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Notice for TAIYO YUDEN products 
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s ofcial sales channel.
Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
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FEATURES
ORDERING CODE
EXTERNAL DIMENSIONS/STANDARD QUANTITY
APPLICATIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Suitable for the use as a choke coil in smaller DC/DC converters. BR-series are suitable for an anti-noise measure on the power sup-
ply circuit of DSC, DVC, eBOOK, LCD-TV, mobile phones,PC, game
equipments, various communication equipments and etc..
WIRE-WOUND CHIP POWER INDUCTORS
BR SERIES
Type
BR Wound Chip
Power Inductors
Packaging
T Tape & Reel
Nominal Inductance
〔μH
example
R20 0.2
1R0 1.0
100 10
101 100
Rdecimal point
Inductance tolerance
M±20%
K±10%
Internal code
External Dimensions
(W×L) : mm (inch)
1608 (0603) 1.6×0.8mm
2012 (0805) 2.0×1.2mm
2016 (0806) 2.0×1.6mm
2515 (1006) 2.5×1.5mm
2518 (1007) 2.5×1.8mm
3225 (1210) 3.2×2.5mm
B R 2 5 1 8 T 2 R 2 M △△△
L
T
W
e
AVAILABLE INDUCTANCE RANGE
Recommended Land Patterns
AA
C
B
Surface Mounting
Mounting and soldering conditions should be
checked beforehand.
Applicable soldering process to this products
is reflow soldering only.
Characteristic Spec
FL, L, HL Low profile
C High Current
REFLOW
OPERATING TEMP.
◦40 105Including-self-generated heat
Type A B C
1608 0.55 0.70 1.00
2012 0.60 1.00 1.45
2016 0.60 1.00 1.80
2515 0.60 1.50 1.70
2518 0.60 1.50 2.00
3225 0.85 1.70 2.70
Unit : mm
Type L W T e
Standard Quantity [pcs]
Paper
Tape
Embossed
Tape
BR L1608 1.6±0.2
(0.063±0.008)
0.8±0.2
(0.031±0.008)
0.7 max
(0.028 max)
0.45±0.15
(0.016±0.006) 3000
BR C1608 1.6±0.2
(0.063±0.008)
0.8±0.2
(0.031±0.008)
0.8±0.2
(0.031±0.008)
0.45±0.15
(0.016±0.006) 3000
BR L2012 2.0±0.2
(0.079±0.008)
1.25±0.2
(0.049±0.008)
1.0 max
(0.040 max)
0.5±0.2
(0.020±0.008) 3000
BR C2012 2.0±0.2
(0.079±0.008)
1.25±0.2
(0.049±0.008)
1.4 max
(0.056 max)
0.5±0.2
(0.020±0.008) 2000
BR C2016 2.0±0.2
(0.079±0.008)
1.6±0.2
(0.063±0.008)
1.6±0.2
(0.063±0.008)
0.5±0.2
(0.020±0.008) 2000
BR L2515 2.5±0.2
(0.098±0.008)
1.5±0.2
(0.060±0.008)
1.2 max
(0.048 max)
0.5±0.2
(0.020±0.008) 2000
BRFL2518 2.5±0.2
(0.098±0.008)
1.8±0.2
(0.071±0.008)
1.00 max
(0.040 max)
0.5±0.2
(0.020±0.008) 3000
BR L2518 2.5±0.2
(0.098±0.008)
1.8±0.2
(0.071±0.008)
1.2 max
(0.048 max)
0.5±0.2
(0.020±0.008) 3000
BRHL2518 2.5±0.2
(0.098±0.008)
1.8±0.2
(0.071±0.008)
1.5 max
(0.060 max)
0.5±0.2
(0.020±0.008) 2000
BR C2518 2.5±0.2
(0.098±0.008)
1.8±0.2
(0.071±0.008)
1.8±0.2
(0.071±0.008)
0.5±0.2
(0.020±0.008) 2000
BR L3225 3.2±0.2
(0.126±0.008)
2.5±0.2
(0.098±0.008)
1.7 max
(0.068 max)
0.75±0.2
(0.03±0.008) 2000
Unit : mm
BR L1608 BR C1608 BR C1608 6 BR L2012 BR C2012 BR C2016 BR L2515 BRFL2518 BR L2518 BRHL2518 BR C2518 BR L3225
0.20
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±30
[Ω]
Imax
[mA]
Rdc±20
[Ω]
0.47
980 0.2μH0.060 1100
0.43μH
0.082 1,050
0.47μH
