the peak voltage specified herein impressed across the diode in the reverse direction, followed by a half-sine waveform of the average rectified current specified herein. The forward conduction angle of the rectified current shall be not greater than 180 nor tess than 150.MIL SPECS W4E D MS 0000125 0032475 4 MENILS MIL-S-19500/116J 4.5.2 forward recovery voltage and time. Forward recovery time shall be measured as the time interval between zero time and the point where the pulse has decreased to 110 percent of the steady-state value of Ve when I, = 50 mA de. The maximum rise time of the response detector shall be 1 ns. 4.5.3 Pulse measurements. Conditions of pulse neasurements shall be specified tn section 4 of MIL-STD-750. 4.5.6 Desap internal visual scribe and break . Scratch glass at cavity area with diamond scribe. Carefully snap open. Using 30X magnification examine the area where die (or bond material) are in contact with the plugs, verify metallurgical bonding area. If the verification of the metallurgical bonding area 1s in question, the test method 3101 and test conditions and limits herein shall be used to determine suitability for use. 4.5.5 Thermal impedance. Thermal impedance Z.), measurements shall be performed in accordance with MIL-STD-750, method 3101. The maximum Limit for ty 1m screening (table II of MIL-S-19500) shall be derived by each vendor by means of Process Control. When three minimum lot date codes have exhibited control, the data from these three minimum lot date codes will be used to establish a fixed screening limit, (mot to exceed the group A, subgroup 2 limit). Once a fixed Limit has been established, monitor ali future sealing lots using a five piece (min) sample from each production lot to be plotted on the applicable xX, R chart. 300 mA to 500 mA m a H ty = 10 ms Iq = 1 mA to 10 mA tuo = 70 Us maximum 4.5.5.1 For Initial qualification and requalification. Read and record data (Zey ) shall be supplied to the qualifying activity on one lot (random sample of 500 devices minimum) prior to 3h pment . Twenty-two samples shall be serialized and provided to the qualifying activity for test correlation. 4.5.6 Thermal resistance. Thermal resistance measurement shall be performed in accordance with MIL-ST0-750, method 3101 or 4081. Forced moving air or draft shall not be permitted across the device during test. The maximum Limit for R J under these test conditions shall be R = 250C/W. The J following conditions shall apply when using method 3101: est(max) 75 mA to 300 mA ot i H 25 seconds minimum 1 mA to 10 mA tup = 70 Us maximum LS = Lead spacing = 3/8 inch as defined on figure 2 below: COPPER LEAO CLAMP 7 \eres LEAD CLAMP LL TTT. | ow 375 w 7 375 9 52) (9 52 NS INFINITE HEAT-DISSIPATOR FIGURE 2. Mounting arrangement. 7MIL SPECS QGE D @ 0000125 0032476 & MEMILS MIL-S-19500\116J 6&5 6.1 For initial qualification and requalification. Thermal resistance read and record data, in accordance with group E herein, shall be included in the quaiification report. 