EMBEDDED IntelDX2TM PROCESSOR Integrated Floating-Point Unit SL Technology Speed-Multiplying Technology Data Bus Parity Generation and Checking 32-Bit RISC Technology Core Boundary Scan (JTAG) 8-Kbyte Write-Through Cache 3.3-Volt Processor, 50 MHz, 25 MHz CLK -- 208-Lead Shrink Quad Flat Pack (SQFP) Four Internal Write Buffers 5-Volt Processor, 66 MHz, 33 MHz CLK Burst Bus Cycles -- 168-Pin Pin Grid Array (PGA) Dynamic Bus Sizing for 8- and 16-bit Binary Compatible with Large Software Data Bus Devices Base 64-Bit Interunit Transfer Bus Core Clock 32-Bit Data Bus 32-Bit Data Bus Linear Address Clock Multiplier CLK 32 PCD PWT Barrel Shifter Register File Base/ Index Bus 32 Segmentation Unit Bus Interface Physical Address 32 8 Kbyte Cache 32 Write Buffers 4 x 32 Data Bus Transceivers D31-D0 32 Bus Control ADS# W/R# D/C# M/IO# PCD PWT RDY# LOCK# PLOCK# BOFF# A20M# BREQ HOLD HLDA RESET SRESET INTR NMI SMI# SMIACT# FERR# IGNNE# STPCLK# 128 Translation Lookaside Buffer Address Drivers Displacement Bus 32 A31-A2 BE3#- BE0# Cache Unit 20 Descriptor Registers Limit and Attribute PLA ALU 2 Paging Unit Prefetcher MicroInstruction Request Sequencer Floating Point Unit Control & Protection Test Unit Floating Point Register File Control ROM Code Stream Instruction Decode 32-Byte Code Queue 2x16 Bytes 24 Decoded Instruction Path Burst Bus Control BRDY# BLAST# Bus Size Control BS16# BS8# Cache Control KEN# FLUSH# AHOLD EADS# Parity Generation and Control Boundary Scan Control DP3-DP0 PCHK# TCK TMS TDI TD0 A3223-01 Figure 1. Embedded IntelDX2TM Processor Block Diagram (c) INTEL CORPORATION, 1997 December 1997 Order Number: 272770-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Embedded IntelDX2TM processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com. Copyright (c) Intel Corporation, 1997 *Third-party brands and names are the property of their respective owners. Contents EMBEDDED IntelDX2TM PROCESSOR 1.0 INTRODUCTION ........................................................................................................................................ 1 1.1 Features ............................................................................................................................................. 1 1.2 Family Members ................................................................................................................................. 2 2.0 HOW TO USE THIS DOCUMENT ............................................................................................................. 3 3.0 PIN DESCRIPTIONS ................................................................................................................................. 3 3.1 Pin Assignments ................................................................................................................................. 3 3.2 Pin Quick Reference ......................................................................................................................... 16 4.0 ARCHITECTURAL AND FUNCTIONAL OVERVIEW ............................................................................. 25 4.1 CPUID Instruction ............................................................................................................................. 25 4.1.1 Operation of the CPUID Instruction ....................................................................................... 25 4.2 Identification After Reset .................................................................................................................. 26 4.3 Boundary Scan (JTAG) .................................................................................................................... 26 4.3.1 Device Identification ............................................................................................................... 26 4.3.2 Boundary Scan Register Bits and Bit Order ........................................................................... 27 5.0 ELECTRICAL SPECIFICATIONS ........................................................................................................... 28 5.1 Maximum Ratings ............................................................................................................................. 28 5.2 DC Specifications ............................................................................................................................. 28 5.3 AC Specifications ............................................................................................................................. 33 5.4 Capacitive Derating Curves .............................................................................................................. 39 6.0 MECHANICAL DATA .............................................................................................................................. 41 6.1 Package Dimensions ........................................................................................................................ 41 6.2 Package Thermal Specifications ...................................................................................................... 44 FIGURES Figure 1. Embedded IntelDX2TM Processor Block Diagram ...................................................................... i Figure 2. Package Diagram for 208-Lead SQFP Embedded IntelDX2TM Processor ................................ 4 Figure 3. Package Diagram for 168-Pin PGA Embedded IntelDX2TM Processor ................................... 10 Figure 4. CLK Waveform ........................................................................................................................ 35 Figure 5. Input Setup and Hold Timing ................................................................................................... 35 Figure 6. Input Setup and Hold Timing ................................................................................................... 36 Figure 7. PCHK# Valid Delay Timing ...................................................................................................... 36 Figure 8. Output Valid Delay Timing ....................................................................................................... 37 Figure 9. Maximum Float Delay Timing .................................................................................................. 37 Figure 10. TCK Waveform ........................................................................................................................ 38 Figure 11. Test Signal Timing Diagram .................................................................................................... 38 iii Contents Figure 12. Typical Loading Delay versus Load Capacitance under Worst-Case Conditions for a Low-to-High Transition, 3.3 V Processor ......................................................................... 39 Figure 13. Typical Loading Delay versus Load Capacitance under Worst-Case Conditions for a High-to-Low Transition, 3.3 V Processor ......................................................................... 39 Figure 14. Typical Loading Delay versus Load Capacitance under Worst-Case Conditions for a Low-to-High Transition, 5 V Processor ...................................... 40 Figure 15. Typical Loading Delay versus Load Capacitance under Worst-Case Conditions for a High-to-Low Transition, 5 V Processor ...................................... 40 Figure 16. 208-Lead SQFP Package Dimensions .................................................................................... 41 Figure 17. Principal Dimensions and Data for 168-Pin Pin Grid Array Package ....................................... 42 TABLES Table 1. The Embedded IntelDX2TM Processor Family ............................................................................ 2 Table 2. Pinout Differences for 208-Lead SQFP Package ...................................................................... 5 Table 3. Pin Assignment for 208-Lead SQFP Package ........................................................................... 6 Table 4. Pin Cross Reference for 208-Lead SQFP Package ................................................................... 8 Table 5. Pinout Differences for 168-Pin PGA Package ......................................................................... 11 Table 6. Pin Assignment for 168-Pin PGA Package .............................................................................. 12 Table 7. Pin Cross Reference for 168-Pin PGA Package ...................................................................... 14 Table 8. Embedded IntelDX2TM Processor Pin Descriptions ................................................................. 16 Table 9. Output Pins .............................................................................................................................. 23 Table 10. Input/Output Pins ..................................................................................................................... 23 Table 11. Test Pins .................................................................................................................................. 23 Table 12. Input Pins ................................................................................................................................. 