0.090 2,850
0.27μH
0.022
1.0
510 1μH 0.23 520 0.180 680 0.188 850 0.135 1,400 1μH 0.06 1,100 1μH 0.085 1,350 1μH 0.070 1,200 1μH 0.090 1,000 1μH 0.080 1,400 1μH 0.055 1,650 1μH 0.050 2,200 0.043
2.2
280 2.2μH0.550 1μH
1,000 0.11 1,000 0.135 850 0.130 850 0.135 1,000 0.115
4.7
650 0.265 650 4.7μH 0.330 470 0.400 750 0.245
600 4.7μH0.265 4.7μH 4.7μH 4.7μH 4.7μH
10
170 2.00 270 0.850 450 0.400 610 0.350 700 0.350
22
150 15μH 2.56
47
100
85 7.70 140 3.40 190 3.60 250 2.50
100μH 100μH 100μH 100μH
Inductance [μH
Range
Type
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INDUCTORS
POWER INDUCTORS
PART NUMBERS
Please specify the inductance tolerance code. (M or K)
The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20)
The temperature rise current value (Idc2) is the DC current value having temperature increase up to 40. (at 20)
1608(0603)TYPE
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR L1608T1R 0M RoHS 1.0
±20%
700 0.230 510 650
1.0
BR L1608T1R5M RoHS 1.5 600 0.280 440 590
BR L1608T2R2M RoHS 2.2 400 0.400 360 500
BR L1608T3R3M RoHS 3.3 300 0.650 290 390
BR L1608T4R7M RoHS 4.7 150 1.00 240 310
BR L1608T6R8M RoHS 6.8 100 1.64 200 250
BR L1608T100M RoHS 10 45 2.00 170 220
BR L1608T150M RoHS 15 32 2.56 150 200
2012(0805)TYPE
2016(0806)TYPE
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR C1608TR20M RoHS 0.20
±20%
400 0.060 1,750 980
7.96
BR C1608TR35M RoHS 0.35 300 0.080 1,400 810
BR C1608TR45M RoHS 0.45 200 0.090 1,250 800
BR C1608TR56M RoHS 0.56 170 0.095 1,150 760
BR C1608TR77M RoHS 0.77 150 0.110 1,000 660
BR C1608T1R0M RoHS 1.0 140 0.180 850 520
BR C1608T1R5M RoHS 1.5 120 0.300 700 410
BR C1608T2R2M RoHS 2.2 100 0.550 550 280
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR C1608TR43M 6 RoHS 0.43
±20%
740 0.082 1,400 1,100
6.0
BR C1608TR50M 6 RoHS 0.50 710 0.090 1,200 1,050
BR C1608TR6 0M 6 RoHS 0.60 630 0.099 1,100 940
BR C1608TR72M 6 RoHS 0.72 600 0.144 1,000 810
BR C1608TR82M 6 RoHS 0.82 560 0.176 950 730
BR C1608T1R0M 6 RoHS 1.0 550 0.188 890 680
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR L2012TR47M RoHS 0.47
±20%
350 0.090 1,100 1,050
7.96
BR L2012T1R0M RoHS 1.0 300 0.135 850 850
BR L2012T1R5M RoHS 1.5 250 0.180 700 750
BR L2012T2R2M RoHS 2.2 200 0.300 600 550
BR L2012T3R3M RoHS 3.3 190 0.500 490 440
BR L2012T4R7M RoHS 4.7 150 0.550 340 400
BR L2012T6R8M RoHS 6.8 60 0.750 290 350
BR L2012T100M RoHS 10 30 0.850 270 330
2.52
BR L2012T150M RoHS 15 15 1.00 220 300
BR L2012T220M RoHS 22 13 1.30 190 270
BR L2012T330M RoHS 33 8.0 2.00 150 220
BR L2012T470M RoHS 47 7.0 3.50 125 160
BR L2012T680M RoHS 68 6.5 5.80 100 110
BR L2012T101M RoHS 100 6.0 7.70 85 85 0.796
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR C2012T1R0M RoHS 1.0
±20%
490 0.060 1,500 1,400
1.0
BR C2012T1R5MD RoHS 1.5 390 0.090 1,200 1,100
BR C2012T2R2MD RoHS 2.2 350 0.110 1,100 1,000
BR C2012T3R3MD RoHS 3.3 300 0.170 800 870
BR C2012T4R7MD RoHS 4.7 250 0.265 700 600
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR C2016T1R0M RoHS 1.0