45 7 Screening option A verification requirements. a. Prior to invoking screening option A, each vendor must complete option 8 screens 12 and 13 herein following completion of screening option A from the same three successive (ot date codes minimum with zero fatlures. The following diagram illustrates the appropriate flow. f {Screening option A completion on 3 successive lots \ t 1 } i 1 | PDA = 4% | l 1 ! r e {Screening option 8, screens 12 and 13 herein on [three lot date codes minimum 1 AL wd T 1 i \ PDA = 0 l J b. ach vendor by means of Process Control shall derive an Ip, Limit. When three successive lot date codes (minimum) have exhibited control, the data from these lots shall be used to establish an I screening Limit, (not to exceed the group A subgroup 2 Limit herein). This Ip, screening Limit shall be invoked anytime after assembly. . Option A requires the written approval of the qualifying activity. The qualifying activity may revoke option A for quality reasons at any time. d. Option A is prohibited for designs which do not exhibit a full area metallurgical bond. Written approval from the qualifying activity is required to verify a full area metallurgical bond. 2.) = 30C/W minimum.MIL SPECS 44HE D MIL-S-19500/116J M@ 0000125 0032477? & MMMILS TABLE I Group A inspection | | i | | MIL-STD-750 ! Limits | Inspection 1/ i | | Symbok | \ unit | Method | Conditions 1 Min | Max | | ! : ! | Subgroup 1 | | | | | Visual and mechanical | 2071 | | inspection | | | | | | i | Subgroup 2 | | { | | | | | | {Thermal impedance , 3101 | See 4.5.5 | Zax ! , 50 C/W | | | | |Forward voltage | 4011 | I, = 10 mA de | Veq | ' 0.8 | Vde | | | | | [Breakdown voltage | 4021 | Tp = 100 HA de | Yer |100 | | V de | | | | | | | |Reverse current | 4016 | DC method i Ip, | | | | | | | Vg = 20 V de | | | | : | | | | | | | | | 1N914 | | | | 125 InA def | 1N4531 | | | | 1 25 InA de | | 1N4148-1 | { | | 1 25 ind de | | | | | | | | |Reverse current | 4016 | DC method | | {500 [nA de | R2 ! ; | | | Vp = 75 V de | | | | | | | | ' | Forward voltage | 6011 | | Veo | | : | | | | | | IN9T4 | | Ip = 50 mA de | i j 1.2 4 de | 1N4531 | | Ip = 100 mA de | | | 1.2 | Vde | 1N4148-1 | | I, = 100 mA dc | | | 1.2 | de | | | | | | | | Subgroup 3 | | | | | | | | | | | | |High temperature | | T, = +150C | | | | | operation: | | | | | | | | | | | | | Reverse current | 4016 | DOC method | Ip3 | | 50 iA de | | | Va = 20 V de | | | | | | | | | | | | 1N9T6 | | | | | | | | 1NG531 { | | | | | | | 1N6148-1 { \ | | | | | | | | | | | | Reverse current | 4016 =| DC method | Ipe | | | | | | | Vp = 75 V de | | | | | | | | | | | | INO14 | | | | {100 uA de | | 1NG531 | | | \100 A de | | 1N6148-1 | | | | [100 [HA de ! | | | | | | | Forward voltage | 4011 | I, = 10 mA de | Veg | | | | { ANST4 | | | | | 0.8 | Vv de | 1N4531 | | | | } 0.8 | Vde | | 1N4148-1 | | { | | 0.8 | V de | | | | | | | | Ss ee footnote at end of table.MIL SPECS WUE D M@@ 0000125 0032478 T MMNILS MIL-$-19500/116J TABLE I. Group A inspection - Continued MIL-STD-750 I Limits Inspection 1/ | 1 Symbol, Y oUnit Method | Conditions I Min | Max : : ! | { 1 Subgroup 3 - Continued | | \ | | | | | | | | | Low temperature TF -55C | i | | operation: ! | | 1 : | 1 | : | Forward voltage | 4011 | | Vey | ' , | { | | | | IN914 | | Ip = 50 mA de | | |} 1.3 2 V de | 1N6531 ' | I, = 100 mA de | | ' 13 3 V de | 1N4148-1 | | I, = 100 mA de | | {| 1.3 | V de | | | | | Subgroup & | | | | | | | | {junction capacitance | 4004 | VW, = OV de | C4 | | | | f = 1 MHz | | | , | | | Veqg 7 SO mv. | | | i | \ | mad mum