24 Table 13. CPUID Instruction Description ................................................................................................. 25 Table 14. Boundary Scan Component Identification Code (3.3 Volt Processor) ..................................... 26 Table 15. Boundary Scan Component Identification Code (5 Volt Processor) ........................................ 27 Table 16. Absolute Maximum Ratings ..................................................................................................... 28 Table 17. Operating Supply Voltages ...................................................................................................... 28 Table 18. 3.3 V DC Specifications ........................................................................................................... 29 Table 19. 3.3 V ICC Values ...................................................................................................................... 30 Table 20. 5 V DC Specifications .............................................................................................................. 31 Table 21. 5 V ICC Values ......................................................................................................................... 32 Table 22. AC Characteristics ................................................................................................................... 33 Table 23. AC Specifications for the Test Access Port ............................................................................. 34 Table 24. 168-Pin Ceramic PGA Package Dimensions ........................................................................... 42 Table 25. Ceramic PGA Package Dimension Symbols ........................................................................... 43 Table 26. Thermal Resistance, JA (C/W) ............................................................................................. 44 Table 27. Thermal Resistance, JC (C/W) ............................................................................................. 44 Table 28. Maximum Tambient, TA max (C) ............................................................................................... 44 iv Embedded IntelDX2TM Processor 1.0 INTRODUCTION The embedded IntelDX2TM processor provides high performance to 32-bit, embedded applications. Designed for applications that need a floating-point unit, the processor is ideal for embedded designs running DOS*, Microsoft Windows*, OS/2*, or UNIX * applications written for the Intel architecture. Projects can be completed quickly by utilizing the wide range of software tools, utilities, assemblers and compilers that are available for desktop computer systems. Also, developers can find advantages in using existing chipsets and peripheral components in their embedded designs. The embedded IntelDX2 processor is binary compatible with the Intel386TM and earlier Intel processors. Compared with the Intel386 processor, it provides faster execution of many commonly-used instructions. It also provides the benefits of an integrated, 8-Kbyte, write-through cache for code and data. Its data bus can operate in burst mode which provides up to 106-Mbyte-per-second transfers for cache-line fills and instruction prefetches. Intel's SL technology is incorporated in the embedded IntelDX2 processor. Utilizing Intel's System Management Mode (SMM), it enables designers to develop energy-efficient systems. Two component packages are available. A 168-pin Pin Grid Array (PGA) is available for 5-Volt designs and a 208-lead Shrink Quad Flat Pack (SQFP) is available for 3.3-Volt designs. The processor operates at twice the external-bus frequency. The 5 V processor operates up to 66 MHz (33-MHz CLK). The 3.3 V processor operates up to 50 MHz (25-MHz CLK). 1.1 Features The embedded IntelDX2 processor offers these features: * 32-bit RISC-Technology Core -- The embedded IntelDX2 processor performs a complete set of arithmetic and logical operations on 8-, 16-, and 32-bit data types using a full-width ALU and eight general purpose registers. * Instruction Pipelining -- Overlapped instruction fetching, decoding, address translation and execution. * On-Chip Floating-Point Unit -- Intel486TM processors support the 32-, 64-, and 80-bit formats specified in IEEE standard 754. The unit is binary compatible with the 8087, Intel287TM, Intel387TM coprocessors, and Intel OverDrive(R) processor. * On-Chip Cache with Cache Consistency Support -- An 8-Kbyte, write-through, internal cache is used for both data and instructions. Cache hits provide zero wait-state access times for data within the cache. Bus activity is tracked to detect alterations in the memory represented by the internal cache. The internal cache can be invalidated or flushed so that an external cache controller can maintain cache consistency. * External Cache Control -- Write-back and flush controls for an external cache are provided so the processor can maintain cache consistency. * On-Chip Memory Management Unit -- Address management and memory space protection mechanisms maintain the integrity of memory in a multitasking and virtual memory environment. Both memory segmentation and paging are supported. * Burst Cycles -- Burst transfers allow a new double-word to be read from memory on each bus clock cycle. This capability is especially useful for instruction prefetch and for filling the internal cache. * Write Buffers -- The processor contains four write buffers to enhance the performance of consecutive writes to memory. The processor can continue internal operations after a write to these buffers, without waiting for the write to be completed on the external bus. * Bus Backoff -- When another bus master needs control of the bus during a processor initiated bus cycle, the embedded IntelDX2 processor floats its bus signals, then restarts the cycle when the bus becomes available again. * Instruction Restart -- Programs can continue execution following an exception generated by an unsuccessful attempt to access memory. This feature is important for supporting demand-paged virtual memory applications. * Dynamic Bus Sizing -- External controllers can dynamically alter the effective width of the data bus. Bus widths of 8, 16, or 32 bits can be used. * Single Cycle Execution -- Many instructions execute in a single clock cycle. * Other brands and names are the property of their respective owners. 1 Embedded IntelDX2TM Processor * Boundary Scan (JTAG) -- Boundary Scan provides in-circuit testing of components on printed circuit boards. The Intel Boundary Scan implementation conforms with the IEEE Standard Test Access Port and Boundary Scan Architecture. Intel's SL technology provides these features: * Intel System Management Mode (SMM) -- A unique Intel architecture operating mode provides a dedicated special purpose interrupt and address space that can be used to implement intelligent power management and other enhanced functions in a manner that is completely transparent to the operating system and applications software. * I/O Restart -- An I/O instruction interrupted by a System Management Interrupt (SMI#) can automatically be restarted following the execution of the RSM instruction. * Stop Clock -- The embedded IntelDX2 processor has a stop clock control mechanism that provides two low-power states: a Stop Grant state (20-45 mA typical, depending on input clock frequency) and a Stop Clock state (~100-200 A typical, with input clock frequency of 0 MHz). * Auto HALT Power Down -- After the execution of a HALT instruction, the embedded IntelDX2 processor issues a normal Halt bus cycle and the clock input to the processor core is automatically stopped, causing the processor to enter the Auto HALT Power Down state (20-45 mA typical, depending on input clock frequency). * Auto Idle Power Down -- This function allows the processor to reduce the core frequency to the bus frequency when both the core and bus are idle. Auto Idle Power Down is software transparent and does not affect processor performance. Auto Idle Power Down provides an average power savings of 10% and is only applicable to clock multiplied processors. 