8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet SST's 25 series Serial Flash family features a four-wire, SPI-compatible interface that allows for a low pin-count package which occupies less board space and ultimately lowers total system costs. The SST25VF080B devices are enhanced with improved operating frequency which lowers power consumption. SST25VF080B SPI serial flash memories are manufactured with SST's proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches Features: * Single Voltage Read and Write Operations - 2.7-3.6V * Serial Interface Architecture - SPI Compatible: Mode 0 and Mode 3 * High Speed Clock Frequency - 50/66 MHz conditional (see Table 15) - (SST25VF080B-50-xx-xxxx) - 80 MHz - (SST25VF080B-80-xx-xxxx) * Superior Reliability - Endurance: 100,000 Cycles (typical) - Greater than 100 years Data Retention * Low Power Consumption: - Active Read Current: 10 mA (typical) - Standby Current: 5 A (typical) * Flexible Erase Capability - Uniform 4 KByte sectors - Uniform 32 KByte overlay blocks - Uniform 64 KByte overlay blocks * Fast Erase and Byte-Program: - Chip-Erase Time: 35 ms (typical) - Sector-/Block-Erase Time: 18 ms (typical) - Byte-Program Time: 7 s (typical) * Auto Address Increment (AAI) Programming - Decrease total chip programming time over Byte-Program operations * End-of-Write Detection - Software polling the BUSY bit in Status Register - Busy Status readout on SO pin in AAI Mode * Hold Pin (HOLD#) - Suspends a serial sequence to the memory without deselecting the device * Write Protection (WP#) - Enables/Disables the Lock-Down function of the status register * Software Write Protection - Write protection through Block-Protection bits in status register * Temperature Range - Commercial: 0C to +70C - Industrial: -40C to +85C * Packages Available - 8-lead SOIC (200 mils) - 8-lead SOIC (150 mils) - 8-contact WSON (6mm x 5mm) - 8-lead PDIP (300 mils) * All devices are RoHS compliant (c)2011 Silicon Storage Technology, Inc. www.microchip.com www.sst.com S71296-05-000 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Product Description SST's 25 series Serial Flash family features a four-wire, SPI-compatible interface that allows for a low pin-count package which occupies less board space and ultimately lowers total system costs. The SST25VF080B devices are enhanced with improved operating frequency and lower power consumption. SST25VF080B SPI serial flash memories are manufactured with SST's proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST25VF080B devices significantly improve performance and reliability, while lowering power consumption. The devices write (Program or Erase) with a single power supply of 2.7-3.6V for SST25VF080B. The total energy consumed is a function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash memory technologies. The SST25VF080B device is offered in 8-lead SOIC (200 mils), 8-lead SOIC (150 mils), 8-contact WSON (6mm x 5mm), and 8-lead PDIP (300 mils) packages. See Figure 2 for pin assignments. (c)2011 Silicon Storage Technology, Inc. S71296-05-000 2 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Block Diagram SuperFlash Memory X - Decoder Address Buffers and Latches Y - Decoder I/O Buffers and Data Latches Control Logic Serial Interface 1296 B1.0 CE# SCK SI SO WP# HOLD# Figure 1: Functional Block Diagram (c)2011 Silicon Storage Technology, Inc. S71296-05-000 3 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Pin Description CE# 1 SO 2 8 VDD 7 HOLD# CE# 1 SO 2 8 VDD 7 HOLD# Top View Top View WP# 3 6 SCK WP# 3 6 SCK VSS 4 5 SI VSS 4 5 SI 1296 08-soic S2A P1.0 1296 08-wson QA P2.0 8-lead SOIC 8-contact WSON CE# VDD SO Top View HOLD# WP# SCK VSS SI 1296 08-pdip-PA-P3.0 8-lead PDIP Figure 2: Pin Assignments Table 1: Pin Description Symbol Pin Name Functions SCK Serial Clock To provide the timing of the serial interface. Commands, addresses, or input data are latched on the rising edge of the clock input, while output data is shifted out on the falling edge of the clock input. SI Serial Data Input To transfer commands, addresses, or data serially into the device. Inputs are latched on the rising edge of the serial clock. SO Serial Data Output To transfer data serially out of the device. Data is shifted out on the falling edge of the serial clock. Outputs Flash busy status during AAI Programming when reconfigured as RY/ BY# pin. See "Hardware End-of-Write Detection" on page 13 for details. CE# Chip Enable The device is enabled by a high to low transition on CE#. CE# must remain low for the duration of any command sequence. WP# Write Protect The Write Protect (WP#) pin is used to enable/disable BPL bit in the status register. HOLD# Hold To temporarily stop serial communication with SPI flash memory without resetting the device. VDD Power Supply To provide power supply voltage: 2.7-3.6V for SST25VF080B VSS Ground T1.0 1296 (c)2011 Silicon Storage Technology, Inc. S71296-05-000 4 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Memory Organization The SST25VF080B SuperFlash memory array is organized in uniform 4 KByte erasable sectors with 32 KByte overlay blocks and 64 KByte overlay erasable blocks. Device Operation The SST25VF080B is accessed through the SPI (Serial Peripheral Interface) bus compatible protocol. The SPI bus consist of four control lines; Chip Enable (CE#) is used to select the device, and data is accessed through the Serial Data Input (SI), Serial Data Output (SO), and Serial Clock (SCK). The SST25VF080B supports both Mode 0 (0,0) and Mode 3 (1,1) of SPI bus operations. The difference between the two modes, as shown in Figure 3, is the state of the SCK signal when the bus master is in Stand-by mode and no data is being transferred. The SCK signal is low for Mode 0 and SCK signal is high for Mode 3. For both modes, the Serial Data In (SI) is sampled at the rising edge of the SCK clock signal and the Serial Data Output (SO) is driven after the falling edge of the SCK clock signal. CE# SCK SI MODE 3 MODE 3 MODE 0 MODE 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 MSB HIGH IMPEDANCE DON T CARE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 SO MSB 1296 SPIprot.0 Figure 3: SPI Protocol (c)2011 Silicon Storage Technology, Inc. S71296-05-000 5 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Hold