SLB9645VQ12FW13332XUMA2 - INFINEON TECHNOLOGIES AG

Data Sheet Please read the Important Notice and Warnings at the end of this document Revision 1.2

www.infineon.com 2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Data Sheet

Devices

• SLB 9645VQ1.2

• SLB 9645XQ1.2

• SLB 9645TT1.2

• SLB 9645XT1.2

Key Features

• Compliant to TPM Main Specification, Version 1.2, Rev. 116 (see [1])

•I2C interface

• Approved for Google Chromebook / Chromebox

• Standard (-20°C to +85°C) and enhanced temperature range (-40°C to +85°C)

• PG-VQFN-32-13 or PG-TSSOP-28-2 package

• Optimized for battery operated devices: low standby power consumption (typ. 150μA)

• 24 PCRs

• 6 kByte free NV memory

• Up to 10 concurrent sessions

• Up to eight 2048-bit keys can be loaded into volatile storage

• 16 slots for keys of up to 2048-bit

• 8 monotonic counters

• 1280 Byte I/O buffer

• Built-in support by Linux Kernel

About this document

Scope and purpose

This data sheet describes the OPTIGA™ TPM SLB 9645 TPM1.2 Trusted Platform Module together with its

features, functionality and programming interface.

Intended audience

This data sheet is primarily intended for system developers.

Data Sheet 2 Revision 1.2 
    2018-09-21
OPTIGA™ TPM
SLB 9645 TPM1.2
 
Table of contents
About this document   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2
List of figures   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  4
List of tables  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  5
1 Overview  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  6
2 Device Types / Ordering Information   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  6
3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  6
3.1 Typical Schematic  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   9
4 Electrical Characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  10
4.2 Functional Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  10
4.3 DC Characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   11
4.4 AC Characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   12
4.5 Timing   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   12
4.6 I2C Standard/Fast Mode Interface Characteristics   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13
5 Package Dimensions (TSSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 Packing Type   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   14
5.2 Recommended Footprint   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
5.3 Chip Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   15
6 Package Dimensions (VQFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.1 Packing Type   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   16
6.2 Recommended Footprint   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16
6.3 Chip Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   17
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Terminology  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table of contents

Data Sheet 4 Revision 1.2 
    2018-09-21
OPTIGA™ TPM
SLB 9645 TPM1.2
 
List of figures
Figure 1 Pinout of the SLB 9645TT1.2 / SLB 9645XT1.2 (PG-TSSOP-28-2 Package, Top View) . . . . . . . . . . . . . .   6
Figure 2 Pinout of the SLB 9645VQ1.2 / SLB 9645XQ1.2 (PG-VQFN-32-13 Package, Top View). . . . . . . . . . . . . .   7
Figure 3 Typical Schematic  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   9
Figure 4 RST# Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   12
Figure 5 Package Dimensions PG-TSSOP-28-2  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   14
Figure 6 Tape & Reel Dimensions PG-TSSOP-28-2  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   14
Figure 7 Recommended Footprint PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
Figure 8 Chip Marking PG-TSSOP-28-2  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
Figure 9 Package Dimensions PG-VQFN-32-13  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16
Figure 10 Tape & Reel Dimensions PG-VQFN-32-13  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16
Figure 11 Recommended Footprint PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16
Figure 12 Chip Marking PG-VQFN-32-13  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
List of figures

Data Sheet 5 Revision 1.2 
    2018-09-21
OPTIGA™ TPM
SLB 9645 TPM1.2
 
List of tables
Table 1 Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   6
Table 2 Buffer Types  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   7
Table 3 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   7
Table 4 Power Supply  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   8
Table 5 Not Connected  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   8
Table 6 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   10
Table 7 Functional Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   10
Table 8 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   11
Table 9 DC Characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11
Table 10 Device Reset  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   12
Table 11 I2C Standard Mode Interface Characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13
Table 12 I2C Fast Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   13
List of tables

Data Sheet 6 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Overview

1 Overview

The OPTIGA™ TPM SLB 9645 is a Trusted Platform Module. It is available in different packages, see Table 1 below.

It only supports the I2C interface and features a dedicated interrupt pin which increases performance (since no

polling on the I2C bus is necessary). The I2C interface is compliant to both standard mode operation (up to

100 kHz) and fast mode operation (up to 400 kHz); for details regarding the characteristics in these modes, please

refer to Section 4.6.

2 Device Types / Ordering Information

The OPTIGA™ TPM SLB 9645 product family features devices with different packages and different temperature

ranges. Table 1 shows the available versions.