1.2 Family Members Table 1 shows the embedded IntelDX2 processors and briefly describes their characteristics. Table 1. The Embedded IntelDX2TM Processor Family VCC Maximum Processor Frequency Maximum External Bus Frequency Package SB80486DX2SC50 3.3 V 50 MHz 25 MHz 208-Lead SQFP A80486DX2SA66 5.0 V 66 MHz 33 MHz 168-Pin PGA Product 2 Supply Voltage Embedded IntelDX2TM Processor 2.0 HOW TO USE THIS DOCUMENT For a complete set of documentation related to the embedded IntelDX2 processor, use this document in conjunction with the following reference documents: * Embedded Intel486TM Processor Family Developer's Manual -- Order No. 273021 * Embedded Intel486TM Processor Hardware Reference Manual -- Order No. 273025 * Intel486 Microprocessor Family Programmer's Reference Manual -- Order No. 240486 3.0 PIN DESCRIPTIONS 3.1 Pin Assignments The following figures and tables show the pin assignments of each package type for the embedded IntelDX2 processor. Tables are provided showing the pin differences between the embedded IntelDX2 processor and other embedded Intel486 processor products. * Intel Application Note AP-485 -- Intel Processor Identification with the CPUID Instruction -- Order No. 241618 208-Lead SQFP - Quad Flat Pack The information in the reference documents for the IntelDX2 processor applies to the embedded IntelDX2 processor. Some of the IntelDX2 processor information is duplicated in this document to minimize the dependence on the reference documents. * Table 2, Pinout Differences for 208-Lead SQFP Package (pg. 5) * Figure 2, Package Diagram for 208-Lead SQFP Embedded IntelDX2TM Processor (pg. 4) * Table 3, Pin Assignment for 208-Lead SQFP Package (pg. 6) * Table 4, Pin Cross Reference for 208-Lead SQFP Package (pg. 8) 168-Pin PGA - Pin Grid Array * Figure 3, Package Diagram for 168-Pin PGA Embedded IntelDX2TM Processor (pg. 10) * Table 5, Pinout Differences for 168-Pin PGA Package (pg. 11) * Table 6, Pin Assignment for 168-Pin PGA Package (pg. 12) * Table 7, Pin Cross Reference for 168-Pin PGA Package (pg. 14) 3 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 VSS LOCK# PLOCK# VCC BLAST# ADS# A2 VSS VCC VSS VCC A3 A4 A5 RESERVED# A6 A7 VCC A8 VSS VCC A9 A10 VCC VSS VCC A11 VSS A12 VCC A13 A14 VCC VSS A15 A16 VCC A17 VSS VCC TDI TMS A18 A19 A20 VCC VCC A21 A22 A23 A24 VSS Embedded IntelDX2TM Processor 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 208-Lead SQFP Embedded IntelDX2TM Processor Top View 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 VSS VCC A25 A26 A27 A28 VCC A29 A30 A31 VSS DP0 D0 D1 D2 D3 D4 VCC VSS VCC VCC VSS VCC VCC VSS VCC D5 D6 VCC NC D7 DP1 D8 D9 VSS VCC VSS D10 D11 D12 D13 VSS VCC D14 D15 VCC VSS DP2 D16 VSS VCC VSS VSS VCC VSS VCC VSS SRESET SMIACT# VCC VSS VCC INC INC SMI# FERR# NC TDO VCC INC INC IGNNE# STPCLK# D31 D30 VSS VCC D29 D28 VCC VSS VCC D27 D26 D25 VCC D24 VSS VCC DP3 D23 D22 D21 VSS VCC NC VSS VCC D20 D19 D18 VCC D17 VSS 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 VSS VCC VCC PCHK# BRDY# BOFF# BS16# BS8# VCC VSS INC RDY# KEN# VCC VSS HOLD AHOLD TCK VCC VCC VSS VCC VCC CLK VCC HLDA W/R# VSS VCC BREQ BE0# BE1# BE2# BE3# VCC VSS M/IO# VCC D/C# PWT PCD VCC VSS VCC VCC EADS# A20M# RESET FLUSH# INTR NMI VSS A3227-01 Figure 2. Package Diagram for 208-Lead SQFP Embedded IntelDX2TM Processor 4 Embedded IntelDX2TM Processor Table 2. Pinout Differences for 208-Lead SQFP Package Pin # Embedded Intel486TM SX Processor Embedded IntelDX2TM Processor Embedded Write-Back Enhanced IntelDX4TM Processor 3 VCC1 VCC VCC5 11 INC2 INC CLKMUL 63 INC INC HITM# 64 INC INC WB/WT# 66 INC FERR# FERR# 70 INC INC CACHE# 71 INC INC INV 72 INC IGNNE# IGNNE# NOTES: 1. This pin location is for the VCC5 pin on the embedded IntelDX4 processor. For compatibility with 3.3V processors that have 5V-tolerant input buffers (i.e., embedded IntelDX4 processors), this pin should be connected to a VCC trace, not to the VCC plane. 2. INC. Internal No Connect. These pins are not connected to any internal pad in the embedded IntelDX2 processor. However, new signals are defined for the location of the INC pins in the embedded IntelDX4 processor. One system design can accommodate any one of these processors provided the purpose of each INC pin is understood before it is used. 5 Embedded IntelDX2TM Processor Table 3. Pin Assignment for 208-Lead SQFP Package (Sheet 1 of 2) Pin# 6 Description Pin# Description Pin# 1 VSS 2 VCC 3 VCC1 Description Pin# 53 VSS 54 VCC 55 Description 105 VSS 157 VSS 106 VCC 158 A24 VSS 107 VSS 159 A23 A22 4 PCHK# 56 VCC 108 D16 160 5 BRDY# 57 VSS 109 DP2 161 A21 6 BOFF# 58 SRESET 110 VSS 162 VCC 7 BS16# 59 SMIACT# 111 VCC 163 VCC 8 BS8# 60 VCC 112 D15 164 A20 9 VCC 61 VSS 113 D14 165 A19 10 VSS 62 VCC 114 VCC 166 A18 11 INC2 63 INC2 115 VSS 167 TMS 12 RDY# 64 INC2 116 D13 168 TDI VCC 13 KEN# 65 SMI# 117 D12 169 14 VCC 66 FERR# 118 D11 170 VSS 15 VSS 67 NC3 119 D10 171 A17 16 HOLD 68 TDO 120 VSS 172 VCC 17 AHOLD 69 VCC 121 VCC 173 A16 18 TCK 70 INC2 122 VSS 174 A15 19 VCC 71 INC2 123 D9 175 VSS 20 VCC 72 IGNNE# 124 D8 176 VCC 21 VSS 73 STPCLK# 125 DP1 177 A14 22 VCC 74 D31 126 D7 178 A13 23 VCC 75 D30 127 NC3 179 VCC A12 24 CLK 76 VSS 128 VCC 180 25 VCC 77 VCC 129 D6 181 VSS 26 HLDA 78 D29 130 D5 182 A11 27 W/R# 79 D28 131 VCC 183 VCC 28 VSS 80 VCC 132 VSS 184 VSS 29 VCC 81 VSS 133 VCC 185 VCC 30 BREQ 82 VCC 134 VCC 186 A10 31 BE0# 83 D27 135 VSS 187 A9 32 BE1# 84 D26 136 VCC 188 VCC 33 BE2# 85 D25 137 VCC 189 VSS 34 BE3# 86 VCC 138 VSS 190 A8 35 VCC 87 D24 139 VCC 191 VCC Embedded IntelDX2TM Processor Table 3. Pin Assignment for 208-Lead SQFP Package (Sheet 2 of 2) Pin# Description Pin# Description Pin# Description Pin# Description A7 36 VSS 88 VSS 140 D4 192 37 M/IO# 89 VCC 141 D3 193 A6 38 VCC 90 DP3 142 D2 194 RESERVED# 39 D/C# 91 D23 143 D1 195 A5 40 PWT 92 D22 144 D0 196 A4 41 PCD 93 D21 145 DP0 197 A3 42 VCC 94 VSS 146 VSS 198 VCC 43 VSS 95 VCC 147 A31 199 VSS 44 VCC 96 NC 3 148 A30 200 VCC 45 VCC 97 VSS 149 A29 201 VSS 46 EADS# 98 VCC 150 VCC 202 A2 47 A20M# 99 D20 151 A28 203 ADS# 48 RESET 100 D19 152 A27 204 BLAST# 49 FLUSH# 101 D18 153 A26 205 VCC 50 INTR 102 VCC 154 A25 206 PLOCK# 51 NMI 103 D17 155 VCC 207 LOCK# 52 VSS 104 VSS 156 VSS 208 VSS NOTES: 1. This pin location is for the VCC5 pin on the embedded IntelDX4 processor. For compatibility with 3.3V processors that have 5V-tolerant input buffers (i.e., embedded IntelDX4 processors), this pin should be connected to a VCC trace, not to the VCC plane. 2. INC. Internal No Connect. These pins are not connected to any internal pad in the embedded IntelDX2 processors. However, signals are defined for the location of the INC pins in the IntelDX4 processor. One system design can accommodate any one of these processors provided the purpose of each INC pin is understood before it is used. 3. NC. Do Not Connect. These pins should always remain unconnected. Connection of NC pins to VCC, or VSS or to any other signal can result in component malfunction or incompatibility with future steppings of the Intel486 processors. 7 Embedded IntelDX2TM Processor Table 4. Pin Cross Reference for 208-Lead SQFP Package (Sheet 1 of 2) 8 Address Pin # Data Pin # Control Pin # NC INC VCC A2 202 D0 144 A20M# 47 67 11 2 1 A3 197 D1 143 ADS# 203 96 63 3 10 A4 196 D2 142 AHOLD 17 127 64 9 15 A5 195 D3 141 BE0# 31 70 14 21 A6 193 D4 140 BE1# 32 71 A7 192 D5 130 BE2# 33 A8 190 D6 129 BE3# 34 22 43 A9 187 D7 126 BLAST# 204 23 52 A10 186 D8 124 BOFF# 6 25 53 A11 182 D9 123 BRDY# 5 29 55 A12 180 D10 119 BREQ 30 35 57 A13 178 D11 118 BS16# 7 38 61 A14 177 D12 117 BS8# 8 42 76 A15 174 D13 116 CLK 24 44 81 A16 173 D14 113 D/C# 39 45 88 A17 171 D15 112 DP0 145 54 94 A18 166 D16 108 DP1 125 56 97 A19 165 D17 103 DP2 109 60 104 A20 164 D18 101 DP3 90 62 105 A21 161 D19 100 EADS# 46 69 107 A22 160 D20 99 FERR# 66 77 110 A23 159 D21 93 FLUSH# 49 80 115 A24 158 D22 92 HLDA 26 82 120 A25 154 D23 91 HOLD 16 86 122 A26 153 D24 87 IGNNE# 72 89 132 A27 152 D25 85 INTR 50 95 135 A28 151 D26 84 KEN# 13 98 138 A29 149 D27 83 LOCK# 207 102 146 A30 148 D28 79 M/IO# 37 106 156 A31 147 D29 78 NMI 51 111 157 VSS 19 28 20 36 D30 75 PCD 41 114 170 D31 74 PCHK# 4 121 175 PLOCK# 206 128 181 PWT 40 131 184 RDY# 12 133 189 RESERVED# 194 RESET 48 SMI# 65 134 199 SMIACT# 59 136 201 Embedded IntelDX2TM Processor Table 4. Pin Cross Reference for 208-Lead SQFP Package (Sheet 2 of 2) Address Pin # Data Pin # Control Pin # V CC VSS SRESET 58 NC INC 137 208 STPCLK# 73 139 TCK 18 150 TDI 168 155 TDO 68 162 TMS 167 163 W/R# 27 169 172 176 179 183 185 188 191 198 200 205 9 Embedded IntelDX2TM Processor 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 A B C D E F G H J K L M N P Q R S D20 D19 D11 D9 VSS DP1 VSS VSS VCC VSS VSS VSS D2 D0 A31 A28 A27 D22 D21 D18 D13 VCC D8 VCC D3 D5 VCC D6 VCC D1 A29 VSS A25 A26 TCK VSS CLK D17 D10 D15 D12 DP2 D16 D14 D7 D4 DP0 A30 A17 VCC A23 D23 VSS VCC A19 VSS NC DP3 VSS VCC A21 A18 A14 D24 D25 D27 A24 VCC VSS VSS VCC D26 A22 A15 A12 A20 VCC VSS 8 A16 VCC VSS 9 A13 VCC VSS 10 A9 VCC VSS 11 12 D29 D31 D28 VSS VCC D30 INC SMI# SRESET 168-Pin PGA Embedded IntelDX2TM Processor Pin Side View VSS VCC RESERVED# INC INC SMIACT# A5 A11 VSS INC INC NC A7 A8 A10 TDI TMS FERR# A2 VCC VSS IGNNE# NMI FLUSH# A20M# HOLD KEN# STPCLK# BRDY# BREQ A3 A6 INTR TDO RESET BS8# AHOLD EADS# BS16# BOFF# A B C D BE2# BE0# PWT D/C# LOCK# HLDA 1 2 3 4 5 6 7 13 14 15 VCC RDY# VCC VCC BE1# VCC VCC VCC M/IO# VCC PLOCK# BLAST# A4 16 VSS BE3# VSS VSS PCD VSS VSS VSS W/R# VSS PCHK# INC ADS# 17 E F G H J K L M N P Q R S A3226-01 Figure 3. Package Diagram for 168-Pin PGA Embedded IntelDX2TM Processor 10 Embedded IntelDX2TM Processor Table 5. Pinout Differences for 168-Pin PGA Package Embedded Write-Back Enhanced IntelDX4TM Processor Pin # Embedded IntelDX2TM Processor A10 INC INV A12 INC HITM# B12 INC CACHE# B13 INC WB/WT# J1 VCC V CC5 R17 INC CLKMUL S4 NC VOLDET 11 Embedded IntelDX2TM Processor Table 6. Pin Assignment for 168-Pin PGA Package (Sheet 1 of 2) 12 Pin # Description Pin # Description Pin # Description A1 D20 D17 BOFF# P2 A29 A2 D22 E1 VSS P3 A30 A3 TCK E2 VCC P15 HLDA A4 D23 E3 D10 P16 VCC A5 DP3 E15 HOLD P17 VSS A6 D24 E16 VCC Q1 A31 A7 VSS E17 VSS Q2 VSS A8 D29 F1 DP1 Q3 A17 A9 VSS F2 D8 Q4 A19 1 A10 INC F3 D15 Q5 A21 A11 VSS F15 KEN# Q6 A24 A12 INC1 F16 RDY# Q7 A22 A13 INC1 F17 BE3# Q8 A20 A14 TDI G1 VSS Q9 A16 A15 IGNNE# G2 VCC Q10 A13 A16 INTR G3 D12 Q11 