±20%
450 0.085 1,350 1,100
0.10
BR C2016T1R5M RoHS 1.5 370 0.150 1,100 820
BR C2016T2R2M RoHS 2.2 250 0.180 910 760
BR C2016T3R3M RoHS 3.3 140 0.220 740 680
BR C2016T4R7M RoHS 4.7 78 0.270 660 610
BR C2016T6R8M RoHS 6.8 39 0.330 550 560
BR C2016T100RoHS 10
±10%
±20%
35 0.400 450 520
BR C2016T150RoHS 15 28 0.600 400 410
BR C2016T220RoHS 22 24 1.00 310 310
BR C2016T330RoHS 33 13 1.70 270 240
BR C2016T470RoHS 47 11 2.20 210 210
BR C2016T680RoHS 68 8 2.80 200 190
BR C2016T101RoHS 100 7 3.40 140 170
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
70
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Please specify the inductance tolerance code. (M or K)
The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20)
The temperature rise current value (Idc2) is the DC current value having temperature increase up to 40. (at 20)
PART NUMBERS
2515(1006)TYPE
3225(1210)TYPE
2518(1007)TYPE
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR L2515T1R0M RoHS 1.0
±20%
160 0.070 1,500 1,350
1.0
BR L 2515T1R5M RoHS 1.5 130 0.100 1,200 1,150
BR L2515T2R2M RoHS 2.2 100 0.135 1,000 1,000
BR L2515T3R3MD RoHS 3.3 70 0.215 800 750
BR L2515T4R7MD RoHS 4.7 60 0.265 650 700
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR L3225TR 27M RoHS 0.27
±20%
390 0.022 4,500 2,850
7.96 BR L3225TR36M RoHS 0.36 350 0.025 4,300 2,750
BR L3225TR51M RoHS 0.51 270 0.029 3,600 2,550
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±20
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR L3225T1R0M RoHS 1.0
±20%
220 0.043 2,400 2,200
0.1
BR L3225T1R5M RoHS 1.5 170 0.045 2,200 1,750
BR L3225T2R2M RoHS 2.2 150 0.065 1,850 1,600
BR L3225T3R3M RoHS 3.3 140 0.120 1,450 1,200
BR L3225T4R7M RoHS 4.7 120 0.180 1,300 1,000
BR L3225T6R8M RoHS 6.8 90 0.270 1,050 770
BR L3225T100RoHS 10
±10%
±20%
70 0.350 900 700
BR L3225T150RoHS 15 20 0.570 700 530
BR L3225T220RoHS 22 13 0.690 550 470
BR L3225T330RoHS 33 9 0.840 470 420
BR L3225T470RoHS 47 7 1.00 420 390
BR L3225T680 RoHS 68 6 1.40 330 300
BR L3225T101RoHS 100 5 2.50 270 250
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BRFL2518T1R 0M RoHS 1.0
±20%
130 0.090 1,200 1,200
1.0
BRFL2518T1R5M RoHS 1.5 100 0.110 1,100 1,000
BRFL2518T2R2M RoHS 2.2 80 0.130 850 950
BRFL2518T3R3M RoHS 3.3 70 0.220 700 700
BRFL2518T4R7M RoHS 4.7 60 0.330 650 650
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR L2518T1R0M RoHS 1.0
±20%
130 0.080 1,600 1,000
7.96
BR L2518T1R5M RoHS 1.5 100 0.100 1,200 920
BR L2518T2R2M RoHS 2.2 80 0.135 1,000 850
BR L 2518T3R3M RoHS 3.3 70 0.300 800 580
BR L 2518T4R7M RoHS 4.7 60 0.400 700 470
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BRHL 2518T1R0M RoHS 1.0
±20%
400 0.055 2,000 1,400
1.0
BRHL 2518T1R5M RoHS 1.5 350 0.085 1,700 1,100
BRHL 2518T2R2M RoHS 2.2 300 0.115 1,500 1,000
BRHL 2518T3R3MD RoHS 3.3 200 0.165 1,200 800
BRHL 2518T4R7MD RoHS 4.7 150 0.245 1,100 750
Ordering code EMS Inductance
[μH]
Inductance
Tolerance
Self-resonant
frequency
[MHz]min.
