OPTIGATM T PM SLB 9645 TPM1.2 Data Sheet Devices * SLB 9645VQ1.2 * SLB 9645XQ1.2 * SLB 9645TT1.2 * SLB 9645XT1.2 Key Features * Compliant to TPM Main Specification, Version 1.2, Rev. 116 (see [1]) * I2C interface * Approved for Google Chromebook / Chromebox * Standard (-20C to +85C) and enhanced temperature range (-40C to +85C) * PG-VQFN-32-13 or PG-TSSOP-28-2 package * Optimized for battery operated devices: low standby power consumption (typ. 150A) * 24 PCRs * 6 kByte free NV memory * Up to 10 concurrent sessions * Up to eight 2048-bit keys can be loaded into volatile storage * 16 slots for keys of up to 2048-bit * 8 monotonic counters * 1280 Byte I/O buffer * Built-in support by Linux Kernel About this document Scope and purpose This data sheet describes the OPTIGATM TPM SLB 9645 TPM1.2 Trusted Platform Module together with its features, functionality and programming interface. Intended audience This data sheet is primarily intended for system developers. Data Sheet www.infineon.com Please read the Important Notice and Warnings at the end of this document Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Table of contents Table of contents About this document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 List of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Device Types / Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 3.1 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Typical Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 4.1 4.2 4.3 4.4 4.5 4.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I2C Standard/Fast Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10 10 11 12 12 13 5 5.1 5.2 5.3 Package Dimensions (TSSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packing Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chip Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 15 15 6 6.1 6.2 6.3 Package Dimensions (VQFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packing Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chip Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 16 17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Data Sheet 2 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 List of figures List of figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 Data Sheet Pinout of the SLB 9645TT1.2 / SLB 9645XT1.2 (PG-TSSOP-28-2 Package, Top View) . . . . . . . . . . . . . . 6 Pinout of the SLB 9645VQ1.2 / SLB 9645XQ1.2 (PG-VQFN-32-13 Package, Top View). . . . . . . . . . . . . . 7 Typical Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 RST# Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package Dimensions PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Tape & Reel Dimensions PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Recommended Footprint PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Chip Marking PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Package Dimensions PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Tape & Reel Dimensions PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Recommended Footprint PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Chip Marking PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 List of tables List of tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Table 11 Table 12 Data Sheet Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Buffer Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Not Connected . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Functional Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Device Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 I2C Standard Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 I2C Fast Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Overview 1 Overview The OPTIGATM TPM SLB 9645 is a Trusted Platform Module. It is available in different packages, see Table 1 below. It only supports the I2C interface and features a dedicated interrupt pin which increases performance (since no polling on the I2C bus is necessary). The I2C interface is compliant to both standard mode operation (up to 100 kHz) and fast mode operation (up to 400 kHz); for details regarding the characteristics in these modes, please refer to Section 4.6. 