A9 A17 AHOLD G15 STPCLK# Q12 A5 B1 D19 G16 VCC Q13 A7 B2 D21 G17 VSS Q14 A2 B3 VSS H1 VSS Q15 BREQ B4 VSS H2 D3 Q16 PLOCK# B5 VSS H3 DP2 Q17 PCHK# B6 D25 H15 BRDY# R1 A28 B7 VCC H16 VCC R2 A25 B8 D31 H17 VSS R3 VCC B9 VCC J1 VCC R4 VSS B10 SMI# J2 D5 R5 A18 B11 VCC J3 D16 R6 VCC B12 INC1 J15 BE2# R7 A15 B13 INC1 J16 BE1# R8 VCC B14 TMS J17 PCD R9 VCC B15 NMI K1 VSS R10 VCC B16 TDO K2 VCC R11 VCC Embedded IntelDX2TM Processor Table 6. Pin Assignment for 168-Pin PGA Package (Sheet 2 of 2) Pin # Description Pin # Description Pin # Description B17 EADS# K3 D14 R12 A11 C1 D11 K15 BE0# R13 A8 C2 D18 K16 VCC R14 VCC C3 CLK K17 VSS R15 A3 C4 VCC L1 VSS R16 BLAST# C5 VCC L2 D6 R17 INC1 C6 D27 L3 D7 S1 A27 C7 D26 L15 PWT S2 A26 C8 D28 L16 VCC S3 A23 C9 D30 L17 VSS S4 NC2 C10 SRESET M1 VSS S5 A14 C11 RESERVED# M2 VCC S6 VSS C12 SMIACT# M3 D4 S7 A12 C13 NC2 M15 D/C# S8 VSS C14 FERR# M16 VCC S9 VSS C15 FLUSH# M17 VSS S10 VSS C16 RESET N1 D2 S11 VSS C17 BS16# N2 D1 S12 VSS D1 D9 N3 DP0 S13 A10 D2 D13 N15 LOCK# S14 VSS D3 D17 N16 M/IO# S15 A6 D15 A20M# N17 W/R# S16 A4 D16 BS8# P1 D0 S17 ADS# NOTES: 1. INC. Internal No Connect. These pins are not connected to any internal pad in the embedded IntelDX2 processors. However, signals are defined for the location of the INC pins in the IntelDX4 processor. One system design can accommodate any one of these processors provided the purpose of each INC pin is understood before it is used. 2. NC. Do Not Connect. These pins should always remain unconnected. Connection of NC pins to VCC, or VSS or to any other signal can result in component malfunction or incompatibility with future steppings of the Intel486 processors. 13 Embedded IntelDX2TM Processor Table 7. Pin Cross Reference for 168-Pin PGA Package (Sheet 1 of 2) Address Pin # Data Pin # Control Pin # NC INC Vcc A2 Q14 D0 P1 A20M# D15 C13 A10 B7 A7 A3 R15 D1 N2 ADS# S17 S4 A12 B9 A9 A4 S16 D2 N1 AHOLD A17 A13 B11 A11 A5 Q12 D3 H2 BE0# K15 B12 C4 B3 A6 S15 D4 M3 BE1# J16 B13 C5 B4 A7 Q13 D5 J2 BE2# J15 R17 E2 B5 A8 R13 D6 L2 BE3# F17 E16 E1 A9 Q11 D7 L3 BLAST# R16 G2 E17 A10 S13 D8 F2 BOFF# D17 G16 G1 A11 R12 D9 D1 BRDY# H15 H16 G17 A12 S7 D10 E3 BREQ Q15 J1 H1 A13 Q10 D11 C1 BS16# C17 K2 H17 14 Vss A14 S5 D12 G3 BS8# D16 K16 K1 A15 R7 D13 D2 CLK C3 L16 K17 A16 Q9 D14 K3 D/C# M15 M2 L1 A17 Q3 D15 F3 DP0 N3 M16 L17 A18 R5 D16 J3 DP1 F1 P16 M1 A19 Q4 D17 D3 DP2 H3 R3 M17 A20 Q8 D18 C2 DP3 A5 R6 P17 A21 Q5 D19 B1 EADS# B17 R8 Q2 A22 Q7 D20 A1 FERR# C14 R9 R4 A23 S3 D21 B2 FLUSH# C15 R10 S6 A24 Q6 D22 A2 HLDA P15 R11 S8 A25 R2 D23 A4 HOLD E15 R14 S9 A26 S2 D24 A6 IGNNE# A15 A27 S1 D25 B6 INTR A16 S11 A28 R1 D26 C7 KEN# F15 S12 S14 A29 P2 D27 C6 LOCK# N15 A30 P3 D28 C8 M/IO# N16 A31 Q1 B15 D29 A8 NMI D30 C9 PCD J17 D31 B8 PCHK# Q17 PLOCK# Q16 PWT L15 RDY# F16 RESERVED# C11 RESET C16 SMI# B10 SMIACT# C12 S10 Embedded IntelDX2TM Processor Table 7. Pin Cross Reference for 168-Pin PGA Package (Sheet 2 of 2) Address Pin # Data Pin # Control Pin # SRESET C10 STPCLK# G15 TCK A3 TDI A14 TDO B16 TMS B14 W/R# N17 NC INC Vcc Vss 15 Embedded IntelDX2TM Processor 3.2 Pin Quick Reference The following is a brief pin description. For detailed signal descriptions refer to Appendix A, "Signal Descriptions," in the Embedded Intel486TM Processor Family Developer's Manual, order No. 273021. Table 8. Embedded IntelDX2TM Processor Pin Descriptions (Sheet 1 of 7) Symbol Type Name and Function CLK I Clock provides the fundamental timing and internal operating frequency for the embedded IntelDX2 processor. All external timing parameters are specified with respect to the rising edge of CLK. A31-A4 I/O A3-A2 O Address Lines A31-A2, together with the byte enable signals, BE3#-BE0#, define the physical area of memory or input/output space accessed. Address lines A31-A4 are used to drive addresses into the embedded IntelDX2 processor to perform cache line invalidation. Input signals must meet setup and hold times t22 and t23. A31-A2 are not driven during bus or address hold. BE3# O BE2# O BE1# O BE0# O ADDRESS BUS Byte Enable signals indicate active bytes during read and write cycles. During the first cycle of a cache fill, the external system should assume that all byte enables are active. BE3#-BE0# are active LOW and are not driven during bus hold. BE3# applies to D31-D24 BE2# applies to D23-D16 BE1# applies to D15-D8 BE0# applies to D7-D0 DATA BUS D31-D0 I/O Data Lines. D7-D0 define the least significant byte of the data bus; D31-D24 define the most significant byte of the data bus. These signals must meet setup and hold times t22 and t23 for proper operation on reads. These pins are driven during the second and subsequent clocks of write cycles. I/O There is one Data Parity pin for each byte of the data bus. Data parity is generated on all write data cycles with the same timing as the data driven by the embedded IntelDX2 processor. Even parity information must be driven back into the processor on the data parity pins with the same timing as read information to ensure that the correct parity check status is indicated by the embedded IntelDX2 processor. The signals read on these pins do not affect program execution. DATA PARITY DP3-DP0 Input signals must meet setup and hold times t22 and t23. DP3-DP0 must be connected to VCC through a pull-up resistor in systems that do not use parity. DP3-DP0 are active HIGH and are driven during the second and subsequent clocks of write cycles. PCHK# 16 O Parity Status is driven on the PCHK# pin the clock after ready for read operations. The parity status is for data sampled at the end of the previous clock. A parity error is indicated by PCHK# being LOW. Parity status is only checked for enabled bytes as indicated by the byte enable and bus size signals. PCHK# is valid only in the clock immediately after read data is returned to the processor. At all other times PCHK# is inactive (HIGH). PCHK# is never floated. Embedded IntelDX2TM Processor Table 8. Embedded IntelDX2TM Processor Pin Descriptions (Sheet 2 of 7) Symbol Type Name and Function BUS CYCLE DEFINITION M/IO# O D/C# O Memory/Input-Output, Data/Control and Write/Read lines are the primary bus definition signals. These signals are driven valid as the ADS# signal is asserted. W/R# O M/IO# D/C# W/R# Bus Cycle Initiated 0 0 0 Interrupt Acknowledge 0 0 1 HALT/Special Cycle (see details below) 0 1 0 I/O Read 0 1 1 I/O Write 1 0 0 Code Read 1 0 1 Reserved 1 1 0 Memory Read 1 1 1 Memory Write HALT/Special Cycle Cycle Name BE3# - BE0# Shutdown 1110 A4-A2 000 HALT 1011 000 Stop Grant bus cycle 1011 100 LOCK# O Bus Lock indicates that the current bus cycle is locked. The embedded IntelDX2 processor does not allow a bus hold when LOCK# is asserted (address holds are allowed). LOCK# goes active in the first clock of the first locked bus cycle and goes inactive after the last clock of the last locked bus cycle. The last locked cycle ends when Ready is returned. LOCK# is active LOW and not driven during bus hold. Locked read cycles are not transformed into cache fill cycles when KEN# is returned active. PLOCK# O Pseudo-Lock indicates that the current bus transaction requires more than one bus cycle to complete. For the embedded IntelDX2 processor, examples of such operations are segment table descriptor reads (64 bits) and cache line fills (128 bits). For Intel486 processors with on-chip Floating-Point Unit, floating-point long reads and writes (64 bits) also require more than one bus cycle to complete. The embedded IntelDX2 processor drives PLOCK# active until the addresses for the last bus cycle of the transaction are driven, regardless of whether RDY# or BRDY# have been returned. Normally PLOCK# and BLAST# are inverse of each other. However, during the first bus cycle of a 64-bit floating-point write (for Intel486 processors with on-chip Floating-Point Unit) both PLOCK# and BLAST# are asserted. PLOCK# is a function of the BS8#, BS16# and KEN# inputs. PLOCK# should be sampled only in the clock in which Ready is returned. PLOCK# is active LOW and is not driven during bus hold. BUS CONTROL ADS# O Address Status output indicates that a valid bus cycle definition and address are available on the cycle definition lines and address bus. ADS# is driven active in the same clock in which the addresses are driven. ADS# is active LOW and not driven during bus hold. 17 Embedded IntelDX2TM Processor Table 8. Embedded IntelDX2TM Processor Pin Descriptions (Sheet 3 of 7) Symbol Type Name and Function RDY# I Non-burst Ready input indicates that the current bus cycle is complete. RDY# indicates that the external system has presented valid data on the data pins in response to a read or that the external system has accepted data from the embedded IntelDX2 processor in response to a write. RDY# is ignored when the bus is idle and at the end of the first clock of the bus cycle. RDY# is active during address hold. Data can be returned to the embedded IntelDX2 processor while AHOLD is active. RDY# is active LOW and is not provided with an internal pull-up resistor. RDY# must satisfy setup and hold times t16 and t17 for proper chip operation. BURST CONTROL BRDY# I Burst Ready input performs the same function during a burst cycle that RDY# performs during a non-burst cycle. BRDY# indicates that the external system