3 Pin Description

Figure 1 Pinout of the SLB 9645TT1.2 / SLB 9645XT1.2 (PG-TSSOP-28-2 Package, Top View)

Table 1 Device Types

Device Name Package Remarks

SLB 9645VQ1.2 PG-VQFN-32-13 Standard temperature range

SLB 9645XQ1.2 PG-VQFN-32-13 Enhanced temperature range

SLB 9645TT1.2 PG-TSSOP-28-2 Standard temperature range

SLB 9645XT1.2 PG-TSSOP-28-2 Enhanced temperature range

SDA

SCL

GND

VDD

DA VINT#

RESET#

VDD

GND

TPM

SLB 9645TT1.2

PG-TSSOP-28-2

14 8 14

15182228

Pi n ning _TSS OP- 28 - 2_S LB 96 45. vsd

Data Sheet 7 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Pin Description

Figure 2 Pinout of the SLB 9645VQ1.2 / SLB 9645XQ1.2 (PG-VQFN-32-13 Package, Top View)

Table 2 Buffer Types

Buffer Type Description

TS Tri-State pin

ST Schmitt-Trigger pin

OD Open-Drain pin

Table 3 I/O Signals

Pin Number Name Pin

Type

Buffer

Type

Function

PG-TSSOP-

28-2

PG-VQFN-

32-13

129SDAI/OODI2C Bus Data Signal

The data line of the I2C bus.

230SCLI/OODI2C Bus Clock Signal

The clock signal of the I2C bus.

98RESET#ISTReset

External reset signal. Asserting this pin

unconditionally resets the device. The signal is

active low.

VDD

GND

SCL

SDA

GND

TPM

SLB 9645 VQ1.2

PG-VQFN-32-13

10 15

2630

Pinning_VQFN-32-13_SLB9645.vsd

VDD

DAVINT#

RESET#

Data Sheet 8 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Pin Description

64DAVINT#I/OSTData Available Interrupt

This pin can be connected to the host interrupt

controller to allow interrupt driven reads of the

response data instead of polling of the

TPM_STS_x.dataAvail bit. The signal remains

inactive (high) as long as TPM_STS_x.dataAvail is 0.

As soon as a response is available, the signal is

asserted (low) and remains active until the

complete response is read by the host.

75PPISTPhysical Presence

This pin should be connected to a jumper. The

standard position of the jumper should connect the

pin to GND. If the pin is connected to VDD, some

special commands are enabled (for instance, the

command TPM_ForceClear, also refer to [1]).

This pin does not have an internal pull-up or

pulldown resistor and must not be left floating if it is

used for physical presence detection via hardware

pin.

If physical presence detection via hardware pin is

not used, this pin may be left unconnected;

however, to minimize power consumption, it shall

be connected to a fixed level (either GND or VDD).

Table 4 Power Supply

Pin Number Name Pin

Type

Buffer

Type

Function

PG-TSSOP-

28-2

PG-VQFN-

32-13

5, 10 1, 9, 10 VDD PWR — Power Supply

All VDD pins must be connected externally and

should be bypassed to GND via 100 nF capacitors.

4, 11, 18, 25 16, 26, 32 GND GND — Ground

All GND pins must be connected externally.

Table 5 Not Connected

Pin Number Name Pin

Type

Buffer

Type

Function

PG-TSSOP-

28-2

PG-VQFN-

32-13

3, 8, 12 - 17,

19 - 24, 26 -

2, 3, 6, 7, 11 -

15, 17 - 25,

27, 28, 31

NC NU — Not Connected

All NC pins must not be connected externally (must

be left floating).

Table 3 I/O Signals (continued)

Pin Number Name Pin

Type

Buffer

Type

Function

PG-TSSOP-

28-2

PG-VQFN-

32-13

Data Sheet 9 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Pin Description

3.1 Typical Schematic

Figure 3 shows the typical schematic for the OPTIGA™ TPM SLB 9645. The power supply pins should be bypassed

to GND with capacitors located close to the device. The physical presence input may be connected to a jumper as

shown in the schematic; or it may be driven by other devices (this is application- or platform-dependent).

Note that pull-up resistors are needed on the I2C clock and data signals, these are not shown in the schematic.