Operation The HOLD# pin is used to pause a serial sequence underway with the SPI flash memory without resetting the clocking sequence. To activate the HOLD# mode, CE# must be in active low state. The HOLD# mode begins when the SCK active low state coincides with the falling edge of the HOLD# signal. The HOLD mode ends when the HOLD# signal's rising edge coincides with the SCK active low state. If the falling edge of the HOLD# signal does not coincide with the SCK active low state, then the device enters Hold mode when the SCK next reaches the active low state. Similarly, if the rising edge of the HOLD# signal does not coincide with the SCK active low state, then the device exits in Hold mode when the SCK next reaches the active low state. See Figure 4 for Hold Condition waveform. Once the device enters Hold mode, SO will be in high-impedance state while SI and SCK can be VIL or VIH. If CE# is driven active high during a Hold condition, it resets the internal logic of the device. As long as HOLD# signal is low, the memory remains in the Hold condition. To resume communication with the device, HOLD# must be driven active high, and CE# must be driven active low. See Figure 24 for Hold timing. SCK HOLD# Hold Active Active Hold Active 1296 HoldCond.0 Figure 4: Hold Condition Waveform Write Protection SST25VF080B provides software Write protection. The Write Protect pin (WP#) enables or disables the lock-down function of the status register. The Block-Protection bits (BP3, BP2, BP1, BP0, and BPL) in the status register provide Write protection to the memory array and the status register. See Table 4 for the Block-Protection description. Write Protect Pin (WP#) The Write Protect (WP#) pin enables the lock-down function of the BPL bit (bit 7) in the status register. When WP# is driven low, the execution of the Write-Status-Register (WRSR) instruction is determined by the value of the BPL bit (see Table 2). When WP# is high, the lock-down function of the BPL bit is disabled. Table 2: Conditions to execute Write-Status-Register (WRSR) Instruction WP# BPL Execute WRSR Instruction L 1 Not Allowed L 0 Allowed H X Allowed T2.0 1296 (c)2011 Silicon Storage Technology, Inc. S71296-05-000 6 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Status Register The software status register provides status on whether the flash memory array is available for any Read or Write operation, whether the device is Write enabled, and the state of the Memory Write protection. During an internal Erase or Program operation, the status register may be read only to determine the completion of an operation in progress. Table 3 describes the function of each bit in the software status register. Table 3: Software Status Register Default at Power-up Read/Write 1 = Internal Write operation is in progress 0 = No internal Write operation is in progress 0 R WEL 1 = Device is memory Write enabled 0 = Device is not memory Write enabled 0 R 2 BP0 Indicate current level of block write protection (See Table 4) 1 R/W 3 BP1 Indicate current level of block write protection (See Table 4) 1 R/W 4 BP2 Indicate current level of block write protection (See Table 4) 1 R/W 5 BP3 Indicate current level of block write protection (See Table 4) 0 R/W 6 AAI Auto Address Increment Programming status 1 = AAI programming mode 0 = Byte-Program mode 0 R 7 BPL 1 = BP3, BP2, BP1, BP0 are read-only bits 0 = BP3, BP2, BP1, BP0 are read/writable 0 R/W Bit Name Function 0 BUSY 1 T3.0 1296 Busy The Busy bit determines whether there is an internal Erase or Program operation in progress. A "1" for the Busy bit indicates the device is busy with an operation in progress. A "0" indicates the device is ready for the next valid operation. Write Enable Latch (WEL) The Write-Enable-Latch bit indicates the status of the internal memory Write Enable Latch. If the Write-Enable-Latch bit is set to "1", it indicates the device is Write enabled. If the bit is set to "0" (reset), it indicates the device is not Write enabled and does not accept any memory Write (Program/Erase) commands. The Write-Enable-Latch bit is automatically reset under the following conditions: * * * * * * * * Power-up Write-Disable (WRDI) instruction completion Byte-Program instruction completion Auto Address Increment (AAI) programming is completed or reached its highest unprotected memory address Sector-Erase instruction completion Block-Erase instruction completion Chip-Erase instruction completion Write-Status-Register instructions (c)2011 Silicon Storage Technology, Inc. S71296-05-000 7 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Auto Address Increment (AAI) The Auto Address Increment Programming-Status bit provides status on whether the device is in AAI programming mode or Byte-Program mode. The default at power up is Byte-Program mode. Block Protection (BP3,BP2, BP1, BP0) The Block-Protection (BP3, BP2, BP1, BP0) bits define the size of the memory area, as defined in Table 4, to be software protected against any memory Write (Program or Erase) operation. The WriteStatus-Register (WRSR) instruction is used to program the BP3, BP2, BP1 and BP0 bits as long as WP# is high or the Block-Protect-Lock (BPL) bit is 0. Chip-Erase can only be executed if Block-Protection bits are all 0. After power-up, BP3, BP2, BP1 and BP0 are set to 1. Block Protection Lock-Down (BPL) WP# pin driven low (VIL), enables the Block-Protection-Lock-Down (BPL) bit. When BPL is set to 1, it prevents any further alteration of the BPL, BP3, BP2, BP1, and BP0 bits. When the WP# pin is driven high (VIH), the BPL bit has no effect and its value is "Don't Care". After power-up, the BPL bit is reset to 0. Table 4: Software Status Register Block Protection for SST25VF080B1 Status Register Bit2 Protection Level Protected Memory Address BP3 BP2 BP1 BP0 8 Mbit None X 0 0 0 None Upper 1/16 X 0 0 1 F0000H-FFFFFH Upper 1/8 X 0 1 0 E0000H-FFFFFH Upper 1/4 X 0 1 1 C0000H-FFFFFH Upper 1/2 X 1 0 0 80000H-FFFFFH All Blocks X 1 0 1 00000H-FFFFFH All Blocks X 1 1 0 00000H-FFFFFH All Blocks X 1 1 1 00000H-FFFFFH T4.0 1296 1. X = Don't Care (RESERVED) default is "0 2. Default at power-up for BP2, BP1, and BP0 is `111'. (All Blocks Protected) (c)2011 Silicon Storage Technology, Inc. S71296-05-000 8 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Instructions