2 Device Types / Ordering Information The OPTIGATM TPM SLB 9645 product family features devices with different packages and different temperature ranges. Table 1 shows the available versions. Table 1 Device Types Device Name Package Remarks SLB 9645VQ1.2 PG-VQFN-32-13 Standard temperature range SLB 9645XQ1.2 PG-VQFN-32-13 Enhanced temperature range SLB 9645TT1.2 PG-TSSOP-28-2 Standard temperature range SLB 9645XT1.2 PG-TSSOP-28-2 Enhanced temperature range Pin Description 18 NC NC NC 22 GND NC NC NC 25 NC NC NC GND NC NC NC 28 15 Pinning_TSSOP-28-2_SLB9645.vsd 3 TPM SLB 9645TT1.2 PG-TSSOP-28-2 1 8 11 14 NC NC NC GND VDD RESET# NC PP DAVINT# VDD GND NC Data Sheet SCL SDA Figure 1 4 Pinout of the SLB 9645TT1.2 / SLB 9645XT1.2 (PG-TSSOP-28-2 Package, Top View) 6 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Pin Description 26 NC 1 NC NC TPM SLB 9645 VQ1.2 NC DAVINT# 22 NC NC PP PG-VQFN-32-13 NC NC NC NC 18 7 RESET# 10 NC NC 15 Pinning_VQFN-32-13_SLB9645.vsd NC 30 GND NC NC SCL SDA NC GND VDD GND NC NC NC NC NC VDD VDD Figure 2 Pinout of the SLB 9645VQ1.2 / SLB 9645XQ1.2 (PG-VQFN-32-13 Package, Top View) Table 2 Buffer Types Buffer Type Description TS Tri-State pin ST Schmitt-Trigger pin OD Open-Drain pin Table 3 I/O Signals Pin Number Name Pin Type Buffer Type Function PG-TSSOP28-2 PG-VQFN32-13 1 29 SDA I/O OD I2C Bus Data Signal The data line of the I2C bus. 2 30 SCL I/O OD I2C Bus Clock Signal The clock signal of the I2C bus. 9 8 RESET# I ST Reset External reset signal. Asserting this pin unconditionally resets the device. The signal is active low. Data Sheet 7 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Pin Description Table 3 I/O Signals (continued) Pin Number Name Pin Type Buffer Type Function PG-TSSOP28-2 PG-VQFN32-13 6 4 DAVINT# I/O ST Data Available Interrupt This pin can be connected to the host interrupt controller to allow interrupt driven reads of the response data instead of polling of the TPM_STS_x.dataAvail bit. The signal remains inactive (high) as long as TPM_STS_x.dataAvail is 0. As soon as a response is available, the signal is asserted (low) and remains active until the complete response is read by the host. 7 5 PP I ST Physical Presence This pin should be connected to a jumper. The standard position of the jumper should connect the pin to GND. If the pin is connected to VDD, some special commands are enabled (for instance, the command TPM_ForceClear, also refer to [1]). This pin does not have an internal pull-up or pulldown resistor and must not be left floating if it is used for physical presence detection via hardware pin. If physical presence detection via hardware pin is not used, this pin may be left unconnected; however, to minimize power consumption, it shall be connected to a fixed level (either GND or VDD). Name Pin Type Buffer Type Function Table 4 Power Supply Pin Number PG-TSSOP28-2 PG-VQFN32-13 5, 10 1, 9, 10 VDD PWR -- Power Supply All VDD pins must be connected externally and should be bypassed to GND via 100 nF capacitors. 4, 11, 18, 25 16, 26, 32 GND GND -- Ground All GND pins must be connected externally. Name Pin Type Buffer Type Function NU -- Not Connected All NC pins must not be connected externally (must be left floating). Table 5 Not Connected Pin Number PG-TSSOP28-2 PG-VQFN32-13 3, 8, 12 - 17, 19 - 24, 26 28 2, 3, 6, 7, 11 - NC 15, 17 - 25, 27, 28, 31 Data Sheet 8 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Pin Description 3.1 Typical Schematic Figure 3 shows the typical schematic for the OPTIGATM TPM SLB 9645. The power supply pins should be bypassed to GND with capacitors located close to the device. The physical presence input may be connected to a jumper as shown in the schematic; or it may be driven by other devices (this is application- or platform-dependent). Note that pull-up resistors are needed on the I2C clock and data signals, these are not shown in the schematic. VDD SCL SCL SDA SDA RESET# VDD 1 F RESET# GND 2x 100 nF (place close to device VDD/GND pins) VDD J1 Physical Presence HW Switch DAVINT# DAVINT# PP 4k7 NC SLB 9645 Schematic _SLB9645 .vsd Figure 3 Data Sheet Typical Schematic 9 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Electrical Characteristics 4 Electrical Characteristics This chapter lists the maximum and operating ranges for various electrical and timing parameters. 