Figure 3 Typical Schematic

SLB 9645

SDA

RESET#

SDA

VDD

GND

VDD

2x 100 nF (place close to

device VDD/GND pins)

VDD

DAVINT#

Schem ati c _SLB 9645 .vs d

1 µF

SCL

4k7

Physical Presence

HW Switch

DAVINT#

RESET#

Data Sheet 10 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Electrical Characteristics

4 Electrical Characteristics

This chapter lists the maximum and operating ranges for various electrical and timing parameters.

4.1 Absolute Maximum Ratings

Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability. Maximum

ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the

integrated circuit.

4.2 Functional Operating Range

Table 6 Absolute Maximum Ratings

Parameter Symbol Values Unit Note or Test Condition

Min. Typ. Max.

Supply Voltage VDD -0.3 – 7 V –

Voltage on any pin Vmax -0.3 – VDD+0.3 V –

Ambient temperature TA-40 – 85 °C –

Storage temperature TS-40 – 125 °C –

ESD robustness HBM:

1.5 kΩ, 100 pF

VESD,HBM – – 2000 V According to EIA/JESD22-A114-B

ESD robustness VESD,CDM – – 500 V According to ESD Association

Standard STM5.3.1 - 1999

Latchup immunity Ilatch 100 mA According to EIA/JESD78

Table 7 Functional Operating Range

Parameter Symbol Values Unit Note or Test Condition

Min. Typ. Max.

Supply Voltage VDD 3.0 3.3 3.6 V 3.3 V system environment

Supply Voltage VDD 1.62 1.8 1.98 V 1.8 V system environment

Ambient temperature TA-20 – 85 °C Standard temperature range

devices

Ambient temperature TA-40 – 85 °C Enhanced temperature range

devices

Useful lifetime ––10 y

Operating lifetime – – 10 y

Average TA over lifetime – 55 – °C

Data Sheet 11 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Electrical Characteristics

4.3 DC Characteristics

TA = 25°C, VDD = 3.3V ± 0.3V or 1.8V ± 0.18V unless otherwise noted

Note: Current consumption does not include any currents flowing through resistive loads on output pins!

Table 8 Current Consumption

Parameter Symbol Values Unit Note or Test Condition

Min. Typ. Max.

Current Consumption in

Active Mode

IVDD_Active 3.0 25 mA VDD = 3.3V ± 0.3V

Device is active and is operating

internally. Note that since the

device is mostly in an internal

sleep state in a “typical”

application, the typical average

current consumption is far less

than the maximum value. It is

assumed that in a normal

environment, the device is in an

internal sleep state for

approximately 90% of the

operating time of the platform.

Current Consumption in

Sleep Mode

IVDD_Sleep 0.9 mA VDD = 3.3V ± 0.3V

Device is active, SCL is toggling but

no ongoing internal TPM

operation. The device is in an

internal sleep state.

Current Consumption in

Sleep Mode with Stopped

Clock

IVDD_Sleep_CS 150 µA VDD = 3.3V ± 0.3V

Device is active, SCL is not toggling

and no ongoing internal TPM

operation. The device is in an

internal sleep state.

Table 9 DC Characteristics

Parameter Symbol Values Unit Note or Test Condition

Min. Typ. Max.

Input voltage high VIH 0.7 VDD VDD+0.3 V All pins except RESET#

Input voltage low VIL -0.3 0.3 VDD V All pins except RESET#

Input voltage high VIH 0.8 VDD VDD VPin RESET#

Input voltage low VIL 00.2 V

DD VPin RESET#

Input high leakage

current

IIH -15 15 µA VIN = VDD

Input low leakage current IIL -15 15 µA VIN = 0V

Output high voltage VOH VDD-0.3 V IOH = 1mA

Output low voltage VOL 0.3 V IOL = 1mA

Data Sheet 12 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Electrical Characteristics

4.4 AC Characteristics

TA = 25°C, VDD = 3.3V ± 0.3V or 1.8V ± 0.18V unless otherwise noted

Figure 4 RST# Timing

4.5 Timing

The TPM_ACCESS_x.tpmEstablishment bit has the correct value and the TPM_ACCESS_x.tpmRegValidSts bit is

typically set within 8ms after RESET# is deasserted.

The TPM is ready to receive a command after less than 30 ms.

The OPTIGA™ TPM SLB 9645 features a sophisticated protection mechanism against dictionary attacks on TPM-

based authorization data. Basically, the device counts the number of failed authorization attempts in a counter

which is located in the non-volatile memory. An attacker who has physical access to the device could try to

circumvent that mechanism by resetting the device after the authorization attempt but before the updated

failure counter has been written into the NVM.