Instructions are used to read, write (Erase and Program), and configure the SST25VF080B. The instruction bus cycles are 8 bits each for commands (Op Code), data, and addresses. Prior to executing any Byte-Program, Auto Address Increment (AAI) programming, Sector-Erase, Block-Erase, WriteStatus-Register, or Chip-Erase instructions, the Write-Enable (WREN) instruction must be executed first. The complete list of instructions is provided in Table 5. All instructions are synchronized off a high to low transition of CE#. Inputs will be accepted on the rising edge of SCK starting with the most significant bit. CE# must be driven low before an instruction is entered and must be driven high after the last bit of the instruction has been shifted in (except for Read, Read-ID, and Read-Status-Register instructions). Any low to high transition on CE#, before receiving the last bit of an instruction bus cycle, will terminate the instruction in progress and return the device to standby mode. Instruction commands (Op Code), addresses, and data are all input from the most significant bit (MSB) first. Table 5: Device Operation Instructions Address Dummy Data Cycle(s)2 Cycle(s) Cycle(s) Instruction Description Op Code Cycle1 Read Read Memory 0000 0011b (03H) 3 0 1 to High-Speed Read Read Memory at higher speed 0000 1011b (0BH) 3 1 1 to 4 KByte Sector-Erase3 Erase 4 KByte of memory array 0010 0000b (20H) 3 0 0 32 KByte Block-Erase4 Erase 32 KByte block of memory array 0101 0010b (52H) 3 0 0 64 KByte Block-Erase5 Erase 64 KByte block of memory array 1101 1000b (D8H) 3 0 0 Chip-Erase Erase Full Memory Array 0110 0000b (60H) or 1100 0111b (C7H) 0 0 0 Byte-Program To Program One Data Byte 0000 0010b (02H) 3 0 1 AAI-Word-Program6 Auto Address Increment Programming 1010 1101b (ADH) 3 0 2 to RDSR7 Read-Status-Register 0000 0101b (05H) 0 0 1 to EWSR Enable-Write-Status-Register 0101b 0000b (50H) 0 0 0 WRSR Write-Status-Register 0000 0001b (01H) 0 0 1 WREN Write-Enable 0000 0110b (06H) 0 0 0 WRDI Write-Disable 0000 0100b (04H) 0 0 0 RDID8 Read-ID 1001 0000b (90H) or 1010 1011b (ABH) 3 0 1 to JEDEC-ID JEDEC ID read 1001 1111b (9FH) 0 0 3 to EBSY Enable SO to output RY/BY# 0111 0000b (70H) status during AAI programming 0 0 0 DBSY Disable SO as RY/BY# status during AAI programming 0 0 0 1000 0000b (80H) T5.0 1296 1. 2. 3. 4. 5. One bus cycle is eight clock periods. Address bits above the most significant bit of each density can be VIL or VIH. 4KByte Sector Erase addresses: use AMS-A12, remaining addresses are don't care but must be set either at VIL or VIH. 32KByte Block Erase addresses: use AMS-A15, remaining addresses are don't care but must be set either at VIL or VIH. 64KByte Block Erase addresses: use AMS-A16, remaining addresses are don't care but must be set either at VIL or VIH. (c)2011 Silicon Storage Technology, Inc. S71296-05-000 9 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet 6. To continue programming to the next sequential address location, enter the 8-bit command, ADH, followed by 2 bytes of data to be programmed. Data Byte 0 will be programmed into the initial address [A23-A1] with A0=0, Data Byte 1 will be programmed into the initial address [A23-A1] with A0=1. 7. The Read-Status-Register is continuous with ongoing clock cycles until terminated by a low to high transition on CE#. 8. Manufacturer's ID is read with A0=0, and Device ID is read with A0=1. All other address bits are 00H. The Manufacturer's ID and device ID output stream is continuous until terminated by a low-to-high transition on CE#. Read (25/33 MHz) The Read instruction, 03H, supports up to 25 MHz (for SST25VF080B-50-xx-xxxx) or 33 MHz (for SST25VF080B-80-xx-xxxx) Read. The device outputs the data starting from the specified address location. The data output stream is continuous through all addresses until terminated by a low to high transition on CE#. The internal address pointer will automatically increment until the highest memory address is reached. Once the highest memory address is reached, the address pointer will automatically increment to the beginning (wrap-around) of the address space. Once the data from address location 1FFFFFH has been read, the next output will be from address location 000000H. The Read instruction is initiated by executing an 8-bit command, 03H, followed by address bits [A23A0]. CE# must remain active low for the duration of the Read cycle. See Figure 5 for the Read sequence. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 8 03 SI ADD. ADD. MSB MSB SO 15 16 23 24 31 32 39 40 47 48 55 56 63 64 70 MODE 0 ADD. N DOUT HIGH IMPEDANCE N+1 DOUT N+2 DOUT N+3 DOUT N+4 DOUT MSB 1296 ReadSeq 0.0 Figure 5: Read Sequence (c)2011 Silicon Storage Technology, Inc. S71296-05-000 10 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet High-Speed-Read (66/80 MHz) The High-Speed-Read instruction supporting up to 66 MHz (for SST25VF080B-50-xx-xxxx) or 80 MHz (for SST25VF040B-80-xx-xxxx) Read is initiated by executing an 8-bit command, 0BH, followed by address bits [A23-A0] and a dummy byte. CE# must remain active low for the duration of the HighSpeed-Read cycle. See Figure 6 for the High-Speed-Read sequence. Following a dummy cycle, the High-Speed-Read instruction outputs the data starting from the specified address location. The data output stream is continuous through all addresses until terminated by a low to high transition on CE#. The internal address pointer will automatically increment until the highest memory address is reached. Once the highest memory address is reached, the address pointer will automatically increment to the beginning (wrap-around) of the address space. Once the data from address location FFFFFH has been read, the next output will be from address location 00000H. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 8 0B SI MSB SO 15 16 23 24 31 32 39 40 47 48 55 56 63 64 71 72 80 MODE 0 ADD. MSB ADD. ADD. X HIGH IMPEDANCE N DOUT N+1 DOUT N+2 DOUT N+3 DOUT N+4 DOUT MSB 1296 HSRdSeq.0 Note: X = Dummy Byte: 8 Clocks Input Dummy Cycle (VIL or VIH) Figure 6: High-Speed-Read Sequence (c)2011 Silicon Storage Technology, Inc. S71296-05-000 11 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Byte-Program The Byte-Program instruction programs the bits in the selected byte to the desired data. The selected byte must be in the erased state (FFH) when initiating a Program operation. A Byte-Program instruction applied to a protected memory area will be ignored. Prior to any Write operation, the Write-Enable (WREN) instruction must be executed. CE# must remain active low for the duration of the Byte-Program instruction. The Byte-Program instruction is initiated by executing an 8-bit command, 02H, followed by address bits [A23-A0]. Following the address, the data is input in order from MSB (bit 7) to LSB (bit 0). CE# must be driven high before the instruction is executed. The user may poll the Busy bit in the software status register or wait TBP for the completion of the internal self-timed Byte-Program operation. See Figure 7 for the Byte-Program sequence. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 8 15 16 23 24 31 32 39 MODE 0 02 SI ADD. ADD. MSB MSB SO ADD. DIN MSB LSB HIGH IMPEDANCE 1296 ByteProg.0 Figure 7: Byte-Program Sequence (c)2011 Silicon Storage Technology, Inc. S71296-05-000 12 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Auto Address Increment (AAI) Word-Program The AAI program instruction allows multiple bytes of data to be programmed without re-issuing the next sequential address location. This feature decreases total programming time when multiple bytes or entire memory array is to be programmed. An AAI Word program instruction pointing to a protected memory area will be ignored. The selected address range must be in the erased state (FFH) when initiating an AAI Word Program operation. While within AAI Word Programming sequence, only the following instructions are valid: for software end-of-write detection--AAI Word (ADH), WRDI (04H), and RDSR (05H); for hardware end-of-write detection--AAI Word (ADH) and WRDI (04H). There are three options to determine the completion of each AAI Word program cycle: hardware detection by reading the Serial Output, software detection by polling the BUSY bit in the software status register, or wait TBP. Refer to"End-of-Write Detection" for details. Prior to any write operation, the Write-Enable (WREN) instruction must be executed. Initiate the AAI Word Program instruction by executing an 8-bit command, ADH, followed by address bits [A23-A0]. Following the addresses, two bytes of data are input sequentially, each one from MSB (Bit 7) to LSB (Bit 0). The first byte of data (D0) is programmed into the initial address [A23-A1] with A0=0, the second byte of Data (D1) is programmed into the initial address [A23-A1] with A0=1. CE# must be driven high before executing the AAI Word Program instruction. Check the BUSY status before entering the next valid command. Once the device indicates it is no longer busy, data for the next two sequential addresses may be programmed, followed by the next two, and so on. When programming the last desired word, or the highest unprotected memory address, check the busy status using either the hardware or software (RDSR instruction) method to check for program completion. Once programming is complete, use the applicable method to terminate AAI. If the device is in Software End-of-Write Detection mode, execute the Write-Disable (WRDI) instruction, 04H. If the device is in AAI Hardware End-of-Write Detection mode, execute the Write-Disable (WRDI) instruction, 04H, followed by the 8-bit DBSY command, 80H. There is no wrap mode during AAI programming once the highest unprotected memory address is reached. See Figures 10 and 11 for the AAI Word programming sequence. End-of-Write Detection There are three methods to determine completion of a program cycle during AAI Word programming: hardware detection by reading the Serial Output, software detection by polling the BUSY bit in the Software Status Register, or wait TBP. The Hardware End-of-Write detection method is described in the section below. Hardware End-of-Write Detection The Hardware End-of-Write detection method eliminates the overhead of polling the Busy bit in the Software Status Register during an AAI Word program operation. The 8-bit command, 70H, configures the Serial Output (SO) pin to indicate Flash Busy status during AAI Word programming. (see Figure 8) The 8-bit command, 70H, must be executed prior to initiating an AAI Word-Program instruction. Once an internal programming operation begins, asserting CE# will immediately drive the status of the internal flash status on the SO pin. A `0' indicates the device is busy and a `1' indicates the device is ready for the next instruction. De-asserting CE# will return the SO pin to tri-state. While in AAI and Hardware End-of-Write detection mode, the only valid instructions are AAI Word (ADH) and WRDI (04H). To exit AAI Hardware End-of-Write detection, first execute WRDI instruction, 04H, to reset the WriteEnable-Latch bit (WEL=0) and AAI bit. Then execute the 8-bit DBSY command, 80H, to disable RY/ BY# status during the AAI command. See Figures 9 and 10. (c)2011 Silicon Storage Technology, Inc. S71296-05-000 13 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet CE# MODE 3 SCK 0 1 2 3 4 5 6 7 MODE 0 70 SI MSB HIGH IMPEDANCE SO 1271 EnableSO.0 Figure 8: Enable SO as Hardware RY/BY# During AAI Programming CE# MODE 3 SCK 0 1 2 3 4 5 6 7 MODE 0 80 SI MSB HIGH IMPEDANCE SO 1271 DisableSO.0 Figure 9: Disable SO as Hardware RY/BY# During AAI Programming (c)2011 Silicon Storage Technology, Inc. S71296-05-000 14 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet CE# MODE 3 0 7 0 0 7 7 8 15 16 23 24 31 32 39 40 47 0 7 8 15 16 23 SCK MODE 0 SI EBSY AD WREN A A A D0 D1 AD D2 D3 Load AAI command, Address, 2 bytes data SO Check for Flash Busy Status to load next valid1 command CE# cont. 0 15 16 23 7 8 0 7 0 7 7 8 0 15 SCK cont. AD SI cont. Dn-1 WRDI Dn Last 2 Data Bytes RDSR DBSY WRDI followed by DBSY to exit AAI Mode DOUT SO cont. Check for Flash Busy Status to load next valid1 command Note: 1. Valid commands during AAI programming: AAI command or WRDI command 2. User must configure the SO pin to output Flash Busy status during AAI programming 1296 AAI.HW.3 Figure 10:Auto Address Increment (AAI) Word-Program Sequence with Hardware End-of-Write Detection Wait TBP or poll Software Status register to load next valid1 command CE# MODE 3 0 7 8 15 16 23 24 31 32 39 40 47 0 7 8 15 16 23 0 7 8 15 16 23 0 7 