DC Resistance
[Ω]
(±30
Rated current [mA] Measuring
frequency
[MHz]
Saturation current
Idc1
Temperture rise current
Idc2
BR C2518T1R0M RoHS 1.0
±20%
280 0.050 2,550 1,650
1.0
BR C2518T1R5M RoHS 1.5 230 0.080 2,100 1,300
BR C2518T2R 2M RoHS 2.2 200 0.120 1,800 1,000
BR C2518T3R3M RoHS 3.3 150 0.175 1,450 860
BR C2518T4R7M RoHS 4.7 100 0.230 1,250 750
BR C2518T6R8M RoHS 6.8 45 0.280 1,050 680
BR C2518T10 0RoHS 10
±10%
±20%
20 0.350 890 610
BR C2518T150RoHS 15 13 0.430 760 550
BR C2518T220RoHS 22 10 0.560 640 490
BR C2518T330RoHS 33 8.0 0.850 560 390
BR C2518T470RoHS 47 6.5 1.45 410 300
BR C2518T680RoHS 68 5.5 2.40 340 230
BR C2518T101RoHS 100 4.5 3.60 300 190
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
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INDUCTORS
POWER INDUCTORS
ELECTRICAL CHARACTERISTICS
DC Bias characteristics Measured by HP4285A
InductanceμH
DC BIASmA
BRC1608
0.1
1
10
110 100 1000 10000
R77M
2R2M
R20M
InductanceμH
DC BIASmA
BRL2515
0.1
1
10
110 100 1000 10000
4R7M
2R2M
1R0M
InductanceμH
DC BIASmA
BRC2012
0.1
1
10
110 100 1000 10000
4R7MD
2R2MD
1R0M
InductanceμH
DC BIASmA
BRL2518
0.1
1
10
110 100 1000 10000
4R7M
2R2M
1R0M
InductanceμH
DC BIASmA
BRL2012
0.1
1
10
100
1000
110 100 1000 10000
101M
100M
1R0M
InductanceμH
DC BIASmA
BRFL2518
0.1
1
10
110 100 1000 10000
4R7M
2R2M
1R0M
InductanceμH
DC BIASmA
BRC2016
0.1
1
10
100
110 100 1000 10000
101
100
1R0M
InductanceμH
DC BIASmA
BRHL2518
0.1
1
10
110 100 1000 10000
4R7MD
2R2M
1R0M
InductanceμH
DC BIASmA
BRC2518
0.1
1
10
100
110 100 1000 10000
101
100
1R0M
InductanceμH
DC BIASmA
BRL3225
1
0.1
1
10
100
10 100 1000 10000
101
100
1R0M
InductanceμH
DC BIASmA
BRC1608 6
0.1
10
1
110 100 100 1000
R72M
1R0M
R43M
InductanceμH
DC BIASmA
BRL1608
0.1
10
1
100
110 100 1000
4R7M
150M
1R0M
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1
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wound07_pack_e-01
PACKAGING
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Embossed Tape 8mm wide (0.315 inches wide)
Card board carrier tape 8mm wide (0.315 inches wide)
Minimum Quantity
2.00±0.05
0.079±0.002
8.0±0.20
0.315±0.008
Tape Material
Taping dimensions
Leader and Blank portion
160 to 200 mm
6.3 to 7.9 inch
Blank portions Chip cavity Blank portions Leader
Direction of tape feed
160 to 320mm
6.3 to 12.6 inch
400 to 560 mm
15.7 to 22.0 inch
Reel size
Top Tape Strength
The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as
illustrated below.