As a countermeasure, another feature called early reset detection (ERD) has been added to the

OPTIGA™ TPM SLB 9645. This mechanism detects external resets and counts them. In certain time windows

during power-on or warm boot of the device, such reset events might influence the dictionary attack counters

and trigger other security mechanisms as well. In worst case, this might trigger special security defense modes

from which a recovery is very complex or even not possible.

To avoid that the OPTIGA™ TPM SLB 9645 reaches such a security defense state, the RST# signal must not be

asserted in certain time windows. After the deassertion of the RST# signal, the system should wait for a minimum

time of tRSTIN before asserting RST# again (see Figure 4 and Table 10).

TPM commands should only be started after tRSTIN has expired (see Figure 4 again). If a TPM command is running,

RST# should not be asserted; otherwise, this might also trigger some security functions. When the TPM shall be

reset, the command TPM_SaveState should be issued before the assertion of the RST# signal.

Table 10 Device Reset

Parameter Symbol Values Unit Note or Test Condition

Min. Typ. Max.

Cold (Power-On) Reset tPOR 80 µs

Warm Reset tWRST 10 µs

Reset Inactive Time tRSTIN 30 ms

RST#

VDD

tPOR

tRSTIN tWRST tRSTIN tWRST tRSTIN TPM commands

RST_Timing.vsdx

Data Sheet 13 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Electrical Characteristics

4.6 I2C Standard/Fast Mode Interface Characteristics

The electrical characteristics are compliant to the NXP I2C bus specification [5] and [6] for “standard-mode”

(fSCL ≤100 kHz) and “fast-mode” (fSCL ≤400 kHz), with certain deviations stated in Table 11 and Table 12 below.

For printed circuit board design the reduced output fall time tOF compared to the NXP I2C bus specification needs

to be considered!

TA = 25°C, VDD = 3.3V ± 0.3V unless otherwise noted

Table 11 I2C Standard Mode Interface Characteristics

Parameter Symbol Values Unit Note or Test Condition

Min. Typ. Max.

SCL clock frequency fSCL 0 — 100 kHz —

Output fall time from

VIHmin to VILmax (at device

pin)

tOF — — 75 ns 10 pF ≤ Cb ≤ 400 pF

SCL fall time (bus line,

output)

tfSCL ——25ns—

Table 12 I2C Fast Mode Interface Characteristics

Parameter Symbol Values Unit Note or Test Condition

Min. Typ. Max.

SCL clock frequency fSCL 0 — 400 kHz —

Hysteresis of input stage VHYS 0.05 — — V —

Output fall time from

VIHmin to VILmax (at device

pin)

tOF 0.4 — 75 ns 10 pF ≤ Cb ≤ 400 pF

Spikes suppressed by

input filter

tSP — 20 — ns Input filter implemented for SCL,

not for SDA

SCL fall time (bus line,

output)

tfSCL ——25ns—

Input current (SCL, SDA) II-10 — 10 µA VIN between 10% and 90% of the

supply voltage VDD; the condition

“If VDD is switched off, I/O pins of

fast-mode devices must not

obstruct the SDA and SCL lines” is

not fulfilled.

Data Sheet 14 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Package Dimensions (TSSOP)

5 Package Dimensions (TSSOP)

All dimensions are given in millimeters (mm) unless otherwise noted. The packages are “green” and RoHS

compliant.

Figure 5 Package Dimensions PG-TSSOP-28-2

5.1 Packing Type

PG-TSSOP-28-2: Tape & Reel (reel diameter 330mm), 3000 pcs. per reel

Figure 6 Tape & Reel Dimensions PG-TSSOP-28-2

0.1 MABC28x

1.1 MAX.

STAND OFF

0.1 28x

0.65

0.22

+0.08

-0.03 2)

13 x 0.65 = 8.45

COPLANARITY

SEATING

PLANE

0.1±0.05

0.9±0.05

9.7

±0.1

Index Marking

±0.13)

4.4

0.127

+0.073

-0.037

0°... 8°

6.4

±0.1

0.6

PG-TSSOP-28-2, -16-PO V07

1) Does not include plastic or metal protrusion of 0.15 max. per side

2) Does not include dambar protrusion of 0.08 max. per side

3) Does not include interlead flash or protrusion of 0.25 max. per side

2x 14 TIPS

0.2 CA-B, H

10.2

1.6

1.2

80.3

6.8

PG-TSSOP-28-2, -16-TP V01

Index

Marking

Data Sheet 15 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Package Dimensions (TSSOP)

5.2 Recommended Footprint

Controlling dimension is millimeters (mm).