has presented valid data in response to a read or that the external system has accepted data in response to a write. BRDY# is ignored when the bus is idle and at the end of the first clock in a bus cycle. BRDY# is sampled in the second and subsequent clocks of a burst cycle. Data presented on the data bus is strobed into the embedded IntelDX2 processor when BRDY# is sampled active. If RDY# is returned simultaneously with BRDY#, BRDY# is ignored and the burst cycle is prematurely aborted. BRDY# is active LOW and is provided with a small pull-up resistor. BRDY# must satisfy the setup and hold times t16 and t17. O Burst Last signal indicates that the next time BRDY# is returned, the burst bus cycle is complete. BLAST# is active for both burst and non-burst bus cycles. BLAST# is active LOW and is not driven during bus hold. RESET I Reset input forces the embedded IntelDX2 processor to begin execution at a known state. The processor cannot begin executing instructions until at least 1 ms after VCC , and CLK have reached their proper DC and AC specifications. The RESET pin must remain active during this time to ensure proper processor operation. However, for warm resets, RESET should remain active for at least 15 CLK periods. RESET is active HIGH. RESET is asynchronous but must meet setup and hold times t20 and t21 for recognition in any specific clock. INTR I Maskable Interrupt indicates that an external interrupt has been generated. When the internal interrupt flag is set in EFLAGS, active interrupt processing is initiated. The embedded IntelDX2 processor generates two locked interrupt acknowledge bus cycles in response to the INTR pin going active. INTR must remain active until the interrupt acknowledges have been performed to ensure processor recognition of the interrupt. BLAST# INTERRUPTS INTR is active HIGH and is not provided with an internal pull-down resistor. INTR is asynchronous, but must meet setup and hold times t20 and t21 for recognition in any specific clock. NMI 18 I Non-Maskable Interrupt request signal indicates that an external non-maskable interrupt has been generated. NMI is rising-edge sensitive and must be held LOW for at least four CLK periods before this rising edge. NMI is not provided with an internal pull-down resistor. NMI is asynchronous, but must meet setup and hold times t20 and t21 for recognition in any specific clock. Embedded IntelDX2TM Processor Table 8. Embedded IntelDX2TM Processor Pin Descriptions (Sheet 4 of 7) Symbol Type SRESET I Soft Reset pin duplicates all functionality of the RESET pin except that the SMBASE register retains its previous value. For soft resets, SRESET must remain active for at least 15 CLK periods. SRESET is active HIGH. SRESET is asynchronous but must meet setup and hold times t20 and t21 for recognition in any specific clock. Name and Function SMI# I System Management Interrupt input invokes System Management Mode (SMM). SMI# is a falling-edge triggered signal which forces the embedded IntelDX2 processor into SMM at the completion of the current instruction. SMI# is recognized on an instruction boundary and at each iteration for repeat string instructions. SMI# does not break LOCKed bus cycles and cannot interrupt a currently executing SMM. The embedded IntelDX2 processor latches the falling edge of one pending SMI# signal while it is executing an existing SMI#. The nested SMI# is not recognized until after the execution of a Resume (RSM) instruction. SMIACT# O System Management Interrupt Active, an active LOW output, indicates that the embedded IntelDX2 processor is operating in SMM. It is asserted when the processor begins to execute the SMI# state save sequence and remains active LOW until the processor executes the last state restore cycle out of SMRAM. STPCLK# I Stop Clock Request input signal indicates a request was made to turn off or change the CLK input frequency. When the embedded IntelDX2 processor recognizes a STPCLK#, it stops execution on the next instruction boundary (unless superseded by a higher priority interrupt), empties all internal pipelines and write buffers, and generates a Stop Grant bus cycle. STPCLK# is active LOW. Though STPCLK# has an internal pull-up resistor, an external 10-K pullup resistor is needed if the STPCLK# pin is unused. STPCLK# is an asynchronous signal, but must remain active until the embedded IntelDX2 processor issues the Stop Grant bus cycle. STPCLK# may be de-asserted at any time after the processor has issued the Stop Grant bus cycle. BUS ARBITRATION BREQ O Bus Request signal indicates that the embedded IntelDX2 processor has internally generated a bus request. BREQ is generated whether or not the processor is driving the bus. BREQ is active HIGH and is never floated. HOLD I Bus Hold Request allows another bus master complete control of the embedded IntelDX2 processor bus. In response to HOLD going active, the processor floats most of its output and input/output pins. HLDA is asserted after completing the current bus cycle, burst cycle or sequence of locked cycles. The embedded IntelDX2 processor remains in this state until HOLD is de-asserted. HOLD is active HIGH and is not provided with an internal pull-down resistor. HOLD must satisfy setup and hold times t18 and t19 for proper operation. HLDA O Hold Acknowledge goes active in response to a hold request presented on the HOLD pin. HLDA indicates that the embedded IntelDX2 processor has given the bus to another local bus master. HLDA is driven active in the same clock that the processor floats its bus. HLDA is driven inactive when leaving bus hold. HLDA is active HIGH and remains driven during bus hold. 19 Embedded IntelDX2TM Processor Table 8. Embedded IntelDX2TM Processor Pin Descriptions (Sheet 5 of 7) Symbol Type Name and Function BOFF# I Backoff input forces the embedded IntelDX2 processor to float its bus in the next clock. The processor floats all pins normally floated during bus hold but HLDA is not asserted in response to BOFF#. BOFF# has higher priority than RDY# or BRDY#; if both are returned in the same clock, BOFF# takes effect. The embedded IntelDX2 processor remains in bus hold until BOFF# is negated. If a bus cycle is in progress when BOFF# is asserted the cycle is restarted. BOFF# is active LOW and must meet setup and hold times t18 and t19 for proper operation. CACHE INVALIDATION AHOLD I Address Hold request allows another bus master access to the embedded IntelDX2 processor's address bus for a cache invalidation cycle. The processor stops driving its address bus in the clock following AHOLD going active. Only the address bus is floated during address hold, the remainder of the bus remains active. AHOLD is active HIGH and is provided with a small internal pull-down resistor. For proper operation, AHOLD must meet setup and hold times t18 and t19. EADS# I External Address - This signal indicates that a valid external address has been driven onto the embedded IntelDX2 processor address pins. This address is used to perform an internal cache invalidation cycle. EADS# is active LOW and is provided with an internal pull-up resistor. EADS# must satisfy setup and hold times t12 and t13 for proper operation. KEN# I Cache Enable pin is used to determine whether the current cycle is cacheable. When the embedded IntelDX2 processor generates a cycle that can be cached and KEN# is active one clock before RDY# or BRDY# during the first transfer of the cycle, the cycle becomes a cache line fill cycle. Returning KEN# active one clock before RDY# during the last read in the cache line fill causes the line to be placed in the on-chip cache. KEN# is active LOW and is provided with a small internal pull-up resistor. KEN# must satisfy setup and hold times t14 and t15 for proper operation. FLUSH# I Cache Flush input forces the embedded IntelDX2 processor to flush its entire internal cache. FLUSH# is active LOW and need only be asserted for one clock. FLUSH# is asynchronous but setup and hold times t20 and t21 must be met for recognition in any specific clock. CACHE CONTROL PAGE CACHEABILITY PWT PCD 20 O O Page Write-Through and Page Cache Disable pins reflect the state of the page attribute bits, PWT and PCD, in the page table entry, page directory entry or control register 3 (CR3) when paging is enabled. When paging is disabled, the embedded IntelDX2 processor ignores the PCD and PWT bits and assumes they are zero for the purpose of caching and driving PCD and PWT pins. PWT and PCD have the same timing as the cycle definition pins (M/IO#, D/C#, and W/R#). PWT and PCD are active HIGH and are not driven during bus hold. PCD is masked by the cache disable bit (CD) in Control Register 0. Embedded IntelDX2TM Processor Table 8. Embedded IntelDX2TM Processor Pin Descriptions (Sheet 6 of 7) Symbol Type Name and Function BUS SIZE CONTROL BS16# BS8# I I Bus Size 16 and Bus Size 8 pins (bus sizing pins) cause the embedded IntelDX2 processor to run multiple bus cycles to complete a request from devices that cannot provide or accept 32 bits of data in a single cycle. The bus sizing pins are sampled every clock. The processor uses the state of these pins in the clock before Ready to determine bus size. These signals are active LOW and are provided with internal pull-up