PrP | | | | | | | | | | | 1N916 | | | | | 46.0 | pF | 1N4531 | | | | | 4.0 | pF | 1N4148-1 | | | | | 4.0 | pF | | | | | {Junction capacitance | 4001 | Va = 1.5 V de | C5 | | 2.8 ' pF | | f = 1 MHz | | | | | | Verg 7 50 Vy. ! | : | | | maxtmun = PP | | | | | | | | | | | [Reverse recovery time | 4034 | Conditian A | t,. | | 5 1 ons | | > 1 nF | | | | | | i Ip = I, = 10 mA de | | | | | R= 1Bon 5% | | | | | | | lop = 1.0 mA de | | | | | | | R = 1000R | | | | 1N914 | | | | [| 1N4531 | _ 4 | | | | | 1N4148-1 | | | | | | | | | | | | | Subgroup 5 | | | | | | | | | | | |Not applicable | | | | | | | | | | | | See footnote at end of table. 10MIL SPECS YUE D TABLE LI. MIL-S-19500/116J Group A inspection - Continued. M@ O0O001eS5 0032479 1 MENILS 1 ' | MIL-STD-750 | | Limits | Inspection | ; Symbol | i | Unit ;Methad = | Conditions | | Min | Max | | ! ! | ! iL | | | Subgroup 6 | | ' | | | | | | | ; Surge current | 4066 oat ften A (sine wave) | | | | rqe) = 1 A (pk) for 1N974 and | | | ! | Aiea | | | | | | I esurgey = 2 A (Pk) for 1NG148-1 | | | | = maximum rated dc | | | | | | | current = 0 | | | | i | = 0 | | | | | | 8 surges, 8.3 ms wrath each, one | | | { | ' | : surge per minute, = 25C | | | | | | or | | | | | | conan tron B (square wave) | | | | | | | = 0.704 A (pk) for | | | ast? 963 1Na531 | | | | | | [Ip ) = 1.41 & (pk) for | | | | | | | aS | | | | | | = 8.3 ms | | | | | | 4B surges | | | | | | \ lone surge per minute | { | | | | | [T, = 25C | | | | | | | | | {Electrical measurements | \See table III, steps 2 and 3 | | | | i | | | | | Subgroup 7 | | | | | | | | | | | | |Forward recovery | 4026 lI, = 50 mA de [Ven | {5.0 [Vv (pk) | voltage and time | i (see 4.5.2) ite, | {20 | ns | l | | | i | 1/ For sampling plan, see MIL-S-19500. 41MIL SPECS 44HE D MM 0000125 0032480 & MIMILS MIL-S-19500/116J TABLE 11. Group E inspection (all quality levels) for qualification only. | | Lo MIL-STD-750 i | Inspection | | | Sampling plan ' Method | Conditions | | | | | | | | | I Subgroup 1 | | | 45 devices c= | | | | Thermal shock | 1056 1500 cycles | | (glass strain) | | | | | | |Electrical measurements | |See table IIIf, steps 1, 2, 3, 4,| | | | and 7 | | | | | | Subgroup 2 | { | 45 devices c= | | | | | Steady-state de | 1037 |6,000 cycles | | intermittent | | | | operating life | | | | | | | [Electrical measurements | {See table I1l steps 1, 2, 3, 4, | | | | 5, 6, and ? | | | | | | Subgroup 3 | | | | | | | |Not applicable | | | | | | | | Subgroup & | | | 22 devices c= | | | | | Thermal resistance | 3101 {See 4.5.6 | | | or | | | | 4081 | | | | | | | Subgroup 5 | | | 45 devices = | | | | [Monitored mission | 1055 | | | temperature cycling | | | | | | | | | | | |Electrical measurements [ {See table III, steps 2, 3, and | | | 7 | | | | | Le | | | 12MIL SPECS WHE D MB 0000125 0032481 T MEMILS MIL-S-19500/116J TABLE III. Groups A, 8, C, and E electrical measurements. | | | | | Step | Inspection | MIL-STD-750 iL Symbol Limits L Unit | | | | | | \ | | Method | Conditions | | Min | Max | | | | | 1. {Forward voltage | 4011 |Pulse width = 8.3 ms iVeq | | 1 | | | | maximum; duty cycle | | | | | | | | = 2% maximum | { \ | | | | | | | IN914 | [I, = 10 mA dc | | | 0.8 |V de | | | 1N4537, 1N4148 | [I, = 10 mA dc | | | 0.8 |V de | | 1N4148-1 | [Ie = 10 mA de | | | Q.8 