Type Standard Quantity [pcs]
Paper Tape Embossed Tape
BR C1608 3,000
BR L1608 3,000
BR L2012 3,000
BR C2012 2,000
BR C2016 2,000
BR L2515 2,000
BR C2518 2,000
BRHL2518 2,000
BR L2518 3,000
BRFL2518 3,000
BR L3225 2,000
Type Chip cavity
Insertion pitch
Tape thickness
A B F T K
BR L1608 1.1±0.1
(0.043±0.004)
1.9±0.1
(0.075±0.004)
4.0±0.1
(0.157±0.004)
0.2±0.05
(0.008±0.002)
0.9MAX
(0.035MAX)
BR C1608 1.1±0.1
(0.043±0.004)
1.9±0.1
(0.075±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.2MAX
(0.047MAX)
BR L2012 1.45±0.1
(0.057±0.004)
2.2±0.1
(0.087±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.2MAX
(0.047MAX)
BR C2012 1.45±0.1
(0.057±0.004)
2.37±0.1
(0.093±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.59MAX
(0.063MAX)
BR C2016 1.75±0.1
(0.069±0.004)
2.1±0.1
(0.083±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
1.9MAX
(0.075MAX)
BR L2515 1.8±0.1
(0.071±0.004)
2.8±0.1
(0.110±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.45MAX
(0.057MAX)
BRFL2518 2.3±0.1
(0.091±0.004)
2.8±0.1
(0.110±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.3MAX
(0.051MAX)
BR L2518 2.3±0.1
(0.091±0.004)
2.8±0.1
(0.110±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
1.45MAX
(0.057MAX)
BRHL2518 2.1±0.1
(0.083±0.04)
2.8±0.1
(0.110±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
1.7MAX
(0.067MAX)
BR C2518 2.15±0.1
(0.085±0.004)
2.7±0.1
(0.106±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
2.2MAX
(0.087MAX)
BR L3225 2.8±0.1
(0.110±0.004)
3.5±0.1
(0.138±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.9MAX
(0.075MAX)
Unit : mm inch
1
2
wound07_reli-RP1 wound07_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Operating Temperature Range
All of BR-series
40~+105
Test Method and Remarks
Including self-generated heat
2. Storage Temperature Rangeafter soldering
All of BR-series
40~+85
Test Method and Remarks
Please refer the term of "7.Storage conditions" in Precautions.
3. Rated current
All of BR-series
Within the specified tolerance
4. Inductance
All of BR-series
Within the specified tolerance
Test Method and Remarks
LCR Meter : HP 4285A or equivalent, Measuring frequency : Specified frequency
5. DC Resistance
All of BR-series
Within the specified tolerance
Test Method and Remarks
DC ohmmeter : HIOKI 3227 or equivalent
6. Self resonance frequency
All of BR-series
Within the specified tolerance
Test Method and Remarks
Inpedance analyzer/material analyzer : HP4291A or equivalent HP4191A, 4192A or equivalent
7. Temperature characteristic
All of BR-series
Inductance change : Within ±15%
Test Method and Remarks
Based on the inductance at 20 and Measured at the ambient of 40~+85.
9. Temperature characteristic
All of BR-series
No damage.
Test Method and Remarks
2012 Appiled force : 10N
Duration : 10sec.
1608size Appiled force : 5N
Duration : 10sec.
10. Adhesion of terminal electrodes
All of BR-series
Not to removed from the board.
Test Method and Remarks
The given sample is soldered to the board and then it is kept for 5sec with 10N stress (5N for 1608(0603) inductors) like the figure.
10N (5N for 1608(0603) inductors
8. Resistance to the bendability
All of BR-series
No damage.
Test Method and Remarks
The given sample is soldered on the board and then the back side of the board is pushed until it bends 2mm like the figure.
Dimension of the board : 100×40×1.0mm (0.8mm thickness for 1608(0603) inductors)
Material of the board : Glass-epoxy
Thickness of soldering paste : 0.12mm
Force Rod
Board
Test Sample
20
10
R230
R5
45±2mm 45±2mm
11. Resistance to vibration
All of BR-series
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Method and Remarks
The given sample is soldered to the board and then it is tested depending on the conditions of the following table.
Vibration Frequency 1055Hz
Total Amplitude 1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method 10Hz to 55Hz to 10Hz for 1min.
Time
X
For 2 hours on each X, Y, and Z axis.Y
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
Wound Chip power inductorBR-series
1
2
wound07_reli-RP2
wound07_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
13. Resistance to soldering heat
All of BR-series
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Method and Remarks
3 times reflow having the temparature profile of 5sec of 2600
5 and 40sec of more than 230.
Test board thickness : 1.0mm
Test board material : glass epoxy-resin
14. Thermal shock
All of BR-series
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Method and Remarks
The given sample is soldered to the board and then its Inductance is measured after 100cycles of the following conditions.
Conditions of 1 cycle
Step Temperature () Duration (min)
140±3 30±3
2 Room temperature Within 3
385±2 30±3
4 Room temperature Within 3
12. Solderability
All of BR-series
At least 90% area of the electrodes is covered by new solder.
Test Method and Remarks
The given sample is dipped into the flux and then it is tested depending on the conditions of the following table.
Flux : Methanol solution containing rosin 25%.
Solder
Temperature 245±5
Time 5±0.5 sec.
15. Damp heat
All of BR-series
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Method and Remarks
The given sample is soldered to the board and then it is kept at the following conditions.