resistors. These inputs must satisfy setup and hold times t14 and t15 for proper operation. I Address Bit 20 Mask pin, when asserted, causes the embedded IntelDX2 processor to mask physical address bit 20 (A20) before performing a lookup to the internal cache or driving a memory cycle on the bus. A20M# emulates the address wraparound at 1 Mbyte, which occurs on the 8086 processor. A20M# is active LOW and should be asserted only when the embedded IntelDX2 processor is in real mode. This pin is asynchronous but should meet setup and hold times t20 and t21 for recognition in any specific clock. For proper operation, A20M# should be sampled HIGH at the falling edge of RESET. ADDRESS MASK A20M# TEST ACCESS PORT TCK I Test Clock, an input to the embedded IntelDX2 processor, provides the clocking function required by the JTAG Boundary scan feature. TCK is used to clock state information (via TMS) and data (via TDI) into the component on the rising edge of TCK. Data is clocked out of the component (via TDO) on the falling edge of TCK. TCK is provided with an internal pull-up resistor. TDI I Test Data Input is the serial input used to shift JTAG instructions and data into the processor. TDI is sampled on the rising edge of TCK, during the SHIFT-IR and SHIFT-DR Test Access Port (TAP) controller states. During all other TAP controller states, TDI is a "don't care." TDI is provided with an internal pull-up resistor. TDO O Test Data Output is the serial output used to shift JTAG instructions and data out of the component. TDO is driven on the falling edge of TCK during the SHIFT-IR and SHIFT-DR TAP controller states. At all other times TDO is driven to the high impedance state. TMS I Test Mode Select is decoded by the JTAG TAP to select test logic operation. TMS is sampled on the rising edge of TCK. To guarantee deterministic behavior of the TAP controller, TMS is provided with an internal pull-up resistor. 21 Embedded IntelDX2TM Processor Table 8. Embedded IntelDX2TM Processor Pin Descriptions (Sheet 7 of 7) Symbol Type Name and Function NUMERIC ERROR REPORTING FERR# O The Floating Point Error pin is driven active when a floating point error occurs. FERR# is similar to the ERROR# pin on the Intel387TM Math CoProcessor. FERR# is included for compatibility with systems using DOS type floating point error reporting. FERR# will not go active if FP errors are masked in FPU register. FERR# is active LOW, and is not floated during bus hold. IGNNE# I When the Ignore Numeric Error pin is asserted the processor will ignore a numeric error and continue executing non-control floating point instructions, but FERR# will still be activated by the processor. When IGNNE# is de-asserted the processor will freeze on a non-control floating point instruction, if a previous floating point instruction caused an error. IGNNE# has no effect when the NE bit in control register 0 is set. IGNNE# is active LOW and is provided with a small internal pull-up resistor. IGNNE# is asynchronous but setup and hold times t20 and t21 must be met to ensure recognition on any specific clock. I Reserved is reserved for future use. This pin MUST be connected to an external pull-up resistor circuit. The recommended resistor value is 10 kOhms. The pull-up resistor must be connected only to the RESERVED# pin. Do not share this resistor with other pins requiring pull-ups. RESERVED PINS RESERVED# 22 Embedded IntelDX2TM Processor Table 9. Output Pins Output Signal Name Active Level BREQ HIGH Previous State HLDA HIGH As per HOLD Floated During Address Hold Floated During Bus Hold During Stop Grant and Stop Clock States BE3#-BE0# LOW * Previous State PWT, PCD HIGH * Previous State W/R#, M/IO#, D/C# HIGH/LOW * Previous State LOCK# LOW * HIGH (inactive) PLOCK# LOW * HIGH (inactive) ADS# LOW * HIGH (inactive) BLAST# LOW * PCHK# LOW FERR# LOW A3-A2 HIGH SMIACT# LOW Previous State Previous State Previous State * * Previous State Previous State NOTES: The term "Previous State" means that the processor maintains the logic level applied to the signal pin just before the processor entered the Stop Grant state. This conserves power by preventing the signal pin from floating. Table 10. Input/Output Pins Output Signal Name Active Level Floated During Address Hold Floated During Bus Hold During Stop Grant and Stop Clock States D31-D0 HIGH * Floated DP3-DP0 HIGH * Floated A31-A4 HIGH * Previous State * NOTES: The term "Previous State" means that the processor maintains the logic level applied to the signal pin just before the processor entered the Stop Grant state. This conserves power by preventing the signal pin from floating. Table 11. Test Pins Name Input or Output Sampled/ Driven On TCK Input N/A TDI Input Rising Edge of TCK TDO Output Failing Edge of TCK TMS Input Rising Edge of TCK 23 Embedded IntelDX2TM Processor Table 12. Input Pins Name Active Level Synchronous/ Asynchronous Internal Pull-Up/ Pull-Down CLK RESET HIGH Asynchronous SRESET HIGH Asynchronous HOLD HIGH Synchronous AHOLD HIGH Synchronous Pull-Down EADS# LOW Synchronous Pull-Up BOFF# LOW Synchronous Pull-Up FLUSH# LOW Asynchronous Pull-Up A20M# LOW Asynchronous Pull-Up BS16#, BS8# LOW Synchronous Pull-Up KEN# LOW Synchronous Pull-Up RDY# LOW Synchronous BRDY# LOW Synchronous INTR HIGH Asynchronous NMI HIGH Asynchronous IGNNE# LOW Asynchronous Pull-Down Pull-Up Pull-Up RESERVED# SMI# LOW Asynchronous Pull-Up STPCLK# LOW Asynchronous Pull-Up1 TCK HIGH Pull-Up TDI HIGH Pull-Up TMS HIGH Pull-Up NOTES: 1. Though STPCLK# has an internal pull-up resistor, an external 10-K pull-up resistor is needed if the STPCLK# pin is unused. 24 Embedded IntelDX2TM Processor 4.0 ARCHITECTURAL AND FUNCTIONAL OVERVIEW The embedded IntelDX2 processor architecture is essentially the same as the IntelDX2 processor. Refer to the Embedded Intel486TM Processor Family Developer's Manual for a description of the IntelDX2 processor. Note that the embedded IntelDX2 processor has one pin reserved for possible future use. This pin, an input signal, is called RESERVED# and must be connected to a 10-K pull-up resistor. The pull-up resistor must be connected only to the RESERVED# pin. Do not share this resistor with other pins requiring pull-ups. can change the value of this flag, the CPUID instruction is available. The actual state of the ID Flag bit is irrelevant and provides no significance to the hardware. This bit is cleared (reset to zero) upon device reset (RESET or SRESET) for compatibility with Intel486 processor designs that do not support the CPUID instruction. CPUID-instruction details are provided here for the embedded IntelDX2 processor. Refer to Intel Application Note AP-485 Intel Processor Identification with the CPUID Instruction (Order No. 241618) for a description that covers all aspects of the CPUID instruction and how it pertains to other Intel processors. 4.1.1 4.1 CPUID Instruction The embedded IntelDX2 processor supports the CPUID instruction (see Table 13). Because not all Intel processors support the CPUID instruction, a simple test can determine if the instruction is supported. The test involves the processor's ID Flag, which is bit 21 of the EFLAGS register. If software Operation of the CPUID Instruction The CPUID instruction requires the software developer to pass an input parameter to the processor in the EAX register. The processor response is returned in registers EAX, EBX, EDX, and ECX. Table 13. CPUID Instruction Description OP CODE 0F A2 Instruction Processor Core Clocks CPUID Parameter passed in EAX Description (Input Value) 9 0 Vendor (Intel) ID String 14 1 Processor Identification 9 >1 Undefined (Do Not Use) Vendor ID String - When the parameter passed in EAX is 0 (zero), the register values returned upon instruction execution are shown in the following table. 31-------------24 23-----------16 15--------------8 7--------------0 High Value (= 1) EAX 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 Vendor ID String EBX u (75) n (6E) e (65) G (47) (ASCII EDX I (49) e (65) n (6E) i (69) Characters) ECX l (6C) e (65) t (74) n (6E) The values in EBX, EDX and ECX indicate an Intel processor. When taken in the proper order, they decode to the string "GenuineIntel." 