0 7 8 15 SCK MODE 0 SI AD A A A D0 D1 AD D2 D3 AD Dn-1 Dn Last 2 Data Bytes Load AAI command, Address, 2 bytes data WRDI RDSR WRDI to exit AAI Mode SO Note: DOUT 1. Valid commands during AAI programming: AAI command, RDSR command, or WRDI command 1296 AAI.SW.3 Figure 11:Auto Address Increment (AAI) Word-Program Sequence with Software End-of-Write Detection (c)2011 Silicon Storage Technology, Inc. S71296-05-000 15 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet 4-KByte Sector-Erase The Sector-Erase instruction clears all bits in the selected 4 KByte sector to FFH. A Sector-Erase instruction applied to a protected memory area will be ignored. Prior to any Write operation, the WriteEnable (WREN) instruction must be executed. CE# must remain active low for the duration of any command sequence. The Sector-Erase instruction is initiated by executing an 8-bit command, 20H, followed by address bits [A23-A0]. Address bits [AMS-A12] (AMS = Most Significant address) are used to determine the sector address (SAX), remaining address bits can be VIL or VIH. CE# must be driven high before the instruction is executed. The user may poll the Busy bit in the software status register or wait TSE for the completion of the internal self-timed Sector-Erase cycle. See Figure 12 for the SectorErase sequence. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 8 15 16 23 24 31 MODE 0 20 SI MSB SO ADD. ADD. ADD. MSB HIGH IMPEDANCE 1296 SecErase.0 Figure 12:Sector-Erase Sequence (c)2011 Silicon Storage Technology, Inc. S71296-05-000 16 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet 32-KByte and 64-KByte Block-Erase The 32-KByte Block-Erase instruction clears all bits in the selected 32 KByte block to FFH. A BlockErase instruction applied to a protected memory area will be ignored. The 64-KByte Block-Erase instruction clears all bits in the selected 64 KByte block to FFH. A Block-Erase instruction applied to a protected memory area will be ignored. Prior to any Write operation, the Write-Enable (WREN) instruction must be executed. CE# must remain active low for the duration of any command sequence. The 32-KByte Block-Erase instruction is initiated by executing an 8-bit command, 52H, followed by address bits [A23-A0]. Address bits [AMS-A15] (AMS = Most Significant Address) are used to determine block address (BAX), remaining address bits can be VIL or VIH. CE# must be driven high before the instruction is executed. The 64-KByte BlockErase instruction is initiated by executing an 8-bit command D8H, followed by address bits [A23-A0]. Address bits [AMS-A15] are used to determine block address (BAX), remaining address bits can be VIL or VIH. CE# must be driven high before the instruction is executed. The user may poll the Busy bit in the software status register or wait TBE for the completion of the internal self-timed 32-KByte Block-Erase or 64-KByte Block-Erase cycles. See Figures 13 and 14 for the 32-KByte Block-Erase and 64-KByte Block-Erase sequences. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 8 15 16 23 24 31 MODE 0 ADDR 52 SI MSB ADDR ADDR MSB SO HIGH IMPEDANCE 1296 32KBklEr.0 Figure 13:32-KByte Block-Erase Sequence CE# MODE 3 SCK 0 1 2 3 4 5 6 7 8 15 16 23 24 31 MODE 0 ADDR D8 SI MSB ADDR ADDR MSB SO HIGH IMPEDANCE 1296 63KBlkEr.0 Figure 14:64-KByte Block-Erase Sequence (c)2011 Silicon Storage Technology, Inc. S71296-05-000 17 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Chip-Erase The Chip-Erase instruction clears all bits in the device to FFH. A Chip-Erase instruction will be ignored if any of the memory area is protected. Prior to any Write operation, the Write-Enable (WREN) instruction must be executed. CE# must remain active low for the duration of the Chip-Erase instruction sequence. The Chip-Erase instruction is initiated by executing an 8-bit command, 60H or C7H. CE# must be driven high before the instruction is executed. The user may poll the Busy bit in the software status register or wait TCE for the completion of the internal self-timed Chip-Erase cycle. See Figure 15 for the Chip-Erase sequence. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 MODE 0 60 or C7 SI MSB SO HIGH IMPEDANCE 1296 ChEr.0 Figure 15:Chip-Erase Sequence Read-Status-Register (RDSR) The Read-Status-Register (RDSR) instruction allows reading of the status register. The status register may be read at any time even during a Write (Program/Erase) operation. When a Write operation is in progress, the Busy bit may be checked before sending any new commands to assure that the new commands are properly received by the device. CE# must be driven low before the RDSR instruction is entered and remain low until the status data is read. Read-Status-Register is continuous with ongoing clock cycles until it is terminated by a low to high transition of the CE#. See Figure 16 for the RDSR instruction sequence. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 MODE 0 05 SI MSB SO HIGH IMPEDANCE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 MSB Status Register Out 1296 RDSRseq.0 Figure 16:Read-Status-Register (RDSR) Sequence (c)2011 Silicon Storage Technology, Inc. S71296-05-000 18 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Write-Enable (WREN) The Write-Enable (WREN) instruction sets the Write-Enable-Latch bit in the Status Register to 1 allowing Write operations to occur. The WREN instruction must be executed prior to any Write (Program/ Erase) operation. The WREN instruction may also be used to allow execution of the Write-Status-Register (WRSR) instruction; however, the Write-Enable-Latch bit in the Status Register will be cleared upon the rising edge CE# of the WRSR instruction. CE# must be driven high before the WREN instruction is executed. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 MODE 0 06 SI MSB SO HIGH IMPEDANCE 1296 WREN.0 Figure 17:Write Enable (WREN) Sequence Write-Disable (WRDI) The Write-Disable (WRDI) instruction resets the Write-Enable-Latch bit and AAI bit to 0 disabling any new Write operations from occurring. The WRDI instruction will not terminate any programming operation in progress. Any program operation in progress may continue up to TBP after executing the WRDI instruction. CE# must be driven high before the WRDI instruction is executed. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 MODE 0 04 SI MSB SO HIGH IMPEDANCE 1296 WRDI.0 Figure 18:Write Disable (WRDI) Sequence (c)2011 Silicon Storage Technology, Inc. S71296-05-000 19 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Enable-Write-Status-Register (EWSR) The Enable-Write-Status-Register (EWSR) instruction arms the Write-Status-Register (WRSR) instruction and opens the status register for alteration. The Write-Status-Register instruction must be executed immediately after the execution of the Enable-Write-Status-Register instruction. This twostep instruction sequence of the EWSR instruction followed by the WRSR instruction works like SDP (software data protection) command structure which prevents any accidental alteration of the status register values. CE# must be driven low before the EWSR instruction is entered and must be driven high before the EWSR instruction is executed. Write-Status-Register (WRSR) The Write-Status-Register instruction writes new values to the BP3, BP2, BP1, BP0, and BPL bits of the status register. CE# must be driven low before the command sequence of the WRSR instruction is entered and driven high before the WRSR instruction is executed. See Figure 19 for EWSR or WREN and WRSR instruction sequences. Executing the Write-Status-Register instruction will be ignored when WP# is low and BPL bit is set to "1". When the WP# is low, the BPL bit can only be set from "0" to "1" to lock-down the status register, but cannot be reset from "1" to "0". When WP# is high, the lock-down function of the BPL bit is disabled and the BPL, BP0, and BP1 and BP2 bits in the status register can all be changed. As long as BPL bit is set to 0 or WP# pin is driven high (VIH) prior to the low-to-high transition of the CE# pin at the end of the WRSR instruction, the bits in the status register can all be altered by the WRSR instruction. In this case, a single WRSR instruction can set the BPL bit to "1" to lock down the status register as well as altering the BP0, BP1, and BP2 bits at the same time. See Table 2 for a summary description of WP# and BPL functions. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 MODE 3 MODE 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 MODE 0 50 or 06 SI 01 MSB MSB STATUS REGISTER IN 7 6 5 4 3 2 1 0 MSB HIGH IMPEDANCE SO 1296 EWSR.0 Figure 19:Enable-Write-Status-Register (EWSR) or Write-Enable (WREN) and Write-Status-Register (WRSR) Sequence (c)2011 Silicon Storage Technology, Inc. S71296-05-000 20 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet JEDEC Read-ID The JEDEC Read-ID instruction identifies the device as SST25VF080B and the manufacturer as SST. The device information can be read from executing the 8-bit command, 9FH. Following the JEDEC Read-ID instruction, the 8-bit manufacturer's ID, BFH, is output from the device. After that, a 16-bit device ID is shifted out on the SO pin. Byte 1, BFH, identifies the manufacturer as SST. Byte 2, 25H, identifies the memory type as SPI Serial Flash. Byte 3, 8EH, identifies the device as SST25VF080B. The instruction sequence is shown in Figure 20. The JEDEC Read ID instruction is terminated by a low to high transition on CE# at any time during data output. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 MODE 0 SI SO 9F HIGH IMPEDANCE 25 BF MSB 8E MSB 1296 JEDECID.1 Figure 20:JEDEC Read-ID Sequence Table 6: JEDEC Read-ID Data Manufacturer's ID Device ID Memory Type Memory Capacity Byte1 Byte 2 Byte 3 BFH 25H 8EH T6.0 1296 (c)2011 Silicon Storage Technology, Inc. S71296-05-000 21 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Read-ID (RDID) The Read-ID instruction (RDID) identifies the devices as SST25VF080B and manufacturer as SST. This command is backward compatible and should be used as default device identification when multiple versions of SPI Serial Flash devices are used in a design. The device information can be read from executing an 8-bit command, 90H or ABH, followed by address bits [A23-A0]. Following the Read-ID instruction, the manufacturer's ID is located in address 00000H and the device ID is located in address 00001H. Once the device is in Read-ID mode, the manufacturer's and device ID output data toggles between address 00000H and 00001H until terminated by a low to high transition on CE#. Refer to Tables 6 and 7 for device identification data. CE# MODE 3 SCK 0 1 2 3 4 5 6 7 8 23 24 15 16 31 32 39 40 47 48 55 56 63 MODE 0 90 or AB SI 00 00 MSB SO ADD1 MSB HIGH IMPEDANCE BF Device ID BF Device ID HIGH IMPEDANCE MSB 1265 RdID.0 Note: The manufacturer's and device ID output stream is continuous until terminated by a low-to-high transition on CE#. Device ID = 8EH for SST25VF080B 1 00H will output the manufacture's ID first and 01H will output device ID first before toggling between the two. Figure 21:Read-ID Sequence Table 7: Product Identification Manufacturer's ID Address Data 00000H BFH 00001H 8EH Device ID SST25VF080B T7.0 1296 (c)2011 Silicon Storage Technology, Inc. S71296-05-000 22 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Electrical Specifications Absolute Maximum Stress Ratings (Applied conditions greater than those listed under "Absolute Maximum Stress Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to +125C Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to +150C D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V Package Power Dissipation Capability (TA = 25C). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C for 10 seconds Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA 1. Output shorted for no more than one second. No more than one output shorted at a time. Table 8: Operating Range Range Commercial Industrial Ambient Temp VDD 0C to +70C 2.7-3.6V -40C to +85C 2.7-3.6V T8.1 1296 Table 9: AC Conditions of Test1 Input Rise/Fall Time Output Load 5ns CL = 30 pF T9.1 1296 1. See Figures 26 and 27 Table 10:DC Operating Characteristics (SST25VF080B-50-xx-xxxx) Limits Symbol Parameter Min Max Units Test Conditions IDDR Read Current 10 mA CE#=0.1 VDD/0.9 VDD@25 MHz, SO=open IDDR2 Read Current 15 mA CE#=0.1 VDD/0.9 VDD@50 MHz, SO=open IDDW Program and Erase Current 30 mA CE#=VDD ISB Standby Current 20 A CE#=VDD, VIN=VDD or VSS ILI Input Leakage Current 1 A VIN=GND to VDD, VDD=VDD Max ILO Output Leakage Current 1 A VOUT=GND to VDD, VDD=VDD Max 0.8 V VDD=VDD Min V VDD=VDD Max VIL Input Low Voltage VIH Input High Voltage VOL Output Low Voltage 0.2 V IOL=100 A, VDD=VDD Min VOL2 Output Low Voltage 0.4 V IOL=1.6 mA, VDD=VDD Min VOH Output High Voltage V IOH=-100 A, VDD=VDD Min 0.7 VDD VDD-0.2 T10.0 1296 (c)2011 Silicon Storage Technology, Inc. S71296-05-000 23 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Table 11:DC Operating Characteristics (SST25VF080B-80-xx-xxxx) Limits Symbol Parameter Min Max Units Test Conditions IDDR Read Current 12 mA CE#=0.1 VDD/0.9 VDD@33 MHz, SO=open IDDR3 Read Current 20 mA CE#=0.1 VDD/0.9 VDD@80 MHz, SO=open IDDW Program and Erase Current 30 mA CE#=VDD ISB Standby Current 20 A CE#=VDD, VIN=VDD or VSS ILI Input Leakage Current 1 A VIN=GND to VDD, VDD=VDD Max ILO Output Leakage Current VIL Input Low Voltage VIH Input High Voltage VOL Output Low Voltage VOL2 Output Low Voltage VOH Output High Voltage 1 A VOUT=GND to VDD, VDD=VDD Max 0.8 V VDD=VDD Min V VDD=VDD Max 0.2 V IOL=100 A, VDD=VDD Min 0.4 V IOL=1.6 mA, VDD=VDD Min V IOH=-100 A, VDD=VDD Min 0.7 VDD VDD-0.2 T11.0 1296 Table 12:Recommended System Power-up Timings Symbol Parameter TPU-READ1 TPU-WRITE1 Minimum Units VDD Min to Read Operation 10 s VDD Min to Write Operation 10 s T12.0 1296 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. Table 13:Capacitance (TA = 25C, f=1 Mhz, other pins open) Parameter Description COUT1 Output Pin Capacitance 1 CIN Input Capacitance Test Condition Maximum VOUT = 0V 12 pF VIN = 0V 6 pF T13.0 1296 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. Table 14:Reliability Characteristics Symbol Parameter Minimum Specification Units Test Method NEND1 Endurance 10,000 Cycles JEDEC Standard A117 TDR1 ILTH1 Data Retention 100 Years 100 + IDD mA Latch Up JEDEC Standard A103 JEDEC Standard 78 T14.0 1296 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. (c)2011 Silicon Storage Technology, Inc. S71296-05-000 24 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Table 15:AC Operating Characteristics (SST25VF080B-50-xx-xxxx) 25 MHz Symbo l Parameter Min Max 66 MHz1,2 50 MHz Min Max Min Max Units 66 MHz 3 Serial Clock Frequency TSCKH Serial Clock High Time TSCKL Serial Clock Low Time 18 9 7 ns TSCKR4 Serial Clock Rise Time (Slew Rate) 0.1 0.1 0.1 V/ns TSCKF Serial Clock Fall Time (Slew Rate) 0.1 0.1 0.1 V/ns TCES5 CE# Active Setup Time 10 5 4 ns TCEH5 CE# Active Hold Time 10 5 4 ns FCLK 5 25 18 50 9 7 ns CE# Not Active Setup Time 10 5 4 ns TCHH5 CE# Not Active Hold Time 10 5 4 ns TCPH CE# High Time 100 TCHZ CE# High to High-Z Output TCLZ SCK Low to Low-Z Output 0 0 0 ns TDS Data In Setup Time 5 2 2 ns TDH Data In Hold Time 5 5 3 ns THLS HOLD# Low Setup Time 10 5 4 ns THHS HOLD# High Setup Time 10 5 4 ns THLH HOLD# Low Hold Time 10 5 4 ns THHH HOLD# High Hold Time 10 THZ HOLD# Low to High-Z Output TLZ HOLD# High to Low-Z Output TOH Output Hold from SCK Change TV Output Valid from SCK 15 8 6 ns TSE Sector-Erase 25 25 25 ms TBE Block-Erase 25 25 25 ms TSCE Chip-Erase 50 50 50 ms TBP Byte-Program 10 10 10 TCHS 50 15 100 8 5 20 ns 4 8 15 0 ns 6 8 0 ns 8 ns 8 ns 0 ns s T15.0 1296 1. 2. 3. 4. 5. VDD = 3.0 - 3.6 V, CL = 15 pF Characterized, but not fully tested Maximum clock frequency for Read Instruction, 03H, is 25 MHz Maximum Rise and Fall time may be limited by TSCKH and TSCKL requirements Relative to SCK. (c)2011 Silicon Storage Technology, Inc. S71296-05-000 25 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Table 16:AC Operating Characteristics (SST25VF080B-80-xx-xxxx) 33 MHz Symbol Parameter Min 80 MHz Max Min Max Units 80 MHz FCLK1 Serial Clock Frequency TSCKH Serial Clock High Time 13 6 ns TSCKL Serial Clock Low Time 13 6 ns TSCKR2 Serial Clock Rise Time (Slew Rate) 0.1 0.1 V/ns TSCKF Serial Clock Fall Time (Slew Rate) 0.1 0.1 V/ns TCES3 TCEH5 TCHS5 TCHH5 CE# Active Setup Time 5 5 ns CE# Active Hold Time 5 5 ns 33 CE# Not Active Setup Time 5 5 ns CE# Not Active Hold Time 5 5 ns TCPH CE# High Time 50 TCHZ CE# High to High-Z Output TCLZ SCK Low to Low-Z Output 0 0 ns TDS Data In Setup Time 2 2 ns TDH Data In Hold Time 4 4 ns THLS HOLD# Low Setup Time 5 5 ns THHS HOLD# High Setup Time 5 5 ns THLH HOLD# Low Hold Time 5 5 ns THHH HOLD# High Hold Time 5 THZ HOLD# Low to High-Z Output TLZ HOLD# High to Low-Z Output TOH Output Hold from SCK Change TV Output Valid from SCK 10 6 ns TSE Sector-Erase 25 25 ms TBE Block-Erase 25 25 ms TSCE Chip-Erase 50 50 ms TBP Byte-Program 10 10 50 7 ns 7 ns 5 7 7 0 ns 7 ns 7 ns 0 ns s T16.0 1296 1. Maximum clock frequency for Read Instruction, 03H, is 33 MHz 2. Maximum Rise and Fall time may be limited by TSCKH and TSCKL requirements 3. Relative to SCK. (c)2011 Silicon Storage Technology, Inc. S71296-05-000 26 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet TCPH CE# TCHH TCES TCEH TSCKF TCHS SCK TDS SI SO TSCKR TDH MSB LSB HIGH-Z HIGH-Z 1296 SerIn.0 Figure 22:Serial Input Timing Diagram CE# TSCKL TSCKH SCK TOH TCLZ SO TCHZ LSB MSB TV SI 1296 SerOut.0 Figure 23:Serial Output Timing Diagram CE# THHH THHS THLS SCK THLH THZ TLZ SO SI HOLD# 1296 Hold.0 Figure 24:Hold Timing Diagram (c)2011 Silicon Storage Technology, Inc. S71296-05-000 27 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet VDD VDD Max Chip selection is not allowed. Commands may not be accepted or properly interpreted by the device. VDD Min TPU-READ TPU-WRITE Device fully accessible Time 1296 PwrUp.0 Figure 25:Power-up Timing Diagram VIHT VHT VHT INPUT VILT REFERENCE POINTS OUTPUT VLT VLT 1296 IORef.0 AC test inputs are driven at VIHT (0.9VDD) for a logic "1" and VILT (0.1VDD) for a logic "0". Measurement reference points for inputs and outputs are VHT (0.6VDD) and VLT (0.4VDD). Input rise and fall times (10% 90%) are <5 ns. Note: VHT - VHIGH Test VLT - VLOW Test VIHT - VINPUT HIGH Test VILT - VINPUT LOW Test Figure 26:AC Input/Output Reference Waveforms (c)2011 Silicon Storage Technology, Inc. S71296-05-000 28 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet TO TESTER TO DUT CL 1296 TstLd.0 Figure 27:A Test Load Example (c)2011 Silicon Storage Technology, Inc. S71296-05-000 29 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Product Ordering Information SST 25 VF XX XX 080B XXXX - 80 XX - 4C XX - S2AE XXXX Environmental Attribute E1 = non-Pb / non-Sn contact (lead) finish F2 = non-Pb / non-Sn contact (lead) finish: Nickel plating with Gold top (outer) layer Package Modifier A = 8 leads or contacts Package Type S = SOIC 150 mil body width S2 = SOIC 200 mil body width Q = WSON P= PDIP 300 mil body width Temperature Range C = Commercial = 0C to +70C I = Industrial = -40C to +85C Minimum Endurance 4 = 10,000 cycles Operating Frequency 50 = 50 MHz 80 = 80 MHz Device Density 080 = 8 Mbit Voltage V = 2.7-3.6V Product Series 25 = Serial Peripheral Interface flash memory 1. Environmental suffix "E" denotes non-Pb solder. SST non-Pb solder devices are "RoHS Compliant". 