©2002 Fairchild Semiconductor Corporation Rev. A1, December 2002
2N3819
Epitaxial Silicon Transistor
Absolute Maximum Ratings* TC=25°C unless otherwise noted
* This ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These rating are based on a maximum junction temperature of 150 degrees C.
2) These are steady limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Electrical Characteristics TC=25°C unless otherwise noted
Thermal Charac teris tics TA=25°C unless otherwise noted
* Device mounted on FR-4 PCB 1.5” × 1.6” × 0.06”
Symbol Parameter Ratings Units
VDG Drain-Gate Voltage 25 V
VGS Gate-Source Voltage -25 V
IDDrain Current 50 mA
IGF Forward Gate Current 10 mA
TSTG Storage Temperature Range -55 ~ 150 °C
Symbol Parameter Test Condition Min. Typ. Max. Units
Off Characteristics
V(BR)GSS Gate-Source Breakdwon Voltage IG = 1.0µA, VDS = 0 25 V
IGSS Gate Reverse Current VGS = -15V, VDS = 0 2.0 nA
VGS(off) Gate-Source Cutoff Voltage VDS = 15V, ID = 2.0nA 8.0 V
VGS Gate-Source Voltage VDS = 15V, ID = 200µA -0.5 -7.5 V
On Characteristics
IDSS Zero-Gate Voltage Drain Current VDS = 15V, VGS = 0 2.0 20 mA
Small Signal Characteristics
gfs Forward Transfer Conductance VDS = 15V, VGS = 0, f = 1.0KHz 2000 6500 µmhos
goss Output Conductance VDS= 15V, VGS = 0, f = 1.0KHz 50 µmhos
yfs Forward Trans fer Adm ittance VDS= 15V, VGS = 0, f = 1.0KHz 1600 µmhos
Ciss Input Capacitance VDS = 15V, VGS = 0, f = 1.0KHz 8.0 pF
Crss Reverse Trans fer Capacitance VDS = 15V, VGS = 0, f = 1.0KHz 4.0 pF
Symbol Parameter Max. Units
PDTotal Device Dissipation
Derate above 25°C350
2.8 mW
mW/°C
RθJC Thermal Resistance, Junction to Case 125 °C/W
RθJA Thermal Resistance, Junction to Ambient 357 °C/W
2N3819
N-Channel RF Amplifier
This device is designed for RF amplifier and mixer applications
operating up to 450MHz, and for analog switching requiring low
capacitance.
Sourced from process 50.
TO-92
1. Drain 2. Gate 3. Source
1
0.46 ±0.10
1.27TYP
(R2.29)
3.86MAX
[1.27 ±0.20]1.27TYP
[1.27 ±0.20]
3.60 ±0.20
14.47 ±0.40
1.02 ±0.10
(0.25) 4.58 ±0.20
4.58 +0.25
–0.15
0.38 +0.10
–0.05
0.38 +0.10
–0.05
TO-92
Package Dimensions
2N3819
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation Rev. A1, December 2002
©2002 Fairchild Semiconductor Corporation Rev. I1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all su ch trademarks.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY A NY LICENSE UNDER ITS PATENT RIGHTS, N OR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devic es or syst em s
which, (a) ar e intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconduct or reserv es the right to make
changes at any time without notice in order to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
FACT™
FACT Quiet series™
FAST®
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
I2C™
ImpliedDisconnect™
ISOPLANAR™
LittleFET
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC®
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
SILENT SWITCHER®
SMART START™
SPM™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation
UHC™
UltraFET®
VCX™
ACEx™
ActiveArray™
Bottomless
CoolFET™
CROSSVOLT
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
Across the board. Around the w orld.™
The Power Franchise™
Programmab le Acti ve Droo p™