25 Embedded IntelDX2TM Processor Processor Identification - When the parameter passed to EAX is 1 (one), the register values returned upon instruction execution are: 31---------------------------14 Processor Signature EAX 13,12 11----8 7----4 3----0 (Do Not Use) 00 0100 0011 XXXX Intel Reserved Processor Type Family Model Stepping (Intel releases information about stepping numbers as needed) 31--------------------------------------------------------------------------------------------------0 Intel Reserved EBX Intel Reserved (Do Not Use) ECX Intel Reserved Feature Flags EDX 4.2 31----------------------------------------------------------------------------2 1 0------------------------------------------------------------------------------0 1 0 0 VME FPU Identification After Reset Processor Identification - Upon reset, the EDX register contains the processor signature: Processor Signature EDX 31---------------------------14 13,12 11----8 7----4 3----0 (Do Not Use) 00 0100 0011 XXXX Intel Reserved Processor Type Family Model Stepping (Intel releases information about stepping numbers as needed) 4.3 Boundary Scan (JTAG) 4.3.1 Device Identification Tables 14 and 15 show the 32-bit code for the embedded IntelDX2 processor. This code is loaded into the Device Identification Register. Table 14. Boundary Scan Component Identification Code (3.3 Volt Processor) Version Part Number 1 Intel Architecture Type Family 0100 = Intel486 CPU Family Model 00101 = embedded IntelDX2 processor 009H = Intel 31----28 27 26-----------21 20----17 16--------12 11------------1 0 XXXX 1 000001 0100 00101 00000001001 1 (Intel releases information about version numbers as needed) Boundary Scan Component Identification Code = x828 5013 (Hex) 26 Mfg ID VCC 0=5 V 1=3.3 V Embedded IntelDX2TM Processor Table 15. Boundary Scan Component Identification Code (5 Volt Processor) Version Part Number Mfg ID 1 009H = Intel VCC 0=5 V 1=3.3 V Intel Architecture Type Family 0100 = Intel486 CPU Family Model 00101 = embedded IntelDX2 processor 31----28 27 26-----------21 20----17 16--------12 11------------1 0 XXXX 0 000001 0100 00101 00000001001 1 (Intel releases information about version numbers as needed) Boundary Scan Component Identification Code = x028 5013 (Hex) 4.3.2 Boundary Scan Register Bits and Bit Order The boundary scan register contains a cell for each pin as well as cells for control of bidirectional and three-state pins. There are "Reserved" bits which correspond to no-connect (N/C) signals of the embedded IntelDX2 processor. Control registers WRCTL, ABUSCTL, BUSCTL, and MISCCTL are used to select the direction of bidirectional or threestate output signal pins. A "1" in these cells designates that the associated bus or bits are floated if the pins are three-state, or selected as input if they are bidirectional. * WRCTL controls D31-D0 and DP3-DP0 * ABUSCTL controls A31-A2 * BUSCTL controls ADS#, BLAST#, PLOCK#, LOCK#, W/R#, BE0#, BE1#, BE2#, BE3#, M/IO#, D/C#, PWT, and PCD * MISCCTL controls PCHK#, HLDA, and BREQ The following is the bit order of the embedded IntelDX2 processor boundary scan register: TDO A2, A3, A4, A5, RESERVED#, A6, A7, A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18, A19, A20, A21, A22, A23, A24, A25, A26, A27, A28, A29, A30, A31, DP0, D0, D1, D2, D3, D4, D5, D6, D7, DP1, D8, D9, D10, D11, D12, D13, D14, D15, DP2, D16, D17, D18, D19, D20, D21, D22, D23, DP3, D24, D25, D26, D27, D28, D29, D30, D31, STPCLK#, IGNNE#, FERR#, SMI#, SMIACT#, SRESET, NMI, INTR, FLUSH#, RESET, A20M#, EADS#, PCD, PWT, D/C#, M/IO#, BE3#, BE2#, BE1#, BE0#, BREQ, W/R#, HLDA, CLK, RESERVED#, AHOLD, HOLD, KEN#, RDY#, BS8#, BS16#, BOFF#, BRDY#, PCHK#, LOCK#, PLOCK#, BLAST#, ADS#, MISCCTL, BUSCTL, ABUSCTL, WRCTL TDI 27 Embedded IntelDX2TM Processor 5.0 ELECTRICAL SPECIFICATIONS 5.2 5.1 Maximum Ratings The following tables show the operating supply voltages, DC I/O specifications, and component power consumption for the embedded IntelDX2 processor. Table 16 is a stress rating only. Extended exposure to the Maximum Ratings may affect device reliability. Furthermore, although the embedded IntelDX2 processor contains protective circuitry to resist damage from electrostatic discharge, always take precautions to avoid high static voltages or electric fields. Functional operating conditions are given in Section 5.2, DC Specifications and Section 5.3, AC Specifications. Table 16. Absolute Maximum Ratings Case Temperature under Bias -65 C to +110 C Storage Temperature -65 C to +150 C DC Voltage on Any Pin with Respect to Ground Supply Voltage VCC with Respect to VSS 28 -0.5 V to VCC + 0.5 V -0.5 V to +6.5 V DC Specifications Table 17. Operating Supply Voltages Product VCC SB80486DX2SC50 3.3 V 0.3 V A80486DX2SA66 5.0 V 0.25 V Embedded IntelDX2TM Processor Table 18. 3.3 V DC Specifications Functional Operating Range: VCC = 3.3 V 0.3 V, TCASE=0 C to +85 C Symbol Parameter Min. Max. Unit VIL Input LOW Voltage -0.3 +0.8 V VIH Input HIGH Voltage 2.0 VCC +0.3 V VCC -0.6 VCC +0.3 V I OL = 2.0 mA 0.4 V I OL = 100 A 0.2 V VIHC Input HIGH Voltage of CLK VOL Output LOW Voltage VOH Notes Note 1 Output HIGH Voltage I OH = -2.0 mA I OH = -100 A 2.4 VCC -0.2 V V ILI Input Leakage Current 15 A Note 2 IIH Input Leakage Current SRESET 200 300 A A Note 3 Note 3 Note 4 IIL Input Leakage Current 400 A I LO Output Leakage Current 15 A CIN Input Capacitance 10 pF Note 5 COUT I/O or Output Capacitance 10 pF Note 5 CCLK CLK Capacitance 6 pF Note 5 NOTES: 1. All inputs except CLK. 2. This parameter is for inputs without pull-up or pull-down resistors and 0V VIN VCC. 3. This parameter is for inputs with pull-down resistors and VIH = 2.4V. 4. This parameter is for inputs with pull-up resistors and VIL = 0.4V. 5. FC=1 MHz. Not 100% tested. 29 Embedded IntelDX2TM Processor Table 19. 3.3 V ICC Values Functional Operating Range: VCC = 3.3 V 0.3 V; TCASE = 0C to +85C Parameter Operating Frequency Maximum Notes 450 mA 550 mA Note 1 318 mA 395 mA 416 mA 507 mA Notes 2, 3, 4 40 MHz 50 MHz 20 mA 23 mA 40 mA 50 mA Note 5 0 MHz 100 A 1 mA Note 6 ICC Active (Power Supply) 40 MHz 50 MHz ICC Active (Thermal Design) 40 MHz 50 MHz ICC Stop Grant ICC Stop Clock Typ NOTES: 1. This parameter is for proper power supply selection. It is measured using the worst case instruction mix at VCC = 3.6V. 2. The maximum current column is for thermal design power dissipation. It is measured using the worst case instruction mix at VCC = 3.3V. 3. The typical current column is the typical operating current in a system. This value is measured in a system using a typical device at VCC = 3.3V, running Microsoft Windows 3.1 at an idle condition. This typical value is dependent upon the specific system configuration. 4. Typical values are not 100% tested. 5. The ICC Stop Grant specification refers to the ICC value once the embedded IntelDX2 processor enters the Stop Grant or Auto HALT Power Down state. 6. The ICC Stop Clock specification refers to the ICC value once the embedded IntelDX2 processor enters the Stop Clock state. The VIH and VIL levels must be equal to VCC and 0 V, respectively, to meet the ICC Stop Clock specifications. 30 Embedded IntelDX2TM Processor Table 20. 5 V DC Specifications Functional operating range: VCC = 5V 0.25V; TCASE = 0C to +85C Symbol Min Max Unit VIL Input LOW Voltage Parameter -0.3 +0.8 V 2.0 VCC+0.3 V VIH Input HIGH Voltage VOL Output LOW Voltage VOH Output HIGH Voltage 0.45 2.4 Notes V Note 1 V Note 2 ILI Input Leakage Current 15 A Note 3 IIH Input Leakage Current SRESET 200 300 A A Note 4 Note 4 Note 5 IIL Input Leakage Current 400 A ILO Output Leakage Current 15 A CIN Input Capacitance 20 pF Note 6 COUT Output or I/O Capacitance 20 pF Note 6 CCLK CLK Capacitance 20 pF Note 6 NOTES: 1. This parameter is measured at: Address, Data, BEn # 4.0 mA Definition, Control 5.0 #mA 2. This parameter is measured at: Address, Data, BEn # -1.0 mA Definition, Control -0.9 mA 3. This parameter is for inputs without pull-ups or pull-downs and 0V VIN VCC. 4. This parameter is for inputs with pull-downs and VIH = 2.4V. 5. This parameter is for inputs with pull-ups and VIL = 0.45V. 6. FC=1 MHz; Not 100% tested. 31 Embedded IntelDX2TM Processor Table 21. 5 V ICC Values Functional Operating Range: VCC = 5V 0.25V; TCASE = 0C to +85C Parameter Operating Frequency Maximum Notes 950 mA 1200 mA Note 1 680 mA 901 mA 906 mA 1145 mA Notes 2, 3, 4 50 MHz 66 MHz 35 mA 40 mA 70 mA 90 mA Note 5 0 MHz 200 A 2 mA Note 6 ICC Active (Power Supply) 50 MHz 66 MHz ICC Active (Thermal Design) 50 MHz 66 MHz ICC Stop Grant ICC Stop Clock Typ NOTES: 1. This parameter is for proper power supply selection. It is measured using the worst case instruction mix at VCC = 5.25V. 2. The maximum current column is for thermal design power dissipation. It is measured using the worst case instruction mix at VCC = 5V. 3. The typical current column is the typical operating current in a system. This value is measured in a system using a typical device at VCC = 5V, running Microsoft Windows 3.1 at an idle condition. This typical value is dependent upon the specific system configuration. 4. Typical values are not 100% tested. 5. The ICC Stop Grant specification refers to the ICC value once the embedded IntelDX2 processor enters the Stop Grant or Auto HALT Power Down state. 6. The ICC Stop Clock specification refers to the ICC value once the processor enters the Stop Clock state. The VIH and VIL levels must be equal to VCC and 0V, respectively, in order to meet the ICC Stop Clock specifications. 