4.1 Absolute Maximum Ratings Table 6 Absolute Maximum Ratings Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition Supply Voltage VDD -0.3 - 7 V - Voltage on any pin Vmax -0.3 - VDD+0.3 V - Ambient temperature TA -40 - 85 C - Storage temperature TS -40 - 125 C - ESD robustness HBM: 1.5 k, 100 pF VESD,HBM - - 2000 V According to EIA/JESD22-A114-B ESD robustness VESD,CDM - - 500 V According to ESD Association Standard STM5.3.1 - 1999 Latchup immunity Ilatch 100 mA According to EIA/JESD78 Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 4.2 Functional Operating Range Table 7 Functional Operating Range Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition Supply Voltage VDD 3.0 3.3 3.6 V 3.3 V system environment Supply Voltage VDD 1.62 1.8 1.98 V 1.8 V system environment Ambient temperature TA -20 - 85 C Standard temperature range devices Ambient temperature TA -40 - 85 C Enhanced temperature range devices Useful lifetime - - 10 y Operating lifetime - - 10 y Average TA over lifetime - 55 - C Data Sheet 10 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Electrical Characteristics 4.3 DC Characteristics TA = 25C, VDD = 3.3V 0.3V or 1.8V 0.18V unless otherwise noted Table 8 Current Consumption Parameter Symbol Values Min. Typ. Max. 25 Unit Note or Test Condition mA VDD = 3.3V 0.3V Device is active and is operating internally. Note that since the device is mostly in an internal sleep state in a "typical" application, the typical average current consumption is far less than the maximum value. It is assumed that in a normal environment, the device is in an internal sleep state for approximately 90% of the operating time of the platform. Current Consumption in Active Mode IVDD_Active 3.0 Current Consumption in Sleep Mode IVDD_Sleep 0.9 mA VDD = 3.3V 0.3V Device is active, SCL is toggling but no ongoing internal TPM operation. The device is in an internal sleep state. 150 A VDD = 3.3V 0.3V Device is active, SCL is not toggling and no ongoing internal TPM operation. The device is in an internal sleep state. Current Consumption in IVDD_Sleep_CS Sleep Mode with Stopped Clock Note: Current consumption does not include any currents flowing through resistive loads on output pins! Table 9 DC Characteristics Parameter Symbol Values Min. Typ. Unit Note or Test Condition Max. Input voltage high VIH 0.7 VDD VDD+0.3 V All pins except RESET# Input voltage low VIL -0.3 0.3 VDD V All pins except RESET# Input voltage high VIH 0.8 VDD VDD V Pin RESET# Input voltage low VIL 0 0.2 VDD V Pin RESET# Input high leakage current IIH -15 15 A VIN = VDD Input low leakage current IIL -15 15 A VIN = 0V Output high voltage VOH VDD-0.3 V IOH = 1mA Output low voltage VOL V IOL = 1mA Data Sheet 0.3 11 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Electrical Characteristics 4.4 AC Characteristics TA = 25C, VDD = 3.3V 0.3V or 1.8V 0.18V unless otherwise noted Table 10 Device Reset Parameter Symbol Values Min. Typ. Unit Note or Test Condition Max. Cold (Power-On) Reset tPOR 80 s Warm Reset tWRST 10 s Reset Inactive Time tRSTIN 30 ms tPOR VDD tRSTIN tWRST tRSTIN tWRST tRSTIN TPM commands RST# RST_Timing.vsdx Figure 4 RST# Timing 4.5 Timing The TPM_ACCESS_x.tpmEstablishment bit has the correct value and the TPM_ACCESS_x.tpmRegValidSts bit is typically set within 8ms after RESET# is deasserted. The TPM is ready to receive a command after less than 30 ms. The OPTIGATM TPM SLB 9645 features a sophisticated protection mechanism against dictionary attacks on TPMbased authorization data. Basically, the device counts the number of failed authorization