Temperature 60±2
Humidity 9095%RH
Time 1000 hours.
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
17. Low temperature life test
All of BR-series
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Method and Remarks
The given sample is soldered to the board and then it is kept at the following conditions.
Temperature 40±2
Duration 1000hours
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
18. High temperature life test
All of BR-series
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Method and Remarks
The given sample is soldered to the board and then it is kept at the following conditions.
Temperature 85±2
Duration 1000hours
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
16. Loading under damp heat
All of BR-series
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Method and Remarks
The given sample is soldered to the board and then it is kept at the following conditions.
Temperature 60±2
Humidity 9095RH
Applied current Rated current
Time 1000hours.
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
19. Standard conditions
All of BR-series
Standard test condition :
Unless otherwise specified, temperature is 20±15 and 65±20of relative humidity.
When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 20±2
of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
Wound Chip power inductorBR-series
1
2
wound07_reli-RP3 wound07_reli_e-01
PRECAUTIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Circuit Design
Precautions
Operationg Ambient
The products are premised on the usage for the general equipments like the office supply equipment, the telecommunications systems, the measuring
equipment, the household equipment and so on.
Please ask to TAIYO YUDEN's sales person in advance, if you need to apply them to the equipments or the systems which might have any influences for the
human body, the property, like the traffic systems, the safety equipment, the aerospace systems, the nuclear control systems, the medical equipment and so
on.
2. PCB Design
Precautions Land pattern design
1. Please refer to a recommended land pattern.
Technical
consider-
ations
Land pattern design
Surface Mounting
1. The conditions of the picking and placing should be checked in advence.
2. The products are only for reflow soldering.
3. Considerations for automatic placement
Precautions
Adjustment of mounting machine
1. Excessive fisical impact should not be imposed on the products for picking and placing onto the PC boards.
2. Mounting and soldering conditions should be checked in advance.
Technical
consider-
ations
Adjustment of mounting machine
The products might be broken if too much stress is given for the picking and placing.
4. Soldering
Precautions
Reflow soldering
1. Please apply our recommended soldering conditions on the specification as much as possible.
2. The products are only for reflow soldering.
3. Please do not give any stress to a product until it returns in room temperature after reflow soldering.
Lead free soldering
1. Please check the adhesion, the solder temperature, the solderability and the shape of solder filet if the solder that is not in the specification is used.
Recommended conditions for using a soldering iron (NR10050 Type)
Touch a soldering iron to the land pattern not to the product directly.
The temperature of a soldering iron is less than 350degC.
The soldering is for 3 seconds or less.
Technical
consider-
ations
Reflow soldering
1. The product might break or might make the tombstoning, if the soldering conditions are too far from our recommended conditions.
Temperature[℃]
300
200
100
0
90±30sec
150180
30±10sec
230 min
5sec max
Peak
2600/5
eating Timesec
5. Cleaning
Precautions Cleaning conditions
1. Please don't wash by the ultra-sonic waves.
Technical
consider-
ations
Cleaning conditions
1. Washing by the ultra-sonic waves might break the product.
6. Handling
Precautions
Handling
1. Keep the product away from any magnets.
Cutting the PC boards
1. Please don't give any stress of the bending or the twisting for the cutting process of PC boards.
2. Please don't give any shock and stress to the products in transportation.
Mechanical considerations
1. Please don't give too much shock to the product.
2. Please don't give any shock and stress to the products in transportation.
The stress for picking and placing
1. Please don't give any shock into an exposed ferrite core.
Packing
1. Please don't pile the packing boxes up as much as possible.
Technical
consider-
ations
Cutting the PC boards
1. Please don't give the bending stress or the twisting stress to the products because they might break in such cases.
Mechanical considerations
1. The mechnical shock might break the products.
2. The products might break depending on the handling in transportation.
Pick-up pressure
1. The electrical characteristics of the products might be shifted by too much ficical shock and stress.
Packing
1. The products and the tape might break, if the packing boxes are piled up.
7. Storage conditions
Precautions
Storage
1. The packing boxes can be kept at the ambient which the temperature is from 0 to 40degC and the humidity is less than 70%.
2. Tthe ambient temperature of less than 30degC is recommended not to get the tape and the solderability worse.
3. Please solder the products by a half year after they have been shipped.
Otherwise please use them after checking the solderability in advance.
Technical
consider-
ations
Storage
1. The ambient of high temperature or high humidity might accelerate to make the solderability and the tape worse.
Wound Chip power inductorBR-series