jV de | | | | | | 2. |Forward voltage | 4011 |Pulse width = 8.3 ms [Yeo | | | | | | maximum; duty cycle { | | | | | | | | = 2% maximum | | | | | | | | | | | | | | | | 1N914 | [Ip = 50 mA de | | | 4.2 |Vde | | | 1N4531 and 1N4148-1 | {I, = 100 mA de | | | .2 |V de | | | | | | | | | | 3. [Reverse current | 4016 [DC method; Vp = 20 V de | Igy | | | | | | | | | | | | | | | 1N914 { | | | {| 25 [nA de | | 1N4531 and 1N4148-1 | | | | { 25 {nA de | | | | | | | | | | | 4. [Reverse current | 4016 [DC method; V, = 75 V de j'R2 | | 300 | nA de | | | | | | | 5. [Capacitance | 4001 |, = OV de; f = 1 MHz {C4 | | | | | | | ac signal = 50 mV op | | | | | | | | | maximum | | | | | | | | | | | | | | | 1N914 | | | | | 4.0 | pF | | | %N4531 and 1N4148-1 | | | | | 4.0 | pF | | | | | | | | | | | 6, |Capacitance | 4001 |[V, = 1.5 V de [C5 | | 2.8 | pF | | | {f= 1 MHz; | | | | | | | jac signal = 50 m5 | | | | | | | | | maximum | | | | | | | | | | | | | | { 7. [Thermal impedance | 3101 |See 4.5.5 lZeax { | 50. [C/W | | | | | | | | | - | | | | | | | | | | | | | | | | | | | | | { | | 1/ Devices which exceed the group A Limits for this test shall be rejected. 2/ The electrical measurements for table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500 are as follows: a. Subgroup 2, see table III herein, steps 2, 3, 4, and 7, b. Subgroup 3, see table III herein, steps 1, 3, 5, and 6. c. Subgroup 6, see table IfI herein, steps 1, 3, 5, and 6. 3/ The electrical measurements for table V of MIL-S-19500 are as follows: a. Subgroup 2, see table III herein, steps 2, 3, 4, and 7. b. Subgroup 6, see table III herein, steps 1, 3, 5, and 6. 13MIL SPECS WHE D MM 0000325 0032482 1] MENILS MIL-5-19500, 116J wa PACKAGING 5 1 Packaging requirements The requirements for packagng shall be in accordance with MIL-S-195CQ 6 NOTES (This section contains information of a general or explanatory nature that nay be helpful, but +s not mandatory ) 61 Notes. The notes specified in MIL-S-19500 are applicable to this specification 6 2 Acquisition requirements. Acquisition documents must specify the following: a Issue of DODISS to be cited in the solicitation b. Lead finish as specified (see 3.3.1). c Type designation and product assurance level 6.3 Substitution information. The 1N6638 or 1N6642 or 1N6643 (MIL-S-19500/578) 1s preferred in Lieu of the 1NG148-1. The JANS1N6638 or 1N6642 1s substitutable for the JANSIN4148-1 and should be used tn treu of the JANS1N6148-1. 6.3.1 Cross reference supersession list. JANS level will no longer be built to this specification Devices in stock are acceptable provided the date code does not exceed the date of implementation of this specification. Devices required for space flight applications are found on MIL-$-19500/578. A PIN for PIN replacement table follows, and these devices are directly interchangeable: | JANS | JANS | | Nonpreferred PIN | Preferred PIN { | | | 1N4148-1 | 1N6638 | { | 1N6642 | | | 6.4 Changes from previous issue. Asterisks are not used in this revision ta identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER Navy - EC Navy - EC Air Force - 17 Agent: NASA - NA OLA - ES Review activities: (Project 5961-1256) Army - AR, MI Navy - SH Air Force - 19, 8, #9 OLA - ES NASA - LRC, MSF User activities: Army - SM Navy - AS, CG, MC, OS 14