attempts in a counter which is located in the non-volatile memory. An attacker who has physical access to the device could try to circumvent that mechanism by resetting the device after the authorization attempt but before the updated failure counter has been written into the NVM. As a countermeasure, another feature called early reset detection (ERD) has been added to the OPTIGATM TPM SLB 9645. This mechanism detects external resets and counts them. In certain time windows during power-on or warm boot of the device, such reset events might influence the dictionary attack counters and trigger other security mechanisms as well. In worst case, this might trigger special security defense modes from which a recovery is very complex or even not possible. To avoid that the OPTIGATM TPM SLB 9645 reaches such a security defense state, the RST# signal must not be asserted in certain time windows. After the deassertion of the RST# signal, the system should wait for a minimum time of tRSTIN before asserting RST# again (see Figure 4 and Table 10). TPM commands should only be started after tRSTIN has expired (see Figure 4 again). If a TPM command is running, RST# should not be asserted; otherwise, this might also trigger some security functions. When the TPM shall be reset, the command TPM_SaveState should be issued before the assertion of the RST# signal. Data Sheet 12 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Electrical Characteristics 4.6 I2C Standard/Fast Mode Interface Characteristics The electrical characteristics are compliant to the NXP I2C bus specification [5] and [6] for "standard-mode" (fSCL 100 kHz) and "fast-mode" (fSCL 400 kHz), with certain deviations stated in Table 11 and Table 12 below. For printed circuit board design the reduced output fall time tOF compared to the NXP I2C bus specification needs to be considered! TA = 25C, VDD = 3.3V 0.3V unless otherwise noted Table 11 I2C Standard Mode Interface Characteristics Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition SCL clock frequency fSCL 0 -- 100 kHz -- Output fall time from VIHmin to VILmax (at device pin) tOF -- -- 75 ns 10 pF Cb 400 pF SCL fall time (bus line, output) tfSCL -- -- 25 ns -- Unit Note or Test Condition Table 12 I2C Fast Mode Interface Characteristics Parameter Symbol Values Min. Typ. Max. SCL clock frequency fSCL 0 -- 400 kHz -- Hysteresis of input stage VHYS 0.05 -- -- V -- Output fall time from VIHmin to VILmax (at device pin) tOF 0.4 -- 75 ns 10 pF Cb 400 pF Spikes suppressed by input filter tSP -- 20 -- ns Input filter implemented for SCL, not for SDA SCL fall time (bus line, output) tfSCL -- -- 25 ns -- Input current (SCL, SDA) II -10 -- 10 A VIN between 10% and 90% of the supply voltage VDD; the condition "If VDD is switched off, I/O pins of fast-mode devices must not obstruct the SDA and SCL lines" is not fulfilled. Data Sheet 13 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Package Dimensions (TSSOP) 5 Package Dimensions (TSSOP) H B 0.65 C 0.1 C 28x SEATING COPLANARITY PLANE 0.6 0.1 6.4 13 x 0.65 = 8.45 2) 0.22 +0.08 -0.03 28 0... 8 4.4 0.13) +0.073 0.127 -0. 037 1.1 MAX. 0.9 0.05 0.1 0.05 STAND OFF All dimensions are given in millimeters (mm) unless otherwise noted. The packages are "green" and RoHS compliant. 0.2 A-B, H C 2x 14 TIPS 0.1 M A B C 28x 15 1 14 9.7 0.11) A Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion of 0.08 max. per side 3) Does not include interlead flash or protrusion of 0.25 max. per side PG-TSSOP-28-2, -16-PO V07 Figure 5 Package Dimensions PG-TSSOP-28-2 5.1 Packing Type PG-TSSOP-28-2: Tape & Reel (reel diameter 330mm), 3000 pcs. per reel 0.3 8 6.8 16 10.2 Index Marking 1.2 1.6 PG-TSSOP-28-2, -16-TP V01 Figure 6 Data Sheet Tape & Reel Dimensions PG-TSSOP-28-2 14 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Package Dimensions (TSSOP) 5.2 Recommended Footprint Controlling dimension is millimeters (mm). 