32 Embedded IntelDX2TM Processor 5.3 AC Specifications The AC specifications for the embedded IntelDX2 processor are given in this section. Table 22. AC Characteristics TCASE = 0C to +85C; CL = 50pF, unless otherwise specified. (Sheet 1 of 2) Vcc (Package) Symbol Parameter CLK Frequency 3.3V (208-Lead SQFP) 5V (168-Pin PGA) Min Max Min Max Unit 8 25 8 33 MHz 125 30 Figure Notes Note 1 t1 CLK Period t1a CLK Period Stability t2 CLK High Time 14 t3 CLK Low Time 14 t4 CLK Fall Time 4 3 ns 4 2V to 0.8V t5 CLK Rise Time 4 3 ns 4 0.8V to 2V t6 A31-A2, PWT, PCD, BE3-BE0#, M/IO#, D/C#, W/R#, ADS#, LOCK#, BREQ, HLDA, SMIACT#, FERR# Valid Delay 16 ns 8 t7 A31-A2, PWT, PCD, BE3-BE0#, M/IO#, D/C#, W/R#, ADS#, LOCK#, BREQ, HLDA Float Delay 20 ns 9 40 125 ns 4 250 ps 4 11 ns 4 at 2V 11 ns 4 at 0.8V 250 3 19 3 28 t8 PCHK# Valid Delay 3 24 3 22 ns 7 t8a BLAST#, PLOCK# Valid Delay 3 24 3 20 ns 8 20 ns 9 3 20 3 18 ns 8 20 ns 9 5 t9 BLAST#, PLOCK# Float Delay t10 D31-D0, DP3-DP0 Write Data Valid Delay t11 D31-D0, DP3-DP0 Write Data Float Delay t12 EADS# Setup Time 8 5 ns t13 EADS# Hold Time 3 3 ns 5 t14 KEN#, BS16#, BS8# Setup Time 8 5 ns 5 t15 KEN#, BS16#, BS8# Hold Time 3 3 ns 5 t16 RDY#, BRDY# Setup Time 8 5 ns 6 t17 RDY#, BRDY# Hold Time 3 3 ns 6 t18 HOLD, AHOLD Setup Time 10 6 ns 5 t18a BOFF# Setup Time 10 8 ns 5 t19 HOLD, AHOLD, BOFF# Hold Time 3 3 ns 5 28 28 Adjacent clocks Note 2 Note 2 Note 2 33 Embedded IntelDX2TM Processor Table 22. AC Characteristics TCASE = 0C to +85C; CL = 50pF, unless otherwise specified. (Sheet 2 of 2) Vcc (Package) 3.3V (208-Lead SQFP) 5V (168-Pin PGA) Symbol Parameter Unit Figure Notes t20 FLUSH#, A20M#, NMI, INTR, SMI#, STPCLK#, SRESET, RESET, IGNNE# Setup Time 10 5 ns 5 Note 3 t21 FLUSH#, A20M#, NMI, INTR, SMI#, STPCLK#, SRESET, RESET, IGNNE# Hold Time 3 3 ns 5 Note 3 t22 D31-D0, DP3-DP0, A31-A4 Read Setup Time 6 5 ns 6 5 t23 D31-D0, DP3-DP0, A31-A4 Read Hold Time 3 3 ns 6 5 Min Max Min Max NOTES: 1. 0-MHz operation is guaranteed when the STPCLK# and Stop Grant bus cycle protocol is used. 2. Not 100% tested, guaranteed by design characterization. 3. A reset pulse width of 15 CLK cycles is required for warm resets (RESET or SRESET). Power-up resets (cold resets) require RESET to be asserted for at least 1 ms after VCC and CLK are stable. Table 23. AC Specifications for the Test Access Port (Both 3.3V SQFP and 5V PGA Processors) TCASE = 0C to +85C; CL = 50 pF Symbol Parameter Min Max Unit 8 MHz Figure Notes t24 TCK Frequency t25 TCK Period 125 ns 10 t26 TCK High Time 40 ns 10 @ 2.0V t27 TCK Low Time 40 ns 10 @ 0.8V t28 TCK Rise Time 8 ns 10 Note 2 t29 TCK Fall Time 8 ns 10 Note 2 t30 TDI, TMS Setup Time 8 ns 11 Note 3 t31 TDI, TMS Hold Time 10 ns 11 Note 3 t32 TDO Valid Delay 3 30 ns 11 Note 3 t33 TDO Float Delay 36 ns 11 Note 3 t34 All Outputs (except TDO) Valid Delay 30 ns 11 Note 3 t35 All Outputs (except TDO) Float Delay 36 ns 11 Note 3 t36 All Inputs (except TDI, TMS, TCK) Setup Time 8 ns 11 Note 3 t37 All Inputs (except TDI, TMS, TCK) Hold Time 10 ns 11 Note 3 3 Note 1 NOTES: 1. TCK period CLK period. 2. Rise/Fall times are measured between 0.8V and 2.0V. Rise/Fall times can be relaxed by 1 ns per 10-ns increase in TCK period. 3. Parameters t30 - t37 are measured from TCK. 34 Embedded IntelDX2TM Processor CLK 2.0 V 1.5 V 2.0 V 1.5 V 0.8 V 0.8 V t2 t3 t4 t5 t1 tx ty 1.5 V tx = input setup times ty = input hold times, output float, valid and hold times Figure 4. CLK Waveform Tx Tx Tx Tx CLK t12 t13 t14 t15 t18 t19 t20 t21 t22 t23 EADS# BS8#, BS16#, KEN# BOFF#, AHOLD, HOLD RESET, FLUSH#, A20M#, INTR, NMI, SMI#, STPCLK#, SRESET, IGNNE# A31-A4 (READ) Figure 5. Input Setup and Hold Timing 35 Embedded IntelDX2TM Processor Tx T2 Tx CLK t16 t17 RDY#, BRDY# 1.5 V t22 t23 D31-D0, DP3-DP0 1.5 V Figure 6. Input Setup and Hold Timing T2 Tx Tx Tx CLK RDY#, BRDY# D31-D0, DP3-DP0 VALID t8 PCHK# MIN MAX VALID Figure 7. PCHK# Valid Delay Timing 36 Embedded IntelDX2TM Processor Tx Tx Tx Tx CLK MIN A2-A31, PWT, PCD, BE0-3#, M/IO#, D/C#, W/R#, ADS#, LOCK#, BREQ, HLDA, SMIACT# MAX t6 VALID n VALID n+1 MIN MAX t10 D31-D0, DP3-DP0 VALID n VALID n+1 MIN t8a BLAST#, PLOCK# MAX VALID n VALID n+1 Figure 8. Output Valid Delay Timing Tx Tx Tx CLK A2-A31, PWT, PCD, BE0-3#, M/IO#, D/C#, W/R#, ADS#, LOCK#, BREQ, HLDA, FERR# t6 MIN t11 VALID t8a BLAST#, PLOCK# t7 VALID t10 D31-D0, DP3-DP0 MIN MIN t9 VALID Figure 9. Maximum Float Delay Timing 37 Embedded IntelDX2TM Processor 2.0 V 2.0 V t27 TCK 0.8 V 0.8 V t28 t26 t29 t25 Figure 10. TCK Waveform 1.5 V TCK t31 t30 TMS, TDI VALID t33 t32 VALID TDO t 35 t34 VALID OUTPUT t36 INPUT VALID t37 VALID Figure 11. Test Signal Timing Diagram 38 Embedded IntelDX2TM Processor 5.4 Capacitive Derating Curves The following graphs are the capacitive derating curves for the embedded IntelDX2 processor. nom+7 nom+6 Delay (ns) nom+5 nom+4 nom+3 nom+2 nom+1 nom nom-1 nom-2 25 50 75 100 125 150 Capacitive Load (pF) NOTE: This graph will not be linear outside of the capacitive range shown. nom = nominal value from the AC Characteristics table. Figure 12. Typical Loading Delay versus Load Capacitance under Worst-Case Conditions for a Low-to-High Transition, 3.3 V Processor Delay (ns) nom+5 nom+4 nom+3 nom+2 nom+1 nom nom-1 nom-2 25 50 75 100 Capacitive Load (pF) 125 150 NOTE: This graph will not be linear outside of the capacitive range shown. nom = nominal value from the AC Characteristics table. Figure 13. Typical Loading Delay versus Load Capacitance under Worst-Case Conditions for a High-to-Low Transition, 3.3 V Processor 39 Embedded IntelDX2TM Processor nom+5 Delay (ns) nom+4 nom+3 nom+2 nom+1 nom nom-1 nom-2 25 50 75 100 125 150 Capacitive Load (pF) Note: This graph will not be linear outside of the capacitive range shown. nom = nominal value from the AC Characteristics table. A3234-01 Figure 14. Typical Loading Delay versus Load Capacitance under Worst-Case Conditions for a Low-to-High Transition, 5 V Processor nom+7 nom+6 nom+5 Delay (ns) nom+4 nom+3 nom+2 nom+1 nom nom-1 nom-2 25 Note: 50 75 100 Capacitive Load (pF) 125 150 This graph will not be linear outside of the capacitive range shown. nom = nominal value from the AC Characteristics table. A3235-01 Figure 15. Typical Loading Delay versus Load Capacitance under Worst-Case Conditions for a High-to-Low Transition, 5 V Processor 40 Embedded IntelDX2TM Processor 6.0 MECHANICAL DATA This section describes the packaging dimensions and thermal specifications for the embedded IntelDX2 processor. 6.1 Package Dimensions 30.6 0.25 28.0 0.10 25.50 (ref) 1.14 (ref) .40 Min 157 208 0.13 + 0.12-0.08 1 156 0 Min 7 Max 0.60 0.10 0.50 1.30 Ref Top View 3.37 0.08 3.70 Max 52 0.13 Min 0.25 Max 105 53 104 NOTE: Length measurements same as width measurements 1.76 Max Tolerance Window for Lead Skew from Theoretical True Position 0.10 Max Units: mm A3262-01 Figure 16. 208-Lead SQFP Package Dimensions 41 Embedded IntelDX2TM Processor Figure 17. Principal Dimensions and Data for 168-Pin Pin Grid Array Package Table 24. 168-Pin Ceramic PGA Package Dimensions Symbol Millimeters Min Max A 3.56 4.57 Min Max 0.140 0.180 Notes A1 0.64 1.14 SOLID LID 0.025 0.045 SOLID LID A2 2.8 3.5 SOLID LID 0.110 0.140 SOLID LID A3 1.14 1.40 0.045 0.055 B 0.43 0.51 0.017 0.020 D 44.07 44.83 1.735 1.765 D1 40.51 40.77 1.595 1.605 e1 2.29 2.79 0.090 0.110 L 2.54 3.30 0.100 N S1 42 Inches Notes 168 1.52 0.130 168 2.54 0.060 0.100 Embedded IntelDX2TM Processor Table 25. Ceramic PGA Package Dimension Symbols Letter or Symbol Description of Dimensions A Distance from seating plane to highest point of body A1 Distance between seating plane and base plane (lid) A2 Distance from base plane to highest point of body A3 Distance from seating plane to bottom of body B Diameter of terminal lead pin D Largest overall package dimension of length D1 A body length dimension, outer lead center to outer lead center e1 Linear spacing between true lead position centerlines L Distance from seating plane to end of lead S1 Other body dimension, outer lead center to edge of body NOTES: 1. Controlling dimension: millimeter. 2. Dimension "e1" ("e") is non-cumulative. 3. Seating plane (standoff) is defined by P.C. board hole size: 0.0415-0.0430 inch. 4. Dimensions "B", "B1" and "C" are nominal. 5. Details of Pin 1 identifier are optional. 43 Embedded IntelDX2TM Processor 6.2 Where TJ, TA, TC equals Junction, Ambient and Case Temperature respectively. JC, JA equals Junction-to-Case and Junction-to-Ambient thermal Resistance, respectively. P is defined as Maximum Power Consumption. Package Thermal Specifications The embedded IntelDX2 processor is specified for operation when the case temperature (TC) is within the range of 0C to 85C. TC may be measured in any environment to determine whether the processor is within the specified operating range. Values for JA and JC are given in the following tables for each product at its maximum operating frequencies. Maximum TA is shown for each product operating at various processor frequencies (twice the CLK frequencies). The ambient temperature (TA) can be calculated from JC and JA from the following equations: TJ = TC + P * JC TA = TJ - P * JA TC = TA + P * [JA - JC] TA = TC - P * [JA - JC] Table 26. Thermal Resistance, JA (C/W) JA vs. Airflow -- ft/min. (m/sec) 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) 1000 (5.07) 208-Lead SQFP (3.3V) - Without Heat Sink 24.0 17.0 15.0 13.0 - - 168-Pin PGA (5V) - Without Heat Sink 17.0 14.5 12.5 11.0 10.0 9.5 168-Pin PGA (5V) - With Heat Sink* 13.0 8.0 6.0 5.0 4.5 4.25 *0.350" high omnidirectional heat sink. Table 27. Thermal Resistance, JC (C/W) JC vs. Airflow -- ft/min. (m/sec) 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 0 200 400 600 208-Lead SQFP (3.3V) 3.5 6.0 6.0 6.0 168-Pin PGA (5V) 1.5 - - - Table 28. Maximum Tambient, TA max (C) Airflow -- ft/min. (m/sec) Freq. (MHz) 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) IntelDX2TM Processor 208-Lead SQFP (3.3V) 40 57 70 73 75 Without Heat Sink 50 51 67 70 73 168-Pin PGA (5V) 50 15 26 35 46 Without Heat Sink 66 -4 11 22 36 168-Pin PGA (5V) 50 33 56 65 69 With Heat Sink 66 19 48 59 65 44