Figure 7 Recommended Footprint PG-TSSOP-28-2

5.3 Chip Marking

Line 1: SLB9645TT12 or SLB9645XT12 (see Table 1)

Line 2: G <datecode> KMC, <K> indicates assembly site code, <MC> indicates mold compound code

Line 3: 00 <Lot number>, the 00 is an internal FW indication (only at manufacturing due to field upgrade option)

Figure 8 Chip Marking PG-TSSOP-28-2

For details and recommendations regarding assembly of packages on PCBs, please refer to

http://www.infineon.com/cms/en/product/technology/packages/

PG-TSSOP-28-2, -16

-FP V01

5.85

0.29

1.35

0.65

5.85

0.25

1.31

0.65

Stencil apertures

Copper Solder mask

12345678901

12XXXXXXXXXXX

G KMC

Mold Compound Code

Lot CodeSoftwarecode

Assembly Site Code

ChipMarking.vsd

Data Sheet 16 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Package Dimensions (VQFN)

6 Package Dimensions (VQFN)

All dimensions are given in millimeters (mm) unless otherwise noted. The packages are “green” and RoHS

compliant.

Figure 9 Package Dimensions PG-VQFN-32-13

6.1 Packing Type

PG-VQFN-32-13: Tape & Reel (reel diameter 330mm), 5000 pcs. per reel

Figure 10 Tape & Reel Dimensions PG-VQFN-32-13

6.2 Recommended Footprint

Figure 11 shows the recommended footprint for the PG-VQFN-32-13 package. The exposed pad of the package is

internally connected to GND. It shall be connected to GND externally as well.

Figure 11 Recommended Footprint PG-VQFN-32-13

32x

0.9 MAX.

(0.2)

SEATING PLANE

0.05 MAX.

0.05 C

0.1 C

7 x 0.5 = 3.5

0.5

0.4±0.05 (4.2)

0.1

32x

0.05

-0.07

+0.05

0.25

2417

±0.1

3.6

±0.1

3.6

Index Marking

0.1 A2x

0.1 B2x

PG-VQFN-32-13-PO V01

5.25

80.3

1.1

Index Marking

PG-VQFN-32-13-TP V01

PG-VQFN-32-13-FP V01

Package outline 5 x 5

3.6

4.1

0.5 0.25

0.7

Data Sheet 17 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Package Dimensions (VQFN)

6.3 Chip Marking

Line 1: SLB9645

Line 2: VQ12 yy or XQ12_yy (see Table 1), the <yy> is an internal FW indication

Line 3: <Lot number> H <datecode>

Figure 12 Chip Marking PG-VQFN-32-13

For details and recommendations regarding assembly of packages on PCBs, please refer to

http://www.infineon.com/cms/en/product/technology/packages/

1234567

Infineon

Lot Code

Softwarecode

ChipMarking_VQFN.vsd

XXH

VQ12 YY

Data Sheet 18 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

References

[1] —, “TPM Main Specification”, Version 1.2, Rev. 116, 2011-03-01, TCG (parts 1-3)

[2] —, “TCG PC Client TPM Interface Specification (TIS)”, Version 1.21, 2011-04-28, TCG

[3] —, “PC Client Implementation Specification”, Version 1.2, 2005-07-13, TCG

[4] —, “TCG Software Stack Specification (TSS)”, Version 1.2, 2005-11-02, TCG

[5] —, “NXP I2C bus specification, Rev. 03”, 19 June 2007

[6] —, “NXP I2C bus specification, Rev. 4”, 13 February 2012

Data Sheet 19 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Terminology

ERD Early Reset Detection

ESW Embedded Software

HMAC Hashed Message Authentication Code

I2C Inter-Integrated Circuit

PCR Platform Configuration Register

PUBEK Public Endorsement Key

TCG Trusted Computing Group

TPM Trusted Platform Module

TSS TCG Software Stack

Data Sheet 20 Revision 1.2

2018-09-21

OPTIGA™ TPM

SLB 9645 TPM1.2

Revision History

Page or Item Subjects (major changes since previous revision)

Revision 1.2, 2018-09-21

New document template. Inserted Section 4.5.

Revision 1.1, 2014-02-12

Fixed typos, document references, added note to Table 8.

Revision 1.0, 2013-01-31

Initial version

Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

Edition 2018-09-21

Published by

Infineon Technologies AG

81726 Munich, Germany

Do you have a question about any

aspect of this document?

Email:

security.chipcard.ics@infineon.com

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