0.65 Copper 5.85 5.85 1.31 0.25 1.35 0.29 0.65 Solder mask Stencil apertures PG-TSSOP-28-2, -16-FP V01 Figure 7 Recommended Footprint PG-TSSOP-28-2 5.3 Chip Marking Line 1: SLB9645TT12 or SLB9645XT12 (see Table 1) Line 2: G <datecode> KMC, <K> indicates assembly site code, <MC> indicates mold compound code Line 3: 00 <Lot number>, the 00 is an internal FW indication (only at manufacturing due to field upgrade option) Assembly Site Code 12345678901 G KMC 12XXXXXXXXXXX Softwarecode Mold Compound Code Lot Code ChipMarking.vsd Figure 8 Chip Marking PG-TSSOP-28-2 For details and recommendations regarding assembly of packages on PCBs, please refer to http://www.infineon.com/cms/en/product/technology/packages/ Data Sheet 15 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Package Dimensions (VQFN) 6 Package Dimensions (VQFN) All dimensions are given in millimeters (mm) unless otherwise noted. The packages are "green" and RoHS compliant. 7 x 0.5 = 3.5 5 A 0.5 0.9 MAX. 0.1 A 2x B 17 32x 0.05 C 0.1 C 24 25 0.1 B 2x SEATING PLANE 5 3.6 0.1 16 Index Marking 9 32 8 1 3.6 0.1 C (0.2) (4.2) 0.4 0.05 0.05 MAX. Figure 9 Package Dimensions PG-VQFN-32-13 6.1 Packing Type Index Marking 32x 0.25 +0.05 -0.07 0.1 M A B C 0.05 M C PG-VQFN-32-13-PO V01 PG-VQFN-32-13: Tape & Reel (reel diameter 330mm), 5000 pcs. per reel 0.3 5.25 12 8 5.25 Index Marking 1.1 PG-VQFN-32-13-TP V01 Figure 10 Tape & Reel Dimensions PG-VQFN-32-13 6.2 Recommended Footprint Figure 11 shows the recommended footprint for the PG-VQFN-32-13 package. The exposed pad of the package is internally connected to GND. It shall be connected to GND externally as well. 4.1 3.6 3.6 0.5 4.1 0.7 Package outline 5 x 5 0.25 PG-VQFN-32-13-FP V01 Figure 11 Data Sheet Recommended Footprint PG-VQFN-32-13 16 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Package Dimensions (VQFN) 6.3 Chip Marking Line 1: SLB9645 Line 2: VQ12 yy or XQ12_yy (see Table 1), the <yy> is an internal FW indication Line 3: <Lot number> H <datecode> Infineon 1234567 VQ12 YY XXH Softwarecode Lot Code Figure 12 ChipMarking_VQFN.vsd Chip Marking PG-VQFN-32-13 For details and recommendations regarding assembly of packages on PCBs, please refer to http://www.infineon.com/cms/en/product/technology/packages/ Data Sheet 17 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 References References [1] --, "TPM Main Specification", Version 1.2, Rev. 116, 2011-03-01, TCG (parts 1-3) [2] --, "TCG PC Client TPM Interface Specification (TIS)", Version 1.21, 2011-04-28, TCG [3] --, "PC Client Implementation Specification", Version 1.2, 2005-07-13, TCG [4] --, "TCG Software Stack Specification (TSS)", Version 1.2, 2005-11-02, TCG [5] --, "NXP I2C bus specification, Rev. 03", 19 June 2007 [6] --, "NXP I2C bus specification, Rev. 4", 13 February 2012 Data Sheet 18 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Terminology Terminology ERD Early Reset Detection ESW Embedded Software HMAC Hashed Message Authentication Code I2C Inter-Integrated Circuit PCR Platform Configuration Register PUBEK Public Endorsement Key TCG Trusted Computing Group TPM Trusted Platform Module TSS TCG Software Stack Data Sheet 19 Revision 1.2 2018-09-21 OPTIGATM TPM SLB 9645 TPM1.2 Revision History Page or Item Subjects (major changes since previous revision) Revision 1.2, 2018-09-21 New document template. Inserted Section 4.5. Revision 1.1, 2014-02-12 Fixed typos, document references, added note to Table 8. Revision 1.0, 2013-01-31 Initial version Data Sheet 20 Revision 1.2 2018-09-21 Please read the Important Notice and Warnings at the end of this document Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2018-09-21 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2018 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? Email: security.chipcard.ics@infineon.com IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer's compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer's products and any use of the product of Infineon Technologies in customer's applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer's technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 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