2. Environmental suffix "F" denotes non-Pb/non-SN solder. SST non-Pb/non-Sn solder devices are "RoHS Compliant". (c)2011 Silicon Storage Technology, Inc. S71296-05-000 30 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Valid Combinations for SST25VF080B SST25VF080B-50-4C-S2AF SST25VF080B-50-4I-S2AF SST25VF080B-50-4C-QAF SST25VF080B-50-4I-QAF SST25VF080B-80-4C-S2AE SST25VF080B-80-4I-S2AE SST25VF080B-80-4C-QAE SST25VF080B-80-4I-QAE SST25VF080B-50-4C-PAE SST25VF080B-80-4C-SAE SST25VF080B-80-4I-SAE Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST sales representative to confirm availability of valid combinations and to determine availability of new combinations. (c)2011 Silicon Storage Technology, Inc. S71296-05-000 31 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Packaging Diagrams Pin #1 Identifier TOP VIEW SIDE VIEW 0.50 0.35 5.40 5.15 1.27 BSC 0.25 0.05 5.40 5.15 END VIEW 2.16 1.75 8.10 7.70 0 0.25 0.19 Note: 1. All linear dimensions are in millimeters (max/min). 2. Coplanarity: 0.1 mm 3. Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads. 8 08-soic-EIAJ-S2A-3 0.80 0.50 1mm Figure 28: 8-lead Small Outline Integrated Circuit (SOIC) 200 mil body width (5.2mm x 8mm) SST Package Code: S2A (c)2011 Silicon Storage Technology, Inc. S71296-05-000 32 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Pin #1 Identifier TOP VIEW SIDE VIEW 7 4 places 0.51 0.33 5.0 4.8 1.27 BSC END VIEW 45 0.25 0.10 4.00 3.80 1.75 1.35 6.20 5.80 7 4 places 0.25 0.19 Note: 1. Complies with JEDEC publication 95 MS-012 AA dimensions, although some dimensions may be more stringent. 2. All linear dimensions are in millimeters (max/min). 3. Coplanarity: 0.1 mm 4. Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads. 0 8 08-soic-5x6-SA-8 1.27 0.40 1mm Figure 29: 8-lead Small Outline Integrated Circuit (SOIC) 150 mil body width (4.9mm x 6mm) SST Package Code: SA (c)2011 Silicon Storage Technology, Inc. S71296-05-000 33 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet TOP VIEW SIDE VIEW BOTTOM VIEW Pin #1 0.2 Pin #1 Corner 1.27 BSC 5.00 0 .10 0.076 4.0 0.48 0.35 3.4 0.70 0.50 0.05 Max 6.00 0.10 0.80 0.70 Note: 1. All linear dimensions are in millimeters (max/min). 2. Untoleranced dimensions (shown with box surround) are nominal target dimensions. 3. The external paddle is electrically connected to the die back-side and possibly to certain VSS leads. This paddle can be soldered to the PC board; it is suggested to connect this paddle to the VSS of the unit. Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device. CROSS SECTION 0.80 0.70 1mm 8-wson-5x6-QA-9.0 Figure 30:8-contact Very-very-thin Small Outline No-lead (WSON) SST Package Code: QA (c)2011 Silicon Storage Technology, Inc. S71296-05-000 34 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet TOP VIEW 0.355 0.400 0.245 0.260 Pin 1 SIDE VIEW END VIEW 0.300 0.325 0.056 0.064 0.126 0.142 0.008 0.014 0.115 0.150 0.014 0.022 0.015 min 0.100 BSC 0.335 0.375 0.25 inches Note: 1. Complies with JEDEC publication 95 MS-001 BA dimensions, although some dimensions may be more stringent. 2. All linear dimensions are in inches (min/max). 3. Dimensions do not include mold flash. Maximum allowable mold flash is .010 inches. 8-pdip-PA-1.0 Figure 31:8-lead Plastic Dual In-Line Pins (PDIP) SST Package Code: PA (c)2011 Silicon Storage Technology, Inc. S71296-05-000 35 02/11 8 Mbit SPI Serial Flash SST25VF080B A Microchip Technology Company Data Sheet Table 17:Revision History Number 00 01 02 03 04 Description * * * * * * * * * * * * * * * 05 * * * * Date Initial release of data sheet Migrated document to a Data Sheet Updated Surface Mount Solder Reflow Temperature information Updated Features Updated Table 5 on page 9 Updated "High-Speed-Read (66/80 MHz)" on page 11 Updated Table 15 on page 25 Modified "Features", "Product Description", "Pin Description", "Product Ordering Information", and "Packaging Diagrams" to include the PAE package. Updated Figures 10 and 11 on page 15. Added 80 MHz High Speed Clock Frequency to Features Removed Maximum Frequency from Table 5 on page 9 Edited "Read (25/33 MHz)" on page 10 and "High-Speed-Read (66/80 MHz)" on page 11. Added Table 11 on page 24 and Table 16 on page 26 Edited Product Ordering Information Added Valid Combinations SST25VF080B-80-4C-S2AE, SST25VF080B-80-4I-S2AE, SST25VF080B-80-4C-QAE, and SST25VF080B-80-4I-QAE Updated "Auto Address Increment (AAI) Word-Program", "End-of-Write Detection", and "Hardware End-of-Write Detection" on page 13. Revised Figures 10 and 11 on page page 15. Updated document to new format. Added SAE package drawing on page 33 and SAE information to "Product Ordering Information" on page 30 Sep 2005 Jan 2006 Jun 2007 Mar 2009 Jan 2010 Feb 2011 (c) 2011 Silicon Storage Technology, Inc-a Microchip Technology Company. All rights reserved. SST, Silicon Storage Technology, the SST logo, SuperFlash, MTP, and FlashFlex are registered trademarks of Silicon Storage Technology, Inc. MPF, SQI, Serial Quad I/O, and Z-Scale are trademarks of Silicon Storage Technology, Inc. All other trademarks and registered trademarks mentioned herein are the property of their respective owners. Specifications are subject to change without notice. Refer to www.microchip.com or www.sst.com for the most recent documentation. Memory sizes denote raw storage capacity; actual usable capacity may be less. SST makes no warranty for the use of its products other than those expressly contained in the Standard Terms and Conditions of Sale. For sales office(s) location and information, please see www.microchip.com or www.sst.com. Silicon Storage Technology, Inc. A Microchip Technology Company www.microchip.com or www.sst.com (c)2011 Silicon Storage Technology, Inc. S71296-05-000 36 02/11